ATMEL ATC18RHA Comprehensive library of standard logic and i/o cell Datasheet

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Comprehensive Library of Standard Logic and I/O Cells
Up to 6.5 usable Mgates equivalent NAND2
Operating voltage 1.8V for core and 3.3V or 2.5V for I/O’s
Memory Cells Compiled or synthesized to the Requirements of the Design
EDAC Library
Cold Sparing Buffers
High Speed LVDS Buffers (655Mbps)
PCI Buffers
MQFP Package Up to 352 Pins (336 Signal Pins)
MLGA Packages Up to 625 Pins (575 Signal Pins)
ESD better than 2000V for I/O and better than 1000V for PLL
Predefined Die Sizes to Accommodate Standardized Packages
Space Multi Project Wafer - SMPW - possibility
No single event latch-up below a LET threshold of 95 Mev/mg/cm² at 125°C
SEU hardened flip-flops
Tested up to a total dose of 300 krads (Si) according to Mil Std 883 Test Method 1019
Quality Grades: QML-Q and QML-V with 5962-06B02, ESCC 9000
Description
The ATC18RHA asic family provides high-performance and high-density solutions for
space applications. ATC18RHA is fabricated on a 0.18 µm, five-metal-layers CMOS
process intended for use with a supply voltage of 1.8V for core. It offers up to 6.5 million routable gates and more than 800 pads.
Rad. Hard
0.18 µm CMOS
Cell-based ASIC
for Space Use
ATC18RHA
The ATC18RHA family is supported by a combination of state-of-art third-party and
proprietary design tools: Synopsys, Mentor and Cadence are the reference front end
and back end tools suppliers.
The ATC18RHA asic family is available in several quality assurance grades, such as
Mil-Prf 38535 QML-Q and QML-V and ESCC 9000.
4261G–AERO–02/11
Overview
Introduction
The ASIC “ATC18RHA Design Manual” presents all the required information and flows for
0.18µm designs for aerospace applications, allowing users to view Atmel specific or standard
commercial tool kits and methodological details for actual implementations.
This offering is a 0.18µm CMOS technology based, specified with the 3.3V or 2.5V range for the
periphery (it should be noticed that mixed supply is not allowed), and with the 1.8V range for the
core. The technology parameters and some extra features are described here after.
Periphery
Buffers Description
The peripheral buffer, so called pad, is the electrical interface between the external signals (voltage range from 2.3 to 3.6V) and the internal core signals (from 1.65 to 1.95V).
All I/O pads are Cold Sparing and tolerant, they contains:
• Bidirectional pads
• Tristate Output pads
• Output Only pads
• Input Only pads (Inverting,Non-Inverting,Schmitt Trigger)
Furthermore the Bidirectional, Tristate Ouputs and Input Only pads are available with or without
Pull-Up or Pull-Down structures.
Specific pads have been developed in 3.3V and 2.5V:
• LVDS transmitter and Receiver differential pads
Cold sparing and tolerant only when they are disabled (ien=’1’ or oen=’1’)
• LVPECL Receiver differential pads
And, in 3.3V only:
• Cold sparing PCI Bidirectional, Tristate Output and Output Only pads
Clusters
The periphery of the chip (pad ring) can be split into several I/O segments (I/O clusters), some
clusters can be unpowered while others are active.
A specific Power control line is distributed inside the cluster to be able to force all the I/Os of the
cluster in tristate mode whatever their initial state is (ie: an output only buffer will also be turned
to HiZ mode).
Double Pad Ring
In order to increase the number of programmable I/O’s, Atmel proposes the double pad ring configuration. The number of pads on the inner ring will be tailored to the actual need of each
design.
Core supplies are automatically routed to the inner ring. As long as the inner ring of the double
pad ring configuration is used only for core supply pads, the designs are produceable to space
quality levels. During feasibility study, an investigation will be conducted to evaluate if additional
pads, and how many, can be added in the inner ring to be used as I/O’s and still be produced in
space quality level. Anyhow, the resulting total number of pads in the inner ring will not go above
maximum number given in table 2.
