Freescale MPC8323CVRAFDCA Powerquiccâ ¢ ii pro integrated communications processor family hardware specification Datasheet

Freescale Semiconductor
Technical Data
Document Number: MPC8323EEC
Rev. 3, 02/2010
MPC8323E
PowerQUICC™ II Pro Integrated
Communications Processor
Family Hardware Specifications
This document provides an overview of the MPC8323E
PowerQUICC™ II Pro processor features. The MPC8323E
is a cost-effective, highly integrated communications
processor that addresses the requirements of several
networking applications, including ADSL SOHO and
residential gateways, modem/routers, industrial control, and
test and measurement applications. The MPC8323E extends
current PowerQUICC offerings, adding higher CPU
performance, additional functionality, and faster interfaces,
while addressing the requirements related to time-to-market,
price, power consumption, and board real estate. This
document describes the MPC8323E, and unless otherwise
noted, the information also applies to the MPC8323,
MPC8321E, and MPC8321.
To locate published errata or updates for this document, refer
to the MPC8323E product summary page on our website
listed on the back cover of this document or contact your
local Freescale sales office.
© 2010 Freescale Semiconductor, Inc. All rights reserved.
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
13.
14.
15.
16.
17.
18.
19.
20.
21.
22.
23.
24.
25.
26.
Contents
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . 6
Power Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 9
Clock Input Timing . . . . . . . . . . . . . . . . . . . . . . . . . . 10
RESET Initialization . . . . . . . . . . . . . . . . . . . . . . . . . 11
DDR1 and DDR2 SDRAM . . . . . . . . . . . . . . . . . . . . 13
DUART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Ethernet and MII Management . . . . . . . . . . . . . . . . . 19
Local Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
JTAG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
I2C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
PCI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Timers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
GPIO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
IPIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
SPI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
TDM/SI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
UTOPIA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
HDLC, BISYNC, Transparent, and Synchronous
UART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .45
USB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Package and Pin Listings . . . . . . . . . . . . . . . . . . . . . 49
Clocking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
Thermal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
System Design Information . . . . . . . . . . . . . . . . . . . 76
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 79
Document Revision History . . . . . . . . . . . . . . . . . . . 80
Overview
1
Overview
The MPC8323E incorporates the e300c2 (MPC603e-based) core built on Power Architecture™
technology, which includes 16 Kbytes of L1 instruction and data caches, dual integer units, and on-chip
memory management units (MMUs). The e300c2 core does not contain a floating point unit (FPU). The
MPC8323E also includes a 32-bit PCI controller, four DMA channels, a security engine, and a 32-bit
DDR1/DDR2 memory controller.
A new communications complex based on QUICC Engine™ technology forms the heart of the networking
capability of the MPC8323E. The QUICC Engine block contains several peripheral controllers and a
32-bit RISC controller. Protocol support is provided by the main workhorses of the device—the unified
communication controllers (UCCs). Note that the MPC8321 and MPC8321E do not support UTOPIA. A
block diagram of the MPC8323E is shown in Figure 1.
MPC8323E
e300c2 Core
16 KB
I-Cache
16 KB
D-Cache
Integer Unit
(IU1)
Integer Unit
(IU2)
Security Engine (SEC 2.2)
System Interface Unit
(SIU)
Memory Controllers
GPCM/UPM
32-Bit DDR1/DDR2
Interface Unit
Classic G2 MMUs
PCI Controller
Timers, Power Management,
and JTAG/COP
Bus Arbitration
Multi-User
RAM
Accelerators
Baud Rate
Generators
Single 32-Bit RISC CP
DUART
Serial DMA
and
2 Virtual
DMAs
I2C
USB
SPI
SPI
Interrupt Controller
UCC5
UCC4
UCC3
4 Channel DMA
UCC2
UCC1
Parallel I/O
Protection and Configuration
System Reset
Time Slot Assigner
Serial Interface
4 TDM Ports
PCI
Local
Local Bus
QUICC Engine Block
DDR
3 MII/RMII
Clock Synthesizer
1 UL2/8-Bit
Figure 1. MPC8323E Block Diagram
Each of the five UCCs can support a variety of communication protocols: 10/100 Mbps Ethernet, serial
ATM, HDLC, UART, and BISYNC—and, in the MPC8323E and MPC8323, multi-PHY ATM and ATM
support for up to OC-3 speeds.
MPC8323E PowerQUICC™ II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3
2
Freescale Semiconductor
Overview
NOTE
The QUICC Engine block can also support a UTOPIA level 2 capable of
supporting 31 multi-PHY (MPC8323E- and MPC8323-specific).
The MPC8323E security engine (SEC 2.2) allows CPU-intensive cryptographic operations to be offloaded
from the main CPU core. The security-processing accelerator provides hardware acceleration for the DES,
3DES, AES, SHA-1, and MD-5 algorithms.
In summary, the MPC8323E family provides users with a highly integrated, fully programmable
communications processor. This helps ensure that a low-cost system solution can be quickly developed
and offers flexibility to accommodate new standards and evolving system requirements.
1.1
MPC8323E Features
Major features of the MPC8323E are as follows:
• High-performance, low-power, and cost-effective single-chip data-plane/control-plane solution for
ATM or IP/Ethernet packet processing (or both).
• MPC8323E QUICC Engine block offers a future-proof solution for next generation designs by
supporting programmable protocol termination and network interface termination to meet evolving
protocol standards.
• Single platform architecture supports the convergence of IP packet networks and ATM networks.
• DDR1/DDR2 memory controller—one 32-bit interface at up to 266 MHz supporting both DDR1
and DDR2.
• An e300c2 core built on Power Architecture technology with 16-Kbyte instruction and data caches,
and dual integer units.
• Peripheral interfaces such as 32-bit PCI (2.2) interface up to 66-MHz operation, 16-bit local bus
interface up to 66-MHz operation, and USB 2.0 (full-/low-speed).
• Security engine provides acceleration for control and data plane security protocols.
• High degree of software compatibility with previous-generation PowerQUICC processor-based
designs for backward compatibility and easier software migration.
1.1.1
Protocols
The protocols are as follows:
• ATM SAR up to 155 Mbps (OC-3) full duplex, with ATM traffic shaping (ATF TM4.1)
• Support for ATM AAL1 structured and unstructured circuit emulation service (CES 2.0)
• Support for IMA and ATM transmission convergence sub-layer
• ATM OAM handling features compatible with ITU-T I.610
• IP termination support for IPv4 and IPv6 packets including TOS, TTL, and header checksum
processing
• Extensive support for ATM statistics and Ethernet RMON/MIB statistics
• Support for 64 channels of HDLC/transparent
MPC8323E PowerQUICC™ II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3
Freescale Semiconductor
3
Overview
1.1.2
Serial Interfaces
The MPC8323E serial interfaces are as follows:
• Support for one UL2 interface with 31 multi-PHY addresses (MPC8323E and MPC8323 only)
• Support for up to three 10/100 Mbps Ethernet interfaces using MII or RMII
• Support for up to four T1/E1/J1/E3 or DS-3 serial interfaces (TDM)
• Support for dual UART and SPI interfaces and a single I2C interface
1.2
QUICC Engine Block
The QUICC Engine block is a versatile communications complex that integrates several communications
peripheral controllers. It provides on-chip system design for a variety of applications, particularly in
communications and networking systems. The QUICC Engine block has the following features:
• One 32-bit RISC controller for flexible support of the communications peripherals
• Serial DMA channel for receive and transmit on all serial channels
• Five universal communication controllers (UCCs) supporting the following protocols and
interfaces (not all of them simultaneously):
— 10/100 Mbps Ethernet/IEEE 802.3® standard
— IP support for IPv4 and IPv6 packets including TOS, TTL, and header checksum processing
— ATM protocol through UTOPIA interface (note that the MPC8321 and MPC8321E do not
support the UTOPIA interface)
— HDLC /transparent up to 70-Mbps full-duplex
— HDLC bus up to 10 Mbps
— Asynchronous HDLC
— UART
— BISYNC up to 2 Mbps
— QUICC multi-channel controller (QMC) for 64 TDM channels
• One UTOPIA interface (UPC1) supporting 31 multi-PHYs (MPC8323E- and MPC8323-specific)
• Two serial peripheral interfaces (SPI). SPI2 is dedicated to Ethernet PHY management.
• Four TDM interfaces
• Thirteen independent baud rate generators and 19 input clock pins for supplying clocks to UCC
serial channels
• Four independent 16-bit timers that can be interconnected as two 32-bit timers
The UCCs are similar to the PowerQUICC II peripherals: SCC (BISYNC, UART, and HDLC bus) and
FCC (fast Ethernet, HDLC, transparent, and ATM).
MPC8323E PowerQUICC™ II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3
4
Freescale Semiconductor
Overview
1.3
Security Engine
The security engine is optimized to handle all the algorithms associated with IPSec, IEEE 802.11i®
standard, and iSCSI. The security engine contains one crypto-channel, a controller, and a set of crypto
execution units (EUs). The execution units are:
• Data encryption standard execution unit (DEU), supporting DES and 3DES
• Advanced encryption standard unit (AESU), supporting AES
• Message digest execution unit (MDEU), supporting MD5, SHA1, SHA-256, and HMAC with any
algorithm
• One crypto-channel supporting multi-command descriptor chains
1.4
DDR Memory Controller
The MPC8323E DDR1/DDR2 memory controller includes the following features:
• Single 32-bit interface supporting both DDR1 and DDR2 SDRAM
• Support for up to 266-MHz data rate
• Support for two ×16 devices
• Support for up to 16 simultaneous open pages
• Supports auto refresh
• On-the-fly power management using CKE
• 1.8-/2.5-V SSTL2 compatible I/O
• Support for 1 chip select only
• FCRAM, ECC, hardware/software calibration, bit deskew, QIN stage, or atomic logic are not
supported.
1.5
PCI Controller
The MPC8323E PCI controller includes the following features:
• PCI Specification Revision 2.3 compatible
• Single 32-bit data PCI interface operates up to 66 MHz
• PCI 3.3-V compatible (not 5-V compatible)
• Support for host and agent modes
• On-chip arbitration, supporting three external masters on PCI
• Selectable hardware-enforced coherency
1.6
Programmable Interrupt Controller (PIC)
The programmable interrupt controller (PIC) implements the necessary functions to provide a flexible
solution for general-purpose interrupt control. The PIC programming model is compatible with the
MPC8260 interrupt controller, and it supports 8 external and 35 internal discrete interrupt sources.
Interrupts can also be redirected to an external interrupt controller.
MPC8323E PowerQUICC™ II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3
Freescale Semiconductor
5
Electrical Characteristics
2
Electrical Characteristics
This section provides the AC and DC electrical specifications and thermal characteristics for the
MPC8323E. The MPC8323E is currently targeted to these specifications. Some of these specifications are
independent of the I/O cell, but are included for a more complete reference. These are not purely I/O buffer
design specifications.
2.1
Overall DC Electrical Characteristics
This section covers the ratings, conditions, and other characteristics.
2.1.1
Absolute Maximum Ratings
Table 1 provides the absolute maximum ratings.
Table 1. Absolute Maximum Ratings1
Characteristic
Symbol
Max Value
Unit
Notes
Core supply voltage
VDD
–0.3 to 1.26
V
—
PLL supply voltage
AVDDn
–0.3 to 1.26
V
—
DDR1 and DDR2 DRAM I/O voltage
GVDD
–0.3 to 2.75
–0.3 to 1.98
V
—
PCI, local bus, DUART, system control and power management, I2C,
SPI, MII, RMII, MII management, and JTAG I/O voltage
OV DD
–0.3 to 3.6
V
—
Input voltage
MVIN
–0.3 to (GV DD + 0.3)
V
2
MVREF
–0.3 to (GV DD + 0.3)
V
2
Local bus, DUART, CLKIN, system
control and power management,
I2C, SPI, and JTAG signals
OVIN
–0.3 to (OV DD + 0.3)
V
3
PCI
OVIN
–0.3 to (OV DD + 0.3)
V
5
TSTG
–55 to 150
°C
—
DDR1/DDR2 DRAM signals
DDR1/DDR2 DRAM reference
Storage temperature range
Notes:
1. Functional and tested operating conditions are given in Table 2. Absolute maximum ratings are stress ratings only, and
functional operation at the maximums is not guaranteed. Stresses beyond those listed may affect device reliability or cause
permanent damage to the device.
2. Caution: MVIN must not exceed GVDD by more than 0.3 V. This limit may be exceeded for a maximum of 100 ms during
power-on reset and power-down sequences.
3. Caution: OVIN must not exceed OVDD by more than 0.3 V. This limit may be exceeded for a maximum of 100 ms during
power-on reset and power-down sequences.
MPC8323E PowerQUICC™ II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3
6
Freescale Semiconductor
Electrical Characteristics
2.1.2
Power Supply Voltage Specification
Table 2 provides the recommended operating conditions for the MPC8323E. Note that these values are the
recommended and tested operating conditions. Proper device operation outside of these conditions is not
guaranteed.
Table 2. Recommended Operating Conditions
Symbol
Recommended
Value
Unit
Notes
Core supply voltage
VDD
1.0 V ± 50 mV
V
1
PLL supply voltage
AVDD
1.0 V ± 50 mV
V
1
DDR1 and DDR2 DRAM I/O voltage
GVDD
2.5 V ± 125 mV
1.8 V ± 90 mV
V
1
PCI, local bus, DUART, system control and power management,
I2C, SPI, and JTAG I/O voltage
OV DD
3.3 V ± 300 mV
V
1
Junction temperature
TA/TJ
0 to 105
°C
2
Characteristic
Note:
1. GVDD, OVDD, AVDD, and VDD must track each other and must vary in the same direction—either in the positive or negative
direction.
2. Minimum temperature is specified with TA; maximum temperature is specified with TJ.
Figure 2 shows the undershoot and overshoot voltages at the interfaces of the MPC8323E
G/OVDD + 20%
G/OVDD + 5%
VIH
G/OVDD
GND
GND – 0.3 V
VIL
GND – 0.7 V
Not to Exceed 10%
of tinterface1
Note:
1. tinterface refers to the clock period associated with the bus clock interface.
Figure 2. Overshoot/Undershoot Voltage for GVDD/OVDD
MPC8323E PowerQUICC™ II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3
Freescale Semiconductor
7
Electrical Characteristics
2.1.3
Output Driver Characteristics
Table 3 provides information on the characteristics of the output driver strengths. The values are
preliminary estimates.
Table 3. Output Drive Capability
Output Impedance
(Ω)
Supply
Voltage
Local bus interface utilities signals
42
OVDD = 3.3 V
PCI signals
25
DDR1 signal
18
GVDD = 2.5 V
DDR2 signal
18
GVDD = 1.8 V
DUART, system control, I2C, SPI, JTAG
42
OVDD = 3.3 V
GPIO signals
42
OVDD = 3.3 V
Driver Type
2.1.4
Input Capacitance Specification
Table 4 describes the input capacitance for the CLKIN pin in the MPC8323E.
Table 4. Input Capacitance Specification
Parameter/Condition
Input capacitance for all pins except CLKIN
Input capacitance for CLKIN
Symbol
Min
Max
Unit
Notes
CI
6
8
pF
—
CICLKIN
10
—
pF
1
Note:
1. The external clock generator should be able to drive 10 pF.
2.2
Power Sequencing
The device does not require the core supply voltage (VDD) and IO supply voltages (GVDD and OVDD) to
be applied in any particular order. Note that during power ramp-up, before the power supplies are stable
and if the I/O voltages are supplied before the core voltage, there might be a period of time that all input
and output pins are actively driven and cause contention and excessive current. In order to avoid actively
driving the I/O pins and to eliminate excessive current draw, apply the core voltage (VDD) before the I/O
voltage (GVDD and OVDD) and assert PORESET before the power supplies fully ramp up. In the case
where the core voltage is applied first, the core voltage supply must rise to 90% of its nominal value before
the I/O supplies reach 0.7 V; see Figure 3. Once both the power supplies (I/O voltage and core voltage) are
stable, wait for a minimum of 32 clock cycles before negating PORESET.
Note that there is no specific power down sequence requirement for the device. I/O voltage supplies
(GVDD and OVDD) do not have any ordering requirements with respect to one another.
MPC8323E PowerQUICC™ II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3
8
Freescale Semiconductor
Power Characteristics
I/O Voltage (GVDD and OVDD)
V
Core Voltage (VDD)
0.7 V
90%
t
0
PORESET
tSYS_CLK_IN/tPCI_SYNC_IN >= 32 clocks
Figure 3. MPC8323E Power-Up Sequencing Example
3
Power Characteristics
The estimated typical power dissipation for this family of MPC8323E devices is shown in Table 5.
Table 5. MPC8323E Power Dissipation
CSB
Frequency (MHz)
QUICC Engine
Frequency (MHz)
Core
Frequency (MHz)
Typical
Maximum
Unit
Notes
133
200
266
0.74
1.48
W
1, 2, 3
133
200
333
0.78
1.62
W
1, 2, 3
Notes:
1. The values do not include I/O supply power (OVDD and GVDD) or AV DD. For I/O power values, see Table 6.
2. Typical power is based on a nominal voltage of VDD = 1.0 V, ambient temperature, and the core running a Dhrystone
benchmark application. The measurements were taken on the MPC8323MDS evaluation board using WC process silicon.
3. Maximum power is based on a voltage of VDD = 1.07 V, WC process, a junction TJ = 110°C, and an artificial smoke test.
Table 6 shows the estimated typical I/O power dissipation for the device.
Table 6. Estimated Typical I/O Power Dissipation
Interface
DDR I/O
65% utilization
2.5 V
Rs = 20 Ω
Rt = 50 Ω
1 pair of clocks
Parameter
266 MHz, 1 × 32 bits
GVDD (1.8 V)
0.212
GVDD (2.5 V) OVDD (3.3 V) Unit
0.367
—
W
Comments
—
MPC8323E PowerQUICC™ II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3
Freescale Semiconductor
9
Clock Input Timing
Table 6. Estimated Typical I/O Power Dissipation (continued)
Local bus I/O
load = 25 pF
1 pair of clocks
66 MHz, 32 bits
—
—
0.12
W
—
PCI I/O load = 30 pF
66 MHz, 32 bits
—
—
0.057
W
—
QUICC Engine block and
other I/Os
UTOPIA 8-bit 31 PHYs
—
—
0.041
W
TDM serial
—
—
0.001
W
Mutiply by number
of interfaces used.
TDM nibble
—
—
0.004
W
HDLC/TRAN serial
—
—
0.003
W
HDLC/TRAN nibble
—
—
0.025
W
DUART
—
—
0.017
W
MIIs
—
—
0.009
W
RMII
—
—
0.009
W
Ethernet management
—
—
0.002
W
USB
—
—
0.001
W
SPI
—
—
0.001
W
Timer output
—
—
0.002
W
NOTE
AVDDn (1.0 V) is estimated to consume 0.05 W (under normal operating
conditions and ambient temperature).
4
Clock Input Timing
This section provides the clock input DC and AC electrical characteristics for the MPC8323E.
NOTE
The rise/fall time on QUICC Engine input pins should not exceed 5 ns. This
should be enforced especially on clock signals. Rise time refers to signal
transitions from 10% to 90% of VCC; fall time refers to transitions from
90% to 10% of VCC.
4.1
DC Electrical Characteristics
Table 7 provides the clock input (CLKIN/PCI_SYNC_IN) DC timing specifications for the MPC8323E.
Table 7. CLKIN DC Electrical Characteristics
Parameter
Condition
Symbol
Min
Max
Unit
Input high voltage
—
VIH
2.7
OVDD + 0.3
V
Input low voltage
—
VIL
–0.3
0.4
V
MPC8323E PowerQUICC™ II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3
10
Freescale Semiconductor
RESET Initialization
Table 7. CLKIN DC Electrical Characteristics (continued)
0 V ≤ VIN ≤ OVDD
IIN
—
±5
μA
PCI_SYNC_IN input current
0 V ≤ VIN ≤ 0.5 V or
OVDD – 0.5 V ≤ VIN ≤ OV DD
IIN
—
±5
μA
PCI_SYNC_IN input current
0.5 V ≤ VIN ≤ OVDD – 0.5 V
IIN
—
±50
μA
CLKIN input current
4.2
AC Electrical Characteristics
The primary clock source for the MPC8323E can be one of two inputs, CLKIN or PCI_CLK, depending
on whether the device is configured in PCI host or PCI agent mode. Table 8 provides the clock input
(CLKIN/PCI_CLK) AC timing specifications for the MPC8323E.
