LITEON LTL2P3TBU2KS Through hole lamp Datasheet

Through Hole Lamp
Product Data Sheet
LTL2P3TBU2KS
Spec No.: DS20-2013-0092
Effective Date: 06/15/2013
Revision: -
LITE-ON DCC
RELEASE
BNS-OD-FC001/A4
LITE-ON Technology Corp. / Optoelectronics
No.90,Chien 1 Road, Chung Ho, New Taipei City 23585, Taiwan, R.O.C.
Tel: 886-2-2222-6181 Fax: 886-2-2221-1948 / 886-2-2221-0660
http://www.liteon.com/opto
LITE-ON TECHNOLOGY CORPORATION
Property of Lite-On Only
Features
* High luminous intensity output.
* Low power consumption.
* High efficiency.
* Versatile mounting on P.C. board or panel.
* I.C. Compatible/low current requirements.
* Popular T-13/4 diameter.
* Lead (Pb) free product – RoHS compliant.
Package Dimensions
Part No.
Lens
Source Color
LTL2P3TBU2KS
Water clear
InGaN Blue
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.25mm(.010") unless otherwise noted.
3. Lead spacing is measured where the leads emerge from the package.
4. Specifications are subject to change without notice.
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Absolute Maximum Ratings at TA=25°C
Parameter
Maximum Rating
Unit
105
mW
100
mA
30
mA
Derating Linear From 30°C
0.45
mA/°C
Operating Temperature Range
-30°C to + 85°C
Storage Temperature Range
-40°C to + 100°C
Lead Soldering Temperature
[2.0 mm(.078") From Body]
260°C for 5 Seconds Max.
Power Dissipation
Peak Forward Current
(1/10 Duty Cycle, 0.1ms Pulse Width)
DC Forward Current
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Electrical / Optical Characteristics at TA=25°C
Parameter
Luminous Intensity
Symbol
Min.
IV
4200
Typ.
Max.
Unit
7200
mcd
2θ1/2
23
deg
Peak Emission Wavelength
λP
472
nm
Dominant Wavelength
λd
Spectral Line Half-Width
Δλ
Forward Voltage
VF
Reverse Current
IR
Viewing Angle
464
472
26
2.75
Test Condition
IF = 20mA
Note 1,5
Note 2 (Fig.6)
Measurement
@Peak (Fig.1)
nm
Note 3
nm
3.5
V
IF = 20mA
100
μA
VR = 5V, Note 8
NOTE: 1. Luminous intensity is measured with a light sensor and filter combination that approximates the CIE
eye-response curve.
2. θ1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity.
3. The dominant wavelength, λd is derived from the CIE chromaticity diagram and represents the single
wavelength which defines the color of the device.
4. Iv classification code is marked on each packing bag.
5. The Iv guarantee should be added ±15% tolerance.
6. Precautions in handling:
‧
When soldering, leave 2mm of minimum clearance from the resin to the soldering point.
‧
Dipping the resin to solder must be avoided.
‧
Correcting the soldered position after soldering must be avoided.
‧
In soldering, do not apply any stress to the lead frame particularly when heated.
‧
When forming a lead, make sure not to apply any stress inside the resin.
‧
Lead forming must be done before soldering.
‧
It is necessary to cut the lead frame at normal temperature.
7. Caution in ESD:
Static Electricity and surge damages the LED. It is recommend to use a wrist band or anti-electrostatic
glove when handling the LED. All devices, equipment and machinery must be properly grounded.
Reverse
voltage (VR) condition is applied for IR test only. The device is not designed for reverse operation
8.
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Typical Electrical / Optical Characteristics Curves
(25°C Ambient Temperature Unless Otherwise Noted)
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Packing Spec
500 or 250 pcs per packing bag
10 packing bags per inner carton
total 5000 pcs per inner carton
8 Inner cartons per outer carton
total 40000 pcs per outer carton
In every shipping lot, only the last pack will be non-full packing
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Bin Table Specifications
Luminous Intensity
Unit : mcd @20mA
Bin Code
Min.
