TYPICAL APPLICATION CIRCUITS Input voltage range: 3.3 V to 20 V Maximum output current: 500 mA Low noise: 15 µV rms for fixed output versions PSRR performance of 60 dB at 10 kHz, VOUT = 3.3 V Reverse current protection Low dropout voltage: 350 mV at 500 mA Initial accuracy: ±0.8% Accuracy over line, load, and temperature: −2% to +1% Low quiescent current: 900 μA at VIN = 10 V, IOUT = 500 mA Low shutdown current: <50 µA at VIN = 12 V, stable with small 1 µF ceramic output capacitor 3 fixed output voltage options: 1.8, 3.3 V and 5 V Adjustable output from 1.22 V to 19 V Programmable soft start for inrush current control Foldback current-limit and thermal overload protection User programmable precision UVLO/enable Power-good indicator 8-lead LFCSP and 8-lead SOIC packages VIN = 8V CIN + 1µF VIN VOUT SENSE ON OFF 100kΩ VOUT = 5V + COUT 1µF 100kΩ EN/ UVLO PG PG 100kΩ GND SS 11641-001 FEATURES CSS Figure 1. ADP7105 with Fixed Output Voltage, 5 V VIN = 8V CIN + 1µF VIN VOUT 40.2kΩ ADJ ON OFF VOUT = 5V + COUT 1µF 13kΩ 100kΩ 100kΩ EN/ UVLO 100kΩ PG PG GND SS CSS 11641-002 Data Sheet 20 V, 500 mA, Low Noise LDO Regulator with Soft Start ADP7105 Figure 2. ADP7105 with Adjustable Output Voltage, 5 V APPLICATIONS Regulation of noise sensitive applications: ADC and DAC circuits, precision amplifiers, high frequency oscillators, clocks, and PLLs Communications and infrastructure Medical and healthcare Industrial and instrumentation GENERAL DESCRIPTION The ADP7105 is a CMOS, low dropout (LDO)linear regulator that operates from 3.3 V to 20 V and provides up to 500 mA of output current. This high input voltage LDO is ideal for regulation of high performance analog and mixed-signal circuits operating from 1.22 V to 19 V rails. Using an advanced proprietary architecture, the ADP7105 provides high power supply rejection and low noise, and achieves excellent line and load transient response with only a small 1 µF ceramic output capacitor. The ADP7105 is available in three fixed output voltage options and an adjustable version that allows output voltages ranging from 1.22 V to 19 V via an external feedback divider. The ADP7105 allows an external soft start capacitor to be connected to program the startup. Rev. 0 Note that throughout this data sheet, the sense function (SENSE) of the SENSE/ADJ pin applies to fixed output voltage models only, whereas the adjust input function (ADJ) applies to adjustable output voltage models only. For example, Figure 1 shows the sense function, and Figure 2 shows the adjust input function. The ADP7105 output noise voltage is 15 μV rms and is independent of the output voltage. A digital power-good output allows power system monitors to check the health of the output voltage. A user programmable precision undervoltage lockout function facilitates sequencing of multiple power supplies. The ADP7105 is available in 8-lead, 3 mm × 3 mm LFCSP and 8-lead SOIC packages. The LFCSP offers a very compact solution and provides excellent thermal performance for applications that require up to 500 mA of output current in a small, low profile footprint. Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 ©2013 Analog Devices, Inc. All rights reserved. Technical Support www.analog.com ADP7105 Data Sheet TABLE OF CONTENTS Features .............................................................................................. 1 Theory of Operation ...................................................................... 17 Applications ....................................................................................... 1 Applications Information .............................................................. 18 Typical Application Circuits............................................................ 1 Capacitor Selection .................................................................... 18 General Description ......................................................................... 1 Programmable Undervoltage Lockout (UVLO) .................... 19 Revision History ............................................................................... 2 Soft Start Function ..................................................................... 19 Specifications..................................................................................... 3 Power-Good Feature .................................................................. 20 Input and Output Capacitor, Recommended Specifications .. 4 Noise Reduction of the Adjustable ADP7105 ........................ 20 Absolute Maximum Ratings ............................................................ 5 Current-Limit and Thermal Overload Protection ................. 21 Thermal Data ................................................................................ 5 Thermal Considerations............................................................ 21 Thermal Resistance ...................................................................... 5 Printed Circuit Board Layout Considerations ............................ 24 ESD Caution .................................................................................. 5 Outline Dimensions ....................................................................... 25 Pin Configurations and Function Descriptions ........................... 6 Ordering Guide .......................................................................... 26 Typical Performance Characteristics ............................................. 7 REVISION HISTORY 7/13—Revision 0: Initial Version Rev. 0 | Page 2 of 28 Data Sheet ADP7105 SPECIFICATIONS VIN = (VOUT + 1 V) or 3.3 V (whichever is greater), EN = VIN, IOUT = 10 mA, CIN = COUT = 1 µF, TA = 25°C, unless otherwise noted. Table 1. Parameter INPUT VOLTAGE RANGE OPERATING SUPPLY CURRENT Symbol VIN IGND SHUTDOWN CURRENT IGND-SD INPUT REVERSE CURRENT IREV-INPUT OUTPUT VOLTAGE ACCURACY Fixed Output Voltage Accuracy Adjustable Output Voltage Accuracy VOUT VADJ LINE REGULATION LOAD REGULATION 1 ∆VOUT/∆VIN ∆VOUT/∆IOUT ADJ INPUT BIAS CURRENT 2 ADJI-BIAS SENSE INPUT BIAS CURRENT2 SENSEI-BIAS DROPOUT VOLTAGE 3 VDROPOUT START-UP TIME 4 tSTART-UP CURRENT-LIMIT THRESHOLD 5 PG OUTPUT LOGIC LEVEL PG Output Logic High PG Output Logic Low PG OUTPUT THRESHOLD Output Voltage Falling Output Voltage Rising THERMAL SHUTDOWN Thermal Shutdown Threshold Thermal Shutdown Hysteresis ILIMIT PGHIGH PGLOW Test Conditions/Comments IOUT = 100 µA, VIN = 10 V IOUT = 100 µA, VIN = 10 V, TJ = −40°C to +125°C IOUT = 10 mA, VIN = 10 V IOUT = 10 mA, VIN = 10 V, TJ = −40°C to +125°C IOUT = 300 mA, VIN = 10 V IOUT = 300 mA, VIN = 10 V, TJ = −40°C to +125°C IOUT = 500 mA, VIN = 10 V IOUT = 500 mA, VIN = 10 V, TJ = −40°C to +125°C EN = GND, VIN = 12 V EN = GND, VIN = 12 V, TJ = −40°C to +125°C EN = GND, VIN = 0 V, VOUT = 20 V EN = GND, VIN = 0 V, VOUT = 20 V, TJ = −40°C to +125°C +0.8 +1 % % 1.23 V 1.232 V +0.015 10 %/V %/A %/A nA 1 μA 1050 750 1400 900 40 1600 50 75 0.3 1.196 1.21 1.22 −0.015 0.2 0.75 20 1000 mV mV mV mV mV mV mV mV µs ms mA 0.4 V V 40 100 175 200 325 350 550 625 Rev. 0 | Page 3 of 28 5 Unit V µA µA µA µA µA µA µA µA µA µA µA µA 900 1 mA < IOUT < 500 mA, VIN = (VOUT + 1 V) to 20 V, TJ = −40°C to +125°C VIN = (VOUT + 1 V) to 20 V, TJ = −40°C to +125°C 1 mA < IOUT < 500 mA 1 mA < IOUT < 500 mA, TJ = −40°C to +125°C 1 mA < IOUT < 500 mA, VIN = (VOUT + 1 V) to 20 V, ADJ connected to VOUT 1 mA < IOUT < 500 mA, VIN = (VOUT + 1 V) to 20 V, SENSE connected to VOUT, VOUT = 1.5 V IOUT = 10 mA IOUT = 10 mA, TJ = −40°C to +125°C IOUT = 150 mA IOUT = 150 mA, TJ = −40°C to +125°C IOUT = 300 mA IOUT = 300 mA, TJ = −40°C to +125°C IOUT = 500 mA IOUT = 500 mA, TJ = −40°C to +125°C CSS = 0 nF, IOUT = 10 mA CSS = 10 nF, IOUT = 10 mA TJ rising Max 20 450 −0.8 −2 IOH < 1 µA IOL < 2 mA Typ 400 IOUT = 10 mA 1 mA < IOUT < 500 mA, VIN = (VOUT + 1 V) to 20 V, TJ = −40°C to +125°C IOUT = 10 mA PGFALL PGRISE TSSD TSSD-HYS Min 3.3 625 11.5 775 1.0 −9.2 −6.5 % % 150 15 °C °C ADP7105 Data Sheet Parameter SOFT START SOURCE CURRENT PROGRAMMABLE EN/UVLO UVLO Threshold Rising UVLO Threshold Falling Symbol SSI-SOURCE Test Conditions/Comments SS = GND Min Typ 1 Max Unit µA UVLORISE UVLOFALL 1.18 1.23 1.13 1.28 V V UVLO Hysteresis Current Enable Pull-Down Current Start Threshold Shutdown Threshold Hysteresis OUTPUT NOISE UVLOHYS IEN-IN VSTART VSHUTDOWN 3.3 V ≤ VIN ≤ 20 V, TJ = −40°C to +125°C 3.3 V ≤ VIN ≤ 20 V, TJ = −40°C to +125°C, 10 kΩ in series with the enable input pin VEN > 1.25 V, TJ = −40°C to +125°C EN = VIN TJ = −40°C to +125°C TJ = −40°C to +125°C 7.5 9.8 500 12 250 15 15 15 15 18 µA nA V V mV µV rms µV rms µV rms µV rms µV rms 30 µV rms 65 µV rms 50 50 60 60 50 60 60 60 80 80 dB dB dB dB dB dB dB dB dB dB POWER SUPPLY REJECTION RATIO OUTNOISE PSRR 3.2 2.45 10 Hz to 100 kHz, VIN = 5.5 V, VOUT = 1.8 V 10 Hz to 100 kHz, VIN = 6.3 V, VOUT = 3.3 V 10 Hz to 100 kHz, VIN = 8 V, VOUT = 5 V 10 Hz to 100 kHz, VIN = 12 V, VOUT = 9 V 10 Hz to 100 kHz, VIN = 5.5 V, VOUT = 1.5 V, adjustable mode 10 Hz to 100 kHz, VIN = 12 V, VOUT = 5 V, adjustable mode 10 Hz to 100 kHz, VIN = 20 V, VOUT = 15 V, adjustable mode 100 kHz, VIN = 4.3 V, VOUT = 3.3 V 100 kHz, VIN = 6 V, VOUT = 5 V 10 kHz, VIN = 4.3 V, VOUT = 3.3 V 10 kHz, VIN = 6 V, VOUT = 5 V 100 kHz, VIN = 3.3 V, VOUT = 1.8 V, adjustable mode 100 kHz, VIN = 6 V, VOUT = 5 V, adjustable mode 100 kHz, VIN = 16 V, VOUT = 15 V, adjustable mode 10 kHz, VIN = 3.3 V, VOUT = 1.8 V, adjustable mode 10 kHz, VIN = 6 V, VOUT = 5 V, adjustable mode 10 kHz, VIN = 16 V, VOUT = 15 V, adjustable mode Based on an endpoint calculation using 1 mA and 500 mA loads. See Figure 6 for typical load regulation performance for loads less than 1 mA. The adjust input function (ADJ) of the SENSE/ADJ pin applies to adjustable output voltage models only; whereas the sense function (SENSE) applies to fixed output voltage models only. 3 Dropout voltage is defined as the input-to-output voltage differential when the input voltage is set to the nominal output voltage. This specification applies only for output voltages greater than 3.0 V. 4 Start-up time is defined as the time between the rising edge of EN to VOUT being at 90% of its nominal value. 5 Current-limit threshold is defined as the current at which the output voltage falls to 90% of the specified typical value. For example, the current limit for a 5.0 V output voltage is defined as the current that causes the output voltage to fall to 90% of 5.0 V, or 4.5 V. 1 2 INPUT AND OUTPUT CAPACITOR, RECOMMENDED SPECIFICATIONS Table 2. Parameter Minimum Input and Output Capacitance 1 Capacitor ESR 1 Symbol CMIN RESR Test Conditions/Comments TA = −40°C to +125°C TA = −40°C to +125°C Min 0.7 0.001 Typ Max 0.2 Unit µF Ω Ensure that the minimum input and output capacitance is greater than 0.7 μF over the full range of operating conditions. The full range of operating conditions in the application must be considered during device selection to ensure that the minimum capacitance specification is met. X7R and X5R type capacitors are recommended; Y5V and Z5U capacitors are not recommended for use with any LDO regulator. Rev. 0 | Page 4 of 28 Data Sheet ADP7105 ABSOLUTE MAXIMUM RATINGS Table 3. Parameter VIN to GND VOUT to GND EN/UVLO to GND PG to GND SENSE/ADJ to GND SS to GND Storage Temperature Range Operating Junction Temperature Range Soldering Conditions Rating −0.3 V to +22 V −0.3 V to +20 V −0.3 V to VIN −0.3 V to VIN −0.3 V to VOUT −0.3 V to +3.6 V −65°C to +150°C −40°C to +125°C JEDEC J-STD-020 Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. THERMAL DATA Absolute maximum ratings apply individually only, not in combination. The ADP7105 can be damaged when the junction temperature (TJ) limit is exceeded. Monitoring ambient temperature does not guarantee that TJ is within the specified temperature limits. In applications with high power dissipation and poor printed circuit board (PCB) thermal resistance, the maximum ambient temperature may need to be derated. In applications with moderate power dissipation and low PCB thermal resistance, the maximum ambient temperature can exceed the maximum limit as long as the junction temperature is within specification limits. The junction temperature (TJ) of the device is dependent on the ambient temperature (TA), the power dissipation of the device (PD), and the junction-to-ambient thermal resistance of the package (θJA). Maximum junction temperature (TJ) is calculated from the ambient temperature (TA) and power dissipation (PD) using the formula board design is required. The value of θJA may vary, depending on PCB material, layout, and environmental conditions. The specified values of θJA are based on a 4-layer, 4 in. × 3 in. circuit board. See JEDEC JESD51-7 and JESD51-9 for detailed information on the board construction. For additional information, see the AN-772 Application Note, A Design and Manufacturing Guide for the Lead Frame Chip Scale Package (LFCSP), available at www.analog.com. ΨJB is the junction-to-board thermal characterization parameter with units of °C/W. The package ΨJB is based on modeling and calculation using a 4-layer board. JEDEC JESD51-12, Guidelines for Reporting and Using Electronic