Microchip DSPIC33FJ12GP202TI/P-XXX High-performance, 16-bit digital signal controller Datasheet

dsPIC33FJ12GP201/202
Data Sheet
High-Performance, 16-Bit
Digital Signal Controllers
© 2007 Microchip Technology Inc.
Preliminary
DS70264B
Note the following details of the code protection feature on Microchip devices:
•
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•
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•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
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•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
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Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, KEELOQ logo, microID, MPLAB, PIC,
PICmicro, PICSTART, PRO MATE, PowerSmart, rfPIC, and
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and The Embedded Control Solutions Company are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, ECAN,
ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,
In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi,
MPASM, MPLAB Certified logo, MPLIB, MPLINK, PICkit,
PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal,
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SQTP is a service mark of Microchip Technology Incorporated
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All other trademarks mentioned herein are property of their
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© 2007, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received ISO/TS-16949:2002 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
DS70264B-page ii
Preliminary
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
High-Performance, 16-Bit Digital Signal Controllers
Operating Range:
Digital I/O:
• Up to 40 MIPS operation (at 3.0-3.6V):
- Industrial temperature range
(-40°C to +85°C)
- Extended temperature range
(-40°C to +125°C)
•
•
•
•
•
•
•
High-Performance DSC CPU:
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Modified Harvard architecture
C compiler optimized instruction set
16-bit wide data path
24-bit wide instructions
Linear program memory addressing up to 4M
instruction words
Linear data memory addressing up to 64 Kbytes
83 base instructions, mostly 1 word/1 cycle
Sixteen 16-bit general purpose registers
Two 40-bit accumulators with rounding and
saturation options
Flexible and powerful addressing modes:
- Indirect
- Modulo
- Bit-Reversed
Software stack
16 x 16 fractional/integer multiply operations
32/16 and 16/16 divide operations
Single-cycle multiply and accumulate:
- Accumulator write back for DSP operations
- Dual data fetch
Up to ±16-bit shifts for up to 40-bit data
Interrupt Controller:
•
•
•
•
•
•
5-cycle latency
118 interrupt vectors
Up to 21 available interrupt sources
Up to 3 external interrupts
7 programmable priority levels
4 processor exceptions
Peripheral Pin Select Functionality
Up to 21 programmable digital I/O pins
Wake-up/interrupt-on-change for up to 21 pins
Output pins can drive from 3.0V to 3.6V
Up to 5V output with open drain configuration
All digital input pins are 5V tolerant
4 mA sink on all I/O pins
System Management:
• Flexible clock options:
- External, crystal, resonator, internal RC
- Fully integrated Phase-Locked Loop (PLL)
- Extremely low jitter PLL
• Power-up Timer
• Oscillator Start-up Timer/Stabilizer
• Watchdog Timer with its own RC oscillator
• Fail-Safe Clock Monitor
• Reset by multiple sources
Power Management:
• On-chip 2.5V voltage regulator
• Switch between clock sources in real time
• Idle, Sleep and Doze modes with fast wake-up
Timers/Capture/Compare:
• Timer/Counters, up to three 16-bit timers:
- Can pair up to make one 32-bit timer
- 1 timer runs as Real-Time Clock with external
32.768 kHz oscillator
- Programmable prescaler
• Input Capture (up to 4 channels):
- Capture on up, down or both edges
- 16-bit capture input functions
- 4-deep FIFO on each capture
• Output Compare (up to 2 channels):
- Single or Dual 16-Bit Compare mode
- 16-bit Glitchless PWM Mode
On-Chip Flash and SRAM:
• Flash program memory (12 Kbytes)
• Data SRAM (1024 bytes)
• Boot and General Security for Program Flash
© 2007 Microchip Technology Inc.
Preliminary
DS70264B-page 1
dsPIC33FJ12GP201/202
Communication Modules:
Analog-to-Digital Converters (ADCs):
• 4-wire SPI:
- Framing supports I/O interface to simple
codecs
- Supports 8-bit and 16-bit data
- Supports all serial clock formats and
sampling modes
• I2C™:
- Full Multi-Master Slave mode support
- 7-bit and 10-bit addressing
- Bus collision detection and arbitration
- Integrated signal conditioning
- Slave address masking
• UART:
- Interrupt on address bit detect
- Interrupt on UART error
- Wake-up on Start bit from Sleep mode
- 4 character TX and RX FIFO buffers
- LIN bus support
- IrDA® encoding and decoding in hardware
- High-Speed Baud mode
- Hardware Flow Control with CTS and RTS
• 10-bit, 1.1 Msps or 12-bit, 500 Ksps conversion:
- 2 and 4 simultaneous samples (10-bit ADC)
- Up to 10 input channels with auto-scanning
- Conversion start can be manual or
synchronized with 1 of 4 trigger sources
- Conversion possible in Sleep mode
- ±2 LSb max integral nonlinearity
- ±1 LSb max differential nonlinearity
DS70264B-page 2
CMOS Flash Technology:
•
•
•
•
•
Low-power, high-speed Flash technology
Fully static design
3.3V (±10%) operating voltage
Industrial and extended temperature
Low power consumption
Packaging:
• 18-pin SDIP/SOIC
• 28-pin SDIP/SOIC/QFN
Note:
Preliminary
See the device variant tables for exact
peripheral features per device.
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
dsPIC33FJ12GP201/202 Product Families
The device names, pin counts, memory sizes and
peripheral availability of each family are listed below,
followed by their pinout diagrams.
dsPIC33FJ12GP201/202 CONTROLLER FAMILIES
RAM
(Kbyte)
Remappable
Pins
16-bit Timer
Input Capture
Output Compare
Std. PWM
UART
SPI
10-Bit/12-Bit ADC
I2C™
I/O Pins (Max)
dsPIC33FJ12GP201
18
12
1
8
3(1)
4
2
1
1
1 ADC, 6 ch
1
13
SDIP
SOIC
dsPIC33FJ12GP202
28
12
1
16
3(1)
4
2
1
1
1 ADC, 10 ch
1
21
SDIP
SOIC
QFN
Note 1:
Packages
Device
Program Flash Memory
(Kbyte)
Remappable Peripherals
Pins
TABLE 1:
Only 2 out of 3 timers are remappable.
© 2007 Microchip Technology Inc.
Preliminary
DS70264B-page 3
dsPIC33FJ12GP201/202
dsPIC33FJ12GP201 18-Pin SDIP/SOIC Package Diagram
18-PIN SDIP, SOIC
1
18
VDD
PGD2/EMUD2/AN0/VREF+/CN2/RA0
2
17
VSS
PGC2/EMUC2/AN1/VREF-/CN3/RA1
3
PGD1/EMUD1/AN2/RP0/CN4/RB0
4
PGC1/EMUC1/AN3/RP1/CN5/RB1
5
OSCI/CLKI/CN30/RA2
6
OSCO/CLKO/CN29/RA3
7
PGD3/EMUD3/SOSCI/RP4/CN1/RB4
8
PGC3/EMUC3/SOSCO/T1CK/CN0/RA4
9
dsPIC33FJ12GP201
MCLR
16
AN6/RP15/CN11/RB15
15
AN7/RP14/CN12/RB14
14
VDDCORE
13
VSS
12
SCL1/RP9/CN21/RB9
11
SDA1/RP8/CN22/RB8
10
INT0/RP7/CN23/RB7
Pin Diagrams dsPIC33FJ12GP202 28-Pin SDIP/SOIC Package Diagram
28-PIN SDIP, SOIC
28
AVDD
2
27
AV ss
3
26
AN6/RP15/CN11/RB15
PGD1/EMUD1/AN2/RP0/CN4/RB0
4
25
AN7/RP14/CN12/RB14
PGC1/EMUC1/AN3/RP1/CN5/RB1
5
24
AN8/RP13/CN13/RB13
AN4/RP2/CN6/RB2
6
MCLR
PGC2/EMUC2/AN1/VREF-/CN3/RA1
1
AN5/RP3/CN7/RB3
7
Vss
8
OSCI/CLKI/CN30/RA2
9
dsPIC33FJ12GP202
DS70264B-page 4
PGD2/EMUD2/AN0/VREF+/CN2/RA0
23
AN9/RP12/CN14/RB12
22
TMS/RP11/CN15/RB11
21
TDI/RP10/CN16/RB10
20
VDDCORE
OSCO/CLKO/CN29/RA3
10
19
Vss
PGD3/EMUD3/SOSC/RP4/CN1/RB4
11
18
TDO/SDA1/RP9/CN21/RB9
PGC3/EMUC3/SOSCO/T1CK/CN0/RA4
12
17
TCK/SCL1/RP8/CN22/RB8
VDD
13
16
INT0/RP7/CN23/RB7
ASDA1/RP5/CN27/RB5
14
15
ASCL1/RP6/CN24/RB6
Preliminary
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
dsPIC33FJ12GP202 28-Pin QFN Package Diagram
MCLR
AVDD
AVSS
AN6/RP15/CN11/RB15
AN7/RP14/CN12/RB14
28
PGD2/EMUD2/AN0/VREF+/CN2/RA0
PGC2/EMUC2/AN1/VREF-/CN3/RA1
28-Pin QFN 6x6mm
27
26
25
24
23
22
PGD1/EMUD1/AN2/RP0/CN4/RB0
1
21
AN8/RP13/CN13/RB13
PGC1/EMUC1/AN3/RP1/CN5/RB1
2
20
AN9/RP12/CN14/RB12
AN4/RP2/CN6/RB2
3
19
TMS/RP11/CN15/RB11
AN5/RP3/CN7/RB3
4
18
TDI/RP10/CN16/RB10
dsPIC33FJ12GP202
VSS
OSCO/CLKO/CN29/RA3
7
15
TDO/SDA1/RP9/CN21/RB9
© 2007 Microchip Technology Inc.
9
10
VDD
8
11
12
13
14
TCK/SCL1/RP8/CN22/RB8
16
INT0/RP7/CN23/RB7
6
ASCL1/RP6/CN24/RB6
VDDCORE
ASDA1/RP5/CN27/RB5
17
PGC3/EMUC3/SOSCO/T1CK/CN0/RA4
5
OSCI/CLKI/CN30/RA2
PGD3/EMUD3/SOSCI/RP4/CN1/RB4
VSS
Preliminary
DS70264B-page 5
dsPIC33FJ12GP201/202
Table of Contents
1.0 Device Overview .......................................................................................................................................................................... 7
2.0 CPU ............................................................................................................................................................................................ 11
3.0 Memory Organization ................................................................................................................................................................. 23
4.0 Flash Program Memory .............................................................................................................................................................. 47
5.0 Resets ....................................................................................................................................................................................... 53
6.0 Interrupt Controller ..................................................................................................................................................................... 59
7.0 Oscillator Configuration .............................................................................................................................................................. 87
8.0 Power-Saving Features .............................................................................................................................................................. 97
9.0 I/O Ports ..................................................................................................................................................................................... 99
10.0 Timer1 ...................................................................................................................................................................................... 119
11.0 Timer2/3 Feature...................................................................................................................................................................... 121
12.0 Input Capture............................................................................................................................................................................ 127
13.0 Output Compare ....................................................................................................................................................................... 129
14.0 Serial Peripheral Interface (SPI)............................................................................................................................................... 135
15.0 Inter-Integrated Circuit (I2C) ..................................................................................................................................................... 143
16.0 Universal Asynchronous Receiver Transmitter (UART) ........................................................................................................... 153
17.0 10-bit/12-bit Analog-to-Digital Converter (ADC) ....................................................................................................................... 161
18.0 Special Features ...................................................................................................................................................................... 173
19.0 Instruction Set Summary .......................................................................................................................................................... 179
20.0 Development Support............................................................................................................................................................... 187
21.0 Electrical Characteristics .......................................................................................................................................................... 191
22.0 Packaging Information.............................................................................................................................................................. 225
Appendix A: Revision History............................................................................................................................................................. 231
Index ................................................................................................................................................................................................. 233
The Microchip Web Site ..................................................................................................................................................................... 237
Customer Change Notification Service .............................................................................................................................................. 237
Customer Support .............................................................................................................................................................................. 237
Reader Response .............................................................................................................................................................................. 238
Product Identification System............................................................................................................................................................. 239
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DS70264B-page 6
Preliminary
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
1.0
Note:
DEVICE OVERVIEW
This data sheet summarizes the features
of the dsPIC33FJ12GP201/202 devices. It
is not intended to be a comprehensive
reference source. To complement the
information in this data sheet, refer to the
“dsPIC33F Family Reference Manual”.
Please see the Microchip web site
(www.microchip.com) for the latest
dsPIC33F Family Reference Manual
sections.
This document contains device specific information for
the dsPIC33FJ12GP201/202 Digital Signal Controller
(DSC) devices. The dsPIC33F devices contain
extensive Digital Signal Processor (DSP) functionality
with a high performance 16-bit microcontroller (MCU)
architecture.
Figure 1-1 shows a general block diagram of the
core
and
peripheral
modules
in
the
dsPIC33FJ12GP201/202 family of devices. Table 1-1
lists the functions of the various pins shown in the
pinout diagrams.
© 2007 Microchip Technology Inc.
Preliminary
DS70264B-page 7
dsPIC33FJ12GP201/202
FIGURE 1-1:
dsPIC33FJ12GP201/202 BLOCK DIAGRAM
PSV & Table
Data Access
Control Block
Y Data Bus
X Data Bus
Interrupt
Controller
16
8
PORTA
16
16
16
Data Latch
Data Latch
X RAM
Y RAM
Address
Latch
Address
Latch
23
PCU PCH PCL
Program Counter
Loop
Stack
Control
Control
Logic
Logic
23
PORTB
16
23
16
16
Remappable
Pins
Address Generator Units
Address Latch
Program Memory
EA MUX
Address Bus
Data Latch
ROM Latch
24
Instruction Reg
Control Signals
to Various Blocks
Timing
Generation
FRC/LPRC
Oscillators
Precision
Band Gap
Reference
Voltage
Regulator
VDDCORE/VCAP
16
DSP Engine
Power-up
Timer
Divide Support
16 x 16
W Register Array
16
Oscillator
Start-up Timer
Power-on
Reset
16-bit ALU
Watchdog
Timer
16
Brown-out
Reset
VDD, VSS
Timers
1-3
IC1,2,7,8
Note:
Literal Data
Instruction
Decode &
Control
OSC2/CLKO
OSC1/CLKI
16
16
MCLR
UART1
ADC1
CNx
I2C1
OC/
PWM1-2
Not all pins or features are implemented on all device pinout configurations. See pinout diagrams for
the specific pins and features on each device.
DS70264B-page 8
Preliminary
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
TABLE 1-1:
PINOUT I/O DESCRIPTIONS
Pin Type
Buffer
Type
AN0-AN9
I
Analog
CLKI
CLKO
I
O
ST/CMOS External clock source input. Always associated with OSC1 pin function.
—
Oscillator crystal output. Connects to crystal or resonator in Crystal Oscillator
mode. Optionally functions as CLKO in RC and EC modes. Always
associated with OSC2 pin function.
OSC1
OSC2
I
I/O
ST/CMOS Oscillator crystal input. ST buffer when configured in RC mode; CMOS
—
otherwise.
Oscillator crystal output. Connects to crystal or resonator in Crystal Oscillator
mode. Optionally functions as CLKO in RC and EC modes.
SOSCI
SOSCO
I
O
ST/CMOS 32.768 kHz low-power oscillator crystal input; CMOS otherwise.
—
32.768 kHz low-power oscillator crystal output.
CN0-CN7
CN11-CN15
CN21-CN24
CN27
CN29-CN30
I
ST
Change notification inputs.
Can be software programmed for internal weak pull-ups on all inputs.
IC0-IC1
IC7-IC8
I
ST
Capture inputs 1/2
Capture inputs 7/8
OCFA
OC1-OC2
I
O
ST
—
Compare Fault A input (for Compare Channels 1 and 2).
Compare outputs 1 through 2.
INT0
INT1
INT2
I
I
I
ST
ST
ST
External interrupt 0.
External interrupt 1.
External interrupt 2.
RA0-RA4
I/O
ST
PORTA is a bidirectional I/O port.
RB0-RB15
I/O
ST
PORTB is a bidirectional I/O port.
T1CK
T2CK
T3CK
I
I
I
ST
ST
ST
Timer1 external clock input.
Timer2 external clock input.
Timer3 external clock input.
U1CTS
U1RTS
U1RX
U1TX
I
O
I
O
ST
—
ST
—
UART1 clear to send.
UART1 ready to send.
UART1 receive.
UART1 transmit.
SCK1
SDI1
SDO1
SS1
I/O
I
O
I/O
ST
ST
—
ST
Synchronous serial clock input/output for SPI1.
SPI1 data in.
SPI1 data out.
SPI1 slave synchronization or frame pulse I/O.
SCL1
SDA1
ASCL1
ASDA1
I/O
I/O
I/O
I/O
ST
ST
ST
ST
Synchronous serial clock input/output for I2C1.
Synchronous serial data input/output for I2C1.
Alternate synchronous serial clock input/output for I2C1.
Alternate synchronous serial data input/output for I2C1.
TMS
TCK
TDI
TDO
I
I
I
O
ST
ST
ST
—
JTAG Test mode select pin.
JTAG test clock input pin.
JTAG test data input pin.
JTAG test data output pin.
PGD1/EMUD1
PGC1/EMUC1
PGD2/EMUD2
PGC2/EMUC2
PGD3/EMUD3
PGC3/EMUC3
I/O
I
I/O
I
I/O
I
ST
ST
ST
ST
ST
ST
Data I/O pin for programming/debugging communication channel 1.
Clock input pin for programming/debugging communication channel 1.
Data I/O pin for programming/debugging communication channel 2.
Clock input pin for programming/debugging communication channel 2.
Data I/O pin for programming/debugging communication channel 3.
Clock input pin for programming/debugging communication channel 3.
Pin Name
Description
Analog input channels.
Legend: CMOS = CMOS compatible input or output
ST = Schmitt Trigger input with CMOS levels
© 2007 Microchip Technology Inc.
Analog = Analog input
O = Output
Preliminary
P = Power
I = Input
DS70264B-page 9
dsPIC33FJ12GP201/202
TABLE 1-1:
Pin Name
PINOUT I/O DESCRIPTIONS (CONTINUED)
Pin Type
Buffer
Type
Description
VDDCORE
P
—
CPU logic filter capacitor connection.
VSS
P
—
Ground reference for logic and I/O pins.
VREF+
I
Analog
Analog voltage reference (high) input.
VREF-
I
Analog
Analog voltage reference (low) input.
AVDD
P
P
Positive supply for analog modules.
MCLR
I/P
ST
Master Clear (Reset) input. This pin is an active-low Reset to the device.
AVSS
P
P
Ground reference for analog modules.
VDD
P
—
Positive supply for peripheral logic and I/O pins.
Legend: CMOS = CMOS compatible input or output
ST = Schmitt Trigger input with CMOS levels
DS70264B-page 10
Analog = Analog input
O = Output
Preliminary
P = Power
I = Input
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
2.0
Note:
CPU
This data sheet summarizes the features
of the dsPIC33FJ12GP201/202 devices. It
is not intended to be a comprehensive
reference source. To complement the
information in this data sheet, refer to the
“dsPIC33F Family Reference Manual”.
Please see the Microchip web site
(www.microchip.com) for the latest
dsPIC33F Family Reference Manual
sections.
The dsPIC33FJ12GP201/202 CPU module has a 16-bit
(data) modified Harvard architecture with an enhanced
instruction set, including significant support for DSP. The
CPU has a 24-bit instruction word with a variable length
opcode field. The Program Counter (PC) is 23 bits wide
and addresses up to 4M x 24 bits of user program memory
space. The actual amount of program memory
implemented varies by device. A single-cycle instruction
prefetch mechanism is used to help maintain throughput
and provides predictable execution. All instructions
execute in a single cycle, with the exception of instructions
that change the program flow, the double-word move
(MOV.D) instruction and the table instructions.
Overhead-free program loop constructs are supported
using the DO and REPEAT instructions, both of which are
interruptible at any point.
The dsPIC33FJ12GP201/202 devices have sixteen,
16-bit working registers in the programmer’s model. Each
of the working registers can serve as a data, address or
address offset register. The 16th working register (W15)
operates as a software Stack Pointer (SP) for interrupts
and calls.
The dsPIC33FJ12GP201/202 instruction set has two
classes of instructions: MCU and DSP. These two instruction classes are seamlessly integrated into a single CPU.
The instruction set includes many addressing modes and
is designed for optimum C compiler efficiency. For most
instructions, the dsPIC33FJ12GP201/202 is capable of
executing a data (or program data) memory read, a working register (data) read, a data memory write and a program (instruction) memory read per instruction cycle. As a
result, three parameter instructions can be supported,
allowing A + B = C operations to be executed in a single
cycle.
A block diagram of the CPU is shown in Figure 2-1. The
programmer’s model for the dsPIC33FJ12GP201/202 is
shown in Figure 2-2.
2.1
Data Addressing Overview
The data space can be addressed as 32K words or
64 Kbytes and is split into two blocks, referred to as X and
Y data memory. Each memory block has its own
independent Address Generation Unit (AGU). The MCU
class of instructions operates solely through the X memory AGU, which accesses the entire memory map as one
linear data space. Certain DSP instructions operate
© 2007 Microchip Technology Inc.
through the X and Y AGUs to support dual operand reads,
which splits the data address space into two parts. The X
and Y data space boundary is device-specific.
Overhead-free circular buffers (Modulo Addressing mode)
are supported in both X and Y address spaces. The
Modulo Addressing removes the software boundary
checking overhead for DSP algorithms. Furthermore, the
X AGU circular addressing can be used with any of the
MCU class of instructions. The X AGU also supports
Bit-Reversed Addressing to greatly simplify input or output
data reordering for radix-2 FFT algorithms.
The upper 32 Kbytes of the data space memory map can
optionally be mapped into program space at any 16K
program word boundary defined by the 8-bit Program
Space Visibility Page (PSVPAG) register. The program to
data space mapping feature lets any instruction access
program space as if it were data space.
2.2
DSP Engine Overview
The DSP engine features a high-speed 17-bit by 17-bit
multiplier, a 40-bit ALU, two 40-bit saturating
accumulators and a 40-bit bidirectional barrel shifter. The
barrel shifter is capable of shifting a 40-bit value up to 16
bits right or left, in a single cycle. The DSP instructions
operate seamlessly with all other instructions and have
been designed for optimal real-time performance. The
MAC instruction and other associated instructions can
concurrently fetch two data operands from memory while
multiplying two W registers and accumulating and
optionally saturating the result in the same cycle. This
instruction functionality requires that the RAM data space
be split for these instructions and linear for all others. Data
space partitioning is achieved in a transparent and flexible
manner through dedicating certain working registers to
each address space.
2.3
Special MCU Features
The dsPIC33FJ12GP201/202 features a 17-bit by 17-bit
single-cycle multiplier that is shared by both the MCU ALU
and DSP engine. The multiplier can perform signed,
unsigned and mixed-sign multiplication. Using a 17-bit by
17-bit multiplier for 16-bit by 16-bit multiplication not only
allows you to perform mixed-sign multiplication, it also
achieves accurate results for special operations, such as
(-1.0) x (-1.0).
The dsPIC33FJ12GP201/202 supports 16/16 and 32/16
divide operations, both fractional and integer. All divide
instructions are iterative operations. They must be
executed within a REPEAT loop, resulting in a total
execution time of 19 instruction cycles. The divide
operation can be interrupted during any of those 19 cycles
without loss of data.
A 40-bit barrel shifter is used to perform up to a 16-bit left
or right shift in a single cycle. The barrel shifter can be
used by both MCU and DSP instructions.
Preliminary
DS70264B-page 11
dsPIC33FJ12GP201/202
FIGURE 2-1:
dsPIC33FJ12GP201/202 CPU CORE BLOCK DIAGRAM
PSV & Table
Data Access
Control Block
Y Data Bus
X Data Bus
Interrupt
Controller
8
16
23
23
PCU PCH PCL
Program Counter
Loop
Stack
Control
Control
Logic
Logic
16
16
16
Data Latch
Data Latch
X RAM
Y RAM
Address
Latch
Address
Latch
23
16
16
16
Address Generator Units
Address Latch
Program Memory
EA MUX
Address Bus
Data Latch
ROM Latch
24
Control Signals
to Various Blocks
Instruction Reg
Literal Data
Instruction
Decode &
Control
16
16
16
DSP Engine
Divide Support
16 x 16
W Register Array
16
16-bit ALU
16
To Peripheral Modules
DS70264B-page 12
Preliminary
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
FIGURE 2-2:
dsPIC33FJ12GP201/202 PROGRAMMER’S MODEL
D15
D0
W0/WREG
PUSH.S Shadow
W1
DO Shadow
W2
W3
Legend
W4
DSP Operand
Registers
W5
W6
W7
Working Registers
W8
W9
DSP Address
Registers
W10
W11
W12/DSP Offset
W13/DSP Write Back
W14/Frame Pointer
W15/Stack Pointer
SPLIM
AD39
Stack Pointer Limit Register
AD15
AD31
AD0
ACCA
DSP
Accumulators
ACCB
PC22
PC0
Program Counter
0
0
7
TBLPAG
Data Table Page Address
7
0
PSVPAG
Program Space Visibility Page Address
15
0
RCOUNT
REPEAT Loop Counter
15
0
DCOUNT
DO Loop Counter
22
0
DOSTART
DO Loop Start Address
DOEND
DO Loop End Address
22
15
0
Core Configuration Register
CORCON
OA
OB
SA
SB OAB SAB DA
SRH
© 2007 Microchip Technology Inc.
DC
IPL2 IPL1 IPL0 RA
N
OV
Z
C
STATUS Register
SRL
Preliminary
DS70264B-page 13
dsPIC33FJ12GP201/202
2.4
CPU Control Registers
CPU control registers include:
• SR: CPU Status Register
• CORCON: CORE Control Register
REGISTER 2-1:
SR: CPU STATUS REGISTER
R-0
R-0
R/C-0
R/C-0
R-0
R/C-0
R -0
R/W-0
OA
OB
SA(1)
SB(1)
OAB
SAB
DA
DC
bit 15
bit 8
R/W-0(2)
R/W-0(3)
R/W-0(3)
IPL<2:0>(2)
R-0
R/W-0
R/W-0
R/W-0
R/W-0
RA
N
OV
Z
C
bit 7
bit 0
Legend:
C = Clear only bit
R = Readable bit
U = Unimplemented bit, read as ‘0’
S = Set only bit
W = Writable bit
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15
OA: Accumulator A Overflow Status bit
1 = Accumulator A overflowed
0 = Accumulator A has not overflowed
bit 14
OB: Accumulator B Overflow Status bit
1 = Accumulator B overflowed
0 = Accumulator B has not overflowed
bit 13
SA: Accumulator A Saturation ‘Sticky’ Status bit(1)
1 = Accumulator A is saturated or has been saturated at some time
0 = Accumulator A is not saturated
bit 12
SB: Accumulator B Saturation ‘Sticky’ Status bit(1)
1 = Accumulator B is saturated or has been saturated at some time
0 = Accumulator B is not saturated
bit 11
OAB: OA || OB Combined Accumulator Overflow Status bit
1 = Accumulators A or B have overflowed
0 = Neither Accumulators A or B have overflowed
bit 10
SAB: SA || SB Combined Accumulator ‘Sticky’ Status bit
1 = Accumulators A or B are saturated or have been saturated at some time in the past
0 = Neither Accumulator A or B are saturated
bit 9
DA: DO Loop Active bit
1 = DO loop in progress
0 = DO loop not in progress
Note:
Note 1:
2:
3:
This bit can be read or cleared (not set). Clearing this bit will clear SA and SB.
This bit can be read or cleared (not set).
The IPL<2:0> bits are concatenated with the IPL<3> bit (CORCON<3>) to form the CPU Interrupt Priority
Level. The value in parentheses indicates the IPL if IPL<3> = 1. User interrupts are disabled when
IPL<3> = 1.
The IPL<2:0> Status bits are read only when NSTDIS = 1 (INTCON1<15>).
DS70264B-page 14
Preliminary
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
REGISTER 2-1:
SR: CPU STATUS REGISTER (CONTINUED)
bit 8
DC: MCU ALU Half Carry/Borrow bit
1 = A carry-out from the 4th low-order bit (for byte-sized data) or 8th low-order bit (for word-sized data)
of the result occurred
0 = No carry-out from the 4th low-order bit (for byte-sized data) or 8th low-order bit (for word-sized
data) of the result occurred
bit 7-5
IPL<2:0>: CPU Interrupt Priority Level Status bits(2)
111 = CPU Interrupt Priority Level is 7 (15), user interrupts disabled
110 = CPU Interrupt Priority Level is 6 (14)
101 = CPU Interrupt Priority Level is 5 (13)
100 = CPU Interrupt Priority Level is 4 (12)
011 = CPU Interrupt Priority Level is 3 (11)
010 = CPU Interrupt Priority Level is 2 (10)
001 = CPU Interrupt Priority Level is 1 (9)
000 = CPU Interrupt Priority Level is 0 (8)
bit 4
RA: REPEAT Loop Active bit
1 = REPEAT loop in progress
0 = REPEAT loop not in progress
bit 3
N: MCU ALU Negative bit
1 = Result was negative
0 = Result was non-negative (zero or positive)
bit 2
OV: MCU ALU Overflow bit
This bit is used for signed arithmetic (2’s complement). It indicates an overflow of a magnitude that
causes the sign bit to change state.
1 = Overflow occurred for signed arithmetic (in this arithmetic operation)
0 = No overflow occurred
bit 1
Z: MCU ALU Zero bit
1 = An operation that affects the Z bit has set it at some time in the past
0 = The most recent operation that affects the Z bit has cleared it (i.e., a non-zero result)
bit 0
C: MCU ALU Carry/Borrow bit
1 = A carry-out from the Most Significant bit of the result occurred
0 = No carry-out from the Most Significant bit of the result occurred
Note 1:
2:
3:
This bit can be read or cleared (not set).
The IPL<2:0> bits are concatenated with the IPL<3> bit (CORCON<3>) to form the CPU Interrupt Priority
Level. The value in parentheses indicates the IPL if IPL<3> = 1. User interrupts are disabled when
IPL<3> = 1.
The IPL<2:0> Status bits are read only when NSTDIS = 1 (INTCON1<15>).
© 2007 Microchip Technology Inc.
Preliminary
DS70264B-page 15
dsPIC33FJ12GP201/202
REGISTER 2-2:
CORCON: CORE CONTROL REGISTER
U-0
—
bit 15
U-0
—
R/W-0
SATA
bit 7
R/W-0
SATB
bit 11
bit 10-8
bit 7
bit 6
bit 5
bit 4
bit 3
bit 2
bit 1
bit 0
Note 1:
2:
R/W-0
US
R/W-0
EDT(1)
R-0
R-0
DL<2:0>
R-0
bit 8
Legend:
R = Readable bit
0’ = Bit is cleared
bit 15-13
bit 12
U-0
—
R/W-1
SATDW
R/W-0
ACCSAT
C = Clear only bit
W = Writable bit
‘x = Bit is unknown
R/C-0
IPL3(2)
R/W-0
PSV
R/W-0
RND
R/W-0
IF
bit 0
-n = Value at POR
‘1’ = Bit is set
U = Unimplemented bit, read as ‘0’
Unimplemented: Read as ‘0’
US: DSP Multiply Unsigned/Signed Control bit
1 = DSP engine multiplies are unsigned
0 = DSP engine multiplies are signed
EDT: Early DO Loop Termination Control bit(1)
1 = Terminate executing DO loop at end of current loop iteration
0 = No effect
DL<2:0>: DO Loop Nesting Level Status bits
111 = 7 DO loops active
•
•
•
001 = 1 DO loop active
000 = 0 DO loops active
SATA: ACCA Saturation Enable bit
1 = Accumulator A saturation enabled
0 = Accumulator A saturation disabled
SATB: ACCB Saturation Enable bit
1 = Accumulator B saturation enabled
0 = Accumulator B saturation disabled
SATDW: Data Space Write from DSP Engine Saturation Enable bit
1 = Data space write saturation enabled
0 = Data space write saturation disabled
ACCSAT: Accumulator Saturation Mode Select bit
1 = 9.31 saturation (super saturation)
0 = 1.31 saturation (normal saturation)
IPL3: CPU Interrupt Priority Level Status bit 3(2)
1 = CPU interrupt priority level is greater than 7
0 = CPU interrupt priority level is 7 or less
PSV: Program Space Visibility in Data Space Enable bit
1 = Program space visible in data space
0 = Program space not visible in data space
RND: Rounding Mode Select bit
1 = Biased (conventional) rounding enabled
0 = Unbiased (convergent) rounding enabled
IF: Integer or Fractional Multiplier Mode Select bit
1 = Integer mode enabled for DSP multiply operations
0 = Fractional mode enabled for DSP multiply operations
This bit will always read as ‘0’.
The IPL3 bit is concatenated with the IPL<2:0> bits (SR<7:5>) to form the CPU interrupt priority level.
DS70264B-page 16
Preliminary
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
2.5
Arithmetic Logic Unit (ALU)
The dsPIC33FJ12GP201/202 ALU is 16 bits wide and
is capable of addition, subtraction, bit shifts and logic
operations. Unless otherwise mentioned, arithmetic
operations are 2’s complement in nature. Depending
on the operation, the ALU can affect the values of the
Carry (C), Zero (Z), Negative (N), Overflow (OV) and
Digit Carry (DC) Status bits in the SR register. The C
and DC Status bits operate as Borrow and Digit Borrow
bits, respectively, for subtraction operations.
The ALU can perform 8-bit or 16-bit operations,
depending on the mode of the instruction that is used.
Data for the ALU operation can come from the W
register array or data memory, depending on the
addressing mode of the instruction. Likewise, output
data from the ALU can be written to the W register array
or a data memory location.
The dsPIC33FJ12GP201/202 CPU incorporates hardware support for both multiplication and division. This
includes a dedicated hardware multiplier and support
hardware for 16-bit-divisor division.
Refer to the “dsPIC30F/33F Programmer’s Reference
Manual” (DS70157) for information on the SR bits
affected by each instruction.
2.5.1
MULTIPLIER
Using the high-speed 17-bit x 17-bit multiplier of the DSP
engine, the ALU supports unsigned, signed or mixed-sign
operation in several MCU multiplication modes:
•
•
•
•
•
•
•
16-bit x 16-bit signed
16-bit x 16-bit unsigned
16-bit signed x 5-bit (literal) unsigned
16-bit unsigned x 16-bit unsigned
16-bit unsigned x 5-bit (literal) unsigned
16-bit unsigned x 16-bit signed
8-bit unsigned x 8-bit unsigned
2.5.2
32-bit signed/16-bit signed divide
32-bit unsigned/16-bit unsigned divide
16-bit signed/16-bit signed divide
16-bit unsigned/16-bit unsigned divide
The quotient for all divide instructions ends up in W0
and the remainder in W1. 16-bit signed and unsigned
DIV instructions can specify any W register for both the
16-bit divisor (Wn) and any W register (aligned) pair
(W(m+1):Wm) for the 32-bit dividend. The divide
algorithm takes one cycle per bit of divisor, so both
32-bit/16-bit and 16-bit/16-bit instructions take the
same number of cycles to execute.
2.6
DSP Engine
The DSP engine consists of a high-speed 17-bit x
17-bit multiplier, a barrel shifter and a 40-bit
adder/subtracter (with two target accumulators, round
and saturation logic).
The dsPIC33FJ12GP201/202 is a single-cycle instruction flow architecture; therefore, concurrent operation of
the DSP engine with MCU instruction flow is not possible.
However, some MCU ALU and DSP engine resources
can be used concurrently by the same instruction
(e.g., ED, EDAC).
The DSP engine can also perform accumulator-to-accumulator operations that require no additional
data. These instructions are ADD, SUB and NEG.
The DSP engine has options selected through bits in
the CPU Core Control register (CORCON), as listed
below:
•
•
•
•
DIVIDER
The divide block supports 32-bit/16-bit and 16-bit/16-bit
signed and unsigned integer divide operations with the
following data sizes:
TABLE 2-1:
1.
2.
3.
4.
Fractional or integer DSP multiply (IF)
Signed or unsigned DSP multiply (US)
Conventional or convergent rounding (RND)
Automatic saturation on/off for ACCA (SATA),
ACCB (SATB) and writes to data memory
(SATDW)
• Accumulator Saturation mode selection
(ACCSAT)
A block diagram of the DSP engine is shown in
Figure 2-3.
DSP INSTRUCTIONS SUMMARY
Instruction
CLR
ED
EDAC
MAC
MAC
MOVSAC
MPY
MPY
MPY.N
MSC
© 2007 Microchip Technology Inc.
Algebraic Operation
ACC Write Back
A=0
A = (x – y)2
A = A + (x – y)2
A = A + (x * y)
A = A + x2
No change in A
A=x*y
A=x2
A=–x*y
A=A–x*y
Yes
No
No
Yes
No
Yes
No
No
No
Yes
Preliminary
DS70264B-page 17
dsPIC33FJ12GP201/202
FIGURE 2-3:
DSP ENGINE BLOCK DIAGRAM
40
S
a
40 Round t 16
u
Logic r
a
t
e
40-bit Accumulator A
40-bit Accumulator B
Carry/Borrow Out
Carry/Borrow In
Saturate
Adder
Negate
40
40
40
16
X Data Bus
Barrel
Shifter
40
Y Data Bus
Sign-Extend
32
Zero Backfill
16
32
33
17-bit
Multiplier/Scaler
16
16
To/From W Array
DS70264B-page 18
Preliminary
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
2.6.1
MULTIPLIER
The 17-bit x 17-bit multiplier is capable of signed or
unsigned operation and can multiplex its output using a
scaler to support either 1.31 fractional (Q31) or 32-bit
integer results. Unsigned operands are zero-extended
into the 17th bit of the multiplier input value. Signed
operands are sign-extended into the 17th bit of the
multiplier input value. The output of the 17-bit x 17-bit
multiplier/scaler is a 33-bit value that is sign-extended
to 40 bits. Integer data is inherently represented as a
signed 2’s complement value, where the Most
Significant bit (MSb) is defined as a sign bit.
• The range of an N-bit 2’s complement integer is
-2N-1 to 2N-1 – 1.
• For a 16-bit integer, the data range is -32768
(0x8000) to 32767 (0x7FFF) including ‘0’.
• For a 32-bit integer, the data range is
-2,147,483,648 (0x8000 0000) to 2,147,483,647
(0x7FFF FFFF).
When the multiplier is configured for fractional
multiplication, the data is represented as a 2’s
complement fraction, where the MSb is defined as a
sign bit and the radix point is implied to lie just after the
sign bit (QX format). The range of an N-bit 2’s
complement fraction with this implied radix point is -1.0
to (1 – 21-N). For a 16-bit fraction, the Q15 data range
is -1.0 (0x8000) to 0.999969482 (0x7FFF) including ‘0’
and has a precision of 3.01518x10-5. In Fractional
mode, the 16 x 16 multiply operation generates a 1.31
product that has a precision of 4.65661 x 10-10.
The same multiplier is used to support the MCU
multiply instructions which include integer 16-bit
signed, unsigned and mixed sign multiply operations.
The MUL instruction can be directed to use byte or
word-sized operands. Byte operands will direct a 16-bit
result, and word operands will direct a 32-bit result to
the specified register(s) in the W array.
2.6.2
DATA ACCUMULATORS AND
ADDER/SUBTRACTER
The data accumulator consists of a 40-bit
adder/subtracter with automatic sign extension logic. It
can select one of two accumulators (A or B) as its
pre-accumulation source and post-accumulation
destination. For the ADD and LAC instructions, the data
to be accumulated or loaded can be optionally scaled
using the barrel shifter prior to accumulation.
2.6.2.1
Adder/Subtracter, Overflow and
Saturation
• In the case of addition, the Carry/Borrow input is
active-high and the other input is true data (not
complemented).
• In the case of subtraction, the Carry/Borrow input
is active-low and the other input is complemented.
The adder/subtracter generates Overflow Status bits,
SA/SB and OA/OB, which are latched and reflected in
the STATUS register:
• Overflow from bit 39: this is a catastrophic
overflow in which the sign of the accumulator is
destroyed.
• Overflow into guard bits 32 through 39: this is a
recoverable overflow. This bit is set whenever all
the guard bits are not identical to each other.
The adder has an additional saturation block that
controls accumulator data saturation, if selected. It
uses the result of the adder, the Overflow Status bits
described
previously
and
the
SAT<A:B>
(CORCON<7:6>) and ACCSAT (CORCON<4>) mode
control bits to determine when and to what value to
saturate.
Six STATUS register bits have been provided to
support saturation and overflow:
• OA: ACCA overflowed into guard bits
• OB: ACCB overflowed into guard bits
• SA: ACCA saturated (bit 31 overflow and
saturation)
or
ACCA overflowed into guard bits and saturated
(bit 39 overflow and saturation)
• SB: ACCB saturated (bit 31 overflow and
saturation)
or
ACCB overflowed into guard bits and saturated
(bit 39 overflow and saturation)
• OAB: Logical OR of OA and OB
• SAB: Logical OR of SA and SB
The OA and OB bits are modified each time data
passes through the adder/subtracter. When set, they
indicate that the most recent operation has overflowed
into the accumulator guard bits (bits 32 through 39).
The OA and OB bits can also optionally generate an
arithmetic warning trap when set and the
corresponding Overflow Trap Flag Enable bits (OVATE,
OVBTE) in the INTCON1 register are set (refer to
Section 6.0 “Interrupt Controller”). This allows the
user application to take immediate action, for example,
to correct system gain.
The adder/subtracter is a 40-bit adder with an optional
zero input into one side, and either true or complement
data into the other input.
© 2007 Microchip Technology Inc.
Preliminary
DS70264B-page 19
dsPIC33FJ12GP201/202
The SA and SB bits are modified each time data
passes through the adder/subtracter, but can only be
cleared by the user application. When set, they indicate
that the accumulator has overflowed its maximum
range (bit 31 for 32-bit saturation or bit 39 for 40-bit saturation) and will be saturated (if saturation is enabled).
When saturation is not enabled, SA and SB default to
bit 39 overflow and thus indicate that a catastrophic
overflow has occurred. If the COVTE bit in the
INTCON1 register is set, SA and SB bits will generate
an arithmetic warning trap when saturation is disabled.
The Overflow and Saturation Status bits can optionally
be viewed in the STATUS Register (SR) as the logical
OR of OA and OB (in bit OAB) and the logical OR of SA
and SB (in bit SAB). Programs can check one bit in the
STATUS register to determine if either accumulator has
overflowed, or one bit to determine if either accumulator has saturated. This is useful for complex number
arithmetic, which typically uses both accumulators.
The device supports three Saturation and Overflow
modes:
• Bit 39 Overflow and Saturation:
When bit 39 overflow and saturation occurs, the
saturation logic loads the maximally positive 9.31
(0x7FFFFFFFFF) or maximally negative 9.31 value
(0x8000000000) into the target accumulator. The
SA or SB bit is set and remains set until cleared by
the user application. This condition is referred to as
‘super saturation’ and provides protection against
erroneous data or unexpected algorithm problems
(such as gain calculations).
• Bit 31 Overflow and Saturation:
When bit 31 overflow and saturation occurs, the
saturation logic then loads the maximally positive
1.31 value (0x007FFFFFFF) or maximally negative 1.31 value (0x0080000000) into the target
accumulator. The SA or SB bit is set and remains
set until cleared by the user application. When
this Saturation mode is in effect, the guard bits are
not used, so the OA, OB or OAB bits are never
set.
• Bit 39 Catastrophic Overflow:
The bit 39 Overflow Status bit from the adder is
used to set the SA or SB bit, which remains set
until cleared by the user application. No saturation
operation is performed and the accumulator is
allowed to overflow, destroying its sign. If the
COVTE bit in the INTCON1 register is set, a
catastrophic overflow can initiate a trap exception.
2.6.2.2
Accumulator ‘Write Back’
The MAC class of instructions (with the exception of
MPY, MPY.N, ED and EDAC) can optionally write a
rounded version of the high word (bits 31 through 16)
of the accumulator that is not targeted by the instruction
into data space memory. The write is performed across
the X bus into combined X and Y address space. The
following addressing modes are supported:
DS70264B-page 20
• W13, Register Direct:
The rounded contents of the non-target
accumulator are written into W13 as a
1.15 fraction.
• [W13] + = 2, Register Indirect with Post-Increment:
The rounded contents of the non-target accumulator are written into the address pointed to by
W13 as a 1.15 fraction. W13 is then incremented
by 2 (for a word write).
2.6.2.3
Round Logic
The round logic is a combinational block that performs
a conventional (biased) or convergent (unbiased)
round function during an accumulator write (store). The
Round mode is determined by the state of the RND bit
in the CORCON register. It generates a 16-bit, 1.15
data value that is passed to the data space write saturation logic. If rounding is not indicated by the instruction, a truncated 1.15 data value is stored and the least
significant word (lsw) is simply discarded.
Conventional rounding zero-extends bit 15 of the accumulator and adds it to the ACCxH word (bits 16 through
31 of the accumulator).
• If the ACCxL word (bits 0 through 15 of the accumulator) is between 0x8000 and 0xFFFF (0x8000
included), ACCxH is incremented.
• If ACCxL is between 0x0000 and 0x7FFF, ACCxH
is left unchanged.
A consequence of this algorithm is that over a succession of random rounding operations, the value tends to
be biased slightly positive.
Convergent (or unbiased) rounding operates in the
same manner as conventional rounding, except when
ACCxL equals 0x8000. In this case, the Least Significant bit (bit 16 of the accumulator) of ACCxH is
examined.
• If it is ‘1’, ACCxH is incremented.
• If it is ‘0’, ACCxH is not modified. Assuming that
bit 16 is effectively random in nature, this scheme
removes any rounding bias that may accumulate.
The SAC and SAC.R instructions store either a
truncated (SAC), or rounded (SAC.R) version of the
contents of the target accumulator to data memory via
the X bus, subject to data saturation (see
Section 2.6.2.4 “Data Space Write Saturation”). For
the MAC class of instructions, the accumulator
write-back operation functions in the same manner,
addressing combined MCU (X and Y) data space
though the X bus. For this class of instructions, the data
is always subject to rounding.
Preliminary
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
2.6.2.4
Data Space Write Saturation
2.6.3
BARREL SHIFTER
In addition to adder/subtracter saturation, writes to data
space can also be saturated but without affecting the
contents of the source accumulator. The data space
write saturation logic block accepts a 16-bit, 1.15
fractional value from the round logic block as its input,
together with overflow status from the original source
(accumulator) and the 16-bit round adder. These inputs
are combined and used to select the appropriate 1.15
fractional value as output to write to data space
memory.
The barrel shifter can perform up to 16-bit arithmetic or
logic right shifts, or up to 16-bit left shifts in a single
cycle. The source can be either of the two DSP
accumulators or the X bus (to support multi-bit shifts of
register or memory data).
If the SATDW bit in the CORCON register is set, data
(after rounding or truncation) is tested for overflow and
adjusted accordingly:
The barrel shifter is 40 bits wide, thereby obtaining a
40-bit result for DSP shift operations and a 16-bit result
for MCU shift operations. Data from the X bus is
presented to the barrel shifter between bit positions 16
and 31 for right shifts, and between bit positions 0 and
16 for left shifts.
• For input data greater than 0x007FFF, data written to memory is forced to the maximum positive
1.15 value, 0x7FFF.
• For input data less than 0xFF8000, data written to
memory is forced to the maximum negative 1.15
value, 0x8000.
The shifter requires a signed binary value to determine
both the magnitude (number of bits) and direction of the
shift operation. A positive value shifts the operand right.
A negative value shifts the operand left. A value of ‘0’
does not modify the operand.
The Most Significant bit of the source (bit 39) is used to
determine the sign of the operand being tested.
If the SATDW bit in the CORCON register is not set, the
input data is always passed through unmodified under
all conditions.
© 2007 Microchip Technology Inc.
Preliminary
DS70264B-page 21
dsPIC33FJ12GP201/202
NOTES:
DS70264B-page 22
Preliminary
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
3.0
Note:
MEMORY ORGANIZATION
3.1
The program address memory space of the
dsPIC33FJ12GP201/202 devices is 4M instructions. The
space is addressable by a 24-bit value derived either from
the 23-bit PC during program execution, or from table
operation or data space remapping as described in
Section 3.6 “Interfacing Program and Data Memory
Spaces”.
This data sheet summarizes the features
of the dsPIC33FJ12GP201/202 devices. It
is not intended to be a comprehensive
reference source. To complement the
information in this data sheet, refer to the
“dsPIC33F Family Reference Manual”.
Please see the Microchip web site
(www.microchip.com) for the latest
dsPIC33F Family Reference Manual
sections.
The dsPIC33FJ12GP201/202 architecture features
separate program and data memory spaces and
buses. This architecture also allows the direct access
of program memory from the data space during code
execution.
FIGURE 3-1:
Program Address Space
User application access to the program memory space
is restricted to the lower half of the address range
(0x000000 to 0x7FFFFF). The exception is the use of
TBLRD/TBLWT operations, which use TBLPAG<7> to
permit access to the Configuration bits and Device ID
sections of the configuration memory space.
The memory map for the dsPIC33FJ12GP201/202 device
is shown in Figure 3-1.
PROGRAM MEMORY FOR dsPIC33FJ12GP201/202 DEVICES
User Memory Space
dsPIC33FJ12GP201/202
GOTO Instruction
Reset Address
Interrupt Vector Table
Reserved
Alternate Vector Table
User Program
Flash Memory
(4K instructions)
0x000000
0x000002
0x000004
0x0000FE
0x000100
0x000104
0x0001FE
0x000200
0x001FFE
0x002000
Unimplemented
(Read ‘0’s)
0x7FFFFE
0x800000
Configuration Memory Space
Reserved
Device Configuration
Registers
Reserved
DEVID (2)
© 2007 Microchip Technology Inc.
0xF7FFFE
0xF80000
0xF80017
0xF80018
Preliminary
0xFEFFFE
0xFF0000
0xFFFFFE
DS70264B-page 23
dsPIC33FJ12GP201/202
3.1.1
PROGRAM MEMORY
ORGANIZATION
3.1.2
All dsPIC33FJ12GP201/202 devices reserve the
addresses between 0x00000 and 0x000200 for
hard-coded program execution vectors. A hardware
Reset vector is provided to redirect code execution
from the default value of the PC on device Reset to the
actual start of code. A GOTO instruction is programmed
by the user application at 0x000000, with the actual
address for the start of code at 0x000002.
The program memory space is organized in
word-addressable blocks. Although it is treated as
24 bits wide, it is more appropriate to think of each
address of the program memory as a lower and upper
word, with the upper byte of the upper word being
unimplemented. The lower word always has an even
address, while the upper word has an odd address
(Figure 3-2).
dsPIC33FJ12GP201/202 devices also have two
interrupt vector tables, located from 0x000004 to
0x0000FF and 0x000100 to 0x0001FF. These vector
tables allow each of the many device interrupt sources
to be handled by separate Interrupt Service Routines
(ISRs). A more detailed discussion of the interrupt
vector tables is provided in Section 6.1 “Interrupt
Vector Table”.
Program memory addresses are always word-aligned
on the lower word, and addresses are incremented or
decremented by two during code execution. This
arrangement provides compatibility with data memory
space addressing and makes data in the program
memory space accessible.
FIGURE 3-2:
msw
Address
PROGRAM MEMORY ORGANIZATION
16
8
PC Address
(lsw Address)
0
0x000000
0x000002
0x000004
0x000006
00000000
00000000
00000000
00000000
Program Memory
‘Phantom’ Byte
(read as ‘0’)
DS70264B-page 24
least significant word
most significant word
23
0x000001
0x000003
0x000005
0x000007
INTERRUPT AND TRAP VECTORS
Instruction Width
Preliminary
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
3.2
Data Address Space
The dsPIC33FJ12GP201/202 CPU has a separate
16-bit-wide data memory space. The data space is
accessed using separate Address Generation Units
(AGUs) for read and write operations. The data
memory maps is shown in Figure 3-3.
All Effective Addresses (EAs) in the data memory space
are 16 bits wide and point to bytes within the data space.
This arrangement gives a data space address range of
64 Kbytes or 32K words. The lower half of the data
memory space (that is, when EA<15> = 0) is used for
implemented memory addresses, while the upper half
(EA<15> = 1) is reserved for the Program Space
Visibility area (see Section 3.6.3 “Reading Data From
Program Memory Using Program Space Visibility”).
dsPIC33FJ12GP201/202 devices implement up to
30 Kbytes of data memory. Should an EA point to a
location outside of this area, an all-zero word or byte
will be returned.
3.2.1
DATA SPACE WIDTH
The data memory space is organized in byte addressable, 16-bit-wide blocks. Data is aligned in data
memory and registers as 16-bit words, but all data
space EAs resolve to bytes. The Least Significant
Bytes (LSBs) of each word have even addresses, while
the Most Significant Bytes (MSBs) have odd
addresses.
3.2.2
DATA MEMORY ORGANIZATION
AND ALIGNMENT
To maintain backward compatibility with PIC® MCU
devices and improve data space memory usage
efficiency, the dsPIC33FJ12GP201/202 instruction set
supports both word and byte operations. As a consequence of byte accessibility, all effective address calculations are internally scaled to step through
word-aligned memory. For example, the core recognizes that Post-Modified Register Indirect Addressing
mode [Ws++] will result in a value of Ws + 1 for byte
operations and Ws + 2 for word operations.
Data byte reads will read the complete word that
contains the byte, using the LSB of any EA to
determine which byte to select. The selected byte is
placed onto the LSB of the data path. That is, data
memory and registers are organized as two parallel
byte-wide entities with shared (word) address decode
but separate write lines. Data byte writes only write to
the corresponding side of the array or register that
matches the byte address.
© 2007 Microchip Technology Inc.
All word accesses must be aligned to an even address.
Misaligned word data fetches are not supported, so
care must be taken when mixing byte and word operations, or translating from 8-bit MCU code. If a misaligned read or write is attempted, an address error
trap is generated. If the error occurred on a read, the
instruction underway is completed. If the instruction
occurred on a write, the instruction is executed but the
write does not occur. In either case, a trap is then executed, allowing the system and/or user application to
examine the machine state prior to execution of the
address Fault.
All byte loads into any W register are loaded into the
Least Significant Byte. The Most Significant Byte is not
modified.
A sign-extend instruction (SE) is provided to allow
users to translate 8-bit signed data to 16-bit signed
values. Alternatively, for 16-bit unsigned data, user
applications can clear the MSB of any W register by
executing a zero-extend (ZE) instruction on the
appropriate address.
3.2.3
SFR SPACE
The first 2 Kbytes of the near data space, from 0x0000
to 0x07FF, is primarily occupied by Special Function
Registers (SFRs). These are used by the
dsPIC33FJ12GP201/202 core and peripheral modules
for controlling the operation of the device.
SFRs are distributed among the modules that they
control, and are generally grouped together by module.
Much of the SFR space contains unused addresses;
these are read as ‘0’. A complete listing of implemented
SFRs, including their addresses, is shown in Table 3-1
through Table 3-21.
Note:
3.2.4
The actual set of peripheral features and
interrupts varies by the device. Refer to
the corresponding device tables and
pinout diagrams for device-specific
information.
NEAR DATA SPACE
The 8-Kbyte area between 0x0000 and 0x1FFF is
referred to as the near data space. Locations in this
space are directly addressable via a 13-bit absolute
address field within all memory direct instructions.
Additionally, the whole data space is addressable using
MOV instructions, which support Memory Direct
Addressing mode with a 16-bit address field, or by
using Indirect Addressing mode using a working
register as an address pointer.
Preliminary
DS70264B-page 25
dsPIC33FJ12GP201/202
FIGURE 3-3:
DATA MEMORY MAP FOR dsPIC33FJ12GP201/202 DEVICES WITH 1 KB RAM
MSB
Address
MSb
2 Kbyte
SFR Space
1 Kbyte
SRAM Space
LSB
Address
16 bits
LSb
0x0000
0x0001
SFR Space
0x07FF
0x0801
0x09FF
0x0A01
X Data RAM (X)
Y Data RAM (Y)
0x0BFF
0x0C01
0x09FE
0x0A00
8-Kbyte
Near Data Space
0x0BFE
0x0C00
0x1FFF
0x2001
0x1FFFF
0x2000
0x8001
0x8000
X Data
Unimplemented (X)
Optionally
Mapped
into Program
Memory
0xFFFF
DS70264B-page 26
0x07FE
0x0800
0xFFFE
Preliminary
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
3.2.5
X AND Y DATA SPACES
The core has two data spaces, X and Y. These data
spaces can be considered either separate (for some
DSP instructions), or as one unified linear address
range (for MCU instructions). The data spaces are
accessed using two Address Generation Units (AGUs)
and separate data paths. This feature allows certain
instructions to concurrently fetch two words from RAM,
thereby enabling efficient execution of DSP algorithms
such as Finite Impulse Response (FIR) filtering and
Fast Fourier Transform (FFT).
The X data space is used by all instructions and
supports all addressing modes. X data space has
separate read and write data buses. The X read data
bus is the read data path for all instructions that view
data space as combined X and Y address space. It is
also the X data prefetch path for the dual operand DSP
instructions (MAC class).
The Y data space is used in concert with the X data
space by the MAC class of instructions (CLR, ED,
EDAC, MAC, MOVSAC, MPY, MPY.N and MSC) to
provide two concurrent data read paths.
Both the X and Y data spaces support Modulo
Addressing mode for all instructions, subject to
addressing mode restrictions. Bit-Reversed Addressing
mode is only supported for writes to X data space.
All data memory writes, including in DSP instructions,
view data space as combined X and Y address space.
The boundary between the X and Y data spaces is
device-dependent and is not user-programmable.
All effective addresses are 16 bits wide and point to
bytes within the data space. Therefore, the data space
address range is 64 Kbytes, or 32K words, though the
implemented memory locations vary by device.
© 2007 Microchip Technology Inc.
Preliminary
DS70264B-page 27
SFR Name
CPU CORE REGISTERS MAP
SFR
Addr
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
All
Resets
Preliminary
WREG0
0000
Working Register 0
0000
WREG1
0002
Working Register 1
0000
WREG2
0004
Working Register 2
0000
WREG3
0006
Working Register 3
0000
WREG4
0008
Working Register 4
0000
WREG5
000A
Working Register 5
0000
WREG6
000C
Working Register 6
0000
WREG7
000E
Working Register 7
0000
WREG8
0010
Working Register 8
0000
WREG9
0012
Working Register 9
0000
WREG10
0014
Working Register 10
0000
WREG11
0016
Working Register 11
0000
WREG12
0018
Working Register 12
0000
WREG13
001A
Working Register 13
0000
WREG14
001C
Working Register 14
0000
WREG15
001E
Working Register 15
0800
SPLIM
0020
Stack Pointer Limit Register
xxxx
PCL
002E
Program Counter Low Word Register
PCH
0030
—
—
—
—
—
—
—
—
Program Counter High Byte Register
0000
TBLPAG
0032
—
—
—
—
—
—
—
—
Table Page Address Pointer Register
0000
PSVPAG
0034
—
—
—
—
—
—
—
—
Program Memory Visibility Page Address Pointer Register
0000
RCOUNT
0036
Repeat Loop Counter Register
xxxx
DCOUNT
0038
DCOUNT<15:0>
xxxx
0000
© 2007 Microchip Technology Inc.
