Microchip MCP1630 High-speed, microcontroller-adaptable, pulse width modulator Datasheet

MCP1630/MCP1630V
High-Speed, Microcontroller-Adaptable,
Pulse Width Modulator
Features
Description
• High-Speed PWM Operation (12 ns Current
Sense to Output Delay)
• Operating Temperature Range:
- -40°C to +125°C
• Precise Peak Current Limit (±5%) (MCP1630)
• Voltage Mode and Average Current Mode Control
(MCP1630V)
• CMOS Output Driver (drives MOSFET driver or
low-side N-channel MOSFET directly)
• External Oscillator Input
(from PIC® Microcontroller (MCU))
• External Voltage Reference Input (for adjustable
voltage or current output application)
• Peak Current Mode Operation > 1 MHz
• Low Operating Current: 2.8 mA (typ.)
• Fast Output Rise and Fall Times: 5.9 ns and
6.2 ns
• Undervoltage Lockout (UVLO) Protection
• Output Short Circuit Protection
• Overtemperature Protection
The MCP1630/V is a high-speed Pulse Width Modulator (PWM) used to develop intelligent power systems.
When used with a microcontroller unit (MCU), the
MCP1630/V will control the power system duty cycle to
provide output voltage or current regulation. The MCU
can be used to adjust output voltage or current, switching frequency, maximum duty cycle and other features
that make the power system more intelligent.
Applications
•
•
•
•
•
•
Intelligent Power Systems
Smart Battery Charger Applications
Multiple Output/Multiple Phase Converters
Output Voltage Calibration
AC Power Factor Correction
VID Capability (programmed and calibrated by
PIC® microcontroller)
• Buck/Boost/Buck-Boost/SEPIC/Flyback/Isolated
Converters
• Parallel Power Supplies
Related Literature
• “MCP1630 NiMH Demo Board User’s Guide”,
Microchip Technology Inc., DS51505, 2004
• “MCP1630 Low-Cost Li-Ion Battery Charger
User’s Guide”, Microchip Technology Inc.,
DS51555, 2005
• “MCP1630 Li-Ion Multi-Bay Battery Charger
User’s Guide”, Microchip Technology Inc.,
DS51515, 2005
• “MCP1630 Dual Buck Demo Board User’s Guide”,
Microchip Technology Inc., DS51531, 2005
 2004-2013 Microchip Technology Inc.
Typical applications include smart battery chargers,
intelligent power systems, brick dc/dc converters, ac
power-factor correction, multiple output power supplies,
multi-phase power supplies and more.
The MCP1630/V inputs were developed to be easily
attached to the I/O of a MCU. The MCU supplies the
oscillator and reference to the MCP1630/V to provide
the most flexible and adaptable power system. The
power system switching frequency and maximum duty
cycle are set using the I/O of the MCU. The reference
input can be external, a D/A Converter (DAC) output or
as simple as an I/O output from the MCU. This enables
the power system to adapt to many external signals
and variables in order to optimize performance and
facilitate calibration.
When operating in Current mode, a precise limit is set
on the peak current. With the fast comparator speed
(typically 12 ns), the MCP1630 is capable of providing a
tight limit on the maximum switch current over a wide
input voltage range when compared to other high-speed
PWM controllers.
For Voltage mode or Average Current mode
applications, the MCP1630V provides a larger range for
the external ramp voltage.
Additional protection features
overtemperature and overcurrent.
include:
UVLO,
Package Type
8-Lead DFN
(2 mm x 3 mm)
8-Lead MSOP
COMP 1
8 VREF
COMP 1
FB 2
FB 2
CS 3
7 VIN
6 VEXT
CS 3
6 VEXT
OSC IN 4
5 GND
OSC IN 4
5 GND
8 VREF
7 VIN
DS21896C-page 1
MCP1630/MCP1630V
Functional Block Diagram – MCP1630
MCP1630 High-Speed PWM
VIN
Overtemperature
0.1 µA
VIN
UVLO
VEXT
OSC IN
Note
S
VIN
GND
Q
0.1 µA
100 k
CS
+
Comp
–
COMP
R
VIN
Q
Latch Truth Table
FB
–
VREF EA
+
2R
R
2.7V Clamp
Note:
DS21896C-page 2
S
R
Q
0
0
Qn
0
1
1
1
0
0
1
1
1
During overtemperature, VEXT driver is high-impedance.
 2004-2013 Microchip Technology Inc.
MCP1630/MCP1630V
Functional Block Diagram – MCP1630V
MCP1630V High-Speed PWM
VIN
Overtemperature
0.1 µA
VIN
UVLO
VEXT
OSC IN
Note
S
VIN
GND
Q
0.1 µA
100 k
CS
+
Comp
–
COMP
R
VIN
FB
VREF
Latch Truth Table
–
EA
+
2.7V Clamp
Note:
Q
S
R
Q
0
0
Qn
0
1
1
1
0
0
1
1
1
During overtemperature, VEXT driver is high-impedance.
 2004-2013 Microchip Technology Inc.
