OPA OPA 433 OPA336 OPA2336 OPA4336 6 336 OPA2 336 SBOS068C – JANUARY 1997 – REVISED JANUARY 2005 SINGLE-SUPPLY, microPower CMOS OPERATIONAL AMPLIFIERS microAmplifier ™ Series FEATURES DESCRIPTION ● ● ● ● OPA336 series microPower CMOS operational amplifiers are designed for battery-powered applications. They operate on a single supply with operation as low as 2.1V. The output is rail-to-rail and swings to within 3mV of the supplies with a 100kΩ load. The common-mode range extends to the negative supply—ideal for single-supply applications. Single, dual, and quad versions have identical specifications for maximum design flexibility. SINGLE-SUPPLY OPERATION RAIL-TO-RAIL OUTPUT (within 3mV) microPOWER: IQ = 20µA/Amplifier microSIZE PACKAGES ● LOW OFFSET VOLTAGE: 125µV max ● SPECIFIED FROM VS = 2.3V to 5.5V ● SINGLE, DUAL, AND QUAD VERSIONS In addition to small size and low quiescent current (20µA/amplifier), they feature low offset voltage (125µV max), low input bias current (1pA), and high openloop gain (115dB). Dual and quad designs feature completely independent circuitry for lowest crosstalk and freedom from interaction. APPLICATIONS ● ● ● ● ● ● ● BATTERY-POWERED INSTRUMENTS PORTABLE DEVICES HIGH-IMPEDANCE APPLICATIONS PHOTODIODE PRE-AMPS PRECISION INTEGRATORS MEDICAL INSTRUMENTS TEST EQUIPMENT OPA336 packages are the tiny SOT23-5 surface mount and SO-8 surface-mount. OPA2336 come in the miniature MSOP-8 surface-mount, SO-8 surface-mount, and DIP-8 packages. The OPA4336 package is the space-saving SSOP-16 surface-mount. All are specified from –40°C to +85°C and operate from –55°C to +125°C. A macromodel is available for download (at www.ti.com) for design analysis. OPA336 Out 1 V– 2 +In 3 5 V+ 4 –In OPA4336 Out A 1 –In A 2 A SOT23-5 OPA336 OPA2336 NC 1 8 NC Out A 1 –In 2 7 V+ –In A 2 +In 3 6 Output +In A 3 V– 4 5 NC V– 4 SO-8 A B DIP-8, SO-8, MSOP-8 16 Out D 15 –In D D +In A 3 14 +In D V+ 4 13 V– +In B 5 12 +In C 8 V+ 7 Out B –In B 6 11 –In C 6 –In B Out B 7 10 Out C 5 +In B NC 8 9 NC B C SSOP-16 NC = No Connection NC = No Connection Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. Copyright © 1997-2005, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. www.ti.com PACKAGE/ORDERING INFORMATION(1) PRODUCT PACKAGE-LEAD PACKAGE DRAWING DESIGNATOR Single OPA336N OPA336NA OPA336NJ OPA336U OPA336UA OPA336UJ SOT23-5 SOT23-5 SOT23-5 SO-8 Surface-Mount SO-8 Surface-Mount SO-8 Surface-Mount DBV DBV DBV D D D A36(2) A36(2) J36 OPA336U OPA336UA OPA336UJ Dual OPA2336E OPA2336EA OPA2336P MSOP-8 Surface-Mount MSOP-8 Surface-Mount DIP-8 DGK DGK P B36(2) B36(2) OPA2336P PACKAGE MARKING OPA2336PA DIP-8 P OPA2336PA OPA2336U OPA2336UA SO-8 Surface-Mount SO-8 Surface-Mount D D OPA2336U OPA2336UA Quad OPA4336EA SSOP-16 Surface-Mount DBQ OPA4336EA NOTES: (1) For the most current package and ordering information, see the package option addendum at the end of this data sheet. (2) Grade will be marked on the Reel. ELECTROSTATIC DISCHARGE SENSITIVITY ABSOLUTE MAXIMUM RATINGS(1) Supply Voltage ................................................................................... 7.5V Signal Input Terminals, Voltage(2) ..................... (V–) –0.3V to (V+) +0.3V Current(2) .................................................... 