Cypress CY7C1069AV33-12BAI 2m x 8 static ram Datasheet

CY7C1069AV33
2M x 8 Static RAM
Features
Functional Description
• High speed
The CY7C1069AV33 is a high-performance CMOS Static
RAM organized as 2,097,152 words by 8 bits. Writing to the
device is accomplished by enabling the chip (by taking CE1
LOW and CE2 HIGH) and Write Enable (WE) inputs LOW.
— tAA = 10, 12 ns
• Low active power
— 990 mW (max.)
Reading from the device is accomplished by enabling the chip
(CE1 LOW and CE2 HIGH) as well as forcing the Output
Enable (OE) LOW while forcing the Write Enable (WE) HIGH.
See the truth table at the back of this data sheet for a complete
description of Read and Write modes.
• Operating voltages of 3.3 ± 0.3V
• 2.0V data retention
• Automatic power-down when deselected
• TTL-compatible inputs and outputs
• Easy memory expansion with CE1 and CE2 features
• Available in Pb-free and non Pb-free 54-pin TSOP II ,
non Pb-free 60-ball fine-pitch ball grid array (FBGA)
package
The input/output pins (I/O0 through I/O7) are placed in a
high-impedance state when the device is deselected (CE1
HIGH or CE2 LOW), the outputs are disabled (OE HIGH), or
during a Write operation (CE1 LOW, CE2 HIGH, and WE
LOW).
The CY7C1069AV33 is available in a 54-pin TSOP II package
with center power and ground (revolutionary) pinout, and a
60-ball fine-pitch ball grid array (FBGA) package.
Logic Block Diagram
Pin Configurations[1, 2]
TSOP II
Top View
I/O0
Data in Drivers
I/O1
2048K x 8
ARRAY
I/O3
I/O4
I/O5
I/O6
POWER
DOWN
COLUMN
DECODER
CE1
CE2
I/O2
SENSE AMPS
ROW DECODER
A0
A1
A2
A3
A4
A5
A6
A7
A
A98
A10
A11
A12
1
2
3
54
53
4
52
51
5
6
50
49
7
8
9
10
11
12
48
47
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
NC
VSS
NC
I/O5
VCC
I/O4
A5
A6
A7
A8
A9
NC
OE
VSS
DNU
A20
A10
A11
A12
A13
A14
I/O3
VSS
I/O2
NC
VCC
NC
I/O7
Cypress Semiconductor Corporation
Document #: 38-05255 Rev. *F
A17
A18
A19
A20
A16
A13
A14
A15
WE
OE
NC
VCC
NC
I/O6
VSS
I/O7
A4
A3
A2
A1
A0
NC
CE1
VCC
WE
CE2
A19
A18
A17
A16
A15
I/O0
VCC
I/O1
NC
VSS
NC
•
198 Champion Court
•
San Jose, CA 95134-1709
•
408-943-2600
Revised August 3, 2006
[+] Feedback
CY7C1069AV33
Selection Guide
–10
–12
Unit
Maximum Access Time
10
12
ns
Maximum Operating Current
275
260
mA
Maximum CMOS Standby Current
50
50
mA
Pin Configurations[1, 2](continued)
1
NC
2
60-ball FBGA
(Top View)
3
4
5
6
NC
NC
NC
NC
NC
OE
A0
A1
A2
CE2
A
NC
NC
A3
A4
CE1
NC
B
I/O0
NC
A5
A6
NC
I/O4
C
VSS
I/O1
A17
A7
I/O5 V
CC
D
VCC I/O2
A18
A16 I/O6 VSS
E
I/O3
NC
A14
A15
NC
I/O7
F
NC
DNU
A12
A13
WE
NC
G
A19
A8
A9
A10
A11 A20
H
NC
NC
NC
NC
NC
NC
NC
Notes:
1. NC pins are not connected on the die.
2. DNU pins have to be left floating or tied to VSS to ensure proper application.
Document #: 38-05255 Rev. *F
Page 2 of 9
[+] Feedback
CY7C1069AV33
Maximum Ratings
DC Input Voltage[3] ................................ –0.5V to VCC + 0.5V
(Above which the useful life may be impaired. For user guidelines, not tested.)
