MLX90640 32x24 IR array Short form Datasheet 1. Features and Benefits Small size, low cost 32x24 pixels IR array Easy to integrate Industry standard four lead TO39 package Factory calibrated I2C compatible digital interface Programmable frame rate 0,5Hz…32Hz 3V supply voltage 2 FOV options – 55°x35° and 110°x75° Operating temperature -40°C ÷ 85°C Target temperature -40°C ÷ 300°C 2. Application Examples Temperature sensing in residential, industrial and commercial air conditioning Home appliances with temperature control Thermal Comfort sensor in automotive Air Conditioning control systems Passenger detection and classification Microwave ovens Industrial temperature control Identifying thermal leaks in homes Security / safety gates Presence detection / Person localization Complies with RoHS regulations 3. Description The MLX90640 is a fully calibrated 32x24 pixels IR array in an industry standard 4-lead TO39 package with digital interface The MLX90640 contains 768 FIR pixels. An ambient sensor is integrated to measure the ambient temperature of the chip and supply sensor to measure the VDD. The outputs of all sensors IR, Ta and VDD are stored in internal RAM and are accessible through I2C. MLX90640 32x24 IR array Short form Datasheet Contents 1. Features and Benefits ............................................................................................................................ 1 2. Application Examples............................................................................................................................. 1 3. Description ............................................................................................................................................ 1 4. Ordering Information ............................................................................................................................ 3 5. Glossary of Terms .................................................................................................................................. 4 6. Pin Definitions and Descriptions ............................................................................................................ 5 6.1. Pin Definition....................................................................................................................................... 5 6.2. Absolute Maximum Ratings ............................................................................................................... 5 7. Detailed General Description................................................................................................................. 6 7.1. Pixel position ....................................................................................................................................... 6 7.2. Communication protocol.................................................................................................................... 7 Low level .................................................................................................................................................. 7 7.3. Device modes ...................................................................................................................................... 7 Normal mode .......................................................................................................................................... 7 Step mode ............................................................................................................................................... 8 8. General Electrical Specifications ............................................................................................................ 9 9. Mechanical drawings ........................................................................................................................... 10 FOV 55° ..................................................................................................................................................... 10 FOV 110° ................................................................................................................................................... 11 Disclaimer................................................................................................................................................ 12 REVISION 3 – NOVEMBER 4, 2016 Page 2 of 12 MLX90640 32x24 IR array Short form Datasheet 4. Ordering Information Product Temperature Package Option Code Custom Configuration Packing Form Definition MLX90640 E SF BAA 000 TU 32x24 IR array MLX90640 E SF BAB 000 TU 32x24 IR array Legend: Temperature Code: E: -40°C to 85°C Package Code: “SF” for TO39 package Option Code: BAA – FOV = 110°x75° BAB – FOV = 50°x35° Custom configuration Packing Form: Ordering Example: 000 – standard product “TU” - Tubes “MLX90640ESF-BAA-000-TU” Table 1 Ordering information REVISION 3 – NOVEMBER 4, 2016 Page 3 of 12 MLX90640 32x24 IR array Short form Datasheet 5. Glossary of Terms TC POR Temperature Coefficient (in ppm/°C) Power On Reset IR Infra-Red Ta Ambient Temperature – the temperature of the TO39 package IR data Infrared data (raw data from ADC proportional to IR energy received by the sensor) ADC Analog To Digital Converter TGC Temperature Gradient Coefficient FOV Field Of View nFOV Field Of View of the N-th pixel 2 IC Inter-Integrated Circuit communication protocol SDA Serial Data SCL Serial Clock LSB Least Significant Bit MSB Most Significant Bit Fps Frames per Second – data refresh rate MD Master Device SD Slave Device ASP Analog Signal Processing DSP Digital Signal Processing ESD Electro Static Discharge EMC Electro Magnetic Compatibility NC Not Connected NA Not Applicable Table 2 Glosarry of terms REVISION 3 – NOVEMBER 4, 2016 Page 4 of 12 MLX90640 32x24 IR array Short form Datasheet 6. Pin Definitions and Descriptions 6.1. Pin Definition Pin # Name Description 1 SDA I2C serial data (input / output) 2 VDD Positive supply 3 GND Negative supply (Ground) 4 SCL I2C serial clock (input only) Table 3 Pin definition 6.2. Absolute Maximum Ratings Parameter Symbol Min. Typ. Max. Unit V Supply Voltage (over voltage) VDD 5 Supply Voltage (operating max voltage) VDD 3.6 Reverse Voltage (each pin) Operating Temperature Storage Temperature ESD sensitivity (AEC Q100 002) SDA