FEATURES FUNCTIONAL BLOCK DIAGRAM Gain: 14 dB typical Operational frequency range: 0.01 GHz to 10 GHz Input/output internally matched to 50 Ω High input linearity 1 dB compression (P1dB): 20 dBm typical Output third-order intercept (OIP3): 33 dBm typical Supply voltage: 5 V typical 2 mm × 2 mm, 6-lead lead frame chip scale package HMC788A 6 NIC NIC 1 RFIN 2 5 RFOUT GND 3 4 NIC PACKAGE BASE 16204-001 Data Sheet 0.01 GHz to 10 GHz, MMIC, GaAs, pHEMT RF Gain Block HMC788A Figure 1. APPLICATIONS Cellular, 3G, LTE, WiMAX, and 4G LO driver applications Microwave radio Test and measurement equipment Ultra wideband (UWB) communications GENERAL DESCRIPTION The HMC788A is a 0.01 GHz to 10 GHz, gain block, monolithic microwave integrated circuit (MMIC) amplifier using gallium arsenide (GaAs), pseudomorphic high electron mobility transistor (pHEMT) technology. This 2 mm × 2 mm LFCSP amplifier can be used as either a cascadable 50 Ω gain stage, or to drive the local oscillator (LO) port of many of the single and double balanced mixers from Analog Devices, Inc. with up to 20 dBm output power. Rev. B The HMC788A offers 14 dB of gain and an output IP3 of 33 dBm while requiring only 76 mA from a 5 V supply. The Darlington feedback pair exhibits reduced sensitivity to normal process variations and yields excellent gain stability over temperature while requiring a minimal number of external bias components. Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 ©2017 Analog Devices, Inc. All rights reserved. Technical Support www.analog.com HMC788A Data Sheet TABLE OF CONTENTS Features .............................................................................................. 1 ESD Caution...................................................................................4 Applications ....................................................................................... 1 Pin Configuration and Function Descriptions..............................5 Functional Block Diagram .............................................................. 1 Interface Schematics .....................................................................5 General Description ......................................................................... 1 Typical Performance Characteristics ..............................................6 Revision History ............................................................................... 2 Theory of Operation .........................................................................9 Specifications..................................................................................... 3 Basic Connections .........................................................................9 Electrical Specifications ............................................................... 3 Evaluation PCB ............................................................................... 10 Absolute Maximum Ratings ............................................................ 4 Outline Dimensions ....................................................................... 12 Thermal Resistance ...................................................................... 4 Ordering Guide............................................................................... 12 REVISION HISTORY 11/2017—Rev. A to Rev. B Changes to Continuous Power Dissipation, PDISS Parameter and Junction (TJ) Temperature Parameter, Table 2 ............................. 