ON MC33275DT-3.0RK Low dropout micropower voltage regulator Datasheet

MC33275
Low Dropout 300 mA
Voltage Regulator
The MC33275 series are micropower low dropout voltage
regulators available in a wide variety of output voltages as well as
packages, DPAK, SOT–223, and SOP–8 surface mount packages.
These devices feature a very low quiescent current and are capable of
supplying output currents up to 300 mA. Internal current and thermal
limiting protection are provided by the presence of a short circuit at the
output and an internal thermal shutdown circuit.
The MC33275 is available as a MC33375 which includes an On/Off
control.
Due to the low input–to–output voltage differential and bias current
specifications, these devices are ideally suited for battery powered
computer, consumer, and industrial equipment where an extension of
useful battery life is desirable.
http://onsemi.com
LOW DROPOUT
MICROPOWER VOLTAGE
REGULATOR
Gnd
4
4
Features:
• Low Quiescent Current (125 mA)
• Low Input–to–Output Voltage Differential of 25 mV at IO = 10 mA,
MC33275
1
3
1
2
3
Vin Gnd Vout
and 260 mV at IO = 300 mA
• Extremely Tight Line and Load Regulation
• Stable with Output Capacitance of only 0.33 mF for 2.5 V Output
PLASTIC
DT SUFFIX
CASE 369A
Voltage
• Internal Current and Thermal Limiting
Gnd
4
Simplified Block Diagram
MC33375
4
Vin
1
Vout
1
3
2
Gnd
Vin
Thermal &
Anti–sat
Protection
3
Vout
PLASTIC
ST SUFFIX
CASE 318E
Rint
1
8
2
7
Output
Input
1.23 V
V. Ref.
Gnd
Gnd
3
8
54 K
Gnd
Gnd
1
Gnd
MC33375
4
6
Gnd
5
N/C
Pins 4 and 5 Not Connected
This device contains 41 active transistors
PLASTIC
D SUFFIX
CASE 751
ORDERING INFORMATION
See detailed ordering and shipping information in the
package dimensions section on page 9 of this data sheet.
 Semiconductor Components Industries, LLC, 2000
March, 2000 – Rev. 4
1
Publication Order Number:
MC33275/D
MC33275
MAXIMUM RATINGS (TA = 25°C, for min/max values TJ = –40°C to +125°C)
Rating
Symbol
Value
Unit
VCC
13
Vdc
PD
Internally Limited
W
RθJA
RθJC
160
25
°C/W
°C/W
RθJA
RθJC
92
6.0
°C/W
°C/W
RθJA
RθJC
245
15
°C/W
°C/W
Output Current
IO
300
mA
Maximum Junction Temperature
TJ
150
°C
Operating Junction Temperature Range
TJ
– 40 to +125
°C
Storage Temperature Range
Tstg
– 65 to +150
°C
Input Voltage
Power Dissipation and Thermal Characteristics
TA = 25°C
Maximum Power Dissipation
Case 751 (SOP–8) D Suffix
Thermal Resistance, Junction–to–Ambient
Thermal Resistance, Junction–to–Case
Case 369A (DPAK) DT Suffix
Thermal Resistance, Junction–to–Air
Thermal Resistance, Junction–to–Case
Case 318E (SOT–223) ST Suffix
Thermal Resistance, Junction–to–Air
Thermal Resistance, Junction–to–Case
ELECTRICAL CHARACTERISTICS (CL = 1.0µF, TA = 25°C, for min/max values TJ = –40°C to +125°C, Note 1)
Characteristic
Output Voltage
2.5 V Suffix
3.0 V Suffix
3.3 V Suffix
5.0 V Suffix
Symbol
IO = 0 mA to 250 mA
TA = 25°C, Vin = [VO + 1] V
Min
Typ
Max
2.475
2.970
3.267
4.950
2.50
3.00
3.30
5.00
2.525
3.030
3.333
5.05
2.450
2.940
3.234
4.900
—
—
—
—
2.550
3.060
3.366
5.100
VO
Unit
Vdc
2.5 V Suffix
3.0 V Suffix
3.3 V Suffix
5.0 V Suffix
Vin = [VO + 1] V, 0 < IO < 100 mA
2% Tolerance from TJ = –40 to +125°C
Line Regulation
Vin = [VO + 1] V to 12 V, IO = 250 mA,
All Suffixes TA = 25°C