Table 8. CLKIN AC Timing Specifications
Parameter/Condition
Symbol
Min
Typical
Max
Unit
Notes
CLKIN/PCI_CLK frequency
fCLKIN
25
—
66.67
MHz
1
CLKIN/PCI_CLK cycle time
tCLKIN
15
—
—
ns
—
CLKIN rise and fall time
tKH, tKL
0.6
0.8
4
ns
2
PCI_CLK rise and fall time
tPCH, tPCL
0.6
0.8
1.2
ns
2
CLKIN/PCI_CLK duty cycle
tKHK/tCLKIN
40
—
60
%
3
—
—
—
±150
ps
4, 5
CLKIN/PCI_CLK jitter
Notes:
1. Caution: The system, core, security, and QUICC Engine block must not exceed their respective maximum or minimum
operating frequencies.
2. Rise and fall times for CLKIN/PCI_CLK are measured at 0.4 and 2.7 V.
3. Timing is guaranteed by design and characterization.
4. This represents the total input jitter—short term and long term—and is guaranteed by design.
5. The CLKIN/PCI_CLK driver’s closed loop jitter bandwidth should be < 500 kHz at –20 dB. The bandwidth must be set low to
allow cascade-connected PLL-based devices to track CLKIN drivers with the specified jitter.
5
RESET Initialization
This section describes the AC electrical specifications for the reset initialization timing requirements of
the MPC8323E. Table 9 provides the reset initialization AC timing specifications for the reset
component(s).
Table 9. RESET Initialization Timing Specifications
Parameter/Condition
Min
Max
Unit
Notes
Required assertion time of HRESET or SRESET (input) to activate reset
flow
32
—
tPCI_SYNC_IN
1
Required assertion time of PORESET with stable clock applied to CLKIN
when the MPC8323E is in PCI host mode
32
—
tCLKIN
2
Required assertion time of PORESET with stable clock applied to
PCI_SYNC_IN when the MPC8323E is in PCI agent mode
32
—
tPCI_SYNC_IN
1
MPC8323E PowerQUICC™ II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3
Freescale Semiconductor
11
RESET Initialization
Table 9. RESET Initialization Timing Specifications (continued)
HRESET/SRESET assertion (output)
512
—
tPCI_SYNC_IN
1
HRESET negation to SRESET negation (output)
16
—
tPCI_SYNC_IN
1
Input setup time for POR configuration signals
(CFG_RESET_SOURCE[0:2] and CFG_CLKIN_DIV) with respect to
negation of PORESET when the MPC8323E is in PCI host mode
4
—
tCLKIN
2
Input setup time for POR configuration signals
(CFG_RESET_SOURCE[0:2] and CFG_CLKIN_DIV) with respect to
negation of PORESET when the MPC8323E is in PCI agent mode
4
—
tPCI_SYNC_IN
1
Input hold time for POR config signals with respect to negation of
HRESET
0
—
ns
—
Time for the MPC8323E to turn off POR configuration signals with respect
to the assertion of HRESET
—
4
ns
3
Time for the MPC8323E to turn on POR configuration signals with respect
to the negation of HRESET
1
—
tPCI_SYNC_IN
1, 3
Notes:
1. tPCI_SYNC_IN is the clock period of the input clock applied to PCI_SYNC_IN. When the MPC8323E is In PCI host mode the
primary clock is applied to the CLKIN input, and PCI_SYNC_IN period depends on the value of CFG_CLKIN_DIV. See the
MPC8323E PowerQUICC™ II Pro Integrated Communications Processor Reference Manual for more details.
2. tCLKIN is the clock period of the input clock applied to CLKIN. It is only valid when the MPC8323E is in PCI host mode. See
the MPC8323E PowerQUICC™ II Pro Integrated Communications Processor Reference Manual for more details.
3. POR configuration signals consists of CFG_RESET_SOURCE[0:2] and CFG_CLKIN_DIV.
Table 10 provides the PLL lock times.
Table 10. PLL Lock Times
Parameter/Condition
PLL lock times
5.1
Min
Max
Unit
Notes
—
100
μs
—
Reset Signals DC Electrical Characteristics
Table 11 provides the DC electrical characteristics for the MPC8323E reset signals mentioned in Table 9.
Table 11. Reset Signals DC Electrical Characteristics
Characteristic
Symbol
Condition
Min
Max
Unit
Notes
Output high voltage
VOH
IOH = –6.0 mA
2.4
—
V
1
Output low voltage
VOL
IOL = 6.0 mA
—
0.5
V
1
Output low voltage
VOL
IOL = 3.2 mA
—
0.4
V
1
Input high voltage
VIH
—
2.0
OVDD + 0.3
V
1
Input low voltage
VIL
—
–0.3
0.8
V
—
Input current
IIN
0 V ≤ VIN ≤ OVDD
—
±5
μA
—
Note:
1. This specification applies when operating from 3.3 V supply.
MPC8323E PowerQUICC™ II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3
12
Freescale Semiconductor
DDR1 and DDR2 SDRAM
6
DDR1 and DDR2 SDRAM
This section describes the DC and AC electrical specifications for the DDR1 and DDR2 SDRAM interface
of the MPC8323E. Note that DDR1 SDRAM is Dn_GVDD(typ) = 2.5 V and DDR2 SDRAM is
Dn_GVDD(typ) = 1.8 V. The AC electrical specifications are the same for DDR1 and DDR2 SDRAM.
6.1
DDR1 and DDR2 SDRAM DC Electrical Characteristics
Table 12 provides the recommended operating conditions for the DDR2 SDRAM component(s) of the
MPC8323E when Dn_GVDD(typ) = 1.8 V.
Table 12. DDR2 SDRAM DC Electrical Characteristics for Dn_GVDD(typ) = 1.8 V
Parameter/Condition
Symbol
Min
Max
Unit
Notes
Dn_GVDD
1.71
1.89
V
1
MVREFnREF
0.49 × Dn_GVDD
0.51 × Dn_GVDD
V
2
I/O termination voltage
VTT
MVREFnREF – 0.04
MVREFnREF + 0.04
V
3
Input high voltage
VIH
MVREFnREF + 0.125
Dn_GV DD + 0.3
V
—
Input low voltage
VIL
–0.3
MVREFnREF – 0.125
V
—
Output leakage current
IOZ
–9.9
9.9
μA
4
Output high current (VOUT = 1.35 V)
IOH
–13.4
—
mA
—
Output low current (VOUT = 0.280 V)
IOL
13.4
—
mA
—
I/O supply voltage
I/O reference voltage
Notes:
1. Dn_GVDD is expected to be within 50 mV of the DRAM Dn_GVDD at all times.
2. MVREF nREF is expected to be equal to 0.5 × Dn_GVDD, and to track Dn_GVDD DC variations as measured at the receiver.
Peak-to-peak noise on MVREFnREF may not exceed ±2% of the DC value.
3. VTT is not applied directly to the device. It is the supply to which far end signal termination is made and is expected to be
equal to MVREFnREF. This rail should track variations in the DC level of MVREFnREF.
4. Output leakage is measured with all outputs disabled, 0 V ≤ VOUT ≤ Dn_GVDD.
Table 13 provides the DDR2 capacitance when Dn_GVDD(typ) = 1.8 V.
Table 13. DDR2 SDRAM Capacitance for Dn_GVDD(typ) = 1.8 V
Parameter/Condition
Symbol
Min
Max
Unit
Notes
Input/output capacitance: DQ, DQS
CIO
6
8
pF
1
Delta input/output capacitance: DQ, DQS
CDIO
—
0.5
pF
1
Note:
1. This parameter is sampled. Dn_GVDD = 1.8 V ± 0.090 V, f = 1 MHz, TA = 25 °C, VOUT = Dn_GVDD ÷ 2,
VOUT (peak-to-peak) = 0.2 V.
MPC8323E PowerQUICC™ II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3
Freescale Semiconductor
13
DDR1 and DDR2 SDRAM
Table 14 provides the recommended operating conditions for the DDR1 SDRAM component(s) of the
MPC8323E when Dn_GVDD(typ) = 2.5 V.
Table 14. DDR1 SDRAM DC Electrical Characteristics for Dn_GVDD(typ) = 2.5 V
Parameter/Condition
Symbol
Min
Max
Unit
Notes
Dn_GVDD
2.375
2.625
V
1
MVREFnREF
0.49 × Dn_GVDD
0.51 × Dn_GVDD
V
2
I/O termination voltage
VTT
MVREFnREF – 0.04
MVREFnREF + 0.04
V
3
Input high voltage
VIH
MVREFnREF + 0.15
Dn_GV DD + 0.3
V
—
Input low voltage
VIL
–0.3
MVREFnREF – 0.15
V
—
Output leakage current
IOZ
–9.9
–9.9
μA
4
Output high current (VOUT = 1.95 V)
IOH
–16.2
—
mA
—
Output low current (VOUT = 0.35 V)
IOL
16.2
—
mA
—
I/O supply voltage
I/O reference voltage
Notes:
1. Dn_GVDD is expected to be within 50 mV of the DRAM Dn_GVDD at all times.
2. MVREF nREF is expected to be equal to 0.5 × Dn_GVDD, and to track Dn_GVDD DC variations as measured at the receiver.
Peak-to-peak noise on MVREFnREF may not exceed ±2% of the DC value.
3. VTT is not applied directly to the device. It is the supply to which far end signal termination is made and is expected to be
equal to MVREFnREF. This rail should track variations in the DC level of MVREFnREF.
4. Output leakage is measured with all outputs disabled, 0 V ≤ VOUT ≤ Dn_GVDD.
Table 15 provides the DDR1 capacitance Dn_GVDD(typ) = 2.5 V.
Table 15. DDR1 SDRAM Capacitance for Dn_GVDD(typ) = 2.5 V Interface
Parameter/Condition
Input/output capacitance: DQ,DQS
Delta input/output capacitance: DQ, DQS
Symbol
Min
Max
Unit
Notes
CIO
6
8
pF
1
CDIO
—
0.5
pF
1
Note:
1. This parameter is sampled. D n_GVDD = 2.5 V ± 0.125 V, f = 1 MHz, TA = 25° C, VOUT = Dn_GVDD ÷ 2,
VOUT (peak-to-peak) = 0.2 V.
MPC8323E PowerQUICC™ II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3
14
Freescale Semiconductor
DDR1 and DDR2 SDRAM
6.2
DDR1 and DDR2 SDRAM AC Electrical Characteristics
This section provides the AC electrical characteristics for the DDR1 and DDR2 SDRAM interface.
6.2.1
DDR1 and DDR2 SDRAM Input AC Timing Specifications
Table 16 provides the input AC timing specifications for the DDR2 SDRAM (Dn_GVDD(typ) = 1.8 V).
Table 16. DDR2 SDRAM Input AC Timing Specifications for 1.8-V Interface
At recommended operating conditions with D n_GVDD of 1.8 ± 5%.
Parameter
Symbol
Min
Max
Unit
Notes
AC input low voltage
VIL
—
MVREFnREF – 0.25
V
—
AC input high voltage
VIH
MVREFnREF + 0.25
—
V
—
Table 17 provides the input AC timing specifications for the DDR1 SDRAM (Dn_GVDD(typ) = 2.5 V).
Table 17. DDR1 SDRAM Input AC Timing Specifications for 2.5 V Interface
At recommended operating conditions with D n_GVDD of 2.5 ± 5%.
Parameter
Symbol
Min
Max
Unit
Notes
AC input low voltage
VIL
—
MVREFnREF – 0.31
V
—
AC input high voltage
VIH
MVREFnREF + 0.31
—
V
—
Table 18 provides the input AC timing specifications for the DDR1 and DDR2 SDRAM interface.
Table 18. DDR1 and DDR2 SDRAM Input AC Timing Specifications
At recommended operating conditions with D n_GVDD of (1.8 or 2.5 V) ± 5%.
Parameter
Symbol
Controller skew for MDQS—MDQ/MDM
Min
Max
–750
–1250
750
1250
tCISKEW
266 MHz
200 MHz
Unit
Notes
ps
1, 2
Notes:
1. tCISKEW represents the total amount of skew consumed by the controller between MDQS[n] and any corresponding bit that
is captured with MDQS[n]. This should be subtracted from the total timing budget.
2. The amount of skew that can be tolerated from MDQS to a corresponding MDQ signal is called tDISKEW. This can be
determined by the following equation: tDISKEW = ±(T/4 – abs(tCISKEW)) where T is the clock period and abs(tCISKEW) is the
absolute value of tCISKEW.
MPC8323E PowerQUICC™ II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3
Freescale Semiconductor
15
DDR1 and DDR2 SDRAM
Figure 4 shows the input timing diagram for the DDR controller.
MCK[n]
MCK[n]
tMCK
MDQS[n]
MDQ[x]
D0
D1
tDISKEW
tDISKEW
Figure 4. DDR Input Timing Diagram
6.2.2
DDR1 and DDR2 SDRAM Output AC Timing Specifications
Table 19 provides the output AC timing specifications for the DDR1 and DDR2 SDRAM interfaces.
Table 19. DDR1 and DDR2 SDRAM Output AC Timing Specifications
At recommended operating conditions with D n_GVDD of (1.8 or 2.5 V) ± 5%.
Parameter
MCK cycle time, (MCK/MCK crossing)
ADDR/CMD output setup with respect to MCK
Symbol1
Min
Max
Unit
Notes
tMCK
7.5
10
ns
2
ns
3
ns
3
ns
3
ns
3
ns
4
tDDKHAS
266 MHz
200 MHz
ADDR/CMD output hold with respect to MCK
2.5
3.5
tDDKHAX
266 MHz
200 MHz
MCS output setup with respect to MCK
2.5
3.5
—
—
2.5
3.5
—
—
2.5
3.5
—
—
–0.6
0.6
tDDKHCS
266 MHz
200 MHz
MCS output hold with respect to MCK
tDDKHCX
266 MHz
200 MHz
MCK to MDQS Skew
—
—
tDDKHMH
MPC8323E PowerQUICC™ II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3
16
Freescale Semiconductor
DDR1 and DDR2 SDRAM
Table 19. DDR1 and DDR2 SDRAM Output AC Timing Specifications (continued)
At recommended operating conditions with D n_GVDD of (1.8 or 2.5 V) ± 5%.
Symbol1
Parameter
MDQ/MDM output setup with respect to MDQS
Max
tDDKHDS,
tDDKLDS
266 MHz
200 MHz
MDQ/MDM output hold with respect to MDQS
Min
0.9
1.0
Notes
ns
5
ps
5
—
—
tDDKHDX,
tDDKLDX
266 MHz
200 MHz
Unit
1100
1200
—
—
MDQS preamble start
tDDKHMP
–0.5 × tMCK – 0.6
–0.5 × tMCK + 0.6
ns
6
MDQS epilogue end
tDDKHME
–0.6
0.6
ns
6
Notes:
1. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for
inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. Output hold time can be read as DDR timing
(DD) from the rising or falling edge of the reference clock (KH or KL) until the output went invalid (AX or DX). For example,
tDDKHAS symbolizes DDR timing (DD) for the time tMCK memory clock reference (K) goes from the high (H) state until outputs
(A) are setup (S) or output valid time. Also, tDDKLDX symbolizes DDR timing (DD) for the time tMCK memory clock reference
(K) goes low (L) until data outputs (D) are invalid (X) or data output hold time.
2. All MCK/MCK referenced measurements are made from the crossing of the two signals ±0.1 V.
3. ADDR/CMD includes all DDR SDRAM output signals except MCK/MCK, MCS, and MDQ/MDM/MDQS. For the ADDR/CMD
setup and hold specifications, it is assumed that the Clock Control register is set to adjust the memory clocks by 1/2 applied
cycle.
4. Note that tDDKHMH follows the symbol conventions described in note 1. For example, tDDKHMH describes the DDR timing (DD)
from the rising edge of the MCK(n) clock (KH) until the MDQS signal is valid (MH). tDDKHMH can be modified through control
of the DQSS override bits in the TIMING_CFG_2 register. This is typically set to the same delay as the clock adjust in the
CLK_CNTL register. The timing parameters listed in the table assume that these 2 parameters have been set to the same
adjustment value. See the MPC8323E PowerQUICC™ II Pro Integrated Communications Processor Reference Manual for
a description and understanding of the timing modifications enabled by use of these bits.
5. Determined by maximum possible skew between a data strobe (MDQS) and any corresponding bit of data (MDQ), or data
mask (MDM). The data strobe should be centered inside of the data eye at the pins of the microprocessor.
6. All outputs are referenced to the rising edge of MCK(n) at the pins of the microprocessor. Note that tDDKHMP follows the
symbol conventions described in note 1.
MPC8323E PowerQUICC™ II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3
Freescale Semiconductor
17
DDR1 and DDR2 SDRAM
Figure 5 shows the DDR SDRAM output timing for the MCK to MDQS skew measurement (tDDKHMH).
MCK
MCK
tMCK
tDDKHMH(max) = 0.6 ns
MDQS
tDDKHMH(min) = –0.6 ns
MDQS
Figure 5. Timing Diagram for tDDKHMH
Figure 6 shows the DDR1 and DDR2 SDRAM output timing diagram.
MCK[n]
MCK[n]
tMCK
tDDKHAS,tDDKHCS
tDDKHAX,tDDKHCX
ADDR/CMD
Write A0
NOOP
tDDKHMP
tDDKHMH
MDQS[n]
tDDKHME
tDDKHDS
tDDKLDS
MDQ[x]
D0
D1
tDDKLDX
tDDKHDX
Figure 6. DDR1 and DDR2 SDRAM Output Timing Diagram
MPC8323E PowerQUICC™ II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3
18
Freescale Semiconductor
DUART
7
DUART
This section describes the DC and AC electrical specifications for the DUART interface of the
MPC8323E.
7.1
DUART DC Electrical Characteristics
Table 20 provides the DC electrical characteristics for the DUART interface of the MPC8323E.
Table 20. DUART DC Electrical Characteristics
Parameter
Symbol
Min
Max
Unit
High-level input voltage
VIH
2
OVDD + 0.3
V
Low-level input voltage OVDD
VIL
–0.3
0.8
V
High-level output voltage, IOH = –100 μA
VOH
OV DD – 0.2
—
V
Low-level output voltage, IOL = 100 μA
VOL
—
0.2
V
IIN
—
±5
μA
Input current (0 V ≤ VIN ≤ OV DD)1
Note:
1. Note that the symbol VIN, in this case, represents the OV IN symbol referenced in Table 1 and Table 2.
7.2
DUART AC Electrical Specifications
Table 21 provides the AC timing parameters for the DUART interface of the MPC8323E.
Table 21. DUART AC Timing Specifications
Parameter
Value
Unit
Minimum baud rate
256
baud
Maximum baud rate
> 1,000,000
baud
1
16
—
2
Oversample rate
Notes
Notes:
1. Actual attainable baud rate is limited by the latency of interrupt processing.
2. The middle of a start bit is detected as the 8th sampled 0 after the 1-to-0 transition of the start bit. Subsequent bit values are
sampled each 16th sample.
8
Ethernet and MII Management
This section provides the AC and DC electrical characteristics for Ethernet and MII management.
8.1
Ethernet Controller (10/100 Mbps)—MII/RMII Electrical
Characteristics
The electrical characteristics specified here apply to all MII (media independent interface) and RMII
(reduced media independent interface), except MDIO (management data input/output) and MDC
MPC8323E PowerQUICC™ II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3
Freescale Semiconductor
19
Ethernet and MII Management
(management data clock). The MII and RMII are defined for 3.3 V. The electrical characteristics for MDIO
and MDC are specified in Section 8.3, “Ethernet Management Interface Electrical Characteristics.”
8.1.1
DC Electrical Characteristics
All MII and RMII drivers and receivers comply with the DC parametric attributes specified in Table 22.
The potential applied to the input of a MII or RMII receiver may exceed the potential of the receiver’s
power supply (that is, a MII driver powered from a 3.6-V supply driving VOH into a MII receiver powered
from a 2.5-V supply). Tolerance for dissimilar MII driver and receiver supply potentials is implicit in these
specifications.
Table 22. MII and RMII DC Electrical Characteristics
Parameter
Symbol
Conditions
Min
Max
Unit
Supply voltage 3.3 V
OVDD
—
2.97
3.63
V
Output high voltage
VOH
IOH = –4.0 mA
OVDD = Min
2.40
OVDD + 0.3
V
Output low voltage
VOL
IOL = 4.0 mA
OVDD = Min
GND
0.50
V
Input high voltage
VIH
—
—
2.0
OVDD + 0.3
V
Input low voltage
VIL
—
—
–0.3
0.90
V
Input current
IIN
0 V ≤ VIN ≤ OVDD
—
±5
μA
8.2
MII and RMII AC Timing Specifications
The AC timing specifications for MII and RMII are presented in this section.