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ATC18RHA
Core
Standard cell library
The Atmel Standard Cell Library contains a comprehensive set of a combination of logic and
storage cells, including cells that belong to the following categories:
• Buffers and Gates
• PLL
• Multiplexers
• Standard and SEU Hardened Flip-flops
• Standard and SEU Hardened Scan Flip-flops
• Latches
• Adders and Subtractors
Memory Hard Blocks
The ATC18RHA memory libraries are developed from Virage memory compilers. All these memories are synchronous.
It can compile single-port synchronous SRAM, dual port (2RW) synchronous SRAM and Twoport (1W,1R) synchronous Register-File.
For maximum block sizes, see the design manual.
Array Organization
Though ATC18RHA is a standard cell library, pre-defined matrix sizes and pad frames have
been set so as to ease the assembly of every individual ASIC design by sticking to presently
available package cavity sizes and layouts. These are close in size to MH1RT matrix sizes.
The following tables give, for each matrix, for a single or a double pad ring configuration, the
maximum number of pads on the outer ring, the maximum number of pads implementable on the
inner ring, and the resulting typical gate count capability of each matrix.
Table 1. Single Pad Ring Standard Arrays Dimensions and Integration Capabilities
Name
MH1RT Equivalence
Size (mm)
Pads
Usable Gates (typ)
ATC18RHA95_216
NA
6.19x6.19
216
1M
ATC18RHA95_324
MH1099E
8.76x8.76
324
2.2M
ATC18RHA95_404
MH1156E
10.66x10.66
404
3.5M
ATC18RHA95_504
MH1242E
13.03x13.03
504
5.5M
ATC18RHA95_544
NA
14.03x14.03
544
6.5M
Table 2. Double Pad Ring Standard Arrays Dimensions and Integration Capabilities
Outer Ring Programmable
Pads
Inner Ring Max
Number of Pads
Size (mm)
Usable Gates (typ)
ATC18RHA95_216D
216
88
6.19x6.19
0.725M
ATC18RHA95_324D
324
140
8.76x8.76
1.8M
ATC18RHA95_404D
404
180
10.66x10.66
2.97M
ATC18RHA95_504D
504
232
13.03x13.03
4.83M
ATC18RHA95_544D
544
252
14.03x14.03
5.71M
Name
3
4261G–AERO–02/11
Design
Management
Introduction
Atmel used to propose different design modes, where each mode indicated the designer responsibilities, the design location and the design tools. With designs becoming more complex, timing
and power constraints more severe, and design behaviour more technology dependent, Atmel
believes that any design must be a close cooperation between the customer and the manufacturer. Therefore, only one design scenario is retained: the ASIC chip is designed by the
customer, at his site with a set of design tools supported by Atmel.
Design Phases
The development of an ASIC chip can be split into 4 main phases.
A meeting is set between each phase.
Figure 1. Design Management Phases
During the review meetings, the conformity of the design to Atmel rules is checked and acknowledged in formal documents, and the data is transferred to the next phase. The content of each
phase and responsibilities are described in the ‘ATC18RHA design manual’.
Deliverables
Table 3. Deliverables at the end of each phase
DESIGN PHASE
DELIVERABLE
WHO
FEASIBILITY STUDY
ASIC feasibility study report (APF-tc-FSR-project code).
Design start review document (APF-tc-DSR-project code).
Atmel
ASIC logic review document (APF-tc-LR-project code) +
Files as required in the document.
CUSTOMER
Updated DSR document
Atmel
ASIC design review document (APF-tc-DR-project code) +
Files as required in the document.
CUSTOMER
PHYSICAL DESIGN
Updated DSR document
Atmel
PROTOTYPES MANUFACTURING
& TEST
Packaged parts and associated documents
Atmel
LOGIC DESIGN
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ATC18RHA
4261G–AERO–02/11
ATC18RHA
Design Flows
Introduction
This chapter summarizes the design flow with reference to different platforms used for Cell
based chip design. For further details, refer to the ATC18RHA design manual.
