STMicroelectronics M24128-BWBN3P 128 kbit, 64 kbit and 32 kbit serial iâ²c bus eeprom Datasheet

M24128
M24C64 M24C32
128 Kbit, 64 Kbit and 32 Kbit serial I²C bus EEPROM
Features
■
Two-wire I2C serial interface
supports 400 kHz protocol
■
Single supply voltages (see Table 1 for root
part numbers):
– 2.5 V to 5.5 V
– 1.8 V to 5.5 V
– 1.7 V to 5.5 V
■
Write Control input
■
Byte and Page Write
■
Random and Sequential Read modes
■
Self-timed programming cycle
■
Automatic address incrementing
■
Enhanced ESD/latch-up protection
■
More than 1 Million write cycles
■
More than 40-year data retention
■
Packages
– ECOPACK® (RoHS compliant)
Table 1.
M24C64
M24C32
SO8 (MN)
150 mil width
TSSOP8 (DW)
169 mil width
Device summary
Reference
M24128
PDIP8 (BN)
Part number
Supply voltage
M24128-BW
2.5 V to 5.5V
M24128-BR
1.8 V to 5.5V
M24128-BF
1.7 V to 5.5V
M24C64-W
2.5 V to 5.5V
M24C64-R
1.8 V to 5.5V
M24C64-F
1.7 V to 5.5V
M24C32-W
2.5 V to 5.5V
M24C32-R
1.8 V to 5.5V
M24C32-F
1.7 V to 5.5V
September 2008
UFDFPN8 (MB)
2 × 3 mm (MLP)
WLCSP (CS)
Rev 15
1/39
www.st.com
1
Contents
M24128, M24C64, M24C32
Contents
1
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2
Signal description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.1
Serial Clock (SCL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.2
Serial Data (SDA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.3
Chip Enable (E0, E1, E2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.4
Write Control (WC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.5
VSS ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.6
Supply voltage (VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.6.1
2.6.2
Operating supply voltage VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Power-up conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.6.3
Device reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.6.4
Power-down conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
3
Memory organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
4
Device operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
2/39
4.1
Start condition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
4.2
Stop condition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
4.3
Acknowledge bit (ACK) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
4.4
Data Input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
4.5
Memory addressing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
4.6
Write operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
4.7
Byte Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
4.8
Page Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
4.9
ECC (error correction code) and write cycling . . . . . . . . . . . . . . . . . . . . . 17
4.10
Minimizing system delays by polling on ACK . . . . . . . . . . . . . . . . . . . . . . 18
4.11
Read operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
4.12
Random Address Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
4.13
Current Address Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
4.14
Sequential Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
4.15
Acknowledge in Read mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
M24128, M24C64, M24C32
Contents
5
Initial delivery state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
6
Maximum rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
7
DC and AC parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
8
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
9
Part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
10
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
3/39
List of tables
M24128, M24C64, M24C32
List of tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.
Table 10.
Table 11.
Table 12.
Table 13.
Table 14.
Table 15.
Table 16.
Table 17.
Table 18.
Table 19.
Table 20.
Table 21.
Table 22.
Table 23.
Table 24.
Table 25.
Table 26.
Table 27.
Table 28.
4/39
Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Signal names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Device select code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Address most significant byte . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Address least significant byte . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Operating modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Operating conditions (M24xxx-W) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Operating conditions (M24xxx-R) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Operating conditions (M24xxx-F) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
AC test measurement conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Input parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
DC characteristics (M24xxx-W, device grade 6). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
DC characteristics (M24xxx-W, device grade 3). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
DC characteristics (M24xxx-R - device grade 6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
DC characteristics (M24xxx-F) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
AC characteristics (M24xxx-W6, M24xxW3, M24xxR6) . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
AC characteristics (M24xxx-F) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
PDIP8 – 8 pin plastic DIP, 0.25 mm lead frame, package mechanical data. . . . . . . . . . . . 29
SO8 narrow – 8 lead plastic small outline, 150 mils body width,
package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
TSSOP8 – 8 lead thin shrink small outline, package mechanical data. . . . . . . . . . . . . . . . 31
UFDFPN8 (MLP8) – 8-lead ultra thin fine pitch dual flat package no lead
2 × 3mm, package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
M24128 WLCSP, 0.5 mm pitch, package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . 33
Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Available M24C32 products (package, voltage range, temperature grade) . . . . . . . . . . . . 35
Available M24C64 products (package, voltage range, temperature grade) . . . . . . . . . . . . 35
Available M24128 products (package, voltage range, temperature grade) . . . . . . . . . . . . 35
Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
M24128, M24C64, M24C32
List of figures
List of figures
Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
Figure 8.