8.2.1
MII AC Timing Specifications
This section describes the MII transmit and receive AC timing specifications.
8.2.1.1
MII Transmit AC Timing Specifications
Table 23 provides the MII transmit AC timing specifications.
Table 23. MII Transmit AC Timing Specifications
At recommended operating conditions with OVDD of 3.3 V ± 10%.
Symbol1
Min
Typical
Max
Unit
TX_CLK clock period 10 Mbps
tMTX
—
400
—
ns
TX_CLK clock period 100 Mbps
tMTX
—
40
—
ns
tMTXH/tMTX
35
—
65
%
tMTKHDX
1
5
15
ns
tMTXR
1.0
—
4.0
ns
Parameter/Condition
TX_CLK duty cycle
TX_CLK to MII data TXD[3:0], TX_ER, TX_EN delay
TX_CLK data clock rise VIL(min) to VIH(max)
MPC8323E PowerQUICC™ II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3
20
Freescale Semiconductor
Ethernet and MII Management
Table 23. MII Transmit AC Timing Specifications (continued)
At recommended operating conditions with OVDD of 3.3 V ± 10%.
Parameter/Condition
TX_CLK data clock fall VIH(max) to VIL(min)
Symbol1
Min
Typical
Max
Unit
tMTXF
1.0
—
4.0
ns
Note:
1. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for
inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tMTKHDX symbolizes MII transmit
timing (MT) for the time tMTX clock reference (K) going high (H) until data outputs (D) are invalid (X). Note that, in general,
the clock reference symbol representation is based on two to three letters representing the clock of a particular functional.
For example, the subscript of tMTX represents the MII(M) transmit (TX) clock. For rise and fall times, the latter convention is
used with the appropriate letter: R (rise) or F (fall).
Figure 7 shows the MII transmit AC timing diagram.
tMTXR
tMTX
TX_CLK
tMTXH
tMTXF
TXD[3:0]
TX_EN
TX_ER
tMTKHDX
Figure 7. MII Transmit AC Timing Diagram
8.2.1.2
MII Receive AC Timing Specifications
Table 24 provides the MII receive AC timing specifications.
Table 24. MII Receive AC Timing Specifications
At recommended operating conditions with OVDD of 3.3 V ± 10%.
Symbol1
Min
Typical
Max
Unit
RX_CLK clock period 10 Mbps
tMRX
—
400
—
ns
RX_CLK clock period 100 Mbps
tMRX
—
40
—
ns
tMRXH/tMRX
35
—
65
%
RXD[3:0], RX_DV, RX_ER setup time to RX_CLK
tMRDVKH
10.0
—
—
ns
RXD[3:0], RX_DV, RX_ER hold time to RX_CLK
tMRDXKH
10.0
—
—
ns
tMRXR
1.0
—
4.0
ns
Parameter/Condition
RX_CLK duty cycle
RX_CLK clock rise VIL(min) to VIH(max)
MPC8323E PowerQUICC™ II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3
Freescale Semiconductor
21
Ethernet and MII Management
Table 24. MII Receive AC Timing Specifications (continued)
At recommended operating conditions with OVDD of 3.3 V ± 10%.
Parameter/Condition
Symbol1
Min
Typical
Max
Unit
tMRXF
1.0
—
4.0
ns
RX_CLK clock fall time VIH(max) to VIL(min)
Note:
1. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for
inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tMRDVKH symbolizes MII receive
timing (MR) with respect to the time data input signals (D) reach the valid state (V) relative to the tMRX clock reference (K)
going to the high (H) state or setup time. Also, tMRDXKL symbolizes MII receive timing (GR) with respect to the time data input
signals (D) went invalid (X) relative to the tMRX clock reference (K) going to the low (L) state or hold time. Note that, in general,
the clock reference symbol representation is based on three letters representing the clock of a particular functional. For
example, the subscript of tMRX represents the MII (M) receive (RX) clock. For rise and fall times, the latter convention is used
with the appropriate letter: R (rise) or F (fall).
Figure 8 provides the AC test load.
Z0 = 50 Ω
Output
RL = 50 Ω
OVDD/2
Figure 8. AC Test Load
Figure 9 shows the MII receive AC timing diagram.
tMRXR
tMRX
RX_CLK
tMRXH
RXD[3:0]
RX_DV
RX_ER
tMRXF
Valid Data
tMRDVKH
tMRDXKH
Figure 9. MII Receive AC Timing Diagram
8.2.2
RMII AC Timing Specifications
This section describes the RMII transmit and receive AC timing specifications.
MPC8323E PowerQUICC™ II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3
22
Freescale Semiconductor
Ethernet and MII Management
8.2.2.1
RMII Transmit AC Timing Specifications
Table 23 provides the RMII transmit AC timing specifications.
Table 25. RMII Transmit AC Timing Specifications
At recommended operating conditions with OVDD of 3.3 V ± 10%.
Symbol1
Min
Typical
Max
Unit
tRMX
—
20
—
ns
tRMXH/tRMX
35
—
65
%
REF_CLK to RMII data TXD[1:0], TX_EN delay
tRMTKHDX
2
—
10
ns
REF_CLK data clock rise VIL(min) to VIH(max)
tRMXR
1.0
—
4.0
ns
REF_CLK data clock fall VIH(max) to VIL(min)
tRMXF
1.0
—
4.0
ns
Parameter/Condition
REF_CLK clock
REF_CLK duty cycle
Note:
1. The symbols used for timing specifications follow the pattern of t(first three letters of functional block)(signal)(state)(reference)(state) for
inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tRMTKHDX symbolizes RMII
transmit timing (RMT) for the time tRMX clock reference (K) going high (H) until data outputs (D) are invalid (X). Note that, in
general, the clock reference symbol representation is based on two to three letters representing the clock of a particular
functional. For example, the subscript of tRMX represents the RMII(RM) reference (X) clock. For rise and fall times, the latter
convention is used with the appropriate letter: R (rise) or F (fall).
Figure 10 shows the RMII transmit AC timing diagram.
tRMX
tRMXR
REF_CLK
tRMXH
tRMXF
TXD[1:0]
TX_EN
tRMTKHDX
Figure 10. RMII Transmit AC Timing Diagram
8.2.2.2
RMII Receive AC Timing Specifications
Table 24 provides the RMII receive AC timing specifications.
Table 26. RMII Receive AC Timing Specifications
At recommended operating conditions with OVDD of 3.3 V ± 10%.
Symbol1
Min
Typical
Max
Unit
tRMX
—
20
—
ns
tRMXH/tRMX
35
—
65
%
RXD[1:0], CRS_DV, RX_ER setup time to REF_CLK
tRMRDVKH
4.0
—
—
ns
RXD[1:0], CRS_DV, RX_ER hold time to REF_CLK
tRMRDXKH
2.0
—
—
ns
tRMXR
1.0
—
4.0
ns
Parameter/Condition
REF_CLK clock period
REF_CLK duty cycle
REF_CLK clock rise VIL(min) to VIH(max)
MPC8323E PowerQUICC™ II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3
Freescale Semiconductor
23
Ethernet and MII Management
Table 26. RMII Receive AC Timing Specifications (continued)
At recommended operating conditions with OVDD of 3.3 V ± 10%.
Parameter/Condition
REF_CLK clock fall time V IH(max) to VIL(min)
Symbol1
Min
Typical
Max
Unit
tRMXF
1.0
—
4.0
ns
Note:
1. The symbols used for timing specifications follow the pattern of t(first three letters of functional block)(signal)(state)(reference)(state) for
inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tRMRDVKH symbolizes RMII
receive timing (RMR) with respect to the time data input signals (D) reach the valid state (V) relative to the tRMX clock
reference (K) going to the high (H) state or setup time. Also, tRMRDXKL symbolizes RMII receive timing (RMR) with respect to
the time data input signals (D) went invalid (X) relative to the tRMX clock reference (K) going to the low (L) state or hold time.
Note that, in general, the clock reference symbol representation is based on three letters representing the clock of a particular
functional. For example, the subscript of tRMX represents the RMII (RM) reference (X) clock. For rise and fall times, the latter
convention is used with the appropriate letter: R (rise) or F (fall).
Figure 11 provides the AC test load.
Z0 = 50 Ω
Output
RL = 50 Ω
OVDD/2
Figure 11. AC Test Load
Figure 12 shows the RMII receive AC timing diagram.
tRMXR
tRMX
REF_CLK
tRMXH
RXD[1:0]
CRS_DV
RX_ER
tRMXF
Valid Data
tRMRDVKH
tRMRDXKH
Figure 12. RMII Receive AC Timing Diagram
8.3
Ethernet Management Interface Electrical Characteristics
The electrical characteristics specified here apply to MII management interface signals MDIO
(management data input/output) and MDC (management data clock). The electrical characteristics for
MII, and RMII are specified in Section 8.1, “Ethernet Controller (10/100 Mbps)—MII/RMII Electrical
Characteristics.”
MPC8323E PowerQUICC™ II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3
24
Freescale Semiconductor
Ethernet and MII Management
8.3.1
MII Management DC Electrical Characteristics
MDC and MDIO are defined to operate at a supply voltage of 3.3 V. The DC electrical characteristics for
MDIO and MDC are provided in Table 27.
Table 27. MII Management DC Electrical Characteristics When Powered at 3.3 V
Parameter
Supply voltage (3.3 V)
Symbol
Conditions
Min
Max
Unit
OVDD
—
2.97
3.63
V
Output high voltage
VOH
IOH = –1.0 mA
OVDD = Min
2.10
OVDD + 0.3
V
Output low voltage
VOL
IOL = 1.0 mA
OVDD = Min
GND
0.50
V
Input high voltage
VIH
—
2.00
—
V
Input low voltage
VIL
—
—
0.80
V
Input current
IIN
0 V ≤ VIN ≤ OVDD
—
±5
μA
8.3.2
MII Management AC Electrical Specifications
Table 28 provides the MII management AC timing specifications.
Table 28. MII Management AC Timing Specifications
At recommended operating conditions with OVDD is 3.3 V ± 10%.
Symbol1
Min
Typical
Max
Unit
Notes
MDC frequency
fMDC
—
2.5
—
MHz
—
MDC period
tMDC
—
400
—
ns
—
MDC clock pulse width high
tMDCH
32
—
—
ns
—
MDC to MDIO delay
tMDKHDX
10
—
70
ns
—
MDIO to MDC setup time
tMDDVKH
5
—
—
ns
—
MDIO to MDC hold time
tMDDXKH
0
—
—
ns
—
MDC rise time
tMDCR
—
—
10
ns
—
MDC fall time
tMDHF
—
—
10
ns
—
Parameter/Condition
Note:
1. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for
inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tMDKHDX symbolizes management
data timing (MD) for the time tMDC from clock reference (K) high (H) until data outputs (D) are invalid (X) or data hold time.
Also, tMDDVKH symbolizes management data timing (MD) with respect to the time data input signals (D) reach the valid state
(V) relative to the tMDC clock reference (K) going to the high (H) state or setup time. For rise and fall times, the latter
convention is used with the appropriate letter: R (rise) or F (fall).
MPC8323E PowerQUICC™ II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3
Freescale Semiconductor
25
Local Bus
Figure 13 shows the MII management AC timing diagram.
tMDC
tMDCR
MDC
tMDCH
tMDCF
MDIO
(Input)
tMDDVKH
tMDDXKH
MDIO
(Output)
tMDKHDX
Figure 13. MII Management Interface Timing Diagram
9
Local Bus
This section describes the DC and AC electrical specifications for the local bus interface of the
MPC8323E.
9.1
Local Bus DC Electrical Characteristics
Table 29 provides the DC electrical characteristics for the local bus interface.
Table 29. Local Bus DC Electrical Characteristics
Parameter
Symbol
Min
Max
Unit
High-level input voltage
VIH
2
OVDD + 0.3
V
Low-level input voltage
VIL
–0.3
0.8
V
High-level output voltage, IOH = –100 μA
VOH
OV DD – 0.2
—
V
Low-level output voltage, IOL = 100 μA
VOL
—
0.2
V
IIN
—
±5
μA
Input current
9.2
Local Bus AC Electrical Specifications
Table 30 describes the general timing parameters of the local bus interface of the MPC8323E.
Table 30. Local Bus General Timing Parameters
Symbol1
Min
Max
Unit
Notes
tLBK
15
—
ns
2
Input setup to local bus clock (LCLKn)
tLBIVKH
7
—
ns
3, 4
Input hold from local bus clock (LCLKn)
tLBIXKH
1.0
—
ns
3, 4
tLBOTOT1
1.5
—
ns
5
Parameter
Local bus cycle time
LALE output fall to LAD output transition (LATCH hold time)
MPC8323E PowerQUICC™ II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3
26
Freescale Semiconductor
Local Bus
Table 30. Local Bus General Timing Parameters (continued)
Symbol1
Min
Max
Unit
Notes
LALE output fall to LAD output transition (LATCH hold time)
tLBOTOT2
3
—
ns
6
LALE output fall to LAD output transition (LATCH hold time)
tLBOTOT3
2.5
—
ns
7
Local bus clock (LCLK n) to output valid
tLBKHOV
—
3
ns
3
Local bus clock (LCLK n) to output high impedance for LAD/LDP
tLBKHOZ
—
4
ns
8
Local bus clock (LCLK n) duty cycle
tLBDC
47
53
%
—
Local bus clock (LCLK n) jitter specification
tLBRJ
—
400
ps
—
Delay between the input clock (PCI_SYNC_IN) of local bus
output clock (LCLKn)
tLBCDL
—
1.7
ns
—
Parameter
Notes:
1. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for
inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tLBIXKH1 symbolizes local bus
timing (LB) for the input (I) to go invalid (X) with respect to the time the t LBK clock reference (K) goes high (H), in this case for
clock one(1).
2. All timings are in reference to falling edge of LCLK0 (for all outputs and for LGTA and LUPWAIT inputs) or rising edge of
LCLK0 (for all other inputs).
3. All signals are measured from OVDD/2 of the rising/falling edge of LCLK0 to 0.4 × OVDD of the signal in question for 3.3-V
signaling levels.
4. Input timings are measured at the pin.
5. tLBOTOT1 should be used when RCWH[LALE] is not set and the load on LALE output pin is at least 10 pF less than the load
on LAD output pins.
6. tLBOTOT2 should be used when RCWH[LALE] is set and the load on LALE output pin is at least 10 pF less than the load on
LAD output pins.
7. tLBOTOT3 should be used when RCWH[LALE] is set and the load on LALE output pin equals to the load on LAD output pins.
8. For purposes of active/float timing measurements, the Hi-Z or off state is defined to be when the total current delivered
through the component pin is less than or equal to the leakage current specification.
Figure 14 provides the AC test load for the local bus.
Output
Z0 = 50 Ω
RL = 50 Ω
OVDD/2
Figure 14. Local Bus C Test Load
MPC8323E PowerQUICC™ II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3
Freescale Semiconductor
27
Local Bus
Figure 15 through Figure 17 show the local bus signals.
LCLK[n]
tLBIXKH
tLBIVKH
Input Signals:
LAD[0:15]
tLBIXKH
tLBIVKH
Input Signal:
LGTA
tLBIXKH
tLBKHOV
Output Signals:
LBCTL/LBCKE/LOE
tLBKHOV
tLBKHOZ
Output Signals:
LAD[0:15]
tLBOTOT
LALE
Figure 15. Local Bus Signals, Nonspecial Signals Only
LCLK
T1
T3
tLBKHOV
tLBKHOZ
GPCM Mode Output Signals:
LCS[0:3]/LWE
tLBIVKH
tLBIXKH
UPM Mode Input Signal:
LUPWAIT
tLBIXKH
tLBIVKH
Input Signals:
LAD[0:15]/LDP[0:3]
tLBKHOV
tLBKHOZ
UPM Mode Output Signals:
LCS[0:3]/LBS[0:1]/LGPL[0:5]
Figure 16. Local Bus Signals, GPCM/UPM Signals for LCCR[CLKDIV] = 2
MPC8323E PowerQUICC™ II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3
28
Freescale Semiconductor
JTAG
LCLK
T1
T2
T3
T4
tLBKHOZ
tLBKHOV
GPCM Mode Output Signals:
LCS[0:3]/LWE
tLBIXKH
tLBIVKH
UPM Mode Input Signal:
LUPWAIT
tLBIXKH
tLBIVKH
Input Signals:
LAD[0:15]
tLBKHOZ
tLBKHOV
UPM Mode Output Signals:
LCS[0:3]/LBS[0:1]/LGPL[0:5]
Figure 17. Local Bus Signals, GPCM/UPM Signals for LCCR[CLKDIV] = 4
10 JTAG
This section describes the DC and AC electrical specifications for the IEEE Std. 1149.1™ (JTAG)
interface of the MPC8323E.
10.1
JTAG DC Electrical Characteristics
Table 31 provides the DC electrical characteristics for the IEEE Std. 1149.1 (JTAG) interface of the
MPC8323E.
Table 31. JTAG Interface DC Electrical Characteristics
Characteristic
Symbol
Condition
Min
Max
Unit
Output high voltage
VOH
IOH = –6.0 mA
2.4
—
V
Output low voltage
VOL
IOL = 6.0 mA
—
0.5
V
Output low voltage
VOL
IOL = 3.2 mA
—
0.4
V
Input high voltage
VIH
—
2.5
OVDD + 0.3
V
MPC8323E PowerQUICC™ II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3
Freescale Semiconductor
29
JTAG
Table 31. JTAG Interface DC Electrical Characteristics (continued)
Characteristic
Symbol
Condition
Min
Max
Unit
Input low voltage
VIL
—
–0.3
0.8
V
Input current
IIN
0 V ≤ VIN ≤ OVDD
—
±5
μA
10.2
JTAG AC Electrical Characteristics
This section describes the AC electrical specifications for the IEEE Std. 1149.1 (JTAG) interface of the
MPC8323E. Table 32 provides the JTAG AC timing specifications as defined in Figure 19 through
Figure 22.
Table 32. JTAG AC Timing Specifications (Independent of CLKIN)1
At recommended operating conditions (see Table 2).
Symbol2
Min
Max
Unit
Notes
JTAG external clock frequency of operation
fJTG
0
33.3
MHz
—
JTAG external clock cycle time
t JTG
30
—
ns
—
tJTKHKL
11
—
ns
—
tJTGR, tJTGF
0
2
ns
—
tTRST
25
—
ns
3
Boundary-scan data
TMS, TDI
tJTDVKH
tJTIVKH
4
4
—
—
Boundary-scan data
TMS, TDI
tJTDXKH
tJTIXKH
10
10
—
—
Boundary-scan data
TDO
tJTKLDV
tJTKLOV
2
2
15
15
Boundary-scan data
TDO
tJTKLDX
tJTKLOX
2
2
—
—
Parameter
JTAG external clock pulse width measured at 1.4 V
JTAG external clock rise and fall times
TRST assert time
ns
Input setup times:
Input hold times:
4
ns
Valid times:
4
ns
Output hold times:
5
ns
5
MPC8323E PowerQUICC™ II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3
30
Freescale Semiconductor
JTAG
Table 32. JTAG AC Timing Specifications (Independent of CLKIN)1 (continued)
At recommended operating conditions (see Table 2).
Parameter
Symbol2
Min
Max
JTAG external clock to output high impedance:
Boundary-scan data
TDO
tJTKLDZ
tJTKLOZ
2
2
19
9
Unit
Notes
ns
5, 6
6
Notes:
1. All outputs are measured from the midpoint voltage of the falling/rising edge of tTCLK to the midpoint of the signal in question.
The output timings are measured at the pins. All output timings assume a purely resistive 50-Ω load (see Figure 14).
Time-of-flight delays must be added for trace lengths, vias, and connectors in the system.
2. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for
inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tJTDVKH symbolizes JTAG device
timing (JT) with respect to the time data input signals (D) reaching the valid state (V) relative to the tJTG clock reference (K)
going to the high (H) state or setup time. Also, tJTDXKH symbolizes JTAG timing (JT) with respect to the time data input signals
(D) went invalid (X) relative to the tJTG clock reference (K) going to the high (H) state. Note that, in general, the clock reference
symbol representation is based on three letters representing the clock of a particular functional. For rise and fall times, the
latter convention is used with the appropriate letter: R (rise) or F (fall).
3. TRST is an asynchronous level sensitive signal. The setup time is for test purposes only.
4. Non-JTAG signal input timing with respect to tTCLK.
5. Non-JTAG signal output timing with respect to tTCLK.
6. Guaranteed by design and characterization.
Figure 18 provides the AC test load for TDO and the boundary-scan outputs of the MPC8323E.
