NCP4632 3A, Low Voltage, Low Dropout Linear Voltage Regulator with Reverse Current Protection The NCP4632 is a CMOS Linear voltage regulator with high output current capability (up to 3 A). This device can provide output voltages as low as 0.8 V while maintaining a low dropout voltage of 510 mV typ. at full load. The NCP4632 is designed to draw only 350 mA of supply current and less than 1 mA in standby mode to minimize current consumption for battery operated applications. The device has a high accuracy output voltage of ±1% along with soft−start and reverse current protection circuits to protect the device and the application. The NCP4632 is available in a Pb−Free DPAK−5 package in both fixed and adjustable output voltage options. The output voltage for the fixed options can be modified in 0.1 V steps from 0.8 V to 4.2 V Please contact your sales office for any additional fixed voltage outputs to those already listed. http://onsemi.com MARKING DIAGRAMS E1Jxx1 yy zz DPAK−5 CASE 369AE 1 2 3 4 5 Features • Operating Input Voltage Range: 1.6 V to 5.25 V • Output Voltage Range: 0.8 to 4.5 V (0.1 V steps for fixed options) • Supply current: Typical Operation Mode − 350.0 mA • • • • • • Standby Mode − 1.0 mA Dropout Voltage: 150 mV Typ. at IOUT = 1 A, VOUT = 2.5 V 510 mV Typ. at IOUT = 3 A, VOUT = 2.5 V ±1% Output Voltage Accuracy Line Regulation 0.15%/V Typ. Current Fold Back Protection Typ. 220 mA Stable with Ceramic Capacitors Available in DPAK−5 Package (TO252−5) These are Pb−Free Devices • • • • Battery Powered Equipments Portable Communication Equipments Cameras, VCRs and Camcorders Home appliances • xx YY = Specific Device Code = B − Without Active Discharge = D − With Active Discharge = Lot Number zz ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 13 of this data sheet. Typical Applications NCP4632 (Fixed) VIN VIN VOUT VIN VOUT NCP4632 (Adj) VIN VOUT R1 C1 10m CE SENSE GND C2 10m C1 10m CE GND VADJ R2 VOUT C2 10m Figure 1. Typical Application Schematics © Semiconductor Components Industries, LLC, 2012 June, 2012 − Rev. 0 1 Publication Order Number: NCP4632/D NCP4632 VIN VIN VOUT VOUT SENSE/ ADJ SENSE/ADJ Vref Vref Current Limit Thermal Protection CE Current Limit Thermal Protection CE GND GND Reverse Detector Reverse Detector NCP4632B NCP4632D Figure 2. Simplified Schematic Block Diagram PIN FUNCTION DESCRIPTION Pin No. TO252−5−P2 Pin Name 4 VOUT 2 VIN 3 GND (Note 1) 1 CE 5 SENSE / ADJ Description Output Voltage Pin Input Voltage Pin Ground Pin Chip Enable Pin, Active “H”, Connect to VIN pin if not used. Sense Pin on Fixed Options, ADJ for Adjustable 1. TAB is internally connected to pin 3 GND. ABSOLUTE MAXIMUM RATINGS Rating Symbol Value Unit VIN 6.0 V Output Voltage VOUT −0.3 to VIN + 0.3 V Chip Enable Input VCE −0.3 to 6.0 V Vsense −0.3 to 6.0 V IOUT 3000 mA Input Voltage Sense Input Output Current Power Dissipation (Note 2) PD(MAX) 3800 mW Storage Temperature TSTG −55 to 125 °C Operating Temperature TOP −40 to 85 °C ESD Capability, Human Body Model (Note 3) ESDHBM 2000 V ESD Capability, Machine Model (Note 3) ESDMM 200 V Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 2. JEDEC standard 76.2mm x 114.3 