MOTOROLA MPXHZ6115A6T1 Media resistant and high temperature accuracy integrated silicon pressure sensor Datasheet

Freescale Semiconductor, Inc.
MOTOROLA
Order Number: MPXAZ6115A
Rev. 1, 06/2004
SEMICONDUCTOR TECHNICAL DATA
Freescale Semiconductor, Inc...
Media Resistant and
High Temperature Accuracy
Integrated Silicon Pressure Sensor
for Measuring Absolute Pressure,
On-Chip Signal Conditioned,
Temperature Compensated
and Calibrated
MPXAZ6115A
MPXHZ6115A
SERIES
INTEGRATED
PRESSURE SENSOR
15 to 115 kPa (2.2 to 16.7 psi)
0.2 to 4.8 Volts Output
SMALL OUTLINE PACKAGE
Motorola's MPXAZ6115A series sensor integrates on-chip, bipolar op amp
circuitry and thin film resistor networks to provide a high output signal and
temperature compensation. The sensor's packaging has been designed to provide
resistance to high humidity conditions as well as common automotive media. The
small form factor and high reliability of on-chip integration make the Motorola
pressure sensor a logical and economical choice for the system designer.
The MPXAZ6115A series piezoresistive transducer is a state-of-the-art,
monolithic, signal conditioned, silicon pressure sensor. This sensor combines
advanced micromachining techniques, thin film metallization, and bipolar
semiconductor processing to provide an accurate, high level analog output signal
that is proportional to applied pressure.
MPXAZ6115A6U
CASE 482-01
Figure 1 shows a block diagram of the internal circuitry integrated on a pressure
sensor chip.
Features
• Resistant to High Humidity and Common Automotive Media
• Improved Accuracy at High Temperature
• 1.5% Maximum Error over 0° to 85°C
• Ideally suited for Microprocessor or Microcontroller-Based Systems
• Temperature Compensated from -40° to +125°C
• Durable Thermoplastic (PPS) Surface Mount Package
Application Examples
• Aviation Altimeters
• Industrial Controls
• Engine Control/Manifold Absolute Pressure (MAP)
• Weather Station and Weather Reporting Devices
MPXAZ6115AC6U
CASE 482A-01
PIN NUMBER
1
N/C
5
N/C
2
VS
6
N/C
3
Gnd
7
N/C
4
Vout
8
N/C
NOTE: Pins 1, 5, 6, 7, and 8 are internal
device connections. Do not
connect to external circuitry or
ground. Pin 1 is denoted by the
notch in the lead.
VS
SUPER SMALL OUTLINE PACKAGE
THIN FILM
TEMPERATURE
COMPENSATION
AND
GAIN STAGE #1
SENSING
ELEMENT
GAIN STAGE #2
AND
GROUND
REFERENCE
SHIFT CIRCUITRY
Vout
MPXHZ6115A6U
CASE 1317-04
PINS 1, 5, 6, 7 AND 8 ARE NO CONNECTS
GND
Figure 1. Fully Integrated Pressure Sensor
Schematic
© Motorola, Inc. 2004
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MPXAZ6115AC6U
CASE 1317A-03
Freescale Semiconductor, Inc.
MPXAZ6115A MPXHZ6115A SERIES
MAXIMUM RATINGS(1)
Parametrics
Symbol
Value
Units
Maximum Pressure (P1 > P2)
Pmax
400
kPa
Storage Temperature
Tstg
-40° to +125°
°C
TA
-40° to +125°
°C
Io +
0.5
mAdc
Io -
-0.5
mAdc
Operating Temperature
(2)
Output Source Current @ Full Scale Output
Output Sink Current @ Minimum Pressure Offset
(2)
Freescale Semiconductor, Inc...
NOTES:
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
2. Maximum Output Current is controlled by effective impedance from Vout to Gnd or Vout to VS in the application circuit.
OPERATING CHARACTERISTICS (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2.)
