Rohm BD28623MUV Class d speaker amplifier for digital input Datasheet

Datasheet
Middle Power Class-D Speaker Amplifier Series
17W+17W
Class D Speaker Amplifier for Digital Input
BD28623MUV
General Description
BD28623MUV is a Class D Speaker Amplifier designed for
Flat-panel TVs in particular for space-saving and
low-power consumption. This IC delivers an output power
of 20W+20W. This IC employs state-of-the-art Bipolar,
CMOS, and DMOS (BCD) process technology. With this
technology, the IC can achieve high efficiency. In addition,
the IC is packaged in a compact back-surface heat-sink
type power package to achieve low power consumption
and low heat generation and to eliminate need for external
heat-sink. With this package, total output power is only
34W as compared to 40W total output power of package
with external heat-sink This product satisfies all needs for
drastic downsizing, low-profile structures and powerful
high quality playback of sound systems.
Key Specifications
 Supply Voltage:
8.5V to 24V
 Speaker Output Power:
17W+17W (Typ)
(VCC=18V, RL=8Ω, Gain=26dB)
 Total Harmonic Distortion: 0.08% (Typ) @PO=1W
(VCC=12V, RL=8Ω, Gain=20dB)
 Crosstalk:
90dB (Typ)
 PSRR:
60dB (Typ)
 Output Noise Voltage:
150μVrms (Typ)
 Standby Current:
33μA (Typ)
 Operating Temperature Range:
-25°C to +85°C
Package
W(Typ) x D(Typ) x H(Max)
4.00mm x 4.00mm x 1.00mm
VQFN024V4040
Features
BSP2N
MCLK
OUT2N
BCLK
LRCLK
BSP2P
OUT2P
SDATA
BSP1N
OUT1N
OUT1P
BSP1P
SP ch2
(Rch)
ERROR
Flat Panel TVs (LCD, Plasma)
Home Audio (Sound Bar)
Amusement Equipment
Electronic Music Equipment
Desktop PC, etc.
SP ch1
(Lch)
GAIN
-
Typical Application Circuit
MUTEＸ
Applications
VQFN024V4040
RSTX
 1 Digital Audio Interface
2
I S format
SDATA: 16 / 20 / 24bit
LRCLK (fS): 32 kHz/ 44.1kHz / 48kHz
BCLK: 64fS (fixed)
MCLK: 256fS / 512fS Automatic Identification)
 Low supply current at RESET mode.
 Slew rate controller
; No need snubber circuit (Vcc≤22V)
 Output Feedback Circuitry which prevents decrease of
sound quality caused by change of power supply
voltage, achieves low noise and low distortion, So
the large electrolytic-capacitors for Vcc bypass is able
to be eliminated.
 Variable Gain (17dB / 20dB / 26dB)
 Wide power supply voltage range (8.5V to 24V)
 High efficiency, low heat
 Pop noise prevention at power supply on / off
 Soft Muting Technology
 High reliability design by built-in protection circuits
- Overheat protection
- Under voltage protection
- Output short protection
- Output DC voltage protection
- Clock stop protection (MCLK, BCLK, LRCLK)
 Small package (VQFN024V4040)
Digital Audio Source
Figure 1. Typical Application Circuit
○Product structure：Silicon monolithic integrated circuit ○This product has no designed protection against radioactive rays
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Pin Configuration
16
15
14
13
24
1
2
3
4
5
6
MCLK
SDATA
BCLK
LRCLK
GAIN
RSTX
12
17
BSP1N
11
18
23
ERROR
OUT1N
22
OUT2N
VCCA
21
BSP2N
GNDA
GNDP1
10
20
GNDP2
REGD
VCCP1
9
19
VCCP2
REGG
BSP1P
8
OUT2P
BSP2P
OUT1P
7
(TOP VIEW)
MUTEX
Figure 2. Pin Configuration
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Pin Descriptions, I/O Equivalent Circuits (Provided pin voltages are typical values)
Pin No.
1
2
3
4
7
Pin Name
MCLK
SDATA
BCLK
LRCLK
Pin Voltage
0V
MUTEX
Pin Descriptions
Digital sound signal input pin
Internal Equivalent Circuit
14
1,2,3,4,7
Speaker output mute control pin
100k
H: Mute OFF
L: Mute ON
15
Gain setting pin
3k
5
5
PLIMT
33k
0V
15
Reset pin
14
H: Reset OFF
L: Reset ON
6
RSTX
0V
6
57k
43k
15
8
OUT1P
VCC to 0V
Output pin of Ch1 positive PWM signal
Please connect to output LPF.
*If this pin is shorted to GND, the IC may be broken.
9
BSP1P
-
10
VCCP1
-
11
GNDP1
0V
12
BSP1N
-
13
OUT1N
VCC to 0V
10
Boot-strap pin of Ch1 positive PWM signal
Please connect a capacitor to OUT1P.
Power supply pin for Ch1 PWM signal
Please connect a capacitor.
17
12
9
GND pin for Ch1 PWM signal
13
8
Boot-strap pin of Ch1 negative PWM signal
Please connect a capacitor to OUT1N.
Output pin of Ch1 negative PWM signal
Please connect to output LPF.
11
*If this pin is shorted to GND, the IC may be broken.
14
VCCA
VCC
15
GNDA
0V
Power supply pin for Analog signal
Please connect a capacitor to GND.
GND pin for Analog signal
－
－
Internal power supply pin for Digital circuit
Please connect a capacitor to GND.
16
REGD
5.0V
14
*The REGD terminal of BD28623MUV should not be used as
external supply. Therefore, don't connect anything except for the
capacitor for stabilization.
16
500K
15
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Pin Descriptions, I/O Equivalent Circuits – continued (Provided pin voltages are typical values)
Pin No.
17
Pin Name
REGG
Pin Voltage
5.7V
Internal Equivalent Circuit
Pint Descriptions
Internal power supply pin for Gate driver
Please connect a capacitor to GND.
14
*The REGG terminal of BD28623MUV should not be used as
external supply. Therefore, don't connect anything except for
the capacitor for stabilization.
17
500k
15
18
19
BSP2P
OUT2P
-
VCC to 0V
Boot-strap pin of Ch2 positive PWM signal
Please connect a capacitor to OUT2P.
20
Output pin of Ch2 positive PWM signal
Please connect to output LPF.
17
18
22
*If this pin is shorted to GND, the IC may be broken.
20
VCCP2
VCC
GNDP2
0V
22
BSP2N
-
23
OUT2N
VCC to 0V
21
Power supply pin for Ch2 PWM signal
Please connect a capacitor to GND.
GND pin for Ch2 PWM signal
19
23
Boot-strap pin of Ch2 negative PWM signal
Please connect a capacitor to OUT2N.
Output pin of Ch2 negative PWM signal
Please connect to output LPF.
21
*If this pin is shorted to GND, the IC may be broken.
Error flag pin
Please connect pull-up resistor.
24
ERROR
-
500
H: Normal
L: Error
24
*An error flag is outputted when Output Short Protection, DC
Voltage Protection in the speaker, and High Temperature
Protection are operated. This flag shows IC condition during
operation.
15
The numerical value of internal equivalent circuit is typical value, not guaranteed value.
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13
21
BSP2N
22
OUT2N
Output Short Protection
Output DC Voltage Protection
High Temperature Protection
Driver
FET
2P
Driver
FET
1N
Under Voltage Protection
Clock Stop Protection
23
feedback
Driver
FET
2N
PWM
Modulator
feedback
Driver
FET
1P
×4 Over
Sampling Digital Filter
24
I2S I/F
Control I/F
1
2
3
4
5
6
MCLK
SDATA
BCLK
LRCLK
GAIN
RSTX
12
OUT1N
14
BSP1N
11
VCCA
15
GNDP1
10
GNDA
16
VCCP1
9
GNDP2
ERROR
REGD
17
BSP1P
8
20
VCCP2
REGG
18
19
OUT2P
BSP2P
OUT1P
7
Block Diagram
MUTEX
Figure 3. Block Diagram
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Absolute Maximum Ratings
Parameter
(Note 1) (Note 2)
Supply Voltage
Symbol
VCCMAX
Power Dissipation
Pd
(Note 1)
Input Voltage1
Limit
-0.3 to +30
2.21
(Note 3)
3.56
(Note 4)
Unit
V
Conditions
Pin10, 14, 20
W
Please refer to Power
Dissipation for details.
VIN1
-0.3 to +3.7
V
Pin1-7
Terminal Voltage 1
(Note 1)
VPIN1
-0.3 to +7
V
Pin16, 17
Terminal Voltage 2
(Note 1) (Note 5-1)
VPIN2
-0.3 to +VCC
V
Pin8, 13, 19, 23
Terminal Voltage 3
(Note 1) (Note 5-2)
VPIN3
-0.3 to OUTxx+7
V
Pin9, 12, 18, 22
VERR
-0.3 to +VCCMAX
V
Pin24
Open-drain Terminal Voltage
(Note 1)
Operating Temperature Range
Topr
-25 to +85
°C
Storage Temperature Range
Tstg
-55 to +150
°C
Tjmax
+150
°C
Maximum Junction Temperature
(Note 1) Voltage that can be applied with reference to GND (Pin11, 15, 21).
(Note 2) Pd and Tjmax=150°C must not be exceeded.
(Note 3) 74.2mm×74.2mm×1.6mm, FR4, 4-layer glass epoxy board
(Top and bottom layer back copper foil size: 20.2mm2, 2nd and 3rd layer back copper foil size: 5505mm2)
Derate by 17.7mW/°C when operating above Ta=25°C. The board is provided with thermal via.
