Datasheet Small-sized Class-D Speaker Amplifiers Analog Input Monaural Class-D Speaker Amplifier BD5469GUL General Description BD5469GUL is a monaural Class-D speaker amplifier that has integrated ALC function suitable for mobile phones, portable type electronic devices, etc. LC filter at the speaker output is not needed. The IC forms a monaural speaker amplifier using just 3 external components. ALC, short for Automatic Level Control, is a function that automatically adjusts the level of suppression to avoid distortion (clipping) of the output waveform during excessive input. The time until the suppression of the output level is released is called the release time (or recovery time). This IC has a typical release time of 262ms/1dB which suits music play applications. Through Class-D operation, the IC can achieve high efficiency and low power consumption which makes it suitable for battery driven applications. The current consumption in shutdown mode is lowered to 0.01μA(Typ). Startup time from shutdown mode to active mode is fast and pop noise is minimized which enables it to withstand repeated active and shutdown modes. Key Specifications Supply Voltage Range: 2.5V to 5.5V THD+N: 0.2%(0.3W, RL=8Ω, Typ) Switching Frequency: 250kHz(Typ) Shutdown Current: 0.01μA (Typ) Operating Temperature Range: -40°C to +85°C Package W(Typ) x D(Typ) x H(Max) 1.70mm x 1.70mm x 0.55mm VCSP50L1 Features Integrated Digital ALC (Automatic Level Control) Function. External parts : 3 components. Ultra slim type package: 9 pin WL-CSP(1.7×1.7×0.55mmMax). Pin Compatible Specs. BD5460/61GUL (No ALC Function, Fixed Output Gain) BD5465/66/68GUL (ALC Function, Fixed Output Gain) ALC release (recovery) time : 262ms/1dB (Typ). Output Power Limit : 0.88W (Typ) [VDD=4.2V, RL=8Ω, THD+N ≤ 1%] : 0.9W (Typ) [VDD=3.7V, RL=6Ω, THD+N ≤ 1%] : 0.64W (Typ) [VDD=3.6V, RL=8Ω, THD+N ≤ 1%] Audio Analog Input (has option for either single-end input or differential input). No need for output LC filter Pop noise suppression circuit Shutdown Mode (used as mute at the same time) [low shutdown current = 0.01μA (Typ)] Built-in protection circuits: output short protection, high temperature protection, under voltage protection VCSP50L1 Typical Application Circuit VDD VDD SDNB VDD OUT+ IN+ Diff. Input IN- OUTGND Applications Mobile Phones, Portable Audio Devices, PND, DSC, Note-PC etc. 〇Product structure : Silicon monolithic integrated circuit 〇This product has no designed protection against radioactive rays .www.rohm.com TSZ02201-0C1C0E700150-1-2 © 2014 ROHM Co., Ltd. All rights reserved. 1/22 TSZ22111 • 14 • 001 2014.04.04 Rev.001 BDD5469GUL Pin Configuration (Bottom View) In d e x P o s t C1 C2 C3 IN - SDNB OUT+ B1 B2 B3 VDD PVDD PGND A1 A2 A3 IN + GND OUT- Pin Descriptions Pin No. Pin Name A1 IN+ Function Audio differential input positive terminal A2 GND GND terminal (signal) A3 OUT- Class-D BTL output negative terminal B1 VDD VDD terminal (signal) B2 PVDD VDD terminal (power) B3 PGND GND terminal (power) C1 IN- C2 SDNB Audio differential input negative terminal Shutdown control terminal C3 OUT+ Class-D BTL output positive terminal Block Diagram B2 VDD B1 PVDD SDNB Shutdown Control C2 VDD BIAS OSC ALC IN+ Ri OUT- Rf A1 A3 PWM OUT+ INC1 HBridge Ri C3 Rf GND A2 www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 B3 PGND 2/22 TSZ02201-0C1C0E700150-1-2 2014.04.04 Rev.001 BDD5469GUL Absolute Maximum Ratings (Ta = 25°C) Parameter Supply Voltage [VDD, PVDD] Power Dissipation Symbol VDD PVDD Pd Limit Unit -0.3 to +7.0 V 0.69 (Note 1) W Operating Temperature Range