Material Content Data Sheet Sales Product Name TDA7210 Issued MA# MA000527228 Package PG-TSSOP-28-1 Weight* Construction Element Material Group Substances CAS# if applicable chip leadframe inorganic material non noble metal non noble metal noble metal organic material plastics inorganic material non noble metal noble metal plastics noble metal < 10% silicon nickel iron gold carbon black epoxy resin silicondioxide tin silver acrylic resin silver 7440-21-3 7440-02-0 7439-89-6 7440-57-5 1333-86-4 60676-86-0 7440-31-5 7440-22-4 7440-22-4 wire encapsulation leadfinish plating glue *deviation 28. August 2013 Weight [mg] 106.98 mg Average Mass [%] Sum [%] 2.30 Average Mass [ppm] Sum [ppm] 22970 22970 2.457 2.30 14.398 13.46 19.882 18.59 32.05 185855 320440 0.938 0.88 0.88 8769 8769 0.196 0.18 134585 1833 8.301 7.76 56.867 53.15 61.09 531573 611004 1.539 1.44 1.44 14391 14391 1.416 1.32 1.32 13233 13233 0.197 0.18 0.787 0.74 77598 1839 0.92 Sum in total: 100,00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 7354 9193 1000000