mm, FR4 Four−layers board 3. This device series incorporates ESD protection and is tested by the following methods: ESD Human Body Model tested per AEC−Q100−002 (EIA/JESD22−A114) ESD Machine Model tested per AEC−Q100−003 (EIA/JESD22−A115) Latchup Current Maximum Rating tested per JEDEC standard: JESD78. THERMAL CHARACTERISTICS Rating Thermal Characteristics, DPAK−5 Thermal Resistance, Junction−to−Air http://onsemi.com 2 Symbol Value Unit RqJA 7 °C/W NCP4632 ELECTRICAL CHARACTERISTICS −40°C ≤ TJ ≤ 85°C; VIN = VOUT(NOM) + 1 V; IOUT = 1 mA; CIN = COUT = 10 mF; unless otherwise noted. Typical values are at TJ = +25°C. Parameter Test Conditions Operating Input Voltage (Note 4) Output Voltage Symbol Min VIN VOUT x1.02 V −45 30 mV 0.808 V TJ = +25°C, IOUT = 5 mA VOUT = ADJ 1 mA ≤ IOUT < 300 mA TJ = +25°C, IOUT = 1000 mA VOUT = 3.3 V IOUT = 3000 mA VADJ 0.792 3 LoadReg %/V −15 2 20 −70 3 50 VDO 100 0.9 V ≤ VOUT < 1.0 V 0.865 1.000 1.0 V ≤ VOUT < 1.1 V 0.810 0.950 0.755 0.895 VDO 0.720 0.840 1.5 V ≤ VOUT < 2.5 V 0.630 0.760 2.5 V ≤ VOUT < 3.3 V 0.510 0.600 3.3 V ≤ VOUT < 4.2 V 0.480 0.560 VOUT ≤ 1.5 V ISC 220 IQ 390 450 350 430 VOUT > 1.5 V IOUT = 3000 mA IGND VCE = 5.25 V, TJ = 25°C ISTB CE Input Voltage “H” VCEH CE Input Voltage “L” VCEL CE Pull Down Current mV mV 1.110 VOUT = 0 V IOUT = 0 mA, VIN = 5.25 V A 0.15 0.910 1.2 V ≤ VOUT < 1.5 V Short Current Limit 0.8 0.8 V ≤ VOUT < 0.9 V 1.1 V ≤ VOUT < 1.2 V Reverse Current Limit mV x0.97 1 mA ≤ IOUT < 3000 mA Auto Discharge Low Output Nch Tr. On Resistance V VOUT ≤ 2 V Load Regulation Output Noise Voltage x1.01 VOUT > 2 V IOUT Power Supply Rejection Ratio x0.99 15 LineReg CE Pin Threshold Voltage V −15 TJ = −40 to 85°C Standby Current 5.25 VOUT ≤ 1.5 V VIN = VOUT + 0.5 V to 5 V, IOUT = 1 mA VIN ≥ 1.6 V for NCP4632xDT08T5G, IOUT = 1 mA Supply Current 1.6 −40°C ≤ TJ ≤ 85°C, IOUT = 5 mA Line Regulation Quiescent Current Unit VOUT > 1.5 V Output Current Dropout Voltage Max TJ = +25°C, IOUT = 5 mA Output Voltage (Adjustable Option) Dropout Voltage Typ V mA 450 1 mA mA mA V 1.0 0.4 ICEPD 0.3 0.6 VIN = VOUT + 1 V or 2.2 V whichever is higher, DVIN = 0.2 Vpk−pk, IOUT = 300 mA, f = 1 kHz PSRR 55 dB VOUT = 1.5 V, IOUT = 300 mA, f = 10 Hz to 100 kHz VN 60 mVrms VIN = 4 V, VCE = 0 V RLOW 30 W VOUT > 0.5 V, 0 V ≤ VIN < 5.25 V IREV 10 mA mA 4. The maximum Input Voltage of the ELECTRICAL CHARACTERISTICS is 5.25 V. In case of exceeding this specification, the IC must be operated on condition that the Input Voltage is up to 5.5 V and the total operating time is within 500 hrs. http://onsemi.com 3 NCP4632 0.9 1.6 0.8 1.4 0.7 0.6 OUTPUT VOLTAGE (V) OUTPUT VOLTAGE (V) TYPICAL CHARACTERISTICS 1 mA 0.5 10 mA 0.4 100 mA 0.3 1A 0.2 2A 1A 0.6 100 mA 0.4 10 mA INPUT VOLTAGE (V) INPUT VOLTAGE (V) Figure 3. Output Voltage vs. Input Voltage at NCP4632xDT08 Figure 4. Output Voltage vs. Input Voltage at NCP4632xDT15 2.5 3.0 OUTPUT VOLTAGE (V) 3.5 2.0 2A 1.5 1A 1.0 100 mA 10 mA 1 mA 0.5 2.5 2.0 1.5 INPUT VOLTAGE (V) INPUT VOLTAGE (V) Figure 5. Output Voltage vs. Input Voltage at NCP4632xDT28 Figure 6. Output Voltage vs. Input Voltage at NCP4632xDT33 350 400 300 250 200 150 TA = 25°C Iout = 0 Cin = Cout = 10 mF 0 100 mA 10 mA 1 mA 0.