Cypress CY7C433-30LMB 256/512/1k/2k/4k x 9 asynchronous fifo Datasheet

CY7C419/21/25/29/33256/512/1K/2K/4K x 9 Asynchronous FIFO
CY7C419/21/25/29/33
256/512/1K/2K/4K x 9 Asynchronous FIFO
Features
• Asynchronous first-in first-out (FIFO) buffer memories
• 256 x 9 (CY7C419)
• 512 x 9 (CY7C421)
• 1K x 9 (CY7C425)
• 2K x 9 (CY7C429)
• 4K x 9 (CY7C433)
• Dual-ported RAM cell
• High-speed 50.0-MHz read/write independent of
depth/width
• Low operating power: ICC = 35 mA
• Empty and Full flags (Half Full flag in standalone)
• TTL compatible
• Retransmit in standalone
• Expandable in width
• PLCC, 7x7 TQFP, SOJ, 300-mil and 600-mil DIP
• Pb-Free Packages Available
• Pin compatible and functionally equivalent to IDT7200,
IDT7201, IDT7202, IDT7203, IDT7204, AM7200, AM7201,
AM7202, AM7203, and AM7204
Functional Description
The CY7C419, CY7C420/1, CY7C424/5, CY7C428/9, and
CY7C432/3 are first-in first-out (FIFO) memories offered in
Cypress Semiconductor Corporation
Document #: 38-06001 Rev. *B
•
600-mil wide and 300-mil wide packages. They are, respectively, 256, 512, 1,024, 2,048, and 4,096 words by 9-bits wide.
Each FIFO memory is organized such that the data is read in
the same sequential order that it was written. Full and Empty
flags are provided to prevent overrun and underrun. Three
additional pins are also provided to facilitate unlimited
expansion in width, depth, or both. The depth expansion
technique steers the control signals from one device to
another in parallel, thus eliminating the serial addition of
propagation delays, so that throughput is not reduced. Data is
steered in a similar manner.
The read and write operations may be asynchronous; each
can occur at a rate of 50.0 MHz. The write operation occurs
when the write (W) signal is LOW. Read occurs when read (R)
goes LOW. The nine data outputs go to the high-impedance
state when R is HIGH.
A Half Full (HF) output flag is provided that is valid in the
standalone and width expansion configurations. In the depth
expansion configuration, this pin provides the expansion out
(XO) information that is used to tell the next FIFO that it will be
activated.
In the standalone and width expansion configurations, a LOW
on the retransmit (RT) input causes the FIFOs to retransmit
the data. Read enable (R) and write enable (W) must both be
HIGH during retransmit, and then R is used to access the data.
The CY7C419, CY7C420, CY7C421, CY7C424, CY7C425,
CY7C428, CY7C429, CY7C432, and CY7C433 are fabricated
using an advanced 0.65-micron P-well CMOS technology.
Input ESD protection is greater than 2000V and latch-up is
prevented by careful layout and guard rings.
3901 North First Street
•
San Jose, CA 95134
•
408-943-2600
Revised June 30, 2005
CY7C419/21/25/29/33
Logic Block Diagram
Pin Configurations
DATA INPUTS
(D0–D 8)
DIP
Top View
D3
D8
W
NC
Vcc
D4
D5
PLCC/LCC
Top View
RAM ARRAY
256 x 9
512 x 9
1024x 9
2048x 9
4096x 9
WRITE
POINTER
READ
POINTER
TQFP
Top View
RESET
LOGIC
READ
CONTROL
FLAG
LOGIC
XI
MR
1
28
2
27
3
26
4
25
5
24
7C419
6 7C420/1 23
7 7C424/5 22
8 7C428/9 21
7C432/3
9
20
10
19
11
18
12
17
13
16
15
14
Vcc
D4
D5
D6
D7
FL/RT
MR
EF
XO/HF
Q7
Q6
Q5
Q4
R
FL/RT
32 3130 29 28 27 26 25
EF
FF
EXPANSION
LOGIC
D2
DATA OUTPUTS
(Q0–Q 8)
R
XO/HF
Q7
Q6
Q3
Q8
GND
NC
R
Q4
Q5
THREESTATE
BUFFERS
W
D8
D3
D2
D1
D0
XI
FF
Q0
Q1
Q2
Q3
Q8
GND
D6
D7
NC
FL/RT
MR
EF
D5
D6
WRITE
CONTROL
4 3 2 1 323130
5
29
6
28
7
27
8
26
7C419
7C421/5/9 25
9
7C433
10
24
11
23
12
22
13
21
14 15 1617 181920
D3
D8
W
VCC
D4
W
D2
D1
D0
XI
FF
Q0
Q1
NC
Q2
D1
D0
1
2
3
4
5
6
7
8
NC
NC
XI
FF
Q0
Q1
XO/HF
24
23
22
21
20
19
18
17
7C419
7C421/5/9
7C433
D7
FL/RT
NC
NC
MR
EF
XO/HF
Q7
Q6
Q5
Q2
Q3
Q8
GND
R
Q4
9 10 11 12 13 14 15 16
Selection Guide
256 x 9
7C419–10
7C419–15
512 x 9 (600-mil only)
512 x 9
7C421–10
7C421–15
1K x 9 (600-mil only)
1K x 9
7C425–10
7C425–15
2K x 9 (600-mil only)
2K x 9
7C419–30
7C420–20
7C420–25
7C421–20
7C421–25
7C424–20
7C424–25
7C425–20
7C425–25
7C420–40
7C420–65
7C421–30
7C421–40
7C421–65
7C424–30
7C424–40
7C424–65
7C425–30
7C425–40
7C425–65
7C428–20
7C429–10
7C429–15
7C429–20
4K x 9 (600-mil only)
4K x 9
7C419–40
7C428–65
7C429–25
7C429–30
7C432–25
7C429–40
7C429–65
7C432–40
7C433–10
7C433–15
7C433–20
7C433–25
7C433–30
7C433–40
7C433–65
Frequency (MHz)
50
40
33.3
28.5
25
20
12.5
Maximum Access Time (ns)
10
15
20
25
30
40
65
ICC1 (mA)
35
35
35
35
35
35
35
Maximum Rating[1]
DC Voltage Applied to Outputs
in High Z State ................................................–0.5V to +7.0V
(Above which the useful life may be impaired. For user guidelines, not tested.)
