AVAGO HSMX-C170 High performance chipled Datasheet

HSMx-C110/C170/C190/C191/C150
High Performance ChipLED
Data Sheet
HSMA-C110/C170/C190/C191/C150
HSML-C110/C170/C190/C191/C150
HSMC-C110/C170/C190/C191/C150
HSMZ-C110/C170/C190
Description
These chip-type LEDs utilize Aluminum Indium Gallium Phosphide (AlInGaP) material technology. The
AlInGaP material has a very high luminous efficiency,
capable of producing high light output over a wide
range of drive currents. The available colors in this
surface mount series are 592 nm Amber, 605 nm
Orange, 626 nm Red for AS AlInGaP and 631 nm red
for TS AlInGaP.
All packages are binned by both color and intensity,
except for red color.
These ChipLEDs come either in two top emitting
packages (HSMx-C170/C190/C191/C150) or in a side
emitting package (HSMx-C110). The right angle
ChipLEDs are suitable for applications such as LCD
backlighting. The top emitting ChipLEDs with wide
viewing angle are suitable for light piping and direct
backlighting of keypads and panels. In order to facilitate pick and place operation, these ChipLEDs are
shipped in tape and reel, with 4000 units per reel for
HSMx-C170/C190/C191 and 3000 units per reel for
HSMx-C110/C150.
These packages are compatible with IR soldering
process.
Features
• High brightness AlInGaP material
• Small size
• Industry standard footprint
• Diffused optics
•
•
•
•
•
Top emitting or right angle emitting
Available in 3 colors (red, orange, amber)
Compatible with IR soldering
Available in 8 mm tape on 7" diameter reel
Reel sealed in zip locked moisture barrier bags
Applications
• LCD backlighting
• Push button backlighting
• Front panel indicator
• Symbol indicator
• Microdisplays
• Small message panel signage
Package Dimensions
CATHODE
LINE
LED DIE
CATHODE
MARK
LED DIE
1.0 (0.039)
1.25 (0.049)
2.6 (0.102 )
0.62 (0.024)
2.0 (0.079 )
3.2 (0.126 )
POLARITY
CLEAR
EPOXY
1.4
(0.055)
DIFFUSED
EPOXY
1.5 (0.059)
PC BOARD
POLARITY
0.3 (0.012)
PC BOARD
1.6 (0.063 )
0.8 (0.031)
0.5 (0.020)
0.3 (0.012)
CATHODE LINE
3.2 (0.126 )
0.4 ± 0.15
(0.016 ± 0.006)
0.8 (0.031)
0.4 ± 0.15
(0.016 ± 0.006)
CATHODE LINE
1.0 (0.039)
SOLDERING
TERMINAL
SOLDERING
TERMINAL
HSMx-C110
HSMx-C170
CATHODE
MARK
LED DIE
CATHODE
MARK
LED DIE
0.8 (0.031)
0.8 (0.031)
0.4 (0.016)
1.6
(0.063 )
1.0
(0.039)
0.4 (0.016)
1.6
(0.063 )
1.0
(0.039)
POLARITY
0.3 (0.012)
0.3 (0.012)
DIFFUSED EPOXY
DIFFUSED EPOXY
POLARITY
PC BOARD
PC BOARD
CATHODE LINE
0.8 (0.031)
0.3 (0.012)
0.3 ± 0.15
(0.012 ± 0.006)
0.3 ± 0.15
(0.012 ± 0.006)
CATHODE LINE
0.6 (0.023)
0.3 (0.012)
0.3 ± 0.15
(0.012 ± 0.006)
0.3 ± 0.15
(0.012 ± 0.006)
0.7 (0.028) MIN.
0.7 (0.028) MIN.
SOLDERING
TERMINAL
SOLDERING
TERMINAL
HSMx-C190
HSMx-C191
NOTES:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.
2
CATHODE
MARK
LED DIE
Package Dimensions, continued
1.6 (0.063)
0.8 (0.031)
3.2 (0.126 )
DIFFUSED
EPOXY
POLARITY
2.0 (0.079)
0.6 (0.024)
1.1 (0.043)
PC BOARD
CATHODE LINE
0.50 ± 0.2
(0.020 ± 0.008)
SOLDERING
TERMINAL
HSMx-C150
0.5 (0.020)
0.50 ± 0.2
(0.020 ± 0.008)
NOTES:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.