Regline
–
2.0
10
mV
Load Regulation
Vin = [VO + 1] V, IO = 0 mA to 250 mA,
All Suffixes TA = 25°C
Regload
–
5.0
25
mV
—
—
—
—
25
115
220
260
100
200
400
500
65
75
—
Dropout Voltage
IO = 10 mA
IO = 100 mA
IO = 250 mA
IO = 300 mA
Vin – VO
TJ = –40°C to +125°C
Ripple Rejection (120 Hz)
Vin(peak–peak) = [VO + 1.5] V to [VO + 5.5] V
Output Noise Voltage
C L = 1 mF
CL = 200 mF
—
mV
dB
mVrm
Vn
—
—
160
46
—
—
s
Min
Typ
Max
Unit
—
—
125
1100
200
1500
ILIMIT
—
450
—
mA
Symbol
Min
Typ
Max
Unit
—
—
150
—
°C
IO = 50 mA (10 Hz to 100 kHz)
CURRENT PARAMETERS
Characteristic
Symbol
Quiescent Current
On Mode
On Mode SAT
Vin = [VO + 1] V, IO = 0 mA
Vin = [VO – 0.5] V, IO = 0 mA, Note 2
Current Limit
Vin = [VO + 1], VO shorted
mA
IQ
THERMAL SHUTDOWN
Characteristic
Thermal Shutdown
NOTE: 1. Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible.
NOTE: 2. Quiescent Current is measured where the PNP pass transistor is in saturation. Vin = [VO – 0.5] V guarantees this condition.
http://onsemi.com
2
MC33275
DEFINITIONS
difference between the input power (VCC X ICC) and the
output power (Vout X Iout) is increasing.
Depending on ambient temperature, it is possible to
calculate the maximum power dissipation and so the
maximum current as following:
Load Regulation – The change in output voltage for a
change in load current at constant chip temperature.
Dropout Voltage – The input/output differential at which
the regulator output no longer maintains regulation against
further reductions in input voltage. Measured when the
output drops 100 mV below its nominal value (which is
measured at 1.0 V differential), dropout voltage is affected
by junction temperature, load current and minimum input
supply requirements.
Output Noise Voltage – The RMS AC voltage at the
output with a constant load and no input ripple, measured
over a specified frequency range.
Maximum Power Dissipation – The maximum total
dissipation for which the regulator will operate within
specifications.
Quiescent Current – Current which is used to operate the
regulator chip and is not delivered to the load.
Line Regulation – The change in output voltage for a
change in the input voltage. The measurement is made under
conditions of low dissipation or by using pulse techniques
such that the average chip temperature is not significantly
affected.
Maximum Package Power Dissipation – The maximum
package power dissipation is the power dissipation level at
which the junction temperature reaches its maximum value
i.e. 150°C. The junction temperature is rising while the
Pd
+ TRJ – TA
qJA
The maximum operating junction temperature TJ is
specified at 150°C, if TA = 25°C, then PD can be found. By
neglecting the quiescent current, the maximum power
dissipation can be expressed as:
I out
+V
P
D
– Vout
CC
The thermal resistance of the whole circuit can be
evaluated by deliberately activating the thermal shutdown
of the circuit (by increasing the output current or raising the
input voltage for example).
Then you can calculate the power dissipation by
subtracting the output power from the input power. All
variables are then well known: power dissipation, thermal
shutdown temperature (150°C for MC33275) and ambient
temperature.