Figure 2. Global design flow
Atmel Package Assistant is running on SUN stations under SOLARIS and on LINUX PC (RedHat distribution from version 7.0). Design Kits are compatible with both platforms depending on
third party tools availability. Hardware platform memory requirement is design dependant.
Design Kit
The use of both external and internal ICCAD tools requires the modelization of each library element. The set of required files for all the supported CAD tools relevant to the ATC18RHA family
is called the ATC18RHA Design Kit. These files describe the functionality, including or not timings and other attributes, with respect to each targeted tools modelization features and methods.
The design kit contains relevant descriptions of standard cells and peripheral cells, given for different pre-defined ranges of temperature, voltage and process.
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4261G–AERO–02/11
Design flow
The Design flow can be described in two sections.
The front-end done at
the customer’s
premises
The following table lists the activities and tools that will be used during the front-end
design.Tools in bold are included in the ‘ATC18RHA design kit’.
Table 4. Front-end tools
Function
6
Tool
Supplier
RTL simulation
MODELSIM
MENTOR
Code coverage
VHDL-COVER
TRANSEDA
HDL synthesis
DESIGN-COMPILER
SYNOPSYS
Physical synthesis
DC TOPO, ICC
SYNOPSYS
Power optimization
POWER-COMPILER
SYNOPSYS
Power analysis
PrimetimePX
SYNOPSYS
DFTC
SYNOPSYS
DFT tools
DFT SUITE
MENTOR
Gate level simulation
MODELSIM
MENTOR
Design rules check
STAR
Atmel
ATC18RHA
4261G–AERO–02/11
ATC18RHA
The back-end at Atmel
Technical Centers
Provided that the front-end activity has been validated and accepted by Atmel during the Logic
Review (LR) meeting, the following table lists the activities and the tools that will be used during
the back-end design
Table 5. Back-end tools
Activities
Bonding diagram
Physical implementation
Function
Supplier
Array Definition
Mgtechgen
Atmel
Bonding diagram
Pimtool
Atmel
Pads pre-placement
P2def
Atmel
Periphery check
COP
Atmel
IBIS model
Genibis
Atmel
Blocks Preplacement
Silver
Atmel
Virtual Layout Prototyping
First Encounter
CADENCE
Physical Knowledgeable Synthesis
FE OPT.
CADENCE
Power routing
Snow
Atmel
Placement
FE Place
CADENCE
Scan chains ordering
FE Place
CADENCE
Clock tree synthesis
FE CTS
CADENCE
Routing
Nanoroute
CADENCE
Final violation fix
FE OPT.
CADENCE
Eco Place and route
FE
CADENCE
Layout edition
Silver
Atmel
3D extraction
Star-RCXT
SYNOPSYS
Static timing analysis
Prime time
SYNOPSYS
Equivalence checking
Formality
SYNOPSYS
Modelsim
MENTOR
Nc-sim
CADENCE
Consumption analysis
PrimetimePX
SYNOPSYS
Power scheme check
Voltagestorm
CADENCE
Cross talk analysis
Celtic
CADENCE
Cross talk errors fix
Nanoroute
CADENCE
Final analysis
Celtic-NDC
CADENCE
Test patterns
TVT
Atmel
GDSII generation
SE2GDS
Atmel
Back-annotated simulation
Final verifications
Tool
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Space Multi
Project Wafer
Atmel proposes a Multi Projects Wafer service, so called SMPW, in order to decrease the cost of
reticules and silicon by sharing them over several designs. Specific milestones have been created to coordinate the activities and guarantee that there will be no interaction between
customer designs.
Main milestones are the Logic Review Closing Date (LRCD) and the Design Review Closing
Date (DRCD). The LR meeting must be held prior to LRCD and the DR meeting prior to DRCD.
For each SMPW, those dates are known in advance.
