AVAGO AMMP-6130-TR1G 30 ghz power amplifier with frequency multiplier (x2) Datasheet

AMMP-6130
30 GHz Power Amplifier with Frequency Multiplier (x2)
in SMT Package
Data Sheet
Description
Features
Avago Technologies AMMP-6130 is a high gain,
narrowband doubler and output power amplifier
designed for DBS applications and other commercial
communication systems. The MMIC takes an input 15
GHz signal and passes it through a harmonic frequency
multiplier (x2) and then three stages of power
amplification. Integrated matching structures filter and
match input/output to 50 Ω. It has integrated input
and output DC blocking capacitors and bias structures
to all stages. The MMIC is fabricated using PHEMT
technology. The backside of this package part is both
RF and DC ground. This helps simply the assembly
process and reduces assembly related performance
variations and costs. The surface mount package allows
elimination of “chip & wire” assembly for lower cost.
This MMIC is a cost effective alternative to hybrid
(discrete-FET) amplifiers that require complex tuning
and assembly process.
•
•
•
•
•
Surface Mount Package, 5.0 x 5.0 x 1.25 mm
5x5 mm Surface Mount Package
Integrated DC Block and Choke
50 Ω Input and Output Match
Single Positive Supply Pin
No Negative Gate Bias
Specifications (Vd=4.5V, Idd=200mA)
•
•
•
•
•
Frequency Range 15GHz in, 30GHz out
Output Power: 21 dBm
Harmonic Suppression: 60dBc
Single Positive Supply
DC Requirements: 4.5V, 200mA
Applications
• Microwave Radio systems
• Satellite VSAT, DBS Up/Down Link
• Broadband Wireless Access)
Pin Connections (Top View)
1
8
2
3
X2
4
7
6
Pin
1
2
3
4
5
6
7
8
Function
Vd
RF Out
RF In
5
PACKAGE
BASE
GND
Note: These devices are ESD sensitive. The following precautions are strongly recommended. Ensure
that an ESD approved carrier is used when units are transported from one destination to another.
Personal grounding is to be worn at all times when handling these devices. The manufacturer
assumes no responsibilities for ESD damage due to improper storage and handling of these devices.
Absolute Maximum Ratings (1)
DC Specifications/ Physical Properties (2)
Sym Parameters/Condition
Unit
Max
Vdd
Drain to Ground Voltage
V
Idd
Drain Current
Pin
5
Parameter and
Sym Test Condition
Unit
mA
300
Idd
mA
RF CW Input Power Max
dBm
15
Tch
Max channel temperature
C
+150
Drain Supply Current
under any RF power
drive and temp.
(Vd=4.5 V)
Tstg
Storage temperature
C
-65 +150
Vd
Drain Supply Voltage
V
C
260 for 20s
θjc
Thermal Resistance(3)
C/W
Tmax Maximum Assembly Temp
Notes.
1. Operation in excess of any of these conditions may result in
permanent damage to this device. The absolute maximum ratings
for Vdd, Idd and Pin were determined at an ambient temperature
of 25°C unless noted otherwise.
Min Typ
3.5
Max
200
250
4.5
5
45
2. Ambient operational temperature TA=25°C unless noted
3. Channel-to-backside Thermal Resistance (Tchannel = 34°C) as
measured using infrared microscopy. Thermal Resistance at
backside temp. (Tb) = 25°C calculated from measured data.
AMMP-6130 RF Specifications (4,5)
TA= 25°C, Vdd = 4.5 V, Idd = 200mA, Zo=50 Ω, Pin=5dBm
Symbol
Parameters and Test Conditions
Freq
Operational Frequency
Gain
(4,5)
Conversion Gain
(5)
Pout
Output Power
FS
Fundamental Suppression
3H Sup
3rd Harmonic Suppression
Frequency
Units
Minimum
Maximum
GHz
30
30
dB
14
18.5
16
30
dBm
19
23.5
21
30
dBc
60
dBc
50
Notes.
4. Small/Large -signal data measured in a fully de-embedded test fixture form TA = 25°C.
5. All tested parameters guaranteed with measurement accuracy +/-1dB/dBm/dBc.
Typical Distribution of Conversion Gain and Output Power based on 1000 parts
StDev = 0.46
Conversion Gain at 30GHz
2
Typical
StDev = 0.39
Output Power at 30GHz
AMMP-6130 Typical Performance
(TA = 25°C, Vdd=4.5V, Idd=200 mA, Zin = Zout = 50Ω, Pin=3dBm unless otherwise stated)
20
65
18
16
60
22
50
45
8
40
C.G.
