LITEON LTL1BEA4JLCH233 Through hole lamp Datasheet

Through Hole Lamp
Product Data Sheet
LTL1BEA4JLCH233
Spec No. :DS20-2017-0069
Effective Date: 08/09/2017
Revision: -
LITE-ON DCC
RELEASE
BNS-OD-FC001/A4
LITE-ON Technology Corp. / Optoelectronics
No.90,Chien 1 Road, Chung Ho, New Taipei City 23585, Taiwan, R.O.C.
Tel: 886-2-2222-6181 Fax: 886-2-2221-1948 / 886-2-2221-0660
http://www.liteon.com/opto
Through Hole Lamp
LTL1BEA4JLCH233
Through Hole Lamp
LTL1BEA4JLCH233
Rev
Description
By
Date
P001
Preliminary Specification ( RDR-20170027-01 )
Javy H.
5/05/2017
P002
Update the specification of pin length
Javy H.
5/15/2017
P003
Update Hue specification
Javy H.
6/19/2017
Above data for PD and Customer tracking only
-
New Specification Upload On OPNC
Chalerm Ya.
1/9
6/29/2017
Part No. : LTL1BEA4JLCH233
BNS-OD-FC002/A4
Through Hole Lamp
LTL1BEA4JLCH233
1. Description
CBI (Circuit Board Indicator) is a black plastic right angle Holder (Housing) which mates with Lite-On LED lamps. Lite-On CBI is
available in a wide variety of packages, including top-view (Spacer) or right angle and horizontal or vertical arrays which is
stackable and easy to assembly.
1. 1. Features
Designed for ease in circuit board assembly.
Black case enhance contrast ratio.
Solid state light source.
Low power consumption & High efficiency.
Lead free product & RoHS Compliant.
T-1 lamp: Emitted color is AlInGaP red/yellow green
bi-color with white diffused lens.
1.2. Applications
Communication.
Computer.
Consumer.
Industrial.
2. Outline Dimensions
Notes :
1.
2.
3.
4.
All dimensions are in millimeters (inches).
Tolerance is ±0.25mm (.010") unless otherwise noted.
The Holder (Housing) material is plastic black.
The LED lamp is red (super red)/yellow green bi-color, common cathode.
5. Specifications are subject to change without notice.
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Part No. : LTL1BEA4JLCH233
BNS-OD-FC002/A4
Through Hole Lamp
LTL1BEA4JLCH233
3. Absolute Maximum Ratings at TA=25°C
Parameter
Red
Yellow Green
Unit
75
75
mW
(Duty Cycle≦1/10, Pulse Width≦0.1ms)
90
60
mA
DC Forward Current
30
30
mA
Power Dissipation
Peak Forward Current
Operating Temperature Range
-30°C to + 85°C
Storage Temperature Range
-40°C to + 100°C
Lead Soldering Temperature
[2.0mm (.079") From Body]
260°C for 5 Seconds Max.
4. Electrical / Optical Characteristics at TA=25°C
Parameter
Radiant Intensity
Symbol
Color
Min.
Red
10
Peak Emission Wavelength
10
45
Yellow Green
45
Red
639
deg
nm
575
631
nm
568
Red
20
Yellow Green
11
570.5
Δλ
@Peak (Fig.1)
Note 3
nm
Red
1.5
2.0
2.3
Yellow Green
1.5
2.1
2.3
VF
V
Red
Reverse Current
Note 2 (Fig.6)
IF = 5mA
637
λd
563
Note 1,4
Measurement
λP
624
Test Condition
IF = 5mA
38
Red
Yellow Green
Forward Voltage
38
2θ1/2
Red
Spectral Line Half-Width
Unit
mcd
Yellow Green
Dominant Wavelength
Max.
Iv
Yellow Green
Viewing Angle
Typ.
IR
IF = 5mA
VR = 5V
100
μA
Yellow Green
Note 6
NOTE:
1. Luminous intensity is measured with a light sensor and filter combination that approximates the CIE eye-response curve.
2. θ1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity.
3. The dominant wavelength, λd is derived from the CIE chromaticity diagram and represents the single wavelength which defines
the color of the device.