Any questions related to SMPW service can be addressed to the hotline, at [email protected].
Advanced
Packaging
The ATC18RHA Series are offered in ceramic packages: multi layers quad flat packs (MQFP)
with up to 352 pins and a multi layer land grid array (MLGA) with up to 625 lands.
The following table provides the standard matrix / package combination in single and double ring
configuration.
In addition, Atmel proposes custom packages development for specific requirements.
Table 6. Dice/Packages standardized combinations
ATC18RHA95
_216
MQFPT352
ATC18RHA95
_324
ATC18RHA95
_404
ATC18RHA95
_504
X
X
X
X
X
MQFPF256
X
X
MQFPF196
X
X
MQFPF160
X
X
MQFPF100
X
AlN MLGA625
X
MLGA625
X
MLGA472
MLGA349
Testability
Techniques
ATC18RHA95
_544
X
X
X
X
X
X
For complex designs, involving blocks of memory and/or cores, careful attention must be given
to design-for-test techniques. The sheer size of complex designs and the number of functional
vectors that would need to be created to exercise them fully, strongly suggests the use of more
efficient techniques. Combinations of SCAN paths, multiplexed access to memory and/or core
blocks, and built-in-self-test logic must be employed, in addition to functional test patterns, to
provide both the user and Atmel the ability to test the finished product.
An example of a highly complex design could include a PLL for clock management or synthesis,
a microcontroller or DSP engine or both, SRAM to support the microcontroller or DSP engine,
and glue logic to support the interconnectivity of each of these blocks. The design of each of
these blocks must take into consideration the fact that the manufactured device will be tested on
a high performance digital tester. Combinations of parametric, functional, and structural tests,
defined for digital testers, should be employed to create a suite of manufacturing tests.
The type of block dictates the type of testability technique to be employed. The PLL will, by construction, provide access to key nodes so that functional and/or parametric testing can be
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ATC18RHA
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ATC18RHA
performed. Since a digital tester must control all the clocks during the testing of chip, provision
must be made for the VCO to be bypassed. Atmel’s PLLs include a multiplexing capability for
just this purpose. The addition of a few pins will allow other portions of the PLL to be isolated for
test, without impinging upon the normal functionality.
In a similar vein, access to microcontroller, DSP, and SRAM blocks must be provided so that
controllability and observability of the inputs and outputs to the blocks are achieved with the minimum amount of preconditioning. SRAM blocks need to provide access to both address and data
ports so that comprehensive memory tests can be performed. Multiplexing I/O pins provides a
method for providing this accessibility.
The glue logic can be designed using full SCAN techniques to enhance its testability.
It should be noted that, in almost all of these cases, the purpose of the testability technique is to
provide Atmel a means to assess the structural integrity of the chip, i.e., sort devices with manufacturing-induced defects. All of the techniques described above should be considered
supplemental to a set of patterns which exercise the functionality of the design in its anticipated
operating modes.
Radiation
Hardness
ATC18RHA Asics are designed and processed to be Rad-Hard. The ATC18RHA standard cell
library encompasses all the specific functions and buffers necessary for space designs, such as
LVDS transmitters and receivers, PCI buffers, SEU hardened DFFs and cold sparing buffers.
Key radiation-tolerance parameters are controlled and monitored.
Table 7. Radiation-Tolerance key parameters
Parameter
Radiation Hardness
Assurance
TID (1,2)
Total Ionizing Dose
100 krads(Si)
SEU(1, 3)
Single Event Upset
< 4.10-11 errors/bit-day
SEL (1, 4)
Single Event Latch-up
LET > 95 MeV/mg/cm² at 125°C
Notes:
(1) Report available under request, after Non-Disclosure Agreement
(2) Co-60 testing, in compliance with Mil-Std 883 TM 1019.5: Tested at 25°C, with a total dose rate of 300
rad/h and a total dose of 300 krad(Si)
(3) Based on hardened DFF included in a SEC (Standard Evaluation Circuit), at 1.65V for core, 3V for I/O’s
and 25°C.