10mA Output Short-Circuit(3) .............................................................. Continuous Operating Temperature .................................................. –55°C to +125°C Storage Temperature ..................................................... –55°C to +125°C Junction Temperature ...................................................................... 150°C Lead Temperature (soldering, 10s) ................................................. 300°C ESD Rating: Charged Device Model, OPA336 NJ and UJ only (CDM)(4) ....... 1000V Human Body Model (HBM)(4) ......................................................... 500V Machine Model (MM)(4) .................................................................. 100V NOTES: (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only. Functional operation of the device at these conditions, or beyond the specified operating conditions, is not implied. (2) Input terminals are diode-clamped to the power supply rails. Input signals that can swing more than 0.3V beyond the supply rails should be current-limited to 10mA or less. (3) Short-circuit to ground, one amplifier per package. (4) OPA336 NJ and UJ have been tested to CDM of 1000V. All other previous package versions have been tested using HBM and MM. Results are shown. 2 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. OPA336, 2336, 4336 www.ti.com SBOS068C ELECTRICAL CHARACTERISTICS: VS = 2.3V to 5.5V Boldface limits apply over the specified temperature range, TA = –40°C to +85°C. At TA = +25°C, VS = +5V, and RL = 25kΩ connected to VS/2, unless otherwise noted. OPA336N, U OPA2336E, P, U PARAMETER OFFSET VOLTAGE Input Offset Voltage vs Temperature vs Power Supply Over Temperature Channel Separation, dc CONDITION VOS dVOS/dT PSRR INPUT BIAS CURRENT Input Bias Current Over Temperature Input Offset Current MIN TYP(1) MAX ±60 ±125 25 100 130 ±1.5 VS = 2.3V to 5.5V VS = 2.3V to 5.5V ±1 IOS ±1 NOISE Input Voltage Noise, f = 0.1 to 10Hz Input Voltage Noise Density, f = 1kHz en Current Noise Density, f = 1kHz in 3 40 30 VCM CMRR –0.2V < VCM < (V+) –1V –0.2V < VCM < (V+) –1V –0.2 80 76 INPUT IMPEDANCE Differential Common-Mode OPEN-LOOP GAIN Open-Loop Voltage Gain Over Temperature Over Temperature FREQUENCY RESPONSE Gain-Bandwidth Product Slew Rate Overload Recovery Time AOL RL = 25kΩ, 100mV < VO < (V+) – 100mV RL = 25kΩ, 100mV < VO < (V+) – 100mV RL = 5kΩ, 500mV < VO < (V+) – 500mV RL = 5kΩ, 500mV < VO < (V+) – 500mV GBW SR Over Temperature POWER SUPPLY Specified Voltage Range Minimum Operating Voltage Quiescent Current (per amplifier) Over Temperature TEMPERATURE RANGE Specified Range Operating Range Storage Range Thermal Resistance SOT-23-5 Surface-Mount MSOP-8 Surface-Mount SO-8 Surface-Mount DIP-8 SSOP-16 Surface-Mount DIP-14 100 100 90 90 ✻ 70 ✻ 76 74 VS IQ 2.3 90 90 ✻ ✻ IO = 0 IO = 0 –40 –55 –55 ✻ ✻ ✻ ✻ ✻ ✻ ✻ 76 74 90 90 ✻ ✻ ✻ ✻ 32 36 +85 +125 +125 ✻ ✻ ✻ V dB dB ✻ ✻ Ω || pF Ω || pF ✻ dB dB dB dB ✻ kHz V/µs µs ✻ ✻ ✻ ✻ ✻ ✻ ✻ ✻ ✻ ✻ ✻ ✻ 23 ✻ ✻ ✻ θJA 200 150 150 100 100 80 µVp-p nV/√Hz fA/√Hz ✻ ✻ ✻ ✻ ✻ ✻ ✻ ✻ ✻ ✻ pA pA pA 86 ✻ ✻ ✻ ✻ ✻ ✻ ✻ ✻ ✻ ✻ ✻ ✻ ✻ ✻ ✻ ✻ ✻ ✻ ±500 ±2500 µV ✻ µV/°C ✻ ✻ µV/V ✻ µV/V ✻ µV/V ✻ ✻ ✻ 86 ✻ ✻ 100 100 500 500 TYP MAX UNITS ✻ ✻ ✻ ✻ 5.5 2.1 20 ✻ ✻ ✻ ✻ ±5 See Text ISC CLOAD ✻ ✻ MIN ✻ ✻ ✻ 106 3 20 ±500 ±10 115 RL = 100kΩ, AOL ≥ 70dB RL = 25kΩ, AOL ≥ 90dB RL = 25kΩ, AOL ≥ 90dB RL = 5kΩ, AOL ≥ 90dB RL = 5kΩ, AOL ≥ 90dB ✻ ✻ ✻ ✻ (V+) –1 100 0.03 100 MAX ±10 ±60 90 VS = 5V, G = 1 VS = 5V, G = 1 VIN • G = VS TYP OPA336NJ, UJ ✻ 1013 || 2 1013 || 4 OUTPUT Voltage Output Swing from Rail(2) Over Temperature Short-Circuit Current Capacitive Load Drive MIN 