Characteristic
Symbol
Min
Typ
Max
Unit
Pressure Range
POP
15
-
115
kPa
Supply Voltage(1)
VS
4.75
5.0
5.25
Vdc
Io
-
6.0
10
mAdc
(0 to 85°C)
Voff
0.133
0.200
0.268
Vdc
Full Scale Output(3)
@ VS = 5.0 Volts
(0 to 85°C)
VFSO
4.633
4.700
4.768
Vdc
Full Scale Span(4)
@ VS = 5.0 Volts
(0 to 85°C)
VFSS
4.433
4.500
4.568
Vdc
Accuracy(5)
(0 to 85°C)
-
-
-
±1.5
%VFSS
Supply Current
Minimum Pressure
@ VS = 5.0 Volts
Sensitivity
Offset(2)
V/P
-
45.9
-
mV/kPa
Response
Time(6)
tR
-
1.0
-
ms
Warm-Up
Time(7)
-
-
20
-
ms
-
-
±0.25
-
%VFSS
(8)
Offset Stability
NOTES:
1. Device is radiometric within this specified excitation range.
2. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
3. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure.
4. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
5. Accuracy is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent of span at
25°C due to all sources of error including the following:
• Linearity:
Output deviation from a straight line relationship with pressure over the specified pressure range.
• Temperature Hysteresis:
Output deviation at any temperature within the operating temperature range, after the temperature is
cycled to and from the minimum or maximum operating temperature points, with zero differential
pressure applied.
• Pressure Hysteresis:
Output deviation at any pressure within the specified range, when this pressure is cycled to and
from minimum or maximum rated pressure at 25°C.
• TcSpan:
Output deviation over the temperature range of 0° to 85°C, relative to 25°C.
• TcOffset:
Output deviation with minimum pressure applied, over the temperature range of 0° to 85°C, relative
to 25°C.
6.
Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a
specified step change in pressure.
7. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized.
8. Offset Stability is the product's output deviation when subjected to 1000 cycles of Pulsed Pressure, Temperature Cycling with Bias Test.
MPXAZ6115A
2
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MPXAZ6115A MPXHZ6115A SERIES
DIE
GEL DIE COAT
+5.0 V
STAINLESS
STEEL CAP
P1
VS Pin 2
THERMOPLASTIC
CASE
WIRE BOND
LEAD
FRAME
MPXAZ6115A
Vout Pin 4
100 nF
GND Pin 3
ABSOLUTE ELEMENT
to ADC
47 pF
51 K
DIE BOND
Figure 2. Cross Sectional Diagram SOP
(Not to Scale)
Figure 2 illustrates the absolute sensing chip in the basic
Small Outline chip carrier (Case 482).
Figure 3. Typical Application Circuit
(Output Source Current Operation)
Figure 3 shows a typical application circuit (output source
current operation).
5.0
4.5
4.0
OUTPUT (Volts)
3.5
TRANSFER FUNCTION:
MAX
Vout = Vs* (.009*P-.095) ± Error
VS = 5.0 Vdc
TEMP = 0 to 85°C
TYP
3.0
2.5
2.0
1.5
MIN
1.0
0.5
0
5
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
85
90
95
100
105
110
115
120
Freescale Semiconductor, Inc...
SEALED VACUUM REFERENCE
Pressure (ref: to sealed vacuum) in kPa
Figure 4. Output versus Absolute Pressure
Figure 4 shows the sensor output signal relative to pressure
input. Typical minimum and maximum output curves are shown
for operation over 0 to 85°C temperature range. The output will
saturate outside of the rated pressure range.
A gel die coat isolates the die surface and wire bonds from
the environment, while allowing the pressure signal to be
transmitted to the sensor diaphragm.
Motorola Sensor Device Data
The gel die coat and durable polymer package provide a
media resistant barrier that allows the sensor to operate reliably
in high humidity conditions as well as environments containing
common automotive media. Contact the factory for more
information regarding media compatibility in your specific
application.