Device Selection Guide
Footprint
(mm)[1,2]
AS AlInGaP
Amber
AS AlInGaP
Orange
AS AlInGaP
Red
TS AlInGaP
Red
Package
Description
1.6 x 0.8 x 0.8
HSMA-C190
HSML-C190
HSMC-C190
HSMZ-C190
Untinted, Diffused
2.0 x 1.25 x 0.8
HSMA-C170
HSML-C170
HSMC-C170
HSMZ-C170
Untinted, Diffused
3.2 x 1.0 x 1.5
HSMA-C110
HSML-C110
HSMC-C110
HSMZ-C110
Untinted, Nondiffused
1.6 x 0.8 x 0.6
HSMA-C191
HSML-C191
HSMC-C191
Untinted, Diffused
3.2 x 1.6 x 1.1
HSMA-C150
HSML-C150
HSMC-C150
Untinted, Diffused
Notes:
1. Dimensions in mm.
2. Tolerance ± 0.1 mm unless otherwise noted.
Absolute Maximum Ratings
TA = 25°C
Parameter
HSMA-C110/170/190/191/150
HSML-C110/170/190/191/150
HSMC-C110/170/190/191/150
HSMZ-C110/170/190
Units
DC Forward Current[1,2]
25
25
mA
Power Dissipation
60
65
mW
Reverse Voltage (IR = 100 µA)
5
5
V
LED Junction Temperature
95
95
°C
Operating Temperature Range
–30 to +85
–30 to +85
°C
Storage Temperature Range
–40 to +85
–40 to +85
°C
Soldering Temperature
See reflow soldering profile (Figure 7 & 8)
Notes:
1. Derate linearly as shown in Figure 4.
2. Drive currents above 5 mA are recommended for best long term performance.
3
Electrical Characteristics
TA = 25°C
Parameter Number
Forward Voltage
VF (Volts)
@ IF = 20 mA
Typ. Max.
Reverse Breakdown
VR (Volts)
@ IR = 100 µA
Min.
Capacitance C
(pF), VF = 0,
f = 1 MHz
Typ.
Thermal
Resistance
RθJ-PIN = (°C/W)
Typ.
HSMA-C110
1.9
2.4
5
45
600
HSML-C110
1.9
2.4
5
45
600
HSMC-C110
1.9
2.4
5
45
600
HSMZ-C110
2.2
2.8
5
35
600
HSMA-C170/190/191/150
1.9
2.4
5
45
300
HSML-C170/190/191/150
1.9
2.4
5
45
300
HSMC-C170/190/191/150
1.9
2.4
5
45
300
HSMZ-C170/190
2.2
2.6
5
35
300
Optical Characteristics
TA = 25°C
Part
Number
Color
Luminous
Intensity
Iv (mcd)
@ 20 mA[1]
Min.
Typ.
Peak
Wavelength
λpeak (nm)
Typ.
Color,
Dominant
Wavelength
λd[2] (nm)
Typ.
Viewing
Angle
2 θ1/2
Degrees[3]
Typ.
Luminous
Efficacy
ηv
(lm/w)
Typ.
HSMA-C110
AS Amber
28.5
95
595
592
130
480
HSMA-C170/190/191/150
AS Amber
28.5
90
595
592
170
480
HSML-C110
AS Orange
28.5
95
609
605
130
370
HSML-C170/190/191/150
AS Orange
28.5
90
609
605
170
370
HSMC-C110
AS Red
28.5
95
637
626
130
155
HSMC-C170/190/191/150
AS Red
28.5
90
637
626
170
155
HSMZ-C110
TS Red
45
170
643
631
130
122
HSMZ-C170/190
TS Red
45
165
643
631
170
122
Notes:
1. The luminous intensity, Iv, is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the
lamp package.
2. The dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the perceived color of the device.
3. θ1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity.
4
Color Bin Limits[1]
Bin ID
A
B
C
D
E
F
Orange Color Bins[1]
Dom. Wavelength (nm)
Min.
Max.
597.0
600.0
600.0
603.0
603.0
606.0
606.0
609.0
609.0
612.0
612.0
615.0
Tolerance: ± 1 nm.
Bin ID
A
B
C
D
E
F
Amber Color Bins[1]
Dom. Wavelength (nm)
Min.
