Formosa MS Chip Fast Recovery Rectifiers FFM101-MH1 THRU FFM107-MH1 List List................................................................................................. 1 Package outline............................................................................... 2 Features.......................................................................................... 2 Mechanical data............................................................................... 2 Maximum ratings and electrical characteristics ................................. 2 Rating and characteristic curves........................................................ 3 Pinning information........................................................................... 4 Marking........................................................................................... 4 Suggested solder pad layout............................................................. 4 Packing information.......................................................................... 5 Reel packing.................................................................................... 6 Suggested thermal profiles for soldering processes............................. 6 High reliability test capabilities........................................................... 7 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 1 Document ID Issued Date Revised Date Revision Page. DS-121211 2014/01/20 - A 7 Formosa MS Chip Fast Recovery Rectifiers FFM101-MH1 THRU FFM107-MH1 1.0A Surface Mount Fast Recovery Rectifiers-50-1000V Package outline Features • Batch process design, excellent power dissipation offers • • • • • • • • SOD-123H1 better reverse leakage current and thermal resistance. Low profile surface mounted application in order to optimize board space. T iny plastic SMD package. High current capability. Fast switching for high efficiency. High surge current capability. Glass passivated chip junction. Lead-free parts meet RoHS requirments. Suffix "-H" indicates Halogen-free parts, ex. FFM101-MH1-H. 0.146(3.7) 0.130(3.3) 0.071(1.8) 0.056(1.4) 0.012(0.3) Typ. 0.004(0.1) Typ. Mechanical data • • • Epoxy : UL94-V0 rated flame retardant 0.040(1.0) 0.024(0.6) Case : Molded plastic, SOD-123H1 Terminals :Plated terminals, solderable per MIL-STD-750, 0.031(0.8) Typ. 0.031(0.8) Typ. Method 2026 • • • Polarity : Indicated by cathode band Dimensions in inches and (millimeters) Mounting Position : Any Weight : Approximated 0.0103 gram Maximum ratings and Electrical characteristics (AT PARAMETER T A=25 oC unless otherwise noted) SYMBOLS FFM101-MH1 FFM102-MH1 FFM103-MH1 FFM104-MH1 FFM105-MH1 FFM106-MH1 FFM107-MH1 UNIT Maximum repetitive peak reverse voltage VRRM 50 100 200 400 600 800 1000 V Maximum RMS voltage VRMS 35 70 140 280 420 560 700 V Maximum DC blocking voltage VDC 50 100 200 400 600 800 1000 V Maximum average forward rectified current IO 1.0 A Peak forward surge current 8.3ms single half sine-wave(JEDEC method) IFSM 25 A Maximum forward voltage at I F =1.0A VF 1.30 V Maximum DC reverse current T J =25°C at rated DC blocking voltage T J =125°C IR 5.0 100 uA uA Typical thermal resistance junction to ambient Typical thermal resistance junction to case RθJA RθJC 73 53 °C/W °C/W Typical junction capacitance (Note 2) CJ 15 pF Maximum reverse recovery time (Note 1) trr Operating junction temperature range TJ -55 to +150 °C Storage temperature range TSTG -65 to +175 °C 250 150 ns 500 Note 1. Reverse recovery time test condition, I F =0.5A, I R =1.0A, I RR =0.25A 2. Measured at 1 MHz and applied reverse voltage of 4.0 VDC http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 2 Document ID Issued Date Revised Date Revision Page. DS-121211 2014/01/20 - A 7 Rating and characteristic curves (FFM101-MH1 THRU FFM107-MH1) FIG.1-TYPICAL FORWARD FIG.2-TYPICAL FORWARD CURRENT DERATING CURVE AVERAGE FORWARD CURRENT,(A) CHARACTERISTICS 10 3.0 1.0 1.2 1.0 0.8 0.6 0.4 0.2 0 0 20 40 TJ=25 C 60 80 100 120 140 160 180 200 LEAD TEMPERATURE (°C) Pulse Width 300us 1% Duty Cycle 0.1 .01 .6 .8 1.0 1.2 1.4 1.6 1.8 2.0 FORWARD VOLTAGE,(V) FIG.3- TEST CIRCUIT DIAGRAM AND REVERSE RECOVERY TIME CHARACTERISTICS 50W NONINDUCTIVE 10W NONINDUCTIVE ( ) (+) D.U.T. 25Vdc (approx.) PULSE GENERATOR (NOTE 2) ( ) PEAK FORWAARD SURGE CURRENT,(A) FIG.4-MAXIMUM NON-REPETITIVE FORWARD SURGE CURRENT 50 40 30 8.3ms Single Half TJ=25 C JEDEC method 10 0 1 5 2. Rise