TI ADS8512IDWR 12-bit, 40-ksps, low power sampling analog-to-digital converter with internal reference and serial interface Datasheet

ADS8512
www.ti.com ...................................................................................................................................................................................................... SLAS485 – JUNE 2008
12-Bit, 40-kSPS, Low Power Sampling ANALOG-TO-DIGITAL CONVERTER
with Internal Reference and Serial Interface
FEATURES
APPLICATIONS
• 40-kHz Minimum Sampling Rate
• Very Low Power: 25 mW
• ±3.33-V, ±5-V, ±10-V, 4-V, and 10-V Input
Ranges
• 73.9-dB SINAD with 10-kHz Input
• ±0.5 LSB Max INL
• ±0.5 LSB Max DNL, 12-Bit NMC
• ±5-mV BPZ, ±2 ppm/°C BPZ Drift
• 72-dB Min SINAD, 80-dB Min SFDR
• Uses Internal or External 2.5-V Reference
• No External Calibration Resistors Required
• Single 5-V Analog Supply:
– 32.5-mW Max Power Dissipation
– 50-µW Max Power-Down Mode
• SPI™-Compatible Serial Port up to 20MHz,
with Master/Slave Feature
• Global CONV and 3-Stated Bus for Multi-Chip
Simultaneous S/H Operation
• Pin-Compatible with ADS7812 and 16-Bit
ADS7813/8513
• SO-16 Package
•
•
•
•
•
•
1
234
Industrial Process Control
Test Equipment
Robotics
DSP Servo Control
Medical Instrumentation
Portable Data Acquisition Systems
DESCRIPTION
The ADS8512 is a complete low-power, single 5-V
supply, 12-bit sampling analog-to-digital (A/D)
converter.
It
contains
a
complete
12-bit
capacitor-based, successive approximation register
(SAR) A/D converter with sample-and-hold (S/H),
clock, reference, and serial data interface. The
converter can be configured for a variety of input
ranges including ±10 V, ±5 V, 0 V to 10 V, and 0.5 V
to 4.5 V. A high-impedance, 0.3-V to 2.8-V input is
also available with input impedance greater than 10
MΩ. For most input ranges, the input voltage can
swing to 25 V or –25 V without damage to the
converter.
An SPI-compatible serial interface allows data to be
synchronized to an internal or external clock. The
ADS8512 is specified at 40-kHz sampling rate over
the –40°C to +85°C industrial temperature range.
Successive Approximation Register
Clock
EXT/INT
CDAC
40 kW
R1IN
8 kW
R2IN
20 kW
R3IN
Comparator
Serial
Data
Out
and
Control
PWRD
BUSY
CS
CONV
SDATA
DATACLK
BUF
CAP
Buffer
4 kW
REF
Internal
+2.5 V Ref
1
2
3
4
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
TMS320 is a trademark of Texas Instruments.
SPI is a trademark of Motorola, Inc.
All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2008, Texas Instruments Incorporated
ADS8512
SLAS485 – JUNE 2008 ...................................................................................................................................................................................................... www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
PACKAGE/ORDERING INFORMATION (1)
PRODUCT
MINIMUM
INL
(LSB)
NO
MISSING
CODES
MINIMUM
SINAD
(dB)
SPECIFIED
TEMPERATURE
RANGE
PACKAGELEAD
PACKAGE
DESIGNATOR
ADS8512IB
±0.5
12
72
-40°C to +85°C
SO-16
DW
ADS8512I
±1
12
70
-40°C to +85°C
SO-16
DW
(1)
ORDERING
NUMBER
TRANSPORT
MEDIA, QUANTITY
ADS8512IBDW
Tube, 20
ADS8512IBDWR
Tape and Reel, 1000
ADS8512IDW
Tube, 20
ADS8512IDWR
Tape and Reel, 1000
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
ABSOLUTE MAXIMUM RATINGS (1) (2)
Over operating free-air temperature range (unless otherwise noted).
PARAMETER
Analog inputs
Ground voltage differences
UNIT
R1IN
±25 V
R2IN
±25 V
R3IN
±25 V
REF
VS + 0.3 V to GND – 0.3 V
GND
±0.3 V
VS
6V
Digital inputs
–0.3 V to VS + 0.3 V
Maximum junction temperature
+165°C
Storage temperature range
–65°C to +150°C
Internal power dissipation
700 mW
Lead temperature (soldering, 1,6 mm from case, 10 seconds)
+260°C
(1)
(2)
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to absolute
maximum conditions for extended periods may affect device reliability.
All voltage values are with respect to network ground terminal.
ELECTRICAL CHARACTERISTICS
At TA = -40°C to +85°C, fS = 40 kHz, VS = 5 V, and using internal reference and fixed resistors, unless otherwise specified.
ADS8512I
PARAMETER
TEST CONDITIONS
MIN
TYP
Resolution
ADS8512IB
MAX
MIN
TYP
12
MAX
12
UNIT
Bits
ANALOG INPUT
Voltage ranges
See Table 1
See Table 1
V
Impedance
See Table 1
See Table 1
kΩ
Capacitance
45
45
pF
THROUGHPUT SPEED
Conversion time
Complete cycle
Throughput rate
2
Acquire and convert
40
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20
20
25
25
40
µs
µs
kHz
Copyright © 2008, Texas Instruments Incorporated
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ELECTRICAL CHARACTERISTICS (continued)
At TA = -40°C to +85°C, fS = 40 kHz, VS = 5 V, and using internal reference and fixed resistors, unless otherwise specified.
ADS8512I
PARAMETER
TEST CONDITIONS
ADS8512IB
MIN
TYP
MAX
MIN
TYP
MAX
UNIT
DC ACCURACY
INL
Integral linearity error
–1
±0.1
1
–0.5
±0.1
0.5
LSB (1)
DNL
Differential linearity error
–1
±0.1
1
–0.5
±0.1
0.5
LSB
No missing codes
12
Transition noise (2)
12
0.05
Gain error
±0.2
Full scale error (3) (4)
-0.5
Full scale error drift
External 2.5-V reference
Full scale error drift
External 2.5-V reference
Bipolar zero error (3)
Bipolar ranges
Bipolar zero error drift
Bipolar ranges
Unipolar zero error (3)
Unipolar ranges
Unipolar zero error drift
Unipolar ranges
Recovery time to rated accuracy from
power down (5)
1-µF capacitor to CAP
Power-supply sensitivity
+4.75 V < VS < +5.25 V
–0.5
–0.25
0.5
–0.25
10
0.25
–5
5
–6
%
ppm/°C
±2
6
%
ppm/°C
±0.5
±2
–6
%
0.25
±10
±0.5
–10
LSB
±0.1
0.5
±10
Full scale error (3) (4)
Bits
0.05
mV
ppm/°C
6
mV
±3
±3
ppm/°C
300
300
µs
±0.75
±0.75
LSB
AC ACCURACY
SFDR
Spurious-free dynamic range
fIN = 1 kHz, ±10 V
THD
Total harmonic distortion
fIN = 1 kHz, ±10 V
SINAD
Signal-to-(noise+distortion)
SNR
Signal-to-noise
fIN = 1 kHz, ±10 V
80
70
–60 dB input
80
–80
74
72
30
70
dB (6)
98
–98
–80
74
dB
32
dB
130
130
kHz
600
600
kHz
Aperture delay
40
40
ns
Aperture jitter
20
20
(7)
Full-power bandwidth (–3 dB)
74
72
dB
74
Usable bandwidth
fIN = 1 kHz, ±10 V
98
–96
SAMPLING DYNAMICS
Transient response
FS step
5
Overvoltage recovery (8)
ps
5
750
750
µs
ns
REFERENCE
Internal reference voltage
No load
2.48
(6)
(7)
(8)
2.48
2.5
2.52
V
1
µA
Internal reference drift
8
8
ppm/°C
External reference current drain
(5)
2.52
1
External reference voltage range for
specified linearity
(1)
(2)
(3)
(4)
2.5
Internal reference source current (must
use external buffer)
2.3
External 2.5-V reference
2.5
2.7
100
2.3
2.5
2.7
V
100
µA
LSB means least significant bit. 1 LSB for the ±10 V input range is 305 µV.