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 450 0 1A 1.0 400 50 2A 0.5 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 100 1 mA 0.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 QUIESCENT CURRENT (mA) OUTPUT VOLTAGE (V) QUIESCENT CURRENT (mA) 2A 0.8 3.0 0.0 3A 1.0 0.2 0.1 0.0 1.2 350 300 250 200 150 100 TA = 25°C Iout = 0 Cin = Cout = 10 mF 50 0 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 INPUT VOLTAGE (V) INPUT VOLTAGE (V) Figure 7. Quiescent Current vs. Input Voltage at NCP4632xDT08 Figure 8. Quiescent Current vs. Input Voltage at NCP4632xDT15 http://onsemi.com 4 NCP4632 450 450 400 400 QUIESCENT CURRENT (mA) QUIESCENT CURRENT (mA) TYPICAL CHARACTERISTICS 350 300 250 200 150 100 TA = 25°C Iout = 0 Cin = Cout = 10 mF 50 0 0 150 100 TA = 25°C Iout = 0 Cin = Cout = 10 mF 50 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 INPUT VOLTAGE (V) Figure 10. Quiescent Current vs. Input Voltage at NCP4632xDT33 1.6 1.4 Vin = 1.8 V 0.7 OUTPUT VOLTAGE (V) OUTPUT VOLTAGE (V) 200 INPUT VOLTAGE (V) 0.6 0.5 0.4 Vin = 3 V 0.3 0.2 Vin = 5.5 V TA = 25°C Cin = Cout = 10 mF 0.1 0 1 2 3 4 5 6 1.2 Vin = 5.5 V 1 0.8 Vin = 2.5 V 0.6 0.4 Vin = 3.5 V 0.2 TA = 25°C Cin = Cout = 10 mF 0 0 7 1 2 3 4 5 6 OUTPUT CURRENT (A) OUTPUT CURRENT (mA) Figure 11. Output Voltage vs. Output Current at NCP4632xDT08 Figure 12. Output Voltage vs. Output Current at NCP4632xDT15 4 7 0.6 DROPOUT VOLTAGE (V) 3.5 OUTPUT VOLTAGE (V) 250 Figure 9. Quiescent Current vs. Input Voltage at NCP4632xDT28 0.8 3 2.5 2 Vin = 5.5 V 1.5 Vin = 5 V Vin = 4.3 V 1 0.5 0 300 0 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 0.9 0 350 TA = 25°C Cin = Cout = 10 mF 0 1 2 3 4 5 6 7 0.5 0.4 85°C 0.2 40°C 0.1 0 8 25°C 0.3 0 0.5 1 1.5 2 2.5 OUTPUT CURRENT (A) OUTPUT CURRENT (A) Figure 13. Output Voltage vs. Output Current at NCP4632xDT33 Figure 14. Dropout Voltage vs. Output Current at NCP4632xDT15 http://onsemi.com 5 3 NCP4632 0.4 0.4 0.35 0.35 0.3 DROPOUT VOLTAGE (V) DROPOUT VOLTAGE (V) TYPICAL CHARACTERISTICS 85°C 0.25 0.2 25°C 0.15 40°C 0.1 0.5 0 1 1.5 2 2.5 25°C 0.2 0.15 40°C 0.1 0 0.5 1 1.5 2 2.5 3 OUTPUT CURRENT (A) OUTPUT CURRENT (A) Figure 15. Dropout Voltage vs. Output Current at NCP4632xDT28 Figure 16. Dropout Voltage vs. Output Current at NCP4632xDT33 100 90 80 Iout = 1 mA 70 70 PSRR (dB) 50 40 30 10 10 40 100 Iout = 1 A 10 1000 0 0.1 1 10 100 FREQUENCY (kHz) FREQUENCY (kHz) Figure 17. PSRR vs. Frequency at NCP4632xDT08 Figure 18. PSRR vs. Frequency at NCP4632xDT15 1000 70 90 80 Iout = 1 mA 60 Iout = 1 mA 70 50 PSRR (dB) 60 50 40 30 Iout = 100 mA 20 1 10 40 Iout = 100 mA 30 20 Iout = 1 A 10 0 0.1 Iout = 100 mA 50 20 Iout = 1 A 1 60 30 Iout = 100 mA 20 0 0.1 Iout = 1 mA 80 60 PSRR (dB) 0.25 0 3 90 PSRR (dB) 85°C 0.05 0.05 0 0.3 100 Iout = 1 A 10 1000 0 0.1 1 10 100 FREQUENCY (kHz) FREQUENCY (kHz) Figure 19. PSRR vs. Frequency at NCP4632xDT28 Figure 20. PSRR vs. Frequency at NCP4632xDT33 http://onsemi.com 6 1000 NCP4632 TYPICAL CHARACTERISTICS 4.5 Vin = 1.8 V Iout = 100 mA Cin = Cout = 10 mF 2.0 Vin = 2.5 V Iout = 100 mA Cin = Cout = 10 mF 4.0 NOISE DENSITY (mV/√HZ) NOISE DENSITY (mV/√HZ) 2.5 1.5 1.0 0.5 