DC sink current -0.3 V TAMB -40 +85 °C TST -40 +125 °C 2 Remark kV 40 mA Table 4 Absolute maximum ratings Exceeding the absolute maximum ratings may cause permanent damage. Exposure to absolute maximumrated conditions for extended periods may affect device reliability. REVISION 3 – NOVEMBER 4, 2016 Page 5 of 12 MLX90640 32x24 IR array Short form Datasheet 7. Detailed General Description 7.1. Pixel position Col 3 Col 2 Col 1 Col 32 The array consists of 768 IR sensors (also called pixels). Each pixel is identified with its row and column position as Pix(i,j) where i is its row number (from 1 to 24) and j is its column number (from 1 to 32) Row 1 Row 2 Row 3 VDD 0 Row 24 SDA GND SCL Reference tap Figure 1 Pixel in the whole FOV REVISION 3 – NOVEMBER 4, 2016 Page 6 of 12 MLX90640 32x24 IR array Short form Datasheet 7.2. Communication protocol Low level Start / Stop conditions Each communication session is initiated by a START condition and ends with a STOP condition. A START condition is initiated by a HIGH to LOW transition of the SDA while a STOP is generated by a LOW to HIGH transition. Both changes must be done while the SCL is HIGH. Device addressing The master is addressing the slave device by sending a 7-bit slave address after the START condition. The first seven bits are th dedicated for the address and the 8 is Read/Write (R/W) bit. This bit indicates the direction of the transfer: • Read (HIGH) means that the master will read the data from the slave • Write (LOW) means that the master will send data to the slave Acknowledge th During the 9 clock following every byte transfer the transmitter releases the SDA line. The receiver acknowledges (ACK) receiving the byte by pulling SDA line to low or does not acknowledge (NoACK) by letting the SDA ‘HIGH’. I2C command format Slave address MSByte address SDA 2 S 0 1 1 I C write LSByte address 0 0 1 1 W A A MSByte data A LSByte data A A P SCL 2 Figure 2 I C write command format (default SA=0x33 is used) Slave address Slave address 2 MSByte address SDA I C read S 0 1 1 0 0 1 1 W A LSByte address A MSByte data A S 0 1 1 0 0 1 1 W A LSByte data A NAK P SCL 2 Figure 3 I C read command format (default SA=0x33 is used) 7.3. Device modes The device can operate in following modes: • Normal mode • Step mode Normal mode In this mode the measurements are constantly running. Depending on the selected frame rate Fps in the control register, the data for IR pixels and Ta will be updated in the RAM each 1/Fps seconds. In this mode the external microcontroller has full access to the internal registers and memories of the device. REVISION 3 – NOVEMBER 4, 2016 Page 7 of 12 MLX90640 32x24 IR array Short form Datasheet Step mode This mode is foreseen for single measurements triggered by an external device (microcontroller). Entering this mode is possible by writing the appropriate code in the configuration register. A measurement is triggered by setting the start measurement bit to 1 in status register. The measurement time is A flag bit in Status register (bit 0x03) is dedicated in order to be able to check whenever the measurement is done. REVISION 3 – NOVEMBER 4, 2016 Page 8 of 12 MLX90640 32x24 IR array Short form Datasheet 8. General Electrical Specifications Electrical Parameter Symbol Min. Typ. Max. Unit Condition Supply Voltage VDD 2.9 3 3.6 V Supply Current IDD 8 10 14 mA VPOR_UP 0.9 2.0 V VDD rising 1.95 V VDD falling 2.6 V VDD rising 2.55 V VDD falling POR level up digital POR level down digital POR level up analog POR level down analog POR hysteresis VPOR_DOWN VPOR_UP 2.2 VPOR_DOWN VPOR_hys Input high voltage (SDA, SCL) VIH Input low voltage (SDA, SCL) VLOW SDA output low voltage 50 mV V Over Ta and VDD 0.3*VDD V Over Ta and VDD VOL 0.4 V Over Ta and VDD ISINK=3mA SDA leakage ISDA_leak ±10 µA VSDA=3.6V, Ta=125°C SCL leakage ISCL_leak ±10 µA VSCL=3.6V, Ta=125°C SDA capacitance CSDA 10 pF SCL capacitance CSCL 10 pF Acknowledge setup time TSUAC(MD) 0.45 µs Acknowledge hold time TDUAC(MD) 0.45 µs Acknowledge setup time TSUAC(SD) 0.45 µs Acknowledge hold time TDUAC(SD) 0.45 µs FI2C 1 MHz I2C clock frequency Erase/write cycles 0.7*VDD TBD times Ta=25°C TBD Ta=125°C, erase/write times at high temperature must be checked, avoid Erase/write cycles Write cell time TWRITE 5 ms Table 5 Electrical specification REVISION 3 – NOVEMBER 4, 2016 Page 9 of 12 MLX90640 32x24 IR array Short form Datasheet 9. Mechanical drawings FOV 55° Figure 4 Mechanical drawing of 55° FOV device REVISION 3 – NOVEMBER 4, 2016 Page 10 of 12 MLX90640 32x24 IR array Short form Datasheet FOV 110° Figure 5 Mechanical drawing of 110° FOV device REVISION 3 – NOVEMBER 4, 2016 Page 11 of 12 MLX90640 32x24 IR array Short form Datasheet Disclaimer Devices sold by Melexis are covered by the warranty and patent indemnification provisions appearing in its Term of Sale. Melexis makes no warranty, express, statutory, implied, or by description regarding the information set forth herein or regarding the freedom of the described devices from patent infringement. Melexis reserves the right to change specifications and prices at any time and without notice. Therefore, prior to designing this product into a system, it is necessary to check with Melexis for current information. This product is intended for use in normal commercial applications. Applications requiring extended temperature range, unusual environmental requirements, or high reliability applications, such as military, medical life-support or life-sustaining equipment are specifically not recommended without additional processing by Melexis for each application. The information furnished by Melexis is believed to be correct and accurate. However, Melexis shall not be liable to recipient or any third party for any damages, including but not limited to personal injury, property damage, loss of profits, loss of use, interrupt of business or indirect, special incidental or consequential damages, of any kind, in connection with or arising out of the furnishing, performance or use of the technical data herein. No obligation or liability to recipient or any third party shall arise or flow out of Melexis’ rendering of technical or other services. © 2016 Melexis NV. All rights reserved. www.melexis.com REVISION 3 – NOVEMBER 4, 2016 Page 12 of 12