R
T –T
J A
+
qJA
P
D
http://onsemi.com
3
MC33275
Figure 1. Line Transient Response
Figure 2. Line Transient Response
Vin , INPUT VOLTAGE (V)
5
Vin
7
150
TA = 25° C
6 CL = 33 mF
IL = 10 mA
5 Vout = 3.3 V
100
4
50
3
0
2
Vout
1
–50
0
–100
0
20
40
60
80
100
120
140
160
180 200
70
60
Vin
40
4
30
20
3
10
2
0
1
Vout
0
50
100
350
0.8
250
0.4
0
0.2
0
–100
–200
–0.2
Vout CHANGE
50
–0.4
–0.6
–0.8
100
150
200
250
300
350
0.14
150
LOAD CURRENT (mA)
0.6
LOAD CURRENT
0
LOAD CURRENT
0.09
50
–50
0.04
–150
–0.01
–250
–350
CL = 33.0 mF
Vout = 3.3 V
TA = 25° C
Vin = 4.3 V
Vout CHANGE
–450
–550
–0.06
–0.11
–650
–1.0
400
–0.16
–750
0
50
TIME (mS)
100
150
200
250
300
TIME (mS)
Figure 5. Output Voltage versus Input Voltage
Figure 6. Dropout Voltage versus Output Current
300
3.5
3.0
IL = 1 mA
DROPOUT VOLTAGE (mV)
OUTPUT VOLTAGE (V)
–20
OUTPUT VOLTAGE CHANGE (V)
LOAD CURRENT (mA)
1.0
OUTPUT VOLTAGE CHANGE (V)
200
–700
200
Figure 4. Load Transient Response
300
–400 CL = 1.0 mF
Vout = 3.3 V
–500 TA = 25° C
–600 Vin = 4.3 V
150
TIME (mS)
Figure 3. Load Transient Response
–300
–10
0
TIME (mS)
100
50
OUTPUT VOLTAGE CHANGE (mV)
6
200
OUTPUT VOLTAGE CHANGE (mV)
TA = 25° C
CL = 0.47 mF
IL = 10 mA
Vout = 3.3 V
Vin , INPUT VOLTAGE (V)
7
2.5
IL = 250 mA
2.0
1.5
1.0
250
200
150
100
50
0.5
0
0
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
1
4.5 5.0
10
100
IO, OUTPUT CURRENT (mA)
INPUT VOLTAGE (V)
http://onsemi.com
4
1000
MC33275
Figure 8. Ground Pin Current versus
Input Voltage
Figure 7. Dropout Voltage versus Temperature
12
250
10
IL = 300 mA
8
200
Ignd (mA)
DROPOUT VOLTAGE (mV)
300
IL = 250 mA
150
IL = 100 mA
100
IL = 300 mA
6
4
IL = 100 mA
50
2
IL = 10 mA
0
–40
0
IL = 50 mA
25
0
85
0
1
2
3
TEMPERATURE (°C)
Figure 9. Ground Pin Current versus
Ambient Temperature
2.5
8
7
4
5
6
7
8
Vin (VOLTS)
Figure 10. Output Voltage versus Ambient
Temperature (Vin = Vout1 +1V)
IO = 0
2.495
IL = 250 mA
Vout (VOLTS)
Ignd (mA)
6
5
4
3
2.49
IO = 250 mA
2.485
IL = 100 mA
2.48
IL = 50 mA
2.475
2
1
0
–40
–20
0
20
40
60
80
100
120
2.47
–40
140
0
25
TEMPERATURE (°C)
TA (°C)
http://onsemi.com
5
85
MC33275
Figure 11. Output Voltage versus Ambient
Temperature (Vin = 12 V)
2.5
IO = 0
2.495
Vout (VOLTS)
2.49
IO = 250 mA
2.485
2.48
2.475
2.47
2.465
–40
0
25
85
TEMPERATURE (°C)
Figure 12. Ripple Rejection
Figure 13. Ripple Rejection
70
70
60
60
IL = 100 mA
IL = 10 mA
50
50
IL = 250 mA
dB
dB
IL = 1 mA
40
40
30
30
20
20
10
10
0
0.1
1
10
0
0.1
100
1
10
FREQUENCY (kHz)
FREQUENCY (kHz)
http://onsemi.com
6
100
MC33275
APPLICATIONS INFORMATION
Figure 14. Typical Application Circuit
Vout
Vin
MC33275–XX
Cin
Cout
LOAD
GND
Figure 15. ESR for Vout = 3.0V
The MC33275 regulators are designed with internal
current limiting and thermal shutdown making them
user–friendly. Figure 14 is a typical application circuit. The
output capability of the regulator is in excess of 300 mA,
with a typical dropout voltage of less than 260 mV. Internal
protective features include current and thermal limiting.
