TI1 ADS58C20 Dual if receivers with snrboost3g signal processing Datasheet

ADS58C20
ADS58C23
SLAS780 – JULY 2011
www.ti.com
3G+
Dual IF Receivers with SNRBoost
Signal Processing
Check for Samples: ADS58C20 , ADS58C23
FEATURES
APPLICATIONS
•
•
1
2
•
•
•
•
Differential Analog IF Input, DDR LVDS Digital
IF Output
Up to 125-MHz Signal Bandwidth Per Receiver
– With 40- and 75-MHz Optimized Bands
High Dynamic Performance
High Impedance Input
80-Pin TQFP Package with PowerPAD™
•
ADS58C20: Multi-Carrier
GSM/3G/LTE/TDS-CDMA Cellular Base-Station
Receiver
ADS58C23: Multi-Carrier 3G/LTE/TDS-CDMA
Cellular Base-Station Receiver
DESCRIPTION
The ADS58C20 and ADS58C23 are dual IF receivers for wideband, multi-mode cellular infrastructure base
stations. Each channel provides high dynamic performance up to 125 MHz of bandwidth, with optimized bands of
40- and 75-MHz. The IF receiver architecture eases front end filter design for wide bandwidth receivers. The
receivers have integrated buffers at the analog inputs with benefits of uniform performance and input impedance
across a wide frequency range.
The ADS58C20 is a high performance part with superior specifications for single/multi-mode cellular base-station
receivers that include multi-carrier GSM. It can also process other cellular protocols such as TDS-CDMA/3G/LTE
and prior generation systems.
The ADS58C23 offers the same functionality and pinout as ADS58C20 but with reduced minimum performance
specifications for lower cost and performance systems, such as TDS-CDMA/3G/LTE single/multi-mode receivers
(when GSM is not required). It can also process prior generation protocols.
The devices are available in an 80-pin TQFP package and are specified over the full industrial temperature range
(–40°C to 85°C).
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PowerPAD is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2011, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
6-Jul-2011
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
ADS58C20IPFP
ACTIVE
HTQFP
PFP
80
96
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
ADS58C20IPFPR
ACTIVE
HTQFP
PFP
80
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
ADS58C23IPFP
ACTIVE
HTQFP
PFP
80
96
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
ADS58C23IPFPR
ACTIVE
HTQFP
PFP
80
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
Samples
(Requires Login)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Jul-2011
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
ADS58C20IPFPR
HTQFP
PFP
80
1000
330.0
24.4
15.0
15.0
1.5
20.0
24.0
Q2
ADS58C23IPFPR
HTQFP
PFP
80
1000
330.0
24.4
15.0
15.0
1.5
20.0
24.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Jul-2011
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
ADS58C20IPFPR
HTQFP
PFP
80
1000
346.0
346.0
41.0
ADS58C23IPFPR
HTQFP
PFP
80
1000
346.0
346.0
41.0
Pack Materials-Page 2
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