Max.
U
4200
5500
V
5500
7200
Note: Tolerance of each bin limit is ±15%
Dominant Wavelength
Unit : nm @20mA
Bin Code
Min.
Max.
B01
464
468
B02
468
472
Note: Tolerance of each bin limit is ±1nm
Forward Voltage Vf (Volts)
IF@20mA
Bin Code
Min.
Max.
3
2.75
3.00
4
3.00
3.25
5
3.25
3.50
Note: Tolerance of each bin limit is ±0.1V
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CAUTIONS
1. Application
The LEDs described here are intended to be used for ordinary electronic equipment (such as office
equipment,
communication equipment and household applications).Consult Liteon’s Sales in advance
for information on applications in which exceptional reliability is required, particularly when the failure or
malfunction of the LEDs may directly jeopardize life or health (such as in aviation, transportation, traffic
control equipment, medical and life support systems and safety devices).
2. Storage
The storage ambient for the LEDs should not exceed 30°C temperature or 70% relative humidity.
It is recommended that LEDs out of their original packaging are used within three months.
For extended storage out of their original packaging, it is recommended that the LEDs be stored
in a sealed container with appropriate desiccant or in desiccators with nitrogen ambient.
3. Cleaning
Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LEDs if necessary.
4. Lead Forming & Assembly
During lead forming, the leads should be bent at a point at least 3mm from the base of LED lens.
Do not use the base of the lead frame as a fulcrum during forming.
Lead forming must be done before soldering, at normal temperature.
During assembly on PCB, use minimum clinch force possible to avoid excessive mechanical stress.
5. Soldering
When soldering, leave a minimum of 2mm clearance from the base of the lens to the soldering point.
Dipping the lens into the solder must be avoided.
Do not apply any external stress to the lead frame during soldering while the LED is at high temperature.
Recommended soldering conditions :
Soldering iron
Temperature
Soldering time
300°C Max.
3 sec. Max.
(one time only)
Wave soldering
Pre-heat
Pre-heat time
Solder wave
Soldering time
100°C Max.
60 sec. Max.
260°C Max.
5 sec. Max.
Note: Excessive soldering temperature and/or time might result in deformation of the LED lens or catastrophic
failure of the LED. IR reflow is not suitable process for through hole type LED lamp product.
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6. Drive Method
An LED is a current-operated device. In order to ensure intensity uniformity on multiple LEDs
connected in parallel in an application, it is recommended that a current limiting resistor be
incorporated in the drive circuit, in series with each LED as shown in Circuit A below.
Circuit model A
LED
Circuit model B
LED
(A) Recommended circuit
(B) The brightness of each LED might appear different due to the differences in the I-V characteristics
of those LEDs
7. ESD (Electrostatic Discharge)
Static Electricity or power surge will damage the LED.
Suggestions to prevent ESD damage:
 Use a conductive wrist band or anti- electrostatic glove when handling these LEDs
 All devices, equipment, and machinery must be properly grounded
 Work tables, storage racks, etc. should be properly grounded
 Use ion blower to neutralize the static charge which might have built up on surface of the LEDs
plastic lens as a result of friction between LEDs during storage and handing
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Suggested checking list :
Training and Certification
1. Everyone working in a static-safe area is ESD-certified?
2. Training records kept and re-certification dates monitored?
Static-Safe Workstation & Work Areas
1. Static-safe workstation or work-areas have ESD signs?
2. All surfaces and objects at all static-safe workstation and within 1 ft measure less than 100V?
3. All ionizer activated, positioned towards the units?
4. Each work surface mats grounding is good?
Personnel Grounding
1. Every person (including visitors) handling ESD sensitive (ESDS) items wear wrist strap, heel strap or
conductive shoes with conductive flooring?
2. If conductive footwear used, conductive flooring also present where operator stand or walk?
3. Garments, hairs or anything closer than 1 ft to ESD items measure less than 100V*?
4. Every wrist strap or heel strap/conductive shoes checked daily and result recorded for all DLs?
5. All wrist strap or heel strap checkers calibration up to date?
Note: *50V for Blue LED.