4. Iv guarantee must be included with ±30% testing tolerance.
5. Reverse current is controlled by dice source.
6. Reverse voltage (VR) condition is applied for IR test only. The device is not designed for reverse operation.
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Part No. : LTL1BEA4JLCH233
BNS-OD-FC002/A4
Through Hole Lamp
LTL1BEA4JLCH233
5. Typical Electrical / Optical Characteristics Curves
(25°C Ambient Temperature Unless Otherwise Noted)
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Part No. : LTL1BEA4JLCH233
BNS-OD-FC002/A4
Through Hole Lamp
LTL1BEA4JLCH233
6. Packing Specification
PAPERBOARD
EMPTYTRAY
252Pcsx14TRAYS/ LOT
LOTTOTAL:3,528Pcs
1LOT/ INNERCARTON
TOTAL: 3,528Pcs
(I-CARTON: 300X165X130mm)
8I-CARTON/OUTERCARTON
TOTAL: 28,224Pcs
(O-CARTON: 610X350X280mm)
5/9
Part No. : LTL1BEA4JLCH233
BNS-OD-FC002/A4
Through Hole Lamp
LTL1BEA4JLCH233
7. Bin Table Specification
Luminous Intensity
Luminous Intensity
(Red)
(Green)
Bin Code
Bin Code
Unit : mcd @5mA
Min.
Max.
A
10
19
B
19
38
Unit : mcd @5mA
Min.
Max.
A
10
19
B
19
38
Note: Tolerance of each bin limit is ±30%
Green Dominant Wavelength Unit : nm @5mA
Bin Code
Min
Max
1
563.0
565.5
2
565.5
568.0
3
568.0
570.5
Note: Tolerance of each bin limit is ±1nm
Green Forward Voltage Vf Unit : V @5mA
Bin Code
Min
Max
1
1.5
1.7
2
1.7
1.9
3
1.9
2.1
4
2.1
2.3
Note: Tolerance of each bin limit is ±0.1V
6/9
Part No. : LTL1BEA4JLCH233
BNS-OD-FC002/A4
Through Hole Lamp
LTL1BEA4JLCH233
8. CAUTIONS
8.1. Application
This LED lamp is good for application of indoor and outdoor sign, also ordinary electronic equipment.
8.2. Storage
The storage ambient for the LEDs should not exceed 30°C temperature or 70% relative humidity. It is re commended that
LEDs out of their original packaging are used within three months. For extended storage out of their original packaging, it is
recommended that the LEDs be stored in a sealed container with appropriate desiccant or in desiccators with nitrogen
ambient.
8.3. Cleaning
Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LEDs if necessary.
8.4. Lead Forming & Assembly
During lead forming, the leads should be bent at a point at least 3mm from the base of LED lens. Do not use the base of the
lead frame as a fulcrum during forming. Lead forming must be done before soldering, at normal temperature. During assembly
on PCB, use minimum clinch force possible to avoid excessive mechanical stress.
8.5. Soldering
When soldering, leave a minimum of 2mm clearance from the base of the lens/Holder to the soldering point. Dipping the
lens/Holder into the solder must be avoided. Do not apply any external stress to the lead frame during soldering while the LED
is at high temperature.
Recommended soldering conditions:
Soldering iron
Temperature
Soldering time
Position
350°C Max.
3 seconds Max.
(one time only)
No closer than 2mm
from the base of the epoxy bulb/Holder
Wave soldering
Pre-heat
Pre-heat time
Solder wave
Soldering time
Dipping Position
120°C Max.
100 seconds Max.
260°C Max.
5 seconds Max.
No lower than 2mm from the
base of the epoxy bulb/Holder
Note: Excessive soldering temperature and/or time might result in deformation of the LED lens or catastrophic failure of the LED.
IR reflow is not suitable process for through hole type LED lamp product. Max temperature of wave soldering is not means
that Holder’s HDT/Melting temperature.
8.6. Drive Method
An LED is a current-operated device. In order to ensure intensity uniformity on multiple LEDs connected in parallel in an
application, it is recommended that a current limiting resistor be incorporated in the drive circuit, in series with each LED as
shown in Circuit A below.
Circuit model (A)
LED
Circuit model (B)
LED
(A) Recommended circuit
(B) The brightness of each LED might appear different due to the differences in the I-V characteristics of those LEDs.
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Part No. : LTL1BEA4JLCH233
BNS-OD-FC002/A4
Through Hole Lamp
LTL1BEA4JLCH233
8.7. ESD (Electrostatic Discharge)
Static Electricity or power surge will damage the LED.
Suggestions to prevent ESD damage:
Use a conductive wrist band or anti- electrostatic glove when handling these LEDs
All devices, equipment, and machinery must be properly grounded
Work tables, storage racks, etc. should be properly grounded
Use ion blower to neutralize the static charge which might have built up on surface of the LEDs plastic
lens as a result of friction between LEDs during storage and handing
Suggested checking list:
Training and Certification
8.7.1.1. Everyone working in a static-safe area is ESD-certified?
8.7.1.2. Training records kept and re-certification dates monitored?
Static-Safe Workstation & Work Areas
8.7.2.1. Static-safe workstation or work-areas have ESD signs?
8.7.2.2. All surfaces and objects at all static-safe workstation and within 1 ft measure less than 100V?
8.7.2.3. All ionizer activated, positioned towards the units?
8.7.2.4. Each work surface mats grounding is good?
Personnel Grounding
8.7.3.1. Every person (including visitors) handling ESD sensitive (ESDS) items wear wrist strap, heel strap or conductive shoes
with conductive flooring?