DC Input Voltage ............................................–0.5V to +7.0V
Storage Temperature .................................–65°C to +150°C
Ambient Temperature with
Power Applied.............................................–55°C to +125°C
Supply Voltage to Ground Potential ............... –0.5V to +7.0V
Power Dissipation.......................................................... 1.0W
Output Current, into Outputs (LOW)............................ 20 mA
Static Discharge Voltage............................................ >2000V
(per MIL–STD–883, Method 3015)
Latch-Up Current ..................................................... >200 mA
Note:
1. Single Power Supply: The voltage on any input or I/O pin can not exceed the power pin during power-up.
Document #: 38-06001 Rev. *B
Page 2 of 25
CY7C419/21/25/29/33
Operating Range
Range
Ambient Temperature[2]
VCC
0°C to + 70°C
5V ± 10%
Industrial
–40°C to +85°C
5V ± 10%
Military
–55°C to +125°C
5V ± 10%
Commercial
Electrical Characteristics Over the Operating Range[3]
Parameter
Description
VOH
Output HIGH Voltage
VOL
Output LOW Voltage
VIH
Input HIGH Voltage
VIL
IIX
IOZ
IOS
Test Conditions
VCC = Min., IOH = –2.0 mA
VCC = Min., IOL = 8.0 mA
Com’l
Mil/Ind
Input LOW Voltage
Input Leakage Current
Output Leakage Current
Output Short Circuit Current[5]
GND < VI < VCC
R > VIH, GND < VO < VCC
VCC = Max., VOUT = GND
7C419–10, 15, 30, 40
7C420/1–10, 15, 20, 25, 30, 40, 65
7C424/5–10, 15, 20, 25, 30, 40, 65
7C428/9–10, 15, 20, 25, 30, 40, 65
7C432/3–10, 15, 20, 25, 30, 40, 65
Min.
Max.
2.4
0.4
2.0
VCC
2.2
VCC
Note 4
0.8
–10
+10
–10
+10
–90
Unit
V
V
V
V
µA
µA
mA
Electrical Characteristics Over the Operating Range[3] (continued)
Parameter
ICC
Description
Operating Current
Test Conditions
VCC = Max.,
IOUT = 0 mA
f = fMAX
Com’l
7C419–10
7C419–15
7C421–10
7C421–15
7C425–10
7C425–15
7C429–10
7C429–15
7C420–20
7C421–20
7C424–20
7C425–20
7C428–20
7C429–20
7C433–10
7C433–15
7C433–20
7C420–25
7C421–25
7C424–25
7C425–25
7C429–25
7C432–25
7C433–25
Min. Max. Min. Max. Min. Max. Min. Max.
85
Mil/Ind
65
55
50
100
90
80
Unit
mA
ICC1
Operating Current
VCC = Max.,
IOUT = 0 mA
F = 20 MHz
Com’l
35
35
35
35
mA
ISB1
Standby Current
All Inputs =
VIH Min.
Com’l
10
10
10
10
mA
15
15
15
ISB2
Power-Down Current All Inputs >
VCC –0.2V
Com’l
5
5
5
8
8
8
Mil/Ind
Mil/Ind
5
mA
Notes:
2. TA is the “instant on” case temperature.
3. See the last page of this specification for Group A subgroup testing information.
4. VIL (Min.) = –2.0V for pulse durations of less than 20 ns.
5. For test purposes, not more than one output at a time should be shorted. Short circuit test duration should not exceed 30 seconds.
Document #: 38-06001 Rev. *B
Page 3 of 25
CY7C419/21/25/29/33
Electrical Characteristics Over the Operating Range[3] (continued)
7C419–30
7C421–30
7C424–30
7C425–30
7C429–30
7C433–30
Parameter
ICC
Description
Test Conditions
Operating Current
Min.
Max.
7C419–40
7C420–40
7C421–40
7C424–40
7C425–40
7C420–65
7C421–65
7C424–65
7C425–65
7C428–65
7C429–65
7C429–40
7C432–40
7C433–40
Min.
7C433–65
Max.
Unit
VCC = Max.,
IOUT = 0 mA
f = fMAX
Com’l
40
Max.
35
Min.
35
mA
Mil/Ind
75
70
65
ICC1
Operating Current
VCC = Max.,
IOUT = 0 mA
F = 20 MHz
Com’l
35
35
35
mA
ISB1
Standby Current
All Inputs =
VIH Min.
Com’l
10
10
10
mA
Mil
15
15
15
ISB2
Power-Down Current
All Inputs >
VCC –0.2V
Com’l
5
5
5
Mil
8
8
8
mA
Capacitance[6]
Parameter
Description
CIN
Input Capacitance
COUT
Output Capacitance
Test Conditions
TA = 25°C, f = 1 MHz,
VCC = 4.5V
Max.
Unit
6
pF
6
pF
AC Test Loads and Waveforms
R1 500 Ω
5V
R1 500 Ω
5V
OUTPUT
ALL INPUT PULSES
3.0V
OUTPUT
R2
333 Ω
30 pF
INCLUDING
JIGAND
SCOPE
(a)
R2
333 Ω
5 pF
INCLUDING
JIGAND
SCOPE
GND
≤ 3 ns
90%
10%
90%
10%
≤ 3 ns
(b)
Equivalent to:
THÉVENIN EQUIVALENT
200Ω
OUTPUT
2V
Note:
6. Tested initially and after any design or process changes that may affect these parameters.
Document #: 38-06001 Rev. *B
Page 4 of 25
CY7C419/21/25/29/33
Switching Characteristics Over the Operating Range[7, 8]
Parameter
Description
7C419–10
7C419–15
7C421–10
7C421–15
7C425–10
7C425–15
7C429–10
7C429–15
7C420–20
7C421–20
7C424–20
7C425–20
7C428–20
7C429–20
7C433–10
7C433–15
7C433–20
Min.
Max.
Min.
Max.
Min.
Max.
Max.
Access Time
tRR
Read Recovery Time
10
10
10
10
ns
tPR
Read Pulse Width
10
15
20
25
ns
tLZR[6,9]
Read LOW to Low Z
3
3
3
3
ns
Data Valid After Read HIGH
5
15
5
35
Unit
tA
10
30
Min.