(Note 4 74.2mm×74.2mm×1.6mm, FR4, 4-layer glass epoxy board
(Top and bottom layer back copper foil size: 5505mm2)
Derate by 28.5mW/°C when operating above Ta=25°C. The board is provided with thermal via.
(Note 5-1) The chip should be used within AC peak limits at all conditions. Overshoot should be ≤30V with reference to GND.
Undershoot should be ≤10nsec and ≤30V with reference to VCC. (Please refer to figure 4-1.)
(Note 5-2) The chip should be used within AC peak limits at all conditions. Overshoot should be ≤OUTxx+7V with reference to OUTxx.
Undershoot should be ≤10nsec and ≤OUTxx+7V with reference to OUTxx. (Please refer to figure 4-2.)
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over
the absolute maximum ratings.
Overshoot to OUTxx
7V (Max.)
Vcc
Overshoot to GND
30V (Max.)
Undershoot to Vcc
30V(Max.)
BSPxx
GND
Undershoot to OUTxx
7V(Max.)
OUTxx
≦10nsec
≦10nsec
Figure 4-1
Figure 4-2
Recommended Operating Conditions
Parameter
(Note 1) (Note 2)
Supply Voltage
Minimum Load Impedance
Symbol
VCC
(Note 6)
RL
Limit
8.5 to 24
6.4
4.8
3.6
Unit
V
Ω
Conditions
Pin10, 14, 20
21V < VCC ≤ 24V
14V < VCC ≤ 21V
VCC ≤14V
(Note 6) Pd should not be exceeded.
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Electrical Characteristics
(Unless otherwise specified, Ta=25°C, VCC=18V, f=1kHz, RL=8Ω, RSTX=3.3V, MUTEX=3.3V, Gain= 20dB, fS=48kHz,
MCLK=256fS, Output LC filter: L=10µH, C=0.68µF, Without Snubber circuit)
Parameter
Symbol
Limit
Min
Typ
Max
Unit
Conditions
Total Circuit
Circuit Current (Reset Mode)
ICC1
-
33
200
µA
No load, RSTX=0V, MUTEX=0V
Circuit Current (Mute Mode)
ICC2
-
15
25
mA
No load, RSTX=3.3V,
MUTEX=0V
Circuit Current (Active Mode)
ICC3
-
40
80
mA
No load, RSTX=3.3V,
MUTEX=3.3V
Open-drain Terminal Low Level
Voltage
Regulator Output Voltage 1
VERR
-
-
0.8
V
IO=0.5mA
VREGG
4.6
5.7
6.5
V
RSTX=3.3V, MUTEX=3.3V
Regulator Output Voltage 2
VREGD
4.2
5.0
5.7
V
RSTX=3.3V, MUTEX=3.3V
High level Input Voltage 1
VIH1
2.2
-
3.3
V
Pin1-4,6-7
Low level Input Voltage 1
VIL1
0
-
0.8
V
Pin1-4,6-7
High level Input Voltage 2
VIH2
2.6
-
3.3
V
Pin5
Low level Input Voltage 2
VIL2
0
-
0.45
V
Pin5
IIH
27.5
33
42
µA
VIN = 3.3V, Pin1-4,6-7
IIH2
65
100
135
µA
VIN = 3.3V, Pin5
PO1
-
15
-
W
PO2
10
12.5
-
W
PO3
5
6.3
-
W
GV26
25
26
27
dB
GV20
19
20
21
dB
GV17
16
17
18
dB
THD1
-
0.08
-
%
CT
60
90
-
dB
PSRR
-
60
-
dB
VNO
-
150
250
μVrms
-
512
-
kHz
GAIN=L
VCC=12V, PO=1W
BW=20 to 20kHz (AES17)
GAIN=20dB, With snubber circuit
PO=1W, 1kHz BPF,
GAIN=20dB
Vripple=1Vrms, f=1kHz,
GAIN=20dB
Input=-∞dBFS, BW=IHF-A,
GAIN=20dB
fS=32kHz
-
705.6
-
kHz
fS=44.1kHz
-
768
-
kHz
fS=48kHz
Input Current1
(Input Pull-down Terminal)
]Input Current2
(Input Pull-down Terminal)
Speaker Parts
Maximum Output Power 1
(Note 7)
Maximum Output Power 2
(Note 7)
Maximum Output Power 3
(Note 7)
Voltage Gain1
(Note 7)
Voltage Gain2
(Note 7)
Voltage Gain3
(Note 7)
Total Harmonic Distortion1
Crosstalk
PSRR
(Note 7)
(Note 7)
(Note 7)
Output Noise Voltage
(Note 7)
PWM (Pulse Width Modulation)
Frequency
fPWM
VCC=16V, THD+N=10%,
GAIN=26dB
VCC=16V, THD+N<10%,
GAIN=20dB
VCC=16V, THD+N<10%,
GAIN=17dB
PO=1W,
GAIN=H
PO=1W ,
GAIN=Pull up(47kΩ)
PO=1W,
(Note 7) The rated values of items above indicate average performances of the device, which largely depend on circuit layouts, components, and power supplies.
The reference values are those applicable to the device and components directly installed on a board specified by ROHM during testing.
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Typical Performance Curves (1/11)
(Unless otherwise specified, Ta=25°C, VCC=18V, f=1kHz, RL=8Ω, RSTX=3.3V, MUTEX=3.3V, fS=48kHz, MCLK=256fS,
Gain=26dB, ROHM 4-layer Board)
80
60
RL=No load
No signal
“RESET”
60
RESET
40
ACTIVE
50
ICC [mA]
Circuit Current : ICC [µA]
50
RL=No load
No signal
“MUTE”
“ACTIVE”
70
30
40
30
20
MUTE
20
ｗw
10
10
0
6
8
10
12 14 16 18 20 22
Supply Voltage : VCC [V]
24
0
26
8
10
Figure 5. Circuit Current vs Supply Voltage
(RESET)
14
16 18
VCC [V]
20
22
24
26
Figure 6. Circuit Current vs Supply Voltage
(MUTE, ACTIVE)
3.0
100
GAIN=H
90
GAIN=H
RL=8Ω
2.5
80
RL=6Ω
RL=6Ω
70
2.0
RL=8Ω
60
ICC [A]
Efficiency [%]
12
50
40
1.5
1.0
30
20
0.5
10
0.0
0
0
5
10
15
0
20
Figure 7. Efficiency vs Output Power
(8Ω, 6Ω)
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10
15
20
Output Power [W/ch]
Output Power [W/ch]
※
5
Figure 8. Circuit Current vs Output Power
(8Ω, 6Ω)
Dotted line means power dissipation is exceeded.
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Typical Performance Curves – continued (2/11)
(Unless otherwise specified, Ta=25°C, VCC=18V, f=1kHz, RL=8Ω, RSTX=3.3V, MUTEX=3.3V, fS=48kHz, MCLK=256fS,
Gain=20dB, ROHM 4-layer Board)
100
3.5
GAIN=H
VCC=12V
90
3.0
80
70
2.5
RL=4Ω
RL=4Ω
60
ICC [A]
Efficiency [%]
GAIN=H
VCC=12V
50
40
30
2.0
1.5
1.0
20
0.5
10
0
0.0
0
5
10
15
20
0
Output Power [W/ch]
5
10
15
20
Output Power [W/ch]
Figure 9. Efficiency vs Output Power
(4Ω)
Figure 10. Circuit Current vs Output Power
(4Ω)
Speaker output
Speaker output
MUTEX
MUTEX
Figure 11. Waveform of Soft Start
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Figure 12. Waveform of Soft Mute
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Typical Performance Curves - continued (3/11)
(Unless otherwise specified, Ta=25°C, VCC=18V, f=1kHz, RL=8Ω, RSTX=3.3V, MUTEX=3.3V, fS=48kHz, MCLK=256fS,
Gain=26dB, ROHM 4-layer Board)
35
3
GAIN=H
RL=8Ω
25
GAIN=H
RL=8Ω
2.5
THD+N=10%
20
15
THD+N=1%
VCC=12V
1.5
VCC=24V
1
10
0.5
5
0
0
6
8
10
12
14
16
18
20
22
24
0
26
5
10
15
20
25
Output Power [W/ch]
Supply Voltage : VCC [V]
Figure 13. Output Power vs Supply Voltage
(8Ω)
Figure 14. Circuit Current vs Output Power
(8Ω)
35
3
GAIN=H
RL=6Ω
30
25
GAIN=H
RL=6Ω
2.5
THD+N=10%
2
20
ICC [A]
Output Power [W/ch]
VCC=18V
2
ICC [A]
Output Power [W/ch]
30
THD+N=1%
15
VCC=12V
VCC=18V
1.5
1
10
0.5
5
0
0
6
8
10
12
14
16
18
20
22
24
26
0
Supply Voltage : VCC [V]
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10
15
20
25
Output Power [W/ch]
Figure 15. Output Power vs Supply Voltage
(6Ω)
※
5
Figure 16. Circuit Current vs Output Power
(6Ω)
Dotted line means power dissipation is exceeded.
