Melexis MLX10410 8 fold high side driver Datasheet

Features and Benefits
Small package (SOIC20)
Short-circuit protection
Diagnostic features
Current limitation
Low-power consumption
Over-temperature protection
Direct micro controller compatible
Integrated free wheel diodes
Applications
Automotive climate Control
Dashboard
Industrial Actuator control
Ordering Information
Part No.
MLX10410
Temperature Suffix
E (-40°C to 85°C)
Package Code
DF (SOIC-20)
Option code
CA
Functional Diagram
VDD
VCC1
VCC2
ADR2
ADR1
ADR0
CEN
STROBE
DATAI
DATAO
OTB
GND
LOGIC
LOGIC
LOGIC
LOGIC
LOGIC
OUTPUT
CURRENT LIMIT
OUTPUT
CURRENT LIMIT
OUTPUT
CURRENT LIMIT
OUTPUT
CURRENT LIMIT
OUTPUT
CURRENT LIMIT
OSCILLATOR
OVER-TEMP
PROTECT
BG OVER-VOLT
PROTECT
STAND-BY
LOGIC
LOGIC
LOGIC
OUTPUT
CURRENT LIMIT
OUTPUT
CURRENT LIMIT
OUTPUT
CURRENT LIMIT
OUT7
DETECT C.C.
OUT6
DETECT C.C.
OUT5
DETECT C.C.
OUT4
DETECT C.C.
OUT3
DETECT C.C.
OUT2
DETECT C.C.
OUT1
DETECT C.C.
OUT0
DETECT C.C.
Figure 1
Description
The 10410 is a high-side driver for automotive applications. It can drive small lamps, relays, coils etc. The output current
can be up to 250mA per driver (current limit at minimum 250mA).
The IC will only react to commands on the bus if the CEN (chip enable) signal is high. The CEN signal has nothing to do
with the power down mode, the IC will react to the micro controller commands if CEN is high.
MLX902xx
of High
Sensor
MLX10410Name
8 Fold
Side Driver
3901010410
Rev. 003
Y.X 1
PageRev
1Page
22/Aug/98
Page
1
Rev 1.1 16/Apr/01
Aug/02
In order to switch a particular output, it is necessary to apply its address on the 3 bit bus and the data on the input
DATAI. A high level on STROBE will latch the data and switch the output. When the IC is in active mode and CEN is
high, the logic level of the addressed output will be available on the pin DATAO.
When all 8 outputs are inactive (latched value is low) the circuit automatically switches to power down mode.
Diagnostic mode: when the DATAI is low and the STROBE is high, a 50K pull up to VCC is switched on, on the
corresponding output channel (addressed by ADR2, ADR1, ADR0) to see whether there is a load connected. The logic
level of the output can be observed on the pin DATAO. In this way, it is possible to scan all the outputs for an open
circuit.
When the IC is in active mode, then there is an over-temperature sensor that monitors the temperature of the IC. If the
die temperature goes above 165°C, all outputs are switched off and the output OTB will go low. As soon as the
temperature decreases below 125°C all outputs are switched back to their previous state.
The outputs are short-circuit proof against GND and VCC. When an output is shorted to GND, the current is limited and,
after a delay of typically 20ms, the output is switched off and the output OTB goes low. A delay is used to guarantee that
the output does not detect a short circuit when a normal lamp is driven. The latched value of the ouput is set to 0. A
rising edge on CEN will set OTB back to 1. When an output is shorted to a supply larger than VCC+100mV, the output
driver bulk is immediately disconnect from VCC, and after a delay of typically 20ms, the output is switched off and the
output OTB goes low. The latched value of the ouput is set to 0. A rising edge on CEN will set OTB back to 1
There is an over-voltage shut off that switches all the outputs off when the VCC voltage is above 18V for at least 1ms.
When an over-voltage occurs, CEN being low, DATAO pin will go low. The outputs will come on again as soon as the
voltage decreases below 18V. The status of all 8 outputs stays latched.
Every output stage is protected with a free wheel diode both to ground and to VCC.