DS21896C-page 3
MCP1630/MCP1630V
Typical Application Circuit – MCP1630
MCP1630 NiMH Battery Charger and Fuel Gauge Application Diagram
CC
+VBATT
SEPIC Converter
+8V to +15V Input Voltage
4 NiMH Cells
+5V Bias
COUT
Cin
MCP1630
VIN
5.7V
COMP VEXT
FB
OSC IN CS
VREF GND
+VBATT
1:1
N-channel
MOSFET
IBATT
ISW
+5V Bias
+
3V
0V
PIC16LF818
PWM OUT
VDD
MCP1700
3.0V
SOT23
VDD
A/D
1/2 MCP6042
+
VDD
I2C™ To System
+
A/D
1/2 MCP6042
DS21896C-page 4
 2004-2013 Microchip Technology Inc.
MCP1630/MCP1630V
Typical Application Circuit - MCP1630V
Bidirectional Power Converter/Battery Charger for 4-Series Cell Li-Ion Batteries
4-Cell Li-Ion
Battery Pack
Bidirectional Buck/Boost
Boost
Buck
Battery Protection
Switches
Buck
Switch
L
+
Fuse
+
CIN
Boost
Switch
+
DC Bus
Voltage
PS501
+VBATT
COUT
–
SMBus
VSENSE
Sync.
FET
Driver
Battery
Protection
and
Monitor
-VBATT
GND
RSENSE
0V to 2.7V
ISENSE
MCP1630V
+2.5 VREF
CompVREF
VIN
FB
CS VEXT
OSC GND
Charge Current Loop
(1/2) MCP6021
+DC Bus VREF
+
(1/2) MCP6021
–
+
–
PIC16F88
DC bus Voltage Loop
SMBus
IREF Voltage (PWM)
Filter
+
–
(1/2) MCP6021
 2004-2013 Microchip Technology Inc.
DS21896C-page 5
MCP1630/MCP1630V
1.0
ELECTRICAL
CHARACTERISTICS
† Notice: Stresses above those listed under “Maximum
Ratings” may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operational listings of this specification is not implied.
Exposure to maximum rating conditions for extended periods
may affect device reliability.
Absolute Maximum Ratings †
VDD...................................................................................6.0V
Maximum Voltage on Any Pin .. (VGND - 0.3)V to (VIN + 0.3)V
VEXT Short Circuit Current ...........................Internally Limited
Storage temperature .....................................-65°C to +150°C
Maximum Junction Temperature, TJ ........................... +150°C
Continuous Operating Temperature Range ..-40°C to +125°C
ESD protection on all pins, HBM 3 kV
AC/
AC/DC CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, VIN = 3.0V to 5.5V, FOSC = 1 MHz with 10% Duty Cycle, CIN = 0.1 µF,
VIN for typical values = 5.0V, TA = -40°C to +125°C.
Parameters
Sym
Min
Typ
Max
Units
Conditions
Input Operating Voltage
VIN
3.0
—
5.5
V
Input Quiescent Current
I(VIN)
—
2.8
4.5
mA
IEXT = 0 mA, FOSC IN = 0 Hz
External Oscillator Range
FOSC
—
—
1
MHz
Note 1
Min. Oscillator High Time
Min. Oscillator Low Time
TOH_MIN
TOL_MIN
—
10
Input Voltage
Oscillator Input
ns
Oscillator Rise Time
TRISE
0.01
—
10
µs
Note 2
Oscillator Fall Time
TFALL
0.01
—
10
µs
Note 2
VL
—
—
0.8
V
Oscillator Input Voltage High
VH
2.0
—
—
Oscillator Input Capacitance
COSC
Oscillator Input Voltage Low
5
V
pf
External Reference Input
Reference Voltage Input
VREF
0
—
VIN
V
Note 2, Note 3
Error Amplifier
Input Offset Voltage
Error Amplifier PSRR
Common Mode Input Range
VOS
-4
0.1
+4
mV
PSRR
80
99
—
dB
VIN = 3.0V to 5.0V, VCM = 1.2V
VCM
GND - 0.3
—
VIN
V
Note 2, Note 3
—
80
—
dB
VIN = 5V, VCM = 0V to 2.5V
AVOL
85
95
—
dB
RL = 5 k to VIN/2, 100 mV < VEAOUT
< VIN - 100 mV, VCM = 1.2V
Common Mode Rejection Ratio
Open-loop Voltage Gain
Low-level Output
Gain Bandwidth Product
Error Amplifier Sink Current
Error Amplifier Source Current
Note 1:
2:
3:
VOL
—
25
GND + 50
mV
RL = 5 k to VIN/2
GBWP
—
3.5
—
MHz
VIN = 5V
ISINK
5
11
—
mA
VIN = 5V, VREF = 1.2V, VFB = 1.4V,
VCOMP = 2.0V
ISOURCE
-2
-9
—
mA
VIN = 5V, VREF = 1.2V, VFB = 1.0V,
VCOMP = 2.0V, Absolute Value
Capable of higher frequency operation depending on minimum and maximum duty cycles needed.
External oscillator input (OSC IN) rise and fall times between 10 ns and 10 µs used for characterization testing. Signal
levels between 0.8V and 2.0V with rise and fall times measured between 10% and 90% of maximum and minimum
values. Not production tested.