Typical rms noise at worst-case transitions.
As measured with fixed resistors. Adjustable to zero with external potentiometer.
Full-scale error is the worst case of –Full Scale or +Full Scale deviation from ideal first and last code transitions, divided by the full-scale
range; includes the effect of offset error. Tested at –40°C to +85°C.
Time delay after the ADS8512 is brought out of Power-Down mode until all internal settling occurs and the analog input is acquired to
rated accuracy. A Convert command after this delay yields accurate results.
All specifications in dB are referred to a full-scale input.
Usable bandwidth defined as full-scale input frequency at which Signal-to-(Noise + Distortion) degrades to 60 dB.
Recovers to specified performance after 2 x FS input overvoltage.
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ELECTRICAL CHARACTERISTICS (continued)
At TA = -40°C to +85°C, fS = 40 kHz, VS = 5 V, and using internal reference and fixed resistors, unless otherwise specified.
ADS8512I
PARAMETER
TEST CONDITIONS
MIN
TYP
ADS8512IB
MAX
MIN
–0.3
+0.8
2.0
VS + 0.3
TYP
MAX
UNIT
–0.3
+0.8
V
2.0
DIGITAL INPUTS
VIL
Low-level input voltage
VIH
High-level input voltage
VS + 0.3
V
IIL
Low-level input current
VIL = 0 V
±10
±10
µA
IIH
High-level input current
VIH = 5 V
±10
±10
µA
0.4
V
DIGITAL OUTPUTS
Data format - Serial
Data coding - binary 2s complement
VOL
Low-level output voltage
ISINK = 1.6 mA
VOH
High-level output voltage
ISOURCE = 500 µA
0.4
Leakage current
High-Z state,
VOUT = 0 V to VS
±1
±1
µA
Output capacitance
High-Z state
15
15
pF
Bus access time
RL = 3.3 kΩ, CL = 50 pF
83
83
ns
Bus relinquish time
RL = 3.3 kΩ, CL = 10 pF
83
83
ns
4
4
V
DIGITAL TIMING
POWER SUPPLIES
VS
Analog voltage
IDIG
Digital current
IANA
Analog current
4.75
5
5.25
4.75
0.6
4.2
Power dissipation
VS = 5 V, fS = 40 kHz
24
PWRD
50
5
5.25
0.6
4.2
32.5
24
V
mA
mA
32.5
mW
µW
50
TEMPERATURE RANGE
θJA
Specified performance
–40
+85
–40
+85
°C
Derated performance
–55
+125
–55
+125
°C
Storage temperature
–65
+150
–65
+150
Thermal resistance
SO-16
46
46
°C
°C/W
Table 1. Input Ranges
ANALOG INPUT RANGE
CONNECT R1IN
TO
CONNECT R2IN
TO
CONNECT R3IN
TO
4
INPUT IMPEDANCE
(kΩ)
±10 V
VIN
BUF
GND
45.7
0.3125V to 2.8125 V
VIN
VIN
VIN
> 10,000
±5 V
GND
BUF
VIN
26.7
0 V to 10 V
BUF
GND
VIN
26.7
0 V to 4 V
BUF
VIN
GND
21.3
±3.33 V
VIN
BUF
VIN
21.3
0.5 V to 4.5 V
GND
VIN
GND
21.3
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PIN CONFIGURATION
DW PACKAGE
SO-16
(TOP VIEW)
R1IN 1
16 VS
GND 2
15 PWRD
R2IN 3
14 BUSY
R3IN 4
13 CS
BUF
12 CONV
5
CAP 6
11 EXT/INT
REF
10 DATA
7
GND 8
9 DATACLK
Terminal Functions
TERMINAL
DIGITAL
I/O
NAME
NO.
R1IN
1
Analog input. See Table 1 and Table 3.
DESCRIPTION
R2IN
3
Analog input. See Table 1 and Table 3.
R3IN
4
Analog input. See Table 1 and Table 3.
BUF
5
Reference buffer output. Connect to R1IN, R2IN, or R3IN as needed.
CAP
6
Reference buffer compensation node. Decouple to ground with a 1-µF tantalum capacitor in
parallel with a 0.01-µF ceramic capacitor.
REF
7
Reference input/output. Outputs internal 2.5-V reference via a series 4-kΩ resisitor. Decouple this
voltage with a 1-µF to 2.2-µF tantalum capacitor to ground. If an external reference voltage is
applied to this pin, it overrides the internal reference.
DATACLK
9
I/O
Data clock pin. With EXT/INT low, this pin is an output and provides the synchrnous clock for the
serial data. The output is 3-stated when CS is high. With EXT/INT high, this pin is an input and the
serial data clock must be provided externally.
DATA
10
O
Serial data output. The serial data are always the result of the last completed conversion and are
synchronized to DATACLK. If DATACLK is from the internal clock (EXT/INT low), the serial data
are valid on both the rising and falling edges of DATACLK. DATA is 3-stated when CS is high.
I
External/Internal DATACLK pin. Selects the source of the synchronous clock for serial data. if
high, the clock must be provided externally. If low, the clock is derived from the internal conversion
clock. Note that the clock used to time the conversion is always interna,l regardless of the status of
EXT/INT.
EXT/INT
11
CONV
12
CS
13
I
Chip select. This input 3-states all outputs when high, and enables all outputs when low, including
DATA, BUSY, and DATACLK (when EXT/INT is low). Note that a falling edge on CONV will initiate
a conversion even when CS is high.
BUSY
14
O
Busy output. When a conversion starts, BUSY goes low and remains low throughout the
conversion. If EXT/INT is low, data are serially transmitted while BUSY is low. BUSY is 3-stated
when CS is high.
I
Power down input. When high, the majority of the ADS8512 is placed in a low-power mode, and
power consumption is significantly reduced. CONV must be taken low before PWRD goes in order
to achieve the lowest power consumption. The time required for the ADS8512 to return to normal
operation after power down depends on a number of factors. Consult the Power-Down section for
more information.
Convert input. A falling edge on this input puts the internal sample/hold into the hold state and
starts a conversion regardless of the state of CS. If a conversion is already in progress, the falling
edge is ignored. If EXT/INT is low, data from the previous conversion will be serially transmitted
during the current conversion.
PWRD
15
GND
2, 8
Ground.
VS
16
+5-V supply input. For best performance, decouple to ground with a 0.1-µF ceramic capacitor in
parallel with a 10-µF tantalum capacitor.
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TYPICAL CHARACTERISTICS
POWER-SUPPLY CURRENT
vs
FREE-AIR TEMPERATURE
HISTOGRAM
6
0
2.52
Vref - Internal Reference Voltage - V
16384
Power Supply Current - mA
Bipolar Range,
VIN = 0 V in ±10 V
INTERNAL REFERENCE VOLTAGE
vs
FREE-AIR TEMPERATURE
5.5
5
4.5
2.51
2.5
2.49
0
FFF
000
4
-45 -25
001
-5
15
35
55
75
95
2.48
-45 -25
115
TA - Free Air Temperature - °C
115
Figure 1.