Max.
582.0
584.5
584.5
587.0
587.0
589.5
589.5
592.0
592.0
594.5
594.5
597.0
Tolerance: ± 1 nm.
Note:
1. Bin categories are established for classification of products. Products
may not be available in all categories. Please contact your Avago representative for information on currently available bins.
Light Intensity (Iv) Bin Limits[1]
Intensity (mcd)
Bin ID
Min.
Max.
A
0.11
0.18
B
0.18
0.29
C
0.29
0.45
D
0.45
0.72
E
0.72
1.10
F
1.10
1.80
G
1.80
2.80
H
2.80
4.50
J
4.50
7.20
K
7.20
11.20
L
11.20
18.00
M
18.00
28.50
Bin ID
N
P
Q
R
S
T
U
V
W
X
Y
Intensity (mcd)
Min.
Max.
28.50
45.00
45.00
71.50
71.50
112.50
112.50
180.00
180.00
285.00
285.00
450.00
450.00
715.00
715.00
1125.00
1125.00
1800.00
1800.00
2850.00
2850.00
4500.00
Tolerance: ± 15%.
Note:
1. Bin categories are established for classification of products. Products may not be available in all
categories. Please contact your Avago representative for information on currently available bins.
5
1.0
AS AlInGaP
RED
RELATIVE INTENSITY
AS AlInGaP
AMBER
AS AlInGaP
ORANGE
0.5
TS AlInGaP
RED
0
500
550
600
650
700
750
WAVELENGTH – nm
1.4
AS AlInGaP
LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
IF – FORWARD CURRENT – mA
100
10
TS AlInGaP
1
0.1
1.5
1.7
1.9
2.1
2.3
2.5
VF – FORWARD VOLTAGE – V
Figure 2. Forward current vs. forward voltage.
6
1.2
1.0
0.8
0.6
0.4
0.2
0
0
5
10
15
20
25
IF – FORWARD CURRENT – mA
Figure 3. Luminous intensity vs. forward
current.
30
IF MAX. – MAXIMUM FORWARD CURRENT – mA
Figure 1. Relative intensity vs. wavelength.
30
25
20
HSMx-C110
15
HSMx-C150/170/
190/191
10
5
0
0
20
40
60
80
100
TA – AMBIENT TEMPERATURE – °C
Figure 4. Maximum forward current vs.
ambient temperature.
1.00
RELATIVE INTENSITY – %
0.90
0.80
0.70
0.60
0.50
0.40
0.30
0.20
0.10
0
-90 -80 -70 -60 -50 -40 -30 -20 -10
0
10 20 30 40 50 60 70 80 90
ANGLE
1.00
RELATIVE INTENSITY – %
0.90
0.80
0.70
0.60
0.50
0.40
0.30
0.20
0.10
0
-90 -80 -70 -60 -50 -40 -30 -20 -10
0
10 20 30 40 50 60 70 80 90
ANGLE
Figure 5. Relative intensity vs. angle for HSMx-C110.
1.00
RELATIVE INTENSITY – %
0.90
0.80
0.70
0.60
0.50
0.40
0.30
0.20
0.10
0
-90 -80 -70 -60 -50 -40 -30 -20 -10
0
10 20 30 40 50 60 70 80 90
ANGLE
Figure 6. Relative intensity vs. angle for HSMx-C170, C190, C191, and C150.
7
TEMPERATURE
10 - 30 SEC.
TEMPERATURE
10 SEC. MAX.
230°C MAX.
4°C/SEC. MAX.
140-160°C
255 - 260 °C
3 °C/SEC. MAX.
217 °C
200 °C
6 °C/SEC. MAX.
150 °C
3 °C/SEC. MAX.
–3°C/SEC.
4°C/SEC.
MAX.
100 SEC. MAX.
60 - 120 SEC.
OVER 2 MIN.
TIME
TIME
(Acc. to J-STD-020C)
Figure 7. Recommended reflow soldering profile.
Figure 8. Recommended Pb-free reflow soldering profile.
5.0 (0.200)
0.9 (0.035)
0.9 (0.035)
1.2 (0.047)
1.0 (0.039)
0.2 (0.008)
CENTERING
BOARD
1.5
(0.059)
2.0
(0.079)
1.5
(0.059)
Figure 9. Recommended soldering pattern for HSMx-C110.
