TI1 LM13700N Dual operational transconductance amplifier Datasheet

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LM13700
SNOSBW2F – NOVEMBER 1999 – REVISED NOVEMBER 2015
LM13700 Dual Operational Transconductance Amplifiers
With Linearizing Diodes and Buffers
1 Features
3 Description
•
•
•
•
•
•
The LM13700 series consists of two currentcontrolled transconductance amplifiers, each with
differential inputs and a push-pull output. The two
amplifiers share common supplies but otherwise
operate independently. Linearizing diodes are
provided at the inputs to reduce distortion and allow
higher input levels. The result is a 10-dB signal-tonoise improvement referenced to 0.5 percent THD.
High impedance buffers are provided which are
especially designed to complement the dynamic
range of the amplifiers. The output buffers of the
LM13700 differ from those of the LM13600 in that
their input bias currents (and thus their output DC
levels) are independent of IABC. This may result in
performance superior to that of the LM13600 in audio
applications.
1
gm Adjustable Over 6 Decades
Excellent gm Linearity
Excellent Matching Between Amplifiers
Linearizing Diodes for reduced output distortion
High Impedance Buffers
High Output Signal-to-Noise Ratio
2 Applications
•
•
•
•
•
•
•
•
Current-Controlled Amplifiers
Stereo Audio Amplifiers
Current-Controlled Impedances
Current-Controlled Filters
Current-Controlled Oscillators
Multiplexers
Timers
Sample-and-Hold Circuits
Device Information(1)
PART NUMBER
LM13700
PACKAGE
BODY SIZE (NOM)
SOIC (16)
3.91 mm × 9.90 mm
PDIP (16)
6.35 mm × 19.304 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Connection Diagram
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LM13700
SNOSBW2F – NOVEMBER 1999 – REVISED NOVEMBER 2015
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Table of Contents
1
2
3
4
5
6
7
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
4
6.1
6.2
6.3
6.4
6.5
4
4
4
5
6
Absolute Maximum Ratings .....................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
Electrical Characteristics ..........................................
Typical Characteristics ..............................................
Detailed Description .............................................. 9
7.1 Overview ................................................................... 9
7.2 Functional Block Diagram ......................................... 9
7.3 Feature Description................................................... 9
7.4 Device Functional Modes........................................ 10
8
Application and Implementation ........................ 11
8.1 Application Information............................................ 11
8.2 Typical Application ................................................. 11
8.3 System Examples ................................................... 12
9 Power Supply Recommendations...................... 29
10 Layout................................................................... 29
10.1 Layout Guidelines ................................................. 29
10.2 Layout Example .................................................... 29
11 Device and Documentation Support ................. 30
11.1
11.2
11.3
11.4
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
30
30
30
30
12 Mechanical, Packaging, and Orderable
Information ........................................................... 30
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision E (March 2013) to Revision F
Page
•
Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section. ................................................................................................ 1
•
Removed soldering information in Absolute Maximum Ratings table .................................................................................... 4
Changes from Revision D (March 2013) to Revision E
•
2
Page
Changed layout of National Data Sheet to TI format ........................................................................................................... 27
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5 Pin Configuration and Functions
D or NFG Package
16-Pin SOIC or PDIP
Top View
Pin Functions
PIN
I/O
DESCRIPTION
NAME
NO.
Amp bias input
1, 16
A
Current bias input
Buffer input
7, 10
A
Buffer amplifier input
Buffer output
8, 9
A
Buffer amplifier output
Diode bias
2, 15
A
Linearizing diode bias input
Input+
3, 14
A
Positive input
Input–
4, 13
A
Negative input
Output
5, 12
A
Unbuffered output
V+
11
P
Positive power supply
V–
6
P
Negative power supply
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
MIN
Supply voltage
DC input voltage
MAX
UNIT
36 VDC or ±18
V
−VS
V
+VS
Differential input voltage
±5
V
Diode bias current (ID)
2
mA
Amplifier bias current (IABC)
2
mA
Buffer output current (2)
20
mA
Power dissipation (3) TA = 25°C – LM13700N
570
mW
150
°C
Output short circuit duration
Continuous
−65
Storage temperature, Tstg
(1)
(2)
(3)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Buffer output current should be limited so as to not exceed package dissipation.
