ams AS7264N Xyz chromatic color and 440/490nm blue sensor with electronic shutter Datasheet

AS7264N
XYZ Chromatic Color and 440/490nm
Blue Sensor with Electronic Shutter
General Description
The AS7264N provides direct XYZ sensor data which conforms
to the tri-stimulus standard observer color response of the
human eye. In addition, two channels added for measurement
of blue spectrum light, plus a near-IR channel enables
additional application flexibility. LED drivers with
programmable currents are provided for electronic shutter
applications.
The AS7264N integrates Gaussian filters into standard CMOS
silicon via nano-optic deposited interference filter technology
and is packaged in an LGA package that provides a built in
aperture to control the light entering the sensor array.
Control and spectral data access is implemented through an I²C
register set.
Ordering Information and Content Guide appear at end of
datasheet.
Key Benefits & Features
The benefits and features of AS7264N, XYZ Chromatic Color and
440/490nm Blue Sensor with Electronic Shutter are listed
below:
Figure 1:
AS7264N Benefits and Features
Benefits
Features
• XYZ channel data conforming to human eye
response to color information
• XYZ tri-stimulus standard observer filter set
• Additional specific blue light sensing in ranges
associated with eye health and other biological
light effects
• Two added blue channels at 440nm and 490nm
• High accuracy ambient light measurements
• Ambient light sensing (photopic response)
• Direct register read and write with interrupt on
sensor ready
• I²C slave digital Interface with optional interrupt
operation
• High stability over lifetime with minimal drift over
temperature
• Filter set realized by silicon interference filters
• No additional signal conditioning required
• 16-bit ADC with digital access
• Direct register read and write with interrupt on
sensor ready
• I²C slave digital Interface with optional interrupt
operation
ams Datasheet
[v1-00] 2017-Oct-05
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AS7264N − General Description
Benefits
Features
• Electronic shutter control/synchronization
• Programmable LED drivers
• Low voltage operation
• 2.7V to 3.6V with I²C interface
• Small, robust package, with built-in aperture
• 20-pin LGA package 4.5mm x 4.7mm x 2.5mm
-40°C to 85°C temperature range
Application
The AS7264N applications include:
• Ambient light spectral exposure
• Biological lighting measurements
• Color measurement and absorbance
• Color matching and identification
• Precision color tuning/calibration
System Block Diagram
Figure 2:
AS7264N Sensor System
3.3V
100nF
10uF
VDD1
VDD2
AS7264N
MCU
SCL_S
SDA_S
INT
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3.3V
LED_IND
LED_DRV
X, Y, Z,
NIR, B440
& B490
Sensors
GND
3.3V
Light
Source
Light in
Reflective
Surface
ams Datasheet
[v1-00] 2017-Oct-05
AS7264N − Pin Assignments
The device pin assignments are described below.
Pin Assignments
Figure 3:
Pin Diagram of AS7264N (Top View)
20
16
1
15
5
11
6
10
Pin Description
Figure 4:
Pin Description of AS7264N
Pin Number
Pin Name
1
NF
2
RESN
3
NF
Not functional. Do not connect.
4
NF
Not functional. Do not connect.
5
NF
Not functional. Do not connect.
6
NF
Not functional. Do not connect.
7
NF
Not functional. Do not connect.
8
NF
Not functional. Do not connect.
9
SCL_S
I²C slave clock pin
10
SDA_S
I²C slave data pin
11
NF
ams Datasheet
[v1-00] 2017-Oct-05
Description
Not functional. Do not connect.
Reset, active LOW
Not functional. Do not connect.
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AS7264N − Pin Assignments
Pin Number
Pin Name
12
NF
Not functional. Do not connect.
13
INT
Interrupt, active HIGH
14
VDD2
15
LED_DRV
16
GND
Ground
17
VDD1
Voltage supply
18
LED_IND
19
NF
Not functional. Do not connect.
20
NF
Not functional. Do not connect.
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Description
Voltage supply
LED driver output for driving LED current sink
LED driver output for indicator LED current sink
ams Datasheet
[v1-00] 2017-Oct-05
AS7264N − Absolute Maximum Ratings
Absolute Maximum Ratings
Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. These are stress
ratings only. Functional operation of the device at these or any
other conditions beyond those indicated under Electrical
Characteristics is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device
reliability. The device is not designed for high energy UV
(ultraviolet) environments, including upward looking outdoor
applications, which could affect long term optical performance.
Figure 5:
Absolute Maximum Ratings
Symbol
Parameter
Min
Max
Units
Comments
Electrical Parameters
VDD_MAX
VDD_IO
ISCR
Supply Voltages VDD1,
VDD2
-0.3
5
V
Pins VDD1 & VDD2 must be
sourced from the same supply
voltage
Input/Output Pin
Voltage
-0.3
VDD+0.3
V
Input/Output pin to GND
Input Current
(latch-up immunity)
±100
mA
JESD78D
Electrostatic Discharge
ESDHBM
Electrostatic Discharge
HBM
±1000
V
JS-001-2014
ESDCDM
Electrostatic Discharge
CDM
±500
V
JSD22-C101F
Temperature Ranges and Storage Conditions
TSTRG
Storage Temperature
TBODY
Package Body
Temperature
RHNC
Relative Humidity
(non-condensing)
MSL
Moisture Sensitivity
Level
ams Datasheet
[v1-00] 2017-Oct-05
-40
85
5
3
°C
260
°C
85
%
IPC/JEDEC J-STD-020. The
reflow peak soldering
temperature (body
temperature) is specified
according IPC/JEDEC
J-STD-020 “Moisture/Reflow
Sensitivity Classification for
Non-hermetic Solid State
Surface Mount Devices”
Maximum floor life time of
168 hours
Page 5
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AS7264N − Electrical Characteristics
All limits are guaranteed with VDD = VDD1 = VDD2 = 3.3V,
TAMB = 25°C. The parameters with min and max values are
guaranteed with production tests or SQC (Statistical Quality
Control) methods. VDD1 and VDD2 must be sourced from the
same power supply.