Figure 2.
Figure 3.
POWER-SUPPLY CURRENT
vs
SAMPLING FREQUENCY
BIPOLAR OFFSET ERROR
vs
FREE-AIR TEMPERATURE
BIPOLAR POSITIVE FULL-SCALE
ERROR
vs
FREE-AIR TEMPERATURE
6
9
0.5
5.5
5
4.5
0.4
6
-10 V to 10 V
0.3
Bipolar Error - %FSR
Bipolar Offset Error - mV
-10 V to 10 V
Power-Supply Current - mA
-5
15 35 55 75 95
TA - Free Air Temperature - °C
3
0
-3
0.2
0.1
0
-0.1
-0.2
-0.3
-0.4
4
10
20
30
fS - Sampling Frequency - kHz
-6
-45
40
-0.5
-45 -25
115
-5 15 35 55 75 95
TA - Free Air Temperature - °C
115
Figure 5.
Figure 6.
BIPOLAR NEGATIVE FULL-SCALE
ERROR
vs
FREE-AIR TEMPERATURE
BIPOLAR OFFSET ERROR
vs
FREE-AIR TEMPERATURE
BIPOLAR POSITIVE FULL-SCALE
ERROR
vs
FREE-AIR TEMPERATURE
5
-10 V to 10 V
4
0.2
-5 V to 5 V
-5 V to 5 V
0.15
Bipolar Offset Error - mV
0.3
0.2
0.1
0
-0.1
-0.2
3
2
1
0
-1
-2
-3
-0.4
-4
-5 15
35 55 75 95
TA - Free Air Temperature - °C
115
Figure 7.
0.1
0.05
0
-0.05
-0.1
-0.3
-0.5
-45 -25
Bipolar Error - %FSR
0.4
Bipolar Error - %FSR
-5 15 35 55 75 95
TA - Free Air Temperature - °C
Figure 4.
0.5
6
-25
-5
-45 -25
-0.15
-5 15 35 55 75 95
TA - Free Air Temperature - °C
115
Figure 8.
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-0.2
-45
-25
-5 15 35
55 75
95 115
TA - Free Air Temperature - °C
Figure 9.
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TYPICAL CHARACTERISTICS (continued)
BIPOLAR NEGATIVE FULL-SCALE
ERROR
vs
FREE-AIR TEMPERATURE
UNIPOLAR POSITIVE FULL-SCALE
ERROR
vs
FREE-AIR TEMPERATURE
UNIPOLAR OFFSET ERROR
vs
FREE-AIR TEMPERATURE
0.2
2
-5 V to 5 V
0.15
1.5
0.4
0 V to 4 V
0 V to 4 V
Bipolar Error - %FSR
0.1
0.05
0
-0.05
1
Unipolar Error - %FSR
Unipolar Offset Error - mV
0.3
0.5
0
-0.5
-0.1
-1
0.2
0.1
0
-0.1
-0.15
-1.5
-0.2
-45
-25
-5 15 35 55 75 95
TA - Free Air Temperature - °C
-2
-45 -25
115
15
35
55
75
95
-25
-5
15
35
55
75
95
115
TA - Free Air Temperature - °C
Figure 10.
Figure 11.
Figure 12.
UNIPOLAR OFFSET ERROR
vs
FREE-AIR TEMPERATURE
UNIPOLAR POSITIVE FULL-SCALE
ERROR
vs
FREE-AIR TEMPERATURE
SPURIOUS FREE DYNAMIC RANGE
vs
FREE-AIR TEMPERATURE
0.5
100
SFDR - Spurious Free Dynamic Range - dB
0.4
0 V to 10 V
0 V to 10 V
0.3
Unipolar Error - %FSR
6
3
0
-3
0.2
0.1
0
-0.1
-0.2
-0.3
-0.4
-6
-45 -25
-5
15 35 55 75 95
TA - Free Air Temperature - °C
-0.5
-45
115
-25
-5 15 35 55 75 95
TA - Free Air Temperature - °C
115
99
98
97
96
95
94
93
92
91
90
-45 -25
-5
15
35
55
75
95
115
TA - Free Air Temperature - °C
Figure 13.
Figure 14.
Figure 15.
TOTAL HARMONIC DISTORTION
vs
FREE-AIR TEMPERATURE
SIGNAL-TO-NOISE RATIO
vs
FREE-AIR TEMPERATURE
SIGNAL-TO-NOISE + DISTORTION
vs
FREE-AIR TEMPERATURE
75
-91
74.5
-92
-93
-94
-95
-96
-97
-98
74
73.5
73
72.5
72
71.5
71
70.5
-99
-100
-45 -25
75
SINAD - Signal-to-Noise + Distortion - dB
-90
SNR - Signal to Noise Ratio - dB
THD - Total Harmonic Distortion - dB
-0.2
-45
115
TA - Free Air Temperature - °C
9
Unipolar Offset Error - mV
-5
-5
15
35
55
75
95
115
TA - Free Air Temperature - °C
Figure 16.
70
-45 -25
-5
15
35
55
75
95
TA - Free Air Temperature - °C
Figure 17.
115
74.5
74
73.5
73
72.5
72
71.5
71
70.5
70
-45 -25
-5
15
35
55
75
95
Figure 18.
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TA - Free Air Temperature - °C
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TYPICAL CHARACTERISTICS (continued)
SIGNAL-TO-NOISE + DISTORTION
vs
FREQUENCY
SIGNAL-TO-NOISE + DISTORTION
vs
FREE-AIR TEMPERATURE
75
90
80
0 dB
70
60
-20 dB
50
40
30
20
-60 dB
10
0
0
2
4
6
8
10 12 14 16 18
20
80
Fs = 10 KHz
74
73
Fs = 30 KHz
Fs = 40 KHz
72
71
78
70
-45 -25
76
74
72
70
68
66
64
62
Input Frequency: 10 KHz, 0 dB
60
-5
15
35
55
75
95
115
1
Figure 20.
Figure 21.
SIGNAL-TO-NOISE + DISTORTION
vs
FREQUENCY
SPURIOUS FREE DYNAMIC RANGE
vs
FREQUENCY
TOTAL HARMONIC DISTORTION
vs
FREQUENCY
74
72
70
68
66
64
62
60
1
10
100
fi - Frequency - kHz
THD - Total Harmonic Distortion - dB
76
-60
100
SFDR - Spurious Free Dynamic Range - dB
78
95
90
85
80
75
70
65
60
-70
-75
-80
-85
-90
-95
-100
1
1000
-65
10
100
fi - Frequency - kHz
1000
1
10
100
fi - Frequency - kHz
Figure 22.
Figure 23.
Figure 24.
SPURIOUS FREE DYNAMIC RANGE
vs
ESR
TOTAL HARMONIC DISTORTION
vs
ESR
SIGNAL-TO-NOISE RATIO
vs
ESR
75
-91
74.5
98
97
96
95
94
93
92
91
1
2
3
4
5
6
7
8
Reference Capacitor ESR - W
9
10
Figure 25.
SNR - Signal to Noise Ratio - dB
-90
99
THD - Total Harmonic Distortion - dB
100
90
0
1000
Figure 19.