DOSTARTL
003A
DOSTARTH
003C
DOSTARTL<15:1>
DOENDL
003E
DOENDH
0040
—
—
—
—
—
—
—
—
—
—
SR
0042
OA
OB
SA
SB
OAB
SAB
DA
DC
IPL2
IPL1
IPL0
RA
N
OV
Z
C
CORCON
0044
—
—
—
US
EDT
SATA
SATB
SATDW
ACCSAT
IPL3
PSV
RND
IF
MODCON
0046
XMODEN
YMODEN
—
—
—
—
—
—
—
—
—
—
—
—
BWM<3:0>
xxxx
0
xxxx
00xx
DOENDL<15:1>
DL<2:0>
0
DOSTARTH<5:0>
DOENDH
YWM<3:0>
00xx
XWM<3:0>
0000
0000
0000
XMODSRT
0048
XS<15:1>
0
XMODEND
004A
XE<15:1>
1
xxxx
YMODSRT
004C
YS<15:1>
0
xxxx
1
xxxx
YMODEND
004E
XBREV
0050
BREN
DISICNT
0052
—
Legend:
YE<15:1>
XB<14:0>
—
Disable Interrupts Counter Register
x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
xxxx
xxxx
xxxx
dsPIC33FJ12GP201/202
DS70264B-page 28
TABLE 3-1:
© 2007 Microchip Technology Inc.
TABLE 3-2:
CHANGE NOTIFICATION REGISTER MAP FOR dsPIC33FJ12GP202
SFR
Name
SFR
Addr
Bit 15
Bit 14
Bit 13
Bit 12
CNEN1
0060
CN15IE
CN14IE
CN13IE
CNEN2
0062
—
CN30IE
CN29IE
CNPU1
0068
CNPU2
006A
Legend:
Bit 11
Bit 10
Bit 9
CN12IE
CN11IE
—-
—
—
CN7IE
—
CN27IE
—
—
CN24IE
CN23IE
—
—
—
CN7PUE
CN6PUE
—
—
CN15PUE CN14PUE CN13PUE CN12PUE CN11PUE
—
CN30PUE CN29PUE
—
CN27PUE
Bit 8
Bit 7
Bit 6
Bit 0
All
Resets
CN1IE
CN0IE
0000
—
—
CN16IE
0000
CN3PUE
CN2PUE
CN1PUE
CN0PUE
0000
—
—
—
CN16PUE
0000
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
CN6IE
CN5IE
CN4IE
CN3IE
CN2IE
CN22IE
CN21IE
—
—
CN5PUE
CN4PUE
—
CN24PUE CN23PUE CN22PUE CN21PUE
x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
TABLE 3-3:
CHANGE NOTIFICATION REGISTER MAP FOR dsPIC33FJ12GP201
SFR
Addr
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
All
Resets
CNEN1
0060
—
—
—
CN12IE
CN11IE
—
—
—
—
—
CN5IE
CN4IE
CN3IE
CN2IE
CN1IE
CN0IE
0000
CNEN2
0062
—
CN30IE
CN29IE
—
—
—
—
—
CN23IE
CN22IE
CN21IE
—
—
—
—
—
0000
CNPU1
0068
—
—
—
—
—
—
—
—
CN5PUE
CN4PUE
CNPU2
006A
—
—
—
—
Legend:
CN30PUE CN29PUE
CN12PUE CN11PUE
—
—
CN23PUE CN22PUE CN21PUE
x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
—
CN3PUE CN2PUE CN1PUE CN0PUE
—
—
—
—
0000
0000
DS70264B-page 29
dsPIC33FJ12GP201/202
Preliminary
SFR
Name
SFR
Name
SFR
Addr
INTERRUPT CONTROLLER REGISTER MAP
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
INTCON1
0080
NSTDIS OVAERR OVBERR COVAERR COVBERR OVATE
INTCON2
0082
ALTIVT
DISI
IFS0
0084
—
IFS1
0086
—
IFS4
008C
IEC0
Bit 8
OVBTE
COVTE
—
—
Bit 7
Bit 6
SFTACERR DIV0ERR
Bit 5
—
—
—
—
T3IE
T2IE
OC2IE
—
—
IC8IE
—
—
—
IC1IF
INT0IF
0000
MI2C1IF
SI2C1IF
0000
Preliminary
—
—
—
—
—
—
—
—
—
—
0094
—
—
AD1IE
U1TXIE
U1RXIE
IEC1
0096
—
—
INT2IE
—
—
—
IEC4
009C
—
—
—
—
—
—
IPC0
00A4
—
IPC1
00A6
IPC2
00A8
IPC3
00AA
—
—
—
—
—
IPC4
00AC
—
CNIP<2:0>
—
—
—
—
IPC5
00AE
—
IC8IP<2:0>
—
IPC7
00B2
—
—
—
—
—
—
—
—
—
INT2IP<2:0>
—
—
—
—
4444
IPC16
00C4
—
—
—
—
—
—
—
—
—
U1EIP<2:0>
—
—
—
—
4444
INTTREG
00E0
—
—
—
—
Legend:
—
0000
U1RXIF
—
—
0000
INT0EP
—
—
IC2IF
IC7IF
—
INT1EP
U1TXIF
—
OC2IF
IC8IF
OSCFAIL
AD1IF
SPI1IF SPI1EIF
SPI1IE SPI1EIE
OC1IP<2:0>
—
—
OC2IP<2:0>
—
SPI1IP<2:0>
IC7IP<2:0>
ILR<3:0>>
—
All
Resets
INT2IF
T2IP<2:0>
T2IF
—
MATHERR ADDRERR STKERR
Bit 0
—
U1RXIP<2:0>
T3IF
Bit 1
—
—
—
Bit 2
—
—
—
Bit 3
—
—
—
Bit 4
—
T1IP<2:0>
—
Bit 9
—
INT2EP
—
T1IF
OC1IF
INT1IF
CNIF
—
—
—
—
U1EIF
—
0000
IC2IE
—
T1IE
OC1IE
IC1IE
INT0IE
0000
IC7IE
—
INT1IE
CNIE
—
—
—
—
—
—
IC1IP<2:0>
—
—
IC2IP<2:0>
—
—
SPI1EIP<2:0>
—
—
AD1IP<2:0>
—
MI2C1IP<2:0>
—
—
x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
—
—
—
MI2C1IE SI2C1IE
U1EIE
—
INT0IP<2:0>
—
—
0000
0000
4444
—
4444
T3IP<2:0>
4444
—
U1TXIP<2:0>
4444
—
SI2C1IP<2:0>
4444
—
INT1IP<2:0>
VECNUM<6:0>
4444
4444
dsPIC33FJ12GP201/202
DS70264B-page 30
TABLE 3-4:
© 2007 Microchip Technology Inc.
© 2007 Microchip Technology Inc.
TABLE 3-5:
TIMER REGISTER MAP
SFR Name
SFR
Addr
TMR1
0100
Timer1 Register
PR1
0102
Period Register 1
T1CON
0104
TMR2
0106
Timer2 Register
xxxx
TMR3HLD
0108
Timer3 Holding Register (for 32-bit timer operations only)
xxxx
TMR3
010A
Timer3 Register
xxxx
PR2
010C
Period Register 2
FFFF
PR3
010E
Period Register 3
T2CON
0110
TON
—
TSIDL
—
—
—
—
—
—
TGATE
TCKPS<1:0>
T32
—
TCS
—
0000
T3CON
0112
TON
—
TSIDL
—
—
—
—
—
—
TGATE
TCKPS<1:0>
—
—
TCS
—
0000
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
All
Resets
ICI<1:0>
ICOV
ICBNE
ICM<2:0>
ICI<1:0>
ICOV
ICBNE
ICM<2:0>
ICI<1:0>
ICOV
ICBNE
ICM<2:0>
ICI<1:0>
ICOV
ICBNE
ICM<2:0>
Bit 4
Bit 3
Legend:
—
Bit 13
TSIDL
Bit 12
—
Bit 11
—
Bit 10
—
Bit 9
—
Bit 8
—
Bit 7
—
Bit 6
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
All
Resets
xxxx
FFFF
TGATE
TCKPS<1:0>
—
TSYNC
TCS
—
0000
FFFF
IC1BUF
0140
IC1CON
0142
IC2BUF
0144
IC2CON
0146
IC7BUF
0158
IC7CON
015A
IC8BUF
015C
IC8CON
015E
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
—
—
ICSIDL
—
—
—
—
Bit 8
Bit 7
Bit 6
Bit 5
Input 1 Capture Register
—
xxxx
ICTMR
0000
Input 2 Capture Register
—
—
ICSIDL
—
—
—
—
—
xxxx
ICTMR
0000
Input 7 Capture Register
—
—
ICSIDL
—
—
—
—
—
xxxx
ICTMR
0000
Input 8Capture Register
—
—
ICSIDL
—
—
—
—
—
xxxx
ICTMR
0000
x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
TABLE 3-7:
OUTPUT COMPARE REGISTER MAP
SFR
Addr
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
DS70264B-page 31
OC1RS
0180
Output Compare 1 Secondary Register
OC1R
0182
Output Compare 1 Register
OC1CON
0184
OC2RS
0186
Output Compare 2 Secondary Register
OC2R
0188
Output Compare 2 Register
OC2CON
018A
—
—
—
—
OCSIDL
OCSIDL
—
—
—
—
—
—
—
—
—
—
—
—
x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
Bit 5
Bit 2
Bit 1
Bit 0
All
Resets
xxxx
xxxx
—
—
OCFLT
OCTSEL
OCM<2:0>
0000
xxxx
xxxx
—
—
OCFLT
OCTSEL
OCM<2:0>
0000
dsPIC33FJ12GP201/202
Preliminary
SFR
Addr
Legend:
Bit 5
INPUT CAPTURE REGISTER MAP
SFR Name
SFR Name
TON
Bit 14
x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
TABLE 3-6:
Legend:
Bit 15
I2C1 REGISTER MAP
SFR Name
SFR
Addr
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
I2C1RCV
0200
—
—
—
—
—
—
—
—
Receive Register
0000
I2C1TRN
0202
—
—
—
—
—
—
—
—
Transmit Register
00FF
I2C1BRG
0204
—
—
—
—
—
—
—
I2C1CON
0206
I2CEN
—
I2CSIDL
SCLREL
IPMIEN
A10M
DISSLW
SMEN
GCEN
STREN
ACKDT
ACKEN
RCEN
PEN
RSEN
SEN
1000
I2C1STAT
0208
ACKSTAT
TRSTAT
—
—
—
BCL
GCSTAT
ADD10
IWCOL
I2COV
D_A
P
S
R_W
RBF
TBF
0000
I2C1ADD
020A
—
—
—
—
—
—
Address Register
0000
I2C1MSK
020C
—
—
—
—
—
—
Address Mask Register
0000
Legend:
x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
TABLE 3-9:
Bit 7
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
All
Resets
0000
UART1 REGISTER MAP
Preliminary
SFR Name
U1MODE
0220
UARTEN
U1STA
0222
UTXISEL1
U1TXREG
0224
—
—
U1RXREG
0226
—
—
U1BRG
0228
Legend:
x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
SFR
Name
Bit 5
Baud Rate Generator Register
SFR
Addr
TABLE 3-10:
Bit 6
Bit 15
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
UEN1
UEN0
WAKE
LPBACK
UTXBF
TRMT
Bit 4
Bit 3
ABAUD
URXINV
BRGH
ADDEN
RIDLE
PERR
Bit 2
Bit 1
STSEL
0000
URXDA
0110
Bit 12
—
USIDL
IREN
RTSMD
—
—
UTXBRK
UTXEN
—
—
—
—
—
UART Transmit Register
xxxx
—
—
—
—
—
UART Receive Register
0000
URXISEL<1:0>
Bit 5
All
Resets
Bit 13
UTXINV UTXISEL0
Bit 11
Bit 0
Bit 14
PDSEL<1:0>
FERR
OERR
Baud Rate Generator Prescaler
0000
SPI1 REGISTER MAP
© 2007 Microchip Technology Inc.
SFR
Addr
Bit 15
Bit 14
Bit 13
SPI1STAT
0240
SPIEN
—
SPISIDL
—
—
—
—
SPI1CON1
0242
—
—
—
DISSCK
DISSDO
MODE16
SMP
SPI1CON2
0244
FRMEN
SPIFSD
FRMPOL
—
—
—
—
—
SPI1BUF
0248
Legend:
x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
—
—
CKE
SSEN
SPIROV
—
—
CKP
MSTEN
—
—
—
SPI1 Transmit and Receive Buffer Register
Bit 3
Bit 2
Bit 1
Bit 0
All
Resets
—
—
SPITBF
SPIRBF
0000
SPRE<2:0>
—
—
PPRE<1:0>
—
FRMDLY
—
0000
0000
0000
dsPIC33FJ12GP201/202
DS70264B-page 32
TABLE 3-8:
© 2007 Microchip Technology Inc.
TABLE 3-11:
PERIPHERAL PIN SELECT INPUT REGISTER MAP
File
Name
Addr
Bit 15
Bit 14
Bit 13
RPINR0
0680
—
—
—
RPINR1
0682
—
—
—
RPINR3
0686
—
—
—
T3CKR<4:0>
RPINR7
068E
—
—
—
RPINR10
0694
—
—
—
RPINR11
0696
—
—
—
RPINR18
06A4
—
—
—
U1CTSR<4:0>
RPINR20
06A8
—
—
—
SCK1R<4:0>
RPINR21
06AA
—
—
—
Legend:
Bit 11
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
All
Resets
—
—
—
—
—
—
—
—
1F00
—
—
—
INT2R<4:0>
001F
—
—
—
T2CKR<4:0>
1F1F
IC2R<4:0>
—
—
—
IC1R<4:0>
1F1F
IC8R<4:0>
—
—
—
IC7R<4:0>
1F1F
—
—
—
OCFAR<4:0>
001F
—
—
—
U1RXR<4:0>
1F1F
—
—
—
SDI1R<4:0>
1F1F
—
—
—
SS1R<4:0>
001F
Bit 10
Bit 9
Bit 8
INT1R<4:0>
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
TABLE 3-12:
PERIPHERAL PIN SELECT OUTPUT REGISTER MAP FOR dsPIC33FJ12GP202
Addr
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
All
Resets
RPOR0
06C0
—
—
—
RP1R<4:0>
—
—
—
RP0R<4:0>
0000
RPOR1
06C2
—
—
—
RP3R<4:0>
—
—
—
RP2R<4:0>
0000
RPOR2
06C4
—
—
—
RP5R<4:0>
—
—
—
RP4R<4:0>
0000
RPOR3
06C6
—
—
—
RP7R<4:0>
—
—
—
RP6R<4:0>
0000
RPOR4
06C8
—
—
—
RP9R<4:0>
—
—
—
RP8R<4:0>
0000
RPOR5
06CA
—
—
—
RP11R<4:0>
—
—
—
RP10R<4:0>
0000
RPOR6
06CC
—
—
—
RP13R<4:0>
—
—
—
RP12R<4:0>
0000
RPOR7
06CE
—
—
—
RP15R<4:0>
—
—
—
RP14R<4:0>
0000
Legend:
x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
TABLE 3-13:
File Name
PERIPHERAL PIN SELECT OUTPUT REGISTER MAP FOR dsPIC33FJ12GP201
Addr
Bit 15
Bit 14
Bit 13
DS70264B-page 33
Bit 12
Bit 11
—
—
Bit 10
Bit 9
Bit 8
—
—
RP1R<4:0>
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
—
—
—
RP0R<4:0>
—
—
—
RP4R<4:0>
Bit 1
Bit 0
All
Resets
RPOR0
06C0
—
—
—
RPOR2
06C4
—
—
—
RPOR3
06C6
—
—
—
RP7R<4:0>
—
—
—
RPOR4
06C8
—
—
—
RP9R<4:0>
—
—
—
RP8R<4:0>
0000
RPOR7
Legend:
—
—
—
RP15R<4:0>
—
06CE
x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
—
—
RP14R<4:0>
0000
—
—
—
—
0000
0000
—
—
0000
dsPIC33FJ12GP201/202
Preliminary
File
Name
Bit 12
ADC1 REGISTER MAP FOR dsPIC33FJ12GP201
Preliminary
Addr
ADC1BUF0
0300
ADC Data Buffer 0
xxxx
ADC1BUF1
0302
ADC Data Buffer 1
xxxx
ADC1BUF2
0304
ADC Data Buffer 2
xxxx
ADC1BUF3
0306
ADC Data Buffer 3
xxxx
ADC1BUF4
0308
ADC Data Buffer 4
xxxx
ADC1BUF5
030A
ADC Data Buffer 5
xxxx
ADC1BUF6
030C
ADC Data Buffer 6
xxxx
ADC1BUF7
030E
ADC Data Buffer 7
xxxx
ADC1BUF8
0310
ADC Data Buffer 8
xxxx
ADC1BUF9
0312
ADC Data Buffer 9
xxxx
ADC1BUFA
0314
ADC Data Buffer 10
xxxx
ADC1BUFB
0316
ADC Data Buffer 11
xxxx
ADC1BUFC
0318
ADC Data Buffer 12
xxxx
ADC1BUFD
031A
ADC Data Buffer 13
xxxx
ADC1BUFE
031C
ADC Data Buffer 14
xxxx
ADC1BUFE
031E
AD1CON1
0320
AD1CON2
0322
AD1CON3
0324
ADRC
—
—
AD1CHS123
0326
—
—
—
AD1CHS0
0328
CH0NB
—
—
AD1PCFGL
032C
—
—
—
—
—
—
—
AD1CSSL
0330
—
—
—
—
—
—
—
Legend:
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
All
Resets
File Name
ADC Data Buffer 15
ADON
—
ADSIDL
VCFG<2:0>
—
—
AD12B
FORM<1:0>
—
—
CSCNA
CHPS<1:0>
—
CH123NB<1:0>
—
SIMSAM
ASAM
DONE
0000
BUFM
ALTS
0000
—
—
—
—
—
—
CH0NA
—
—
—
—
—
PCFG5
PCFG4
PCFG3
PCFG2
PCFG1
PCFG0
0000
—
—
—
CSS5
CSS4
CSS3
CSS2
CSS1
CSS0
0000
CH123SB
CH0SB<4:0>
x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
SMPI<3:0>
SAMP
BUFS
SAMC<4:0>
—
xxxx
SSRC<2:0>
ADCS<5:0>
—
—
0000
CH123NA<1:0>
CH123SA
CH0SA<4:0>
0000
0000
dsPIC33FJ12GP201/202
DS70264B-page 34
TABLE 3-14:
© 2007 Microchip Technology Inc.
© 2007 Microchip Technology Inc.
TABLE 3-15:
ADC1 REGISTER MAP FOR dsPIC33FJ12GP202
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
All
Resets
Addr
ADC1BUF0
0300
ADC Data Buffer 0
xxxx
ADC1BUF1
0302
ADC Data Buffer 1
xxxx
ADC1BUF2
0304
ADC Data Buffer 2
xxxx
ADC1BUF3
0306
ADC Data Buffer 3
xxxx
ADC1BUF4
0308
ADC Data Buffer 4
xxxx
ADC1BUF5
030A
ADC Data Buffer 5
xxxx
ADC1BUF6
030C
ADC Data Buffer 6
xxxx
ADC1BUF7
030E
ADC Data Buffer 7
xxxx
ADC1BUF8
0310
ADC Data Buffer 8
xxxx
ADC1BUF9
0312
ADC Data Buffer 9
xxxx
ADC1BUFA
0314
ADC Data Buffer 10
xxxx
ADC1BUFB
0316
ADC Data Buffer 11
xxxx
ADC1BUFC
0318
ADC Data Buffer 12
xxxx
ADC1BUFD
031A
ADC Data Buffer 13
xxxx
ADC1BUFE
031C
ADC Data Buffer 14
xxxx
ADC1BUFF
031E
AD1CON1
0320
AD1CON2
0322
AD1CON3
0324
ADRC
—
—
AD1CHS123
0326
—
—
—
AD1CHS0
0328
CH0NB
—
—
AD1PCFGL
032C
—
—
0330
—
—
AD1CSSL
Legend:
ADC Data Buffer 15
ADON
—
ADSIDL
xxxx
—
—
AD12B
FORM<1:0>
—
—
CSCNA
CHPS<1:0>
—
—
CH0NA
—
—
—
—
—
—
PCFG9
PCFG8
PCFG7
PCFG6
—
—
—
—
CSS9
CSS8
CSS7
CSS6
VCFG<2:0>
SAMC<4:0>
CH123NB<1:0>
CH123SB
CH0SB<4:0>
SSRC<2:0>
BUFS
—
—
—
—
—
x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
—
SIMSAM
ASAM
SMPI<3:0>
SAMP
DONE
0000
BUFM
ALTS
0000
CH123SA
0000
ADCS<5:0>
—
0000
—
—
CH123NA<1:0>
PCFG5
PCFG4
PCFG3
PCFG2
PCFG1
PCFG0
0000
CSS5
CSS4
CSS3
CSS2
CSS1
CSS0
0000
CH0SA<4:0>
0000
DS70264B-page 35
dsPIC33FJ12GP201/202
Preliminary
File Name
PORTA REGISTER MAP
Addr
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
All
Resets
TRISA
02C0
—
—
—
—
—
—
—
—
—
—
—
TRISA4
TRISA3
TRISA2
TRISA1
TRISA0
001F
PORTA
02C2
—
—
—
—
—
—
—
—
—
—
—
RA4
RA3
RA2
RA1
RA0
xxxx
LATA
02C4
—
—
—
—
—
—
—
—
—
—
—
LATA4
LATA3
LATA2
LATA1
LATA0
xxxx
ODCA
02C6
—
—
—
—
—
—
—
—
—
—
—
ODCA4
ODCA3
ODCA2
ODCA1
ODCA0
xxxx
Legend:
x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
File Name
TABLE 3-17:
PORTB REGISTER MAP FOR dsPIC33FJ12GP202
Addr
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
All
Resets
TRISB
02C8
TRISB15
TRISB14
TRISB13
TRISB12
TRISB11
TRISB10
TRISB9
TRISB8
TRISB7
TRISB6
TRISB5
TRISB4
TRISB3
TRISB2
TRISB1
TRISB0
FFFF
PORTB
02CA
RB15
RB14
RB13
RB12
RB11
RB10
RB9
RB8
RB7
RB6
RB5
RB4
RB3
RB2
RB1
RB0
xxxx
LATB
02CC
LATB15
LATB14
LATB13
LATB12
LATB11
LATB10
LATB9
LATB8
LATB7
LATB6
LATB5
LATB4
LATB3
LATB2
LATB1
LATB0
xxxx
ODCB
02CE
ODCB15
ODCB14
ODCB13
ODCB12
ODCB11
ODCB10
ODCB9
ODCB8
ODCB7
ODCB6
ODCB5
ODCB4
ODCB3
ODCB2
ODCB1
ODCB0
xxxx
Legend:
x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
File Name
Preliminary
TABLE 3-18:
File Name
Addr
PORTB REGISTER MAP FOR dsPIC33FJ12GP201
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
All
Resets
TRISB
02C8
—
—
—
—
TRISB9
TRISB8
TRISB7
—
—
TRISB4
—
—
TRISB1
TRISB0
C393
PORTB
02CA
RB15
RB14
—
—
—
—
RB9
RB8
RB7
—
—
RB4
—
—
RB1
RB0
xxxx
LATB
02CC
LATB15
LATB14
—
—
—
—
LATB9
LATB8
LATB7
—
—
LATB4
—
—
LATB1
LATB0
xxxx
ODCB
02CE
ODCB15
ODCB14
—
—
—
—
ODCB9
ODCB8
ODCB7
—
—
ODCB4
—
—
ODCB1
ODCB0
xxxx
Legend:
x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
TABLE 3-19:
TRISB15 TRISB14
SYSTEM CONTROL REGISTER MAP
© 2007 Microchip Technology Inc.
File Name
Addr
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
All
Resets
RCON
0740
TRAPR
IOPUWR
—
—
—
—
CM
VREGS
EXTR
SWR
SWDTEN
WDTO
SLEEP
IDLE
BOR
POR
xxxx(1)
OSCCON
0742
—
—
CF
—
LPOSCEN
OSWEN
0300(2)
COSC<2:0>
—
DOZE<2:0>
DOZEN
NOSC<2:0>
CLKLOCK IOLOCK
LOCK
FRCDIV<2:0>
PLLPOST<1:0>
—
CLKDIV
0744
ROI
PLLFBD
0746
—
—
—
—
—
—
—
OSCTUN
0748
—
—
—
—
—
—
—
Legend:
Note 1:
2:
x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
RCON register Reset values dependent on type of Reset.
OSCCON register Reset values dependent on the FOSC Configuration bits and by type of Reset.
PLLPRE<4:0>
PLLDIV<8:0>
—
—
—
0040
0030
TUN<5:0>
0000
dsPIC33FJ12GP201/202
DS70264B-page 36
TABLE 3-16:
© 2007 Microchip Technology Inc.
TABLE 3-20:
File Name
NVM REGISTER MAP
Addr
Bit 15
Bit 14
Bit 13
NVMCON
0760
WR
WREN
WRERR
—
—
—
NVMKEY
0766
—
—
—
—
—
—
Legend:
Note 1:
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
—
—
—
ERASE
—
—
—
Bit 4
Bit 3
—
Bit 2
Bit 1
Bit 0
All
Resets
0000(1)
NVMOP<3:0>
NVMKEY<7:0>
0000
x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
Reset value shown is for POR only. Value on other Reset states is dependent on the state of memory write or erase operations at the time of Reset.
TABLE 3-21:
File Name
Addr
PMD1
0770
PMD2
0772
Legend:
Bit 12
PMD REGISTER MAP
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
—
—
T3MD
T2MD
T1MD
—
IC8MD
IC7MD
—
—
—
—
Bit 9
Bit 1
Bit 0
All
Resets
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
—
—
I2C1MD
—
U1MD
—
SPI1MD
—
—
AD1MD
0000
IC2MD
IC1MD
—
—
—
—
—
—
OC2MD
OC1MD
0000
x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
DS70264B-page 37
dsPIC33FJ12GP201/202
Preliminary
dsPIC33FJ12GP201/202
3.2.6
3.2.7
SOFTWARE STACK
In addition to its use as a working register, the W15
register in the dsPIC33FJ12GP201/202 devices is also
used as a software Stack Pointer. The Stack Pointer
always points to the first available free word and grows
from lower to higher addresses. It pre-decrements for
stack pops and post-increments for stack pushes, as
shown in Figure 3-4. For a PC push during any CALL
instruction, the MSB of the PC is zero-extended before
the push, ensuring that the MSB is always clear.
Note:
A PC push during exception processing
concatenates the SRL register to the MSB
of the PC prior to the push.
The Stack Pointer Limit register (SPLIM) associated
with the Stack Pointer sets an upper address boundary
for the stack. SPLIM is uninitialized at Reset. As is the
case for the Stack Pointer, SPLIM<0> is forced to ‘0’
because all stack operations must be word-aligned.
When an EA is generated using W15 as a source or
destination pointer, the resulting address is compared
with the value in SPLIM. If the contents of the Stack
Pointer (W15) and the SPLIM register are equal and a
push operation is performed, a stack error trap will not
occur. The stack error trap will occur on a subsequent
push operation. For example, to cause a stack error
trap when the stack grows beyond address 0x2000 in
RAM, initialize the SPLIM with the value 0x1FFE.
Similarly, a Stack Pointer underflow (stack error) trap is
generated when the Stack Pointer address is found to
be less than 0x0800. This prevents the stack from
interfering with the Special Function Register (SFR)
space.
DATA RAM PROTECTION FEATURE
The dsPIC33F product family supports Data RAM
protection features that enable segments of RAM to be
protected when used in conjunction with Boot and
Secure Code Segment Security. BSRAM (Secure RAM
segment for BS) is accessible only from the Boot
Segment Flash code when enabled. SSRAM (Secure
RAM segment for RAM) is accessible only from the
Secure Segment Flash code when enabled. See
Table 3-1 for an overview of the BSRAM and SSRAM
SFRs.
3.3
Instruction Addressing Modes
The addressing modes shown in Table 3-22 form the
basis of the addressing modes optimized to support the
specific features of individual instructions. The
addressing modes provided in the MAC class of
instructions differ from those in the other instruction
types.
3.3.1
FILE REGISTER INSTRUCTIONS
Most file register instructions use a 13-bit address field
(f) to directly address data present in the first 8192
bytes of data memory (near data space). Most file
register instructions employ a working register, W0,
which is denoted as WREG in these instructions. The
destination is typically either the same file register or
WREG (with the exception of the MUL instruction),
which writes the result to a register or register pair. The
MOV instruction allows additional flexibility and can
access the entire data space.
3.3.2
MCU INSTRUCTIONS
A write to the SPLIM register should not be immediately
followed by an indirect read operation using W15.
The three-operand MCU instructions are of the form:
FIGURE 3-4:
where Operand 1 is always a working register (that is,
the addressing mode can only be register direct), which
is referred to as Wb. Operand 2 can be a W register,
fetched from data memory, or a 5-bit literal. The result
location can be either a W register or a data memory
location. The following addressing modes are
supported by MCU instructions:
Stack Grows Toward
Higher Address
0x0000
15
CALL STACK FRAME
0
PC<15:0>
000000000 PC<22:16>
<Free Word>
W15 (before CALL)
W15 (after CALL)
POP : [--W15]
PUSH : [W15++]
Operand 3 = Operand 1 <function> Operand 2
•
•
•
•
•
Register Direct
Register Indirect
Register Indirect Post-Modified
Register Indirect Pre-Modified
5-bit or 10-bit Literal
Note:
DS70264B-page 38
Preliminary
Not all instructions support all the
addressing modes given above. Individual
instructions can support different subsets
of these addressing modes.
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
TABLE 3-22:
FUNDAMENTAL ADDRESSING MODES SUPPORTED
Addressing Mode
Description
File Register Direct
The address of the file register is specified explicitly.
Register Direct
The contents of a register are accessed directly.
Register Indirect
The contents of Wn forms the Effective Address (EA.)
Register Indirect Post-Modified
The contents of Wn forms the EA. Wn is post-modified (incremented or
decremented) by a constant value.
Register Indirect Pre-Modified
Wn is pre-modified (incremented or decremented) by a signed constant value
to form the EA.
Register Indirect with Register Offset The sum of Wn and Wb forms the EA.
(Register Indexed)
Register Indirect with Literal Offset
3.3.3
The sum of Wn and a literal forms the EA.
MOVE AND ACCUMULATOR
INSTRUCTIONS
Move instructions and the DSP accumulator class of
instructions provide a greater degree of addressing
flexibility than other instructions. In addition to the
addressing modes supported by most MCU instructions, move and accumulator instructions also support
Register Indirect with Register Offset Addressing
mode, also referred to as Register Indexed mode.
Note:
For the MOV instructions, the addressing
mode specified in the instruction can differ
for the source and destination EA.
However, the 4-bit Wb (Register Offset)
field is shared by both source and
destination (but typically only used by
one).
In summary, the following addressing modes are
supported by move and accumulator instructions:
•
•
•
•
•
•
•
•
Register Direct
Register Indirect
Register Indirect Post-modified
Register Indirect Pre-modified
Register Indirect with Register Offset (Indexed)
Register Indirect with Literal Offset
8-bit Literal
16-bit Literal
Note:
3.3.4
The two-source operand prefetch registers must be
members of the set {W8, W9, W10, W11}. For data
reads, W8 and W9 are always directed to the X RAGU,
and W10 and W11 are always directed to the Y AGU.
The effective addresses generated (before and after
modification) must, therefore, be valid addresses within
X data space for W8 and W9 and Y data space for W10
and W11.
Note:
In summary, the following addressing modes are
supported by the MAC class of instructions:
•
•
•
•
•
Register Indirect
Register Indirect Post-Modified by 2
Register Indirect Post-Modified by 4
Register Indirect Post-Modified by 6
Register Indirect with Register Offset (Indexed)
3.3.5
Not all instructions support all the addressing modes given above. Individual instructions may support different subsets of
these addressing modes.
Register Indirect with Register Offset
Addressing mode is available only for W9
(in X space) and W11 (in Y space).
OTHER INSTRUCTIONS
Besides the addressing modes outlined previously, some
instructions use literal constants of various sizes. For
example, BRA (branch) instructions use 16-bit signed literals to specify the branch destination directly, whereas
the DISI instruction uses a 14-bit unsigned literal field. In
some instructions, such as ADD Acc, the source of an
operand or result is implied by the opcode itself. Certain
operations, such as NOP, do not have any operands.
MAC INSTRUCTIONS
The dual source operand DSP instructions (CLR, ED,
EDAC, MAC, MPY, MPY.N, MOVSAC and MSC), also referred
to as MAC instructions, use a simplified set of addressing
modes to allow the user application to effectively
manipulate the data pointers through register indirect
tables.
© 2007 Microchip Technology Inc.
Preliminary
DS70264B-page 39
dsPIC33FJ12GP201/202
3.4
Modulo Addressing
3.4.1
Modulo Addressing mode is a method of providing an
automated means to support circular data buffers using
hardware. The objective is to remove the need for
software to perform data address boundary checks
when executing tightly looped code, as is typical in
many DSP algorithms.
Modulo Addressing can operate in either data or program
space (since the data pointer mechanism is essentially
the same for both). One circular buffer can be supported
in each of the X (which also provides the pointers into
program space) and Y data spaces. Modulo Addressing
can operate on any W register pointer. However, it is not
advisable to use W14 or W15 for Modulo Addressing
since these two registers are used as the Stack Frame
Pointer and Stack Pointer, respectively.
In general, any particular circular buffer can be configured to operate in only one direction, as there are
certain restrictions on the buffer start address (for incrementing buffers), or end address (for decrementing
buffers), based upon the direction of the buffer.
The only exception to the usage restrictions is for
buffers that have a power-of-two length. As these
buffers satisfy the start and end address criteria, they
can operate in a bidirectional mode (that is, address
boundary checks are performed on both the lower and
upper address boundaries).
FIGURE 3-5:
START AND END ADDRESS
The Modulo Addressing scheme requires that a starting
and ending address be specified and loaded into the
16-bit Modulo Buffer Address registers: XMODSRT,
XMODEND, YMODSRT and YMODEND (see
Table 3-1).
Note:
Y space Modulo Addressing EA calculations assume word-sized data (LSB of
every EA is always clear).
The length of a circular buffer is not directly specified. It
is determined by the difference between the
corresponding start and end addresses. The maximum
possible length of the circular buffer is 32K words
(64 Kbytes).
3.4.2
W ADDRESS REGISTER
SELECTION
The Modulo and Bit-Reversed Addressing Control
register, MODCON<15:0>, contains enable flags as well
as a W register field to specify the W Address registers.
The XWM and YWM fields select the registers that will
operate with Modulo Addressing:
• If XWM = 15, X RAGU and X WAGU Modulo
Addressing is disabled.
• If YWM = 15, Y AGU Modulo Addressing is
disabled.
MODULO ADDRESSING OPERATION EXAMPLE
Byte
Address
0x1100
MOV
MOV
MOV
MOV
MOV
MOV
#0x1100, W0
W0, XMODSRT
#0x1163, W0
W0, MODEND
#0x8001, W0
W0, MODCON
MOV
#0x0000, W0
;W0 holds buffer fill value
MOV
#0x1110, W1
;point W1 to buffer
DO
AGAIN, #0x31
MOV
W0, [W1++]
AGAIN: INC W0, W0
;set modulo start address
;set modulo end address
;enable W1, X AGU for modulo
;fill the 50 buffer locations
;fill the next location
;increment the fill value
0x1163
Start Addr = 0x1100
End Addr = 0x1163
Length = 0x0032 words
DS70264B-page 40
Preliminary
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
3.4.3
MODULO ADDRESSING
APPLICABILITY
3.5.1
BIT-REVERSED ADDRESSING
IMPLEMENTATION
Modulo Addressing can be applied to the EA
calculation associated with any W register.
Bit-Reversed Addressing mode is enabled in any of
these situations:
Address boundaries check for addresses equal to:
• BWM bits (W register selection) in the MODCON
register are any value other than ‘15’ (the stack
cannot be accessed using Bit-Reversed
Addressing)
• The BREN bit is set in the XBREV register
• The addressing mode used is Register Indirect
with Pre-Increment or Post-Increment
• The upper boundary addresses for incrementing
buffers
• The lower boundary addresses for decrementing
buffers
It is important to realize that the address boundaries
also check for addresses less than or greater than
these addresses. Address changes can, therefore,
jump beyond boundaries and still be adjusted correctly.
Note:
3.5
The modulo corrected effective address is
written back to the register only when
Pre-Modify or Post-Modify Addressing
mode is used to compute the effective
address. When an address offset (such as
[W7+W2]) is used, Modulo Address correction is performed but the contents of
the register remain unchanged.
If the length of a bit-reversed buffer is M = 2N bytes,
the last ‘N’ bits of the data buffer start address must
be zeros.
XB<14:0> is the Bit-Reversed Address modifier, or
‘pivot point,’ which is typically a constant. In the case of
an FFT computation, its value is equal to half of the FFT
data buffer size.
Note:
Bit-Reversed Addressing
Bit-Reversed Addressing mode is intended to simplify
data re-ordering for radix-2 FFT algorithms. It is
supported by the X AGU for data writes only.
The modifier, which can be a constant value or register
contents, is regarded as having its bit order reversed. The
address source and destination are kept in normal order.
Thus, the only operand requiring reversal is the modifier.
All bit-reversed EA calculations assume
word-sized data (LSB of every EA is
always clear). The XB value is scaled
accordingly to generate compatible (byte)
addresses.
When enabled, Bit-Reversed Addressing is executed
only for Register Indirect with Pre-Increment or
Post-Increment Addressing and word-sized data
writes. It will not function for any other addressing
mode or for byte-sized data, and normal addresses are
generated instead. When Bit-Reversed Addressing is
active, the W Address Pointer is always added to the
address modifier (XB), and the offset associated with
the Register Indirect Addressing mode is ignored. In
addition, as word-sized data is a requirement, the LSb
of the EA is ignored (and always clear).
Note:
Modulo Addressing and Bit-Reversed
Addressing should not be enabled
together. If an application attempts to do so,
Bit-Reversed Addressing will assume priority when active for the X WAGU and X
WAGU Modulo Addressing will be disabled. However, Modulo Addressing will
continue to function in the X RAGU.
If Bit-Reversed Addressing has already been enabled
by setting the BREN (XBREV<15>) bit, a write to the
XBREV register should not be immediately followed by
an indirect read operation using the W register that has
been designated as the bit-reversed pointer.
© 2007 Microchip Technology Inc.
Preliminary
DS70264B-page 41
dsPIC33FJ12GP201/202
FIGURE 3-6:
BIT-REVERSED ADDRESS EXAMPLE
Sequential Address
b15 b14 b13 b12 b11 b10 b9 b8
b7 b6 b5 b4
b3 b2
b1
0
Bit Locations Swapped Left-to-Right
Around Center of Binary Value
b15 b14 b13 b12 b11 b10 b9 b8 b7 b6 b5 b1 b2 b3 b4
0
Bit-Reversed Address
Pivot Point
XB = 0x0008 for a 16-Word Bit-Reversed Buffer
TABLE 3-23:
BIT-REVERSED ADDRESS SEQUENCE (16-ENTRY)
Normal Address
Bit-Reversed Address
A3
A2
A1
A0
Decimal
A3
A2
A1
A0
Decimal
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
0
0
0
8
0
0
1
0
2
0
1
0
0
4
0
0
1
1
3
1
1
0
0
12
0
1
0
0
4
0
0
1
0
2
0
1
0
1
5
1
0
1
0
10
0
1
1
0
6
0
1
1
0
6
0
1
1
1
7
1
1
1
0
14
1
0
0
0
8
0
0
0
1
1
1
0
0
1
9
1
0
0
1
9
1
0
1
0
10
0
1
0
1
5
1
0
1
1
11
1
1
0
1
13
1
1
0
0
12
0
0
1
1
3
1
1
0
1
13
1
0
1
1
11
1
1
1
0
14
0
1
1
1
7
1
1
1
1
15
1
1
1
1
15
DS70264B-page 42
Preliminary
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
3.6
Interfacing Program and Data
Memory Spaces
3.6.1
Since the address ranges for the data and program
spaces are 16 and 24 bits, respectively, a method is
needed to create a 23-bit or 24-bit program address
from 16-bit data registers. The solution depends on the
interface method to be used.
The dsPIC33FJ12GP201/202 architecture uses a
24-bit-wide program space and a 16-bit-wide data
space. The architecture is also a modified Harvard
scheme, meaning that data can also be present in the
program space. To use this data successfully, it must
be accessed in a way that preserves the alignment of
information in both spaces.
For table operations, the 8-bit Table Page register
(TBLPAG) is used to define a 32K word region within
the program space. This is concatenated with a 16-bit
EA to arrive at a full 24-bit program space address. In
this format, the Most Significant bit of TBLPAG is used
to determine if the operation occurs in the user memory
(TBLPAG<7> = 0) or the configuration memory
(TBLPAG<7> = 1).
Aside
from
normal
execution,
the
dsPIC33FJ12GP201/202 architecture provides two
methods by which program space can be accessed
during operation:
• Using table instructions to access individual bytes
or words anywhere in the program space
• Remapping a portion of the program space into
the data space (Program Space Visibility)
For remapping operations, the 8-bit Program Space
Visibility register (PSVPAG) is used to define a
16K word page in the program space. When the Most
Significant bit of the EA is ‘1’, PSVPAG is concatenated
with the lower 15 bits of the EA to form a 23-bit program
space address. Unlike table operations, this limits
remapping operations strictly to the user memory area.
Table instructions allow an application to read or write
to small areas of the program memory. This capability
makes the method ideal for accessing data tables that
need to be updated periodically. It also allows access
to all bytes of the program word. The remapping
method allows an application to access a large block of
data on a read-only basis, which is ideal for look ups
from a large table of static data. The application can
only access the least significant word of the program
word.
TABLE 3-24:
ADDRESSING PROGRAM SPACE
Table 3-24 and Figure 3-7 show how the program EA is
created for table operations and remapping accesses
from the data EA. Here, P<23:0> refers to a program
space word, and D<15:0> refers to a data space word.
PROGRAM SPACE ADDRESS CONSTRUCTION
Access
Space
Access Type
Program Space Address
<23>
<22:16>
<15>
<14:1>
Instruction Access
(Code Execution)
User
TBLRD/TBLWT
(Byte/Word Read/Write)
User
TBLPAG<7:0>
Configuration
TBLPAG<7:0>
Data EA<15:0>
1xxx xxxx
xxxx xxxx xxxx xxxx
Program Space Visibility
(Block Remap/Read)
Note 1:
PC<22:1>
0
0xx
xxxx
0xxx xxxx
User
xxxx
<0>
0
xxxx
xxxx xxx0
Data EA<15:0>
xxxx xxxx xxxx xxxx
0
PSVPAG<7:0>
0
xxxx xxxx
Data EA<14:0>(1)
xxx xxxx xxxx xxxx
Data EA<15> is always ‘1’ in this case, but is not used in calculating the program space address. Bit 15 of
the address is PSVPAG<0>.
© 2007 Microchip Technology Inc.
Preliminary
DS70264B-page 43
dsPIC33FJ12GP201/202
FIGURE 3-7:
DATA ACCESS FROM PROGRAM SPACE ADDRESS GENERATION
Program Counter(1)
Program Counter
0
0
23 bits
EA
Table Operations(2)
1/0
1/0
TBLPAG
8 bits
16 bits
24 bits
Select
Program Space Visibility(1)
(Remapping)
0
1
EA
0
PSVPAG
8 bits
15 bits
23 bits
User/Configuration
Space Select
Byte Select
Note 1: The Least Significant bit (LSb) of program space addresses is always fixed as ‘0’ to
maintain word alignment of data in the program and data spaces.
2: Table operations are not required to be word-aligned. Table read operations are permitted
in the configuration memory space.
DS70264B-page 44
Preliminary
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
3.6.2
DATA ACCESS FROM PROGRAM
MEMORY USING TABLE
INSTRUCTIONS
The TBLRDL and TBLWTL instructions offer a direct
method of reading or writing the lower word of any
address within the program space without going
through data space. The TBLRDH and TBLWTH
instructions are the only method to read or write the
upper 8 bits of a program space word as data.
The PC is incremented by two for each successive
24-bit program word. This allows program memory
addresses to directly map to data space addresses.
Program memory can thus be regarded as two
16-bit-wide word address spaces, residing side by side,
each with the same address range. TBLRDL and
TBLWTL access the space that contains the least
significant data word. TBLRDH and TBLWTH access the
space that contains the upper data byte.
Two table instructions are provided to move byte or
word-sized (16-bit) data to and from program space.
Both function as either byte or word operations.
• TBLRDL (Table Read Low): In Word mode, this
instruction maps the lower word of the program
space location (P<15:0>) to a data address
(D<15:0>).
FIGURE 3-8:
In Byte mode, either the upper or lower byte of the
lower program word is mapped to the lower byte of
a data address. The upper byte is selected when
Byte Select is ‘1’; the lower byte is selected when
it is ‘0’.
• TBLRDH (Table Read High): In Word mode, this
instruction maps the entire upper word of a program
address (P<23:16>) to a data address. Note that
D<15:8>, the ‘phantom byte’, will always be ‘0’.
In Byte mode, this instruction maps the upper or
lower byte of the program word to D<7:0> of the
data address, as in the TBLRDL instruction. Note
that the data will always be ‘0’ when the upper
‘phantom’ byte is selected (Byte Select = 1).
In a similar fashion, two table instructions, TBLWTH
and TBLWTL, are used to write individual bytes or
words to a program space address. The details of
their operation are explained in Section 4.0 “Flash
Program Memory”.
For all table operations, the area of program memory
space to be accessed is determined by the Table Page
register (TBLPAG). TBLPAG covers the entire program
memory space of the device, including user and configuration spaces. When TBLPAG<7> = 0, the table page
is located in the user memory space. When
TBLPAG<7> = 1, the page is located in configuration
space.
ACCESSING PROGRAM MEMORY WITH TABLE INSTRUCTIONS
Program Space
TBLPAG
02
23
15
0
0x000000
23
16
8
0
00000000
0x020000
0x030000
00000000
00000000
00000000
‘Phantom’ Byte
TBLRDH.B (Wn<0> = 0)
TBLRDL.B (Wn<0> = 1)
TBLRDL.B (Wn<0> = 0)
TBLRDL.W
0x800000
© 2007 Microchip Technology Inc.
The address for the table operation is determined by the data EA
within the page defined by the TBLPAG register.
Only read operations are shown; write operations are also valid in
the user memory area.
Preliminary
DS70264B-page 45
dsPIC33FJ12GP201/202
3.6.3
READING DATA FROM PROGRAM
MEMORY USING PROGRAM
SPACE VISIBILITY
The upper 32 Kbytes of data space may optionally be
mapped into any 16K word page of the program space.
This option provides transparent access to stored constant data from the data space without the need to use
special instructions (such as TBLRDL/H).
Program space access through the data space occurs
if the Most Significant bit of the data space EA is ‘1’ and
program space visibility is enabled by setting the PSV
bit in the Core Control register (CORCON<2>). The
location of the program memory space to be mapped
into the data space is determined by the Program
Space Visibility Page register (PSVPAG). This 8-bit
register defines any one of 256 possible pages of
16K words in program space. In effect, PSVPAG
functions as the upper 8 bits of the program memory
address, with the 15 bits of the EA functioning as the
lower bits. By incrementing the PC by 2 for each
program memory word, the lower 15 bits of data space
addresses directly map to the lower 15 bits in the
corresponding program space addresses.
Data reads to this area add a cycle to the instruction
being executed, since two program memory fetches
are required.
Although each data space address 8000h and higher
maps directly into a corresponding program memory
address (see Figure 3-9), only the lower 16 bits of the
FIGURE 3-9:
24-bit program word are used to contain the data. The
upper 8 bits of any program space location used as
data should be programmed with ‘1111 1111’ or
‘0000 0000’ to force a NOP. This prevents possible
issues should the area of code ever be accidentally
executed.
Note:
PSV access is temporarily disabled during
table reads/writes.
For operations that use PSV and are executed outside
a REPEAT loop, the MOV and MOV.D instructions
require one instruction cycle in addition to the specified
execution time. All other instructions require two
instruction cycles in addition to the specified execution
time.
For operations that use PSV, and are executed inside
a REPEAT loop, these instances require two instruction
cycles in addition to the specified execution time of the
instruction:
• Execution in the first iteration
• Execution in the last iteration
• Execution prior to exiting the loop due to an
interrupt
• Execution upon re-entering the loop after an
interrupt is serviced
Any other iteration of the REPEAT loop will allow the
instruction using PSV to access data to execute in a
single cycle.
PROGRAM SPACE VISIBILITY OPERATION
When CORCON<2> = 1 and EA<15> = 1:
Program Space
PSVPAG
02
23
15
Data Space
0
0x000000
0x0000
Data EA<14:0>
0x010000
0x018000
The data in the page
designated by
PSVPAG is mapped
into the upper half of
the data memory
space...
0x8000
PSV Area
0x800000
DS70264B-page 46
Preliminary
...while the lower 15 bits
of the EA specify an
exact address within
0xFFFF the PSV area. This
corresponds exactly to
the same lower 15 bits
of the actual program
space address.
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
4.0
Note:
FLASH PROGRAM MEMORY
then program the digital signal controller just before
shipping the product. This also allows the most recent
firmware or a custom firmware to be programmed.
This data sheet summarizes the features
of the dsPIC33FJ12GP201/202 devices. It
is not intended to be a comprehensive
reference source. To complement the
information in this data sheet, refer to the
“dsPIC33F Family Reference Manual”.
Please see the Microchip web site
(www.microchip.com) for the latest
dsPIC33F Family Reference Manual
sections.
RTSP is accomplished using TBLRD (table read) and
TBLWT (table write) instructions. With RTSP, the user
application can write program memory data either in
blocks or ‘rows’ of 64 instructions (192 bytes) at a time
or a single program memory word, and erase program
memory in blocks or ‘pages’ of 512 instructions (1536
bytes) at a time.
4.1
The dsPIC33FJ12GP201/202 devices contain internal
Flash program memory for storing and executing application code. The memory is readable, writable and
erasable during normal operation over the entire VDD
range.
Flash memory can be programmed in two ways:
• In-Circuit Serial Programming™ (ICSP™)
programming capability
• Run-Time Self-Programming (RTSP)
ICSP allows a dsPIC33FJ12GP201/202 device to be
serially programmed while in the end application circuit.
This is done with two lines for programming clock and
programming data (one of the alternate programming
pin pairs: PGC1/PGD1, PGC2/PGD2 or PGC3/PGD3),
and three other lines for power (VDD), ground (VSS) and
Master Clear (MCLR). This allows customers to
manufacture boards with unprogrammed devices and
FIGURE 4-1:
Table Instructions and Flash
Programming
Regardless of the method used, all programming of
Flash memory is done with the table read and table
write instructions. These allow direct read and write
access to the program memory space from the data
memory while the device is in normal operating mode.
The 24-bit target address in the program memory is
formed using bits <7:0> of the TBLPAG register and the
Effective Address (EA) from a W register specified in
the table instruction, as shown in Figure 4-1.
The TBLRDL and the TBLWTL instructions are used to
read or write to bits<15:0> of program memory.
TBLRDL and TBLWTL can access program memory in
both Word and Byte modes.
The TBLRDH and TBLWTH instructions are used to read
or write to bits<23:16> of program memory. TBLRDH
and TBLWTH can also access program memory in Word
or Byte mode.
ADDRESSING FOR TABLE REGISTERS
24 bits
Using
Program Counter
Program Counter
0
0
Working Reg EA
Using
Table Instruction
1/0
TBLPAG Reg
8 bits
User/Configuration
Space Select
© 2007 Microchip Technology Inc.
16 bits
24-bit EA
Preliminary
Byte
Select
DS70264B-page 47
dsPIC33FJ12GP201/202
4.2
RTSP Operation
4.3
The dsPIC33FJ12GP201/202 Flash program memory
array is organized into rows of 64 instructions or 192
bytes. RTSP allows the user application to erase a
page of memory, which consists of eight rows (512
instructions) at a time, and to program one row or one
word at a time. The 8-row erase pages and single row
write rows are edge-aligned from the beginning of
program memory, on boundaries of 1536 bytes and
192 bytes, respectively.
The program memory implements holding buffers that
can contain 64 instructions of programming data. Prior
to the actual programming operation, the write data
must be loaded into the buffers sequentially. The
instruction words loaded must always be from a group
of 64 boundary.
The basic sequence for RTSP programming is to set up
a Table Pointer, then do a series of TBLWT instructions
to load the buffers. Programming is performed by setting the control bits in the NVMCON register. A total of
64 TBLWTL and TBLWTH instructions are required to
load the instructions.
All of the table write operations are single-word writes
(two instruction cycles) because only the buffers are
written. A programming cycle is required for
programming each row.
DS70264B-page 48
Control Registers
Two SFRs are used to read and write the program
Flash memory:
• NVMCON: Flash Memory Control Register
• NVMKEY: NonVolatile Memory Key Register
The NVMCON register (Register 4-1) controls which
blocks are to be erased, which memory type is to be
programmed and the start of the programming cycle.
NVMKEY (Register 4-2) is a write-only register that is
used for write protection. To start a programming or
erase sequence, the user application must
consecutively write 55h and AAh to the NVMKEY
register. Refer to Section 4.4 “Programming
Operations” for further details.
4.4
Programming Operations
A complete programming sequence is necessary for
programming or erasing the internal Flash in RTSP
mode. A programming operation is nominally 4 ms in
duration and the processor stalls (waits) until the operation is finished. Setting the WR bit (NVMCON<15>)
starts the operation, and the WR bit is automatically
cleared when the operation is finished.
Preliminary
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
REGISTER 4-1:
NVMCON: FLASH MEMORY CONTROL REGISTER
R/SO-0(1)
R/W-0(1)
R/W-0(1)
U-0
U-0
U-0
U-0
U-0
WR
WREN
WRERR
—
—
—
—
—
bit 15
U-0
bit 8
R/W-0(1)
—
ERASE
U-0
—
U-0
R/W-0(1)
R/W-0(1)
—
R/W-0(1)
NVMOP<3:0>
R/W-0(1)
(2)
bit 7
bit 0
Legend:
SO = Satiable only bit
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15
WR: Write Control bit
1 = Initiates a Flash memory program or erase operation. The operation is self-timed and the bit is
cleared by hardware once operation is complete.
0 = Program or erase operation is complete and inactive
bit 14
WREN: Write Enable bit
1 = Enable Flash program/erase operations
0 = Inhibit Flash program/erase operations
bit 13
WRERR: Write Sequence Error Flag bit
1 = An improper program or erase sequence attempt or termination has occurred (bit is set
automatically on any set attempt of the WR bit)
0 = The program or erase operation completed normally
bit 12-7
Unimplemented: Read as ‘0’
bit 6
ERASE: Erase/Program Enable bit
1 = Perform the erase operation specified by NVMOP<3:0> on the next WR command
0 = Perform the program operation specified by NVMOP<3:0> on the next WR command
bit 5-4
Unimplemented: Read as ‘0’
bit 3-0
NVMOP<3:0>: NVM Operation Select bits(2)
If ERASE = 1:
1111 = Memory bulk erase operation
1101 = Erase General Segment
1100 = Erase Secure Segment
0011 = No operation
0010 = Memory page erase operation
0001 = No operation
0000 = Erase a single Configuration register byte
If ERASE = 0:
1111 = No operation
1101 = No operation
1100 = No operation
0011 = Memory word program operation
0010 = No operation
0001 = Memory row program operation
0000 = Program a single Configuration register byte
Note 1:
2:
These bits can only be Reset on POR.
All other combinations of NVMOP<3:0> are unimplemented.
© 2007 Microchip Technology Inc.
Preliminary
DS70264B-page 49
dsPIC33FJ12GP201/202
REGISTER 4-2:
NVMKEY: NONVOLATILE MEMORY KEY REGISTER
U-0
U-0
U-0
U-0
U-0
U-0
U-0
U-0
—
—
—
—
—
—
—
—
bit 15
bit 8
W-0
W-0
W-0
W-0
W-0
W-0
W-0
W-0
NVMKEY<7:0>
bit 7
bit 0
Legend:
SO = Satiable only bit
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15-8
Unimplemented: Read as ‘0’
bit 7-0
NVMKEY<7:0>: Key Register (write-only) bits
DS70264B-page 50
Preliminary
x = Bit is unknown
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
4.4.1
PROGRAMMING ALGORITHM FOR
FLASH PROGRAM MEMORY
4.
5.
Programmers can program one row of program Flash
memory at a time. To do this, it is necessary to erase
the 8-row erase page that contains the desired row.
The general process is:
1.
2.
3.
Read eight rows of program memory
(512 instructions) and store in data RAM.
Update the program data in RAM with the
desired new data.
Erase the block (see Example 4-1):
a) Set the NVMOP bits (NVMCON<3:0>) to
‘0010’ to configure for block erase. Set the
ERASE (NVMCON<6>) and WREN
(NVMCON<14>) bits.
b) Write the starting address of the page to be
erased into the TBLPAG and W registers.
c) Write 55h to NVMKEY.
d) Write AAh to NVMKEY.
e) Set the WR bit (NVMCON<15>). The erase
cycle begins and the CPU stalls for the duration of the erase cycle. When the erase is
done, the WR bit is cleared automatically.
EXAMPLE 4-1:
For protection against accidental operations, the write
initiate sequence for NVMKEY must be used to allow
any erase or program operation to proceed. After the
programming command has been executed, the user
application must wait for the programming time until
programming is complete. The two instructions
following the start of the programming sequence
should be NOPs, as shown in Example 4-3.
ERASING A PROGRAM MEMORY PAGE
; Set up NVMCON for block erase operation
MOV
#0x4042, W0
MOV
W0, NVMCON
; Init pointer to row to be ERASED
MOV
#tblpage(PROG_ADDR), W0
MOV
W0, TBLPAG
MOV
#tbloffset(PROG_ADDR), W0
TBLWTL W0, [W0]
DISI
#5
MOV
MOV
MOV
MOV
BSET
NOP
NOP
6.
Write the first 64 instructions from data RAM into
the program memory buffers (see Example 4-2).
Write the program block to Flash memory:
a) Set the NVMOP bits to ‘0001’ to configure
for row programming. Clear the ERASE bit
and set the WREN bit.
b) Write 55h to NVMKEY.
c) Write AAh to NVMKEY.
d) Set the WR bit. The programming cycle
begins and the CPU stalls for the duration of
the write cycle. When the write to Flash memory is done, the WR bit is cleared
automatically.
Repeat steps 4 and 5, using the next available
64 instructions from the block in data RAM by
incrementing the value in TBLPAG, until all
512 instructions are written back to Flash memory.
#0x55, W0
W0, NVMKEY
#0xAA, W1
W1, NVMKEY
NVMCON, #WR
© 2007 Microchip Technology Inc.