For operation at ambient temperatures above 25°C, the device must be derated based on a 150°C maximum junction temperature and a
thermal resistance, junction to ambient, as follows: LM13700N, 90°C/W; LM13700M, 110°C/W.
6.2 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
V+ (single-supply configuration)
MIN
MAX
9.5
32
UNIT
V
V
V+ (dual-supply configuration)
4.75
16
V– (dual-supply configuration)
–16
–4.75
V
0
70
°C
Operating temperature, TA
LM13700N
6.3 Thermal Information
LM13700
THERMAL METRIC (1)
D (SOIC)
NFG (PDIP)
UNIT
16 PINS
16 PINS
RθJA
Junction-to-ambient thermal resistance
83.0
43.8
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
44.0
34.9
°C/W
RθJB
Junction-to-board thermal resistance
40.5
28.3
°C/W
ψJT
Junction-to-top characterization parameter
11.5
19.1
°C/W
ψJB
Junction-to-board characterization parameter
40.2
28.2
°C/W
(1)
4
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
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6.4 Electrical Characteristics
These specifications apply for VS = ±15 V, TA = 25°C, amplifier bias current (IABC) = 500 μA, pins 2 and 15 open unless
otherwise specified. The inputs to the buffers are grounded and outputs are open.
PARAMETER
TYP
MAX
Over specified temperature range
0.4
4
IABC = 5 μA
0.3
4
VOS including diodes
Diode bias current (ID) = 500 μA
0.5
5
mV
Input offset change
5 μA ≤ IABC ≤ 500 μA
0.1
3
mV
0.1
0.6
μA
0.4
5
1
8
9600
13000
Input offset voltage (VOS)
TEST CONDITIONS
MIN
Input offset current
Input bias current
Forward transconductance (gm)
Over specified temperature range
6700
Over specified temperature range
5400
gm tracking
0.3
RL = 0, IABC = 5 μA
Peak output current
Supply current
350
RL = 0, Over Specified Temp Range
300
IABC = 500 μA, both channels
Common-mode range
mV
μA
μS
dB
5
RL = 0, IABC = 500 μA
CMRR
UNIT
500
650
μA
2.6
mA
80
110
dB
±12
±13.5
V
Crosstalk
Referred to input (1)
20 Hz < f < 20 kHz
100
dB
Differential input current
IABC = 0, input = ±4 V
0.02
100
Leakage current
IABC = 0 (refer to test circuit)
0.2
100
Input resistance
10
Open-loop bandwidth
Slew rate
Unity gain compensated
Buffer input current
See
(1)
Peak buffer output voltage
See
(1)
nA
nA
26
kΩ
2
MHz
50
0.5
V/μs
2
10
μA
V
PEAK OUTPUT VOLTAGE
Positive
RL = ∞, 5 μA ≤ IABC ≤ 500 μA
12
14.2
V
Negative
RL = ∞, 5 μA ≤ IABC ≤ 500 μA
−12
−14.4
V
VOS SENSITIVITY
(1)
Positive
ΔVOS/ΔV+
20
150
μV/V
Negative
ΔVOS/ΔV−
20
150
μV/V
These specifications apply for VS = ±15 V, IABC = 500 μA, ROUT = 5-kΩ connected from the buffer output to −VS and the input of the
buffer is connected to the transconductance amplifier output.
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6.5 Typical Characteristics
6
Figure 1. Input Offset Voltage
Figure 2. Input Offset Current
Figure 3. Input Bias Current
Figure 4. Peak Output Current
Figure 5. Peak Output Voltage and Common Mode Range
Figure 6. Leakage Current
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Typical Characteristics (continued)
Figure 7. Input Leakage
Figure 8. Transconductance
Figure 9. Input Resistance
Figure 10. Amplifier Bias Voltage vs. Amplifier Bias Current
Figure 11. Input and Output Capacitance
Figure 12. Output Resistance
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Typical Characteristics (continued)
Figure 13. Distortion vs. Differential Input Voltage
Figure 14. Voltage vs. Amplifier Bias Current
Figure 15. Output Noise vs Frequency
8
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7 Detailed Description
7.1 Overview
The LM13700 is a two channel current controlled differential input transconductance amplifier with additional
output buffers. The inputs include linearizing diodes to reduce distortion, and the output current is controlled by a
dedicated pin. The outputs can sustain a continuous short to ground.
