Features and Benefits Small package (SOIC20) Short-circuit protection Diagnostic features Current limitation Low-power consumption Over-temperature protection Direct micro controller compatible Integrated free wheel diodes Applications Automotive climate Control Dashboard Industrial Actuator control Ordering Information Part No. MLX10410 Temperature Suffix E (-40°C to 85°C) Package Code DF (SOIC-20) Option code CA Functional Diagram VDD VCC1 VCC2 ADR2 ADR1 ADR0 CEN STROBE DATAI DATAO OTB GND LOGIC LOGIC LOGIC LOGIC LOGIC OUTPUT CURRENT LIMIT OUTPUT CURRENT LIMIT OUTPUT CURRENT LIMIT OUTPUT CURRENT LIMIT OUTPUT CURRENT LIMIT OSCILLATOR OVER-TEMP PROTECT BG OVER-VOLT PROTECT STAND-BY LOGIC LOGIC LOGIC OUTPUT CURRENT LIMIT OUTPUT CURRENT LIMIT OUTPUT CURRENT LIMIT OUT7 DETECT C.C. OUT6 DETECT C.C. OUT5 DETECT C.C. OUT4 DETECT C.C. OUT3 DETECT C.C. OUT2 DETECT C.C. OUT1 DETECT C.C. OUT0 DETECT C.C. Figure 1 Description The 10410 is a high-side driver for automotive applications. It can drive small lamps, relays, coils etc. The output current can be up to 250mA per driver (current limit at minimum 250mA). The IC will only react to commands on the bus if the CEN (chip enable) signal is high. The CEN signal has nothing to do with the power down mode, the IC will react to the micro controller commands if CEN is high. MLX902xx of High Sensor MLX10410Name 8 Fold Side Driver 3901010410 Rev. 003 Y.X 1 PageRev 1Page 22/Aug/98 Page 1 Rev 1.1 16/Apr/01 Aug/02 In order to switch a particular output, it is necessary to apply its address on the 3 bit bus and the data on the input DATAI. A high level on STROBE will latch the data and switch the output. When the IC is in active mode and CEN is high, the logic level of the addressed output will be available on the pin DATAO. When all 8 outputs are inactive (latched value is low) the circuit automatically switches to power down mode. Diagnostic mode: when the DATAI is low and the STROBE is high, a 50K pull up to VCC is switched on, on the corresponding output channel (addressed by ADR2, ADR1, ADR0) to see whether there is a load connected. The logic level of the output can be observed on the pin DATAO. In this way, it is possible to scan all the outputs for an open circuit. When the IC is in active mode, then there is an over-temperature sensor that monitors the temperature of the IC. If the die temperature goes above 165°C, all outputs are switched off and the output OTB will go low. As soon as the temperature decreases below 125°C all outputs are switched back to their previous state. The outputs are short-circuit proof against GND and VCC. When an output is shorted to GND, the current is limited and, after a delay of typically 20ms, the output is switched off and the output OTB goes low. A delay is used to guarantee that the output does not detect a short circuit when a normal lamp is driven. The latched value of the ouput is set to 0. A rising edge on CEN will set OTB back to 1. When an output is shorted to a supply larger than VCC+100mV, the output driver bulk is immediately disconnect from VCC, and after a delay of typically 20ms, the output is switched off and the output OTB goes low. The latched value of the ouput is set to 0. A rising edge on CEN will set OTB back to 1 There is an over-voltage shut off that switches all the outputs off when the VCC voltage is above 18V for at least 1ms. When an over-voltage occurs, CEN being low, DATAO pin will go low. The outputs will come on again as soon as the voltage decreases below 18V. The status of all 8 outputs stays latched. Every output stage is protected with a free wheel