Figure 9.
Figure 10.
Figure 11.
Figure 12.
Figure 13.
Figure 14.
Figure 15.
Figure 16.
Figure 17.
Figure 18.
Logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
DIP, SO, TSSOP and UFDFPN connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
M24128 WLCSP connections (top view, marking side, with balls on the
underside) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Device select code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Maximum RP value versus bus parasitic capacitance (C) for an I2C bus . . . . . . . . . . . . . . 10
I2C bus protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Write mode sequences with WC = 1 (data write inhibited) . . . . . . . . . . . . . . . . . . . . . . . . . 15
Write mode sequences with WC = 0 (data write enabled) . . . . . . . . . . . . . . . . . . . . . . . . . 17
Write cycle polling flowchart using ACK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Read mode sequences . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
AC test measurement I/O waveform. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
AC waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
PDIP8 – 8 pin plastic DIP, 0.25 mm lead frame, package outline . . . . . . . . . . . . . . . . . . . 29
SO8 narrow – 8 lead plastic small outline, 150 mils body width, package outline . . . . . . . 30
TSSOP8 – 8 lead thin shrink small outline, package outline . . . . . . . . . . . . . . . . . . . . . . . 31
UFDFPN8 (MLP8) – 8-lead ultra thin fine pitch dual flat package no lead
2 × 3mm, package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
M24128 WLCSP, 0.5 mm pitch, package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
5/39
Description
1
M24128, M24C64, M24C32
Description
The M24C32, M24C64 and M24128 devices are I2C-compatible electrically erasable
programmable memories (EEPROM). They are organized as 4096 × 8 bits, 8192 × 8 bits
and 16384 × 8 bits, respectively.
Figure 1.
Logic diagram
VCC
3
E0-E2
SCL
SDA
M24128
M24C64
M24C32
WC
VSS
AI01844e
I2C uses a two-wire serial interface, comprising a bi-directional data line and a clock line.
The devices carry a built-in 4-bit Device Type Identifier code (1010) in accordance with the
I2C bus definition.
The device behaves as a slave in the I2C protocol, with all memory operations synchronized
by the serial clock. Read and Write operations are initiated by a Start condition, generated
by the bus master. The Start condition is followed by a device select code and Read/Write
bit (RW) (as described in Table 3), terminated by an acknowledge bit.
When writing data to the memory, the device inserts an acknowledge bit during the 9th bit
time, following the bus master’s 8-bit transmission. When data is read by the bus master, the
bus master acknowledges the receipt of the data byte in the same way. Data transfers are
terminated by a Stop condition after an Ack for Write, and after a NoAck for Read.
6/39
M24128, M24C64, M24C32
Table 2.
Description
Signal names
Signal name
Function
Direction
E0, E1, E2
Chip Enable
Input
SDA
Serial Data
I/O
SCL
Serial Clock
Input
WC
Write Control
Input
VCC
Supply voltage
VSS
Ground
Figure 2.
DIP, SO, TSSOP and UFDFPN connections
E0
E1
E2
VSS
M24128
M24C64
M24C32
1
8
2
7
3
6
4
5
VCC
WC
SCL
SDA
AI01845e
1. See Package mechanical data section for package dimensions, and how to identify pin-1.
Figure 3.
M24128 WLCSP connections (top view, marking side, with balls on the
underside)
VCC
E1
E2
WC
SDA
E0
SCL
VSS
ai14799
7/39
Signal description
M24128, M24C64, M24C32
2
Signal description
2.1
Serial Clock (SCL)
This input signal is used to strobe all data in and out of the device. In applications where this
signal is used by slave devices to synchronize the bus to a slower clock, the bus master
must have an open drain output, and a pull-up resistor must be connected from Serial Clock
(SCL) to VCC. (Figure 5 indicates how the value of the pull-up resistor can be calculated). In
most applications, though, this method of synchronization is not employed, and so the pullup resistor is not necessary, provided that the bus master has a push-pull (rather than open
drain) output.
2.2
Serial Data (SDA)
This bi-directional signal is used to transfer data in or out of the device. It is an open drain
output that may be wire-OR’ed with other open drain or open collector signals on the bus. A
pull up resistor must be connected from Serial Data (SDA) to VCC. (Figure 5 indicates how
the value of the pull-up resistor can be calculated).
2.3
Chip Enable (E0, E1, E2)
These input signals are used to set the value that is to be looked for on the three least
significant bits (b3, b2, b1) of the 7-bit device select code. These inputs must be tied to VCC
or VSS, to establish the device select code as shown in Figure 4. When not connected (left
floating), these inputs are read as low (0,0,0).
Figure 4.