(4) In worst case: 1.95V for core, 3.6V for I/O’s
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4261G–AERO–02/11
Electrical Characteristics
Absolute Maximum Ratings
*NOTICE:
Core Supply Voltage VDD .....................................-0.3V to +2V
This absolute maximum ratings voltage is the
maximum voltage that guarantees that the
device will not be burned if those maximum voltages are applied during a very limited period of
time. This is not a guarantee of functionality or
reliability. The users must be warned that if a
voltage exceeding the maximum voltage (nominal +10%) and below this absolute maximum rating voltages, is applied to their devices, the
reliability of their devices will be affected.
Buffer Supply Voltage VCC....................................-0.3V to +4V
Buffer Input Voltage............................................... -0.3V to +4V
Storage Temperature...................................... -65°C to +150°C
ESD for I/O....................................................................>2000V
ESD for PLL .................................................................>1000V
Recommended
Operating
Conditions
Core Supply Voltage VDD
1.65V to 1.95V
3.3V Buffer Supply Voltage VCC
3.0V to 3.6V
2.5V Buffer Supply Voltage VCC
2.3V to 2.7V
Buffer Input Voltage
0V to VCC
Storage Temperature
-65°C to +150°C
Consumption
Symbol
Parameter
Min
Typ
Max
Unit
Ta
Operating Temperature
-55
25
125
°C
VDD
Supply Voltage
1.65
1.8
1.95
V
ICCSBA
Leakage current per gate
0.145
5.5
nA
ICCOPA
Dynamic current per gate
8.8
nA/MHz
10
Test Conditions
core
Duty cycle = 20%
ATC18RHA
4261G–AERO–02/11
ATC18RHA
I/O DC at 3.3V Characteristics
Applicable over recommended operating temperature and voltage range unless otherwise noted.
Symbol
Parameter
Min
Typ
Max
Unit
Test Conditions
VDD
Supply Voltage
1.65
1.8
1.95
V
core
VCC
Buffer Supply voltage
3.0
3.3
3.6
V
IOs
Low Level Input Current
-1
1
µA
400
µA
IIL
IIH
Pull-up resistor
110
220
Pull-down resistor
-5
5
µA
High Level Input Current
-1
1
µA
Pull-up resistor
-5
5
µA
600
µA
-1
1
µA
Pull-down resistor
140
320
Vin=Vss
Vin=Vcc
IOZ
High Impedance State
Output Current
VIL
Low-Level Input Voltage
-0.3
0.8
V
VIH
High- Level Input Voltage
2
Vcc+0.3
V
Vhyst
Hysteresis
IICS
Cold Sparing
leakage input current
-1
1
µA
Vcc=Vss=0V
Vin=0 to Vcc
IOCS
Cold Sparing
leakage output current
-1
1
µA
Vcc=Vss=0V
Vout=0 to Vcc
VCSTH
Supply threshold of cold sparing
buffers
0.5
V
VOL
Low level output voltage
0.4
V
IOL=2,4,8,12,16mA
VOH
High level output voltage
V
IOH=2,4,8,12,16mA
IOS (1)
Output Short circuit current
IOSN (nn=1)
IOSP (nn=1)
400
Vin=Vcc or Vss
no pull resistor
mV
vcc-0.4
23
23
mA
mA
IICS < 4µA
Vout=Vcc
Vout=Vss
(1) Supplied as a design limit but not guaranteed or tested. No more than one output may be
shorted at a time for a maximum duration of 10 seconds.
IOSmax = 23,46,92,138,184 mA for nn=1,2,4 ,6,8
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4261G–AERO–02/11
I/O DC at 2.5V Characteristics
Applicable over recommended operating temperature and voltage range unless otherwise noted.