Electrical Characteristics
Figure 6:
Electrical Characteristics of AS7264N
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
2.7
3.3
3.6
V
-40
25
85
°C
5
mA
General Operating Conditions
VDD
Voltage Operating
Supply
TAMB
Operating Temperature
IVDD
Operating Current
ISTANDBY (1)
I²C Interface
Standby Current
12
μA
Internal RC Oscillator
FOSC
tJITTER (2)
Internal RC Oscillator
Frequency
Internal Clock Jitter
15.7
16.3
MHz
1.2
ns
-8.5
8.5
°C
1
8
mA
-30
30
%
0.3
VDD
V
12.5
100
mA
-10
10
%
0.3
VDD
V
@25°C
16
Temperature Sensor
DTEMP
Absolute Accuracy of the
Internal Temperature
Measurement
Indicator LED
IIND
LED Current
IACC
Accuracy of Current
VLED
Voltage Range of
Connected LED
Available current steps:
1, 2, 4, or 8mA
Vds of current sink
LED_DRV
ILED1
LED Current
IACC
Accuracy of Current
VLED
Voltage Range of
Connected LED
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Available current steps:
12.5, 25, 50, or 100mA
Vds of current sink
ams Datasheet
[v1-00] 2017-Oct-05
AS7264N − Electrical Characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Digital Inputs and Outputs
IIH, IIL
Logic Input Current
Vin=0V or VDD
-1
1
μA
IIL RESN
Logic Input Current
(RESN pin)
Vin=0V
-1
-0.2
mA
VIH
CMOS Logic High Input
0.7* VDD
VDD
V
VIL
CMOS Logic Low Input
0
0.3*
VDD
V
VOH
CMOS Logic High Output
I=1mA
VDD 0.4
V
VOL
CMOS Logic Low Output
I=1mA
0.4
V
tRISE (2)
Current Rise Time
C(Pad)=30pF
5
ns
tFALL (2)
Current Fall Time
C(Pad)=30pF
5
ns
Note(s):
1. 15μA over temperature
2. Guaranteed, not tested in production
ams Datasheet
[v1-00] 2017-Oct-05
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AS7264N − Timing Characteristics
Timing Characteristics
Figure 7:
AS7264N I²C Slave Timing Characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
400
kHz
I²C Interface
fSCLK
SCL Clock Frequency
tBUF
Bus Free Time Between a STOP
and START
1.3
μs
Hold Time (Repeated) START
0.6
μs
tLOW
LOW Period of SCL Clock
1.3
μs
tHIGH
HIGH Period of SCL Clock
0.6
μs
tSU:STA
Setup Time for a Repeated START
0.6
μs
tHS:DAT
Data Hold Time
0
tSU:DAT
Data Setup Time
100
tR
Rise Time of Both SDA and SCL
20
300
ns
tF
Fall Time of Both SDA and SCL
20
300
ns
tSU:STO
Setup Time for STOP Condition
0.6
tHS:STA
0
CB
Capacitive Load for Each Bus Line
CI/O
I/O Capacitance (SDA, SCL)
0.9
μs
ns
μs
Total capacitance of one
bus line in pF
400
pF
10
pF
Figure 8:
I²C Slave Timing Diagram
tR
tF
tLOW
SCL
P
tHIGH
S
tHD:STA
tHD:DAT
S
tSU:DAT
tSU:STA
P
tSU:STO
VIH
SDA
tBUF
Stop
VIL
Start
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AS7264N − Operation Characteristics
Operation Characteristics
Figure 9:
Spectral Responsivity
1.2
B490
spectral responsivity relative to Y
1
B440
X
0.8
Y
0.6
Z
NIR
0.4
0.2
0
350
450
550
650
750
850
950
1050
Wavelength [nm]
Figure 10:
AS7264N Optical Characteristics (Pass Band)
Symbol
Parameter
Test Conditions
Min
Typ
Max
Unit
X
Channel X
White LED 5700K source, Ee=116μW/cm2
7.7
counts/
(μW/cm2)
Y
Channel Y
White LED 5700K source, Ee=116μW/cm2
8.6
counts/
(μW/cm2)
Z
Channel Z
White LED 5700K source, Ee=116μW/cm2
4.7
counts/
(μW/cm2)
NIR
Channel NIR
Incandescent light source, Ee=465μW/cm2
14.0
counts/
(μW/cm2)
B490
Channel
Blue490
White LED 5700K source, Ee=116μW/cm2
9.4
counts/
(μW/cm2)
B440
Channel
Blue440
White LED 5700K source, Ee=116μW/cm2
10.9
counts/
(μW/cm2)
PFOV
Package Field
of View
±20.5
deg
Note(s):
1. Each channel is tested with GAIN = 3.7x, Integration Time (INT_T) = 166ms and TAMB=25°C
2. The accuracy of each channel count is ±25%
ams Datasheet
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AS7264N − Operation Characteristics
Figure 11:
AS7264N LGA Package Field of View
Diffused Light
A=0.75mm
β=2
20.5°
0 5°
Lens
H=2.5mm
Sensor
α = 12°
DIE
DIE
LGA Package Substrate
Page 10
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ams Datasheet
[v1-00] 2017-Oct-05
AS7264N − Detailed Descriptions
Detailed Descriptions
Figure 12:
Internal Block Diagram
VDD1
VDD2
LED_IND
INT
SCL_S
LED_DRV
SDA_S
°C
2
X Y Z
B440
B490
I C Control
XYZ
True
Color
Sensor
NIR
RESN
AS7264N
GND
XYZ Sensor
The AS7264N XYZ sensor is a next-generation digital color
sensor device. It senses X, Y, Z standard observer filters
compliant with the CIE 1931 standard observer color response
in addition to near IR (NIR), long wavelength blue (490nm) and
short wavelength blue (440nm) spectrum filters.
The sensor contains analog-to-digital converters (16-bit
resolution ADC), which integrate current from each channel’s
photodiode. Upon completion of conversion cycle, the
integrated result is transferred to the corresponding data
register. Transfers are double-buffered to ensure integrity of the
data is maintained.