Device select code
VCC
VCC
M24xxx
M24xxx
Ei
Ei
VSS
VSS
Ai12806
2.4
Write Control (WC)
This input signal is useful for protecting the entire contents of the memory from inadvertent
write operations. Write operations are disabled to the entire memory array when Write
Control (WC) is driven high. When unconnected, the signal is internally read as VIL, and
Write operations are allowed.
When Write Control (WC) is driven high, device select and Address bytes are
acknowledged, Data bytes are not acknowledged.
8/39
M24128, M24C64, M24C32
2.5
Signal description
VSS ground
VSS is the reference for the VCC supply voltage.
2.6
Supply voltage (VCC)
2.6.1
Operating supply voltage VCC
Prior to selecting the memory and issuing instructions to it, a valid and stable VCC voltage
within the specified [VCC(min), VCC(max)] range must be applied (see Table 9 and Table 10).
In order to secure a stable DC supply voltage, it is recommended to decouple the VCC line
with a suitable capacitor (usually of the order of 10 nF to 100 nF) close to the VCC/VSS
package pins.
This voltage must remain stable and valid until the end of the transmission of the instruction
and, for a Write instruction, until the completion of the internal write cycle (tW).
2.6.2
Power-up conditions
When the power supply is turned on, VCC rises from VSS to VCC. The VCC rise time must not
vary faster than 1V/µs.
2.6.3
Device reset
In order to prevent inadvertent Write operations during power-up, a power on reset (POR)
circuit is included. At power-up (continuous rise of VCC), the device does not respond to any
instruction until VCC has reached the power on reset threshold voltage (this threshold is
lower than the minimum VCC operating voltage defined in Table 9 and Table 10). Until VCC
passes over the POR threshold, the device is reset and in Standby Power mode.
In a similar way, during power-down (continuous decay of VCC), as soon as VCC drops below
the POR threshold voltage, the device is reset and stops responding to any instruction sent
to it.
2.6.4
Power-down conditions
During power-down (continuous decay of VCC), the device must be in Standby Power mode
(mode reached after decoding a Stop condition, assuming that there is no internal Write
cycle in progress).
9/39
Signal description
M24128, M24C64, M24C32
Maximum RP value versus bus parasitic capacitance (C) for an I2C bus
Figure 5.
Bus line pull-up resistor
(k )
100
fC = 400 kHz, tLOW = 1.3 µs
Rbus x Cbus time
constant must be less than
500 ns
VCC
10
Rbus
SCL
I²C bus
master
M24xxx
SDA
1
10
100
Cbus
1000
Bus line capacitor (pF)
ai14796
Figure 6.
I2C bus protocol
SCL
SDA
SDA
Input
Start
Condition
SCL
1
SDA
MSB
2
SDA
Change
Stop
Condition
3
7
8
9
ACK
Start
Condition
SCL
1
SDA
MSB
2
3
7
8
9
ACK
Stop
Condition
AI00792B
10/39
M24128, M24C64, M24C32
Table 3.
Signal description
Device select code
Device type identifier(1)
Device select code
Chip Enable address(2)
RW
b7
b6
b5
b4
b3
b2
b1
b0
1
0
1
0
E2
E1
E0
RW
1. The most significant bit, b7, is sent first.
2. E0, E1 and E2 are compared against the respective external pins on the memory device.
Table 4.
b15
Table 5.
b7
Address most significant byte
b14
b13
b12
b11
b10
b9
b8
b3
b2
b1
b0
Address least significant byte
b6
b5
b4
11/39
Memory organization
3
M24128, M24C64, M24C32
Memory organization
The memory is organized as shown in Figure 7.
Figure 7.
Block diagram
WC
E0
E1
High Voltage
Generator
Control Logic
E2
SCL
SDA
I/O Shift Register
Data
Register
Y Decoder
Address Register
and Counter
1 Page
X Decoder
AI06899
12/39
M24128, M24C64, M24C32
4
Device operation
Device operation
The device supports the I2C protocol. This is summarized in Figure 6. Any device that sends
data on to the bus is defined to be a transmitter, and any device that reads the data to be a
receiver. The device that controls the data transfer is known as the bus master, and the
other as the slave device. A data transfer can only be initiated by the bus master, which will
also provide the serial clock for synchronization. The M24C32, M24C64 and M24128
devices are always slaves in all communications.
4.1
Start condition
Start is identified by a falling edge of Serial Data (SDA) while Serial Clock (SCL) is stable in
the high state. A Start condition must precede any data transfer command. The device
continuously monitors (except during a Write cycle) Serial Data (SDA) and Serial Clock
(SCL) for a Start condition, and will not respond unless one is given.