;
; Initialize NVMCON
;
;
;
;
;
;
;
;
;
;
;
;
Initialize PM Page Boundary SFR
Initialize in-page EA[15:0] pointer
Set base address of erase block
Block all interrupts with priority <7
for next 5 instructions
Write the 55 key
Write the AA key
Start the erase sequence
Insert two NOPs after the erase
command is asserted
Preliminary
DS70264B-page 51
dsPIC33FJ12GP201/202
EXAMPLE 4-2:
LOADING THE WRITE BUFFERS
; Set up NVMCON for row programming operations
MOV
#0x4001, W0
;
MOV
W0, NVMCON
; Initialize NVMCON
; Set up a pointer to the first program memory location to be written
; program memory selected, and writes enabled
MOV
#0x0000, W0
;
MOV
W0, TBLPAG
; Initialize PM Page Boundary SFR
MOV
#0x6000, W0
; An example program memory address
; Perform the TBLWT instructions to write the latches
; 0th_program_word
MOV
#LOW_WORD_0, W2
;
MOV
#HIGH_BYTE_0, W3
;
TBLWTL W2, [W0]
; Write PM low word into program latch
TBLWTH W3, [W0++]
; Write PM high byte into program latch
; 1st_program_word
MOV
#LOW_WORD_1, W2
;
MOV
#HIGH_BYTE_1, W3
;
TBLWTL W2, [W0]
; Write PM low word into program latch
TBLWTH W3, [W0++]
; Write PM high byte into program latch
; 2nd_program_word
MOV
#LOW_WORD_2, W2
;
MOV
#HIGH_BYTE_2, W3
;
; Write PM low word into program latch
TBLWTL W2, [W0]
; Write PM high byte into program latch
TBLWTH W3, [W0++]
•
•
•
; 63rd_program_word
MOV
#LOW_WORD_31, W2
;
MOV
#HIGH_BYTE_31, W3
;
; Write PM low word into program latch
TBLWTL W2, [W0]
; Write PM high byte into program latch
TBLWTH W3, [W0++]
EXAMPLE 4-3:
INITIATING A PROGRAMMING SEQUENCE
DISI
#5
MOV
MOV
MOV
MOV
BSET
NOP
NOP
#0x55, W0
W0, NVMKEY
#0xAA, W1
W1, NVMKEY
NVMCON, #WR
DS70264B-page 52
; Block all interrupts with priority <7
; for next 5 instructions
;
;
;
;
;
;
Write the 55 key
Write the AA key
Start the erase sequence
Insert two NOPs after the
erase command is asserted
Preliminary
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
5.0
Note:
RESETS
This data sheet summarizes the features
of the dsPIC33FJ12GP201/202 devices. It
is not intended to be a comprehensive
reference source. To complement the
information in this data sheet, refer to the
“dsPIC33F Family Reference Manual”.
Please see the Microchip web site
(www.microchip.com) for the latest
dsPIC33F Family Reference Manual
sections.
The Reset module combines all Reset sources and
controls the device Master Reset Signal, SYSRST. The
following is a list of device Reset sources:
•
•
•
•
•
•
•
POR: Power-on Reset
BOR: Brown-out Reset
MCLR: Master Clear Pin Reset
SWR: RESET Instruction
WDTO: Watchdog Timer Reset
TRAPR: Trap Conflict Reset
IOPUWR: Illegal Opcode and Uninitialized W
Register Reset and Security Reset
• CM: Configuration Mismatch Reset
Any active source of Reset makes the SYSRST signal
active. Many registers associated with the CPU and
peripherals are forced to a known Reset state. Most
registers are unaffected by a Reset; their status is
unknown on POR and unchanged by all other Resets.
Note:
Refer to the specific peripheral or CPU
section of this manual for register Reset
states.
All types of device Reset will set a corresponding status
bit in the RCON register to indicate the type of Reset
(see Register 5-1). A POR will clear all bits, except for
the POR bit (RCON<0>), that are set. The user
application can set or clear any bit at any time during
code execution. The RCON bits only serve as status
bits. Setting a particular Reset status bit in software
does not cause a device Reset to occur.
The RCON register also has other bits associated with
the Watchdog Timer and device power-saving states.
The function of these bits is discussed in other sections
of this manual.
Note:
The status bits in the RCON register
should be cleared after they are read so
that the next RCON register value after a
device Reset will be meaningful.
A simplified block diagram of the Reset module is
shown in Figure 5-1.
FIGURE 5-1:
RESET SYSTEM BLOCK DIAGRAM
RESET Instruction
Glitch Filter
MCLR
WDT
Module
Sleep or Idle
VDD
BOR
Internal
Regulator
SYSRST
VDD Rise
Detect
POR
Trap Conflict
Illegal Opcode
Uninitialized W Register
Configuration Mismatch
© 2007 Microchip Technology Inc.
Preliminary
DS70264B-page 53
dsPIC33FJ12GP201/202
RCON: RESET CONTROL REGISTER(1)
REGISTER 5-1:
R/W-0
R/W-0
U-0
U-0
U-0
U-0
R/W-0
R/W-0
TRAPR
IOPUWR
—
—
—
—
CM
VREGS
bit 15
bit 8
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-1
R/W-1
EXTR
SWR
SWDTEN(2)
WDTO
SLEEP
IDLE
BOR
POR
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15
TRAPR: Trap Reset Flag bit
1 = A Trap Conflict Reset has occurred
0 = A Trap Conflict Reset has not occurred
bit 14
IOPUWR: Illegal Opcode or Uninitialized W Access Reset Flag bit
1 = An illegal opcode detection, an illegal address mode or uninitialized W register used as an
Address Pointer caused a Reset
0 = An illegal opcode or uninitialized W Reset has not occurred
bit 13-10
Unimplemented: Read as ‘0’
bit 9
CM: Configuration Mismatch Flag bit
1 = A configuration mismatch Reset has occurred.
0 = A configuration mismatch Reset has NOT occurred.
bit 8
VREGS: Voltage Regulator Standby During Sleep bit
1 = Voltage regulator is active during Sleep
0 = Voltage regulator goes into Standby mode during Sleep
bit 7
EXTR: External Reset (MCLR) Pin bit
1 = A Master Clear (pin) Reset has occurred
0 = A Master Clear (pin) Reset has not occurred
bit 6
SWR: Software Reset (Instruction) Flag bit
1 = A RESET instruction has been executed
0 = A RESET instruction has not been executed
bit 5
SWDTEN: Software Enable/Disable of WDT bit(2)
1 = WDT is enabled
0 = WDT is disabled
bit 4
WDTO: Watchdog Timer Time-out Flag bit
1 = WDT time-out has occurred
0 = WDT time-out has not occurred
bit 3
SLEEP: Wake-up from Sleep Flag bit
1 = Device has been in Sleep mode
0 = Device has not been in Sleep mode
bit 2
IDLE: Wake-up from Idle Flag bit
1 = Device was in Idle mode
0 = Device was not in Idle mode
Note 1:
2:
All of the Reset status bits can be set or cleared in software. Setting one of these bits in software does not
cause a device Reset.
If the FWDTEN Configuration bit is ‘1’ (unprogrammed), the WDT is always enabled, regardless of the
SWDTEN bit setting.
DS70264B-page 54
Preliminary
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
RCON: RESET CONTROL REGISTER(1) (CONTINUED)
REGISTER 5-1:
bit 1
BOR: Brown-out Reset Flag bit
1 = A Brown-out Reset has occurred
0 = A Brown-out Reset has not occurred
bit 0
POR: Power-on Reset Flag bit
1 = A Power-up Reset has occurred
0 = A Power-up Reset has not occurred
Note 1:
2:
All of the Reset status bits can be set or cleared in software. Setting one of these bits in software does not
cause a device Reset.
If the FWDTEN Configuration bit is ‘1’ (unprogrammed), the WDT is always enabled, regardless of the
SWDTEN bit setting.
RESET FLAG BIT OPERATION(1)
TABLE 5-1:
Flag Bit
Setting Event
Clearing Event
TRAPR (RCON<15>)
Trap conflict event
POR, BOR
IOPUWR (RCON<14>)
Illegal opcode or uninitialized
W register access
POR, BOR
CM (RCON<9>)
Configuration mismatch
POR, BOR
EXTR (RCON<7>)
MCLR Reset
POR
SWR (RCON<6>)
RESET instruction
POR, BOR
WDTO (RCON<4>)
WDT time-out
PWRSAV instruction, POR, BOR,
CLRWDT instruction
SLEEP (RCON<3>)
PWRSAV #SLEEP instruction
POR, BOR
IDLE (RCON<2>)
PWRSAV #IDLE instruction
POR, BOR
BOR (RCON<1>)
BOR
—
POR (RCON<0>)
POR
—
Note 1:
All Reset flag bits may be set or cleared by the user software.
© 2007 Microchip Technology Inc.
Preliminary
DS70264B-page 55
dsPIC33FJ12GP201/202
5.1
Clock Source Selection at Reset
5.2
If clock switching is enabled, the system clock source at
device Reset is chosen as shown in Table 5-2. If clock
switching is disabled, the system clock source is always
selected according to the oscillator Configuration bits.
Refer to Section 7.0 “Oscillator Configuration” for
further details.
TABLE 5-2:
OSCILLATOR SELECTION vs.
TYPE OF RESET (CLOCK
SWITCHING ENABLED)
Reset Type
POR
Clock Source Determinant
Oscillator Configuration bits
(FNOSC<2:0>)
BOR
MCLR
Device Reset Times
The Reset times for various types of device Reset are
summarized in Table 5-3. The system Reset signal,
SYSRST, is released after the POR and PWRT delay
times expire.
The time at which the device actually begins to execute
code also depends on the system oscillator delays,
which include the Oscillator Start-up Timer (OST) and
the PLL lock time. The OST and PLL lock times occur
in parallel with the applicable SYSRST delay times.
The FSCM delay determines the time at which the
FSCM begins to monitor the system clock source after
the SYSRST signal is released.
COSC Control bits
(OSCCON<14:12>)
WDTR
SWR
TABLE 5-3:
Reset Type
POR
BOR
RESET DELAY TIMES FOR VARIOUS DEVICE RESETS
SYSRST Delay
System Clock
Delay
FSCM
Delay
EC, FRC, LPRC
TPOR + TSTARTUP + TRST
—
—
Clock Source
Notes
1, 2, 3
ECPLL, FRCPLL
TPOR + TSTARTUP + TRST
TLOCK
TFSCM
1, 2, 3, 5, 6
XT, HS, SOSC
TPOR + TSTARTUP + TRST
TOST
TFSCM
1, 2, 3, 4, 6
XTPLL, HSPLL
TPOR + TSTARTUP + TRST
TOST + TLOCK
TFSCM
1, 2, 3, 4, 5, 6
EC, FRC, LPRC
TSTARTUP + TRST
—
—
ECPLL, FRCPLL
TSTARTUP + TRST
TLOCK
TFSCM
3, 5, 6
3
XT, HS, SOSC
TSTARTUP + TRST
TOST
TFSCM
3, 4, 6
XTPLL, HSPLL
TSTARTUP + TRST
TOST + TLOCK
TFSCM
3, 4, 5, 6
MCLR
Any Clock
TRST
—
—
3
WDT
Any Clock
TRST
—
—
3
Software
Any Clock
TRST
—
—
3
Illegal Opcode
Any Clock
TRST
—
—
3
Uninitialized W
Any Clock
TRST
—
—
3
Trap Conflict
Any Clock
TRST
—
—
3
Note 1:
2:
3:
4:
5:
6:
TPOR = Power-on Reset delay (10 μs nominal).
TSTARTUP = Conditional POR delay of 20 μs nominal (if on-chip regulator is enabled) or 64 ms nominal
Power-up Timer delay (if regulator is disabled). TSTARTUP is also applied to all returns from powered-down
states, including waking from Sleep mode, only if the regulator is enabled.
TRST = Internal state Reset time (20 μs nominal).
TOST = Oscillator Start-up Timer. A 10-bit counter counts 1024 oscillator periods before releasing the
oscillator clock to the system.
TLOCK = PLL lock time (20 μs nominal).
TFSCM = Fail-Safe Clock Monitor delay (100 μs nominal).
DS70264B-page 56
Preliminary
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
5.2.1
POR AND LONG OSCILLATOR
START-UP TIMES
5.2.2.1
The oscillator start-up circuitry and its associated delay
timers are not linked to the device Reset delays that
occur at power-up. Some crystal circuits (especially
low-frequency crystals) have a relatively long start-up
time. Therefore, one or more of the following conditions
is possible after SYSRST is released:
• The oscillator circuit has not begun to oscillate.
• The Oscillator Start-up Timer has not expired (if a
crystal oscillator is used).
• The PLL has not achieved a lock (if PLL is used).
The device will not begin to execute code until a valid
clock source has been released to the system.
Therefore, the oscillator and PLL start-up delays must
be considered when the Reset delay time must be
known.
5.2.2
FAIL-SAFE CLOCK MONITOR
(FSCM) AND DEVICE RESETS
If the FSCM is enabled, it begins to monitor the system
clock source when SYSRST is released. If a valid clock
source is not available at this time, the device
automatically switches to the FRC oscillator and the
user application can switch to the desired crystal
oscillator in the Trap Service Routine (TSR).
© 2007 Microchip Technology Inc.
FSCM Delay for Crystal and PLL
Clock Sources
When the system clock source is provided by a crystal
oscillator and/or the PLL, a short delay, TFSCM, is automatically inserted after the POR and PWRT delay
times. The FSCM does not begin to monitor the system
clock source until this delay expires. The FSCM delay
time is nominally 500 μs and provides additional time
for the oscillator and/or PLL to stabilize. In most cases,
the FSCM delay prevents an oscillator failure trap at a
device Reset when the PWRT is disabled.
5.3
Special Function Register Reset
States
Most of the Special Function Registers (SFRs) associated with the CPU and peripherals are reset to a
particular value at a device Reset. The SFRs are
grouped by their peripheral or CPU function, and their
Reset values are specified in each section of this manual.
The Reset value for each SFR does not depend on the
type of Reset, with the exception of two registers:
• The Reset value for the Reset Control register,
RCON, depends on the type of device Reset.
• The Reset value for the Oscillator Control register,
OSCCON, depends on the type of Reset and the
programmed values of the Oscillator
Configuration bits in the FOSC Configuration
register.
Preliminary
DS70264B-page 57
dsPIC33FJ12GP201/202
NOTES:
DS70264B-page 58
Preliminary
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
6.0
Note:
INTERRUPT CONTROLLER
6.1.1
This data sheet summarizes the features
of the dsPIC33FJ12GP201/202 devices. It
is not intended to be a comprehensive
reference source. To complement the
information in this data sheet, refer to the
“dsPIC33F Family Reference Manual”.
Please see the Microchip web site
(www.microchip.com) for the latest
dsPIC33F Family Reference Manual
sections.
The dsPIC33FJ12GP201/202 interrupt controller
reduces the numerous peripheral interrupt request
signals to a single interrupt request signal to the
dsPIC33FJ12GP201/202 CPU. It has the following
features:
•
•
•
•
Up to 8 processor exceptions and software traps
7 user-selectable priority levels
Interrupt Vector Table (IVT) with up to 118 vectors
A unique vector for each interrupt or exception
source
• Fixed priority within a specified user priority level
• Alternate Interrupt Vector Table (AIVT) for debug
support
• Fixed interrupt entry and return latencies
6.1
Interrupt Vector Table
The Interrupt Vector Table is shown in Figure 6-1. The
IVT resides in program memory, starting at location
000004h. The IVT contains 126 vectors consisting of
8 nonmaskable trap vectors plus up to 118 sources of
interrupt. In general, each interrupt source has its own
vector. Each interrupt vector contains a 24-bit wide
address. The value programmed into each interrupt
vector location is the starting address of the associated
Interrupt Service Routine (ISR).
ALTERNATE INTERRUPT VECTOR
TABLE
The Alternate Interrupt Vector Table (AIVT) is located
after the IVT, as shown in Figure 6-1. Access to the
AIVT is provided by the ALTIVT control bit
(INTCON2<15>). If the ALTIVT bit is set, all interrupt
and exception processes use the alternate vectors
instead of the default vectors. The alternate vectors are
organized in the same manner as the default vectors.
The AIVT supports debugging by providing a means to
switch between an application and a support
environment without requiring the interrupt vectors to
be reprogrammed. This feature also enables switching
between applications for evaluation of different
software algorithms at run time. If the AIVT is not
needed, the AIVT should be programmed with the
same addresses used in the IVT.
6.2
Reset Sequence
A device Reset is not a true exception because the
interrupt controller is not involved in the Reset process.
The dsPIC33FJ12GP201/202 device clears its
registers in response to a Reset, which forces the PC
to zero. The digital signal controller then begins
program execution at location 0x000000. The user
application can use a GOTO instruction at the Reset
address which redirects program execution to the
appropriate start-up routine.
Note:
Any unimplemented or unused vector
locations in the IVT and AIVT should be
programmed with the address of a default
interrupt handler routine that contains a
RESET instruction.
Interrupt vectors are prioritized in terms of their natural
priority; this priority is linked to their position in the
vector table. Lower addresses generally have a higher
natural priority. For example, the interrupt associated
with vector 0 will take priority over interrupts at any
other vector address.
dsPIC33FJ12GP201/202 devices implement up to 21
unique interrupts and 4 nonmaskable traps. These are
summarized in Table 6-1 and Table 6-2.
© 2007 Microchip Technology Inc.
Preliminary
DS70264B-page 59
dsPIC33FJ12GP201/202
Decreasing Natural Order Priority
FIGURE 6-1:
Note 1:
DS70264B-page 60
dsPIC33FJ12GP201/202 INTERRUPT VECTOR TABLE
Reset – GOTO Instruction
Reset – GOTO Address
Reserved
Oscillator Fail Trap Vector
Address Error Trap Vector
Stack Error Trap Vector
Math Error Trap Vector
Reserved
Reserved
Reserved
Interrupt Vector 0
Interrupt Vector 1
~
~
~
Interrupt Vector 52
Interrupt Vector 53
Interrupt Vector 54
~
~
~
Interrupt Vector 116
Interrupt Vector 117
Reserved
Reserved
Reserved
Oscillator Fail Trap Vector
Address Error Trap Vector
Stack Error Trap Vector
Math Error Trap Vector
Reserved
Reserved
Reserved
Interrupt Vector 0
Interrupt Vector 1
~
~
~
Interrupt Vector 52
Interrupt Vector 53
Interrupt Vector 54
~
~
~
Interrupt Vector 116
Interrupt Vector 117
Start of Code
0x000000
0x000002
0x000004
0x000014
0x00007C
0x00007E
0x000080
Interrupt Vector Table (IVT)(1)
0x0000FC
0x0000FE
0x000100
0x000102
0x000114
Alternate Interrupt Vector Table (AIVT)(1)
0x00017C
0x00017E
0x000180
0x0001FE
0x000200
See Table 6-1 for the list of implemented interrupt vectors.
Preliminary
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
TABLE 6-1:
INTERRUPT VECTORS
Vector
Number
Interrupt
Request (IRQ)
Number
IVT Address
AIVT Address
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
0x000014
0x000016
0x000018
0x00001A
0x00001C
0x00001E
0x000020
0x000022
0x000024
0x000026
0x000028
0x00002A
0x00002C
0x00002E
0x000030
0x000032
0x000034
0x000036
0x000038
0x00003A
0x00003C
0x00003E
0x000040
0x000042
0x000044
0x000046
0x000048
0x00004A
0x00004C
0x00004E
0x000050
0x000052
0x000054
0x000056
0x000058
0x00005A
0x00005C
0x00005E
0x000060
0x000062
0x000064
0x000066
0x000068
0x00006A
0x00006C
0x00006E
0x000114
0x000116
0x000118
0x00011A
0x00011C
0x00011E
0x000120
0x000122
0x000124
0x000126
0x000128
0x00012A
0x00012C
0x00012E
0x000130
0x000132
0x000134
0x000136
0x000138
0x00013A
0x00013C
0x00013E
0x000140
0x000142
0x000144
0x000146
0x000148
0x00014A
0x00014C
0x00014E
0x000150
0x000152
0x000154
0x000156
0x000158
0x00015A
0x00015C
0x00015E
0x000160
0x000162
0x000164
0x000166
0x000168
0x00016A
0x00016C
0x00016E
© 2007 Microchip Technology Inc.
Preliminary
Interrupt Source
INT0 – External Interrupt 0
IC1 – Input Compare 1
OC1 – Output Compare 1
T1 – Timer1
Reserved
IC2 – Input Capture 2
OC2 – Output Compare 2
T2 – Timer2
T3 – Timer3
SPI1E – SPI1 Error
SPI1 – SPI1 Transfer Done
U1RX – UART1 Receiver
U1TX – UART1 Transmitter
ADC1 – ADC 1
Reserved
Reserved
SI2C1 – I2C1 Slave Events
MI2C1 – I2C1 Master Events
Reserved
Change Notification Interrupt
INT1 – External Interrupt 1
Reserved
IC7 – Input Capture 7
IC8 – Input Capture 8
Reserved
Reserved
Reserved
Reserved
Reserved
INT2 – External Interrupt 2
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
DS70264B-page 61
dsPIC33FJ12GP201/202
TABLE 6-1:
INTERRUPT VECTORS (CONTINUED)
Vector
Number
Interrupt
Request (IRQ)
Number
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80-125
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72-117
TABLE 6-2:
IVT Address
AIVT Address
0x000070
0x000072
0x000074
0x000076
0x000078
0x00007A
0x00007C
0x00007E
0x000080
0x000082
0x000084
0x000086
0x000088
0x00008A
0x00008C
0x00008E
0x000090
0x000092
0x000094
0x000096
0x000098
0x00009A
0x00009C
0x00009E
0x0000A0
0x0000A2
0x0000A40x0000FE
0x000170
0x000172
0x000174
0x000176
0x000178
0x00017A
0x00017C
0x00017E
0x000180
0x000182
0x000184
0x000186
0x000188
0x00018A
0x00018C
0x00018E
0x000190
0x000192
0x000194
0x000196
0x000198
0x00019A
0x00019C
0x00019E
0x0001A0
0x0001A2
0x0001A40x0001FE
Interrupt Source
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
U1E – UART1 Error
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
TRAP VECTORS
Vector Number
IVT Address
AIVT Address
Trap Source
0
0x000004
0x000104
Reserved
1
0x000006
0x000106
Oscillator Failure
2
0x000008
0x000108
Address Error
3
0x00000A
0x00010A
Stack Error
4
0x00000C
0x00010C
Math Error
5
0x00000E
0x00010E
Reserved
6
0x000010
0x000110
Reserved
7
0x000012
0x000112
Reserved
DS70264B-page 62
Preliminary
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
6.3
Interrupt Control and Status
Registers
6.3.4
dsPIC33FJ12GP201/202 devices implement a total of
17 registers for the interrupt controller:
•
•
•
•
•
•
Interrupt Control Register 1 (INTCON1)
Interrupt Control Register 2 (INTCON2)
Interrupt Flag Status Registers (IFSx)
Interrupt Enable Control Registers (IECx)
Interrupt Priority Control Registers (IPCx)
Interrupt Control and Status Register (INTTREG)
6.3.1
INTCON1 AND INTCON2
Global interrupt control functions are controlled from
INTCON1 and INTCON2. INTCON1 contains the
Interrupt Nesting Disable (NSTDIS) bit as well as the
control and status flags for the processor trap sources.
The INTCON2 register controls the external interrupt
request signal behavior and the use of the Alternate
Interrupt Vector Table.
6.3.2
IFSx
The IFS registers maintain all of the interrupt request
flags. Each source of interrupt has a status bit, which is
set by the respective peripherals or external signal and
is cleared via software.
6.3.3
IECx
The IEC registers maintain all of the interrupt enable
bits. These control bits are used to individually enable
interrupts from the peripherals or external signals.
IPCx
The IPC registers are used to set the interrupt priority
level for each source of interrupt. Each user interrupt
source can be assigned to one of eight priority levels.
6.3.5
INTTREG
The INTTREG register contains the associated
interrupt vector number and the new CPU interrupt
priority level, which are latched into vector number
(VECNUM<6:0>) and Interrupt level (ILR<3:0>) bit
fields in the INTTREG register. The new interrupt
priority level is the priority of the pending interrupt.
The interrupt sources are assigned to the IFSx, IECx
and IPCx registers in the same sequence that they are
listed in Table 6-1. For example, the INT0 (External
Interrupt 0) is shown as having vector number 8 and a
natural order priority of 0. Thus, the INT0IF bit is found
in IFS0<0>, the INT0IE bit in IEC0<0>, and the INT0IP
bits in the first position of IPC0 (IPC0<2:0>).
6.3.6
STATUS REGISTERS
Although they are not specifically part of the interrupt
control hardware, two of the CPU Control registers
contain bits that control interrupt functionality:
• The CPU STATUS register, SR, contains the
IPL<2:0> bits (SR<7:5>). These bits indicate the
current CPU interrupt priority level. The user can
change the current CPU priority level by writing to
the IPL bits.
• The CORCON register contains the IPL3 bit
which, together with IPL<2:0>, also indicates the
current CPU priority level. IPL3 is a read-only bit,
so that trap events cannot be masked by the user
software.
All Interrupt registers are described in Register 6-1
through Register 6-19 in the following pages.
© 2007 Microchip Technology Inc.
Preliminary
DS70264B-page 63
dsPIC33FJ12GP201/202
REGISTER 6-1:
SR: CPU STATUS REGISTER(1)
R-0
R-0
R/C-0
R/C-0
R-0
R/C-0
R -0
R/W-0
OA
OB
SA
SB
OAB
SAB
DA
DC
bit 15
bit 8
R/W-0(3)
R/W-0(3)
IPL2(2)
IPL1
(2)
R/W-0(3)
R-0
R/W-0
R/W-0
R/W-0
R/W-0
IPL0(2)
RA
N
OV
Z
C
bit 7
bit 0
Legend:
C = Clear only bit
R = Readable bit
U = Unimplemented bit, read as ‘0’
S = Set only bit
W = Writable bit
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
IPL<2:0>: CPU Interrupt Priority Level Status bits(1)
111 = CPU Interrupt Priority Level is 7 (15), user interrupts disabled
110 = CPU Interrupt Priority Level is 6 (14)
101 = CPU Interrupt Priority Level is 5 (13)
100 = CPU Interrupt Priority Level is 4 (12)
011 = CPU Interrupt Priority Level is 3 (11)
010 = CPU Interrupt Priority Level is 2 (10)
001 = CPU Interrupt Priority Level is 1 (9)
000 = CPU Interrupt Priority Level is 0 (8)
bit 7-5
Note 1:
2:
3:
For complete register details, see Register 2-1: “SR: CPU Status Register”.
The IPL<2:0> bits are concatenated with the IPL<3> bit (CORCON<3>) to form the CPU Interrupt Priority
Level. The value in parentheses indicates the IPL if IPL<3> = 1. User interrupts are disabled when
IPL<3> = 1.
The IPL<2:0> Status bits are read-only when NSTDIS (INTCON1<15>) = 1.
REGISTER 6-2:
CORCON: CORE CONTROL REGISTER(1)
U-0
—
bit 15
U-0
—
R/W-0
SATA
bit 7
R/W-0
SATB
Note 1:
2:
R/W-0
US
R/W-0
EDT
R-0
R-0
DL<2:0>
R-0
bit 8
Legend:
R = Readable bit
0’ = Bit is cleared
bit 3
U-0
—
R/W-1
SATDW
R/W-0
ACCSAT
C = Clear only bit
W = Writable bit
‘x = Bit is unknown
R/C-0
IPL3(2)
R/W-0
PSV
R/W-0
RND
R/W-0
IF
bit 0
-n = Value at POR
‘1’ = Bit is set
U = Unimplemented bit, read as ‘0’
IPL3: CPU Interrupt Priority Level Status bit 3(2)
1 = CPU interrupt priority level is greater than 7
0 = CPU interrupt priority level is 7 or less
For complete register details, see Register 2-2: “CORCON: CORE Control Register”.
The IPL3 bit is concatenated with the IPL<2:0> bits (SR<7:5>) to form the CPU Interrupt Priority Level.
DS70264B-page 64
Preliminary
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
REGISTER 6-3:
INTCON1: INTERRUPT CONTROL REGISTER 1
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
NSTDIS
OVAERR
OVBERR
COVAERR
COVBERR
OVATE
OVBTE
COVTE
bit 15
bit 8
R/W-0
R/W-0
U-0
R/W-0
R/W-0
R/W-0
R/W-0
U-0
SFTACERR
DIV0ERR
—
MATHERR
ADDRERR
STKERR
OSCFAIL
—
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15
NSTDIS: Interrupt Nesting Disable bit
1 = Interrupt nesting is disabled
0 = Interrupt nesting is enabled
bit 14
OVAERR: Accumulator A Overflow Trap Flag bit
1 = Trap was caused by overflow of Accumulator A
0 = Trap was not caused by overflow of Accumulator A
bit 13
OVBERR: Accumulator B Overflow Trap Flag bit
1 = Trap was caused by overflow of Accumulator B
0 = Trap was not caused by overflow of Accumulator B
bit 12
COVAERR: Accumulator A Catastrophic Overflow Trap Enable bit
1 = Trap was caused by catastrophic overflow of Accumulator A
0 = Trap was not caused by catastrophic overflow of Accumulator A
bit 11
COVBERR: Accumulator B Catastrophic Overflow Trap Enable bit
1 = Trap was caused by catastrophic overflow of Accumulator B
0 = Trap was not caused by catastrophic overflow of Accumulator B
bit 10
OVATE: Accumulator A Overflow Trap Enable bit
1 = Trap overflow of Accumulator A
0 = Trap disabled
bit 9
OVBTE: Accumulator B Overflow Trap Enable bit
1 = Trap overflow of Accumulator B
0 = Trap disabled
bit 8
COVTE: Catastrophic Overflow Trap Enable bit
1 = Trap on catastrophic overflow of Accumulator A or B enabled
0 = Trap disabled
bit 7
SFTACERR: Shift Accumulator Error Status bit
1 = Math error trap was caused by an invalid accumulator shift
0 = Math error trap was not caused by an invalid accumulator shift
bit 6
DIV0ERR: Arithmetic Error Status bit
1 = Math error trap was caused by a divide by zero
0 = Math error trap was not caused by a divide by zero
bit 5
Unimplemented: Read as ‘0’
bit 4
MATHERR: Arithmetic Error Status bit
1 = Math error trap has occurred
0 = Math error trap has not occurred
bit 3
ADDRERR: Address Error Trap Status bit
1 = Address error trap has occurred
0 = Address error trap has not occurred
© 2007 Microchip Technology Inc.
Preliminary
x = Bit is unknown
DS70264B-page 65
dsPIC33FJ12GP201/202
REGISTER 6-3:
INTCON1: INTERRUPT CONTROL REGISTER 1 (CONTINUED)
bit 2
STKERR: Stack Error Trap Status bit
1 = Stack error trap has occurred
0 = Stack error trap has not occurred
bit 1
OSCFAIL: Oscillator Failure Trap Status bit
1 = Oscillator failure trap has occurred
0 = Oscillator failure trap has not occurred
bit 0
Unimplemented: Read as ‘0’
DS70264B-page 66
Preliminary
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
REGISTER 6-4:
INTCON2: INTERRUPT CONTROL REGISTER 2
R/W-0
R-0
U-0
U-0
U-0
U-0
U-0
U-0
ALTIVT
DISI
—
—
—
—
—
—
bit 15
bit 8
U-0
U-0
U-0
U-0
U-0
R/W-0
R/W-0
R/W-0
—
—
—
—
—
INT2EP
INT1EP
INT0EP
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15
ALTIVT: Enable Alternate Interrupt Vector Table bit
1 = Use alternate vector table
0 = Use standard (default) vector table
bit 14
DISI: DISI Instruction Status bit
1 = DISI instruction is active
0 = DISI instruction is not active
bit 13-3
Unimplemented: Read as ‘0’
bit 2
INT2EP: External Interrupt 2 Edge Detect Polarity Select bit
1 = Interrupt on negative edge
0 = Interrupt on positive edge
bit 1
INT1EP: External Interrupt 1 Edge Detect Polarity Select bit
1 = Interrupt on negative edge
0 = Interrupt on positive edge
bit 0
INT0EP: External Interrupt 0 Edge Detect Polarity Select bit
1 = Interrupt on negative edge
0 = Interrupt on positive edge
© 2007 Microchip Technology Inc.
Preliminary
x = Bit is unknown
DS70264B-page 67
dsPIC33FJ12GP201/202
REGISTER 6-5:
IFS0: INTERRUPT FLAG STATUS REGISTER 0
U-0
U-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
—
—
AD1IF
U1TXIF
U1RXIF
SPI1IF
SPI1EIF
T3IF
bit 15
bit 8
R/W-0
R/W-0
R/W-0
U-0
R/W-0
R/W-0
R/W-0
R/W-0
T2IF
OC2IF
IC2IF
—
T1IF
OC1IF
IC1IF
INT0IF
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15-14
Unimplemented: Read as ‘0’
bit 13
AD1IF: ADC1 Conversion Complete Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 12
U1TXIF: UART1 Transmitter Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 11
U1RXIF: UART1 Receiver Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 10
SPI1IF: SPI1 Event Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 9
SPI1EIF: SPI1 Fault Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 8
T3IF: Timer3 Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 7
T2IF: Timer2 Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 6
OC2IF: Output Compare Channel 2 Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 5
IC2IF: Input Capture Channel 2 Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 4
Unimplemented: Read as ‘0’
bit 3
T1IF: Timer1 Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 2
OC1IF: Output Compare Channel 1 Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
DS70264B-page 68
Preliminary
x = Bit is unknown
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
REGISTER 6-5:
IFS0: INTERRUPT FLAG STATUS REGISTER 0 (CONTINUED)
bit 1
IC1IF: Input Capture Channel 1 Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 0
INT0IF: External Interrupt 0 Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
© 2007 Microchip Technology Inc.
Preliminary
DS70264B-page 69
dsPIC33FJ12GP201/202
REGISTER 6-6:
IFS1: INTERRUPT FLAG STATUS REGISTER 1
U-0
U-0
R/W-0
U-0
U-0
U-0
U-0
U-0
—
—
INT2IF
—
—
—
—
—
bit 15
bit 8
R/W-0
R/W-0
U-0
R/W-0
R/W-0
U-0
R/W-0
R/W-0
IC8IF
IC7IF
—
INT1IF
CNIF
—
MI2C1IF
SI2C1IF
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15-14
Unimplemented: Read as ‘0’
bit 13
INT2IF: External Interrupt 2 Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 12-8
Unimplemented: Read as ‘0’
bit 7
IC8IF: Input Capture Channel 8 Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 6
IC7IF: Input Capture Channel 7 Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 5
Unimplemented: Read as ‘0’
bit 4
INT1IF: External Interrupt 1 Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 3
CNIF: Input Change Notification Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 2
Unimplemented: Read as ‘0’
bit 1
MI2C1IF: I2C1 Master Events Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 0
SI2C1IF: I2C1 Slave Events Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
DS70264B-page 70
Preliminary
x = Bit is unknown
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
REGISTER 6-7:
IFS4: INTERRUPT FLAG STATUS REGISTER 4
U-0
U-0
U-0
U-0
U-0
U-0
U-0
U-0
—
—
—
—
—
—
—
—
bit 15
bit 8
U-0
U-0
U-0
U-0
U-0
U-0
U-0
U-0
—
—
—
—
—
—
U1EIF
—
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15-2
Unimplemented: Read as ‘0’
bit 1
U1EIF: UART1 Error Interrupt Flag Status bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 0
Unimplemented: Read as ‘0’
© 2007 Microchip Technology Inc.
Preliminary
x = Bit is unknown
DS70264B-page 71
dsPIC33FJ12GP201/202
REGISTER 6-8:
IEC0: INTERRUPT ENABLE CONTROL REGISTER 0
U-0
U-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
—
—
AD1IE
U1TXIE
U1RXIE
SPI1IE
SPI1EIE
T3IE
bit 15
bit 8
R/W-0
R/W-0
R/W-0
U-0
R/W-0
R/W-0
R/W-0
R/W-0
T2IE
OC2IE
IC2IE
—
T1IE
OC1IE
IC1IE
INT0IE
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15-14
Unimplemented: Read as ‘0’
bit 13
AD1IE: ADC1 Conversion Complete Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 12
U1TXIE: UART1 Transmitter Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 11
U1RXIE: UART1 Receiver Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 10
SPI1IE: SPI1 Event Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 9
SPI1EIE: SPI1 Error Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 8
T3IE: Timer3 Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 7
T2IE: Timer2 Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 6
OC2IE: Output Compare Channel 2 Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 5
IC2IE: Input Capture Channel 2 Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 4
Unimplemented: Read as ‘0’
bit 3
T1IE: Timer1 Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 2
OC1IE: Output Compare Channel 1 Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
DS70264B-page 72
Preliminary
x = Bit is unknown
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
REGISTER 6-8:
IEC0: INTERRUPT ENABLE CONTROL REGISTER 0 (CONTINUED)
bit 1
IC1IE: Input Capture Channel 1 Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 0
INT0IE: External Interrupt 0 Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
© 2007 Microchip Technology Inc.
Preliminary
DS70264B-page 73
dsPIC33FJ12GP201/202
REGISTER 6-9:
IEC1: INTERRUPT ENABLE CONTROL REGISTER 0
U-0
U-0
R/W-0
U-0
U-0
U-0
U-0
U-0
—
—
INT2IE
—
—
—
—
—
bit 15
bit 8
R/W-0
R/W-0
U-0
R/W-0
R/W-0
U-0
R/W-0
R/W-0
IC8IE
IC7IE
—
INT1IE
CNIE
—
MI2C1IE
SI2C1IE
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15-14
Unimplemented: Read as ‘0’
bit 13
INT2IE: External Interrupt 2 Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 12-8
Unimplemented: Read as ‘0’
bit 7
IC8IE: Input Capture Channel 8 Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 6
IC7IE: Input Capture Channel 7 Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 5
Unimplemented: Read as ‘0’
bit 4
INT1IE: External Interrupt 1 Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 3
CNIE: Input Change Notification Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 2
Unimplemented: Read as ‘0’
bit 1
MI2C1IE: I2C1 Master Events Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 0
SI2C1IE: I2C1 Slave Events Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
DS70264B-page 74
Preliminary
x = Bit is unknown
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
REGISTER 6-10:
IEC4: INTERRUPT ENABLE CONTROL REGISTER 0
U-0
U-0
U-0
U-0
U-0
U-0
U-0
U-0
—
—
—
—
—
—
—
—
bit 15
bit 8
U-0
U-0
U-0
U-0
U-0
U-0
R/W-0
U-0
—
—
—
—
—
—
U1EIE
—
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15-2
Unimplemented: Read as ‘0’
bit 1
U1EIE: UART1 Error Interrupt Enable bit
1 = Interrupt request enabled
0 = Interrupt request not enabled
bit 0
Unimplemented: Read as ‘0’
© 2007 Microchip Technology Inc.
Preliminary
x = Bit is unknown
DS70264B-page 75
dsPIC33FJ12GP201/202
REGISTER 6-11:
U-0
IPC0: INTERRUPT PRIORITY CONTROL REGISTER 0
R/W-1
—
R/W-0
R/W-0
T1IP<2:0>
U-0
R/W-1
—
R/W-0
R/W-0
OC1IP<2:0>
bit 15
bit 8
U-0
R/W-1
—
R/W-0
IC1IP<2:0>
R/W-0
U-0
R/W-1
—
R/W-0
R/W-0
INT0IP<2:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15
Unimplemented: Read as ‘0’
bit 14-12
T1IP<2:0>: Timer1 Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 11
Unimplemented: Read as ‘0’
bit 10-8
OC1IP<2:0>: Output Compare Channel 1 Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 7
Unimplemented: Read as ‘0’
bit 6-4
IC1IP<2:0>: Input Capture Channel 1 Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 3
Unimplemented: Read as ‘0’
bit 2-0
INT0IP<2:0>: External Interrupt 0 Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is priority 1
000 = Interrupt source is disabled
DS70264B-page 76
Preliminary
x = Bit is unknown
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
REGISTER 6-12:
U-0
IPC1: INTERRUPT PRIORITY CONTROL REGISTER 1
R/W-1
—
R/W-0
R/W-0
T2IP<2:0>
U-0
R/W-1
—
R/W-0
R/W-0
OC2IP<2:0>
bit 15
bit 8
U-0
R/W-1
—
R/W-0
IC2IP<2:0>
R/W-0
U-0
U-0
U-0
U-0
—
—
—
—
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15
Unimplemented: Read as ‘0’
bit 14-12
T2IP<2:0>: Timer2 Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 11
Unimplemented: Read as ‘0’
bit 10-8
OC2IP<2:0>: Output Compare Channel 2 Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 7
Unimplemented: Read as ‘0’
bit 6-4
IC2IP<2:0>: Input Capture Channel 2 Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 3-0
Unimplemented: Read as ‘0’
© 2007 Microchip Technology Inc.
Preliminary
x = Bit is unknown
DS70264B-page 77
dsPIC33FJ12GP201/202
REGISTER 6-13:
U-0
IPC2: INTERRUPT PRIORITY CONTROL REGISTER 2
R/W-1
—
R/W-0
R/W-0
U1RXIP<2:0>
U-0
R/W-1
—
R/W-0
R/W-0
SPI1IP<2:0>
bit 15
bit 8
U-0
R/W-1
—
R/W-0
SPI1EIP<2:0>
R/W-0
U-0
—
R/W-1
R/W-0
R/W-0
T3IP<2:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15
Unimplemented: Read as ‘0’
bit 14-12
U1RXIP<2:0>: UART1 Receiver Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 11
Unimplemented: Read as ‘0’
bit 10-8
SPI1IP<2:0>: SPI1 Event Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 7
Unimplemented: Read as ‘0’
bit 6-4
SPI1EIP<2:0>: SPI1 Error Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 3
Unimplemented: Read as ‘0’
bit 2-0
T3IP<2:0>: Timer3 Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is priority 1
000 = Interrupt source is disabled
DS70264B-page 78
Preliminary
x = Bit is unknown
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
REGISTER 6-14:
IPC3: INTERRUPT PRIORITY CONTROL REGISTER 3
U-0
U-0
U-0
U-0
U-0
U-0
U-0
U-0
—
—
—
—
—
—
—
—
bit 15
bit 8
U-0
R/W-1
—
R/W-0
AD1IP<2:0>
R/W-0
U-0
R/W-1
—
R/W-0
R/W-0
U1TXIP<2:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15-7
Unimplemented: Read as ‘0’
bit 6-4
AD1IP<2:0>: ADC1 Conversion Complete Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 3
Unimplemented: Read as ‘0’
bit 2-0
U1TXIP<2:0>: UART1 Transmitter Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is priority 1
000 = Interrupt source is disabled
© 2007 Microchip Technology Inc.
Preliminary
x = Bit is unknown
DS70264B-page 79
dsPIC33FJ12GP201/202
REGISTER 6-15:
U-0
IPC4: INTERRUPT PRIORITY CONTROL REGISTER 4
R/W-1
—
R/W-0
R/W-0
CNIP<2:0>
U-0
U-0
U-0
U-0
—
—
—
—
bit 15
bit 8
U-0
R/W-1
—
R/W-0
MI2C1IP<2:0>
R/W-0
U-0
—
R/W-1
R/W-0
R/W-0
SI2C1IP<2:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15
Unimplemented: Read as ‘0’
bit 14-12
CNIP<2:0>: Change Notification Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 11-7
Unimplemented: Read as ‘0’
bit 6-4
MI2C1IP<2:0>: I2C1 Master Events Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 3
Unimplemented: Read as ‘0’
bit 2-0
SI2C1IP<2:0>: I2C1 Slave Events Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is priority 1
000 = Interrupt source is disabled
DS70264B-page 80
Preliminary
x = Bit is unknown
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
REGISTER 6-16:
U-0
IPC5: INTERRUPT PRIORITY CONTROL REGISTER 5
R/W-1
—
R/W-0
R/W-0
IC8IP<2:0>
U-0
R/W-1
—
R/W-0
R/W-0
IC7IP<2:0>
bit 15
bit 8
U-0
U-0
U-0
U-0
U-0
—
—
—
—
—
R/W-1
R/W-0
R/W-0
INT1IP<2:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15
Unimplemented: Read as ‘0’
bit 14-12
IC8IP<2:0>: Input Capture Channel 8 Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 11
Unimplemented: Read as ‘0’
bit 10-8
IC7IP<2:0>: Input Capture Channel 7 Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 7-3
Unimplemented: Read as ‘0’
bit 2-0
INT1IP<2:0>: External Interrupt 1 Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is priority 1
000 = Interrupt source is disabled
© 2007 Microchip Technology Inc.
Preliminary
x = Bit is unknown
DS70264B-page 81
dsPIC33FJ12GP201/202
REGISTER 6-17:
IPC7: INTERRUPT PRIORITY CONTROL REGISTER 7
U-0
U-0
U-0
U-0
U-0
U-0
U-0
U-0
—
—
—
—
—
—
—
—
bit 15
bit 8
U-0
R/W-1
—
R/W-0
INT2IP<2:0>
R/W-0
U-0
U-0
U-0
U-0
—
—
—
—
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15-7
Unimplemented: Read as ‘0’
bit 6-4
INT2IP<2:0>: External Interrupt 2 Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 3-0
Unimplemented: Read as ‘0’
DS70264B-page 82
Preliminary
x = Bit is unknown
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
REGISTER 6-18:
IPC16: INTERRUPT PRIORITY CONTROL REGISTER 16
U-0
U-0
U-0
U-0
U-0
U-0
U-0
U-0
—
—
—
—
—
—
—
—
bit 15
bit 8
U-0
R/W-1
—
R/W-0
U1EIP<2:0>
R/W-0
U-0
U-0
U-0
U-0
—
—
—
—
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15-7
Unimplemented: Read as ‘0’
bit 6-4
U1EIP<2:0>: UART1 Error Interrupt Priority bits
111 = Interrupt is priority 7 (highest priority interrupt)
•
•
•
001 = Interrupt is priority 1
000 = Interrupt source is disabled
bit 3-0
Unimplemented: Read as ‘0’
© 2007 Microchip Technology Inc.
Preliminary
x = Bit is unknown
DS70264B-page 83
dsPIC33FJ12GP201/202
REGISTER 6-19:
INTTREG: INTERRUPT CONTROL AND STATUS REGISTER
U-0
U-0
U-0
U-0
—
—
—
—
R-0
R-0
R-0
R-0
ILR<3:0>
bit 15
bit 8
U-0
R-0
R-0
R-0
—
R-0
R-0
R-0
R-0
VECNUM<6:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15-12
Unimplemented: Read as ‘0’
bit 11-8
ILR: New CPU Interrupt Priority Level bits
1111 = CPU Interrupt Priority Level is 15
•
•
•
0001 = CPU Interrupt Priority Level is 1
0000 = CPU Interrupt Priority Level is 0
bit 7
Unimplemented: Read as ‘0’
bit 6-0
VECNUM: Vector Number of Pending Interrupt bits
0111111 = Interrupt Vector pending is number 135
•
•
•
0000001 = Interrupt Vector pending is number 9
0000000 = Interrupt Vector pending is number 8
DS70264B-page 84
Preliminary
x = Bit is unknown
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
6.4
Interrupt Setup Procedures
6.4.1
6.4.3
A Trap Service Routine is coded like an ISR, except
that the appropriate trap status flag in the INTCON1
register must be cleared to avoid re-entry into the TSR.
INITIALIZATION
To configure an interrupt source at initialization:
1.
2.
Set the NSTDIS bit (INTCON1<15>) if nested
interrupts are not desired.
Select the user-assigned priority level for the
interrupt source by writing the control bits in the
appropriate IPCx register. The priority level will
depend on the specific application and type of
interrupt source. If multiple priority levels are not
desired, the IPCx register control bits for all
enabled interrupt sources can be programmed
to the same non-zero value.
Note:
3.
4.
At a device Reset, the IPCx registers are
initialized such that all user interrupt
sources are assigned to priority level 4.
Clear the interrupt flag status bit associated with
the peripheral in the associated IFSx register.
Enable the interrupt source by setting the
interrupt enable control bit associated with the
source in the appropriate IECx register.
6.4.2
TRAP SERVICE ROUTINE
6.4.4
INTERRUPT DISABLE
All user interrupts can be disabled using this
procedure:
1.
Push the current SR value onto the software
stack using the PUSH instruction.
Force the CPU to priority level 7 by inclusive
ORing the value OEh with SRL.
2.
To enable user interrupts, the POP instruction can be
used to restore the previous SR value.
Note:
Only user interrupts with a priority level of
7 or lower can be disabled. Trap sources
(level 8-level 15) cannot be disabled.
The DISI instruction provides a convenient way to
disable interrupts of priority levels 1-6 for a fixed period
of time. Level 7 interrupt sources are not disabled by
the DISI instruction.
INTERRUPT SERVICE ROUTINE
The method used to declare an ISR and initialize
IVT with the correct vector address depends on
programming language (C or Assembler) and
language development toolsuite used to develop
application.
the
the
the
the
In general, the user application must clear the interrupt
flag in the appropriate IFSx register for the source of
interrupt that the ISR handles. Otherwise, the program
will re-enter the ISR immediately after exiting the
routine. If the ISR is coded in assembly language, it
must be terminated using a RETFIE instruction to
unstack the saved PC value, SRL value and old CPU
priority level.
© 2007 Microchip Technology Inc.
Preliminary
DS70264B-page 85
dsPIC33FJ12GP201/202
NOTES:
DS70264B-page 86
Preliminary
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
7.0
OSCILLATOR
CONFIGURATION
Note:
This data sheet summarizes the features
of the dsPIC33FJ12GP201/202 devices. It
is not intended to be a comprehensive
reference source. To complement the
information in this data sheet, refer to the
“dsPIC33F Family Reference Manual”.
Please see the Microchip web site
(www.microchip.com) for the latest
dsPIC33F Family Reference Manual
sections.
The dsPIC33FJ12GP201/202
provides:
oscillator
system
A simplified diagram of the oscillator system is shown
in Figure 7-1.
• External and internal oscillator options as clock
sources
FIGURE 7-1:
• An on-chip PLL to scale the internal operating
frequency to the required system clock frequency
• An internal FRC oscillator that can also be used
with the PLL, thereby allowing full-speed
operation without any external clock generation
hardware
• Clock switching between various clock sources
• Programmable clock postscaler for system power
savings
• A Fail-Safe Clock Monitor (FSCM) that detects
clock failure and takes fail-safe measures
• A Clock Control register (OSCCON)
• Nonvolatile Configuration bits for main oscillator
selection.
dsPIC33FJ12GP201/202 OSCILLATOR SYSTEM DIAGRAM
dsPIC33F
Primary Oscillator
S3
OSCI
PLL
S1
(1)
XTPLL, HSPLL,
ECPLL, FRCPLL
DOZE<2:0>
S2
DOZE
XT, HS, EC
OSCO
S1/S3
FCY
÷ 2
FRCDIV
FOSC
FRC
Oscillator
FRCDIVN
S7
FRCDIV<2:0>
TUN<5:0>
÷ 16
FRCDIV16
FRC
LPRC
LPRC
Oscillator
Secondary Oscillator
SOSC
SOSCO
S6
S0
S5
S4
LPOSCEN
SOSCI
Clock Fail
S7
Clock Switch
Reset
NOSC<2:0> FNOSC<2:0>
WDT, PWRT,
FSCM
Timer 1
Note 1:
See Figure 7-2 for PLL details.
© 2007 Microchip Technology Inc.
Preliminary
DS70264B-page 87
dsPIC33FJ12GP201/202
7.1
CPU Clocking System
7.1.2
The dsPIC33FJ12GP201/202 device provides seven
system clock options:
•
•
•
•
•
•
•
Fast RC (FRC) Oscillator
FRC Oscillator with PLL
Primary (XT, HS or EC) Oscillator
Primary Oscillator with PLL
Secondary (LP) Oscillator
Low-Power RC (LPRC) Oscillator
FRC Oscillator with postscaler
7.1.1
7.1.1.1
SYSTEM CLOCK SOURCES
SYSTEM CLOCK SELECTION
The oscillator source used at a device Power-on Reset
event is selected using Configuration bit settings. The
oscillator Configuration bit settings are located in the
Configuration registers in the program memory. (Refer
to Section 18.1 “Configuration Bits” for further
details.) The Initial Oscillator Selection Configuration
bits, FNOSC<2:0> (FOSCSEL<2:0>), and the Primary
Oscillator
Mode
Select
Configuration
bits,
POSCMD<1:0> (FOSC<1:0>), select the oscillator
source that is used at a Power-on Reset. The FRC
primary oscillator is the default (unprogrammed)
selection.
The Configuration bits allow users to choose among 12
different clock modes, shown in Table 7-1.
Fast RC
The Fast RC (FRC) internal oscillator runs at a nominal
frequency of 7.37 MHz. User software can tune the
FRC frequency. User software can optionally specify a
factor (ranging from 1:2 to 1:256) by which the FRC
clock frequency is divided. This factor is selected using
the FRCDIV<2:0> (CLKDIV<10:8>) bits.
The output of the oscillator (or the output of the PLL if
a PLL mode has been selected) FOSC is divided by 2 to
generate the device instruction clock (FCY). FCY
defines the operating speed of the device, and speeds
up to
40
MHz
are
supported by
the
dsPIC33FJ12GP201/202 architecture.
7.1.1.2
Instruction execution speed or device operating
frequency, FCY, is given by:
Primary
The primary oscillator can use one of the following as
its clock source:
• XT (Crystal): Crystals and ceramic resonators in
the range of 3 MHz to 10 MHz. The crystal is
connected to the OSC1 and OSC2 pins.
• HS (High-Speed Crystal): Crystals in the range of
10 MHz to 40 MHz. The crystal is connected to
the OSC1 and OSC2 pins.
• EC (External Clock): External clock signal in the
range of 0.8 MHz to 64 MHz. The external clock
signal is directly applied to the OSC1 pin.
7.1.1.3
Secondary
The secondary (LP) oscillator is designed for low power
and uses a 32.768 kHz crystal or ceramic resonator.
The LP oscillator uses the SOSCI and SOSCO pins.
7.1.1.4
Low-Power RC
The Low-Power RC (LPRC) internal oscIllator runs at a
nominal frequency of 32.768 kHz. It is also used as a
reference clock by the Watchdog Timer (WDT) and
Fail-Safe Clock Monitor (FSCM).
7.1.1.5
FRC
The clock signals generated by the FRC and primary
oscillators can be optionally applied to an on-chip
Phase Locked Loop (PLL) to provide a wide range of
output frequencies for device operation. PLL
configuration is described in Section 7.1.3 “PLL
Configuration”.
DS70264B-page 88
EQUATION 7-1:
DEVICE OPERATING
FREQUENCY
FCY = FOSC/2
7.1.3
PLL CONFIGURATION
The primary oscillator and internal FRC oscillator can
optionally use an on-chip PLL to obtain higher speeds
of operation. The PLL provides significant flexibility in
selecting the device operating speed. A block diagram
of the PLL is shown in Figure 7-2.
The output of the primary oscillator or FRC, denoted as
‘FIN’, is divided down by a prescale factor (N1) of 2, 3,...
or 33 before being provided to the PLL’s Voltage
Controlled Oscillator (VCO). The input to the VCO must
be selected in the range of 0.8 MHz to 8 MHz. The
prescale factor ‘N1’ is selected using the
PLLPRE<4:0> bits (CLKDIV<4:0>).
The PLL Feedback Divisor, selected using the
PLLDIV<8:0> bits (PLLFBD<8:0>), provides a factor ‘M,’
by which the input to the VCO is multiplied. This factor
must be selected such that the resulting VCO output
frequency is in the range of 100 MHz to 200 MHz.
The VCO output is further divided by a postscale factor
‘N2.’ This factor is selected using the PLLPOST<1:0>
bits (CLKDIV<7:6>). ‘N2’ can be either 2, 4 or 8, and
must be selected such that the PLL output frequency
(FOSC) is in the range of 12.5 MHz to 80 MHz, which
generates device operating speeds of 6.25-40 MIPS.
Preliminary
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
For a primary oscillator or FRC oscillator, output ‘FIN’,
the PLL output ‘FOSC’ is given by:
EQUATION 7-2:
• If PLLDIV<8:0> = 0x1E, then M = 32. This yields a
VCO output of 5 x 32 = 160 MHz, which is within
the 100-200 MHz ranged needed.
• If PLLPOST<1:0> = 0, then N2 = 2. This provides
a Fosc of 160/2 = 80 MHz. The resultant device
operating speed is 80/2 = 40 MIPS.
FOSC CALCULATION
M
( N1*N2
)
FOSC = FIN*
For example, suppose a 10 MHz crystal is being used,
with “XT with PLL” being the selected oscillator mode.
EQUATION 7-3:
• If PLLPRE<4:0> = 0, then N1 = 2. This yields a
VCO input of 10/2 = 5 MHz, which is within the
acceptable range of 0.8-8 MHz.
FIGURE 7-2:
FCY =
XT WITH PLL MODE
EXAMPLE
(
)
FOSC 1 10000000*32
=
= 40 MIPS
2
2
2*2
dsPIC33FJ12GP201/202 PLL BLOCK DIAGRAM
0.8-8.0 MHz
Here
Source (Crystal, External Clock
or Internal RC)
PLLPRE
100-200 MHz
Here
VCO
X
12.5-80 MHz
Here
FOSC
PLLPOST
PLLDIV
Divide by
2-33
Divide by
2-513
TABLE 7-1:
Divide by
2, 4, 8
CONFIGURATION BIT VALUES FOR CLOCK SELECTION
Oscillator Mode
Oscillator Source
POSCMD<1:0>
FNOSC<2:0>
Note
Fast RC Oscillator with Divide-by-N
(FRCDIVN)
Internal
xx
111
1, 2
Fast RC Oscillator with Divide-by-16
(FRCDIV16)
Internal
xx
110
1
Low-Power RC Oscillator (LPRC)
Internal
xx
101
1
Secondary
xx
100
1
Primary Oscillator (HS) with PLL
(HSPLL)
Primary
10
011
Primary Oscillator (XT) with PLL
(XTPLL)
Primary
01
011
Primary Oscillator (EC) with PLL
(ECPLL)
Primary
00
011
Primary Oscillator (HS)
Primary
10
010
Primary Oscillator (XT)
Primary
01
010
Primary Oscillator (EC)
Primary
00
010
1
Fast RC Oscillator with PLL (FRCPLL)
Internal
xx
001
1
Fast RC Oscillator (FRC)
Internal
xx
000
1
Secondary (Timer1) Oscillator (SOSC)
Note 1:
2:
1
OSC2 pin function is determined by the OSCIOFNC Configuration bit.
This is the default oscillator mode for an unprogrammed (erased) device.
© 2007 Microchip Technology Inc.
Preliminary
DS70264B-page 89
dsPIC33FJ12GP201/202
REGISTER 7-1:
OSCCON: OSCILLATOR CONTROL REGISTER
U-0
R-0
—
R-0
R-0
COSC<2:0>
U-0
R/W-y
—
R/W-y
R/W-y
NOSC<2:0>
bit 15
bit 8
R/W-0
R/W-0
R-0
U-0
R/C-0
U-0
R/W-0
R/W-0
CLKLOCK
IOLOCK
LOCK
—
CF
—
LPOSCEN
OSWEN
bit 7
bit 0
Legend:
y = Value set from Configuration bits on POR
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15
Unimplemented: Read as ‘0’
bit 14-12
COSC<2:0>: Current Oscillator Selection bits (read-only)
000 = Fast RC oscillator (FRC)
001 = Fast RC oscillator (FRC) with PLL
010 = Primary oscillator (XT, HS, EC)
011 = Primary oscillator (XT, HS, EC) with PLL
100 = Secondary oscillator (SOSC)
101 = Low-Power RC oscillator (LPRC)
110 = Fast RC oscillator (FRC) with Divide-by-16
111 = Fast RC oscillator (FRC) with Divide-by-n
bit 11
Unimplemented: Read as ‘0’
bit 10-8
NOSC<2:0>: New Oscillator Selection bits
000 = Fast RC oscillator (FRC)
001 = Fast RC oscillator (FRC) with PLL
010 = Primary oscillator (XT, HS, EC)
011 = Primary oscillator (XT, HS, EC) with PLL
100 = Secondary oscillator (SOSC)
101 = Low-Power RC oscillator (LPRC)
110 = Fast RC oscillator (FRC) with Divide-by-16
111 = Fast RC oscillator (FRC) with Divide-by-n
bit 7
CLKLOCK: Clock Lock Enable bit
If clock switching is enabled and FSCM is disabled (FOSC<FCKSM> = 0b01)
1 = Clock switching is disabled, system clock source is locked
0 = Clock switching is enabled, system clock source can be modified by clock switching
bit 6
IOLOCK: Peripheral Pin Select Lock bit
1 = Peripherial Pin Select is locked, write to peripheral pin select register is not allowed
0 = Peripherial Pin Select is unlocked, write to peripheral pin select register is allowed
bit 5
LOCK: PLL Lock Status bit (read-only)
1 = Indicates that PLL is in lock, or PLL start-up timer is satisfied
0 = Indicates that PLL is out of lock, start-up timer is in progress or PLL is disabled
bit 4
Unimplemented: Read as ‘0’
bit 3
CF: Clock Fail Detect bit (read/clear by application)
1 = FSCM has detected clock failure
0 = FSCM has not detected clock failure
bit 2
Unimplemented: Read as ‘0’
DS70264B-page 90
Preliminary
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
REGISTER 7-1:
OSCCON: OSCILLATOR CONTROL REGISTER (CONTINUED)
bit 1
LPOSCEN: Secondary (LP) Oscillator Enable bit
1 = Enable secondary oscillator
0 = Disable secondary oscillator
bit 0
OSWEN: Oscillator Switch Enable bit
1 = Request oscillator switch to selection specified by NOSC<2:0> bits
0 = Oscillator switch is complete
© 2007 Microchip Technology Inc.