Symbol
Parameter
Min
Typ
Max
Unit
Test Conditions
VDD
Supply Voltage
1.65
1.8
1.95
V
core
VCC
Buffer Supply voltage
2.3
2.5
2.7
V
IOs
Low Level Input Current
-1
1
µA
Pull-up resistor
60
260
µA
Pull-down resistor
-5
5
µA
High Level Input Current
-1
1
µA
Pull-up resistor
-5
5
µA
Pull-down resistor
75
360
µA
IIL
IIH
IOZ
High Impedance State
Output Current
VIL
130
180
µA
Vin=Vss
Vin=Vcc
Vin=Vcc or Vss
no pull resistor
-1
1
Low-Level Input Voltage
-0.3
0.7
V
VIH
High- Level Input Voltage
2
Vcc+0.3
V
Vhyst
Hysteresis
IICS
Cold Sparing
leakage input current
-1
1
µA
Vcc=Vss=0V
Vin=0 to Vcc
IOCS
Cold Sparing
leakage output current
-1
1
µA
Vcc=Vss=0V
Vout=0 to Vcc
VCSTH
Supply threshold of cold sparing
buffers
0.5
V
VOL
Low level output voltage
0.4
V
IOL=1.5,3,6,9,12mA
VOH
High level output voltage
V
IOH=1.5,3,6,9,12mA
IOS (1)
Output Short circuit current
IOSN (nn=1)
IOSP (nn=1)
350
mV
vcc-0.4
14
14
mA
mA
IICS < 4µA
Vout=Vcc
Vout=Vss
(1) Supplied as a design limit but not guaranteed or tested. No more than one output may be
shorted at a time for a maximum duration of 10 seconds.
IOSmax = 14,28,56,84,112 mA for nn=1,2,4 ,6,8
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ATC18RHA
PCI Characteristics
DC specifications
Applicable over recommended operating temperature and voltage range unless otherwise noted.
Symbol
Parameter
Min
Typ
Max
Unit
VCC
Buffer Supply voltage
3.0
3.3
3.6
V
VIH
High Input Level
0.5 Vcc
Vcc + 0.3
V
VIL
Low Input Level
-0.3
0.3 Vcc
V
IOH
High Level Current
16
32
mA
VOH=Vcc - 0.4V
IOL
Low Level Current
16
32
mA
VOL=0.4V
IOS (1)
Output Short Current
184
mA
VOH=0 VOL=Vcc
VCSTH
Supply threshold of cold sparing buffers
0.5
V
IICS < 4µA
112
Tests conditions
(1) Supplied as a design limit but not guaranteed or tested. No more than one output may be shorted at a
time for a maximum duration of 10 seconds.
LVPECL Receiver characteristics
DC specifications
Applicable over recommended operating temperature and voltage range unless otherwise noted.
Symbol
Parameter
Min
Typ
Max
Unit
VCC
Buffer Supply voltage
3.0
3.3
3.6
V
VCC
Buffer Supply voltage
2.3
2.5
2.7
V
IIN
Input Leakage
-10
10
µA
ICCstat
Static Consumption(ien=0)
4
mA
VCC=3.3+/-0.3V
ICCstdby
Static Consumption(ien=1)
10
µA
VCC=3.3+/-0.3V
ICCstat
Static Consumption(ien=0)
2.3
mA
VCC=2.5 +/- 0.25V
ICCstdby
Static Consumption(ien=1)
5.8
µA
VCC=2.5 +/- 0.25V
2.5
1.5
Tests conditions
LVDS Reference characteristics
DC specifications
Applicable over recommended operating temperature and voltage range unless otherwise noted.
Symbol
Parameter
MIN
TYP
MAX
Unit
VCC
Buffer Supply voltage
3.0
3.3
3.6
V
VCC
Buffer Supply voltage
2.3
2.5
2.7
V
Vref
Input Voltage
1.25 - 5%
1.25
1.25 + 5%
V
Rpd
Pull Down resistance
140
200
260
kOhm
VIN=1.25V
ICCstat
Static Consumption (ien=”0”)
260
320
µA
VCC=3.3+/-0.3V
ICCsdby
Static Consumption (ien=”1”)
2
µA
VCC=3.3+/-0.3V
ICCstat
Static Consumption (ien=”0”)
184
µA
VCC=2.5 +/- 0.25V
ICCsdby
Static Consumption (ien=”1”)
1.2
µA
VCC=2.5 +/- 0.25V
150
Tests conditions
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LVDS Transmitter characteristics
DC specifications
Applicable over recommended operating temperature and voltage range unless otherwise noted.