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MPXAZ6115A
3
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MPXAZ6115A MPXHZ6115A SERIES
Transfer Function (MPXAZ6115A)
Nominal Transfer Value: Vout = VS x (0.009 x P - 0.095)
± (Pressure Error x Temp. Factor x 0.009 x VS)
VS = 5.0 ± 0.25 Vdc
Temperature Error Band
MPXAZ6115A Series
4.0
Break Points
Temperature
Error
Factor
2.0
Temp
Multiplier
- 40
0 to 85
125
3
1
1.75
1.0
0.0
-40
-20
0
20
40
60
80
100
120
140
Temperature in C°
NOTE: The Temperature Multiplier is a linear response from 0°C to -40°C and from 85°C to 125°C
Pressure Error Band
Error Limits for Pressure
3.0
Pressure Error (kPa)
Freescale Semiconductor, Inc...
3.0
2.0
1.0
0.0
20
40
60
80
100
Pressure (in kPa)
120
-1.0
Pressure
-2.0
Error (Max)
15 to 115 (kPa) ±1.5 (kPa)
-3.0
ORDERING INFORMATION—SMALL OUTLINE PACKAGE
Device Type
Basic Element
Ported Element
Options
Case No.
MPX Series Order No.
Packing Options
Marking
Absolute, Element Only
482
MPXAZ6115A6U
Rails
MPXAZ6115A
Absolute, Element Only
482
MPXAZ6115A6T1
Tape and Reel
MPXAZ6115A
Absolute, Axial Port
482A
MPXAZ6115AC6U
Rails
MPXAZ6115A
Absolute, Axial Port
482A
MPXAZ6115AC6T1
Tape and Reel
MPXAZ6115A
ORDERING INFORMATION—SUPER SMALL OUTLINE PACKAGE
Device Type
Basic Element
Ported Element
MPXAZ6115A
4
Options
Case No.
MPX Series Order No.
Packing Options
Marking
Absolute, Element Only
1317
MPXHZ6115A6U
Rails
MPXHZ6115A
Absolute, Element Only
1317A
MPXHZ6115A6T1
Tape and Reel
MPXHZ6115A
Absolute, Axial Port
1317A
MPXHZ6115AC6U
Rails
MPXHZ6115A
Absolute, Axial Port
1317A
MPXHZ6115AC6T1
Tape and Reel
MPXHZ6115A
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Freescale Semiconductor, Inc.
MPXAZ6115A MPXHZ6115A SERIES
SURFACE MOUNTING INFORMATION
MINIMUM RECOMMENDED FOOTPRINT FOR SMALL OUTLINE PACKAGE
a solder reflow process. It is always recommended to fabricate
boards with a solder mask layer to avoid bridging and/or
shorting between solder pads, especially on tight tolerances
and/or tight layouts.
Surface mount board layout is a critical portion of the total
design. The footprint for the semiconductor package must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct pad
geometry, the packages will self-align when subjected to
0.100 TYP
2.54
Freescale Semiconductor, Inc...
0.660
16.76
0.060 TYP 8X
1.52
0.300
7.62
0.100 TYP 8X
2.54
inch
mm
Figure 5. SOP Footprint (Case 482 and 482A)
MINIMUM RECOMMENDED FOOTPRINT FOR SUPER SMALL OUTLINE PACKAGES
Surface mount board layout is a critical portion of the total
design. The footprint for the semiconductor package must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct pad
geometry, the packages will self-align when subjected to
0.050
1.27
TYP
a solder reflow process. It is always recommended to fabricate
boards with a solder mask layer to avoid bridging and/or
shorting between solder pads, especially on tight tolerances
and/or tight layouts.
0.387
9.83
0.150
3.81
0.027 TYP 8X
0.69
0.053 TYP 8X
1.35
inch
mm
Figure 6. SSOP Footprint (Case 1317 and 1317A)
Motorola Sensor Device Data
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MPXAZ6115A
5
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MPXAZ6115A MPXHZ6115A SERIES
SMALL OUTLINE PACKAGE DIMENSIONS
-A-
D 8 PL
0.25 (0.010)
4
5
M
T B
S
A
S
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.
-BG
8
1
S
Freescale Semiconductor, Inc...
