ON MC10H164L 8 line multiplexer Datasheet

MC10H164
8-Line Multiplexer
The MC10H164 is a MECL 10H part which is a functional/pinout
duplication of the standard MECL 10K family part, with 100%
improvement in propagation delay, and no increase in power supply
current.
The MC10H164 is designed to be used in data multiplexing and
parallel to serial conversion applications. Full parallel gating provides
equal delays through any data path. The MC10H164 incorporates an
output buffer, eight inputs and an enable. A high on the enable forces
the output low. The open emitter output allows the MC10H164 to be
connected directly to a data bus. The enable line allows an easy means
of expanding to more than 8 lines using additional MC10H164’s.
• Propagation Delay, 1.0 ns Typical
• Power Dissipation, 310 mW Typical (same as MECL 10K)
• Improved Noise Margin 150 mV (Over Operating Voltage and
Temperature Range)
• Voltage Compensated
• MECL 10K–Compatible
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MARKING
DIAGRAMS
16
CDIP–16
L SUFFIX
CASE 620
MC10H164L
AWLYYWW
1
16
PDIP–16
P SUFFIX
CASE 648
MC10H164P
AWLYYWW
1
1
LOGIC DIAGRAM
A 7
VCC1 =
VCC2 =
VEE =
B 9
C 10
PLCC–20
FN SUFFIX
CASE 775
PIN 1
PIN 16
PIN 8
Enable 2
10H164
AWLYYWW
Z
15
X0 6
A
WL
YY
WW
X1 5
X2 4
X3 3
= Assembly Location
= Wafer Lot
= Year
= Work Week
X4 11
TRUTH TABLE
X5 12
X7 14
DIP PIN ASSIGNMENT
VCC1
ENABLE
1
16
2
15
VCC2
Z
X3
3
14
X7
X2
4
13
X6
X1
5
12
X5
X0
6
11
X4
A
7
10
C
VEE
8
9
B
March, 2000 – Rev. 7
A
L
H
L
H
L
H
L
H
X
Z
X0
X1
X2
X3
X4
X5
X6
X7
L
ORDERING INFORMATION
Device
Pin assignment is for Dual–in–Line Package.
For PLCC pin assignment, see the Pin Conversion Tables on page 18
of the ON Semiconductor MECL Data Book (DL122/D).
 Semiconductor Components Industries, LLC, 2000
C
L
L
L
L
H
H
H
H
X
ENABLE
L
L
L
L
L
L
L
L
H
X6 13
ADDRESS INPUTS
B
L
L
H
H
L
L
H
H
X
1
Package
Shipping
MC10H164L
CDIP–16
25 Units/Rail
MC10H164P
PDIP–16
25 Units/Rail
MC10H164FN
PLCC–20
46 Units/Rail
Publication Order Number:
MC10H164/D
MC10H164
MAXIMUM RATINGS
Symbol
Rating
Unit
VEE
VI
Power Supply (VCC = 0)
Characteristic
–8.0 to 0
Vdc
Input Voltage (VCC = 0)
0 to VEE
Vdc
Iout
Output Current – Continuous
– Surge
50
100
mA
TA
Tstg
Operating Temperature Range
0 to +75
°C
–55 to +150
–55 to +165
°C
°C
Storage Temperature Range – Plastic
– Ceramic
ELECTRICAL CHARACTERISTICS (VEE = –5.2 V ±5%) (See Note 1.)
0°
Symbol
IE
Characteristic
Power Supply Current
25°
75°
Min
Max
Min
Max
Min
Max
Unit
–
83
–
75
–
83
mA
µA
IinH
IinL
Input Current High
–
512
–
320
–
320
Input Current Low
0.7
–
0.7
–
0.7
–
µA
VOH
VOL
High Output Voltage
–1.02
–0.84
–0.98
–0.81
–0.92
–0.735
Vdc
Low Output Voltage
–1.95
–1.63
–1.95
–1.63
–1.95
–1.60
Vdc
VIH
VIL
High Input Voltage
–1.17
–0.84
–1.13
–0.81
–1.07
–0.735
Vdc
Low Input Voltage
–1.95
–1.48
–1.95
–1.48
–1.95
–1.45
Vdc
Propagation Delay
Enable
Data
Address
0.4
0.7
1.0
1.45
2.4
2.8
0.4
0.8
1.1
1.5
2.5
2.9
0.5
0.9
1.2
1.7
2.6
3.2
Rise Time
0.5
1.5
0.5
1.6
0.5
1.7
ns
Fall Time
0.5
1.5
0.5
1.6
0.5
1.7
ns
AC PARAMETERS
tpd
tr
tf
ns
1. Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been
established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 Iinear fpm is
maintained. Outputs are terminated through a 50–ohm resistor to –2.0 volts.
