BSI Low Power/Voltage CMOS SRAM 512K X 8 bit BS62LV4005 GENERAL DESCRIPTION FEATURES • Vcc operation voltage : 4.5V ~ 5.5V • Low power consumption Vcc = 5.0V C-grade: 45mA (Max.) operating current I -grade: 50mA (Max.) operating current 1.5uA (Typ.) CMOS standby current • High speed access time : -70 70ns (Max.) at Vcc = 5.0V -55 55ns (Max.) at Vcc = 5.0V • Automatic power down when chip is deselected • Three state outputs and TTL compatible • Fully static operation • Data retention supply voltage as low as 1.5V • Easy expansion with CE and OE options The BS62LV4005 is a high performance, low power CMOS Static Random Access Memory organized as 524,288 words by 8 bits and operates from a wide range of 4.5V to 5.5V supply voltage. Advanced CMOS technology and circuit techniques provide both high speed and low power features with maximum access time of 55/ 70ns in 5V operation. Easy memory expansion is provided by active LOW chip enable (CE), active LOW output enable (OE) and three-state output drivers. The BS62LV4005 has an automatic power down feature, reducing the power consumption significantly when chip is deselected. The BS62LV4005 is available in the JEDEC standard 32 pin SOP , TSOP, TSOP II and STSOP . PRODUCT FAMILY PRODUCT FAMILY OPERATING TEMPERATURE BS62LV4005SC BS62LV4005EC BS62LV4005TC BS62LV4005STC BS62LV4005PC BS62LV4005SI BS62LV4005EI BS62LV4005TI BS62LV4005STI BS62LV4005PI ( ICC , Max ) Vcc = 5.0V Vcc = 5.0V Vcc=5.0V 55 / 70 15uA 45mA -40 O C to +85O C 4.5V ~ 5.5V 55 / 70 25uA 50mA 1 2 3 4 5 6 7 8 BS62LV4005SC 9 BS62LV4005SI 10 BS62LV4005EC BS62LV4005EI 11 BS62LV4005PC 12 BS62LV4005PI 13 14 15 16 • 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 ( ICCSB1 , Max ) 4.5V ~ 5.5V • A11 A9 A8 A13 WE A17 A15 VCC A18 A16 A14 A12 A7 A6 A5 A4 POWER DISSIPATION STANDBY Operating SPEED ( ns ) +0 O C to +70O C PIN CONFIGURATIONS A18 A16 A14 A12 A7 A6 A5 A4 A3 A2 A1 A0 DQ0 DQ1 DQ2 GND Vcc RANGE BS62LV4005TC BS62LV4005STC BS62LV4005TI BS62LV4005STI PKG TYPE SOP-32 TSOP2-32 TSOP-32 STSOP-32 PDIP-32 SOP-32 TSOP2-32 TSOP-32 STSOP-32 PDIP-32 FUNCTIONAL BLOCK DIAGRAM 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 VCC A15 A17 WE A13 A8 A9 A11 OE A10 CE DQ7 DQ6 DQ5 DQ4 DQ3 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 A13 A17 A15 A18 A16 A14 A12 A7 A6 A5 A4 Address Input Buffer 22 2048 Row Memory Array 2048 X 2048 Decoder 2048 DQ0 DQ1 DQ2 DQ3 DQ4 DQ5 DQ6 DQ7 OE A10 CE DQ7 DQ6 DQ5 DQ4 DQ3 GND DQ2 DQ1 DQ0 A0 A1 A2 A3 8 8 Data Input Buffer Data Output Buffer Column I/O 8 8 Write Driver Sense Amp 256 Column Decoder 16 CE WE Control Address Input Buffer OE Vdd Gnd A11 A9 A8 A3 A2 A1 A0 A10 Brilliance Semiconductor Inc. reserves the right to modify document contents without notice. R0201-BS62LV4005 1 Revision 2.4 April 2002 BSI BS62LV4005 PIN DESCRIPTIONS Name Function A0-A18 Address Input These 19 address inputs select one of the 524,288 x 8-bit words