N
H
C
J
-TSEATING
PLANE
PIN 1 IDENTIFIER
K
M
DIM
A
B
C
D
G
H
J
K
M
N
S
INCHES
MIN
MAX
0.415 0.425
0.415 0.425
0.212 0.230
0.038 0.042
0.100 BSC
0.002 0.010
0.009 0.011
0.061 0.071
0˚
7˚
0.405 0.415
0.709 0.725
MILLIMETERS
MIN
MAX
10.54
10.79
10.54
10.79
5.38
5.84
0.96
1.07
2.54 BSC
0.05
0.25
0.23
0.28
1.55
1.80
0˚
7˚
10.29
10.54
18.01
18.41
CASE 482-01
ISSUE O
-A-
D
4
0.25 (0.010)
5
N
8 PL
M
T B
S
A
S
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.
-BG
8
1
S
W
V
C
H
J
-TK
M
PIN 1 IDENTIFIER
DIM
A
B
C
D
G
H
J
K
M
N
S
V
W
INCHES
MIN
MAX
0.415 0.425
0.415 0.425
0.500 0.520
0.038 0.042
0.100 BSC
0.002 0.010
0.009 0.011
0.061 0.071
0˚
7˚
0.444 0.448
0.709 0.725
0.245 0.255
0.115 0.125
MILLIMETERS
MIN
MAX
10.54
10.79
10.54
10.79
12.70
13.21
0.96
1.07
2.54 BSC
0.05
0.25
0.23
0.28
1.55
1.80
0˚
7˚
11.28
11.38
18.01
18.41
6.22
6.48
2.92
3.17
SEATING
PLANE
CASE 482A-01
ISSUE A
MPXAZ6115A
6
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MPXAZ6115A MPXHZ6115A SERIES
SUPER SMALL OUTLINE PACKAGE DIMENSIONS
2X
0.006 C A B
0.420
0.400
0.050
NOTES:
1. ALL DIMENSIONS ARE IN INCHES.
2. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M-1994.
3. DIMENSIONS DO NOT INCLUDE MOLD FLASH OR
PROTRUSIONS. MOLD FLASH OR PROTRUSIONS
SHALL NOT EXCEED .006 INCHES PER SIDE.
4. ALL VERTICAL SURFACES TO BE 5˚ MAXIMUM.
5. DIMENSION DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE .008 INCHES MAXIMUM.
0.025
0.300
0.280
3
0.019
5
0.014
0.004 M C A B
Freescale Semiconductor, Inc...
8X
A
0.300
0.280
B
3
0.298
0.278
.014
GAGE
PLANE
0.165
0.145
0.010
0.002
0.004
10˚
0˚
DETAIL D
DETAIL D
C
0.038
0.048
SEATING
PLANE
CASE 1317-04
ISSUE D
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MPXAZ6115A
7
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MPXAZ6115A MPXHZ6115A SERIES
SUPER SMALL OUTLINE PACKAGE DIMENSIONS
2X
0.006 C A B
0.420
0.400
NOTES:
1. ALL DIMENSIONS ARE IN INCHES.
2. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M-1994.
3. DIMENSIONS DO NOT INCLUDE MOLD FLASH OR
PROTRUSIONS. MOLD FLASH OR PROTRUSIONS
SHALL NOT EXCEED .006 INCHES PER SIDE.
4. ALL VERTICAL SURFACES TO BE 55 MAXIMUM.
5. DIMENSION DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE .008 INCHES MAXIMUM.
0.050
0.025
0.025
0.345
0.325
Freescale Semiconductor, Inc...
8X
0.018
0.014
0.004
0.345
0.325
M
5
.014
C A B
GAGE
PLANE
0.010
0.002
10˚
0˚
0.048
0.038
DETAIL E
Ø 0.130
Ø 0.110
0.200
0.180
0.300
0.280
0.390
0.370
3
0.004
C
SEATING
PLANE
A
0.300
0.280
B
3
DETAIL E
BOTTOM VIEW
CASE 1317A-03
ISSUE A
MPXAZ6115A
8
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MPXAZ6115A MPXHZ6115A SERIES
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NOTES
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MPXAZ6115A
9
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MPXAZ6115A MPXHZ6115A SERIES
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NOTES
MPXAZ6115A
10
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MPXAZ6115A MPXHZ6115A SERIES
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NOTES
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Information in this document is provided solely to enable system and software implementers to use Motorola products. There are no express or implied
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