PROTEC EMIF4100FCD4 Emi filter/tvs array Datasheet

05206
EMIF4-100FCD4
Only One Name Means ProTek’Tion™
EMI FILTER/TVS ARRAY
APPLICATIONS
✔ Cellular Phones
✔ Notebooks
✔ Personal Digital Assistant (PDA)
✔ Ground Positioning System (GPS)
✔ SMART Cards
IEC COMPATIBILITY (EN61000-4)
✔ 61000-4-2 (ESD): Air - 15kV, Contact - 8kV
✔ 61000-4-4 (EFT): 40A - 5/50ns
15 BUMP FC
FEATURES
✔ ESD Protection > 25 kilovolts
✔ 4 Symmetrical I/O Channel EMI Filtering/TVS for ESD Protection
✔ Low Insertion Loss: -3db Roll-Off @ 60MHz
✔ Four Seperate TVS Diodes for ESD Protection
✔ Low Lead Inductance
✔ RoHS Compliant on Lead-Free Versions
MECHANICAL CHARACTERISTICS
✔ 15 Bump Flip Chip Package
✔ Weight 0.73 milligrams (Approximate)
✔ Available in Tin-Lead or Lead-Free Plating
✔ Solder Reflow Temperature:
Tin-Lead - Sn/Pb, 85/15: 240-245°C
Lead-Free - Sn/Ag/Cu, 96/3.5/0.5: 260-270°C
✔ Flammability Rating UL 94V-0
✔ 8mm Tape and Reel Per EIA Standard 481
PIN CONFIGURATION
D2
I/O1
I/O2
I/O3
G1
D1
G2
I/O1
I/O2
D4
I/O4
G3
I/O3
I/O4
D3
Note: All grounds are connected internally.
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EMIF4-100FCD4
DEVICE CHARACTERISTICS
MAXIMUM RATINGS @ 25°C Unless Otherwise Specified
SYMBOL
VALUE
UNITS
TJ
-40°C to 85°C
°C
TSTG
-55°C to 150°C
°C
DC Power Per Resistor
P
100
mW
Typical Resistance @ ± 20%
R
100
OHMS
PARAMETER
Operating Temperature
Storage Temperature
ELECTRICAL CHARACTERISTICS PER LINE @ 25°C Unless Otherwise Specified
PART
NUMBER
RATED
STAND-OFF
VOLTAGE
MINIMUM
BREAKDOWN
VOLTAGE
MAXIMUM
REVERSE
LEAKAGE
CURRENT
TYPICAL
FORWARD
VOLTAGE
MINIMUM
ATTENUATION
VWM
VOLTS
@ 1mA
V(BR)
VOLTS
@ 3.3V
ID
µA
@10mA
VF
VOLTS
5.0
6.0
0.5
0.8
EMIF4-100FCD4
CUT-OFF
FREQUENCY
(50 Ohms I/O
ZERO BIAS)
TYPICAL
CAPACITANCE
PER DIODE
(See Note 1)
@
800-3000 MHz
dB
fc
MHz
@2.5V, 1 MHz
C
pF
30
60
30
Note 1: ±20% tolerance.
FIGURE 1
RESISTANCE VS TEMPERATURE
(Normalized to Resistance at 25°C)
Normalized Resistance
1.100
1.060
1.020
0.980
0.940
0.900
-40
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-20
0
20
40
Temperature °C
2
60
80
100
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EMIF4-100FCD4
GRAPHS
FIGURE 2
INSERTION LOSS - EMIF4-100FCD4
0
-5
-10
Gain (dB)
-15
-20
2.5 Volts
-25
-30
-35
0 Volts
-40
-45
-50
0.1
1
10
100
1000
10000
Frequency (MHz)
FIGURE 3
OVERSHOOT & CLAMPING VOLTAGE
5 Volts per Division
35
25
15
5
-5
ESD Test Pulse: +15 kilovolt, 1/30ns (waveform)
FIGURE 4
OVERSHOOT & FORWARD CLAMPING VOLTAGE
1 Volts per Division
4
2
0
-2
-4
ESD Test Pulse: -15 kilovolt, 1/30ns (waveform)
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EMIF4-100FCD4
APPLICATION INFORMATION
PRINTED CIRCUIT BOARD RECOMMENDATIONS
VALUE
PARAMETER
Pad Size on PCB
Pad Shape
Pad Definition
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
Solder Paste Type
Pad Protective Finish
Tolerance - Edge To Corner Ball
Solder Ball Side Coplanarity
Maximum Dwell Time Above Liquidous (183°C)
Soldering Maximum Temperature
0.275mm
Round
Non-Solder Mask Defined Pads
0.325mm Round
0.150mm
0.330mm Round
No Clean
OSP(Entek Cu Plus 106A)
±50µm
±20µm
60 Seconds
270°C
RECOMMENDED NON-SOLDER MASK
DEFINED PAD ILLUSTRATION
REQUIREMENTS
Non-Solder Mask Defined Pad
0.275mm DIA.
