FESD3V3B Low capacitance ESD protection Applications ● Lan equipment ● Video ● DVI ● High Speed Data Line ● Ethernet ● USB 2.0 Power and Data line Protection Feature ● With TVS Diode ● ESD Protection:Level 4 ● Low clamping voltage ● 100 Watts peak pulse power per line(tp=8/20uS) ● Ultra low capacitance:15pf max.(any I/O to GND.) ● Protection one line I/O port IEC Compatibility ● EN61000-4 ● 61000-4-2(ESD):Level4, Contact:±8kv, Air:±15kv ● 61000-4-4(EFT):40A-5/50ns ● 61000-4-5(Surge):4A-8/20us SOD523 Mechanical Characteristics ● Molded JEDEC SOD523 package ● Packging:Tape and Reel ● Flammability rating UL 94V-0 ● Halgen Free Device Characteristics Maximum Ratings@25 unless otherwise specified Parameter Symbol Value Units Peak pulse power (tp=8/20us) PPP 100 Watts Operating Temperature TJ -55~150 °C TSTG -55~150 °C Storage Temperature STD-A 2016-01 Futurewafer Technology Co.,Ltd FESD3V3B Low capacitance ESD protection Parameter Symbol Condition VRWM Pin 2 to 1/Pin 1 to 2 VBR(min) IZ=1mA Pin to Pin IR(max) Clamping Voltage Peak Pulse Current Reverse Stand-off Voltage Reverse Breakdown Voltage Reverse Leakage Current Junction Capacitance max Units 3.3 V 5 V @VRWM 0.4 uA VC IPP=5A tp=8/20us 18 V IPP tp=8/20us 5 A 15 pf C I/O Pin capacitance to GND. Vdc=0V,f=1MHZ min 3.8 Rating and characteristic curve FIGURE 1 Power Derating Curve STD-A 2016-01 Futurewafer Technology Co.,Ltd FESD3V3B Low capacitance ESD protection Electrical Characteristics (T=25°C) Ordering information Marking codes V3 Part No. Marking Code FESD3V3B V3 Quantity 3,000pcs Futurewafer Technology co.,Ltd 台灣未來芯航電股份有限公司 Tel ：+886-3-3573583 Futurewafer.com.tw 桃園市桃園區中正路 987 巷 50 弄 2 號 STD-A 2016-01 Futurewafer Technology Co.,Ltd