Topr -40 to +85 °C Storage Temperature Range Tstg -55 to +150 °C Tjmax 150 °C VIN -0.3 to +7.0 V VOUT -0.3 to +7.0 V Maximum Junction Temperature SDNB, IN+, IN- Voltage OUT Voltage (Note 1) Derate by 5.52 mW/°C when operating above Ta = 25°C (Mount on 1-layer 70.0mm x 70.0mm x 1.6mm board) Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Recommended Operating Conditions (Ta= -40°C to +85°C) Parameter Supply Voltage Common Mode Input Voltage Range Minimum Load Impedance www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 Symbol VDD PVDD VSW RL Min Typ Max Unit 2.5 3.6 5.5 V +0.5 - VDD-0.8 V 3.6 - - Ω 3/22 TSZ02201-0C1C0E700150-1-2 2014.04.04 Rev.001 BDD5469GUL Electrical Characteristics (Unless otherwise specified, VDD=3.6V, Ta=25°C) Parameter Symbol Min Limit Typ Max Unit Conditions Whole Circuit Circuit Current (No Signal) ICC - 3 6 mA IC Active, No Load VSDNB =VDD Circuit Current (Shutdown) ISDN - 0.01 2 μA IC Shutdown VSDNB =GND PO 0.044 x 2 VDD 0.050 x 2 VDD 0.055 2 xVDD W BTL, f=1kHz, RL=8Ω (Note 2) THD+N ≤ 1% , THD+N - 0.2 1 % BTL, fIN=1kHz, RL=8Ω (Note 2) PO =0.3W, Maximum Gain GMAX 12 13 14 dB BTL, (Note 2) ALC Limit Level VLIM 1.68 x VDD 1.78 x VDD 1.89 x VDD VP-P BTL, (Note 2) ALC Release Level VREL 1.34 x VDD 1.41 x VDD 1.5 x VDD VP-P BTL, (Note 2) Switching Frequency fOSC 150 250 350 kHz Start-up Time tON 0.73 1.02 1.71 msec Audio Input Resistance RI 47 72 97 kΩ Gain=13dB H VSDNBH 1.4 - VDD V IC Active L VSDNBL 0 - 0.4 V IC Shutdown H ISDBNH 24 48 72 µA VSDNB =3.6V L ISDNBL - ±5 µA VSDNB =0V Audio Circuit Limit Output Power Total Harmonic Distortion Control Circuit SDNB Terminal Threshold Voltage SDNB Terminal Inflow Current (Note 2) Filter bandwidth for measurement：400Hz to 30kHz, LC filter for AC measurement : L=22μH / C=1μF, BTL：Voltage between A3,C3 www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 4/22 TSZ02201-0C1C0E700150-1-2 2014.04.04 Rev.001 BDD5469GUL 100 100 90 90 80 80 70 70 Efficiency [%] Efficiency [%] Typical Performance Curves 60 50 40 V DD=2.5V VDD=2.5V 30 60 50 40 30 V DD=3.6V VDD=3.6V 20 V VDD=2.5V DD=2.5V 20 V DD=5V VDD=5V V VDD=3.6V DD=3.6V 10 10 V DD=5V VDD=5V 0 0 0 0.2 0.4 0.6 0.8 Output Power [W] 1 0 1.2 0.4 0.6 0.8 Output Power [W] 1 1.2 Figure 2. Efficiency vs Output Power (f=1kHz, RL=4Ω+33μH) Figure 1. Efficiency vs Output Power (f=1kHz, RL=8Ω+33μH) 300 300 250 250 200 200 Icc [mA] Icc [mA] 0.2 150 100 150 100 VDD=2.5V VVDD=2.5V DD=2.5V V DD=3.6V VDD=3.6V VDD=3.6V VVDD=2.5V DD=2.5V 50 50 VVDD=3.6V DD=3.6V VVDD=5V DD=5V VVDD=5V DD=5V VDD=5V 0 0 0 0.2 0.4 0.6 0.8 Output Power [W] 1 1.2 0 Figure 3. Supply Current vs Output Power (f=1kHz, RL=8Ω+33μH) www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 0.2 0.4 0.6 0.8 Output Power [W] 1 1.2 Figure 4. Supply Current vs Output Power (f=1kHz, RL=4Ω+33μH) 5/22 TSZ02201-0C1C0E700150-1-2 2014.04.04 Rev.001 BDD5469GUL Typical Performance Curves - continued 0.16 0.3 0.14 0.25 0.12 0.2 Pd (W) Pd (W) 0.1 0.08 0.15 0.06 0.1 V VDD=2.5V DD=2.5V 0.04 VDD=2.5V VDD=2.5V V VDD=3.6V DD=3.6V V DD=5V VDD=5V 0.02 VDD=3.6V VDD=3.6V 0.05 VDD=5V VDD=5V 0 0 0 0.2 0.4 0.6 0.8 Output Power (W) 1 0 1.2 0.2 5 4.5 4.5 4 4 3.5 3.5 3 3 ISDNB [μA] ICC [mA] 5 2.5 2 2 1.5 1 1 0.5 0.5 0 4 0 6 0 VDD [V] 2 4 6 VDD [V] Figure 7. Supply Current vs Power Supply (No Load, No Signal) www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 1.2 2.5 1.5 2 1 Figure 6. Power Dissipation vs Output Power (f=1kHz, RL=4Ω+33μH) Figure 5. Power Dissipation vs Output Power (f=1kHz, RL=8Ω+33μH) 0 0.4 0.6 0.8 Output Power (W) Figure 8. Shutdown Current vs Power