The reference input of the internal amplifier is capable of rail-to-rail operation.
DS21896C-page 6
 2004-2013 Microchip Technology Inc.
MCP1630/MCP1630V
AC/DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise noted, VIN = 3.0V to 5.5V, FOSC = 1 MHz with 10% Duty Cycle, CIN = 0.1 µF,
VIN for typical values = 5.0V, TA = -40°C to +125°C.
Parameters
Sym
Min
Typ
Max
Units
Conditions
Maximum Current Sense Signal
MCP1630
VCS_MAX
0.85
0.9
0.95
V
Delay From CS to VEXT
MCP1630
TCS_VEXT
—
12
25
ns
Maximum Current Sense Signal
MCP1630V
VCS_MAX
2.55
2.7
2.85
V
Delay From CS to VEXT
MCP1630V
TCS_VEXT
—
17.5
35
ns
Minimum Duty Cycle
DCMIN
—
—
0
%
VFB = VREF + 0.1V,
VCS = GND
Current Sense Input Bias Current
ICS_B
—
-0.1
—
µA
VIN = 5V
RDSON P-channel
RDSon_P
—
10
30

RDSON N-channel
RDSon_N
—
7
30

VEXT Rise Time
TRISE
—
5.9
18
ns
CL = 100 pF
Typical for VIN = 3V
VEXT Fall Time
TFALL
—
6.2
18
ns
CL = 100 pF
Typical for VIN = 3V
UVLO
2.7
—
3.0
V
VIN falling, VEXT low state when in
UVLO
mV
Current Sense Input
Set by maximum error amplifier
clamp voltage, divided by 3.
VIN > 4.25V
Maximum CS input range limited by
comparator input common mode
range. VCS_MAX = VIN-1.4V
Internal Driver
Protection Features
Under Voltage Lockout
Under Voltage Lockout Hysteresis UVLO HYS
50
75
150
Thermal Shutdown
TSHD
—
150
—
°C
TSHD_HYS
—
18
—
°C
Thermal Shutdown Hysteresis
Note 1:
2:
3:
Capable of higher frequency operation depending on minimum and maximum duty cycles needed.
External oscillator input (OSC IN) rise and fall times between 10 ns and 10 µs used for characterization testing. Signal
levels between 0.8V and 2.0V with rise and fall times measured between 10% and 90% of maximum and minimum
values. Not production tested.
The reference input of the internal amplifier is capable of rail-to-rail operation.
TEMPERATURE SPECIFICATIONS
Electrical Specifications: VIN = 3.0V to 5.5V, FOSC = 1 MHz with 10% Duty Cycle, CIN = 0.1 µF. TA = -40°C to +125°C.
Parameters
Sym
Min
Typ
Max
Units
Conditions
Temperature Ranges
Operating Junction Temperature Range
TA
-40
—
+125
°C
Storage Temperature Range
TA
-65
—
+150
°C
Maximum Junction Temperature
TJ
—
—
+150
°C
Thermal Resistance, 8L-DFN
(2 mm x 3 mm)
JA
—
50.8
—
°C/W
Typical 4-layer board with two
interconnecting vias
Thermal Resistance, 8L-MSOP
JA
—
208
—
°C/W
Typical 4-layer board
Steady state
Transient
Thermal Package Resistances
 2004-2013 Microchip Technology Inc.
DS21896C-page 7
MCP1630/MCP1630V
2.0
TYPICAL PERFORMANCE CURVES
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
TA = + 25°C
0
Input Voltage (V)
TA = - 40°C
TA = + 25°C
5M
0
10M
10000000
Frequency (Hz)
FIGURE 2-3:
Response.
DS21896C-page 8
Error Amplifier Frequency
5.5
5.25
5
4.75
4.5
-14
5.5
-14
1M
1000000
TA = - 40°C
-12
5.25
-12
-10
5
50
4.75
Phase
TA = + 25°C
-8
4.5
-10
TA = + 125°C
-6
4.25
100
-8
-4
4
-6
150
3.5
-4
200
VREF = 2V
RLOAD = 4.7 k
CLOAD = 67 pF
0
3.25
Amplifier Gain (db)
-2
Error Amplifier Sink Current
-2
3
250
Gain
0
FIGURE 2-5:
vs. Input Voltage.
Amplifier Source Current (mA)
Input Quiescent Current vs.
Amplifier Phase Shift
(degrees)
2
4.25
Input Voltage (V)
Input Voltage (V)
FIGURE 2-2:
Input Voltage.
4
TA = + 125°C
3.75
5.5
5.25
5
4.75
4.5
4.25
4
3.75
3.5
TA = + 25°C
18
16
14
12
10
8
6
4
2
0
3.5
TA = + 125°C
3
FOSC IN = 1 MHz
3.25
FIGURE 2-4:
Error Amplifier Input Bias
Current vs. Input Voltage.
3.25
Input Quiescent Current vs.
TA = - 40°C
5.5
Input Voltage (V)
Amplifier Sink Current (mA)
4.5
4
3.5
3
2.5
2
1.5
1
0.5
0
3
VIN Quiescent Current (mA)
FIGURE 2-1:
Input Voltage.
