MC74HCT4851A Analog Multiplexers/ Demultiplexers with Injection Current Effect Control with LSTTL Compatible Inputs http://onsemi.com MARKING DIAGRAMS Automotive Customized This device is pin compatible to standard HC4051 and MC14051B analog mux/demux devices, but feature injection current effect control. This makes them especially suited for usage in automotive applications where voltages in excess of normal logic voltage are common. The injection current effect control allows signals at disabled analog input channels to exceed the supply voltage range without affecting the signal of the enabled analog channel. This eliminates the need for external diode/ resistor networks typically used to keep the analog channel signals within the supply voltage range. The devices utilize low power silicon gate CMOS technology. The Channel Select and Enable inputs are compatible with standard CMOS or LSTTL outputs. Features • • • • • • Injection Current Cross−Coupling Less than 1mV/mA (See Figure 4) Pin Compatible to HC4051 and MC14051B Devices Power Supply Range (VCC − GND) = 2.0 to 6.0 V In Compliance With the Requirements of JEDEC Standard No. 7A Chip Complexity: 154 FETs or 36 Equivalent Gates These are Pb−Free Devices* 16 PDIP−16 N SUFFIX CASE 648 16 1 MC74HCT4851AN AWLYYWWG 1 16 SOIC−16 D SUFFIX CASE 751B 16 1 HCT4851AG AWLYWW 1 16 SOIC−16 WIDE DW SUFFIX CASE 751G 16 1 HCT4851A AWLYWWG 1 16 16 1 TSSOP−16 DT SUFFIX CASE 948F HCT48 51A ALYWG G 1 A = Assembly Location WL, L = Wafer Lot YY, Y = Year WW, W = Work Week G or G = Pb−Free Package (Note: Microdot may be in either location) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 10 of this data sheet. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2009 November, 2009 − Rev. 1 1 Publication Order Number: MC74HCT4851A/D MC74HCT4851A FUNCTION TABLE − MC74HCT4851A Control Inputs 13 X0 14 X1 15 X2 ANALOG 12 MULTIPLEXER/ INPUTS/ X3 DEMULTIPLEXER OUTPUTS X4 1 5 X5 2 X6 4 X7 11 A CHANNEL 10 B SELECT 9 INPUTS C 6 ENABLE PIN 16 = VCC PIN 8 = GND 3 X Select B A Enable C L L L L L L L L H L L L L H H H H X L L H H L L H H X COMMON OUTPUT/ INPUT ON Channels X0 X1 X2 X3 X4 X5 X6 X7 NONE L H L H L H L H X VCC X2 X1 X0 X3 A B C 16 15 14 13 12 11 10 9 6 7 Figure 1. MC74HCT4851A Logic Diagram Single−Pole, 8−Position Plus Common Off 1 2 3 4 5 X4 X6 X X7 X5 Enable NC 8 GND Figure 2. MC74HCT4851A 16−Lead Pinout (Top View) http://onsemi.com 2 MC74HCT4851A MAXIMUM RATINGS Symbol Value Unit VCC Positive DC Supply Voltage (Referenced to GND) –0.5 to + 7.0 V Vin DC Input Voltage (Any Pin) (Referenced to GND) –0.5 to VCC + 0.5 V $25 mA 750 500 450 mW –65 to + 150 °C I Parameter DC Current, Into or Out of Any Pin PD Power Dissipation in Still Air, Plastic DIP† SOIC Package† TSSOP Package† Tstg Storage Temperature Range TL Lead Temperature, 1 mm from Case for 10 Seconds Plastic DIP, SOIC or TSSOP Package °C 260 Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high−impedance circuit. For proper operation, Vin and Vout should be constrained to the range GND v (Vin or Vout) v VCC. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused outputs must be left open. RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Max Unit VCC Positive DC Supply Voltage (Referenced to GND) 2.0 6.0 V Vin DC Input Voltage (Any Pin) (Referenced to GND) GND VCC V 0.0 1.2 V – 55 + 125 °C 0 0 0 1000 500 400 ns VIO* Static or Dynamic Voltage Across Switch TA Operating Temperature Range, All Package Types tr, tf Input Rise/Fall Time (Channel Select or Enable Inputs) VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V *For voltage drops across switch greater than 1.2 V (switch on), excessive VCC current may be drawn; i.e., the current out of the switch may contain both VCC and switch input components. The reliability of the device will be unaffected unless the Maximum Ratings are exceeded. DC CHARACTERISTICS — Digital Section (Voltages Referenced to GND) VEE = GND, Except Where Noted Symbol Parameter Condition VCC V Guaranteed Limit −55 to 25°C ≤85°C ≤125°C Unit VIH Minimum High−Level Input Voltage, Channel−Select or Enable Inputs Ron = Per Spec 4.5 to 5.5 2.0 2.0 2.0 V VIL Maximum Low−Level Input Voltage, Channel−Select or Enable Inputs Ron = Per Spec 4.5 to 5.5 0.8 0.8 0.8 V Iin Maximum Input Leakage Current on Digital Pins (Enable/A/B/C) Vin = VCC or GND 5.5 ± 0.1 ± 1.0 ± 1.0 mA ICC Maximum Quiescent Supply Current (per Package) Vin(digital) = VCC or GND Vin(analog) = GND 5.5 2.0 20 40 mA http://onsemi.com 3 MC74HCT4851A DC CHARACTERISTICS — Analog Section Guaranteed Limit Symbol Ron Parameter Condition VCC −55 to 25°C ≤85°C ≤125°C Unit Maximum “ON” Resistance Vin = VIL or VIH;VIS = VCC to GND; IS ≤ 2.0 mA 4.5 5.5 550 400 650 500 750 600 W Delta “ON” Resistance Vin = VIL or VIH; VIS = VCC/2 IS ≤ 2.0 mA 4.5 5.5 80 60 100 80 120 100 W Ioff Maximum Off−Channel Leakage Current, Any One Channel Common Channel Vin = VCC or GND 5.5 ±0.1 ±0.1 ±0.1 ±0.1 ±0.1 ±0.1 Ion Maximum On−Channel Leakage Vin = VCC or GND Channel−to−Channel 5.5 ±0.1 ±0.1 ±0.1 VCC −55 to 25°C ≤85°C ≤125°C Unit Maximum Propagation Delay, Analog Input to Analog Output 5.0 40 45 50 ns Maximum Propagation Delay, Enable or Channel−Select to Analog Output 5.0 80 90 100 ns 10 35 130 10 35 130 10 35 130 pF DRon mA mA AC CHARACTERISTICS (CL = 50 pF, Input tr = tf = 6 ns, VCC = 5.0 V ± 10%) Parameter Symbol tPHL, tPLH tPHL, tPHZ,PZH tPLH, tPLZ,PZL Cin Maximum Input Capacitance (All Switches Off) (All Switches Off) Digital Pins Any Single Analog Pin Common Analog Pin CPD Power Dissipation Capacitance Typical 5.0 20 pF INJECTION CURRENT COUPLING SPECIFICATIONS (VCC = 5V, TA = −55°C to +125°C) Parameter Symbol VDout Condition Maximum Shift of Output Voltage of Enabled Analog Channel Iin* ≤ 1 mA, RS ≤ 3,9 kW Iin* ≤ 10 mA, RS ≤ 3,9 kW Iin* ≤ 1 mA, RS ≤ 20 kW Iin* ≤ 10 mA, RS ≤ 20 kW * Iin = Total current injected into all disabled channels. 660 R on , ON RESISTANCE (OHMS) 600 540 480 420 360 -55°C 300 +25°C 240 +125°C 180 120 60 0 0.0 0.9 1.8 2.7 3.6 Vin, INPUT VOLTAGE (VOLTS), REFERENCED TO GND Figure 3. Typical On Resistance VCC = 4.5V http://onsemi.com 4 4.5 Typ Max Unit 0.1 1.0 0.5 5.0 1.0 5.0 2.0 20 mV MC74HCT4851A External DC P.S. VCC = 5 V Vin2 / Iin2 meas. here. Current Source HP4155C Smu #2 Vin1 = 4.9 V (Smu3) Iin1 meas. Here Vm1 connected here. X7 RS X0 4 16 13 3 X Vout Vm2 connected here. 6 NOTES: Rs = 3.9 KW or 20 KW. NOTES: Vm1 & Vm2 are internal NOTES: HP4155C Voltmeters. 