Z0 = 50 Ω
Output
RL = 50 Ω
OVDD/2
Figure 18. AC Test Load for the JTAG Interface
Figure 19 provides the JTAG clock input timing diagram.
JTAG
External Clock
VM
VM
VM
tJTGR
tJTKHKL
tJTG
tJTGF
VM = Midpoint Voltage (OVDD/2)
Figure 19. JTAG Clock Input Timing Diagram
Figure 20 provides the TRST timing diagram.
TRST
VM
VM
tTRST
VM = Midpoint Voltage (OVDD/2)
Figure 20. TRST Timing Diagram
MPC8323E PowerQUICC™ II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3
Freescale Semiconductor
31
JTAG
Figure 21 provides the boundary-scan timing diagram.
JTAG
External Clock
VM
VM
tJTDVKH
tJTDXKH
Input
Data Valid
Boundary
Data Inputs
tJTKLDV
tJTKLDX
Boundary
Data Outputs
Output Data Valid
tJTKLDZ
Boundary
Data Outputs
Output Data Valid
VM = Midpoint Voltage (OVDD/2)
Figure 21. Boundary-Scan Timing Diagram
Figure 22 provides the test access port timing diagram.
JTAG
External Clock
VM
VM
tJTIVKH
tJTIXKH
Input
Data Valid
TDI, TMS
tJTKLOV
tJTKLOX
Output Data Valid
TDO
tJTKLOZ
TDO
Output Data Valid
VM = Midpoint Voltage (OVDD/2)
Figure 22. Test Access Port Timing Diagram
MPC8323E PowerQUICC™ II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3
32
Freescale Semiconductor
I2C
11 I2C
This section describes the DC and AC electrical characteristics for the I2C interface of the MPC8323E.
11.1
I2C DC Electrical Characteristics
Table 33 provides the DC electrical characteristics for the I2C interface of the MPC8323E.
Table 33. I2C DC Electrical Characteristics
At recommended operating conditions with OVDD of 3.3 V ± 10%.
Parameter
Symbol
Min
Max
Unit
Notes
Input high voltage level
VIH
0.7 × OV DD
OVDD + 0.3
V
—
Input low voltage level
VIL
–0.3
0.3 × OV DD
V
—
Low level output voltage
VOL
0
0.4
V
1
Output fall time from VIH(min) to VIL(max) with a bus
capacitance from 10 to 400 pF
tI2KLKV
20 + 0.1 × CB
250
ns
2
Pulse width of spikes which must be suppressed by the
input filter
tI2KHKL
0
50
ns
3
Capacitance for each I/O pin
CI
—
10
pF
—
Input current (0 V ≤ VIN ≤ OV DD)
IIN
—
±5
μA
4
Notes:
1. Output voltage (open drain or open collector) condition = 3 mA sink current.
2. CB = capacitance of one bus line in pF.
3. Refer to the MPC8323E PowerQUICC™ II Pro Integrated Communications Processor Reference Manual for information on
the digital filter used.
4. I/O pins obstructs the SDA and SCL lines if OVDD is switched off.
11.2
I2C AC Electrical Specifications
Table 34 provides the AC timing parameters for the I2C interface of the MPC8323E.
Table 34. I2C AC Electrical Specifications
All values refer to VIH (min) and VIL (max) levels (see Table 33).
Symbol1
Min
Max
Unit
SCL clock frequency
fI2C
0
400
kHz
Low period of the SCL clock
tI2CL
1.3
—
μs
High period of the SCL clock
tI2CH
0.6
—
μs
Setup time for a repeated START condition
tI2SVKH
0.6
—
μs
Hold time (repeated) START condition (after this period, the first clock
pulse is generated)
tI2SXKL
0.6
—
μs
Data setup time
tI2DVKH
100
—
ns
tI2DXKL
—
02
—
0.93
μs
Parameter
Data hold time:
CBUS compatible masters
I2C bus devices
MPC8323E PowerQUICC™ II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3
Freescale Semiconductor
33
I2C
Table 34. I2C AC Electrical Specifications (continued)
All values refer to VIH (min) and VIL (max) levels (see Table 33).
Symbol1
Min
Max
Unit
Rise time of both SDA and SCL signals
tI2CR
20 + 0.1 Cb4
300
ns
Fall time of both SDA and SCL signals
tI2CF
20 + 0.1 Cb4
300
ns
Setup time for STOP condition
tI2PVKH
0.6
—
μs
Bus free time between a STOP and START condition
tI2KHDX
1.3
—
μs
Noise margin at the LOW level for each connected device (including
hysteresis)
VNL
0.1 × OV DD
—
V
Noise margin at the HIGH level for each connected device (including
hysteresis)
VNH
0.2 × OV DD
—
V
Parameter
Notes:
1. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for
inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tI2DVKH symbolizes I2C timing (I2)
with respect to the time data input signals (D) reach the valid state (V) relative to the tI2C clock reference (K) going to the high
(H) state or setup time. Also, tI2SXKL symbolizes I2C timing (I2) for the time that the data with respect to the start condition
(S) went invalid (X) relative to the tI2C clock reference (K) going to the low (L) state or hold time. Also, tI2PVKH symbolizes I2C
timing (I2) for the time that the data with respect to the stop condition (P) reaching the valid state (V) relative to the tI2C clock
reference (K) going to the high (H) state or setup time. For rise and fall times, the latter convention is used with the appropriate
letter: R (rise) or F (fall).
2. MPC8323E provides a hold time of at least 300 ns for the SDA signal (referred to the VIH(min) of the SCL signal) to bridge
the undefined region of the falling edge of SCL.
3. The maximum tI2DVKH has only to be met if the device does not stretch the LOW period (tI2CL) of the SCL signal.
4. CB = capacitance of one bus line in pF.
Figure 23 provides the AC test load for the I2C.
Z0 = 50 Ω
Output
RL = 50 Ω
OV DD/2
Figure 23. I2C AC Test Load
Figure 24 shows the AC timing diagram for the I2C bus.
SDA
tI2CF
tI2DVKH
tI2CL
tI2KHKL
tI2SXKL
tI2CF
tI2CR
SCL
tI2SXKL
S
tI2CH
tI2DXKL
tI2SVKH
Sr
tI2PVKH
P
S
Figure 24. I2C Bus AC Timing Diagram
MPC8323E PowerQUICC™ II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3
34
Freescale Semiconductor
PCI
12 PCI
This section describes the DC and AC electrical specifications for the PCI bus of the MPC8323E.
12.1
PCI DC Electrical Characteristics
Table 35 provides the DC electrical characteristics for the PCI interface of the MPC8323E.
Table 35. PCI DC Electrical Characteristics1,2
Parameter
Symbol
Test Condition
Min
Max
Unit
High-level input voltage
VIH
VOUT ≥ VOH (min) or
2
OVDD + 0.3
V
Low-level input voltage
VIL
VOUT ≤ VOL (max)
–0.3
0.8
V
High-level output voltage
VOH
OVDD = min,
IOH = –100 μA
OV DD – 0.2
—
V
Low-level output voltage
VOL
OVDD = min,
IOL = 100 μA
—
0.2
V
IIN
0 V ≤ VIN ≤ OVDD
—
±5
μA
Input current
Notes:
1. Note that the symbol VIN, in this case, represents the OV IN symbol referenced in Table 1 and Table 2.
2. Ranges listed do not meet the full range of the DC specifications of the PCI 2.3 Local Bus Specifications.
12.2
PCI AC Electrical Specifications
This section describes the general AC timing parameters of the PCI bus of the MPC8323E. Note that the
PCI_CLK or PCI_SYNC_IN signal is used as the PCI input clock depending on whether the MPC8323E
is configured as a host or agent device. Table 36 shows the PCI AC timing specifications at 66 MHz.
.
Table 36. PCI AC Timing Specifications at 66 MHz
Symbol1
Min
Max
Unit
Notes
Clock to output valid
tPCKHOV
—
6.0
ns
2
Output hold from clock
tPCKHOX
1
—
ns
2
Clock to output high impedence
tPCKHOZ
—
14
ns
2, 3
Input setup to clock
tPCIVKH
3.0
—
ns
2, 4
Input hold from clock
tPCIXKH
0
—
ns
2, 4
Parameter
Notes:
1. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for
inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tPCIVKH symbolizes PCI timing
(PC) with respect to the time the input signals (I) reach the valid state (V) relative to the PCI_SYNC_IN clock, tSYS, reference
(K) going to the high (H) state or setup time. Also, tPCRHFV symbolizes PCI timing (PC) with respect to the time hard reset
(R) went high (H) relative to the frame signal (F) going to the valid (V) state.
2. See the timing measurement conditions in the PCI 2.3 Local Bus Specifications.
3. For purposes of active/float timing measurements, the Hi-Z or off state is defined to be when the total current delivered
through the component pin is less than or equal to the leakage current specification.
4. Input timings are measured at the pin.
MPC8323E PowerQUICC™ II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3
Freescale Semiconductor
35
PCI
Table 37 shows the PCI AC timing specifications at 33 MHz.
Table 37. PCI AC Timing Specifications at 33 MHz
Symbol1
Min
Max
Unit
Notes
Clock to output valid
tPCKHOV
—
11
ns
2
Output hold from clock
tPCKHOX
2
—
ns
2
Clock to output high impedence
tPCKHOZ
—
14
ns
2, 3
Input setup to clock
tPCIVKH
3.0
—
ns
2, 4
Input hold from clock
tPCIXKH
0
—
ns
2, 4
Parameter
Notes:
1. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for
inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tPCIVKH symbolizes PCI timing
(PC) with respect to the time the input signals (I) reach the valid state (V) relative to the PCI_SYNC_IN clock, tSYS, reference
(K) going to the high (H) state or setup time. Also, tPCRHFV symbolizes PCI timing (PC) with respect to the time hard reset
(R) went high (H) relative to the frame signal (F) going to the valid (V) state.
2. See the timing measurement conditions in the PCI 2.3 Local Bus Specifications.
3. For purposes of active/float timing measurements, the Hi-Z or off state is defined to be when the total current delivered
through the component pin is less than or equal to the leakage current specification.
4. Input timings are measured at the pin.
Figure 25 provides the AC test load for PCI.
Output
Z0 = 50 Ω
RL = 50 Ω
OVDD/2
Figure 25. PCI AC Test Load
Figure 26 shows the PCI input AC timing conditions.
CLK
tPCIVKH
tPCIXKH
Input
Figure 26. PCI Input AC Timing Measurement Conditions
MPC8323E PowerQUICC™ II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3
36
Freescale Semiconductor
Timers
Figure 27 shows the PCI output AC timing conditions.
CLK
tPCKHOV
tPCKHOX
Output Delay
tPCKHOZ
High-Impedance
Output
Figure 27. PCI Output AC Timing Measurement Condition
13 Timers
This section describes the DC and AC electrical specifications for the timers of the MPC8323E.
13.1
Timer DC Electrical Characteristics
Table 38 provides the DC electrical characteristics for the MPC8323E timer pins, including TIN, TOUT,
TGATE, and RTC_CLK.
Table 38. Timer DC Electrical Characteristics
Characteristic
Symbol
Condition
Min
Max
Unit
Output high voltage
VOH
IOH = –6.0 mA
2.4
—
V
Output low voltage
VOL
IOL = 6.0 mA
—
0.5
V
Output low voltage
VOL
IOL = 3.2 mA
—
0.4
V
Input high voltage
VIH
—
2.0
OVDD + 0.3
V
Input low voltage
VIL
—
–0.3
0.8
V
Input current
IIN
0 V ≤ VIN ≤ OVDD
—
±5
μA
13.2
Timer AC Timing Specifications
Table 39 provides the timer input and output AC timing specifications.
Table 39. Timer Input AC Timing Specifications1
Characteristic
Timers inputs—minimum pulse width
Symbol2
Min
Unit
tTIWID
20
ns
Notes:
1. Input specifications are measured from the 50% level of the signal to the 50% level of the rising edge of CLKIN. Timings are
measured at the pin.
2. Timer inputs and outputs are asynchronous to any visible clock. Timer outputs should be synchronized before use by any
external synchronous logic. Timer inputs are required to be valid for at least tTIWID ns to ensure proper operation.
MPC8323E PowerQUICC™ II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3
Freescale Semiconductor
37
GPIO
Figure 28 provides the AC test load for the timers.
Z0 = 50 Ω
Output
OVDD/2
RL = 50 Ω
Figure 28. Timers AC Test Load
14 GPIO
This section describes the DC and AC electrical specifications for the GPIO of the MPC8323E.
14.1
GPIO DC Electrical Characteristics
Table 11 provides the DC electrical characteristics for the MPC8323E GPIO.
Table 40. GPIO DC Electrical Characteristics
Characteristic
Symbol
Condition
Min
Max
Unit
Notes
Output high voltage
VOH
IOH = –6.0 mA
2.4
—
V
1
Output low voltage
VOL
IOL = 6.0 mA
—
0.5
V
1
Output low voltage
VOL
IOL = 3.2 mA
—
0.4
V
1
Input high voltage
VIH
—
2.0
OVDD + 0.3
V
1
Input low voltage
VIL
—
–0.3
0.8
V
—
Input current
IIN
0 V ≤ VIN ≤ OVDD
—
±5
μA
—
Note:
1. This specification applies when operating from 3.3-V supply.
14.2
GPIO AC Timing Specifications
Table 41 provides the GPIO input and output AC timing specifications.
Table 41. GPIO Input AC Timing Specifications1
Characteristic
GPIO inputs—minimum pulse width
Symbol2
Min
Unit
tPIWID
20
ns
Notes:
1. Input specifications are measured from the 50% level of the signal to the 50% level of the rising edge of CLKIN. Timings are
measured at the pin.
2. GPIO inputs and outputs are asynchronous to any visible clock. GPIO outputs should be synchronized before use by any
external synchronous logic. GPIO inputs are required to be valid for at least tPIWID ns to ensure proper operation.
MPC8323E PowerQUICC™ II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3
38
Freescale Semiconductor
IPIC
Figure 29 provides the AC test load for the GPIO.
Z0 = 50 Ω
Output
OVDD /2
RL = 50 Ω
Figure 29. GPIO AC Test Load
15 IPIC
This section describes the DC and AC electrical specifications for the external interrupt pins of the
MPC8323E.
15.1
IPIC DC Electrical Characteristics
Table 42 provides the DC electrical characteristics for the external interrupt pins of the MPC8323E.
Table 42. IPIC DC Electrical Characteristics1,2
Characteristic
Symbol
Condition
Min
Max
Unit
Input high voltage
VIH
—
2.0
OVDD + 0.3
V
Input low voltage
VIL
—
–0.3
0.8
V
Input current
IIN
—
—
±5
μA
Output low voltage
VOL
IOL = 6.0 mA
—
0.5
V
Output low voltage
VOL
IOL = 3.2 mA
—
0.4
V
Notes:
1. This table applies for pins IRQ[0:7], IRQ_OUT, MCP_OUT, and CE ports Interrupts.
2. IRQ_OUT and MCP_OUT are open drain pins, thus VOH is not relevant for those pins.
15.2
IPIC AC Timing Specifications
Table 43 provides the IPIC input and output AC timing specifications.
Table 43. IPIC Input AC Timing Specifications1
Characteristic
IPIC inputs—minimum pulse width
Symbol2
Min
Unit
tPIWID
20
ns
Notes:
1. Input specifications are measured from the 50% level of the signal to the 50% level of the rising edge of CLKIN. Timings are
measured at the pin.
2. IPIC inputs and outputs are asynchronous to any visible clock. IPIC outputs should be synchronized before use by any
external synchronous logic. IPIC inputs are required to be valid for at least tPIWID ns to ensure proper operation when working
in edge triggered mode.
MPC8323E PowerQUICC™ II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3
Freescale Semiconductor
39
SPI
16 SPI
This section describes the DC and AC electrical specifications for the SPI of the MPC8323E.
16.1
SPI DC Electrical Characteristics
Table 44 provides the DC electrical characteristics for the MPC8323E SPI.
Table 44. SPI DC Electrical Characteristics
Characteristic
Symbol
Condition
Min
Max
Unit
Output high voltage
VOH
IOH = –6.0 mA
2.4
—
V
Output low voltage
VOL
IOL = 6.0 mA
—
0.5
V
Output low voltage
VOL
IOL = 3.2 mA
—
0.4
V
Input high voltage
VIH
—
2.0
OVDD + 0.3
V
Input low voltage
VIL
—
–0.3
0.8
V
Input current
IIN
0 V ≤ VIN ≤ OVDD
—
±5
μA
16.2
SPI AC Timing Specifications
Table 45 and provide the SPI input and output AC timing specifications.
Table 45. SPI AC Timing Specifications1
Symbol2
Min
Max
Unit
SPI outputs—Master mode (internal clock) delay
tNIKHOV
0.5
6
ns
SPI outputs—Slave mode (external clock) delay
tNEKHOV
2
8
ns
SPI inputs—Master mode (internal clock) input setup time
tNIIVKH
6
—
ns
SPI inputs—Master mode (internal clock) input hold time
tNIIXKH
0
—
ns
SPI inputs—Slave mode (external clock) input setup time
tNEIVKH
4
—
ns
SPI inputs—Slave mode (external clock) input hold time
tNEIXKH
2
—
ns
Characteristic
Notes:
1. Output specifications are measured from the 50% level of the rising edge of CLKIN to the 50% level of the signal. Timings
are measured at the pin.
2. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for
inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tNIKHOV symbolizes the NMSI
outputs internal timing (NI) for the time tSPI memory clock reference (K) goes from the high state (H) until outputs (O) are
valid (V).
Figure 30 provides the AC test load for the SPI.
Output
Z0 = 50 Ω
RL = 50 Ω
OVDD/2
Figure 30. SPI AC Test Load
MPC8323E PowerQUICC™ II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3
40
Freescale Semiconductor
TDM/SI
Figure 31 and Figure 32 represent the AC timing from Table 45. Note that although the specifications
generally reference the rising edge of the clock, these AC timing diagrams also apply when the falling edge
is the active edge.
Figure 31 shows the SPI timing in slave mode (external clock).
SPICLK (Input)
Input Signals:
SPIMOSI
(See Note)
tNEIXKH
tNEIVKH
tNEKHOV
Output Signals:
SPIMISO
(See Note)
Note: The clock edge is selectable on SPI.
Figure 31. SPI AC Timing in Slave Mode (External Clock) Diagram
Figure 32 shows the SPI timing in master mode (internal clock).
SPICLK (Output)
Input Signals:
SPIMISO
(See Note)
tNIIXKH
tNIIVKH
tNIKHOV
Output Signals:
SPIMOSI
(See Note)
Note: The clock edge is selectable on SPI.
Figure 32. SPI AC Timing in Master Mode (Internal Clock) Diagram
17 TDM/SI
This section describes the DC and AC electrical specifications for the time-division-multiplexed and serial
interface of the MPC8323E.
17.1
TDM/SI DC Electrical Characteristics
Table 46 provides the DC electrical characteristics for the MPC8323E TDM/SI.
Table 46. TDM/SI DC Electrical Characteristics
Characteristic
Symbol
Condition
Min
Max
Unit
Output high voltage
VOH
IOH = –2.0 mA
2.4
—
V
Output low voltage
VOL
IOL = 3.2 mA
—
0.5
V
Input high voltage
VIH
—
2.0
OVDD + 0.3
V
MPC8323E PowerQUICC™ II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3
Freescale Semiconductor
41
TDM/SI
Table 46. TDM/SI DC Electrical Characteristics (continued)
Characteristic
Symbol
Condition
Min
Max
Unit
Input low voltage
VIL
—
–0.3
0.8
V
Input current
IIN
0 V ≤ VIN ≤ OVDD
—
±5
μA
17.2
TDM/SI AC Timing Specifications
Table 47 provides the TDM/SI input and output AC timing specifications.
Table 47. TDM/SI AC Timing Specifications1
Symbol2
Min
Max
Unit
TDM/SI outputs—External clock delay
tSEKHOV
2
12
ns
TDM/SI outputs—External clock High Impedance
tSEKHOX
2
10
ns
TDM/SI inputs—External clock input setup time
tSEIVKH
5
—
ns
TDM/SI inputs—External clock input hold time
tSEIXKH
2
—
ns
Characteristic
Notes:
1. Output specifications are measured from the 50% level of the rising edge of CLKIN to the 50% level of the signal. Timings
are measured at the pin.
2. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for
inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tSEKHOX symbolizes the TDM/SI
outputs external timing (SE) for the time tTDM/SI memory clock reference (K) goes from the high state (H) until outputs (O)
are invalid (X).
Figure 33 provides the AC test load for the TDM/SI.
Output
Z0 = 50 Ω
RL = 50 Ω
OVDD/2
Figure 33. TDM/SI AC Test Load
Figure 34 represents the AC timing from Table 47. Note that although the specifications generally
reference the rising edge of the clock, these AC timing diagrams also apply when the falling edge is the
active edge.
TDM/SICLK (Input)
Input Signals:
TDM/SI
(See Note)
tSEIXKH
tSEIVKH
tSEKHOV
Output Signals:
TDM/SI
(See Note)
tSEKHOX
Note: The clock edge is selectable on TDM/SI.
Figure 34. TDM/SI AC Timing (External Clock) Diagram
MPC8323E PowerQUICC™ II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3
42
Freescale Semiconductor
UTOPIA
18 UTOPIA
This section describes the UTOPIA DC and AC electrical specifications of the MPC8323E.
NOTE
The MPC8321E and MPC8321 do not support UTOPIA.
18.1
UTOPIA DC Electrical Characteristics
Table 48 provides the DC electrical characteristics for the MPC8323E UTOPIA.
Table 48. UTOPIA DC Electrical Characteristics
Characteristic
Symbol
Condition
Min
Max
Unit
Output high voltage
VOH
IOH = –8.0 mA
2.4
—
V
Output low voltage
VOL
IOL = 8.0 mA
—
0.5
V
Input high voltage
VIH
—
2.0
OVDD + 0.3
V
Input low voltage
VIL
—
–0.3
0.8
V
Input current
IIN
0 V ≤ VIN ≤ OVDD
—
±5
μA
18.2
UTOPIA AC Timing Specifications
Table 49 provides the UTOPIA input and output AC timing specifications.
Table 49. UTOPIA AC Timing Specifications1
Symbol2
Min
Max
Unit
UTOPIA outputs—Internal clock delay
tUIKHOV
0
5.5
ns
UTOPIA outputs—External clock delay
tUEKHOV
1
8
ns
UTOPIA outputs—Internal clock high impedance
tUIKHOX
0
5.5
ns
UTOPIA outputs—External clock high impedance
tUEKHOX
1
8
ns
UTOPIA inputs—Internal clock input setup time
tUIIVKH
8
—
ns
UTOPIA inputs—External clock input setup time
tUEIVKH
4
—
ns
UTOPIA inputs—Internal clock input hold time
tUIIXKH
0
—
ns
UTOPIA inputs—External clock input hold time
tUEIXKH
1
—
ns
Characteristic
Notes:
1. Output specifications are measured from the 50% level of the rising edge of CLKIN to the 50% level of the signal. Timings
are measured at the pin.
2. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for
inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tUIKHOX symbolizes the UTOPIA
outputs internal timing (UI) for the time tUTOPIA memory clock reference (K) goes from the high state (H) until outputs (O) are
invalid (X).
MPC8323E PowerQUICC™ II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3
Freescale Semiconductor
43
UTOPIA
Figure 35 provides the AC test load for the UTOPIA.
Z0 = 50 Ω
Output
RL = 50 Ω
OVDD/2
Figure 35. UTOPIA AC Test Load
Figure 36 and Figure 37 represent the AC timing from Table 49. Note that although the specifications
generally reference the rising edge of the clock, these AC timing diagrams also apply when the falling edge
is the active edge.
Figure 36 shows the UTOPIA timing with external clock.
UTOPIACLK (Input)
tUEIVKH
tUEIXKH
Input Signals:
UTOPIA
tUEKHOV
Output Signals:
UTOPIA
tUEKHOX
Figure 36. UTOPIA AC Timing (External Clock) Diagram
Figure 37 shows the UTOPIA timing with internal clock.
UTOPIACLK (Output)
tUIIVKH
tUIIXKH
Input Signals:
UTOPIA
tUIKHOV
Output Signals:
UTOPIA
tUIKHOX
Figure 37. UTOPIA AC Timing (Internal Clock) Diagram
MPC8323E PowerQUICC™ II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3
44
Freescale Semiconductor
HDLC, BISYNC, Transparent, and Synchronous UART
19 HDLC, BISYNC, Transparent, and Synchronous
UART
This section describes the DC and AC electrical specifications for the high level data link control (HDLC),
BISYNC, transparent, and synchronous UART of the MPC8323E.
19.1
HDLC, BISYNC, Transparent, and Synchronous UART DC
Electrical Characteristics
Table 50 provides the DC electrical characteristics for the MPC8323E HDLC, BISYNC, transparent, and
synchronous UART protocols.
Table 50. HDLC, BISYNC, Transparent, and Synchronous UART DC Electrical Characteristics
Characteristic
Symbol
Condition
Min
Max
Unit
Output high voltage
VOH
IOH = –2.0 mA
2.4
—
V
Output low voltage
VOL
IOL = 3.2 mA
—
0.5
V
Input high voltage
VIH
—
2.0
OVDD + 0.3
V
Input low voltage
VIL
—
–0.3
0.8
V
Input current
IIN
0 V ≤ VIN ≤ OVDD
—
±5
μA
19.2
HDLC, BISYNC, Transparent, and Synchronous UART AC Timing
Specifications
Table 51 provides the input and output AC timing specifications for HDLC, BISYNC, and transparent
UART protocols.
Table 51. HDLC, BISYNC, and Transparent UART AC Timing Specifications1
Symbol2
Min
Max
Unit
Outputs—Internal clock delay
tHIKHOV
0
5.5
ns
Outputs—External clock delay
tHEKHOV
1
10
ns
Outputs—Internal clock high impedance
tHIKHOX
0
5.5
ns
Outputs—External clock high impedance
tHEKHOX
1
8
ns
Inputs—Internal clock input setup time
tHIIVKH
6
—
ns
Inputs—External clock input setup time
tHEIVKH
4
—
ns
Inputs—Internal clock input hold time
tHIIXKH
0
—
ns
Characteristic
MPC8323E PowerQUICC™ II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3
Freescale Semiconductor
45
HDLC, BISYNC, Transparent, and Synchronous UART
Table 51. HDLC, BISYNC, and Transparent UART AC Timing Specifications1 (continued)
Characteristic
Inputs—External clock input hold time
Symbol2
Min
Max
Unit
tHEIXKH
1
—
ns
Notes:
1. Output specifications are measured from the 50% level of the rising edge of CLKIN to the 50% level of the signal. Timings
are measured at the pin.
2. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for
inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tHIKHOX symbolizes the outputs
internal timing (HI) for the time tserial memory clock reference (K) goes from the high state (H) until outputs (O) are invalid (X).
Table 52. Synchronous UART AC Timing Specifications1
Symbol2
Min
Max
Unit
Outputs—Internal clock delay
tUAIKHOV
0
5.5
ns
Outputs—External clock delay
tUAEKHOV
1
10
ns
Outputs—Internal clock high impedance
tUAIKHOX
0
5.5
ns
Outputs—External clock high impedance
tUAEKHOX
1
8
ns
Inputs—Internal clock input setup time
tUAIIVKH
6
—
ns
Inputs—External clock input setup time
tUAEIVKH
4
—
ns
Inputs—Internal clock input hold time
tUAIIXKH
0
—
ns
Inputs—External clock input hold time
tUAEIXKH
1
—
ns
Characteristic
Notes:
1. Output specifications are measured from the 50% level of the rising edge of CLKIN to the 50% level of the signal. Timings
are measured at the pin.
2. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for
inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tUAIKHOX symbolizes the outputs
internal timing (UAI) for the time tserial memory clock reference (K) goes from the high state (H) until outputs (O) are
invalid (X).
Figure 38 provides the AC test load.
Output
Z0 = 50 Ω
RL = 50 Ω
OVDD/2
Figure 38. AC Test Load
Figure 39 and Figure 40 represent the AC timing from Table 51. Note that although the specifications
generally reference the rising edge of the clock, these AC timing diagrams also apply when the falling edge
is the active edge.
MPC8323E PowerQUICC™ II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3
46
Freescale Semiconductor
HDLC, BISYNC, Transparent, and Synchronous UART
Figure 39 shows the timing with external clock.
Serial CLK (Input)
tHEIXKH
tHEIVKH
Input Signals:
(See Note)
tHEKHOV
Output Signals:
(See Note)
tHEKHOX
Note: The clock edge is selectable.
Figure 39. AC Timing (External Clock) Diagram
Figure 40 shows the timing with internal clock.
Serial CLK (Output)
tHIIVKH
tHIIXKH
Input Signals:
(See Note)
tHIKHOV
Output Signals:
(See Note)
tHIKHOX
Note: The clock edge is selectable.
Figure 40. AC Timing (Internal Clock) Diagram
MPC8323E PowerQUICC™ II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3
Freescale Semiconductor
47
USB
20 USB
This section provides the AC and DC electrical specifications for the USB interface of the MPC8323E.
20.1
USB DC Electrical Characteristics
Table 53 provides the DC electrical characteristics for the USB interface.
Table 53. USB DC Electrical Characteristics1
Parameter
Symbol
Min
Max
Unit
High-level input voltage
VIH
2
OVDD + 0.3
V
Low-level input voltage
VIL
–0.3
0.8
V
High-level output voltage, IOH = –100 μA
VOH
OV DD – 0.2
—
V
Low-level output voltage, IOL = 100 μA
VOL
—
0.2
V
IIN
—
±5
μA
Input current
Note:
1. Note that the symbol VIN, in this case, represents the OV IN symbol referenced in Table 1 and Table 2.
20.2
USB AC Electrical Specifications
Table 54 describes the general timing parameters of the USB interface of the MPC8323E.
Table 54. USB General Timing Parameters
Symbol1
Min
Max
Unit
USB clock cycle time
tUSCK
20.83
—
ns
Full speed 48 MHz
USB clock cycle time
tUSCK
166.67
—
ns
Low speed 6 MHz
tUSTSPN
—
5
ns
Skew among RXP, RXN, and RXD
tUSRSPND
—
10
ns
Full speed transitions
Skew among RXP, RXN, and RXD
tUSRPND
—
100
ns
Low speed transitions
Parameter
Skew between TXP and TXN
Notes
—
Notes:
1. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(state)(signal) for receive signals
and t(first two letters of functional block)(state)(signal) for transmit signals. For example, tUSRSPND symbolizes USB timing (US) for the
USB receive signals skew (RS) among RXP, RXN, and RXD (PND). Also, tUSTSPN symbolizes USB timing (US) for the USB
transmit signals skew (TS) between TXP and TXN (PN).
2. Skew measurements are done at OVDD/2 of the rising or falling edge of the signals.
Figure 41 provide the AC test load for the USB.
Output
Z0 = 50 Ω
RL = 50 Ω
OVDD/2
Figure 41. USB AC Test Load
MPC8323E PowerQUICC™ II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3
48
Freescale Semiconductor
Package and Pin Listings
21 Package and Pin Listings
This section details package parameters, pin assignments, and dimensions. The MPC8323E is available in
a thermally enhanced Plastic Ball Grid Array (PBGA); see Section 21.1, “Package Parameters for the
MPC8323E PBGA,” and Section 21.2, “Mechanical Dimensions of the MPC8323E PBGA,” for
information on the PBGA.
21.1
Package Parameters for the MPC8323E PBGA
The package parameters are as provided in the following list. The package type is 27 mm × 27 mm, 516
PBGA.
Package outline
27 mm × 27 mm
Interconnects
516
Pitch
1.00 mm
Module height (typical)
2.25 mm
Solder Balls
62 Sn/36 Pb/2 Ag (ZQ package)
95.5 Sn/0.5 Cu/4Ag (VR package)
Ball diameter (typical)
0.6 mm
21.2
Mechanical Dimensions of the MPC8323E PBGA
Figure 42 shows the mechanical dimensions and bottom surface nomenclature of the MPC8323E,
516-PBGA package.
MPC8323E PowerQUICC™ II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3
Freescale Semiconductor
49
Package and Pin Listings
Notes:
1.All dimensions are in millimeters.
2.Dimensions and tolerances per ASME Y14.5M-1994.
3.Maximum solder ball diameter measured parallel to datum A.
4.Datum A, the seating plane, is determined by the spherical crowns of the solder balls.
Figure 42. Mechanical Dimensions and Bottom Surface Nomenclature of the MPC8323E PBGA
MPC8323E PowerQUICC™ II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3
50
Freescale Semiconductor
Package and Pin Listings
21.3
Pinout Listings
Table 55 shows the pin list of the MPC8323E.
Table 55. MPC8323E PBGA Pinout Listing
Signal
Package Pin Number
Pin Type
Power
Supply
Notes
DDR Memory Controller Interface
MEMC_MDQ0
AE9
IO
GVDD
—
MEMC_MDQ1
AD10
IO
GVDD
—
MEMC_MDQ2
AF10
IO
GVDD
—
MEMC_MDQ3
AF9
IO
GVDD
—
MEMC_MDQ4
AF7
IO
GVDD
—
MEMC_MDQ5
AE10
IO
GVDD
—
MEMC_MDQ6
AD9
IO
GVDD
—
MEMC_MDQ7
AF8
IO
GVDD
—
MEMC_MDQ8
AE6
IO
GVDD
—
MEMC_MDQ9
AD7
IO
GVDD
—
MEMC_MDQ10
AF6
IO
GVDD
—
MEMC_MDQ11
AC7
IO
GVDD
—
MEMC_MDQ12
AD8
IO
GVDD
—
MEMC_MDQ13
AE7
IO
GVDD
—
MEMC_MDQ14
AD6
IO
GVDD
—
MEMC_MDQ15
AF5
IO
GVDD
—
MEMC_MDQ16
AD18
IO
GVDD
—
MEMC_MDQ17
AE19
IO
GVDD
—
MEMC_MDQ18
AF17
IO
GVDD
—
MEMC_MDQ19
AF19
IO
GVDD
—
MEMC_MDQ20
AF18
IO
GVDD
—
MEMC_MDQ21
AE18
IO
GVDD
—
MEMC_MDQ22
AF20
IO
GVDD
—
MEMC_MDQ23
AD19
IO
GVDD
—
MEMC_MDQ24
AD21
IO
GVDD
—
MEMC_MDQ25
AF22
IO
GVDD
—
MEMC_MDQ26
AC21
IO
GVDD
—
MEMC_MDQ27
AF21
IO
GVDD
—
MEMC_MDQ28
AE21
IO
GVDD
—
MPC8323E PowerQUICC™ II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3
Freescale Semiconductor
51
Package and Pin Listings
Table 55. MPC8323E PBGA Pinout Listing (continued)
Package Pin Number
Pin Type
Power
Supply
Notes
MEMC_MDQ29
AD20
IO
GVDD
—
MEMC_MDQ30
AF23
IO
GVDD
—
MEMC_MDQ31
AD22
IO
GVDD
—
MEMC_MDM0
AC9
O
GVDD
—
MEMC_MDM1
AD5
O
GVDD
—
MEMC_MDM2
AE20
O
GVDD
—
MEMC_MDM3
AE22
O
GVDD
—
MEMC_MDQS0
AE8
IO
GVDD
—
MEMC_MDQS1
AE5
IO
GVDD
—
MEMC_MDQS2
AC19
IO
GVDD
—
MEMC_MDQS3
AE23
IO
GVDD
—
MEMC_MBA0
AD16
O
GVDD
—
MEMC_MBA1
AD17
O
GVDD
—
MEMC_MBA2
AE17
O
GVDD
—
MEMC_MA0
AD12
O
GVDD
—
MEMC_MA1
AE12
O
GVDD
—
MEMC_MA2
AF12
O
GVDD
—
MEMC_MA3
AC13
O
GVDD
—
MEMC_MA4
AD13
O
GVDD
—
MEMC_MA5
AE13
O
GVDD
—
MEMC_MA6
AF13
O
GVDD
—
MEMC_MA7
AC15
O
GVDD
—
MEMC_MA8
AD15
O
GVDD
—
MEMC_MA9
AE15
O
GVDD
—
MEMC_MA10
AF15
O
GVDD
—
MEMC_MA11
AE16
O
GVDD
—
MEMC_MA12
AF16
O
GVDD
—
MEMC_MA13
AB16
O
GVDD
—
MEMC_MWE
AC17
O
GVDD
—
MEMC_MRAS
AE11
O
GVDD
—
MEMC_MCAS
AD11
O
GVDD
—
MEMC_MCS
AC11
O
GVDD
—
Signal
MPC8323E PowerQUICC™ II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3
52
Freescale Semiconductor
Package and Pin Listings
Table 55. MPC8323E PBGA Pinout Listing (continued)
Package Pin Number
Pin Type
Power
Supply
Notes
MEMC_MCKE
AD14
O
GVDD
3
MEMC_MCK
AF14
O
GVDD
—
MEMC_MCK
AE14
O
GVDD
—
MEMC_MODT
AF11
O
GVDD
—
Signal
Local Bus Controller Interface
LAD0
N25
IO
OV DD
—
LAD1
P26
IO
OV DD
—
LAD2
P25
IO
OV DD
—
LAD3
R26
IO
OV DD
—
LAD4
R25
IO
OV DD
—
LAD5
T26
IO
OV DD
—
LAD6
T25
IO