5.25
-100
5
TA = - 40°C
4.5
5.5
5.25
5
4.75
4.5
4.25
4
3.75
3.25
3.5
0
TA = + 85°C
100
4.75
0.5
200
4.25
1
300
4
1.5
400
3.75
TA = + 25°C
TA = + 125°C
500
3.75
TA = - 40°C
2
VCM = VIN
600
3.5
2.5
700
3.25
TA = + 125°C
3
3
FOSC IN = DC
Amplifier Input Bias Current
(pA)
3.5
3
VIN Quiescent Current (mA)
Note: Unless otherwise noted, VIN = 3.0V to 5.5V, FOSC = 1 MHz with 10% Duty Cycle, CIN = 0.1 µF, VIN for typical
values = 5.0V, TA = -40°C to +125°C.
Input Voltage (V)
FIGURE 2-6:
Error Amplifier Source
Current vs. Input Voltage.
 2004-2013 Microchip Technology Inc.
MCP1630/MCP1630V
10
9
8
7
6
5
4
3
2
1
0
0.9
CS Clamp Voltage (V)
CL = 100 pF
TA = + 125°C
TA = - 40°C
TA = + 25°C
TA = - 40°C
0.899
0.898
TA = + 125°C
0.897
TA = + 25°C
0.896
Input Voltage (V)
VEXT Rise Time vs. Input
UVLO Threshold (V)
TA = - 40°C
5.5
Turn Off Threshold
2.86
2.84
Input Voltage (V)
FIGURE 2-9:
Current Sense to VEXT
Delay vs. Input Voltage (MCP1630).
TA = + 125°C
8
6
TA = + 25°C
4
TA = - 40°C
2
5.5
5.25
5
4.75
0
4.5
5.5
5.25
5
4.75
4.5
4.25
4
3.75
3.5
0
10
4.25
5
12
4
TA = - 40°C
Undervoltage Lockout vs.
3.75
15
3.25
FIGURE 2-11:
Temperature.
3
TA = + 125°C
3
5.5
2.88
EXT Output N-Channel R DSON
(ohms)
25
CS to V EXT delay (ns)
5.25
2.90
-40 -25 -10 5 20 35 50 65 80 95 110 125
Ambient Temperature (°C)
VEXT Fall Time vs. Input
 2004-2013 Microchip Technology Inc.
5
2.92
Input Voltage (V)
TA = + 25°C
Turn On Threshold
2.94
3.5
5.25
5
4.75
4.5
4.25
4
3.75
3.5
3.25
TA = + 25°C
10
4.75
2.96
TA = + 125°C
20
4.5
FIGURE 2-10:
Current Sense Clamp
Voltage vs. Input Voltage (MCP1630).
CL = 100 pF
FIGURE 2-8:
Voltage.
4.25
Input Voltage (V)
3.25
9
8
7
6
5
4
3
2
1
0
3
VEXT Fall Time (ns)
FIGURE 2-7:
Voltage.
4
3.75
3.5
3.25
3
5.5
5.25
5
4.75
4.5
4.25
4
3.75
3.5
3.25
0.895
3
VEXT Rise Time (ns)
Note: Unless otherwise noted, VIN = 3.0V to 5.5V, FOSC = 1 MHz with 10% Duty Cycle, CIN = 0.1 µF, VIN for typical
values = 5.0V, TA = -40°C to +125°C.
Input Voltage (V)
FIGURE 2-12:
EXT Output N-channel
RDSON vs. Input Voltage.
DS21896C-page 9
MCP1630/MCP1630V
18
Maximum CS Input (V)
3
16
14
TA = + 125°C
12
10
8
6
TA = - 40°C
TA = + 25°C
4
2
CS Common Mode
Input Range
2.7
TA = +25°C
2.4
2.1
1.8
1.5
5.5
5
5.25
4.75
4.5
4.25
4
3.75
3.25
3.5
0
3
3
3.5
4
Input Voltage (V)
5
5.5
FIGURE 2-16:
Current Sense Common
Mode Input Voltage Range vs. Input Voltage
(MCP1630V).
0
30
CS to VEXT Delay (ns)
TA = + 125°C
-50
VCM IN = 0V
-100
-150
TA = + 25°C
-200
25
TA = +125°C
20
TA = -40°C
15
TA = +25°C
10
5
TA = - 40°C
5.5
5.25
5
4.75
4.5
4
3.75
3.5
3.25
5.5
5.25
5
4.75
4.5
4.25
4
3.75
3.5
3.25
3
0
-250
3
Error Amp Input Offset Voltage
(µV)
FIGURE 2-13:
EXT Output P-channel
RDSON vs. Input Voltage.
Input Voltage (V)
Input Voltage (V)
FIGURE 2-14:
Error Amplifier Input Offset
Voltage vs. Input Voltage.
FIGURE 2-17:
Current Sense to VEXT
Delay vs. Input Voltage (MCP1630V).