diode both to ground and to VCC. Table 1 Active mode CEN STROBE DATA I 0 0 0 0 0 1 Chip 0 1 0 Disabled 0 1 1 1 0 0 No Command 1 0 1 No Command 1 1 0 Addressed output 0 Load turned OFF (Diagnostic mode) Addressed output turned ON 1 No Load 1 1 1 MLX10410 8 Fold High Side Driver 3901010410 Rev. 003 Description DATA O OTB 0 Over-voltage 1 No Overvoltage 0 Over-temperature OR Page 2 Page 2 Short-circuit to GND Addressed output logic level 1 No Overtemperature Addressed output logic level (always 1) Rev 1.1 16/Apr/01 Aug/02 ABSOLUTE MAXIMUM RATINGS VCC -0.3 to 40V VDD -0.3 to 5.5V Maximum Output Voltage -0.3V to VCC+0.3V Maximum Output Current ±550mA Maximum Free-Wheel Diodes Current ±250mA Die Temperature +170°C Thermal Resistance Package 85°K/W Storage Temperature -55 °C to 125°C ESD Protection all pins (human body model) 2KV DYNAMIC CHARACTERISTICS Limits Characteristics Description tsw STROBE pulse width 1.0 us tsds DATAI to STROBE setup time 0.1 us thds DATAI to STROBE hold time 0.1 us tscs CEN to STROBE setup time 0.1 us tshs CEN to STROBE hold time 0.1 us tdso STROBE to OUTPUT delay (Ron reached 20% of nominal value) Delay between Over voltage detection and outputs switched off Delay between short circuit detection and output switched off Recovery time from an over voltage detection tdov tdso trov MLX902xx of High Sensor MLX10410Name 8 Fold Side Driver 3901010410 Rev. 003 Y.X 3 PageRev 3Page Min Typ Max Units 10 us 0.5 1.0 2.0 ms 12 20 40 ms 10 us 22/Aug/98 Page 3 Rev 1.1 16/Apr/01 Aug/02 Electrical Characteristics Following characteristics are valid over the temperature range from –40°C to +85°C unless otherwise specified. Limits Characteristics Test Conditions Min Typ Max Units Supply voltage VDD 4.5 5.0 5.5 V Supply voltage VCC 4.5 25 V Supply current Iccs all outputs switched off 200 µA Supply current Icca all outputs on and no load VCC=12V, one output on and no load VCC=12V, one output on, no load, per supplementary output on all outputs switched off 1000 µA 200 µA 25 µA 100 µA all outputs on and no load one output on and no load 500 µA 150 µA 0.75*VDD V Supply current Icci Supply current Iccm Supply current Idds Supply current Idda Supply current Iddi Input threshold ADR2, ADR1, ADR0, STROBE, CEN Input hysteresis ADR2, ADR1, ADR0, STROBE, CEN Input current ADR2, ADR1, ADR0, STROBE, CEN Vol DATAO, OTB Voh DATAO Iohl OTB Input threshold OUT7-0 Pull up resistor 0.25*VDD DATAI, 0.1*VDD V DATAI, DATAI, V D D = 5 V 0<Vin<VDD a n d -1.0 0.0 Iout=1mA 1.0 µA 0.5 V Iout=1mA VDD-0.5 Vout=5V -1.0 1.0 µA diagnostic mode 0.2*VDD 0.3*VDD V diagnostic mode 25 50 100 KW 2.5 4.0 W 500 mA Output resistance Ron(OUT7-0) Output current limitation Ilim(OUT7-0) Output short circuit threshold (OUT7-0) Over voltage Shut-Off threshold active mode Iout=200mA, VCC=12V VCC=12V and Vout=0V Over voltage Shut-Off Hysteresis VCC Over temperature Shut-Off Tj VCC MLX10410 8 Fold High Side Driver 3901010410 Rev. 003 V 250 2/3VCC -0.5 2/3VCC 2/3VCC +0.5 V 18.0 21.0 24 V 1.0 150 Page 4 Page 4 165 V 180 Rev 1.1 16/Apr/01 Aug/02 °C Function Name VCC1, VCC2 power inputs, both inputs need to be connected. GND circuit ground VDD 5V logic supply OUT7, OUT0 power outputs DATAI data input STROBE data is latched on the high level of strobe ADR2, ADR1, ADR0 address for output selection DATAO data output OTB open drain output that indicates that the IC is in over temperature protection chip enable signal (in a system with only one IC, it is possible to connect this signal directly to VDD). CEN Pin Assignment Pin 1: VDD Pin 20: CEN Pin 2: OTB Pin 19: DATAO Pin 3: GND Pin 18: OUT7 Pin 4: OUT0 