0.1 IB INPUT VOLTAGE RANGE Common-Mode Voltage Range Common-Mode Rejection Ratio Over Temperature OPA336NA, UA OPA2336EA, PA, UA OPA4336EA ✻ ✻ mV mV mV mV mV mA pF 38 42 V V µA µA ✻ ✻ ✻ °C °C °C °C/W °C/W °C/W °C/W °C/W °C/W ✻Specifications same as OPA2336E, P, U. NOTES: (1) VS = +5V. (2) Output voltage swings are measured between the output and positive and negative power-supply rails. OPA336, 2336, 4336 SBOS068C www.ti.com 3 TYPICAL CHARACTERISTICS At TA = +25°C, VS = +5V, and RL = 25kΩ connected to VS/2, unless otherwise noted. POWER-SUPPLY and COMMON-MODE REJECTION RATIO vs FREQUENCY OPEN-LOOP GAIN/PHASE vs FREQUENCY 100 100 G 0 –45 40 –90 Φ 20 –135 0 –180 PSRR, CMRR (dB) 60 CMRR 80 Phase (°) Voltage Gain (dB) 80 60 PSRR 40 20 –20 0 10 1 100 1k 10k 100k 1M 1 10 Frequency (Hz) 100 1k 100k QUIESCENT CURRENT vs TEMPERATURE QUIESCENT CURRENT vs SUPPLY VOLTAGE 30 30 Per Amplifier Per Amplifier VS = +5V Quiescent Current (µA) 25 Quiescent Current (µA) 10k Frequency (Hz) 25 20 15 20 15 10 VS = +2.3V 5 0 10 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 –75 6.0 –50 –25 Supply Voltage (V) SHORT-CIRCUIT CURRENT vs SUPPLY VOLTAGE 50 75 100 125 8 7 ±5 Short-Circuit Current (mA) Short-Circuit Current (mA) 25 SHORT-CIRCUIT CURRENT vs TEMPERATURE ±6 +ISC ±4 ±3 ±2 –ISC ±1 VS = +5V 6 –ISC 5 4 +ISC +ISC 3 VS = +2.3V 2 –ISC 1 0 0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 –75 Supply Voltage (V) 4 0 Temperature (°C) –50 –25 0 25 50 75 100 125 Temperature (°C) OPA336, 2336, 4336 www.ti.com SBOS068C TYPICAL CHARACTERISTICS (Cont.) At TA = +25°C, VS = +5V, and RL = 25kΩ connected to VS/2, unless otherwise noted. INPUT VOLTAGE AND CURRENT NOISE SPECTRAL DENSITY vs FREQUENCY CHANNEL SEPARATION vs FREQUENCY 1k 150 100 100 10 10 Current Noise (fA/√Hz) 140 130 Dual and Quad devices, G = 1, all channels. Quad measured channel A to D or B to C—other combinations yield improved rejection. 120 Current Noise 1 110 1 10 100 1k 10k 100k 100 1k Frequency (Hz) 120 AOL VS = +5.5V AOL, CMRR, PSRR (dB) 4 3 VS = +2.3V 2 1 110 100 PSRR 90 CMRR 80 70 0 1k 100 10k –75 100k –50 –25 0 25 50 75 100 Frequency (Hz) Temperature (°C) OFFSET VOLTAGE PRODUCTION DISTRIBUTION OFFSET VOLTAGE DRIFT MAGNITUDE PRODUCTION DISTRIBUTION 25 125 25 Percent of Amplifiers (%) Typical production distribution of packaged units. 15 10 5 0.1% 0.3% 0.2% 0.1% 20 15 10 5 Offset Voltage (µV) 4 3.5 3.75 3 3.25 2.5 2.75 2 2.25 1.5 1 1.25 Offset Voltage Drift (µV/°C) OPA336, 2336, 4336 SBOS068C 0.5 0.25 500 400 300 200 100 0 –100 –200 –300 –400 0 –500 0 Typical production distribution of packaged units. 0.75 Output Voltage (Vp-p) 5 Percent of Amplifiers (%) 100k AOL, CMRR, PSRR vs TEMPERATURE MAXIMUM OUTPUT VOLTAGE vs FREQUENCY 6 20 10k Frequency (Hz) 1.75 Voltage Noise (nV/√Hz) Voltage Noise Channel Separation (dB) 1k www.ti.com 5 TYPICAL CHARACTERISTICS (Cont.) At TA = +25°C, VS = +5V, and RL = 25kΩ connected to VS/2, unless otherwise noted. INPUT BIAS CURRENT vs INPUT COMMON-MODE VOLTAGE INPUT BIAS CURRENT vs TEMPERATURE 4 Input Bias Current (pA) Input Bias Current (pA) 1k 100 10 1 3 VS = +5V 2 1 0 0.1 –75 –50 –25 0 25 50 Temperature (°C) 75 100 0 125 OUTPUT VOLTAGE SWING vs OUTPUT CURRENT 1 2 3 Common-Mode Voltage (V) 4 OUTPUT VOLTAGE SWING vs OUTPUT CURRENT 5 –2.5 VS = ±2.5V VS = +5V –2.0 –55°C Sourcing Current +125°C +25°C Output Voltage (V) 4 Output Voltage (V) 5 3 VS = +2.3V +125°C 2 –55°C 1 Sinking Current –1.5 +125°C –1.0 –55°C –0.5 +25°C +25°C 0 0 0 1 2 3 4 5 Output Current (mA) 6 7 8 –0 –2 –3 –4 –5 Output Current (mA) –6 –7 –8 LARGE-SIGNAL STEP RESPONSE G = 1, CL = 620pF, VS = +5V 20mV/div 500mV/div SMALL-SIGNAL STEP RESPONSE G = 1, CL = 200pF, VS = +5V 200µs/div 50µs/div 6 –1 OPA336, 2336, 4336 www.ti.com SBOS068C APPLICATIONS INFORMATION OPA336 series op amps are fabricated on a state-of-the-art 0.6 micron CMOS process. They are unity-gain stable and suitable for a wide range of general-purpose applications. Power-supply pins should be bypassed with 0.01µF ceramic capacitors. OPA336 series op amps are protected against reverse battery voltages. Normally, input bias current is approximately 1pA. However, input voltages exceeding the power supplies can cause excessive current to flow in or out of the input pins. Momentary voltages greater than the power supply can be tolerated as long as the current on the input pins is limited to 10mA. This is easily accomplished with an input resistor, as shown in Figure 2. OPERATING VOLTAGE +5V OPA336 series op amps can operate from a +2.1V to +5.5V single supply with excellent performance. Most behavior remains unchanged throughout the full operating voltage range. Parameters which vary significantly with operating voltage are shown in the typical characteristics. OPA336 series op amps are fully specified for operation from +2.3V to +5.5V; a single limit applies over the supply range. In addition, many parameters are ensured over the specified temperature range, –40°C to +85°C. INPUT VOLTAGE The input common-mode range of OPA336 series op amps extends from (V–) – 0.2V to (V+) – 1V. For normal operation, inputs should be limited to this range. The absolute maximum input voltage is 300mV beyond the supplies. Thus, inputs greater than the input common-mode range but less than maximum input voltage, while not valid, will not cause any damage to the op amp. Furthermore, the inputs may go beyond the power supplies without phase inversion, as shown in Figure 1, unlike some other op amps. IOVERLOAD 10mA max VOUT OPAx336 VIN 5kΩ FIGURE 2. Input Current Protection for Voltages Exceeding the Supply Voltage. CAPACITIVE LOAD AND STABILITY OPA336 series op amps can drive a wide range of capacitive loads. However, all op amps under certain conditions may become unstable. Op-amp configuration, gain, and load value are just a few of the factors to consider when determining stability. When properly configured, OPA336 series op amps can drive approximately 10,000pF. An op amp in unity-gain configuration is the most vulnerable to capacitive load. The capacitive load reacts with the op amp’s output resistance, along with any additional load resistance, to create a pole in the response which degrades the phase margin. In unity gain, OPA336 series op amps perform well with a pure capacitive load up to about 300pF. Increasing gain enhances the amplifier’s ability to drive loads beyond this level. One method of improving capacitive load drive in the unity-gain configuration is to insert a 50Ω to 100Ω resistor inside the feedback loop, as shown in Figure 3. This reduces ringing with large capacitive loads while maintaining DC 6V VOUT RS 100Ω OPAx336 0V VOUT VIN CL FIGURE 1. No Phase Inversion with Inputs Greater than the Power-Supply Voltage. FIGURE 3. Series Resistor in Unity-Gain Configuration Improves Capacitive Load Drive. OPA336, 2336, 4336 SBOS068C RL www.ti.com 7 accuracy. For example, with RL = 25kΩ, OPA336 series op amps perform well with capacitive loads in excess of 1000pF, as shown in Figure 4. Without RS, capacitive load drive is typically 350pF for these conditions, as shown in Figure 5. Figure 5 shows the recommended operating regions for the OPA336. Decreasing the load resistance generally improves capacitive load drive. Figure 5 also illustrates how stability differs depending on where the resistive load is connected. With G = +1 and RL = 10kΩ connected to VS/2, the OPA336 can typically drive 500pF. Connecting the same load to ground improves capacitive load drive to 1000pF. 20mV/div RS = 100Ω, Load = 2kΩ || 1000pF, VS = +5V Direct Current (DC) error at the output; however, this error may be insignificant. For instance, with RL = 100kΩ and RS = 100Ω, there is only about a 0.1% error at the output. 10k 50µs/div FIGURE 4. Small-Signal Step Response Using Series Resistor to Improve Capacitive Load Drive. Alternatively, the resistor may be connected in series with the output outside of the feedback loop. However, if there is a resistive load parallel to the capacitive load, it and the series resistor create a voltage divider. This introduces a 8 Capacitive Load (pF) Operation Above Selected Gain Curve Not Recommended G = +1 RL to Ground G = +2 RL to Ground 1k G = +1 RL to VS/2 VS = +5V, VO = VS/2 100 5 10 100 Resistive Load (kΩ) FIGURE 5. Stability—Capacitive Load vs Resistive Load. OPA336, 2336, 4336 www.ti.com SBOS068C PACKAGE OPTION ADDENDUM www.ti.com 15-Apr-2017 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) HPA00779NA/3K ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM OPA2336E/250 ACTIVE VSSOP DGK 8 250 Green (RoHS & no Sb/Br) CU NIPDAUAG Level-2-260C-1 YEAR -40 to 85 B36 OPA2336E/250G4 ACTIVE VSSOP DGK 8 250 Green (RoHS & no Sb/Br) CU NIPDAUAG Level-2-260C-1 YEAR -40 to 85 B36 OPA2336E/2K5 ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAUAG Level-2-260C-1 YEAR -40 to 85 B36 OPA2336E/2K5G4 ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAUAG Level-2-260C-1 YEAR -40 to 85 B36 OPA2336EA/250 ACTIVE VSSOP DGK 8 250 Green (RoHS & no Sb/Br) CU NIPDAUAG Level-2-260C-1 YEAR -40 to 85 B36 OPA2336EA/250G4 ACTIVE VSSOP DGK 8 250 Green (RoHS & no Sb/Br) CU NIPDAUAG Level-2-260C-1 YEAR -40 to 85 B36 OPA2336EA/2K5 ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAUAG Level-2-260C-1 YEAR -40 to 85 B36 OPA2336EA/2K5G4 ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAUAG Level-2-260C-1 YEAR -40 to 85 B36 OPA2336P ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type -40 to 85 OPA2336P OPA2336PA ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type -40 to 85 OPA2336P A OPA2336PAG4 ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type -40 to 85 OPA2336P A OPA2336PG4 ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type -40 to 85 OPA2336P OPA2336U ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 OPA 2336U OPA2336U/2K5 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 OPA 2336U OPA2336U/2K5G4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 OPA 2336U OPA2336UA ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 OPA 2336U Addendum-Page 1 A36 Samples PACKAGE OPTION ADDENDUM www.ti.com 15-Apr-2017 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) A OPA2336UA/2K5 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 OPA 2336U A OPA2336UA/2K5G4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 OPA 2336U A