Interference filters realize all filter responses and enable
minimal life-time drift and very high temperature stability.
Filter accuracy is affected by the optical angle of incidence
which itself is limited by an integrated aperture and an internal
micro-lens structure in the AS7264N. The package field of view
(PFOV) is ±20.5° to deliver the specified accuracy. External
optics can be used as needed to expand or reduce this built in
PFOV.
ams Datasheet
[v1-00] 2017-Oct-05
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AS7264N − Detailed Descriptions
Data Conversion
AS7264N spectral conversion is implemented via two
photodiode banks. The first bank provides data from the X, Y, Z
and NIR (near-IR) photodiodes. The second bank provides data
from the same X and Y photodiodes as well as blue 440nm and
blue 490nm photodiodes.
The spectral conversion process is controlled with two BANK
Mode settings. Bank Mode 0 uses I²C registers for X, Y,B440 and
B490 data. Bank Mode 1 uses I²C registers for X, Y, Z and NIR
data. Sensor data is available in four I²C registers
(NDATAL/NDATAH, XDATAL/XDATAH, YDATAL/YDATAH and
ZDATAL/ZDATAH) as shown in the figures below.
Figure 13:
Bank Modes
Photo Diode Array
BANK Mode 0
X, Y, B440
and B490
One Conversion
X
Y
B440
Integration Time
BANK Mode 1
Z
B490
NIR
One Conversion
X, Y, Z and NIR
Integration Time
Figure 14:
AS7264N Sensor Data I²C Registers
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I²C Register
Bank Mode 0
Bank Mode 1
NDATAL/NDATAH
B490
NIR
XDATAL/XDATAH
X
X
YDATAL/YDATAH
Y
Y
ZDATAL/ZDATAH
B440
Z
ams Datasheet
[v1-00] 2017-Oct-05
AS7264N − Detailed Descriptions
Spectral Conversion and Data Acquisition
Spectral conversion uses a register set for integration time
(register INT_T). If both photodiode banks are required to
complete the conversion, the second bank requires an
additional integration time. Minimum conversion time for a
single bank is 2.8 milliseconds. If data is required from all 6
photodiodes the device must perform 2 full conversions
(2x integration time). The user has control of gain for the
photodiode current, programmed into bits 0 and 1 of the GAIN_
IDRV register where gain can be set to 1x, 3.7x, 16x or 64x. A
wait time between integration cycles can be programmed into
register WTIME using the same units as the INT_T register.
An auto zero function is automatically performed before the
first data conversion after a power-on or reset, in order to
achieve the best data quality. Auto zero corrects for internal
device temperature. But since it’s automatically done only once,
it can also be manually run. Typically, if the temperature
changes by 15 ºC or more the auto zero should be manually run
by writing to the Auto_Zero register (temperature is user
calculated based on TMPL & TMPH registers values). But auto
zero can also be manually done before every conversion. When
auto zero function is complete the DONE bit (bit7) of Auto_Zero
register will be set to 1.
The BANK bit (bit7) in the BANK register can be changed as
needed before data conversion to acquire the desired channels.
While conversion is continuous, timing is done using registers.
Both polling and interrupt operation are then supported for
“conversion complete” timing. Both require programming the
INTR_POLL_EN register bit 2 to a 1. The conversion process is
started by writing a 0x01 to the DATA_EN register followed by
clearing any previous Data Valid bit in the INTR_POLL_CLR
register. This is followed by a separate write of 0x03 to the
DATA_EN register.
If the AS7264N interrupt output is to be used for data
conversion timing the INTR_PIN_Config register should be
programmed to 0xCA. The INT pin will then be asserted high at
the completion of the conversion cycle. A 0x04 should be
written to the INTR_POLL_CLR register to clear this interrupt
which also clears polling bit 2 in the register.
If only polling is to be used for conversion timing, an external
interrupt is not required and the INTR_PIN_Config register
should be programmed to 0x00. Polling of bit 2 in the INTR_
POLL_CLR register will return 0x00 if the conversion is not
complete, and 0x04 if complete. Once complete a 0x04 should
be written to the INTR_POLL_CLR register to clear bit 2, the
polled bit.
For acquisition, done after conversion, data needs to be latched
by writing 0x83 to the DATA_EN register. The purpose of
latching the data by the user is to provide a mechanism for data
to be coherent and under user control. Now, the data bank
register can be read (one bank per single
conversion-acquisition cycle). The CLR bit (bit2) should be
ams Datasheet
[v1-00] 2017-Oct-05
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AS7264N − Detailed Descriptions
cleared by writing a 1 to the CLR bit (bit2) of the INTR_POLL_
CLR register (0xF8) after each conversion-acquisition cycle is
completed.
Temperature Sensor
The Temperature Sensor measures on-chip temperature on
demand, and enables temperature compensation procedures.
The basic equation for calculating the internal temperature of
the device is:
(EQ1)
TMP – VALUE • 2.048
0.7604 – -------------------------------------------------------1024
------------------------------------------------------------------------------- – 40
–3
2.046 • 10
TMP_VALUE is the derived from TMPL & TMPH (0xD2 [1:0] and
0xD1 [7:0]) register data. Temperature conversions are
performed by writing 0x24 to the TMP_Config register. Polling
the TMP_Config register will indicate data acquisition is
complete upon reading 0x84. After reading 0x84 the TMP_
Config register should be written to either 0x00 for idle or 0x24
to perform another temperature measurement. The result of
the calculation is the device temperature in degree Celsius (°C).
Electronic Shutter with LED_IND or LED_DRV
Driver Control
Under user control there are two LED driver outputs that can
be used to control LEDs on the two driver pins. This allows
different wavelength light sources to be used in the same
system. The LED output sink currents are programmable and
can drive external LED sources. After programming for current
the sources can be turned off and on via registers to provide
the AS7264N with an electronic shutter capability. If turning
LEDs on, they should be fully on optically before a conversion
begins and not shut off until after the conversion-acquisition
cycle completes
The LED_IND pin can be turned on/off via the LED_IND register
with values 0x01, 0x05, 0x09 and 0x0D for sink currents of 1mA,
2mA, 4mA and 8mA respectively.