80
SFDR - Spurious Free Dynamic Range - dB
10
100
fi - Input Frequency - kHz
TA - Free Air Temperature - °C
fi - Frequency - kHz
SINAD - Signal-to-Noise + Distortion - dB
Fs = 20 KHz
SNR - Signal to Noise Ratio - dB
SINAD - Signal-to-Noise + Distortion - dB
SINAD - Signal-to-Noise + Distortion - dB
100
8
SIGNAL-TO-NOISE RATIO
vs
FREQUENCY
-92
-93
-94
-95
-96
-97
-98
74
73.5
73
72.5
72
71.5
71
70.5
-99
-100
0
1000
70
1
2
3
4
5
6 7 8
9
Reference Capacitor ESR - W
Figure 26.
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10
0
1
2
3
4
5 6
7
8 9
Reference Capacitor ESR - W
10
Figure 27.
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TYPICAL CHARACTERISTICS (continued)
OUTPUT REJECTION
vs
POWER-SUPPLY RIPPLE
FREQUENCY
CONVERSION TIME
vs
FREE-AIR TEMPERATURE
12
-25
11.95
-30
74
11.9
-35
73.5
Output Rejection - dB
75
74.5
11.85
73
t - Time - ms
SINAD - Signal-to-Noise + Distortion - dB
SIGNAL-TO-NOISE + DISTORTION
vs
ESR
72.5
72
11.8
11.75
11.7
-40
-45
-50
-55
71.5
11.65
71
11.6
-65
70.5
11.55
-70
70
0
1
2
3
4
5
6
7
8
Reference Capacitor ESR - W
9
10
11.5
-45
-25
-75
100
-5 15 35
55 75 95 115
TA - Free Air Temperature - °C
Figure 28.
-60
1k
Figure 29.
INL
100k
10k
f - Frequency - Hz
1M
Figure 30.
0.3
INL - LSBs
0.2
0.1
0
-0.1
-0.2
-0.3
0
512
1024
1536
2048
2560
3072
3584
4096
Code
Figure 31.
DNL
0.3
DNL - LSBs
0.2
0.1
0
-0.1
-0.2
-0.3
0
512
1024
1536
2048
2560
3072
3584
4096
Code
Figure 32.
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TYPICAL CHARACTERISTICS (continued)
FFT
-10
8192 Point FFT,
fS = 40 kHz,
fIN = 20 kHz at 0 dB
Amplitude - dB
-30
-50
-70
-90
-110
-130
0
5
10
f - Frequency - kHz
15
20
Figure 33.
FFT
-10
Amplitude - dB
-30
8192 Point FFT,
fS = 40 kHz,
fIN = 10 kHz at 0 dB
-50
-70
-90
-110
-130
0
5
10
f - Frequency - kHz
15
20
Figure 34.
FFT
-10
8192 Point FFT,
fS = 40 kHz,
fIN = 1 kHz at 0 dB
Amplitude - dB
-30
-50
-70
-90
-110
-130
0
5
10
f - Frequency - kHz
15
20
Figure 35.
10
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BASIC OPERATION
INTERNAL DATACLK
Figure 36 shows a basic circuit to operate the ADS8512 with a ±10-V input range. To begin a conversion and
serial transmission of the results from the previous conversion, a falling edge must be provided to the CONV
input. BUSY goes low to indicate that a conversion has started, and stays low until the conversion is complete.
During the conversion, the results of the previous conversion are transmitted via DATA while DATACLK provides
the synchronous clock for the serial data. The data format is 12-bit, binary twos complement, MSB first. Each
data bit is valid on both the rising and falling edge of DATACLK. BUSY is low during the entire serial
transmission and can be used as a frame synchronization signal.
C2
C1
0.1 µF 10 µF
ADS8512
±10 V
C3
1 µF
+
C4
0.01 µF
C5
1 µF
+
1
R1IN
VS 16
2
GND
PWRD 15
3
R2IN
BUSY 14
4
R3IN
CS 13
5
BUF
CONV 12
6
CAP
EXT/INT 11
7
REF
DATA
10
8
GND
DATACLK
9
+5 V
+
Frame Sync (optional)
Convert Pulse
40 ns min
Figure 36. Basic Operating Circuit, ±10-V Input Range, Internal DATACLK
EXTERNAL DATACLK
Figure 37 shows another basic circuit to operate the ADS8512 with a ±10-V input range. To begin a conversion,
a falling edge must be provided to the CONV input. BUSY goes low to indicate that a conversion has started and
stays low until the conversion is complete. Just before BUSY rises near the end of the conversion, the
conversion result held in the internal working register is transferred to the internal shift register.
The internal shift register is clocked via the DATACLK input. The recommended method of reading the
conversion result is to provide the serial clock after the conversion has completed. See the External DATACLK
subsection under the Reading Data section of this data sheet for more information.
ADS8512
±10 V
C3
1 µF
+
C4
0.01 µF
C5
1 µF
+
1
R1IN
VS 16
2
GND
PWRD 15
3
R2IN
BUSY 14
4
R3IN
CS 13
5
BUF
CONV 12
6
CAP
EXT/INT 11
7
REF
DATA
10
8
GND
DATACLK
9
C2
C1
0.1 µF 10 µF
+
+5 V
Interrupt (optional)
Chip Select (optional(1))
Convert Pulse
+5 V
40 ns min
External Clock
NOTE: (1) Tie CS to GND if the outputs will always be active.
Figure 37. Basic Operating Circuit, ±10-V Input Range, External DATACLK
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STARTING A CONVERSION
If a conversion is not currently in progress, a falling edge on the CONV input places the sample and hold into the
hold mode and begins a conversion, as shown in Figure 38 according to the timing shown in Table 2. During the
conversion, the CONV input is ignored. Starting a conversion does not depend on the state of CS. A conversion
can be started once every 25 µs (40-kHz maximum conversion rate). There is no minimum conversion rate.
t1
t2
t3
t4
t5
CONV
t6
t7
BUSY
t8
t10
t9
MODE
Acquire
t11
Convert
Acquire
Convert
Figure 38. Basic Conversion Timing
Table 2. Conversion and Data Timing, TA = –40°C to +85°C
SYMBOL
12
MAX
UNIT
t1
Conversion plus acquisition time
DESCRIPTION
MIN
TYP
25
µs
t2
CONV low to all digital inputs stable
19
µs
t3
CONV low to initiate a conversion
12
µs
t4
BUSY rising to any digital input active
5
t5
CONV high before start of conversion (CONV high time)
15
t6
BUSY low
12
15
µs
t7
CONV low to BUSY low
12
20
ns
t8
Aperture delay (CONV falling edge to actual conversion start)
5
t9
Conversion time
12
t10
Conversion complete to BUSY rising
90
t11
Acquisition time
t12
CONV low to rising edge of first internal DATACLK
t13
Internal DATACLK high
300
355
425
ns
t14
Internal DATACLK low
300
355
425
ns
t15
Internal DATACLK period
0.6
0.71
0.85
µs
t16
DATA valid to internal DATACLK rising
150
204
ns
t17
Internal DATACLK falling to DATA not valid
150
208
ns
t18
Falling edge of last DATACLK to BUSY rising
1.78
µs
t19
External DATACLK rising to DATA not valid
2
12
t20
External DATACLK rising to DATA valid
4
14
t21
External DATACLK high
15
ns
t22
External DATACLK low
15
ns
t23
External DATACLK period
35
ns
t24
CONV low to external DATACLK active
15
t25
External DATACLK low or CS high to BUSY rising
t26
CS low to digital outputs enabled
15
ns
t27
CS high to digital outputs disabled
15
ns
0.04
ns
ns
ns
15
ns
13.5
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µs
µs
µs
2
ns
20
ns
ns
5
µs
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Even though the CONV input is ignored while a conversion is in progress, this input should be held static during
the conversion period. Transitions on this digital input can easily couple into sensitive analog portions of the
converter, adversely affecting the conversion results (see the Sensitivity to External Digital Signals section of this
data sheet for more information).
