TI CD74HC21MTG4 High-speed cmos logic dual 4-input and gate Datasheet

[ /Title
(CD74H
C21,
CD74H
CT21)
/Subject
(High
Speed
CMOS
Logic
Dual 4Input
CD54HC21, CD74HC21,
CD74HCT21
Data sheet acquired from Harris Semiconductor
SCHS131C
High-Speed CMOS Logic
Dual 4-Input AND Gate
August 1997 - Revised September 2003
Features
Description
• Buffered Inputs
The ’HC21 and CD74HCT21 logic gates utilize silicon gate
CMOS technology to achieve operating speeds similar to
LSTTL gates with the low power consumption of standard
CMOS integrated circuits. All devices have the ability to drive
10 LSTTL loads. The HCT logic family is functionally pin
compatible with the standard LS logic family.
• Typical Propagation Delay: 9ns at VCC = 5V,
CL = 15pF, TA = 25oC
• Fanout (Over Temperature Range)
- Standard Outputs . . . . . . . . . . . . . . . 10 LSTTL Loads
- Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads
Ordering Information
• Wide Operating Temperature Range . . . -55oC to 125oC
• Balanced Propagation Delay and Transition Times
PART NUMBER
• Significant Power Reduction Compared to LSTTL
Logic ICs
TEMP. RANGE
(oC)
PACKAGE
CD54HC21F3A
-55 to 125
14 Ld CERDIP
• HC Types
- 2V to 6V Operation
- High Noise Immunity: NIL = 30%, NIH = 30% of VCC
at VCC = 5V
CD74HC21E
-55 to 125
14 Ld PDIP
CD74HC21M
-55 to 125
14 Ld SOIC
CD74HC21MT
-55 to 125
14 Ld SOIC
• HCT Types
- 4.5V to 5.5V Operation
- Direct LSTTL Input Logic Compatibility,
VIL= 0.8V (Max), VIH = 2V (Min)
- CMOS Input Compatibility, Il ≤ 1µA at VOL, VOH
CD74HC21M96
-55 to 125
14 Ld SOIC
CD74HCT21E
-55 to 125
14 Ld PDIP
CD74HCT21M
-55 to 125
14 Ld SOIC
CD74HCT21MT
-55 to 125
14 Ld SOIC
CD74HCT21M96
-55 to 125
14 Ld SOIC
NOTE: When ordering, use the entire part number. The suffix 96
denotes tape and reel. The suffix T denotes a small-quantity reel of
250.
Pinout
CD54HC21
(CERDIP)
CD74HC21, CD74HCT21
(PDIP, SOIC)
TOP VIEW
1A 1
14 VCC
1B 2
13 2D
NC 3
12 2C
1C 4
11 NC
1D 5
10 2B
1Y 6
9 2A
GND 7
8 2Y
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures.
Copyright
© 2003, Texas Instruments Incorporated
1
CD54HC21, CD74HC21, CD74HCT21
Functional Diagram
1
1A
2
1B
6
4
1C
5
1D
9
2A
2B
2C
2D
1Y
10
8
12
2Y
GND = 7
VCC = 14
NC = 3, 11
13
TRUTH TABLE
INPUTS
OUTPUT
nA
nB
nC
nD
nY
L
X
X
X
L
X
L
X
X
L
X
X
L
X
L
X
X
X
L
L
H
H
H
H
H
H = High Voltage Level, L = Low Voltage Level, X = Irrelevant
Logic Symbol
nA
nB
nY
nC
nD
2
CD54HC21, CD74HC21, CD74HCT21
Absolute Maximum Ratings
Thermal Information
DC Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V
DC Input Diode Current, IIK
For VI < -0.5V or VI > VCC + 0.5V . . . . . . . . . . . . . . . . . . . . . .±20mA
DC Output Diode Current, IOK
For VO < -0.5V or VO > VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±20mA
DC Output Source or Sink Current per Output Pin, IO
For VO > -0.5V or VO < VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±25mA
DC VCC or Ground Current, ICC or IGND . . . . . . . . . . . . . . . . . .±50mA
Thermal Resistance (Typical, Note 1)
θJA (oC/W)
E (PDIP) Package . . . . . . . . . . . . . . . . . . . . . . . . . .
80
M (SOIC) Package. . . . . . . . . . . . . . . . . . . . . . . . . .