100
ESR (ohm)
Vout = 3.0 V
Cout = 1.0 mF
Cin = 1.0 mF
EXTERNAL CAPACITORS
These regulators require only a 0.33 mF (or greater)
capacitance between the output and ground for stability for
2.5 V, 3.0 V, and 3.3 V output voltage options. Output
voltage options of 5.0 V require only 0.22 mF for stability.
The output capacitor must be mounted as close as possible
to the MC33275. If the output capacitor must be mounted
further than two centimeters away from the MC33275, then
a larger value of output capacitor may be required for
stability. A value of 0.68 mF or larger is recommended. Most
type of aluminum, tantalum, or multilayer ceramic will
perform adequately. Solid tantalums or appropriate
multilayer ceramic capacitors are recommended for
operation below 25°C. An input bypass capacitor is
recommended to improve transient response or if the
regulator is connected to the supply input filter with long
wire lengths, more than 4 inches. This will reduce the
circuit’s sensitivity to the input line impedance at high
frequencies. A 0.33 mF or larger tantalum, mylar, ceramic,
or other capacitor having low internal impedance at high
frequencies should be chosen. The bypass capacitor should
be mounted with shortest possible lead or track length
directly across the regulator’s input terminals. Figure 15
shows the ESR that allows the LDO to remain stable for
various load currents.
10
Stable Region
1.0
0.1
0
50
100
150
200
250
300
LOAD CURRENT (mA)
Applications should be tested over all operating
conditions to insure stability.
THERMAL PROTECTION
Internal thermal limiting circuitry is provided to protect
the integrated circuit in the event that the maximum junction
temperature is exceeded. When activated, typically at
150°C, the output is disabled. There is no hysteresis built
into the thermal protection. As a result the output will appear
to be oscillating during thermal limit. The output will turn
off until the temperature drops below the 150°C then the
output turns on again. The process will repeat if the junction
increases above the threshold. This will continue until the
existing conditions allow the junction to operate below the
temperature threshold.
Thermal limit is not a substitute for proper
heatsinking.
The internal current limit will typically limit current to
450 mA. If during current limit the junction exceeds 150°C,
the thermal protection will protect the device also. Current
limit is not a substitute for proper heatsinking.
OUTPUT NOISE
In many applications it is desirable to reduce the noise
present at the output. Reducing the regulator bandwidth by
increasing the size of the output capacitor will reduce the
noise on the MC33275.
