MLOTM Hi-Q Inductors The Multilayer Organic Hi-Q Inductor is a low profile organic based inductor that can support mobile communications, satellite applications, GPS, matching networks, and collision avoidance. The MLOTM Hi-Q Inductor series of components are based on AVX’s patented multilayer organic technology (US patent 6,987,307 and 7,439,840). MLOTM Hi-Q Inductors incorporate very low loss organic materials and low profile copper which allow for high Q and high stability over frequency. MLOTM HiQ Inductors are surface mountable and are expansion matched to FR4 printed wiring boards. MLOTM Hi-Q Inductors utilize fine line high density interconnect technology thereby allowing for tight tolerance control and high repeatability. Reliability testing is performed to JEDEC and mil standards. Finishes are available in RoHS compliant Sn. APPLICATIONS FEATURES • • • • • • • • • • • • • Mobile communications Satellite Applications GPS Collision Avoidance Wireless LAN’s SURFACE MOUNT ADVANTAGES High Q High SRF High Frequency Low DC Resistance Surface Mountable 0402 Case Size RoHS Compliant Finishes Available in Tape and Reel • • • • • Inherent Low Profile Excellent Solderability Low Parasitics Better Heat Dissipation Expansion Matched to PCB HOW TO ORDER HLQ 02 XXX X T TR Type HLQ = High Q Size 02 = 0402 Inductance Expressed in nH (2 significant digits + number of zeros) for values <10nH, letter R denotes decimal point. Example: 22nH = 220 4.7nH = 4R7 Tolerance B = ±0.1nH C = ±0.2nH H = ±3% Termination Sn100 Packaging Tape & Reel DIMENSIONS QUALITY INSPECTION Finished parts are 100% tested for electrical parameters and visual characteristics. R T TERMINATION RoHS compliant Sn finish. L W OPERATING TEMPERATURE mm (inches) 1 -55ºC to +125ºC L W T R 1.00±0.10 (0.040±0.004) 0.58±0.075 (0.023±0.003) 0.35±0.10 (0.014±0.004) 0.125±0.050 (0.005±0.002) MLOTM Hi-Q Inductors 0402 ELECTRICAL SPECIFICATIONS L (nH) 450MHz 0.8 0.9 1 1.1 1.2 1.3 1.5 1.6 1.8 2 2.2 2.4 2.7 3 3.3 3.6 3.9 4.7 5.6 6.8 8.2 10 12 15 18 22 27 30 32 Available Inductance Tolerance B = ±0.1nH, C = ±0.2nH H = ±3% ±0.1nH, ±0.2nH ±0.1nH, ±0.2nH ±0.1nH, ±0.2nH ±0.1nH, ±0.2nH ±0.1nH, ±0.2nH ±0.1nH, ±0.2nH ±0.1nH, ±0.2nH ±0.1nH, ±0.2nH ±0.1nH, ±0.2nH ±0.1nH, ±0.2nH ±0.1nH, ±0.2nH ±0.1nH, ±0.2nH ±0.1nH, ±0.2nH ±0.1nH, ±0.2nH ±0.1nH, ±0.2nH ±0.1nH, ±0.2nH ±0.1nH, ±0.2nH ±0.1nH, ±0.2nH ±0.1nH, ±0.2nH ±3% ±3% ±3% ±3% ±3% ±3% ±3% ±3% ±3% ±3% Q min 450MHz SRF min (GHz) Rdc max (mΩ) Idc max (mA) 17 17 17 17 17 17 17 17 17 17 17 17 17 17 17 17 17 17 17 17 17 17 17 17 17 17 17 17 17 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 6 5 4 4 3 3 3 2 2 100 100 100 100 110 130 150 150 160 180 200 200 250 300 340 350 400 480 500 600 800 1000 1100 1200 1500 1900 2100 2200 2200 350 350 330 330 330 330 330 300 300 245 245 245 245 225 225 200 200 195 170 160 130 120 110 110 110 95 95 85 85 Specifications based on performance of component assembled properly on printed circuit board with 50Ω nominal impedance. Idc max: Maximum 15ºC rise in component temperature over ambient. 2