BILIN BAV756DW Surface mount fast switching diode Datasheet

Production specification
Surface Mount Fast Switching Diodes
BAV756DW
FEATURES
Pb
z
Fast switching speed.
z
For general purpose switching application.
z
High conductance.
z
One BAV70 circuit and one BAW56 circuit in one package.
z
Easily connected as full wave bridge.
Lead-free
APPLICATIONS
z
SOT-363
For general purpose switching application.
ORDERING INFORMATION
Type No.
Marking
Package Code
BAV756DW
KCA
SOT-363
MAXIMUM RATING @ Ta=25℃ unless otherwise specified
Symbol
Characteristic
Value
Unit
VRM
Non-Repetitive Peak Reverse Voltage
100
V
VR
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Reverse Voltage
75
V
VR(RMS)
RMS Reverse Voltage
53
V
IO
Average Rectified Output Current
150
mA
2.0
1.0
A
IFSM
Non-Repetitive Peak Forward Surge Current
@t=1.0us
@t=1.0s
PD
Power Dissipation
200
mW
RθJA
Thermal Resistance, Junction to Ambient
625
℃/W
Tj,Tstg
Junction and Storage Temperature
-65 to +150
℃
G014
Rev.A
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1
Production specification
Surface Mount Fast Switching Diodes
BAV756DW
ELECTRICAL CHARACTERISTICS @ Ta=25℃ unless otherwise specified
Parameter
Symbol
Test conditions
MIN
V(BR)R
IR=2.5μA
75
IR
VR=75V
VR=75V,Tj=150℃
VR=25V,Tj=150℃
VR=20V
2.5
50
30
25
μA
μA
μA
nA
Forward voltage
VF
IF=1.0mA
IF=10mA
IF=50mA
IF=150mA
0.715
0.855
1.0
1.25
V
Total Capacitance
CT
VR=0V,f=1.0MHz
2.0
pF
Reverse Recovery time
trr
IF=IR=10mA,Irr=0.1*IR,
RL=100Ω
4.0
ns
Reverse breakdown voltage
Reverse voltage leakage current
MAX
UNIT
V
TYPICAL CHARACTERISTICS @ Ta=25℃ unless otherwise specified
G014
Rev.A
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2
Production specification
Surface Mount Fast Switching Diodes
BAV756DW
PACKAGE OUTLINE
Plastic surface mounted package
SOT-363
A
SOT-363
E
K
B
D
J
G
H
Dim
Min
Max
A
2.00
2.20
B
1.15
1.35
C
0.95 Typical
D
0.25 Typical
E
0.25
0.40
G
0.60
0.70
H
0.02
0.10
J
C
K
0.10 Typical
2.2
2.4
All Dimensions in mm
SOLDERING FOOTPRINT
0.40
0.65
0.65
0.50
Unit : mm
1.90
PACKAGE
INFORMATION
Device
Package
Shipping
BAV756DW
SOT-363
3000/Tape&Reel
G014
Rev.A
www.gmicroelec.com
3
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