4 This Hittite Microwave Products data sheet has been reformatted to meet the styles and standards of Analog Devices, Inc. 10/2017—v00.0913 to Rev. A Changes to Product Title, Features Section, General Description Section, and Figure 1 .........................................................................1 Changes to Table 1.............................................................................3 Changes to Table 2.............................................................................4 Added Thermal Resistance Section and Table 3; Renumbered Sequentially ........................................................................................4 Changes to Figure 2, Table 4, and Figure 3 ....................................5 Changes to Typical Perfomance Characteristics Section .............6 Added Figure 17; Renumbered Sequentially .................................8 Added Theory of Operation Section ..............................................9 Added Applications Information Section Heading ................... 10 Changes to Evaluation PCB Section and Figure 18 ................... 10 Updated Outline Dimensions ....................................................... 12 Changes to Ordering Guide .......................................................... 12 Rev. B | Page 2 of 12 Data Sheet HMC788A SPECIFICATIONS ELECTRICAL SPECIFICATIONS Collector bias voltage (VCC) = 5 V, TCASE = 25°C, 6.35 µH external inductor between VCC and RFOUT, 50 Ω system, unless otherwise noted. Table 1. Parameter OVERALL FUNCTION Frequency Range Gain Symbol Min 0.01 12 9 Gain Variation Over Temperature Reverse Isolation RADIO FREQUENCY (RF) INPUT INTERFACE Input Return Loss RF OUTPUT INTERFACE Output Power for 1 dB Compression P1dB 18 15 Output Return Loss DISTORTION AND NOISE Output Third-Order Intercept Noise Figure POWER INTERFACE Supply Voltage Supply Current OIP3 NF ICC 4.5 60 Typ Max Unit Test Conditions/Comments 10 14 12 0.004 0.007 23 20 GHz dB dB dB/°C dB/°C dB dB 0.01 GHz to 6.0 GHz 6.0 GHz to 10.0 GHz 0.01 GHz to 6.0 GHz 6.0 GHz to 10.0 GHz 0.01 GHz to 6.0 GHz 6.0 GHz to 10 GHz 16 9 dB dB 0.01 GHz to 6.0 GHz 6.0 GHz to 10.0 GHz 20 18 9 12 dBm dBm dB dB 0.01 GHz to 6.0 GHz 6.0 GHz to 10.0 GHz 0.01 GHz to 6.0 GHz 6.0 GHz to 10.0 GHz 33 30 6 7 dBm dBm dB dB 0.01 GHz to 6.0 GHz 6.0 GHz to 10.0 GHz 0.01 GHz to 6.0 GHz 6.0 GHz to 10.0 GHz V mA mA mA VCC = 4.5 V VCC = 5 V VCC = 5.5 V 5 65 76 87 Rev. B | Page 3 of 12 5.5 90 HMC788A Data Sheet ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE Table 2. Parameter Collector Bias Voltage (VCC) RF Input Power (RFIN), VCC = 5 V Continuous Power Dissipation, PDISS (TCASE = 85°C, Derate 8.5 mW/°C Above 85°C) Junction (TJ) Temperature Operating (TOPR) Temperature Range Storage Temperature Range Electrostatic Discharge (ESD) Sensitivity, Human Body Model (HBM) Thermal performance is directly linked to printed circuit board (PCB) design and operating environment. Careful attention to PCB thermal design is required. Rating 7V 15 dBm 0.76 W 175°C −40°C to +85°C −65°C to +150°C Class 1A Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. θJC is the junction to case thermal resistance. Table 3. Thermal Resistance Package Type CP-6-101 1 θJC 118.0 Unit °C/W Thermal impedance simulated values are based on a JEDEC 2S2P thermal test board with nine thermal vias. See JEDEC JESD51. ESD CAUTION Rev. B | Page 4 of 12 Data Sheet HMC788A PIN CONFIGURATION AND FUNCTION DESCRIPTIONS 6 NIC NIC 1 HMC788A RFIN 2 GND 3 TOP VIEW 5 RFOUT (Not to Scale) 4 NIC NOTES 1. NIC = NOT INTERNALLY CONNECTED. THE PINS ARE NOT CONNECTED INTERNALLY; HOWEVER, ALL DATA SHOWN HEREIN WAS MEASURED WITH THESE PINS CONNECTED TO GROUND EXTERNALLY. 2. EXPOSED PAD. THE EXPOSED PAD MUST BE CONNECTED TO GROUND FOR PROPER OPERATION. 