150
TA = + 125°C
100
50
VCM IN = 1.2V
0
-50
-100
TA = + 25°C
-150
TA = - 40°C
5.5
5.25
5
4.75
4.5
4.25
4
3.75
3.5
3.25
-200
3
Error Amp Input Offset Voltage
(µV)
4.5
Input Voltage (V)
4.25
EXT Output P-Channel R DSON
(Ohms)
Note: Unless otherwise noted, VIN = 3.0V to 5.5V, FOSC = 1 MHz with 10% Duty Cycle, CIN = 0.1 µF, VIN for typical
values = 5.0V, TA = -40°C to +125°C.
Input Voltage (V)
FIGURE 2-15:
Error Amplifier Input Offset
Voltage vs. Input Voltage.
DS21896C-page 10
 2004-2013 Microchip Technology Inc.
MCP1630/MCP1630V
3.0
MCP1630 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
DFN/MSOP
Name
1
COMP
2
FB
Error Amplifier Inverting Input
3
CS
Current Sense Input pin (MCP1630) or Voltage Ramp Input pin (MCP1630V)
4
OSC IN
Oscillator Input pin
5
GND
Circuit Ground pin
6
VEXT
External Driver Output pin
7
VIN
8
VREF
3.1
Function
Error Amplifier Output pin
Input Bias pin
Reference Voltage Input pin
Error Amplifier Output Pin (COMP)
COMP is an internal error amplifier output pin. External
compensation is connected from the FB pin to the
COMP pin for control-loop stabilization. An internal
voltage clamp is used to limit the maximum COMP pin
voltage to 2.7V (typ.). This clamp is used to set the
maximum peak current in the power system switch by
setting a maximum limit on the CS input for Peak
Current mode control systems.
3.2
Error Amplifier Inverting Input
(FB)
FB is an internal error amplifier inverting input pin. The
output (voltage or current) is sensed and fed back to
the FB pin for regulation. Inverting or negative
feedback is used.
3.3
Current Sensing Input (CS)
CS is the current sense input pin used for cycle-bycycle control for Peak Current mode converters. The
MCP1630 is typically used for sensed current
applications to reduce the current sense signal, thus
reducing power dissipation.
For Voltage mode or Average Current mode
applications, a ramp is used to compare the error
amplifier output voltage with producing the PWM duty
cycle. For applications that require higher signal levels,
the MCP1630V is used to increase the level from a
maximum of 0.9V (MCP1630) to 2.7V (MCP1630V).
The common mode voltage range for the MCP1630V
CS input is VIN-1.4V. For normal PWM operation, the
CS input should be less than or equal to VIN - 1.4V at
all times.
3.4
Oscillator Input (OSC)
OSC is an external oscillator input pin. Typically, a
microcontroller I/O pin is used to generate the OSC
input. When high, the output driver pin (VEXT) is driven
 2004-2013 Microchip Technology Inc.
low. The high-to-low transition initiates the start of a
new cycle. The duty cycle of the OSC input pin determines the maximum duty cycle of the power converter.
For example, if the OSC input is low for 75% of the time
and high for 25% of the time, the duty cycle range for
the power converter is 0% to 75% maximum.
3.5
Ground (GND)
Connect the circuit ground to the GND pin. For most
applications, this should be connected to the analog or
quiet ground plane. Noise on this ground can affect the
sensitive cycle-by-cycle comparison between the CS
input and the error amplifier output.
3.6
External Driver Output Pin (VEXT)
VEXT is an external driver output pin, used to determine
the power system duty cycle. For high-power or highside drives, this output should be connected to the logiclevel input of the MOSFET driver. For low-power, lowside applications, the VEXT pin can be used to directly
drive the gate of an N-channel MOSFET.
3.7
Input Bias Pin (VIN)
VIN is an input voltage pin. Connect the input voltage
source to the VIN pin. For normal operation, the voltage
on the VIN pin should be between +3.0V and +5.5V. A
0.1 µF bypass capacitor should be connected between
the VIN pin and the GND pin.
3.8
Reference Voltage Input (VREF)
VREF is an external reference input pin used to regulate
the output of the power system. By changing the VREF
input, the output (voltage or current) of the power system can be changed. The reference voltage can range
from 0V to VIN (rail-to-rail).
DS21896C-page 11
MCP1630/MCP1630V
4.0
DETAILED DESCRIPTION
4.1
Device Overview
The MCP1630 is comprised of a high-speed comparator, high-bandwidth amplifier and logic gates that can
be combined with a PIC MCU to develop an advanced
programmable power supply. The oscillator and reference voltage inputs are generated by the PIC MCU so
that switching frequency, maximum duty cycle and output voltage are programmable. Refer to Figure 4-1.
4.2
PWM
The VEXT output of the MCP1630/V is determined by
the output level of the internal high-speed comparator
and the level of the external oscillator. When the oscillator level is high, the PWM output (VEXT) is forced low.
When the external oscillator is low, the PWM output is
determined by the output level of the internal highspeed comparator. During UVLO, the VEXT pin is held
in the low state. During overtemperature operation, the
VEXT pin is high-impedance (100 k to ground).