OPA2336UAG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 OPA 2336U A OPA2336UG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 OPA 2336U OPA336N/250 ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM A36 OPA336N/250G4 ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM A36 OPA336N/3K ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM A36 OPA336N/3KG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM A36 OPA336NA/250 ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM A36 OPA336NA/250G4 ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM A36 OPA336NA/3K ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM A36 OPA336NA/3KG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM A36 OPA336NJ/250 ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 J36 OPA336NJ/250G4 ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 J36 OPA336NJ/3K ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 J36 OPA336NJ/3KG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 J36 Addendum-Page 2 Samples PACKAGE OPTION ADDENDUM www.ti.com 15-Apr-2017 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) OPA336U ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA 336U OPA336U/2K5 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA 336U OPA336U/2K5G4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA 336U OPA336UA ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA 336U A OPA336UA/2K5 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA 336U A OPA336UA/2K5G4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA 336U A OPA336UAG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA 336U A OPA336UG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA 336U OPA4336EA/250 ACTIVE SSOP DBQ 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 OPA 4336EA OPA4336EA/250G4 ACTIVE SSOP DBQ 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 OPA 4336EA OPA4336EA/2K5 ACTIVE SSOP DBQ 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 OPA 4336EA OPA4336EA/2K5G4 ACTIVE SSOP DBQ 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 OPA 4336EA (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. Addendum-Page 3 Samples PACKAGE OPTION ADDENDUM www.ti.com 15-Apr-2017 TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. 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OTHER QUALIFIED VERSIONS OF OPA336 : • Enhanced Product: OPA336-EP NOTE: Qualified Version Definitions: • Enhanced Product - Supports Defense, Aerospace and Medical Applications Addendum-Page 4 PACKAGE MATERIALS INFORMATION www.ti.com 29-Mar-2017 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant OPA2336E/250 VSSOP DGK 8 250 180.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 OPA2336E/2K5 VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 OPA2336EA/250 VSSOP DGK 8 250 180.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 OPA2336EA/2K5 VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 OPA2336U/2K5 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 OPA2336UA/2K5 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 OPA336N/250 SOT-23 DBV 5 250 178.0 9.0 3.3 3.2 1.4 4.0 8.0 Q3 OPA336N/3K SOT-23 DBV 5 3000 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 OPA336N/3K SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 OPA336NA/250 SOT-23 DBV 5 250 178.0 9.0 3.3 3.2 1.4 4.0 8.0 Q3 OPA336NA/3K SOT-23 DBV 5 3000 178.0 9.0 3.3 3.2 1.4 4.0 8.0 Q3 OPA336NA/3K SOT-23 DBV 5 3000 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 OPA336NJ/250 SOT-23 DBV 5 250 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 OPA336NJ/3K SOT-23 DBV 5 3000 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 OPA336NJ/3K SOT-23 DBV 5 3000 178.0 9.0 3.3 3.2 1.4 4.0 8.0 Q3 OPA336U/2K5 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 OPA336UA/2K5 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 OPA4336EA/250 SSOP DBQ 16 250 180.