Preliminary
DS70264B-page 91
dsPIC33FJ12GP201/202
REGISTER 7-2:
R/W-0
CLKDIV: CLOCK DIVISOR REGISTER
R/W-0
ROI
R/W-0
R/W-0
R/W-0
R/W-1
DOZEN(1)
DOZE<2:0>
R/W-0
R/W-0
FRCDIV<2:0>
bit 15
bit 8
R/W-0
R/W-1
PLLPOST<1:0>
U-0
R/W-0
R/W-0
—
R/W-0
R/W-0
R/W-0
PLLPRE<4:0>
bit 7
bit 0
Legend:
y = Value set from Configuration bits on POR
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15
ROI: Recover on Interrupt bit
1 = Interrupts will clear the DOZEN bit and the processor clock/peripheral clock ratio is set to 1:1
0 = Interrupts have no effect on the DOZEN bit
bit 14-12
DOZE<2:0>: Processor Clock Reduction Select bits
000 = FCY/1
001 = FCY/2
010 = FCY/4
011 = FCY/8 (default)
100 = FCY/16
101 = FCY/32
110 = FCY/64
111 = FCY/128
bit 11
DOZEN: DOZE Mode Enable bit(1)
1 = DOZE<2:0> field specifies the ratio between the peripheral clocks and the processor clocks
0 = Processor clock/peripheral clock ratio forced to 1:1
bit 10-8
FRCDIV<2:0>: Internal Fast RC Oscillator Postscaler bits
000 = FRC divide by 1 (default)
001 = FRC divide by 2
010 = FRC divide by 4
011 = FRC divide by 8
100 = FRC divide by 16
101 = FRC divide by 32
110 = FRC divide by 64
111 = FRC divide by 256
bit 7-6
PLLPOST<1:0>: PLL VCO Output Divider Select bits (also denoted as ‘N2’, PLL postscaler)
00 = Output/2
01 = Output/4 (default)
10 = Reserved
11 = Output/8
bit 5
Unimplemented: Read as ‘0’
bit 4-0
PLLPRE<4:0>: PLL Phase Detector Input Divider bits (also denoted as ‘N1’, PLL prescaler)
00000 = Input/2 (default)
00001 = Input/3
•••
11111 = Input/33
Note 1:
This bit is cleared when the ROI bit is set and an interrupt occurs.
DS70264B-page 92
Preliminary
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
REGISTER 7-3:
PLLFBD: PLL FEEDBACK DIVISOR REGISTER
U-0
U-0
U-0
U-0
U-0
U-0
U-0
R/W-0(1)
—
—
—
—
—
—
—
PLLDIV<8>
bit 15
bit 8
R/W-0
R/W-0
R/W-1
R/W-1
R/W-0
R/W-0
R/W-0
R/W-0
PLLDIV<7:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15-9
Unimplemented: Read as ‘0’
bit 8-0
PLLDIV<8:0>: PLL Feedback Divisor bits (also denoted as ‘M’, PLL multiplier)
000000000 = 2
000000001 = 3
000000010 = 4
•
•
•
000110000 = 50 (default)
•
•
•
111111111 = 513
© 2007 Microchip Technology Inc.
Preliminary
DS70264B-page 93
dsPIC33FJ12GP201/202
REGISTER 7-4:
OSCTUN: FRC OSCILLATOR TUNING REGISTER
U-0
U-0
U-0
U-0
U-0
U-0
U-0
U-0
—
—
—
—
—
—
—
—
bit 15
bit 8
U-0
U-0
—
—
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
TUN<5:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15-6
Unimplemented: Read as ‘0’
bit 5-0
TUN<5:0>: FRC Oscillator Tuning bits
011111 = Center frequency + 11.625%
011110 = Center frequency + 11.25% (8.23 MHz)
•
•
•
000001 = Center frequency + 0.375% (7.40 MHz)
000000 = Center frequency (7.37 MHz nominal)
111111 = Center frequency -0.375% (7.345 MHz)
•
•
•
100001 = Center frequency -11.625% (6.52 MHz)
100000 = Center frequency -12% (6.49 MHz)
DS70264B-page 94
Preliminary
x = Bit is unknown
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
7.2
Clock Switching Operation
1.
Applications are free to switch among any of the four
clock sources (Primary, LP, FRC and LPRC) under
software control at any time. To limit the possible side
effects of this flexibility, dsPIC33FJ12GP201/202
devices have a safeguard lock built into the switch
process.
Note:
7.2.1
Primary Oscillator mode has three different
submodes (XT, HS and EC), which are
determined by the POSCMD<1:0> Configuration bits. While an application can
switch to and from Primary Oscillator
mode in software, it cannot switch among
the different primary submodes without
reprogramming the device.
The clock switching hardware compares the
COSC status bits with the new value of the
NOSC control bits. If they are the same, the
clock switch is a redundant operation. In this
case, the OSWEN bit is cleared automatically
and the clock switch is aborted.
If a valid clock switch has been initiated, the
LOCK
(OSCCON<5>)
and
the
CF
(OSCCON<3>) status bits are cleared.
The new oscillator is turned on by the hardware
if it is not currently running. If a crystal oscillator
must be turned on, the hardware waits until the
Oscillator Start-up Timer (OST) expires. If the
new source is using the PLL, the hardware waits
until a PLL lock is detected (LOCK = 1).
The hardware waits for 10 clock cycles from the
new clock source and then performs the clock
switch.
The hardware clears the OSWEN bit to indicate a
successful clock transition. In addition, the NOSC
bit values are transferred to the COSC status bits.
The old clock source is turned off at this time,
with the exception of LPRC (if WDT or FSCM
are enabled) or LP (if LPOSCEN remains set).
2.
3.
4.
ENABLING CLOCK SWITCHING
To enable clock switching, the FCKSM1 Configuration
bit in the Configuration register must be programmed to
‘0’. (Refer to Section 18.1 “Configuration Bits” for
further details.) If the FCKSM1 Configuration bit is
unprogrammed (‘1’), the clock switching function and
Fail-Safe Clock Monitor function are disabled. This is
the default setting.
The NOSC control bits (OSCCON<10:8>) do not
control the clock selection when clock switching is
disabled. However, the COSC bits (OSCCON<14:12>)
reflect the clock source selected by the FNOSC
Configuration bits.
5.
6.
Note 1: The processor continues to execute code
throughout the clock switching sequence.
Timing-sensitive code should not be
executed during this time.
2: Direct clock switches between any primary
oscillator mode with PLL and FRCPLL
mode are not permitted. This applies to
clock switches in either direction. In these
instances, the application must switch to
FRC mode as a transition clock source
between the two PLL modes.
The OSWEN control bit (OSCCON<0>) has no effect
when clock switching is disabled. It is held at ‘0’ at all
times.
7.2.2
Performing
sequence:
1.
2.
3.
4.
5.
OSCILLATOR SWITCHING
SEQUENCE
a
clock
switch requires this
basic
If
desired,
read
the
COSC
bits
(OSCCON<14:12>) to determine the current
oscillator source.
Perform the unlock sequence to allow a write to
the OSCCON register high byte.
Write the appropriate value to the NOSC control
bits (OSCCON<10:8>) for the new oscillator
source.
Perform the unlock sequence to allow a write to
the OSCCON register low byte.
Set the OSWEN bit to initiate the oscillator
switch.
Once the basic sequence is completed, the system
clock hardware responds automatically as follows:
© 2007 Microchip Technology Inc.
7.3
Fail-Safe Clock Monitor (FSCM)
The Fail-Safe Clock Monitor (FSCM) allows the device
to continue to operate even in the event of an oscillator
failure. The FSCM function is enabled by programming.
If the FSCM function is enabled, the LPRC internal
oscillator runs at all times (except during Sleep mode)
and is not subject to control by the Watchdog Timer.
In the event of an oscillator failure, the FSCM
generates a clock failure trap event and switches the
system clock over to the FRC oscillator. Then the
application program can either attempt to restart the
oscillator or execute a controlled shutdown. The trap
can be treated as a warm Reset by simply loading the
Reset address into the oscillator fail trap vector.
If the PLL multiplier is used to scale the system clock,
the internal FRC is also multiplied by the same factor
on clock failure. Essentially, the device switches to
FRC with PLL on a clock failure.
Preliminary
DS70264B-page 95
dsPIC33FJ12GP201/202
NOTES:
DS70264B-page 96
Preliminary
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
8.0
Note:
POWER-SAVING FEATURES
8.2
This data sheet summarizes the features
of the dsPIC33FJ12GP201/202 devices. It
is not intended to be a comprehensive
reference source. To complement the
information in this data sheet, refer to the
“dsPIC33F Family Reference Manual”.
Please see the Microchip web site
(www.microchip.com) for the latest
dsPIC33F Family Reference Manual
sections.
The dsPIC33FJ12GP201/202 devices provide the
ability to manage power consumption by selectively
managing clocking to the CPU and the peripherals. In
general, a lower clock frequency and a reduction in the
number of circuits being clocked constitutes lower
consumed power. dsPIC33FJ12GP201/202 devices
can manage power consumption in four different ways:
•
•
•
•
Clock frequency
Instruction-based Sleep and Idle modes
Software-controlled Doze mode
Selective peripheral control in software
dsPIC33FJ12GP201/202 devices have two special
power-saving modes that are entered through the
execution of a special PWRSAV instruction. Sleep mode
stops clock operation and halts all code execution. Idle
mode halts the CPU and code execution, but allows
peripheral modules to continue operation. The
Assembler syntax of the PWRSAV instruction is shown
in Example 8-1.
Note:
SLEEP_MODE and IDLE_MODE are constants defined in the assembler include
file for the selected device.
Sleep and Idle modes can be exited as a result of an
enabled interrupt, WDT time-out or a device Reset. When
the device exits these modes, it is said to wake-up.
8.2.1
SLEEP MODE
The following occur in Sleep mode:
Combinations of these methods can be used to
selectively tailor an application’s power consumption
while still maintaining critical application features, such
as timing-sensitive communications.
8.1
Instruction-Based Power-Saving
Modes
Clock Frequency and Clock
Switching
dsPIC33FJ12GP201/202 devices allow a wide range
of clock frequencies to be selected under application
control. If the system clock configuration is not locked,
users can choose low-power or high-precision
oscillators by simply changing the NOSC bits
(OSCCON<10:8>). The process of changing a system
clock during operation, as well as limitations to the
process, are discussed in more detail in Section 7.0
“Oscillator Configuration”.
• The system clock source is shut down. If an
on-chip oscillator is used, it is turned off.
• The device current consumption is reduced to a
minimum, provided that no I/O pin is sourcing
current.
• The Fail-Safe Clock Monitor does not operate,
since the system clock source is disabled.
• The LPRC clock continues to run if the WDT is
enabled.
• The WDT, if enabled, is automatically cleared
prior to entering Sleep mode.
• Some device features or peripherals may continue
to operate. This includes items such as the input
change notification on the I/O ports, or peripherals
that use an external clock input.
• Any peripheral that requires the system clock
source for its operation is disabled.
The device will wake-up from Sleep mode on any of the
these events:
• Any interrupt source that is individually enabled
• Any form of device Reset
• A WDT time-out
On wake-up from Sleep mode, the processor restarts
with the same clock source that was active when Sleep
mode was entered.
EXAMPLE 8-1:
PWRSAV INSTRUCTION SYNTAX
PWRSAV #SLEEP_MODE
PWRSAV #IDLE_MODE
; Put the device into SLEEP mode
; Put the device into IDLE mode
© 2007 Microchip Technology Inc.
Preliminary
DS70264B-page 97
dsPIC33FJ12GP201/202
8.2.2
IDLE MODE
The following occur in Idle mode:
• The CPU stops executing instructions.
• The WDT is automatically cleared.
• The system clock source remains active. By
default, all peripheral modules continue to operate
normally from the system clock source, but can
also be selectively disabled (see Section 8.4
“Peripheral Module Disable”).
• If the WDT or FSCM is enabled, the LPRC also
remains active.
The device will wake from Idle mode on any of these
events:
• Any interrupt that is individually enabled.
• Any device Reset
• A WDT time-out
Doze mode is enabled by setting the DOZEN bit
(CLKDIV<11>). The ratio between peripheral and core
clock speed is determined by the DOZE<2:0> bits
(CLKDIV<14:12>). There are eight possible
configurations, from 1:1 to 1:128, with 1:1 being the
default setting.
Programs can use Doze mode to selectively reduce
power consumption in event-driven applications. This
allows clock-sensitive functions, such as synchronous
communications, to continue without interruption while
the CPU idles, waiting for something to invoke an
interrupt routine. An automatic return to full-speed CPU
operation on interrupts can be enabled by setting the
ROI bit (CLKDIV<15>). By default, interrupt events
have no effect on Doze mode operation.
On wake-up from Idle mode, the clock is reapplied to
the CPU and instruction execution begins immediately,
starting with the instruction following the PWRSAV
instruction, or the first instruction in the ISR.
For example, suppose the device is operating at
20 MIPS and the CAN module has been configured for
500 kbps based on this device operating speed. If the
device is placed in Doze mode with a clock frequency
ratio of 1:4, the CAN module continues to communicate
at the required bit rate of 500 kbps, but the CPU now
starts executing instructions at a frequency of 5 MIPS.
8.2.3
8.4
INTERRUPTS COINCIDENT WITH
POWER SAVE INSTRUCTIONS
Any interrupt that coincides with the execution of a
PWRSAV instruction is held off until entry into Sleep or
Idle mode has completed. The device then wakes up
from Sleep or Idle mode.
8.3
Doze Mode
The preferred strategies for reducing power
consumption are changing clock speed and invoking
one of the power-saving modes. In some
circumstances, however, these are not practical. For
example, it may be necessary for an application to
maintain uninterrupted synchronous communication,
even while it is doing nothing else. Reducing system
clock speed can introduce communication errors, while
using a power-saving mode can stop communications
completely.
The Peripheral Module Disable (PMD) registers
provide a method to disable a peripheral module by
stopping all clock sources supplied to that module.
When a peripheral is disabled using the appropriate
PMD control bit, the peripheral is in a minimum power
consumption state. The control and status registers
associated with the peripheral are also disabled, so
writes to those registers will have no effect and read
values will be invalid.
A peripheral module is enabled only if both the
associated bit in the PMD register is cleared and the
peripheral is supported by the specific dsPIC® DSC
variant. If the peripheral is present in the device, it is
enabled in the PMD register by default.
Note:
Doze mode is a simple and effective alternative method
to reduce power consumption while the device is still
executing code. In this mode, the system clock continues to operate from the same source and at the same
speed. Peripheral modules continue to be clocked at
the same speed, while the CPU clock speed is
reduced. Synchronization between the two clock
domains is maintained, allowing the peripherals to
access the SFRs while the CPU executes code at a
slower rate.
DS70264B-page 98
Peripheral Module Disable
Preliminary
If a PMD bit is set, the corresponding module is disabled after a delay of one instruction cycle. Similarly, if a PMD bit is cleared,
the corresponding module is enabled after
a delay of one instruction cycle (assuming
the module control registers are already
configured to enable module operation).
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
9.0
Note:
I/O PORTS
This data sheet summarizes the features
of the dsPIC33FJ12GP201/202 devices. It
is not intended to be a comprehensive
reference source. To complement the
information in this data sheet, refer to the
“dsPIC33F Family Reference Manual”.
Please see the Microchip web site
(www.microchip.com) for the latest
dsPIC33F Family Reference Manual
sections.
All of the device pins (except VDD, VSS, MCLR and
OSC1/CLKI) are shared among the peripherals and the
parallel I/O ports. All I/O input ports feature Schmitt
Trigger inputs for improved noise immunity.
9.1
Parallel I/O (PIO) Ports
A parallel I/O port that shares a pin with a peripheral is
generally subservient to the peripheral. The
peripheral’s output buffer data and control signals are
provided to a pair of multiplexers. The multiplexers
select whether the peripheral or the associated port
has ownership of the output data and control signals of
the I/O pin. The logic also prevents “loop through,” in
which a port’s digital output can drive the input of a
peripheral that shares the same pin. Figure 9-1 shows
how ports are shared with other peripherals and the
associated I/O pin to which they are connected.
FIGURE 9-1:
When a peripheral is enabled and the peripheral is
actively driving an associated pin, the use of the pin as
a general purpose output pin is disabled. The I/O pin
can be read, but the output driver for the parallel port bit
is disabled. If a peripheral is enabled, but the peripheral
is not actively driving a pin, that pin can be driven by a
port.
All port pins have three registers directly associated
with their operation as digital I/O. The data direction
register (TRISx) determines whether the pin is an input
or an output. If the data direction bit is a ‘1’, then the pin
is an input. All port pins are defined as inputs after a
Reset. Reads from the latch (LATx) read the latch.
Writes to the latch, write the latch. Reads from the port
(PORTx) read the port pins, while writes to the port pins
write the latch.
Any bit and its associated data and control registers
that are not valid for a particular device will be
disabled. That means the corresponding LATx and
TRISx registers and the port pin will read as zeros.
When a pin is shared with another peripheral or
function that is defined as an input only, it is
nevertheless regarded as a dedicated port because
there is no other competing source of outputs.
BLOCK DIAGRAM OF A TYPICAL SHARED PORT STRUCTURE
Peripheral Module
Output Multiplexers
Peripheral Input Data
Peripheral Module Enable
Peripheral Output Enable
Peripheral Output Data
PIO Module
WR TRIS
Output Enable
0
1
Output Data
0
Read TRIS
Data Bus
I/O
1
D
Q
I/O Pin
CK
TRIS Latch
D
WR LAT +
WR Port
Q
CK
Data Latch
Read LAT
Input Data
Read Port
© 2007 Microchip Technology Inc.
Preliminary
DS70264B-page 99
dsPIC33FJ12GP201/202
9.1.1
9.3
OPEN-DRAIN CONFIGURATION
In addition to the PORT, LAT and TRIS registers for
data control, each port pin can also be individually
configured for either digital or open-drain output. This
is controlled by the Open-Drain Control register,
ODCx, associated with each port. Setting any of the
bits configures the corresponding pin to act as an
open-drain output.
The open-drain feature allows the generation of
outputs higher than VDD (e.g., 5V) on any desired
digital-only pins by using external pull-up resistors.
The maximum open-drain voltage allowed is the same
as the maximum VIH specification.
9.2
Configuring Analog Port Pins
The AD1PCFG and TRIS registers control the operation of the Analog-to-Digital (A/D) port pins. The port
pins that are desired as analog inputs must have their
corresponding TRIS bit set (input). If the TRIS bit is
cleared (output), the digital output level (VOH or VOL)
will be converted.
When the PORT register is read, all pins configured as
analog input channels will read as cleared (a low level).
Pins configured as digital inputs will not convert an
analog input. Analog levels on any pin that is defined as
a digital input (including the ANx pins) can cause the
input buffer to consume current that exceeds the
device specifications.
9.2.1
Input Change Notification
The input change notification function of the I/O ports
allows the dsPIC33FJ12GP201/202 devices to
generate interrupt requests to the processor in
response to a change-of-state on selected input pins.
This feature can detect input change-of-states even in
Sleep mode, when the clocks are disabled. Depending
on the device pin count, up to 21 external signals (CNx
pin) can be selected (enabled) for generating an
interrupt request on a change-of-state.
Four control registers are associated with the CN module. The CNEN1 and CNEN2 registers contain the
interrupt enable control bits for each of the CN input
pins. Setting any of these bits enables a CN interrupt
for the corresponding pins.
Each CN pin also has a weak pull-up connected to it.
The pull-ups act as a current source connected to the
pin, and eliminate the need for external resistors when
push button or keypad devices are connected. The
pull-ups are enabled separately using the CNPU1 and
CNPU2 registers, which contain the control bits for
each of the CN pins. Setting any of the control bits
enables the weak pull-ups for the corresponding pins.
Note:
Pull-ups on change notification pins
should always be disabled when the port
pin is configured as a digital output.
I/O PORT WRITE/READ TIMING
One instruction cycle is required between a port
direction change or port write operation and a read
operation of the same port. Typically this instruction
would be a NOP. An example is shown in Example 9-1.
EXAMPLE 9-1:
MOV
MOV
NOP
btss
0xFF00, W0
W0, TRISBB
PORTB, #13
DS70264B-page 100
PORT WRITE/READ EXAMPLE
;
;
;
;
Configure PORTB<15:8> as inputs
and PORTB<7:0> as outputs
Delay 1 cycle
Next Instruction
Preliminary
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
9.4
Peripheral Pin Select
A major challenge in general purpose devices is
providing the largest possible set of peripheral
features while minimizing the conflict of features on I/O
pins. The challenge is even greater on low-pin count
devices. In an application where more than one
peripheral must be assigned to a single pin,
inconvenient workarounds in application code or a
complete redesign may be the only option.
Peripheral pin select configuration enables peripheral
set selection and placement on a wide range of I/O
pins. By increasing the pinout options available on a
particular device, programmers can better tailor the
microcontroller to their entire application, rather than
trimming the application to fit the device.
Remappable peripherals are not associated with a
default I/O pin. The peripheral must always be
assigned to a specific I/O pin before it can be used. In
contrast, non remappable peripherals are always available on a default pin, assuming that the peripheral is
active and not conflicting with another peripheral.
9.4.2.1
Peripheral Pin Select Function
Priority
When a remappable peripheral is active on a given I/O
pin, it takes priority over all other digital I/O and digital
communication peripherals associated with the pin.
Priority is given regardless of the type of peripheral that
is mapped. Remappable peripherals never take priority
over any analog functions associated with the pin.
The peripheral pin select configuration feature
operates over a fixed subset of digital I/O pins.
Programmers can independently map the input and/or
output of most digital peripherals to any one of these
I/O pins. Peripheral pin select is performed in
software, and generally does not require the device to
be reprogrammed. Hardware safeguards are included
that prevent accidental or spurious changes to the
peripheral mapping, once it has been established.
9.4.3
9.4.1
The association of a peripheral to a peripheral
selectable pin is handled in two different ways,
depending on whether an input or output is being
mapped.
AVAILABLE PINS
The peripheral pin select feature is used with a range
of up to 16 pins. The number of available pins depends
on the particular device and its pin count. Pins that
support the peripheral pin select feature include the
designation “RPn” in their full pin designation, where
“RP” designates a remappable peripheral and “n” is the
remappable pin number.
9.4.2
AVAILABLE PERIPHERALS
The peripherals managed by the peripheral pin select
feature are all digital-only peripherals. These include:
• General serial communications (UART and SPI)
• General purpose timer clock inputs
• Timer-related peripherals (input capture and
output compare)
• Interrupt-on-change inputs
In comparison, some digital-only peripheral modules
are never included in the peripheral pin select feature.
This is because the peripheral’s function requires special I/O circuitry on a specific port and cannot be easily
connected to multiple pins. These modules include I2C.
A similar requirement excludes all modules with analog
inputs, such as the Analog-to-Digital Converter (ADC).
© 2007 Microchip Technology Inc.
CONTROLLING PERIPHERAL PIN
SELECT
Peripheral pin select features are controlled through
two sets of special function registers: one to map
peripheral inputs, and one to map outputs. Because
they are separately controlled, a particular peripheral’s
input and output (if the peripheral has both) can be
placed on any selectable function pin without
constraint.
9.4.3.1
Input Mapping
The inputs of the peripheral pin select options are
mapped on the basis of the peripheral. A control
register associated with a peripheral dictates the pin it
will be mapped to. The RPINRx registers are used to
configure peripheral input mapping (see Register 9-1
through Register 9-9). Each register contains sets of
5-bit fields, with each set associated with one of the
remappable peripherals. Programming a given
peripheral’s bit field with an appropriate 5-bit value
maps the RPn pin with that value to that peripheral.
For any given device, the valid range of values for any
bit field corresponds to the maximum number of
peripheral pin selections supported by the device.
Figure 9-2 Illustrates remappable pin selection for
U1RX input.
Preliminary
DS70264B-page 101
dsPIC33FJ12GP201/202
FIGURE 9-2:
REMAPPABLE MUX INPUT FOR U1RX
U1RXR<4:0>
0
RP0
1
RP1
2
U1RX input
to peripheral
RP2
15
RP15
SELECTABLE INPUT SOURCES (MAPS INPUT TO FUNCTION)(1)
TABLE 9-1:
Function Name
Register
Configuration
Bits
External Interrupt 1
INT1
RPINR0
INT1R<4:0>
External Interrupt 2
INT2
RPINR1
INT2R<4:0>
Timer 2 External Clock
T2CK
RPINR3
T2CKR<4:0>
Timer 3 External Clock
T3CK
RPINR3
T3CKR<4:0>
Input Capture 1
IC1
RPINR7
IC1R<4:0>
Input Capture 2
IC2
RPINR7
IC2R<4:0>
Input Capture 7
IC7
RPINR10
IC7R<4:0>
Input Capture 8
IC8
RPINR10
IC8R<4:0>
Input Name
Output Compare Fault A
OCFA
RPINR11
OCFAR<4:0>
UART 1 Receive
U1RX
RPINR18
U1RXR<4:0>
U1CTS
RPINR18
U1CTSR<4:0>
SPI 1 Data Input
SDI1
RPINR20
SDI1R<4:0>
SPI 1 Clock Input
SCK1IN
RPINR20
SCK1R<4:0>
SS1IN
RPINR21
SS1R<4:0>
UART 1 Clear To Send
SPI 1 Slave Select Input
Note 1:
Unless otherwise noted, all inputs use the Schmitt input buffers.
DS70264B-page 102
Preliminary
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
9.4.3.2
Output Mapping
through Register 9-17). The value of the bit field
corresponds to one of the peripherals, and that
peripheral’s output is mapped to the pin (see Table 9-2
and Figure 9-3).
In contrast to inputs, the outputs of the peripheral pin
select options are mapped on the basis of the pin. In
this case, a control register associated with a
particular pin dictates the peripheral output to be
mapped. The RPORx registers are used to control
output mapping. Like the RPINRx registers, each
register contains sets of 5-bit fields, with each set
associated with one RPn pin (see Register 9-10
FIGURE 9-3:
The list of peripherals for output mapping also includes
a null value of 00000 because of the mapping
technique. This permits any given pin to remain
unconnected from the output of any of the pin
selectable peripherals.
MULTIPLEXING OF REMAPPABLE OUTPUT FOR RPn
RPnR<4:0>
Default
U1TX Output Enable
0
3
U1RTS Output Enable 4
Output Enable
OC1 Output Enable
OC2 Output Enable
Default
U1TX Output
U1RTS Output
18
19
0
3
4
RPn
Output Data
OC1 Output
OC2 Output
TABLE 9-2:
18
19
OUTPUT SELECTION FOR REMAPPABLE PIN (RPn)
Function
NULL
RPnR<4:0>
00000
Output Name
RPn tied to default port pin
U1TX
00011
RPn tied to UART 1 Transmit
U1RTS
00100
RPn tied to UART 1 Ready To Send
SDO1
00111
RPn tied to SPI 1 Data Output
SCK1OUT
01000
RPn tied to SPI 1 Clock Output
SS1OUT
01001
RPn tied to SPI 1 Slave Select Output
OC1
10010
RPn tied to Output Compare 1
OC2
10011
RPn tied to Output Compare 2
© 2007 Microchip Technology Inc.
Preliminary
DS70264B-page 103
dsPIC33FJ12GP201/202
9.4.3.3
Mapping
9.4.4.2
The control schema of peripheral select pins is not limited to a small range of fixed peripheral configurations.
There are no mutual or hardware-enforced lockouts
between any of the peripheral mapping SFRs. Literally
any combination of peripheral mappings across any or
all of the RPn pins is possible. This includes both
many-to-one and one-to-many mappings of peripheral
inputs and outputs to pins.
While such mappings may be technically possible from
a configuration point of view, they may not be
supportable electrically.
9.4.4
CONTROLLING CONFIGURATION
CHANGES
Because peripheral remapping can be changed during
run time, some restrictions on peripheral remapping
are needed to prevent accidental configuration
changes. dsPIC33F devices include three features to
prevent alterations to the peripheral map:
• Control register lock sequence
• Continuous state monitoring
• Configuration bit pin select lock
9.4.4.1
Under normal operation, writes to the RPINRx and
RPORx registers are not allowed. Attempted writes
appear to execute normally, but the contents of the
registers remain unchanged. To change these
registers, they must be unlocked in hardware. The
register lock is controlled by the IOLOCK bit
(OSCCON<6>). Setting IOLOCK prevents writes to
the control registers; clearing IOLOCK allows writes.
To set or clear IOLOCK, a specific command sequence
must be executed:
1.
2.
3.
Write 0x46 to OSCCON<7:0>.
Write 0x57 to OSCCON<7:0>.
Clear (or set) IOLOCK as a single operation.
Note:
MPLAB® C30 provides built-in C language
functions for unlocking the OSCCON
register:
__builtin_write_OSCCONL(value)
__builtin_write_OSCCONH(value)
See MPLAB
information.
IDE
Help
for
more
Unlike the similar sequence with the oscillator’s LOCK
bit, IOLOCK remains in one state until changed. This
allows all of the peripheral pin selects to be configured
with a single unlock sequence followed by an update to
all control registers, then locked with a second lock
sequence.
DS70264B-page 104
In addition to being protected from direct writes, the
contents of the RPINRx and RPORx registers are
constantly monitored in hardware by shadow registers.
If an unexpected change in any of the registers occurs
(such as cell disturbances caused by ESD or other
external events), a configuration mismatch Reset will
be triggered.
9.4.4.3
Configuration Bit Pin Select Lock
As an additional level of safety, the device can be configured to prevent more than one write session to the
RPINRx and RPORx registers. The IOL1WAY
(FOSC<IOL1WAY>) configuration bit blocks the
IOLOCK bit from being cleared after it has been set
once.
In the default (unprogrammed) state, IOL1WAY is set,
restricting users to one write session. Programming
IOL1WAY allows user applications unlimited access
(with the proper use of the unlock sequence) to the
peripheral pin select registers.
9.4.5
Control Register Lock
Continuous State Monitoring
CONSIDERATIONS FOR
PERIPHERAL PIN SELECTION
The ability to control peripheral pin selection
introduces several considerations into application
design, including several common peripherals that are
only available as remappable peripherals.
9.4.5.1
Configuration
The peripheral pin selects are not available on default
pins in the device’s default (Reset) state. More
specifically, since all RPINRx and RPORx registers
reset to 0000h, this means all peripheral pin select
inputs are tied to RP0, while all peripheral pin select
outputs are disconnected. This means that before any
other application code is executed, the user
application must initialize the device with the proper
peripheral configuration.
Since the IOLOCK bit resets in the unlocked state, it is
not necessary to execute the unlock sequence after
the device has come out of Reset. For the sake of
application safety, however, it is always a good idea to
set IOLOCK and lock the configuration after writing to
the control registers.
Because the unlock sequence is timing-critical, it must
be executed as an assembly language routine, in the
same manner as changes to the oscillator
configuration. If the bulk of the application is written in
C or another high-level language, the unlock sequence
should be performed by writing inline assembly.
Preliminary
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
9.4.5.2
Changing the Configuration
EXAMPLE 9-2:
Choosing the configuration requires review of all
peripheral pin selects and their pin assignments,
especially those that will not be used in the application.
In all cases, unused pin selectable peripherals should
be disabled completely. Unused peripherals should
have their inputs assigned to an unused RPn pin
function. I/O pins with unused RPn functions should be
configured with the null peripheral output.
The assignment of a peripheral to a particular pin does
not automatically perform any other configuration of
the pin’s I/O circuitry. This means adding a pin
selectable output to a pin can inadvertently drive an
existing peripheral input when the output is driven.
Programmers must be familiar with the behavior of
other fixed peripherals that share a remappable pin,
and know when to enable or disable them. To be safe,
fixed digital peripherals that share the same pin should
be disabled when not in use.
9.4.5.3
9.4.5.4
Analog Function
A final consideration is that peripheral pin select
functions neither override analog inputs nor
reconfigure pins with analog functions for digital I/O. If
a pin is configured as an analog input on device Reset,
it must be explicitly reconfigured as digital I/O when
used with a peripheral pin select.
9.4.5.5
//*************************************
// Unlock Registers
//*************************************
asm volatile ( "mov #OSCCONL, w1 \n"
"mov #0x46, w2
\n"
"mov #0x57, w3
\n"
"mov.b w2, [w1]
\n"
"mov.b w3, [w1]
\n"
"bclr OSCCON, 6");
//***************************
// Configure Input Functions
// (See Table 9-1)
//***************************
//***************************
// Assign U1Rx To Pin RP0
//***************************
RPINR18bits.U1RXR = 0;
Pin Operation
Configuring a remappable pin for a specific peripheral
does not automatically turn that feature on. The
peripheral must be specifically configured for
operation and enabled, as if it were tied to a fixed pin.
Where this happens in the application code
(immediately following device Reset and peripheral
configuration, or inside the main application routine)
depends on the peripheral and its use in the
application.
Configuration Example
Example 9-2 shows a configuration for bidirectional
communication with flow control using UART1. The
following input and output functions are used:
• Input Functions: U1RX, U1CTS
• Output Functions: U1TX, U1RTS
© 2007 Microchip Technology Inc.
CONFIGURING UART1
INPUT AND OUTPUT
FUNCTIONS
//***************************
// Assign U1CTS To Pin RP1
//***************************
RPINR18bits.U1CTSR = 1;
//***************************
// Configure Output Functions
// (See Table 9-2)
//***************************
//***************************
// Assign U1Tx To Pin RP2
//***************************
RPOR1bits.RP2R = 3;
//***************************
// Assign U1RTS To Pin RP3
//***************************
RPOR1bits.RP3R = 4;
//*************************************
// Lock Registers
//*************************************
asm volatile ( "mov #OSCCONL, w1 \n"
"mov #0x46, w2
\n"
"mov #0x57, w3
\n"
"mov.b w2, [w1]
\n"
"mov.b w3, [w1]
\n"
"bset OSCCON, 6");
Preliminary
DS70264B-page 105
dsPIC33FJ12GP201/202
9.5
Peripheral Pin Select Registers
The dsPIC33FJ12GP201/202 devices implement 17
registers for remappable peripheral configuration:
• Input Remappable Peripheral Registers (9)
• Output Remappable Peripheral Registers (8)
Note:
Input and Output Register values can only
be changed if OSCCON<IOLOCK> = 0.
See Section 9.4.4.1 “Control Register
Lock” for a specific command sequence.
REGISTER 9-1:
RPINR0: PERIPHERAL PIN SELECT INPUT REGISTER 0
U-0
U-0
U-0
—
—
—
R/W-1
R/W-1
R/W-1
R/W-1
R/W-1
INT1R<4:0>
bit 15
bit 8
U-0
U-0
U-0
U-0
U-0
U-0
U-0
U-0
—
—
—
—
—
—
—
—
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15-13
Unimplemented: Read as ‘0’
bit 12-8
INT1R<4:0>: Assign External Interrupt 1 (INTR1) to the corresponding RPn pin bits
11111 = Input tied to VSS
01111 = Input tied to RP15
•
•
•
00001 = Input tied to RP1
00000 = Input tied to RP0
bit 7-0
Unimplemented: Read as ‘0’
DS70264B-page 106
Preliminary
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
REGISTER 9-2:
RPINR1: PERIPHERAL PIN SELECT INPUT REGISTER 1
U-0
U-0
U-0
U-0
U-0
U-0
U-0
U-0
—
—
—
—
—
—
—
—
bit 15
bit 8
U-0
U-0
U-0
—
—
—
R/W-1
R/W-1
R/W-1
R/W-1
R/W-1
INT2R<4:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15-5
Unimplemented: Read as ‘0’
bit 4-0
INT2R<4:0>: Assign External Interrupt 2 (INTR2) to the corresponding RPn pin bits
11111 = Input tied to VSS
01111 = Input tied to RP15
•
•
•
00001 = Input tied to RP1
00000 = Input tied to RP0
© 2007 Microchip Technology Inc.
Preliminary
DS70264B-page 107
dsPIC33FJ12GP201/202
REGISTER 9-3:
RPINR3: PERIPHERAL PIN SELECT INPUT REGISTER 3
U-0
U-0
U-0
—
—
—
R/W-1
R/W-1
R/W-1
R/W-1
R/W-1
T3CKR<4:0>
bit 15
bit 8
U-0
U-0
U-0
—
—
—
R/W-1
R/W-1
R/W-1
R/W-1
R/W-1
T2CKR<4:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15-13
Unimplemented: Read as ‘0’
bit 12-8
T3CKR<4:0>: Assign Timer3 External Clock (T3CK) to the Corresponding RPn pin bits
11111 = Input tied to VSS
01111 = Input tied to RP15
•
•
•
00001 = Input tied to RP1
00000 = Input tied to RP0
bit 7-5
Unimplemented: Read as ‘0’
bit 4-0
T2CKR<4:0>: Assign Timer2 External Clock (T2CK) to the Corresponding RPn pin bits
11111 = Input tied to VSS
01111 = Input tied to RP15
•
•
•
00001 = Input tied to RP1
00000 = Input tied to RP0
DS70264B-page 108
Preliminary
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
REGISTER 9-4:
RPINR7: PERIPHERAL PIN SELECT INPUT REGISTER 7
U-0
U-0
U-0
—
—
—
R/W-1
R/W-1
R/W-1
R/W-1
R/W-1
IC2R<4:0>
bit 15
bit 8
U-0
U-0
U-0
—
—
—
R/W-1
R/W-1
R/W-1
R/W-1
R/W-1
IC1R<4:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15-13
Unimplemented: Read as ‘0’
bit 12-8
IC2R<4:0>: Assign Input Capture 2 (IC2) to the corresponding RPn pin bits
11111 = Input tied to VSS
01111 = Input tied to RP15
•
•
•
00001 = Input tied to RP1
00000 = Input tied to RP0
bit 7-5
Unimplemented: Read as ‘0’
bit 4-0
IC1R<4:0>: Assign Input Capture 1 (IC1) to the corresponding RPn pin bits
11111 = Input tied to VSS
01111 = Input tied to RP15
•
•
•
00001 = Input tied to RP1
00000 = Input tied to RP0
© 2007 Microchip Technology Inc.
Preliminary
DS70264B-page 109
dsPIC33FJ12GP201/202
REGISTER 9-5:
RPINR10: PERIPHERAL PIN SELECT INPUT REGISTERS 10
U-0
U-0
U-0
—
—
—
R/W-1
R/W-1
R/W-1
R/W-1
R/W-1
IC8R<4:0>
bit 15
bit 8
U-0
U-0
U-0
—
—
—
R/W-1
R/W-1
R/W-1
R/W-1
R/W-1
IC7R<4:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15-13
Unimplemented: Read as ‘0’
bit 12-8
IC8R<4:0>: Assign Input Capture 8 (IC8) to the corresponding pin RPn pin bits
11111 = Input tied to VSS
01111 = Input tied to RP15
•
•
•
00001 = Input tied to RP1
00000 = Input tied to RP0
bit 7-5
Unimplemented: Read as ‘0’
bit 4-0
IC7R<4:0>: Assign Input Capture 7 (IC7) to the corresponding pin RPn pin bits
11111 = Input tied to VSS
01111 = Input tied to RP15
•
•
•
00001 = Input tied to RP1
00000 = Input tied to RP0
DS70264B-page 110
Preliminary
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
REGISTER 9-6:
RPINR11: PERIPHERAL PIN SELECT INPUT REGISTER 11
U-0
U-0
U-0
U-0
U-0
U-0
U-0
U-0
—
—
—
—
—
—
—
—
bit 15
bit 8
U-0
U-0
U-0
—
—
—
R/W-1
R/W-1
R/W-1
R/W-1
R/W-1
OCFAR<4:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15-5
Unimplemented: Read as ‘0’
bit 4-0
OCFAR<4:0>: Assign Output Capture A (OCFA) to the corresponding RPn pin bits
11111 = Input tied to VSS
01111 = Input tied to RP15
•
•
•
00001 = Input tied to RP1
00000 = Input tied to RP0
© 2007 Microchip Technology Inc.
Preliminary
DS70264B-page 111
dsPIC33FJ12GP201/202
REGISTER 9-7:
RPINR18: PERIPHERAL PIN SELECT INPUT REGISTER 18
U-0
U-0
U-0
—
—
—
R/W-1
R/W-1
R/W-1
R/W-1
R/W-1
U1CTSR<4:0>
bit 15
bit 8
U-0
U-0
U-0
—
—
—
R/W-1
R/W-1
R/W-1
R/W-1
R/W-1
U1RXR<4:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15-13
Unimplemented: Read as ‘0’
bit 12-8
U1CTSR<4:0>: Assign UART 1 Clear to Send (U1CTS) to the corresponding RPn pin bits
11111 = Input tied to VSS
01111 = Input tied to RP15
•
•
•
00001 = Input tied to RP1
00000 = Input tied to RP0
bit 7-5
Unimplemented: Read as ‘0’
bit 4-0
U1RXR<4:0>: Assign UART 1 Receive (U1RX) to the corresponding RPn pin bits
11111 = Input tied to VSS
01111 = Input tied to RP15
•
•
•
00001 = Input tied to RP1
00000 = Input tied to RP0
DS70264B-page 112
Preliminary
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
REGISTER 9-8:
RPINR20: PERIPHERAL PIN SELECT INPUT REGISTER 20
U-0
U-0
U-0
—
—
—
R/W-1
R/W-1
R/W-1
R/W-1
R/W-1
SCK1R<4:0>
bit 15
bit 8
U-0
U-0
U-0
—
—
—
R/W-1
R/W-1
R/W-1
R/W-1
R/W-1
SDI1R<4:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15-13
Unimplemented: Read as ‘0’
bit 12-8
SCK1R<4:0>: Assign SPI 1 Clock Input (SCK1IN) to the corresponding RPn pin bits
11111 = Input tied to VSS
01111 = Input tied to RP15
•
•
•
00001 = Input tied to RP1
00000 = Input tied to RP0
bit 7-5
Unimplemented: Read as ‘0’
bit 4-0
SDI1R<4:0>: Assign SPI 1 Data Input (SDI1) to the corresponding RPn pin bits
11111 = Input tied to VSS
01111 = Input tied to RP15
•
•
•
00001 = Input tied to RP1
00000 = Input tied to RP0
© 2007 Microchip Technology Inc.
Preliminary
DS70264B-page 113
dsPIC33FJ12GP201/202
REGISTER 9-9:
RPINR21: PERIPHERAL PIN SELECT INPUT REGISTER 21
U-0
U-0
U-0
U-0
U-0
U-0
U-0
U-0
—
—
—
—
—
—
—
—
bit 15
bit 8
U-0
U-0
U-0
—
—
—
R/W-1
R/W-1
R/W-1
R/W-1
R/W-1
SS1R<4:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15-5
Unimplemented: Read as ‘0’
bit 4-0
SS1R<4:0>: Assign SPI1 Slave Select Input (SS1IN) to the Corresponding RPn pin bits
11111 = Input tied to VSS
01111 = Input tied to RP15
•
•
•
00001 = Input tied to RP1
00000 = Input tied to RP0
DS70264B-page 114
Preliminary
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
REGISTER 9-10:
RPOR0: PERIPHERAL PIN SELECT OUTPUT REGISTERS 0
U-0
U-0
U-0
—
—
—
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
RP1R<4:0>
bit 15
bit 8
U-0
U-0
U-0
—
—
—
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
RP0R<4:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15-13
Unimplemented: Read as ‘0’
bit 12-8
RP1R<4:0>: Peripheral Output Function is Assigned to RP1 Output Pin bits (see Table 9-2 for
peripheral function numbers)
bit 7-5
Unimplemented: Read as ‘0’
bit 4-0
RP0R<4:0>: Peripheral Output Function is Assigned to RP0 Output Pin bits (see Table 9-2 for
peripheral function numbers)
REGISTER 9-11:
RPOR1: PERIPHERAL PIN SELECT OUTPUT REGISTERS 1
U-0
U-0
U-0
—
—
—
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
RP3R<4:0>
bit 15
bit 8
U-0
U-0
U-0
—
—
—
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
RP2R<4:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15-13
Unimplemented: Read as ‘0’
bit 12-8
RP3R<4:0>: Peripheral Output Function is Assigned to RP3 Output Pin bits (see Table 9-2 for
peripheral function numbers)
bit 7-5
Unimplemented: Read as ‘0’
bit 4-0
RP2R<4:0>: Peripheral Output Function is Assigned to RP2 Output Pin bits (see Table 9-2 for
peripheral function numbers)
© 2007 Microchip Technology Inc.
Preliminary
DS70264B-page 115
dsPIC33FJ12GP201/202
REGISTER 9-12:
RPOR2: PERIPHERAL PIN SELECT OUTPUT REGISTERS 2
U-0
U-0
U-0
—
—
—
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
RP5R<4:0>
bit 15
bit 8
U-0
U-0
U-0
—
—
—
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
RP4R<4:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15-13
Unimplemented: Read as ‘0’
bit 12-8
RP5R<4:0>: Peripheral Output Function is Assigned to RP5 Output Pin bits (see Table 9-2 for
peripheral function numbers)
bit 7-5
Unimplemented: Read as ‘0’
bit 4-0
RP4R<4:0>: Peripheral Output Function is Assigned to RP4 Output Pin bits (see Table 9-2 for
peripheral function numbers)
REGISTER 9-13:
RPOR3: PERIPHERAL PIN SELECT OUTPUT REGISTERS 3
U-0
U-0
U-0
—
—
—
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
RP7R<4:0>
bit 15
bit 8
U-0
U-0
U-0
—
—
—
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
RP6R<4:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15-13
Unimplemented: Read as ‘0’
bit 12-8
RP7R<4:0>: Peripheral Output Function is Assigned to RP7 Output Pin bits (see Table 9-2 for
peripheral function numbers)
bit 7-5
Unimplemented: Read as ‘0’
bit 4-0
RP6R<4:0>: Peripheral Output Function is Assigned to RP6 Output Pin bits (see Table 9-2 for
peripheral function numbers)
DS70264B-page 116
Preliminary
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
REGISTER 9-14:
RPOR4: PERIPHERAL PIN SELECT OUTPUT REGISTERS 0
U-0
U-0
U-0
—
—
—
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
RP9R<4:0>
bit 15
bit 8
U-0
U-0
U-0
—
—
—
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
RP8R<4:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15-13
Unimplemented: Read as ‘0’
bit 12-8
RP9R<4:0>: Peripheral Output Function is Assigned to RP9 Output Pin bits (see Table 9-2 for
peripheral function numbers)
bit 7-5
Unimplemented: Read as ‘0’
bit 4-0
RP8R<4:0>: Peripheral Output Function is Assigned to RP8 Output Pin bits (see Table 9-2 for
peripheral function numbers)
REGISTER 9-15:
RPOR5: PERIPHERAL PIN SELECT OUTPUT REGISTERS 5
U-0
U-0
U-0
—
—
—
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
RP11R<4:0>
bit 15
bit 8
U-0
U-0
U-0
—
—
—
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
RP10R<4:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15-13
Unimplemented: Read as ‘0’
bit 12-8
RP11R<4:0>: Peripheral Output Function is Assigned to RP11 Output Pin bits (see Table 9-2 for
peripheral function numbers)
bit 7-5
Unimplemented: Read as ‘0’
bit 4-0
RP10R<4:0>: Peripheral Output Function is Assigned to RP10 Output Pin bits (see Table 9-2 for
peripheral function numbers)
© 2007 Microchip Technology Inc.
Preliminary
DS70264B-page 117
dsPIC33FJ12GP201/202
REGISTER 9-16:
RPOR6: PERIPHERAL PIN SELECT OUTPUT REGISTERS 6
U-0
U-0
U-0
—
—
—
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
RP13R<4:0>
bit 15
bit 8
U-0
U-0
U-0
—
—
—
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
RP12R<4:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15-13
Unimplemented: Read as ‘0’
bit 12-8
RP13R<4:0>: Peripheral Output Function is Assigned to RP13 Output Pin bits (see Table 9-2 for
peripheral function numbers)
bit 7-5
Unimplemented: Read as ‘0’
bit 4-0
RP12R<4:0>: Peripheral Output Function is Assigned to RP12 Output Pin bits (see Table 9-2 for
peripheral function numbers)
REGISTER 9-17:
RPOR7: PERIPHERAL PIN SELECT OUTPUT REGISTERS 7
U-0
U-0
U-0
—
—
—
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
RP15R<4:0>
bit 15
bit 8
U-0
U-0
U-0
—
—
—
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
RP14R<4:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15-13
Unimplemented: Read as ‘0’
bit 12-8
RP15R<4:0>: Peripheral Output Function is Assigned to RP15 Output Pin bits (see Table 9-2 for
peripheral function numbers)
bit 7-5
Unimplemented: Read as ‘0’
bit 4-0
RP14R<4:0>: Peripheral Output Function is Assigned to RP14 Output Pin bits (see Table 9-2 for
peripheral function numbers)
DS70264B-page 118
Preliminary
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
10.0
Note:
TIMER1
Figure 10-1 presents a block diagram of the 16-bit
timer module.
This data sheet summarizes the features
of the dsPIC33FJ12GP201/202 devices. It
is not intended to be a comprehensive
reference source. To complement the
information in this data sheet, refer to the
“dsPIC33F Family Reference Manual”.
Please see the Microchip web site
(www.microchip.com) for the latest
dsPIC33F Family Reference Manual
sections.
To configure Timer1 for operation:
1.
2.
3.
4.
5.
The Timer1 module is a 16-bit timer, which can serve
as the time counter for the real-time clock, or operate
as a free-running interval timer/counter. Timer1 can
operate in three modes:
6.
Set the TON bit (= 1) in the T1CON register.
Select the timer prescaler ratio using the
TCKPS<1:0> bits in the T1CON register.
Set the Clock and Gating modes using the TCS
and TGATE bits in the T1CON register.
Set or clear the TSYNC bit in T1CON to select
synchronous or asynchronous operation.
Load the timer period value into the PR1
register.
If interrupts are required, set the interrupt enable
bit, T1IE. Use the priority bits, T1IP<2:0>, to set
the interrupt priority.
• 16-bit Timer
• 16-bit Synchronous Counter
• 16-bit Asynchronous Counter
Timer1 also supports these features:
• Timer gate operation
• Selectable prescaler settings
• Timer operation during CPU Idle and Sleep
modes
• Interrupt on 16-bit Period register match or falling
edge of external gate signal
FIGURE 10-1:
16-BIT TIMER1 MODULE BLOCK DIAGRAM
TCKPS<1:0>
SOSCO/
T1CK
1x
SOSCEN
SOSCI
Gate
Sync
01
TCY
00
Prescaler
1, 8, 64, 256
TGATE
TCS
TGATE
Set T1IF
2
TON
1
Q
D
0
Q
CK
Reset
0
TMR1
1
Equal
Comparator
Sync
TSYNC
PR1
© 2007 Microchip Technology Inc.
Preliminary
DS70264B-page 119
dsPIC33FJ12GP201/202
REGISTER 10-1:
T1CON: TIMER1 CONTROL REGISTER
R/W-0
U-0
R/W-0
U-0
U-0
U-0
U-0
U-0
TON
—
TSIDL
—
—
—
—
—
bit 15
bit 8
U-0
R/W-0
—
TGATE
R/W-0
R/W-0
TCKPS<1:0>
U-0
R/W-0
R/W-0
U-0
—
TSYNC
TCS
—
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15
TON: Timer1 On bit
1 = Starts 16-bit Timer1
0 = Stops 16-bit Timer1
bit 14
Unimplemented: Read as ‘0’
bit 13
TSIDL: Stop in Idle Mode bit
1 = Discontinue module operation when device enters Idle mode
0 = Continue module operation in Idle mode
bit 12-7
Unimplemented: Read as ‘0’
bit 6
TGATE: Timer1 Gated Time Accumulation Enable bit
When T1CS = 1:
This bit is ignored.
When T1CS = 0:
1 = Gated time accumulation enabled
0 = Gated time accumulation disabled
bit 5-4
TCKPS<1:0> Timer1 Input Clock Prescale Select bits
11 = 1:256
10 = 1:64
01 = 1:8
00 = 1:1
bit 3
Unimplemented: Read as ‘0’
bit 2
TSYNC: Timer1 External Clock Input Synchronization Select bit
When TCS = 1:
1 = Synchronize external clock input
0 = Do not synchronize external clock input
When TCS = 0:
This bit is ignored.
bit 1
TCS: Timer1 Clock Source Select bit
1 = External clock from pin T1CK (on the rising edge)
0 = Internal clock (FCY)
bit 0
Unimplemented: Read as ‘0’
DS70264B-page 120
Preliminary
x = Bit is unknown
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
11.0
Note:
TIMER2/3 FEATURE
11.1
This data sheet summarizes the features
of the dsPIC33FJ12GP201/202 devices. It
is not intended to be a comprehensive
reference source. To complement the
information in this data sheet, refer to the
“dsPIC33F Family Reference Manual”.
Please see the Microchip web site
(www.microchip.com) for the latest
dsPIC33F Family Reference Manual
sections.
The Timer2/3 feature has 32-bit timers that can also be
configured as two independent 16-bit timers with
selectable operating modes.
As a 32-bit timer, the Timer2/3 feature permits
operation in three modes:
To configure the Timer2/3 feature for 32-bit operation:
1.
2.
3.
4.
5.
6.
• Two Independent 16-bit timers (Timer2 and
Timer3) with all 16-bit operating modes (except
Asynchronous Counter mode)
• Single 32-bit timer (Timer2/3)
• Single 32-bit synchronous counter (Timer2/3)
32-bit Operation
Set the corresponding T32 control bit.
Select the prescaler ratio for Timer2 using the
TCKPS<1:0> bits.
Set the Clock and Gating modes using the
corresponding TCS and TGATE bits.
Load the timer period value. PR3 contains the
most significant word of the value, while PR2
contains the least significant word.
If interrupts are required, set the interrupt enable
bit, T3IE. Use the priority bits T3IP<2:0> to set
the interrupt priority. While Timer2 controls the
timer, the interrupt appears as a Timer3 interrupt.
Set the corresponding TON bit.
The timer value at any point is stored in the register
pair TMR3:TMR2. TMR3 always contains the most
significant word of the count, while TMR2 contains the
least significant word.
To configure any of the timers for individual 16-bit
operation:
The Timer2/3 feature also supports:
•
•
•
•
•
Timer gate operation
Selectable Prescaler Settings
Timer operation during Idle and Sleep modes
Interrupt on a 32-bit Period Register Match
Time Base for Input Capture and Output Compare
Modules (Timer2 and Timer3 only)
• ADC1 Event Trigger (Timer2/3 only)
Individually, all eight of the 16-bit timers can function as
synchronous timers or counters. They also offer the
features listed above, except for the event trigger. The
operating modes and enabled features are determined
by setting the appropriate bit(s) in the T2CON and
T3CON registers. T2CON registers are shown in
generic form in Register 11-1. T3CON registers are
shown in Register 11-2.
1.
2.
3.
4.
5.
6.
Clear the T32 bit corresponding to that timer.
Select the timer prescaler ratio using the
TCKPS<1:0> bits.
Set the Clock and Gating modes using the TCS
and TGATE bits.
Load the timer period value into the PRx
register.
If interrupts are required, set the interrupt enable
bit, TxIE. Use the priority bits, TxIP<2:0>, to set
the interrupt priority.
Set the TON bit.
For 32-bit timer/counter operation, Timer2 is the least
significant word, and Timer3 is the most significant
word of the 32-bit timers.
Note:
For 32-bit operation, T3CON control bits
are ignored. Only T2CON control bit is
used for setup and control. Timer2 clock
and gate inputs are used for the 32-bit
timer modules, but an interrupt is generated with the Timer3 interrupt flags.
© 2007 Microchip Technology Inc.
Preliminary
DS70264B-page 121
dsPIC33FJ12GP201/202
TIMER2/3 (32-BIT) BLOCK DIAGRAM(1)
FIGURE 11-1:
1x
T2CK
Gate
Sync
01
TCY
00
Prescaler
1, 8, 64, 256
TGATE
TCS
TGATE
Q
1
Set T3IF
Q
0
Equal
D
CK
PR2
PR3
ADC Event Trigger(2)
TCKPS<1:0>
2
TON
Comparator
MSb
LSb
TMR3
Reset
TMR2
Sync
16
Read TMR2
Write TMR2
16
TMR3HLD
16
16
Data Bus<15:0>
Note 1:
2:
The 32-bit timer control bit, T32, must be set for 32-bit timer/counter operation. All control bits are respective
to the T2CON register.
The ADC event trigger is available only on Timer2/3.
DS70264B-page 122
Preliminary
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
FIGURE 11-2:
TIMER2 (16-BIT) BLOCK DIAGRAM
T2CK
1x
Gate
Sync
TON
TCKPS<1:0>
2
Prescaler
1, 8, 64, 256
01
00
TGATE
TCS
TCY
1
Set T2IF
0
Reset
Equal
Q
D
Q
CK
TGATE
Sync
TMR2
Comparator
PR2
© 2007 Microchip Technology Inc.
Preliminary
DS70264B-page 123
dsPIC33FJ12GP201/202
REGISTER 11-1:
T2CON CONTROL REGISTER
R/W-0
U-0
R/W-0
U-0
U-0
U-0
U-0
U-0
TON
—
TSIDL
—
—
—
—
—
bit 15
bit 8
U-0
R/W-0
—
TGATE
R/W-0
R/W-0
TCKPS<1:0>
R/W-0
U-0
R/W-0
U-0
T32(1)
—
TCS
—
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15
TON: Timer2 On bit
When T32 = 1:
1 = Starts 32-bit Timer2/3
0 = Stops 32-bit Timer2/3
When T32 = 0:
1 = Starts 16-bit Timer2
0 = Stops 16-bit Timer2
bit 14
Unimplemented: Read as ‘0’
bit 13
TSIDL: Stop in Idle Mode bit
1 = Discontinue module operation when device enters Idle mode
0 = Continue module operation in Idle mode
bit 12-7
Unimplemented: Read as ‘0’
bit 6
TGATE: Timer2 Gated Time Accumulation Enable bit
When TCS = 1:
This bit is ignored.