4.3
Normal Cycle by Cycle Control
The beginning of a cycle is defined when OSC IN transitions from a high state to a low state. For normal operation, the state of the high-speed comparator output
(R) is low and the Q output of the latch is low. On the
OSC IN high-to-low transition, the S and R inputs to the
high-speed latch are both low and the Q output will
remain unchanged (low). The output of the OR gate
(VDRIVE) will transition from a high state to a low state,
turning on the internal P-channel drive transistor in the
output stage of the PWM. This will change the PWM
output (VEXT) from a low state to a high state, turning
on the power-train external switch and ramping current
in the power-train magnetic device.
The sensed current in the magnetic device is fed into
the CS input (shown as a ramp) and increases linearly.
Once the sensed current ramp (MCP1630) reaches the
same voltage level as 1/3 of the EA output, the comparator output (R) changes states (low-to-high) and resets
the PWM latch. The Q output transitions from a low
state to a high state, turning on the N-channel MOSFET
in the output stage, which turns off the VEXT drive to the
external MOSFET driver terminating the duty cycle.
The OSC IN will transition from a low state to a high
state while the VEXT pin remains unchanged. If the CS
input ramp had never reached the same level as 1/3 of
the error amplifier output, the low-to-high transition on
OSC IN would terminate the duty cycle and this would
be considered maximum duty cycle. In either case,
while OSC IN is high, the VEXT drive pin is low, turning
off the external power-train switch. The next cycle will
start on the transition of the OSC IN pin from a high
state to a low state.
DS21896C-page 12
For Voltage mode or Average Current mode applications that utilize a large signal ramp at the CS input, the
MCP1630V is used to provide more signal (2.7V typ.).
The operation of the PWM does not change.
4.4
Error Amp/Comparator Current
Limit Function
The internal amplifier is used to create an error output
signal that is determined by the external VREF input and
the power supply output fed back into the FB pin. The
error amplifier output is rail-to-rail and clamped by a
precision 2.7V. The output of the error amplifier is then
divided down 3:1 (MCP1630) and connected to the
inverting input of the high-speed comparator. Since the
maximum output of the error amplifier is 2.7V, the maximum input to the inverting pin of the high-speed comparator is 0.9V. This sets the peak current limit for the
switching power supply.
For the MCP1630V, the maximum error amplifier output is still 2.7V. However, the resistor divider is
removed, raising the maximum input signal level at the
high-speed comparator inverting input (CS) to 2.7V.
As the output load current demand increases, the error
amplifier output increases, causing the inverting input
pin of the high-speed comparator to increase.
Eventually, the output of the error amplifier will hit the
2.7V clamp, limiting the input of the high-speed comparator to 0.9V max (MCP1630). Even if the FB input
continues to decrease (calling for more current), the
inverting input is limited to 0.9V. By limiting the inverting
input to 0.9V, the current-sense input (CS) is limited to
0.9V, thus limiting the output current of the power
supply.
For Voltage mode control, the error amplifier output will
increase as input voltage decreases. A voltage ramp is
used instead of sensed inductor current at the CS input
of the MCP1630V. The 3:1 internal error amplifier output resistor divider is removed in the MCP1630V option
to increase the maximum signal level input to 2.7V
(typ.).
4.5
0% Duty Cycle Operation
The duty cycle of the VEXT output is capable of reaching 0% when the FB pin is held higher than the VREF pin
(inverting error amplifier). This is accomplished by the
rail-to-rail output capability of the error amplifier and the
offset voltage of the high-speed comparator. The minimum error amplifier output voltage, divided by three, is
less than the offset voltage of the high-speed comparator. In the case where the output voltage of the converter is above the desired regulation point, the FB
input will be above the VREF input and the error amplifier will be pulled to the bottom rail (GND). This low
voltage is divided down 3:1 by the 2R and 1R resistor
(MCP1630) and connected to the input of the highspeed comparator. This voltage will be low enough so
that there is no triggering of the comparator, allowing
narrow pulse widths at VEXT.
 2004-2013 Microchip Technology Inc.
MCP1630/MCP1630V
4.6
Undervoltage Lockout (UVLO)
When the input voltage (VIN) is less than the UVLO
threshold, the VEXT is held in the low state. This will
ensure that, if the voltage is not adequate to operate
the MCP1630/V, the main power supply switch will be
held in the off state. When the UVLO threshold is
exceeded, there is some hysteresis in the input voltage
prior to the UVLO off threshold being reached. The
typical hysteresis is 75 mV. Typically, the MCP1630 will
not start operating until the input voltage at VIN is
between 3.0V and 3.1V.
 2004-2013 Microchip Technology Inc.
4.7
Overtemperature Protection
To protect the VEXT output if shorted to VIN or GND, the
MCP1630/V VEXT output will be high-impedance if the
junction temperature is above the thermal shutdown
threshold. There is an internal 100 k pull-down resistor connected from VEXT to ground to provide some
pull-down during overtemperature conditions. The
protection is set to 150°C (typ.), with a hysteresis of
18°C.