Read Cycle Time
tDVR
25
7C429–25
7C432–25
7C433–25
tRC
[9,10]
20
7C420–25
7C421–25
7C424–25
7C425–25
20
5
ns
25
5
ns
ns
tHZR[6,9,10]
Read HIGH to High Z
tWC
Write Cycle Time
20
25
30
35
ns
tPW
Write Pulse Width
10
15
20
25
ns
tHWZ[6,9]
Write HIGH to Low Z
5
5
5
5
ns
tWR
Write Recovery Time
10
10
10
10
ns
tSD
Data Set-Up Time
6
8
12
15
ns
tHD
Data Hold Time
0
0
0
0
ns
tMRSC
MR Cycle Time
20
25
30
35
ns
tPMR
MR Pulse Width
10
15
20
25
ns
tRMR
MR Recovery Time
10
10
10
10
ns
tRPW
Read HIGH to MR HIGH
10
15
20
25
ns
tWPW
Write HIGH to MR HIGH
10
15
20
25
ns
tRTC
Retransmit Cycle Time
20
25
30
35
ns
tPRT
Retransmit Pulse Width
10
15
20
25
ns
tRTR
Retransmit Recovery Time
10
10
10
10
ns
15
15
15
18
ns
Notes:
7. Test conditions assume signal transition time of 3 ns or less, timing reference levels of 1.5V and output loading of the specified IOL/IOH and 30 pF load
capacitance, as in part (a) of AC Test Load and Waveforms, unless otherwise specified.
8. See the last page of this specification for Group A subgroup testing information.
9. tHZR transition is measured at +200 mV from VOL and –200 mV from VOH. tDVR transition is measured at the 1.5V level. tHWZ and tLZR transition is measured
at ±100 mV from the steady state.
10. tHZR and tDVR use capacitance loading as in part (b) of AC Test Load and Waveforms.
Document #: 38-06001 Rev. *B
Page 5 of 25
CY7C419/21/25/29/33
Switching Characteristics Over the Operating Range[7, 8] (continued)
Parameter
Description
7C419–10
7C419–15
7C421–10
7C421–15
7C425–10
7C425–15
7C429–10
7C429–15
7C420–20
7C421–20
7C424–20
7C425–20
7C428–20
7C429–20
7C433–10
7C433–15
7C433–20
Max.
Min.
Max.
Unit
MR to EF LOW
20
25
30
35
ns
tHFH
MR to HF HIGH
20
25
30
35
ns
tFFH
MR to FF HIGH
20
25
30
35
ns
tREF
Read LOW to EF LOW
10
15
20
25
ns
tRFF
Read HIGH to FF HIGH
10
15
20
25
ns
tWEF
Write HIGH to EF HIGH
10
15
20
25
ns
tWFF
Write LOW to FF LOW
10
15
20
25
ns
tWHF
Write LOW to HF LOW
10
15
20
25
ns
tRHF
Read HIGH to HF HIGH
10
15
20
25
ns
tRAE
Effective Read from Write HIGH
25
ns
tRPE
Effective Read Pulse Width After EF HIGH
tWAF
Effective Write from Read HIGH
tWPF
Effective Write Pulse Width After FF HIGH
tXOL
Expansion Out LOW Delay from Clock
10
15
20
25
ns
tXOH
Expansion Out HIGH Delay from Clock
10
15
20
25
ns
10
10
Max.
15
15
10
10
Min.
Max.
7C429–25
7C432–25
7C433–25
tEFL
Document #: 38-06001 Rev. *B
Min.
7C420–25
7C421–25
7C424–25
7C425–25
20
20
15
15
Min.
25
20
20
ns
25
25
ns
ns
Page 6 of 25
CY7C419/21/25/29/33
Switching Characteristics Over the Operating Range[7, 8] (continued)
7C419–30
7C421–30
7C424–30
7C425–30
7C429–30
7C433–30
Parameter
Description
Min.
Max.
7C429–40
7C432–40
7C433–40
Min.
Max.
7C433–65
Min.
Max.
Read Cycle Time
Access Time
tRR
Read Recovery Time
10
10
15
ns
tPR
Read Pulse Width
30
40
65
ns
Read LOW to Low Z
3
3
3
ns
Data Valid After Read HIGH
5
5
5
ns
tDVR[9,10]
tHZR
[6,9,10]
30
Read HIGH to High Z
80
Unit
tA
tLZR
50
7C420–65
7C421–65
7C424–65
7C425–65
7C428–65
7C429–65
tRC
[6,9]
40
7C419–40
7C420–40
7C421–40
7C424–40
7C425–40
40
20
ns
65
20
20
ns
ns
tWC
Write Cycle Time
40
50
80
ns
tPW
Write Pulse Width
30
40
65
ns
tHWZ[6,9]
Write HIGH to Low Z
5
5
5
ns
tWR
Write Recovery Time
10
10
15
ns
tSD
Data Set-Up Time
18
20
30
ns
tHD
Data Hold Time
0
0
0
ns
tMRSC
MR Cycle Time
40
50
80
ns
tPMR
MR Pulse Width
30
40
65
ns
tRMR
MR Recovery Time
10
10
15
ns
tRPW
Read HIGH to MR HIGH
30
40
65
ns
tWPW
Write HIGH to MR HIGH
30
40
65
ns
tRTC
Retransmit Cycle Time
40
50
80
ns
tPRT
Retransmit Pulse Width
30
40
65
ns
tRTR
Retransmit Recovery Time
10
tEFL
MR to EF LOW
40
50
80
ns
tHFH
MR to HF HIGH
40
50
80
ns
tFFH
MR to FF HIGH
40
50
80
ns
tREF
Read LOW to EF LOW
30
35
60
ns
tRFF
Read HIGH to FF HIGH
30
35
60
ns
tWEF
Write HIGH to EF HIGH
30
35
60
ns
tWFF
Write LOW to FF LOW
30
35
60
ns
tWHF
Write LOW to HF LOW
30
35
60
ns
tRHF
Read HIGH to HF HIGH
30
35
60
ns
tRAE
Effective Read from Write HIGH
60
ns
tRPE
Effective Read Pulse Width After EF HIGH
tWAF
Effective Write from Read HIGH
tWPF
Effective Write Pulse Width After FF HIGH
tXOL
Expansion Out LOW Delay from Clock
30
40
65
ns
tXOH
Expansion Out HIGH Delay from Clock
30
40
65
ns
Document #: 38-06001 Rev. *B
10
30
30
15
35
40
30
30
ns
65
35
40
ns
60
65
ns
ns
Page 7 of 25
CY7C419/21/25/29/33
Switching Waveforms
Asynchronous Read and Write
tRC
tA
tPR
tA
tRR
R
tLZR
tDVR
tHZR
DATA VALID
Q0–Q 8
tPW
tWC
DATA VALID
tWR
W
tSD
tHD
DATA VALID
D0–D 8
DATA VALID
Master Reset
tMRSC [12]
tPMR
MR
R, W [11]
tRPW
tWPW
tEFL
tRMR
EF
tHFH
HF
tFFH
FF
Half-full Flag
HALF FULL
HALF FULL+1
HALF FULL
W
tRHF
R
tWHF
HF
Notes:
11. W and R ≥ VIH around the rising edge of MR.
12. tMRSC = tPMR + tRMR.