When TCS = 0:
1 = Gated time accumulation enabled
0 = Gated time accumulation disabled
bit 5-4
TCKPS<1:0>: Timer2 Input Clock Prescale Select bits
11 = 1:256
10 = 1:64
01 = 1:8
00 = 1:1
bit 3
T32: 32-bit Timer Mode Select bit(1)
1 = Timer2 and Timer3 form a single 32-bit timer
0 = Timer2 and Timer3 act as two 16-bit timers
bit 2
Unimplemented: Read as ‘0’
bit 1
TCS: Timer2 Clock Source Select bit
1 = External clock from pin T2CK (on the rising edge)
0 = Internal clock (FCY)
bit 0
Unimplemented: Read as ‘0’
Note 1:
x = Bit is unknown
In 32-bit mode, T3CON control bits do not affect 32-bit timer operation.
DS70264B-page 124
Preliminary
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
REGISTER 11-2:
T3CON CONTROL REGISTER
R/W-0
U-0
R/W-0
U-0
U-0
U-0
U-0
U-0
TON(1)
—
TSIDL(1)
—
—
—
—
—
bit 15
bit 8
U-0
R/W-0
—
TGATE(1)
R/W-0
R/W-0
TCKPS<1:0>(1)
U-0
U-0
R/W-0
U-0
—
—
TCS(1)
—
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15
TON: Timer3 On bit(1)
1 = Starts 16-bit Timer3
0 = Stops 16-bit Timer3
bit 14
Unimplemented: Read as ‘0’
bit 13
TSIDL: Stop in Idle Mode bit(1)
1 = Discontinue module operation when device enters Idle mode
0 = Continue module operation in Idle mode
bit 12-7
Unimplemented: Read as ‘0’
bit 6
TGATE: Timer3 Gated Time Accumulation Enable bit(1)
When TCS = 1:
This bit is ignored.
When TCS = 0:
1 = Gated time accumulation enabled
0 = Gated time accumulation disabled
bit 5-4
TCKPS<1:0>: Timer3 Input Clock Prescale Select bits(1)
11 = 1:256
10 = 1:64
01 = 1:8
00 = 1:1
bit 3-2
Unimplemented: Read as ‘0’
bit 1
TCS: Timer3 Clock Source Select bit(1)
1 = External clock from pin T3CK (on the rising edge)
0 = Internal clock (FCY)
bit 0
Unimplemented: Read as ‘0’
Note 1:
x = Bit is unknown
When 32-bit operation is enabled (T2CON<3> = 1), these bits have no effect on Timer3 operation; all timer
functions are set through T2CON.
© 2007 Microchip Technology Inc.
Preliminary
DS70264B-page 125
dsPIC33FJ12GP201/202
NOTES:
DS70264B-page 126
Preliminary
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
12.0
INPUT CAPTURE
Note:
This data sheet summarizes the features
of the dsPIC33FJ12GP201/202 devices. It
is not intended to be a comprehensive
reference source. To complement the
information in this data sheet, refer to the
“dsPIC33F Family Reference Manual”.
Please see the Microchip web site
(www.microchip.com) for the latest
dsPIC33F Family Reference Manual
sections.
The input capture module is useful in applications
requiring frequency (period) and pulse measurement.
The dsPIC33FJ12GP201/202 devices support up to
eight input capture channels.
The input capture module captures the 16-bit value of
the selected Time Base register when an event occurs
at the ICx pin. The events that cause a capture event
are listed below in three categories:
• Simple Capture Event modes:
- Capture timer value on every falling edge of
input at ICx pin
- Capture timer value on every rising edge of
input at ICx pin
FIGURE 12-1:
• Capture timer value on every edge (rising and
falling)
• Prescaler Capture Event modes:
- Capture timer value on every 4th rising edge
of input at ICx pin
-Capture timer value on every 16th rising
edge of input at ICx pin
Each input capture channel can select one of two
16-bit timers (Timer2 or Timer3) for the time base.
The selected timer can use either an internal or
external clock.
Other operational features include:
• Device wake-up from capture pin during CPU
Sleep and Idle modes
• Interrupt on input capture event
• 4-word FIFO buffer for capture values
- Interrupt optionally generated after 1, 2, 3 or
4 buffer locations are filled
• Use of input capture to provide additional sources
of external interrupts
INPUT CAPTURE BLOCK DIAGRAM
From 16-bit Timers
TMR2 TMR3
16
16
1
Edge Detection Logic
and
Clock Synchronizer
Prescaler
Counter
(1, 4, 16)
ICx Pin
ICM<2:0> (ICxCON<2:0>)
Mode Select
ICTMR
(ICxCON<7>)
FIFO
3
0
FIFO
R/W
Logic
ICOV, ICBNE (ICxCON<4:3>)
ICxBUF
ICxI<1:0>
ICxCON
System Bus
Interrupt
Logic
Set Flag ICxIF
(in IFSn Register)
Note: An ‘x’ in a signal, register or bit name denotes the number of the capture channel.
© 2007 Microchip Technology Inc.
Preliminary
DS70264B-page 127
dsPIC33FJ12GP201/202
12.1
Input Capture Registers
REGISTER 12-1:
ICxCON: INPUT CAPTURE x CONTROL REGISTER
U-0
U-0
R/W-0
U-0
U-0
U-0
U-0
U-0
—
—
ICSIDL
—
—
—
—
—
bit 15
bit 8
R/W-0
R/W-0
ICTMR
R/W-0
ICI<1:0>
R-0, HC
R-0, HC
ICOV
ICBNE
R/W-0
R/W-0
R/W-0
ICM<2:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15-14
Unimplemented: Read as ‘0’
bit 13
ICSIDL: Input Capture Module Stop in Idle Control bit
1 = Input capture module will halt in CPU Idle mode
0 = Input capture module will continue to operate in CPU Idle mode
bit 12-8
Unimplemented: Read as ‘0’
bit 7
ICTMR: Input Capture Timer Select bits
1 = TMR2 contents are captured on capture event
0 = TMR3 contents are captured on capture event
bit 6-5
ICI<1:0>: Select Number of Captures per Interrupt bits
11 = Interrupt on every fourth capture event
10 = Interrupt on every third capture event
01 = Interrupt on every second capture event
00 = Interrupt on every capture event
bit 4
ICOV: Input Capture Overflow Status Flag bit (read-only)
1 = Input capture overflow occurred
0 = No input capture overflow occurred
bit 3
ICBNE: Input Capture Buffer Empty Status bit (read-only)
1 = Input capture buffer is not empty, at least one more capture value can be read
0 = Input capture buffer is empty
bit 2-0
ICM<2:0>: Input Capture Mode Select bits
111 =Input capture functions as interrupt pin only when device is in Sleep or Idle mode
(Rising edge detect only, all other control bits are not applicable.)
110 = Unused (module disabled)
101 = Capture mode, every 16th rising edge
100 = Capture mode, every 4th rising edge
011 = Capture mode, every rising edge
010 = Capture mode, every falling edge
001 = Capture mode, every edge (rising and falling)
(ICI<1:0> bits do not control interrupt generation for this mode.)
000 =Input capture module turned off
DS70264B-page 128
Preliminary
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
13.0
Note:
13.1
OUTPUT COMPARE
This data sheet summarizes the features
of the dsPIC33FJ12GP201/202 devices. It
is not intended to be a comprehensive
reference source. To complement the
information in this data sheet, refer to the
“dsPIC33F Family Reference Manual”.
Please see the Microchip web site
(www.microchip.com) for the latest
dsPIC33F Family Reference Manual
sections.
8. To initiate another single pulse output, change the
Timer and Compare register settings, if needed,
and then issue a write to set the OCM bits to ‘100’.
Disabling and re-enabling the timer, and clearing
the TMRy register, are not required, but may be
advantageous for defining a pulse from a known
event time boundary.
The output compare module does not have to be
disabled after the falling edge of the output pulse.
Another pulse can be initiated by rewriting the value of
the OCxCON register.
13.2
Setup for Single Output Pulse
Generation
Setup for Continuous Output
Pulse Generation
When the OCM control bits (OCxCON<2:0>) are set to
‘100’, the selected output compare channel initializes
the OCx pin to the low state and generates a single
output pulse.
When the OCM control bits (OCxCON<2:0>) are set to
‘101’, the selected output compare channel initializes
the OCx pin to the low state and generates output
pulses on each and every compare match event.
To generate a single output pulse, the following steps
are required. These steps assume timer source is
initially turned off but this is not a requirement for the
module operation.
To configure the module for generation of a continuous
stream of output pulses, the following steps are
required. These steps assume timer source is initially
turned off but this is not a requirement for the module
operation.
1. Determine the instruction clock cycle time. Take
into account the frequency of the external clock to
the timer source (if one is used) and the timer
prescaler settings.
2. Calculate time to the rising edge of the output
pulse relative to the TMRy start value (0000h).
3. Calculate the time to the falling edge of the pulse
based on the desired pulse width and the time to
the rising edge of the pulse.
4. Write the value computed in step 2 into the Output
Compare register, OCxR, and the value computed
in step 3 into the Output Compare Secondary
register, OCxRS.
5. Set Timer Period register, PRy, to a value equal to
or greater than value in OCxRS, the Output
Compare Secondary register.
6. Set the OCM bits to ‘100’ and the OCTSEL
(OCxCON<3>) bit to the desired timer source. The
OCx pin state will now be driven low.
7. Set the TON (TyCON<15>) bit to ‘1’, which
enables the compare time base to count. Upon the
first match between TMRy and OCxR, the OCx pin
will be driven high.
When the incrementing timer, TMRy, matches the
Output Compare Secondary register, OCxRS, the
second and trailing edge (high-to-low) of the pulse
is driven onto the OCx pin. No additional pulses
are driven onto the OCx pin and it remains at low.
As a result of the second compare match event,
the OCxIF interrupt flag bit is set. This will result in
an interrupt if it is enabled by setting the OCxIE bit.
For further information on peripheral interrupts,
refer to Section 6.0 “Interrupt Controller”.
© 2007 Microchip Technology Inc.
1. Determine the instruction clock cycle time. Take
into account the frequency of the external clock to
the timer source (if one is used) and the timer
prescaler settings.
2. Calculate time to the rising edge of the output
pulse relative to the TMRy start value (0000h).
3. Calculate the time to the falling edge of the pulse,
based on the desired pulse width and the time to
the rising edge of the pulse.
4. Write the values computed in step 2 into the Output Compare register, OCxR, and value computed
in step 3 into the Output Compare Secondary
register, OCxRS.
5. Set Timer Period register, PRy, to a value equal to
or greater than value in OCxRS, the Output
Compare Secondary Register.
6. Set the OCM bits to ‘101’ and the OCTSEL bit to
the desired timer source. The OCx pin state will
now be driven low.
7. Enable the compare time base by setting the TON
(TyCON<15>) bit to ‘1’. Upon the first match
between TMRy and OCxR, the OCx pin will be
driven high.
When the compare time base, TMRy, matches the
Output Compare Secondary register, OCxRS, the
second and trailing edge (high-to-low) of the pulse
is driven onto the OCx pin.
Preliminary
DS70264B-page 129
dsPIC33FJ12GP201/202
8. As a result of the second compare match event,
the OCxIF interrupt flag bit is set.
When the compare time base and the value in its
respective Timer Period register match, the TMRy
register resets to 0x0000 and resumes counting.
9. Steps 8 through 11 are repeated and a continuous
stream of pulses is generated, indefinitely. The
OCxIF flag is set on each OCxRS-TMRy compare
match event.
13.3
13.3.1
The PWM period is specified by writing to PRy, the
Timer Period register. The PWM period can be
calculated using Equation 13-1:
EQUATION 13-1:
Pulse-Width Modulation Mode
2.
3.
4.
5.
Set the PWM period by writing to the selected
Timer Period register (PRy).
Set the PWM duty cycle by writing to the OCxRS
register.
Write the OxCR register with the initial duty cycle.
Enable interrupts, if required, for the timer and
output compare modules. The output compare
interrupt is required for PWM Fault pin utilization.
Configure the output compare module for one of
two PWM operation modes by writing to the Output Compare Mode bits, OCM<2:0> and
(OCxCON<2:0>).
Set the TMRy prescale value and enable the time base
by setting TON = 1 (TxCON<15>)
Note:
The OCxR register should be initialized
before the output compare module is first
enabled. The OCxR register becomes a
read-only duty cycle register when the
module is operated in the PWM modes.
The value held in OCxR will become the
PWM duty cycle for the first PWM period.
The contents of the Output Compare
Secondary register, OCxRS, will not be
transferred into OCxR until a time base
period match occurs.
EQUATION 13-2:
Note:
13.3.2
A PRy value of N will produce a PWM
period of N + 1 time base count cycles. For
example, a value of 7 written into the PRy
register will yield a period consisting of
eight time base cycles.
PWM DUTY CYCLE
Specify the PWM duty cycle is specified by writing to the
OCxRS register. The OCxRS register can be written to at
any time, but the duty cycle value is not latched into OCxR
until a match between PRy and TMRy occurs (i.e., the
period is complete). This provides a double buffer for the
PWM duty cycle and is essential for glitchless PWM
operation. In the PWM mode, OCxR is a read-only
register.
Some important boundary parameters of the PWM duty
cycle include:
• If the Output Compare register, OCxR, is loaded
with 0000h, the OCx pin will remain low (0% duty
cycle).
• If OCxR is greater than PRy (Timer Period register),
the pin will remain high (100% duty cycle).
• If OCxR is equal to PRy, the OCx pin will be low
for one time base count value and high for all
other count values.
See Example 13-1 for PWM mode timing details.
Table 13-1 shows example PWM frequencies and
resolutions for a device operating at 10 MIPS.
CALCULATION FOR MAXIMUM PWM RESOLUTION
log10
Maximum PWM Resolution (bits) =
DS70264B-page 130
CALCULATING THE PWM
PERIOD
PWM Period = [(PRy) + 1] • TCY • (Timer Prescale Value)
where:
PWM Frequency = 1/[PWM Period]
Use the following steps when configuring the output
compare module for PWM operation:
1.
PWM PERIOD
Preliminary
( FF )
CY
PWM
log10(2)
bits
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
EXAMPLE 13-1:
1.
2.
PWM PERIOD AND DUTY CYCLE CALCULATIONS
Find the Timer Period register value for a desired PWM frequency that is 52.08 kHz, where FCY = 16 MHz and a Timer2
prescaler setting of 1:1.
TCY
= 62.5 ns
PWM Period = 1/PWM Frequency = 1/52.08 kHz = 19.2 ms
PWM Period = (PR2 + 1) • TCY • (Timer2 Prescale Value)
19.2 ms
= (PR2 + 1) • 62.5 ns • 1
PR2
= 306
Find the maximum resolution of the duty cycle that can be used with a 52.08 kHz frequency and a 32 MHz device clock rate:
PWM Resolution = log10 (FCY/FPWM)/log102) bits
= (log10 (16 MHz/52.08 kHz)/log102) bits
= 8.3 bits
TABLE 13-1:
EXAMPLE PWM FREQUENCIES AND RESOLUTIONS AT 4 MIPS (FCY = 4 MHz)
PWM Frequency
7.6 Hz
61 Hz
122 Hz
977 Hz
3.9 kHz
31.3 kHz
125 kHz
Timer Prescaler Ratio
8
1
1
1
1
1
1
Period Register Value
FFFFh
FFFFh
7FFFh
0FFFh
03FFh
007Fh
001Fh
16
16
15
12
10
7
5
Resolution (bits)
TABLE 13-2:
EXAMPLE PWM FREQUENCIES AND RESOLUTIONS AT 16 MIPS (FCY = 16 MHz)
PWM Frequency
30.5 Hz
244 Hz
488 Hz
3.9 kHz
15.6 kHz
125 kHz
500 kHz
Timer Prescaler Ratio
8
1
1
1
1
1
1
Period Register Value
FFFFh
FFFFh
7FFFh
0FFFh
03FFh
007Fh
001Fh
16
16
15
12
10
7
5
Resolution (bits)
TABLE 13-3:
EXAMPLE PWM FREQUENCIES AND RESOLUTIONS AT 40 MIPS (FCY = 40 MHz)
PWM Frequency
76 Hz
610 Hz
1.22 Hz
9.77 kHz
39 kHz
313 kHz
1.25 MHz
Timer Prescaler Ratio
8
1
1
1
1
1
1
Period Register Value
FFFFh
FFFFh
7FFFh
0FFFh
03FFh
007Fh
001Fh
16
16
15
12
10
7
5
Resolution (bits)
© 2007 Microchip Technology Inc.
Preliminary
DS70264B-page 131
dsPIC33FJ12GP201/202
FIGURE 13-1:
OUTPUT COMPARE MODULE BLOCK DIAGRAM
Set Flag bit
OCxIF(1)
OCxRS(1)
Output
Logic
OCxR(1)
3
OCM2:OCM0
Mode Select
Comparator
0
16
OCTSEL
1
0
S Q
R
OCx(1)
Output Enable
OCFA(2)
1
16
TMR register inputs
from time bases(3)
Period match signals
from time bases(3)
Note 1: Where ‘x’ is shown, reference is made to the registers associated with the respective output compare channels 1
through 8.
2: OCFA pin controls OC1-OC2 channels.
3: TMR2/TMR3 can be selected via OCTSEL(OCxOCN<3>) bit.
DS70264B-page 132
Preliminary
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
13.4
Output Compare Register
REGISTER 13-1:
OCxCON: OUTPUT COMPARE x CONTROL REGISTER
U-0
U-0
R/W-0
U-0
U-0
U-0
U-0
U-0
—
—
OCSIDL
—
—
—
—
—
bit 15
bit 8
U-0
U-0
U-0
R-0 HC
R/W-0
—
—
—
OCFLT
OCTSEL
R/W-0
R/W-0
R/W-0
OCM<2:0>
bit 7
bit 0
Legend:
HC = Cleared in Hardware
HS = Set in Hardware
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15-14
Unimplemented: Read as ‘0’
bit 13
OCSIDL: Stop Output Compare in Idle Mode Control bit
1 = Output Compare x will halt in CPU Idle mode
0 = Output Compare x will continue to operate in CPU Idle mode
bit 12-5
Unimplemented: Read as ‘0’
bit 4
OCFLT: PWM Fault Condition Status bit
1 = PWM Fault condition has occurred (cleared in hardware only)
0 = No PWM Fault condition has occurred
(This bit is only used when OCM<2:0> = 111.)
bit 3
OCTSEL: Output Compare Timer Select bit
1 = Timer3 is the clock source for Compare x
0 = Timer2 is the clock source for Compare x
bit 2-0
OCM<2:0>: Output Compare Mode Select bits
111 = PWM mode on OCx, Fault pin enabled
110 = PWM mode on OCx, Fault pin disabled
101 = Initialize OCx pin low, generate continuous output pulses on OCx pin
100 = Initialize OCx pin low, generate single output pulse on OCx pin
011 = Compare event toggles OCx pin
010 = Initialize OCx pin high, compare event forces OCx pin low
001 = Initialize OCx pin low, compare event forces OCx pin high
000 = Output compare channel is disabled
© 2007 Microchip Technology Inc.
Preliminary
DS70264B-page 133
dsPIC33FJ12GP201/202
NOTES:
DS70264B-page 134
Preliminary
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
14.0
Note:
SERIAL PERIPHERAL
INTERFACE (SPI)
14.3
This data sheet summarizes the features
of the dsPIC33FJ12GP201/202 devices. It
is not intended to be a comprehensive
reference source. To complement the
information in this data sheet, refer to the
“dsPIC33F Family Reference Manual”.
Please see the Microchip web site
(www.microchip.com) for the latest
dsPIC33F Family Reference Manual
sections.
The Serial Peripheral Interface (SPI) module is a
synchronous serial interface useful for communicating
with other peripheral or microcontroller devices. These
peripheral devices can be serial EEPROMs, shift
registers, display drivers, analog-to-digital (A/D)
converters, etc. The SPI module is compatible with
SPI and SIOP from Motorola®.
Each SPI module consists of a 16-bit shift register,
SPIxSR (where x = 1 or 2), used for shifting data in and
out, and a buffer register, SPIxBUF. A control register,
SPIxCON, configures the module. Additionally, a status
register, SPIxSTAT, indicates status conditions.
Transmit writes are also double-buffered. The user
application writes to SPIxBUF. When the Master or
Slave transfer is completed, the contents of the shift
register (SPIxSR) are moved to the receive buffer. If any
transmit data has been written to the buffer register, the
contents of the transmit buffer are moved to SPIxSR.
The received data is thus placed in SPIxBUF and the
transmit data in SPIxSR is ready for the next transfer.
Note:
14.4
SDIx (serial data input)
SDOx (serial data output)
SCKx (shift clock input or output)
SSx (active low slave select).
1.
2.
In Master mode operation, SCK is a clock output. In
Slave mode, it is a clock input.
14.1
A series of 8 or 16 clock pulses shift out bits from the
SPIxSR to SDOx pin and simultaneously shift in data
from the SDIx pin. An interrupt is generated when the
transfer is complete and the corresponding interrupt flag
bit (SPI1IF) is set. This interrupt can be disabled through
an interrupt enable bit (SPI1IE).
14.2
3.
4.
5.
Interrupts
If the receive buffer is full when new data is being
transferred from SPIxSR to SPIxBUF, the module sets
the SPIROV bit, indicating an overflow condition. The
transfer of the data from SPIxSR to SPIxBUF is not
completed, and the new data is lost. The module will
not respond to SCL transitions while SPIROV is ‘1’,
effectively disabling the module until SPIxBUF is read
by user software.
© 2007 Microchip Technology Inc.
SPI Setup
If using interrupts:
a) Clear the SPIxIF bit in the respective IFSn
register.
b) Set the SPIxIE bit in the respective IECn
register.
c) Write the SPIxIP bits in the respective IPCn
register to set the interrupt priority.
Write the desired settings to the SPIxCON
register with MSTEN (SPIxCON1<5>) = 1.
Clear the SPIROV bit (SPIxSTAT<6>).
Enable SPI operation by setting the SPIEN bit
(SPIxSTAT<15>).
Write the data to be transmitted to the SPIxBUF
register. Transmission (and reception) will start as
soon as data is written to the SPIxBUF register.
To set up the SPI module for the Slave mode of operation:
1.
2.
Receive Operations
The receive operation is double-buffered. When a
complete byte is received, it is transferred from
SPIxSR to SPIxBUF.
Both the transmit buffer (SPIxTXB) and
the receive buffer (SPIxRXB) are mapped
to the same register address, SPIxBUF.
Do not perform read-modify-write operations (such as bit-oriented instructions) on
the SPIxBUF register.
To set up the SPI module for the Master mode of
operation:
The serial interface consists of 4 pins:
•
•
•
•
Transmit Operations
3.
4.
5.
6.
7.
Preliminary
Clear the SPIxBUF register.
If using interrupts:
a) Clear the SPIxIF bit in the respective IFSn
register.
b) Set the SPIxIE bit in the respective IECn
register.
c) Write the SPIxIP bits in the respective IPCn
register to set the interrupt priority.
Write the desired settings to the SPIxCON1 and
SPIxCON2
registers
with
MSTEN
(SPIxCON1<5>) = 0.
Clear the SMP bit.
If the CKE bit is set, then set the SSEN bit
(SPIxCON1<7>) to enable the SSx pin.
Clear the SPIROV bit (SPIxSTAT<6>).
Enable SPI operation by setting the SPIEN bit
(SPIxSTAT<15>).
DS70264B-page 135
dsPIC33FJ12GP201/202
The SPI module generates an interrupt indicating completion of a byte or word transfer, as well as a separate
interrupt for all SPI error conditions.
FIGURE 14-1:
SPI MODULE BLOCK DIAGRAM
SCKx
SSx
1:1 to 1:8
Secondary
Prescaler
Sync
Control
1:1/4/16/64
Primary
Prescaler
Select
Edge
Control
Clock
SPIxCON1<1:0>
Shift Control
SPIxCON1<4:2>
SDOx
Enable
Master Clock
bit 0
SDIx
FCY
SPIxSR
Transfer
Transfer
SPIxRXB
SPIxTXB
SPIxBUF
Read SPIxBUF
Write SPIxBUF
16
Internal Data Bus
DS70264B-page 136
Preliminary
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
FIGURE 14-2:
SPI MASTER/SLAVE CONNECTION
PROCESSOR 1 (SPI Master)
PROCESSOR 2 (SPI Slave)
SDOx
SDIx
Serial Receive Buffer
(SPIxRXB)
Serial Receive Buffer
(SPIxRXB)
SDIx
Shift Register
(SPIxSR)
SDOx
LSb
MSb
MSb
LSb
Serial Transmit Buffer
(SPIxTXB)
Serial Transmit Buffer
(SPIxTXB)
SPI Buffer
(SPIxBUF)(2)
Shift Register
(SPIxSR)
Serial Clock
SCKx
SCKx
SPI Buffer
(SPIxBUF)(2)
SSx(1)
(MSTEN (SPIxCON1<5>) = 1)
Note
1:
2:
FIGURE 14-3:
(SSEN (SPIxCON1<7>) = 1 and MSTEN (SPIxCON1<5>) = 0)
Using the SSx pin in Slave mode of operation is optional.
User application must write transmit data to read received data from SPIxBUF. The SPIxTXB and SPIxRXB registers
are memory mapped to SPIxBUF.
SPI MASTER, FRAME MASTER CONNECTION DIAGRAM
PROCESSOR 2
dsPIC33F
SDOx
SDIx
SDIx
SDOx
Serial Clock
SCKx
SSx
FIGURE 14-4:
Frame Sync
Pulse
SCKx
SSx
SPI MASTER, FRAME SLAVE CONNECTION DIAGRAM
PROCESSOR 2
dsPIC33F
SDIx
SDOx
SDOx
SDIx
SCKx
SSx
© 2007 Microchip Technology Inc.
Serial Clock
Frame Sync
Pulse
Preliminary
SCKx
SSx
DS70264B-page 137
dsPIC33FJ12GP201/202
FIGURE 14-5:
SPI SLAVE, FRAME MASTER CONNECTION DIAGRAM
PROCESSOR 2
dsPIC33F
SDIx
SDOx
SDOx
SDIx
Serial Clock
SCKx
SSx
FIGURE 14-6:
SCKx
SSx
Frame Sync
Pulse
SPI SLAVE, FRAME SLAVE CONNECTION DIAGRAM
PROCESSOR 2
dsPIC33F
SDIx
SDOx
SDOx
SDIx
Serial Clock
SCKx
SSx
EQUATION 14-1:
SSx
Frame Sync
Pulse
RELATIONSHIP BETWEEN DEVICE AND SPI CLOCK SPEED
FSCK =
TABLE 14-1:
SCKx
FCY
Primary Prescaler * Secondary Prescaler
SAMPLE SCKx FREQUENCIES
Secondary Prescaler Settings
FCY = 40 MHz
Primary Prescaler Settings
1:1
2:1
4:1
6:1
8:1
1:1
Invalid
Invalid
10000
6666.67
5000
4:1
10000
5000
2500
1666.67
1250
16:1
2500
1250
625
416.67
312.50
64:1
625
312.5
156.25
104.17
78.125
1:1
5000
2500
1250
833
625
FCY = 5 MHz
Primary Prescaler Settings
Note:
4:1
1250
625
313
208
156
16:1
313
156
78
52
39
64:1
78
39
20
13
10
SCKx frequencies shown in kHz.
DS70264B-page 138
Preliminary
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
REGISTER 14-1:
SPIxSTAT: SPIx STATUS AND CONTROL REGISTER
R/W-0
U-0
R/W-0
U-0
U-0
U-0
U-0
U-0
SPIEN
—
SPISIDL
—
—
—
—
—
bit 15
bit 8
U-0
R/C-0
U-0
U-0
U-0
U-0
R-0
R-0
—
SPIROV
—
—
—
—
SPITBF
SPIRBF
bit 7
bit 0
Legend:
C = Clearable bit
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15
SPIEN: SPIx Enable bit
1 = Enables module and configures SCKx, SDOx, SDIx and SSx as serial port pins
0 = Disables module
bit 14
Unimplemented: Read as ‘0’
bit 13
SPISIDL: Stop in Idle Mode bit
1 = Discontinue module operation when device enters Idle mode
0 = Continue module operation in Idle mode
bit 12-7
Unimplemented: Read as ‘0’
bit 6
SPIROV: Receive Overflow Flag bit
1 = A new byte/word is completely received and discarded. The user software has not read the
previous data in the SPIxBUF register.
0 = No overflow has occurred.
bit 5-2
Unimplemented: Read as ‘0’
bit 1
SPITBF: SPIx Transmit Buffer Full Status bit
1 = Transmit not yet started, SPIxTXB is full
0 = Transmit started, SPIxTXB is empty
Automatically set in hardware when CPU writes SPIxBUF location, loading SPIxTXB
Automatically cleared in hardware when SPIx module transfers data from SPIxTXB to SPIxSR
bit 0
SPIRBF: SPIx Receive Buffer Full Status bit
1 = Receive complete, SPIxRXB is full
0 = Receive is not complete, SPIxRXB is empty
Automatically set in hardware when SPIx transfers data from SPIxSR to SPIxRXB
Automatically cleared in hardware when core reads SPIxBUF location, reading SPIxRXB
© 2007 Microchip Technology Inc.
Preliminary
DS70264B-page 139
dsPIC33FJ12GP201/202
REGISTER 14-2:
SPIXCON1: SPIx CONTROL REGISTER 1
U-0
U-0
U-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
—
—
—
DISSCK
DISSDO
MODE16
SMP
CKE(1)
bit 15
bit 8
R/W-0
R/W-0
R/W-0
SSEN
CKP
MSTEN
R/W-0
R/W-0
R/W-0
R/W-0
SPRE<2:0>
R/W-0
PPRE<1:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15-13
Unimplemented: Read as ‘0’
bit 12
DISSCK: Disable SCKx pin bit (SPI Master modes only)
1 = Internal SPI clock is disabled, pin functions as I/O
0 = Internal SPI clock is enabled
bit 11
DISSDO: Disable SDOx pin bit
1 = SDOx pin is not used by module; pin functions as I/O
0 = SDOx pin is controlled by the module
bit 10
MODE16: Word/Byte Communication Select bit
1 = Communication is word-wide (16 bits)
0 = Communication is byte-wide (8 bits)
bit 9
SMP: SPIx Data Input Sample Phase bit
Master mode:
1 = Input data sampled at end of data output time
0 = Input data sampled at middle of data output time
Slave mode:
SMP must be cleared when SPIx is used in Slave mode.
bit 8
CKE: SPIx Clock Edge Select bit(1)
1 = Serial output data changes on transition from active clock state to Idle clock state (see bit 6)
0 = Serial output data changes on transition from Idle clock state to active clock state (see bit 6)
bit 7
SSEN: Slave Select Enable bit (Slave mode)
1 = SSx pin used for Slave mode
0 = SSx pin not used by module. Pin controlled by port function.
bit 6
CKP: Clock Polarity Select bit
1 = Idle state for clock is a high level; active state is a low level
0 = Idle state for clock is a low level; active state is a high level
bit 5
MSTEN: Master Mode Enable bit
1 = Master mode
0 = Slave mode
Note 1:
The CKE bit is not used in the Framed SPI modes. Program this bit to ‘0’ for the Framed SPI modes
(FRMEN = 1).
DS70264B-page 140
Preliminary
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
REGISTER 14-2:
SPIXCON1: SPIx CONTROL REGISTER 1 (CONTINUED)
bit 4-2
SPRE<2:0>: Secondary Prescale bits (Master mode)
111 = Secondary prescale 1:1
110 = Secondary prescale 2:1
•
•
•
000 = Secondary prescale 8:1
bit 1-0
PPRE<1:0>: Primary Prescale bits (Master mode)
11 = Primary prescale 1:1
10 = Primary prescale 4:1
01 = Primary prescale 16:1
00 = Primary prescale 64:1
Note 1:
The CKE bit is not used in the Framed SPI modes. Program this bit to ‘0’ for the Framed SPI modes
(FRMEN = 1).
© 2007 Microchip Technology Inc.
Preliminary
DS70264B-page 141
dsPIC33FJ12GP201/202
REGISTER 14-3:
SPIxCON2: SPIx CONTROL REGISTER 2
R/W-0
R/W-0
R/W-0
U-0
U-0
U-0
U-0
U-0
FRMEN
SPIFSD
FRMPOL
—
—
—
—
—
bit 15
bit 8
U-0
U-0
U-0
U-0
U-0
U-0
R/W-0
U-0
—
—
—
—
—
—
FRMDLY
—
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15
FRMEN: Framed SPIx Support bit
1 = Framed SPIx support enabled (SSx pin used as frame sync pulse input/output)
0 = Framed SPIx support disabled
bit 14
SPIFSD: Frame Sync Pulse Direction Control bit
1 = Frame sync pulse input (slave)
0 = Frame sync pulse output (master)
bit 13
FRMPOL: Frame Sync Pulse Polarity bit
1 = Frame sync pulse is active-high
0 = Frame sync pulse is active-low
bit 12-2
Unimplemented: Read as ‘0’
bit 1
FRMDLY: Frame Sync Pulse Edge Select bit
1 = Frame sync pulse coincides with first bit clock
0 = Frame sync pulse precedes first bit clock
bit 0
Unimplemented: This bit must not be set to ‘1’ by the user application.
DS70264B-page 142
Preliminary
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
15.0
Note:
INTER-INTEGRATED CIRCUIT
(I2C)
This data sheet summarizes the features
of the dsPIC33FJ12GP201/202 devices. It
is not intended to be a comprehensive
reference source. To complement the
information in this data sheet, refer to the
“dsPIC33F Family Reference Manual”.
Please see the Microchip web site
(www.microchip.com) for the latest
dsPIC33F Family Reference Manual
sections.
The Inter-Integrated Circuit (I2C) module provides
complete hardware support for both Slave and MultiMaster modes of the I2C serial communication
standard, with a 16-bit interface.
The I2C module has a 2-pin interface:
• The SCLx pin is clock
• The SDAx pin is data
The I2C module offers the following key features:
• I2C interface supporting both Master and Slave
modes of operation
• I2C Slave mode supports 7 and 10-bit address
• I2C Master mode supports 7 and 10-bit address
• I2C port allows bidirectional transfers between
master and slaves
• Serial clock synchronization for I2C port can be
used as a handshake mechanism to suspend and
resume serial transfer (SCLREL control)
• I2C supports multi-master operation, detects bus
collision and arbitrates accordingly
15.1
Operating Modes
The hardware fully implements all the master and slave
functions of the I2C Standard and Fast mode
specifications, as well as 7 and 10-bit addressing.
The I2C module can operate either as a slave or a
master on an I2C bus.
The following types of I2C operation are supported:
•
•
•
I2C slave operation with 7-bit address
I2C slave operation with 10-bit address
I2C master operation with 7 or 10-bit address
15.2
I2CxCON and I2CxSTAT are control and status
registers, respectively. The I2CxCON register is
readable and writable. The lower six bits of I2CxSTAT
are read-only. The remaining bits of the I2CSTAT are
read/write.
• I2CxRSR is the shift register used for shifting data
• I2CxRCV is the receive buffer and the register to
which data bytes are written, or from which data
bytes are read
• I2CxTRN is the transmit register to which bytes
are written during a transmit operation
• The I2CxADD register holds the slave address
• A status bit, ADD10, indicates 10-bit Address
mode
• I2CxBRG acts as the Baud Rate Generator
(BRG) reload value.
In receive operations, I2CxRSR and I2CxRCV together
form a double-buffered receiver. When I2CxRSR
receives a complete byte, it is transferred to I2CxRCV,
and an interrupt pulse is generated.
15.3
I2C Interrupts
The I2C module generates two interrupt flags:
• MI2CxIF (I2C Master Events Interrupt flag)
• SI2CxIF (I2C Slave Events Interrupt flag)
A separate interrupt is generated for all I2C error
conditions.
15.4
Baud Rate Generator
In I2C Master mode, the reload value for the Baud Rate
Generator (BRG) is located in the I2CxBRG register.
When the BRG is loaded with this value, the BRG
counts down to zero and stops until another reload has
taken place. If clock arbitration is taking place, for
example, the BRG is reloaded when the SCLx pin is
sampled high.
As per the I2C standard, FSCL can be 100 kHz or
400 kHz. However, the user application can specify any
baud rate up to 1 MHz. I2CxBRG values of ‘0’ or ‘1’ are
illegal.
EQUATION 15-1:
For details about the communication sequence in each
of these modes, refer to the “dsPIC33F Family Reference Manual”. Please see the Microchip web site
(www.microchip.com) for the latest dsPIC33F Family
Reference Manual sections.
© 2007 Microchip Technology Inc.
I2C Registers
Preliminary
I2CxBRG =
SERIAL CLOCK RATE
CY
( FFSCL
–
)
FCY
–1
10,000,000
DS70264B-page 143
dsPIC33FJ12GP201/202
FIGURE 15-1:
I2C™ BLOCK DIAGRAM (X = 1)
Internal
Data Bus
I2CxRCV
SCLx
Read
Shift
Clock
I2CxRSR
LSb
SDAx
Address Match
Match Detect
Write
I2CxMSK
Write
Read
I2CxADD
Read
Start and Stop
Bit Detect
Write
Start and Stop
Bit Generation
Control Logic
I2CxSTAT
Collision
Detect
Read
Write
I2CxCON
Acknowledge
Generation
Read
Clock
Stretching
Write
I2CxTRN
LSb
Read
Shift Clock
Reload
Control
Write
BRG Down Counter
I2CxBRG
Read
TCY/2
DS70264B-page 144
Preliminary
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
15.5
I2C Module Addresses
15.8
The 10-bit I2CxADD register contains the Slave mode
addresses.
If the A10M bit (I2CxCON<10>) is ‘0’, the address is
interpreted by the module as a 7-bit address. When an
address is received, it is compared to the 7 Least
Significant bits of the I2CxADD register.
If the A10M bit is ‘1’, the address is assumed to be a
10-bit address. When an address is received, it is
compared with the binary value, ‘11110 A9 A8’
(where ‘A9’ and ‘A8’ are two Most Significant bits of
I2CxADD). If that value matches, the next address will
be compared with the Least Significant 8 bits of
I2CxADD, as specified in the 10-bit addressing
protocol.
TABLE 15-1:
7-BIT I2C™ SLAVE
ADDRESSES SUPPORTED BY
dsPIC33FJ12GP201/202
0x00
General call address or Start byte
0x01-0x03
Reserved
0x04-0x07
Hs mode Master codes
0x08-0x77
Valid 7-bit addresses
0x78-0x7b
Valid 10-bit addresses
(lower 7 bits)
0x7c-0x7f
Reserved
15.6
Slave Address Masking
The I2CxMSK register (Register 15-3) designates
address bit positions as “don’t care” for both 7-bit and
10-bit Address modes. Setting a particular bit location
(= 1) in the I2CxMSK register causes the slave module
to respond, whether the corresponding address bit
value is a ‘0’ or ‘1’. For example, when I2CxMSK is set
to ‘00100000’, the Slave module will detect both
addresses, ‘0000000’ and ‘00100000’.
To enable address masking, the IPMI (Intelligent
Peripheral Management Interface) must be disabled by
clearing the IPMIEN bit (I2CxCON<11>).
15.7
IPMI Support
The control bit IPMIEN enables the module to support
the Intelligent Peripheral Management Interface (IPMI).
When this bit is set, the module accepts and acts upon
all addresses.
General Call Address Support
The general call address can address all devices.
When this address is used, all devices should, in
theory, respond with an Acknowledgement.
The general call address is one of eight addresses
reserved for specific purposes by the I2C protocol. It
consists of all ‘0’s with R_W = 0.
The general call address is recognized when the
General Call Enable (GCEN) bit is set
(I2CxCON<7> = 1). When the interrupt is serviced, the
source for the interrupt can be checked by reading the
contents of the I2CxRCV to determine if the address
was device-specific or a general call address.
15.9
Automatic Clock Stretch
In Slave modes, the module can synchronize buffer
reads and write to the master device by clock stretching.
15.9.1
TRANSMIT CLOCK STRETCHING
Both 10-bit and 7-bit Transmit modes implement clock
stretching by asserting the SCLREL bit after the falling
edge of the ninth clock, if the TBF bit is cleared,
indicating the buffer is empty.
In Slave Transmit modes, clock stretching is always
performed, irrespective of the STREN bit. The user’s
ISR must set the SCLREL bit before transmission is
allowed to continue. By holding the SCLx line low, the
user application has time to service the ISR and load
the contents of the I2CxTRN before the master device
can initiate another transmit sequence.
15.9.2
RECEIVE CLOCK STRETCHING
The STREN bit in the I2CxCON register can be used to
enable clock stretching in Slave Receive mode. When
the STREN bit is set, the SCLx pin will be held low at
the end of each data receive sequence.
The user’s ISR must set the SCLREL bit before
reception is allowed to continue. By holding the SCLx
line low, the user application has time to service the
ISR and read the contents of the I2CxRCV before the
master device can initiate another receive sequence.
This prevents buffer overruns.
15.10 Software Controlled Clock
Stretching (STREN = 1)
When the STREN bit is ‘1’, the software can clear the
SCLREL bit to allow software to control the clock
stretching.
If the STREN bit is ‘0’, a software write to the SCLREL
bit is disregarded and has no effect on the SCLREL bit.
© 2007 Microchip Technology Inc.
Preliminary
DS70264B-page 145
dsPIC33FJ12GP201/202
15.11 Slope Control
2
The I C standard requires slope control on the SDAx
and SCLx signals for Fast mode (400 kHz). The control
bit, DISSLW, enables the user application to disable
slew rate control if desired. It is necessary to disable
the slew rate control for 1 MHz mode.
15.12 Clock Arbitration
Clock arbitration occurs when the master deasserts the
SCLx pin (SCLx allowed to float high) during any
receive, transmit or Restart/Stop condition. When the
SCLx pin is allowed to float high, the BRG is suspended from counting until the SCLx pin is actually
sampled high. When the SCLx pin is sampled high, the
BRG is reloaded with the contents of I2CxBRG and
begins counting. This process ensures that the SCLx
high time will always be at least one BRG rollover count
in the event that the clock is held low by an external
device.
DS70264B-page 146
15.13 Multi-Master Communication, Bus
Collision and Bus Arbitration
Multi-Master mode support is achieved by bus
arbitration. When the master outputs address/data bits
onto the SDAx pin, arbitration takes place when the
master outputs a ‘1’ on SDAx by letting SDAx float high
while another master asserts a ‘0’. When the SCLx pin
floats high, data should be stable. If the expected data
on SDAx is a ‘1’ and the data sampled on the
SDAx pin = 0, then a bus collision has taken place. The
master will set the I2C master events interrupt flag and
reset the master portion of the I2C port to its Idle state.
15.14 Peripheral Pin Select Limitations
The I2C module has limited peripheral pin select functionality. When the ACTI2C bit in the FPOR configuration register is set to ‘1‘, the module uses the SDAx/
SCLx pins. If the ALTI2C bit is ‘0‘, the module uses the
ASDAx/ASCLx pins.
Preliminary
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
REGISTER 15-1:
I2CxCON: I2Cx CONTROL REGISTER
R/W-0
U-0
R/W-0
R/W-1 HC
R/W-0
R/W-0
R/W-0
R/W-0
I2CEN
—
I2CSIDL
SCLREL
IPMIEN
A10M
DISSLW
SMEN
bit 15
bit 8
R/W-0
R/W-0
R/W-0
R/W-0 HC
R/W-0 HC
R/W-0 HC
R/W-0 HC
R/W-0 HC
GCEN
STREN
ACKDT
ACKEN
RCEN
PEN
RSEN
SEN
bit 7
bit 0
Legend:
U = Unimplemented bit, read as ‘0’
R = Readable bit
W = Writable bit
HS = Set in hardware
HC = Cleared in hardware
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15
I2CEN: I2Cx Enable bit
1 = Enables the I2Cx module and configures the SDAx and SCLx pins as serial port pins
0 = Disables the I2Cx module. All I2C pins are controlled by port functions
bit 14
Unimplemented: Read as ‘0’
bit 13
I2CSIDL: Stop in Idle Mode bit
1 = Discontinue module operation when device enters an Idle mode
0 = Continue module operation in Idle mode
bit 12
SCLREL: SCLx Release Control bit (when operating as I2C slave)
1 = Release SCLx clock
0 = Hold SCLx clock low (clock stretch)
If STREN = 1:
Bit is R/W (i.e., software can write ‘0’ to initiate stretch and write ‘1’ to release clock). Hardware clear
at beginning of slave transmission. Hardware clear at end of slave reception.
If STREN = 0:
Bit is R/S (i.e., software can only write ‘1’ to release clock). Hardware clear at beginning of slave
transmission.
bit 11
IPMIEN: Intelligent Peripheral Management Interface (IPMI) Enable bit
1 = IPMI mode is enabled; all addresses Acknowledged
0 = IPMI mode disabled
bit 10
A10M: 10-bit Slave Address bit
1 = I2CxADD is a 10-bit slave address
0 = I2CxADD is a 7-bit slave address
bit 9
DISSLW: Disable Slew Rate Control bit
1 = Slew rate control disabled
0 = Slew rate control enabled
bit 8
SMEN: SMbus Input Levels bit
1 = Enable I/O pin thresholds compliant with SMbus specification
0 = Disable SMbus input thresholds
bit 7
GCEN: General Call Enable bit (when operating as I2C slave)
1 = Enable interrupt when a general call address is received in the I2CxRSR
(module is enabled for reception)
0 = General call address disabled
bit 6
STREN: SCLx Clock Stretch Enable bit (when operating as I2C slave)
Used in conjunction with SCLREL bit.
1 = Enable software or receive clock stretching
0 = Disable software or receive clock stretching
© 2007 Microchip Technology Inc.
Preliminary
DS70264B-page 147
dsPIC33FJ12GP201/202
REGISTER 15-1:
I2CxCON: I2Cx CONTROL REGISTER (CONTINUED)
bit 5
ACKDT: Acknowledge Data bit (when operating as I2C master, applicable during master receive)
Value that will be transmitted when the software initiates an Acknowledge sequence.
1 = Send NACK during Acknowledge
0 = Send ACK during Acknowledge
bit 4
ACKEN: Acknowledge Sequence Enable bit
(when operating as I2C master, applicable during master receive)
1 = Initiate Acknowledge sequence on SDAx and SCLx pins and transmit ACKDT data bit.
Hardware clear at end of master Acknowledge sequence
0 = Acknowledge sequence not in progress
bit 3
RCEN: Receive Enable bit (when operating as I2C master)
1 = Enables Receive mode for I2C. Hardware clear at end of eighth bit of master receive data byte
0 = Receive sequence not in progress
bit 2
PEN: Stop Condition Enable bit (when operating as I2C master)
1 = Initiate Stop condition on SDAx and SCLx pins. Hardware clear at end of master Stop sequence
0 = Stop condition not in progress
bit 1
RSEN: Repeated Start Condition Enable bit (when operating as I2C master)
1 = Initiate Repeated Start condition on SDAx and SCLx pins. Hardware clear at end of
master Repeated Start sequence
0 = Repeated Start condition not in progress
bit 0
SEN: Start Condition Enable bit (when operating as I2C master)
1 = Initiate Start condition on SDAx and SCLx pins. Hardware clear at end of master Start sequence
0 = Start condition not in progress
DS70264B-page 148
Preliminary
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
REGISTER 15-2:
I2CxSTAT: I2Cx STATUS REGISTER
R-0 HSC
R-0 HSC
U-0
U-0
U-0
R/C-0 HS
R-0 HSC
R-0 HSC
ACKSTAT
TRSTAT
—
—
—
BCL
GCSTAT
ADD10
bit 15
bit 8
R/C-0 HS
R/C-0 HS
R-0 HSC
R/C-0 HSC
R/C-0 HSC
R-0 HSC
R-0 HSC
R-0 HSC
IWCOL
I2COV
D_A
P
S
R_W
RBF
TBF
bit 7
bit 0
Legend:
U = Unimplemented bit, read as ‘0’
R = Readable bit
W = Writable bit
HS = Set in hardware
HSC = Hardware set/cleared
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15
ACKSTAT: Acknowledge Status bit
(when operating as I2C master, applicable to master transmit operation)
1 = NACK received from slave
0 = ACK received from slave
Hardware set or clear at end of slave Acknowledge.
bit 14
TRSTAT: Transmit Status bit (when operating as I2C master, applicable to master transmit operation)
1 = Master transmit is in progress (8 bits + ACK)
0 = Master transmit is not in progress
Hardware set at beginning of master transmission. Hardware clear at end of slave Acknowledge.
bit 13-11
Unimplemented: Read as ‘0’
bit 10
BCL: Master Bus Collision Detect bit
1 = A bus collision has been detected during a master operation
0 = No collision
Hardware set at detection of bus collision.
bit 9
GCSTAT: General Call Status bit
1 = General call address was received
0 = General call address was not received
Hardware set when address matches general call address. Hardware clear at Stop detection.
bit 8
ADD10: 10-bit Address Status bit
1 = 10-bit address was matched
0 = 10-bit address was not matched
Hardware set at match of 2nd byte of matched 10-bit address. Hardware clear at Stop detection.
bit 7
IWCOL: Write Collision Detect bit
1 = An attempt to write the I2CxTRN register failed because the I2C module is busy
0 = No collision
Hardware set at occurrence of write to I2CxTRN while busy (cleared by software).
bit 6
I2COV: Receive Overflow Flag bit
1 = A byte was received while the I2CxRCV register is still holding the previous byte
0 = No overflow
Hardware set at attempt to transfer I2CxRSR to I2CxRCV (cleared by software).
bit 5
D_A: Data/Address bit (when operating as I2C slave)
1 = Indicates that the last byte received was data
0 = Indicates that the last byte received was device address
Hardware clear at device address match. Hardware set by reception of slave byte.
bit 4
P: Stop bit
1 = Indicates that a Stop bit has been detected last
0 = Stop bit was not detected last
Hardware set or clear when Start, Repeated Start or Stop detected.
© 2007 Microchip Technology Inc.
Preliminary
DS70264B-page 149
dsPIC33FJ12GP201/202
REGISTER 15-2:
I2CxSTAT: I2Cx STATUS REGISTER (CONTINUED)
bit 3
S: Start bit
1 = Indicates that a Start (or Repeated Start) bit has been detected last
0 = Start bit was not detected last
Hardware set or clear when Start, Repeated Start or Stop detected.
bit 2
R_W: Read/Write Information bit (when operating as I2C slave)
1 = Read – indicates data transfer is output from slave
0 = Write – indicates data transfer is input to slave
Hardware set or clear after reception of I 2C device address byte.
bit 1
RBF: Receive Buffer Full Status bit
1 = Receive complete, I2CxRCV is full
0 = Receive not complete, I2CxRCV is empty
Hardware set when I2CxRCV is written with received byte. Hardware clear when software
reads I2CxRCV.
bit 0
TBF: Transmit Buffer Full Status bit
1 = Transmit in progress, I2CxTRN is full
0 = Transmit complete, I2CxTRN is empty
Hardware set when software writes I2CxTRN. Hardware clear at completion of data transmission.
DS70264B-page 150
Preliminary
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
REGISTER 15-3:
I2CxMSK: I2Cx SLAVE MODE ADDRESS MASK REGISTER
U-0
U-0
U-0
U-0
U-0
U-0
R/W-0
R/W-0
—
—
—
—
—
—
AMSK9
AMSK8
bit 15
bit 8
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
AMSK7
AMSK6
AMSK5
AMSK4
AMSK3
AMSK2
AMSK1
AMSK0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15-10
Unimplemented: Read as ‘0’
bit 9-0
AMSKx: Mask for Address bit x Select bit
1 = Enable masking for bit x of incoming message address; bit match not required in this position
0 = Disable masking for bit x; bit match required in this position
© 2007 Microchip Technology Inc.
Preliminary
DS70264B-page 151
dsPIC33FJ12GP201/202
NOTES:
DS70264B-page 152
Preliminary
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
16.0
Note:
UNIVERSAL ASYNCHRONOUS
RECEIVER TRANSMITTER
(UART)
This data sheet summarizes the features
of the dsPIC33FJ12GP201/202 devices. It
is not intended to be a comprehensive
reference source. To complement the
information in this data sheet, refer to the
“dsPIC33F Family Reference Manual”.
Please see the Microchip web site
(www.microchip.com) for the latest
dsPIC33F Family Reference Manual
sections.
The Universal Asynchronous Receiver Transmitter
(UART) module is one of the serial I/O modules
available in the dsPIC33FJ12GP201/202 device family.
The UART is a full-duplex asynchronous system that
can communicate with peripheral devices, such as
personal computers, LIN, RS-232 and RS-485
interfaces. The module also supports a hardware flow
control option with the UxCTS and UxRTS pins and
also includes an IrDA® encoder and decoder.
The primary features of the UART module are:
• Full-Duplex, 8- or 9-bit Data Transmission through
the UxTX and UxRX pins
• Even, odd or no parity options (for 8-bit data)
• One or two stop bits
FIGURE 16-1:
• Hardware Flow Control Option with UxCTS and
UxRTS pins
• Fully Integrated Baud Rate Generator with 16-bit
prescaler
• Baud rates ranging from 1 Mbps to 15 Mbps at
16 MIPS
• 4-deep First-In First-Out (FIFO) Transmit Data
Buffer
• 4-Deep FIFO Receive Data Buffer
• Parity, framing and buffer overrun error detection
• Support for 9-bit mode with Address Detect
(9th bit = 1)
• Transmit and Receive interrupts
• A separate interrupt for all UART error conditions
• Loopback mode for diagnostic support
• Support for Sync and Break characters
• Support for automatic baud rate detection
• IrDA encoder and decoder logic
• 16x baud clock output for IrDA support
A simplified block diagram of the UART module is
shown in Figure 16-1. The UART module consists of
these key hardware elements:
• Baud Rate Generator
• Asynchronous Transmitter
• Asynchronous Receiver
UART SIMPLIFIED BLOCK DIAGRAM
Baud Rate Generator
IrDA®
BCLK
Hardware Flow Control
UxRTS
UxCTS
© 2007 Microchip Technology Inc.
UART Receiver
UxRX
UART Transmitter
UxTX
Preliminary
DS70264B-page 153
dsPIC33FJ12GP201/202
16.1
UART Baud Rate Generator
The UART module includes a dedicated 16-bit BRG.
The BRGx register controls the period of a free-running
16-bit timer. Equation 16-1 shows the formula for
computation of the baud rate with BRGH = 0.
EQUATION 16-1:
Note:
EQUATION 16-2:
FCY
16 • (BRGx + 1)
BRGx =
Note:
FCY
–1
16 • Baud Rate
FCY denotes the instruction cycle clock
frequency (FOSC/2).
Example 16-1 shows the calculation of the baud rate
error for the following conditions:
• FCY = 4 MHz
• Desired Baud Rate = 9600
UART BAUD RATE WITH
BRGH = 1
Baud Rate =
UART BAUD RATE WITH
BRGH = 0
Baud Rate =
BRGx =
Equation 16-2 shows the formula for computation of
the baud rate with BRGH = 1.
FCY
4 • (BRGx + 1)
FCY
–1
4 • Baud Rate
FCY denotes the instruction cycle clock
frequency (FOSC/2).
The maximum baud rate (BRGH = 1) possible is FCY/4
(for BRGx = 0), and the minimum baud rate possible is
FCY/(4 * 65536).
Writing a new value to the BRGx register causes the
BRG timer to be reset (cleared). This ensures the BRG
does not wait for a timer overflow before generating the
new baud rate.
The maximum baud rate (BRGH = 0) possible is
FCY/16 (for BRGx = 0), and the minimum baud rate
possible is FCY/(16 * 65536).
EXAMPLE 16-1:
BAUD RATE ERROR CALCULATION (BRGH = 0)
Desired Baud Rate
=
FCY/(16 (BRGx + 1))
=
=
=
((FCY/Desired Baud Rate)/16) – 1
((4000000/9600)/16) – 1
25
Calculated Baud Rate
=
=
4000000/(16 (25 + 1))
9615
Error
=
(Calculated Baud Rate – Desired Baud Rate)
Desired Baud Rate
(9615 – 9600)/9600
0.16%
Solving for BRGx Value:
BRGx
BRGx
BRGx
=
=
DS70264B-page 154
Preliminary
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
16.2
1.
2.
3.
4.
Transmitting in 8-bit Data Mode
16.5
Set up the UART:
a) Write appropriate values for data, parity and
Stop bits.
b) Write appropriate baud rate value to the
BRGx register.
c) Set up transmit and receive interrupt enable
and priority bits.
Enable the UART.
Set the UTXEN bit (causes a transmit interrupt).
Write data byte to lower byte of UxTXREG word.
The value will be immediately transferred to the
Transmit Shift Register (TSR) and the serial bit
stream will start shifting out with the next rising
edge of the baud clock.
Alternately, the data byte can be transferred
while UTXEN = 0, and the user application can
set UTXEN. This causes the serial bit stream to
begin immediately, because the baud clock
starts from a cleared state.
A transmit interrupt will be generated as per interrupt
control bits, UTXISEL<1:0>.
16.3
1.
2.
3.
4.
5.
Transmitting in 9-bit Data Mode
Set up the UART (as described in Section 16.2
“Transmitting in 8-bit Data Mode”).
Enable the UART.
Set the UTXEN bit (causes a transmit interrupt).
Write UxTXREG as a 16-bit value only.
A word write to UxTXREG triggers the transfer
of the 9-bit data to the TSR. The serial bit stream
will start shifting out with the first rising edge of
the baud clock.
A transmit interrupt will be generated as per the setting
of control bits, UTXISEL<1:0>.
16.4
3.
4.
Configure the UART for the desired mode.
Set UTXEN and UTXBRK, which sets up the
Break character.
Load the UxTXREG register with a dummy
character to initiate transmission (value is
ignored).
Write 0x55 to UxTXREG, which loads the Sync
character into the transmit FIFO. After the Break
has been sent, the UTXBRK bit is reset by
hardware.
The Sync character now transmits.
© 2007 Microchip Technology Inc.
2.
3.
4.
Set up the UART (as described in Section 16.2
“Transmitting in 8-bit Data Mode”).
Enable the UART. A receive interrupt will be
generated when one or more data characters
have been received as per interrupt control bits,
URXISEL<1:0>.
Read the OERR bit to determine if an overrun
error has occurred. The OERR bit must be reset
in software.
Read UxRXREG.
The act of reading the UxRXREG character will move
the next character to the top of the receive FIFO,
including a new set of PERR and FERR values.
16.6
Flow Control Using UxCTS and
UxRTS Pins
UARTx Clear to Send (UxCTS) and Request to Send
(UxRTS) are the two hardware controlled active-low
pins associated with the UART module. The UEN<1:0>
bits in the UxMODE register configure these pins.
These two pins allow the UART to operate in Simplex
and Flow Control modes. They are implemented to
control the transmission and the reception between the
Data Terminal Equipment (DTE).
16.7
Infrared Support
The UART module provides two types of infrared UART
support:
• IrDA clock output to support external IrDA
encoder and decoder device (legacy module
support)
• Full implementation of the IrDA encoder and
decoder.
16.7.1
Break and Sync Transmit
Sequence
The following sequence will send a message frame
header made up of a Break, followed by an auto-baud
Sync byte.
1.
2.
1.
Receiving in 8-bit or 9-bit Data
Mode
EXTERNAL IrDA SUPPORT – IrDA
CLOCK OUTPUT
To support external IrDA encoder and decoder devices,
the BCLK pin can be configured to generate the 16x
baud clock. With UEN<1:0> = 11, the BCLK pin will
output the 16x baud clock if the UART module is
enabled. The pin can be used to support the IrDA
codec chip.
16.7.2
BUILT-IN IrDA ENCODER AND
DECODER
The UART module includes full implementation of the
IrDA encoder and decoder. The built-in IrDA encoder
and decoder functionality is enabled using the IREN bit
(UxMODE<12>). When enabled (IREN = 1), the
receive pin (UxRX) acts as the input from the infrared
receiver. The transmit pin (UxTX) acts as the output to
the infrared transmitter.