DS21896C-page 13
MCP1630/MCP1630V
MCP1630 High-Speed PWM Timing Diagram
OSC IN
S
COMP
CS
R
Q
VDRIVE
VEXT
VIN
VIN
Overtemperature
0.1 µA
UVLO
VEXT
OSC IN
Note
S
VIN
GND
Q
0.1 µA
100 k
CS
+
Comp
–
COMP
R
Q
Latch Truth Table
VIN
FB
–
VREF EA
+
2R
R
2.7V Clamp
Note:
FIGURE 4-1:
DS21896C-page 14
S
R
Q
0
0
Qn
0
1
1
1
0
0
1
1
1
During overtemperature, VEXT driver is high-impedance.
Cycle-by-Cycle Timing Diagram (MCP1630).
 2004-2013 Microchip Technology Inc.
MCP1630/MCP1630V
MCP1630V High-Speed PWM Timing Diagram
OSC IN
S
COMP
CS
R
Q
VDRIVE
VEXT
VIN
VIN
Overtemperature
0.1 µA
UVLO
VEXT
OSC IN
VDRIVE
Note
S
VIN
GND
Q
0.1 µA
100 k
CS
+
Comp
–
COMP
R
Q
Latch Truth Table
VIN
FB
VREF
–
EA
+
2.7V Clamp
Note:
During overtemperature, VEXT driver is high-impedance.
FIGURE 4-2:
Cycle-by-Cycle Timing Diagram (MCP1630V).
 2004-2013 Microchip Technology Inc.
S
R
Q
0
0
Qn
0
1
1
1
0
0
1
1
1
DS21896C-page 15
MCP1630/MCP1630V
5.0
5.1
APPLICATION
CIRCUITS/ISSUES
Typical Applications
The MCP1630/V high-speed PWM can be used for any
circuit topology and power-train application when
combined with a microcontroller. Intelligent, costeffective power systems can be developed for applications that require multiple outputs, multiple phases,
adjustable outputs, temperature monitoring and
calibration.
5.2
NiMH Battery Charger Application
A typical NiMH battery charger application is shown in
the “Typical Application Circuit – MCP1630” of this
data sheet. In that example, a Single-Ended Primary
Inductive Converter (SEPIC) is used to provide a
constant charge current to the series-connected
batteries. The MCP1630 is used to regulate the charge
current by monitoring the current through the battery
sense resistor and providing the proper pulse width.
5.3
Bidirectional Power Converter
A bidirectional Li-Ion charger/buck regulator is shown
in the “Typical Application Circuit” of the this data
sheet. In this example, a synchronous, bidirectional
power converter example is shown using the
MCP1630V. In this application, when the ac-dc input
power is present, the bidirectional power converter is
used to charge 4-series Li-Ion batteries by boosting the
input voltage. When ac-dc power is removed, the
bidirectional power converter bucks the battery voltage
down to provide a dc bus for system power. By using
this method, a single power train is capable of charging
4-series cell Li-Ion batteries and efficiently converting
the battery voltage down to a low, usable voltage.
5.4
Multiple Output Converters
By using additional MCP1630 devices, multiple output
converters can be developed using a single MCU. If a
two-output converter is desired, the MCU can provide
two PWM outputs that are phased 180° apart. This will
reduce the input ripple current to the source and
eliminate beat frequencies.
The PIC16F818 monitors the battery voltage to provide
a termination to the charge current. Additional features
(trickle charge, fast charge, overvoltage protection,
etc.) can be added to the system using the programmability of the microcontroller and the flexibility of the
MCP1630.
DS21896C-page 16
 2004-2013 Microchip Technology Inc.
MCP1630/MCP1630V
6.0
PACKAGING INFORMATION
6.1
Package Marking Information
Example:
1630E
522256
8-Lead MSOP
XXXXX
YWWNNN
Example:
1630VE
522256
8-Lead DFN (2 mm x 3 mm)
XXX
YWW
NN
Example:
ABC
522
25
For DFN samples, contact your Microchip Sales Office for availability..
Legend: XX...X
Y
YY
WW
NNN
e3
*
Note:
Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
 2004-2013 Microchip Technology Inc.
DS21896C-page 17
MCP1630/MCP1630V
8-Lead Plastic Micro Small Outline Package (MS) (MSOP)
Note:
For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
E
E1
p
D
2
B
n
1
α
A2
A
c
φ
A1
(F)
L
β
Units
Dimension Limits
n
p
MIN
INCHES
NOM
8
.026 BSC
.033
.193 TYP.
.118 BSC
.118 BSC
.024
.037 REF
.006
.012
-
MAX
MILLIMETERS*
NOM
8
0.65 BSC
0.75
0.85
0.00
4.90 BSC
3.00 BSC
3.00 BSC
0.40
0.60
0.95 REF
0°
0.08
0.22
5°
5°
-
MIN
Number of Pins
Pitch
A
.043
Overall Height
.037
A2
Molded Package Thickness
.030
A1
.006
Standoff
.000
E
Overall Width
E1
Molded Package Width
D
Overall Length
L
Foot Length
.016
.031
Footprint (Reference)
F
φ
Foot Angle
0°
8°
c
Lead Thickness
.003
.009
B
Lead Width
.009
.016
α
Mold Draft Angle Top
5°
15°
β
Mold Draft Angle Bottom
5°
15°
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed .010" (0.254mm) per side.