Ideally, the CONV input should go low and remain low throughout the conversion. It should return high sometime
after BUSY goes high. In addition, it should be high before the start of the next conversion for a minimum time
period given by t5. This period ensures that the digital transition on the CONV input does not affect the signal that
is acquired for the next conversion.
An acceptable alternative is to return the CONV input high as soon after the start of the conversion as possible.
For example, a negative going pulse 100ns wide would make a good CONV input signal. It is strongly
recommended that from time t2 after the start of a conversion until BUSY rises, the CONV input should be held
static (either high or low). During this time, the converter is more sensitive to external noise.
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READING DATA
The ADS8512 digital output is in binary twos complement (BTC) format. Table 3 shows the relationship between
the digital output word and the analog input voltage under ideal conditions.
Table 3. Output Codes and Ideal Input Voltages
DIGITAL OUTPUT
BINARY TWOS COMPLEMENT
DESCRIPTION
ANALOG INPUT
Full-scale range
±10
Least significant bit (LSB)
+Full-Scale (FS - 1LSB)
Midscale
One LSB below midscale
-Full-Scale-
BINARY CODE
HEX CODE
7FF
0.5 V to 4.5 V
4.88 mV
0.98 mV
9.99512 V
4.49902 V
0111 1111 1111
0V
2.5 V
0000 0000 0000
000
-4.88 mV
2.49902 mV
1111 1111 1111
FFF
-10 V
0.5 V
1000 0000 0000
800
Figure 39 shows the relationship between the various digital inputs, digital outputs, and internal logic of the
ADS8512. Figure 40 illustrates when the internal shift register of the ADS8512 is updated and how this relates to
a single conversion cycle. Together, these two figures highlight very important aspect of the ADS8512: the
conversion result is not available until after the conversion is complete. The implications of this constraint
are discussed in the following sections.
CONV
t25
t6 – t25
BUSY
NOTE: Update of the internal shift register occurs in the
shaded region. If EXT/INT is HIGH, then DATACLK
must be LOW or CS must be HIGH during this time.
Figure 39. Timing of the Shift Register Update
t1
CONV
BUSY
t13
t12
t15
DATACLK
1
2
t16
3
t18
10
11
12
Bit 2
Bit 1
LSB
1
t14
t17
DATA
MSB
Bit 10
Bit 9
MSB
Figure 40. Serial Data Timing, Internal Clock (EXT/INT and CS Low)
14
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Internal DATACLK
With EXT/INT tied low, the result from conversion n is serially transmitted during conversion n+1, as shown in
Figure 41, with the timing given in Table 2. Serial transmission of data occurs only during a conversion. When a
transmission is not in progress, DATA and DATACLK are low.
Converter Core
REF
CDAC
CONV
Clock
Control Logic
BUSY
Each flip-flop in the
working register is
latched as the
conversion proceeds
Working Register
D
Q
D
Q
D
Q
D
Q
D
Q
•••
W0
W1
W2
W14
W15
Update of the shift
register occurs just prior
to BUSY rising (1)
Shift Register
D
Q
D
Q
D
Q
D
Q
D
Q
D
DATA
Q
EXT/INT
S0
S1
S2
S14
S15
SOUT
Delay
DATACLK
CS
NOTE: (1) If EXT/INT is HIGH (external clock), DATACLK is HIGH, and CS is LOW during
this time, the shift register will not be updated and the conversion result will be lost.
Figure 41. Block Diagram of the ADS8512 Digital Inputs and Outputs
During the conversion, the results of the previous conversion are transmitted via DATA, while DATACLK
provides the synchronous clock for the serial data. The data format is 12-bit, binary twos complement, MSB first.
Each data bit is valid on both the rising and falling edges of DATACLK. BUSY is low during the entire serial
transmission and can be used as a frame synchronization signal.
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External DATACLK
With EXT/INT tied high, the result from conversion n is clocked out after the conversion has completed, during
the next conversion (n+1), or a combination of these two. Figure 42 shows the case of reading the conversion
result after the conversion is complete. Figure 43 describes reading the result during the next conversion.
Figure 44 combines the important aspects of Figure 42 and Figure 43 for reading part of the result after the
conversion is complete and the balance during the next conversion.
The serial transmission of the conversion result is initiated by a rising edge on DATACLK. The data format is
12-bit, binary twos complement, MSB first. Each data bit is valid on the falling edge of DATACLK. In some cases,
it might be possible to use the rising edge of the DATACLK signal. However, one extra clock period (not shown
in Figure 42, Figure 43, and Figure 44) is needed for the final bit.
The external DATACLK signal must be low or CS must be high before BUSY rises (see time t25 in Figure 43 and
Figure 44). If this limit is not observed during this time, the output shift register of the ADS8512 is not updated
with the conversion result. Instead, the previous contents of the shift register remain and the new result is lost.
Before reading the next three paragraphs, consult the Sensitivity to External Digital Signals section of this data
sheet. That section explains many of the concerns regarding how and when to apply the external DATACLK
signal.
External DATACLK Active After the Conversion
The preferred method of obtaining the conversion result is to provide the DATACLK signal after the conversion
has been completed and before the next conversion starts, as shown in Figure 42. Note that the DATACLK
signal should be static before the start of the next conversion. If this limit is not observed, the DATACLK signal
could affect the voltage that is acquired.
t1
t5
CONV
BUSY
t21
t4
DATACLK
t23
1
2
3
t19
4
10
11
12
t22
t20
DATA
MSB
Bit 10
Bit 9
Bit 2
Bit 1
LSB
Figure 42. Serial Data Timing, External Clock, Clocking After the Conversion Completes (EXT/INT High,
CS Low)
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External DATACLK Active During the Next Conversion
Another method of obtaining the conversion result is shown in Figure 43. Because the output shift register is not
updated until the end of the conversion, the previous result remains valid during the next conversion. If a fast
clock (≥ 2MHz) can be provided to the ADS8512, the result can be read during time t2. During this time, the noise
from the DATACLK signal is less likely to affect the conversion result.
t1
t2
CONV
BUSY
t21
t24
t23
DATACLK
1
2
3
t19
t25
4
11
12
1
t22
t20
DATA
MSB
Bit 10
Bit 9
Bit 1
LSB
MSB
Figure 43. Serial Data Timing, External Clock, Clocking During the Next Conversion (EXT/INT High, CS
Low)
External DATACLK Active After the Conversion and During the Next Conversion
Figure 44 shows a method that combines the two previous approaches. This method works very well for
microcontrollers that do serial transfers 8 bits at a time and for slower microcontrollers. For example, if the fastest
serial clock that the microcontroller can produce is 1 µs, the approach shown in Figure 42 would result in a
diminished throughput (26-kHz maximum conversion rate). The method described in Figure 43 could not be used
without risk of affecting the conversion result (the clock would have to be active after time t2). Therefore, the
approach in Figure 44 results in an improved throughput rate (33 kHz maximum with a 1-µs clock), and
DATACLK is not active after time t2.