Time= 10ns max., Source Impedance= 50 ohms. | | | | | | | | 0 -0.25A 100 FIG.5-TYPICAL JUNCTION CAPACITANCE NOTES: 1. Rise Time= 7ns max., Input Impedance= 1 megohm.22pF. +0.5A 50 10 NUMBER OF CYCLES AT 60Hz OSCILLISCOPE (NOTE 1) trr Sine Wave 20 (+) 1W NONINDUCTIVE 35 JUNCTION CAPACITANCE,(pF) INSTANTANEOUS FORWARD CURRENT,(A) 50 30 25 20 15 10 5 0 -1.0A 1cm .01 SET TIME BASE FOR .05 .1 .5 1 5 10 50 100 REVERSE VOLTAGE,(V) 50 / 10ns / cm http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 3 Document ID Issued Date Revised Date Revision Page. DS-121211 2014/01/20 - A 7 Formosa MS Chip Fast Recovery Rectifiers FFM101-MH1 THRU FFM107-MH1 Pinning information Pin Pin1 Pin2 Simplified outline cathode anode 1 Symbol 2 1 2 Marking Type number Marking code FFM101-MH1 FFM102-MH1 FFM103-MH1 FFM104-MH1 FFM105-MH1 FFM106-MH1 FFM107-MH1 F1 F2 F3 F4 F5 F6 F7 Suggested solder pad layout C A B Dimensions in inches and (millimeters) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 PACKAGE A B C SOD-123H1 0.071 (1.80) 0.051 (1.30) 0.067 (1.70) Page 4 Document ID Issued Date Revised Date Revision Page. DS-121211 2014/01/20 - A 7 Formosa MS Chip Fast Recovery Rectifiers FFM101-MH1 THRU FFM107-MH1 Packing information P0 P1 d E F B A W P D2 D1 T C W1 D unit:mm Item Symbol Tolerance SOD-123H1 Carrier width Carrier length Carrier depth Sprocket hole 13" Reel outside diameter 13" Reel inner diameter 7" Reel outside diameter 7" Reel inner diameter Feed hole diameter Sprocket hole position Punch hole position Punch hole pitch Sprocket hole pitch Embossment center Overall tape thickness Tape width Reel width A B C d D D1 D D1 D2 E F P P0 P1 T W W1 0.1 0.1 0.1 0.1 2.0 min 2.0 min 0.5 0.1 0.1 0.1 0.1 0.1 0.1 0.3 1.0 2.00 3.85 1.10 1.50 178.00 62.00 13.00 1.75 3.50 4.00 4.00 2.00 0.23 8.00 11.40 Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above. http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 5 Document ID Issued Date Revised Date Revision Page. DS-121211 2014/01/20 - A 7 Formosa MS Chip Fast Recovery Rectifiers FFM101-MH1 THRU FFM107-MH1 Reel packing PACKAGE REEL SIZE SOD-123H1 7" REEL (pcs) COMPONENT SPACING (m/m) 3,000 4.0 BOX (pcs) 30,000 INNER BOX REEL DIA, CARTON SIZE CARTON APPROX. GROSS WEIGHT (m/m) (m/m) (m/m) (pcs) (kg) 183*123*183 178 382*257*387 240,000 9.0 Suggested thermal profiles for soldering processes 1.Storage environment: Temperature=5 oC ~40 oC Humidity=55%±25% 2.Reflow soldering of surface-mount devices Critical Zone TL to TP Tp TP Ramp-up TL TL Tsmax Temperature Tsmin tS Preheat Ramp-down 25 t25o C to Peak Time 3.Reflow soldering Profile Feature Soldering Condition Average ramp-up rate(T L to T P ) o <3 C /sec Preheat -Temperature Min(Tsmin) -Temperature Max(Tsmax) -Time(min to max)(t s ) 150 oC 200 oC 60~120sec Tsmax to T L -Ramp-upRate <3 oC/sec Time maintained above: -Temperature(T L ) -Time(t L ) 217 oC 60~260sec 255 oC-0/+5 oC Peak Temperature(T P ) Time within 5 oC of actual Peak Temperature(t P ) 10~30sec Ramp-down Rate <6 oC/sec Time 25 oC to Peak Temperature <6minutes http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 6 Document ID Issued Date Revised Date Revision Page. DS-121211 2014/01/20 - A 7 Formosa MS Chip Fast Recovery Rectifiers FFM101-MH1 THRU FFM107-MH1 High reliability test capabilities Item Test Conditions Reference O 1. Solder Resistance at 260 ± 5 C for 10 ± 2sec. MIL-STD-750D METHOD-2031 2. Solderability at 245±5 OC for 5 sec. MIL-STD-202F METHOD-208 3. High Temperature Reverse Bias V R=80% rate at T J=150 OC for 168 hrs. MIL-STD-750D METHOD-1038 4. Forward Operation Life Rated average rectifier current at T A=25 OC for 500hrs. MIL-STD-750D METHOD-1027 T A = 25 OC, I F = I O On state: power on for 5 min. off state: power off for 5 min. on and off for 500 cycles. MIL-STD-750D METHOD-1036 5. Intermittent Operation Life 6. Pressure Cooker JESD22-A102 15P SIG at T A=121 OC for 4 hrs. MIL-STD-750D METHOD-1051 7. Temperature Cycling -55 OC to +125 OC dwelled for 30 min. and transferred for 5min. total 10 cycles. 8. Forward Surge 8.3ms single half sine-wave , one surge. MIL-STD-750D METHOD-4066-2 9. Humidity at T A=85 OC, RH=85% for 1000hrs. MIL-STD-750D METHOD-1021 10. High Temperature Storage Life at 175 OC for 1000 hrs. MIL-STD-750D METHOD-1031 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 7 Document ID Issued Date Revised Date Revision Page. DS-121211 2014/01/20 - A 7