For the LED_DRV pin, the GAIN_IDRV Register (0xB9) bits 7 and
6 control the drive strength of the pin for current values 12.5mA,
25mA, 50mA and 100mA. This register also controls the gain of
all light acquisitions so care should be taken when writing to it.
The LED_DRV pin can be turned on/off via the LED_DRV register
bit 2.
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ams Datasheet
[v1-00] 2017-Oct-05
AS7264N − Detailed Descriptions
Low Power Mode
AS7264N can be put into the low power mode by writing 0x02
to the POWER MODE Register (0x73). Write 0x00 to set it back
to normal mode. Wait at least 50μs before doing further
AS7264N operations after powering back to normal.
The sequence to configure AS7264N into low power mode:
• Write 0x00 to Register 0xFA
• Write 0x02 to Register 0x73
• AS7264N is in low power mode
The sequence to configure AS7264N out of low power mode:
• Write 0x00 to Register 0x73
• Wait for at least 50μS
• Write 0x03 to Register 0xFA
• AS7264N is in normal mode
Device Initialization and Pin Assignment
On power up device needs to be initialized as follows before
programming registers to do data conversion and acquisition:
• Device Config 1 register: 0x70 written to 0x8A
• Device Config 2 register: 0x71 written to 0x02
• Device Config 3 register: 0xB0 written to 0x02
• Device Config 4 register: 0x88 written to 0x00
• Device Config 5 register: 0x9A written to 0x02
• Interrupt Operation: The only user defined pin
functionality is whether to use pin 13 as an interrupt signal
at the completion of data conversion. This is done by
programming the INTR_PIN_Config register (0x22) to
0xCA. To disable interrupt function the INTR_PIN_Config
register should be programmed to 0x00, which is the
power-on and reset default.
RC Oscillator
An internal on-chip timing generation circuit provides a 16MHz
temperature compensated oscillator for the AS7264N master
clock.
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[v1-00] 2017-Oct-05
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AS7264N − Detailed Descriptions
Reset
Pulling down the RESN pin for longer than 100ms resets the
AS7264N.
Figure 15:
Reset Circuit
RESN
2
IC
Registers
Reset
AS7264N
Page 16
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Push > 100ms
ams Datasheet
[v1-00] 2017-Oct-05
AS7264N − Detailed Descriptions
Figure 16:
I²C Register Programming Flow Chart
External
MicroController
AS7264N
Power-on or device reset
One Time Device Configuration
DEV_Config_1, DEV_Config_2,
DEV_Config_3, DEV_Config_4,
DEV_Config_5
AS7264N
System Configuration
Interrupt Configuration
INTR_PIN_Config,
INTR_POLL_CLR,
INTR_POLL_EN
AS7264N
Start Data Acquisition
Turn off Low Power Mode (if on)
PWR_MODE, DATA_EN
Configure LEDs
LED_IND, LED_DRV
Sensor Configuration
INT_T, GAIN_IDRV, BANK, WTIME
Perform Auto Zero
Auto_Zero, TMPH, TMPL, TMP_Config
Conversion Start
INTR_POLL_CLR,
DATA_EN (first write),
DATA_EN (separate write)
AS7264N
Interrupt Service Entry Point
(if Interrupt enabled)
Read For Conversion Complete
INTR_POLL_CLR
NO
= 0x04 ?
YES
Latch Data for Acquisition
DATA_EN
Read Sensor Data
If BANK MODE 0, read X, Y, D & C
If BANK MODE 1, read X, Y, Z, & NIR
More Data?
YES
NO
Clear Poll Bit
INTR_POLL_CLR
Turn off LEDs
LED_IND, LED_DRV
Turn on Low Power Mode
DATA_EN, PWR_MODE
Note(s):
1. When using shuttered LEDs, the LED source(s) should be at desired brightness before conversion starts.
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[v1-00] 2017-Oct-05
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AS7264N − Detailed Descriptions
I²C Slave Interface
Interface, control and reading sensor data is accomplished
through an I²C compatible slave interface via a set of registers.
I²C Feature List
• Fast mode (400 kHz) and standard mode (100 kHz) support
• 7+1-bit addressing mode
• Write format: Byte
• Read format: Byte
I²C Register Set
The 7-bit I²C slave address of AS7264N is 0x49 plus one bit for
read/write. When reading from I²C registers, the 7 + 1-bit
address should be 0x93. When writing to I²C registers, the
7+1-bit address should be 0x92.
The figure below provides a summary of the AS7264N I²C
register set. Figures after that provide additional details. All
register data is hex, and all multi-byte entities are Big Endian
(most significant byte is situated at the lower register address).
I²C register addresses not listed should be treated as reserved
and not used.