7.2 Functional Block Diagram
Figure 16. One Operational Transconductance Amplifier
7.3 Feature Description
7.3.1 Circuit Description
The differential transistor pair Q4 and Q5 form a transconductance stage in that the ratio of their collector currents
is defined by the differential input voltage according to the transfer function:
(1)
where VIN is the differential input voltage, kT/q is approximately 26 mV at 25°C and I5 and I4 are the collector
currents of transistors Q5 and Q4 respectively. With the exception of Q12 and Q13, all transistors and diodes are
identical in size. Transistors Q1 and Q2 with Diode D1 form a current mirror which forces the sum of currents I4
and I5 to equal IABC:
I4 + I5 = IABC
(2)
where IABC is the amplifier bias current applied to the gain pin.
For small differential input voltages the ratio of I4 and I5 approaches unity and the Taylor series of the In function
is approximated as:
(3)
(4)
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Feature Description (continued)
Collector currents I4 and I5 are not very useful by themselves and it is necessary to subtract one current from the
other. The remaining transistors and diodes form three current mirrors that produce an output current equal to I5
minus I4 thus:
(5)
The term in brackets is then the transconductance of the amplifier and is proportional to IABC.
7.3.2 Linearizing Diodes
For differential voltages greater than a few millivolts, Equation 3 becomes less valid and the transconductance
becomes increasingly nonlinear. Figure 19 demonstrates how the internal diodes can linearize the transfer
function of the amplifier. For convenience assume the diodes are biased with current sources and the input
signal is in the form of current IS. Since the sum of I4 and I5 is IABC and the difference is IOUT, currents I4 and I5 is
written as follows:
(6)
Since the diodes and the input transistors have identical geometries and are subject to similar voltages and
temperatures, the following is true:
(7)
Notice that in deriving Equation 7 no approximations have been made and there are no temperature-dependent
terms. The limitations are that the signal current not exceed ID / 2 and that the diodes be biased with currents. In
practice, replacing the current sources with resistors will generate insignificant errors.
7.4 Device Functional Modes
Use in single ended or dual supply systems requires minimal changes. The outputs can support a sustained
short to ground. Note that use of the LM13700 in ±5 V supply systems requires will reduce signal dynamic range;
this is due to the PNP transistors having a higher VBE than the NPN transistors.
7.4.1 Output Buffers
Each channel includes a separate output buffer which consists of a Darlington pair transistor that can drive up to
20mA.
10
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8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
An OTA is a versatile building block analog component that can be considered an ideal transistor. The LM13700
can be used in a wide variety of applications, from voltage-controlled amplifiers and filters to VCOs. The 2 wellmatched, independent channels make the LDC13700 well suited for stereo audio applications.
8.2 Typical Application
Figure 17. Voltage Controlled Amplifier
8.2.1 Design Requirements
For this example application, the system requirements provide a volume control for a 1 VP input signal with a
THD < 0.1% using ±15 V supplies. The volume control varies between -13 V and 15 V and needs to provide an
adjustable gain range of >30dB.
8.2.2 Detailed Design Procedure
Using the linearizing diodes is recommended for most applications, as they greatly reduce the output distortion. It
is required that the diode bias current, ID be greater than twice the input current, IS. As the input voltage has a
DC level of 0 V, the Diode Bias input pins are 1 diode drop above 0 V, which is +0.7 V. Tying the bias to the
clean V+ supply, results in a voltage drop of 14.3 V across RD. Using the recommended 1mA for ID is appropriate
here, and with VS=+15 V, the voltage drop is 14.3 V, and so using the standard value of 13-kΩ is acceptable and
will provide the desired gain control.