Supply (No Load, No Signal) 6/22 TSZ02201-0C1C0E700150-1-2 2014.04.04 Rev.001 BDD5469GUL Typical Performance Curves - continued 2.5 V DD=2.5V VDD=2.5V V DD=3.6V VDD=3.6V Output Power [W] 2 V DD=5V VDD=5V 1.5 1 0.5 0 4 8 12 16 20 RL [Ω] 24 28 32 Figure 9. Output Power vs Load Resistance (f=1kHz) 3 1.6 1.4 2.5 Output Power [W] Output Power [W] 1.2 1 0.8 0.6 2 1.5 1 0.4 0.5 0.2 0 0 2.5 3 3.5 4 4.5 VDD [V] 5 5.5 6 Figure 10. Output Power vs Power Supply (f=1kHz, RL=8Ω) www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 2.5 3 3.5 4 4.5 VDD [V] 5 5.5 6 Figure 11. Output Power vs Power Supply (f=1kHz, RL=4Ω) 7/22 TSZ02201-0C1C0E700150-1-2 2014.04.04 Rev.001 BDD5469GUL Typical Performance Curves - continued 100 100 VDD=2.5V VDD=2.5V VDD=3.6V VDD=3.6V V VDD=3.6V DD=3.6V VDD=5V VDD=5V VDD=5V VDD=5V 10 THD+N [%] THD+N [%] 10 VDD=2.5V VDD=2.5V 1 0.1 1 0.1 0.01 0.01 0.1 1 Output Power [W] 0.01 0.01 10 Figure 12. THD+N vs Output Power (f=1kHz, RL=8Ω, 400Hz-30kHz BPF) 0.1 1 Output Power [W] 10 Figure 13. THD+N vs Output Power (f=1kHz, RL=4Ω, 400Hz-30kHz BPF) 10 10 Po=25mW Po=25mW Po=100mW Po=100mW Po=150mW Po=250mW 1 THD+N [%] THD+N [%] 1 0.1 0.1 0.01 0.01 10 100 1k 10k Frequency [Hz] 100k 10 Figure 13. THD+N vs Frequency (VDD=5.0V, f=1kHz, RL=8Ω, 400Hz-30kHz BPF) www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 100 1k 10k Frequency [Hz] 100k Figure 14. THD+N vs Frequency (VDD=3.6V, f=1kHz, RL=8Ω, 400Hz-30kHz BPF) 8/22 TSZ02201-0C1C0E700150-1-2 2014.04.04 Rev.001 BDD5469GUL Typical Performance Curves - continued 10 10 Po=25mW VDD=2.5V Po=100mW VDD=3.6V Po=150mW VDD=5V 1 THD+N [%] THD+N [%] 1 0.1 0.1 0.01 0.01 10 10 100 1k 10k Frequency [Hz] 14 14 12 12 10 10 8 VDD=2.5V VDD=2.5V VDD=3.6V VDD=3.6V V VDD=5V DD=5V 4 1k 10k Frequency [Hz] 100k Figure 16. THD+N vs Frequency (f=1kHz, RL=8Ω, Po=125mW, 400Hz-30kHz BPF) Gain [dB] Gain [dB] Figure 15. THD+N vs Frequency (VDD=2.5V, f=1kHz, RL=8Ω, 400Hz-30kHz BPF) 6 100 100k 8 V VDD=2.5V DD=2.5V 6 VVDD=3.6V DD=3.6V V DD=5V VDD=5V 4 2 2 0 0 10 100 1k 10k Frequency [Hz] 100k 10 Figure 17. Gain vs Frequency (Vin=0.5VP-P, RL=8Ω, 400Hz-30kHz BPF) www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 100 1k 10k Frequency [Hz] 100k Figure 18. Gain vs Frequency (Vin=0.5VP-P, RL=4Ω, 400Hz-30kHz BPF) 9/22 TSZ02201-0C1C0E700150-1-2 2014.04.04 Rev.001 BDD5469GUL Typical Performance Curves - continued 10 V DD=2.5V VDD=2.5V V DD=2.5V VDD=2.5V V DD=3.6V VDD=3.6V V DD=3.6V VDD=3.6V V DD=5V VDD=5V V DD=5V VDD=5V 1 Output Power [W] Output Power [W] 10 VDD=5V VDD=3.6V VDD=2.5V 0.1 1 VDD=3.6V VDD=2.5V 0.1 0.01 0.01 -30 -25 -20 -15 -10 -5 0 Vin [dBV] 5 10 -30 -25 -20 -15 -10 -5 0 Vin [dBV] 15 Figure 19. Output Power vs Input Level (f=1kHz, RL=8Ω) 10 15 100 VDD=2.5V VDD=2.5V VDD=2.5V V DD=2.5V V DD=3.6V VDD=3.6V VDD=5V VDD=5V V VDD=3.6V DD=3.6V 10 Pd [W] Pd [W] 5 Figure 20. Output Power vs Input Level (f=1kHz, RL=4Ω) 100 10 VDD=5V 1 0.1 V VDD=5V DD=5V 1 0.1 0.01 0.01 -40 -35 -30 -25 -20 -15 -10 -5 0 Output Power [W] 5 10 15 Figure 21. THD+N vs Output Power (f=1kHz, RL=8Ω, 400Hz-30kHz BPF) www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 -40 -35 -30 -25 -20 -15 -10 -5 0 Output Power [W] 5 10 15 Figure 22. THD+N vs Output Power (f=1kHz, RL=4Ω, 400Hz-30kHz BPF) 10/22 TSZ02201-0C1C0E700150-1-2 2014.04.04 Rev.001 BDD5469GUL Typical Performance Curves - continued INPUT 2V/div INPUT 2V/div 1msec/div f=1kHz OUTPUT 2V/div 400msec/div f=1kHz OUTPUT 2V/div Figure 23. ALC Limit waveform (VDD=3.6V, RL=8Ω) Figure 24. ALC Release waveform (VDD=3.6V, RL=8Ω) 200μsec/div 200μsec/div OUTPUT 2V/div