http://onsemi.com
7
MC33275
2.50
R θ JA, THERMAL RESISTANCE
JUNCTION-TO-AIR (°C/W)
280
Free Air
Mounted
Vertically
240
PD(max) for TA = 50°C
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
200
Minimum
Size Pad
160
1.25
2.0 oz. Copper
L
L
120
80
0.83
0.63
0.50
0.42
RθJA
0.35
40
0
5.0
10
15
20
25
PD, MAXIMUM POWER DISSIPATION (W)
Figure 16. SOT–223 Thermal Resistance and Maximum
Power Dissipation versus P.C.B. Copper Length
30
Figure 17. DPAK Thermal Resistance and Maximum
Power Dissipation versus P.C.B. Copper Length
2.4
R θ JA, THERMAL RESISTANCE, JUNCTION-TO-AIR (°C/W)
100
Free Air
Mounted
Vertically
90
PD(max) for TA = 50°C
2.0
2.0 oz. Copper
L
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
80
Minimum
Size Pad
70
L
60
50
1.6
1.2
0.8
0.4
RθJA
0
40
0
5.0
10
15
20
25
30
L, LENGTH OF COPPER (mm)
Figure 18. SOP–8 Thermal Resistance and Maximum
Power Dissipation versus P.C.B. Copper Length
3.2
170
150
2.8
PD(max) for TA = 50°C
130
2.4
110
Graph Represents Symmetrical Layout 2.0
90
L
70
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
2.0 oz.
Copper
3.0 mm
L
RθJA
50
1.6
1.2
0.8
0.4
30
0
10
20
30
L, LENGTH OF COPPER (mm)
http://onsemi.com
8
40
50
PD, MAXIMUM POWER DISSIPATION (W)
R θ JA, THERMAL RESISTANCE, JUNCTION-TO-AIR (°C/W)
L, LENGTH OF COPPER (mm)
MC33275
ORDERING INFORMATION
Device
Operating
Temperature Range,
Tolerance
Type
Case
Package
369A
DPAK
318E
SOT–223
MC33275D–2.5R2
751–5
SOP–8
MC33275DT–3.0RK
369A
DPAK
318E
SOT–223
751–5
SOP–8
369A
DPAK
318E
SOT–223
MC33275D–3.3R2
751–5
SOP–8
MC33275DT–5.0RK
369A
DPAK
318E
SOT–223
751–5
SOP–8
MC33275DT–2.5RK
MC33275ST–2.5T3
MC33275ST–3.0T3
2.5
2
5V
(Fixed Voltage)
3.0
3
0V
(Fixed Voltage)
1% Tolerance
T l
25°C
C
at TA = 25
MC33275D–3.0R2
MC33275DT–3.3RK
MC33275ST–3.3T3
MC33275ST–5.0T3
3.3
3
3V
(Fixed Voltage)
2% Tolerance
T l
att
40 to +125°C
+125 C
TJ from –40
5.0
5
0V
(Fixed
(
Voltage)
g )
MC33275D–5.0R2
DEVICE MARKING
Device
Version
Marking (1st line)
MC33275
2.5V
27525
MC33275
3.0V
27530
MC33275
3.3V
27533
MC33275
5.0V
27550
TAPE AND REEL SPECIFICATIONS
Device
Reel Size
Tape Width
Quantity
MC33275DT
13”
16mm embossed tape
2500 units
MC33275D
13”
12mm embossed tape
2500 units
MC33275S
13”
8mm embossed tape
4000 units
http://onsemi.com
9
MC33275
PACKAGE DIMENSIONS
ST SUFFIX
PLASTIC PACKAGE
CASE 318E–04
(SOT–223)
ISSUE J
A
F
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
4
S
B
1
2
3
D
L
G
J
C
0.08 (0003)
M
H
INCHES
DIM MIN
MAX
A
0.249
0.263
B
0.130
0.145
C
0.060
0.068
D
0.024
0.035
F
0.115
0.126
G
0.087
0.094
H 0.0008 0.0040
J
0.009
0.014
K
0.060
0.078
L
0.033
0.041
M
0_
10 _
S
0.264
0.287
MILLIMETERS
MIN
MAX
6.30
6.70
3.30
3.70
1.50
1.75
0.60
0.89
2.90
3.20
2.20
2.40
0.020
0.100
0.24
0.35
1.50
2.00
0.85
1.05
0_
10 _
6.70
7.30
K
D SUFFIX
PLASTIC PACKAGE
CASE 751–06
(SOP–8)
ISSUE T
D
A
8
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. DIMENSIONS ARE IN MILLIMETER.