MAX
1.10
0.95
0.15
0.80
8°
0.23
0.40
15°
15°
JEDEC Equivalent: MO-187
Drawing No. C04-111
DS21896C-page 18
 2004-2013 Microchip Technology Inc.
MCP1630/MCP1630V
8-Lead Plastic Dual Flat No Lead Package (MC) 2x3x0.9 mm Body (DFN) – Saw Singulated
Note:
For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
For DFN samples, contact your Microchip Sales Office for availability..
p
D
b
n
L
E
E2
EXPOSED
METAL
PAD
PIN 1
ID INDEX
AREA
(NOTE 2)
2
1
D2
BOTTOM VIEW
TOP VIEW
A
A1
A3
EXPOSED
TIE BAR
(NOTE 1)
Units
Dimension Limits
n
p
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Length
Exposed Pad Length
Overall Width
Exposed Pad Width
Contact Width
Contact Length
(Note 3)
(Note 3)
A
A1
A3
D
D2
E
E2
b
L
MIN
INCHES
NOM
MAX
8
.031
.000
.055
.047
.008
.012
.020 BSC
.035
.001
.008 REF.
.079 BSC
.065
.118 BSC
.059
.010
.016
MILLIMETERS*
NOM
8
0.50 BSC
0.80
0.90
0.00
0.02
0.20 REF.
2.00 BSC
1.65
1.39
3.00 BSC
1.50
1.20
0.20
0.25
0.30
0.40
MIN
.039
.002
.067
.061
.012
.020
MAX
1.00
0.05
1.70
1.55
0.30
0.50
*Controlling Parameter
Notes:
1. BSC: Basic Dimension. Theoretically exact value shown without tolerances.
See ASME Y14.5M
2. REF: Reference Dimension, usually without tolerance, for information purposes only.
See ASME Y14.5M
Exposed pad varies according to die attach paddle size.
Package may have one or more exposed tie bars at ends.
Pin 1 visual index feature may vary, but must be located within the hatched area.
JEDEC equivalent: M0-229
Drawing No. C04-123, Revised 05-05-05
 2004-2013 Microchip Technology Inc.
DS21896C-page 19
MCP1630/MCP1630V
NOTES:
DS21896C-page 20
 2004-2013 Microchip Technology Inc.
MCP1630/MCP1630V
APPENDIX A:
REVISION HISTORY
Revision C (January 2013)
• Added a note to each package outline drawing.
Revision B (June 2005)
The following is the list of modifications:
1.
2.
3.
Added
MCP1630V
device
information
throughout data sheet
Added DFN package information throughout
data sheet.
Added Appendix A: Revision History.
Revision A (June 2004)
• Original Release of this Document.
 2004-2013 Microchip Technology Inc.
DS21896C-page 21
MCP1630/MCP1630V
NOTES:
DS21896C-page 22
l
 2004-2013 Microchip Technology Inc.
MCP1630/MCP1630V
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
X
/XX
Device
Temperature
Range
Package
Device:
MCP1630:
High-Speed, Microcontroller-Adaptable,
PWM
MCP1630T: High-Speed, Microcontroller-Adaptable,
PWM (Tape and Reel)
Examples:
a)
b)
c)
a)
Temperature Range:
E
= -40°C to +125°C
Package:
MC *= Dual Flat, No Lead (2x3mm Body), 8-lead
MS = Plastic MSOP, 8-lead
b)
c)
MCP1630-E/MS:
Extended Temperature,
8LD MSOP package.
MCP1630T-E/MS: Tape and Reel
Extended Temperature,
8LD MSOP package.
MCP1630-E/MC: Extended Temperature,
8LD DFN package.
MCP1630V-E/MS: Extended Temperature,
8LD MSOP package.
MCP1630VT-E/MS: Tape and Reel
Extended Temperature,
8LD MSOP package.
MCP1630V-E/MC: Extended Temperature,
8LD DFN package.
* For DFN samples, contact your Microchip Sales Office for
availability.
 2004-2013 Microchip Technology Inc.
DS21896C-page 23
MCP1630/MCP1630V
NOTES:
DS21896C-page 24
 2004-2013 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,
PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash
and UNI/O are registered trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MTP, SEEVAL and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
Analog-for-the-Digital Age, Application Maestro, BodyCom,
chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB
Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O,
Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA
and Z-Scale are trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
GestIC and ULPP are registered trademarks of Microchip
Technology Germany II GmbH & Co. & KG, a subsidiary of
Microchip Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2004-2013, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 9781620769140
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
 2004-2013 Microchip Technology Inc.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
DS21896C-page 25
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
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Corporate Office
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Technical Support:
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China - Hangzhou
Tel: 86-571-2819-3187
Fax: 86-571-2819-3189
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
China - Hong Kong SAR
Tel: 852-2943-5100
Fax: 852-2401-3431
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
China - Shenzhen
Tel: 86-755-8864-2200
Fax: 86-755-8203-1760
Taiwan - Kaohsiung
Tel: 886-7-213-7828
Fax: 886-7-330-9305
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Taiwan - Taipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
DS21896C-page 26
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Japan - Tokyo
Tel: 81-3-6880- 3770
Fax: 81-3-6880-3771
11/29/12
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