Figure 17:
I²C Register Set Overview
Addr
Name
<D7>
<D6>
<D5>
<D4>
<D3>
<D2>
<D1>
<D0>
PM
RESV
Device Version Registers
0x10
DEV_ID
Device Identification
0x11
DEV_VER
Device Version
Device Configuration Registers
0x70
DEV_Config_1
Device Configuration 1
0x71
DEV_Config_2
Device Configuration 2
0xB0
DEV_Config_3
Device Configuration 3
0x88
DEV_Config_4
Device Configuration 4
0x9A
DEV_Config_5
Device Configuration 5
Power Mode Register
0x73
PWR_MODE
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RESV
ams Datasheet
[v1-00] 2017-Oct-05
AS7264N − Detailed Descriptions
Addr
Name
<D7>
<D6>
<D5>
<D4>
<D3>
<D2>
<D1>
<D0>
Interrupt and Polling Control Registers
0x22
INTR_PIN_Config
OPIN
FUNCT
0xF8
INTR_POLL_CLR
RESV
CLR
RESV
0xF9
INTR_POLL_EN
RESV
EN
RESV
ON_OFF
RESV
LED Control Registers
0xEA
LED_DRV
0x84
LED_IND
RESV
RESV
CURRENT
RESV
ON_OFF
Y_EN
Z_EN
Auto Zero and Temperature Control Registers
0xBA
Auto_Zero
0xD1
TMPH
0xD2
TMPL
0xD3
TMP_Config
RESV
C_EN
X_EN
Most Significant bits (9:2) of Temperature Measurement
RESV
ISTAT
RESVSTRT
TMPL
RESV
SRC
Sensor Control Registers
0xDB
BANK
BANK
RESV
0xB9
GAIN_IDRV
0xD9
INT_T
Integration Time
0xDA
WTIME
Wait Time
0xFA
DATA_EN
IDRV
DL
GAIN
RESV
WAIT
RESV
RESV
CON
PON
Sensor Data Registers
0xDC
NDATA_L
N Channel Low Byte
0xDD
NDATA_H
N Channel High Byte
0xDE
YDATA_L
Y Channel Low Byte
0xDF
YDATA_H
Y Channel High Byte
0xEC
ZDATA_L
Z Channel Low Byte
0xED
ZDATA_H
Z Channel High Byte
0xEE
XDATA_L
X Channel Low Byte
0xEF
XDATA_H
X Channel High Byte
ams Datasheet
[v1-00] 2017-Oct-05
Page 19
Document Feedback
AS7264N − Detailed Descriptions
Detailed Register Description
Figure 18:
Device ID and Version Registers
Addr: 0x01
Device Identification
Bit
Bit Name
Default
Access
7:0
DEV_ID
01110010
R
Addr: 0x11
Bit
Bit Name
7:0
DEV_VER
Bit Description
Device identification number
Device Version
Default
Access
R
Bit Description
Device version number
Figure 19:
Device Configuration Registers
Addr: 0x70
Bit
Bit Name
7:0
DEV_Config_1
Device Configuration 1
Default
Access
Bit Description
R/W
Device Configuration 1, must be initialized to 0x8A by
external MCU
Addr: 0x71
Bit
Bit Name
7:0
DEV_Config_2
Device Configuration 2
Default
Access
Bit Description
R/W
Device Configuration 1, must be initialized to 0x02 by
external MCU
Addr: 0xB0
Bit
Bit Name
7:0
DEV_Config_3
Device Configuration 3
Default
Access
Bit Description
R/W
Device Configuration 1, must be initialized to 0x02 by
external MCU
Addr: 0x88
Bit
Bit Name
7:0
DEV_Config_4
Device Configuration 4
Default
Access
Bit Description
R/W
Device Configuration 1, must be initialized to 0x00 by
external MCU
Addr: 0x9A
Bit
Bit Name
7:0
DEV_Config_5
Page 20
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Device Configuration 5
Default
Access
Bit Description
R/W
Device Configuration 1, must be initialized to 0x02 by
external MCU
ams Datasheet
[v1-00] 2017-Oct-05
AS7264N − Detailed Descriptions
Figure 20:
Power Mode Register
Addr: 0x04/0x84
PWR_MODE
Bit
Bit Name
Default
Access
Bit Description
7:2
RESV
0
R/W
Reserved, set to 000000 if writing the register
1
PM
1
R/W
1= Normal Operation Power Mode
0= Low Power Mode
0
RSVD
0
R/W
Reserved, set to 0 if writing the register
Figure 21:
Interrupt Pin Configuration Register
Addr: 0x22
INTR_PIN_Config
Bit
Bit Name
Default
Access
7:0
INTR_PIN_Config
0x00
R/W
Bit Description
0x00 = INT pin disabled
0xCA = INT pin enabled
Figure 22:
Interrupt and Polling Clear Register
Addr: 0xF8
INTR_POLL_CLR
Bit
Bit Name
Default
Access
Bit Description
7:3
RESV
00000
R/W
Reserved, set to 00000 if writing the register
2
CLR
0
R/W
Set to 1 to clear any asserted interrupt pin INT (the
interrupt channel ready must be enabled). If the interrupt
channel ready is enabled this bit will read a 1.
1:0
RSVD
00
R/W
Reserved, set to 00 if writing the register
Figure 23:
Interrupt and Polling Enable Register
Addr: 0xF9
INT_POLL_EN
Bit
Bit Name
Default
Access
7:3
RESV
0
R/W
Reserved, set to 00000 if writing the register
2:1
EN
0
R/W
Set to 1 to enable the channel data ready for polling or
interrupt.
0
RSVD
0
R/W
Reserved, set to 0 if writing the register
ams Datasheet
[v1-00] 2017-Oct-05
Bit Description
Page 21
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AS7264N − Detailed Descriptions
Figure 24:
LED Driver Register
Addr: 0xEA
LED_DRV
Bit
Bit Name
Default
Access
Bit Description
7:3
RESV
0
R/W
Reserved, set to 00000 if writing the register
2
ON_OFF
0
R/W
Set to 1 to enable the LED_DRV pin to the current level
specified by the register GAIN_IDRV (0xB9). Set to 0 to
turn off.
0:1
RSVD
0
R/W
Reserved, set to 00 if writing the register
Figure 25:
LED Indicator Register
Addr: 0x84
LED_IND
Bit
Bit Name
Default
Access
7:4
RESV
0
R/W
Reserved, set to 0 if writing the register
3:2
CURRENT
00
R/W
For LED_IND pin current value (when on).
Set to:
‘b00=1mA; ‘b01=2mA; ‘b10=4mA; ‘b11=8mA;
1
RSVD
0
R/W
Reserved, set to 0 if writing the register
0
ON_OFF
0
R/W
Set to 1 to enable the LED_DRV pin to the current level
specified by the CURRENT bits. Set to 0 to turn off.
Page 22
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Bit Description
ams Datasheet
[v1-00] 2017-Oct-05
AS7264N − Detailed Descriptions
Figure 26:
Auto Zero Register
Addr: 0xBA
Auto_Zero
Bit
Bit Name
Default
Access
7
DONE
0
R/W
Will be set to 1 when any auto zero function is
completed. Set to 0 if writing to the register.
6:4
RESV
0
R/W
Reserved, set to 000 if writing the register
3
B440_EN
0
R/W
Set to 1 to manually run auto zero on the B440 channel.