Preliminary
DS70264B-page 155
dsPIC33FJ12GP201/202
REGISTER 16-1:
UxMODE: UARTx MODE REGISTER
R/W-0
U-0
R/W-0
R/W-0
R/W-0
U-0
UARTEN
—
USIDL
IREN(1)
RTSMD
—
R/W-0
R/W-0
UEN<1:0>
bit 15
bit 8
R/W-0 HC
R/W-0
R/W-0 HC
R/W-0
R/W-0
WAKE
LPBACK
ABAUD
URXINV
BRGH
R/W-0
R/W-0
PDSEL<1:0>
R/W-0
STSEL
bit 7
bit 0
Legend:
HC = Hardware cleared
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15
UARTEN: UARTx Enable bit
1 = UARTx is enabled; all UARTx pins are controlled by UARTx as defined by UEN<1:0>
0 = UARTx is disabled; all UARTx pins are controlled by port latches; UARTx power consumption
minimal
bit 14
Unimplemented: Read as ‘0’
bit 13
USIDL: Stop in Idle Mode bit
1 = Discontinue module operation when device enters Idle mode
0 = Continue module operation in Idle mode
bit 12
IREN: IrDA Encoder and Decoder Enable bit(1)
1 = IrDA encoder and decoder enabled
0 = IrDA encoder and decoder disabled
bit 11
RTSMD: Mode Selection for UxRTS Pin bit
1 = UxRTS pin in Simplex mode
0 = UxRTS pin in Flow Control mode
bit 10
Unimplemented: Read as ‘0’
bit 9-8
UEN<1:0>: UARTx Enable bits
11 = UxTX, UxRX and BCLK pins are enabled and used; UxCTS pin controlled by port latches
10 = UxTX, UxRX, UxCTS and UxRTS pins are enabled and used
01 = UxTX, UxRX and UxRTS pins are enabled and used; UxCTS pin controlled by port latches
00 = UxTX and UxRX pins are enabled and used; UxCTS and UxRTS/BCLK pins controlled by
port latches
bit 7
WAKE: Wake-up on Start bit Detect During Sleep Mode Enable bit
1 = UARTx will continue to sample the UxRX pin; interrupt generated on falling edge; bit cleared
in hardware on following rising edge
0 = No wake-up enabled
bit 6
LPBACK: UARTx Loopback Mode Select bit
1 = Enable Loopback mode
0 = Loopback mode is disabled
bit 5
ABAUD: Auto-Baud Enable bit
1 = Enable baud rate measurement on the next character – requires reception of a Sync field (55h)
before other data; cleared in hardware upon completion
0 = Baud rate measurement disabled or completed
bit 4
URXINV: Receive Polarity Inversion bit
1 = UxRX Idle state is ‘0’
0 = UxRX Idle state is ‘1’
Note 1:
This feature is only available for the 16x BRG mode (BRGH = 0).
DS70264B-page 156
Preliminary
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
REGISTER 16-1:
UxMODE: UARTx MODE REGISTER (CONTINUED)
bit 3
BRGH: High Baud Rate Enable bit
1 = BRG generates 4 clocks per bit period (4x baud clock, High-Speed mode)
0 = BRG generates 16 clocks per bit period (16x baud clock, Standard mode)
bit 2-1
PDSEL<1:0>: Parity and Data Selection bits
11 = 9-bit data, no parity
10 = 8-bit data, odd parity
01 = 8-bit data, even parity
00 = 8-bit data, no parity
bit 0
STSEL: Stop Bit Selection bit
1 = Two Stop bits
0 = One Stop bit
Note 1:
This feature is only available for the 16x BRG mode (BRGH = 0).
© 2007 Microchip Technology Inc.
Preliminary
DS70264B-page 157
dsPIC33FJ12GP201/202
REGISTER 16-2:
UxSTA: UARTx STATUS AND CONTROL REGISTER
R/W-0
R/W-0
R/W-0
U-0
R/W-0 HC
R/W-0
R-0
R-1
UTXISEL1
UTXINV(1)
UTXISEL0
—
UTXBRK
UTXEN
UTXBF
TRMT
bit 15
bit 8
R/W-0
R/W-0
URXISEL<1:0>
R/W-0
R-1
R-0
R-0
R/C-0
R-0
ADDEN
RIDLE
PERR
FERR
OERR
URXDA
bit 7
bit 0
Legend:
HC = Hardware cleared
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15,13
UTXISEL<1:0>: Transmission Interrupt Mode Selection bits
11 = Reserved; do not use
10 = Interrupt when a character is transferred to the Transmit Shift Register, and as a result, the
transmit buffer becomes empty
01 = Interrupt when the last character is shifted out of the Transmit Shift Register; all transmit
operations are completed
00 = Interrupt when a character is transferred to the Transmit Shift Register (this implies there is
at least one character open in the transmit buffer)
bit 14
UTXINV: IrDA Encoder Transmit Polarity Inversion bit(1)
1 = IrDA encoded, UxTX Idle state is ‘1’
0 = IrDA encoded, UxTX Idle state is ‘0’
bit 12
Unimplemented: Read as ‘0’
bit 11
UTXBRK: Transmit Break bit
1 = Send Sync Break on next transmission – Start bit, followed by twelve ‘0’ bits, followed by Stop bit;
cleared by hardware upon completion
0 = Sync Break transmission disabled or completed
bit 10
UTXEN: Transmit Enable bit
1 = Transmit enabled, UxTX pin controlled by UARTx
0 = Transmit disabled, any pending transmission is aborted and buffer is reset. UxTX pin controlled
by port
bit 9
UTXBF: Transmit Buffer Full Status bit (read-only)
1 = Transmit buffer is full
0 = Transmit buffer is not full, at least one more character can be written
bit 8
TRMT: Transmit Shift Register Empty bit (read-only)
1 = Transmit Shift Register is empty and transmit buffer is empty (the last transmission has completed)
0 = Transmit Shift Register is not empty, a transmission is in progress or queued
bit 7-6
URXISEL<1:0>: Receive Interrupt Mode Selection bits
11 = Interrupt is set on UxRSR transfer making the receive buffer full (i.e., has 4 data characters)
10 = Interrupt is set on UxRSR transfer making the receive buffer 3/4 full (i.e., has 3 data characters)
0x = Interrupt is set when any character is received and transferred from the UxRSR to the receive
buffer. Receive buffer has one or more characters
bit 5
ADDEN: Address Character Detect bit (bit 8 of received data = 1)
1 = Address Detect mode enabled. If 9-bit mode is not selected, this does not take effect
0 = Address Detect mode disabled
Note 1:
Value of bit only affects the transmit properties of the module when the IrDA encoder is enabled
(IREN = 1).
DS70264B-page 158
Preliminary
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
REGISTER 16-2:
UxSTA: UARTx STATUS AND CONTROL REGISTER (CONTINUED)
bit 4
RIDLE: Receiver Idle bit (read-only)
1 = Receiver is Idle
0 = Receiver is active
bit 3
PERR: Parity Error Status bit (read-only)
1 = Parity error has been detected for the current character (character at the top of the receive FIFO)
0 = Parity error has not been detected
bit 2
FERR: Framing Error Status bit (read-only)
1 = Framing error has been detected for the current character (character at the top of the receive
FIFO)
0 = Framing error has not been detected
bit 1
OERR: Receive Buffer Overrun Error Status bit (read/clear only)
1 = Receive buffer has overflowed
0 = Receive buffer has not overflowed. Clearing a previously set OERR bit (1 → 0 transition) will reset
the receiver buffer and the UxRSR to the empty state
bit 0
URXDA: Receive Buffer Data Available bit (read-only)
1 = Receive buffer has data, at least one more character can be read
0 = Receive buffer is empty
Note 1:
Value of bit only affects the transmit properties of the module when the IrDA encoder is enabled
(IREN = 1).
© 2007 Microchip Technology Inc.
Preliminary
DS70264B-page 159
dsPIC33FJ12GP201/202
NOTES:
DS70264B-page 160
Preliminary
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
17.0
Note:
10-BIT/12-BIT
ANALOG-TO-DIGITAL
CONVERTER (ADC)
This data sheet summarizes the features
of the dsPIC33FJ12GP201/202 devices. It
is not intended to be a comprehensive
reference source. To complement the
information in this data sheet, refer to the
“dsPIC33F Family Reference Manual”.
Please see the Microchip web site
(www.microchip.com) for the latest
dsPIC33F Family Reference Manual
sections.
Depending on the particular device pinout, the ADC
can have up to 10 analog input pins, designated AN0
through AN9. In addition, there are two analog input
pins for external voltage reference connections. These
voltage reference inputs can be shared with other
analog input pins.
The actual number of analog input pins and external
voltage reference input configuration depend on the
specific device.
A block diagram of the ADC is shown in Figure 17-1.
17.2
To configure the ADC module:
The dsPIC33FJ12GP201/202 devices have up to 10
ADC module input channels.
1.
The AD12B bit (AD1CON1<10>) allows each of the
ADC modules to be configured as either a 10-bit,
4-sample-and-hold ADC (default configuration) or a
12-bit, 1-sample-and-hold ADC.
2.
Note:
17.1
The ADC module must be disabled before
the AD12B bit can be modified.
•
•
•
•
•
•
•
•
•
•
•
3.
4.
Key Features
The 10-bit ADC configuration has the following key
features:
Successive Approximation (SAR) conversion
Conversion speeds of up to 1.1 Msps
Up to 10 analog input pins
External voltage reference input pins
Simultaneous sampling of up to four analog input
pins
Automatic Channel Scan mode
Selectable conversion trigger source
Selectable Buffer Fill modes
Four result alignment options (signed/unsigned,
fractional/integer)
Operation during CPU Sleep and Idle modes
16-word bit conversion result buffer
ADC Initialization
5.
6.
7.
Select
port
pins
as
analog
inputs
(AD1PCFGH<15:0> or AD1PCFGL<15:0>).
Select voltage reference source to match
expected
range
on
analog
inputs
(AD1CON2<15:13>).
Select the analog conversion clock to match
desired data rate with processor clock
(AD1CON3<5:0>).
Determine how many sample-and-hold channels will be used (AD1CON2<9:8> and
AD1PCFGH<15:0> or AD1PCFGL<15:0>).
Select the appropriate sample/conversion
sequence
(AD1CON1<7:5>
and
AD1CON3<12:8>).
Select the way conversion results are presented
in the buffer (AD1CON1<9:8>).
a) Turn on the ADC module (AD1CON1<15>).
Configure ADC interrupt (if required):
a) Clear the AD1IF bit.
b) Select ADC interrupt priority.
The 12-bit ADC configuration supports all the above
features, except:
• In the 12-bit configuration, conversion speeds of
up to 500 ksps are supported
• There is only 1 sample-and-hold amplifier in the
12-bit configuration, so simultaneous sampling of
multiple channels is not supported.
© 2007 Microchip Technology Inc.
Preliminary
DS70264B-page 161
dsPIC33FJ12GP201/202
FIGURE 17-1:
ADC1 MODULE BLOCK DIAGRAM
AVDD
VREF+(1)
AVSS
AN1
AN4
+
AN7(3)
-
VREFAN2
AN5
AN2
S/H
-
AN9(3)
VREFAN1
+
AN6(3)
AN8(3)
AN3
AN4
00100
AN5
00101
AN6(3)
00110
AN7(3)
00111
AN8(3)
01000
AN9(3)
01001
CH2(2)
Note 1:
2:
3:
Conversion
Result
Conversion Logic
16-bit
ADC Output
Buffer
+
-
S/H
CH3(2)
CH1,CH2,
CH3,CH0
Sample
Input
Switches
+
VREFAN1
ADC1
S/H
VREF00000
00001
00010
00011
CH1(2)
-
Sample/Sequence
Control
Bus Interface
AN0
AN3
AN0
Data Format
VREF-(1)
Input MUX
Control
CH0
S/H
VREF+, VREF- inputs can be multiplexed with other analog inputs.
Channels 1, 2 and 3 are not applicable for the 12-bit mode of operation.
AN6 through AN9 are not applicable to dsPIC33FJ12GP201 devices.
DS70264B-page 162
Preliminary
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
EQUATION 17-1:
ADC CONVERSION CLOCK PERIOD
TAD = TCY(ADCS + 1)
ADCS =
FIGURE 17-2:
TAD
–1
TCY
ADC TRANSFER FUNCTION (10-BIT EXAMPLE)
Output Code
11 1111 1111 (= 1023)
11 1111 1110 (= 1022)
10 0000 0011 (= 515)
10 0000 0010 (= 514)
10 0000 0001 (= 513)
10 0000 0000 (= 512)
01 1111 1111 (= 511)
01 1111 1110 (= 510)
01 1111 1101 (= 509)
00 0000 0001 (= 1)
00 0000 0000 (= 0)
VREFL
VREFL +
VREFH – VREFL
VREFL +
1024
512 * (VREFH – VREFL)
1024
VREFL +
1023 * (VREFH – VREFL)
VREFH
1024
(VINH – VINL)
FIGURE 17-3:
ADC CONVERSION CLOCK PERIOD BLOCK DIAGRAM
AD1CON3<15>
ADC Internal
RC Clock
0
TAD
AD1CON3<5:0>
1
6
TOSC(1)
X2
TCY
ADC Conversion
Clock Multiplier
1, 2, 3, 4, 5,..., 64
Note:
Refer to Figure 7-2 for the derivation of FOSC when the PLL is enabled. If the PLL is not used, FOSC is equal
to the clock frequency. TOSC = 1/FOSC.
© 2007 Microchip Technology Inc.
Preliminary
DS70264B-page 163
dsPIC33FJ12GP201/202
REGISTER 17-1:
AD1CON1: ADC1 CONTROL REGISTER 1
R/W-0
U-0
R/W-0
U-0
U-0
R/W-0
ADON
—
ADSIDL
—
—
AD12B
R/W-0
R/W-0
FORM<1:0>
bit 15
bit 8
R/W-0
R/W-0
R/W-0
SSRC<2:0>
U-0
R/W-0
R/W-0
R/W-0
HC,HS
R/C-0
HC, HS
—
SIMSAM
ASAM
SAMP
DONE
bit 7
bit 0
Legend:
HC = Cleared by hardware
HS = Set by hardware
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15
ADON: ADC Operating Mode bit
1 = ADC module is operating
0 = ADC is off
bit 14
Unimplemented: Read as ‘0’
bit 13
ADSIDL: Stop in Idle Mode bit
1 = Discontinue module operation when device enters Idle mode
0 = Continue module operation in Idle mode
bit 12-11
Unimplemented: Read as ‘0’
bit 10
AD12B: 10-bit or 12-bit Operation Mode bit
1 = 12-bit, 1-channel ADC operation
0 = 10-bit, 4-channel ADC operation
bit 9-8
FORM<1:0>: Data Output Format bits
For 10-bit operation:
11 = Signed fractional (DOUT = sddd dddd dd00 0000, where s = .NOT.d<9>)
10 = Fractional (DOUT = dddd dddd dd00 0000)
01 = Signed integer (DOUT = ssss sssd dddd dddd, where s = .NOT.d<9>)
00 = Integer (DOUT = 0000 00dd dddd dddd)
For 12-bit operation:
11 = Signed fractional (DOUT = sddd dddd dddd 0000, where s = .NOT.d<11>)
10 = Fractional (DOUT = dddd dddd dddd 0000)
01 = Signed Integer (DOUT = ssss sddd dddd dddd, where s = .NOT.d<11>)
00 = Integer (DOUT = 0000 dddd dddd dddd)
bit 7-5
SSRC<2:0>: Sample Clock Source Select bits
111 = Internal counter ends sampling and starts conversion (auto-convert)
110 = Reserved
101 = Motor Control PWM2 interval ends sampling and starts conversion
100 = Reserved
011 = Motor Control PWM1 interval ends sampling and starts conversion
010 = GP timer 3 compare ends sampling and starts conversion
001 = Active transition on INT0 pin ends sampling and starts conversion
000 = Clearing sample bit ends sampling and starts conversion
bit 4
Unimplemented: Read as ‘0’
bit 3
SIMSAM: Simultaneous Sample Select bit (applicable only when CHPS<1:0> = 01 or 1x)
When AD12B = 1, SIMSAM is: U-0, Unimplemented, Read as ‘0’
1 = Samples CH0, CH1, CH2, CH3 simultaneously (when CHPS<1:0> = 1x); or
Samples CH0 and CH1 simultaneously (when CHPS<1:0> = 01)
0 = Samples multiple channels individually in sequence
DS70264B-page 164
Preliminary
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
REGISTER 17-1:
AD1CON1: ADC1 CONTROL REGISTER 1 (CONTINUED)
bit 2
ASAM: ADC Sample Auto-Start bit
1 = Sampling begins immediately after last conversion. SAMP bit is auto-set
0 = Sampling begins when SAMP bit is set
bit 1
SAMP: ADC Sample Enable bit
1 = ADC sample-and-hold amplifiers are sampling
0 = ADC sample-and-hold amplifiers are holding
If ASAM = 0, software can write ‘1’ to begin sampling. Automatically set by hardware if ASAM = 1.
If SSRC = 000, software can write ‘0’ to end sampling and start conversion. If SSRC ≠ 000,
automatically cleared by hardware to end sampling and start conversion.
bit 0
DONE: ADC Conversion Status bit
1 = ADC conversion cycle is completed
0 = ADC conversion not started or in progress
Automatically set by hardware when ADC conversion is complete. Software can write ‘0’ to clear
DONE status (software not allowed to write ‘1’). Clearing this bit will NOT affect any operation in
progress. Automatically cleared by hardware at start of a new conversion.
© 2007 Microchip Technology Inc.
Preliminary
DS70264B-page 165
dsPIC33FJ12GP201/202
REGISTER 17-2:
R/W-0
AD1CON2: ADC1 CONTROL REGISTER 2
R/W-0
R/W-0
VCFG<2:0>
U-0
U-0
R/W-0
—
—
CSCNA
R/W-0
R/W-0
CHPS<1:0>
bit 15
bit 8
R-0
U-0
BUFS
—
R/W-0
R/W-0
R/W-0
R/W-0
SMPI<3:0>
R/W-0
R/W-0
BUFM
ALTS
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15-13
x = Bit is unknown
VCFG<2:0>: Converter Voltage Reference Configuration bits
000
001
010
011
1xx
ADREF+
ADREF-
AVDD
External VREF+
AVDD
External VREF+
AVDD
AVSS
AVSS
External VREFExternal VREFAvss
bit 12-11
Unimplemented: Read as ‘0’
bit 10
CSCNA: Scan Input Selections for CH0+ during Sample A bit
1 = Scan inputs
0 = Do not scan inputs
bit 9-8
CHPS<1:0>: Select Channels Utilized bits
When AD12B = 1, CHPS<1:0> is: U-0, Unimplemented, Read as ‘0’
1x = Converts CH0, CH1, CH2 and CH3
01 = Converts CH0 and CH1
00 = Converts CH0
bit 7
BUFS: Buffer Fill Status bit (valid only when BUFM = 1)
1 = ADC is currently filling second half of buffer, user application should access data in the first half
0 = ADC is currently filling first half of buffer, user application should access data in the second half
bit 6
Unimplemented: Read as ‘0’
bit 5-2
SMPI<3:0>: Sample/Convert Sequences Per Interrupt Selection bits
1111 = Interrupts at the completion of conversion for each 16th sample/convert sequence
1110 = Interrupts at the completion of conversion for each 15th sample/convert sequence
•
•
•
0001 = Interrupts at the completion of conversion for each 2nd sample/convert sequence
0000 = Interrupts at the completion of conversion for each sample/convert sequence
bit 1
BUFM: Buffer Fill Mode Select bit
1 = Starts filling first half of buffer on first interrupt and the second half of buffer on next interrupt
0 = Always starts filling buffer from the beginning
bit 0
ALTS: Alternate Input Sample Mode Select bit
1 = Uses channel input selects for Sample A on first sample and Sample B on next sample
0 = Always uses channel input selects for Sample A
DS70264B-page 166
Preliminary
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
REGISTER 17-3:
AD1CON3: ADC1 CONTROL REGISTER 3
R/W-0
U-0
U-0
ADRC
—
—
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
SAMC<4:0>
bit 15
bit 8
U-0
U-0
—
—
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
ADCS<5:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15
ADRC: ADC Conversion Clock Source bit
1 = ADC internal RC clock
0 = Clock derived from system clock
bit 14-13
Unimplemented: Read as ‘0’
bit 12-8
SAMC<4:0>: Auto Sample Time bits
11111 = 31 TAD
•
•
•
00001 = 1 TAD
00000 = 0 TAD
bit 7-6
Unimplemented: Read as ‘0’
bit 5-0
ADCS<5:0>: ADC Conversion Clock Select bits
111111 = TCY · (ADCS<7:0> + 1) = 64 · TCY = TAD
•
•
•
000010 = TCY · (ADCS<7:0> + 1) = 3 · TCY = TAD
000001 = TCY · (ADCS<7:0> + 1) = 2 · TCY = TAD
000000 = TCY · (ADCS<7:0> + 1) = 1 · TCY = TAD
© 2007 Microchip Technology Inc.
Preliminary
x = Bit is unknown
DS70264B-page 167
dsPIC33FJ12GP201/202
REGISTER 17-4:
AD1CHS123: ADC1 INPUT CHANNEL 1, 2, 3 SELECT REGISTER
U-0
U-0
U-0
U-0
U-0
—
—
—
—
—
R/W-0
R/W-0
CH123NB<1:0>
R/W-0
CH123SB
bit 15
bit 8
U-0
U-0
U-0
U-0
U-0
—
—
—
—
—
R/W-0
R/W-0
CH123NA<1:0>
R/W-0
CH123SA
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15-11
Unimplemented: Read as ‘0’
bit 10-9
CH123NB<1:0>: Channel 1, 2, 3 Negative Input Select for Sample B bits
dsPIC33FJ12GP201 devices only:
If AD12B = 1:
11 = Reserved
10 = Reserved
01 = Reserved
00 = Reserved
If AD12B = 0:
11 = Reserved
10 = Reserved
01 = CH1, CH2, CH3 negative input is VREF00 = CH1, CH2, CH3 negative input is VREFdsPIC33FJ12GP202 devices only:
If AD12B = 1:
11 = Reserved
10 = Reserved
01 = Reserved
00 = Reserved
If AD12B = 0:
11 = CH1 negative input is AN9, CH2 and CH3 negative inputs are not connected
10 = CH1 negative input is AN6, CH2 negative input is AN7, CH3 negative input is AN8
01 = CH1, CH2, CH3 negative input is VREF00 = CH1, CH2, CH3 negative input is VREF-
bit 8
CH123SB: Channel 1, 2, 3 Positive Input Select for Sample B bit
If AD12B = 1:
1 = Reserved
0 = Reserved
If AD12B = 0:
1 = CH1 positive input is AN3, CH2 positive input is AN4, CH3 positive input is AN5
0 = CH1 positive input is AN0, CH2 positive input is AN1, CH3 positive input is AN2
bit 7-3
Unimplemented: Read as ‘0’
DS70264B-page 168
Preliminary
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
REGISTER 17-4:
bit 2-1
AD1CHS123: ADC1 INPUT CHANNEL 1, 2, 3 SELECT REGISTER (CONTINUED)
CH123NA<1:0>: Channel 1, 2, 3 Negative Input Select for Sample A bits
dsPIC33FJ12GP201 devices only:
If AD12B = 1:
11 = Reserved
10 = Reserved
01 = Reserved
00 = Reserved
If AD12B = 0:
11 = Reserved
10 = Reserved
01 = CH1, CH2, CH3 negative input is VREF00 = CH1, CH2, CH3 negative input is VREFdsPIC33FJ12GP202 devices only:
If AD12B = 1:
11 = Reserved
10 = Reserved
01 = Reserved
00 = Reserved
If AD12B = 0:
11 = CH1 negative input is AN9, CH2 and CH3 negative inputs are not connected
10 = CH1 negative input is AN6, CH2 negative input is AN7, CH3 negative input is AN8
01 = CH1, CH2, CH3 negative input is VREF00 = CH1, CH2, CH3 negative input is VREF-
bit 0
CH123SA: Channel 1, 2, 3 Positive Input Select for Sample A bit
If AD12B = 1:
1 = Reserved
0 = Reserved
If AD12B = 0:
1 = CH1 positive input is AN3, CH2 positive input is AN4, CH3 positive input is AN5
0 = CH1 positive input is AN0, CH2 positive input is AN1, CH3 positive input is AN2
© 2007 Microchip Technology Inc.
Preliminary
DS70264B-page 169
dsPIC33FJ12GP201/202
REGISTER 17-5:
AD1CHS0: ADC1 INPUT CHANNEL 0 SELECT REGISTER
R/W-0
U-0
U-0
CH0NB
—
—
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
CH0SB<4:0>
bit 15
bit 8
R/W-0
U-0
U-0
CH0NA
—
—
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
CH0SA<4:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15
CH0NB: Channel 0 Negative Input Select for Sample B bit
1 = Channel 0 negative input is AN1
0 = Channel 0 negative input is VREF-
bit 14-13
Unimplemented: Read as ‘0’
bit 12-8
CH0SB<4:0>: Channel 0 Positive Input Select for Sample B bits
11111 = Channel 0 positive input is AN31
11110 = Channel 0 positive input is AN30
•
•
•
00010 = Channel 0 positive input is AN2
00001 = Channel 0 positive input is AN1
00000 = Channel 0 positive input is AN0
bit 7
CH0NA: Channel 0 Negative Input Select for Sample A bit
1 = Channel 0 negative input is AN1
0 = Channel 0 negative input is VREF-
bit 6-5
Unimplemented: Read as ‘0’
bit 4-0
CH0SA<4:0>: Channel 0 Positive Input Select for Sample A bits
dsPIC33FJ12GP201 devices only:
00101 = Channel 0 positive input is AN5
•
•
•
00010 = Channel 0 positive input is AN2
00001 = Channel 0 positive input is AN1
00000 = Channel 0 positive input is AN0
x = Bit is unknown
dsPIC33FJ12GP202 devices only:
01001 = Channel 0 positive input is AN9
•
•
•
00010 = Channel 0 positive input is AN2
00001 = Channel 0 positive input is AN1
00000 = Channel 0 positive input is AN0
DS70264B-page 170
Preliminary
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
REGISTER 17-6:
AD1CSSL: ADC1 INPUT SCAN SELECT REGISTER LOW(1,2)
U-0
U-0
U-0
U-0
U-0
U-0
R/W-0
R/W-0
—
—
—
—
—
—
CSS9
CSS8
bit 15
bit 8
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
CSS7
CSS6
CSS5
CSS4
CSS3
CSS2
CSS1
CSS0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15-10
Unimplemented: Read as ‘0’
bit 9-0
CSS<9:0>: ADC Input Scan Selection bits
1 = Select ANx for input scan
0 = Skip ANx for input scan
Note 1:
2:
x = Bit is unknown
On devices without nine analog inputs, all AD1CSSL bits can be selected. However, inputs selected for
scan without a corresponding input on device will convert ADREF-.
dsPIC33FJ12GP201 devices support only six channels (CSS0-CSS5).
REGISTER 17-7:
AD1PCFGL: ADC1 PORT CONFIGURATION REGISTER LOW(1,2)
U-0
U-0
U-0
U-0
U-0
U-0
R/W-0
R/W-0
—
—
—
—
—
—
PCFG9
PCFG8
bit 15
bit 8
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
PCFG7
PCFG6
PCFG5
PCFG4
PCFG3
PCFG2
PCFG1
PCFG0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15-10
Unimplemented: Read as ‘0’
bit 9-0
CSS<9:0>: ADC Input Scan Selection bits
1 = Select ANx for input scan
0 = Skip ANx for input scan
Note 1:
2:
x = Bit is unknown
On devices without nine analog inputs, all PCFG bits are R/W. However, PCFG bits are ignored on ports
without a corresponding input on device.
dsPIC33FJ12GP201 devices support only six channels (CSS0-CSS5).
© 2007 Microchip Technology Inc.
Preliminary
DS70264B-page 171
dsPIC33FJ12GP201/202
NOTES:
DS70264B-page 172
Preliminary
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
18.0
SPECIAL FEATURES
Note:
18.1
The Configuration bits can be programmed (read as
‘0’), or left unprogrammed (read as ‘1’), to select
various device configurations. These bits are mapped
starting at program memory location 0xF80000.
This data sheet summarizes the features
of the dsPIC33FJ12GP201/202 devices. It
is not intended to be a comprehensive
reference source. To complement the
information in this data sheet, refer to the
“dsPIC33F Family Reference Manual”.
Please see the Microchip web site
(www.microchip.com) for the latest
dsPIC33F Family Reference Manual
sections.
The Device Configuration register map is shown in
Table 18-1.
The individual Configuration bit descriptions for the
FBS, FGS, FOSCSEL, FOSC, FWDT, FPOR and FICD
Configuration registers are shown in Table 18-2.
dsPIC33FJ12GP201/202 devices include several features intended to maximize application flexibility and
reliability, and minimize cost through elimination of
external components. These are:
•
•
•
•
•
Flexible configuration
Watchdog Timer (WDT)
Code Protection and CodeGuard™ Security
JTAG Boundary Scan Interface
In-Circuit Serial Programming™ (ICSP™)
programming capability
• In-Circuit emulation
TABLE 18-1:
Address
0xF80000
Configuration Bits
Note that address 0xF80000 is beyond the user program
memory space. It belongs to the configuration memory
space (0x800000-0xFFFFFF), which can only be
accessed using table reads and table writes.
The upper byte of all device Configuration registers
should always be ‘1111 1111’. This makes them
appear to be NOP instructions in the remote event that
their locations are ever executed by accident. Since
Configuration bits are not implemented in the
corresponding locations, writing ‘1’s to these locations
has no effect on device operation.
To prevent inadvertent configuration changes during
code execution, all programmable Configuration bits
are write-once. After a bit is initially programmed during
a power cycle, it cannot be written to again. Changing
a device configuration requires that power to the device
be cycled.
DEVICE CONFIGURATION REGISTER MAP
Name
Bit 7
Bit 6
Bit 5
Bit 4
—
—
—
—
FBS
0xF80002
Reserved
0xF80004
FGS
0xF80006
FOSCSEL
0xF80008
FOSC
0xF8000A
FWDT
Bit 3
—
—
IESO
—
—
FCKSM<1:0>
—
—
—
FWDTEN
WINDIS
—
WDTPRE
—
—
—
ALTI2C
0xF8000C FPOR
—
GSS<1:0>
GWRP
OSCIOFNC POSCMD<1:0>
WDTPOST<3:0>
—
FPWRT<2:0>
Reserved(1)
Reserved
0xF80010
FUID0
User Unit ID Byte 0
0xF80012
FUID1
User Unit ID Byte 1
0xF80014
FUID2
User Unit ID Byte 2
FUID3
User Unit ID Byte 3
Note 1:
BWRP
FNOSC<2:0>
0xF8000E
0xF80016
Bit 0
(1)
—
IOL1WAY
Bit 1
BSS<2:0>
Reserved
—
Bit 2
These reserved bits read as ‘1’ and must be programmed as ‘1’.
© 2007 Microchip Technology Inc.
Preliminary
DS70264B-page 173
dsPIC33FJ12GP201/202
TABLE 18-2:
dsPIC33FJ12GP201/202 CONFIGURATION BITS DESCRIPTION
Bit Field
Register
Description
BWRP
FBS
Boot Segment Program Flash Write Protection
1 = Boot segment may be written
0 = Boot segment is write-protected
BSS<2:0>
FBS
Boot Segment Program Flash Code Protection Size
X11 = No Boot program Flash segment
Boot space is 256 Instruction Words (except interrupt vectors)
110 = Standard security; boot program Flash segment ends at 0x0003FE
010 = High security; boot program Flash segment ends at 0x0003FE
Boot space is 768 Instruction Words (except interrupt vectors)
101 = Standard security; boot program Flash segment, ends at
0x0007FE
001 = High security; boot program Flash segment ends at 0x0007FE
Boot space is 1792 Instruction Words (except interrupt vectors)
100 = Standard security; boot program Flash segment ends at 0x000FFE
000 = High security; boot program Flash segment ends at 0x000FFE
GSS<1:0>
FGS
General Segment Code-Protect bit
11 = User program memory is not code-protected
10 = Standard security
0x = High security
GWRP
FGS
General Segment Write-Protect bit
1 = User program memory is not write-protected
0 = User program memory is write-protected
IESO
FOSCSEL
Two-speed Oscillator Start-up Enable bit
1 = Start-up device with FRC, then automatically switch to the
user-selected oscillator source when ready
0 = Start-up device with user-selected oscillator source
FNOSC<2:0>
FOSCSEL
Initial Oscillator Source Selection bits
111 = Internal Fast RC (FRC) oscillator with postscaler
110 = Internal Fast RC (FRC) oscillator with divide-by-16
101 = LPRC oscillator
100 = Secondary (LP) oscillator
011 = Primary (XT, HS, EC) oscillator with PLL
010 = Primary (XT, HS, EC) oscillator
001 = Internal Fast RC (FRC) oscillator with PLL
000 = FRC oscillator
FCKSM<1:0>
FOSC
Clock Switching Mode bits
1x = Clock switching is disabled, fail-safe clock monitor is disabled
01 = Clock switching is enabled, fail-safe clock monitor is disabled
00 = Clock switching is enabled, fail-safe clock monitor is enabled
IOL1WAY
FOSC
Peripheral Pin Select Configuration
1 = Allow only one reconfiguration
0 = Allow multiple reconfigurations
OSCIOFNC
FOSC
OSC2 Pin Function bit (except in XT and HS modes)
1 = OSC2 is clock output
0 = OSC2 is general purpose digital I/O pin
POSCMD<1:0>
FOSC
Primary Oscillator Mode Select bits
11 = Primary oscillator disabled
10 = HS Crystal Oscillator mode
01 = XT Crystal Oscillator mode
00 = EC (External Clock) mode
DS70264B-page 174
Preliminary
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
TABLE 18-2:
dsPIC33FJ12GP201/202 CONFIGURATION BITS DESCRIPTION (CONTINUED)
Bit Field
Register
Description
FWDTEN
FWDT
Watchdog Timer Enable bit
1 = Watchdog Timer always enabled (LPRC oscillator cannot be disabled.
Clearing the SWDTEN bit in the RCON register will have no effect.)
0 = Watchdog Timer enabled/disabled by user software (LPRC can be
disabled by clearing the SWDTEN bit in the RCON register)
WINDIS
FWDT
Watchdog Timer Window Enable bit
1 = Watchdog Timer in Non-Window mode
0 = Watchdog Timer in Window mode
WDTPRE
FWDT
Watchdog Timer Prescaler bit
1 = 1:128
0 = 1:32
WDTPOST<3:0>
FWDT
Watchdog Timer Postscaler bits
1111 = 1:32,768
1110 = 1:16,384
.
.
.
0001 = 1:2
0000 = 1:1
ALTI2C
FPOR
Alternate I2C™ pins
1 = I2C mapped to SDA1/SCL1 pins
0 = I2C mapped to ASDA1/ASCL1 pins
FPWRT<2:0>
FPOR
Power-on Reset Timer Value Select bits
111 = PWRT = 128 ms
110 = PWRT = 64 ms
101 = PWRT = 32 ms
100 = PWRT = 16 ms
011 = PWRT = 8 ms
010 = PWRT = 4 ms
001 = PWRT = 2 ms
000 = PWRT = Disabled
© 2007 Microchip Technology Inc.
Preliminary
DS70264B-page 175
dsPIC33FJ12GP201/202
18.2
On-Chip Voltage Regulator
18.3
All of the dsPIC33FJ12GP201/202 devices power their
core digital logic at a nominal 2.5V. This can create a
conflict for designs that are required to operate at a
higher typical voltage, such as 3.3V. To simplify system
design, all devices in the dsPIC33FJ12GP201/202
family incorporate an on-chip regulator that allows the
device to run its core logic from VDD.
The regulator provides power to the core from the other
VDD pins. When the regulator is enabled, a low ESR
(less than 5 ohms) capacitor (such as tantalum or
ceramic) must be connected to the VDDCORE/VCAP pin
(Figure 18-1). This helps to maintain the stability of the
regulator. The recommended value for the filter capacitor is provided in Table 21-13 located in Section 21.1
“DC Characteristics”.
On a POR, it takes approximately 20 μs for the on-chip
voltage regulator to generate an output voltage. During
this time, designated as TSTARTUP, code execution is
disabled. TSTARTUP is applied every time the device
resumes operation after any power-down.
FIGURE 18-1:
CONNECTIONS FOR THE
ON-CHIP VOLTAGE
REGULATOR(1)
3.3V
dsPIC33F
BOR: Brown-Out Reset
The Brown-out Reset (BOR) module is based on an
internal voltage reference circuit that monitors the regulated voltage VDDCORE. The main purpose of the BOR
module is to generate a device Reset when a
brown-out condition occurs. Brown-out conditions are
generally caused by glitches on the AC mains (for
example, missing portions of the AC cycle waveform
due to bad power transmission lines, or voltage sags
due to excessive current draw when a large inductive
load is turned on).
A BOR generates a Reset pulse, which resets the
device. The BOR selects the clock source, based on
the device Configuration bit values (FNOSC<2:0> and
POSCMD<1:0>).
If an oscillator mode is selected, the BOR activates the
Oscillator Start-up Timer (OST). The system clock is
held until OST expires. If the PLL is used, the clock is
held until the LOCK bit (OSCCON<5>) is ‘1’.
Concurrently, the PWRT time-out (TPWRT) will be
applied before the internal Reset is released. If TPWRT
= 0 and a crystal oscillator is being used, a nominal
delay of TFSCM = 100 is applied. The total delay in this
case is TFSCM.
The BOR Status bit (RCON<1>) is set to indicate that a
BOR has occurred. The BOR circuit, if enabled, continues to operate while in Sleep or Idle modes and resets
the device should VDD fall below the BOR threshold
voltage.
VDD
VDDCORE/VCAP
CF
Note 1:
VSS
These are typical operating voltages. Refer
to Table 21-13 located in Section 21.1 “DC
Characteristics” for the full operating
ranges of VDD and VDDCORE.
DS70264B-page 176
Preliminary
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
18.4
Watchdog Timer (WDT)
18.4.2
For dsPIC33FJ12GP201/202 devices, the WDT is
driven by the LPRC oscillator. When the WDT is
enabled, the clock source is also enabled.
18.4.1
PRESCALER/POSTSCALER
The nominal WDT clock source from LPRC is 32 kHz.
This feeds a prescaler than can be configured for either
5-bit (divide-by-32) or 7-bit (divide-by-128) operation.
The prescaler is set by the WDTPRE Configuration bit.
With a 32 kHz input, the prescaler yields a nominal
WDT time-out period (TWDT) of 1 ms in 5-bit mode, or
4 ms in 7-bit mode.
A variable postscaler divides down the WDT prescaler
output and allows for a wide range of time-out periods.
The postscaler is controlled by the WDTPOST<3:0>
Configuration bits (FWDT<3:0>), which allow the
selection of 16 settings, from 1:1 to 1:32,768. Using the
prescaler and postscaler, time-out periods ranging from
1 ms to 131 seconds can be achieved.
The WDT, prescaler and postscaler are reset:
• On any device Reset
• On the completion of a clock switch, whether
invoked by software (i.e., setting the OSWEN bit
after changing the NOSC bits) or by hardware
(i.e., fail-safe clock monitor)
• When a PWRSAV instruction is executed
(i.e., Sleep or Idle mode is entered)
• When the device exits Sleep or Idle mode to
resume normal operation
• By a CLRWDT instruction during normal execution
Note:
If the WDT is enabled, it will continue to run during
Sleep or Idle modes. When the WDT time-out occurs,
the device will wake the device and code execution will
continue from where the PWRSAV instruction was
executed. The corresponding SLEEP or IDLE bits
(RCON<3,2>) will need to be cleared in software after
the device wakes up.
18.4.3
ENABLING WDT
The WDT is enabled or disabled by the FWDTEN
Configuration bit in the FWDT Configuration register.
When the FWDTEN Configuration bit is set, the WDT is
always enabled.
The WDT flag bit, WDTO (RCON<4>), is not automatically
cleared following a WDT time-out. To detect subsequent
WDT events, the flag must be cleared in software.
The WDT can be optionally controlled in software when
the FWDTEN Configuration bit has been programmed
to ‘0’. The WDT is enabled in software by setting the
SWDTEN control bit (RCON<5>). The SWDTEN
control bit is cleared on any device Reset. The software
WDT option allows the user application to enable the
WDT for critical code segments and disable the WDT
during non-critical segments for maximum power
savings.
Note:
The CLRWDT and PWRSAV instructions
clear the prescaler and postscaler counts
when executed.
FIGURE 18-2:
SLEEP AND IDLE MODES
If the WINDIS bit (FWDT<6>) is cleared, the
CLRWDT instruction should be executed by
the application software only during the last
1/4 of the WDT period. This CLRWDT
window can be determined by using a timer.
If a CLRWDT instruction is executed before
this window, a WDT Reset occurs.
WDT BLOCK DIAGRAM
All Device Resets
Transition to New Clock Source
Exit Sleep or Idle Mode
PWRSAV Instruction
CLRWDT Instruction
Watchdog Timer
Sleep/Idle
WDTPRE
SWDTEN
FWDTEN
WDTPOST<3:0>
RS
Prescaler
(divide by N1)
LPRC Clock
WDT
Wake-up
1
RS
Postscaler
(divide by N2)
0
WINDIS
WDT
Reset
WDT Window Select
CLRWDT Instruction
© 2007 Microchip Technology Inc.
Preliminary
DS70264B-page 177
dsPIC33FJ12GP201/202
18.5
JTAG Interface
18.8
The dsPIC33FJ12GP201/202 devices implement a
JTAG interface, which supports boundary scan device
testing, as well as in-circuit programming. Detailed
information on this interface will be provided in future
revisions of the document.
18.6
In-Circuit Serial Programming
The dsPIC33FJ12GP201/202 devices can be serially
programmed while in the end application circuit. This is
done with two lines for clock and data and three other
lines for power, ground and the programming
sequence. Serial programming allows customers to
manufacture boards with unprogrammed devices and
then program the digital signal controller just before
shipping the product. Serial programming also allows
the most recent firmware or a custom firmware to be
programmed. Refer to the “dsPIC33F Flash
Programming Specification” (DS70152) document for
details about In-Circuit Serial Programming (ICSP).
Any of the three pairs of programming clock/data pins
can be used:
• PGC1/EMUC1 and PGD1/EMUD1
• PGC2/EMUC2 and PGD2/EMUD2
• PGC3/EMUC3 and PGD3/EMUD3
18.7
Code Protection and
CodeGuard™ Security
The dsPIC33FJ12GP201/202 devices offer the
intermediate implementation of CodeGuard Security.
CodeGuard Security enables multiple parties to
securely share resources (memory, interrupts and
peripherals) on a single chip. This feature helps protect
individual Intellectual Property in collaborative system
designs.
When coupled with software encryption libraries,
CodeGuard Security can be used to securely update
Flash even when multiple IPs reside on the single chip.
The code protection features are controlled by the
Configuration registers: FBS and FGS. The Secure
Segment and RAM is not implemented.
TABLE 18-3:
CODE FLASH SECURITY
SEGMENT SIZES FOR 12K
BYTE DEVICES
CONFIG BITS
VS = 256 IW
BSS<2:0> = x11
0K
GS = 3840 IW
In-Circuit Debugger
000000h
0001FEh
000200h
0003FEh
000400h
0007FEh
000800h
000FFEh
001000h
001FFEh
®
When MPLAB ICD 2 is selected as a debugger, the
in-circuit debugging functionality is enabled. This
function allows simple debugging functions when used
with MPLAB IDE. Debugging functionality is controlled
through the EMUCx (Emulation/Debug Clock) and
EMUDx (Emulation/Debug Data) pin functions.
VS = 256 IW
BSS<2:0> = x10
256
GS = 3584 IW
Any of the three pairs of debugging clock/data pins can
be used:
• PGC1/EMUC1 and PGD1/EMUD1
• PGC2/EMUC2 and PGD2/EMUD2
• PGC3/EMUC3 and PGD3/EMUD3
001FFEh
VS = 256 IW
BSS<2:0> = x01
To use the in-circuit debugger function of the device,
the design must implement ICSP connections to
MCLR, VDD, VSS, PGC, PGD and the EMUDx/EMUCx
pin pair. In addition, when the feature is enabled, some
of the resources are not available for general use.
These resources include the first 80 bytes of data RAM
and two I/O pins.
BS = 256 IW
000000h
0001FEh
000200h
0003FEh
000400h
0007FEh
000800h
000FFEh
001000h
BS = 768 IW
768
GS = 3072 IW
000000h
0001FEh
000200h
0003FEh
000400h
0007FEh
000800h
000FFEh
001000h
001FFEh
VS = 256 IW
BSS<2:0> = x00
BS = 1792 IW
1792
GS = 2048 IW
000000h
0001FEh
000200h
0003FEh
000400h
0007FEh
000800h
000FFEh
001000h
001FFEh
Note:
DS70264B-page 178
Preliminary
Refer to Section 23. “CodeGuard™
Security” (DS70199) of the dsPIC33F
Family Reference Manual for further
information on usage, configuration and
operation of CodeGuard Security.
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
19.0
Note:
INSTRUCTION SET SUMMARY
This data sheet summarizes the features
of the dsPIC33FJ12GP201/202 devices. It
is not intended to be a comprehensive
reference source. To complement the
information in this data sheet, refer to the
“dsPIC33F Family Reference Manual”.
Please see the Microchip web site
(www.microchip.com) for the latest
dsPIC33F Family Reference Manual
sections.
The dsPIC33F instruction set is identical to that of the
dsPIC30F.
Most instructions are a single program memory word
(24 bits). Only three instructions require two program
memory locations.
Each single-word instruction is a 24-bit word, divided
into an 8-bit opcode, which specifies the instruction
type and one or more operands, which further specify
the operation of the instruction.
The instruction set is highly orthogonal and is grouped
into five basic categories:
•
•
•
•
•
Word or byte-oriented operations
Bit-oriented operations
Literal operations
DSP operations
Control operations
• The W register (with or without an address
modifier) or file register (specified by the value of
‘Ws’ or ‘f’)
• The bit in the W register or file register (specified
by a literal value or indirectly by the contents of
register ‘Wb’)
The literal instructions that involve data movement can
use some of the following operands:
• A literal value to be loaded into a W register or file
register (specified by ‘k’)
• The W register or file register where the literal
value is to be loaded (specified by ‘Wb’ or ‘f’)
However, literal instructions that involve arithmetic or
logical operations use some of the following operands:
• The first source operand, which is a register ‘Wb’
without any address modifier
• The second source operand, which is a literal
value
• The destination of the result (only if not the same
as the first source operand), which is typically a
register ‘Wd’ with or without an address modifier
The MAC class of DSP instructions can use some of the
following operands:
Table 19-1 shows the general symbols used in
describing the instructions.
The dsPIC33F instruction set summary in Table 19-2
lists all the instructions, along with the status flags
affected by each instruction.
Most word or byte-oriented W register instructions
(including barrel shift instructions) have three
operands:
• The first source operand, which is typically a
register ‘Wb’ without any address modifier
• The second source operand, which is typically a
register ‘Ws’ with or without an address modifier
• The destination of the result, which is typically a
register ‘Wd’ with or without an address modifier
• The accumulator (A or B) to be used (required
operand)
• The W registers to be used as the two operands
• The X and Y address space prefetch operations
• The X and Y address space prefetch destinations
• The accumulator write back destination
The other DSP instructions do not involve any
multiplication and can include:
• The accumulator to be used (required)
• The source or destination operand (designated as
Wso or Wdo, respectively) with or without an
address modifier
• The amount of shift specified by a W register ‘Wn’
or a literal value
The control instructions can use some of the following
operands:
However, word or byte-oriented file register instructions
have two operands:
• The file register specified by the value ‘f’
• The destination, which could be either the file
register ‘f’ or the W0 register, which is denoted as
‘WREG’
© 2007 Microchip Technology Inc.
Most bit-oriented instructions (including simple rotate/
shift instructions) have two operands:
• A program memory address
• The mode of the table read and table write
instructions
Preliminary
DS70264B-page 179
dsPIC33FJ12GP201/202
Most instructions are a single word. Certain doubleword instructions, which were designed to provide all of
the required information in these 48 bits. In the second
word, the 8 MSbs are ‘0’s. If this second word is executed as an instruction (by itself), it will execute as a
NOP. The double-word instructions execute in two
instruction cycles.
Most single-word instructions are executed in a single
instruction cycle, unless a conditional test is true, or the
program counter is changed as a result of the
instruction. In these cases, the execution takes two
instruction cycles with the additional instruction cycle(s)
executed as a NOP. Notable exceptions are the BRA
TABLE 19-1:
(unconditional/computed branch), indirect CALL/GOTO,
all table reads and writes and RETURN/RETFIE
instructions, which are single-word instructions but take
two or three cycles. Certain instructions that involve
skipping over the subsequent instruction require either
two or three cycles if the skip is performed, depending
on whether the instruction being skipped is a single-word
or two-word instruction. Moreover, double-word moves
require two cycles.
Note:
For more details on the instruction set,
refer to the “dsPIC30F/33F Programmer’s
Reference Manual” (DS70157).
SYMBOLS USED IN OPCODE DESCRIPTIONS
Field
#text
Description
Means literal defined by “text”
(text)
Means “content of text”
[text]
Means “the location addressed by text”
{ }
Optional field or operation
<n:m>
Register bit field
.b
Byte mode selection
.d
Double-Word mode selection
.S
Shadow register select
.w
Word mode selection (default)
Acc
One of two accumulators {A, B}
AWB
Accumulator write back destination address register ∈ {W13, [W13] + = 2}
bit4
4-bit bit selection field (used in word addressed instructions) ∈ {0...15}
C, DC, N, OV, Z
MCU Status bits: Carry, Digit Carry, Negative, Overflow, Sticky Zero
Expr
Absolute address, label or expression (resolved by the linker)
f
File register address ∈ {0x0000...0x1FFF}
lit1
1-bit unsigned literal ∈ {0,1}
lit4
4-bit unsigned literal ∈ {0...15}
lit5
5-bit unsigned literal ∈ {0...31}
lit8
8-bit unsigned literal ∈ {0...255}
lit10
10-bit unsigned literal ∈ {0...255} for Byte mode, {0:1023} for Word mode
lit14
14-bit unsigned literal ∈ {0...16384}
lit16
16-bit unsigned literal ∈ {0...65535}
lit23
23-bit unsigned literal ∈ {0...8388608}; LSb must be ‘0’
None
Field does not require an entry, may be blank
OA, OB, SA, SB
DSP Status bits: ACCA Overflow, ACCB Overflow, ACCA Saturate, ACCB Saturate
PC
Program Counter
Slit10
10-bit signed literal ∈ {-512...511}
Slit16
16-bit signed literal ∈ {-32768...32767}
Slit6
6-bit signed literal ∈ {-16...16}
Wb
Base W register ∈ {W0..W15}
Wd
Destination W register ∈ { Wd, [Wd], [Wd++], [Wd--], [++Wd], [--Wd] }
Wdo
Destination W register ∈
{ Wnd, [Wnd], [Wnd++], [Wnd--], [++Wnd], [--Wnd], [Wnd+Wb] }
Wm,Wn
Dividend, Divisor working register pair (direct addressing)
DS70264B-page 180
Preliminary
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
TABLE 19-1:
SYMBOLS USED IN OPCODE DESCRIPTIONS (CONTINUED)
Field
Description
Wm*Wm
Multiplicand and Multiplier working register pair for Square instructions ∈
{W4 * W4,W5 * W5,W6 * W6,W7 * W7}
Wm*Wn
Multiplicand and Multiplier working register pair for DSP instructions ∈
{W4 * W5,W4 * W6,W4 * W7,W5 * W6,W5 * W7,W6 * W7}
Wn
One of 16 working registers ∈ {W0..W15}
Wnd
One of 16 destination working registers ∈ {W0..W15}
Wns
One of 16 source working registers ∈ {W0..W15}
WREG
W0 (working register used in file register instructions)
Ws
Source W register ∈ { Ws, [Ws], [Ws++], [Ws--], [++Ws], [--Ws] }
Wso
Source W register ∈
{ Wns, [Wns], [Wns++], [Wns--], [++Wns], [--Wns], [Wns+Wb] }
Wx
X data space prefetch address register for DSP instructions
∈ {[W8] + = 6, [W8] + = 4, [W8] + = 2, [W8], [W8] - = 6, [W8] - = 4, [W8] - = 2,
[W9] + = 6, [W9] + = 4, [W9] + = 2, [W9], [W9] - = 6, [W9] - = 4, [W9] - = 2,
[W9 + W12], none}
Wxd
X data space prefetch destination register for DSP instructions ∈ {W4..W7}
Wy
Y data space prefetch address register for DSP instructions
∈ {[W10] + = 6, [W10] + = 4, [W10] + = 2, [W10], [W10] - = 6, [W10] - = 4, [W10] - = 2,
[W11] + = 6, [W11] + = 4, [W11] + = 2, [W11], [W11] - = 6, [W11] - = 4, [W11] - = 2,
[W11 + W12], none}
Wyd
Y data space prefetch destination register for DSP instructions ∈ {W4..W7}
© 2007 Microchip Technology Inc.
Preliminary
DS70264B-page 181
dsPIC33FJ12GP201/202
TABLE 19-2:
Base
Instr
#
1
2
3
4
5
6
7
8
9
INSTRUCTION SET OVERVIEW
Assembly
Mnemonic
ADD
ADDC
AND
ASR
BCLR
BRA
BSET
BSW
BTG
Assembly Syntax
Description
# of
# of
Words Cycles
Status Flags
Affected
ADD
Acc
Add Accumulators
1
1
ADD
f
f = f + WREG
1
1
C,DC,N,OV,Z
ADD
f,WREG
WREG = f + WREG
1
1
C,DC,N,OV,Z
ADD
#lit10,Wn
Wd = lit10 + Wd
1
1
C,DC,N,OV,Z
ADD
Wb,Ws,Wd
Wd = Wb + Ws
1
1
C,DC,N,OV,Z
ADD
Wb,#lit5,Wd
Wd = Wb + lit5
1
1
C,DC,N,OV,Z
ADD
Wso,#Slit4,Acc
16-bit Signed Add to Accumulator
1
1
OA,OB,SA,SB
ADDC
f
f = f + WREG + (C)
1
1
C,DC,N,OV,Z
ADDC
f,WREG
WREG = f + WREG + (C)
1
1
C,DC,N,OV,Z
ADDC
#lit10,Wn
Wd = lit10 + Wd + (C)
1
1
C,DC,N,OV,Z
ADDC
Wb,Ws,Wd
Wd = Wb + Ws + (C)
1
1
C,DC,N,OV,Z
ADDC
Wb,#lit5,Wd
Wd = Wb + lit5 + (C)
1
1
C,DC,N,OV,Z
AND
f
f = f .AND. WREG
1
1
N,Z
AND
f,WREG
WREG = f .AND. WREG
1
1
N,Z
AND
#lit10,Wn
Wd = lit10 .AND. Wd
1
1
N,Z
AND
Wb,Ws,Wd
Wd = Wb .AND. Ws
1
1
N,Z
AND
Wb,#lit5,Wd
Wd = Wb .AND. lit5
1
1
N,Z
ASR
f
f = Arithmetic Right Shift f
1
1
C,N,OV,Z
ASR
f,WREG
WREG = Arithmetic Right Shift f
1
1
C,N,OV,Z
ASR
Ws,Wd
Wd = Arithmetic Right Shift Ws
1
1
C,N,OV,Z
ASR
Wb,Wns,Wnd
Wnd = Arithmetic Right Shift Wb by Wns
1
1
N,Z
ASR
Wb,#lit5,Wnd
Wnd = Arithmetic Right Shift Wb by lit5
1
1
N,Z
BCLR
f,#bit4
Bit Clear f
1
1
None
BCLR
Ws,#bit4
Bit Clear Ws
1
1
None
BRA
C,Expr
Branch if Carry
1
1 (2)
None
BRA
GE,Expr
Branch if greater than or equal
1
1 (2)
None
BRA
GEU,Expr
Branch if unsigned greater than or equal
1
1 (2)
None
BRA
GT,Expr
Branch if greater than
1
1 (2)
None
BRA
GTU,Expr
Branch if unsigned greater than
1
1 (2)
None
BRA
LE,Expr
Branch if less than or equal
1
1 (2)
None
BRA
LEU,Expr
Branch if unsigned less than or equal
1
1 (2)
None
BRA
LT,Expr
Branch if less than
1
1 (2)
None
BRA
LTU,Expr
Branch if unsigned less than
1
1 (2)
None
BRA
N,Expr
Branch if Negative
1
1 (2)
None
BRA
NC,Expr
Branch if Not Carry
1
1 (2)
None
BRA
NN,Expr
Branch if Not Negative
1
1 (2)
None
BRA
NOV,Expr
Branch if Not Overflow
1
1 (2)
None
BRA
NZ,Expr
Branch if Not Zero
1
1 (2)
None
BRA
OA,Expr
Branch if Accumulator A overflow
1
1 (2)
None
BRA
OB,Expr
Branch if Accumulator B overflow
1
1 (2)
None
BRA
OV,Expr
Branch if Overflow
1
1 (2)
None
BRA
SA,Expr
Branch if Accumulator A saturated
1
1 (2)
None
BRA
SB,Expr
Branch if Accumulator B saturated
1
1 (2)
None
BRA
Expr
Branch Unconditionally
1
2
None
BRA
Z,Expr
Branch if Zero
1
1 (2)
None
BRA
Wn
Computed Branch
1
2
None
BSET
f,#bit4
Bit Set f
1
1
None
BSET
Ws,#bit4
Bit Set Ws
1
1
None
BSW.C
Ws,Wb
Write C bit to Ws<Wb>
1
1
None
BSW.Z
Ws,Wb
Write Z bit to Ws<Wb>
1
1
None
BTG
f,#bit4
Bit Toggle f
1
1
None
BTG
Ws,#bit4
Bit Toggle Ws
1
1
None
DS70264B-page 182
Preliminary
OA,OB,SA,SB
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
TABLE 19-2:
Base
Instr
#
10
11
12
13
Assembly
Mnemonic
BTSC
BTSS
BTST
BTSTS
14
CALL
15
CLR
16
CLRWDT
17
COM
18
19
20
INSTRUCTION SET OVERVIEW (CONTINUED)
CP
CP0
CPB
Assembly Syntax
Description
# of
# of
Words Cycles
Status Flags
Affected
BTSC
f,#bit4
Bit Test f, Skip if Clear
1
1
(2 or 3)
None
BTSC
Ws,#bit4
Bit Test Ws, Skip if Clear
1
1
(2 or 3)
None
BTSS
f,#bit4
Bit Test f, Skip if Set
1
1
(2 or 3)
None
BTSS
Ws,#bit4
Bit Test Ws, Skip if Set
1
1
(2 or 3)
None
BTST
f,#bit4
Bit Test f
1
1
Z
BTST.C
Ws,#bit4
Bit Test Ws to C
1
1
C
BTST.Z
Ws,#bit4
Bit Test Ws to Z
1
1
Z
BTST.C
Ws,Wb
Bit Test Ws<Wb> to C
1
1
C
BTST.Z
Ws,Wb
Bit Test Ws<Wb> to Z
1
1
Z
BTSTS
f,#bit4
Bit Test then Set f
1
1
Z
BTSTS.C
Ws,#bit4
Bit Test Ws to C, then Set
1
1
C
BTSTS.Z
Ws,#bit4
Bit Test Ws to Z, then Set
1
1
Z
CALL
lit23
Call subroutine
2
2
None
CALL
Wn
Call indirect subroutine
1
2
None
CLR
f
f = 0x0000
1
1
None
CLR
WREG
WREG = 0x0000
1
1
None
CLR
Ws
Ws = 0x0000
1
1
None
CLR
Acc,Wx,Wxd,Wy,Wyd,AWB
Clear Accumulator
1
1
OA,OB,SA,SB
Clear Watchdog Timer
1
1
WDTO,Sleep
CLRWDT
COM
f
f=f
1
1
N,Z
COM
f,WREG
WREG = f
1
1
N,Z
COM
Ws,Wd
Wd = Ws
1
1
N,Z
CP
f
Compare f with WREG
1
1
C,DC,N,OV,Z
CP
Wb,#lit5
Compare Wb with lit5
1
1
C,DC,N,OV,Z
CP
Wb,Ws
Compare Wb with Ws (Wb – Ws)
1
1
C,DC,N,OV,Z
CP0
f
Compare f with 0x0000
1
1
C,DC,N,OV,Z
CP0
Ws
Compare Ws with 0x0000
1
1
C,DC,N,OV,Z
CPB
f
Compare f with WREG, with Borrow
1
1
C,DC,N,OV,Z
CPB
Wb,#lit5
Compare Wb with lit5, with Borrow
1
1
C,DC,N,OV,Z
CPB
Wb,Ws
Compare Wb with Ws, with Borrow
(Wb – Ws – C)
1
1
C,DC,N,OV,Z
21
CPSEQ
CPSEQ
Wb, Wn
Compare Wb with Wn, skip if =
1
1
(2 or 3)
None
22
CPSGT
CPSGT
Wb, Wn
Compare Wb with Wn, skip if >
1
1
(2 or 3)
None
23
CPSLT
CPSLT
Wb, Wn
Compare Wb with Wn, skip if <
1
1
(2 or 3)
None
24
CPSNE
CPSNE
Wb, Wn
Compare Wb with Wn, skip if ≠
1
1
(2 or 3)
None
25
DAW
DAW
Wn
Wn = decimal adjust Wn
1
1
C
26
DEC
DEC
f
f=f–1
1
1
C,DC,N,OV,Z
DEC
f,WREG
WREG = f – 1
1
1
C,DC,N,OV,Z
DEC
Ws,Wd
Wd = Ws – 1
1
1
C,DC,N,OV,Z
DEC2
f
f=f–2
1
1
C,DC,N,OV,Z
DEC2
f,WREG
WREG = f – 2
1
1
C,DC,N,OV,Z
DEC2
Ws,Wd
Wd = Ws – 2
1
1
C,DC,N,OV,Z
DISI
#lit14
Disable Interrupts for k instruction cycles
1
1
None
27
28
DEC2
DISI
© 2007 Microchip Technology Inc.