3. DIMENSION D AND E DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS
OF THE B DIMENSION AT MAXIMUM MATERIAL
CONDITION.
C
5
0.25
H
E
M
B
M
1
4
h
B
e
X 45 _
q
A
C
SEATING
PLANE
L
0.10
A1
B
0.25
M
C B
S
A
S
DIM
A
A1
B
C
D
E
e
H
h
L
q
http://onsemi.com
10
MILLIMETERS
MIN
MAX
1.35
1.75
0.10
0.25
0.35
0.49
0.19
0.25
4.80
5.00
3.80
4.00
1.27 BSC
5.80
6.20
0.25
0.50
0.40
1.25
0_
7_
MC33275
PACKAGE DIMENSIONS
DT SUFFIX
PLASTIC PACKAGE
CASE 369A–13
(DPAK)
ISSUE Z
–T–
C
B
V
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
SEATING
PLANE
E
R
4
Z
A
S
1
2
3
U
K
F
J
L
H
D
G
2 PL
0.13 (0.005)
M
T
http://onsemi.com
11
DIM
A
B
C
D
E
F
G
H
J
K
L
R
S
U
V
Z
INCHES
MIN
MAX
0.235
0.250
0.250
0.265
0.086
0.094
0.027
0.035
0.033
0.040
0.037
0.047
0.180 BSC
0.034
0.040
0.018
0.023
0.102
0.114
0.090 BSC
0.175
0.215
0.020
0.050
0.020
–––
0.030
0.050
0.138
–––
MILLIMETERS
MIN
MAX
5.97
6.35
6.35
6.73
2.19
2.38
0.69
0.88
0.84
1.01
0.94
1.19
4.58 BSC
0.87
1.01
0.46
0.58
2.60
2.89
2.29 BSC
4.45
5.46
0.51
1.27
0.51
–––
0.77
1.27
3.51
–––
MC33275
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes
without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability,
including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be
validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others.
SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or
death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold
SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable
attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim
alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer.
PUBLICATION ORDERING INFORMATION
NORTH AMERICA Literature Fulfillment:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303–675–2175 or 800–344–3860 Toll Free USA/Canada
Fax: 303–675–2176 or 800–344–3867 Toll Free USA/Canada
Email: [email protected]
Fax Response Line: 303–675–2167 or 800–344–3810 Toll Free USA/Canada
N. American Technical Support: 800–282–9855 Toll Free USA/Canada
EUROPE: LDC for ON Semiconductor – European Support
German Phone: (+1) 303–308–7140 (M–F 1:00pm to 5:00pm Munich Time)
Email: ONlit–[email protected]
French Phone: (+1) 303–308–7141 (M–F 1:00pm to 5:00pm Toulouse Time)
Email: ONlit–[email protected]
English Phone: (+1) 303–308–7142 (M–F 12:00pm to 5:00pm UK Time)
Email: [email protected]
EUROPEAN TOLL–FREE ACCESS*: 00–800–4422–3781
*Available from Germany, France, Italy, England, Ireland
CENTRAL/SOUTH AMERICA:
Spanish Phone: 303–308–7143 (Mon–Fri 8:00am to 5:00pm MST)
Email: ONlit–[email protected]
ASIA/PACIFIC: LDC for ON Semiconductor – Asia Support
Phone: 303–675–2121 (Tue–Fri 9:00am to 1:00pm, Hong Kong Time)
Toll Free from Hong Kong & Singapore:
001–800–4422–3781
Email: ONlit–[email protected]
JAPAN: ON Semiconductor, Japan Customer Focus Center
4–32–1 Nishi–Gotanda, Shinagawa–ku, Tokyo, Japan 141–8549
Phone: 81–3–5740–2745
Email: [email protected]
ON Semiconductor Website: http://onsemi.com
For additional information, please contact your local
Sales Representative.
http://onsemi.com
12
MC33275/D