86
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . 150oC
Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC
(SOIC - Lead Tips Only)
Operating Conditions
Temperature Range (TA) . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC
Supply Voltage Range, VCC
HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V
HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V
DC Input or Output Voltage, VI, VO . . . . . . . . . . . . . . . . . 0V to VCC
Input Rise and Fall Time
2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (Max)
4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (Max)
6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (Max)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. The package thermal impedance is calculated in accordance with JESD 51-7.
DC Electrical Specifications
TEST
CONDITIONS
PARAMETER
SYMBOL
VI (V)
High Level Input
Voltage
VIH
-
Low Level Input
Voltage
VIL
25oC
IO (mA) VCC (V)
-40oC TO 85oC
-55oC TO 125oC
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNITS
2
1.5
-
-
1.5
-
1.5
-
V
4.5
3.15
-
-
3.15
-
3.15
-
V
6
4.2
-
-
4.2
-
4.2
-
V
2
-
-
0.5
-
0.5
-
0.5
V
4.5
-
-
1.35
-
1.35
-
1.35
V
6
-
-
1.8
-
1.8
-
1.8
V
-0.02
2
1.9
-
-
1.9
-
1.9
-
V
-0.02
4.5
4.4
-
-
4.4
-
4.4
-
V
-0.02
6
5.9
-
-
5.9
-
5.9
-
V
-
-
-
-
-
-
-
-
-
V
HC TYPES
High Level Output
Voltage
CMOS Loads
VOH
-
VIH or
VIL
High Level Output
Voltage
TTL Loads
Low Level Output
Voltage
CMOS Loads
VOL
VIH or
VIL
Low Level Output
Voltage
TTL Loads
Input Leakage
Current
II
VCC or
GND
-
-
-4
4.5
3.98
-
-
3.84
-
3.7
-
V
-5.2
6
5.48
-
-
5.34
-
5.2
-
V
0.02
2
-
-
0.1
-
0.1
-
0.1
V
0.02
4.5
-
-
0.1
-
0.1
-
0.1
V
0.02
6
-
-
0.1
-
0.1
-
0.1
V
-
-
-
-
-
-
-
-
-
V
4
4.5
-
-
0.26
-
0.33
-
0.4
V
5.2
6
-
-
0.26
-
0.33
-
0.4
V
-
6
-
-
±0.1
-
±1
-
±1
µA
3
CD54HC21, CD74HC21, CD74HCT21
DC Electrical Specifications
(Continued)
TEST
CONDITIONS
SYMBOL
VI (V)
ICC
VCC or
GND
0
High Level Input
Voltage
VIH
-
Low Level Input
Voltage
VIL
High Level Output
Voltage
CMOS Loads
VOH
PARAMETER
Quiescent Device
Current
25oC
IO (mA) VCC (V)
-40oC TO 85oC
-55oC TO 125oC
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNITS
6
-
-
2
-
20
-
40
µA
-
4.5 to
5.5
2
-
-
2
-
2
-
V
-
-
4.5 to
5.5
-
-
0.8
-
0.8
-
0.8
V
VIH or
VIL
-0.02
4.5
4.4
-
-
4.4
-
4.4
-
V
-4
4.5
3.98
-
-
3.84
-
3.7
-
V
0.02
4.5
-
-
0.1
-
0.1
-
0.1
V
4
4.5
-
-
0.26
-
0.33
-
0.4
V
±0.1
-
±1
-
±1
µA
HCT TYPES
High Level Output
Voltage
TTL Loads
Low Level Output
Voltage
CMOS Loads
VOL
VIH or
VIL
Low Level Output
Voltage
TTL Loads
Input Leakage
Current
II
VCC
and
GND
0
5.5
-
ICC
VCC or
GND
0
5.5
-
-
2
-
20
-
40
µA
∆ICC
(Note 2)
VCC
-2.1
-
4.5 to
5.5
-
100
360
-
450
-
490
µA
Quiescent Device
Current
Additional Quiescent
Device Current Per
Input Pin: 1 Unit Load
NOTE:
2. For dual-supply systems theoretical worst case (VI = 2.4V, VCC = 5.5V) specification is 1.8mA.
HCT Input Loading Table
INPUT
UNIT LOADS
All
1
NOTE: Unit Load is ∆ICC limit specified in DC Electrical
Specifications table, e.g. 360µA max at 25oC.