To obtain the <0.1% THD requirement, the differential input voltage must be <60mVpp when the linearizing
diodes are used. The input divider on the input will reduce the 1 VP input to 33mVPP, which is within the desired
spec.
Next, set IBIAS. The Bias Input pins (pins 1 or 16), are 2 diode drops above the negative supply, and therefore
VBIAS = 2(VBE) + V- , which for this application is -13.6 V. To set IBIAS to 1ma when VC = 15 V requires a 28.6-kΩ;
30-kΩ is a standard value and is used for this application. The gain will be linear with the applied voltage.
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Typical Application (continued)
8.2.3 Application Curve
0
Signal Amplitude (dB)
-5
-10
-15
-20
-25
-30
-35
-15
-10
-5
0
5
Control Voltage (V)
10
15
D001
Figure 18. Signal Amplitude vs Control Voltage
8.3 System Examples
8.3.1 Voltage-Controlled Amplifiers
Figure 20 shows how the linearizing diodes is used in a voltage-controlled amplifier. To understand the input
biasing, it is best to consider the 13-kΩ resistor as a current source and use a Thevenin equivalent circuit as
shown in Figure 21. This circuit is similar to Figure 19 and operates the same. The potentiometer in Figure 20 is
adjusted to minimize the effects of the control signal at the output.
Figure 19. Linearizing Diodes
For optimum signal-to-noise performance, IABC should be as large as possible as shown by the Output Voltage vs
Amplifier Bias Current graph. Larger amplitudes of input signal also improve the S/N ratio. The linearizing diodes
help here by allowing larger input signals for the same output distortion as shown by the Distortion vs. Differential
Input Voltage graph. S/N may be optimized by adjusting the magnitude of the input signal via RIN (Figure 20) until
the output distortion is below the desired level. The output voltage swing can then be set at any level by selecting
RL.
Although the noise contribution of the linearizing diodes is negligible relative to the contribution of the amplifier's
internal transistors, ID should be as large as possible. This minimizes the dynamic junction resistance of the
diodes (re) and maximizes their linearizing action when balanced against RIN. A value of 1 mA is recommended
for ID unless the specific application demands otherwise.
12
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System Examples (continued)
Figure 20. Voltage-Controlled Amplifier
Figure 21. Equivalent VCA Input Circuit
8.3.2 Stereo Volume Control
The circuit of Figure 22 uses the excellent matching of the two LM13700 amplifiers to provide a Stereo Volume
Control with a typical channel-to-channel gain tracking of 0.3 dB. RP is provided to minimize the output offset
voltage and may be replaced with two 510Ω resistors in AC-coupled applications. For the component values
given, amplifier gain is derived for Figure 20 as being:
(8)
If VC is derived from a second signal source then the circuit becomes an amplitude modulator or two-quadrant
multiplier as shown in Figure 23, where:
(9)
The constant term in the above equation may be cancelled by feeding IS × IDRC/2(V− + 1.4 V) into IO. The circuit
of Figure 24 adds RM to provide this current, resulting in a four-quadrant multiplier where RC is trimmed such that
VO = 0 V for VIN2 = 0 V. RM also serves as the load resistor for IO.
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System Examples (continued)
Figure 22. Stereo Volume Control
Figure 23. Amplitude Modulator
Figure 24. Four-Quadrant Multiplier
14
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System Examples (continued)
Noting that the gain of the LM13700 amplifier of Figure 21 may be controlled by varying the linearizing diode
current ID as well as by varying IABC, Figure 25 shows an AGC Amplifier using this approach. As VO reaches a
high enough amplitude (3 VBE) to turn on the Darlington transistors and the linearizing diodes, the increase in ID
reduces the amplifier gain so as to hold VO at that level.
8.3.3 Voltage-Controlled Resistors
An Operational Transconductance Amplifier (OTA) may be used to implement a Voltage Controlled Resistor as
shown in Figure 26. A signal voltage applied at RX generates a VIN to the LM13700 which is then multiplied by
the gm of the amplifier to produce an output current, thus:
(10)
where gm ≈ 19.2IABC at 25°C. Note that the attenuation of VO by R and RA is necessary to maintain VIN within the
linear range of the LM13700 input.