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 0.01 0.1 1 10 1000 0.0 0.01 0.1 1 10 100 1000 FREQUENCY (kHz) FREQUENCY (kHz) Figure 21. Output Noise Density vs. Frequency at NCP4632xDT08 Figure 22. Output Noise Density vs. Frequency at NCP4632xDT15 9 9 Vin = 3.8 V Iout = 100 mA Cin = Cout = 10 mF 7 Vin = 4.3 V Iout = 100 mA Cin = Cout = 10 mF 8 NOISE DENSITY (mV/√HZ) 8 6 5 4 3 2 7 6 5 4 3 2 1 1 0 0.01 0.1 1 10 100 0 0.01 1000 0.1 1 10 100 1000 FREQUENCY (kHz) FREQUENCY (kHz) Figure 23. Output Noise Density vs. Frequency at NCP4632xDT28 Figure 24. Output Noise density vs. Frequency at NCP4632xDT33 4.0 3.0 1.0 0.810 0.0 0.805 0.800 Vin = 1.8 V to 2.8 V Iout = 50 mA Cin = 0, Cout = 10 mF 0.795 0.790 0 10 20 30 40 50 60 t (ms) Figure 25. Line Transient Response at NCP4632xDT08 http://onsemi.com 7 70 Vin (V) 2.0 Vout (V) NOISE DENSITY (mV/√HZ) 100 NCP4632 TYPICAL CHARACTERISTICS 6.0 3.310 4.0 3.305 3.0 Vin (V) Vout (V) 5.0 3.300 Vin = 4.3 V to 5.3 V Iout = 50 mA Cin = 0, Cout = 10 mF 3.295 3.290 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 t (ms) 600 500 400 300 200 100 0 0.82 0.81 0.80 0.79 0.78 0.77 0 10 20 30 Iout (mA) Vout (V) Figure 26. Line Transient Response at NCP4632xDT33 Vin = 1.8 V Iout = step 5 mA to 500 mA Cin = Cout = 10 mF 40 50 60 70 t (ms) 3.32 3.31 3.30 3.29 3.28 3.27 600 500 400 300 200 100 0 Vin = 5.3 V Iout = step 5 mA to 500 mA Cin = Cout = 10 mF 0 10 20 30 40 t (ms) 50 60 Figure 28. Load Transient Response at NCP4632xDT33 http://onsemi.com 8 70 Iout (mA) Vout (V) Figure 27. Load Transient Response at NCP4632xDT08 NCP4632 TYPICAL CHARACTERISTICS 4 2 Vin = 1.8 V Iout = step 1 mA to 3 A Slope 1 A/ms Cin = Cout = 10 mF 1 0 Iout (A) Vout (V) 3 0.85 0.80 0.75 0.70 0.0 0.2 0.4 0.6 0.8 t (ms) 1.0 1.2 1.4 Figure 29. Load Transient Response at NCP4632xDT08 4 2 Vin = 5.3 V Iout = step 1 mA to 3 A Slope 1 A/ms Cin = Cout = 10 mF 3.40 1 0 3.35 Iout (A) Vout (V) 3 3.30 3.25 3.20 3.15 0.0 0.2 0.4 0.6 0.8 t (ms) 1.0 1.2 1.4 Figure 30. Load Transient Response at NCP4632xDT33 2 1.6 Vout (V) 0.8 0.4 CE Pin Voltage 0 Iout = 1 mA 0.8 Iout = 10 mA 0.6 Iout = 100 mA 0.4 0.2 0 0 10 20 30 40 t (ms) Figure 31. Turn Off with CE pin vs. Output Current at NCP4632BDT08 http://onsemi.com 9 50 CE PIN VOLTAGE (V) 1.2 NCP4632 TYPICAL CHARACTERISTICS 2 1.6 Vout (V) 0.8 0.4 CE Pin Voltage 0 Iout = 1 mA 0.8 Iout = 10 mA 0.6 Iout = 100 mA 0.4 CE PIN VOLTAGE (V) 1.2 0.2 0 0 3 6 9 12 15 t (ms) Figure 32. Turn Off with CE pin vs. Output Current at NCP4632DDT08 2 1.2 Vout (V) 0.8 0.4 CE Pin Voltage 0 0.8 NCP4632BDT08, Iout = 1 mA 0.6 0.4 NCP4632DDT08, Iout = 1 mA CE PIN VOLTAGE (V) 1.6 0.2 0 0 10 20 30 40 50 t (ms) Figure 33. Turn Off with CE pin at NCP4632xDT08, Iout = 1 mA 2 1 Vout (V) 0.5 Iout = 300 mA 0.8 0 Iout = 100 mA 0.6 0.4 Iout = 1 mA 0.2 0 0.0 0.1 0.2 0.3 0.4 t (ms) Figure 34. Turn On with CE pin at NCP4632xDT08 http://onsemi.com 10 0.5 CE PIN VOLTAGE (V) 1.5 CE Pin Voltage NCP4632 TYPICAL CHARACTERISTICS 3 Vout (V) 1 Iout = 500 mA 1.6 1.2 0 Iout = 100 mA 0.8 Iout = 1 mA 0.4 CE PIN VOLTAGE (V) 2 CE Pin Voltage 0 0.0 0.1 0.2 t (ms) 0.3 0.4 0.5 Figure 35. Turn On with CE Pin at NCP4632xDT15 5 CE Pin Voltage 4 Vout (V) Iout = 1000 mA 2 