OV DD
—
LAD7
U25
IO
OV DD
—
LAD8
M24
IO
OV DD
—
LAD9
N24
IO
OV DD
—
LAD10
P24
IO
OV DD
—
LAD11
R24
IO
OV DD
—
LAD12
T24
IO
OV DD
—
LAD13
U24
IO
OV DD
—
LAD14
U26
IO
OV DD
—
LAD15
V26
IO
OV DD
—
LA16
K25
O
OV DD
—
LA17
L25
O
OV DD
—
LA18
L26
O
OV DD
—
LA19
L24
O
OV DD
—
LA20
M26
O
OV DD
—
LA21
M25
O
OV DD
—
LA22
N26
O
OV DD
—
LA23
AC24
O
OV DD
—
LA24
AC25
O
OV DD
—
LA25
AB23
O
OV DD
—
LCS0
AB24
O
OV DD
4
MPC8323E PowerQUICC™ II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3
Freescale Semiconductor
53
Package and Pin Listings
Table 55. MPC8323E PBGA Pinout Listing (continued)
Package Pin Number
Pin Type
Power
Supply
Notes
LCS1
AB25
O
OV DD
4
LCS2
AA23
O
OV DD
4
LCS3
AA24
O
OV DD
4
LWE0
Y23
O
OV DD
4
LWE1
W25
O
OV DD
4
LBCTL
V25
O
OV DD
4
RST_LALE/M1LALE/M2LALE
V24
O
OV DD
—
CFG_RESET_SOURCE[0]/LSDA10/LGPL0
L23
IO
OV DD
—
CFG_RESET_SOURCE[1]/LSDWE/LGPL1
K23
IO
OV DD
—
LSDRAS/LGPL2/LOE
J23
O
OV DD
4
CFG_RESET_SOURCE[2]/LSDCAS/LGPL3
H23
IO
OV DD
—
LGPL4/LGTA/LUPWAIT/LPBSE
G23
IO
OV DD
4
LGPL5
AC22
O
OV DD
4
PD_XLB_CLOCK_OUT/LCLK0/
PD_MG2XLB_ENC_CLOCK/CORE_CLK_OUT
Y24
O
OV DD
—
PD_XLB2MG_DDR_CLOCK/LCLK1/
PD_MG2XLB_ENC_SYNC
Y25
O
OV DD
—
UART_SOUT1/MSRCID0 (DDR ID)/LSRCID0
G1
IO
OV DD
—
UART_SIN1/MSRCID1 (DDR ID)/LSRCID1
G2
IO
OV DD
—
UART_CTS1/MSRCID2 (DDR ID)/LSRCID2
H3
IO
OV DD
—
UART_RTS1/MSRCID3 (DDR ID)/LSRCID3
K3
IO
OV DD
—
UART_SOUT2/MSRCID4 (DDR ID)/LSRCID4
H2
IO
OV DD
—
UART_SIN2/MDVAL (DDR ID)/LDVAL
H1
IO
OV DD
—
UART_CTS2
J3
IO
OV DD
—
UART_RTS2
K4
IO
OV DD
—
IIC_SDA/CKSTOP_OUT
AE24
IO
OV DD
2
IIC_SCL/CKSTOP_IN
AF24
IO
OV DD
2
Signal
DUART
I2C interface
Programmable Interrupt Controller
MCP_OUT
AD25
O
OV DD
—
IRQ0/MCP_IN
AD26
I
OV DD
—
K1
IO
OV DD
—
IRQ1
MPC8323E PowerQUICC™ II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3
54
Freescale Semiconductor
Package and Pin Listings
Table 55. MPC8323E PBGA Pinout Listing (continued)
Package Pin Number
Pin Type
Power
Supply
Notes
IRQ2
K2
I
OV DD
—
IRQ3
J2
I
OV DD
—
IRQ4
J1
I
OV DD
—
IRQ5
AE26
I
OV DD
—
IRQ6/CKSTOP_OUT
AE25
IO
OV DD
—
IRQ7/CKSTOP_IN
AF25
I
OV DD
—
CFG_CLKIN_DIV
F1
I
OV DD
—
M23
I
OV DD
—
TCK
W26
I
OV DD
—
TDI
Y26
I
OV DD
4
TDO
AA26
O
OV DD
3
TMS
AB26
I
OV DD
4
TRST
AC26
I
OV DD
4
N23
I
OV DD
6
T23
O
OV DD
—
Signal
CFG_LBIU_MUX_EN
JTAG
TEST
TEST_MODE
PMC
QUIESCE
System Control
HRESET
AC23
IO
OV DD
1
PORESET
AD23
I
OV DD
—
SRESET
AD24
IO
OV DD
2
CLKIN
R3
I
OV DD
—
CLKIN
P4
O
OV DD
—
PCI_SYNC_OUT
V1
O
OV DD
3
RTC_PIT_CLOCK
U23
I
OV DD
—
PCI_SYNC_IN/PCI_CLK
V2
I
OV DD
—
PCI_CLK0/clkpd_cerisc1_ipg_clkout/DPTC_OSC
T3
O
OV DD
—
PCI_CLK1/clkpd_half_cemb4ucc1_ipg_clkout/
CLOCK_XLB_CLOCK_OUT
U2
O
OV DD
—
PCI_CLK2/clkpd_third_cesog_ipg_clkout/
cecl_ipg_ce_clock
R4
O
OV DD
—
Clocks
MPC8323E PowerQUICC™ II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3
Freescale Semiconductor
55
Package and Pin Listings
Table 55. MPC8323E PBGA Pinout Listing (continued)
Signal
Package Pin Number
Pin Type
Power
Supply
Notes
Power and Ground Supplies
AVDD1
P3
I
AV DD1
—
AVDD2
AA1
I
AV DD2
—
AVDD3
AB15
I
AV DD3
—
AVDD4
C24
I
AV DD4
—
MVREF1
AB8
I
DDR
reference
voltage
—
MVREF2
AB17
I
DDR
reference
voltage
—
PCI_INTA /IRQ_OUT
AF2
O
OV DD
2
PCI_RESET_OUT
AE2
O
OV DD
—
PCI_AD0/MSRCID0 (DDR ID)
L1
IO
OV DD
—
PCI_AD1/MSRCID1 (DDR ID)
L2
IO
OV DD
—
PCI_AD2/MSRCID2 (DDR ID)
M1
IO
OV DD
—
PCI_AD3/MSRCID3 (DDR ID)
M2
IO
OV DD
—
PCI_AD4/MSRCID4 (DDR ID)
L3
IO
OV DD
—
PCI_AD5/MDVAL (DDR ID)
N1
IO
OV DD
—
PCI_AD6
N2
IO
OV DD
—
PCI_AD7
M3
IO
OV DD
—
PCI_AD8
P1
IO
OV DD
—
PCI_AD9
R1
IO
OV DD
—
PCI_AD10
N3
IO
OV DD
—
PCI_AD11
N4
IO
OV DD
—
PCI_AD12
T1
IO
OV DD
—
PCI_AD13
R2
IO
OV DD
—
PCI_AD14/ECID_TMODE_IN
T2
IO
OV DD
—
PCI_AD15
U1
IO
OV DD
—
PCI_AD16
Y2
IO
OV DD
—
PCI_AD17
Y1
IO
OV DD
—
PCI_AD18
AA2
IO
OV DD
—
PCI_AD19
AB1
IO
OV DD
—
PCI
MPC8323E PowerQUICC™ II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3
56
Freescale Semiconductor
Package and Pin Listings
Table 55. MPC8323E PBGA Pinout Listing (continued)
Package Pin Number
Pin Type
Power
Supply
Notes
PCI_AD20
AB2
IO
OV DD
—
PCI_AD21
Y4
IO
OV DD
—
PCI_AD22
AC1
IO
OV DD
—
PCI_AD23
AA3
IO
OV DD
—
PCI_AD24
AA4
IO
OV DD
—
PCI_AD25
AD1
IO
OV DD
—
PCI_AD26
AD2
IO
OV DD
—
PCI_AD27
AB3
IO
OV DD
—
PCI_AD28
AB4
IO
OV DD
—
PCI_AD29
AE1
IO
OV DD
—
PCI_AD30
AC3
IO
OV DD
—
PCI_AD31
AC4
IO
OV DD
—
PCI_C_BE0
M4
IO
OV DD
—
PCI_C_BE1
T4
IO
OV DD
—
PCI_C_BE2
Y3
IO
OV DD
—
PCI_C_BE3
AC2
IO
OV DD
—
PCI_PAR
U3
IO
OV DD
—
PCI_FRAME
W1
IO
OV DD
5
PCI_TRDY
W4
IO
OV DD
5
PCI_IRDY
W2
IO
OV DD
5
PCI_STOP
V4
IO
OV DD
5
PCI_DEVSEL
W3
IO
OV DD
5
PCI_IDSEL
P2
I
OV DD
—
PCI_SERR
U4
IO
OV DD
5
PCI_PERR
V3
IO
OV DD
5
PCI_REQ0
AD4
IO
OV DD
—
PCI_REQ1/CPCI_HS_ES
AE3
I
OV DD
—
PCI_REQ2
AF3
I
OV DD
—
PCI_GNT0
AD3
IO
OV DD
—
PCI_GNT1/CPCI_HS_LED
AE4
O
OV DD
—
PCI_GNT2/CPCI_HS_ENUM
AF4
O
OV DD
—
L4
I
OV DD
—
Signal
M66EN
MPC8323E PowerQUICC™ II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3
Freescale Semiconductor
57
Package and Pin Listings
Table 55. MPC8323E PBGA Pinout Listing (continued)
Signal
Package Pin Number
Pin Type
Power
Supply
Notes
CE/GPIO
GPIO_PA0/SER1_TXD[0]/TDMA_TXD[0]/USBTXN
G3
IO
OV DD
—
GPIO_PA1/SER1_TXD[1]/TDMA_TXD[1]/USBTXP
F3
IO
OV DD
—
GPIO_PA2/SER1_TXD[2]/TDMA_TXD[2]
F2
IO
OV DD
—
GPIO_PA3/SER1_TXD[3]/TDMA_TXD[3]
E3
IO
OV DD
—
GPIO_PA4/SER1_RXD[0]/TDMA_RXD[0]/USBRXP
E2
IO
OV DD
—
GPIO_PA5/SER1_RXD[1]/TDMA_RXD[1]/USBRXN
E1
IO
OV DD
—
GPIO_PA6/SER1_RXD[2]/TDMA_RXD[2]/USBRXD
D3
IO
OV DD
—
GPIO_PA7/SER1_RXD[3]/TDMA_RXD[3]
D2
IO
OV DD
—
GPIO_PA8/SER1_CD/TDMA_REQ/USBOE
D1
IO
OV DD
—
GPIO_PA9 TDMA_CLKO
C3
IO
OV DD
—
GPIO_PA10/SER1_CTS/TDMA_RSYNC
C2
IO
OV DD
—
GPIO_PA11/TDMA_STROBE
C1
IO
OV DD
—
GPIO_PA12/SER1_RTS/TDMA_TSYNC
B1
IO
OV DD
—
GPIO_PA13/CLK9/BRGO9
H4
IO
OV DD
—
GPIO_PA14/CLK11/BRGO10
G4
IO
OV DD
—
GPIO_PA15/BRGO7
J4
IO
OV DD
—
GPIO_PA16/ LA0 (LBIU)
K24
IO
OV DD
—
GPIO_PA17/ LA1 (LBIU)
K26
IO
OV DD
—
GPIO_PA18/Enet2_TXD[0]/SER2_TXD[0]/
TDMB_TXD[0]/LA2 (LBIU)
G25
IO
OV DD
—
GPIO_PA19/Enet2_TXD[1]/SER2_TXD[1]/
TDMB_TXD[1]/LA3 (LBIU)
G26
IO
OV DD
—
GPIO_PA20/Enet2_TXD[2]/SER2_TXD[2]/
TDMB_TXD[2]/LA4 (LBIU)
H25
IO
OV DD
—
GPIO_PA21/Enet2_TXD[3]/SER2_TXD[3]/
TDMB_TXD[3]/LA5 (LBIU)
H26
IO
OV DD
—
GPIO_PA22/Enet2_RXD[0]/SER2_RXD[0]/
TDMB_RXD[0]/LA6 (LBIU)
C25
IO
OV DD
—
GPIO_PA23/Enet2_RXD[1]/SER2_RXD[1]/
TDMB_RXD[1]/LA7 (LBIU)
C26
IO
OV DD
—
GPIO_PA24/Enet2_RXD[2]/SER2_RXD[2]/
TDMB_RXD[2]/LA8 (LBIU)
D25
IO
OV DD
—
GPIO_PA25/Enet2_RXD[3]/SER2_RXD[3]/
TDMB_RXD[3]/LA9 (LBIU)
D26
IO
OV DD
—
MPC8323E PowerQUICC™ II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3
58
Freescale Semiconductor
Package and Pin Listings
Table 55. MPC8323E PBGA Pinout Listing (continued)
Package Pin Number
Pin Type
Power
Supply
Notes
GPIO_PA26/Enet2_RX_ER/SER2_CD/TDMB_REQ/
LA10 (LBIU)
E26
IO
OV DD
—
GPIO_PA27/Enet2_TX_ER/TDMB_CLKO/LA11 (LBIU)
F25
IO
OV DD
—
GPIO_PA28/Enet2_RX_DV/SER2_CTS/
TDMB_RSYNC/LA12 (LBIU)
E25
IO
OV DD
—
GPIO_PA29/Enet2_COL/RXD[4]/SER2_RXD[4]/
TDMB_STROBE/LA13 (LBIU)
J25
IO
OV DD
—
GPIO_PA30/Enet2_TX_EN/SER2_RTS/
TDMB_TSYNC/LA14 (LBIU)
F26
IO
OV DD
—
GPIO_PA31/Enet2_CRS/SDET LA15 (LBIU)
J26
IO
OV DD
—
GPIO_PB0/Enet3_TXD[0]/SER3_TXD[0]/
TDMC_TXD[0]
A13
IO
OV DD
—
GPIO_PB1/Enet3_TXD[1]/SER3_TXD[1]/
TDMC_TXD[1]
B13
IO
OV DD
—
GPIO_PB2/Enet3_TXD[2]/SER3_TXD[2]/
TDMC_TXD[2]
A14
IO
OV DD
—
GPIO_PB3/Enet3_TXD[3]/SER3_TXD[3]/
TDMC_TXD[3]
B14
IO
OV DD
—
GPIO_PB4/Enet3_RXD[0]/SER3_RXD[0]/
TDMC_RXD[0]
B8
IO
OV DD
—
GPIO_PB5/Enet3_RXD[1]/SER3_RXD[1]/
TDMC_RXD[1]
A8
IO
OV DD
—
GPIO_PB6/Enet3_RXD[2]/SER3_RXD[2]/
TDMC_RXD[2]
A9
IO
OV DD
—
GPIO_PB7/Enet3_RXD[3]/SER3_RXD[3]/
TDMC_RXD[3]
B9
IO
OV DD
—
GPIO_PB8/Enet3_RX_ER/SER3_CD/TDMC_REQ
A11
IO
OV DD
—
GPIO_PB9/Enet3_TX_ER/TDMC_CLKO
B11
IO
OV DD
—
GPIO_PB10/Enet3_RX_DV/SER3_CTS/
TDMC_RSYNC
A10
IO
OV DD
—
GPIO_PB11/Enet3_COL/RXD[4]/SER3_RXD[4]/
TDMC_STROBE
A15
IO
OV DD
—
GPIO_PB12/Enet3_TX_EN/SER3_RTS/
TDMC_TSYNC
B12
IO
OV DD
—
GPIO_PB13/Enet3_CRS/SDET
B15
IO
OV DD
—
GPIO_PB14/CLK12
D9
IO
OV DD
—
GPIO_PB15 UPC1_TxADDR[4]
D14
IO
OV DD
—
GPIO_PB16 UPC1_RxADDR[4]
B16
IO
OV DD
—
Signal
MPC8323E PowerQUICC™ II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3
Freescale Semiconductor
59
Package and Pin Listings
Table 55. MPC8323E PBGA Pinout Listing (continued)
Package Pin Number
Pin Type
Power
Supply
Notes
GPIO_PB17/BRGO1/CE_EXT_REQ1
D10
IO
OV DD
—
GPIO_PB18/Enet4_TXD[0]/SER4_TXD[0]/
TDMD_TXD[0]
C10
IO
OV DD
—
GPIO_PB19/Enet4_TXD[1]/SER4_TXD[1]/
TDMD_TXD[1]
C9
IO
OV DD
—
GPIO_PB20/Enet4_TXD[2]/SER4_TXD[2]/
TDMD_TXD[2]
D8
IO
OV DD
—
GPIO_PB21/Enet4_TXD[3]/SER4_TXD[3]/
TDMD_TXD[3]
C8
IO
OV DD
—
GPIO_PB22/Enet4_RXD[0]/SER4_RXD[0]/
TDMD_RXD[0]
C15
IO
OV DD
—
GPIO_PB23/Enet4_RXD[1]/SER4_RXD[1]/
TDMD_RXD[1]
C14
IO
OV DD
—
GPIO_PB24/Enet4_RXD[2]/SER4_RXD[2]/
TDMD_RXD[2]
D13
IO
OV DD
—
GPIO_PB25/Enet4_RXD[3]/SER4_RXD[3]/
TDMD_RXD[3]
C13
IO
OV DD
—
GPIO_PB26/Enet4_RX_ER/SER4_CD/TDMD_REQ
C12
IO
OV DD
—
GPIO_PB27/Enet4_TX_ER/TDMD_CLKO
D11
IO
OV DD
—
GPIO_PB28/Enet4_RX_DV/SER4_CTS/
TDMD_RSYNC
D12
IO
OV DD
—
GPIO_PB29/Enet4_COL/RXD[4]/SER4_RXD[4]/
TDMD_STROBE
D7
IO
OV DD
—
GPIO_PB30/Enet4_TX_EN/SER4_RTS/
TDMD_TSYNC
C11
IO
OV DD
—
GPIO_PB31/Enet4_CRS/SDET
C7
IO
OV DD
—
GPIO_PC0/UPC1_TxDATA[0]/SER5_TXD[0]
A18
IO
OV DD
—
GPIO_PC1/UPC1_TxDATA[1]/SER5_TXD[1]
A19
IO
OV DD
—
GPIO_PC2/UPC1_TxDATA[2]/SER5_TXD[2]
B18
IO
OV DD
—
GPIO_PC3/UPC1_TxDATA[3]/SER5_TXD[3]
B19
IO
OV DD
—
GPIO_PC4/UPC1_TxDATA[4]
A24
IO
OV DD
—
GPIO_PC5/UPC1_TxDATA[5]
B24
IO
OV DD
—
GPIO_PC6/UPC1_TxDATA[6]
A23
IO
OV DD
—
GPIO_PC7/UPC1_TxDATA[7]
B26
IO
OV DD
—
GPIO_PC8/UPC1_RxDATA[0]/SER5_RXD[0]
A21
IO
OVDD
—
GPIO_PC9/UPC1_RxDATA[1]/SER5_RXD[1]
B20
IO
OVDD
—
Signal
MPC8323E PowerQUICC™ II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3
60
Freescale Semiconductor
Package and Pin Listings
Table 55. MPC8323E PBGA Pinout Listing (continued)
Package Pin Number
Pin Type
Power
Supply
Notes
GPIO_PC10/UPC1_RxDATA[2]/SER5_RXD[2]
B21
IO
OV DD
—
GPIO_PC11/UPC1_RxDATA[3]/SER5_RXD[3]
A20
IO
OV DD
—
GPIO_PC12/UPC1_RxDATA[4]
D19
IO
OV DD
—
GPIO_PC13/UPC1_RxDATA[5]/LSRCID0
C18
IO
OV DD
—
GPIO_PC14/UPC1_RxDATA[6]/LSRCID1
D18
IO
OV DD
—
GPIO_PC15/UPC1_RxDATA[7]/LSRCID2
A25
IO
OV DD
—
GPIO_PC16/UPC1_TxADDR[0]
C21
IO
OV DD
—
GPIO_PC17/UPC1_TxADDR[1]/LSRCID3
D22
IO
OV DD
—
GPIO_PC18/UPC1_TxADDR[2]/LSRCID4
C23
IO
OV DD
—
GPIO_PC19/UPC1_TxADDR[3]/LDVAL
D23
IO
OV DD
—
GPIO_PC20/UPC1_RxADDR[0]
C17
IO
OV DD
—
GPIO_PC21/UPC1_RxADDR[1]
D17
IO
OV DD
—
GPIO_PC22/UPC1_RxADDR[2]
C16
IO
OV DD
—
GPIO_PC23/UPC1_RxADDR[3]
D16
IO
OV DD
—
GPIO_PC24/UPC1_RxSOC/SER5_CD
A16
IO
OV DD
—
GPIO_PC25/UPC1_RxCLAV
D20
IO
OV DD
—
GPIO_PC26/UPC1_RxPRTY/CE_EXT_REQ2
E23
IO
OV DD
—
GPIO_PC27/UPC1_RxEN
B17
IO
OV DD
—
GPIO_PC28/UPC1_TxSOC
B22
IO
OV DD
—
GPIO_PC29/UPC1_TxCLAV/SER5_CTS
A17
IO
OV DD
—
GPIO_PC30/UPC1_TxPRTY
A22
IO
OV DD
—
GPIO_PC31/UPC1_TxEN/SER5_RTS
C20
IO
OV DD
—
GPIO_PD0/SPIMOSI
A2
IO
OV DD
—
GPIO_PD1/SPIMISO
B2
IO
OV DD
—
GPIO_PD2/SPICLK
B3
IO
OV DD
—
GPIO_PD3/SPISEL
A3
IO
OV DD
—
GPIO_PD4/SPI_MDIO/CE_MUX_MDIO
A4
IO
OV DD
—
GPIO_PD5/SPI_MDC/CE_MUX_MDC
B4
IO
OV DD
—
GPIO_PD6/CLK8/BRGO16/CE_EXT_REQ3
F24
IO
OV DD
—
GPIO_PD7/GTM1_TIN1/GTM2_TIN2/CLK5
G24
IO
OV DD
—
GPIO_PD8/GTM1_TGATE1/GTM2_TGATE2/CLK6
H24
IO
OV DD
—
GPIO_PD9/GTM1_TOUT1
D24
IO
OV DD
—
Signal
MPC8323E PowerQUICC™ II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3
Freescale Semiconductor
61
Package and Pin Listings
Table 55. MPC8323E PBGA Pinout Listing (continued)
Package Pin Number
Pin Type
Power
Supply
Notes
GPIO_PD10/GTM1_TIN2/GTM2_TIN1/CLK17
J24
IO
OV DD
—
GPIO_PD11/GTM1_TGATE2/GTM2_TGATE1
B25
IO
OV DD
—
GPIO_PD12/GTM1_TOUT2/GTM2_TOUT1
C4
IO
OV DD
—
GPIO_PD13/GTM1_TIN3/GTM2_TIN4/BRGO8
D4
IO
OV DD
—
GPIO_PD14/GTM1_TGATE3/GTM2_TGATE4
D5
IO
OV DD
—
GPIO_PD15/GTM1_TOUT3
A5
IO
OV DD
—
GPIO_PD16/GTM1_TIN4/GTM2_TIN3
B5
IO
OV DD
—
GPIO_PD17/GTM1_TGATE4/GTM2_TGATE3
C5
IO
OV DD
—
GPIO_PD18/GTM1_TOUT4/GTM2_TOUT3
A6
IO
OV DD
—
GPIO_PD19/CE_RISC1_INT/CE_EXT_REQ4
B6
IO
OV DD
—
GPIO_PD20/CLK18/BRGO6
D21
IO
OV DD
—
GPIO_PD21/CLK16/BRGO5/UPC1_CLKO
C19
IO
OV DD
—
GPIO_PD22/CLK4/BRGO9/UCC2_CLKO
A7
IO
OV DD
—
GPIO_PD23/CLK3/BRGO10/UCC3_CLKO
B7
IO
OV DD
—
GPIO_PD24/CLK10/BRGO2/UCC4_CLKO
A12
IO
OV DD
—
GPIO_PD25/CLK13/BRGO16/UCC5_CLKO
B10
IO
OV DD
—
GPIO_PD26/CLK2/BRGO4/UCC1_CLKO
E4
IO
OV DD
—
GPIO_PD27/CLK1/BRGO3
F4
IO
OV DD
—
GPIO_PD28/CLK19/BRGO11
D15
IO
OV DD
—
GPIO_PD29/CLK15/BRGO8
C6
IO
OV DD
—
GPIO_PD30/CLK14
D6
IO
OV DD
—
GPIO_PD31/CLK7/BRGO15
E24
IO
OV DD
—
Signal
Power anf Ground Supplies
GV DD
AA8, AA10, AA11, AA13,
AA14, AA16, AA17, AA19,
AA21, AB9, AB10, AB11,
AB12, AB14, AB18, AB20,
AB21, AC6, AC8, AC14, AC18
GVDD
—
—
OVDD
E5, E6, E8, E9, E10, E12, E14,
E15, E16, E18, E19, E20, E22,
F5, F6, F8, F10, F14, F16, F19,
F22, G22, H5, H6, H21, J5,
J22, K21, K22, L5, L6, L22, M5,
M22, N5, N21, N22, P6, P22,
P23, R5, R23, T5, T21, T22,
U6, U22, V5, V22, W22, Y5,
AB5, AB6, AC5
OV DD
—
—
MPC8323E PowerQUICC™ II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3
62
Freescale Semiconductor
Package and Pin Listings
Table 55. MPC8323E PBGA Pinout Listing (continued)
Package Pin Number
Pin Type
Power
Supply
Notes
VDD
K10, K11, K12, K13, K14, K15,
K16, K17, L10, L17, M10, M17,
N10, N17, P10, P17, R10, R17,
T10, T17, U10, U11, U12, U13,
U14, U15, U16, U17
VDD
—
—
VSS
B23, E7, E11, E13, E17, E21,
F11, F13, F17, F21, F23, G5,
H22, K5, K6, L11, L12, L13,
L14, L15, L16, L21, M11, M12,
M13, M14, M15, M16, N6, N11,
N12, N13, N14, N15, N16, P5,
P11, P12, P13, P14, P15, P16,
P21, R11, R12, R13, R14, R15,
R16, R22, T6, T11, T12, T13,
T14, T15, T16, U5, U21, V23,
W5, W6, W21, W23, W24, Y22,
AA5, AA6, AA22, AA25, AB7,
AB13, AB19, AB22, AC10,
AC12, AC16, AC20
VSS
—
—
—
—
—
Signal
No Connect
NC
C22
Notes:
1. This pin is an open drain signal. A weak pull-up resistor (1 kΩ) should be placed on this pin to OVDD.
2. This pin is an open drain signal. A weak pull-up resistor (2–10 kΩ) should be placed on this pin to OVDD.
3. This output is actively driven during reset rather than being three-stated during reset.
4. These JTAG and local bus pins have weak internal pull-up P-FETs that are always enabled.
5. This pin should have a weak pull up if the chip is in PCI host mode. Follow the PCI specification’s recommendation.
6. This pin must always be tied to GND.
MPC8323E PowerQUICC™ II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3
Freescale Semiconductor
63
Clocking
22 Clocking
Figure 43 shows the internal distribution of clocks within the MPC8323E.
e300c2 core
MPC8323E
to DDR
memory
controller
csb_clk
DDR
Clock
Divider
/2
QUICC
Engine
PLL
MEMC_MCK
DDR
Memory
Device
MEMC_MCK
ddr_clk
Clock
Unit
System
PLL
core_clk
Core PLL
ce_clk to QUICC
Engine block
lbc_clk
/n
to local bus
LBC
Clock
Divider
LCLK[0:1]
Local Bus
Memory
Device
csb_clk to rest
of the device
PCI_CLK/
PCI_SYNC_IN
CFG_CLKIN_DIV
1
0
CLKIN
Crystal
PCI_SYNC_OUT
PCI Clock
Divider (÷2)
CLKIN
3
PCI_CLK_OUT[0:2]
Figure 43. MPC8323E Clock Subsystem
The primary clock source for the MPC8323E can be one of two inputs, CLKIN or PCI_CLK, depending
on whether the device is configured in PCI host or PCI agent mode, respectively.
MPC8323E PowerQUICC™ II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3
64
Freescale Semiconductor
Clocking
22.1
Clocking in PCI Host Mode
When the MPC8323E is configured as a PCI host device (RCWH[PCIHOST] = 1), CLKIN is its primary
input clock. CLKIN feeds the PCI clock divider (÷2) and the PCI_SYNC_OUT and PCI_CLK_OUT
multiplexors. The CFG_CLKIN_DIV configuration input selects whether CLKIN or CLKIN/2 is driven
out on the PCI_SYNC_OUT signal.
PCI_SYNC_OUT is connected externally to PCI_SYNC_IN to allow the internal clock subsystem to
synchronize to the system PCI clocks. PCI_SYNC_OUT must be connected properly to PCI_SYNC_IN,
with equal delay to all PCI agent devices in the system.
22.1.1
PCI Clock Outputs (PCI_CLK_OUT[0:2])
When the MPC8323E is configured as a PCI host, it provides three separate clock output signals,
PCI_CLK_OUT[0:2], for external PCI agents.
When the device comes out of reset, the PCI clock outputs are disabled and are actively driven to a steady
low state. Each of the individual clock outputs can be enabled (enable toggling of the clock) by setting its
corresponding OCCR[PCICOEn] bit. All output clocks are phase-aligned to each other.
22.2
Clocking in PCI Agent Mode
When the MPC8323E is configured as a PCI agent device, PCI_CLK is the primary input clock. In agent
mode, the CLKIN signal should be tied to GND, and the clock output signals, PCI_CLK_OUTn and
PCI_SYNC_OUT, are not used.
22.3
System Clock Domains
As shown in Figure 43, the primary clock input (frequency) is multiplied up by the system phase-locked
loop (PLL) and the clock unit to create three major clock domains:
• The coherent system bus clock (csb_clk)
• The QUICC Engine clock (ce_clk)
• The internal clock for the DDR controller (ddr_clk)
• The internal clock for the local bus controller (lb_clk)
The csb_clk frequency is derived from a complex set of factors that can be simplified into the following
equation:
csb_clk = [PCI_SYNC_IN × (1 + ~CFG_CLKIN_DIV)] × SPMF
In PCI host mode, PCI_SYNC_IN × (1 + ~CFG_CLKIN_DIV) is the CLKIN frequency.
The csb_clk serves as the clock input to the e300c2 core. A second PLL inside the core multiplies up the
csb_clk frequency to create the internal clock for the core (core_clk). The system and core PLL multipliers
are selected by the SPMF and COREPLL fields in the reset configuration word low (RCWL) which is
loaded at power-on reset or by one of the hard-coded reset options. See the “Reset Configuration” section
in the MPC8323E PowerQUICC™ II Pro Communications Processor Reference Manual for more
information.
MPC8323E PowerQUICC™ II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3
Freescale Semiconductor
65
Clocking
The ce_clk frequency is determined by the QUICC Engine PLL multiplication factor (RCWL[CEPMF)
and the QUICC Engine PLL division factor (RCWL[CEPDF]) according to the following equation:
When CLKIN is the primary input clock,
ce_clk = (primary clock input × CEPMF) ÷ (1 + CEPDF)
When PCI_CLK is the primary input clock,
ce_clk = [primary clock input × CEPMF × (1 + ~CFG_CLKIN_DIV)] ÷ (1 + CEPDF)
See the “QUICC Engine PLL Multiplication Factor” section and the “QUICC Engine PLL Division
Factor” section in the MPC8323E PowerQUICC™ II Pro Communications Processor Reference Manual
for more information.
The DDR SDRAM memory controller operates with a frequency equal to twice the frequency of csb_clk.
Note that ddr_clk is not the external memory bus frequency; ddr_clk passes through the DDR clock divider
(÷2) to create the differential DDR memory bus clock outputs (MCK and MCK). However, the data rate
is the same frequency as ddr_clk.
The local bus memory controller operates with a frequency equal to the frequency of csb_clk. Note that
lbc_clk is not the external local bus frequency; lbc_clk passes through the LBC clock divider to create the
external local bus clock outputs (LSYNC_OUT and LCLK[0:2]). The LBC clock divider ratio is
controlled by LCCR[CLKDIV]. See the “LBC Bus Clock and Clock Ratios” section in the MPC8323E
PowerQUICC™ II Pro Communications Processor Reference Manual for more information.
In addition, some of the internal units may be required to be shut off or operate at lower frequency than
the csb_clk frequency. These units have a default clock ratio that can be configured by a memory mapped
register after the device comes out of reset. Table 56 specifies which units have a configurable clock
frequency. Refer to the “System Clock Control Register (SCCR)” section in the MPC8323E
PowerQUICC™ II Pro Communications Processor Reference Manual for a detailed description.
Table 56. Configurable Clock Units
Unit
Default Frequency
Options
Security core, I2C, SAP, TPR
csb_clk
Off, csb_clk/2, csb_clk/3
PCI and DMA complex
csb_clk
Off, csb_clk
NOTE
Setting the clock ratio of these units must be performed prior to any access
to them.
Table 57 provides the operating frequencies for the 8323E PBGA under recommended operating
conditions (see Table 2).
Table 57. Operating Frequencies for PBGA
Characteristic1
Max Operating Frequency
Unit
e300 core frequency (core_clk)
333
MHz
Coherent system bus frequency (csb_clk)
133
MHz
QUICC Engine frequency (ce_clk)
200
MHz
MPC8323E PowerQUICC™ II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3
66
Freescale Semiconductor
Clocking
Table 57. Operating Frequencies for PBGA (continued)
Characteristic1
Max Operating Frequency
Unit
133
MHz
66
MHz
66
MHz
DDR1/DDR2 memory bus frequency (MCLK)2
Local bus frequency (LCLKn)
3
PCI input frequency (CLKIN or PCI_CLK)
1
The CLKIN frequency, RCWL[SPMF], and RCWL[COREPLL] settings must be chosen such that the resulting csb_clk, MCLK,
LCLK[0:2], and core_clk frequencies do not exceed their respective maximum or minimum operating frequencies.
2
The DDR1/DDR2 data rate is 2× the DDR1/DDR2 memory bus frequency.
3
The local bus frequency is 1/2, 1/4, or 1/8 of the lb_clk frequency (depending on LCCR[CLKDIV]) which is in turn 1× or 2× the
csb_clk frequency (depending on RCWL[LBCM]).
22.4
System PLL Configuration
The system PLL is controlled by the RCWL[SPMF] parameter. Table 58 shows the multiplication factor
encodings for the system PLL.
NOTE
System PLL VCO frequency = 2 × (CSB frequency) × (System PLL VCO
divider).
The VCO divider needs to be set properly so that the System PLL VCO
frequency is in the range of 300–600 MHz.
Table 58. System PLL Multiplication Factors
RCWL[SPMF]
System PLL
Multiplication Factor
0000
Reserved
0001
Reserved
0010
×2
0011
×3
0100
×4
0101
×5
0110
×6
0111–1111
Reserved
As described in Section 22, “Clocking,” the LBCM, DDRCM, and SPMF parameters in the reset
configuration word low and the CFG_CLKIN_DIV configuration input signal select the ratio between the
primary clock input (CLKIN or PCI_CLK) and the internal coherent system bus clock (csb_clk). Table 59
MPC8323E PowerQUICC™ II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3
Freescale Semiconductor
67
Clocking
shows the expected frequency values for the CSB frequency for select csb_clk to CLKIN/PCI_SYNC_IN
ratios.
Table 59. CSB Frequency Options
Input Clock Frequency (MHz)2
CFG_CLKIN_DIV_B
at Reset1
SPMF
csb_clk :
Input Clock
Ratio 2
25
33.33
66.67
csb_clk Frequency (MHz)
High
0010
2:1
High
0011
3:1
High
0100
4:1
100
High
0101
5:1
125
High
0110
6:1
High
0111
7:1
High
1000
8:1
High
1001
9:1
High
1010
10 : 1
High
1011
11 : 1
High
1100
12 : 1
High
1101
13 : 1
High
1110
14 : 1
High
1111
15 : 1
High
0000
16 : 1
Low
0010
2:1
Low
0011
3:1
100
Low
0100
4:1
133
Low
0101
5:1
Low
0110
6:1
Low
0111
7:1
Low
1000
8:1
Low
1001
9:1
Low
1010
10 : 1
Low
1011
11 : 1
Low
1100
12 : 1
Low
1101
13 : 1
Low
1110
14 : 1
Low
1111
15 : 1
Low
0000
16 : 1
133
100
133
133
1
CFG_CLKIN_DIV_B is only used for host mode; CLKIN must be tied low and
CFG_CLKIN_DIV_B must be pulled up (high) in agent mode.
2 CLKIN is the input clock in host mode; PCI_CLK is the input clock in agent mode.
MPC8323E PowerQUICC™ II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3
68
Freescale Semiconductor
Clocking
22.5
Core PLL Configuration
RCWL[COREPLL] selects the ratio between the internal coherent system bus clock (csb_clk) and the e300
core clock (core_clk). Table 60 shows the encodings for RCWL[COREPLL]. COREPLL values not listed
in Table 60 should be considered reserved.
Table 60. e300 Core PLL Configuration
RCWL[COREPLL]
core_clk : csb_clk Ratio
VCO Divider
n
PLL bypassed
(PLL off, csb_clk clocks
core directly)
PLL bypassed
(PLL off, csb_clk clocks
core directly)
0001
0
1:1
÷2
01
0001
0
1:1
÷4
10
0001
0
1:1
÷8
11
0001
0
1:1
÷8
00
0001
1
1.5:1
÷2
01
0001
1
1.5:1
÷4
10
0001
1
1.5:1
÷8
11
0001
1
1.5:1
÷8
00
0010
0
2:1
÷2
01
0010
0
2:1
÷4
10
0010
0
2:1
÷8
11
0010
0
2:1
÷8
00
0010
1
2.5:1
÷2
01
0010
1
2.5:1
÷4
10
0010
1
2.5:1
÷8
11
0010
1
2.5:1
÷8
00
0011
0
3:1
÷2
01
0011
0
3:1
÷4
10
0011
0
3:1
÷8
11
0011
0
3:1
÷8
0-1
2-5
6
nn
0000
00
NOTE
Core VCO frequency = core frequency × VCO divider
VCO divider (RCWL[COREPLL[0:1]]) must be set properly so that the
core VCO frequency is in the range of 500–800 MHz.
MPC8323E PowerQUICC™ II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3
Freescale Semiconductor
69
Clocking
22.6
QUICC Engine PLL Configuration
The QUICC Engine PLL is controlled by the RCWL[CEPMF] and RCWL[CEPDF] parameters. Table 61
shows the multiplication factor encodings for the QUICC Engine PLL.
Table 61. QUICC Engine PLL Multiplication Factors
RCWL[CEPMF]
RCWL[CEPDF]
QUICC Engine PLL Multiplication
Factor = RCWL[CEPMF]/
(1 + RCWL[CEPDF)
00000–00001
0
Reserved
00010
0
×2
00011
0
×3
00100
0
×4
00101
0
×5
00110
0
×6
00111
0
×7
01000
0
×8
01001–11111
0
Reserved
The RCWL[CEVCOD] denotes the QUICC Engine PLL VCO internal frequency as shown in Table 62.
Table 62. QUICC Engine PLL VCO Divider
RCWL[CEVCOD]
VCO Divider
00
4
01
8
10
2
11
Reserved
NOTE
The VCO divider (RCWL[CEVCOD]) must be set properly so that the
QUICC Engine VCO frequency is in the range of 300–600 MHz. The
QUICC Engine frequency is not restricted by the CSB and core frequencies.
The CSB, core, and QUICC Engine frequencies should be selected
according to the performance requirements.
The QUICC Engine VCO frequency is derived from the following
equations:
ce_clk = (primary clock input × CEPMF) ÷ (1 + CEPDF)
QUICC Engine VCO Frequency = ce_clk × VCO divider × (1 + CEPDF)
MPC8323E PowerQUICC™ II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3
70
Freescale Semiconductor
Thermal
22.7
Suggested PLL Configurations
To simplify the PLL configurations, the MPC8323E might be separated into two clock domains. The first
domain contain the CSB PLL and the core PLL. The core PLL is connected serially to the CSB PLL, and
has the csb_clk as its input clock. The second clock domain has the QUICC Engine PLL. The clock
domains are independent, and each of their PLLs are configured separately. Both of the domains has one
common input clock. Table 63 shows suggested PLL configurations for 33, 25, and 66 MHz input clocks.
Table 63. Suggested PLL Configurations
CEDF
Input Clock
Frequency
(MHz)
CSB
Frequency
(MHz)
Core
Frequency
(MHz)
QUICC
Engine
Frequency
(MHz)
Conf No.
SPMF
Core
PLL
1
0100
0000100
0110
0
33.33
133.33
266.66
200
2
0100
0000101
1000
0
25
100
250
200
3
0010
0000100
0011
0
66.67
133.33
266.66
200
4
0100
0000101
0110
0
33.33
133.33
333.33
200
5
0101
0000101
1000
0
25
125
312.5
200
6
0010
0000101
0011
0
66.67
133.33
333.33
200
CEMF
23 Thermal
This section describes the thermal specifications of the MPC8323E.
23.1
Thermal Characteristics
Table 64 provides the package thermal characteristics for the 516 27 × 27 mm PBGA of the MPC8323E.
Table 64. Package Thermal Characteristics for PBGA
Characteristic
Board type
Symbol
Value
Unit
Notes
Junction-to-ambient natural convection
Single-layer board (1s)
RθJA
28
°C/W
1, 2
Junction-to-ambient natural convection
Four-layer board (2s2p)
RθJA
21
°C/W
1, 2 ,3
Junction-to-ambient (@200 ft/min)
Single-layer board (1s)
RθJMA
23
°C/W
1, 3
Junction-to-ambient (@200 ft/min)
Four-layer board (2s2p)
RθJMA
18
°C/W
1, 3
Junction-to-board
—
RθJB
13
°C/W
4
Junction-to-case
—
RθJC
9
°C/W
5
MPC8323E PowerQUICC™ II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3
Freescale Semiconductor
71
Thermal
Table 64. Package Thermal Characteristics for PBGA (continued)
Characteristic
Junction-to-package top
Board type
Symbol
Value
Unit
Notes
Natural convection
ΨJT
2
°C/W
6
Notes:
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
2. Per JEDEC JESD51-2 with the single layer board horizontal. Board meets JESD51-9 specification.
3. Per JEDEC JESD51-6 with the board horizontal.
4. Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is measured on
the top surface of the board near the package.
5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method
1012.1).
6. Thermal characterization parameter indicating the temperature difference between package top and the junction temperature
per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-JT.
23.2
Thermal Management Information
For the following sections, PD = (VDD × IDD) + PI/O, where PI/O is the power dissipation of the I/O drivers.
23.2.1
Estimation of Junction Temperature with Junction-to-Ambient
Thermal Resistance
An estimation of the chip junction temperature, TJ, can be obtained from the equation:
TJ = TA + (RθJA × PD)
where:
TJ = junction temperature (°C)
TA = ambient temperature for the package (°C)
RθJA = junction-to-ambient thermal resistance (°C/W)
PD = power dissipation in the package (W)
The junction-to-ambient thermal resistance is an industry standard value that provides a quick and easy
estimation of thermal performance. As a general statement, the value obtained on a single layer board is
appropriate for a tightly packed printed-circuit board. The value obtained on the board with the internal
planes is usually appropriate if the board has low power dissipation and the components are well separated.
Test cases have demonstrated that errors of a factor of two (in the quantity TJ – TA) are possible.
23.2.2
Estimation of Junction Temperature with Junction-to-Board
Thermal Resistance
The thermal performance of a device cannot be adequately predicted from the junction-to-ambient thermal
resistance. The thermal performance of any component is strongly dependent on the power dissipation of
surrounding components. In addition, the ambient temperature varies widely within the application. For
many natural convection and especially closed box applications, the board temperature at the perimeter
MPC8323E PowerQUICC™ II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3
72
Freescale Semiconductor
Thermal
(edge) of the package is approximately the same as the local air temperature near the device. Specifying
the local ambient conditions explicitly as the board temperature provides a more precise description of the
local ambient conditions that determine the temperature of the device.