Will be automatically set to 0 when DONE bit is set.
2
X_EN
0
R/W
Set to 1 to manually run auto zero on the X channel. Will
be automatically set to 0 when DONE bit is set.
1
Y_EN
0
R/W
Set to 1 to manually run auto zero on the Y channel. Will
be automatically set to 0 when DONE bit is set.
0
Z_EN
0
R/W
Set to 1 to manually run auto zero on the Z/B490
channel. Will be automatically set to 0 when DONE bit is
set.
ams Datasheet
[v1-00] 2017-Oct-05
Bit Description
Page 23
Document Feedback
AS7264N − Detailed Descriptions
Temperature Measurement High Register (bits 9:2)
TMP_VALUE is the value from TMPL & TMPH (0xD2 [1:0] and
0xD1 [7:0]) registers (see the Temperature Sensor section of this
datasheet). Temperature conversion controlled by the TEMP_
Config register.
Figure 27:
Temperature Measurement High Register
Addr: 0xD1
Bit
Bit Name
7:0
TMPH
TMPH
Default
Access
R
Bit Description
Most significant 8 bits (9:2) of the temperature
measurement.
Temperature Measurement Low Register (bits 1:0)
TMP_VALUE is the value from TMPL & TMPH (0xD2 [1:0] and
0xD1 [7:0]) registers (see the Temperature Sensor section of this
datasheet). Temperature conversion controlled by the TEMP_
Config register.
Figure 28:
Temperature Measurement Low Register
Addr: 0xD2
Bit
Bit Name
7:0
TMPL
TMPL
Default
Access
R
Bit Description
Least significant 2 bits (1:0) of the temperature
measurement.
Figure 29:
Temperature Configure Register
Addr: 0xD3
TEMP_Config
Bit
Bit Name
Default
Access
Bit Description
7
ISTAT
0
R/W
Will be set to 1 when internal temperature measurement
is complete. Set to 0 if writing to the register.
6
RESV
0
R/W
Reserved, set to 0 if writing the register
5
START
0
R/W
Set to 1 to start a temperature conversion cycle. Set to 0
for IDLE state.
4
RESV
0
R/W
Reserved, set to 0 if writing the register
3:0
SRC
0
R/W
Set to 0100 to start a temperature conversion cycle. Set
to 0000 for IDLE state.
Page 24
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ams Datasheet
[v1-00] 2017-Oct-05
AS7264N − Detailed Descriptions
Figure 30:
Bank Register
Addr: 0xDB
BANK
Bit
Bit Name
Default
Access
Bit Description
7
BANK
0
R/W
Sets Bank mode for sensor channel selection:
0= Mode 0 for X, Y, D and D sensor data
1= Mode 1 for X, Y, Z and NIR sensor data
6:0
RESV
0
R/W
Reserved, set to 0000000 if writing the register
Figure 31:
Sensor Gain and LED_DRV Current Drive Register
Addr: 0xB9
GAIN_IDRV
Bit
Bit Name
Default
Access
Bit Description
7:6
IDRV
0
R/W
For LED_DRV pin current limit (when on).
Set to:
‘b00=100mA; ‘b01=50mA; ‘b10=25mA; ‘b11=12.5mA;
5:2
RESV
0
R/W
Reserved, set to 0000 if writing the register
1:0
GAIN
0
R/W
Sensor channel gain setting (all channels)
‘b00=1x; ‘b01=3.7x; ‘b10=16x; ‘b11=64x;
Figure 32:
Integration Time Register
Addr: 0xD9
INT_T
Bit
Bit Name
Default
Access
7:0
INT_T
0xFF
R/W
ams Datasheet
[v1-00] 2017-Oct-05
Bit Description
Sets sensor integration time
Integration time = (256 - value) * 2.8ms
Page 25
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AS7264N − Detailed Descriptions
Figure 33:
Integration Wait Time Register
Addr: 0xDA
INT_WT
Bit
Bit Name
Default
Access
7:0
INT_WT
0xFF
R/W
Bit Description
Sets time between sensor integrations
Integration wait time = (256 - value) * 2.8ms
Figure 34:
Data Enable Register
Addr: 0xFA
DATA_EN
Bit
Bit Name
Default
Access
7
DL
0
R/W
Data latch. Set to 1 to latch the data after acquisition
completes
6:4
RESV
0
R/W
Reserved, set to 000 if writing the register
3
WAIT
0
R/W
Set to 1 to enable the wait timer between data channel
acquisitions
2
RESV
0
R/W
Reserved, set to 0 if writing the register
1
CON
0
R/W
Set to 1 to enable data channel acquisitions
0
PON
0
R/W
Set to 1 if writing the register
Page 26
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Bit Description
ams Datasheet
[v1-00] 2017-Oct-05
AS7264N − Detailed Descriptions
Figure 35:
Sensor Data Registers
Addr: 0xDC
Bit
Bit Name
7:0
NDATA_L
NDATA_L
Default
Access
R
Addr: 0xDD
Bit
Bit Name
7:0
NDATA_H
Bit Name
7:0
YDATA_L
Default
Access
R
Bit Name
7:0
YDATA_H
Default
Access
R
Bit Name
7:0
ZDATA_L
Default
Access
R
Bit Name
7:0
ZDATA_H
Default
Access
R
Bit Name
7:0
XDATA_L
Default
Access
R
Bit Name
7:0
XDATA_H
ams Datasheet
[v1-00] 2017-Oct-05
Bit Description
Channel Y High Data Byte
Bit Description
Channel Z Low Data Byte
Bit Description
Channel Z High Data Byte
XDATA_L
Default
Access
R
Addr: 0xEF
Bit
Channel Y Low Data Byte
ZDATA_H
Addr: 0xEE
Bit
Bit Description
ZDATA_L
Addr: 0xED
Bit
Channel N High Data Byte
YDATA_H
Addr: 0xEC
Bit
Bit Description
YDATA_L
Addr: 0xDF
Bit
Channel N Low Data Byte
NDATA_H
Addr: 0xDE
Bit
Bit Description
Bit Description
Channel X Low Data Byte
XDATA_H
Default
Access
R
Bit Description
Channel X High Data Byte
Page 27
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AS7264N − Application Information
Application Information
Schematic
Figure 36:
AS7264N Typical Application Circuit
3V3
100nF 10uF
10K
RST
17
VDD1
NF
7
14
VDD2
NF
6
2
RESN
NF
5
16
GND
NF
4
NF
3
NF
8
NF
NF
NF
NF
NF
19
20
1
11
12
3V3 3V3
SCL_M
Micro
Controller
Unit
Page 28
Document Feedback
SDA_M
INT
15
LED_DRV
18
LED_IND
9
SCL_S
10
SDA_S
13
INT
AS7264N
ams Datasheet
[v1-00] 2017-Oct-05
AS7264N − Application Information
PCB Layout
Figure 37:
Typical Layout Routing
In order to prevent interference, avoid trace routing
feedthroughs with exposure directly under the AS7264N. An
example routing is illustrated in the diagram.