Pin 17: OUT6 Pin 5: OUT1 Pin 16: VCC Pin 6: VCC Pin 15: OUT5 Pin 7: OUT2 Pin 14: OUT4 Pin 8: OUT3 Pin 13:STROBE Pin 9:ADR2 Pin 12:DATAI Pin 10:ADR1 Pin 11: ADR0 MLX902xx of High Sensor MLX10410Name 8 Fold Side Driver 3901010410 Rev. 003 Y.X 5 PageRev 5Page 22/Aug/98 Page 5 Rev 1.1 16/Apr/01 Aug/02 Reliability Information Melexis devices are classified and qualified regarding suitability for infrared, vapor phase and wave soldering with usual (63/37 SnPb-) solder (melting point at 183degC). The following test methods are applied: IPC/JEDEC J-STD-020A (issue April 1999) Moisture/Reflow Sensitivity Classification For Nonhermetic Solid State Surface Mount Devices CECC00802 (issue 1994) Standard Method For The Specification of Surface Mounting Components (SMDs) of Assessed Quality MIL 883 Method 2003 / JEDEC-STD-22 Test Method B102 Solderability For all soldering technologies deviating from above mentioned standard conditions (regarding peak temperature, temperature gradient, temperature profile etc) additional classification and qualification tests have to be agreed upon with Melexis. The application of Wave Soldering for SMD’s is allowed only after consulting Melexis regarding assurance of adhesive strength between device and board. For more information on manufacturability/solderability see quality page at our website: http://www.melexis.com/ ESD Precautions Electronic semiconductor products are sensitive to Electro Static Discharge (ESD). Always observe Electro Static Discharge control procedures whenever handling semiconductor products MLX10410 8 Fold High Side Driver 3901010410 Rev. 003 Page 6 Page 6 Rev 1.1 16/Apr/01 Aug/02 Disclaimer Devices sold by Melexis are covered by the warranty and patent indemnification provisions appearing in its Term of Sale. Melexis makes no warranty, express, statutory, implied, or by description regarding the information set forth herein or regarding the freedom of the described devices from patent infringement. Melexis reserves the right to change specifications and prices at any time and without notice. Therefore, prior to designing this product into a system, it is necessary to check with Melexis for current information. This product is intended for use in normal commercial applications. Applications requiring extended temperature range, unusual environmental requirements, or high reliability applications, such as military, medical life-support or life-sustaining equipment are specifically not recommended without additional processing by Melexis for each application. The information furnished by Melexis is believed to be correct and accurate. However, Melexis shall not be liable to recipient or any third party for any damages, including but not limited to personal injury, property damage, loss of profits, loss of use, interrupt of business or indirect, special incidental or consequential damages, of any kind, in connection with or arising out of the furnishing, performance or use of the technical data herein. No obligation or liability to recipient or any third party shall arise or flow out of Melexis’ rendering of technical or other services. © 2002 Melexis NV. All rights reserved. For the latest version of this document, go to our website at: www.melexis.com Or for additional information contact Melexis Direct: Europe and Japan: All other locations: Phone: +32 13 670495 E-mail: [email protected] Phone: +1 603 223 2362 E-mail: [email protected] QS9000, VDA6.1 and ISO14001 Certified MLX902xx of High Sensor MLX10410Name 8 Fold Side Driver 3901010410 Rev. 003 Y.X 7 PageRev 7Page 22/Aug/98 Page 7 Rev 1.1 16/Apr/01 Aug/02