Document #: 38-06001 Rev. *B
Page 8 of 25
CY7C419/21/25/29/33
Switching Waveforms (continued)
Last Write to First Read Full Flag
LAST WRITE
FIRST READ
ADDITIONAL
READS
FIRST WRITE
ADDITIONAL
WRITES
FIRST READ
R
W
tRFF
tWFF
FF
Last Read to First Write Empty Flag
LAST READ
FIRST WRITE
W
R
tWEF
tREF
EF
tA
DATA OUT
VALID
VALID
Retransmit[13]
tRTC[14]
tPRT
FL/RT
R,W
tRTR
Notes:
13. EF, HF and FF may change state during retransmit as a result of the offset of the read and write pointers, but flags will be valid at tRTC.
14. tRTC = tPRT + tRTR.
Document #: 38-06001 Rev. *B
Page 9 of 25
CY7C419/21/25/29/33
Switching Waveforms (continued)
Empty Flag and Read Data Flow-through Mode
DATA IN
W
tRAE
R
tREF
EF
tWEF
tHWZ
tRPE
tA
DATA OUT
DATA VALID
Full Flag and Write Data Flow-through Mode
R
tWAF
tWPF
W
tRFF
tWFF
FF
tHD
DATA IN
DATA VALID
tA
DATA OUT
Document #: 38-06001 Rev. *B
tSD
DATA VALID
Page 10 of 25
CY7C419/21/25/29/33
Switching Waveforms (continued)
Expansion Timing Diagrams
WRITE TO LAST PHYSICAL
LOCATION OF DEVICE 1
WRITE TO FIRST PHYSICAL
LOCATION OF DEVICE 2
W
tWR
tXOL
XO1(XI2)[15]
tXOH
tHD
tSD
DATA VALID
D0–D 8
READ FROM LAST PHYSICAL
LOCATION OF DEVICE 1
tHD
tSD
DATA VALID
READ FROM FIRST PHYSICAL
LOCATION OF DEVICE 2
R
tRR
tXOL
tXOH
[15]
XO1(XI2)
tHZR
tLZR
tDVR
tDVR
DATA
VALID
Q0–Q 8
tA
DATA
VALID
tA
Note:
15. Expansion Out of device 1 (XO1) is connected to Expansion In of device 2 (XI2).
Architecture
Resetting the FIFO
The CY7C419, CY7C420/1, CY7C424/5, CY7C428/9,
CY7C432/3 FIFOs consist of an array of 256, 512, 1024, 2048,
4096 words of 9 bits each (implemented by an array of
dual-port RAM cells), a read pointer, a write pointer, control
signals (W, R, XI, XO, FL, RT, MR), and Full, Half Full, and
Empty flags.
Upon power-up, the FIFO must be reset with a Master Reset
(MR) cycle. This causes the FIFO to enter the empty condition
signified by the Empty flag (EF) being LOW, and both the Half
Full (HF) and Full flags (FF) being HIGH. Read (R) and write
(W) must be HIGH tRPW/tWPW before and tRMR after the rising
edge of MR for a valid reset cycle. If reading from the FIFO
after a reset cycle is attempted, the outputs will all be in the
high-impedance state.
Dual-Port RAM
The dual-port RAM architecture refers to the basic memory
cell used in the RAM. The cell itself enables the read and write
operations to be independent of each other, which is
necessary to achieve truly asynchronous operation of the
inputs and outputs. A second benefit is that the time required
to increment the read and write pointers is much less than the
time that would be required for data propagation through the
memory, which would be the case if the memory were implemented using the conventional register array architecture.
Document #: 38-06001 Rev. *B
Writing Data to the FIFO
The availability of at least one empty location is indicated by a
HIGH FF. The falling edge of W initiates a write cycle. Data
appearing at the inputs (D0–D8) tSD before and tHD after the
rising edge of W will be stored sequentially in the FIFO.
The EF LOW-to-HIGH transition occurs tWEF after the first
LOW-to-HIGH transition of W for an empty FIFO. HF goes
LOW tWHF after the falling edge of W following the FIFO
actually being Half Full. Therefore, the HF is active once the
Page 11 of 25
CY7C419/21/25/29/33
FIFO is filled to half its capacity plus one word. HF will remain
LOW while less than one half of total memory is available for
writing. The LOW-to-HIGH transition of HF occurs tRHF after
the rising edge of R when the FIFO goes from half full +1 to
half full. HF is available in standalone and width expansion
modes. FF goes LOW tWFF after the falling edge of W, during
the cycle in which the last available location is filled. Internal
logic prevents overrunning a full FIFO. Writes to a full FIFO are
ignored and the write pointer is not incremented. FF goes
HIGH tRFF after a read from a full FIFO.
Reading Data from the FIFO
The falling edge of R initiates a read cycle if the EF is not LOW.
Data outputs (Q0–Q8) are in a high-impedance condition
between read operations (R HIGH), when the FIFO is empty,
or when the FIFO is not the active device in the depth
expansion mode.
When one word is in the FIFO, the falling edge of R initiates a
HIGH-to-LOW transition of EF. The rising edge of R causes the
data outputs to go to the high-impedance state and remain
such until a write is performed. Reads to an empty FIFO are
ignored and do not increment the read pointer. From the empty
condition, the FIFO can be read tWEF after a valid write.
The retransmit feature is beneficial when transferring packets
of data. It enables the receipt of data to be acknowledged by
the receiver and retransmitted if necessary.
The Retransmit (RT) input is active in the standalone and width
expansion modes. The retransmit feature is intended for use
when a number of writes equal to or less than the depth of the
FIFO have occurred since the last MR cycle. A LOW pulse on
RT resets the internal read pointer to the first physical location
of the FIFO. R and W must both be HIGH while and tRTR after
retransmit is LOW. With every read cycle after retransmit,
previously accessed data as well as not previously accessed
data is read and the read pointer is incremented until it is equal
to the write pointer. Full, Half Full, and Empty flags are
governed by the relative locations of the read and write
pointers and are updated during a retransmit cycle. Data
written to the FIFO after activation of RT are transmitted also.