Package Thermal Information, states that thermal characterization parameters are not the same as thermal resistances. ΨJB measures the component power flowing through multiple thermal paths rather than through a single path as in thermal resistance, θJB. Therefore, ΨJB thermal paths include convection from the top of the package as well as radiation from the package, factors that make ΨJB more useful in real-world applications. Maximum junction temperature (TJ) is calculated from the board temperature (TB) and power dissipation (PD) using the formula TJ = TB + (PD × ΨJB) See JESD51-8 and JESD51-12 for more detailed information about ΨJB. THERMAL RESISTANCE θJA and ΨJB are specified for the worst-case conditions, that is, a device soldered in a circuit board for surface-mount packages. θJC is a parameter for surface-mount packages with top mounted heat sinks. θJC is presented here for reference only. Table 4. Thermal Resistance Package Type 8-Lead LFCSP 8-Lead SOIC ESD CAUTION TJ = TA + (PD × θJA) Junction-to-ambient thermal resistance (θJA) of the package is based on modeling and calculation using a 4-layer board. The junction-to-ambient thermal resistance is highly dependent on the application and board layout. In applications where high maximum power dissipation exists, close attention to thermal Rev. 0 | Page 5 of 28 θJA 40.1 48.5 θJC 27.1 58.4 ΨJB 17.2 31.3 Unit °C/W °C/W ADP7105 Data Sheet PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS 8 VIN GND 3 TOP VIEW (Not to Scale) SS 4 VOUT 1 7 PG 6 GND 5 EN/UVLO NOTES 1. IT IS HIGHLY RECOMMENDED THAT THE EXPOSED PAD ON THE BOTTOM OF THE PACKAGE BE CONNECTED TO THE GROUND PLANE ON THE BOARD. 8 ADP7105 VIN PG TOP VIEW GND 3 (Not to Scale) 6 GND 5 EN/UVLO SS 4 SENSE/ADJ 2 7 NOTES 1. IT IS HIGHLY RECOMMENDED THAT THE EXPOSED PAD ON THE BOTTOM OF THE PACKAGE BE CONNECTED TO THE GROUND PLANE ON THE BOARD. 11641-003 ADP7105 Figure 3. Pin Configuration, LFCSP Package 11641-004 VOUT 1 SENSE/ADJ 2 Figure 4. Pin Configuration, Narrow-Body SOIC Package Table 5. Pin Function Descriptions Pin No. 1 2 Mnemonic VOUT SENSE/ADJ 3 4 5 GND SS EN/UVLO 6 7 GND PG 8 VIN EPAD Description Regulated Output Voltage. Bypass VOUT to GND with a 1 µF or greater capacitor. Sense (SENSE). SENSE measures the actual output voltage at the load and feeds it to the error amplifier. Connect SENSE as close as possible to the load to minimize the effect of IR drop between the regulator output and the load. This function applies to fixed voltage models only. Adjust Input (ADJ). An external resistor divider sets the output voltage. This function applies to adjustable voltage models only. Ground. Soft Start. A capacitor connected to this pin determines the soft start time. Enable Input (EN). Drive EN high to turn on the regulator; drive EN low to turn off the regulator. For automatic startup, connect EN to VIN. Programmable Undervoltage Lockout (UVLO). When the programmable UVLO function is used, the upper and lower thresholds are determined by the programming resistors. Ground. Power Good. This open-drain output requires an external pull-up resistor to VIN or VOUT. If the part is in shutdown mode, current-limit mode, or thermal shutdown, or if VOUT falls below 90% of the nominal output voltage, PG immediately transitions low. If the power-good function is not used, the pin can be left open or connected to ground. Regulator Input Supply. Bypass VIN to GND with a 1 µF or greater capacitor. Exposed Pad. The exposed pad on the bottom of the package enhances thermal performance and is electrically connected to GND inside the package. It is highly recommended that the exposed pad be connected to the ground plane on the board. Rev. 0 | Page 6 of 28 Data Sheet ADP7105 TYPICAL PERFORMANCE CHARACTERISTICS VIN = 7.5 V, VOUT = 5 V, IOUT = 10 mA, CIN = COUT = 1 µF, TA = 25°C, unless otherwise noted. 3.35 LOAD = 100µA LOAD = 1mA LOAD = 10mA LOAD = 100mA LOAD = 300mA LOAD = 500mA 1000 GROUND CURRENT (µA) 3.33 3.31 3.29 3.27 800 600 400 200 –40 –5 25 85 0 11641-005 3.25 125 TJ (°C) –40 –5 25 85 11641-008 VOUT (V) 1200 LOAD = 100µA LOAD = 1mA LOAD = 10mA LOAD = 100mA LOAD = 300mA LOAD = 500mA 125 TJ (°C) Figure 8. Ground Current vs. Junction Temperature, VOUT = 3.3 V Figure 5. Output Voltage vs. Junction Temperature, VOUT = 3.3 V 800 3.35 700 GROUND CURRENT (µA) VOUT (V) 3.33 3.31 3.29 600 500 400 300 200 3.27 1 10 100 1000 ILOAD (mA) 0 0.1 11641-006 3.25 0.1 1000 LOAD = 100µA LOAD = 1mA LOAD = 10mA LOAD = 100mA LOAD = 300mA LOAD = 500mA GROUND CURRENT (µA) 1000 3.29 3.27 800 600 400 4 6 8 10 12 14 16 18 VIN (V) 20 0 4 6 8 10 12 14 16 18 VIN (V) Figure 7. Output Voltage vs. Input Voltage, VOUT = 3.3 V Figure 10. Ground Current vs. Input Voltage, VOUT = 3.3 V Rev. 0 | Page 7 of 28 20 11641-010 200 11641-007 VOUT (V) 1200 3.31 3.25 100 Figure 9. Ground Current vs. Load Current, VOUT = 3.3 V LOAD = 100µA LOAD = 1mA LOAD = 10mA LOAD = 100mA LOAD = 300mA LOAD = 500mA 3.33 10 ILOAD (mA) Figure 6. Output Voltage vs. Load Current, VOUT = 3.3 V 3.35 1 11641-009 100 ADP7105 120 1200 GROUND CURRENT (µA) 140 SHUTDOWN CURRENT (µA) 1400 3.3V 4.0V 6.0V 8.0V 12.0V 20.0V 100 80 60 40 1000 800 600 400 200 20 –25 0 25 50 75 100 0 3.1 11641-011 0 –50 125 TEMPERATURE (°C) 3.3 3.4 3.5 3.6 3.7 Figure 14. Ground Current vs. Input Voltage (in Dropout), VOUT = 3.3 V 5.05 VOUT = 3.3V TA = 25°C LOAD = 100µA LOAD = 1mA LOAD = 10mA LOAD = 100mA LOAD = 300mA LOAD = 500mA 5.04 300 5.03 250 5.02 200 VOUT (V) DROPOUT VOLTAGE (mV) 3.2 VIN (V) Figure 11. Shutdown Current vs. Temperature at Various Input Voltages 350 LOAD = 5mA LOAD = 10mA LOAD = 100mA LOAD = 200mA LOAD = 300mA LOAD = 500mA 11641-014 160 Data Sheet 150 5.01 5.00 4.99 4.98 100 4.97 50 1 10 100 1000 ILOAD (mA) 4.95 11641-012 0 –40°C –5°C 25°C 85°C 125°C TJ (°C) 11641-015 4.96 Figure 15. Output Voltage vs. Junction Temperature, VOUT = 5 V Figure 12. Dropout Voltage vs. Load Current, VOUT = 3.3 V 5.05 3.4 5.04 3.3 5.03 VOUT (V) 5.02 3.1 3.0 5.00 4.98 LOAD = 5mA LOAD = 10mA LOAD = 100mA LOAD = 200mA LOAD = 300mA LOAD = 500mA 2.8 3.2 3.3 3.4 VIN (V) 3.5 3.6 3.7 4.97 4.96 4.95 0.1 1 10 100 ILOAD (mA) Figure 16. Output Voltage vs. Load Current, VOUT = 5 V Figure 13. Output Voltage vs. Input Voltage (in Dropout), VOUT = 3.3 V Rev. 0 | Page 8 of 28 1000 11641-016 2.9 2.7 3.1 5.01 4.99 11641-013 VOUT (V) 3.2 Data Sheet 5.05 ADP7105 300 LOAD = 100µA LOAD = 1mA LOAD = 10mA LOAD = 100mA LOAD = 300mA LOAD = 500mA 5.03 5.02 VOUT (V) VOUT = 5V TA = 25°C 250 DROPOUT VOLTAGE (mV) 5.04 5.01 5.00 4.99 4.98 200 150 100 4.97 50 6 8 10 12 14 16 18 20 VIN (V) 0 11641-017 1 1000 Figure 20. Dropout Voltage vs. Load Current, VOUT = 5 V 1000 5.05 LOAD = 100µA LOAD = 1mA LOAD = 10mA LOAD = 100mA LOAD = 300mA 900 800 5.00 4.95 4.90 600 4.85 VOUT (V) 700 500 400 4.80 4.75 4.70 200 4.65 100 4.60 –40 –5 25 85 4.55 4.8 11641-118 0 125 TJ (°C) LOAD = 5mA LOAD = 10mA LOAD = 100mA LOAD = 200mA LOAD = 300mA LOAD = 500mA 4.9 5.0 5.1 5.2 5.3 5.4 VIN (V) 11641-019 300 Figure 21. Output Voltage vs. Input Voltage (in Dropout), VOUT = 5 V 700 2500 600 2000 GROUND CURRENT (µA) Figure 18. Ground Current vs. Junction Temperature, VOUT = 5 V 500 400 300 200 1500 1000 500 0 100 0 0.1 1 10 100 ILOAD (mA) 1000 11641-119 GROUND CURRENT (µA) 100 ILOAD (mA) Figure 17. Output Voltage vs. Input Voltage, VOUT = 5 V GROUND CURRENT (µA) 10 –500 4.80 LOAD = 5mA LOAD = 10mA LOAD = 100mA LOAD = 200mA LOAD = 300mA LOAD = 500mA 4.90 5.00 5.10 5.20 5.30 5.40 VIN (V) Figure 22. Ground Current vs. Input Voltage (in Dropout), VOUT = 5 V Figure 19. Ground Current vs. Load Current, VOUT = 5 V Rev. 0 | Page 9 of 28 11641-020 4.95 11641-018 4.96 ADP7105 1.85 900 LOAD = 100µA LOAD = 1mA LOAD = 10mA LOAD = 100mA LOAD = 300mA LOAD = 500mA 800 700 GROUND CURRENT (µA) 1.83 VOUT (V) Data Sheet 1.81 1.79 LOAD = 100µA LOAD = 1mA LOAD = 10mA LOAD = 100mA LOAD = 300mA 600 500 400 300 200 1.77 –40 –5 25 85 0 11641-021 1.75 125 TJ (°C) –40 25 –5 85 11641-126 100 125 TJ (°C) Figure 23. Output Voltage vs. Junction Temperature, VOUT = 1.8 V Figure 26. Ground Current vs. Junction Temperature, VOUT = 1.8 V 1.85 700 600 GROUND CURRENT (µA) VOUT (V) 1.83 1.81 1.79 500 400 300 200 1.77 1 10 100 1000 ILOAD (mA) 0 11641-022 1.75 0.1 0.1 1000 LOAD = 100µA LOAD = 1mA LOAD = 10mA LOAD = 100mA LOAD = 300mA LOAD = 500mA GROUND CURRENT (µA) 1000 1.79 1.77 800 600 400 2 4 6 8 10 12 14 16 18 VIN (V) 20 0 2 4 6 8 10 12 14 16 18 VIN (V) Figure 28. Ground Current vs. Input Voltage, VOUT = 1.8 V Figure 25. Output Voltage vs. Input Voltage, VOUT = 1.8 V Rev. 0 | Page 10 of 28 20 11641-024 200 11641-023 VOUT (V) 1200 1.81 1.75 100 Figure 27. Ground Current vs. Load Current, VOUT = 1.8 V LOAD = 100µA LOAD = 1mA LOAD = 10mA LOAD = 100mA LOAD = 300mA LOAD = 500mA 1.83 10 ILOAD (mA) Figure 24. Output Voltage vs. Load Current, VOUT = 1.8 V 1.85 1 11641-127 100 Data Sheet 5.07 5.06 2.0 LOAD = 100µA LOAD = 1mA LOAD = 10mA LOAD = 100mA LOAD = 300mA LOAD = 500mA REVERSE INPUT CURRENT (µA) 5.08 ADP7105 VOUT (V) 5.05 5.04 5.03 5.02 5.01 5.00 3.3V 4V 5V 6V 8V 10V 12V 15V 18V 20V 1.5 1.0 0.5 4.98 –5 25 85 0 –40 11641-025 –40 125 TJ (°C) –20 0 20 40 60 80 100 120 140 TEMPERATURE (°C) Figure 29. Output Voltage vs. Junction Temperature, VOUT = 5 V, Adjustable 11641-054 4.99 Figure 32. Reverse Input Current vs. Temperature, VIN = 0 V, Different Voltages on VOUT 5.08 5.07 5.06 VOUT (V) 5.05 EN 1 5.04 5.03 VOUT 2 5.02 5.01 5.00 IIN 4.99 1 10 100 1000 ILOAD (mA) 5.08 0 5.07 –10 5.06 –20 5.05 –30 5.04 –40 5.03 5.02 M2.00ms A CH1 T 5.95ms 3.00V LOAD = 500mA LOAD = 300mA LOAD = 100mA LOAD = 10mA LOAD = 1mA –50 –60 –70 5.01 LOAD = 100µA LOAD = 1mA LOAD = 10mA LOAD = 100mA LOAD = 300mA LOAD = 500mA 6 8 10 –90 12 14 16 18 20 VIN (V) Figure 31. Output Voltage vs. Input Voltage, VOUT = 5 V, Adjustable –100 10 100 1k 10k 100k FREQUENCY (Hz) 1M 10M 11641-028 4.99 –80 11641-027 5.00 4.98 CH2 2.00V Figure 33. Start-Up Time, VEN and VIN = 6 V, CIN and COUT = 1 µF, CSS = 10 nF, IOUT = 10 mA, VOUT = 5 V PSRR (dB) VOUT (V) Figure 30. Output Voltage vs. Load Current, VOUT = 5 V, Adjustable CH1 2.00V CH3 20mA 11641-133 4.98 0.1 11641-026 3 Figure 34. Power Supply Rejection Ratio vs. Frequency, VOUT = 1.8 V, VIN = 3.3 V Rev. 0 | Page 11 of 28 ADP7105 –20 –30 –40 –40 –50 –60 –80 –80 –90 –90 –100 10 –100 10 1k 10k 100k 1M 10M Figure 35. Power Supply Rejection Ratio vs. Frequency, VOUT = 3.3 V, VIN = 4.8 V 0 –10 –20 0 –10 –20 –30 –40 –40 PSRR (dB) –30 –60 –80 –80 –90 –90 –100 10 –100 10 10k 100k 1M 10M FREQUENCY (Hz) Figure 36. Power Supply Rejection Ratio vs. Frequency, VOUT = 3.3 V, VIN = 4.3 V 0 –10 –20 0 –20 –30 –40 –40 PSRR (dB) –30 –70 –80 –90 –90 10k 100k FREQUENCY (Hz) 1M 10M Figure 37. Power Supply Rejection Ratio vs. Frequency, VOUT = 3.3 V, VIN = 3.8 V 1k 10k 100k 1M 10M LOAD = 500mA LOAD = 300mA LOAD = 100mA LOAD = 10mA LOAD = 1mA –100 11641-031 1k 100 –60 –80 100 LOAD = 500mA LOAD = 300mA LOAD = 100mA LOAD = 10mA LOAD = 1mA –50 –70 –100 10 10M Figure 39. Power Supply Rejection Ratio vs. Frequency, VOUT = 5 V, VIN = 6 V –10 –60 1M FREQUENCY (Hz) LOAD = 500mA LOAD = 300mA LOAD = 100mA LOAD = 10mA LOAD = 1mA –50 100k –60 –70 1k 10k –50 –70 100 1k Figure 38. Power Supply Rejection Ratio vs. Frequency, VOUT = 5 V, VIN = 6.5 V LOAD = 500mA LOAD = 300mA LOAD = 100mA LOAD = 10mA LOAD = 1mA –50 100 FREQUENCY (Hz) 11641-030 PSRR (dB) –60 –70 FREQUENCY (Hz) PSRR (dB) –50 –70 100 LOAD = 500mA LOAD = 300mA LOAD = 100mA LOAD = 10mA LOAD = 1mA 11641-032 PSRR (dB) –30 11641-029 PSRR (dB) –20 –10 11641-033 –10 0 LOAD = 500mA LOAD = 300mA LOAD = 100mA LOAD = 10mA LOAD = 1mA 10 100 1k 10k 100k FREQUENCY (Hz) 1M 10M 11641-034 0 Data Sheet Figure 40. Power Supply Rejection Ratio vs. Frequency, VOUT = 5 V, VIN = 5.5 V Rev. 0 | Page 12 of 28 Data Sheet –20 –30 –40 –40 PSRR (dB) –30 –50 –60 –70 –80 –80 –90 –90 100 1k 10k 100k 1M 10M FREQUENCY (Hz) –100 11641-035 10 Figure 41. Power Supply Rejection Ratio vs. Frequency, VOUT = 5 V, VIN = 5.3 V 10 0 0 –10 –20 –20 –30 –30 –40 –40 –60 –70 –90 –100 10 –20 10M LOAD = 500mA LOAD = 300mA LOAD = 100mA LOAD = 10mA LOAD = 1mA –50 –60 100 1k 10k 100k 1M 10M –100 0 0.50 0.75 1.00 0 –20 –40 –40 PSRR (dB) –30 –60 –50 –60 –70 –70 –80 –80 –90 –90 1k 10k 100k FREQUENCY (Hz) 1M 10M –100 11641-037 –100 Figure 43. Power Supply Rejection Ratio vs. Frequency, VOUT = 5 V, VIN = 6 V, Adjustable 1.50 LOAD = 500mA LOAD = 300mA LOAD = 100mA LOAD = 10mA LOAD = 1mA –10 –50 1.25 Figure 45. Power Supply Rejection Ratio vs. Headroom Voltage, 100 Hz, VOUT = 5 V LOAD = 500mA LOAD = 300mA LOAD = 100mA LOAD = 10mA LOAD = 1mA 100 0.25 HEADROOM VOLTAGE (V) –30 10 1M –90 Figure 42. Power Supply Rejection Ratio vs. Frequency, VOUT = 5 V, VIN = 5.2 V 0 100k –80 LOAD = 500mA LOAD = 300mA LOAD = 100mA LOAD = 10mA LOAD = 1mA FREQUENCY (Hz) –10 10k –70 11641-036 –80 1k Figure 44. Power Supply Rejection Ratio vs. Frequency, VOUT = 5 V, VIN = 6 V, Adjustable with Noise Reduction Circuit –10 –50 100 FREQUENCY (Hz) PSRR (dB) PSRR (dB) –60 –70 –100 PSRR (dB) –50 11641-038 –20 LOAD = 500mA LOAD = 300mA LOAD = 100mA LOAD = 10mA LOAD = 1mA –10 11641-039 –10 PSRR (dB) 0 LOAD = 500mA LOAD = 300mA LOAD = 100mA LOAD = 10mA LOAD = 1mA 0 0.25 0.50 0.75 1.00 