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Typical Performance Curves - continued (4/11)
(Unless otherwise specified, Ta=25°C, VCC=18V, f=1kHz, RL=8Ω, RSTX=3.3V, MUTEX=3.3V, fS=48kHz, MCLK=256fS,
Gain=20dB, ROHM 4-layer Board)
35
4
GAIN=H
RL=4Ω
GAIN=H
RL=4Ω
3.5
3
25
VCC=12V
THD+N=10%
2.5
20
ICC [A]
Output Power [W/ch]
30
15
VCC=14V
2
1.5
THD+N=1%
10
1
5
0.5
0
0
6
8
10
12
14
16
18
20
22
24
0
26
5
Supply Voltage : VCC [V]
Figure 17. Output Power vs Supply Voltage
(4Ω)
15
20
Figure 18. Circuit Current vs Output Power
(4Ω)
35
3
GAIN=H
RL=4.8Ω
30
GAIN=H
RL=4.8Ω
2.5
25
2
THD+N=10%
20
ICC [A]
Output Power [W/ch]
10
Output Power [W/ch]
15
THD+N=1%
VCC=12V
VCC=18V
1.5
1
10
0.5
5
0
0
6
8
10
12
14
16
18
20
22
24
0
26
Figure 19. Output Power vs Supply Voltage
(4.8Ω)
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10
15
20
Output Power [W/ch]
Supply Voltage : VCC [V]
※
5
Figure 20. Circuit Current vs Output Power
(4.8Ω)
Dotted line means power dissipation is exceeded.
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Typical Performance Curves - continued (5/11)
(Unless otherwise specified, Ta=25°C, VCC=18V, f=1kHz, RL=8Ω, RSTX=3.3V, MUTEX=3.3V, fS=48kHz, MCLK=256fS,
Gain=20dB, ROHM 4-layer Board)
0
30
OUT1
OUT2
-20
25
Voltage Gain [dB]
-40
Noise FFT [dBV]
Po=1W
RL=8Ω
OUT1
OUT2
No Signal
RL=8Ω
-60
-80
-100
20
15
-120
-140
10
10
100
1k
10k
100k
10
100
1k
Frequency [Hz]
10k
100k
Frequency [Hz]
Figure 22. Voltage Gain vs Frequency (8Ω)
Figure 21. FFT of output noise voltage (8Ω)
10
10
f=1kHz
f=100Hz
f=6kHz
OUT1
OUT2
BW 20 to 20kHz
AES17
RL=8Ω
BW 20 to 20kHz
AES17
RL=8Ω
1
1
THD+N [%]
THD+N [%]
f=6kHz
f=1kHz
OUT1
0.1
0.1
f=100Hz
OUT2
0.01
0.01
0.01
0.1
1
10
10
100
1k
10k
100k
Frequency [Hz]
Output Power [W/ch]
Figure 24. THD+N vs Frequency (8Ω)
Figure 23. THD+N vs Output Power (8Ω)
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Typical Performance Curves - continued (6/11)
(Unless otherwise specified, Ta=25°C, VCC=18V, f=1kHz, RL= 8Ω/6Ω, RSTX=3.3V, MUTEX=3.3V, fS=48kHz, MCLK=256fS,
Gain=20dB, ROHM 4-layer Board)
0
0
OUT1
OUT2
RL=8Ω
-40
OUT2
-60
-80
-100
OUT1
OUT2
-20
Crosstalk [dB]
Crosstalk [dB]
-20
RL=8Ω
-40
-60
OUT1
-80
-100
OUT1
OUT2
-120
0.01
-120
0.1
1
10
10
100
100
Output Power [W/ch]
Figure 25. Crosstalk vs Output Power (8Ω)
10k
100k
Figure 26. Crosstalk vs Frequency (8Ω)
0
30
OUT1
OUT2
-20
OUT1
OUT2
No Signal
RL=6Ω
PO=1W
RL=6Ω
25
Voltage Gain [dB]
-40
Noise FFT [dBV]
1k
Frequency [Hz]
-60
-80
-100
20
15
-120
-140
10
10
100
1k
10k
100k
Frequency [Hz]
100
1k
10k
100k
Frequency [Hz]
Figure 27. FFT of output noise voltage (6Ω)
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Figure 28. Voltage Gain vs Frequency (6Ω)
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Typical Performance Curves – continued (7/11)
(Unless otherwise specified, Ta=25°C, VCC=18V, f=1kHz, RL=6Ω, RSTX=3.3V, MUTEX=3.3V, fS=48kHz, MCLK=256fS,
Gain=20dB, ROHM 4-layer Board)
10
10
f=1kHz
f=100Hz
f=6kHz
BW 20 to 20kHz
AES17
RL=6Ω
1
OUT1
OUT2
1
THD+N [%]
f=6kHz
THD+N [%]
BW 20 to 20kHz
AES17
RL=6Ω
f=1kHz
OUT1
0.1
0.1
f=100Hz
OUT2
0.01
0.01
0.01
0.1
1
10
10
100
100
Figure 29. THD+N vs Output Power (6Ω)
0
OUT1
OUT2
RL=6Ω
-40
-60
-80
OUT1
RL=6Ω
OUT1
OUT2
-20
Crosstalk [dB]
Crosstalk [dB]
100k
Figure 30. THD+N vs Frequency (6Ω)
0
-40
-60
OUT1
-80
-100
-100
OUT2
-120
0.01
10k
Frequency [Hz]
Output Power [W/ch]
-20
1k
OUT2
-120
0.1
1
10
10
100
Figure 31. Crosstalk vs Output Power (6Ω)
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100
1k
10k
100k
Freq [Hz]
Output Power [W/ch]
Figure 32. Crosstalk vs Frequency (6Ω)
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Typical Performance Curves – continued (8/11)
(Unless otherwise specified, Ta=25°C, VCC=12V, f=1kHz, RL=4Ω, RSTX=3.3V, MUTEX=3.3V, fS=48kHz, MCLK=256fS,
Gain=20dB, ROHM 4-layer Board)
0
30
-20
OUT1
OUT2
25
Voltage Gain [dB]
Noise FFT [dBV]
-40
PO=1W
RL=4Ω
VCC=12V
OUT1
OUT2
No Signal
RL=4Ω
VCC=12V
-60
-80
-100
20
15
-120
-140
10
10
100
1k
10k
100k
10
100
1k
Frequency [Hz]
100k
Frequency [Hz]
Figure 33. FFT of output noise voltage (4Ω)
Figure 34. Voltage Gain vs Frequency (4Ω)
10
10
BW 20 to 20kHz
AES17
RL=4Ω
VCC=12V
OUT1
OUT2
f=6kHz
BW 20 to 20kHz
AES17
RL=4Ω
VCC=12V
1
THD+N [%]
1
THD+N [%]
10k
f=1kHz
0.1
OUT1
0.1
f=1kHz
f=100Hz
f=6kHz
0.01
0.01
0.1
f=100Hz
1
10
OUT2
100
Output Power [W/ch]
10
100
1k
10k
100k
Frequency [Hz]
Figure 35. THD+N vs Output Power (4Ω)
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0.01
Figure 36. THD+N vs Frequency (4Ω)
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Typical Performance Curves - continued (9/11)
(Unless otherwise specified, Ta=25°C, VCC=18V, f=1kHz, RL= 4Ω/4.8Ω, RSTX=3.3V, MUTEX=3.3V, fS=48kHz, MCLK=256fS,
Gain=20dB, ROHM 4-layer Board)
0
0
OUT1
OUT2
-40
-60
-80
OUT1
OUT2
-20
RL=4Ω
VCC=12V
-60
OUT1
-80
OUT1
-100
-100
OUT2
OUT2
-120
0.01
-120
0.1
1
10
10
100
100
1k
10k
100k
Frequency [Hz]
Output Power [W/ch]
Figure 37. Crosstalk vs Output Power (4Ω)
Figure 38. Crosstalk vs Frequency (4Ω)
0
30
OUT1
OUT2
-20
OUT1
OUT2
No Signal
RL=4.8Ω
PO=1W
RL=4.8Ω
25
Voltage Gain [dB]
-40
Noise FFT [dBV]
RL=4Ω
VCC=12V
-40
Crosstalk [dB]
Crosstalk [dB]
-20
-60
-80
-100
20
15
-120
-140
10
10
100
1k
10k
100k
Frequency [Hz]
100
1k
10k
100k
Frequency [Hz]
Figure 39. FFT of output noise voltage (4.8Ω)
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Figure 40. Voltage Gain vs Frequency (4.8Ω)
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Typical Performance Curves – continued (10/11)
(Unless otherwise specified, Ta=25°C, VCC=18V, f=1kHz, RL=4.8Ω, RSTX=3.3V, MUTEX=3.3V, fS=48kHz, MCLK=256fS,
Gain=20dB, ROHM 4-layer Board)
10
f=1kHz
f=100Hz
f=6kHz
1
10
BW 20 to 20kHz
AES17
RL=4.8Ω
OUT1
OUT2
1
THD+N [%]
THD+N [%]
f=6kHz
f=1kHz
0.1
BW 20 to 20kHz
AES17
RL=4.8Ω
OUT2
0.1
f=100Hz
OUT1
0.01
0.01
0.01
0.1
1
10
100
10
100
Output Power [W/ch]
0
-20
RL=4.8Ω
OUT1
OUT2
-40
-60
Crosstalk [dB]
Crosstalk [dB]
100k
Figure 42. THD+N vs Frequency (4.8Ω)
0
OUT1
-80
RL=4.8Ω
OUT1
OUT2
-40
-60
OUT1
-80
-100
-100
OUT2
OUT2
-120
0.01
10k
Frequency [Hz]
Figure 41. THD+N vs Output Power (4.8Ω)
-20
1k
-120
0.1
1
10
100
Figure 43. Crosstalk vs Output Power (4.8Ω)
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10
100
1k
10k
100k
Frequency [Hz]
Output Power [W/ch]
Figure 44. Crosstalk vs Frequency (4.8Ω)
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Typical Performance Curves – continued (11/11)
(Unless otherwise specified, Ta=25°C, VCC=18V, f=1kHz, RL=8Ω/6Ω, RSTX=3.3V, MUTEX=3.3V, fS=48kHz,
MCLK=256fS, ROHM 4-layer Board)
30
26dB
RL=8Ω
BW 20 to 20kHz
AES17
THD+N<1%
25
20
20dB
15
10
17dB
5
Maximum Output Power [W/ch]
Maximum Output Power [W/ch]
30
RL=6Ω
BW 20 to 20kHz
AES17
THD+N<1%
25
20
26dB
20dB
15
17dB
10
5
0
0
6
8
6
10 12 14 16 18 20 22 24 26
Figure 45. Supply Voltage vs Maximum Output Power
(8Ω)
PC
8
10 12 14 16 18 20 22 24 26
Supply Voltage : VCC [V]
Supply Voltage : VCC [V]
Figure 46. Supply Voltage vs Maximum Output Power
(6Ω)
Power Supply
Audio Precision
Ammeter
I2S
INPUT
AP AUX-0025
(passive filter)
LC filter
BD28623MUV
Voltmeter
OUTPUT
Dummy Resister
(RL= 4, 6 or 8Ω )
Figure 47. Audio Characteristics Measurement Environment
※
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Dotted line means power dissipation is exceeded.