1.2
(0.047)
1.2
(0.047)
0.9
(0.035)
Figure 10. Recommended soldering pattern for HSMx-C170.
0.8 (0.031)
1.5 (0.059)
0.8
(0.031)
0.7
(0.028)
0.8
(0.031)
Figure 11. Recommended soldering pattern for HSMx-C190 and C191.
Note: All dimensions in millimeters (inches).
8
1.5
(0.059)
2.0
(0.079)
1.5
(0.059)
Figure 12. Recommended soldering pattern for HSMx-C150.
USER FEED DIRECTION
CATHODE SIDE
PRINTED LABEL
Figure 13. Reeling orientation.
;;
;;
;;
;;
;;
;;
8.0 ± 1.0 (0.315 ± 0.039)
10.50 ± 1.0 (0.413 ± 0.039)
Ø 13.1 ± 0.5
(Ø 0.516 ± 0.020)
Ø 20.20 MIN.
(Ø 0.795 MIN.)
3.0 ± 0.5
(0.118 ± 0.020)
59.60 ± 1.00
(2.346 ± 0.039)
178.40 ± 1.00
(7.024 ± 0.039)
4.0 ± 0.5
(0.157 ± 0.020)
Figure 14. Reel dimensions.
Note: All dimensions in millimeters (inches).
9
6
PS
5.0 ± 0.5
(0.197 ± 0.020)
;;;
;;;;;;
;;;
;;;;;;;;;
4.00 (0.157)
DIM. C
(SEE TABLE 1)
CATHODE
1.50 (0.059)
0.20 ± 0.05
(0.008 ± 0.002)
1.75 (0.069)
3.50 ± 0.05
(0.138 ± 0.002)
DIM. A
(SEE TABLE 1)
8.00 ± 0.30
(0.315 ± 0.012)
;;;
;;;
;;
DIM. B
(SEE TABLE 1)
2.00 ± 0.05
(0.079 ± 0.002)
CARRIER TAPE
USER FEED
DIRECTION
COVER TAPE
4.00 (0.157)
HSMx-C110
POSITION IN
CARRIER TAPE
DIM. A
(SEE TABLE 1)
TABLE 1
DIMENSIONS IN MILLIMETERS (INCHES)
DIM. A
DIM. B
DIM. C
± 0.10 (± 0.004) ± 0.10 (± 0.004) ± 0.10 (± 0.004)
PART NUMBER
HSMx-C191 SERIES
1.86 (0.073)
0.89 (0.035)
HSMx-C190 SERIES
1.75 (0.069)
0.90 (0.035)
0.87 (0.034)
0.90 (0.035)
HSMx-C170 SERIES
HSMx-C110 SERIES
2.30 (0.091)
3.40 (0.134)
1.45 (0.057)
1.70 (0.067)
0.95 (0.037)
1.20 (0.047)
HSMx-C150 SERIES
3.50 (0.138)
1.88 (0.074)
1.27 (0.050)
R 1.0 ± 0.05
(0.039 ± 0.002)
DIM. B
(SEE TABLE 1)
Figure 15. Tape dimensions.
END
THERE SHALL BE A
MINIMUM OF 160 mm
(6.3 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
START
MOUNTED WITH
COMPONENTS
THERE SHALL BE A
MINIMUM OF 160 mm
(6.3 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
Figure 16. Tape leader and trailer dimensions.
NOTES:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.
10
MINIMUM OF
230 mm
(9.05 INCH)
MAY CONSIST
OF CARRIER
AND/OR
COVER TAPE.
Convective IR Reflow Soldering
For more information on IR
reflow soldering, refer to
Application Note 1060, Surface
Mounting SMT LED Indicator
Components.
Storage Condition: 5 to 30˚C
@ 60% RH max.
Baking is required under the
condition:
a) Humidity Indicator Card is
>10% when read at 23± 5°C.
b) Device exposed to factory
conditions <30°C/60% RH
more than 672 hours.
Baking recommended condition:
60 +/– 5˚C for 20 hours.
For product information and a complete list of distributors, please go to our website:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries.
Data subject to change. Copyright © 2007 Avago Technologies Limited. All rights reserved. Obsoletes 5989-3604EN
AV02-0112EN January 25, 2007
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