Switching Specifications Input tr, tf = 6ns
PARAMETER
SYMBOL
TEST
CONDITIONS
tPLH, tPHL
CL = 50pF
25oC
-40oC TO 85oC -55oC TO 125oC
VCC
(V)
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNITS
2
-
-
110
-
140
-
165
ns
4.5
-
-
22
-
28
-
33
ns
6
-
-
19
-
24
-
28
ns
5
-
9
-
-
-
-
-
ns
HC TYPES
Propagation Delay, Input to
Output (Figure 1)
Propagation Delay, Data Input to
Output Y
tPLH, tPHL
CL = 15pF
4
CD54HC21, CD74HC21, CD74HCT21
Switching Specifications Input tr, tf = 6ns
PARAMETER
Transition Times (Figure 1)
Input Capacitance
Power Dissipation Capacitance
(Notes 3, 4)
(Continued)
SYMBOL
TEST
CONDITIONS
tTLH, tTHL
CL = 50pF
25oC
-40oC TO 85oC -55oC TO 125oC
VCC
(V)
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNITS
2
-
-
75
-
95
-
110
ns
4.5
-
-
15
-
19
-
22
ns
6
-
-
13
-
16
-
19
ns
CI
-
-
-
-
10
-
10
-
10
pF
CPD
-
5
-
36
-
-
-
-
-
pF
HCT TYPES
Propagation Delay, Input to
Output (Figure 2)
tRHL, tPHL
CL = 50pF
4.5
-
-
27
-
34
-
41
ns
Propagation Delay, Data Input to
Output Y
tPLH, tPHL
CL = 15pF
5
-
11
-
-
-
-
-
ns
Transition Times (Figure 2)
tTLH, tTHL
CL = 50pF
4.5
-
-
15
-
19
-
22
ns
Input Capacitance
Power Dissipation Capacitance
(Notes 3, 4)
CI
-
-
-
-
10
-
10
-
10
pF
CPD
-
5
-
42
-
-
-
-
-
pF
NOTES:
3. CPD is used to determine the dynamic power consumption, per gate.
4. PD = VCC2 fi (CPD + CL) where fi = input frequency, CL = output load capacitance, VCC = supply voltage.
Test Circuits and Waveforms
tr = 6ns
tf = 6ns
90%
50%
10%
INPUT
GND
tTLH
GND
tTHL
90%
50%
10%
INVERTING
OUTPUT
3V
2.7V
1.3V
0.3V
INPUT
tTHL
tPHL
tf = 6ns
tr = 6ns
VCC
tTLH
90%
1.3V
10%
INVERTING
OUTPUT
tPHL
tPLH
FIGURE 1. HC AND HCU TRANSITION TIMES AND PROPAGATION DELAY TIMES, COMBINATION LOGIC
tPLH
FIGURE 2. HCT TRANSITION TIMES AND PROPAGATION
DELAY TIMES, COMBINATION LOGIC
5
PACKAGE OPTION ADDENDUM
www.ti.com
9-Oct-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
CD54HC21F3A
ACTIVE
CDIP
J
14
1
TBD
A42 SNPB
N / A for Pkg Type
CD74HC21E
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74HC21EE4
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74HC21M
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC21M96
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC21M96E4
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC21M96G4
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC21ME4
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC21MG4
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC21MT
ACTIVE
SOIC
D
14
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC21MTE4
ACTIVE
SOIC
D
14
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC21MTG4
ACTIVE
SOIC
D
14
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT21E
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74HCT21EE4
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74HCT21M
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT21M96
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT21M96E4
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT21M96G4
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT21ME4
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT21MG4
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT21MT
ACTIVE
SOIC
D
14
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT21MTE4
ACTIVE
SOIC
D
14
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT21MTG4
ACTIVE
SOIC
D
14
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Package
Drawing
Pins Package Eco Plan (2)
Qty
(1)
Lead/Ball Finish
MSL Peak Temp (3)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
9-Oct-2007
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Oct-2007
TAPE AND REEL BOX INFORMATION
Device
Package Pins
Site
Reel
Diameter
(mm)
Reel
Width
(mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
CD74HC21M96
D
14
SITE 41
330
16
6.5
9.0
2.1
8
16
Q1
CD74HCT21M96
D
14
SITE 41
330
16
6.5
9.0
2.1
8
16
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Oct-2007
Device
Package
Pins
Site
Length (mm)
Width (mm)
Height (mm)
CD74HC21M96
D
14
SITE 41
346.0
346.0
33.0
CD74HCT21M96
D
14
SITE 41
346.0
346.0
33.0
Pack Materials-Page 2
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are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
RFID
www.ti-rfid.com
Telephony
www.ti.com/telephony
Low Power
Wireless
www.ti.com/lpw
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
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