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Timing Chart
1.
Power Supply Start-up Sequence
①Power up VCCA, VCCP1, VCCP2 simultaneously.
VCCA
VCCP1
VCCP2
t
RSTX
②Set RSTX to High
after power up.
t
REGG
REGD
REGG
REGD
t
MCLK
SDATA
BCLK
LRCLK
③Digital audio data communication.
t
MUTEX
④After RSTX=L→H wait more than
TWAIT to MUTEX=L→H
More than TWAIT
t
Soft-start
21.5msec(fS=48kHz)
Speaker
Output
t
Figure 48. Power Supply Start-up Sequence
Caution: To eliminate pop noise when power supply is turned ON, RSTX and MUTEX should always be set Low. And also, all
power supply terminals should start up together.
Order of ② and ③ can be interchange
BSP Capacitor Value
(C9, C12, C19, C22)
3.3μF
Min
300
4.7μF
400
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Limit of TWAIT
Typ
Max
-
-
19/49
Unit
msec
msec
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20.May.2016 Rev.002
BD28623MUV
2.
Power Supply Shutdown Sequence
④Power down VCCA, VCCP1,
VCCP2, simultaneously.
VCCA
VCCP1
VCCP2
t
REGG
REGD
REGG
REGD
t
③Set RSTX to Low
RSTX
t
②After stopping speaker output,
Turn off the transmission of digital audio signal.
MCLK
SDATA
BCLK
LRCLK
t
MUTEX
①Set MUTEX to Low
t
Soft-mute
21.5msec(fS=48kHz)
Speaker
Output
t
Figure 49. Power Supply Shutdown Sequence
Caution: To eliminate pop noise when power supply is turned OFF, RSTX and MUTEX should always be set Low first. And also,
all power supply terminals should shut down together.
Order of ② and ③ can be interchanged
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3.
About Changing Audio Signal
Output PWM frequency is sixteen times the sampling frequency “fS”.
Therefore, output PWM frequency will also become unstable if MCLK becomes unstable when switching channel or
switching input. During unstable period, LC resonance may occur and short protection function may work.
MCLK unstable period
MCLK
AUDIODATA
MUTEX
OUTX
ERROR
Figure 50. Action at MCLK Unstable 1
To prevent “MCLK unstable condition”, please obey the following process.
(1) Mute “AUDIODATA” from scaler IC. (A)
(2) After muting “AUDIODATA” (B), set MUTEX=L (C).
(3) After MCLK goes to stable state, set MUTEX=H (D).
(4) Release mute “AUDIODATA” (E).
MCLK unstable period
MCLK
AUDIODATA
Soft-Mute
21.5msec(fs=48kHz.)
Soft-start
21.5msec(fs=48kHz.)
MUTEX
OUTX
PWM STOP
A
B
C
D
E
F
Order of E and F can be interchanged
Figure 51. Action at MCLK Unstable 2
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Especially, if the “twice and more frequency compared with normality” is entered, for some timing, the incorrect
data is set to the IC’s internal resistor and it generates noises continuously.
In case the “twice and more frequency compared with normality” is entered, please follow the timing chart
bellow and add a reset sequence.
(Please release reset after MCLK (BCLK) becomes stable, then release mute of BD28623MUV.)
MCLK(BCLK) unstable period
(Twice and more frequency
compared with normality.)
MCLK
(BCLK)
AUDIODATA
Soft-Mute
21.5msec(fs=48kHz.)
Soft-start
21.5msec(fs=48kHz.)
MUTEX
More than TWAIT*
RESETX
OUTX
PWM STOP
A
B
C D
E
F
G
Order of F and G can be interchanged
*TWAIT: Refer to P.19
Figure 52. Action at MCLK Unstable 3
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4.
Recovery Sequence from the Instantaneous Power Supply Interruption
VCCA
VCCP1
VCCP2
①Instantaneous power interruotion occurs.
④Power recovery
②VCC under 7V
=>UVLO Function ON
(Stop speaker out)
t
REGG
REGD
t
RSTX
t
MCLK
BCLK
LRCLK
SDATA
⑤Degital audio data communication
t
③ Please set MUTEX “L”
and stop digital audio data.
MUTEX
⑦ Please set MUTEX “H”
⑥Wait over TWAIT*
t
⑧Soft Start
21.5msec(fs=48kHz)
Speaker
Output
t
Figure 53. Instantaneous Power Interruption Recovery Sequence
*TWAIT: Refer to P.19
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Application Information
1. About digital audio input
(1) Input digital audio signal sampling frequency (fS)
PWM frequency, Soft-start time, Soft-mute time, and the detection time of the DC voltage protection in the speaker
depend on the sampling frequency (fS) of the digital audio input.
Sampling Frequency of the
Digital Audio Input (fS)
32kHz
PWM Frequency
(fPWM)
512kHz
44.1kHz
48kHz
(2)
32msec
DC Voltage Protection in the
Speaker Detection Time
1.02sec
705.6kHz
23msec
0.74sec
768kHz
21.5msec
0.68sec
Soft-start / Soft-mute Time
Format of digital audio input
MCLK: System Clock input signal
It will input LRCLK, BCLK, SDATA that synchronizes with this clock. MCLK frequency is 256 times the sampling
frequency (256fS) or 512 times the sampling frequency (512fS).
LRCLK: L/R Clock input signal
It corresponds to 32kHz/44.1kHz/48kHz clock (fS) which are same to the sampling frequency (fS). The audio
data of left and right channel for one sample is input to this section.
BCLK: Bit Clock input signal
It is used to latch data per bit using 64 times the sampling frequency (64fS).
SDATA: Data input signal
It is amplitude data. The data length is different according to the resolution of the input digital audio data. It
corresponds to 16/ 20/ 24 bits.
2
(3) I S Data Format
LRCLK
1/64fs
Lch
Rch
BCLK
SDATA
MSB 22 21 20 19 18 17 16 15 14 13 12 11 10
9
8
7
6
5
4
3
2
MSB 22 21 20 19 18 17 16 15 14 13 12 11 10
1 LSB
32 clocks
9
8
7
6
5
4
3
2
1 LSB
32 clocks
Figure 54. I2S Data Format 64fs, 24bit Data
LRCLK
Lch
Rch
BCLK
SDATA
MSB 18 17 16 15 14 13 12 11 10
9
8
7
6
5
4
3
2
MSB 18 17 16 15 14 13 12 11 10
1 LSB
9
8
7
6
5
4
3
2
1 LSB
Figure 55. I2S Data Format 64fs, 20bit Data
LRCLK
Lch
Rch
BCLK
SDATA
MSB 14 13 12 11 10
9
8
7
6
5
4
3
2
MSB 14 13 12 11 10
1 LSB
9
8
7
6
5
4
3
2
1 LSB
Figure 56. I2S Data Format 64fs, 16bit Data
The Low section of LRCLK becomes Lch and the High section of LRCLK becomes Rch.
After changing LRCLK, second bit becomes MSB.
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(4)
Audio Interface Format and Timing
Recommended timing and operating condition (MCLK, BCLK, LRCLK and SDATA)
1/ｆ
/ MCLK
MCLK
1/fLRCLK
LRCLK
1/fBCLK
BCLK
Figure 57. Clock Timing
LRCLK
tSU;LR
tSU;LR
ttHD;LR
HD;LR
BCLK
; SD
tSU
tSU;SD
; SD
tHD
tHD;SD
SDATA
Figure 58. Audio Interface Timing
Limit
No.
Parameter
(Note 8-1)
1
MCLK Frequency
2
LRCLK Frequency
3
BCLK Frequency
4
5
6
7
8
9
10
(Note 8-1)
(Note 8-1)
(Note 8-2)
Setup Time, LRCLK
(Note 8-2)
Hold Time, LRCLK
Setup Time, SDATA
Hold Time, SDATA
MCLK, DUTY
LRCLK, DUTY
BCLK, DUTY
Symbol
fMCLK
fLRCLK
fBCLK
tSU;LR
tHD;LR
tSU;SD
tHD;SD
dMCLK
dLRCLK
dBCLK
MCLK=256fS
Min
Max
8.192
12.288
±10%
±10%
32
48
±10%
±10%
2.048
3.072
±10%
±10%
20
－
20
－
－
20
20
－
40
60
40
60
40
60
MCLK=512fS
Min
Max
16.384
24.576
±10%
±10%
32
48
±10%
±10%
2.048
3.072
±10%
±10%
20
－
20
－
－
20
20
－
40
60
40
60
40
60
Unit
MHz
kHz
MHz
ns
ns
ns
ns
%
%
%
(Note 8-1) Must be synchronized with BCLK, LRCK
(Note 8-2) This regulation is to keep rising edge of LRCK and rising edge of BCLK from overlapping.
