Material Content Data Sheet Sales Product Name SGW30N60HS MA# MA000617830 Package PG-TO247-3-41 Issued 29. August 2013 Weight* 6047.91 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal inorganic material non noble metal non noble metal organic material plastics inorganic material non noble metal non noble metal non noble metal noble metal non noble metal inorganic material non noble metal non noble metal < 10% silicon iron phosphorus copper aluminium carbon black epoxy resin silicondioxide tin nickel antimony silver tin phosphorus iron copper 7440-21-3 7439-89-6 7723-14-0 7440-50-8 7429-90-5 1333-86-4 60676-86-0 7440-31-5 7440-02-0 7440-36-0 7440-22-4 7440-31-5 7723-14-0 7439-89-6 7440-50-8 5.987 0.10 0.530 0.01 wire encapsulation leadfinish plating solder heatspreader *deviation Sum [%] Average Mass [ppm] Sum [ppm] 0.10 990 990 88 0.159 0.00 529.068 8.75 8.76 87480 26 87594 4.078 0.07 0.07 674 674 20.010 0.33 3309 380.191 6.29 1600.803 26.47 33.09 264687 330859 31.874 0.53 0.53 5270 5270 29.065 0.48 0.48 4806 4806 0.366 0.01 0.915 0.02 2.378 0.04 1.033 0.02 3.442 0.06 3438.006 56.82 62863 61 151 0.07 393 569 56.90 568462 Sum in total: 100,00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 605 171 569202 1000000