Up to the full depth of the FIFO can be repeatedly retransmitted.
Standalone/Width Expansion Modes
Standalone and width expansion modes are set by grounding
Expansion In (XI) and tying First Load (FL) to VCC. FIFOs can
be expanded in width to provide word widths greater than nine
in increments of nine. During width expansion mode, all control
line inputs are common to all devices, and flag outputs from
any device can be monitored.
Document #: 38-06001 Rev. *B
Depth Expansion Mode (see Figure 1)
Depth expansion mode is entered when, during a MR cycle,
Expansion Out (XO) of one device is connected to Expansion
In (XI) of the next device, with XO of the last device connected
to XI of the first device. In the depth expansion mode the First
Load (FL) input, when grounded, indicates that this part is the
first to be loaded. All other devices must have this pin HIGH.
To enable the correct FIFO, XO is pulsed LOW when the last
physical location of the previous FIFO is written to and pulsed
LOW again when the last physical location is read. Only one
FIFO is enabled for read and one for write at any given time.
All other devices are in standby.
FIFOs can also be expanded simultaneously in depth and
width. Consequently, any depth or width FIFO can be created
of word widths in increments of 9. When expanding in depth,
a composite FF must be created by ORing the FFs together.
Likewise, a composite EF is created by ORing the EFs
together. HF and RT functions are not available in depth
expansion mode.
Use of the Empty and Full Flags
In order to achieve the maximum frequency, the flags must be
valid at the beginning of the next cycle. However, because
they can be updated by either edge of the read of write signal,
they must be valid by one-half of a cycle. Cypress FIFOs meet
this requirement; some competitors’ FIFOs do not.
The reason why the flags are required to be valid by the next
cycle is fairly complex. It has to do with the “effective pulse
width violation” phenomenon, which can occur at the full and
empty boundary conditions, if the flags are not properly used.
The empty flag must be used to prevent reading from an empty
FIFO and the full flag must be used to prevent writing into a full
FIFO.
For example, consider an empty FIFO that is receiving read
pulses. Because the FIFO is empty, the read pulses are
ignored by the FIFO, and nothing happens. Next, a single word
is written into the FIFO, with a signal that is asynchronous to
the read signal. The (internal) state machine in the FIFO goes
from empty to empty+1. However, it does this asynchronously
with respect to the read signal, so that it cannot be determined
what the effective pulse width of the read signal is, because
the state machine does not look at the read signal until it goes
to the empty+1 state. In a similar manner, the minimum write
pulse width may be violated by attempting to write into a full
FIFO, and asynchronously performing a read. The empty and
full flags are used to avoid these effective pulse width violations, but in order to do this and operate at the maximum
frequency, the flag must be valid at the beginning of the next
cycle.
Page 12 of 25
CY7C419/21/25/29/33
XO
R
W
FF
9
EF
CY7C419
CY7C420/1
CY7C424/5
CY7C428/9
CY7C432/3
9
D
9
Q
FL
VCC
XI
XO
FULL
FF
EF
CY7C419
CY7C420/1
CY7C424/5
CY7C428/9
CY7C432/3
9
EMPTY
FL
XI
XO
*
FF
9
MR
CY7C419
CY7C420/1
CY7C424/5
CY7C428/9
CY7C432/3
EF
FL
XI
* FIRST DEVICE
Figure 1. Depth Expansion
Document #: 38-06001 Rev. *B
Page 13 of 25
CY7C419/21/25/29/33
Ordering Information
Speed
(ns)
10
15
Ordering Code
Package
Type
Package Type
Operating
Range
CY7C419–10AC
A32
32-Pin Thin Plastic Quad Flatpack
CY7C419–10JC
J65
32-Lead Plastic Leaded Chip Carrier
CY7C419–10JXC
J65
32-Lead Pb-Free Plastic Leaded Chip Carriers
CY7C419–10PC
P21
28-Lead (300-Mil) Molded DIP
CY7C419–10VC
V21
28-Lead (300-Mil) Molded SOJ
CY7C419–15AC
A32
32-Pin Thin Plastic Quad Flatpack
CY7C419–15JC
J65
32-Lead Plastic Leaded Chip Carrier
CY7C419–15JXC
J65
32-Lead Pb-Free Plastic Leaded Chip Carrier
CY7C419–15VC
V21
28-Lead (300-Mil) Molded SOJ
CY7C419-15VXC
V21
28-Lead (300-Mil) Pb-Free Molded SOJ
CY7C419–15JI
J65
32-Lead Plastic Leaded Chip Carrier
Industrial
Commercial
30
CY7C419–30JC
J65
32-Lead Plastic Leaded Chip Carrier
40
CY7C419–40AC
A32
32-Pin Thin Plastic Quad Flatpack
CY7C419–40JC
J65
32-Lead Plastic Leaded Chip Carrier
Commercial
Commercial
Ordering Information (continued)
Speed
(ns)
Ordering Code
Package
Type
Package Type
25
CY7C420–25PC
P15
28-Lead (600-Mil) Molded DIP
40
CY7C420–40PC
P15
28-Lead (600-Mil) Molded DIP
65
CY7C420–65PC
P15
28-Lead (600-Mil) Molded DIP
Operating
Range
Commercial
Ordering Information (continued)
Speed
(ns)
10
15
20
Ordering Code
Package
Type