HEADROOM VOLTAGE (V) 1.25 1.50 11641-040 0 ADP7105 Figure 46. Power Supply Rejection Ratio vs. Headroom Voltage, 1 kHz, VOUT = 5 V Rev. 0 | Page 13 of 28 ADP7105 Data Sheet 0 10 LOAD = 500mA LOAD = 300mA LOAD = 100mA LOAD = 10mA LOAD = 1mA –10 –20 NOISE (µV/√Hz) –30 PSRR (dB) –40 –50 –60 –70 3.3V 5V 5VADJ 5VADJ NR 1 0.1 –80 0.25 0.50 0.75 1.00 1.25 1.50 HEADROOM VOLTAGE (V) 0.01 10 11641-041 0 –20 10k 100k Figure 50. Output Noise Spectral Density, ILOAD = 10 mA, COUT = 1 μF LOAD = 500mA LOAD = 300mA LOAD = 100mA LOAD = 10mA LOAD = 1mA –10 1k FREQUENCY (Hz) Figure 47. Power Supply Rejection Ratio vs. Headroom Voltage, 10 kHz, VOUT = 5 V 0 100 11641-044 –90 –100 LOAD CURRENT 1 –30 PSRR (dB) –40 –50 –60 OUTPUT VOLTAGE 2 –70 –80 0 0.25 0.50 0.75 1.00 1.25 1.50 HEADROOM VOLTAGE (V) Figure 48. Power Supply Rejection Ratio vs. Headroom Voltage, 100 kHz, VOUT = 5 V CH1 500mA Ω B W CH2 50mV B W M 20µs T 10% A CH1 270mA 11641-045 –100 11641-042 –90 Figure 51. Load Transient Response, CIN = COUT = 1 μF, ILOAD = 1 mA to 500 mA, VOUT = 1.8 V, VIN = 5 V 30 LOAD CURRENT 25 15 OUTPUT VOLTAGE 2 3.3V 1.8V 5V 5VADJ 5VADJ NR 5 0 0.00001 0.0001 0.001 0.01 0.1 1 ILOAD (A) Figure 49. Output Noise vs. Load Current and Output Voltage, COUT = 1 μF CH1 500mA Ω B W CH2 50mV B W M 20µs T 10.2% A CH1 280mA 11641-046 10 11641-043 NOISE (µV rms) 1 20 Figure 52. Load Transient Response, CIN = COUT = 1 μF, ILOAD = 1 mA to 500 mA, VOUT = 3.3 V, VIN = 5 V Rev. 0 | Page 14 of 28 Data Sheet ADP7105 INPUT VOLTAGE LOAD CURRENT 1 OUTPUT VOLTAGE 2 B W B CH2 50mV W M 20µs T 10.2% A CH1 300mA 1 11641-047 CH1 500mA Ω CH1 1V B W CH2 10mV B W M 4µs T 9.8% A CH4 1.56V 11641-050 OUTPUT VOLTAGE 2 Figure 53. Load Transient Response, CIN = COUT = 1 μF, ILOAD = 1 mA to 500 mA, VOUT = 5 V, VIN = 7 V Figure 56. Line Transient Response, CIN = COUT = 1 μF, ILOAD = 500 mA, VOUT = 5 V INPUT VOLTAGE INPUT VOLTAGE OUTPUT VOLTAGE 2 OUTPUT VOLTAGE 2 B W CH2 10mV B W M 4µs T 9.8% A CH4 1.56V 11641-048 CH1 1V CH1 1V B W CH2 10mV B W M 4µs T 9.8% A CH4 1.56V 11641-051 1 1 Figure 54. Line Transient Response, CIN = COUT = 1 μF, ILOAD = 500 mA, VOUT = 1.8 V Figure 57. Line Transient Response, CIN = COUT = 1 μF, ILOAD = 1 mA, VOUT = 1.8 V INPUT VOLTAGE INPUT VOLTAGE OUTPUT VOLTAGE 2 OUTPUT VOLTAGE 2 B W CH2 10mV B W M 4µs T 9.8% A CH4 1.56V 11641-049 CH1 1V CH1 1V Figure 55. Line Transient Response, CIN = COUT = 1 μF, ILOAD = 500 mA, VOUT = 3.3 V B W CH2 10mV B W M 4µs T 9.8% A CH4 1.56V 11641-052 1 1 Figure 58. Line Transient Response, CIN = COUT = 1 μF, ILOAD = 1 mA, VOUT = 3.3 V Rev. 0 | Page 15 of 28 ADP7105 Data Sheet INPUT VOLTAGE 1 CH1 1V B W CH2 10mV B W M 4µs T 9.8% A CH4 1.56V 11641-053 OUTPUT VOLTAGE 2 Figure 59. Line Transient Response, CIN = COUT = 1 μF, ILOAD = 1 mA, VOUT = 5 V Rev. 0 | Page 16 of 28 Data Sheet ADP7105 THEORY OF OPERATION The ADP7105 is a low quiescent current, LDO linear regulator that operates from 3.3 V to 20 V and provides up to 500 mA of output current. The ADP7105 draws a low 900 µA of quiescent current (typical) at full load, making it ideal for battery-operated portable equipment. Typical shutdown current consumption is 40 μA at room temperature. Optimized for use with small 1 µF ceramic capacitors, the ADP7105 provides excellent transient performance. VOUT = 1.22 V(1 + R1/R2) VOUT VREG GND SHORT-CIRCUIT, THERMAL PROTECT PGOOD VIN = 8V PG SHUTDOWN EN/ UVLO CIN + 1µF VIN VOUT R1 40.2kΩ ADJ R1 ON SENSE 9.8µA The ADP7105 is available in three fixed output voltage options, 1.8 V, 3.3 V, and 5 V, and in an adjustable version with an output voltage that can be set from 1.22 V to 19 V by an external voltage divider. The output voltage can be set according to the following equation: OFF R2 R3 100kΩ R4 100kΩ EN/ UVLO R2 13kΩ 11641-055 GND 1.22V REFERENCE Figure 60. Fixed Output Voltage Internal Block Diagram VIN VREG 9.8µA EN/ UVLO SHORT-CIRCUIT, THERMAL PROTECT SHUTDOWN PGOOD PG R2 ADJ 11641-056 SS 1.22V REFERENCE RPG 100kΩ CSS Figure 62. Typical Adjustable Output Voltage Application Schematic Ensure that the value of R2 is less than 200 kΩ to minimize errors in the output voltage caused by the ADJ input current. For example, when R1 and R2 each equal 200 kΩ, the output voltage is 2.46 V. The output voltage error introduced by the ADJ input current is 2 mV or 0.08%, assuming a typical ADJ input current of 10 nA at 25°C. VOUT GND SS VOUT = 5V PG PG SS + COUT 1µF 11641-075 VIN device is pulled higher, allowing less current to pass and decreasing the output voltage. Figure 61. Adjustable Output Voltage Internal Block Diagram Internally, the ADP7105 consists of a reference, an error amplifier, a feedback voltage divider, and a PMOS pass transistor. Output current is delivered via the PMOS pass device, which is controlled by the error amplifier. The error amplifier compares the reference voltage with the feedback voltage from the output and amplifies the difference. If the feedback voltage is lower than the reference voltage, the gate of the PMOS device is pulled lower, allowing more current to pass and increasing the output voltage. If the feedback voltage is higher than the reference voltage, the gate of the PMOS The ADP7105 uses the EN/UVLO pin to enable and disable the VOUT pin under normal operating conditions. When EN/UVLO is high, VOUT turns on; when EN/UVLO is low, VOUT turns off. For automatic startup, EN/UVLO can be tied to VIN. The ADP7105 incorporates reverse current protection circuitry that prevents current flow backwards through the pass element when the output voltage is greater than the input voltage. A comparator senses the difference between the input and output voltages. When the difference between the input voltage and output voltage exceeds 55 mV, the body of the PFET is switched to VOUT and turned off or opened. In other words, the gate is connected to VOUT. Rev. 0 | Page 17 of 28 ADP7105 Data Sheet APPLICATIONS INFORMATION Output Capacitor The ADP7105 is designed for operation with small, space-saving ceramic capacitors but functions with most commonly used capacitors as long as care is taken with regard to the effective series resistance (ESR) value. The ESR of the output capacitor affects the stability of the LDO control loop. A minimum of 1 µF capacitance with an ESR of 1 Ω or less is recommended to ensure the stability of the ADP7105. Transient response to changes in load current is also affected by output capacitance. Using a larger value of output capacitance improves the transient response of the ADP7105 to large changes in load current. Figure 63 shows the transient responses for an output capacitance value of 1 µF. LOAD CURRENT Figure 64 shows the capacitance vs. voltage bias characteristic of an 0402, 1 µF, 10 V, X5R capacitor. The voltage stability of a capacitor is strongly influenced by the capacitor size and voltage rating. In general, a capacitor in a larger package or higher voltage rating exhibits better stability. The temperature variation of the X5R dielectric is ~±15% over the −40°C to +85°C temperature range and is not a function of package or voltage rating. 