16204-002 PACKAGE BASE Figure 2. Pin Configuration Table 4. Pin Function Descriptions Pin No. 1, 4, 6 Mnemonic NIC 2 3 5 RFIN GND RFOUT EPAD Description Not Internally Connected. The pins are not connected internally; however, all data shown herein was measured with these pins connected to GND externally. RF Input. This pin is dc-coupled and ac matched to 50 Ω. An external dc blocking capacitor is required on this pin. Ground. This pin must be connected to ground. RF Output. This pin is ac matched to 50 Ω and supplies dc bias for the output stage. Exposed Pad. The exposed pad must be connected to GND for proper operation. GND RFOUT 16204-003 RFIN 16204-004 INTERFACE SCHEMATICS Figure 4. GND Interface Schematic Figure 3. RFIN, RFOUT Interface Schematic Rev. B | Page 5 of 12 HMC788A Data Sheet TYPICAL PERFORMANCE CHARACTERISTICS 20 20 10 GAIN (dB) 15 0 –10 10 S22 S21 S11 –30 0 2 4 6 8 10 12 14 16 FREQUENCY (GHz) 5 0 –5 OUTPUT RETURN LOSS (dB) –5 +85°C +25°C –40°C –25 –30 0 2 4 6 8 10 12 FREQUENCY (GHz) 10 12 –15 –20 +85°C +25°C –40°C –30 0 2 4 6 8 10 12 FREQUENCY (GHz) Figure 6. Input Return Loss vs. Frequency at Various Temperatures Figure 9. Output Return Loss vs. Frequency at Various Temperatures –10 20 +85°C +25°C –40°C –12 –14 15 NOISE FIGURE (dB) –16 –18 –20 –22 –24 10 5 –26 –28 –30 0 2 4 6 8 10 12 FREQUENCY (GHz) 0 0 2 4 6 8 10 12 FREQUENCY (GHz) Figure 7. Reverse Isolation vs. Frequency at Various Temperatures Figure 10. Noise Figure vs. Frequency at Various Temperatures Rev. B | Page 6 of 12 16204-010 +85°C +25°C –40°C 16204-007 REVERSE ISOLATION (dB) 8 –10 –25 16204-006 INPUT RETURN LOSS (dB) 0 –20 6 Figure 8. Gain vs. Frequency at Various Temperatures 0 –15 4 FREQUENCY (GHz) Figure 5. Gain, Input Return Loss, and Output Return Loss vs. Frequency; S21 is Gain, S11 is Input Return Loss, S22 is Output Return Loss –10 2 16204-008 +85°C +25°C –40°C 16204-009 –20 16204-005 GAIN, INPUT RETURN LOSS, AND OUTPUT RETURN LOSS 30 Data Sheet HMC788A 25 45 40 20 OUTPUT IP3 (dBm) P1dB (dBm) 35 15 10 30 25 20 5 4 6 8 10 12 FREQUENCY (GHz) 10 0 8 10 12 25 PAE GAIN (dBm) POUT (dBm) 20 45 40 PSAT (dBm) 35 30 25 15 10 20 15 5 10 +85°C +25°C –40°C 5 –5 0 INPUT POWER (dBm) 5 10 0 16204-012 0 –10 0 2 4 6 FREQUENCY (GHz) Figure 12. Output Power (POUT), Gain, and Power Added Efficiency (PAE) vs. Input Power at 1 GHz 8 10 12 16204-014 POUT (dBm), GAIN (dB), AND PAE (%) 6 Figure 13. Output IP3 vs. Frequency at Various Temperatures; 5 dBm per Tone Output Power 60 50 4 FREQUENCY (GHz) Figure 11. P1dB vs. Frequency at Various Temperatures 55 2 16204-013 2 16204-011 0 0 +85°C +25°C –40°C 15 +85°C +25°C –40°C Figure 14. Saturation Power (PSAT) vs. Frequency at Various Temperatures Rev. B | Page 7 of 12 HMC788A Data Sheet –80 PAE GAIN (dBm) POUT (dBm) 25 –90 ADDITIVE PHASE NOISE (dBc/Hz) POUT (dBm), GAIN (dB), AND PAE (%) 30 20 15 10 5 –100 –110 –120 –130 –140 –150 –160 0 2 4 6 8 10 12 INPUT POWER (dBm) –180 100 16204-015 0 30 IP3 P1dB GAIN 20 5.5 SUPPLY VOLTAGE (V) 16204-016 GAIN (dB), P1dB (dBm), AND IP3 (dBm) 100k Figure 17. Additive Phase Noise vs. Offset Frequency; RF Frequency = 5 GHz, RF Input Power = 6 dBm (P1dB) 40 5.0 10k OFFSET FREQUENCY (Hz) Figure 15. POUT, Gain, and PAE vs. Input Power at 10 GHz 10 4.5 1k Figure 16. Gain, P1dB, and IP3 vs. Supply Voltage at 1 GHz Rev. B | Page 8 of 12 1M 16204-017 –170 Data Sheet HMC788A THEORY OF OPERATION The HMC788A is designed with a Darlington feedback pair that exhibits reduced sensitivity to normal process variations and yields excellent gain stability over temperature while requiring minimal external bias components. The amplifier can be operated from a 5 V supply by adding a choke inductor from the amplifier output to VCC. It is critical to supply very low inductance ground connections to the GND pin as well as to the backside exposed pad, ensuring stable operation. It is recommended that the NIC pins also be connected to GND. The HMC788A RF gain block is a fixed gain amplifier with singleended input and output ports featuring impedances nominally equal to 50 Ω over the 0.01 GHz to 10 GHz frequency range. The input and output impedances are sufficiently stable across variations in