2H-1H
6
4
29
25
14.5
15
15.5
Input Frequency [GHz]
22
20
2H [dBm]
20
18
4V
3.5V
5V
4.5V
30.5
-5
-10
-15
-20
-25
-30
-35
-40
-45
-50
10
2H
1H
3H
0
12
30
31
15
5
29.5
30.5
Figure 2. Output Power vs. Output Frequency vs. Input Power
25
29
30
Output Frequency [GHz]
24
14
29.5
16
Figure 1. Conversion Gain & Fundamental Sup vs. Input Freq
16
3dBm
5dBm
4dBm
14
30
14
2H [dBm]
18
16
35
2
20
29
31
29.5
30
30.5
Frequency [GHz]
1H [dBm], 3H [dBm]
12
10
2H [dBm]
2H-1H [dBm]
55
14
C.G.[dB]
24
31
Frequency [GHz]
24
0
20
-5
16
-10
12
8
14GHz
16GHz
15GHz
4
-6
-4
-2
0
2
4
6
-15
-20
-25
13
Pin [dBm]
Figure 5. Output Power vs. Input Power vs. Input Freq
22
20
18
16
-40C
25C
85C
14
12
29
29.5
30
30.5
18
23
Frequency [GHz]
28
Figure 6. Input and Output Return Loss vs. Freq
24
2H [dBm]
S11[dB]
S22[dB]
-30
0
31
Frequency [GHz]
Figure 7. Output Power vs. Output Freq @ Temp = 25C, -40C &
85C
3
Figure 4. Fundamental, 2H & 3H Output Power vs. Output Freq
Return Loss [dB]
2H [dBm]
Figure 3. Output Power vs. Output Frequency @ 4 bias levels
33
Typical Scattering Parameters [1]
(TA = 25°C, Vdd =4.5 V, IDD = 200 mA, Zin = Zout = 50 Ω)
Freq
S11
S21
S12
S22
GHz dB
Mag
Phase
dB
Mag
Phase
dB
Mag
Phase
dB
Mag
Phase
1
0.779
73.909
-80.000
0.000
32.383
-76.478
0.000
96.570
-0.425
0.952
-101.410
-2.166
2
-2.531
0.747
-33.368
-55.139
0.002
131.860
-64.437
0.001
14.797
-1.765
0.816
159.979
3
-3.497
0.669
-148.095
-47.131
0.004
4.147
-60.915
0.001
-81.506
-3.270
0.686
61.101
4
-4.889
0.570
81.765
-35.890
0.016
-149.666 -61.938
0.001
-167.459 -6.891
0.452
-23.500
5
-4.747
0.579
-58.704
-39.659
0.010
14.517
-76.478
0.000
-43.361
-5.259
0.546
-102.375
6
-4.158
0.620
177.213
-42.499
0.008
-90.973
-60.000
0.001
179.115
-5.923
0.506
170.014
7
-3.851
0.642
65.073
-40.491
0.009
125.799
-52.217
0.002
90.638
-6.641
0.466
79.202
8
-3.490
0.669
-47.052
-38.202
0.012
6.552
-50.903
0.003
-0.484
-7.851
0.405
-19.043
9
-2.858
0.720
-152.082
-36.449
0.015
127.728
-51.213
0.003
-66.346
-8.101
0.394
-114.956
10
-2.405
0.758
115.491
-39.453
0.011
-65.533
-50.752
0.003
-143.716 -7.230
0.435
158.758
11
-2.455
0.754
30.433
-36.924
0.014
-163.279 -51.057
0.003
143.963
-6.848
0.455
78.557
12
-3.151
0.696
-60.545
-31.920
0.025
107.046
-51.701
0.003
70.767
-7.764
0.409
-2.902
13
-4.322
0.608
-169.451
-25.739
0.052
3.617
-53.351
0.002
-5.502
-9.863
0.321
-100.642
14
-4.834
0.573
73.490
-21.180
0.087
-117.593 -56.773
0.001
-76.081
-9.730
0.326
143.433
15
-8.532
0.471
-34.070
-18.548
0.118
110.391
-58.416
0.001
-115.604 -7.355
0.429
47.561
16
-17.084
0.140
178.992
-17.566
0.132
6.543
-55.139
0.002
176.951
-6.539
0.471
-30.885
17
-4.491
0.596
-53.423
-17.635
0.131
-135.344 -54.895
0.002
114.486
-7.803
0.407
-107.509
18
-3.044
0.704
-155.503
-23.293
0.068
136.100