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1. Terminal Setting
1) RSTX Pin, MUTEX Pin Function
Condition
Normal
PWM Outputs
(OUT1P, 1N, 2P, 2N)
(Note 10)
High-Z_Low
(Reset mode)
Error Detection
PWM Outputs
ERROR
(OUT1P, 1N, 2P, 2N)
High-Z_Low
H
(Reset mode)
RSTX
MUTEX
L
L/H
“MUTE”
H
L
High-Z_Low
(MUTE_ON)
H
High-Z_Low
(MUTE_ON)
L
“ACTIVE”
H
H
Active
(MUTE_OFF)
H
High-Z_Low
(MUTE_ON)
L
“RESET”
(Note 9)
(Note 10)
(Note 9)
ERROR
H
2
If RSTX is set Low, internal registers (I S / I/F part, ×8 over sampling digital filter part, latch circuit when detecting ERROR) are initialized.
This means that all power transistors are OFF and output terminals are pulled down by 40kΩ (Typ).
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2) GAIN Pin Function
GAIN terminal sets the gain. Gain setting limits maximum output power.
GAIN setting depends on the value of speaker load, because maximum output power depends on speaker load.
Please set GAIN after setting MUTE to L. Pop noise may be occur if GAIN is set while MUTE=H.
GAIN
L
Pull-up (3.3V)
to 47kΩ (1/16W, J (±5%))
H
Gain Setting (BTL)
17dB
Output Power
Min 5 W (at 8Ω)
20dB
Min 10 W (at 8Ω)
26dB
-
V
CC
Vcc
VCC
Vcc
VO_DF=1.1 Vrms
VO_SP=VO_DF x GBTL
VO_DF=1.1Vrms
0V
Digital Filter Output Signal
(Changed into Analog signal)
VO_SP=VO_DF×GBTL
Driver Output Signal
(converted in the analog signal)
Maximum output
Depends on a setup
of Gain
Figure 59.
-Vcc
-VCC
Speaker Output Signal
(BTL Output Signal)
VCC
VCC
ON
rDS
rL
OFF
rL
RL
rDS
OFF
Cg
ON
Cg
Figure 60. Schematic of Output Equivalent
VO _ SP
IN
 V20
 10

PO (THD1%) 
 GBTL 



RL
  10  20  

rDS  2rDC   RL

 VIN
10 20


  10


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TSZ22111・15・001
 GBTL 


 20 

rDS
[Vrms]

RL

 2rDC   RL 
RL
27/49
2
[W]
where:
2
VIN is the I S input level [dBFS]
GBTL is the gain setting [dB]
RL is the load resistance [Ω]
rDS is the resistance of FET [Ω]
(Typ=0.23Ω)
rDC is the DC resistance of inductor [Ω]
TSZ02201-0C1C0E900290-1-2
20.May.2016 Rev.002
BD28623MUV
2. About the Protection Function
Protection Function
Output Short
Protection
DC Voltage
Protection in the
Speaker
Overheat
Protection
Under Voltage
Protection
Detecting & Releasing Condition
PWM Output
OUT1P,1N,2P,2N
ERROR
Detecting
condition
Detecting current = 8A (Typ) /5A (Min. Tj=85°C)
High-Z_Low
(Latch)
L
(Latch)
Detecting
condition
At speaker output, impressed DC voltage over
0.68sec (fS=48kHz)
Over 3.5V (Gain=26dB)
Over 1.75V (Gain=20dB)
Over 1.225V (Gain=17dB)
High-Z_Low
(Latch)
L
(Latch)
Chip temperature above 150°C(Min.)
High-Z_Low
Chip temperature below 120°C(Min.)
Normal
operation
Power supply voltage below 7V (Typ)
High-Z_Low
Detecting
condition
Releasing
condition
Detecting
condition
Releasing
condition
Normal
operation
Power supply voltage above 7.5V (Typ)
L
H
No change in MCLK for more than 1µsec (Typ) or
Clock Stop
Protection
Detecting
condition
No change in BCLK for more than 1µsec (Typ) or
High-Z_Low
H
No change in LRCLK for more than 21µsec (at
fS=48kHz.).
Releasing
condition
Normal input to MCLK, BCLK and LRCLK.
Normal
operation
(Note) The ERROR pin is Nch open-drain output. ERROR pin is pulled up by 100kΩ resistor.
(Note) Once an IC is latched, the circuit is not released automatically even after the detecting status is removed.
Procedure ① or ② is needed for recovery.
①MUTEX terminal is turned Low (holding time at Low = 10msec(Min)) then turned back to High again.
②Power supply is turned on again after dropping to VCC<3V(10msec (Min) holding) in which the internal power ON reset circuit activates.
(Note) Please remove the DC component in SCALER IC of the preceding paragraph of this IC so that DC voltage protection feature not to aim at does not
operate.
The High pass filter function for the DC component removal is not to BD28623MUV.
www.rohm.com
© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
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TSZ02201-0C1C0E900290-1-2
20.May.2016 Rev.002
BD28623MUV
(1) Output Short Protection (Short to Power Supply)
This IC has PWM output short protection circuit that stops the PWM output when the Speaker output (after LC-filter) is
short-circuited to the power supply due to wrong condition.
Detecting condition - It will detect when MUTEX pin is set High and the current that flows in the PWM output pin
becomes 8A(Typ) or more. The PWM output instantaneously enters the state of High-Z_Low if
detected, and the IC is latched.
Releasing method - ①After MUTEX terminal is turned Low (holding time at Low = 10msec(Min)) then turned back to
High again.
② Power supply is turned on again after dropping to VCC<3V(10msec (Min) holding) in which the
internal power ON reset circuit activates.
Short to VCC
Release from short to VCC
OUT1P
OUT1N
OUT2P
OUT2N
t
PWM out : IC latches with High-Z_Low.
Released from latch state.
Over-current
8A(Typ)
t
ERROR
t
About 0.3µsec
MUTEX
Latch release
t
10msec(Min)
Figure 61. Output Short Protection (Short to Power Supply) Sequence
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© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
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TSZ02201-0C1C0E900290-1-2
20.May.2016 Rev.002
BD28623MUV
(2) Output Short Protection6 (Short to GND)
This IC has PWM output short protection circuit that stops the PWM output when the Speaker output (after LC-filter) is
short-circuited to GND due to wrong condition.
Detecting condition - It will detect when MUTEX pin is set High and the current that flows in the PWM output terminal
becomes 8A(Typ) or more. The PWM output instantaneously enters the state of High-Z_Low if
detected, and the IC is latched.
Releasing method - ① After MUTEX terminal is turned Low (holding time at Low = 10msec(Min)) then turned back to
High again.
② Power supply is turned on again after dropping to VCC<3V(10msec (Min) holding) in which the
internal power ON reset circuit activates.
Short to GND
Release from short to GND
OUT1P
OUT1N
OUT2P
OUT2N
t
Released from latch state.
PWM out : IC latches with High-Z_Low.
Over-current
8A(Typ)
t
ERROR
t
About 0.4µsec
MUTEX
Latch release
t
10msec(Min)
Figure 62. Output Short Protection (Short to GND) Sequence
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© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
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TSZ02201-0C1C0E900290-1-2
20.May.2016 Rev.002
BD28623MUV
(3) DC Voltage Protection
When DC voltage is applied to the speaker due to wrong condition, this IC has protection circuit where the speaker is
protected from destruction.
Detecting condition -
It will detect when MUTEX pin is set High and speaker output is more than 3.5V (TYP,
Gain=26dB setting), 1.75V (TYP, Gain=20dB setting), 1.225V (TYP, Gain=17dB setting),
0.68sec (fS=48kHz) or above. Once detected, the PWM output instantaneously enters the state
of High-Z_Low, and the IC is latched.
Releasing method -
①After MUTEX terminal is turned Low (holding time at Low = 10msec(Min)) then turned back
to High again.
② Power supply is turned on again after dropping to VCC<3V(10msec (Min) holding) in which
the internal power ON reset circuit activates.
Abnormal condition
Impress DC voltage to speaker output ever 3.5V
OUT1P
OUT1N
OUT2P
OUT2N
Release abnormal condition
PWM out ： IC latches with High-Z_Low
t
Latch release
3.5V
Speaker
Output
t
-3.5V
Soft-start
21.5msec(fS=48kHz)
Protection start about
0.68sec(fS=48kHz) impress DC
voltage to speaker output
ERROR
t
MUTEX
Latch release
t
10msec(Min)
(GAIN=26dB settings)
Figure 63. DC Voltage Protection Sequence
(Note) Please remove the DC component in SCALER IC of the preceding paragraph of this IC so that DC voltage protection feature not to aim at does not
operate.
The High pass filter function for the DC component removal is not to BD28623MUV.
www.rohm.com
© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
31/49
TSZ02201-0C1C0E900290-1-2
20.May.2016 Rev.002
BD28623MUV
(4) Overheat Protection
This IC has the overheat protection circuit that prevents thermal runaway when the temperature of the chip exceeds
Tjmax=150°C.
Detecting condition -
It will detect when MUTEX pin is set High and the temperature of the chip becomes 150°C
(Min) or more. Speaker output turns MUTE immediately when high temperature protection is
detected.
