Production specification Surface Mount Fast Switching Diodes BAV756DW FEATURES Pb z Fast switching speed. z For general purpose switching application. z High conductance. z One BAV70 circuit and one BAW56 circuit in one package. z Easily connected as full wave bridge. Lead-free APPLICATIONS z SOT-363 For general purpose switching application. ORDERING INFORMATION Type No. Marking Package Code BAV756DW KCA SOT-363 MAXIMUM RATING @ Ta=25℃ unless otherwise specified Symbol Characteristic Value Unit VRM Non-Repetitive Peak Reverse Voltage 100 V VR Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Reverse Voltage 75 V VR(RMS) RMS Reverse Voltage 53 V IO Average Rectified Output Current 150 mA 2.0 1.0 A IFSM Non-Repetitive Peak Forward Surge Current @t=1.0us @t=1.0s PD Power Dissipation 200 mW RθJA Thermal Resistance, Junction to Ambient 625 ℃/W Tj,Tstg Junction and Storage Temperature -65 to +150 ℃ G014 Rev.A www.gmicroelec.com 1 Production specification Surface Mount Fast Switching Diodes BAV756DW ELECTRICAL CHARACTERISTICS @ Ta=25℃ unless otherwise specified Parameter Symbol Test conditions MIN V(BR)R IR=2.5μA 75 IR VR=75V VR=75V,Tj=150℃ VR=25V,Tj=150℃ VR=20V 2.5 50 30 25 μA μA μA nA Forward voltage VF IF=1.0mA IF=10mA IF=50mA IF=150mA 0.715 0.855 1.0 1.25 V Total Capacitance CT VR=0V,f=1.0MHz 2.0 pF Reverse Recovery time trr IF=IR=10mA,Irr=0.1*IR, RL=100Ω 4.0 ns Reverse breakdown voltage Reverse voltage leakage current MAX UNIT V TYPICAL CHARACTERISTICS @ Ta=25℃ unless otherwise specified G014 Rev.A www.gmicroelec.com 2 Production specification Surface Mount Fast Switching Diodes BAV756DW PACKAGE OUTLINE Plastic surface mounted package SOT-363 A SOT-363 E K B D J G H Dim Min Max A 2.00 2.20 B 1.15 1.35 C 0.95 Typical D 0.25 Typical E 0.25 0.40 G 0.60 0.70 H 0.02 0.10 J C K 0.10 Typical 2.2 2.4 All Dimensions in mm SOLDERING FOOTPRINT 0.40 0.65 0.65 0.50 Unit : mm 1.90 PACKAGE INFORMATION Device Package Shipping BAV756DW SOT-363 3000/Tape&Reel G014 Rev.A www.gmicroelec.com 3