Current into Outputs (LOW)......................................... 20 mA
Operating Range
Storage Temperature ................................. –65°C to +150°C
Range
Ambient
Temperature
VCC
Commercial
0°C to +70°C
3.3V ± 0.3V
Ambient Temperature with
Power Applied............................................. –55°C to +125°C
[3]
Supply Voltage on VCC to Relative GND
.... –0.5V to +4.6V
Industrial
DC Voltage Applied to Outputs
in High-Z State[3] ....................................–0.5V to VCC + 0.5V
–40°C to +85°C
DC Electrical Characteristics Over the Operating Range
–10
Parameter
Description
Test Conditions
Min.
2.4
–12
Max.
VOH
Output HIGH Voltage
VCC = Min., IOH = –4.0 mA
VOL
Output LOW Voltage
VCC = Min., IOL = 8.0 mA
VIH
Input HIGH Voltage
2.0
VCC + 0.3
VIL
Input LOW Voltage[3]
–0.3
0.8
Min.
Max.
Unit
2.4
V
0.4
0.4
V
2.0
VCC + 0.3
V
–0.3
0.8
V
–1
+1
–1
+1
µA
–1
+1
–1
+1
µA
275
260
mA
CE2 < VIL,
Max. VCC, CE1 > VIH
VIN > VIH or VIN < VIL, f = fMAX
70
70
mA
CE2 < 0.3V, Max. VCC,
CE1> VCC – 0.3V,
VIN > VCC – 0.3V,
or VIN < 0.3V, f = 0
50
50
mA
IIX
Input Leakage Current
IOZ
Output Leakage Current GND < VOUT < VCC, Output Disabled
GND < VI < VCC
ICC
VCC Operating
Supply Current
VCC = Max.,
f = fMAX = 1/tRC
ISB1
Automatic CE
Power-down Current
—TTL Inputs
ISB2
Automatic CE
Power-down Current
—CMOS Inputs
Capacitance[4]
Parameter
CIN
Description
Test Conditions
Input Capacitance
COUT
TSOP II
TA = 25°C, f = 1 MHz, VCC = 3.3V
I/O Capacitance
FBGA
Unit
6
8
pF
8
10
pF
AC Test Loads and Waveforms[5]
50Ω
R1 317 Ω
VTH = 1.5V
OUTPUT
Z0 = 50Ω
3.3V
30 pF* *Capacitive Load consists of all
components of the test environment
OUTPUT
5 pF*
*Including
jig and
scope
(b)
(a)
All input pulses
3.3V
GND
90%
10%
R2
351Ω
90%
10%
Fall time: > 1V/ns
Rise time > 1V/ns
(c)
Notes:
3. VIL (min.) = –2.0V for pulse durations of less than 20 ns.
4. Tested initially and after any design or process changes that may affect these parameters.
5. Valid SRAM operation does not occur until the power supplies have reached the minimum operating VDD (3.0V). As soon as 1ms (Tpower) after reaching the
minimum operating VDD, normal SRAM operation can begin including reduction in VDD to the data retention (VCCDR, 2.0V) voltage.
Document #: 38-05255 Rev. *F
Page 3 of 9
[+] Feedback
CY7C1069AV33
AC Switching Characteristics Over the Operating Range
[7]
–10
Parameter
Description
Min.
–12
Max.
Min.
Max.
Unit
Read Cycle
tpower
VCC(typical) to the First Access[8]
1
tRC
Read Cycle Time
10
tAA
Address to Data Valid
tOHA
Data Hold from Address Change
tACE
CE1 LOW/CE2 HIGH to Data Valid
10
12
ns
tDOE
OE LOW to Data Valid
5
6
ns
3
OE LOW to Low-Z
tHZOE
OE HIGH to High-Z
tLZCE
[9]
CE1 LOW/CE2 HIGH to Low-Z
tHZCE
CE1 HIGH/CE2 LOW to
9]
High-Z[
tPU
CE1 LOW/CE2 HIGH to
Power-up[10]
tPD
CE1 HIGH/CE2 LOW to Power-down
Write
5
ns
6
3
5
0
ns
ns
6
0
10
ns
ns
1
3
[10]
ns
12
3
1
[9]
ms
12
10
[9]
tLZOE
1
ns
ns
12
ns
Cycle[10, 11]
tWC
Write Cycle Time
10
12
ns
tSCE
CE1 LOW/CE2 HIGH to Write End
7
8
ns
tAW
Address Set-up to Write End
7
8
ns
tHA
Address Hold from Write End
0
0
ns
tSA
Address Set-up to Write Start
0
0
ns
tPWE
WE Pulse Width
7
8
ns
tSD
Data Set-up to Write End
5.5
6
ns
tHD
Data Hold from Write End
0
0
ns
tLZWE
tHZWE
WE HIGH to
Low-Z[9]
WE LOW to
9
High-Z[ ]
3
3
5
ns
6
ns
Data Retention Waveform
DATA RETENTION MODE
VCC
3.0V
tCDR
VDR > 2V
3.0V
tR
CE
Notes:
6. Valid SRAM operation does not occur until the power supplies have reached the minimum operating VDD (3.0V). As soon as 1ms (Tpower) after reaching the
minimum operating VDD, normal SRAM operation can begin including reduction in VDD to the data retention (VCCDR, 2.0V) voltage.