temperature and supply voltage such that the HMC788A can be directly inserted into a 50 Ω system with no impedance matching circuitry required. The HMC788A is designed to operate with a supply voltage of 5 V, which is connected through an external RF choke between the supply voltage and the output pin, RFOUT. The inductance of the RF choke must be approximately 6 µH, and care must be taken to ensure that the lowest series self resonant frequency of this choke is well above the maximum frequency of operation for the HMC788A. Consequently, a dc blocking capacitor must be connected between the bias connection to RFOUT and the output load. The value of this capacitor is not critical, but it is recommended to be 100 pF or larger. The input pin, RFIN, is dc-coupled and ac matched to 50 Ω. A dc blocking capacitor must be connected between the source that drives the HMC788A and the RFIN pin. Bypass the bias supply voltage, VCC, using a large value capacitance (approximately 2.2 µF or larger) and a smaller, high frequency bypass capacitor (approximately 100 pF). BASIC CONNECTIONS The recommended connections and components are shown in the Evaluation PCB section. Rev. B | Page 9 of 12 HMC788A Data Sheet APPLICATIONS INFORMATION EVALUATION PCB The PCB used in this application must use RF circuit design techniques. Signal lines must have 50 Ω impedance while the package ground leads and exposed pad must be connected directly to the ground plane similar to that shown in Figure 19. A sufficient number of via holes must be used to connect the top and bottom ground planes. The EV1HMC788ALP2 evaluation board must be mounted to an appropriate heat sink. Figure 18 shows the schematic of the EV1HMC788ALP2 evaluation board. The board is powered by a single supply between 4.5 V and 5.5 V and is decoupled by a 2.2 µF capacitor and a 100 pF capacitor. DC blocking capacitors are installed at the RFIN and RFOUT ports. Note that inductor L1 is a required component to apply the VCC = 5 V bias to the RFOUT pin. Table 5. List of Materials for the Evaluation PCB EV1HMC788ALP21 Item J1 to J2 J5, J6 C1, C2 C3 C4 R1 L1 U1 PCB2 1 2 Reference this number when ordering the complete evaluation PCB. The circuit board material is Rogers 4350. VCC C4 2.2µF C3 100pF L1 6.35µH C1 .01µF C2 .01µF RFIN RFOUT PIN 3 PIN 5 PACKAGE BOTTOM MUST BE CONNECTED TO RF GROUND. 16204-018 PIN 2 Description PCB mount Subminiature Version A (SMA) connector DC pin 0.01 μF capacitor, 0502 package 100 pF capacitor, 0402 package 2.2 μF Case A package 0 Ω resistor, 0402 package Inductor, conical 6.35 μH HMC788ALP2E 129549 evaluation PCB Figure 18. Evaluation Board Schematic Rev. B | Page 10 of 12 HMC788A 16204-019 Data Sheet Figure 19. Evaluation Board, Top View Rev. B | Page 11 of 12 HMC788A Data Sheet OUTLINE DIMENSIONS 1.50 1.40 1.30 8 5 PIN 1 INDEX AREA PKG-004900/005352 SEATING PLANE 0.90 0.80 0.70 EXPOSED PAD 0.40 0.35 0.30 TOP VIEW 0.90 0.85 0.80 DETAIL A (JEDEC 95) 0.65 BSC SIDE VIEW 4 0.05 MAX 0.02 NOM COPLANARITY 0.08 0.30 0.25 0.20 1 PIN 1 INDIC ATOR AREA OPTIONS (SEE DETAIL A) BOTTOM VIEW 1.30 REF FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET. 0.203 REF 02-09-2017-C 2.05 2.00 SQ 1.95 Figure 20. 6-Lead Lead Frame Chip Scale Package [LFCSP] 2 mm × 2 mm Body and 0.85 mm Package Height (CP-6-10) Dimensions shown in millimeters ORDERING GUIDE Model 1 HMC788ALP2E HMC788ALP2ETR EV1HMC788ALP2 1 2 Temperature Range −40°C to +85°C −40°C to +85°C MSL Rating 2 MSL1 MSL1 Package Description 6-Lead Lead Frame Chip Scale Package [LFCSP] 6-Lead Lead Frame Chip Scale Package [LFCSP] Evaluation Board All models are RoHS Compliant. See the Absolute Maximum Ratings section. ©2017 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D16204-0-11/17(B) Rev. B | Page 12 of 12 Package Option CP-6-10 CP-6-10