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 29-Mar-2017 Device OPA4336EA/2K5 Package Package Pins Type Drawing SSOP DBQ 16 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 2500 330.0 12.4 6.4 B0 (mm) K0 (mm) P1 (mm) 5.2 2.1 8.0 W Pin1 (mm) Quadrant 12.0 Q1 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) OPA2336E/250 VSSOP DGK 8 250 210.0 185.0 35.0 OPA2336E/2K5 VSSOP DGK 8 2500 367.0 367.0 35.0 OPA2336EA/250 VSSOP DGK 8 250 210.0 185.0 35.0 OPA2336EA/2K5 VSSOP DGK 8 2500 367.0 367.0 35.0 OPA2336U/2K5 SOIC D 8 2500 367.0 367.0 35.0 OPA2336UA/2K5 SOIC D 8 2500 367.0 367.0 35.0 OPA336N/250 SOT-23 DBV 5 250 180.0 180.0 18.0 OPA336N/3K SOT-23 DBV 5 3000 203.0 203.0 35.0 OPA336N/3K SOT-23 DBV 5 3000 180.0 180.0 18.0 OPA336NA/250 SOT-23 DBV 5 250 180.0 180.0 18.0 OPA336NA/3K SOT-23 DBV 5 3000 180.0 180.0 18.0 OPA336NA/3K SOT-23 DBV 5 3000 203.0 203.0 35.0 OPA336NJ/250 SOT-23 DBV 5 250 180.0 180.0 18.0 OPA336NJ/3K SOT-23 DBV 5 3000 203.0 203.0 35.0 OPA336NJ/3K SOT-23 DBV 5 3000 180.0 180.0 18.0 OPA336U/2K5 SOIC D 8 2500 367.0 367.0 35.0 Pack Materials-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 29-Mar-2017 Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) OPA336UA/2K5 SOIC D 8 2500 367.0 367.0 35.0 OPA4336EA/250 SSOP DBQ 16 250 210.0 185.0 35.0 OPA4336EA/2K5 SSOP DBQ 16 2500 367.0 367.0 35.0 Pack Materials-Page 3 PACKAGE OUTLINE DBQ0016A SSOP - 1.75 mm max height SCALE 2.800 SHRINK SMALL-OUTLINE PACKAGE C SEATING PLANE .228-.244 TYP [5.80-6.19] A .004 [0.1] C PIN 1 ID AREA 16 1 14X .0250 [0.635] 2X .175 [4.45] .189-.197 [4.81-5.00] NOTE 3 8 9 B .150-.157 [3.81-3.98] NOTE 4 16X .008-.012 [0.21-0.30] .007 [0.17] C A B .069 MAX [1.75] .005-.010 TYP [0.13-0.25] SEE DETAIL A .010 [0.25] GAGE PLANE .004-.010 [0.11-0.25] 0 -8 .016-.035 [0.41-0.88] (.041 ) [1.04] DETAIL A TYPICAL 4214846/A 03/2014 NOTES: 1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed .006 inch, per side. 4. This dimension does not include interlead flash. 5. Reference JEDEC registration MO-137, variation AB. www.ti.com EXAMPLE BOARD LAYOUT DBQ0016A SSOP - 1.75 mm max height SHRINK SMALL-OUTLINE PACKAGE 16X (.063) [1.6] SEE DETAILS SYMM 1 16 16X (.016 ) [0.41] 14X (.0250 ) [0.635] 9 8 (.213) [5.4] LAND PATTERN EXAMPLE SCALE:8X METAL SOLDER MASK OPENING SOLDER MASK OPENING .002 MAX [0.05] ALL AROUND METAL .002 MIN [0.05] ALL AROUND SOLDER MASK DEFINED NON SOLDER MASK DEFINED SOLDER MASK DETAILS 4214846/A 03/2014 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com EXAMPLE STENCIL DESIGN DBQ0016A SSOP - 1.75 mm max height SHRINK SMALL-OUTLINE PACKAGE 16X (.063) [1.6] SYMM 1 16 16X (.016 ) [0.41] SYMM 14X (.0250 ) [0.635] 9 8 (.213) [5.4] SOLDER PASTE EXAMPLE BASED ON .005 INCH [0.127 MM] THICK STENCIL SCALE:8X 4214846/A 03/2014 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. www.ti.com IMPORTANT NOTICE Texas Instruments Incorporated (TI) reserves the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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