1.2 1.0 CAPACITANCE (µF) CAPACITOR SELECTION 1 0.8 0.6 0.4 0 0 2 4 6 8 10 VOLTAGE (V) OUTPUT VOLTAGE 2 11641-058 0.2 Figure 64. Capacitance vs. Voltage Bias Characteristic CH1 500mA Ω CH2 50mV M 20µs T 10% A CH1 270mA 11641-057 Use Equation 1 to determine the worst-case capacitance, accounting for capacitor variation over temperature, component tolerance, and voltage. CEFF = CBIAS × (1 − TEMPCO) × (1 − TOL) Figure 63. Output Transient Response, VOUT = 1.8 V, COUT = 1 µF Input Bypass Capacitor (1) where: CBIAS is the effective capacitance at the operating voltage. TEMPCO is the worst-case capacitor temperature coefficient. TOL is the worst-case component tolerance. Connecting a 1 µF capacitor from VIN to GND reduces the circuit sensitivity to PCB layout, especially when long input traces or high source impedance is encountered. If greater than 1 µF of output capacitance is required, increase the input capacitor to match it. In this example, the worst-case temperature coefficient (TEMPCO) over −40°C to +85°C is assumed to be 15% for an X5R dielectric. The tolerance of the capacitor (TOL) is assumed to be 10%, and CBIAS is 0.94 μF at 1.8 V, as shown in Figure 64. Input and Output Capacitor Properties Substituting these values in Equation 1 yields Any good quality ceramic capacitors can be used with the ADP7105, as long as they meet the minimum capacitance and maximum ESR requirements. Ceramic capacitors are manufactured with a variety of dielectrics, each with different behavior over temperature and applied voltage. Capacitors must have a dielectric adequate to ensure the minimum capacitance over the necessary temperature range and dc bias conditions. X5R or X7R dielectrics with a voltage rating of 6.3 V to 25 V are recommended. Y5V and Z5U dielectrics are not recommended, due to their poor temperature and dc bias characteristics. CEFF = 0.94 μF × (1 − 0.15) × (1 − 0.1) = 0.719 μF Therefore, the capacitor chosen in this example meets the minimum capacitance requirement of the LDO regulator overtemperature and tolerance at the chosen output voltage. To guarantee the performance of the ADP7105, it is imperative that the effects of dc bias, temperature, and tolerances on the behavior of the capacitors be evaluated for each application. Rev. 0 | Page 18 of 28 Data Sheet ADP7105 PROGRAMMABLE UNDERVOLTAGE LOCKOUT (UVLO) The ADP7105 uses the EN/UVLO pin to enable and disable the VOUT pin under normal operating conditions. As shown in Figure 65, when a rising voltage on EN/UVLO crosses the upper threshold, VOUT turns on. When a falling voltage on EN/UVLO crosses the lower threshold, VOUT turns off. The hysteresis of the EN/UVLO threshold is determined by the Thevenin equivalent resistance in series with the EN/UVLO pin. 2.0 1.8 1.6 SOFT START FUNCTION For applications that require a controlled startup, the ADP7105 provides a programmable soft start function. Programmable soft start is useful for reducing inrush current upon startup and for providing voltage sequencing. To implement soft start, connect a small ceramic capacitor from SS to GND. Upon startup, a 1 µA current source charges this capacitor. The ADP7105 start-up output voltage is limited by the voltage at SS, providing a smooth ramp-up to the nominal output voltage. The soft start time is calculated by tSS = VREF × (CSS/ISS) 1.2 VOUT, EN/UVLO RISE VOUT, EN/UVLO FALL 1.0 where: tSS is the soft start delay. VREF is the 1.22 V reference voltage. CSS is the soft start capacitance between SS and GND. ISS is the current sourced from SS (1 µA). 0.8 0.6 0.4 0 1.00 1.25 1.50 1.75 2.00 2.25 2.50 2.75 3.00 11641-060 0.2 EN/UVLO (V) When the ADP7105 is disabled (by driving EN low), the soft start capacitor is discharged to GND through an internal 5 kΩ resistor. Figure 65. Typical VOUT Response to EN/UVLO Pin Operation 7 R2 = 1.23 V × R1/(VIN − 1.23 V) R2 100kΩ 10nF 3 2 VIN VOUT SENSE +C OUT 1µF VOUT = 5V 100kΩ EN/ UVLO PG PG GND SS 0 5 10 Figure 67. Typical Start-Up Behavior CSS 11641-059 OFF R1 100kΩ 6.8nF 2.7nF TIME (ms) Hysteresis can also be achieved by connecting a resistor in series with the EN/UVLO pin. For the example shown in Figure 66, the enable threshold is 2.46 V with a hysteresis of 1 V. ON 0nF 4 0 where: VHYS is the desired EN/UVLO hysteresis level. VIN is the desired turn-on voltage. CIN + 1µF EN 5 1 R1 = VHYS/10 μA VIN = 8V 6 OUTPUT VOLTAGE (V) The upper and lower thresholds are user programmable and can be set using two resistors. When the EN/UVLO pin voltage is below 1.23 V, the LDO is disabled. When the EN/UVLO pin voltage transitions above 1.23 V, the LDO is enabled and 10 µA hysteresis current is sourced out of the pin, raising the voltage and thus providing threshold hysteresis. Typically, two external resistors program the minimum operational voltage for the LDO. The resistance values, R1 and R2, can be determined from the following: Figure 66. Typical EN/UVLO Pin Voltage Divider Rev. 0 | Page 19 of 28 15 11641-061 VOUT (V) 1.4 Figure 65 shows the typical hysteresis of the EN/UVLO pin. This prevents on/off oscillations that can occur due to noise on the EN/UVLO pin as it passes through the threshold points. ADP7105 Data Sheet The ADP7105 provides a power-good pin (PG) to indicate the status of the output. This open-drain output requires an external pull-up resistor to VIN or VOUT. If the part is in shutdown mode, current-limit mode, or thermal shutdown, or if VOUT falls below 90% of the nominal output voltage, the power-good pin (PG) immediately transitions low. During soft start, the rising threshold of the power-good signal is 93.5% of the nominal output voltage. The open-drain output is held low when the ADP7105 has sufficient input voltage to turn on the internal PG transistor. The PG transistor is terminated via a pull-up resistor to VOUT or VIN. Power-good accuracy is 93.5% of the nominal regulator output voltage when this voltage is rising, with a 90.8% trip point when this voltage is falling. Regulator input voltage brownouts or glitches trigger power no good signals if VOUT falls below 90.8% of the nominal output voltage. A normal power-down causes the power-good signal to go low when VOUT falls below 90.8%. Figure 68 and Figure 69 show the typical power-good rising and falling thresholds over temperature. 