CONV
BUSY
t5
t24
t4
DATACLK
DATA
1
2
MSB
n
Bit 10
t25
n+1
Bit n
Bit n-1
11
12
Bit 1
LSB
Figure 44. Serial Data Timing, External Clock, Clocking After the Conversion Completes and During the
Next Conversion (EXT/INT High, CS Low)
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CHIP SELECT
The CS input allows the digital outputs of the ADS8512 to be disabled and gates the external DATACLK signal
when EXT/INT is high. See Figure 45 for the enable and disable time associated with CS and Figure 41 for a
block diagram of the ADS8512 logic. The digital outputs can be disabled at any time.
CS
t26
BUSY, DATA,
DATACLK (1)
t27
HI-Z
Active
HI-Z
NOTE: (1) DATACLK is an output only when EXT/INT is LOW.
Figure 45. Enable and Disable Timing for Digital Outputs
Note that a conversion is initiated on the falling edge of CONV even if CS is high. If the EXT/INT input is low
(internal DATACLK) and CS is high during the entire conversion, the previous conversion result is lost (that is,
the serial transmission occurs but DATA and DATACLK are disabled).
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ANALOG INPUT
The ADS8512 offers a number of input ranges. This set of options is accomplished by connecting the three input
resistors to either the analog input (VIN), to ground (GND), or to the 2.5-V reference buffer output (BUF). Table 1
shows the input ranges that are typically used in most data acquisition applications. These ranges are all
specified to meet the specifications given in the Electrical Characteristics table. Table 4 contains a complete list
of ideal input ranges, associated input connections, and comments regarding the range.
Table 4. Complete list of Ideal Input Ranges
ANALOG
INPUT
RANGE (V)
CONNECT
R1IN
TO
CONNECT
R2IN
TO
CONNECT
R3IN
TO
INPUT
IMPEDANCE
(kΩ)
0.3125 to 2.8125
VIN
–0.417 to 2.916
VIN
VIN
VIN
> 10,000
VIN
BUF
26.7
0.417 to 3.750
VIN cannot go below GND – 0.3V
VIN
VIN
GND
26.7
Offset and gain not specified
±3.333
VIN
BUF
VIN
21.3
Specified offset and gain
–15 to 5
VIN
BUF
BUF
45.7
Offset and gain not specified
±10
VIN
BUF
GND
45.7
Specified offset and gain
0.833 to 7.5
VIN
GND
VIN
21.3
Offset and gain not specified
–2.5 to 17.5
VIN
GND
BUF
45.7
Offset and gain not specified
2.5 to 22.5
VIN
GND
GND
45.7
Offset and gain not specified
0 to 2.857
BUF
VIN
VIN
45.7
Offset and gain not specified
–1 to 3
BUF
VIN
BUF
21.3
VIN cannot go below GND – 0.3V
0 to 4
BUF
VIN
GND
21.3
Specified offset and gain
–6.25 to 3.75
BUF
BUF
VIN
26.7
Offset and gain not specified
0 to 10
BUF
GND
VIN
26.7
Specified offset and gain
0.357 to 3.214
GND
VIN
VIN
45.7
Offset and gain not specified
–0.5 to 3.5
GND
VIN
BUF
21.3
VIN cannot go below GND – 0.3V
0.5 to 4.5
GND
VIN
GND
21.3
Specified offset and gain
±5
GND
BUF
VIN
26.7
Specified offset and gain
1.25 to 11.25
GND
GND
VIN
26.7
Offset and gain not specified
COMMENT
Specified offset and gain
+15 V
2.2 mF
22 pF
ADS8512
GND
R1IN
100 nF
2 kW
Pin 7
2 kW
GND
Pin 1
Pin 2
VIN
22 pF
OPA627
or
OPA132
+
Pin 3
Pin 4
GND
R3IN
R2IN
Pin 6
BUF
2.2 mF
CAP
GND
REF
1 mF
100 nF
2.2 mF
GND
GND
-15 V
GND
Figure 46. Typical Driving Circuit (±10 V, No Trim)
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The input impedance results from the various connections and the internal resistor values (refer to the block
diagram on the front page of this data sheet). The internal resistor values are typical and can change by ±30%
as a result of process variations. However, the ratio matching of the resistors is considerably better than this
range. Thus, the input range only varies a few tenths of a percent from part to part, while the input impedance
can vary up to ±30%.
The Electrical Characteristics table contains the maximum limits for the variation of the analog input range, but
only for those ranges where the comment field shows that the offset and gain are specified (including all the
ranges listed in Table 1). For the other ranges, the offset and gain are not tested and are not specified.
Three of the input ranges in Table 4 are not recommended for general use. These input ranges involve the
connection at R2IN being driven below GND. This input has a reverse-biased ESD protection diode connection to
ground. If R2IN is taken below GND – 0.3V, this diode will be forward-biased and will clamp the negative input at
–0.4V to –0.7V, depending on the temperature. Since the negative full-scale value of these input ranges exceed
–0.4V, they are not recommended.
Note that Table 4 assumes that the voltage at the REF pin is +2.5V. This assumption is true if the internal
reference is being used or if the external reference is +2.5V. Other reference voltages change the values
inTable 4.
HIGH IMPEDANCE MODE
When R1IN, R2IN, and R3IN are connected to the analog input, the input range of the ADS8512 is 0.3125 V to
2.8125 V and the input impedance is greater than 10 MΩ. This input range can be used to connect the ADS8512
directly to a wide variety of sensors. Figure 47 shows the impedance of the sensor versus the change in INL and
DNL of the ADS8512. The performance of the ADS8512 can be improved for higher sensor impedance by
allowing more time for acquisition. For example, 10 µs of acquisition time approximately doubles sensor
impedance for the same INL/DNL performance.
The input impedance and capacitance of the ADS8512 are very stable over temperature. Assuming that this
performance is true of the sensor as well, the graph shown in Figure 47 will vary less than a few percent over the
ensured temperature range of the ADS8512. If the sensor impedance varies significantly with temperature, the
worst-case impedance should be used.
LINEARITY ERROR vs SOURCE IMPEDANCE
10
TA = +25°C
Acquisition Time = 5 µs
Change in Worst-Case
Linearity Error (LSBs)
9
DNL
8
7
6
INL
5
4
3
2
1
0
0
1
2
3
4
5
6
7
8
9 10 11 12 13 14 15
External Source Impedance (kW)
Figure 47. Linearity Error vs Source Impedance in High Impedance Mode (R1IN = R2IN = R3IN = VIN)
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DRIVING THE ADS8512 ANALOG INPUT
In general, any reasonably fast, high-quality operational or instrumentation amplifier can be used to drive the
ADS8512 input. When the converter enters the acquisition mode, there is some charge injection from the
converter input to the amplifier output. This charge injection can result in inadequate settling time with slower
amplifiers. Be very careful with single-supply amplifiers, particularly if their output is required to swing very close
to the supply rails.
In addition, be careful with regard to the amplifier linearity. The outputs of single-supply and rail-to-rail amplifiers
can saturate as the outputs approach the supply rails. Rather than the amplifier transfer function being a straight
line, the curve can become severely S-shaped. Also, watch for the point where the amplifier switches from
sourcing current to sinking current. For some amplifiers, the transfer function can be noticeably discontinuous at
this point, causing a significant change in the output voltage for a much smaller change on the input.
Texas Instruments manufactures a wide variety of operational and instrumentation amplifiers that can be used to
drive the input of the ADS8512. These include the OPA627, OPA132, and INA110.
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ADS8512
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REFERENCE
The ADS8512 can be operated with its internal 2.5-V reference or an external reference. By applying an external
reference voltage to the REF pin, the internal reference voltage is overdriven. The voltage at the REF input is
internally buffered by a unity gain buffer. The output of this buffer is present at the BUF and CAP pins.
