TECHNICAL DATA IN74HC651A Octal 3-State Bus Transceivers and D Flip-Flops High-Performance Silicon-Gate CMOS The IN74HC651A is identical in pinout to the LS/ALS651. The device inputs are compatible with standard CMOS outputs; with pullup resistors, they are compatible with LS/ALSTTL outputs. These devices consist of bus transceiver circuits, D-type flip-flop, and control circuitry arranged for multiplex transmission of data directly from the data bus or from the internal storage registers. Direction and Output Enable are provided to select the read-time or stored data function. Data on the A or B Data bus, or both, can be stored in the internal D flip-flops by low-to-high transitions at the appropriate clock pins (A-to-B Clock or B-to-A Clock) regardless of the select or enable or enable control pins. When A-to-B Source and B-to-A Source are in the real-time transfer mode, it is also possible to store data without using the internal D-type flip-flops by simulta-neously enabling Direction and Output Enable. In this configuration each output reinforces its input. Thus, when all other data sources to the two sets of bus lines are at high impedance, each set of bus lines will remain at its last state. The IN74HC651A has inverted outputs. • Outputs Directly Interface to CMOS, NMOS, and TTL • Operating Voltage Range: 2.0 to 6.0 V • Low Input Current: 1.0 μA • High Noise Immunity Characteristic of CMOS Devices ORDERING INFORMATION IN74HC651AN Plastic IN74HC651ADW SOIC TA = -55° to 125° C for all packages PIN ASSIGNMENT LOGIC DIAGRAM PIN 24=VCC PIN 12 = GND Rev. 00 IN74HC651A MAXIMUM RATINGS* Symbol Parameter Value Unit -0.5 to +7.0 V VCC DC Supply Voltage (Referenced to GND) VIN DC Input Voltage (Referenced to GND) -1.5 to VCC +1.5 V DC Output Voltage (Referenced to GND) -0.5 to VCC +0.5 V DC Input Current, per Pin ±20 mA IOUT DC Output Current, per Pin ±35 mA ICC DC Supply Current, VCC and GND Pins ±75 mA PD Power Dissipation in Still Air, Plastic DIP+ SOIC Package+ 750 500 mW -65 to +150 °C 260 °C VOUT IIN Tstg TL Storage Temperature Lead Temperature, 1 mm from Case for 10 Seconds (Plastic DIP or SOIC Package) * Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recommended Operating Conditions. +Derating - Plastic DIP: - 10 mW/°C from 65° to 125°C SOIC Package: : - 7 mW/°C from 65° to 125°C RECOMMENDED OPERATING CONDITIONS Symbol VCC VIN, VOUT Parameter DC Supply Voltage (Referenced to GND) DC Input Voltage, Output Voltage (Referenced to GND) TA Operating Temperature, All Package Types tr, tf Input Rise and Fall Time (Figures 2,3) VCC =2.0 V VCC =4.5 V VCC =6.0 V Min Max Unit 2.0 6.0 V 0 VCC V -55 +125 °C 0 0 0 1000 500 400 ns This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, VIN and VOUT should be constrained to the range GND≤(VIN or VOUT)≤VCC. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused outputs must be left open. I/O pins must be connected to a properly terminated line or bus. Rev. 00 IN74HC651A DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND) VCC Symbol Parameter Test Conditions Guaranteed Limit V 25 °C to -55°C ≤85 °C ≤125 °C Unit VIH Minimum HighLevel Input Voltage VOUT=0.1 V or VCC-0.1 V ⎢IOUT⎢≤ 20 μA 2.0 4.5 6.0 1.5 3.15 4.2 1.5 3.15 4.2 1.5 3.15 4.2 V VIL Maximum Low Level Input Voltage VOUT=0.1 V or VCC-0.1 V ⎢IOUT⎢ ≤ 20 μA 2.0 4.5 6.0 0.5 1.35 1.8 0.5 1.35 1.8 0.5 1.35 1.8 V VOH Minimum HighLevel Output Voltage VIN=VIH or VIL ⎢IOUT⎢ ≤ 20 μA 2.0 4.5 6.0 1.9 4.4 5.9 1.9 4.4 5.9 1.9 4.4 5.9 V 4.5 6.0 3.98 5.48 3.84 5.34 3.7 5.2 2.0 4.5 6.0 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 4.5 6.0 0.26 0.26 0.33 0.33 0.4 0.4 VIN=VIH or VIL ⎢IOUT⎢ ≤ 6.0 mA ⎢IOUT⎢ ≤ 7.8 mA VOL Maximum LowLevel Output Voltage VIN= VIL or VIH ⎢IOUT⎢ ≤ 20 μA VIN=VIH or VIL ⎢IOUT⎢ ≤ 6.0 mA ⎢IOUT⎢ ≤ 7.8 mA) V IIN Maximum Input Leakage Current VIN=VCC or GND (Pins 1,2,3,21,22,and 23) 6.0 ±0.1 ±1.0 ±1.0 μA IOZ Maximum ThreeState Leakage Current Output in High-Impedance State VIN= VIL or VIH VOUT=VCC or GND, I/O Pins 6.0 ±0.5 ±5.0 ±10 μA ICC Maximum Quiescent Supply Current (per Package) VIN=VCC or GND IOUT=0μA 6.0 8.0 80 160 μA Rev. 00 IN74HC651A AC ELECTRICAL CHARACTERISTICS (CL=50pF,Input tr=tf=6.0 ns) Guaranteed Limit VCC Symbol Parameter V 25 °C to -55°C ≤85°C ≤125°C Unit tPLH, tPHL Maximum Propagation Delay, Input A to Output B (or Input B to Output A) (Figures 2,3 and 9) 2.0 4.5 6.0 180 36 31 225 45 38 270 54 46 ns tPLH, tPHL Maximum Propagation Delay, A-to-B Clock to Output B (or B-to-A Clock to Output A) (Figures 1 and 9) 2.0 4.5 6.0 240 48 41 300 60 51 360 72 61 ns tPLH, tPHL Maximum Propagation Delay, A-to-B Source to Output B (or B-to-A Source to Output A) (Figures 4 and 9) 2.0 4.5 6.0 220 44 37 275 55 47 330 66 56 ns tPLZ, tPHZ Maximum Propagation Delay , Direction or Output Enable to Output A or B (Figures 5,6 and 10) 2.0 4.5 6.0 170 34 29 215 43 37 255 51 43 ns tPZL, tPZH Maximum Propagation Delay , Direction or Output Enable to Output A or B (Figures 5,6 and 10) 2.0 4.5 6.0 180 36 31 225 45 38 270 54 46 ns tTLH, tTHL Maximum Output Transition Time, Any Output (Figure 2) 2.0 4.5 6.0 60 12 10 75 15 13 90 18 15 ns Maximum Input Capacitance - 10 10 10 pF Maximum Three-State I/O Capacitance (Output in High-Impedance State - 15 15 15 pF CIN COUT CPD Power Dissipation Capacitance (Per Channel) Typical @25°C,VCC=5.0 V Used to determine the no-load dynamic power consumption: PD=CPDVCC2f+ICCVCC 60 pF Rev. 00 IN74HC651A TIMING REQUIREMENTS (Input tr=tf=6.0 ns) Guaranteed Limit VCC Symbol Parameter V 25 °C to-55°C ≤85°C ≤125°C Unit tsu Minimum Setup Time, Input A to A-to-B Clock (or Input B to B-to-A Clock) (Figure 7) 2.0 4.5 6.0 50 10 9 65 13 11 75 15 13 ns th Minimum Hold Time, A-to-B Clock to Input A (or B-to-A Clock to Input B) (Figure 7) 2.0 4.5 6.0 25 5 5 30 6 5 40 8 7 ns tw Minimum Pulse Width, A-to-B Clock (or B-to-A Clock) (Figure 7) 2.0 4.5 6.0 75 15 13 95 19 16 110 22 19 ns tr, tf Maximum Input Rise and Fall Times (Figures 2 and 3) 2.0 4.5 6.0 1000 500 400 1000 500 400 1000 500 400 ns TIMING DIAGRAM Rev. 00 IN74HC651A FUNCTION TABLE Dir. OE L H CAB CBA SAB SBA X X* L L X X X* X* X X* A B INPUTS INPUTS Both the A bus and the B bus are inputs. X X Z Z The output functions of the A and B bus