Device Handling
1. Every ESDS items identified by EIA-471 labels on item or packaging?
2. All ESDS items completely inside properly closed static-shielding containers when not at static-safe
workstation?
3. No static charge generators (e.g. plastics) inside shielding containers with ESDS items?
4. All flexible conductive and dissipative package materials inspected before reuse or recycle?
Others
1. Audit result reported to entity ESD control coordinator?
2. Corrective action from previous audits completed?
3. Are audit records complete and on file?
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8. Reliability Test
Classification
Test Item
Test Condition
Sample
Size
Ta = 25°C
45 PCS
IF = 30mA
*Test Time= 1000hrs
(CL=90%;
LTPD=5%)
High Temperature/
Ta = 85°C
45 PCS
High Humidity storage
(THB)
RH = 85%
(CL=90%;
LTPD=5%)
Operation Life
*Test Time= 1000hrs
Steady state
Ta = 85°C, RH= 85 %
76 PCS
Operation Life of
IF = 8 mA
Endurance
High Humidity Heat
*Test Time= 500hrs
(CL=90%;
LTPD=3%)
Test
Low Temperature
Operation Life of
Ta = -30°C
45 PCS
IF = 30mA
(CL=90%;
LTPD=5%)
*Test Time= 1000hrs
High Temperature
Storage
Ta= 105 ± 5°C
*Test Time= 1000hrs
(CL=90%;
LTPD=5%)
100°C ~ 25°C ~ -40°C ~ 25°C
76 PCS
30mins
(CL=90%;
LTPD=3%)
5mins
30mins 5mins
Thermal
15mins
Shock
*Test time: 200 Cycles
15mins
(CL=90%;
LTPD=3%)
11 PCS
(CL=90%;
LTPD=18.9%)
11 PCS
(CL=90%;
(Lead Free Solder, Coverage ≧95% of LTPD=18.9%)
the dipped surface)
Dwell Time= 3.5 ± 0.5 seconds
MIL-STD-883G:1011 (2006)
MIL-STD-202G:107G (2002)
MIL-STD-750D:2031(1995)
JEITA ED-4701: 300 302 (2001)
MIL-STD-750D:2026 (1995)
T. sol = 245 ± 5°C
T. sol = 350 ± 5°C
JEITA ED-4701:100 105 (2001)
JESD22-A106B (2004)
Dwell Time= 10±1 seconds
Dwell Time= 5 ± 0.5 seconds
MIL-STD-883G:1010 (2006)
MIL-STD-750D:1056 (1995)
76 PCS
T.sol = 260 ± 5°C
3mm from the base of the epoxy bulb
JEITA ED-4701:200 202 (2001)
JESD22-A104C (2005)
(<20 secs transfer)
Soldering Iron
JEITA ED-4701:200 201 (2001)
MIL-STD-750D:1051 (1995)
100 ± 5°C ~ -30°C ± 5°C
Solderability
JESD22-A101C (2009)
MIL-STD-883G:1008 (2006)
*Test Time= 1000hrs
Resistance
JEITA ED-4701:100 103 (2001)
45 PCS
*Test time: 200 Cycles
Test
MIL-STD-202G:103B (2002)
(CL=90%;
LTPD=5%)
Storage
Solder
MIL-STD-883G:1005 (2006)
MIL-STD-750D:1031 (1995)
Ta= -55 ± 5°C
Temperature
Environmental
MIL-STD-750D:1026 (1995)
45 PCS
Low Temperature
Cycling
Reference Standard
11 PCS
(CL=90%;
LTPD=18.9%)
MIL-STD-883G:2003 (2006)
MIL-STD-202G:208H (2002)
IPC/EIA J-STD-002 (2004)
MIL-STD-202G:208H (2002)
JEITA ED-4701:300 302 (2001)
9. Others
The appearance and specifications of the product may be modified for improvement, without prior notice.
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