in the RAM CE Chip Enable Input CE is active LOW. Chip enable must be active when data read from or write to the device. if chip enable is not active, the device is deselected and is in a standby power mode. The DQ pins will be in the high impedance state when the device is deselected. WE Write Enable Input The write enable input is active LOW and controls read and write operations. With the chip selected, when WE is HIGH and OE is LOW, output data will be present on the DQ pins; when WE is LOW, the data present on the DQ pins will be written into the selected memory location. OE Output Enable Input The output enable input is active LOW. If the output enable is active while the chip is selected and the write enable is inactive, data will be present on the DQ pins and they will be enabled. The DQ pins will be in the high impedance state when OE is inactive. DQ0-DQ7 Data Input/Output Ports These 8 bi-directional ports are used to read data from or write data into the RAM. Vcc Power Supply Gnd Ground TRUTH TABLE MODE WE CE OE I/O OPERATION Vcc CURRENT Not selected X H X High Z ICCSB, ICCSB1 Output Disabled H L H High Z ICC Read H L L DOUT ICC Write L L X DIN ICC ABSOLUTE MAXIMUM RATINGS(1) SYMBOL OPERATING RANGE PARAMETER RATING UNITS V TERM Terminal Voltage with Respect to GND -0.5 to 6.0 V T BIAS Temperature Under Bias -40 to +125 O C T STG Storage Temperature -60 to +150 O C PT Power Dissipation 1.0 W I OUT DC Output Current 20 mA RANGE AMBIENT TEMPERATURE Vcc Commercial 0 O C to +70 O C 4.5~5.5V Industrial -40 O C to +85 O C 4.5~5.5V CAPACITANCE (1) (TA = 25oC, f = 1.0 MHz) SYMBOL 1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. R0201-BS62LV4005 2 CIN CDQ PARAMETER Input Capacitance Input/Output Capacitance CONDITIONS MAX. UNIT VIN=0V 6 pF VI/O=0V 8 pF 1. This parameter is guaranteed and not tested. Revision 2.4 April 2002 BSI BS62LV4005 DC ELECTRICAL CHARACTERISTICS ( TA = 0 to + 70oC ) PARAMETER NAME VIL VIH PARAMETER MIN. TYP. (1) MAX. TEST CONDITIONS Guaranteed Input Low (2) Voltage Guaranteed Input High Voltage(2) UNITS Vcc=5.0V -0.5 -- 0.8 V Vcc=5.0V 2.2 -- Vcc+0.3 V IIL Input Leakage Current Vcc = Max, VIN = 0V to Vcc -- -- 1 uA IOL Output Leakage Current Vcc = Max, CE = VIH, or OE = VIH, VI/O = 0V to Vcc -- -- 1 uA VOL Output Low Voltage Vcc = Max, IOL = 2mA Vcc=5.0V -- -- 0.4 V VOH Output High Voltage Vcc = Min, IOH = -1mA Vcc=5.0V 2.4 -- -- V ICC Operating Power Supply Current CE = VIL, IDQ = 0mA, F = Fmax(3) Vcc=5.0V -- -- 45 mA ICCSB Standby Current-TTL CE = VIH, IDQ = 0mA Vcc=5.0V -- -- 2 mA ICCSB1 Standby Current-CMOS CE Њ Vcc-0.2V, VIN Њ Vcc - 0.2V or VIN Љ 0.2V Vcc=5.0V -- 1.5 15 uA 1. Typical characteristics are at TA = 25oC. 2. These are absolute values with respect to device ground and all overshoots due to system or tester notice are included. 