LIGITEK LMD8811-2ESR-XX-PF Dot matrix digit led display (1.2inch) Datasheet

LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
DOT MATRIX DIGIT LED DISPLAY (1.2Inch)
Pb
Lead-Free Parts
LMD8811/2ESR-XX-PF
DATA SHEET
DOC. NO
:
QW0905- LMD8811/2ESR-XX-PF
REV.
:
A
DATE
: 24 - Jun. - 2006
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LMD8811/2ESR-XX-PF
Page 1/8
Package Dimensions
8.0(0.315")
32.0(1.26")
32.0
(1.26")
4.0X7=
28.0(1.102")
ψ3.0(0.118")
4.0X7=28.0(1.102")
LMD8811/2ESR-XX-PF
LIGITEK
6.0±0.5
Ø 0.51
TYP
2.54X7=17.78
(0.7")
PIN NO.1
Note : 1.All dimension are in millimeters and (lnch) tolerance is ±0.25mm unless otherwise noted.
2.Specifications are subject to change without notice.
24.0
(0.945")
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Property of Ligitek Only
Page 2/8
PART NO. LMD8811/2ESR-XX-PF
Internal Circuit Diagram
LMD8811ESR-XX-PF
COLUMN
PIN
ROW
1
9
2
14
3
8
4
12
5
1
6
7
7
2
8
5
1 2 3 4 5 6 7 8
13 3 4 10 6 11 15 16
LMD8812ESR-XX-PF
COLUMN
PIN
ROW
1
9
2
14
3
8
4
12
5
1
6
7
7
2
8
5
1 2 3 4 5 6 7 8
13 3 4 10 6 11 15 16
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 3/8
PART NO. LMD8811/2ESR-XX-PF
Electrical Connection
PIN NO.
LMD8811ESR-XX-PF
PIN NO.
LMD8812ESR-XX-PF
1
Anode Row 5
1
Cathode Row 5
2
Anode Row 7
2
Cathode Row 7
3
Cathode Column 2
3
Anode Column 2
4
Cathode Column 3
4
Anode Column 3
5
Anode Row 8
5
Cathode Row 8
6
Cathode Column 5
6
Anode Column 5
7
Anode Row 6
7
Cathode Row 6
8
Anode Row 3
8
Cathode Row 3
9
Anode Row 1
9
Cathode Row 1
10
Cathode Column 4
10
Anode Column 4
11
Cathode Column 6
11
Anode Column 6
12
Anode Row 4
12
Cathode Row 4
13
Cathode Column 1
13
Anode Column 1
14
Anode Row 2
14
Cathode Row 2
15
Cathode Column 7
15
Anode Column 7
16
Cathode Column 8
16
Anode Column 8
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LMD8811/2ESR-XX-PF
Page 4/8
Absolute Maximum Ratings at Ta=25 ℃
Ratings
Symbol
Parameter
UNIT
SR
Forward Current Per Chip
IF
30
mA
Peak Forward Current Per
Chip (Duty 1/10,0.1ms
Pulse Width)
IFP
100
mA
Power Dissipation Per Chip
PD
100
mW
Ir
10
μA
Operating Temperature
Topr
-25 ~ +85
℃
Storage Temperature
Tstg
-25 ~ +85
℃
Reverse Current Per Any Chip
Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260 ℃
Part Selection And Application Information(Ratings at 25℃)
common
cathode
or
anode
Material Emitted
CHIP
PART NO
△λ
Vf(v)
(nm)
Iv(mcd)
IV-M
Min. Typ. Max. Min. Typ.
Common
Cathode
LMD8811ESR-XX-PF
660
GaAlAs Red
LMD8812ESR-XX-PF
Electrical
λP
(nm)
20
1.5
1.8
Common
Anode
Note : 1.The forward voltage data did not including ±0.1V testing tolerance.