Package Type
CY7C421–10AC
A32
32-Pin Thin Plastic Quad Flatpack
CY7C421–10JC
J65
32-Lead Plastic Leaded Chip Carrier
CY7C421–10JXC
J65
32-Lead Pb-Free Plastic Leaded Chip Carriers
CY7C421–10PC
P21
28-Lead (300-Mil) Molded DIP
CY7C421–10VC
V21
28-Lead (300-Mil) Molded SOJ
CY7C421–15AC
A32
32-Pin Thin Plastic Quad Flatpack
CY7C421–15AXC
A32
32-Pin Pb-Free Thin Plastic Quad Flatpack
CY7C421–15JC
J65
32-Lead Plastic Leaded Chip Carrier
CY7C421–15JI
J65
32-Lead Plastic Leaded Chip Carrier
CY7C421–15VI
V21
28-Lead (300-Mil) Molded SOJ
CY7C421–15DMB
D22
28-Lead (300-Mil) CerDIP
CY7C421–15LMB
L55
32-Pin Rectangular Leadless Chip Carrier
CY7C421–20JC
J65
32-Lead Plastic Leaded Chip Carrier
CY7C421–20JXC
J65
32-Lead Pb-Free Plastic Leaded Chip Carriers
CY7C421–20PC
P21
28-Lead (300-Mil) Molded DIP
CY7C421–20VC
V21
28-Lead (300-Mil) Molded SOJ
CY7C421–20VXC
V21
28-Lead (300-Mil) Pb-Free Molded SOJ
CY7C421–20JI
J65
32-Lead Plastic Leaded Chip Carrier
Document #: 38-06001 Rev. *B
Operating
Range
Commercial
Commercial
Industrial
Military
Commercial
Industrial
Page 14 of 25
CY7C419/21/25/29/33
Ordering Information (continued)
Speed
(ns)
25
30
40
65
Ordering Code
Package
Type
Package Type
Operating
Range
CY7C421–25JC
J65
32-Lead Plastic Leaded Chip Carrier
CY7C421–25PC
P21
28-Lead (300-Mil) Molded DIP
Commercial
CY7C421–25VC
V21
28-Lead (300-Mil) Molded SOJ
CY7C421–25JI
J65
32-Lead Plastic Leaded Chip Carrier
CY7C421–25PI
P21
28-Lead (300-Mil) Molded DIP
CY7C421–25DMB
D22
28-Lead (300-Mil) CerDIP
Military
CY7C421–30JC
J65
32-Lead Plastic Leaded Chip Carrier
Commercial
CY7C421–30PC
P21
28-Lead (300-Mil) Molded DIP
CY7C421–30JI
J65
32-Lead Plastic Leaded Chip Carrier
Industrial
CY7C421–30DMB
D22
28-Lead (300-Mil) CerDIP
Military
CY7C421–30LMB
L55
32-Pin Rectangular Leadless Chip Carrier
CY7C421–40JC
J65
32-Lead Plastic Leaded Chip Carrier
CY7C421–40PC
P21
28-Lead (300-Mil) Molded DIP
CY7C421–40VC
V21
28-Lead (300-Mil) Molded SOJ
CY7C421–40JI
J65
32-Lead Plastic Leaded Chip Carrier
Industrial
CY7C421–65JC
J65
32-Lead Plastic Leaded Chip Carrier
Commercial
CY7C421–65PC
P21
28-Lead (300-Mil) Molded DIP
CY7C421–65VC
V21
28-Lead (300-Mil) Molded SOJ
CY7C421–65JI
J65
32-Lead Plastic Leaded Chip Carrier
Industrial
CY7C421–65DMB
D22
28-Lead (300-Mil) CerDIP
Military
Industrial
Commercial
Ordering Information (continued)
Speed
(ns)
Ordering Code
Package
Type
Package Type
Operating
Range
40
CY7C424–40PC
P15
28-Lead (600-Mil) Molded DIP
Commercial
65
CY7C424–65PC
P15
28-Lead (600-Mil) Molded DIP
Commercial
Ordering Information (continued)
Speed
(ns)
10
15
Ordering Code
Package
Type
Package Type
CY7C425–10AC
A32
32-Pin Thin Plastic Quad Flatpack
CY7C425–10AXC
A32
32-Pin Pb-Free Thin Plastic Quad Flatpack
CY7C425–10JC
J65
32-Lead Plastic Leaded Chip Carrier
CY7C425–10JXC
J65
32-Lead Pb-Free Plastic Leaded Chip Carrier
CY7C425–10PC
P21
28-Lead (300-Mil) Molded DIP
CY7C425–10VC
V21
28-Lead (300-Mil) Molded SOJ
CY7C425–15JC
J65
32-Lead Plastic Leaded Chip Carrier
CY7C425–15JXC
J65
32-Lead Pb-Free Plastic Leaded Chip Carrier
CY7C425–15PC
P21
28-Lead (300-Mil) Molded DIP
CY7C425–15DMB
D22
28-Lead (300-Mil) CerDIP
CY7C425–15LMB
L55
32-Pin Rectangular Leadless Chip Carrier
Document #: 38-06001 Rev. *B
Operating
Range
Commercial
Commercial
Military
Page 15 of 25
CY7C419/21/25/29/33
Ordering Information (continued)
Speed
(ns)
20
25
30
40
65
Ordering Code
Package
Type
Package Type
Operating
Range
CY7C425–20JC
J65
32-Lead Plastic Leaded Chip Carrier
CY7C425–20JXC
J65
32-Lead Pb-Free Plastic Leaded Chip Carrier
Commercial
CY7C425–20PC
P21
28-Lead (300-Mil) Molded DIP
CY7C425–20VC
V21
28-Lead (300-Mil) Molded SOJ
CY7C425–20VXC
V21
28-Lead (300-Mil) Pb-Free Molded SOJ
CY7C425–25JC
J65
32-Lead Plastic Leaded Chip Carrier
CY7C425–25PC
P21
28-Lead (300-Mil) Molded DIP
CY7C425–25JI
J65
32-Lead Plastic Leaded Chip Carrier
CY7C425–25VI
V21
28-Lead (300-Mil) Molded SOJ
CY7C425–25DMB
D22
28-Lead (300-Mil) CerDIP
CY7C425–25LMB
L55
32-Pin Rectangular Leadless Chip Carrier
CY7C425–30JC
J65
32-Lead Plastic Leaded Chip Carrier
CY7C425–30PC
P21
28-Lead (300-Mil) Molded DIP
CY7C425–30VC
V21
28-Lead (300-Mil) Molded SOJ
CY7C425–30VI
V21
28-Lead (300-Mil) Molded SOJ
Industrial
CY7C425–40JC
J65
32-Lead Plastic Leaded Chip Carrier
Commercial
CY7C425–40PC
P21
28-Lead (300-Mil) Molded DIP
CY7C425–40VC
V21
28-Lead (300-Mil) Molded SOJ
CY7C425–40JI
J65
32-Lead Plastic Leaded Chip Carrier
Industrial
CY7C425–65JC
J65
32-Lead Plastic Leaded Chip Carrier
Commercial
CY7C425–65PC
P21
28-Lead (300-Mil) Molded DIP
Commercial
Industrial
Military
Commercial
Ordering Information (continued)
Speed
(ns)
Ordering Code
Package
Type
Package Type
Operating
Range
20
CY7C428–20PC
P15
28-Lead (600-Mil) Molded DIP
Commercial
25
CY7C428–25DMB