Table 1
Active mode
CEN
STROBE
DATA I
0
0
0
0
0
1
Chip
0
1
0
Disabled
0
1
1
1
0
0
No Command
1
0
1
No Command
1
1
0
Addressed output
0
Load
turned OFF
(Diagnostic mode)
Addressed output
turned ON
1
No Load
1
1
1
MLX10410 8 Fold High Side Driver
3901010410
Rev. 003
Description
DATA O
OTB
0 Over-voltage
1
No Overvoltage
0
Over-temperature
OR
Page 2 Page 2
Short-circuit to
GND
Addressed
output
logic level
1
No Overtemperature
Addressed
output logic
level (always
1)
Rev 1.1 16/Apr/01
Aug/02
ABSOLUTE MAXIMUM RATINGS
VCC
-0.3 to 40V
VDD
-0.3 to 5.5V
Maximum Output Voltage
-0.3V to VCC+0.3V
Maximum Output Current
±550mA
Maximum Free-Wheel Diodes Current
±250mA
Die Temperature
+170°C
Thermal Resistance Package
85°K/W
Storage Temperature
-55 °C to 125°C
ESD Protection all pins
(human body model)
2KV
DYNAMIC CHARACTERISTICS
Limits
Characteristics
Description
tsw
STROBE pulse width
1.0
us
tsds
DATAI to STROBE setup time
0.1
us
thds
DATAI to STROBE hold time
0.1
us
tscs
CEN to STROBE setup time
0.1
us
tshs
CEN to STROBE hold time
0.1
us
tdso
STROBE to OUTPUT delay (Ron reached
20% of nominal value)
Delay between Over voltage detection and
outputs switched off
Delay between short circuit detection and
output switched off
Recovery time from an over voltage detection
tdov
tdso
trov
MLX902xx
of High
Sensor
MLX10410Name
8 Fold
Side Driver
3901010410
Rev. 003
Y.X 3
PageRev
3Page
Min
Typ
Max
Units
10
us
0.5
1.0
2.0
ms
12
20
40
ms
10
us
22/Aug/98
Page
3
Rev 1.1 16/Apr/01
Aug/02
Electrical Characteristics
Following characteristics are valid over the temperature range from –40°C to +85°C
unless otherwise specified.
Limits
Characteristics
Test Conditions
Min
Typ
Max
Units
Supply voltage VDD
4.5
5.0
5.5
V
Supply voltage VCC
4.5
25
V
Supply current Iccs
all outputs switched off
200
µA
Supply current Icca
all outputs on and no
load
VCC=12V, one output
on and no load
VCC=12V, one output
on, no load, per supplementary output on
all outputs switched off
1000
µA
200
µA
25
µA
100
µA
all outputs on and no
load
one output on and no
load
500
µA
150
µA
0.75*VDD
V
Supply current Icci
Supply current Iccm
Supply current Idds
Supply current Idda
Supply current Iddi
Input threshold
ADR2, ADR1, ADR0,
STROBE, CEN
Input hysteresis
ADR2, ADR1, ADR0,
STROBE, CEN
Input current
ADR2, ADR1, ADR0,
STROBE, CEN
Vol
DATAO, OTB
Voh
DATAO
Iohl
OTB
Input threshold
OUT7-0
Pull up resistor
0.25*VDD
DATAI,
0.1*VDD
V
DATAI,
DATAI,
V D D = 5 V
0<Vin<VDD
a n d
-1.0
0.0
Iout=1mA
1.0
µA
0.5
V
Iout=1mA
VDD-0.5
Vout=5V
-1.0
1.0
µA
diagnostic mode
0.2*VDD
0.3*VDD
V
diagnostic mode
25
50
100
KW
2.5
4.0
W
500
mA
Output resistance
Ron(OUT7-0)
Output current limitation
Ilim(OUT7-0)
Output short circuit threshold
(OUT7-0)
Over voltage Shut-Off threshold
active mode
Iout=200mA, VCC=12V
VCC=12V and Vout=0V
Over voltage Shut-Off Hysteresis
VCC
Over temperature Shut-Off
Tj
VCC
MLX10410 8 Fold High Side Driver
3901010410
Rev. 003
V
250
2/3VCC -0.5
2/3VCC
2/3VCC +0.5
V
18.0
21.0
24
V
1.0
150
Page 4 Page 4
165
V
180
Rev 1.1 16/Apr/01
Aug/02
°C
Function
Name
VCC1, VCC2
power inputs, both inputs need to be connected.