Symbol
Parameter
MIN
TYP
MAX
Unit
VCC
Buffer Supply voltage
3.0
3.3
3.6
V
VCC
Buffer Supply voltage
2.3
2.5
2.7
V
|VOD|
Output Differential Voltage
247
350
454
mV
Rload = 100 ohms
VOS
Output offset Voltage
1.125
1.25
1.375
V
Rload = 100 ohms
|∆VOD| (1)
Change in |VOD|
50
mV
Rload = 100 ohms
Change in VOS - steady state
50
Change in VOS - dynamic state
150
mV
Rload = 100 ohms
|∆VOS| (1)
IOS
7
24
mA
Drivers shorten to
ground or VCC
4.5
12
mA
Drivers shorten
together
4
6
mA
VCC=3.3+/-0.3V
10
µA
VCC=3.3+/-0.3V
3.5
mA
VCC=2.5 +/- 0.25V
5.8
µA
VCC=2.5 +/- 0.25V
Output short current
ICCstat
Static Consumption (ien=”0”)
ICCsdby
Static Consumption (ien=”1”)
ICCstat
Static Consumption (ien=”0”)
ICCsdby
Static Consumption (ien=”1”)
Tests conditions
2.3
(1) Supplied as a design limit but not guaranteed or tested. No more than one output may be shorted at a
time for a maximum duration of 10 seconds.
LVDS Receiver characteristics
DC specifications
Applicable over recommended operating temperature and voltage range unless otherwise noted.
14
Symbol
Parameter
MIN
TYP
MAX
Unit
VCC
Buffer Supply voltage
3.0
3.3
3.6
V
VCC
Buffer Supply voltage
2.3
2.5
2.7
V
VID
Input Differential Voltage
200
600
mV
VCM
Common Mode Input Voltage
0.05
2.35
V
IIN
Input Leakage
-10
10
µA
ICCstat
Static Consumption (ien=”0”)
6
mA
VCC=3.3+/-0.3V
ICCsdby
Static Consumption (ien=”1”)
10
µA
VCC=3.3+/-0.3V
ICCstat
Static Consumption (ien=”0”)
3.5
mA
VCC=2.5 +/- 0.25V
ICCsdby
Static Consumption (ien=”1”)
5.8
µA
VCC=2.5 +/- 0.25V
3.5
2
Tests conditions
ATC18RHA
4261G–AERO–02/11
ATC18RHA
Document Revision History
Changes from Rev.
4261B-06/05 to 4261C04/06
1. Added double pad ring configuration
2. Clarification of paragraphs concerning ESD and array organization
3. Tools update (moved from Hyperextract to Star-RCXT)
Changes from Rev.
4261C-04/06 to 4261D07/07
1. Remove 1.8V I/O offering
Changes from Rev.
4261D-07/07 to 4261E10/07
1. Added I/O33 supplied at 2.5V offering and LVDS/LVPECL 2.5V
Changes from Rev.
4261E-10/07 to 4261F08/08
1. Added note to MCGA625 product offering
Changes from Rev.
4261F-08/08 to 4261G02/11
1. Removed informations already included in the ‘ATC18RHA design manual’
2. Added MLGA packages up to 625 lands - removed MCGA packages
3. Added ATC18RHA95_544 die
4. Added a note on dual voltage on periphery - page 2
5. Corrections on LVDS data
6. Typo: For core, supply is Vdd and for buffers is Vcc
7. Add radiation tolerance paragraph
15
4261G–AERO–02/11
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4261G–AERO–02/11