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2
MC10H164
TYPICAL APPLICATIONS
FIGURE 1 – HIGH SPEED 16–BIT MULTIPLEXER/DEMULTIPLEXER
Control Selection
15 14 13 12 11 10 9 8
S0
S1
CR
A
7 6 5 4 3 2 1 0
MC10H136
B
C
D
E1
C
B
A
MC10H164
D0
E1
C
B
A
MC10H164
E1
C
B
A
MC10H161
MC10H164
D0
S0
S0
S1
S1
CR
A
CR
MC10H136
B
C
D
E0
MC10H161
MC10H162
E1
C
B
A
Start/Stop
15 14 1312 11 10 9 8
FIGURE 2 – 1–OF–64 LINE MULTIPLEXER
E
A B C
MC10H164
E
A B C
MC10H164
E
MSB
MC10H161
9
7
LSB
Q7
Q6
Q5
Q4
Q3
Q2
Q1
Q0
E
E
3
Dout
A B C
MC10H164
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Dout
A B C
MC10H164
E
Dout
A B C
MC10H164
E
Dout
A B C
MC10H164
The Bit chosen is dependent on six–bit
code present on inputs 7, 9, 14 of the
MC10H161 and the A, B, C inputs of the
MC10H164.
Dout
A B C
MC10H164
E
Dout
A B C
MC10H164
14
Dout
Dout
E0
7 6 5 4 3 2 1 0
MC10H164
PACKAGE DIMENSIONS
PLCC–20
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 775–02
ISSUE C
0.007 (0.180) M T L–M
B
Y BRK
–N–
U
N
S
0.007 (0.180) M T L–M
S
S
N
S
D
–L–
–M–
Z
W
20
D
1
G1
X
V
0.010 (0.250)
S
T L–M
S
N
S
VIEW D–D
A
0.007 (0.180) M T L–M
S
N
S
R
0.007 (0.180) M T L–M
S
N
S
0.007 (0.180) M T L–M
H
S
N
S
Z
K1
K
C
E
F
0.007 (0.180) M T L–M
S
0.004 (0.100)
G
J
–T–
VIEW S
G1
0.010 (0.250) S T L–M
S
N
S
VIEW S
SEATING
PLANE
NOTES:
1. DATUMS –L–, –M–, AND –N– DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS PLASTIC
BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE TOP
AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037 (0.940).
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE
THE H DIMENSION TO BE SMALLER THAN 0.025
(0.635).
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DIM
A
B
C
E
F
G
H
J
K
R
U
V
W
X
Y
Z
G1
K1
INCHES
MIN
MAX
0.385
0.395
0.385
0.395
0.165
0.180
0.090
0.110
0.013
0.019
0.050 BSC
0.026
0.032
0.020
–––
0.025
–––
0.350
0.356
0.350
0.356
0.042
0.048
0.042
0.048
0.042
0.056
–––
0.020
2_
10 _
0.310
0.330
0.040
–––
MILLIMETERS
MIN
MAX
9.78
10.03
9.78
10.03
4.20
4.57
2.29
2.79
0.33
0.48
1.27 BSC
0.66
0.81
0.51
–––
0.64
–––
8.89
9.04
8.89
9.04
1.07
1.21
1.07
1.21
1.07
1.42
–––
0.50
2_
10 _
7.88
8.38
1.02
–––
N
S
MC10H164
PACKAGE DIMENSIONS
–A–
16
9
1
8
–B–
CDIP–16
L SUFFIX
CERAMIC DIP PACKAGE
CASE 620–10
ISSUE T
C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
L
DIM
A
B
C
D
E
F
G
H
K
L
M
N
–T–
K
N
SEATING
PLANE
M
E
F
J
G
D
16 PL
0.25 (0.010)
16 PL
0.25 (0.010)
M
T A
T B
M
–A–
9
1
8
B
F
C
L
S
–T–
SEATING
PLANE
K
H
G
D
M
J
16 PL
0.25 (0.010)
M
MILLIMETERS
MIN
MAX
19.05
19.93
6.10
7.49
–––
5.08
0.39
0.50
1.27 BSC
1.40
1.65
2.54 BSC
0.21
0.38
3.18
4.31
7.62 BSC
0_
15 _
0.51
1.01
S
PDIP–16
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648–08
ISSUE R
16
S
INCHES
MIN
MAX
0.750
0.785
0.240
0.295
–––
0.200
0.015
0.020
0.050 BSC
0.055
0.065
0.100 BSC
0.008
0.015
0.125
0.170
0.300 BSC
0_
15 _
0.020
0.040
T A
M
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NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
DIM
A
B
C
D
F
G
H
J
K
L
M
S
INCHES
MIN
MAX
0.740
0.770
0.250
0.270
0.145
0.175
0.015
0.021
0.040
0.70
0.100 BSC
0.050 BSC
0.008
0.015
0.110
0.130
0.295
0.305
0_
10 _
0.020
0.040
MILLIMETERS
MIN
MAX
18.80
19.55
6.35
6.85
3.69
4.44
0.39
0.53
1.02
1.77
2.54 BSC
1.27 BSC
0.21
0.38
2.80
3.30
7.50
7.74
0_
10 _
0.51
1.01
MC10H164
Notes
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MC10H164
Notes
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MC10H164
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including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or
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MC10H164/D
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