Releasing condition - It will release when MUTEX pin is set High and the temperature of the chip becomes 120°C
(Min) or less. The speaker output is outputted through a soft-start when released. (Auto
recovery)
Tj
150℃
120℃
t
OUT1P
OUT1N
OUT2P
OUT2N
High-Z_Low
t
Soft-Start(Auto recovery)
21.5msec(fS=48kHz)
Speaker
Output
ERROR
t
3.3V
t
Figure 64. Overheat Protection Sequence
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© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
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TSZ02201-0C1C0E900290-1-2
20.May.2016 Rev.002
BD28623MUV
(5) Under Voltage Protection
This IC has under voltage protection circuit that mutes the speaker output mute once it detects extreme drop of the
power supply voltage.
Detecting condition - It will detect when MUTEX pin is set High and the power supply voltage becomes lower than 7V (Typ).
Speaker output turns MUTE immediately when under voltage protection is detected.
Releasing condition - It will release when MUTEX pin is set High and the power supply voltage becomes more than 7.5V
(Typ). The speaker output is outputted through a soft-start when released. (Auto recovery)
VCCA
VCCP1
VCCP2
7.5V
7V
t
OUT1P
OUT1N
OUT2P
OUT2N
High-Z_Low
t
Soft-start(Auto recovery)
21.5msec(fS=48kHz)
Speaker
Output
ERROR
t
3.3V
t
Figure 65. Under Voltage Protection Sequence
www.rohm.com
© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
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TSZ02201-0C1C0E900290-1-2
20.May.2016 Rev.002
BD28623MUV
(6) Clock Stop Protection (MCLK)
This IC has clock stop protection circuit that mutes the speaker output when the MCLK signal of the digital audio input
stops.
Detecting condition - It will detect when MUTEX pin is set High and the MCLK signal stops for about 1µsec or more.
Speaker output turns MUTE immediately when clock stop protection is detected.
Releasing condition - It will release when MUTEX pin is set High and the MCLK signal returns to the normal clock
operation. The speaker output is outputted through a soft-start when released. (Auto recovery)
Clock stop
Clock recover
MCLK
t
Protection start with
About 1µsec clock stop
OUT1P
OUT1N
OUT2P
OUT2N
High-Z_Low
t
Soft-start(Auto recovery)
21.5msec(fS=48kHz)
Speaker
Output
t
3.3V
ERROR
t
Figure 66. Clock Stop Protection (MCLK) Sequence
www.rohm.com
© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
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TSZ02201-0C1C0E900290-1-2
20.May.2016 Rev.002
BD28623MUV
(7) Clock Stop Protection (BCLK)
This IC has clock stop protection circuit that mutes the speaker output when the BCLK signal of the digital audio input
stops.
Detecting condition - It will detect when MUTEX pin is set High and the BCLK signal stops for about 1µsec or more. Speaker
output turns MUTE immediately when clock stop protection is detected.
Releasing condition - It will release when MUTEX pin is set High and the BCLK signal returns to the normal clock operation.
The speaker output is outputted through a soft-start when released. (Auto recovery)
Clock stop
Clock recover
BCLK
t
Protection start with
about 1µsec clock stop
OUT1P
OUT1N
OUT2P
OUT2N
High-Z_Low
t
Soft-start(Auto recovery)
21.5msec(fS=48kHz)
Speaker
Output
t
3.3V
ERROR
t
Figure 67. Clock Stop Protection (BCLK) Sequence
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© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
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TSZ02201-0C1C0E900290-1-2
20.May.2016 Rev.002
BD28623MUV
(8) Clock Stop Protection (LRCLK)
This IC has clock stop protection circuit that mutes the speaker output when the LRCLK signal of the digital audio input
stops.
Detecting condition - It will detect when MUTEX pin is set High and the LRCLK signal stops for about 21µsec (at fS=48kHz)
or more. Speaker output turns MUTE immediately when clock stop protection is detected.
Releasing condition - It will release when MUTEX pin is set High and the LRCLK signal returns to the normal clock operation.
The speaker output is outputted through a soft-start when released. (Auto recovery)
Clock stop
Clock recover
LRCLK
t
Protection start about
21µsec(fs=48kHz) clock stop
OUT1P
OUT1N
OUT2P
OUT2N
High-Z_Low
t
Soft-start(Auto recovery)
21.5msec(fS=48kHz)
Speaker
Output
t
3.3V
ERROR
t
Figure 68. Clock Stop Protection (LRCLK) Sequence
www.rohm.com
© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
36/49
TSZ02201-0C1C0E900290-1-2
20.May.2016 Rev.002
BD28623MUV
3. Application Circuit Example
Stereo BTL Output, RL=8Ω/6Ω, Vcc≤22V
GNDA
GNDA
L18
10uH
C17
10uF
C19
3.3uF
BSP2P
L13
10uH
C16
0.1uF
REGG
18
VCCA
GNDA
17
16
OUT1N
C14
10uF
GNDA
REGD
15
VCCA
14
13
20
Under Voltage Protection
Clock Stop Protection
C20
10uF
BSP1N
GNDP1
feedback
GNDP2
C8
0.68uF
VCCP1
GNDP2
SP 2ch
(Rch)
C13
0.68uF
GNDP1
C10
10uF
PWM
Modulator
feedback
21
C23
0.68uF
Driver
FET
1N
11
VCCP2
GNDP2
Output Short Protection
Output DC Voltage Protection
High Temperature Protection
Driver
FET
2P
10
VCCP2
19
OUT2P
C18
0.68uF
12
C12
3.3uF
VCCP1
SP 1ch
(Lch)
GNDP2
Driver
FET
2N
C22
3.3uF
8
C9
3.3uF
I2S I/F
Control I/F
OUT1P
L8
10uH
3.3V
7
ERROR
24
To SCALER IC
23
OUT2N
L23
10uH
Driver
FET
1P
×4 Over
Sampling Digital Filter
9
22
BSP2N
BSP1P
MUTEX
R24
100kΩ
1
2
3
4
MCLK
SDATA
BCLK
LRCLK
R1
0Ω
R2
0Ω
R3
0Ω
R4
0Ω
5
GAIN
6
RSTX
3.3V
3.3V
Digital Audio Source
3.3V
3.3V
R5
47kΩ
Figure 69. Application Circuit
Parts
Qty
Parts No.
Inductor
4
L8, L13, L18, L23
1
R5
Resistor
Caution2:
Caution3:
Caution4:
Caution5:
Product No.
10μH / 3.8A / (±20%) / 7.6mm×7.6mm
TOKO
B1047DS-100M
10μH / 3.1A / (±20%) / 6.0mm×6.0mm
Taiyo Yuden
NRS6045T-100MMGK
47kΩ / 1/16W / J(±5%) / 1.0mm×0.5mm
MCR01MZPJ473
ROHM
R1, R2, R3, R4
0Ω / 1/10W / J(±5%) / 1.6mm×0.8mm
1
100kΩ / 1/16W / J(±5%) / 1.0mm×0.5mm
MCR01MZPJ104
0.68μF / 50V / B(±10%） / 2.0mm×1.25mm
GRM21BB31H684KAC4
1
R24
C8, C13,
C18, C23,
C9, C12,
C19, C22
C16
0.1μF / 16V / B(±10%） / 1.6mm×0.8mm
GRM188B11C104KA01
1
C17
10μF / 16V / B(±10%) / 2.0mm×1.25mm
GRM21BB31C106KE15
3
C10, C14, C20
10μF / 35V / B(±10%) / 3.2mm×2.5mm
4
Caution1:
Company
4
4
Capacitor
Description
3.3μF / 16V / B(±10%） / 1.6mm×0.8mm
MURATA
MURATA
MCR03EZPJ000
GRM21BB31E335KA75
GRM32EB3YA106KA12
If the impedance characteristics of the speakers at high-frequency range increase rapidly, the IC might not have stable operation in the resonance
frequency range of the LC filter. Therefore, consider adding damping-circuit, etc., depending on the impedance of the speaker.
Though this IC has a short protection function, when short to VCC or GND after the LC filter, over current occurs during short protection function
operation. Be careful about over/undershoot which exceeds the maximum standard ratings because back electromotive force of the inductor will occur
which sometimes leads to IC destruction.
The Inductor must be use to the coil with large margin of rated DC current (saturation current). When the short-circuit of the speaker output (After the
LC filter) to VCC or GND occurs when the coil with small rated DC current is used, IC destruction might be caused. Because the coil cause the
magnetic saturation behavior, it instantaneously pass the heavy-current to IC.
Overshoot of output PWM differs according to the board or coupling capacitor of Vcc, and etc. Please check to ensure that it is lower than absolute
maximum ratings.
If it exceeds the absolute maximum ratings, snubber circuit must need to be added, the circuit example is shown on the P41 page.
When it is used over Vcc=22V, snubber circuit must need to be added, the circuit example is shown on the P.42 page, and must change LC filter value
to suppress the influence of the LRC resonance..