REF
The REF pin is the output of the internal 2.5-V reference or the input for an external reference. A 1-µF to 2.2-µF
tantulum capacitor should be connected between this pin and ground. The capacitor should be placed as close
to the ADS8512 as possible.
When using the internal reference, the REF pin should not be connected to any type of significant load. An
external load will cause a voltage drop across the internal 4-kΩ resistor that is in series with the internal
reference. Even a 40-MΩ external load to ground will cause a decrease in the full-scale range of the converter by
6 LSBs.
The range for the external reference is 2.3 V to 2.7 V. The voltage on REF determines the full-scale range of the
converter and the corresponding LSB size. Increasing the reference voltage increases the LSB size in relation to
the internal noise sources which, in turn, can improve signal-to-noise ratio. Likewise, decreasing the reference
voltage reduces the LSB size and signal-to-noise ratio.
CAP
The CAP pin is used to compensate the internal reference buffer. A 1-µF tantalum capacitor in parallel with a
0.01-µF ceramic capacitor should be connected between this pin and ground, with the ceramic capacitor placed
as close to the ADS8512 as possible. The total value of the capacitance on the CAP pin is critical to optimum
performance of the ADS8512. A value larger than 2.0 µF could overcompensate the buffer while a value lower
than 0.5 µF may not provide adequate compensation. The equivalent series resistance (ESR) of these
compensation capacitors is also critical. Keep the total ESR under 3 Ω. See Figure 25 through Figure 28 for how
the worst-case INL is affected by ESR.
BUF
The voltage on the BUF pin is the output of the internal reference buffer. This pin is used to provide +2.5 V to the
analog input or inputs for the various input configurations. The BUF output can provide up to 1 mA of current to
an external load. The load should be constant because a variable load could affect the conversion result by
modulating the BUF voltage. Also note that the BUF output shows significant glitches as each bit decision is
made during a conversion. Between conversions, the BUF output is quiet.
22
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POWER DOWN
The ADS8512 has a power-down mode that is activated by taking CONV low and then PWRD high. This mode
will power down all of the analog circuitry including the reference, reducing power dissipation to under 50 µW. To
exit the power-down mode, CONV is taken high and then PWRD is taken low. Note that a conversion is initiated
if PWRD is taken high while CONV is low.
While in the power-down mode, the voltage on the capacitors connected to CAP and REF begins to leak off. The
voltage on the CAP capacitor leaks off much more rapidly than on the REF capacitor (the REF input of the
ADS8512 becomes high-impedance when PWRD is high—this is not true for the CAP input). When exiting
power-down mode, these capacitors must be allowed to recharge and settle to a 12-bit level. Figure 48 shows
the amount of time typically required to obtain a valid 12-bit result based on the amount of time spent in power
down (at room temperature). This figure assumes that the total capacitance on the CAP pin is 1.01 µF.
Figure 49 shows a circuit that can significantly reduce the power-up time if the power down time is fairly brief (a
few seconds or less). A low on-resistance MOSFET is used to disconnect the capacitance on the CAP pin from
the leakage paths internal to the ADS8512. This disconnection allows the capacitors to retain the respecetive
charges for a much longer period of time, reducing the time required to recharge them at power-up. With this
circuit, the power-down time can be extended to tens or hundreds of milliseconds with almost instantaneous
power-up.
Power-Up Time to Rated Accuracy (µs)
POWER-DOWN TO POWER-UP RESPONSE
300
TA = +25°C
250
200
150
100
50
0
0.1
1
10
100
Power-Down Duration (ms)
Figure 48. Power-Down to Power-Up Response
1RF7604
+
1 µF
ADS8512
1
8
1
R1IN
VS 16
2
7
2
GND
PWRD 15
3
6
3
R2IN
BUSY 14
4
5
4
R3IN
CS 13
5
BUF
CONV 12
6
CAP
EXT/INT 11
7
REF
DATA
10
8
GND
DATACLK
9
0.01 µF
Power-Down Signal
Figure 49. Improved Power-Up Response Circuit
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ADS8512
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LAYOUT
POWER FOR SO-16 PACKAGE
For optimum performance, tie the analog and digital power pins to the same +5-V power supply and tie the
analog and digital grounds together. As noted in the Electrical Characteristics table, the ADS8512 uses 90% of
its power for the analog circuitry. The ADS8512 should be considered as an analog component.
The +5-V power for the A/D converter should be separate from the +5 V used for the system digital logic.
Connecting +VS directly to a digital supply can reduce converter performance due to switching noise from the
digital logic. For best performance, the +5-V supply can be produced from whatever analog supply is used for the
rest of the analog signal conditioning. If +12-V or +15-V supplies are present, a simple +5-V regulator can be
used. Although it is not suggested, if the digital supply must be used to power the converter, be sure to properly
filter the supply. Either using a filtered digital supply or a regulated analog supply, VS should be tied to the same
+5-V source.
GROUNDING
All the ground pins of the A/D converter should be tied to an analog ground plane (separated from the system
digital logic ground) to achieve optimum performance. Both analog and digital ground planes should be tied to
the system ground as close to the power supplies as possible. This layout helps to prevent dynamic digital
ground currents from modulating the analog ground through a common impedance to power ground.
SIGNAL CONDITIONING
The FET switches used for the sample-and-hold on many CMOS A/D converters release a significant amount of
charge injection that can cause the driving op amp to oscillate. The amount of charge injection due to the
sampling FET switch on the ADS8512 is approximately 5% to 10% of the amount on similar A/D converters with
the charge redistribution digital-to-analog converter (DAC) CDAC architecture. There is also a resistive front-end
that attenuates any released charge. The end result is a minimal requirement for the drive capability on the
signal conditioning preceding the A/D converter. Any op amp sufficient for the signal in an application is sufficient
to drive the ADS8512.
The resistive front-end of the ADS8512 also provides a specified ±25-V overvoltage protection. In most cases,
this architecture eliminates the need for external over-voltage protection circuitry.
SENSITIVITY TO EXTERNAL DIGITAL SIGNALS
All successive approximation register-based A/D converters are sensitive to external sources of noise. For the
ADS8512 and similar A/D converters, this noise most often originates because of the transition of external digital
signals. While digital signals that run near the converter can be the source of the noise, the biggest problem
occurs with the digital inputs to the converter itself.
In many cases, the system designer may not be aware that there is a problem or a potential for a problem. For a
12-bit system, these problems typically occur at the least significant bits and only at certain places in the
converter transfer function. For a 12-bit converter, the problem can be much easier to spot.
For example, the timing diagram in Figure 38 shows that the CONV signal should return high sometime during
time t2. In fact, the CONV signal can return high at any time during the conversion. However, after time t2, the
transition of the CONV signal has the potential of creating a good deal of noise on the ADS8512 die. If this
transition occurs at just precisely the wrong time, the conversion results could be affected. In a similar manner,
transitions on the DATACLK input could affect the conversion result.
For the ADS8512, there are 12 separate bit decisions that are made during the conversion. The most significant
bit decision is made first, proceeding to the least significant bit at the end of the conversion. Each bit decision
involves the assumption that the bit being tested should be set. This action is combined with the result that has
been achieved so far. The converter compares this combined result with the actual input voltage. If the combined
result is too high, the bit is cleared. If the result is equal to or lower than the actual input voltage, the bit remains
high. This effect is why the basic architecture is referred to as a successive approximation register (SAR).
