CYStech Electronics Corp. Spec. No. : C374N3 Issued Date : 2002.06.01 Revised Date :2011.07.15 Page No. : 1/6 NPN Digital Transistors (Built-in Resistors) DTC144TN3 Features • Built-in bias resistors enable the configuration of an inverter circuit without connecting external input resistors (see equivalent circuit). • The bias resistors consist of thin-film resistors with complete isolation to allow negative biasing of the input. They also have the advantage of almost completely eliminating parasitic effects. • Only the on/off conditions need to be set for operation, making device design easy. • Complements the DTA144TN3 • Pb-free lead plating and halogen-free package Equivalent Circuit Outline SOT-23 DTC144TN3 R1=47kΩ , B : Base C : Collector E : Emitter Absolute Maximum Ratings (Ta=25℃) Parameter Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Collector Current Power Dissipation Junction Temperature Storage Temperature DTC144TN3 Symbol VCBO VCEO VEBO IC Pd Tj Tstg Limits 50 50 5 100 200 150 -55 ~ +150 Unit V V V mA mW °C °C CYStek Product Specification CYStech Electronics Corp. Spec. No. : C374N3 Issued Date : 2002.06.01 Revised Date :2011.07.15 Page No. : 2/6 Characteristics (Ta=25℃) Parameter Collector-Base Breakdown Voltage Collector-Emitter Breakdown Voltage Emitter-Base Breakdown Voltage Collector-Base Cutoff Current Emitter-Base Cutoff Current Collector-Emitter Saturation Voltage DC Current Gain Input Resistance Transition Frequency Symbol VCBO Min. Typ. Max. Unit Test Conditions 50 V IC=50μA VCEO 50 - - V IC=1mA VEBO ICBO IEBO 5 - - 0.5 0.5 V μA μA IE=50μA VCB=50V VEB=4V VCE(sat) - - 0.3 V IC=5mA, IB=0.5mA hFE R1 fT 100 32.9 - 47 250 600 VCE=5V, IC=1mA 61.1 kΩ MHz VCE=10V, IC=5mA, f=100MHz * * Transition frequency of the device Ordering Information Device DTC144T3 DTC144TN3 Package SOT-23 (Pb-free lead plating and halogen-free package) Shipping Marking 3000 pcs / Tape & Reel 8T CYStek Product Specification Spec. No. : C374N3 Issued Date : 2002.06.01 Revised Date :2011.07.15 Page No. : 3/6 CYStech Electronics Corp. Characteristic Curves Current Gain vs Collector Current Saturation Voltage vs Collector Current 1000 Saturation Voltage---(mV) Current Gain---HFE 1000 100 HFE@VCE=5V 100 VCE(SAT)@IC=10IB 10 10 0.1 1 10 100 Collector Current ---IC(mA) 1 10 100 Collector Current ---IC(mA) Power Derating Curve Power Dissipation---PD(mW) 250 200 150 100 50 0 0 50 100 150 200 Ambient Temperature --- Ta(℃ ) DTC144TN3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C374N3 Issued Date : 2002.06.01 Revised Date :2011.07.15 Page No. : 4/6 Reel Dimension Carrier Tape Dimension DTC144TN3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C374N3 Issued Date : 2002.06.01 Revised Date :2011.07.15 Page No. : 5/6 Recommended wave soldering condition Product Pb-free devices Peak Temperature 260 +0/-5 °C Soldering Time 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Average ramp-up rate (Tsmax to Tp) Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) Time maintained above: −Temperature (TL) − Time (tL) Peak Temperature(TP) Time within 5°C of actual peak temperature(tp) Ramp down rate Time 25 °C to peak temperature Sn-Pb eutectic Assembly Pb-free Assembly 3°C/second max. 3°C/second max. 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds 183°C 60-150 seconds 240 +0/-5 °C 217°C 60-150 seconds 260 +0/-5 °C 10-30 seconds 20-40 seconds 6°C/second max. 6 minutes max. 6°C/second max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface. DTC144TN3 CYStek Product Specification Spec. No. : C374N3 Issued Date : 2002.06.01 Revised Date :2011.07.15 Page No. : 6/6 CYStech Electronics Corp. SOT-23 Dimension Marking: A Product Code 8T 3 B S Date Code: Year+Month Year: 3→2003, 4→2004 Month: 1→1, 2→2,‧‧‧ 9→9, A→10, B→11, C→12 2 1 XX L G V 3-Lead SOT-23 Plastic Surface Mounted Package CYStek Package Code: N3 C D K H Style : Pin 1.Base 2.Emitter 3.Collector J *:Typical Inches Min. Max. 0.1102 0.1204 0.0472 0.0630 0.0335 0.0512 0.0118 0.0197 0.0669 0.0910 0.0005 0.0040 DIM A B C D G H Millimeters Min. Max. 2.80 3.04 1.20 1.60 0.89 1.30 0.30 0.50 1.70 2.30 0.013 0.10 DIM J K L S V Inches Min. Max. 0.0034 0.0070 0.0128 0.0266 0.0335 0.0453 0.0830 0.1083 0.0098 0.0256 Millimeters Min. Max. 0.085 0.177 0.32 0.67 0.85 1.15 2.10 2.75 0.25 0.65 Notes : 1.Controlling dimension : millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material : • Lead : Pure tin plated. • Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0. Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYSrek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. DTC144TN3 CYStek Product Specification