-55.918
0.002
53.047
-10.664
0.293
152.353
19
-3.366
0.679
102.797
-18.655
0.117
95.071
-55.650
0.002
10.720
-9.247
0.345
7.160
20
-3.044
0.704
-9.051
-9.450
0.337
-14.777
-50.604
0.003
-48.544
-6.265
0.486
-113.148
21
-2.867
0.719
-108.593
-5.991
0.502
-145.395 -48.068
0.004
-132.798 -11.811
0.257
132.293
22
-3.422
0.674
162.205
-4.028
0.629
82.328
-48.291
0.004
150.079
-13.966
0.200
-67.065
23
-4.695
0.582
63.767
-3.379
0.678
-39.850
-47.033
0.004
77.624
-10.858
0.287
-171.437
24
-4.668
0.584
-51.945
-2.061
0.789
-163.461 -49.119
0.004
-14.763
-13.856
0.203
116.377
25
-3.628
0.659
-154.450
-0.831
0.909
69.328
0.002
-91.783
-26.366
0.048
37.539
-54.425
26
-3.951
0.635
115.995
1.569
1.198
-59.027
-63.098
0.001
-133.605 -20.510
0.094
-161.333
27
-6.246
0.487
5.230
5.448
1.872
160.771
-54.425
0.002
-121.717 -14.933
0.179
150.560
28
-4.878
0.570
-139.262
8.677
2.716
0.554
-52.956
0.002
154.890
-13.580
0.209
94.577
29
-2.704
0.732
123.438
8.718
2.728
-161.843 -51.535
0.003
104.130
-19.160
0.110
112.029
30
-2.261
0.771
55.231
7.537
2.381
45.858
0.006
33.927
-10.134
0.324
60.389
31
-2.438
0.755
-17.264
4.931
1.764
-99.661
-40.677
0.009
-92.384
-16.812
0.144
-33.753
32
-4.679
0.584
-129.407
2.021
1.262
124.211
-45.352
0.005
171.824
-12.958
0.225
93.604
33
-3.935
0.636
87.568
-2.173
0.779
-7.487
-47.639
0.004
82.835
-7.855
0.405
28.172
34
-2.625
0.739
-0.364
-3.950
0.635
-121.959 -54.425
0.002
29.124
-6.979
0.448
-23.046
35
-2.781
0.726
-54.324
-5.113
0.555
74.844
-51.213
0.003
24.686
-7.925
0.402
-70.880
36
-1.933
0.800
-110.128
-14.647
0.185
-47.149
-50.314
0.003
-44.356
-12.031
0.250
-120.006
37
-2.389
0.760
-179.000
-20.114
0.099
-142.199 -47.432
0.004
-103.624 -24.967
0.056
-83.063
38
-3.601
0.661
76.661
-23.728
0.065
119.631
0.005
170.138
0.266
-78.816
39
-3.147
0.696
-52.739
-29.776
0.032
19.317
-48.995
0.004
109.913
-8.394
0.380
-129.674
40
-2.535
0.747
-142.354
-37.109
0.014
-63.508
-48.636
0.004
59.709
-8.793
0.363
175.556
Note:
Data obtained off of a connectorized module
4
-44.883
-45.514
-11.511
Biasing and Operation
The AMMP-6130 frequency doubler has been designed
with a fully integrated self bias network; thus, requiring
only a single 4.5v bias input with a typical current draw
of 200mA.
The one-stage frequency doubler relies on the nonlinear behavior of the FET to produce the doubled
signal at the output. A high-pass filter at the input
shorts any reflected 2nd harmonic signal to ground.
The input also consists of matching components tuned
to 15GHz. An additional LC-filter is included at the
input for stability. The doubler is operated at pinchoff to create a half-wave conduction angle ideal for
generation of the 2nd harmonic. The AMMP-6130 is
also designed for stability over temperature.