3. Fmax = 1/tRC . DATA RETENTION CHARACTERISTICS ( TA = 0 to + 70oC ) SYMBOL PARAMETER TEST CONDITIONS MIN. TYP. (1) MAX. UNITS VDR Vcc for Data Retention CE Њ Vcc - 0.2V VIN Њ Vcc - 0.2V or VIN Љ 0.2V 1.5 -- -- V ICCDR Data Retention Current CE Њ Vcc - 0.2V VIN Њ Vcc - 0.2V or VIN Љ 0.2V -- 0.1 1.5 uA tCDR Chip Deselect to Data Retention Time 0 -- -- ns TRC (2) -- -- ns tR See Retention Waveform Operation Recovery Time 1. Vcc = 1.5V, TA = + 25OC 2. tRC = Read Cycle Time LOW VCC DATA RETENTION WAVEFORM ( CE Controlled ) Data Retention Mode Vcc VDR ≥ 2.0V Vcc CE R0201-BS62LV4005 VIH Vcc tR t CDR CE ≥ Vcc - 0.2V 3 VIH Revision 2.4 April 2002 BSI BS62LV4005 KEY TO SWITCHING WAVEFORMS AC TEST CONDITIONS Input Pulse Levels Input Rise and Fall Times Input and Output Timing Reference Level Vcc/0 5ns WAVEFORM 0.5Vcc AC TEST LOADS AND WAVEFORMS 1928 Ω 5.0V 1928 Ω 5.0V OUTPUT INPUTS OUTPUTS MUST BE STEADY MUST BE STEADY MAY CHANGE FROM H TO L WILL BE CHANGE FROM H TO L MAY CHANGE FROM L TO H WILL BE CHANGE FROM L TO H OUTPUT , 100PF 5PF INCLUDING JIG AND SCOPE INCLUDING JIG AND SCOPE 1020Ω 1020 Ω FIGURE 1A FIGURE 1B THEVENIN EQUIVALENT 667 Ω OUTPUT DON T CARE: ANY CHANGE PERMITTED CHANGE : STATE UNKNOWN DOES NOT APPLY CENTER LINE IS HIGH IMPEDANCE ”OFF ”STATE 1.73V ALL INPUT PULSES Vcc GND 10% → 90% 90% ← → 10% ← 5ns FIGURE 2 AC ELECTRICAL CHARACTERISTICS ( TA = 0 to + 70oC , Vcc = 5.0V ) READ CYCLE JEDEC PARAMETER PARAMETER NAME NAME t AVAX t AVQV t ELQV t GLQV t ELQX t GLQX t EHQZ t GHQZ t AXOX R0201-BS62LV4005 t RC t AA t ACS t OE t CLZ t OLZ t CHZ t OHZ t OH BS62LV4005-55 MIN. TYP. MAX. DESCRIPTION Read Cycle Time Address Access Time Chip Select Access Time Output Enable to Output Valid Chip Select to Output Low Z Output Enable to Output in Low Z Chip Deselect to Output in High Z Output Disable to Output in High Z Output Disable to Output Address Change 4 55 ---10 10 0 0 10 ---------- -55 55 30 --30 25 -- BS62LV4005 -70 MIN. TYP. MAX. 70 ---10 10 0 0 10 ---------- -70 70 35 --35 30 -- UNIT ns ns ns ns ns ns ns ns ns Revision 2.4 April 2002 BSI BS62LV4005 SWITCHING WAVEFORMS (READ CYCLE) READ CYCLE1 (1,2,4) t RC ADDRESS t t t OH AA OH D OUT READ CYCLE2 (1,3,4) CE t t (5) ACS t CHZ (5) CLZ D OUT READ CYCLE3 (1,4) t RC ADDRESS t AA OE t t CE t OH OE OLZ t ACS t (5) t OHZ (5) t CHZ(1,5) CLZ D OUT NOTES: 1. WE is high for read Cycle. 2. Device is continuously selected when CE = VIL. 3. Address valid prior to or coincident with CE transition low. 4. OE = VIL . 5. Transition is measured ± 500mV from steady state with CL = 5pF as shown in Figure 1B. The parameter is guaranteed but not 100% tested. R0201-BS62LV4005 5 Revision 2.4 April 2002 BSI BS62LV4005 AC ELECTRICAL CHARACTERISTICS ( TA = 0 to + 70oC , Vcc = 5.0V ) WRITE CYCLE JEDEC PARAMETER NAME PARAMETER NAME DESCRIPTION BS62LV4005 - 55 MIN. TYP. MAX. BS62LV4005 - 70 MIN. TYP. MAX. UNIT t AVAX t WC Write Cycle Time 55 -- 70 -- -- ns tE1LWH t CW Chip Select to End of Write 55 -- 70 -- -- ns t AVWL t