HLMP-Cxxx T-13/4 (5 mm) Precision Optical Performance InGaN Blue, Green and Cyan Lamps Data Sheet HLMP-CB15, HLMP-CB16, HLMP-CB30, HLMP-CB31, HLMP-CM15, HLMP-CM16, HLMP-CM30, HLMP-CM31, HLMP-CE15, HLMP-CE16, HLMP-CE23, HLMP-CE24, HLMP-CE30, HLMP-CE31 Description Features These high intensity blue, green and cyan LEDs are based on InGaN material technology. InGaN is the most efficient and cost effective material for LEDs in the blue and green region of the spectrum. The 472 nm typical dominant wavelength for blue and 526 nm typical dominant wavelength for green are well suited to color mixing in full color signs. The 505 nm typical dominant wavelength matches international specifications for green traffic signals. These LED lamps are untinted, nondiffused, T13/4 packages incorporating second generation optics which produce well defined spatial radiation patterns at specific viewing cone angles. These lamps are made with an advanced optical grade epoxy, offering superior high temperature and high moisture resistance performance in outdoor signal and sign applications. The high maximum LED junction temperature limit of +130°C enables high temperature operation in bright sunlight conditions. The package epoxy contains both UV-A and UV-B inhibitors to reduce the effects of long term exposure to direct sunlight. These lamps are available in two viewing angle for Green and Blue, and 3 viewing angles options for Cyan to give the designer flexibility with optical design. • Well defined spatial radiation pattern • Viewing angles: 15° , 23º and 30° • High luminous output • Colors: 472 nm Blue, 526 nm Green, 505 nm Cyan • Superior resistance to moisture • UV resistant epoxy Benefits • Superior performance in outdoor environments • Wavelengths suitable for color mixing in full color (RGB) signs Applications • Commercial outdoor signs • Automotive interior lights • Front panel indicators • Front panel backlighting CAUTION: HLMP-CBxx, HLMP-CMxx and HLMP-CExx LEDs are Class 1C ESD sensitive. Please observe appropriate precautions during handling and processing. Refer to Avago Application Note AN-1142 for additional details. Device Selection Guide Color and Typ. Dominant Wavelength λd (nm) [2] Min. Max. Leads with Stand-Offs Package Drawing HLMP-CB15-P00xx 15° Blue 472 880 - No A HLMP-CB15-QT0xx 15° Blue 472 1150 3200 No A HLMP-CB15-R00xx 15° Blue 472 1500 - No A HLMP-CB15-RSCxx 15° Blue 472 1500 2500 No A HLMP-CB16-P00xx 15° Blue 472 880 - Yes B HLMP-CB16-QT0xx 15° Blue 472 1150 3200 Yes B HLMP-CM15-S00xx 15° Green 526 1900 - No A Part Number Luminous Intensity, Iv (mcd) at 20 mA [3,4,5] Typical Viewing Angle 2q1/2 (Deg)[1] HLMP-CM15-SV0xx 15° Green 526 1900 5500 No A HLMP-CM15-VY0xx 15° Green 526 4200 12000 No A HLMP-CM15-W00xx 15° Green 526 5500 - No A HLMP-CM15-WXBxx 15° Green 526 5500 9300 No A HLMP-CM15-WZ0xx 15° Green 526 5500 16000 No A HLMP-CM16-S00xx 15° Green 526 1900 - Yes B HLMP-CM16-VY0xx 15° Green 526 4200 12000 Yes B HLMP-CM16-WYGxx 15° Green 526 5500 12000 Yes B HLMP-CE15-VWCxx 15° Cyan 505 4200 7200 No A HLMP-CE15-WZCxx 15° Cyan 505 5500 16000 No A HLMP-CE15-WZQxx 15° Cyan 505 5500 16000 No A HLMP-CE16-UXQxx 15° Cyan 505 3200 9300 Yes B HLMP-CE16-WZBxx 15° Cyan 505 5500 16000 Yes B HLMP-CE16-WZCxx 15° Cyan 