6 5 –40°C –5°C +25°C +85°C +125°C NOISE REDUCTION OF THE ADJUSTABLE ADP7105 The ultralow output noise of the fixed output ADP7105 is achieved by keeping the LDO error amplifier in unity gain and setting the reference voltage equal to the output voltage. This architecture does not apply to the adjustable output voltage LDO regulator. The adjustable output ADP7105 uses the more conventional architecture where the reference voltage is fixed and the error amplifier gain is a function of the output voltage. The disadvantage of the conventional LDO architecture is that the output voltage noise is proportional to the output voltage. The adjustable LDO circuit can be modified slightly to reduce the output voltage noise to levels close to that of the fixed output ADP7105. The circuit shown in Figure 70 adds two additional components to the output voltage setting resistor divider. CNR and RNR are added in parallel with RFB1 to reduce the ac gain of the error amplifier. RNR is chosen to be equal to RFB2. This limits the ac gain of the error amplifier to approximately 6 dB. The actual gain is the parallel combination of RNR and RFB1 divided by RFB2. This ensures that the error amplifier always operates at greater than unity gain. CNR is chosen by setting the reactance of CNR equal to RFB1 − RNR at a frequency between 50 Hz and 100 Hz. This capacitor value sets the frequency so that the ac gain of the error amplifier is 3 dB less than its dc gain. VIN = 8V PG (V) 4 CIN + 1µF VIN VOUT RFB1 40.2kΩ ADJ 3 OFF R3 ON 100kΩ R4 100kΩ 2 RFB2 13kΩ EN/ UVLO VOUT = 5V + COUT 1µF + CNR 100nF RNR 13kΩ RPG 100kΩ PG PG GND 0 4.2 4.3 4.4 4.5 4.6 4.7 4.8 4.9 5.0 VOUT (V) 11641-062 1 Figure 68. Typical Power-Good Threshold vs. Output Voltage and Temperature, VOUT Rising 6 CSS Figure 70. Noise Reduction Modification to Adjustable LDO Regulator The noise of the adjustable LDO regulator can be found by using the following formula, assuming the noise of a fixed output LDO is approximately 15 μV: –40°C –5°C +25°C +85°C +125°C 1 / 13 kΩ 15 μV × 1 + 1/13 kΩ + 1 / 40.2 kΩ 4 Based on the component values shown in Figure 70, the ADP7105 has the following characteristics: 3 • • • • • 2 1 0 4.2 4.3 4.4 4.5 4.6 4.7 4.8 4.9 5.0 VOUT (V) 11641-063 PG (V) 5 SS 11641-064 POWER-GOOD FEATURE • Figure 69. Typical Power-Good Threshold vs. Output Voltage and Temperature, VOUT Falling Rev. 0 | Page 20 of 28 DC gain of 4.09 (12.2 dB) 3 dB roll-off frequency of 59 Hz High frequency ac gain of 1.76 (4.89 dB) Noise reduction factor of 1.33 (2.59 dB) RMS noise of the ADP7105 adjustable LDO without noise reduction of 27.8 µV rms RMS noise of the ADP7105 adjustable LDO with noise reduction (assuming 15 µV rms for fixed voltage option) of 19.95 µV rms Data Sheet ADP7105 CURRENT-LIMIT AND THERMAL OVERLOAD PROTECTION The ADP7105 is protected against damage due to excessive power dissipation by current and thermal overload protection circuits. The ADP7105 is designed to limit the current when the output load reaches 775 mA (typical). When the output load exceeds 775 mA, the output voltage is reduced to maintain a constant current limit. As the output voltage drops, the current is folded back to approximately 50 mA to minimize heat generation inside the LDO regulator. Thermal overload protection is included, which limits the junction temperature to a maximum of 150°C (typical). Under extreme conditions (that is, high ambient temperature and/or high power dissipation) when the junction temperature starts to rise above 150°C, the output is turned off, reducing the output current to zero. When the junction temperature falls below 135°C, the output is turned on again, and output current is restored to its operating value. Consider the case where a hard short from VOUT to ground occurs. At first, the ADP7105 limits the current so that only 775 mA is conducted into the short. If self heating of the junction is great enough to cause its temperature to rise above 150°C, thermal shutdown is activated, turning off the output and reducing the output current to zero. As the junction temperature cools and falls below 135°C, the output turns on and conducts 775 mA into the short, again causing the junction temperature to rise above 150°C. This thermal oscillation between 135°C and 150°C causes a current oscillation between 775 mA and 0 mA that continues as long as the short remains at the output. Current-limit and thermal limit protections are intended to protect the device against accidental overload conditions. For reliable operation, device power dissipation must be externally limited so that the junction temperature does not exceed 125°C. THERMAL CONSIDERATIONS In applications with a low input-to-output voltage differential, the ADP7105 does not dissipate much heat. However, in applications with high ambient temperature and/or high input voltage, the heat dissipated in the package may become significant enough that it causes the junction temperature of the die to exceed the maximum junction temperature of 125°C. When the junction temperature exceeds 150°C, the regulator enters thermal shutdown. It recovers only after the junction temperature decreases below 135°C to prevent any permanent damage. Therefore, thermal analysis for the chosen application is very important to guarantee reliable performance over all conditions. The junction temperature of the die is the sum of the ambient temperature of the environment and the temperature rise of the package due to the power dissipation, as shown in Equation 2. To guarantee reliable operation, the junction temperature of the ADP7105 must not exceed 125°C. To ensure that the junction temperature stays below this maximum value, the user must be aware of the parameters that contribute to junction temperature changes. These parameters include ambient temperature, power dissipation in the power device, and thermal resistances between the junction and ambient air (θJA). The θJA value is dependent on the package assembly compounds that are used and the amount of copper used to solder the package GND pins to the PCB. Table 6 shows typical θJA values for the 8-lead SOIC and 8-lead LFCSP packages for various PCB copper sizes. Table 7 shows the typical ΨJB values for the 8-lead SOIC and 8-lead LFCSP with PCB area. Table 6. Typical θJA Values Copper Size (mm2) 251 100 500 1000 6400 1 LFCSP 165.1 125.8 