7. Test conditions assume signal transition time of 3 ns or less, timing reference levels of 1.5V, input pulse levels of 0 to 3.0V, and output loading of the specified
IOL/IOH and transmission line loads. Test conditions for the Read cycle use output loading shown in part a) of the AC test loads, unless specified otherwise.
8. This part has a voltage regulator which steps down the voltage from 3V to 2V internally. tpower time has to be provided initially before a Read/Write operation is
started.
9. tHZOE, tHZSCE, tHZWE and tLZOE, tLZCE, and tLZWE are specified with a load capacitance of 5 pF as in (b) of AC Test Loads. Transition is measured ±200 mV from
steady-state voltage.
10. These parameters are guaranteed by design and are not tested.
11. The internal Write time of the memory is defined by the overlap of CE1 LOW/CE2 HIGH, and WE LOW. CE1 and WE must be LOW along with CE2 HIGH to initiate
a Write, and the transition of any of these signals can terminate the Write. The input data set-up and hold timing should be referenced to the leading edge of the
signal that terminates the Write.
12. The minimum Write cycle time for Write Cycle No. 3 (WE controlled, OE LOW) is the sum of tHZWE and tSD.
Document #: 38-05255 Rev. *F
Page 4 of 9
[+] Feedback
CY7C1069AV33
Switching Waveforms
Read Cycle No. 1[13, 14]
tRC
ADDRESS
tAA
tOHA
DATA OUT
PREVIOUS DATA VALID
DATA VALID
Read Cycle No. 2 (OE Controlled)[14, 15]
ADDRESS
tRC
CE1
CE2
tASCE
OE
tHZOE
tDOE
tHZSCE
tLZOE
DATA OUT
HIGH IMPEDANCE
tLZSCE
VCC
SUPPLY
CURRENT
HIGH
IMPEDANCE
DATA VALID
tPD
tPU
50%
ICC
50%
ISB
Notes:
13. Device is continuously selected. CE1 = VIL, CE2 = VIH.
14. WE is HIGH for Read cycle.
15. Address valid prior to or coincident with CE1 transition LOW and CE2 transition HIGH.
Document #: 38-05255 Rev. *F
Page 5 of 9
[+] Feedback
CY7C1069AV33
Switching Waveforms (continued)
Write Cycle No. 1 (CE1 Controlled)[16, 17, 18]
tWC
ADDRESS
tSA
CE
tSCE
tAW
tHA
tPWE
WE
t BW
tSD
tHD
DATAI/O
Write Cycle No. 2 (WE Controlled, OE LOW)[16, 17, 18]
tWC
ADDRESS
tSCE
CE
tAW
tHA
tSA
tPWE
WE
tHZWE
tSD
tHD
DATA I/O
tLZWE
Truth Table
CE1
CE2
OE
WE
I/O0–I/O7
Mode
Power
H
X
X
X
High-Z
Power-down
Standby (ISB)
X
L
X
X
High-Z
Power-down
Standby (ISB)
L
H
L
H
Data Out
Read All Bits
Active (ICC)
L
H
X
L
Data In
Write All Bits
Active (ICC)
L
H
H
H
High-Z
Selected, Outputs Disabled
Active (ICC)
Notes:
16. Data I/O is high-impedance if OE = VIH.
17. If CE1 goes HIGH/CE2 LOW simultaneously with WE going HIGH, the output remains in a high–impedance state.
18. CE above is defined as a combination of CE1 and CE2. It is active low.
Document #: 38-05255 Rev. *F
Page 6 of 9
[+] Feedback
CY7C1069AV33
Ordering Information
Speed
(ns)
10
12
Ordering Code
CY7C1069AV33-10ZC
CY7C1069AV33-10ZXC
CY7C1069AV33-10BAC
CY7C1069AV33-10ZI
CY7C1069AV33-10ZXI
CY7C1069AV33-10BAI
CY7C1069AV33-12ZC
CY7C1069AV33-12ZXC
CY7C1069AV33-12BAC
CY7C1069AV33-12ZI
CY7C1069AV33-12ZXI
CY7C1069AV33-12BAI
Package
Diagram
51-85160
51-85162
51-85160
51-85162
51-85160
51-85162
51-85160
51-85162
Package Type
54-pin TSOP II
54-pin TSOP II (Pb-free)
60-ball (8 mm x 20 mm x 1.2 mm) FBGA
54-pin TSOP II
54-pin TSOP II (Pb-free)
60-ball (8 mm x 20 mm x 1.2 mm) FBGA
54-pin TSOP II
54-pin TSOP II (Pb-free)
60-ball (8 mm x 20 mm x 1.2 mm) FBGA
54-pin TSOP II
54-pin TSOP II (Pb-free)
60-ball (8 mm x 20 mm x 1.2 mm) FBGA
Operating
Range
Commercial
Industrial
Commercial
Industrial
Package Diagrams
54-pin TSOP II (51-85160)
51-85160-**
Document #: 38-05255 Rev. *F
Page 7 of 9
[+] Feedback
CY7C1069AV33
Package Diagrams (continued)
60-ball FBGA (8 mm x 20 mm x 1.2 mm) (51-85162)
TOP VIEW
A1 CORNER
1
2
3
4
5
BOTTOM VIEW
6
A1 CORNER
6
5
4
3
2
1
DUMMY BALL (0.3) X12
Ø0.05 M C
Ø0.25 M C A B
Ø0.30±0.05(48X)
A
B
A
G
H
C
D
E
0.75
F
18.00
20.00±0.10
E
2.625
B
D
5.25
20.00±0.10
C
F
G
H
0.75
DIMENSIONS IN MM
1.00
PART #
A
B
8.00±0.10
1.875
A
BA60A
STANDARD PKG.
BK60A
LEAD FREE PKG.
0.75
0.75
1.00
PKG WEIGHT: 0.30 gms
6.00
0.15 C
0.21±0.05
0.25 C
0.53±0.05
3.75
B
0.15(4X)
8.00±0.10
51-85162-*D
C
1.20 MAX
0.36
SEATING PLANE
All product and company names mentioned in this document may be the trademarks of their respective holders
Document #: 38-05255 Rev. *F
Page 8 of 9
© Cypress Semiconductor Corporation, 2006. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be
used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its
products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
[+] Feedback
CY7C1069AV33
Document History Page
Document Title: CY7C1069AV33 2M x 8 Static RAM
Document Number: 38-05255
REV.
ECN NO.
Issue
Date
Orig. of
Change
Description of Change
**
113724
03/27/02
NSL
New Data Sheet
*A
117060
07/31/02
DFP
Removed 15-ns bin
*B
117990
08/30/02
DFP
Added 8-ns bin
Changing ICC for 8, 10, 12 bins
tpower changed from 1 µs to 1 ms
Load Cap Comment changed (for Tx line load)
tSD changed to 5.5 ns for the 10-ns bin
Changed some 8-ns bin #'s (tHZ, tDOE, tDBE)
Removed hz < lz comments
*C
120385
11/13/02
DFP
Final Data Sheet
Added note 4 to “AC Test Loads and Waveforms” and note 7 to tpu and tpd
Updated Input/Output Caps (for 48BGA only) to 8 pf/10 pf and for the 54-pin
TSOP to 6/8 pf
*D
124441
2/25/03
MEG
Changed ISB1 from 100 mA to 70 mA
Shaded the 48fBGA product offering information
*E
403984
See ECN
NXR
Changed the Logic Block Diagram On page # 1
Added notes under Pin Configuration
Changed the Package diagram of 51-85162 from Rev *A to Rev *D
Changed 48-Ball FBGA to 60-Ball FBGA in Pin Configuration
Updated the Ordering Information
*F
492137
See ECN
NXR
Removed 8 ns speed bin from product offering
Changed the description of IIX from Input Load Current to Input Leakage
Current in DC Electrical Characteristics table
Updated the Ordering Information
Document #: 38-05255 Rev. *F
Page 9 of 9
[+] Feedback
Similar pages