D16
28-Lead (600-Mil) CerDIP
Military
65
CY7C428–65PC
P15
28-Lead (600-Mil) Molded DIP
Commercial
Ordering Information (continued)
Speed
(ns)
10
15
Ordering Code
Package
Type
Package Type
Operating
Range
CY7C429–10AC
A32
32-Pin Thin Plastic Quad Flatpack
CY7C429–10AXC
A32
32-Pin Pb-Free Thin Plastic Quad Flatpack
CY7C429–10JC
J65
32-Lead Plastic Leaded Chip Carrier
CY7C429–10PC
P21
28-Lead (300-Mil) Molded DIP
CY7C429–15JC
J65
32-Lead Plastic Leaded Chip Carrier
CY7C429–15JXC
J65
32-Lead Pb-Free Plastic Leaded Chip Carrier
CY7C429–15JI
J65
32-Lead Plastic Leaded Chip Carrier
Industrial
CY7C429–15DMB
D22
28-Lead (300-Mil) CerDIP
Military
CY7C429–15LMB
L55
32-Pin Rectangular Leadless Chip Carrier
Document #: 38-06001 Rev. *B
Commercial
Commercial
Page 16 of 25
CY7C419/21/25/29/33
Ordering Information (continued)
Speed
(ns)
20
25
30
40
65
Ordering Code
Package
Type
Package Type
Operating
Range
CY7C429–20JC
J65
32-Lead Plastic Leaded Chip Carrier
CY7C429–20JXC
J65
32-Lead Pb-Free Plastic Leaded Chip Carrier
Commercial
CY7C429–20PC
P21
28-Lead (300-Mil) Molded DIP
CY7C429–20VC
V21
28-Lead (300-Mil) Molded SOJ
CY7C429–20DMB
D22
28-Lead (300-Mil) CerDIP
Military
CY7C429–25JC
J65
32-Lead Plastic Leaded Chip Carrier
Commercial
CY7C429–25PC
P21
28-Lead (300-Mil) Molded DIP
CY7C429–25VC
V21
28-Lead (300-Mil) Molded SOJ
CY7C429–25JI
J65
32-Lead Plastic Leaded Chip Carrier
Industrial
CY7C429–25DMB
D22
28-Lead (300-Mil) CerDIP
Military
CY7C429–25LMB
L55
32-Pin Rectangular Leadless Chip Carrier
CY7C429–30JC
J65
32-Lead Plastic Leaded Chip Carrier
CY7C429–30PC
P21
28-Lead (300-Mil) Molded DIP
CY7C429–30VC
V21
28-Lead (300-Mil) Molded SOJ
CY7C429–30DMB
D22
28-Lead (300-Mil) CerDIP
Military
CY7C429–40AC
A32
32-Pin Thin Plastic Quad Flatpack
Commercial
CY7C429–40JC
J65
32-Lead Plastic Leaded Chip Carrier
CY7C429–40PC
P21
28-Lead (300-Mil) Molded DIP
CY7C429–65JC
J65
32-Lead Plastic Leaded Chip Carrier
CY7C429–65PC
P21
28-Lead (300-Mil) Molded DIP
CY7C429–65JI
J65
32-Lead Plastic Leaded Chip Carrier
Commercial
Commercial
Industrial
Ordering Information (continued)
Speed
(ns)
Ordering Code
Package
Name
Package Type
Operating
Range
25
CY7C432–25PC
P15
28-Lead (600-Mil) Molded DIP
Commercial
40
CY7C432–40PC
P15
28-Lead (600-Mil) Molded DIP
Commercial
Ordering Information (continued)
Speed
(ns)
10
15
Ordering Code
Package
Name
Package Type
CY7C433–10AC
A32
32-Pin Thin Plastic Quad Flatpack
CY7C433–10AXC
A32
32-Pin Pb-Free Thin Plastic Quad Flatpack
CY7C433–10JC
J65
32-Lead Plastic Leaded Chip Carrier
CY7C433–10JXC
J65
32-Lead Pb-Free Plastic Leaded Chip Carrier
CY7C433–10PC
P21
28-Lead (300-Mil) Molded DIP
CY7C433–10VC
V21
28-Lead (300-Mil) Molded SOJ
CY7C433–15AC
A32
32-Pin Thin Plastic Quad Flatpack
CY7C433–15JC
J65
32-Lead Plastic Leaded Chip Carrier
CY7C433–15JXC
J65
32-Lead Pb-Free Plastic Leaded Chip Carrier
CY7C433–15JI
J65
32-Lead Plastic Leaded Chip Carrier
CY7C433–15PI
P21
28-Lead (300-Mil) Molded DIP
CY7C433–15DMB
D22
28-Lead (300-Mil) CerDIP
CY7C433–15LMB
L55
32-Pin Rectangular Leadless Chip Carrier
Document #: 38-06001 Rev. *B
Operating
Range
Commercial
Commercial
Industrial
Military
Page 17 of 25
CY7C419/21/25/29/33
Ordering Information (continued)
Speed
(ns)
20
25
30
40
65
Ordering Code
Package
Name
Package Type
Operating
Range
CY7C433–20AC
A32
32-Pin Thin Plastic Quad Flatpack
CY7C433–20AXC
A32
32-Pin Pb-Free Thin Plastic Quad Flatpack
CY7C433–20JC
J65
32-Lead Plastic Leaded Chip Carrier
CY7C433–20JXC
J65
32-Lead Pb-Free Plastic Leaded Chip Carrier
CY7C433–20PC
P21
28-Lead (300-Mil) Molded DIP
CY7C433–25JC
J65
32-Lead Plastic Leaded Chip Carrier
CY7C433–25PC
P21
28-Lead (300-Mil) Molded DIP
CY7C433–25VC
V21
28-Lead (300-Mil) Molded SOJ
CY7C433–25JI
J65
32-Lead Plastic Leaded Chip Carrier
Industrial
CY7C433–30JC
J65
32-Lead Plastic Leaded Chip Carrier
Commercial
CY7C433–30PC
P21
28-Lead (300-Mil) Molded DIP
CY7C433–30JI
J65
32-Lead Plastic Leaded Chip Carrier
CY7C433–30PI
P21
28-Lead (300-Mil) Molded DIP
CY7C433–30DMB
D22
28-Lead (300-Mil) CerDIP
CY7C433–30LMB
L55
32-Pin Rectangular Leadless Chip Carrier
CY7C433–40JC
J65
32-Lead Plastic Leaded Chip Carrier
CY7C433–40PC
P21
28-Lead (300-Mil) Molded DIP
CY7C433–40VC
V21
28-Lead (300-Mil) Molded SOJ
CY7C433–40JI
J65
32-Lead Plastic Leaded Chip Carrier
Industrial
CY7C433–65JC
J65
32-Lead Plastic Leaded Chip Carrier
Commercial
CY7C433–65PC
P21
28-Lead (300-Mil) Molded DIP
Document #: 38-06001 Rev. *B
Commercial
Commercial
Industrial
Military
Commercial
Page 18 of 25
CY7C419/21/25/29/33
MILITARY SPECIFICATIONS
Group A Subgroup Testing
DC Characteristics
Parameters
Switching Characteristics
Subgroups
Parameters
Subgroups
VOH
1, 2, 3
tRC
9, 10, 11
VOL
1, 2, 3
tA
9, 10, 11
VIH
1, 2, 3
tRR
9, 10, 11
VIL Max.