505 5500 16000 Yes B HLMP-CE16-WZQxx 15° Cyan 505 5500 16000 Yes B HLMP-CE23-UVQxx 23° Cyan 505 3200 5500 No A HLMP-CE23-UXCxx 23° Cyan 505 3200 9300 No A HLMP-CE23-UXQxx 23° Cyan 505 3200 9300 No A HLMP-CE23-VWCxx 23° Cyan 505 4200 7200 No A HLMP-CE23-VWQxx 23° Cyan 505 4200 7200 No A HLMP-CE23-VXQxx 23° Cyan 505 4200 9300 No A HLMP-CE23-VYCxx 23° Cyan 505 4200 12000 No A HLMP-CE24-UX0xx 23° Cyan 505 3200 9300 Yes B HLMP-CE24-UXCxx 23° Cyan 505 3200 9300 Yes B HLMP-CE24-UXQxx 23° Cyan 505 3200 9300 Yes B HLMP-CE24-VXQxx 23° Cyan 505 4200 9300 Yes B HLMP-CE24-VYCxx 23° Cyan 505 4200 12000 Yes B HLMP-CE24-VYQxx 23° Cyan 505 4200 12000 Yes B Device Selection Guide (Continued) Luminous Intensity, Iv (mcd) at 20 mA [3,4,5] Typical Viewing Angle 2q1/2 (Deg)[1] Color and Typ. Dominant Wavelength λd (nm) [2] Min. Max. Leads with Stand-Offs Package Drawing HLMP-CB30-K00xx 30° Blue 472 310 - No A HLMP-CB30-M00xx 30° Blue 472 520 - No A HLMP-CB30-NPCxx 30° Blue 472 680 1150 No A HLMP-CB30-NRGxx 30° Blue 472 680 1900 No A HLMP-CB30-PQCxx 30° Blue 472 880 1500 No A HLMP-CB31-M00xx 30° Blue 472 520 - Yes B HLMP-CB31-NRGxx 30° Blue 472 680 1900 Yes B HLMP-CB31-PQCxx 30° Blue 472 880 1500 Yes B HLMP-CM30-M00xx 30° Green 526 520 - No A HLMP-CM30-RSBxx 30° Green 526 1500 2500 No A HLMP-CM30-S00xx 30° Green 526 1900 - No A HLMP-CM30-TUCxx 30° Green 526 2500 4200 No A HLMP-CM30-TW0xx 30° Green 526 2500 7200 No A HLMP-CM30-TWAxx 30° Green 526 2500 7200 No A HLMP-CM30-UVAxx 30° Green 526 3200 5500 No A HLMP-CM30-UVCxx 30° Green 526 3200 5500 No A HLMP-CM31-M00xx 30° Green 526 520 - Yes B HLMP-CM31-S00xx 30° Green 526 1900 - Yes B HLMP-CM31-S0Dxx 30° Green 526 1900 - Yes B HLMP-CM31-TUCxx 30° Green 526 2500 4200 Yes B HLMP-CM31-TW0xx 30° Green 526 2500 7200 Yes B HLMP-CM31-TWAxx 30° Green 526 2500 7200 Yes B HLMP-CM31-UVCxx 30° Green 526 3200 5500 Yes B HLMP-CM31-VWCxx 30° Green 526 4200 7200 Yes B HLMP-CE30-RSCxx 30° Cyan 505 1500 2500 No A HLMP-CE30-RUCxx 30° Cyan 505 1500 4200 No A HLMP-CE30-STQxx 30° Cyan 505 1900 3200 No A HLMP-CE30-SVCxx 30° Cyan 505 1900 5500 No A HLMP-CE30-SVQxx 30° Cyan 505 1900 5500 No A HLMP-CE31-SVCxx 30° Cyan 505 1900 5500 Yes B HLMP-CE31-SVQxx 30° Cyan 505 1900 5500 Yes B Part Number Notes: 1. q1/2 is the off-axis angle where the luminous intensity is one half the on-axis intensity. 2. Dominant Wavelength, λd, is derived from the CIE Chromaticity. Diagram and represents the color of the lamp. 3. The luminous intensity is measured on the mechanical axis of the lamp package. 4. The optical axis is closely aligned with the package mechanical axis. 5. Tolerance for each intensity bin limit is ±15%. Part Numbering System HLMP - X X XX - X X X XX Mechanical Options 00: Bulk DD: Ammo Pack YY: Flexi bin, Bulk ZZ: Flexi bin, Ammo Pack Color Bin Selection 0: Full color range A: Color bin 1 & 2 only B: Color bin 2 & 3 only C: Color bin 3 & 4 only G: Color bin 2, 3 & 4 only Q: Color bin 7 & 8 only Maximum Intensity Bin 0: No maximum Iv bin limit Others: Refer to Intensity Bin Limit Table Minimum Intensity Bin Refer to Device Selection Guide Viewing Angle and Standoff Options 15: 15 degree without standoff 16: 15 degree with standoff 23: 23 degree without standoff 24: 23 degree with standoff 30: 30 degree