Preliminary
DS70264B-page 183
dsPIC33FJ12GP201/202
TABLE 19-2:
Base
Instr
#
29
INSTRUCTION SET OVERVIEW (CONTINUED)
Assembly
Mnemonic
DIV
Assembly Syntax
# of
# of
Words Cycles
Description
Status Flags
Affected
DIV.S
Wm,Wn
Signed 16/16-bit Integer Divide
1
18
N,Z,C,OV
DIV.SD
Wm,Wn
Signed 32/16-bit Integer Divide
1
18
N,Z,C,OV
DIV.U
Wm,Wn
Unsigned 16/16-bit Integer Divide
1
18
N,Z,C,OV
DIV.UD
Wm,Wn
Unsigned 32/16-bit Integer Divide
1
18
N,Z,C,OV
Signed 16/16-bit Fractional Divide
1
18
N,Z,C,OV
None
30
DIVF
DIVF
31
DO
DO
#lit14,Expr
Do code to PC + Expr, lit14 + 1 times
2
2
DO
Wn,Expr
Do code to PC + Expr, (Wn) + 1 times
2
2
None
Wm,Wn
32
ED
ED
Wm*Wm,Acc,Wx,Wy,Wxd
Euclidean Distance (no accumulate)
1
1
OA,OB,OAB,
SA,SB,SAB
33
EDAC
EDAC
Wm*Wm,Acc,Wx,Wy,Wxd
Euclidean Distance
1
1
OA,OB,OAB,
SA,SB,SAB
34
EXCH
EXCH
Wns,Wnd
Swap Wns with Wnd
1
1
None
35
FBCL
FBCL
Ws,Wnd
Find Bit Change from Left (MSb) Side
1
1
C
36
FF1L
FF1L
Ws,Wnd
Find First One from Left (MSb) Side
1
1
C
37
FF1R
FF1R
Ws,Wnd
Find First One from Right (LSb) Side
1
1
C
38
GOTO
GOTO
Expr
Go to address
2
2
None
GOTO
Wn
Go to indirect
1
2
None
INC
f
f=f+1
1
1
C,DC,N,OV,Z
INC
f,WREG
WREG = f + 1
1
1
C,DC,N,OV,Z
INC
Ws,Wd
Wd = Ws + 1
1
1
C,DC,N,OV,Z
INC2
f
f=f+2
1
1
C,DC,N,OV,Z
INC2
f,WREG
WREG = f + 2
1
1
C,DC,N,OV,Z
INC2
Ws,Wd
Wd = Ws + 2
1
1
C,DC,N,OV,Z
IOR
f
f = f .IOR. WREG
1
1
N,Z
IOR
f,WREG
WREG = f .IOR. WREG
1
1
N,Z
IOR
#lit10,Wn
Wd = lit10 .IOR. Wd
1
1
N,Z
IOR
Wb,Ws,Wd
Wd = Wb .IOR. Ws
1
1
N,Z
39
40
41
INC
INC2
IOR
IOR
Wb,#lit5,Wd
Wd = Wb .IOR. lit5
1
1
N,Z
LAC
LAC
Wso,#Slit4,Acc
Load Accumulator
1
1
OA,OB,OAB,
SA,SB,SAB
43
LNK
LNK
#lit14
Link Frame Pointer
1
1
None
44
LSR
LSR
f
f = Logical Right Shift f
1
1
C,N,OV,Z
LSR
f,WREG
WREG = Logical Right Shift f
1
1
C,N,OV,Z
LSR
Ws,Wd
Wd = Logical Right Shift Ws
1
1
C,N,OV,Z
LSR
Wb,Wns,Wnd
Wnd = Logical Right Shift Wb by Wns
1
1
N,Z
LSR
Wb,#lit5,Wnd
Wnd = Logical Right Shift Wb by lit5
1
1
N,Z
MAC
Wm*Wn,Acc,Wx,Wxd,Wy,Wyd
,
AWB
Multiply and Accumulate
1
1
OA,OB,OAB,
SA,SB,SAB
MAC
Wm*Wm,Acc,Wx,Wxd,Wy,Wyd
Square and Accumulate
1
1
OA,OB,OAB,
SA,SB,SAB
MOV
f,Wn
Move f to Wn
1
1
None
MOV
f
Move f to f
1
1
N,Z
MOV
f,WREG
Move f to WREG
1
1
N,Z
MOV
#lit16,Wn
Move 16-bit literal to Wn
1
1
None
MOV.b
#lit8,Wn
Move 8-bit literal to Wn
1
1
None
MOV
Wn,f
Move Wn to f
1
1
None
MOV
Wso,Wdo
Move Ws to Wd
1
1
None
MOV
WREG,f
Move WREG to f
1
1
N,Z
Wns,Wd
Move Double from W(ns):W(ns + 1) to Wd
1
2
None
Ws,Wnd
Move Double from Ws to W(nd + 1):W(nd)
1
2
None
Prefetch and store accumulator
1
1
None
42
45
46
MAC
MOV
MOV.D
MOV.D
47
MOVSAC
MOVSAC
DS70264B-page 184
Acc,Wx,Wxd,Wy,Wyd,AWB
Preliminary
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
TABLE 19-2:
Base
Instr
#
48
INSTRUCTION SET OVERVIEW (CONTINUED)
Assembly
Mnemonic
MPY
Assembly Syntax
Description
# of
# of
Words Cycles
Status Flags
Affected
MPY
Wm*Wn,Acc,Wx,Wxd,Wy,Wyd
Multiply Wm by Wn to Accumulator
1
1
OA,OB,OAB,
SA,SB,SAB
MPY
Wm*Wm,Acc,Wx,Wxd,Wy,Wyd
Square Wm to Accumulator
1
1
OA,OB,OAB,
SA,SB,SAB
49
MPY.N
MPY.N
Wm*Wn,Acc,Wx,Wxd,Wy,Wyd
-(Multiply Wm by Wn) to Accumulator
1
1
None
50
MSC
MSC
Wm*Wm,Acc,Wx,Wxd,Wy,Wyd
,
AWB
Multiply and Subtract from Accumulator
1
1
OA,OB,OAB,
SA,SB,SAB
51
MUL
MUL.SS
Wb,Ws,Wnd
{Wnd + 1, Wnd} = signed(Wb) * signed(Ws)
1
1
None
MUL.SU
Wb,Ws,Wnd
{Wnd + 1, Wnd} = signed(Wb) * unsigned(Ws)
1
1
None
MUL.US
Wb,Ws,Wnd
{Wnd + 1, Wnd} = unsigned(Wb) * signed(Ws)
1
1
None
MUL.UU
Wb,Ws,Wnd
{Wnd + 1, Wnd} = unsigned(Wb) *
unsigned(Ws)
1
1
None
MUL.SU
Wb,#lit5,Wnd
{Wnd + 1, Wnd} = signed(Wb) * unsigned(lit5)
1
1
None
MUL.UU
Wb,#lit5,Wnd
{Wnd + 1, Wnd} = unsigned(Wb) *
unsigned(lit5)
1
1
None
MUL
f
W3:W2 = f * WREG
1
1
None
NEG
Acc
Negate Accumulator
1
1
OA,OB,OAB,
SA,SB,SAB
52
53
54
NEG
NOP
POP
NEG
f
f=f+1
1
1
C,DC,N,OV,Z
NEG
f,WREG
WREG = f + 1
1
1
C,DC,N,OV,Z
NEG
Ws,Wd
Wd = Ws + 1
1
1
C,DC,N,OV,Z
NOP
No Operation
1
1
None
NOPR
No Operation
1
1
None
None
POP
f
Pop f from Top-of-Stack (TOS)
1
1
POP
Wdo
Pop from Top-of-Stack (TOS) to Wdo
1
1
None
POP.D
Wnd
Pop from Top-of-Stack (TOS) to
W(nd):W(nd + 1)
1
2
None
Pop Shadow Registers
1
1
All
f
Push f to Top-of-Stack (TOS)
1
1
None
PUSH
Wso
Push Wso to Top-of-Stack (TOS)
1
1
None
PUSH.D
Wns
Push W(ns):W(ns + 1) to Top-of-Stack (TOS)
1
2
None
Push Shadow Registers
1
1
None
Go into Sleep or Idle mode
1
1
WDTO,Sleep
POP.S
55
PUSH
PUSH
PUSH.S
56
PWRSAV
PWRSAV
57
RCALL
RCALL
Expr
Relative Call
1
2
None
RCALL
Wn
Computed Call
1
2
None
REPEAT
#lit14
Repeat Next Instruction lit14 + 1 times
1
1
None
REPEAT
Wn
Repeat Next Instruction (Wn) + 1 times
1
1
None
None
58
REPEAT
#lit1
59
RESET
RESET
Software device Reset
1
1
60
RETFIE
RETFIE
Return from interrupt
1
3 (2)
None
61
RETLW
RETLW
Return with literal in Wn
1
3 (2)
None
62
RETURN
RETURN
Return from Subroutine
1
3 (2)
None
63
RLC
RLC
f
f = Rotate Left through Carry f
1
1
C,N,Z
RLC
f,WREG
WREG = Rotate Left through Carry f
1
1
C,N,Z
RLC
Ws,Wd
Wd = Rotate Left through Carry Ws
1
1
C,N,Z
RLNC
f
f = Rotate Left (No Carry) f
1
1
N,Z
RLNC
f,WREG
WREG = Rotate Left (No Carry) f
1
1
N,Z
RLNC
Ws,Wd
Wd = Rotate Left (No Carry) Ws
1
1
N,Z
RRC
f
f = Rotate Right through Carry f
1
1
C,N,Z
RRC
f,WREG
WREG = Rotate Right through Carry f
1
1
C,N,Z
RRC
Ws,Wd
Wd = Rotate Right through Carry Ws
1
1
C,N,Z
64
65
RLNC
RRC
#lit10,Wn
© 2007 Microchip Technology Inc.
Preliminary
DS70264B-page 185
dsPIC33FJ12GP201/202
TABLE 19-2:
Base
Instr
#
66
INSTRUCTION SET OVERVIEW (CONTINUED)
Assembly
Mnemonic
RRNC
Assembly Syntax
Description
# of
# of
Words Cycles
Status Flags
Affected
RRNC
f
f = Rotate Right (No Carry) f
1
1
N,Z
RRNC
f,WREG
WREG = Rotate Right (No Carry) f
1
1
N,Z
RRNC
Ws,Wd
Wd = Rotate Right (No Carry) Ws
1
1
N,Z
SAC
Acc,#Slit4,Wdo
Store Accumulator
1
1
None
67
SAC
SAC.R
Acc,#Slit4,Wdo
Store Rounded Accumulator
1
1
None
68
SE
SE
Ws,Wnd
Wnd = sign-extended Ws
1
1
C,N,Z
69
SETM
SETM
f
f = 0xFFFF
1
1
None
SETM
WREG
WREG = 0xFFFF
1
1
None
SETM
Ws
Ws = 0xFFFF
1
1
None
SFTAC
Acc,Wn
Arithmetic Shift Accumulator by (Wn)
1
1
OA,OB,OAB,
SA,SB,SAB
SFTAC
Acc,#Slit6
Arithmetic Shift Accumulator by Slit6
1
1
OA,OB,OAB,
SA,SB,SAB
SL
f
f = Left Shift f
1
1
C,N,OV,Z
SL
f,WREG
WREG = Left Shift f
1
1
C,N,OV,Z
SL
Ws,Wd
Wd = Left Shift Ws
1
1
C,N,OV,Z
SL
Wb,Wns,Wnd
Wnd = Left Shift Wb by Wns
1
1
N,Z
SL
Wb,#lit5,Wnd
Wnd = Left Shift Wb by lit5
1
1
N,Z
SUB
Acc
Subtract Accumulators
1
1
OA,OB,OAB,
SA,SB,SAB
SUB
f
f = f – WREG
1
1
C,DC,N,OV,Z
SUB
f,WREG
WREG = f – WREG
1
1
C,DC,N,OV,Z
SUB
#lit10,Wn
Wn = Wn – lit10
1
1
C,DC,N,OV,Z
SUB
Wb,Ws,Wd
Wd = Wb – Ws
1
1
C,DC,N,OV,Z
SUB
Wb,#lit5,Wd
Wd = Wb – lit5
1
1
C,DC,N,OV,Z
C,DC,N,OV,Z
70
71
72
73
74
75
76
SFTAC
SL
SUB
SUBB
SUBR
SUBBR
SWAP
SUBB
f
f = f – WREG – (C)
1
1
SUBB
f,WREG
WREG = f – WREG – (C)
1
1
C,DC,N,OV,Z
SUBB
#lit10,Wn
Wn = Wn – lit10 – (C)
1
1
C,DC,N,OV,Z
SUBB
Wb,Ws,Wd
Wd = Wb – Ws – (C)
1
1
C,DC,N,OV,Z
SUBB
Wb,#lit5,Wd
Wd = Wb – lit5 – (C)
1
1
SUBR
f
f = WREG – f
1
1
C,DC,N,OV,Z
SUBR
f,WREG
WREG = WREG – f
1
1
C,DC,N,OV,Z
SUBR
Wb,Ws,Wd
Wd = Ws – Wb
1
1
C,DC,N,OV,Z
SUBR
Wb,#lit5,Wd
Wd = lit5 – Wb
1
1
C,DC,N,OV,Z
C,DC,N,OV,Z
C,DC,N,OV,Z
SUBBR
f
f = WREG – f – (C)
1
1
SUBBR
f,WREG
WREG = WREG – f – (C)
1
1
C,DC,N,OV,Z
SUBBR
Wb,Ws,Wd
Wd = Ws – Wb – (C)
1
1
C,DC,N,OV,Z
SUBBR
Wb,#lit5,Wd
Wd = lit5 – Wb – (C)
1
1
C,DC,N,OV,Z
SWAP.b
Wn
Wn = nibble swap Wn
1
1
None
SWAP
Wn
Wn = byte swap Wn
1
1
None
None
77
TBLRDH
TBLRDH
Ws,Wd
Read Prog<23:16> to Wd<7:0>
1
2
78
TBLRDL
TBLRDL
Ws,Wd
Read Prog<15:0> to Wd
1
2
None
79
TBLWTH
TBLWTH
Ws,Wd
Write Ws<7:0> to Prog<23:16>
1
2
None
80
TBLWTL
TBLWTL
Ws,Wd
Write Ws to Prog<15:0>
1
2
None
81
ULNK
ULNK
Unlink Frame Pointer
1
1
None
82
XOR
XOR
f
f = f .XOR. WREG
1
1
N,Z
XOR
f,WREG
WREG = f .XOR. WREG
1
1
N,Z
XOR
#lit10,Wn
Wd = lit10 .XOR. Wd
1
1
N,Z
XOR
Wb,Ws,Wd
Wd = Wb .XOR. Ws
1
1
N,Z
XOR
Wb,#lit5,Wd
Wd = Wb .XOR. lit5
1
1
N,Z
ZE
Ws,Wnd
Wnd = Zero-extend Ws
1
1
C,Z,N
83
ZE
DS70264B-page 186
Preliminary
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
20.0
DEVELOPMENT SUPPORT
20.1
The PIC® microcontrollers are supported with a full
range of hardware and software development tools:
• Integrated Development Environment
- MPLAB® IDE Software
• Assemblers/Compilers/Linkers
- MPASMTM Assembler
- MPLAB C18 and MPLAB C30 C Compilers
- MPLINKTM Object Linker/
MPLIBTM Object Librarian
- MPLAB ASM30 Assembler/Linker/Library
• Simulators
- MPLAB SIM Software Simulator
• Emulators
- MPLAB ICE 2000 In-Circuit Emulator
- MPLAB REAL ICE™ In-Circuit Emulator
• In-Circuit Debugger
- MPLAB ICD 2
• Device Programmers
- PICSTART® Plus Development Programmer
- MPLAB PM3 Device Programmer
- PICkit™ 2 Development Programmer
• Low-Cost Demonstration and Development
Boards and Evaluation Kits
MPLAB Integrated Development
Environment Software
The MPLAB IDE software brings an ease of software
development previously unseen in the 8/16-bit microcontroller market. The MPLAB IDE is a Windows®
operating system-based application that contains:
• A single graphical interface to all debugging tools
- Simulator
- Programmer (sold separately)
- Emulator (sold separately)
- In-Circuit Debugger (sold separately)
• A full-featured editor with color-coded context
• A multiple project manager
• Customizable data windows with direct edit of
contents
• High-level source code debugging
• Visual device initializer for easy register
initialization
• Mouse over variable inspection
• Drag and drop variables from source to watch
windows
• Extensive on-line help
• Integration of select third party tools, such as
HI-TECH Software C Compilers and IAR
C Compilers
The MPLAB IDE allows you to:
• Edit your source files (either assembly or C)
• One touch assemble (or compile) and download
to PIC MCU emulator and simulator tools
(automatically updates all project information)
• Debug using:
- Source files (assembly or C)
- Mixed assembly and C
- Machine code
MPLAB IDE supports multiple debugging tools in a
single development paradigm, from the cost-effective
simulators, through low-cost in-circuit debuggers, to
full-featured emulators. This eliminates the learning
curve when upgrading to tools with increased flexibility
and power.
© 2007 Microchip Technology Inc.
Preliminary
DS70264B-page 187
dsPIC33FJ12GP201/202
20.2
MPASM Assembler
20.5
The MPASM Assembler is a full-featured, universal
macro assembler for all PIC MCUs.
The MPASM Assembler generates relocatable object
files for the MPLINK Object Linker, Intel® standard HEX
files, MAP files to detail memory usage and symbol
reference, absolute LST files that contain source lines
and generated machine code and COFF files for
debugging.
The MPASM Assembler features include:
20.3
Support for the entire dsPIC30F instruction set
Support for fixed-point and floating-point data
Command line interface
Rich directive set
Flexible macro language
MPLAB IDE compatibility
20.6
MPLAB C18 and MPLAB C30
C Compilers
The MPLAB C18 and MPLAB C30 Code Development
Systems are complete ANSI C compilers for
Microchip’s PIC18 and PIC24 families of microcontrollers and the dsPIC30 and dsPIC33 family of digital signal controllers. These compilers provide powerful
integration capabilities, superior code optimization and
ease of use not found with other compilers.
For easy source level debugging, the compilers provide
symbol information that is optimized to the MPLAB IDE
debugger.
20.4
MPLAB ASM30 Assembler produces relocatable
machine code from symbolic assembly language for
dsPIC30F devices. MPLAB C30 C Compiler uses the
assembler to produce its object file. The assembler
generates relocatable object files that can then be
archived or linked with other relocatable object files and
archives to create an executable file. Notable features
of the assembler include:
•
•
•
•
•
•
• Integration into MPLAB IDE projects
• User-defined macros to streamline
assembly code
• Conditional assembly for multi-purpose
source files
• Directives that allow complete control over the
assembly process
MPLINK Object Linker/
MPLIB Object Librarian
The MPLINK Object Linker combines relocatable
objects created by the MPASM Assembler and the
MPLAB C18 C Compiler. It can link relocatable objects
from precompiled libraries, using directives from a
linker script.
MPLAB ASM30 Assembler, Linker
and Librarian
MPLAB SIM Software Simulator
The MPLAB SIM Software Simulator allows code
development in a PC-hosted environment by simulating the PIC MCUs and dsPIC® DSCs on an instruction
level. On any given instruction, the data areas can be
examined or modified and stimuli can be applied from
a comprehensive stimulus controller. Registers can be
logged to files for further run-time analysis. The trace
buffer and logic analyzer display extend the power of
the simulator to record and track program execution,
actions on I/O, most peripherals and internal registers.
The MPLAB SIM Software Simulator fully supports
symbolic debugging using the MPLAB C18 and
MPLAB C30 C Compilers, and the MPASM and
MPLAB ASM30 Assemblers. The software simulator
offers the flexibility to develop and debug code outside
of the hardware laboratory environment, making it an
excellent, economical software development tool.
The MPLIB Object Librarian manages the creation and
modification of library files of precompiled code. When
a routine from a library is called from a source file, only
the modules that contain that routine will be linked in
with the application. This allows large libraries to be
used efficiently in many different applications.
The object linker/library features include:
• Efficient linking of single libraries instead of many
smaller files
• Enhanced code maintainability by grouping
related modules together
• Flexible creation of libraries with easy module
listing, replacement, deletion and extraction
DS70264B-page 188
Preliminary
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
20.7
MPLAB ICE 2000
High-Performance
In-Circuit Emulator
20.9
The MPLAB ICE 2000 In-Circuit Emulator is intended
to provide the product development engineer with a
complete microcontroller design tool set for PIC
microcontrollers. Software control of the MPLAB ICE
2000 In-Circuit Emulator is advanced by the MPLAB
Integrated Development Environment, which allows
editing, building, downloading and source debugging
from a single environment.
The MPLAB ICE 2000 is a full-featured emulator
system with enhanced trace, trigger and data monitoring features. Interchangeable processor modules allow
the system to be easily reconfigured for emulation of
different processors. The architecture of the MPLAB
ICE 2000 In-Circuit Emulator allows expansion to
support new PIC microcontrollers.
The MPLAB ICE 2000 In-Circuit Emulator system has
been designed as a real-time emulation system with
advanced features that are typically found on more
expensive development tools. The PC platform and
Microsoft® Windows® 32-bit operating system were
chosen to best make these features available in a
simple, unified application.
20.8
MPLAB REAL ICE In-Circuit
Emulator System
MPLAB REAL ICE In-Circuit Emulator System is
Microchip’s next generation high-speed emulator for
Microchip Flash DSC® and MCU devices. It debugs and
programs PIC® and dsPIC® Flash microcontrollers with
the easy-to-use, powerful graphical user interface of the
MPLAB Integrated Development Environment (IDE),
included with each kit.
The MPLAB REAL ICE probe is connected to the design
engineer’s PC using a high-speed USB 2.0 interface and
is connected to the target with either a connector
compatible with the popular MPLAB ICD 2 system
(RJ11) or with the new high speed, noise tolerant, lowvoltage differential signal (LVDS) interconnection
(CAT5).
MPLAB ICD 2 In-Circuit Debugger
Microchip’s In-Circuit Debugger, MPLAB ICD 2, is a
powerful, low-cost, run-time development tool,
connecting to the host PC via an RS-232 or high-speed
USB interface. This tool is based on the Flash PIC
MCUs and can be used to develop for these and other
PIC MCUs and dsPIC DSCs. The MPLAB ICD 2 utilizes
the in-circuit debugging capability built into the Flash
devices. This feature, along with Microchip’s In-Circuit
Serial ProgrammingTM (ICSPTM) protocol, offers costeffective, in-circuit Flash debugging from the graphical
user interface of the MPLAB Integrated Development
Environment. This enables a designer to develop and
debug source code by setting breakpoints, single stepping and watching variables, and CPU status and
peripheral registers. Running at full speed enables
testing hardware and applications in real time. MPLAB
ICD 2 also serves as a development programmer for
selected PIC devices.
20.10 MPLAB PM3 Device Programmer
The MPLAB PM3 Device Programmer is a universal,
CE compliant device programmer with programmable
voltage verification at VDDMIN and VDDMAX for
maximum reliability. It features a large LCD display
(128 x 64) for menus and error messages and a modular, detachable socket assembly to support various
package types. The ICSP™ cable assembly is included
as a standard item. In Stand-Alone mode, the MPLAB
PM3 Device Programmer can read, verify and program
PIC devices without a PC connection. It can also set
code protection in this mode. The MPLAB PM3
connects to the host PC via an RS-232 or USB cable.
The MPLAB PM3 has high-speed communications and
optimized algorithms for quick programming of large
memory devices and incorporates an SD/MMC card for
file storage and secure data applications.
MPLAB REAL ICE is field upgradeable through future
firmware downloads in MPLAB IDE. In upcoming
releases of MPLAB IDE, new devices will be supported,
and new features will be added, such as software breakpoints and assembly code trace. MPLAB REAL ICE
offers significant advantages over competitive emulators
including low-cost, full-speed emulation, real-time
variable watches, trace analysis, complex breakpoints, a
ruggedized probe interface and long (up to three meters)
interconnection cables.
© 2007 Microchip Technology Inc.
Preliminary
DS70264B-page 189
dsPIC33FJ12GP201/202
20.11 PICSTART Plus Development
Programmer
20.13 Demonstration, Development and
Evaluation Boards
The PICSTART Plus Development Programmer is an
easy-to-use, low-cost, prototype programmer. It
connects to the PC via a COM (RS-232) port. MPLAB
Integrated Development Environment software makes
using the programmer simple and efficient. The
PICSTART Plus Development Programmer supports
most PIC devices in DIP packages up to 40 pins.
Larger pin count devices, such as the PIC16C92X and
PIC17C76X, may be supported with an adapter socket.
The PICSTART Plus Development Programmer is CE
compliant.
A wide variety of demonstration, development and
evaluation boards for various PIC MCUs and dsPIC
DSCs allows quick application development on fully functional systems. Most boards include prototyping areas for
adding custom circuitry and provide application firmware
and source code for examination and modification.
20.12 PICkit 2 Development Programmer
The PICkit™ 2 Development Programmer is a low-cost
programmer and selected Flash device debugger with
an easy-to-use interface for programming many of
Microchip’s baseline, mid-range and PIC18F families of
Flash memory microcontrollers. The PICkit 2 Starter Kit
includes a prototyping development board, twelve
sequential lessons, software and HI-TECH’s PICC™
Lite C compiler, and is designed to help get up to speed
quickly using PIC® microcontrollers. The kit provides
everything needed to program, evaluate and develop
applications using Microchip’s powerful, mid-range
Flash memory family of microcontrollers.
DS70264B-page 190
The boards support a variety of features, including LEDs,
temperature sensors, switches, speakers, RS-232
interfaces, LCD displays, potentiometers and additional
EEPROM memory.
The demonstration and development boards can be
used in teaching environments, for prototyping custom
circuits and for learning about various microcontroller
applications.
In addition to the PICDEM™ and dsPICDEM™ demonstration/development board series of circuits, Microchip
has a line of evaluation kits and demonstration software
for analog filter design, KEELOQ® security ICs, CAN,
IrDA®, PowerSmart® battery management, SEEVAL®
evaluation system, Sigma-Delta ADC, flow rate
sensing, plus many more.
Check the Microchip web page (www.microchip.com)
and the latest “Product Selector Guide” (DS00148) for
the complete list of demonstration, development and
evaluation kits.
Preliminary
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
21.0
ELECTRICAL CHARACTERISTICS
This section provides an overview of dsPIC33FJ12GP201/202 electrical characteristics. Additional information will be
provided in future revisions of this document as it becomes available.
Absolute maximum ratings for the dsPIC33FJ12GP201/202 family are listed below. Exposure to these maximum rating
conditions for extended periods can affect device reliability. Functional operation of the device at these or any other
conditions above the parameters indicated in the operation listings of this specification is not implied.
Absolute Maximum Ratings(1)
Ambient temperature under bias.............................................................................................................-40°C to +125°C
Storage temperature .............................................................................................................................. -65°C to +150°C
Voltage on VDD with respect to VSS ......................................................................................................... -0.3V to +4.0V
Voltage on any combined analog and digital pin and MCLR, with respect to VSS ......................... -0.3V to (VDD + 0.3V)
Voltage on any digital-only pin with respect to VSS .................................................................................. -0.3V to +5.6V
Voltage on VDDCORE with respect to VSS ................................................................................................ 2.25V to 2.75V
Maximum current out of VSS pin ...........................................................................................................................300 mA
Maximum current into VDD pin(2) ...........................................................................................................................250 mA
Maximum output current sunk by any I/O pin(3) ........................................................................................................4 mA
Maximum output current sourced by any I/O pin(3) ...................................................................................................4 mA
Maximum current sunk by all ports .......................................................................................................................200 mA
Maximum current sourced by all ports(2) ...............................................................................................................200 mA
Note 1: Stresses above those listed under “Absolute Maximum Ratings” can cause permanent damage to the
device. This is a stress rating only, and functional operation of the device at those or any other conditions
above those indicated in the operation listings of this specification is not implied. Exposure to maximum
rating conditions for extended periods can affect device reliability.
2: Maximum allowable current is a function of device maximum power dissipation (see Table 21-2).
3: Exceptions are CLKOUT, which is able to sink/source 25 mA, and the VREF+, VREF-, SCLx, SDAx, PGCx
and PGDx pins, which are able to sink/source 12 mA.
© 2007 Microchip Technology Inc.
Preliminary
DS70264B-page 191
dsPIC33FJ12GP201/202
21.1
DC Characteristics
TABLE 21-1:
OPERATING MIPS VS. VOLTAGE
VDD Range
(in Volts)
Characteristic
TABLE 21-2:
Max MIPS
Temp Range
(in °C)
dsPIC33FJ12GP201/202
3.0-3.6V
-40°C to +85°C
40
3.0-3.6V
-40°C to +125°C
35
THERMAL OPERATING CONDITIONS
Rating
Symbol
Min
Typ
Max
Unit
Operating Junction Temperature Range
TJ
-40
—
+125
°C
Operating Ambient Temperature Range
TA
-40
—
+85
°C
Operating Junction Temperature Range
TJ
-40
—
+140
°C
Operating Ambient Temperature Range
TA
-40
—
+125
°C
Industrial Temperature Devices
Extended Temperature Devices
Power Dissipation:
Internal chip power dissipation:
PINT = VDD x (IDD – Σ IOH)
PD
PINT + PI/O
W
PDMAX
(TJ – TA)/θJA
W
I/O Pin Power Dissipation:
I/O = Σ ({VDD – VOH} x IOH) + Σ (VOL x IOL)
Maximum Allowed Power Dissipation
TABLE 21-3:
THERMAL PACKAGING CHARACTERISTICS
Characteristic
Package Thermal Resistance, 18-pin PDIP
Package Thermal Resistance, 28-pin SPDIP
Package Thermal Resistance, 18-pin SOIC
Package Thermal Resistance, 28-pin SOIC
Package Thermal Resistance, 28-pin QFN
Note 1:
Symbol
Typ
Max
Unit
Notes
θJA
θJA
θJA
θJA
θJA
66
—
°C/W
1
60
—
°C/W
1
63.6
—
°C/W
1
80.2
—
°C/W
1
32
—
°C/W
1
Junction to ambient thermal resistance, Theta-JA (θJA) numbers are achieved by package simulations.
DS70264B-page 192
Preliminary
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
TABLE 21-4:
DC TEMPERATURE AND VOLTAGE SPECIFICATIONS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
DC CHARACTERISTICS
Param
Symbol
No.
Characteristic
Min
Typ(1)
Max
Units
3.0
—
3.6
V
Conditions
Operating Voltage
DC10
Supply Voltage
VDD
(2)
DC12
VDR
RAM Data Retention Voltage
1.1
1.3
1.8
V
DC16
VPOR
VDD Start Voltage
to ensure internal
Power-on Reset signal
—
—
VSS
V
DC17
SVDD
VDD Rise Rate
to ensure internal
Power-on Reset signal
0.03
—
—
DC18
VCORE
VDD Core(3)
Internal regulator voltage
2.25
—
2.75
Note 1:
2:
3:
Industrial and Extended
V/ms 0-3.0V in 0.1s
V
Voltage is dependent on
load, temperature and
VDD
Data in “Typ” column is at 3.3V, 25°C unless otherwise stated.
This is the limit to which VDD can be lowered without losing RAM data.
These parameters are characterized but not tested in manufacturing.
© 2007 Microchip Technology Inc.
Preliminary
DS70264B-page 193
dsPIC33FJ12GP201/202
TABLE 21-5:
DC CHARACTERISTICS: OPERATING CURRENT (IDD)
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
DC CHARACTERISTICS
Parameter
No.
Typical(1)
Max
Units
Conditions
Operating Current (IDD)(2)
DC20d
24
30
mA
-40°C
DC20a
27
30
mA
+25°C
DC20b
27
30
mA
+85°C
DC20c
27
35
mA
+125°C
DC21d
30
40
mA
-40°C
DC21a
31
40
mA
+25°C
DC21b
32
45
mA
+85°C
DC21c
33
45
mA
+125°C
DC22d
35
50
mA
-40°C
DC22a
38
50
mA
+25°C
DC22b
38
55
mA
+85°C
DC22c
39
55
mA
+125°C
DC23d
47
70
mA
-40°C
DC23a
48
70
mA
+25°C
DC23b
48
70
mA
+85°C
DC23c
48
70
mA
+125°C
DC24d
56
90
mA
-40°C
DC24a
56
90
mA
+25°C
DC24b
54
90
mA
+85°C
DC24c
54
80
mA
+125°C
Note 1:
2:
3.3V
10 MIPS
3.3V
16 MIPS
3.3V
20 MIPS
3.3V
30 MIPS
3.3V
40 MIPS
3.3V
35 MIPS
Data in “Typical” column is at 3.3V, 25°C unless otherwise stated.
The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O
pin loading and switching rate, oscillator type, internal code execution pattern and temperature, also have
an impact on the current consumption. The test conditions for all IDD measurements are as follows: OSC1
driven with external square wave from rail to rail. All I/O pins are configured as inputs and pulled to VSS.
MCLR = VDD, WDT and FSCM are disabled. CPU, SRAM, program memory and data memory are
operational. No peripheral modules are operating; however, every peripheral is being clocked (PMD bits
are all zeroed).
DS70264B-page 194
Preliminary
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
TABLE 21-6:
DC CHARACTERISTICS: IDLE CURRENT (IIDLE)
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
DC CHARACTERISTICS
Parameter
No.
Typical(1)
Max
Units
Conditions
Idle Current (IIDLE): Core OFF Clock ON Base Current(2)
DC40d
3
25
mA
-40°C
DC40a
3
25
mA
+25°C
DC40b
3
25
mA
+85°C
DC40c
3
25
mA
+125°C
DC41d
4
25
mA
-40°C
DC41a
4
25
mA
+25°C
DC41b
5
25
mA
+85°C
DC41c
5
25
mA
125°C
DC42d
6
25
mA
-40°C
DC42a
6
25
mA
+25°C
DC42b
7
25
mA
+85°C
DC42c
7
25
mA
+125°C
DC43d
9
25
mA
-40°C
DC43a
9
25
mA
+25°C
DC43b
9
25
mA
+85°C
DC43c
9
25
mA
+125°C
DC44d
10
25
mA
-40°C
DC44a
10
25
mA
+25°C
DC44b
10
25
mA
+85°C
DC44c
10
25
mA
+125°C
Note 1:
2:
3.3V
10 MIPS
3.3V
16 MIPS
3.3V
20 MIPS
3.3V
30 MIPS
3.3V
40 MIPS
3.3V
35 MIPS
Data in “Typical” column is at 3.3V, 25°C unless otherwise stated.
Base IIDLE current is measured with core off, clock on and all modules turned off. Peripheral Module
Disable SFR registers are zeroed. All I/O pins are configured as inputs and pulled to VSS.
© 2007 Microchip Technology Inc.
Preliminary
DS70264B-page 195
dsPIC33FJ12GP201/202
TABLE 21-7:
DC CHARACTERISTICS: POWER-DOWN CURRENT (IPD)
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
DC CHARACTERISTICS
Parameter
No.
Typical(1)
Max
Units
μA
Conditions
Power-Down Current (IPD)(2)
DC60d
55
500
-40°C
DC60a
63
500
μA
+25°C
DC60b
85
500
μA
+85°C
DC60c
146
1
mA
+125°C
DC61d
8
13
μA
-40°C
DC61a
10
15
μA
+25°C
DC61b
12
20
μA
+85°C
13
25
μA
+125°C
DC61c
Note 1:
2:
3:
4:
Base Power-Down Current(3,4)
3.3V
Watchdog Timer Current: ΔIWDT(3)
Data in the Typical column is at 3.3V, 25°C unless otherwise stated.
Base IPD is measured with all peripherals and clocks shut down. All I/Os are configured as inputs and
pulled to VSS. WDT, etc., are all switched off.
The Δ current is the additional current consumed when the module is enabled. This current should be
added to the base IPD current.
These currents are measured on the device containing the most memory in this family.
TABLE 21-8:
DC CHARACTERISTICS: DOZE CURRENT (IDOZE)
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
DC CHARACTERISTICS
Doze
Ratio
Units
35
1:2
mA
30
1:64
mA
11
30
1:128
mA
11
50
1:2
mA
Parameter No.
Typical(1)
Max
DC73a
11
DC73f
11
DC73g
DC70a
DC70f
11
30
1:64
mA
DC70g
11
30
1:128
mA
DC71a
12
50
1:2
mA
DC71f
12
30
1:64
mA
DC71g
12
30
1:128
mA
DC72a
12
50
1:2
mA
DC72f
12
30
1:64
mA
DC72g
12
30
1:128
mA
Note 1:
3.3V
Conditions
-40°C
3.3V
40 MIPS
+25°C
3.3V
40 MIPS
+85°C
3.3V
40 MIPS
+125°C
3.3V
35 MIPS
Data in the Typical column is at 3.3V, 25°C unless otherwise stated.
DS70264B-page 196
Preliminary
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
TABLE 21-9:
DC CHARACTERISTICS: I/O PIN INPUT SPECIFICATIONS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
DC CHARACTERISTICS
Param
Symbol
No.
VIL
Characteristic
Min
Typ(1)
Max
Units
Conditions
Input Low Voltage
DI10
I/O pins
VSS
—
0.2 VDD
V
DI15
MCLR
VSS
—
0.2 VDD
V
DI16
OSC1 (XT mode)
VSS
—
0.2 VDD
V
DI17
OSC1 (HS mode)
VSS
—
0.2 VDD
V
DI18
SDAx, SCLx
VSS
—
0.3 VDD
V
SMbus disabled
DI19
SDAx, SCLx
VSS
—
0.2 VDD
V
SMbus enabled
I/O pins:
with analog functions
digital-only
0.8 VDD
0.8 VDD
—
—
VDD
5.5
V
V
DI25
MCLR
0.8 VDD
—
VDD
V
DI26
OSC1 (XT mode)
0.7 VDD
—
VDD
V
DI27
OSC1 (HS mode)
0.7 VDD
—
VDD
V
DI28
SDAx, SCLx
0.7 VDD
—
VDD
V
SMbus disabled
SDAx, SCLx
0.8 VDD
—
VDD
V
SMbus enabled
50
250
400
μA
VDD = 3.3V, VPIN = VSS
VIH
DI20
DI29
Input High Voltage
ICNPU
CNx Pull-up Current
IIL
Input Leakage Current(2)(3)
DI30
DI50
I/O ports
—
—
±2
μA
VSS ≤ VPIN ≤ VDD,
Pin at high-impedance
DI51
Analog Input Pins
—
—
±2
μA
VSS ≤ VPIN ≤ VDD,
Pin at high-impedance
DI51a
Analog Input Pins
—
—
±2
μA
Analog pins shared with
external reference pins
DI51b
Analog Input Pins
—
—
±3.5
μA
VSS ≤ VPIN ≤ VDD, Pin at
high-impedance,
-40°C ≤ TA ≤ +125°C
DI51c
Analog Input Pins
—
—
±8
μA
Analog pins shared with
external reference pins,
-40°C ≤ TA ≤ +125°C
DI55
MCLR
—
—
±2
μA
VSS ≤ VPIN ≤ VDD
DI56
OSC1
—
—
±2
μA
VSS ≤ VPIN ≤ VDD,
XT and HS modes
Note 1:
2:
3:
Data in “Typ” column is at 3.3V, 25°C unless otherwise stated.
The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified
levels represent normal operating conditions. Higher leakage current may be measured at different input
voltages.
Negative current is defined as current sourced by the pin.
© 2007 Microchip Technology Inc.
Preliminary
DS70264B-page 197
dsPIC33FJ12GP201/202
TABLE 21-10: DC CHARACTERISTICS: I/O PIN OUTPUT SPECIFICATIONS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
DC CHARACTERISTICS
Param
Symbol
No.
VOL
DO10
DO16
VOH
Characteristic
Min
Typ
Max
Units
Conditions
I/O ports
—
—
0.4
V
IOL = 2mA, VDD = 3.3V
OSC2/CLKO
—
—
0.4
V
IOL = 2mA, VDD = 3.3V
Output Low Voltage
Output High Voltage
DO20
I/O ports
2.40
—
—
V
IOH = -2.3 mA, VDD = 3.3V
DO26
OSC2/CLKO
2.41
—
—
V
IOH = -1.3 mA, VDD = 3.3V
TABLE 21-11: ELECTRICAL CHARACTERISTICS: BOR
DC CHARACTERISTICS
Param
No.
Symbol
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
Characteristic
Min
Typ
Max
Units
BOR Event on VDD transition
high-to-low
BOR event is tied to VDD core voltage
decrease
2.40
—
2.55
V
BO10
VBOR
Note 1:
Parameters are for design guidance only and are not tested in manufacturing.
DS70264B-page 198
Preliminary
Conditions
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
TABLE 21-12: DC CHARACTERISTICS: PROGRAM MEMORY
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
DC CHARACTERISTICS
Param
Symbol
No.
Characteristic
Min
Typ(1)
Max
10,000
—
—
Units
Conditions
Program Flash Memory
D130
EP
Cell Endurance
D131
VPR
VDD for Read
VMIN
—
3.6
V
VMIN = Minimum operating
voltage
D132B
VPEW
VDD for Self-Timed Write
VMIN
—
3.6
V
VMIN = Minimum operating
voltage
D134
TRETD
Characteristic Retention
20
—
—
Year Provided no other specifications
are violated (-40°C to +125°C)
D135
IDDP
Supply Current during
Programming
—
10
—
mA
D136
TRW
Row Write Time
—
1.6
—
ms
D137
TPE
Page Erase Time
—
20
—
ms
D138
TWW
Word Write Cycle Time
20
—
40
μs
Note 1:
E/W -40°C to +125°C
Data in “Typ” column is at 3.3V, 25°C unless otherwise stated.
TABLE 21-13: INTERNAL VOLTAGE REGULATOR SPECIFICATIONS
Operating Conditions: -40°C < TA < +85°C (unless otherwise stated)
Param
No.
Symbol
CEFC
Characteristics
External Filter Capacitor
Value
© 2007 Microchip Technology Inc.
Min
Typ
Max
Units
1
10
—
μF
Preliminary
Comments
Capacitor must be low
series resistance
(< 5 ohms)
DS70264B-page 199
dsPIC33FJ12GP201/202
21.2
AC Characteristics and Timing
Parameters
The information contained in this section defines
dsPIC33FJ12GP201/202 AC characteristics and
timing parameters.
TABLE 21-14: TEMPERATURE AND VOLTAGE SPECIFICATIONS – AC
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
Operating voltage VDD range as described in Section 21.0 “Electrical
Characteristics”.
AC CHARACTERISTICS
FIGURE 21-1:
LOAD CONDITIONS FOR DEVICE TIMING SPECIFICATIONS
Load Condition 1 – for all pins except OSC2
Load Condition 2 – for OSC2
VDD/2
CL
Pin
RL
VSS
CL
Pin
RL = 464Ω
CL = 50 pF for all pins except OSC2
15 pF for OSC2 output
VSS
TABLE 21-15: CAPACITIVE LOADING REQUIREMENTS ON OUTPUT PINS
Param
Symbol
No.
Characteristic
Min
Typ
Max
Units
Conditions
DO50
COSC2
OSC2/SOSC2 pin
—
—
15
pF
In XT and HS modes when
external clock is used to drive
OSC1
DO56
CIO
All I/O pins and OSC2
—
—
50
pF
EC mode
DO58
CB
SCLx, SDAx
—
—
400
pF
In I2C™ mode
DS70264B-page 200
Preliminary
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
FIGURE 21-2:
EXTERNAL CLOCK TIMING
Q1
Q2
Q3
Q4
Q1
Q2
Q3
Q4
OSC1
OS20
OS30
OS25
OS30
OS31
OS31
CLKO
OS41
OS40
TABLE 21-16: EXTERNAL CLOCK TIMING REQUIREMENTS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
No.
OS10
Symb
FIN
Min
Typ(1)
Max
Units
External CLKI Frequency
(External clocks allowed only
in EC and ECPLL modes)
DC
—
40
MHz
EC
Oscillator Crystal Frequency
3.5
10
—
—
—
—
10
40
33
MHz
MHz
kHz
XT
HS
SOSC
Characteristic
Conditions
OS20
TOSC
TOSC = 1/FOSC
12.5
—
DC
ns
OS25
TCY
Instruction Cycle Time(2)
25
—
DC
ns
OS30
TosL,
TosH
External Clock in (OSC1)
High or Low Time
0.375 x TOSC
—
0.625 x TOSC
ns
EC
OS31
TosR,
TosF
External Clock in (OSC1)
Rise or Fall Time
—
—
20
ns
EC
OS40
TckR
CLKO Rise Time(3)
—
5.2
—
ns
—
5.2
—
ns
OS41
TckF
Note 1:
2:
3:
(3)
CLKO Fall Time
Data in “Typ” column is at 3.3V, 25°C unless otherwise stated.
Instruction cycle period (TCY) equals two times the input oscillator time-base period. All specified values
are based on characterization data for that particular oscillator type under standard operating conditions
with the device executing code. Exceeding these specified limits can result in an unstable oscillator
operation and/or higher than expected current consumption. All devices are tested to operate at “min.”
values with an external clock applied to the OSC1/CLKI pin. When an external clock input is used, the
“max.” cycle time limit is “DC” (no clock) for all devices.
Measurements are taken in EC mode. The CLKO signal is measured on the OSC2 pin.
© 2007 Microchip Technology Inc.
Preliminary
DS70264B-page 201
dsPIC33FJ12GP201/202
TABLE 21-17: PLL CLOCK TIMING SPECIFICATIONS (VDD = 3.0V TO 3.6V)
Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
No.
Symbol
Characteristic
Min
Typ(1)
Max
Units
Conditions
ECPLL and XTPLL modes
OS50
FPLLI
PLL Voltage Controlled
Oscillator (VCO) Input
Frequency Range
0.8
—
8
MHz
OS51
FSYS
On-Chip VCO System
Frequency
100
—
200
MHz
OS52
TLOCK
PLL Start-up Time (Lock Time)
0.9
1.5
3.1
ms
OS53
DCLK
CLKO Stability (Jitter)
-3
0.5
3
%
Note 1:
Measured over 100 ms
period
Data in “Typ” column is at 3.3V, 25°C unless otherwise stated.
TABLE 21-18: AC CHARACTERISTICS: INTERNAL RC ACCURACY
AC CHARACTERISTICS
Param
No.
Characteristic
Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated)
Operating temperature
-40°C ≤ TA ≤ +85°C for industrial
-40°C ≤ TA ≤ +125°C for Extended
Min
Typ
Max
Units
Conditions
Internal FRC Accuracy @ 7.3728 MHz(1,2)
F20
Note 1:
2:
FRC
-2
—
+2
%
-40°C ≤ TA ≤ +85°C
VDD = 3.0-3.6V
FRC
-5
—
+5
%
-40°C ≤ TA ≤ +125°C
VDD = 3.0-3.6V
Frequency calibrated at 25°C and 3.3V. TUN bits can be used to compensate for temperature drift.
FRC is set to initial frequency of 7.37 MHz (±2%) at 25°C.
TABLE 21-19: INTERNAL RC ACCURACY
AC CHARACTERISTICS
Param
No.
Characteristic
Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
Min
Typ
Max
Units
Conditions
LPRC
-20
±6
+20
%
-40°C ≤ TA ≤ +85°C
VDD = 3.0-3.6V
LPRC
-70
—
+20
%
-40°C ≤ TA ≤ +125°C
VDD = 3.0-3.6V
LPRC @ 32.768 kHz(1)
F21
Note 1:
Change of LPRC frequency as VDD changes.
DS70264B-page 202
Preliminary
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
FIGURE 21-3:
CLKO AND I/O TIMING CHARACTERISTICS
I/O Pin
(Input)
DI35
DI40
I/O Pin
(Output)
New Value
Old Value
DO31
DO32
Note: Refer to Figure 21-1 for load conditions.
TABLE 21-20: I/O TIMING REQUIREMENTS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
No.
Symbol
Characteristic
Min
Typ(1)
Max
Units
Conditions
—
10
25
ns
—
DO31
TIOR
DO32
TIOF
Port Output Fall Time
—
10
25
ns
—
DI35
TINP
INTx Pin High or Low Time (output)
20
—
—
ns
—
TRBP
CNx High or Low Time (input)
2
—
—
TCY
—
DI40
Note 1:
Port Output Rise Time
Data in “Typ” column is at 3.3V, 25°C unless otherwise stated.
© 2007 Microchip Technology Inc.
Preliminary
DS70264B-page 203
dsPIC33FJ12GP201/202
FIGURE 21-4:
VDD
RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER AND POWER-UP
TIMER TIMING CHARACTERISTICS
SY12
MCLR
SY10
Internal
POR
PWRT
Time-out
OSC
Time-out
SY11
SY30
Internal
Reset
Watchdog
Timer
Reset
SY13
SY20
SY13
I/O Pins
SY35
FSCM
Delay
Note: Refer to Figure 21-1 for load conditions.
DS70264B-page 204
Preliminary
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
TABLE 21-21: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER, POWER-UP TIMER
TIMING REQUIREMENTS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
Symbol
No.
Characteristic(1)
Min
Typ(2)
Max
Units
Conditions
SY10
TMCL
MCLR Pulse Width (low)
2
—
—
μs
-40°C to +85°C
SY11
TPWRT
Power-up Timer Period
—
2
4
8
16
32
64
128
—
ms
-40°C to +85°C
User programmable
SY12
TPOR
Power-on Reset Delay
3
10
30
μs
-40°C to +85°C
SY13
TIOZ
I/O High-Impedance from MCLR
Low or Watchdog Timer Reset
0.68
0.72
1.2
μs
SY20
TWDT1
Watchdog Timer Time-out Period
(No Prescaler)
1.7
2.1
2.6
ms
SY30
TOST
Oscillator Start-up Time
—
1024 TOSC
—
—
TOSC = OSC1 period
SY35
TFSCM
Fail-Safe Clock Monitor Delay
—
500
900
μs
-40°C to +85°C
Note 1:
2:
VDD = 3V, -40°C to +85°C
These parameters are characterized but not tested in manufacturing.
Data in “Typ” column is at 3.3V, 25°C unless otherwise stated.
© 2007 Microchip Technology Inc.
Preliminary
DS70264B-page 205
dsPIC33FJ12GP201/202
FIGURE 21-5:
TIMER1, 2 AND 3 EXTERNAL CLOCK TIMING CHARACTERISTICS
TxCK
Tx11
Tx10
Tx15
OS60
Tx20
TMRx
Note: Refer to Figure 21-1 for load conditions.
TABLE 21-22: TIMER1 EXTERNAL CLOCK TIMING REQUIREMENTS(1)
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
No.
TA10
TA11
TA15
Symbol
TTXH
TTXL
TTXP
Characteristic
TxCK High Time
TxCK Low Time
Min
Typ
Max
Units
Conditions
Synchronous,
no prescaler
0.5 TCY + 20
—
—
ns
Must also meet
parameter TA15
Synchronous,
with prescaler
10
—
—
ns
Asynchronous
10
—
—
ns
Synchronous,
no prescaler
0.5 TCY + 20
—
—
ns
Synchronous,
with prescaler
10
—
—
ns
Asynchronous
10
—
—
ns
TCY + 40
—
—
ns
Synchronous,
with prescaler
Greater of:
20 ns or
(TCY + 40)/N
—
—
—
Asynchronous
20
—
—
ns
DC
—
50
kHz
1.5 TCY
—
TxCK Input Period Synchronous,
no prescaler
OS60
Ft1
TA20
TCKEXTMRL Delay from External TxCK Clock
Edge to Timer Increment
Note 1:
SOSC1/T1CK Oscillator Input
frequency Range (oscillator enabled
by setting bit TCS (T1CON<1>))
0.5 TCY
Must also meet
parameter TA15
N = prescale
value
(1, 8, 64, 256)
Timer1 is a Type A.
DS70264B-page 206
Preliminary
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
TABLE 21-23: TIMER2 EXTERNAL CLOCK TIMING REQUIREMENTS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
No.
TB10
TB11
TB15
TB20
Symbol
TtxH
TtxL
TtxP
TCKEXTMRL
Characteristic
TxCK High Time
TxCK Low Time
TxCK Input
Period
Min
Typ
Max
Units
Conditions
Synchronous,
no prescaler
0.5 TCY + 20
—
—
ns
Must also meet
parameter TB15
Synchronous,
with prescaler
10
—
—
ns
Synchronous,
no prescaler
0.5 TCY + 20
—
—
ns
Synchronous,
with prescaler
10
—
—
ns
Synchronous,
no prescaler
TCY + 40
—
—
ns
Synchronous,
with prescaler
Greater of:
20 ns or
(TCY + 40)/N
—
1.5 TCY
—
Delay from External TxCK Clock
Edge to Timer Increment
0.5 TCY
Must also meet
parameter TB15
N = prescale
value
(1, 8, 64, 256)
TABLE 21-24: TIMER3 EXTERNAL CLOCK TIMING REQUIREMENTS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
No.
Symbol
Characteristic
Min
Typ
Max
Units
Conditions
TC10
TtxH
TxCK High Time
Synchronous
0.5 TCY + 20
—
—
ns
Must also meet
parameter TC15
TC11
TtxL
TxCK Low Time
Synchronous
0.5 TCY + 20
—
—
ns
Must also meet
parameter TC15
TC15
TtxP
TxCK Input Period Synchronous,
no prescaler
TCY + 40
—
—
ns
N = prescale
value
(1, 8, 64, 256)
—
1.5
TCY
—
Synchronous,
with prescaler
TC20
TCKEXTMRL Delay from External TxCK Clock
Edge to Timer Increment
© 2007 Microchip Technology Inc.
Greater of:
20 ns or
(TCY + 40)/N
0.5 TCY
Preliminary
DS70264B-page 207
dsPIC33FJ12GP201/202
FIGURE 21-6:
INPUT CAPTURE (CAPx) TIMING CHARACTERISTICS
ICx
IC10
IC11
IC15
Note: Refer to Figure 21-1 for load conditions.
TABLE 21-25: INPUT CAPTURE TIMING REQUIREMENTS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
No.
Symbol
IC10
TccL
ICx Input Low Time
IC11
TccH
ICx Input High Time
IC15
TccP
ICx Input Period
Characteristic(1)
No Prescaler
Min
Max
Units
0.5 TCY + 20
—
ns
With Prescaler
No Prescaler
10
—
ns
0.5 TCY + 20
—
ns
With Prescaler
Note 1:
10
—
ns
(TCY + 40)/N
—
ns
Conditions
N = prescale
value (1, 4, 16)
These parameters are characterized but not tested in manufacturing.
FIGURE 21-7:
OUTPUT COMPARE MODULE (OCx) TIMING CHARACTERISTICS
OCx
(Output Compare
or PWM Mode)
OC10
OC11
Note: Refer to Figure 21-1 for load conditions.
TABLE 21-26: OUTPUT COMPARE MODULE TIMING REQUIREMENTS
AC CHARACTERISTICS
Param
Symbol
No.
Characteristic(1)
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
Min
Typ
Max
Units
Conditions
OC10
TccF
OCx Output Fall Time
—
—
—
ns
See parameter D032
OC11
TccR
OCx Output Rise Time
—
—
—
ns
See parameter D031
Note 1:
These parameters are characterized but not tested in manufacturing.
DS70264B-page 208
Preliminary
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
FIGURE 21-8:
OC/PWM MODULE TIMING CHARACTERISTICS
OC20
OCFA/OCFB
OC15
OCx
TABLE 21-27: SIMPLE OC/PWM MODE TIMING REQUIREMENTS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
No.
Symbol
Characteristic(1)
Min
Typ
Max
Units
Conditions
OC15
TFD
Fault Input to PWM I/O
Change
—
—
50
ns
—
OC20
TFLT
Fault Input Pulse Width
50
—
—
ns
—
Note 1:
These parameters are characterized but not tested in manufacturing.
© 2007 Microchip Technology Inc.
Preliminary
DS70264B-page 209
dsPIC33FJ12GP201/202
FIGURE 21-9:
SPIx MODULE MASTER MODE (CKE = 0) TIMING CHARACTERISTICS
SCKx
(CKP = 0)
SP11
SP10
SP21
SP20
SP20
SP21
SCKx
(CKP = 1)
SP35
Bit 14 - - - - - -1
MSb
SDOx
SP31
SDIx
LSb
SP30
MSb In
LSb In
Bit 14 - - - -1
SP40 SP41
Note: Refer to Figure 21-1 for load conditions.
TABLE 21-28: SPIx MASTER MODE (CKE = 0) TIMING REQUIREMENTS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
No.