ams Datasheet
[v1-00] 2017-Oct-05
Page 29
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AS7264N − Package Drawings & Markings
Package Drawings & Markings
Figure 38:
Package Drawing
AS7264N
XXXXX
RoHS
Green
Note(s):
1. Parallelism measurement shall exclude any effect of mark on top surface of package.
2. General lid tolerance should be ±0-05mm.
3. All linear dimensions are in millimeters.
4. XXXXX = tracecode
Page 30
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ams Datasheet
[v1-00] 2017-Oct-05
AS7264N − PCB Pad Layout
Suggested PCB pad layout guidelines for the LGA device are
shown.
PCB Pad Layout
Figure 39:
Recommended PCB Pad Layout
Unit: mm
0.30
1.10
0.65
4.60
1
4.40
Note(s):
1. Unless otherwise specified, all dimensions are in millimeters.
2. Dimensional tolerances are ±0.05mm unless otherwise noted.
3. This drawing is subject to change without notice.
ams Datasheet
[v1-00] 2017-Oct-05
Page 31
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AS7264N − Mechanical Data
Mechanical Data
Figure 40:
Tape & Reel Information
Note(s):
1. All dimensions in millimeters unless of otherwise stated.
2. Measured from centreline of sprocket hole to centreline of pocket.
3. Cumulative tolerance of 10 sprocket holes is ±0.20.
4. Measured from centreline of sprocket hole to centreline of pocket.
5. Other material available.
Page 32
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ams Datasheet
[v1-00] 2017-Oct-05
AS7264N − Soldering & Storage Information
Soldering & Storage
Information
Soldering Information
The module has been tested and has demonstrated an ability
to be reflow soldered to a PCB substrate. The solder reflow
profile describes the expected maximum heat exposure of
components during the solder reflow process of product on a
PCB. Temperature is measured on top of component. The
components should be limited to a maximum of three passes
through this solder reflow profile.
Figure 41:
Solder Reflow Profile
Parameter
Reference
Average temperature gradient in preheating
Soak time
Device
2.5°C/s
tSOAK
2 to 3 minutes
Time above 217°C(T1)
t1
Max 60s
Time above 230°C(T2)
t2
Max 50s
Time above Tpeak - 10°C(T3)
t3
Max 10s
Peak temperature in reflow
Tpeak
260°C
Temperature gradient in cooling
Max -5°C/s
Figure 42:
Solder Reflow Profile Graph
ams Datasheet
[v1-00] 2017-Oct-05
Page 33
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AS7264N − Soldering & Storage Information
Manufacturing Process Considerations
The AS7264N package is compatible with standard reflow
no-clean and cleaning processes including aqueous, solvent or
ultrasonic techniques. However, as an open-aperture device,
precautions must be taken to avoid particulate or solvent
contamination as a result of any manufacturing processes,
including pick and place, reflow, cleaning, integration assembly
and/or testing. Temporary covering of the aperture is allowed.
To avoid degradation of accuracy or performance in the end
product, care should be taken that any temporary covering and
associated sealants/debris are thoroughly removed prior to any
optical testing or final packaging.
Storage Information
Moisture Sensitivity
Optical characteristics of the device can be adversely affected
during the soldering process by the release and vaporization of
moisture that has been previously absorbed into the package.
To ensure the package contains the smallest amount of
absorbed moisture possible, each device is baked prior to being
dry packed for shipping.
Devices are dry packed in a sealed aluminized envelope called
a moisture-barrier bag with silica gel to protect them from
ambient moisture during shipping, handling, and storage
before use.
Shelf Life
The calculated shelf life of the device in an unopened moisture
barrier bag is 12 months from the date code on the bag when
stored under the following conditions:
• Shelf Life: 12 months
• Ambient Temperature: <40°C
• Relative Humidity: <90%
Rebaking of the devices will be required if the devices exceed
the 12 month shelf life or the Humidity Indicator Card shows
that the devices were exposed to conditions beyond the
allowable moisture region.
Page 34
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ams Datasheet
[v1-00] 2017-Oct-05
AS7264N − Soldering & Storage Information
Floor Life
The module has been assigned a moisture sensitivity level of
MSL 3. As a result, the floor life of devices removed from the
moisture barrier bag is 168 hours from the time the bag was
opened, provided that the devices are stored under the
following conditions:
• Floor Life: 168 hours
• Ambient Temperature: <30°C
• Relative Humidity: <60%
If the floor life or the temperature/humidity conditions have
been exceeded, the devices must be rebaked prior to solder
reflow or dry packing.