without standoff 31: 30 degree with standoff Color B: Blue M: Green E: Cyan Package C: T-1 3/4 (5 mm) round lamp Package Dimensions Package B Package A 5.00 ± 0.20 (0.197 ± 0.008) 5.00 ± 0.20 (0.197 ± 0.008) 8.71 ± 0.20 (0.343 ± 0.008) 1.14 ± 0.20 (0.045 ± 0.008) 0.70 (0.028) MAX. d 31.60 MIN. (1.244) CATHODE LEAD CATHODE LEAD CATHODE FLAT 0.50 ± 0.10 (0.020 ± 0.004) SQ. TYP. 5.80 ± 0.20 (0.228 ± 0.008) 1.00 MIN. (0.039) CATHODE FLAT 2.54 ± 0.38 (0.100 ± 0.015) HLMP-Cx16 HLMP-Cx24 HLMP-Cx31 d = 12.6 ± 0.18 d = 12.40 ± 0.25 d = 12.22 ± 0.50 (0.496 ± 0.007) (0.488 ± 0.010) (0.481 ± 0.020) Notes: 1. Dimensions in mm. 2. Tolerance ± 0.1 mm unless otherwise noted. 1.14 ± 0.20 (0.045 ± 0.008) 2.35 (0.093) MAX. 31.60 MIN. (1.244) 1.00 MIN. (0.039) 8.71 ± 0.20 (0.343 ± 0.008) 1.50 ± 0.15 (0.059 ± 0.006) 0.70 (0.028) MAX. 0.50 ± 0.10 (0.020 ± 0.004) SQ. TYP. 5.80 ± 0.20 (0.228 ± 0.008) 2.54 ± 0.38 (0.100 ± 0.015) Absolute Maximum Ratings at TA= 25°C Parameter Value Units DC Forward Current [1] 30 mA Peak Forward Current 100 mA Power Dissipation Blue Green / Cyan 111 117 Reverse Voltage (IR= 100 µA) 5 V LED Junction Temperature 130 °C Operating Temperature Range -40 to +80 °C Storage Temperature Range -40 to +100 °C mW Note: 1. Derate linearly as shown in Figure 4 for temperatures above 50°C. 2. Duty Factor 10%, 1kHz Electrical/Optical Characteristics at TA = 25°C Parameter Symbol Forward Voltage Blue Green / Cyan VF Reverse Voltage VR Peak Wavelength Blue (λd = 472 nm) Green (λd = 526 nm) Cyan (λd = 505 nm) lpeak Spectral Halfwidth Blue (λd = 472 nm) Green (λd = 526 nm) Cyan (λd = 505 nm) Dl1/2 Capacitance Blue/ Green Cyan C Luminous Efficacy Blue (λd = 472 nm) Green (λd = 526 nm) Cyan (λd = 505 nm) ηv Thermal Resistance RqJ-PIN Min. Typ. Max. 3.2 3.2 3.7 3.9 Units Test Conditions V IF= 20 mA 5 IR = 100 µA nm Peak of Wavelength of Spectral Distribution at IF = 20 mA nm Wavelength Width at Spectral Power Point at IF = 20 mA pF VF = 0, F = 1 MHz lm/W Emitted Luminous Power/Emitted Radiant Power °C/W LED Junction-to-Cathode Lead 470 524 502 35 47 35 43 40 75 520 350 240 Notes: 1. The dominant wavelength, ld, is derived from the CIE Chromaticity Diagram and represents the perceived color of the device. 2. The radiant intensity, le in watts per steradian, may be found from the equation le = IV/hV, where Iv is the luminous intensity in candelas and hV is the luminous efficacy in lumens/watt. 35 Cyan FORWARD CURRENT - mA RELATIVE INTENSITY 1.0 0.9 Blue 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 380 430 Green 480 530 580 630 WAVELENGTH - nm 680 730 15 Blue 10 5 0 0.5 1 1.5 2 2.5 FORWARD VOLTAGE - V 3 3.5 4 40 I F - FORWARD CURRENT - mA INTENSITY NORMALIZED AT 20 mA Green/ Cyan 20 Figure 2 : Forward current vs. forward voltage. 1.5 1.0 0.5 0 10 20 15 I F - FORWARD CURRENT - mA 5 25 35 30 25 20 15 10 5 0 30 Figure 3. Relative luminous intensity vs. forward current. 0 20 40 60 80 TA - AMBIENT TEMPERATURE - oC 100 Figure 4. Maximum forward current vs. ambient temperature. 1.030 0.9 1.025 1.020 NORMALIZED INTENSITY RELATIVE DOMINANT WAVELENGTH - nm 25 0 780 Figure 1. Relative intensity vs. wavelength. 