8 GND or VSS Figure 4. Injection Current Coupling Specification http://onsemi.com 5 MC74HCT4851A 5V 6V 5V VCC VCC HC4051A Sensor Microcontroller Channel 1 Channel 2 Channel 3 Channel 4 Channel 5 Channel 6 Channel 7 Channel 8 (8x Identical Circuitry) Common Out A/D - Input Figure 5. Actual Technology Requires 32 passive components and one extra 6V regulator to suppress injection current into a standard HC4051 multiplexer 5V VCC VCC HC4851A Sensor Microcontroller Channel 1 Channel 2 Channel 3 Channel 4 Channel 5 Channel 6 Channel 7 Channel 8 (8x Identical Circuitry) Common Out A/D - Input Figure 6. MC74HCT4851A Solution Solution by applying the HC4851A multiplexer http://onsemi.com 6 MC74HCT4851A PLOTTER VCC PROGRAMMABLE POWER SUPPLY MINI COMPUTER DC ANALYZER 16 VEE VCC OFF - + VCC VCC A COMMON O/I OFF NC DEVICE UNDER TEST ANALOG IN VIH COMMON OUT 6 8 GND Figure 8. Maximum Off Channel Leakage Current, Any One Channel, Test Set−Up Figure 7. On Resistance Test Set−Up VCC 16 VEE ANALOG I/O 16 A OFF VCC OFF VIH VCC VCC VCC ON VEE COMMON O/I VCC N/C ANALOG I/O VIL 6 COMMON O/I OFF 6 8 8 Figure 9. Maximum Off Channel Leakage Current, Common Channel, Test Set−Up Figure 10. Maximum On Channel Leakage Current, Channel to Channel, Test Set−Up VCC VCC CHANNEL SELECT (VI) ON/OFF VM COMMON O/I ANALOG I/O OFF/ON GND tPLH ANALOG OUT 16 VCC TEST POINT CL* tPHL 6 VM 8 CHANNEL SELECT VI = GND to 3.0 V VM = 1.3 V *Includes all probe and jig capacitance Figure 11. Propagation Delays, Channel Select to Analog Out Figure 12. Propagation Delay, Test Set−Up Channel Select to Analog Out http://onsemi.com 7 MC74HCT4851A VCC 16 VCC ANALOG IN (VI) COMMON O/I ANALOG I/O ON VM TEST POINT CL* GND tPLH tPHL ANALOG OUT 6 8 VM VI = GND to 3.0 V VM = 1.3 V *Includes all probe and jig capacitance Figure 13. Propagation Delays, Analog In to Analog Out Figure 14. Propagation Delay, Test Set−Up Analog In to Analog Out tr tf 90% VM 10% ENABLE (VI) tPZL ANALOG OUT 2 GND tPLZ 16 HIGH IMPEDANCE 10% 1 10kW ANALOG I/O TEST POINT ON/OFF 2 CL* VOL tPHZ ENABLE VOH 90% ANALOG OUT VCC VCC VM tPZH POSITION 1 WHEN TESTING tPHZ AND tPZH POSITION 2 WHEN TESTING tPLZ AND tPZL 1 VCC VM 6 8 HIGH IMPEDANCE VI = GND to 3.0 V VM = 1.3 V Figure 15. Propagation Delays, Enable to Analog Out Figure 16. Propagation Delay, Test Set−Up Enable to Analog Out VCC A VCC 16 ON/OFF COMMON O/I NC ANALOG I/O OFF/ON VCC 6 8 11 CHANNEL SELECT Figure 17. Power Dissipation Capacitance, Test Set−Up http://onsemi.com 8 MC74HCT4851A Gate = VCC (Disabled) Disabled Analog Mux Input Vin > VCC + 0.7V P+ Common Analog Output Vout > VCC P+ + + + N - Substrate (on VCC potential) Figure 18. Diagram of Bipolar Coupling Mechanism Appears if Vin exceeds VCC, driving injection current into the substrate A B C ENABLE 11 10 9 6 Figure 19. Function Diagram, HC4851A http://onsemi.com 9 INJECTION CURRENT CONTROL 13 INJECTION CURRENT CONTROL 14 INJECTION CURRENT CONTROL 15 INJECTION CURRENT CONTROL 