Figure 27 shows a similar VCR where the linearizing diodes are added, essentially improving the noise
performance of the resistor. A floating VCR is shown in Figure 28, where each “end” of the “resistor” may be at
any voltage within the output voltage range of the LM13700.
Figure 25. AGC Amplifier
Figure 26. Voltage-Controlled Resistor, Single-Ended
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System Examples (continued)
Figure 27. Voltage-Controlled Resistor with Linearizing Diodes
8.3.4 Voltage-Controlled Filters
OTA's are extremely useful for implementing voltage controlled filters, with the LM13700 having the advantage
that the required buffers are included on the I.C. The VC Lo-Pass Filter of Figure 29 performs as a unity-gain
buffer amplifier at frequencies below cut-off, with the cut-off frequency being the point at which XC/gm equals the
closed-loop gain of (R/RA). At frequencies above cut-off the circuit provides a single RC roll-off (6 dB per octave)
of the input signal amplitude with a −3 dB point defined by the given equation, where gm is again 19.2 × IABC at
room temperature. Figure 30 shows a VC High-Pass Filter which operates in much the same manner, providing a
single RC roll-off below the defined cut-off frequency.
Additional amplifiers may be used to implement higher order filters as demonstrated by the two-pole Butterworth
Lo-Pass Filter of Figure 31 and the state variable filter of Figure 32. Due to the excellent gm tracking of the two
amplifiers, these filters perform well over several decades of frequency.
Figure 28. Floating Voltage-Controlled Resistor
16
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System Examples (continued)
Figure 29. Voltage-Controlled Low-Pass Filter
Figure 30. Voltage-Controlled Hi-Pass Filter
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System Examples (continued)
Figure 31. Voltage-Controlled 2-Pole Butterworth Lo-Pass Filter
Figure 32. Voltage-Controlled State Variable Filter
8.3.5 Voltage-Controlled Oscillators
The classic Triangular/Square Wave VCO of Figure 33 is one of a variety of Voltage Controlled Oscillators which
may be built utilizing the LM13700. With the component values shown, this oscillator provides signals from 200
kHz to below 2 Hz as IC is varied from 1 mA to 10 nA. The output amplitudes are set by IA × RA. Note that the
peak differential input voltage must be less than 5 V to prevent zenering the inputs.
A few modifications to this circuit produce the ramp/pulse VCO of Figure 34. When VO2 is high, IF is added to IC
to increase amplifier A1's bias current and thus to increase the charging rate of capacitor C. When VO2 is low, IF
goes to zero and the capacitor discharge current is set by IC.
18
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System Examples (continued)
The VC Lo-Pass Filter of Figure 29 may be used to produce a high-quality sinusoidal VCO. The circuit of
Figure 34 employs two LM13700 packages, with three of the amplifiers configured as lo-pass filters and the
fourth as a limiter/inverter. The circuit oscillates at the frequency at which the loop phase-shift is 360° or 180° for
the inverter and 60° per filter stage. This VCO operates from 5 Hz to 50 kHz with less than 1% THD.
Figure 33. Triangular/Square-Wave VCO
Figure 34. Ramp/Pulse VCO
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System Examples (continued)
Figure 35. Sinusoidal VCO
Figure 36 shows how to build a VCO using one amplifier when the other amplifier is needed for another function.
Figure 36. Single Amplifier VCO
8.3.6 Additional Applications
Figure 37 presents an interesting one-shot which draws no power supply current until it is triggered. A positivegoing trigger pulse of at least 2 V amplitude turns on the amplifier through RB and pulls the non-inverting input
high. The amplifier regenerates and latches its output high until capacitor C charges to the voltage level on the
non-inverting input. The output then switches low, turning off the amplifier and discharging the capacitor. The
capacitor discharge rate is speeded up by shorting the diode bias pin to the inverting input so that an additional
discharge current flows through DI when the amplifier output switches low. A special feature of this timer is that
the other amplifier, when biased from VO, can perform another function and draw zero stand-by power as well.