1, 2, 3
tPR
9, 10, 11
IIX
1, 2, 3
tDVR
9, 10, 11
ICC
1, 2, 3
tWC
9, 10, 11
ICC1
1, 2, 3
tPW
9, 10, 11
ISB1
1, 2, 3
tWR
9, 10, 11
ISB2
1, 2, 3
tSD
9, 10, 11
IOS
1, 2, 3
tHD
9, 10, 11
tMRSC
9, 10, 11
tPMR
9, 10, 11
tRMR
9, 10, 11
tRPW
9, 10, 11
tWPW
9, 10, 11
tRTC
9, 10, 11
tPRT
9, 10, 11
tRTR
9, 10, 11
tEFL
9, 10, 11
tHFH
9, 10, 11
tFFH
9, 10, 11
tREF
9, 10, 11
tRFF
9, 10, 11
tWEF
9, 10, 11
tWFF
9, 10, 11
tWHF
9, 10, 11
tRHF
9, 10, 11
tRAE
9, 10, 11
tRPE
9, 10, 11
tWAF
9, 10, 11
tWPF
9, 10, 11
tXOL
9, 10, 11
tXOH
9, 10, 11
Document #: 38-06001 Rev. *B
Page 19 of 25
CY7C419/21/25/29/33
Package Diagrams
32-Lead Thin Plastic Quad Flat Pack A32
32-Lead Pb-Free Thin Plastic Quad Flat Pack A32
51-85063-*B
28-Lead (600-Mil) CerDIP D16
MIL-STD-1835 D-10 Config. A
51-80019-**
Document #: 38-06001 Rev. *B
Page 20 of 25
CY7C419/21/25/29/33
Package Diagrams (continued)
28-Lead (300-Mil) CerDIP D22
MIL-STD-1835 D-15 Config. A
51-80032-**
Document #: 38-06001 Rev. *B
Page 21 of 25
CY7C419/21/25/29/33
Package Diagrams (continued)
32-Lead Plastic Leaded Chip Carrier J65
32-Lead Pb-Free Plastic Leaded Chip Carrier J65
51-85002-*B
32-Pin Rectangular Leadless Chip Carrier L55
MIL-STD-1835 C-12
51-80068-**
Document #: 38-06001 Rev. *B
Page 22 of 25
CY7C419/21/25/29/33
Package Diagrams (continued)
28-Lead (600-Mil) Molded DIP P15
51-85017-*A
28-Lead (300-Mil) PDIP P21
SEE LEAD END OPTION
14
1
DIMENSIONS IN INCHES [MM] MIN.
MAX.
REFERENCE JEDEC MO-095
0.260[6.60]
0.295[7.49]
15
PACKAGE WEIGHT: 2.15 gms
28
0.030[0.76]
0.080[2.03]
SEATING PLANE
1.345[34.16]
1.385[35.18]
0.290[7.36]
0.325[8.25]
0.120[3.05]
0.140[3.55]
0.140[3.55]
0.190[4.82]
0.115[2.92]
0.160[4.06]
0.015[0.38]
0.060[1.52]
0.090[2.28]
0.110[2.79]
0.009[0.23]
0.012[0.30]
0.055[1.39]
0.065[1.65]
0.310[7.87]
0.385[9.78]
0.015[0.38]
0.020[0.50]
LEAD END OPTION
3° MIN.
SEE LEAD END OPTION
51-85014-*D
(LEAD #1, 14, 15 & 28)
Document #: 38-06001 Rev. *B
Page 23 of 25
CY7C419/21/25/29/33
Package Diagrams (continued)
28-Lead
Molded
28 Lead (300
Mil) (300-Mil)
Molded SOJ
V21SOJ V21
28-Lead (300-Mil) Pb-Free Molded SOJ V21
MIN.
MAX.
DIMENSIONS IN INCHES
PIN 1 ID
14
DETAIL
A
EXTERNAL LEAD DESIGN
1
0.291
0.300
15
0.330
0.350
OPTION 1
0.697
0.713
0.014
0.020
OPTION 2
SEATING PLANE
0.120
0.140
0.050
TYP.
0.026
0.032
0.013
0.019
28
A
0.007
0.013
0.004
0.025 MIN.
0.262
0.272
51-85031-*B
All products and company names mentioned in this document may be the trademarks of their respective holders.
Document #: 38-06001 Rev. *B
Page 24 of 25
© Cypress Semiconductor Corporation, 2005. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be
used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its
products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
CY7C419/21/25/29/33
Document History Page
Document Title: CY7C419, CY7C421, CY7C425, CY7C429, CY7C433 256/512/1K/2K/4Kx9 Asynchronous FIFO
Document Number: 38-06001
REV.
ECN NO.
Issue
Date
Orig. of
Change
Description of Change
**
106462
07/11/01
SZV
Change from Spec Number: 38-00079 to 38-06001
*A
122332
12/30/02
RBI
Added power up requirements to maximum ratings information.
*B
383597
See ECN
PCX
Added Pb-Free Logo
Added to Part-Ordering Information:
CY7C419–10JXC, CY7C419–15JXC, CY7C419-15VXC,
CY7C421–10JXC, CY7C421–15AXC, CY7C421–20JXC,
CY7C421–20VXC, CY7C425–10AXC, CY7C425–10JXC,
CY7C425–15JXC, CY7C425–20JXC, CY7C425–20VXC,
CY7C429–10AXC, CY7C429–15JXC, CY7C429–20JXC,
CY7C433–10AXC, CY7C433–10JXC, CY7C433–15JXC,
CY7C433–20AXC, CY7C433–20JXC
Document #: 38-06001 Rev. *B
Page 25 of 25
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