ASM2P2304NZ Four Output PCI-X and General Purpose Buffer Description The ASM2P2304NZ is a low−cost buffer designed to distribute high−speed clocks for PCI−X and other applications. The device operates at 3.3 V and outputs can run up to 140 MHz. http://onsemi.com Features • • • • • • • One Input to Four Output Buffer/Driver General−purpose or PCI−X Clock Buffer Buffers All Frequencies from DC to 140 MHz Output−to−Output Skew less than 100 pS Available in 8−pin TSSOP and SOIC Packages 3.3 V Operation These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant BUF_IN L L H L L L H L H H H © Semiconductor Components Industries, LLC, 2011 August, 2011 − Rev. 3 OUTPUT 4 OUTPUT 3 VDD OUTPUT 1 Output [1:4] L 1 OE Outputs OE TSSOP−8 T SUFFIX CASE 948AL PIN CONFIGURATION BUF_IN Table 1. FUNCTION TABLE Inputs SOIC−8 S SUFFIX CASE 751BD OUTPUT 2 GND (Top View) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 7 of this data sheet. 1 Publication Order Number: ASM2P2304NZ/D ASM2P2304NZ Logic Control OE BUF_IN OUTPUT 1 OUTPUT 2 OUTPUT 3 OUTPUT 4 Figure 1. Block Diagram Table 2. PIN DESCRIPTION Pin # Pin Name Type Description 1 BUF_IN (Note 1) I Input clock. 5 V Tolerant Input. 2 OE I Input pin for Output Enable, active HIGH. Connect to VDD. 3 Output 1 (Note 2) O Output 1. 4 GND P Ground. 5 Output 2 (Note 2) O Output 2. 6 VDD P 3.3 V Voltage Supply. 7 Output 3 (Note 2) O Output 3. 8 Output 4 (Note 2) O Output 4. 1. Weak pull down on input. 2. Weak pull down on all outputs. Table 3. ABSOLUTE MAXIMUM RATINGS Parameter Description Min Max Supply Voltage to Ground Potential −0.5 7 V DC Input Voltage (Except BUF_IN) −0.5 VDD + 0.5 V DC Input Voltage (BUF_IN) −0.5 7 V Storage Temperature −65 +150 °C Max. Soldering Temperature (10 sec) 260 °C Junction Temperature 150 °C Static Discharge Voltage (As per JEDEC STD22− A114−B) 2000 V Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. http://onsemi.com 2 ASM2P2304NZ Table 4. OPERATING CONDITIONS Parameter Min Max Unit Supply Voltage 3.0 3.6 V TA Operating Temperature (Ambient Temperature) −40 85 °C CL Load Capacitance 25 pF CIN Input Capacitance VDD BUF_IN, OUTPUT [1:4] tPU Description 7 pF Operating Frequency DC 140 MHz Power−up time for all VDD’s to reach minimum specified Voltage (Power ramps must be monotonic) 0.05 50 mS Min Max Unit 0.8 V Table 5. ELECTRICAL CHARACTERISTICS Parameter Description Test Conditions VIL Input LOW Voltage (Note 3) VIH Input HIGH Voltage (Note 3) IIL Input LOW Current VIN = 0 V −5 5 mA IIH Input HIGH Current VIN = VDD −5 12 mA VOL Output LOW Voltage (Note 4) IOL = 24 mA 0.8 V IOL = 12 mA 0.55 V 2.0 VOH Output HIGH Voltage (Note 4) IOH = −24 mA 2.0 IOH = −12 mA 2.4 IDD Supply Current Unloaded outputs at 66.66 MHz V V V 25 mA Table 6. SWITCHING CHARACTERISTICS (for Commercial and Industrial Temperature Devices) (Note 5) Parameter Name (Note 4) Description Min Typ Max Unit 40.0 50.0 60.0 % tD Duty Cycle = t2 ÷ t1 Measured at 1.5 V t3 Rise Time Measured between 0.8 V and 2.0 V 1.50 nS t4 Fall Time Measured between 2.0 V and 0.8 V 1.50 nS t5 Output to Output Skew All outputs equally loaded 100 pS t6 Propagation Delay, BUF_IN Rising Edge to OUTPUT Rising Edge Measured at VDD/2 For Commercial parts For Industrial parts 150 2.5 3. BUF_IN input has a threshold voltage of VDD/2. 4. Parameter is guaranteed by design and characterization. It is not 100% tested in production. 5. All parameters specified with loaded outputs. http://onsemi.com 3 3.5 5 nS ASM2P2304NZ Switching Waveforms t1 t2 1.5 V 1.5 V 1.5 V Figure 2. Duty Cycle Timing OUTPUT 2.0 V 3.3 V 2.0 V 0.8 V 0.8 V t3 t4 Figure 3. All Outputs Rise/Fall Time OUTPUT 1.5 V 1.5 V OUTPUT t5 Figure 4. Output−Output Skew INPUT VDD/2 VDD/2 OUTPUT t6 Figure 5. Input−Output Propagation Delay http://onsemi.com 4 0V ASM2P2304NZ PACKAGE DIMENSIONS TSSOP8, 4.4x3 CASE 948AL−01 ISSUE O b SYMBOL MIN NOM A E1 E MAX 1.20 A1 0.05 A2 0.80 b 0.19 0.30 c 0.09 0.20 D 2.90 3.00 3.10 E 6.30 6.40 6.50 E1 4.30 4.40 4.50 0.15 0.90 e 0.65 BSC L 1.00 REF L1 0.50 θ 0º 0.60 1.05 0.75 8º e TOP VIEW D A2 c q1 A A1 L1 SIDE VIEW L END VIEW Notes: (1) All dimensions are in millimeters. Angles in degrees. (2) Complies with JEDEC MO-153. http://onsemi.com 5 ASM2P2304NZ PACKAGE DIMENSIONS SOIC 8, 150 mils CASE 751BD−01 ISSUE O E1 E SYMBOL MIN A 1.35 1.75 A1 0.10 0.25 b 0.33 0.51 c 0.19 0.25 D 4.80 5.00 E 5.80 6.20 E1 3.80 4.00 MAX 1.27 BSC e PIN # 1 IDENTIFICATION NOM h 0.25 0.50 L 0.40 1.27 θ 0º 8º TOP VIEW D h A1 θ A c e b L END VIEW SIDE VIEW Notes: (1) All dimensions are in millimeters. Angles in degrees. (2) Complies with JEDEC MS-012. http://onsemi.com 6 ASM2P2304NZ Table 7. ORDERING INFORMATION Part Number Marking Package Type Temperature P2P2304NZF−08ST 2P2304NZF 8−pin SOIC − Tube, Pb Free Commercial P2P2304NZF−08SR 2P2304NZF 8−pin SOIC − Tape and Reel, Pb Free Commercial ASM2I2304NZF−08−ST 2I2304NZF 8−pin SOIC − Tube, Pb Free ASM2I2304NZF−08−SR 2I2304NZF 8−pin SOIC − Tape and Reel, Pb Free ASM2P2304NZF−08−TT 2P2304NZF 8−pin TSSOP − Tube, Pb Free Commercial P2P2304NZF−08TR 2P2304NZF 8−pin TSSOP − Tape and Reel, Pb Free Commercial P2I2304NZF−08TT 2I2304NZF 8−pin TSSOP − Tube, Pb Free Industrial P2I2304NZF−08−TR 2I2304NZF 8−pin TSSOP − Tape and Reel, Pb Free Industrial Industrial Industrial ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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