20
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System Examples (continued)
Figure 37. Zero Stand-By Power Timer
The operation of the multiplexer of Figure 38 is very straightforward. When A1 is turned on it holds VO equal to
VIN1 and when A2 is supplied with bias current then it controls VO. CC and RC serve to stabilize the unity-gain
configuration of amplifiers A1 and A2. The maximum clock rate is limited to about 200 kHz by the LM13700 slew
rate into 150 pF when the (VIN1–VIN2) differential is at its maximum allowable value of 5 V.
The Phase-Locked Loop of Figure 39 uses the four-quadrant multiplier of Figure 24 and the VCO of Figure 36 to
produce a PLL with a ±5% hold-in range and an input sensitivity of about 300 mV.
Figure 38. Multiplexer
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System Examples (continued)
Figure 39. Phase Lock Loop
The Schmitt Trigger of Figure 40 uses the amplifier output current into R to set the hysteresis of the comparator;
thus VH = 2 × R × IB. Varying IB will produce a Schmitt Trigger with variable hysteresis.
Figure 40. Schmitt Trigger
Figure 41 shows a Tachometer or Frequency-to-Voltage converter. Whenever A1 is toggled by a positive-going
input, an amount of charge equal to (VH–VL) Ct is sourced into Cf and Rt. This once per cycle charge is then
balanced by the current of VO/Rt. The maximum FIN is limited by the amount of time required to charge Ct from
VL to VH with a current of IB, where VL and VH represent the maximum low and maximum high output voltage
swing of the LM13700. D1 is added to provide a discharge path for Ct when A1 switches low.
The Peak Detector of Figure 42 uses A2 to turn on A1 whenever VIN becomes more positive than VO. A1 then
charges storage capacitor C to hold VO equal to VIN PK. Pulling the output of A2 low through D1 serves to turn
off A1 so that VO remains constant.
22
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System Examples (continued)
Figure 41. Tachometer
Figure 42. Peak Detector and Hold Circuit
The Ramp-and-Hold of Figure 44 sources IB into capacitor C whenever the input to A1 is brought high, giving a
ramp-rate of about 1 V/ms for the component values shown.
The true-RMS converter of Figure 45 is essentially an automatic gain control amplifier which adjusts its gain such
that the AC power at the output of amplifier A1 is constant. The output power of amplifier A1 is monitored by
squaring amplifier A2 and the average compared to a reference voltage with amplifier A3. The output of A3
provides bias current to the diodes of A1 to attenuate the input signal. Because the output power of A1 is held
constant, the RMS value is constant and the attenuation is directly proportional to the RMS value of the input
voltage. The attenuation is also proportional to the diode bias current. Amplifier A4 adjusts the ratio of currents
through the diodes to be equal and therefore the voltage at the output of A4 is proportional to the RMS value of
the input voltage. The calibration potentiometer is set such that VO reads directly in RMS volts.
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System Examples (continued)
Figure 43. Sample-Hold Circuit
Figure 44. Ramp and Hold
24
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System Examples (continued)
Figure 45. True RMS Converter
The circuit of Figure 46 is a voltage reference of variable Temperature Coefficient. The 100-kΩ potentiometer
adjusts the output voltage which has a positive TC above 1.2 V, zero TC at about 1.2 V, and negative TC below
1.2 V. This is accomplished by balancing the TC of the A2 transfer function against the complementary TC of D1.
The wide dynamic range of the LM13700 allows easy control of the output pulse width in the Pulse Width
Modulator of Figure 47.
For generating IABC over a range of 4 to 6 decades of current, the system of Figure 48 provides a logarithmic
current out for a linear voltage in.
Since the closed-loop configuration ensures that the input to A2 is held equal to 0 V, the output current of A1 is
equal to I3 = −VC/RC.
The differential voltage between Q1 and Q2 is attenuated by the R1,R2 network so that A1 may be assumed to
be operating within its linear range. From Equation 5, the input voltage to A1 is:
(11)
The voltage on the base of Q1 is then
(12)
The ratio of the Q1 and Q2 collector currents is defined by:
(13)
Combining and solving for IABC yields:
(14)
This logarithmic current is used to bias the circuit of Figure 22 to provide temperature independent stereo
attenuation characteristic.