68.1 56.4 42.1 θJA (°C/W) SOIC 167.8 111 65.9 56.1 45.8 Device soldered to minimum size pin traces. Table 7. Typical ΨJB Values with PCB Area Model 8-Lead LFCSP1 8-Lead SOIC 1 ΨJB (°C/W) 15.1 31.3 Note that the ΨJB value for the LFCSP package accounts for PCB area, which is being used as a heat sink via the exposed pad, whereas the value in Table 4 is per the JEDEC standard. The junction temperature of the ADP7105 is calculated from the following equation: TJ = TA + (PD × θJA) (2) where: TA is the ambient temperature. θJA is the junction-to-ambient thermal resistance. PD is the power dissipation in the die, given by PD = [(VIN − VOUT) × ILOAD] + (VIN × IGND) (3) where: VIN and VOUT are the input and output voltages, respectively. ILOAD is the load current. IGND is the ground current. Power dissipation due to ground current is quite small and can be ignored. Therefore, the junction temperature equation simplifies to the following: TJ = TA + {[(VIN − VOUT) × ILOAD] × θJA} (4) As shown in Equation 4, for a given ambient temperature, inputto-output voltage differential, and continuous load current, a minimum copper size requirement for the PCB exists to ensure that the junction temperature does not rise above 125°C. Figure 71 to Figure 76 show junction temperature calculations for different ambient temperatures, power dissipation, and areas of PCB copper. Rev. 0 | Page 21 of 28 Data Sheet 145 135 135 125 125 115 105 95 85 75 65 55 6400mm 2 500mm 2 25mm 2 TJ MAX 45 35 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 TOTAL POWER DISSIPATION (W) 85 75 65 55 6400mm 2 500mm 2 25mm 2 TJ MAX 45 35 25 0 0.2 0.4 0.6 140 130 130 JUNCTION TEMPERATURE (°C) 140 120 110 100 90 80 70 6400mm 2 500mm 2 25mm 2 TJ MAX 60 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 70 50 6400mm 2 500mm 2 25mm 2 TJ MAX 0 0.2 0.4 JUNCTION TEMPERATURE (°C) 105 95 85 6400mm 2 500mm 2 25mm 2 TJ MAX 75 0.7 TOTAL POWER DISSIPATION (W) 0.6 0.8 1.0 1.2 1.4 1.6 1.8 TOTAL POWER DISSIPATION (W) 0.8 0.9 125 115 105 95 85 6400mm 2 500mm 2 25mm 2 TJ MAX 75 1.0 11641-067 JUNCTION TEMPERATURE (°C) 115 0.6 2.4 Figure 75. SOIC, TA = 50°C 125 0.5 2.2 80 135 0.4 2.0 90 135 0.3 1.8 100 145 0.2 1.6 110 145 0.1 1.4 120 Figure 72. LFCSP, TA = 50°C 0 1.2 60 TOTAL POWER DISSIPATION (W) 65 1.0 Figure 74. SOIC, TA = 25°C 11641-066 JUNCTION TEMPERATURE (°C) Figure 71. LFCSP, TA = 25°C 50 0.8 TOTAL POWER DISSIPATION (W) 11641-069 0 95 Figure 73. LFCSP, TA = 85°C 65 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 TOTAL POWER DISSIPATION (W) Figure 76. SOIC, TA = 85°C Rev. 0 | Page 22 of 28 0.8 0.9 1.0 11641-070 25 115 105 11641-068 JUNCTION TEMPERATURE (°C) 145 11641-065 JUNCTION TEMPERATURE (°C) ADP7105 Data Sheet ADP7105 (5) 100 80 60 40 140 20 120 0 TB = 25°C TB = 50°C TB = 65°C TB = 85°C TJ MAX 0 0.5 1.0 1.5 2.0 Figure 78. SOIC 80 60 40 TB = 25°C TB = 50°C TB = 65°C TB = 85°C TJ MAX 20 0 2.5 TOTAL POWER DISSIPATION (W) 100 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 TOTAL POWER DISSIPATION (W) 11641-071 JUNCTION TEMPERATURE (TJ) The typical value of ΨJB is 15.1°C/W for the 8-lead LFCSP package and 31.3°C/W for the 8-lead SOIC package (see Table 7). 120 Figure 77. LFCSP Rev. 0 | Page 23 of 28 3.0 3.5 11641-072 TJ = TB + (PD × ΨJB) 140 JUNCTION TEMPERATURE (TJ) In the case where the board temperature is known, use the ΨJB thermal characterization parameter to estimate the junction temperature rise (see Figure 77 and Figure 78). Maximum junction temperature (TJ) is calculated from the board temperature (TB) and power dissipation (PD) using the following formula: ADP7105 Data Sheet PRINTED CIRCUIT BOARD LAYOUT CONSIDERATIONS Heat dissipation from the package can be improved by increasing the amount of copper attached to the pins of the ADP7105. However, as shown in Table 6, a point of diminishing returns is eventually reached, beyond which an increase in the copper size does not yield significant heat dissipation benefits. 11641-074 Place the input capacitor as close as possible to the VIN and GND pins. Place the output capacitor as close as possible to the VOUT and GND pins. Use of 0805 or 0603 size capacitors and resistors achieves the smallest possible footprint solution on boards where space is limited. 11641-073 Figure 80. Example SOIC PCB Layout Figure 79. Example LFCSP PCB Layout Rev. 0 | Page 24 of 28 Data Sheet ADP7105 OUTLINE DIMENSIONS 2.48 2.38 2.23 3.10 3.00 SQ 2.90 8 5 EXPOSED PAD INDEX AREA 4 TOP VIEW SEATING PLANE 0.30 0.25 0.18 0.20 MIN PIN 1 INDICATOR (R 0.2) 1 BOTTOM VIEW 0.80 MAX 0.55 NOM 0.80 0.75 0.70 1.74 1.64 1.49 0.05 MAX 0.02 NOM COPLANARITY 0.08 0.20 REF 0.50 BSC FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET. 02-05-2013-B 0.50 0.40 0.30 COMPLIANT TO JEDEC STANDARDS MO-229-WEED-4 Figure 81. 8-Lead Lead Frame Chip Scale Package [LFCSP_WD] 3 mm × 3 mm Body, Very Very Thin, Dual Lead (CP-8-5) Dimensions shown in millimeters 5.00 4.90 4.80 3.098 0.356 5 1 4 6.20 6.00 5.80 4.00 3.90 3.80 2.41 0.457 FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET. BOTTOM VIEW 1.27 BSC 3.81 REF TOP VIEW 1.65 1.25 1.75 1.35 SEATING PLANE 0.51 0.31 0.50 0.25 0.10 MAX 0.05 NOM COPLANARITY 0.10 8° 0° 45° 0.25 0.17 1.04 REF 1.27 0.40 COMPLIANT TO JEDEC STANDARDS MS-012-A A Figure 82. 8-Lead Standard Small Outline Package, with Exposed Pad [SOIC_N_EP] Narrow Body (RD-8-2) Dimensions shown in millimeters Rev. 0 | Page 25 of 28 06-03-2011-B 8 ADP7105 Data Sheet ORDERING GUIDE Model 1 ADP7105ACPZ-1.8-R7 ADP7105ACPZ-3.3-R7 ADP7105ACPZ-5.0-R7 ADP7105ACPZ-R2 ADP7105ACPZ-R7 ADP7105ARDZ-1.8 ADP7105ARDZ-1.8-R7 ADP7105ARDZ-3.3 ADP7105ARDZ-3.3-R7 ADP7105ARDZ-5.0 ADP7105ARDZ-5.0-R7 ADP7105ARDZ ADP7105ARDZ-R7 1 Temperature Range −40°C to +125°C −40°C to +125°C −40°C to +125°C −40°C to +125°C −40°C to +125°C −40°C to +125°C −40°C to +125°C −40°C to +125°C −40°C to +125°C −40°C to +125°C −40°C to +125°C −40°C to +125°C −40°C to +125°C Output Voltage (V) 1.8 3.3 5 Adjustable Adjustable 1.8 1.8 3.3 3.3 5 5 Adjustable Adjustable Z = RoHS Compliant Part. Rev. 0 | Page 26 of 28 Package Description 8-Lead LFCSP_WD 8-Lead LFCSP_WD 8-Lead LFCSP_WD 8-Lead LFCSP_WD 8-Lead LFCSP_WD 8-Lead SOIC_N_EP 8-Lead SOIC_N_EP 8-Lead SOIC_N_EP 8-Lead SOIC_N_EP 8-Lead SOIC_N_EP 8-Lead SOIC_N_EP 8-Lead SOIC_N_EP 8-Lead SOIC_N_EP Package Option CP-8-5 CP-8-5 CP-8-5 CP-8-5 CP-8-5 RD-8-2 RD-8-2 RD-8-2 RD-8-2 RD-8-2 RD-8-2 RD-8-2 RD-8-2 Branding LNS LNT LNU LNV LNV Data Sheet ADP7105 NOTES Rev. 0 | Page 27 of 28 ADP7105 Data Sheet NOTES ©2013 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D11641-0-7/13(0) Rev. 0 | Page 28 of 28