OUTPUT 2V/div SDNB 2V/div SDNB 2V/div Figure 25. Start waveform (VDD=3.6V, RL=8Ω) www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 Figure 26. Shutdown waveform (VDD=3.6V, RL=8Ω) 11/22 TSZ02201-0C1C0E700150-1-2 2014.04.04 Rev.001 BDD5469GUL Application Information 1. Shutdown Control Control terminal Condition SDNB H IC operation (active) L IC stop (shutdown) 2. ALC Parameter ALC Parameter Attack Time (Typ) ~1ms/1dB@fIN=100Hz ~0.5ms/1dB@ fIN=1kHz ~0.05ms/1dB@ fIN=10kHz Release Time (Typ) 262ms/1dB @ fIN=100Hz to 10kHz Gain Switch Step(Typ) ±1dB The gain switch timing during ALC operation occurs at zero cross point of audio output voltage. For that, attack time and release time will change at input frequency “fIN”. ALC Parameter is fixed. ALC operation doesn’t correspond to impulse noise. 3. Protection Function Description Protection Function Output Short Protection High Temperature Protection Under Voltage Protection Speaker PWM Output Detecting and Releasing Condition Detecting condition Detecting condition Releasing condition Detecting condition Releasing condition Detecting current= 2.5A (Typ) High Z (Latch) Chip temperature above 180°C (Typ) High Z Chip temperature below 110°C (Typ) Normal operation Power supply voltage below 2.2V (Typ) 1kΩ pulldown Power supply voltage above 2.3V (Typ) Normal operation Once an IC is latched, the circuit is not released automatically even after the detecting status is removed. Procedure 1 or 2 below is needed for recovery. 1 SDNB pin is turned Low once. After the soft mute transition time, SDNB pin is returned to High again. 2 Power supply is turned on again after dropping to VDD<1V (10ms (Min) holding time) in which the internal power ON reset circuit activates. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 12/22 TSZ02201-0C1C0E700150-1-2 2014.04.04 Rev.001 BDD5469GUL Application Examples Application Circuit Example 1: Differential Input (With Input Coupling Capacitor) VDD C3 10uF VDD B1 B2 PVDD SDNB Shutdown Signal Shutdown Control C2 H = IC Active L = IC Shutdown BIAS 75k (Typ.) OSC ALC Audio Input+ 0.1uF IN+ Ri OUT- Rf A3 A1 C1 HBridge PWM Differential Input 0.1uF Audio Input- OUT+ INC1 C2 Ri C3 Rf GND A2 B3 PGND Application Circuit Example 2: (Without Input Coupling Capacitor) VDD C3 10uF VDD B1 B2 PVDD SDNB Shutdown Signal Shutdown Control C2 H = IC Active L = IC Shutdown BIAS 75k (Typ.) OSC ALC Audio Input+ IN+ Ri OUT- Rf A3 A1 PWM Differential Input OUT+ INAudio Input- C1 HBridge Ri C3 Rf GND A2 B3 PGND The BD5469GUL does not require input coupling capacitors if the design uses a differential source that is biased from 0.5V to VDD-0.8V. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 13/22 TSZ02201-0C1C0E700150-1-2 2014.04.04 Rev.001 BDD5469GUL Application Circuit Example 3: Single End Input (IN-) VDD C3 10uF B2 VDD B1 PVDD SDNB Shutdown Signal Shutdown Control C2 H = IC Active L = IC Shutdown BIAS 75k (Typ.) OSC ALC 0.1uF IN+ OUT- Rf Ri A3 A1 C1 HBridge PWM 0.1uF Audio Input- OUT+ INC1 C2 C3 Rf Ri B3 PGND GND A2 The output (OUT+ to OUT-) and IN- are in reverse phase. Application Circuit Example 4: Single End Input (IN+) VDD C3 10uF VDD B1 B2 PVDD SDNB Shutdown Signal Shutdown Control C2 H = IC Active L = IC Shutdown BIAS 75k (Typ.) OSC ALC Audio Input+ 0.1uF IN+ Ri OUT- Rf A3 A1 C1 PWM 0.1uF C2 OUT+ INC1 HBridge Ri C3 Rf GND A2 B3 PGND The output (OUT+ to OUT-) and IN+ are in phase. Input pin should not be left open through the input coupling capacitor. Please connect to GND as seen on the example above. Audio input pin should be in “mute” condition and not “open” condition when there’s no input signal. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 14/22 TSZ02201-0C1C0E700150-1-2 2014.04.04 Rev.001 BDD5469GUL Application Circuit Example 5: Differential Input (With Input Coupling Capacitor) When it is not possible to drive in 1kΩ pull-down at SDNB=L. VDD C3 10uF VDD B1 B2 PVDD SDNB Shutdown Signal H = IC Active L = IC Shutdown Shutdown Control C2 BIAS 75k (Typ) OSC ALC 0.1uF 1kΩ IN+ Audio Input+ Ri OUT- Rf A3 A1 C1 RIN+ PWM Differential Input Audio Input- 0.1uF 1kΩ INC1 RINC2 HBridge OUT+ Ri C3 Rf GND A2 B3 PGND The input pin uses a 1kΩ pull-down when PDNB=L (Please refer to the I/O equivalent circuit chart). Therefore, please take note of the drive current capability of the audio input. Please insert 1kΩ in the terminal as shown in the above figure when the drive current capability of the input line is insufficient. There is no influence at the ALC level of the output when 1kΩ is inserted. Selecting External Components (1) Input Coupling Capacitor (C1, C2) The input coupling capacitor is 0.1μF. Input impedance during maximum gain of 13dB is 72kΩ (Typ). A high-pass filter is composed by the input coupling capacitor and the input impedance. Cut-off frequency “fc” is calculated using the formula below, given the input coupling capacitor C=(C1=C2) and input impedance Ri. fc = 1 2 π × Ri ×C [Hz] In case of Ri=72kΩ and C=(C1=C2)=0.1μF, the cut-off frequency is about 22Hz. (2) Power Supply Decoupling Capacitor (C3) The power supply decoupling capacitor is 10µF. When the capacity value of the power supply decoupling capacitor is made small, it will have an influence to the audio characteristics THD+N, ALC Limit level, ALC Release level. When making it small, be careful with the audio characteristics at actual application. Please use a capacitor having low enough ESR (equivalent series resistance). www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 15/22 TSZ02201-0C1C0E700150-1-2 2014.04.04 Rev.001 BDD5469GUL Power Dissipation The IC Characteristics has a big relation with the temperature that is used. Exceeding the maximum tolerance junction temperature can deteriorate and destroy it. To avoid instant destruction and maintain long-time operation of the IC, there should be extra caution during thermal operation. Refer to the maximum junction temperature (Tjmax) and the operating temperature range (Topr) in the absolute maximum ratings of the IC, and the Pd-Ta characteristics (Thermal reduction ratio curve) shown below. If input signal is excessive at a state where heat sink is not sufficient, there will be TSD (Thermal Shutdown) TSD of the chip is detected at around 180°C, and is released at around 120°C or less. Since the aim is to prevent damage on the chip, avoid operating at TSD temperature window for a long period of time because this can deteriorate the IC. Thermal Reduction Ratio Curve Reference Data VCSP50L1 2.0 Measurement Condition : ROHM Typical Board Mount Board Size : 70mmx70mmx1.6mm Power Dissipation : Pd (W) 1.5 1.0 0.69W θja = 181.8℃/W 0.5 0.0 0 25 50 75 85 100 125 150 Ambient Temperature : Ta (°C) (Note) This value is the real measurement, but not the guaranteed value. The value of power dissipation changes based on the board that will be mounted. The power dissipation may exceed the value on the above graph depending on the heat dissipation efficiency of the mounted board. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 16/22 TSZ02201-0C1C0E700150-1-2 2014.04.04 Rev.001 BDD5469GUL I/O Equivalent Circuits (Provided pin voltages are typical values) Pin No. Pin Name Pin Voltage (TYP) Pin Descriptions Internal Equivalent Circuits B2 C2 SDNB 0V Shutdown control terminal H: Active L: Shutdown 50k C2 75k A2 B2 A1 IN+ 0V Audio differential input positive terminal 1kΩ pull-down at PDNB=L A1 1k PD A2 B2 C1 IN- 0V Audio differential input negative terminal 1kΩ pull-down at PDNB=L C1 1k PD A2 A3 Class-D BTL output negative terminal OUT- B2 0V C3 A3 C3 Class-D BTL output positive terminal OUT+ 1k B3 B1 VDD - VDD terminal (signal) - B2 PVDD - VDD terminal (power) - A2 GND - GND terminal (signal) - B3 PGND - GND terminal (power) - www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 17/22 TSZ02201-0C1C0E700150-1-2 2014.04.04 Rev.001 BDD5469GUL Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply terminals. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the power dissipation rating be exceeded, the rise in temperature of the chip may result in deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the Pd rating 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned OFF completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 11. Unused Input Pins Input terminals of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input terminals should be connected to the power supply or ground line. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 18/22 TSZ02201-0C1C0E700150-1-2 2014.04.04 Rev.001 BDD5469GUL Operational Notes – continued 12. Regarding the Input Pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Figure 27. Example of Monolithic IC Structure 13. Ceramic Capacitor When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 14. Area of Safe Operation (ASO) Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe Operation (ASO). 15. Thermal Shutdown Circuit (TSD) This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below the TSD threshold, the circuits are automatically restored to normal operation. Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat damage. 16. Over-Current Protection Circuit (OCP) This IC has a built-in over-current protection circuit that activates when the output is accidentally shorted. However, it is strongly advised not to subject the IC to prolonged shorting of the output. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 19/22 TSZ02201-0C1C0E700150-1-2 2014.04.04 Rev.001 BDD5469GUL Ordering Information B D 5 4 6 9 Part Number G U L - Package GUL:VCSP50L1 E2 Packaging and forming specification E2: Embossed tape and reel Marking Diagram VCSP50L1 (TOP VIEW) 1PIN MARK Part Number Marking LOT Number 5469 Part Number Marking 5469 www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 Package VCSP50L1 Orderable Part Number BD5469GUL-E2 20/22 TSZ02201-0C1C0E700150-1-2 2014.04.04 Rev.001 BDD5469GUL Physical Dimension, Tape and Reel Information Package Name www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 VCSP50L1(BD5469GUL) 21/22 TSZ02201-0C1C0E700150-1-2 2014.04.04 Rev.001 BDD5469GUL Revision History Date Revision 04.Apr.2014 1.0 Changes New Release www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 22/22 TSZ02201-0C1C0E700150-1-2 2014.04.04 Rev.001 Datasheet Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) , transport intend to use our Products in devices requiring extremely high reliability (such as medical equipment equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet BD5469GUL - Web Page Buy Distribution Inventory Part Number Package Unit Quantity Minimum Package Quantity Packing Type Constitution Materials List RoHS BD5469GUL VCSP50L1 3000 3000 Taping inquiry Yes