24
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If the result so far is getting very close to the actual input voltage, then the comparison involves two voltages that
are very close together. The ADS8512 has been designed so that the internal noise sources are at a minimum
just before the comparator result is latched. However, if an external digital signal transitions at this time, a great
deal of noise will be coupled into the sensitive analog section of the ADS8512. Even if this noise produces a
difference between the two voltages of only 2 mV, the conversion result will be off by 52 counts or least
significant bits (LSBs). (The internal LSB size of the ADS8512 is 38 µV, regardless of the input range.)
Once a digital transition has caused the comparator to make a wrong bit decision, the decision cannot be
corrected (unless some type of error correction is employed). All subsequent bit decisions will then be wrong.
Figure 50 shows a successive approximation process that has gone wrong. The dashed line represents what the
correct bit decisions should have been. The solid line represents the actual result of the conversion.
External Noise
SAR Operation after
Wrong Bit Decision
Actual Input
Voltage
Converter
Full-Scale
Input Voltage
Range
Proper SAR Operation
Internal DAC
Voltage
Wrong Bit Decision Made Here
t
Conversion Clock
Conversion Start
(Hold Mode)
1
1
0
0
0
0
Incorrect Result
(1
0
1
1
0
1)
Correct Result
Figure 50. SAR Operation When External Noise Affects the Conversion
Keep in mind that the time period when the comparator is most sensitive to noise is fairly small. Also, the peak
portion of the noise event produced by a digital transition is fairly brief, because most digital signals transition in a
few nanoseconds. The subsequent noise may last for a period of time longer than this and may induce further
effects that require a longer settling time. However, in general, the event is over within a few tens of
nanoseconds.
For the ADS8512, error correction is done when the tenth bit is decided. During this bit decision, it is possible to
correct limited errors that may have occurred during previous bit decisions. However, after the tenth bit, no such
correction is possible. Note that for the timing diagrams shown in Figure 38, Figure 40, Figure 42, Figure 43, and
Figure 44 all external digital signals should remain static from 8 µs after the start of a conversion until BUSY
rises. The tenth bit is decided approximately 10 µs to 11 µs into the conversion.
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ADS8512
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APPLICATION INFORMATION
AVERAGING
Converter noise can be compensated by averaging the digital codes. By averaging conversion results, transition
noise is reduced by a factor of 1/√Hz where n is the number of averages. For example, averaging four
conversion results reduces the transition noise (TN) by 1/2 to 0.4 LSBs. Averaging should only be used for input
signals with frequencies near dc.
For ac signals, a digital filter can be used to low-pass filter and decimate the output codes. This action works in a
similar manner to averaging: for every decimation by 2, the signal-to-noise ratio improves 3 dB.
ADS8512 AS AN SPI MASTER DEVICE (INT/EXT TIED LOW)
Figure 51 shows a simple interface between the ADS8512 and an SPI-equipped microcontroller or TMS320
series digital signal processor (DSP) when using the internal serial data clock. This interface assumes that the
microcontroller or DSP is configured as an SPI slave, is capable of receiving 12-bit transfers, and that the
ADS8512 is the only serial peripheral on the SPI bus.
ADS8512
Microcontroller
TOUT
CONV
SS
BUSY
MOSI
SDATA
SCLK
DATACLK
EXT/INT
SPI Slave
CS
SPI Master
NOTE: CPOL = 0 (inactive SCLK is LOW)
CPHA = 0 or 1 (data valid on either SCLK edge)
Figure 51. ADS8512 as SPI Master
To maintain synchronization with the ADS8512, the microcontroller slave select (SS) input should be connected
to the BUSY output of the ADS8512. When a transition from high-to-low occurs on BUSY (indicating the current
conversion is in process), the ADS8512 internal SCLK begins shifting the previous conversion data into the
MOSI pin of the microcontroller. In this scenario, the CONV input to the ADS8512 can be controlled from an
external trigger source, or a trigger generated by the microcontroller. The ADS8512 internal SCLK provides
150ns (min) of setup and hold timing on the SDATA output, allowing the microcontroller to sample data on either
the rising or falling edge of SCLK.
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ADS8512 AS AN SPI SLAVE DEVICE (INT/EXT TIED HIGH)
Figure 52 shows another interface between the ADS8512 and an SPI-equipped microcontroller or DSP in which
the host processor acts as an SPI master device.
ADS8512
Microcontroller
TOUT
CONV
INT
BUSY
MOSI
SDATA
SCLK
DATACLK
VS
EXT/INT
CS
SPI Master
SPI Slave
NOTE: CPOL = 0 (inactive SCLK is LOW)
CPHA = 1 (data valid on SCLK falling edge)
Figure 52. ADS8512 as SPI Slave
In this configuration, the data transfer from the ADS8512 is triggered by the rising edge of the serial data clock
provided by the SPI master. The SPI interface should be configured to read valid SDATA on the falling edge of
SCLK. As noted in the EXTERNAL DATACLK section of this datasheet, when a minimum of 13 SCLKs are
provided to the ADS8512, data can be strobed to the host processor on the rising SCLK edge providing a 2ns
(min) hold time.
When using an external interrupt to facilitate serial data transfers, as shown in Figure 52, there are two options
for the configuration of the interrupt service routine (ISR): falling-edge-triggered or rising-edge-triggered.
A falling-edge-triggered transfer would initiate an SPI transfer after the falling edge of BUSY, providing the host
controller with the previous conversion results, while the current conversion cycle is underway. The timing for this
type of interface is described in detail in Figure 43. Care must be taken to ensure the entire 12-bit conversion
result is retrieved from the ADS8512 before BUSY returns high to avoid the potential corruption of the current
conversion cycle (consult the Sensitivity to External Digital Signals section of this data sheet).
A rising-edge-triggered transfer is the preferred method of obtaining the conversion results. This timing is
depicted in Figure 42. This method of obtaining data ensures that SCLK is static during the conversion cycle and
provides the host processor with current cycle conversion results.
8-BIT SPI INTERFACE
For microcontrollers that only support 8-bit SPI transfers, it is recommended to configure the ADS8512 for SPI
slave operation, as depicted in Figure 52. With the microcontroller configured as the SPI master, two 8-bit
transfers are required to obtain full 12-bit conversion results from the ADS8512. The eight MSBs of the
conversion result are considered valid on the falling SCLK edges of the first transfer, with the remaining four
LSBs being valid on the first four falling SCLK edges in the second transfer.
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PACKAGE OPTION ADDENDUM
www.ti.com
23-Jun-2008
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
ADS8512IBDW
ACTIVE
SOIC
DW
16
ADS8512IBDWR
ACTIVE
SOIC
DW
16
ADS8512IDW
ACTIVE
SOIC
DW
16
ADS8512IDWR
ACTIVE
SOIC
DW
16
40
Lead/Ball Finish
MSL Peak Temp (3)
Green (RoHS &
no Sb/Br)
Call TI
Level-2-260C-1 YEAR
2000 Green (RoHS &
no Sb/Br)
Call TI
Level-2-260C-1 YEAR
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
40
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
20-Jun-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
ADS8512IDWR
Package Package Pins
Type Drawing
SOIC
DW
16
SPQ
Reel
Reel
Diameter Width
(mm) W1 (mm)
2000
330.0
16.4
Pack Materials-Page 1
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
10.75
10.7
2.7
12.0
16.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
20-Jun-2008
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
ADS8512IDWR
SOIC
DW
16
2000
346.0
346.0
33.0
Pack Materials-Page 2
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