This circuit constant is value with ROHM evaluation board, and adjustment of the constant may be necessary for the application board. Please carry
out enough evaluations.
www.rohm.com
© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
37/49
TSZ02201-0C1C0E900290-1-2
20.May.2016 Rev.002
BD28623MUV
Application Circuit Example
Stereo BTL Output, RL=8Ω/6Ω, Vcc=22V to 24V
GNDA
GNDA
L18
15uH
C17
10uF
C19
3.3uF
BSP2P
17
L13
15uH
C16
0.1uF
REGG
18
VCCA
GNDA
16
OUT1N
C14
10uF
GNDA
REGD
15
VCCA
14
13
C12
3.3uF
20
C20
10uF
feedback
GNDP2
VCCP1
VCCP1
GNDP2
Driver
FET
2N
C22
3.3uF
ERROR
Control I/F
C8A
680pF
SP 1ch
(Lch)
C9
3.3uF
8
I2S I/F
24
To SCALER IC
23
OUT2N
L23
15uH
Driver
FET
1P
×4 Over
Sampling Digital Filter
C8
0.47uF
R8
5.6Ω
BSP1P
9
22
BSP2N
C13
0.47uF
GNDP1
GNDP2
C23A
680pF
R13
5.6Ω
C10
10uF
PWM
Modulator
feedback
21
R23
5.6Ω
SP 2ch
(Rch)
Under Voltage Protection
Clock Stop Protection
BSP1N
GNDP1
OUT1P
L8
15uH
3.3V
7
C23
0.47uF
Driver
FET
1N
C13A
680pF
11
VCCP2
GNDP2
Output Short Protection
Output DC Voltage Protection
High Temperature Protection
Driver
FET
2P
10
VCCP1
19
OUT2P
R18
5.6Ω
C18
0.47uF
12
C18A
680pF
MUTEX
R24
100kΩ
1
2
3
4
MCLK
SDATA
BCLK
LRCLK
R1
0Ω
R2
0Ω
R3
0Ω
R4
0Ω
5
GAIN
6
RSTX
3.3V
3.3V
Digital Audio Source
3.3V
3.3V
R5
47kΩ
Figure 70. Application Circuit
Parts
Qty
Parts No.
Inductor
4
L8, L13, L18, L23
1
R5
47kΩ / 1/16W / J(±5%) / 1.0mm×0.5mm
4
R1, R2, R3, R4
0Ω / 1/10W / J(±5%) / 1.6mm×0.8mm
4
R8, R13, R18, R23
5.6Ω / 1/4W / J(±5%) / 1.6mm×0.8mm
ESR03EZPJ5R6
1
100kΩ / 1/16W / J(±5%) / 1.0mm×0.5mm
MCR01MZPJ104
680pF / 50V / CH(±5%） / 1.0mm×0.5mm
GRM1552C1H681JA01
0.47μF / 50V / B(±10%） / 2.0mm×1.25mm
1
R24
C8A, C13A,
C18A, C23A
C8, C13,
C18, C23,
C9, C12,
C19, C22
C16
1
C17
10μF / 16V / B(±10%) / 2.0mm×1.25mm
3
C10, C14, C20
10μF / 35V / B(±10%) / 3.2mm×2.5mm
Resistor
4
4
Capacitor
Caution1:
Caution2:
Caution3:
Caution4:
Caution5:
4
Description
Company
Product No.
15μH / 2.9A / (±20%) / 7.6mm×7.6mm
TOKO
B1047DS-150M
15μH / 2.5A / (±20%) / 6.0mm×6.0mm
Taiyo Yuden
NRS6045T-150MMGK
3.3μF / 16V / B(±10%） / 1.6mm×0.8mm
MCR01MZPJ473
ROHM
MCR03EZPJ000
GRM21BB31H474KA87
MURATA
0.1μF / 16V / B(±10%） / 1.6mm×0.8mm
GRM21BB31E335KA75
GRM188B11C104KA01
GRM21BB31C106KE15
MURATA
GRM32EB3YA106KA12
If the impedance characteristics of the speakers at high-frequency range increase rapidly, the IC might not have stable operation in the resonance
frequency range of the LC filter. Therefore, consider adding damping-circuit, etc., depending on the impedance of the speaker.
Though this IC has a short protection function, when short to VCC or GND after the LC filter, over current occurs during short protection function
operation. Be careful about over/undershoot which exceeds the maximum standard ratings because back electromotive force of the inductor will occur
which sometimes leads to IC destruction.
The Inductor must be use to the coil with large margin of rated DC current (saturation current). When the short-circuit of the speaker output (After the
LC filter) to VCC or GND occurs when the coil with small rated DC current is used, IC destruction might be caused. Because the coil cause the
magnetic saturation behavior, it instantaneously pass the heavy-current to IC.
Overshoot of output PWM differs according to the board or coupling capacitor of Vcc, and etc. Please check to ensure that it is lower than absolute
maximum ratings.
If it exceeds the absolute maximum ratings, snubber circuit must need to be added, the circuit example is shown on the P41 page.
When it is used over Vcc=22V, snubber circuit must need to be added, the circuit example is shown on the P42 page, and must change LC filter value
to suppress the influence of the LRC resonance..
This circuit constant is value with ROHM evaluation board, and adjustment of the constant may be necessary for the application board. Please carry
out enough evaluations.
www.rohm.com
© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
38/49
TSZ02201-0C1C0E900290-1-2
20.May.2016 Rev.002
BD28623MUV
Application Circuit Example
Monaural BTL Output, RL=4Ω
GNDA
GNDA
C17
10uF
BSP2P
17
L13
10uH
C16
0.1uF
REGG
18
VCCA
GNDA
REGD
16
OUT1N
C14
10uF
GNDA
15
VCCA
14
13
VCCP2
20
Driver
FET
1N
Under Voltage Protection
Clock Stop Protection
C13
1uF
GNDP1
C10
10uF
PWM
Modulator
21
feedback
BSP1N
GNDP1
11
Output Short Protection
Output DC Voltage Protection
High Temperature Protection
Driver
FET
2P
feedback
10
19
OUT2P
12
C12
3.3uF
GNDP2
GNDP2
C8
1uF
VCCP1
VCCP1
SP 1ch
(Lch)
8
I2S I/F
Control I/F
BSP1P
C9
3.3uF
7
ERROR
Driver
FET
1P
×4 Over
Sampling Digital Filter
24
To SCALER IC
Driver
FET
2N
23
OUT2N
22
BSP2N
9
GNDP2
OUT1P
L8
10uH
3.3V
MUTEX
R24
100kΩ
1
2
3
4
MCLK
SDATA
BCLK
LRCLK
R1
0Ω
R2
0Ω
R3
0Ω
R4
0Ω
5
GAIN
6
RSTX
3.3V
3.3V
Digital Audio Source
3.3V
3.3V
R5
47kΩ
Figure 71. Application Circuit
Parts
Qty
Parts No.
Inductor
4
L8, L13, L18, L23
1
R5
Resistor
Caution2:
Caution3:
Caution4:
Caution5:
Product No.
10μH / 3.8A / (±20%) / 7.6mm×7.6mm
TOKO
B1047DS-100M
10μH / 3.1A / (±20%) / 6.0mm×6.0mm
Taiyo Yuden
NRS6045T-100MMGK
47kΩ / 1/16W / J(±5%) / 1.0mm×0.5mm
MCR01MZPJ473
ROHM
R1, R2, R3, R4
0Ω / 1/10W / J(±5%) / 1.6mm×0.8mm
1
100kΩ / 1/16W / J(±5%) / 1.0mm×0.5mm
MCR01MZPJ104
1μF / 50V / B(±10%） / 2.0mm×1.25mm
GRM21BB31H105KA12
1
R24
C8, C13,
C18, C23
C9, C12,
C19, C22
C16
0.1μF / 16V / B(±10%） / 1.6mm×0.8mm
GRM188B11C104KA01
1
C17
10μF / 16V / B(±10%) / 2.0mm×1.25mm
GRM21BB31C106KE15
3
C10, C14, C20
10μF / 35V / B(±10%) / 3.2mm×2.5mm
4
Caution1:
Company
4
4
Capacitor
Description
3.3μF / 16V / B(±10%） / 1.6mm×0.8mm
MURATA
MURATA
MCR03EZPJ000
GRM21BB31E335KA75
GRM32EB3YA106KA12
If the impedance characteristics of the speakers at high-frequency range increase rapidly, the IC might not have stable operation in the resonance
frequency range of the LC filter. Therefore, consider adding damping-circuit, etc., depending on the impedance of the speaker.
Though this IC has a short protection function, when short to VCC or GND after the LC filter, over current occurs during short protection function
operation. Be careful about over/undershoot which exceeds the maximum standard ratings because back electromotive force of the inductor will occur
which sometimes leads to IC destruction.
The Inductor must be use to the coil with large margin of rated DC current (saturation current). When the short-circuit of the speaker output (After the
LC filter) to VCC or GND occurs when the coil with small rated DC current is used, IC destruction might be caused. Because the coil cause the
magnetic saturation behavior, it instantaneously pass the heavy-current to IC.
Overshoot of output PWM differs according to the board or coupling capacitor of Vcc, and etc. Please check to ensure that it is lower than absolute
maximum ratings.
If it exceeds the absolute maximum ratings, snubber circuit must need to be added, the circuit example is shown on the P41 page.
When it is used over Vcc=22V, snubber circuit must need to be added, the circuit example is shown on the P42 page, and must change LC filter value
to suppress the influence of the LRC resonance..
This circuit constant is value with ROHM evaluation board, and adjustment of the constant may be necessary for the application board. Please carry
out enough evaluations.
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1. About Using BD28623MUV ICs for 2.1ch or 2.2ch audio
Be careful when using two BD28623MUVs at the same time for 2.1ch or 2.2ch audio.
BD28623MUV doesn’t have the function that synchronizes both PWM frequencies of the two BD28623MUVs.
Beat noise may occur due to the difference between PWM frequencies.
Switching current flows to the GND of LC-Filter and only a small part to the speaker which lowers emission noise. When
you have two BD28623MUVs used at the same time with synchronized PWM output, there is common impedance in the
GND of the filter. The GND electric potential becomes higher which also causes noise to become higher. The GND of the
filter is shorted at one point when you use two BD28623MUVs at the same time. (Figure 73.)