are disabled. X X INPUTS INPUTS Both the A and B bus are used for inputs to the internal flip-flops. Data at the bus will be stored on low to high transition of the clock inputs. OUTPUTS INPUTS The A bus are outputs and the B bus are inputs. X L H L L H The data at the B bus are displayed at the A bus. X L H L L H The data at the B bus are displayed at the A bus. The data of the B bus are stored to the internal flip-flops on low to high transition of the clock pulse. X H Qn X The data stored to the internal flip-flops, are displayed at the A bus. X H L H H L The data at the B bus are stored to the internal flip-flops on low to high transition of the clock pulse. The states of the internal flip-flops output directly to the A bus. INPUTS X H H X L X OUTPUTS The A bus are inputs and the B bus are outputs. X* L X H L L H The data at the A bus are displayed at the B bus. X* L X H L L H The data at the B bus are displayed at the A bus. The data of the B bus are stored to the internal flip-flops on low to high transition of the clock pulse. X* H X X Qn The data stored to the internal flip-flops are displayed at the B bus. X* H X H L L H The data at the A bus are stored to the internal flip-flops on low to high transition of the clock pulse. The states of the internal flip-flops output directly to the B bus. OUTPUTS H FUNCTION X OUTPUTS Both the A bus and the B bus are outputs H H Qn Qn The data stored to the internal flip-flops are displayed at the A and B bus respectively. H H Qn Qn The output at the A bus are displayed at the B bus, the output at the B bus are displayed at the A bus respec. X : DON’T CARE Z : HIGH IMPEDANCE Qn : THE DATA STORED TO THE INTERNAL FLIP-FLOPS BY MOST RECENT LOW TO HIGH TRANSITION OF THE CLOCK INPUTS * : THE DATA AT THE A AND B BUS WILL BE STORED TO THE INTERNAL FLIP-FLOPS ON EVERY LOW TO TRANSITION OF THE CLOCK INPUTS Rev. 00 IN74HC651A SWITCHING DIAGRAMS Figure 1. Switching Waveforms Figure 2. A Data Port = Input, B Data Port = Output Figure 3. A Data Port = Output, B Data Port = Input Figure 4. Switching Waveforms Figure 5. Switching Waveforms Rev. 00 IN74HC651A Figure 6. Switching Waveforms Figure 7. Switching Waveforms Figure 9. Test Circuit Figure 10. Test Circuit Rev. 00 IN74HC651A EXPANDED LOGIC DIAGRAM Rev. 00 IN74HC651A N SUFFIX PLASTIC DIP (MS - 001AF) A Dimension, mm 13 24 Symbol MIN MAX A 31.24 32.51 B 6.1 7.11 B 12 1 C F L 5 .33 D 0.36 0.56 F 1.14 1.78 C -T- SEATING G 2.54 H 7.62 PLANE N G M K H D J 0.25 (0.010) M T NOTES: 1. Dimensions “A”, “B” do not include mold flash or protrusions. Maximum mold flash or protrusions 0.25 mm (0.010) per side. J 0° 10° K 2.92 3.81 L 7.62 8.26 M 0.2 0.36 N 0.38 D SUFFIX SOIC (MS - 013AD) Dimension, mm A 24 13 H B 1 P 12 G R x 45 C -TK D SEATING PLANE 0.25 (0.010) M T C M NOTES: 1. Dimensions A and B do not include mold flash or protrusion. 2. Maximum mold flash or protrusion 0.15 mm (0.006) per side for A; for B ‑ 0.25 mm (0.010) per side. J F Symbol MIN MAX A 15.2 15.6 B 7.4 7.6 C 2.35 2.65 D 0.33 0.51 F 0.4 1.27 G 1.27 H 9.53 M J 0° 8° K 0.1 0.3 M 0.23 0.32 P 10 10.65 R 0.25 0.75 Rev. 00