Symbol
Characteristic(1)
Min
Typ(2)
Max
Units
Conditions
—
—
ns
—
TscL
SCKx Output Low Time(3)
TCY/2
SP11
TscH
SCKx Output High Time
(3)
TCY/2
—
—
ns
SP20
TscF
SCKx Output Fall Time(4)
—
—
—
ns
See parameter D032
SP21
TscR
SCKx Output Rise Time(4)
—
—
—
ns
See parameter D031
SP30
TdoF
SDOx Data Output Fall Time(4)
—
—
—
ns
See parameter D032
See parameter D031
SP10
Time(4)
—
SP31
TdoR
SDOx Data Output Rise
—
—
—
ns
SP35
TscH2doV,
TscL2doV
SDOx Data Output Valid after
SCKx Edge
—
6
20
ns
—
SP40
TdiV2scH,
TdiV2scL
Setup Time of SDIx Data Input
to SCKx Edge
23
—
—
ns
—
SP41
TscH2diL,
TscL2diL
Hold Time of SDIx Data Input
to SCKx Edge
30
—
—
ns
—
Note 1:
2:
3:
4:
These parameters are characterized but not tested in manufacturing.
Data in “Typ” column is at 3.3V, 25°C unless otherwise stated.
The minimum clock period for SCKx is 100 ns. Therefore, the clock generated in Master mode must not
violate this specification.
Assumes 50 pF load on all SPIx pins.
DS70264B-page 210
Preliminary
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
FIGURE 21-10:
SPIx MODULE MASTER MODE (CKE = 1) TIMING CHARACTERISTICS
SP36
SCKX
(CKP = 0)
SP11
SCKX
(CKP = 1)
SP10
SP21
SP20
SP20
SP21
SP35
SP40
SDIX
LSb
Bit 14 - - - - - -1
MSb
SDOX
SP30,SP31
MSb In
Bit 14 - - - -1
LSb In
SP41
Note: Refer to Figure 21-1 for load conditions.
TABLE 21-29: SPIx MODULE MASTER MODE (CKE = 1) TIMING REQUIREMENTS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
No.
Symbol
Characteristic(1)
Min
Typ(2)
Max
Units
Conditions
SP10
TscL
SCKx Output Low Time
TCY/2
—
—
ns
See Note 3
SP11
TscH
SCKx Output High Time
TCY/2
—
—
ns
See Note 3
SP20
TscF
SCKx Output Fall Time
—
—
—
ns
See parameter D032
and Note 4
SP21
TscR
SCKx Output Rise Time
—
—
—
ns
See parameter D031
and Note 4
SP30
TdoF
SDOx Data Output Fall Time
—
—
—
ns
See parameter D032
and Note 4
SP31
TdoR
SDOx Data Output Rise Time
—
—
—
ns
See parameter D031
and Note 4
SP35
TscH2doV, SDOx Data Output Valid after
TscL2doV SCKx Edge
—
6
20
ns
—
SP36
TdoV2sc, SDOx Data Output Setup to
TdoV2scL First SCKx Edge
30
—
—
ns
—
SP40
TdiV2scH, Setup Time of SDIx Data
TdiV2scL Input to SCKx Edge
23
—
—
ns
—
Note 1:
2:
3:
4:
These parameters are characterized but not tested in manufacturing.
Data in “Typ” column is at 3.3V, 25°C unless otherwise stated.
The minimum clock period for SCKx is 100 ns. The clock generated in Master mode must not violate this
specification.
Assumes 50 pF load on all SPIx pins.
© 2007 Microchip Technology Inc.
Preliminary
DS70264B-page 211
dsPIC33FJ12GP201/202
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
No.
SP41
Characteristic(1)
Min
Typ(2)
Max
Units
Conditions
Hold Time of SDIx Data Input
to SCKx Edge
30
—
—
ns
—
Symbol
TscH2diL,
TscL2diL
Note 1:
2:
3:
These parameters are characterized but not tested in manufacturing.
Data in “Typ” column is at 3.3V, 25°C unless otherwise stated.
The minimum clock period for SCKx is 100 ns. The clock generated in Master mode must not violate this
specification.
Assumes 50 pF load on all SPIx pins.
4:
FIGURE 21-11:
SPIx MODULE SLAVE MODE (CKE = 0) TIMING CHARACTERISTICS
SSX
SP52
SP50
SCKX
(CKP = 0)
SP71
SP70
SP73
SP72
SP72
SP73
SCKX
(CKP = 1)
SP35
MSb
SDOX
LSb
Bit 14 - - - - - -1
SP51
SP30,SP31
SDIX
MSb In
Bit 14 - - - -1
LSb In
SP41
SP40
Note: Refer to Figure 21-1 for load conditions.
TABLE 21-30: SPIx MODULE SLAVE MODE (CKE = 0) TIMING REQUIREMENTS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
No.
SP70
Symbol
TscL
Characteristic(1)
Min
Typ(2)
Max
Units
Conditions
SCKx Input Low Time
30
—
—
ns
—
SP71
TscH
SCKx Input High Time
30
—
—
ns
—
SP72
TscF
SCKx Input Fall Time(3)
—
10
25
ns
—
SP73
TscR
SCKx Input Rise Time(3)
—
10
25
ns
—
Note 1:
2:
3:
These parameters are characterized but not tested in manufacturing.
Data in “Typ” column is at 3.3V, 25°C unless otherwise stated.
Assumes 50 pF load on all SPIx pins.
DS70264B-page 212
Preliminary
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
TABLE 21-30: SPIx MODULE SLAVE MODE (CKE = 0) TIMING REQUIREMENTS (CONTINUED)
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
No.
Symbol
Characteristic(1)
Min
Typ(2)
Max
Units
Conditions
SP30
TdoF
SDOx Data Output Fall Time(3)
—
—
—
ns
See parameter D032
SP31
TdoR
SDOx Data Output Rise Time(3)
—
—
—
ns
See parameter D031
SP35
TscH2doV, SDOx Data Output Valid after
TscL2doV SCKx Edge
—
—
30
ns
—
SP40
TdiV2scH, Setup Time of SDIx Data Input
TdiV2scL to SCKx Edge
20
—
—
ns
—
SP41
TscH2diL,
TscL2diL
20
—
—
ns
—
SP50
TssL2scH, SSx ↓ to SCKx ↑ or SCKx Input
TssL2scL
120
—
—
ns
—
SP51
TssH2doZ SSx ↑ to SDOx Output
High-Impedance(3)
10
—
50
ns
—
SP52
TscH2ssH SSx after SCKx Edge
TscL2ssH
1.5 TCY +40
—
—
ns
—
Note 1:
2:
3:
Hold Time of SDIx Data Input
to SCKx Edge
These parameters are characterized but not tested in manufacturing.
Data in “Typ” column is at 3.3V, 25°C unless otherwise stated.
Assumes 50 pF load on all SPIx pins.
FIGURE 21-12:
SPIx MODULE SLAVE MODE (CKE = 1) TIMING CHARACTERISTICS
SP60
SSx
SP52
SP50
SCKx
(CKP = 0)
SP71
SP70
SP73
SP72
SP72
SP73
SCKx
(CKP = 1)
SP35
SP52
MSb
SDOx
Bit 14 - - - - - -1
LSb
SP30,SP31
SDIx
SDI
MSb In
SP51
Bit 14 - - - -1
LSb In
SP41
SP40
Note: Refer to Figure 21-1 for load conditions.
© 2007 Microchip Technology Inc.
Preliminary
DS70264B-page 213
dsPIC33FJ12GP201/202
TABLE 21-31: SPIx MODULE SLAVE MODE (CKE = 1) TIMING REQUIREMENTS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
No.
Symbol
Characteristic(1)
Min
Typ(2)
Max
Units
Conditions
SP70
TscL
SCKx Input Low Time
30
—
—
ns
—
SP71
TscH
SCKx Input High Time
30
—
—
ns
—
SP72
TscF
SCKx Input Fall Time(3)
—
10
25
ns
—
SP73
TscR
SCKx Input Rise Time(3)
—
10
25
ns
—
—
—
—
ns
See parameter D032
—
—
—
ns
See parameter D031
Time(3)
SP30
TdoF
SDOx Data Output Fall
SP31
TdoR
SDOx Data Output Rise Time(3)
SP35
TscH2doV, SDOx Data Output Valid after
TscL2doV SCKx Edge
—
—
30
ns
—
SP40
TdiV2scH, Setup Time of SDIx Data Input
TdiV2scL to SCKx Edge
20
—
—
ns
—
SP41
TscH2diL, Hold Time of SDIx Data Input
TscL2diL to SCKx Edge
20
—
—
ns
—
SP50
TssL2scH, SSx ↓ to SCKx ↓ or SCKx ↑
TssL2scL Input
120
—
—
ns
—
SP51
TssH2doZ SSx ↑ to SDOX Output
High-Impedance(4)
10
—
50
ns
—
SP52
TscH2ssH SSx ↑ after SCKx Edge
TscL2ssH
1.5 TCY + 40
—
—
ns
—
SP60
TssL2doV SDOx Data Output Valid after
SSx Edge
—
—
50
ns
—
Note 1:
2:
3:
4:
These parameters are characterized but not tested in manufacturing.
Data in “Typ” column is at 3.3V, 25°C unless otherwise stated.
The minimum clock period for SCKx is 100 ns. The clock generated in Master mode must not violate this
specification.
Assumes 50 pF load on all SPIx pins.
DS70264B-page 214
Preliminary
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
FIGURE 21-13:
I2Cx BUS START/STOP BITS TIMING CHARACTERISTICS (MASTER MODE)
SCLx
IM31
IM34
IM30
IM33
SDAx
Stop
Condition
Start
Condition
Note: Refer to Figure 21-1 for load conditions.
FIGURE 21-14:
I2Cx BUS DATA TIMING CHARACTERISTICS (MASTER MODE)
IM20
IM21
IM11
IM10
SCLx
IM11
IM26
IM10
IM25
IM33
SDAx
In
IM40
IM40
IM45
SDAx
Out
Note: Refer to Figure 21-1 for load conditions.
© 2007 Microchip Technology Inc.
Preliminary
DS70264B-page 215
dsPIC33FJ12GP201/202
TABLE 21-32: I2Cx BUS DATA TIMING REQUIREMENTS (MASTER MODE)
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
Symbol
No.
IM10
Min(1)
Max
Units
Conditions
TLO:SCL Clock Low Time 100 kHz mode
TCY/2 (BRG + 1)
—
μs
—
400 kHz mode
TCY/2 (BRG + 1)
—
μs
—
mode(2)
TCY/2 (BRG + 1)
—
μs
—
Clock High Time 100 kHz mode
TCY/2 (BRG + 1)
—
μs
—
400 kHz mode
TCY/2 (BRG + 1)
—
μs
—
1 MHz mode(2)
TCY/2 (BRG + 1)
—
μs
—
—
300
ns
20 + 0.1 CB
300
ns
Characteristic
1 MHz
IM11
THI:SCL
IM20
TF:SCL
IM21
TR:SCL
IM25
SDAx and SCLx 100 kHz mode
Fall Time
400 kHz mode
1 MHz mode(2)
—
100
ns
SDAx and SCLx 100 kHz mode
Rise Time
400 kHz mode
—
1000
ns
TSU:DAT Data Input
Setup Time
IM26
THD:DAT Data Input
Hold Time
IM30
TSU:STA
IM31
Start Condition
Setup Time
THD:STA Start Condition
Hold Time
IM33
TSU:STO Stop Condition
Setup Time
IM34
THD:STO Stop Condition
Hold Time
IM40
TAA:SCL
Output Valid
From Clock
TBF:SDA Bus Free Time
IM50
CB
Note 1:
2:
CB is specified to be
from 10 to 400 pF
20 + 0.1 CB
300
ns
1 MHz mode(2)
—
300
ns
100 kHz mode
250
—
ns
400 kHz mode
100
—
ns
1 MHz mode(2)
40
—
ns
100 kHz mode
0
—
μs
400 kHz mode
0
0.9
μs
1 MHz mode(2)
0.2
—
μs
100 kHz mode
TCY/2 (BRG + 1)
—
μs
400 kHz mode
TCY/2 (BRG + 1)
—
μs
1 MHz mode(2)
TCY/2 (BRG + 1)
—
μs
100 kHz mode
TCY/2 (BRG + 1)
—
μs
400 kHz mode
TCY/2 (BRG + 1)
—
μs
1 MHz mode(2)
TCY/2 (BRG + 1)
—
μs
100 kHz mode
TCY/2 (BRG + 1)
—
μs
400 kHz mode
TCY/2 (BRG + 1)
—
μs
1 MHz mode(2)
TCY/2 (BRG + 1)
—
μs
100 kHz mode
TCY/2 (BRG + 1)
—
ns
400 kHz mode
TCY/2 (BRG + 1)
—
ns
1 MHz mode(2)
TCY/2 (BRG + 1)
—
ns
100 kHz mode
—
3500
ns
—
400 kHz mode
—
1000
ns
—
(2)
—
400
ns
—
100 kHz mode
4.7
—
μs
400 kHz mode
1.3
—
μs
1 MHz mode(2)
0.5
—
μs
Time the bus must be
free before a new
transmission can start
—
400
pF
1 MHz mode
IM45
CB is specified to be
from 10 to 400 pF
Bus Capacitive Loading
—
—
Only relevant for
Repeated Start
condition
After this period the
first clock pulse is
generated
—
—
BRG is the value of the I2C Baud Rate Generator. Refer to Section 19. “Inter-Integrated Circuit (I2C™)”
in the “dsPIC33F Family Reference Manual”. Please see the Microchip web site (www.microchip.com) for
the latest dsPIC33F Family Reference Manual sections.
Maximum pin capacitance = 10 pF for all I2Cx pins (for 1 MHz mode only).
DS70264B-page 216
Preliminary
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
FIGURE 21-15:
I2Cx BUS START/STOP BITS TIMING CHARACTERISTICS (SLAVE MODE)
SCLx
IS34
IS31
IS30
IS33
SDAx
Stop
Condition
Start
Condition
FIGURE 21-16:
I2Cx BUS DATA TIMING CHARACTERISTICS (SLAVE MODE)
IS20
IS21
IS11
IS10
SCLx
IS30
IS26
IS31
IS25
IS33
SDAx
In
IS40
IS40
IS45
SDAx
Out
© 2007 Microchip Technology Inc.
Preliminary
DS70264B-page 217
dsPIC33FJ12GP201/202
TABLE 21-33: I2Cx BUS DATA TIMING REQUIREMENTS (SLAVE MODE)
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param Symbol
IS10
IS11
IS20
Characteristic
TLO:SCL Clock Low Time
THI:SCL
TF:SCL
Clock High Time
SDAx and SCLx
Fall Time
Min
Max
Units
100 kHz mode
4.7
—
μs
Device must operate at a
minimum of 1.5 MHz
400 kHz mode
1.3
—
μs
Device must operate at a
minimum of 10 MHz
1 MHz mode(1)
0.5
—
μs
100 kHz mode
4.0
—
μs
Device must operate at a
minimum of 1.5 MHz
400 kHz mode
0.6
—
μs
Device must operate at a
minimum of 10 MHz
1 MHz mode(1)
0.5
—
μs
100 kHz mode
—
300
ns
400 kHz mode
20 + 0.1 CB
300
ns
—
100
ns
100 kHz mode
—
1000
ns
400 kHz mode
20 + 0.1 CB
300
ns
1 MHz mode(1)
—
300
ns
100 kHz mode
250
—
ns
400 kHz mode
100
—
ns
1 MHz mode(1)
100
—
ns
1 MHz
IS21
IS25
IS26
IS30
IS31
IS33
IS34
TR:SCL
TSU:DAT Data Input
Setup Time
THD:DAT Data Input
Hold Time
TSU:STA Start Condition
Setup Time
THD:STA Start Condition
Hold Time
TSU:STO Stop Condition
Setup Time
THD:ST
O
IS40
IS45
IS50
Note 1:
SDAx and SCLx
Rise Time
Stop Condition
Hold Time
TAA:SCL Output Valid
From Clock
TBF:SDA Bus Free Time
CB
Conditions
mode(1)
100 kHz mode
0
0
μs
400 kHz mode
0
0.9
μs
1 MHz mode(1)
0
0.3
μs
100 kHz mode
4.7
—
μs
400 kHz mode
0.6
—
μs
1 MHz mode(1)
0.25
—
μs
100 kHz mode
4.0
—
μs
400 kHz mode
0.6
—
μs
1 MHz mode(1)
0.25
—
μs
100 kHz mode
4.7
—
μs
400 kHz mode
0.6
—
μs
1 MHz mode(1)
0.6
—
μs
100 kHz mode
4000
—
ns
400 kHz mode
600
—
ns
1 MHz mode(1)
250
100 kHz mode
0
3500
ns
400 kHz mode
0
1000
ns
1 MHz mode(1)
0
350
ns
—
CB is specified to be from
10 to 400 pF
CB is specified to be from
10 to 400 pF
—
—
Only relevant for Repeated
Start condition
After this period, the first
clock pulse is generated
—
—
ns
100 kHz mode
4.7
—
μs
400 kHz mode
1.3
—
μs
1 MHz mode(1)
0.5
—
μs
—
400
pF
Bus Capacitive Loading
—
—
Time the bus must be free
before a new transmission
can start
—
Maximum pin capacitance = 10 pF for all I2Cx pins (for 1 MHz mode only).
DS70264B-page 218
Preliminary
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
TABLE 21-34: ADC MODULE SPECIFICATIONS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
Symbol
No.
Characteristic
Min.
Typ
Max.
Units
Conditions
Device Supply
AD01
AVDD
Module VDD Supply
Greater of
VDD – 0.3
or 3.0
—
Lesser of
VDD + 0.3
or 3.6
V
—
AD02
AVSS
Module VSS Supply
VSS – 0.3
—
VSS + 0.3
V
—
AD05
VREFH
Reference Voltage High
Reference Inputs
AD05a
AD06
VREFL
Reference Voltage Low
AD06a
AVSS + 2.7
—
AVDD
V
See Note 2
3.0
—
3.6
V
VREFH = AVDD
VREFL = AVSS = 0
AVSS
—
AVDD – 2.7
V
See Note 2
0
—
0
V
VREFH = AVDD
VREFL = AVSS = 0
AD07
VREF
Absolute Reference Voltage
3.0
—
3.6
V
VREF = VREFH - VREFL
AD08
IREF
Current Drain
—
389
.001
549
1
μA
μA
ADC operating
ADC off
AD10
VINHVINL
Full-Scale Input Span
Analog Input
VREFL
—
VREFH
V
VREFL = 0, VREFH = 3.6V
See Note 1
AVSS
—
AVDD
V
AVSS = 0, AVDD = 3.6V
See Note 1
AD12
VINH
Input Voltage Range VINH
VINL
—
VREFH
V
This voltage reflects
Sample and Hold
Channels 0, 1, 2, and 3
(CH0-CH3), positive input
AD13
VINL
Input Voltage Range VINL
VREFL
—
AVSS + 1V
V
This voltage reflects
Sample and Hold
Channels 0, 1, 2, and 3
(CH0-CH3), negative
input
AD17
RIN
Recommended Impedance
of Analog Voltage Source
—
—
200
200
Ω
Ω
10-bit
12-bit
Note 1:
2:
The ADC conversion result never decreases with an increase in the input voltage, and has no missing
codes.
These parameters are not characterized or tested in manufacturing.
© 2007 Microchip Technology Inc.
Preliminary
DS70264B-page 219
dsPIC33FJ12GP201/202
TABLE 21-35: ADC MODULE SPECIFICATIONS (12-BIT MODE)
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
No.
Symbol
Characteristic
Min.
Typ
Max.
Units
Conditions
ADC Accuracy (12-bit Mode) – Measurements with external VREF+/VREFAD20a Nr
Resolution
12 data bits
AD21a INL
Integral Nonlinearity
AD22a DNL
bits
-1
—
+1
LSb
VINL = AVSS = VREFL =
0V, AVDD = VREFH = 3.6V
Differential Nonlinearity
>-1
—
<1
LSb
VINL = AVSS = VREFL =
0V, AVDD = VREFH = 3.6V
AD23a GERR
Gain Error
1.25
1.5
3
LSb
VINL = AVSS = VREFL =
0V, AVDD = VREFH = 3.6V
AD24a EOFF
Offset Error
-2
-1.5
-1.25
LSb
VINL = AVSS = VREFL =
0V, AVDD = VREFH = 3.6V
AD25a —
Monotonicity(1)
—
—
—
—
Guaranteed
ADC Accuracy (12-bit Mode) – Measurements with internal VREF+/VREFAD20a Nr
Resolution
AD21a INL
Integral Nonlinearity
12 data bits
AD22a DNL
Differential Nonlinearity
AD23a GERR
bits
-1
—
+1
LSb
VINL = AVSS = VREFL =
0V, AVDD = VREFH = 3.6V
>-1
—
<1
LSb
VINL = AVSS = VREFL =
0V, AVDD = VREFH = 3.6V
Gain Error
2
3
7
LSb
VINL = AVSS = VREFL =
0V, AVDD = VREFH = 3.6V
AD24a EOFF
Offset Error
2
3
5
LSb
VINL = AVSS = VREFL =
0V, AVDD = VREFH = 3.6V
AD25a —
Monotonicity(1)
—
—
—
—
AD30a THD
Total Harmonic Distortion
-77
-69
-61
dB
—
AD31a SINAD
Signal to Noise and
Distortion
59
63
64
dB
—
AD32a SFDR
Spurious Free Dynamic
Range
63
72
79
dB
—
AD33a FNYQ
Input Signal Bandwidth
—
—
250
kHz
—
AD34a ENOB
Effective Number of Bits
10.95
11.1
—
bits
—
Guaranteed
Dynamic Performance (12-bit Mode)
Note 1:
The ADC conversion result never decreases with an increase in the input voltage, and has no missing
codes.
DS70264B-page 220
Preliminary
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
TABLE 21-36: ADC MODULE SPECIFICATIONS (10-BIT MODE)
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
No.
Symbol
Characteristic
Min.
Typ
Max.
Units
Conditions
ADC Accuracy (10-bit Mode) – Measurements with external VREF+/VREFAD20b Nr
Resolution
10 data bits
AD21b INL
Integral Nonlinearity
AD22b DNL
Differential Nonlinearity
AD23b GERR
bits
-1
—
+1
LSb
VINL = AVSS = VREFL =
0V, AVDD = VREFH = 3.6V
>-1
—
<1
LSb
VINL = AVSS = VREFL =
0V, AVDD = VREFH = 3.6V
Gain Error
1
3
6
LSb
VINL = AVSS = VREFL =
0V, AVDD = VREFH = 3.6V
AD24b EOFF
Offset Error
1
2
5
LSb
VINL = AVSS = VREFL =
0V, AVDD = VREFH = 3.6V
AD25b —
Monotonicity(1)
—
—
—
—
Guaranteed
ADC Accuracy (10-bit Mode) – Measurements with internal VREF+/VREFAD20b Nr
Resolution
AD21b INL
Integral Nonlinearity
10 data bits
AD22b DNL
bits
-1
—
+1
LSb
VINL = AVSS = VREFL =
0V, AVDD = VREFH = 3.6V
Differential Nonlinearity
>-1
—
<1
LSb
VINL = AVSS = VREFL =
0V, AVDD = VREFH = 3.6V
AD23b GERR
Gain Error
±1
±5
±6
LSb
VINL = AVSS = VREFL =
0V, AVDD = VREFH = 3.6V
AD24b EOFF
Offset Error
±1
±2
±3
LSb
VINL = AVSS = VREFL =
0V, AVDD = VREFH = 3.6V
AD25b —
Monotonicity(1)
—
—
—
—
AD30b THD
Total Harmonic Distortion
—
-64
-67
dB
—
AD31b SINAD
Signal to Noise and
Distortion
—
57
58
dB
—
AD32b SFDR
Spurious Free Dynamic
Range
—
67
71
dB
—
AD33b FNYQ
Input Signal Bandwidth
—
—
550
kHz
—
AD34b ENOB
Effective Number of Bits
9.1
9.7
9.8
bits
—
Guaranteed
Dynamic Performance (10-bit Mode)
Note 1:
The ADC conversion result never decreases with an increase in the input voltage, and has no missing
codes.
© 2007 Microchip Technology Inc.
Preliminary
DS70264B-page 221
dsPIC33FJ12GP201/202
FIGURE 21-17:
ADC CONVERSION (12-BIT MODE) TIMING CHARACTERISTICS
(ASAM = 0, SSRC<2:0> = 000)
AD50
ADCLK
Instruction
Execution
Set SAMP
Clear SAMP
SAMP
AD61
AD60
TSAMP
AD55
DONE
AD1IF
1
2
3
4
5
6
7
8
9
1 – Software sets AD1CON. SAMP to start sampling.
5 – Convert bit 11.
2 – Sampling starts after discharge period. TSAMP is described in
Section 28. “10/12-bit ADC without DMA” in the “dsPIC33F Family
Reference Manual”. Please see the Microchip web site for the
latest dsPIC33F Family Reference Manual sections.
6 – Convert bit 10.
3 – Software clears AD1CON. SAMP to start conversion.
9 – One TAD for end of conversion.
7 – Convert bit 1.
8 – Convert bit 0.
4 – Sampling ends, conversion sequence starts.
TABLE 21-37: ADC CONVERSION (12-BIT MODE) TIMING REQUIREMENTS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
No.
Symbol
Characteristic
Min.
Typ
Max.
Units
Conditions
Clock Parameters(1)
AD50
TAD
ADC Clock Period
AD51
tRC
ADC Internal RC Oscillator
Period
AD55
tCONV
Conversion Time
AD56
FCNV
Throughput Rate
AD57
TSAMP
Sample Time
AD60
tPCS
Conversion Start from Sample
Trigger(2)
AD61
tPSS
Sample Start from Setting
Sample (SAMP) bit(2)
AD62
tCSS
Conversion Completion to
Sample Start (ASAM = 1)(2)
AD63
tDPU
117.6
—
—
ns
—
250
—
ns
Conversion Rate
—
14 TAD
ns
—
—
500
Ksps
3 TAD
—
—
—
Timing Parameters
Note 1:
2:
Time to Stabilize Analog Stage
from ADC Off to ADC On(2)
—
1.0 TAD
—
—
Auto Convert Trigger
not selected
0.5 TAD
—
1.5 TAD
—
—
—
0.5 TAD
—
—
—
1
—
5
μs
—
Because the sample caps will eventually lose charge, clock rates below 10 kHz can affect linearity
performance, especially at elevated temperatures.
These parameters are characterized but not tested in manufacturing.
DS70264B-page 222
Preliminary
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
FIGURE 21-18:
ADC CONVERSION (10-BIT MODE) TIMING CHARACTERISTICS
(CHPS<1:0> = 01, SIMSAM = 0, ASAM = 0, SSRC<2:0> = 000)
AD50
ADCLK
Instruction
Execution Set SAMP
Clear SAMP
SAMP
AD61
AD60
AD55
TSAMP
AD55
DONE
AD1IF
Buffer(0)
Buffer(1)
1
2
3
4
5
6
7
8
5
6
7
8
1 – Software sets AD1CON. SAMP to start sampling.
2 – Sampling starts after discharge period. TSAMP is described in Section 28. “10/12-bit ADC without DMA”
in the “dsPIC33F Family Reference Manual”. Please see the Microchip web site for the latest dsPIC33F
Family Reference Manual sections.
3 – Software clears AD1CON. SAMP to start conversion.
4 – Sampling ends, conversion sequence starts.
5 – Convert bit 9.
6 – Convert bit 8.
7 – Convert bit 0.
8 – One TAD for end of conversion.
FIGURE 21-19:
ADC CONVERSION (10-BIT MODE) TIMING CHARACTERISTICS (CHPS<1:0> = 01,
SIMSAM = 0, ASAM = 1, SSRC<2:0> = 111, SAMC<4:0> = 00001)
AD50
ADCLK
Instruction
Set ADON
Execution
SAMP
TSAMP
AD55
TSAMP
AD55
AD55
AD1IF
DONE
1
2
3
4
5
6
7
1 – Software sets ADxCON. ADON to start AD operation.
3
Preliminary
5
6
8
4 – Convert bit 8.
2 – Sampling starts after discharge period.
5
TSAMP is described in Section 28. “10/12-bit ADC without DMA”
6
in the “dsPIC33F Family Reference Manual”. Please refer to
the Microchip web site for the latest dsPIC33F Family
7
Reference Manual sections.
–
Convert
bit
9.
3
8
© 2007 Microchip Technology Inc.
4
– Convert bit 0.
– One TAD for end of conversion.
– Begin conversion of next channel.
– Sample for time specified by SAMC<4:0>.
DS70264B-page 223
dsPIC33FJ12GP201/202
TABLE 21-38: ADC CONVERSION (10-BIT MODE) TIMING REQUIREMENTS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
Symbol
No.
Characteristic
Min.
Typ(1)
Max.
Units
Conditions
Clock Parameters(2)
AD50
TAD
ADC Clock Period
65
—
—
ns
AD51
tRC
ADC Internal RC Oscillator Period
—
250
—
ns
AD55
tCONV
Conversion Time
AD56
FCNV
Throughput Rate
AD57
TSAMP
Sample Time
AD60
tPCS
Conversion Start from Sample
Trigger(1)
AD61
tPSS
Sample Start from Setting
Sample (SAMP) bit(1)
AD62
tCSS
AD63
tDPU
Conversion Rate
—
12 TAD
—
—
—
—
1.1
Msps
2 TAD
—
—
—
Timing Parameters
Note 1:
2:
—
1.0 TAD
—
—
Auto-Convert Trigger
(SSRC<2:0> = 111) not
selected
0.5 TAD
—
1.5 TAD
—
—
Conversion Completion to
Sample Start (ASAM = 1)(1)
—
0.5 TAD
—
—
—
Time to Stabilize Analog Stage
from ADC Off to ADC On(1)
1
—
5
μs
—
These parameters are characterized but not tested in manufacturing.
Because the sample caps will eventually lose charge, clock rates below 10 kHz can affect linearity
performance, especially at elevated temperatures.
DS70264B-page 224
Preliminary
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
22.0
PACKAGING INFORMATION
22.1
Package Marking Information
18-Lead PDIP
Example
XXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXX
YYWWNNN
dsPIC33FJ12GP
201-E/P e3
0730235
28-Lead SPDIP
Example
dsPIC33FJ12GP
202-E/SP e3
0730235
XXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXX
YYWWNNN
18-Lead SOIC
Example
XXXXXXXXXXXX
XXXXXXXXXXXX
XXXXXXXXXXXX
dsPIC33FJ12
GP201-E/SO e3
0730235
YYWWNNN
28-Lead SOIC (.300”)
Example
XXXXXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXXXXX
YYWWNNN
dsPIC33FJ12GP
202-E/SO e3
0730235
28-Lead QFN
Example
XXXXXXXX
XXXXXXXX
YYWWNNN
Legend: XX...X
Y
YY
WW
NNN
e3
*
Note:
33FJ12GP
202EML e3
0730235
Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
If the full Microchip part number cannot be marked on one line, it is carried over to the next
line, thus limiting the number of available characters for customer-specific information.
© 2007 Microchip Technology Inc.
Preliminary
DS70264B-page 225
dsPIC33FJ12GP201/202
22.2
Package Details
18-Lead Plastic Dual In-Line (P) – 300 mil Body [PDIP]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
N
NOTE 1
E1
1
2
3
D
E
A2
A
L
c
A1
b1
b
e
eB
Units
Dimension Limits
Number of Pins
INCHES
MIN
N
NOM
MAX
18
Pitch
e
Top to Seating Plane
A
–
–
.210
Molded Package Thickness
A2
.115
.130
.195
Base to Seating Plane
A1
.015
–
–
Shoulder to Shoulder Width
E
.300
.310
.325
Molded Package Width
E1
.240
.250
.280
Overall Length
D
.880
.900
.920
Tip to Seating Plane
L
.115
.130
.150
Lead Thickness
c
.008
.010
.014
b1
.045
.060
.070
b
.014
.018
.022
eB
–
–
Upper Lead Width
Lower Lead Width
Overall Row Spacing §
.100 BSC
.430
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-007B
DS70264B-page 226
Preliminary
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
28-Lead Skinny Plastic Dual In-Line (SP) – 300 mil Body [SPDIP]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
N
NOTE 1
E1
1
2
3
D
E
A2
A
L
c
b1
A1
b
e
eB
Units
Dimension Limits
Number of Pins
INCHES
MIN
N
NOM
MAX
28
Pitch
e
Top to Seating Plane
A
–
–
.200
Molded Package Thickness
A2
.120
.135
.150
Base to Seating Plane
A1
.015
–
–
Shoulder to Shoulder Width
E
.290
.310
.335
Molded Package Width
E1
.240
.285
.295
Overall Length
D
1.345
1.365
1.400
Tip to Seating Plane
L
.110
.130
.150
Lead Thickness
c
.008
.010
.015
b1
.040
.050
.070
b
.014
.018
.022
eB
–
–
Upper Lead Width
Lower Lead Width
Overall Row Spacing §
.100 BSC
.430
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-070B
© 2007 Microchip Technology Inc.
Preliminary
DS70264B-page 227
dsPIC33FJ12GP201/202
18-Lead Plastic Small Outline (SO) – Wide, 7.50 mm Body [SOIC]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
N
E
E1
NOTE 1
1
2 3
e
b
α
h
h
c
φ
A2
A
A1
β
L
L1
Units
Dimension Limits
Number of Pins
MILLMETERS
MIN
N
NOM
MAX
18
Pitch
e
Overall Height
A
–
1.27 BSC
–
Molded Package Thickness
A2
2.05
–
–
Standoff §
A1
0.10
–
0.30
2.65
Overall Width
E
Molded Package Width
E1
10.30 BSC
7.50 BSC
Overall Length
D
11.55 BSC
Chamfer (optional)
h
0.25
–
0.75
Foot Length
L
0.40
–
1.27
Footprint
L1
1.40 REF
Foot Angle
φ
0°
–
8°
Lead Thickness
c
0.20
–
0.33
Lead Width
b
0.31
–
0.51
Mold Draft Angle Top
α
5°
–
15°
Mold Draft Angle Bottom
β
5°
–
15°
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-051B
DS70264B-page 228
Preliminary
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
28-Lead Plastic Small Outline (SO) – Wide, 7.50 mm Body [SOIC]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
N
E
E1
NOTE 1
1 2 3
e
b
h
α
A2
A
h
c
φ
L
A1
Units
Dimension Limits
Number of Pins
β
L1
MILLIMETERS
MIN
N
NOM
MAX
28
Pitch
e
Overall Height
A
–
1.27 BSC
–
Molded Package Thickness
A2
2.05
–
–
Standoff §
A1
0.10
–
0.30
Overall Width
E
Molded Package Width
E1
7.50 BSC
Overall Length
D
17.90 BSC
2.65
10.30 BSC
Chamfer (optional)
h
0.25
–
0.75
Foot Length
L
0.40
–
1.27
Footprint
L1
1.40 REF
Foot Angle Top
φ
0°
–
8°
Lead Thickness
c
0.18
–
0.33
Lead Width
b
0.31
–
0.51
Mold Draft Angle Top
α
5°
–
15°
Mold Draft Angle Bottom
β
5°
–
15°
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-052B
© 2007 Microchip Technology Inc.
Preliminary
DS70264B-page 229
dsPIC33FJ12GP201/202
28-Lead Plastic Quad Flat, No Lead Package (ML) – 6x6 mm Body [QFN]
with 0.55 mm Contact Length
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
D2
EXPOSED
PAD
e
E
b
E2
2
2
1
1
K
N
N
NOTE 1
L
BOTTOM VIEW
TOP VIEW
A
A3
A1
Units
Dimension Limits
Number of Pins
MILLIMETERS
MIN
N
NOM
MAX
28
Pitch
e
Overall Height
A
0.80
0.65 BSC
0.90
1.00
Standoff
A1
0.00
0.02
0.05
Contact Thickness
A3
0.20 REF
Overall Width
E
Exposed Pad Width
E2
Overall Length
D
Exposed Pad Length
D2
3.65
3.70
4.20
b
0.23
0.30
0.35
Contact Length
L
0.50
0.55
0.70
Contact-to-Exposed Pad
K
0.20
–
–
Contact Width
6.00 BSC
3.65
3.70
4.20
6.00 BSC
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated.
3. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-105B
DS70264B-page 230
Preliminary
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
APPENDIX A:
REVISION HISTORY
Revision A (January 2007)
Initial release of this document.
Revision B (May 2007)
This revision includes the following corrections and
updates:
• Minor typographical and formatting corrections
throughout the data sheet text.
• New content:
- Addition of bullet item (16-word conversion
result buffer) (see Section 17.1 “Key
Features”)
• Figure update:
- Oscillator System Diagram (see Figure 7-1)
- WDT Block Diagram (see Figure 18-2)
• Equation update:
- Serial Clock Rate (see Equation 15-1)
• Register updates:
- Clock Divisor Register (see Register 7-2)
- PLL Feedback Divisor Register (see
Register 7-3)
- Peripheral Pin Select Input Registers (see
Register 9-1 through Register 9-9)
- ADC1 Input Channel 1, 2, 3 Select Register
(see Register 17-4)
- ADC1 Input Channel 0 Select Register (see
Register 17-5)
• Table updates:
- CNEN2 (see Table 3-2 and Table 3-3)
- Reset Flag Bit Operation (see Table 5-1)
- Configuration Bit Values for Clock Operation
(see Table 7-1)
• Operation value update:
- IOLOCK set/clear operation (see
Section 9.4.4.1 “Control Register Lock”)
• The following tables in Section 21.0 “Electrical
Characteristics” have been updated with
preliminary values:
- Updated Max MIPS for -40°C to +125°C
Temp Range (see Table 21-1)
- Added new parameters for +125°C, and
updated Typical and Max values for most
parameters (see Table 21-5)
- Added new parameters for +125°C, and
updated Typical and Max values for most
parameters (see Table 21-6)
© 2007 Microchip Technology Inc.
- Added new parameters for +125°C, and
updated Typical and Max values for most
parameters (see Table 21-7)
- Added new parameters for +125°C, and
updated Typical and Max values for most
parameters (see Table 21-8)
- Updated parameter DI51, added parameter
DI51a (see Table 21-9)
- Added Note 1 (see Table 21-11)
- Updated parameter OS30 (see Table 21-16)
- Updated parameter OS52 (see Table 21-17)
- Updated parameter F20, added Note 2 (see
Table 21-18)
- Updated parameter F21 (see Table 21-19)
- Updated parameter TA15 (see Table 21-22)
- Updated parameter TB15 (see Table 21-23)
- Updated parameter TC15 (see Table 21-24)
- Updated parameter IC15 (see Table 21-25)
- Updated parameters AD05, AD06, AD07,
AD08, AD10, and AD11; added parameters
AD05a and AD06a; added Note 2; modified
ADC Accuracy headings to include
measurement information (see Table 21-34)
- Separated the ADC Module Specifications
table into three tables (see Table 21-34,
Table 21-35, and Table 21-36)
- Updated parameter AD50 (see Table 21-37)
- Updated parameters AD50 and AD57 (see
Table 21-38)
Preliminary
DS70264B-page 231
dsPIC33FJ12GP201/202
NOTES:
DS70264B-page 232
Preliminary
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
INDEX
A
A/D Converter ................................................................... 161
Initialization ............................................................... 161
Key Features............................................................. 161
AC Characteristics ............................................................ 200
Internal RC Accuracy ................................................ 202
Load Conditions ........................................................ 200
ADC Module
ADC1 Register Map .............................................. 34, 35
Alternate Vector Table (AIVT) ............................................. 59
Arithmetic Logic Unit (ALU)................................................. 17
Assembler
MPASM Assembler................................................... 188
Automatic Clock Stretch.................................................... 145
Receive Mode ........................................................... 145
Transmit Mode .......................................................... 145
B
Barrel Shifter ....................................................................... 21
Bit-Reversed Addressing .................................................... 41
Example ...................................................................... 42
Implementation ........................................................... 41
Sequence Table (16-Entry)......................................... 42
Block Diagrams
16-bit Timer1 Module ................................................ 119
A/D Module ............................................................... 162
Connections for On-Chip Voltage Regulator............. 176
DSP Engine ................................................................ 18
dsPIC33FJ12GP201/202 .............................................. 8
dsPIC33FJ12GP201/202 CPU Core........................... 12
dsPIC33FJ12GP201/202 Oscillator System ............... 87
dsPIC33FJ12GP201/202 PLL..................................... 89
Input Capture ............................................................ 127
Output Compare ....................................................... 132
PLL.............................................................................. 89
Reset System.............................................................. 53
Shared Port Structure ................................................. 99
SPI ............................................................................ 136
Timer2 (16-bit) .......................................................... 123
Timer2/3 (32-bit) ....................................................... 122
UART ........................................................................ 153
Watchdog Timer (WDT) ............................................ 177
C
C Compilers
MPLAB C18 .............................................................. 188
MPLAB C30 .............................................................. 188
Clock Switching................................................................... 95
Enabling ...................................................................... 95
Sequence.................................................................... 95
Code Examples
Erasing a Program Memory Page............................... 51
Initiating a Programming Sequence............................ 52
Loading Write Buffers ................................................. 52
Port Write/Read ........................................................ 100
PWRSAV Instruction Syntax....................................... 97
Code Protection ........................................................ 173, 178
Configuration Bits.............................................................. 173
Description (Table).................................................... 174
Configuration Register Map .............................................. 173
Configuring Analog Port Pins ............................................ 100
CPU
Control Register .......................................................... 14
© 2007 Microchip Technology Inc.
CPU Clocking System ........................................................ 88
Options ....................................................................... 88
Selection..................................................................... 88
Customer Change Notification Service............................. 237
Customer Notification Service .......................................... 237
Customer Support............................................................. 237
D
Data Accumulators and Adder/Subtracter .......................... 19
Data Space Write Saturation ...................................... 21
Overflow and Saturation ............................................. 19
Round Logic ............................................................... 20
Write Back .................................................................. 20
Data Address Space........................................................... 25
Alignment.................................................................... 25
Memory Map for dsPIC33FJ12GP201/202
Devices with 1 KB RAM...................................... 26
Near Data Space ........................................................ 25
Software Stack ........................................................... 38
Width .......................................................................... 25
DC Characteristics............................................................ 192
I/O Pin Input Specifications ...................................... 197
I/O Pin Output Specifications.................................... 198
Idle Current (IDOZE) .................................................. 196
Idle Current (IIDLE) .................................................... 195
Operating Current (IDD) ............................................ 194
Power-Down Current (IPD)........................................ 196
Program Memory...................................................... 199
Temperature and Voltage Specifications.................. 193
Development Support ....................................................... 187
DSP Engine ........................................................................ 17
Multiplier ..................................................................... 19
E
Electrical Characteristics .................................................. 191
AC............................................................................. 200
Equations
A/D Conversion Clock Period ................................... 163
Calculating the PWM Period..................................... 130
Calculation for Maximum PWM Resolution .............. 130
Device Operating Frequency...................................... 88
Relationship Between Device and SPI Clock
Speed ............................................................... 138
Serial Clock Rate...................................................... 143
UART Baud Rate with BRGH = 0 ............................. 154
UART Baud Rate with BRGH = 1 ............................. 154
Errata .................................................................................... 6
F
Flash Program Memory ...................................................... 47
Control Registers........................................................ 48
Operations .................................................................. 48
Programming Algorithm .............................................. 51
RTSP Operation ......................................................... 48
Table Instructions ....................................................... 47
Flexible Configuration ....................................................... 173
FSCM
Delay for Crystal and PLL Clock Sources .................. 57
Device Resets ............................................................ 57
Preliminary
DS70264B-page 233
dsPIC33FJ12GP201/202
I
M
I/O Ports .............................................................................. 99
Parallel I/O (PIO)......................................................... 99
Write/Read Timing .................................................... 100
I2C
Addresses ................................................................. 145
Baud Rate Generator ................................................ 143
General Call Address Support .................................. 145
Interrupts ................................................................... 143
IPMI Support ............................................................. 145
Master Mode Operation
Clock Arbitration................................................ 146
Multi-Master Communication, Bus Collision
and Bus Arbitration ................................... 146
Operating Modes ...................................................... 143
Registers ................................................................... 143
Slave Address Masking ............................................ 145
Slope Control ............................................................ 146
Software Controlled Clock Stretching (STREN = 1).. 145
I2C Module
I2C1 Register Map ...................................................... 32
In-Circuit Debugger ........................................................... 178
In-Circuit Emulation........................................................... 173
In-Circuit Serial Programming (ICSP) ....................... 173, 178
Infrared Support
Built-in IrDA Encoder and Decoder ........................... 155
External IrDA, IrDA Clock Output.............................. 155
Input Capture
Registers ................................................................... 128
Input Change Notification.................................................. 100
Instruction Addressing Modes............................................. 38
File Register Instructions ............................................ 38
Fundamental Modes Supported.................................. 39
MAC Instructions......................................................... 39
MCU Instructions ........................................................ 38
Move and Accumulator Instructions ............................ 39
Other Instructions........................................................ 39
Instruction Set
Overview ................................................................... 182
Summary................................................................... 179
Instruction-Based Power-Saving Modes ............................. 97
Idle .............................................................................. 98
Sleep ........................................................................... 97
Internal RC Oscillator
Use with WDT ........................................................... 177
Internet Address................................................................ 237
Interrupt Control and Status Registers................................ 63
IECx ............................................................................ 63
IFSx............................................................................. 63
INTCON1 .................................................................... 63
INTCON2 .................................................................... 63
IPCx ............................................................................ 63
Interrupt Setup Procedures ................................................. 85
Initialization ................................................................. 85
Interrupt Disable.......................................................... 85
Interrupt Service Routine ............................................ 85
Trap Service Routine .................................................. 85
Interrupt Vector Table (IVT) ................................................ 59
Interrupts Coincident with Power Save Instructions............ 98
Memory Organization ......................................................... 23
Microchip Internet Web Site.............................................. 237
Modulo Addressing ............................................................. 40
Applicability................................................................. 41
Operation Example ..................................................... 40
Start and End Address ............................................... 40
W Address Register Selection .................................... 40
MPLAB ASM30 Assembler, Linker, Librarian ................... 188
MPLAB ICD 2 In-Circuit Debugger ................................... 189
MPLAB ICE 2000 High-Performance Universal
In-Circuit Emulator .................................................... 189
MPLAB Integrated Development Environment Software.. 187
MPLAB PM3 Device Programmer .................................... 189
MPLAB REAL ICE In-Circuit Emulator System ................ 189
MPLINK Object Linker/MPLIB Object Librarian ................ 188
J
JTAG Boundary Scan Interface ........................................ 173
DS70264B-page 234
N
NVM Module
Register Map .............................................................. 37
O
Open-Drain Configuration................................................. 100
Output Compare ............................................................... 129
Registers .................................................................. 133
P
Packaging ......................................................................... 225
Details....................................................................... 226
Marking ..................................................................... 225
Peripheral Module Disable (PMD) ...................................... 98
Peripheral Pin Select
Input Register Map ..................................................... 33
PICSTART Plus Development Programmer..................... 190
Pinout I/O Descriptions (table).............................................. 9
PMD Module
Register Map .............................................................. 37
POR and Long Oscillator Start-up Times ........................... 57
PORTA
Register Map .............................................................. 36
PORTB
Register Map .............................................................. 36
Power-Saving Features ...................................................... 97
Clock Frequency and Switching ................................. 97
Program Address Space..................................................... 23
Construction ............................................................... 43
Data Access from Program Memory Using
Program Space Visibility..................................... 46
Data Access from Program Memory Using Table
Instructions ......................................................... 45
Data Access from, Address Generation ..................... 44
Memory Map............................................................... 23
Table Read Instructions
TBLRDH ............................................................. 45
TBLRDL.............................................................. 45
Visibility Operation ...................................................... 46
Program Memory
Interrupt Vector ........................................................... 24
Organization ............................................................... 24
Reset Vector ............................................................... 24
Pulse-Width Modulation Mode.......................................... 130
PWM
Duty Cycle ................................................................ 130
Period ....................................................................... 130
Preliminary
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
R
S
Reader Response ............................................................. 238
Registers
AD1CHS0 (ADC1 Input Channel 0 Select ................ 170
AD1CHS123 (ADC1 Input Channel 1, 2, 3 Select) ... 168
AD1CON1 (ADC1 Control 1) .................................... 164
AD1CON2 (ADC1 Control 2) .................................... 166
AD1CON3 (ADC1 Control 3) .................................... 167
AD1CSSL (ADC1 Input Scan Select Low)................ 171
AD1PCFGL (ADC1 Port Configuration Low) ............ 171
CLKDIV (Clock Divisor)............................................... 92
CORCON (Core Control) ...................................... 16, 64
I2CxCON (I2Cx Control) ........................................... 147
I2CxMSK (I2Cx Slave Mode Address Mask) ............ 151
I2CxSTAT (I2Cx Status) ........................................... 149
ICxCON (Input Capture x Control) ............................ 128
IEC0 (Interrupt Enable Control 0) ............................... 72
IEC1 (Interrupt Enable Control 0) ............................... 74
IEC4 (Interrupt Enable Control 0) ............................... 75
IFS0 (Interrupt Flag Status 0) ..................................... 68
IFS1 (Interrupt Flag Status 1) ..................................... 70
IFS4 (Interrupt Flag Status 4) ..................................... 71
INTCON1 (Interrupt Control 1).................................... 65
INTCON2 (Interrupt Control 2).................................... 67
INTTREG Interrupt Control and Status Register......... 84
IPC0 (Interrupt Priority Control 0) ............................... 76
IPC1 (Interrupt Priority Control 1) ............................... 77
IPC16 (Interrupt Priority Control 16) ........................... 83
IPC2 (Interrupt Priority Control 2) ............................... 78
IPC3 (Interrupt Priority Control 3) ............................... 79
IPC4 (Interrupt Priority Control 4) ............................... 80
IPC5 (Interrupt Priority Control 5) ............................... 81
IPC7 (Interrupt Priority Control 7) ............................... 82
NVMCON (Flash Memory Control) ............................. 49
NVMCON (Nonvolatile Memory Key).......................... 50
OCxCON (Output Compare x Control) ..................... 133
OSCCON (Oscillator Control) ..................................... 90
OSCTUN (FRC Oscillator Tuning) .............................. 94
PLLFBD (PLL Feedback Divisor)................................ 93
RCON (Reset Control) ................................................ 54
SPIxCON1 (SPIx Control 1)...................................... 140
SPIxCON2 (SPIx Control 2)...................................... 142
SPIxSTAT (SPIx Status and Control) ....................... 139
SR (CPU Status)................................................... 14, 64
T1CON (Timer1 Control)........................................... 120
T2CON Control ......................................................... 124
T3CON Control ......................................................... 125
UxMODE (UARTx Mode).......................................... 156
UxSTA (UARTx Status and Control)......................... 158
Reset
Clock Source Selection............................................... 56
Special Function Register Reset States ..................... 57
Times .......................................................................... 56
Reset Sequence ................................................................. 59
Resets ................................................................................. 53
Serial Peripheral Interface (SPI) ....................................... 135
Setup for Continuous Output Pulse Generation ............... 129
Setup for Single Output Pulse Generation........................ 129
Software Simulator (MPLAB SIM) .................................... 188
Software Stack Pointer, Frame Pointer
CALL Stack Frame ..................................................... 38
Special Features of the CPU ............................................ 173
SPI
Master, Frame Master Connection ........................... 137
Master/Slave Connection ......................................... 137
Slave, Frame Master Connection ............................. 138
Slave, Frame Slave Connection ............................... 138
SPI Module
SPI1 Register Map ..................................................... 32
Symbols Used in Opcode Descriptions ............................ 180
System Control
Register Map .............................................................. 36
© 2007 Microchip Technology Inc.
T
Temperature and Voltage Specifications
AC............................................................................. 200
Timer1 .............................................................................. 119
Timer2/3 ........................................................................... 121
Timing Characteristics
CLKO and I/O ........................................................... 203
Timing Diagrams
10-bit A/D Conversion .............................................. 223
10-bit A/D Conversion (CHPS = 01, SIMSAM = 0,
ASAM = 0, SSRC = 000) .................................. 223
12-bit A/D Conversion (ASAM = 0, SSRC = 000)..... 222
External Clock .......................................................... 201
I2Cx Bus Data (Master Mode) .................................. 215
I2Cx Bus Data (Slave Mode) .................................... 217
I2Cx Bus Start/Stop Bits (Master Mode)................... 215
I2Cx Bus Start/Stop Bits (Slave Mode)..................... 217
Input Capture (CAPx) ............................................... 208
OC/PWM .................................................................. 209
Output Compare (OCx) ............................................ 208
Reset, Watchdog Timer, Oscillator Start-up
Timer and Power-up Timer............................... 204
SPIx Master Mode (CKE = 0) ................................... 210
SPIx Master Mode (CKE = 1) ................................... 211
SPIx Slave Mode (CKE = 0) ..................................... 212
SPIx Slave Mode (CKE = 1) ..................................... 213
Timer1, 2 and 3 External Clock ................................ 206
Timing Requirements
CLKO and I/O ........................................................... 203
DCI AC-Link Mode.................................................... 219
DCI Multi-Channel, I2S Modes ................................. 219
External Clock .......................................................... 201
Input Capture............................................................ 208
Timing Specifications
10-bit A/D Conversion Requirements ....................... 224
12-bit A/D Conversion Requirements ....................... 222
I2Cx Bus Data Requirements (Master Mode)........... 216
I2Cx Bus Data Requirements (Slave Mode)............. 218
Output Compare Requirements................................ 208
PLL Clock ................................................................. 202
Reset, Watchdog Timer, Oscillator Start-up Timer,
Power-up Timer and Brown-out Reset
Requirements ................................................... 205
Simple OC/PWM Mode Requirements ..................... 209
SPIx Master Mode (CKE = 0) Requirements............ 210
SPIx Master Mode (CKE = 1) Requirements............ 211
Preliminary
DS70264B-page 235
dsPIC33FJ12GP201/202
SPIx Slave Mode (CKE = 0) Requirements .............. 212
SPIx Slave Mode (CKE = 1) Requirements .............. 214
Timer1 External Clock Requirements ....................... 206
Timer2 External Clock Requirements ....................... 207
Timer3 External Clock Requirements ....................... 207
U
UART
Baud Rate
Generator (BRG)............................................... 154
Break and Sync Transmit Sequence ........................ 155
Flow Control Using UxCTS and UxRTS Pins............ 155
Receiving in 8-bit or 9-bit Data Mode........................ 155
Transmitting in 8-bit Data Mode ................................ 155
Transmitting in 9-bit Data Mode ................................ 155
UART Module
UART1 Register Map .................................................. 32
V
Voltage Regulator (On-Chip)............................................. 176
W
Watchdog Timer (WDT) ............................................ 173, 177
Programming Considerations ................................... 177
WWW Address.................................................................. 237
WWW, On-Line Support........................................................ 6
DS70264B-page 236
Preliminary
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
THE MICROCHIP WEB SITE
CUSTOMER SUPPORT
Microchip provides online support via our WWW site at
www.microchip.com. This web site is used as a means
to make files and information easily available to
customers. Accessible by using your favorite Internet
browser, the web site contains the following information:
Users of Microchip products can receive assistance
through several channels:
• Product Support – Data sheets and errata, application notes and sample programs, design
resources, user’s guides and hardware support
documents, latest software releases and archived
software
• General Technical Support – Frequently Asked
Questions (FAQ), technical support requests,
online discussion groups, Microchip consultant
program member listing
• Business of Microchip – Product selector and
ordering guides, latest Microchip press releases,
listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives
•
•
•
•
Distributor or Representative
Local Sales Office
Field Application Engineer (FAE)
Technical Support
Customers should contact their distributor, representative or field application engineer (FAE) for support.
Local sales offices are also available to help customers. A listing of sales offices and locations is included
in the back of this document.
Technical support is available through the web site
at: http://support.microchip.com
CUSTOMER CHANGE NOTIFICATION
SERVICE
Microchip’s customer notification service helps keep
customers current on Microchip products. Subscribers
will receive e-mail notification whenever there are
changes, updates, revisions or errata related to a specified product family or development tool of interest.
To register, access the Microchip web site at
www.microchip.com, click on Customer Change Notification and follow the registration instructions.
© 2007 Microchip Technology Inc.
Preliminary
DS70264B-page 237
dsPIC33FJ12GP201/202
READER RESPONSE
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation
can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150.
Please list the following information, and use this outline to provide us with your comments about this document.
To:
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FAX: (______) _________ - _________
Application (optional):
Would you like a reply?
Y
Device: dsPIC33FJ12GP201/202
N
Literature Number: DS70264B
Questions:
1. What are the best features of this document?
2. How does this document meet your hardware and software development needs?
3. Do you find the organization of this document easy to follow? If not, why?
4. What additions to the document do you think would enhance the structure and subject?
5. What deletions from the document could be made without affecting the overall usefulness?
6. Is there any incorrect or misleading information (what and where)?
7. How would you improve this document?
DS70264B-page 238
Preliminary
© 2007 Microchip Technology Inc.
dsPIC33FJ12GP201/202
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
dsPIC 33 FJ 12 GP2 02 T E / SP - XXX
Examples:
a)
Microchip Trademark
Architecture
dsPIC33FJ12GP202-E/SP:
General purpose dsPIC33, 12 KB program memory, 28-pin, Extended temp.,
SPDIP package.
Flash Memory Family
Program Memory Size (KB)
Product Group
Pin Count
Tape and Reel Flag (if applicable)
Temperature Range
Package
Pattern
Architecture:
33
=
16-bit Digital Signal Controller
Flash Memory Family:
FJ
=
Flash program memory, 3.3V
Product Group:
GP2
=
General purpose family
Pin Count:
01
02
=
=
18-pin
28-pin
Temperature Range:
I
E
=
=
-40°C to +85°C (Industrial)
-40°C to +125°C (Extended)
Package:
P
SP
SO
ML
=
=
=
=
Plastic Dual In-Line - 300 mil body (PDIP)
Skinny Plastic Dual In-Line - 300 mil body (SPDIP)
Plastic Small Outline - Wide, 300 mil body (SOIC)
Plastic Quad, No Lead Package - 6x6 mm body (QFN)
© 2007 Microchip Technology Inc.
Preliminary
DS70264B-page 239
WORLDWIDE SALES AND SERVICE
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://support.microchip.com
Web Address:
www.microchip.com
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
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Tel: 852-2401-1200
Fax: 852-2401-3431
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Tel: 91-80-4182-8400
Fax: 91-80-4182-8422
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
India - Pune
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France - Paris
Tel: 33-1-69-53-63-20
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Tel: 81-45-471- 6166
Fax: 81-45-471-6122
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Tel: 49-89-627-144-0
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Tel: 678-957-9614
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Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
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Tel: 630-285-0071
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Tel: 972-818-7423
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Mississauga, Ontario,
Canada
Tel: 905-673-0699
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Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
China - Beijing
Tel: 86-10-8528-2100
Fax: 86-10-8528-2104
Korea - Gumi
Tel: 82-54-473-4301
Fax: 82-54-473-4302
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
China - Fuzhou
Tel: 86-591-8750-3506
Fax: 86-591-8750-3521
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
China - Hong Kong SAR
Tel: 852-2401-1200
Fax: 852-2401-3431
Malaysia - Penang
Tel: 60-4-646-8870
Fax: 60-4-646-5086
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Taiwan - Hsin Chu
Tel: 886-3-572-9526
Fax: 886-3-572-6459
China - Shenzhen
Tel: 86-755-8203-2660
Fax: 86-755-8203-1760
Taiwan - Kaohsiung
Tel: 886-7-536-4818
Fax: 886-7-536-4803
China - Shunde
Tel: 86-757-2839-5507
Fax: 86-757-2839-5571
Taiwan - Taipei
Tel: 886-2-2500-6610
Fax: 886-2-2508-0102
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
China - Xian
Tel: 86-29-8833-7250
Fax: 86-29-8833-7256
12/08/06
DS70264B-page 240
Preliminary
© 2007 Microchip Technology Inc.