Rebaking Instructions
When the shelf life or floor life limits have been exceeded,
rebake at 50°C for 12 hours.
ams Datasheet
[v1-00] 2017-Oct-05
Page 35
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AS7264N − Ordering & Contact Information
Ordering & Contact Information
Figure 43:
Ordering Information
Ordering
Code
Package
Marking
Description
Delivery
Form
Delivery
Quantity
AS7264N-BLGT
20-pin LGA
AS7264N
XYZ and 440/490nm
Blue Sensor with
Electronic Shutter
Tape & Reel
2000 pcs/reel
Buy our products or get free samples online at:
www.ams.com/ICdirect
Technical Support is available at:
www.ams.com/Technical-Support
Provide feedback about this document at:
www.ams.com/Document-Feedback
For further information and requests, e-mail us at:
[email protected]
For sales offices, distributors and representatives, please visit:
www.ams.com/contact
Headquarters
ams AG
Tobelbader Strasse 30
8141 Premstaetten
Austria, Europe
Tel: +43 (0) 3136 500 0
Website: www.ams.com
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ams Datasheet
[v1-00] 2017-Oct-05
AS7264N − RoHS Compliant & ams Green Statement
RoHS Compliant & ams Green
Statement
RoHS: The term RoHS compliant means that ams AG products
fully comply with current RoHS directives. Our semiconductor
products do not contain any chemicals for all 6 substance
categories, including the requirement that lead not exceed
0.1% by weight in homogeneous materials. Where designed to
be soldered at high temperatures, RoHS compliant products are
suitable for use in specified lead-free processes.
ams Green (RoHS compliant and no Sb/Br): ams Green
defines that in addition to RoHS compliance, our products are
free of Bromine (Br) and Antimony (Sb) based flame retardants
(Br or Sb do not exceed 0.1% by weight in homogeneous
material).
Important Information: The information provided in this
statement represents ams AG knowledge and belief as of the
date that it is provided. ams AG bases its knowledge and belief
on information provided by third parties, and makes no
representation or warranty as to the accuracy of such
information. Efforts are underway to better integrate
information from third parties. ams AG has taken and continues
to take reasonable steps to provide representative and accurate
information but may not have conducted destructive testing or
chemical analysis on incoming materials and chemicals. ams AG
and ams AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited
information may not be available for release.
ams Datasheet
[v1-00] 2017-Oct-05
Page 37
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AS7264N − Copyrights & Disclaimer
Copyrights & Disclaimer
Copyright ams AG, Tobelbader Strasse 30, 8141 Premstaetten,
Austria-Europe. Trademarks Registered. All rights reserved. The
material herein may not be reproduced, adapted, merged,
translated, stored, or used without the prior written consent of
the copyright owner.
Devices sold by ams AG are covered by the warranty and patent
indemnification provisions appearing in its General Terms of
Trade. ams AG makes no warranty, express, statutory, implied,
or by description regarding the information set forth herein.
ams AG reserves the right to change specifications and prices
at any time and without notice. Therefore, prior to designing
this product into a system, it is necessary to check with ams AG
for current information. This product is intended for use in
commercial applications. Applications requiring extended
temperature range, unusual environmental requirements, or
high reliability applications, such as military, medical
life-support or life-sustaining equipment are specifically not
recommended without additional processing by ams AG for
each application. This product is provided by ams AG “AS IS”
and any express or implied warranties, including, but not
limited to the implied warranties of merchantability and fitness
for a particular purpose are disclaimed.
ams AG shall not be liable to recipient or any third party for any
damages, including but not limited to personal injury, property
damage, loss of profits, loss of use, interruption of business or
indirect, special, incidental or consequential damages, of any
kind, in connection with or arising out of the furnishing,
performance or use of the technical data herein. No obligation
or liability to recipient or any third party shall arise or flow out
of ams AG rendering of technical or other services.
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ams Datasheet
[v1-00] 2017-Oct-05
AS7264N − Document Status
Document Status
Document Status
Product Preview
Preliminary Datasheet
Datasheet
Datasheet (discontinued)
ams Datasheet
[v1-00] 2017-Oct-05
Product Status
Definition
Pre-Development
Information in this datasheet is based on product ideas in
the planning phase of development. All specifications are
design goals without any warranty and are subject to
change without notice
Pre-Production
Information in this datasheet is based on products in the
design, validation or qualification phase of development.
The performance and parameters shown in this document
are preliminary without any warranty and are subject to
change without notice
Production
Information in this datasheet is based on products in
ramp-up to full production or full production which
conform to specifications in accordance with the terms of
ams AG standard warranty as given in the General Terms of
Trade
Discontinued
Information in this datasheet is based on products which
conform to specifications in accordance with the terms of
ams AG standard warranty as given in the General Terms of
Trade, but these products have been superseded and
should not be used for new designs
Page 39
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AS7264N − Revision Information
Revision Information
Changes from 0-02 (2017-Sep-15) to current revision 1-00 (2017-Oct-05)
Page
Initial production version for release
Note(s):
1. Page and figure numbers for the previous version may differ from page and figure numbers in the current revision.
2. Correction of typographical errors is not explicitly mentioned.
Page 40
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ams Datasheet
[v1-00] 2017-Oct-05
AS7264N − Content Guide
Content Guide
ams Datasheet
[v1-00] 2017-Oct-05
1
1
2
2
General Description
Key Benefits & Features
Application
System Block Diagram
3
3
Pin Assignments
Pin Description
5
6
8
9
Absolute Maximum Ratings
Electrical Characteristics
Timing Characteristics
Operation Characteristics
11
11
12
13
14
14
15
15
15
16
18
18
18
20
24
24
Detailed Descriptions
XYZ Sensor
Data Conversion
Spectral Conversion and Data Acquisition
Temperature Sensor
Electronic Shutter with LED_IND or LED_DRV Driver
Control
Low Power Mode
Device Initialization and Pin Assignment
RC Oscillator
Reset
I²C Slave Interface
I²C Feature List
I²C Register Set
Detailed Register Description
Temperature Measurement High Register (bits 9:2)
Temperature Measurement Low Register (bits 1:0)
28
28
29
Application Information
Schematic
PCB Layout
30
31
32
Package Drawings & Markings
PCB Pad Layout
Mechanical Data
33
33
34
34
34
34
35
35
Soldering & Storage Information
Soldering Information
Manufacturing Process Considerations
Storage Information
Moisture Sensitivity
Shelf Life
Floor Life
Rebaking Instructions
36
37
38
39
40
Ordering & Contact Information
RoHS Compliant & ams Green Statement
Copyrights & Disclaimer
Document Status
Revision Information
Page 41
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