GND
circuit ground
VDD
5V logic supply
OUT7,
OUT0 power outputs
DATAI
data input
STROBE
data is latched on the high level of strobe
ADR2, ADR1, ADR0
address for output selection
DATAO
data output
OTB
open drain output that indicates that the IC is in over
temperature protection
chip enable signal (in a system with only one IC, it is
possible to connect this signal directly to VDD).
CEN
Pin Assignment
Pin 1: VDD
Pin 20: CEN
Pin 2: OTB
Pin 19: DATAO
Pin 3: GND
Pin 18: OUT7
Pin 4: OUT0
Pin 17: OUT6
Pin 5: OUT1
Pin 16: VCC
Pin 6: VCC
Pin 15: OUT5
Pin 7: OUT2
Pin 14: OUT4
Pin 8: OUT3
Pin 13:STROBE
Pin 9:ADR2
Pin 12:DATAI
Pin 10:ADR1
Pin 11: ADR0
MLX902xx
of High
Sensor
MLX10410Name
8 Fold
Side Driver
3901010410
Rev. 003
Y.X 5
PageRev
5Page
22/Aug/98
Page
5
Rev 1.1 16/Apr/01
Aug/02
Reliability Information
Melexis devices are classified and qualified regarding suitability for infrared, vapor phase and wave
soldering with usual (63/37 SnPb-) solder (melting point at 183degC).
The following test methods are applied:
IPC/JEDEC J-STD-020A (issue April 1999)
Moisture/Reflow Sensitivity Classification For Nonhermetic Solid State Surface Mount Devices
CECC00802 (issue 1994)
Standard Method For The Specification of Surface Mounting Components (SMDs) of Assessed
Quality
MIL 883 Method 2003 / JEDEC-STD-22 Test Method B102
Solderability
For all soldering technologies deviating from above mentioned standard conditions (regarding peak
temperature, temperature gradient, temperature profile etc) additional classification and qualification
tests have to be agreed upon with Melexis.
The application of Wave Soldering for SMD’s is allowed only after consulting Melexis regarding assurance of adhesive strength between device and board.
For more information on manufacturability/solderability see quality page at our website:
http://www.melexis.com/
ESD Precautions
Electronic semiconductor products are sensitive to Electro Static Discharge (ESD).
Always observe Electro Static Discharge control procedures whenever handling semiconductor products
MLX10410 8 Fold High Side Driver
3901010410
Rev. 003
Page 6 Page 6
Rev 1.1 16/Apr/01
Aug/02
Disclaimer
Devices sold by Melexis are covered by the warranty and patent indemnification provisions appearing in its
Term of Sale. Melexis makes no warranty, express, statutory, implied, or by description regarding the information set forth herein or regarding the freedom of the described devices from patent infringement. Melexis reserves the right to change specifications and prices at any time and without notice. Therefore, prior to designing
this product into a system, it is necessary to check with Melexis for current information. This product is intended
for use in normal commercial applications. Applications requiring extended temperature range, unusual environmental requirements, or high reliability applications, such as military, medical life-support or life-sustaining
equipment are specifically not recommended without additional processing by Melexis for each application.
The information furnished by Melexis is believed to be correct and accurate. However, Melexis shall not be liable to recipient or any third party for any damages, including but not limited to personal injury, property damage,
loss of profits, loss of use, interrupt of business or indirect, special incidental or consequential damages, of any
kind, in connection with or arising out of the furnishing, performance or use of the technical data herein. No obligation or liability to recipient or any third party shall arise or flow out of Melexis’ rendering of technical or other
services.
© 2002 Melexis NV. All rights reserved.
For the latest version of this document, go to our website at:
www.melexis.com
Or for additional information contact Melexis Direct:
Europe and Japan:
All other locations:
Phone: +32 13 670495
E-mail: [email protected]
Phone: +1 603 223 2362
E-mail: [email protected]
QS9000, VDA6.1 and ISO14001 Certified
MLX902xx
of High
Sensor
MLX10410Name
8 Fold
Side Driver
3901010410
Rev. 003
Y.X 7
PageRev
7Page
22/Aug/98
Page
7
Rev 1.1 16/Apr/01
Aug/02
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