2. The luminous intensity data did not including ±15% testing tolerance.
2.4
6.1
10.5
2:1
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Property of Ligitek Only
Page 5/8
PART NO. LMD8811/2ESR-XX-PF
Test Condition For Each Parameter
Symbol
Unit
Test Condition
Forward Voltage Per Chip
Vf
volt
If=20mA
Luminous Intensity Per Chip
Iv
mcd
If=10mA
Peak Wavelength
λP
nm
If=20mA
△λ
nm
If=20mA
Ir
μA
Vr=5V
Parameter
Spectral Line Half-Width
Reverse Current Any Chip
Luminous Intensity Matching Ratio
IV-M
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LMD8811/2ESR-XX-PF
Page 6/8
Typical Electro-Optical Characteristics Curve
SR CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
3.0
Relative Intensity
Normalize @20mA
Forward Current(mA)
1000
100
10
1.0
2.5
2.0
1.5
1.0
0.5
0.0
0.1
1.0
2.0
3.0
4.0
1.0
5.0
10
Fig.4 Relative Intensity vs. Temperature
1.2
Relative Intensity@20mA
Normalize @25℃
Forward Voltage@20mA
Normalize @25℃
Fig.3 Forward Voltage vs. Temperature
1.1
1.0
0.9
0.8
-20
0
20
40
60
80
100
Relative Intensity@20mA
Fig.5 Relative Intensity vs. Wavelength
1.0
0.5
0.0
650
700
Wavelength (nm)
3.0
2.5
2.0
1.5
1.0
0.5
0.0
-40
-20
0
20
40
60
Ambient Temperature( ℃)
Ambient Temperature( ℃)
600
1000
Forward Current(mA)
Forward Voltage(V)
-40
100
750
80
100
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LMD8811/2ESR-XX-PF
Page 7/8
Soldering Condition(Pb-Free)
1.Iron:
Soldering Iron:30W Max
Temperature 350 ° C Max
Soldering Time:3 Seconds Max(One Time)
Distance:Solder Temperature 1/16 Inch Below Seating
Plane For 3 Seconds At 260 °C
2.Wave Soldering Profile
Dip Soldering
Preheat: 120°C Max
Preheat time: 60seconds Max
Ramp-up
2° C/sec(max)
Ramp-Down:-5° C/sec(max)
Solder Bath:260°C Max
Dipping Time:3 seconds Max
Distance:Solder Temperature 1/16 Inch Below Seating
Plane For 3 Seconds At 260° C
Temp(°C)
260° C3sec Max
260°
5° /sec
max
120°
25°
0° 0
2° /sec
max
Preheat
60 Seconds Max
50
100
150
Time(sec)
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 8/8
PART NO. LMD8811/2ESR-XX-PF
Reliability Test:
Test Item
Test Condition
Description
Reference
Standard
Operating Life Test
1.Under Room Temperature
2.If=10mA
3.t=1000 hrs (-24hrs, +72hrs)
This test is conducted for the purpose
of detemining the resistance of a part
in electrical and themal stressed.
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
High Temperature
Storage Test
1.Ta=105 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of
the device which is laid under condition
of high temperature for hours.
MIL-STD-883:1008
JIS C 7021: B-10
Low Temperature
Storage Test
1.Ta=-40 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance
of the device which is laid under
condition of low temperature for hours.
High Temperature
High Humidity Test
1.Ta=65 ℃±5℃
2.RH=90 %~95%
3.t=240hrs ±2hrs
The purpose of this test is the resistance
of the device under tropical for hours.
Thermal Shock Test
1.Ta=105 ℃±5 ℃&-40 ℃±5 ℃
(10min) (10min)
2.total 10 cycles
The purpose of this is the resistance of
the device to sudden extreme changes
in high and low temperature.
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
Solder Resistance
Test
1.T.Sol=260 ℃±5℃
2.Dwell time= 10 ±1sec.
This test intended to determine the
thermal characteristic resistance
of the device to sudden exposures
at extreme changes in temperature
when soldering the lead wire.
MIL-STD-202: 210A
MIL-STD-750: 2031
JIS C 7021: A-1
Solderability Test
1.T.Sol=230 ℃±5℃
2.Dwell time=5 ±1sec
This test intended to see soldering well
performed or not.
MIL-STD-202: 208D
MIL-STD-750: 2026
MIL-STD-883: 2003
JIS C 7021: A-2
JIS C 7021: B-12
MIL-STD-202:103B
JIS C 7021: B-11
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