0 30 1.015 1.010 Blue Cyan 1.005 Green 1.000 0.995 0.990 0 5 10 15 20 25 30 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 -30 35 DC FORWARD CURRENT - mA -20 -10 0 10 30 20 ANGULAR DISPLACEMENT - DEGREES Figure 5. Color vs. forward current Figure 6. Spatial radiation pattern – 15° lamps. 1.0 NORMALIZED INTENSITY RELATIVE INTENSITY 0.9 0.5 0 -50 -40 -30 -20 -10 0 10 ANGLE - DEGREES Figure 7. Spatial radiation pattern – 23° lamps. 20 30 40 50 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 -40 -30 -20 -10 0 10 20 ANGULAR DISPLACEMENT - DEGREES Figure 8. Spatial radiation pattern – 30° lamps. 30 40 Color Bin Limits (nm at 20 mA) Blue Bin ID 1 2 3 4 5 Intensity Bin Limits Color Range (nm) Min. 460.0 464.0 468.0 472.0 476.0 Bin Name K L M N P Q R S T U V W X Y Z Max. 464.0 468.0 472.0 476.0 480.0 Tolerance for each bin limit is ± 0.5 nm. Green Bin ID 1 2 3 4 5 Color Range (nm at 20mA) Min. Max. 520.0 524.0 524.0 528.0 528.0 532.0 532.0 536.0 536.0 540.0 Note: 1. All bin categories are established for classification of products. Products may not be available in all bin categories. Please contact your Avago representatives for further information. Color Range (nm) Min. Max. 495 500 505 498 503 500 505 510 503 508 Tolerance for each bin limit is ± 0.5 nm Relative Light Output vs. Junction Temperature 1.6 RELATIVE LIGHT OUTPUT ( NORMALIZED AT TJ = ºC) 1.4 Cyan 1.2 Green Blue 1 0.8 0.6 0.4 0.2 0 -40 -20 0 20 40 60 80 TJ - JUNCTION TEMPERATURE -°C Max. 400 520 680 880 1150 1500 1900 2500 3200 4200 5500 7200 9300 12000 16000 Tolerance for each intensity bin limit is ± 15%. Tolerance for each bin limit is ± 0.5 nm. Cyan Bin ID 1 2 3 4 7 8 Min. 310 400 520 680 880 1150 1500 1900 2500 3200 4200 5500 7200 9300 12000 100 120 140 Precautions: Avago Technologies LED configuration Lead Forming: • The leads of an LED lamp may be performed or cut to length prior to insertion and soldering on PC board. • If lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress that induced into the LED package. Otherwise, cut the leads to applicable length after soldering process at room temperature. The solder joint formed will absorb the mechanical stress, due to the lead cutting, from traveling to the LED chip die attach and wirebond. • For better control, it is recommended to use proper tool to precisely form and cut the leads to applicable length rather than doing it manually. Soldering condition: • Care must be taken during PCB assembly and soldering process to prevent damage to the LED component. • The closest manual soldering distance of the soldering heat source (soldering iron’s tip) to the body is 1.59mm. Soldering the LED closer than 1.59mm might damage the LED. 1.59mm Cathode Note: Electrical connection between bottom surface of LED die and the lead frame material through conductive paste of solder. • If necessary, use fixture to hold the LED component in proper orientation with respect to the PCB during soldering process. • At elevated temperature, the LED is more susceptible to mechanical stress. Therefore, PCB must allowed to cool down to room temperature prior to handling, which includes removal of jigs, fixtures or pallet. • Special attention must be given to board fabrication, solder masking, surface platting and lead holes size and component orientation to assure the solderability. • Recommended PC board plated through holes