3 1 2.5 0 2 Iout = 100 mA 1.5 Iout = 1 mA 1 CE PIN VOLTAGE (V) 3 0.5 0 0.0 0.1 0.2 0.3 0.4 0.5 t (ms) Figure 36. Turn On with CE Pin at NCP4632xDT28 5 4 Vout (V) 3.5 3 2 3 1 2.5 0 2 Iout = 1 mA 1.5 1 Iout = 100 mA 0.5 0 0.0 0.1 0.2 t (ms) 0.3 0.4 Figure 37. Turn On with CE Pin at NCP4632xDT33 http://onsemi.com 11 0.5 CE PIN VOLTAGE (V) Iout = 1000 mA NCP4632 APPLICATION INFORMATION A typical application circuit for NCP4632 series is shown in Figure 38. NCP4632 (Fixed) VIN C1 10m VIN VOUT CE SENSE GND V OUT + 0.8 VIN R1 CE C1 10m GND I ADJ + V SET V OUT + 0.8 R1 VADJ R2 I ADJ (eq. 1) R1 RADJ (eq. 2) By choosing R1 << RADJ (RADJ is typically around 1.6 MW), this value becomes very small in which case we can omit the term R1 x IADJ in Equation 1. The simplified equation for the output voltage calculation is shown in Equation 3. C2 10m VOUT R2 The current consumption IADJ flowing into the ADJ pin can be described by Equation 2. VOUT NCP4632 (Adj) VIN ǒ1 ) R1Ǔ ) R1 ǒ1 ) R1Ǔ (eq. 3) R2 The resistor divider should be kept to values below 500 kW to ensure stability. VOUT C2 10m Figure 38. Typical Application Schematic Input Decoupling Capacitor (C1) oncapc7EG A 10 mF ceramic input decoupling capacitor should be connected as close as possible to the input and ground pin of the NCP4632. Higher values and lower ESR improves line transient response. VSET VOUT Output Decoupling Capacitor (C2) A 10 mF ceramic output decoupling capacitor is sufficient to achieve stable operation of the IC. If a tantalum capacitor is used, and its ESR is high, loop oscillation may result. Using multiple ceramic capacitors in parallel should be avoided if possible as this can lead to unstable operation. The Output capacitor should be connected as close as possible to the output and ground pin. Larger capacitance values and lower ESR improves dynamic parameters. Figure 39. Output Voltage Setting Output Discharger The D version includes a transistor between VOUT and GND that is used for faster discharging of the output capacitor. This function is activated when the IC goes into disable mode. Enable Operation Thermal The Enable pin (CE) may be used for turning the regulator on and off. The regulator is switched on when the CE pin voltage is above logic high level. The Enable pin has an internal pull down current source with a 300 nA current capability. If the enable function is not needed, connect CE pin to VIN pin. As power across the IC increases, it might become necessary to provide some thermal relief. The maximum power dissipation supported by the device is dependent upon board design and layout. Mounting pad configuration on the PCB, the board material, and also the ambient temperature affect the rate of temperature rise for the part. That is to say, when the device has good thermal conductivity through the PCB, the junction temperature will be relatively low with high power dissipation applications. Output Voltage Setting For the Adjustable version of the NCP4632, the output voltage can be adjusted by using an external resister divider. The output voltage can be calculated using Equation 1. http://onsemi.com 12 NCP4632 PCB layout regulator off as