8.7.3.1. If conductive footwear used, conductive flooring also present where operator stand or walk?
8.7.3.2. Garments, hairs or anything closer than 1 ft to ESD items measure less than 100V*?
8.7.3.3. Every wrist strap or heel strap/conductive shoes checked daily and result recorded for all DLs?
8.7.3.4. All wrist strap or heel strap checkers calibration up to date?
Note: *50V for Blue LED.
Device Handling
8.7.4.1. Every ESDS items identified by EIA-471 labels on item or packaging?
8.7.4.2. All ESDS items completely inside properly closed static-shielding containers when not at static-safe workstation?
8.7.4.3. No static charge generators (e.g. plastics) inside shielding containers with ESDS items?
8.7.4.4. All flexible conductive and dissipative package materials inspected before reuse or recycle?
Others
8.7.5.1. Audit result reported to entity ESD control coordinator?
8.7.5.2. Corrective action from previous audits completed?
8.7.5.3. Are audit records complete and on file?
8/9
Part No. : LTL1BEA4JLCH233
BNS-OD-FC002/A4
Through Hole Lamp
LTL1BEA4JLCH233
9. Reliability Test
Classification
Endurance
Test Item
Test Condition
Sample Size
Reference Standard
Operation Life
Ta = Under room temperature
IF = per datasheet maximum drive
current
Test Time= 1000hrs
22 PCS
(CL=90%;
LTPD=10%)
High Temperature
High Humidity
storage
Ta = 60°C
RH = 90%
Test Time= 240hrs
22 PCS
(CL=90%;
LTPD=10%)
High Temperature
Storage
Ta= 105 ± 5°C
Test Time= 1000hrs
22 PCS
(CL=90%;
LTPD=10%)
MIL-STD-750D:1031 (1995)
MIL-STD-883G:1008 (2006)
JEITA ED-4701:200 201 (2001)
Low Temperature
Storage
Ta= -55 ± 5°C
Test Time= 1000hrs
22 PCS
(CL=90%;
LTPD=10%)
JEITA ED-4701:200 202 (2001)
Temperature
Cycling
100°C ~ 25°C ~ -40°C ~ 25°C
22 PCS
30mins
5mins
30mins 5mins (CL=90%;
LTPD=10%)
30 Cycles
MIL-STD-750D:1051 (1995)
MIL-STD-883G:1010 (2006)
JEITA ED-4701:100 105 (2001)
JESD22-A104C (2005)
Thermal
Shock
100 ± 5°C ~ -30°C ± 5°C
15mins
15mins
30 Cycles
(<20 secs transfer)
22 PCS
(CL=90%;
LTPD=10%)
MIL-STD-750D:1056 (1995)
MIL-STD-883G:1011 (2006)
MIL-STD-202G:107G (2002)
JESD22-A106B (2004)
Solder
Resistance
T.sol = 260 ± 5°C
Dwell Time= 10±1 seconds
3mm from the base of the epoxy bulb
11 PCS
(CL=90%;
LTPD=18.9%)
MIL-STD-750D:2031(1995)
JEITA ED-4701: 300 302 (2001)
Solderability
T. sol = 245 ± 5°C
11 PCS
Dwell Time= 5 ± 0.5 seconds
(CL=90%;
(Lead Free Solder, Coverage ≧95% of
LTPD=18.9%)
the dipped surface)
MIL-STD-750D:1026 (1995)
MIL-STD-883G:1005 (2006)
MIL-STD-202G:103B (2002)
JEITA ED-4701:100 103 (2001)
Test
Environmental
Test
Soldering Iron
T. sol = 350 ± 5°C
Dwell Time= 3.5 ± 0.5 seconds
11 PCS
(CL=90%;
LTPD=18.9%)
MIL-STD-750D:2026 (1995)
MIL-STD-883G:2003 (2006)
MIL-STD-202G:208H (2002)
IPC/EIA J-STD-002 (2004)
MIL-STD-202G:208H (2002)
JEITA ED-4701:300 302 (2001)
10. Others
The appearance and specifications of the product may be modified for improvement, without prior notice.
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Part No. : LTL1BEA4JLCH233
BNS-OD-FC002/A4
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