At a known board temperature, the junction temperature is estimated using the following equation:
TJ = TB + (RθJB × PD)
where:
TJ = junction temperature (°C)
TB = board temperature at the package perimeter (°C)
RθJB = junction-to-board thermal resistance (°C/W) per JESD51-8
PD = power dissipation in package (W)
When the heat loss from the package case to the air can be ignored, acceptable predictions of junction
temperature can be made. The application board should be similar to the thermal test condition: the
component is soldered to a board with internal planes.
23.2.3
Experimental Determination of Junction Temperature
To determine the junction temperature of the device in the application after prototypes are available, the
thermal characterization parameter (ΨJT) can be used to determine the junction temperature with a
measurement of the temperature at the top center of the package case using the following equation:
TJ = TT + (ΨJT × PD)
where:
TJ = junction temperature (°C)
TT = thermocouple temperature on top of package (°C)
ΨJT = thermal characterization parameter (°C/W)
PD = power dissipation in package (W)
The thermal characterization parameter is measured per JESD51-2 specification using a 40 gauge type T
thermocouple epoxied to the top center of the package case. The thermocouple should be positioned so
that the thermocouple junction rests on the package. A small amount of epoxy is placed over the
thermocouple junction and over about 1 mm of wire extending from the junction. The thermocouple wire
is placed flat against the package case to avoid measurement errors caused by cooling effects of the
thermocouple wire.
23.2.4
Heat Sinks and Junction-to-Case Thermal Resistance
In some application environments, a heat sink is required to provide the necessary thermal management of
the device. When a heat sink is used, the thermal resistance is expressed as the sum of a junction-to-case
thermal resistance and a case to ambient thermal resistance:
RθJA = RθJC + RθCA
MPC8323E PowerQUICC™ II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3
Freescale Semiconductor
73
Thermal
where:
RθJA = junction-to-ambient thermal resistance (°C/W)
RθJC = junction-to-case thermal resistance (°C/W)
RθCA = case-to-ambient thermal resistance (°C/W)
RθJC is device related and cannot be influenced by the user. The user controls the thermal environment to
change the case-to-ambient thermal resistance, RθCA. For instance, the user can change the size of the heat
sink, the air flow around the device, the interface material, the mounting arrangement on printed-circuit
board, or change the thermal dissipation on the printed-circuit board surrounding the device.
To illustrate the thermal performance of the devices with heat sinks, the thermal performance has been
simulated with a few commercially available heat sinks. The heat sink choice is determined by the
application environment (temperature, air flow, adjacent component power dissipation) and the physical
space available. Because there is not a standard application environment, a standard heat sink is not
required.
Accurate thermal design requires thermal modeling of the application environment using computational
fluid dynamics software which can model both the conduction cooling and the convection cooling of the
air moving through the application. Simplified thermal models of the packages can be assembled using the
junction-to-case and junction-to-board thermal resistances listed in the thermal resistance table. More
detailed thermal models can be made available on request.
Heat sink vendors include the following list:
Aavid Thermalloy
80 Commercial St.
Concord, NH 03301
Internet: www.aavidthermalloy.com
Alpha Novatech
473 Sapena Ct. #12
Santa Clara, CA 95054
Internet: www.alphanovatech.com
603-224-9988
408-567-8082
International Electronic Research Corporation (IERC) 818-842-7277
413 North Moss St.
Burbank, CA 91502
Internet: www.ctscorp.com
Millennium Electronics (MEI)
Loroco Sites
671 East Brokaw Road
San Jose, CA 95112
Internet: www.mei-thermal.com
408-436-8770
Tyco Electronics
Chip Coolers™
P.O. Box 3668
Harrisburg, PA 17105-3668
Internet: www.chipcoolers.com
800-522-2800
MPC8323E PowerQUICC™ II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3
74
Freescale Semiconductor
Thermal
Wakefield Engineering
33 Bridge St.
Pelham, NH 03076
Internet: www.wakefield.com
Interface material vendors include the following:
Chomerics, Inc.
77 Dragon Ct.
Woburn, MA 01801
Internet: www.chomerics.com
603-635-5102
781-935-4850
Dow-Corning Corporation
Dow-Corning Electronic Materials
P.O. Box 994
Midland, MI 48686-0997
Internet: www.dowcorning.com
800-248-2481
Shin-Etsu MicroSi, Inc.
10028 S. 51st St.
Phoenix, AZ 85044
Internet: www.microsi.com
888-642-7674
The Bergquist Company
18930 West 78th St.
Chanhassen, MN 55317
Internet: www.bergquistcompany.com
800-347-4572
23.3
Heat Sink Attachment
When attaching heat sinks to these devices, an interface material is required. The best method is to use
thermal grease and a spring clip. The spring clip should connect to the printed-circuit board, either to the
board itself, to hooks soldered to the board, or to a plastic stiffener. Avoid attachment forces which would
lift the edge of the package or peel the package from the board. Such peeling forces reduce the solder joint
lifetime of the package. Recommended maximum force on the top of the package is 10 lb (4.5 kg) force.
If an adhesive attachment is planned, the adhesive should be intended for attachment to painted or plastic
surfaces and its performance verified under the application requirements.
23.3.1
Experimental Determination of the Junction Temperature with a
Heat Sink
When heat sink is used, the junction temperature is determined from a thermocouple inserted at the
interface between the case of the package and the interface material. A clearance slot or hole is normally
required in the heat sink. Minimizing the size of the clearance is important to minimize the change in
thermal performance caused by removing part of the thermal interface to the heat sink. Because of the
experimental difficulties with this technique, many engineers measure the heat sink temperature and then
back calculate the case temperature using a separate measurement of the thermal resistance of the
MPC8323E PowerQUICC™ II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3
Freescale Semiconductor
75
System Design Information
interface. From this case temperature, the junction temperature is determined from the junction-to-case
thermal resistance.
TJ = TC + (RθJC × PD)
where:
TC = case temperature of the package (°C)
RθJC = junction-to-case thermal resistance (°C/W)
PD = power dissipation (W)
24 System Design Information
This section provides electrical and thermal design recommendations for successful application of the
MPC8323E.
24.1
System Clocking
The MPC8323E includes three PLLs.
• The system PLL (AVDD2) generates the system clock from the externally supplied CLKIN input.
The frequency ratio between the system and CLKIN is selected using the system PLL ratio
configuration bits as described in Section 22.4, “System PLL Configuration.”
• The e300 core PLL (AVDD3) generates the core clock as a slave to the system clock. The frequency
ratio between the e300 core clock and the system clock is selected using the e300 PLL ratio
configuration bits as described in Section 22.5, “Core PLL Configuration.”
• The QUICC Engine PLL (AVDD1) which uses the same reference as the system PLL. The QUICC
Engine block generates or uses external sources for all required serial interface clocks.
24.2
PLL Power Supply Filtering
Each of the PLLs listed above is provided with power through independent power supply pins. The voltage
level at each AVDDn pin should always be equivalent to VDD, and preferably these voltages are derived
directly from VDD through a low frequency filter scheme such as the following.
There are a number of ways to reliably provide power to the PLLs, but the recommended solution is to
provide five independent filter circuits as illustrated in Figure 44, one to each of the five AVDD pins. By
providing independent filters to each PLL the opportunity to cause noise injection from one PLL to the
other is reduced.
This circuit is intended to filter noise in the PLLs resonant frequency range from a 500 kHz to 10 MHz
range. It should be built with surface mount capacitors with minimum effective series inductance (ESL).
Consistent with the recommendations of Dr. Howard Johnson in High Speed Digital Design: A Handbook
of Black Magic (Prentice Hall, 1993), multiple small capacitors of equal value are recommended over a
single large value capacitor.
MPC8323E PowerQUICC™ II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3
76
Freescale Semiconductor
System Design Information
Each circuit should be placed as close as possible to the specific AVDD pin being supplied to minimize
noise coupled from nearby circuits. It should be possible to route directly from the capacitors to the AV DD
pin, which is on the periphery of package, without the inductance of vias.
Figure 44 shows the PLL power supply filter circuit.
VDD
10 Ω
AVDD (or L2AVDD)
2.2 µF
2.2 µF
Low ESL Surface Mount Capacitors (<0.5 nH)
GND
Figure 44. PLL Power Supply Filter Circuit
24.3
Decoupling Recommendations
Due to large address and data buses, and high operating frequencies, the MPC8323E can generate transient
power surges and high frequency noise in its power supply, especially while driving large capacitive loads.
This noise must be prevented from reaching other components in the MPC8323E system, and the
MPC8323E itself requires a clean, tightly regulated source of power. Therefore, it is recommended that
the system designer place at least one decoupling capacitor at each VDD, OVDD, and GVDD pins of the
MPC8323E. These decoupling capacitors should receive their power from separate VDD, OVDD, GVDD,
and GND power planes in the PCB, utilizing short traces to minimize inductance. Capacitors may be
placed directly under the device using a standard escape pattern. Others may surround the part.
These capacitors should have a value of 0.01 or 0.1 µF. Only ceramic SMT (surface mount technology)
capacitors should be used to minimize lead inductance, preferably 0402 or 0603 sizes.
In addition, it is recommended that there be several bulk storage capacitors distributed around the PCB,
feeding the VDD, OVDD, and GVDD planes, to enable quick recharging of the smaller chip capacitors.
These bulk capacitors should have a low ESR (equivalent series resistance) rating to ensure the quick
response time necessary. They should also be connected to the power and ground planes through two vias
to minimize inductance. Suggested bulk capacitors—100–330 µF (AVX TPS tantalum or Sanyo OSCON).
24.4
Connection Recommendations
To ensure reliable operation, it is highly recommended to connect unused inputs to an appropriate signal
level. Unused active low inputs should be tied to OVDD, or GVDD as required. Unused active high inputs
should be connected to GND. All NC (no-connect) signals must remain unconnected.
Power and ground connections must be made to all external VDD, GVDD, OVDD, and GND pins of the
MPC8323E.
24.5
Output Buffer DC Impedance
The MPC8323E drivers are characterized over process, voltage, and temperature. For all buses, the driver
is a push-pull single-ended driver type (open drain for I2C).
To measure Z0 for the single-ended drivers, an external resistor is connected from the chip pad to OVDD
or GND. Then, the value of each resistor is varied until the pad voltage is OVDD/2 (see Figure 45). The
MPC8323E PowerQUICC™ II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3
Freescale Semiconductor
77
System Design Information
output impedance is the average of two components, the resistances of the pull-up and pull-down devices.
When data is held high, SW1 is closed (SW2 is open) and RP is trimmed until the voltage at the pad equals
OVDD/2. RP then becomes the resistance of the pull-up devices. RP and RN are designed to be close to each
other in value. Then, Z0 = (RP + RN)/2.
OVDD
RN
SW2
Pad
Data
SW1
RP
OGND
Figure 45. Driver Impedance Measurement
The value of this resistance and the strength of the driver’s current source can be found by making two
measurements. First, the output voltage is measured while driving logic 1 without an external differential
termination resistor. The measured voltage is V1 = Rsource × Isource. Second, the output voltage is measured
while driving logic 1 with an external precision differential termination resistor of value R term. The
measured voltage is V2 = (1/(1/R1 + 1/R2)) × Isource. Solving for the output impedance gives Rsource =
Rterm × (V1/V2 – 1). The drive current is then Isource = V1/Rsource.
Table 65 summarizes the signal impedance targets. The driver impedance are targeted at minimum VDD,
nominal OVDD, 105°C.
Table 65. Impedance Characteristics
Impedance
Local Bus, Ethernet, DUART, Control,
Configuration, Power Management
PCI
DDR DRAM
Symbol
Unit
RN
42 Target
25 Target
20 Target
Z0
W
RP
42 Target
25 Target
20 Target
Z0
W
Differential
NA
NA
NA
ZDIFF
W
Note: Nominal supply voltages. See Table 1, Tj = 105°C.
24.6
Configuration Pin Multiplexing
The MPC8323E provides the user with power-on configuration options which can be set through the use
of external pull-up or pull-down resistors of 4.7 kΩ on certain output pins (see customer visible
configuration pins). These pins are generally used as output only pins in normal operation.
MPC8323E PowerQUICC™ II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3
78
Freescale Semiconductor
Ordering Information
While HRESET is asserted however, these pins are treated as inputs. The value presented on these pins
while HRESET is asserted, is latched when HRESET deasserts, at which time the input receiver is disabled
and the I/O circuit takes on its normal function. Careful board layout with stubless connections to these
pull-up/pull-down resistors coupled with the large value of the pull-up/pull-down resistor should minimize
the disruption of signal quality or speed for output pins thus configured.
24.7
Pull-Up Resistor Requirements
The MPC8323E requires high resistance pull-up resistors (10 kΩ is recommended) on open drain type pins
including I2C pins, Ethernet Management MDIO pin, and IPIC interrupt pins.
For more information on required pull-up resistors and the connections required for the JTAG interface,
see AN3361, “MPC8321E/MPC8323E PowerQUICC™ Design Checklist,” Rev. 1.
25 Ordering Information
This section presents ordering information for the devices discussed in this document, and it shows an
example of how the parts are marked. Ordering information for the devices fully covered by this document
is provided in Section 25.1, “Part Numbers Fully Addressed by This Document.”
25.1
Part Numbers Fully Addressed by This Document
Table 66 provides the Freescale part numbering nomenclature for the MPC8323E family. Note that the
individual part numbers correspond to a maximum processor core frequency. For available frequencies,
contact your local Freescale sales office. In addition to the maximum processor core frequency, the part
numbering scheme also includes the maximum effective DDR memory speed and QUICC Engine bus
frequency. Each part number also contains a revision code which refers to the die mask revision number.
Table 66. Part Numbering Nomenclature
MPC
nnnn
Product
Part
Code Identifier
MPC
8323
E
C
VR
AF
D
C
A
Encryption
Acceleration
Temperature
Range1
Package2
e300 Core
Frequency3
DDR
Frequency
QUICC
Engine
Frequency
Revision
Level
Blank = Not
included
E = included
Blank = 0 to
105°C
C = –40 to
105°C
VR = Pb-free AD = 266 MHz D = 266 MHz C = 200 MHz Contact local
AF = 333 MHz
Freescale
PBGA
sales office
ZQ = Pb
PBGA
Notes:
1. Contact local Freescale office on availability of parts with C temperature range.
2. See Section 21, “Package and Pin Listings,” for more information on available package types.
3. Processor core frequencies supported by parts addressed by this specification only. Not all parts described in this specification
support all core frequencies. Additionally, parts addressed by Part Number Specifications may support other maximum core
frequencies.
MPC8323E PowerQUICC™ II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3
Freescale Semiconductor
79
Document Revision History
25.2
Part Marking
Parts are marked as in the example shown in Figure 46.
MPCnnnnetppaaar
core/platform MHZ
ATWLYYWW
CCCCC
*MMMMM
YWWLAZ
PBGA
Notes:
ATWLYYWW is the traceability code.
CCCCC is the country code.
MMMMM is the mask number.
YWWLAZ is the assembly traceability code.
Figure 46. Freescale Part Marking for PBGA Devices
26 Document Revision History
Table 67 provides a revision history for this hardware specification.
Table 67. Document Revision History
Rev.
No.
Date
3
12/2009
•
•
•
•
•
•
•
•
•
•
•
2
4/2008
• Removed Figures 2 and 3 overshoot and undershoot voltage specs from Section 2.1.2, “Power Supply
Voltage Specification,” and footnotes 4 and 5 from Table 1.
• Corrected QUIESCE signal to be an output signal in Table 55.
• Added column for GVDD (1.8 V) - DDR2 - to Table 6 with 0.212-W typical power dissipation.
• Added Figure 4 DDR input timing diagram.
• Removed CE_TRB* and CE_PIO* signals from Table 55.
• Added three local bus AC specifications to Table 30 (duty cycle, jitter, delay between input clock and
local bus clock).
• Added row in Table 2 stating junction temperature range of 0 to 105°C.
• Modified Section 2.2, “Power Sequencing,” to include PORESET requirement.
Substantive Change(s)
Removed references for note 4 from Table 1.
Added Figure 2 in Section 2.1.2, “Power Supply Voltage Specification.
Added symbol TA in Table 2.
Added footnote 2 in Table 2.
Added a note in Section 4, “Clock Input Timing for rise/fall time of QE input pins.
Modified CLKIN, PCI_CLK rise/fall time parameters in Table 8. Modified min value of tMCK in Table 19.
Modified Figure 43.
Modified formula for ce_clk calculation in Section 22.3, “System Clock Domains.
Added a note in Section 22.4, “System PLL Configuration.
Removed the signal ECID_TMODE_IN from Table 55.
Removed all references of RST signals from Table 55.
MPC8323E PowerQUICC™ II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3
80
Freescale Semiconductor
Document Revision History
Table 67. Document Revision History
Rev.
No.
Date
1
6/2007
Correction to descriptive text in Section 2.2.
0
6/2007
Initial release.
Substantive Change(s)
MPC8323E PowerQUICC™ II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3
Freescale Semiconductor
81
How to Reach Us:
Home Page:
www.freescale.com
Web Support:
http://www.freescale.com/support
USA/Europe or Locations Not Listed:
Freescale Semiconductor, Inc.
Technical Information Center, EL516
2100 East Elliot Road
Tempe, Arizona 85284
1-800-521-6274 or
+1-480-768-2130
www.freescale.com/support
Europe, Middle East, and Africa:
Freescale Halbleiter Deutschland GmbH
Technical Information Center
Schatzbogen 7
81829 Muenchen, Germany
+44 1296 380 456 (English)
+46 8 52200080 (English)
+49 89 92103 559 (German)
+33 1 69 35 48 48 (French)
www.freescale.com/support
Information in this document is provided solely to enable system and software
implementers to use Freescale Semiconductor products. There are no express or
implied copyright licenses granted hereunder to design or fabricate any integrated
circuits or integrated circuits based on the information in this document.
Freescale Semiconductor reserves the right to make changes without further notice to
any products herein. Freescale Semiconductor makes no warranty, representation or
guarantee regarding the suitability of its products for any particular purpose, nor does
Freescale Semiconductor assume any liability arising out of the application or use of
any product or circuit, and specifically disclaims any and all liability, including without
limitation consequential or incidental damages. “Typical” parameters which may be
provided in Freescale Semiconductor data sheets and/or specifications can and do
vary in different applications and actual performance may vary over time. All operating
parameters, including “Typicals” must be validated for each customer application by
customer’s technical experts. Freescale Semiconductor does not convey any license
Japan:
Freescale Semiconductor Japan Ltd.
Headquarters
ARCO Tower 15F
1-8-1, Shimo-Meguro, Meguro-ku
Tokyo 153-0064
Japan
0120 191014 or
+81 3 5437 9125
[email protected]
under its patent rights nor the rights of others. Freescale Semiconductor products are
Asia/Pacific:
Freescale Semiconductor China Ltd.
Exchange Building 23F
No. 118 Jianguo Road
Chaoyang District
Beijing 100022
China
+86 10 5879 8000
[email protected]
claims, costs, damages, and expenses, and reasonable attorney fees arising out of,
For Literature Requests Only:
Freescale Semiconductor
Literature Distribution Center
1-800 441-2447 or
+1-303-675-2140
Fax: +1-303-675-2150
LDCForFreescaleSemiconductor
@hibbertgroup.com
Document Number: MPC8323EEC
Rev. 3
02/2010
not designed, intended, or authorized for use as components in systems intended for
surgical implant into the body, or other applications intended to support or sustain life,
or for any other application in which the failure of the Freescale Semiconductor product
could create a situation where personal injury or death may occur. Should Buyer
purchase or use Freescale Semiconductor products for any such unintended or
unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor
and its officers, employees, subsidiaries, affiliates, and distributors harmless against all
directly or indirectly, any claim of personal injury or death associated with such
unintended or unauthorized use, even if such claim alleges that Freescale
Semiconductor was negligent regarding the design or manufacture of the part.
Freescale, the Freescale logo, CodeWarrior, ColdFire, PowerQUICC,
StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc.
Reg. U.S. Pat. & Tm. Off. CoreNet, QorIQ, QUICC Engine, and VortiQa are
trademarks of Freescale Semiconductor, Inc. All other product or service
names are the property of their respective owners. The Power Architecture
and Power.org word marks and the Power and Power.org logos and related
marks are trademarks and service marks licensed by Power.org. IEEE
802.11i, 802.3, and 1149.1 are registered trademarks of the Institute of
Electrical and Electronics Engineers, Inc. (IEEE). This product is not
endorsed or approved by the IEEE.
© 2010 Freescale Semiconductor, Inc.