BSP1P
BSP2P
DRIVER
OUT1P
OUT2P
OUT1N
OUT2N
DRIVER
BSP1N
BSP2N
Figure 72. Output LC Filter
MAIN
SPEAKER
One point GND
SUB
WOOFER
Figure 73. Circuit Using Two ICs to 2.1ch audio
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2. Selecting External Components
(1) Output LC Filter Circuit
An output filter is required to eliminate radio-frequency components exceeding the audio-frequency region supplied to
a load (speaker). Because this IC uses sampling clock frequencies from 512kHz (fS=32kHz) to 768kHz (fS=48kHz) in
the output PWM signals, the high-frequency components must be appropriately removed.
This section takes an example of an LC type LPF shown below, in which coil L and capacitor C compose a differential
filter with an attenuation property of -12dB/oct. A large part of switching currents of PWM signal flow to capacitor C,
and only a small part of the currents flow to speaker RL. This filter reduces unwanted emission this way. In addition,
coil L and capacitor C compose a filter against in-phase components, reducing unwanted emission further.
.
L
OUT_P
C
RL
C
OUT_N
L
Figure 74. Output LC Filter
The following shows output LC filter constants with typical load impedances.
RL
L
C
4Ω
6Ω, 8Ω
(Vcc≤22V)
6Ω, 8Ω
(Vcc＞22V)
10μH
1μF
10μH
0.68μF
15μH
0.47μF
The inductors must be use with low ESR and with sufficient margin of rated DC current (saturation current).
Power loss will increase if inductors with high ESR are used.
When the short-circuit of the speaker output (After the LC filter) to VCC or GND occurs when the coil with small rated
DC current is used, IC destruction might be caused. Because the coil cause the magnetic saturation behavior, it
instantaneously pass the heavy-current to IC. (The coil of the rated DC current: 7.2A or more will be recommended
when using it by 22V or more.)
Select a closed magnetic circuit type product in normal cases to prevent emission noise.
Use capacitors with low equivalent series resistance, and good impedance characteristics at high frequency ranges
(100kHz or higher). Also, select an item with sufficient voltage rating because massive amount of high-frequency
current flow is expected.
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(2) Snubber circuit constant
When overshoot of PWM Output exceeds absolute maximum rating, or when overshoot of PWM output negatively
affects EMC, or when ringing deteriorates the audio characteristic of the PWM output, snubber circuit is used as
shown below.
(a) Measure the spike resonance frequency “f1” of PWM output waveform (when rising) by using Low capacitance
Probe (e.g. FET probe) at the OUT terminal. (Figure 75)
Shorten GND lead of FET probe and monitor as near as possible to output pin.
(b) Measure the resonance frequency “f2” of the spike as the snubber-circuit R value equals 0Ω
(capacitor “C” is connected to GND)
Adjust the value of the capacitor “C” until it becomes (2 x f2 = f1)
The value of “C” that becomes (2xf2=f1) is 3 times of the parasitic capacity “Cp” that a spike is formed. (C=3Cp)
(c) Parasitic inductance “Lp” is calculated using the next formula.
Lp 
1
2f1 2 C p
(d) The character impedance Z of resonance is calculated from the parasitic capacity “Cp” and the parasitic inductance
Lp using the next formula.
Z
Lp
Cp
(e) Set snubber circuit “R” same as the character impedance “Z”.
Set snubber circuit “C” 4 to 10 times of the parasitic capacity “Cp”.
If “C” is set larger than 10Cp, switching current will possibly increase.
VCC
P
Snubb
er
Spike resonance frequency
LCfilte
r
Driver
5nsec/div
OU
T
C
R
GND
P
Figure 75. PWM Output Waveform
（Measure of Spike Resonance Frequency)
Figure76. Snubber Schematic
The following table shows ROHM recommended value of “Snubber filter constants” when using ROHM 4 layer board.
(Vcc=22V to 24V, RL=8Ω, Po=10W+10W)
C
R
470pF to 820pF, 50V CH(±5%)
Murata GRM1552C1H Series
5.6Ω, 1/4W J(±5%)
ROHM ESR03EZPJ5R6
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3) Operating condition with the application component
Limit
Parameter
Parts No.
Tolerance of Coupling capacitor
for Power supply
C10, C14,
C20
1
Tolerance of Capacitor for
REGG
C17
1
Tolerance of Capacitor for REGD
C16
0.05
C9, C12,
C19, C22
2.0
(Note 11)
Tolerance of Capacitor for BSP
2.0
(Note 11)
4.7
Tolerance of GAIN Terminal Pull
up resistor
R5
43
47
Min
Unit
Typ
Max
(Note 11)
10
-
µF
(Note 11)
10
-
µF
0.1
-
µF
(Note 11)
3.3
Conditions
4.5
(Note 12)
µF
6.3
(Note 12)
µF
B characteristics
Ceramic type capacitor
recommended
B characteristics, 16V
Ceramic type capacitor
recommended
B characteristics, 16V
Ceramic type capacitor
recommended
B characteristics, 16V
Ceramic type capacitor
recommended
51
kΩ
1/16W J(±5%) recommended
(Note 11) Should use the capacity of the capacitor not to be less than a minimum in consideration of temperature characteristics and dc-bias characteristics.
(Note 12) It is value in consideration of +/-10% of capacity unevenness, capacity rate of change 22%. Please use the capacitor within this limit.
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Power Dissipation
VQFN024V4040
4
PCB② 3.56W
Power Dissipation
Pd [W] : Pd [W]
3.5
3
2.5
PCB① 2.21W
2
1.5
1
0.5
0
0
25
50
75
100
125
150
Temperature
Ta [℃:]Ta [°C]
Figure 77. Power Dissipation Curve
VCC
Measuring instrument : TH-156 (Shibukawa Kuwano Electrical Instruments Co., Ltd.)
Measuring conditions : Installation on ROHM’s board
Board size : 74.2mm x 74.2mm x 1.6mm (with thermal via on board)
Material：FR4
・The board and exposed heat sink on the back of package are connected by soldering.
PCB①：4- layer board (Top and bottom layer back copper foil size: 10.29mm2, 2nd and 3rd layer
back copper foil size: 5505mm2),
θja = 56.6°C/W
PCB②：4-layer board（back copper foil size: 5505mm2),
θja = 35.1°C/W
Use a thermal design that has sufficient margin so as not to exceed allowable power dissipation (Pd) in actual operating
conditions. This IC exposes its frame of the backside of package. Note that this part is used to provide heat dissipation
treatment to improve heat dissipation efficiency. Try to occupy as wide as possible heat dissipation pattern not only on the
board surface but also the backside.
Class D speaker amplifier has high efficiency and low heat generation in comparison with conventional analog power
amplifier. However, in case it is operated continuously by maximum output power, power dissipation (Pdiss) may exceed
package dissipation. Please consider heat design that power dissipation (Pdiss) does not exceed package dissipation (Pd) in
average power (Poav).
Package dissipation : PdW   Tj max Ta  / ja
Power dissipation
: PdissW   Poav  1/   1
where:
Tjmax is the maximum junction temperature=150°C
Ta is the peripheral temperature[°C],
θja is the thermal resistance of package[°C/W],
Poav is the average power [W],
η is the efficiency
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Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital
and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block.
Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the
capacitance value when using electrolytic capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on
the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when the
IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating,
increase the board size and copper area to prevent exceeding the Pd rating.
6.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
7.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.
Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of
connections.
8.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always
be turned OFF completely before connecting or removing it from the test setup during the inspection process. To prevent
damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power
supply or ground line.
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Operational Notes – continued
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated.
P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode
or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
C
E
Pin A
N
P+
P
N
N
P+
N
Parasitic
Elements
N
P+
N P
N
P+
B
N
C
E
Parasitic
Elements
P Substrate
P Substrate
Parasitic
Elements
Pin B
B
GND
Parasitic
Elements
GND
GND
N Region
close-by
GND
Figure 78. Example of Monolithic IC Structure
13. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
14. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe
Operation (ASO).
15. Thermal Shutdown Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be
within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction temperature
(Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below the TSD threshold,
the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat
damage.
16. Over-Current Protection Circuit (OCP)
This IC incorporates an integrated over current protection circuit that is activated when the load is shorted. This protection
circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should not be used in
applications characterized by continuous operation or transitioning of the protection circuit.
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Ordering Information
B
D
2
8
6
Part Number
2
3
M
U
V
-
Package
MUV: VQFN024V4040
E2
Packaging and forming specification
E2: Embossed tape and reel
Marking Diagram
VQFN024V4040 (TOP VIEW)
Part Number Marking
2 8 6 2 3
LOT Number
1PIN MARK
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Physical Dimension, Tape and Reel Information
Package Name
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Revision History
Date
Revision
20.Aug.2015
001
First revision
002
P.3 Pin Descriptions, I/O Equivalent Circuits Pin No. 5
P.4 Pin Descriptions, I/O Equivalent Circuits Pin No. 17
P.7 Electrical Characteristics
High level Input Voltage 1, Low level Input Voltage 1 Conditions
P.19 Timing Chart/ Power Supply Start-up Sequence
P.22 Timing Chart/ Action at MCLK Unstable 3
P.23 Timing Chart/ Instantaneous Power Interruption Recovery Sequence
P.38 Application Circuit Example/Product No.
P.39 Application Circuit Example /Description.
P.40 Output LC Filter
P.43 Operating condition with the application component
20.May.2016
Changes
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Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
, transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
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notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
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3.
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concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
Datasheet
BD28623MUV - Web Page
Buy
Distribution Inventory
Part Number
Package
Unit Quantity
Minimum Package Quantity
Packing Type
Constitution Materials List
RoHS
BD28623MUV
VQFN024V4040
2500
2500
Taping
inquiry
Yes