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System Examples (continued)
Figure 46. Delta VBE Reference
Figure 47. Pulse Width Modulator
26
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System Examples (continued)
Figure 48. Logarithmic Current Source
Figure 49. Unity Gain Follower
Figure 50. Leakage Current Test Circuit
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System Examples (continued)
Figure 51. Differential Input Current Test Circuit
28
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9 Power Supply Recommendations
The LM13700 can operate with either a single-ended supply or a dual supplies. The supplies should be low
impedance sources with sufficient bypassing. Use of low-ESR sufficiently rated voltage ceramic capacitors is
recommended. When bypassing dual supply configurations, the supply bypass capacitors should couple to
ground.
10 Layout
10.1 Layout Guidelines
Place supply bypass capacitors as close to the appropriate supply pins as possible. When multiple bypass
capacitors are used, the smallest value capacitor should be closest to the supply pin.
Use of a ground plane to minimize ground impedance and provide constant signal impedance is recommended.
Avoid routing signal traces over any gaps in the ground plane.
Feedback components and passives should be placed close to the device pins to minimize parasitic impedances.
When using capacitors to limit bandwidth, the capacitor should be closer to the device pin than any ballasting or
gain resistors.
2
V+
1
IBIAS1
1 IBIAS1
1
VIN1
2
VOUT1
1
VOUT1
1
VIN2
3 VIN1+
1
14 VIN2+ VIN2 VIN2+
2
GND
2
DARL1
v–
1
GND
2
V–
GND
V– v+
6 V–
7 DARL1
V–
11 V+
v+
10 DARL2
v+
2
V+
V+
1
GND
1
GND
1
VIN2–
1
VOUT2
GND
2
GND
1
GND
2
VOUT2
VOUT2
GND
9 VOUT2
8 VOUT1
v+
VOUT1
2
12 DARL2 DARL2DARL2
5 DARL1
GND
1
VIN2–
13 VIN2–
4VIN1–
1
GND
2
V+
2
VIN2+
DARL2
2
VIN1–
1
IBIAS2
16 IBIAS2
15 ILIN2
GND
1
GND
1
V+
v+
VOUT1
1
VIN1+
1
VIN1–
GND
2
GND
2
GND
2
ILIN2
2 ILIN1
DARL1
GND
GND
2
VIN1+
ILIN2
2
IBIAS1
v+
1
V+
ILIN1
10.2 Layout Example
Figure 52. Layout Recommendation
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11 Device and Documentation Support
11.1 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
11.2 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.3 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.4 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
30
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PACKAGE OPTION ADDENDUM
www.ti.com
14-Dec-2015
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
LM13700M
NRND
SOIC
D
16
48
TBD
Call TI
Call TI
0 to 70
LM13700M
LM13700M/NOPB
ACTIVE
SOIC
D
16
48
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
0 to 70
LM13700M
LM13700MX
NRND
SOIC
D
16
2500
TBD
Call TI
Call TI
0 to 70
LM13700M
LM13700MX/NOPB
ACTIVE
SOIC
D
16
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
0 to 70
LM13700M
LM13700N
NRND
PDIP
NFG
16
25
TBD
Call TI
Call TI
0 to 70
LM13700N
LM13700N/NOPB
ACTIVE
PDIP
NFG
16
25
Pb-Free
(RoHS)
CU SN
Level-1-NA-UNLIM
0 to 70
LM13700N
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
14-Dec-2015
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
2-Oct-2015
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
LM13700MX
SOIC
D
16
2500
330.0
16.4
6.5
10.3
2.3
8.0
16.0
Q1
LM13700MX/NOPB
SOIC
D
16
2500
330.0
16.4
6.5
10.3
2.3
8.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
2-Oct-2015
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LM13700MX
SOIC
D
16
2500
367.0
367.0
35.0
LM13700MX/NOPB
SOIC
D
16
2500
367.0
367.0
35.0
Pack Materials-Page 2
MECHANICAL DATA
NFG0016E
N0016E
N16E (Rev G)
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