12 INJECTION CURRENT CONTROL 1 INJECTION CURRENT CONTROL 5 INJECTION CURRENT CONTROL 2 INJECTION CURRENT CONTROL 4 INJECTION CURRENT CONTROL 3 X0 X1 X2 X3 X4 X5 X6 X7 X MC74HCT4851A ORDERING INFORMATION Package Shipping† MC74HCT4851ANG PDIP−16 (Pb−Free) 500 Units / Box MC74HCT4851ADG SOIC−16 (Pb−Free) 48 Units / Rail MC74HCT4851ADR2G SOIC−16 (Pb−Free) 2500 Units / Tape & Reel TSSOP−16* 2500 Units / Tape & Reel MC74HCT4851ADWG SOIC−16 WIDE (Pb−Free) 48 Units / Rail MC74HCT4851ADWR2G SOIC−16 WIDE (Pb−Free) 1000 Units / Tape & Reel Device MC74HCT4851ADTR2G †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *This package is inherently Pb−Free. http://onsemi.com 10 MC74HCT4851A PACKAGE DIMENSIONS PDIP−16 N SUFFIX CASE 648−08 ISSUE T NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. −A− 16 9 1 8 B F C L DIM A B C D F G H J K L M S S SEATING PLANE −T− K H G D M J 16 PL 0.25 (0.010) T A M M INCHES MIN MAX 0.740 0.770 0.250 0.270 0.145 0.175 0.015 0.021 0.040 0.70 0.100 BSC 0.050 BSC 0.008 0.015 0.110 0.130 0.295 0.305 0_ 10 _ 0.020 0.040 MILLIMETERS MIN MAX 18.80 19.55 6.35 6.85 3.69 4.44 0.39 0.53 1.02 1.77 2.54 BSC 1.27 BSC 0.21 0.38 2.80 3.30 7.50 7.74 0_ 10 _ 0.51 1.01 SOIC−16 D SUFFIX CASE 751B−05 ISSUE J −A− 16 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 9 −B− 1 P 8 PL 0.25 (0.010) 8 M B S G R K F X 45 _ C −T− SEATING PLANE J M D 16 PL 0.25 (0.010) M T B S A S http://onsemi.com 11 DIM A B C D F G J K M P R MILLIMETERS MIN MAX 9.80 10.00 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0_ 7_ 5.80 6.20 0.25 0.50 INCHES MIN MAX 0.386 0.393 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0_ 7_ 0.229 0.244 0.010 0.019 MC74HCT4851A SOIC−16 WIDE DW SUFFIX CASE 751G−03 ISSUE C A D 9 h X 45 _ E 0.25 H 8X M B M 16 NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DIMENSIONS D AND E DO NOT INLCUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 5. DIMENSION B DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS OF THE B DIMENSION AT MAXIMUM MATERIAL CONDITION. q 1 MILLIMETERS DIM MIN MAX A 2.35 2.65 A1 0.10 0.25 B 0.35 0.49 C 0.23 0.32 D 10.15 10.45 E 7.40 7.60 e 1.27 BSC H 10.05 10.55 h 0.25 0.75 L 0.50 0.90 q 0_ 7_ 8 B B 16X M T A 14X e S B S L A 0.25 A1 SEATING PLANE C T TSSOP−16 DT SUFFIX CASE 948F−01 ISSUE A 16X K REF 0.10 (0.004) 0.15 (0.006) T U M T U V S S S K ÇÇÇ ÉÉ ÇÇÇ ÉÉ ÇÇÇ K1 2X L/2 16 9 J1 B −U− L SECTION N−N J PIN 1 IDENT. 8 1 N 0.15 (0.006) T U S 0.25 (0.010) A −V− NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH. PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W−. M N F DETAIL E −W− C 0.10 (0.004) −T− SEATING PLANE D G H DETAIL E http://onsemi.com 12 DIM A B C D F G H J J1 K K1 L M MILLIMETERS MIN MAX 4.90 5.10 4.30 4.50 −−− 1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.18 0.28 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0_ 8_ INCHES MIN MAX 0.193 0.200 0.169 0.177 −−− 0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.007 0.011 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0_ 8_ MC74HCT4851A ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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