size for LED component leads. • Recommended soldering condition: Wave Soldering Manual Solder Dipping Pre-heat temperature 105 °C Max. - Preheat time 30 sec Max - Peak temperature 250 °C Max. 260 °C Max. Dwell time 3 sec Max. 5 sec Max • Wave soldering parameter must be set and maintain according to the recommended temperature and dwell time. Customer is advised to daily check on the soldering profile to ensure that the soldering profile is always conforming to recommended soldering condition. Note: 1. PCB with different size and design (component density) will have different heat mass (heat capacity). This might cause a change in temperature experienced by the board if same wave soldering setting is used. So, it is recommended to re-calibrate the soldering profile again before loading a new type of PCB. 2. Avago Technologies’ high brightness LED are using high efficiency LED die with single wire bond as shown below. Customer is advised to take extra precaution during wave soldering to ensure that the maximum wave temperature is not exceeding 250°C. Over-stressing the LED during soldering process might cause premature failure to the LED due to delamination. LED component lead size Diagonal Plated through hole diameter 0.457 x 0.457 mm (0.018 x 0.018 inch) 0.646 mm (0.025 inch) 0.976 to 1.078 mm (0.038 to 0.042 inch) 0.508 x 0.508 mm (0.020 x 0.020 inch) 0.718 mm (0.028 inch) 1.049 to 1.150 mm (0.041 to 0.045 inch) • Over sizing of plated through hole can lead to twisting or improper LED placement during auto insertion. Under sizing plated through hole can lead to mechanical stress on the epoxy lens during clinching. Note: Refer to application note AN1027 for more information on soldering LED components. Recommended Wave Soldering Profile LAMINAR WAVE TURBULENT WAVE HOT AIR KNIFE 250 TEMPERATURE - °C 200 TOP SIDE OF PC BOARD BOTTOM SIDE OF PC BOARD 150 CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN) PREHEAT SETTING = 150°C (100°C PCB) SOLDER WAVE TEMPERATURE = 245°C ± 5˚C AIR KNIFE AIR TEMPERATURE = 390°C AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.) AIR KNIFE ANGLE = 40 SOLDER: SN63; FLUX: RMA LEAD FREE SOLDER 96.5%Sn; 3.0%Ag; 0.5% Cu FLUXING 100 50 30 NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED BEFORE EXERTING MECHANICAL FORCE. PREHEAT 0 10 20 30 40 50 60 70 80 90 100 TIME - SECONDS Ammo Packs Drawing 6.35±1.30 0.25±0.0512 12.70±1.00 0.50±0.0394 CATHODE 20.50±1.00 0.807±0.039 9.125±0.625 0.3593±0.0246 18.00±0.50 0.7087±0.0197 12.70±0.30 0.50±0.0118 A 0.70±0.20 0.0276±0.0079 A ∅4.00±0.20TYP. 0.1575±0.008 VIEW A-A Note: The ammo-packs drawing is applicable for packaging option –DD & -ZZ and regardless standoff or non-standoff 10 Packaging Box for Ammo Packs Note: For InGaN device, the ammo pack packaging box contain ESD logo DISCLAIMER AVAGO TECHNOLOGIES’ PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR AUTHORIZED FOR SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE OR DIRECT OPERATION OF A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE. For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited in the United States and other countries. Data subject to change. Copyright © 2007 Avago Technologies Limited. All rights reserved. AV02-0213EN - March 21, 2007