Temperature:
TP for Lead-Free (SnAgCu): 260-270°C
TP for Tin-Lead: 240-245°C
Preheat time and temperature depends on solder paste and flux
activation temperature, component size, weight, surface area &
plating.
Solder Mask Opening
0.325mm DIA.
Solder Stencil Opening
0.330mm DIA.
TP
Temperature - °C
Ramp-up
Ramp-down
TL
TSMAX
155°
TSMIN
140°
TS - Preheat
t 25°C to Peak
30-60 seconds
05206.R1 10/05
Ramp-up
15 seconds
4
Solder Time
15-20 seconds
Ramp-down
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EMIF4-100FCD4
PACKAGE OUTLINE & DIMENSIONS
PACKAGE OUTLINE
PACKAGE DIMENSIONS
MILLIMETERS
BOTTOM VIEW
A
G
D
C
SIDE VIEW
E
O
F
G
B
H
I
1
2
3
4
5
6
I
0.30 DIA.
63/67 Sn/Pb
Solder Bumps
INCHES
DIM
MIN
MAX
MIN
MAX
A
B
C
D
E
F
G
H
I
J
2.915
1.285
0.495
0.245
0.430
0.430
0.180
0.180
0.432
0.330
3.005
1.375
0.505
0.255
0.440
0.440
0.280
0.280
0.559
0.457
0.1148
0.0506
0.0195
0.0096
0.0169
0.0169
0.0071
0.0071
0.0170
0.0130
0.1183
0.0541
0.0199
0.0100
0.0173
0.0173
0.0110
0.0110
0.0220
0.0180
NOTE:
1. Controlling dimensions in millimeters.
J
Outline & Dimensions: Rev 1 - 8/05, 06042
Tape & Reel Specifications (Dimensions in millimeters)
Reel Dia.
Tape Width
178mm (7”)
8mm
A0
B0
K0
D
E
F
W
P0
P2
D
P
t
10 Pitches Cumulative
Tolerance on Tape. ± 0.2
MARKING CODE
DIAGRAM
E
Top cover tape
A0
FCD4
P2
1.78 ± 0.05 3.35 ± 0.05 0.76 ± 0.05 1.50 ± 0.10 1.75 ± 0.10 3.50 ± 0.05 8.00 ±0.30 4.00 ±0.10 2.00 ±0.05 4.00 ±0.10 0.20±0.025
t
FCD4
P0
F
W
K0
B0
FCD4
P
User Direction of Feed
TAPE & REEL ORDERING NOMENCLATURE
1.
2.
3.
4.
Surface mount product is taped and reeled in accordance with EIA-481.
Plastic 8mm Tape: Suffix-T73-1 = 7 Inch Reel - 3,000 pieces per reel, i.e., EMIF4-100FCD4-T73-1.
Suffix - LF - Lead-Free, i.e., EMIF4-100FCD4-LF-T73-1.
Suffix - C = Coated Version, i.e., EMIF4-100FCD4-LF-T73C-1.
COPYRIGHT © ProTek Devices 2005
SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except JEDEC).
DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that the final judgement concerning selection and
specifications is the buyer’s and that in furnishing engineering and technical assistance, ProTek assumes no responsibility with respect to the selection or
specifications of such products.
05206.R1 10/05
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ProTek Devices
2929 South Fair Lane, Tempe, AZ 85282
Tel: 602-431-8101 Fax: 602-431-2288
E-Mail: [email protected]
Web Site: www.protekdevices.com
www.protekdevices.com
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