Figure 8. Evaluation / Test Board (Available to qualified
customer requests)
C
C3
Port
Vd1
MLIN
TL10
Port
Vd2
MLIN
TL11
MLIN
TL12
MLOC
TL8
C
C2
Port
Input_15G
MLIN
TL3
MLIN
TL4
MLIN
HP_FET
TL7
HPFET1
C
MLIN
C4
TL20
MLIN
TL21
MLIN
TL15
MLIN
TL18
MLIN
TL2
MLOC
TL9
C
C9
C
C10
R
R1
Figure 9. Simplified Doubler-Amplifier Schematic
5
MLIN
MLINTL14
TL17
C
HP_FET
C5
HPFET2
R
R2
C
C
C11 C12
R
R5
R
R3
C
HP_FET
C6
HPFET3
MLIN
TL13
MLIN
TL22
MLIN
TL16
MLIN
TL19
C C
C C R
C15C13 C14 C16R6
R
R4
C
HP_FET C7
HPFET4
Port
Output_30G
The AMMP Packaged Devices are compatible with high
volume surface mount PCB assembly processes.
Recommended SMT Attachment for 5x5 Package
The PCB material and mounting pattern, as defined in
the data sheet, optimizes RF performance and is
strongly recommended. An electronic drawing of the
land pattern is available upon request from Avago Sales
& Application Engineering.
Manual Assembly
NOTES:
DIMENSIONS ARE IN INCHES [MILIMETERS]
ALL GROUNDS MUST BE SOLDERED TO PCB RF
Material is Rogers RO4350, 0.010" thick
Figure 10. PCB Land Pattern and Stencil Layouts
300
Peak = 250 ± 5˚C
250
Temp (C)
Melting point = 218˚C
200
150
100
50
0
Ramp 1
0
Preheat Ramp 2
50
100
Reflow
150
200
Cooling
250
Seconds
Figure 11. Suggested Lead-Free Reflow Profile for SnAgCu
Solder Paste
300
• Follow ESD precautions while handling packages.
• Handling should be along the edges with tweezers.
• Recommended attachment is conductive solder
paste. Please see recommended solder reflow
profile. Neither Conductive epoxy or hand soldering
is recommended.
• Apply solder paste using a stencil printer or dot
placement. The volume of solder paste will be
dependent on PCB and component layout and
should be controlled to ensure consistent
mechanical and electrical performance.
• Follow solder paste and vendor’s recommendations
when developing a solder reflow profile. A standard
profile will have a steady ramp up from room
temperature to the pre-heat temp. to avoid damage
due to thermal shock.
• Packages have been qualified to withstand a peak
temperature of 260°C for 20 seconds. Verify that
the profile will not expose device beyond these
limits.
A properly designed solder screen or stencil is required
to ensure optimum amount of solder paste is deposited
onto the PCB pads. The recommended stencil layout
is shown in Figure 8. The stencil has a solder paste
deposition opening approximately 70% to 90% of the
PCB pad. Reducing stencil opening can potentially
generate more voids underneath. On the other hand,
stencil openings larger than 100% will lead to excessive
solder paste smear or bridging across the I/O pads.
Considering the fact that solder paste thickness will
directly affect the quality of the solder joint, a good
choice is to use a laser cut stencil composed of
0.127mm (5 mils) thick stainless steel which is capable
of producing the required fine stencil outline.
The most commonly used solder reflow method is
accomplished in a belt furnace using convection heat
transfer. The suggested reflow profile for automated
reflow processes is shown in Figure 9. This profile is
designed to ensure reliable finished joints. However,
the profile indicated in Figure 1 will vary among
different solder pastes from different manufacturers
and is shown here for reference only.
Package, Tape & Reel, and Ordering Information
.011
Dimensional Tolerances: 0.002" [0.05mm]
Back View
Carrier Tape and Pocket Dimensions
AMMP-6130 Part Number Ordering Information
Part Number
Devices Per
Container
Container
AMMP-6130-BLKG
10
Antistatic bag
AMMP-6130-TR1G
100
7" Reel
AMMP-6130-TR2G
500
7" Reel
Note: No RF performance degradation is seen due to ESD upto 250 V HBM and 80 V MM. The DC characteristics in
general show increased leakage at lower ESD discharge voltages. The user is reminded that this device is ESD
sensitive and needs to be handled with all necessary ESD protocols.
For product information and a complete list of distributors, please go to our web site:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited in the United States and other countries.
Data subject to change. Copyright © 2006 Avago Technologies Pte. All rights reserved.
AV01-0287EN - August 2, 2006
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