Address Set up Time 0 -- -- 0 -- -- ns t AVWH t AW Address Valid to End of Write 55 -- -- 70 -- -- ns t WLWH t WP Write Pulse Width 30 -- -- 35 -- -- ns t WHAX t WR Write Recovery Time 0 -- -- 0 -- -- ns t WLOZ t WHZ Write to Output in High Z 0 -- 25 0 -- 30 ns t DVWH t DW Data to Write Time Overlap 25 -- -- 30 -- -- ns t WHDX t DH Data Hold from Write Time 0 -- -- 0 -- -- ns t GHOZ t OHZ Output Disable to Output in High Z 0 -- 25 0 -- 30 ns t WHQX t OW End ot Write to Output Active 5 -- -- 5 -- -- ns AS (CE , WE) SWITCHING WAVEFORMS (WRITE CYCLE) WRITE CYCLE1 (1) t WC ADDRESS (3) t WR OE (11) t CW (5) CE t AW WE t WP t AS (2) (4,10) t OHZ D OUT t DH t DW D IN R0201-BS62LV4005 6 Revision 2.4 April 2002 BSI BS62LV4005 WRITE CYCLE2 (1,6) t WC t CW ADDRESS (11) (5) CE t AW t WP (2) WE t t AS DH (4,10) t WHZ (7) D OUT (8) t DW t DH (8,9) D IN NOTES: 1. WE must be high during address transitions. 2. The internal write time of the memory is defined by the overlap of CE and WE low. All signals must be active to initiate a write and any one signal can terminate a write by going inactive. The data input setup and hold timing should be referenced to the second transition edge of the signal that terminates the write. 3. TWR is measured from the earlier of CE or WE going high at the end of write cycle. 4. During this period, DQ pins are in the output state so that the input signals of opposite phase to the outputs must not be applied. 5. If the CE low transition occurs simultaneously with the WE low transitions or after the WE transition, output remain in a high impedance state. 6. OE is continuously low (OE = VIL ). 7. DOUT is the same phase of write data of this write cycle. 8. DOUT is the read data of next address. 9. If CE is low during this period, DQ pins are in the output state. Then the data input signals of opposite phase to the outputs must not be applied to them. 10. Transition is measured ± 500mV from steady state with CL = 5pF as shown in Figure 1B. The parameter is guaranteed but not 100% tested. 11. TCW is measured from the later of CE going low to the end of write. R0201-BS62LV4005 7 Revision 2.4 April 2002 BSI BS62LV4005 ORDERING INFORMATION BS62LV4005 X X ˀˀ Y Y SPEED 70: 70ns 55: 55ns GRADE C: +0oC ~ +70oC I: -40oC ~ +85oC PACKAGE S: SOP E: TSOP 2 T: TSOP ST: Small TSOP P: PDIP PACKAGE DIMENSIONS WITH PLATING b c c1 BASE METAL b1 SECTION A-A SOP -32 R0201-BS62LV4005 8 Revision 2.4 April 2002 BSI BS62LV4005 PACKAGE DIMENSIONS (continued) TSOP2 - 32 TSOP - 32 R0201-BS62LV4005 9 Revision 2.4 April 2002 BSI BS62LV4005 PACKAGE DIMENSIONS (continued) STSOP - 32 PDIP - 32 R0201-BS62LV4005 10 Revision 2.4 April 2002 BSI BS62LV4005 REVISION HISTORY Revision Description Date 2.2 2001 Data Sheet release Apr. 15, 2001 2.3 Modify Standby Current (Typ. and Jun. 29, 2001 Max.) 2.4 Modify some AC parameters. R0201-BS62LV4005 11 Note April,10,2002 Revision 2.4 April 2002