soon as VIN drops to < 30 mV above VOUT. In this state, reverse current is restricted to less than 10 mA, which flows to ground. As VIN recovers, the power device is switched back on. In order to avoid unstable behavior, there is a 5 mV hysteresis incorporated in the design which will require the dropout to rise above 35 mV before the power device is switched on again. Therefore, the minimum voltage dropout of the device at small output current is limited to 35 mV. Figures 40 and 41 show the diagrams of both operating modes. Make VIN and GND line sufficient. If their impedance is high, noise pickup or unstable operation may result. Connect capacitors C1 and C2 as close as possible to the IC, and make wiring as short as possible. Reverse Current Protection The NCP4632 device include a Reverse Current Protection Circuit, which stops a reverse current flowing from the VOUT pin to the VIN or GND pin when the voltage on VOUT becomes higher than VIN. The reverse current protection circuitry switches the output power device of the Vin Vin VOUT Vout SENSE SENSE Vref Vref Current Limit CE CE Current Limit Reverse Detector Reverse Detector GND GND Figure 40. Normal Operating Mode Figure 41. Reverse Operating Mode ORDERING INFORMATION Nominal Output Voltage Description Marking Package Shipping† Adj Adjustable, auto discharge E1J081D DPAK−5 (Pb−Free) 3000 / Tape & Reel NCP4632BDT08T5G 0.8 V W/O Auto discharge E1J081B DPAK−5 (Pb−Free) 3000 / Tape & Reel NCP4632DDT08T5G 0.8 V Auto discharge E1J081D DPAK−5 (Pb−Free) 3000 / Tape & Reel NCP4632DDT15T5G 1.5 V Auto discharge E1J151D DPAK−5 (Pb−Free) 3000 / Tape & Reel NCP4632DDT28T5G 2.8 V Auto discharge E1J281D DPAK−5 (Pb−Free) 3000 / Tape & Reel NCP4632DDT33T5G 3.3 V Auto discharge E1J331D DPAK−5 (Pb−Free) 3000 / Tape & Reel Device NCP4632DDTADJT5G NOTE: The Adjustable and the 0.8 V fixed voltage option devices are interchangeable and have the same device marking. Evaluation Boards are available for select devices. Consult our website for further details †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 13 NCP4632 PACKAGE DIMENSIONS DPAK−5 (TO−252, 5 LEAD) CASE 369AE−01 ISSUE O C A E b2 A B c2 L3 Z D H DETAIL A 1 2 3 4 E2 5 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. THERMAL PAD CONTOUR OPTIONAL, WITHIN DIMENSIONS b3, E2, L3 AND Z. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.15mm PER SIDE. THESE DIMENSIONS TO BE MEASURED AT DATUM H. 5. DIMENSIONS D AND E ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY. 6. DATUMS A AND B ARE DETERMINED AT DATUM PLANE H. c e b TOP VIEW 0.12 M SIDE VIEW C A B BOTTOM VIEW H RECOMMENDED SOLDERING FOOTPRINT* C L2 GUAGE PLANE 5.70 0.10 C L DIM A A1 b b2 c c2 D E E2 e H L L1 L2 L3 Z MILLIMETERS MIN MAX 2.10 2.50 0.00 0.13 0.40 0.60 5.14 5.54 0.40 0.60 0.40 0.60 5.90 6.30 6.40 6.80 5.04 REF 1.27 BSC 9.60 10.20 1.39 1.78 2.50 2.90 0.51 BSC 0.90 1.30 2.74 REF A1 L1 DETAIL A 6.00 10.50 5X 2.10 5X 1.27 PITCH 0.80 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: [email protected] N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5817−1050 http://onsemi.com 14 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative NCP4632/D