4.2
Stop condition
Stop is identified by a rising edge of Serial Data (SDA) while Serial Clock (SCL) is stable
and driven high. A Stop condition terminates communication between the device and the
bus master. A Read command that is followed by NoAck can be followed by a Stop condition
to force the device into the Standby mode. A Stop condition at the end of a Write command
triggers the internal Write cycle.
4.3
Acknowledge bit (ACK)
The acknowledge bit is used to indicate a successful byte transfer. The bus transmitter,
whether it be bus master or slave device, releases Serial Data (SDA) after sending eight bits
of data. During the 9th clock pulse period, the receiver pulls Serial Data (SDA) low to
acknowledge the receipt of the eight data bits.
4.4
Data Input
During data input, the device samples Serial Data (SDA) on the rising edge of Serial Clock
(SCL). For correct device operation, Serial Data (SDA) must be stable during the rising edge
of Serial Clock (SCL), and the Serial Data (SDA) signal must change only when Serial Clock
(SCL) is driven low.
13/39
Device operation
4.5
M24128, M24C64, M24C32
Memory addressing
To start communication between the bus master and the slave device, the bus master must
initiate a Start condition. Following this, the bus master sends the device select code, shown
in Table 3 (on Serial Data (SDA), most significant bit first).
The device select code consists of a 4-bit device type identifier, and a 3-bit Chip Enable
“Address” (E2, E1, E0). To address the memory array, the 4-bit device type identifier is
1010b.
Up to eight memory devices can be connected on a single I2C bus. Each one is given a
unique 3-bit code on the Chip Enable (E0, E1, E2) inputs. When the device select code is
received, the device only responds if the Chip Enable Address is the same as the value on
the Chip Enable (E0, E1, E2) inputs.
The 8th bit is the Read/Write bit (RW). This bit is set to 1 for Read and 0 for Write operations.
If a match occurs on the device select code, the corresponding device gives an
acknowledgment on Serial Data (SDA) during the 9th bit time. If the device does not match
the device select code, it deselects itself from the bus, and goes into Standby mode.
Table 6.
Operating modes
Mode
Current Address
Read
RW bit WC(1)
1
X
0
X
Bytes
1
Start, device select, RW = 1
Start, device select, RW = 0, Address
Random Address
Read
1
X
Sequential Read
1
X
≥1
Byte Write
0
VIL
1
Start, device select, RW = 0
Page Write
0
VIL
≤ 32 for M24C64
and M24C32
Start, device select, RW = 0
1
reStart, device select, RW = 1
≤ 64 for M24128
1. X = VIH or VIL.
14/39
Initial sequence
Similar to Current or Random Address
Read
M24128, M24C64, M24C32
Figure 8.
Device operation
Write mode sequences with WC = 1 (data write inhibited)
WC
ACK
Byte address
ACK
Byte address
NO ACK
Data in
Stop
Dev select
Start
Byte Write
ACK
R/W
WC
ACK
Dev select
Start
Page Write
ACK
Byte address
ACK
Byte address
NO ACK
Data in 1
Data in 2
R/W
WC (cont'd)
NO ACK
Data in N
Stop
Page Write
(cont'd)
NO ACK
AI01120d
15/39
Device operation
4.6
M24128, M24C64, M24C32
Write operations
Following a Start condition the bus master sends a device select code with the Read/Write
bit (RW) reset to 0. The device acknowledges this, as shown in Figure 9, and waits for two
address bytes. The device responds to each address byte with an acknowledge bit, and
then waits for the data Byte.
Writing to the memory may be inhibited if Write Control (WC) is driven high. Any Write
instruction with Write Control (WC) driven high (during a period of time from the Start
condition until the end of the two address bytes) will not modify the memory contents, and
the accompanying data bytes are not acknowledged, as shown in Figure 8.
Each data byte in the memory has a 16-bit (two byte wide) address. The Most Significant
Byte (Table 4) is sent first, followed by the Least Significant Byte (Table 5). Bits b15 to b0
form the address of the byte in memory.
When the bus master generates a Stop condition immediately after the Ack bit (in the “10th
bit” time slot), either at the end of a Byte Write or a Page Write, the internal Write cycle is
triggered. A Stop condition at any other time slot does not trigger the internal Write cycle.
After the Stop condition, the delay tW, and the successful completion of a Write operation,
the device’s internal address counter is incremented automatically, to point to the next byte
address after the last one that was modified.
During the internal Write cycle, Serial Data (SDA) is disabled internally, and the device does
not respond to any requests.
4.7
Byte Write
After the device select code and the address bytes, the bus master sends one data byte. If
the addressed location is Write-protected, by Write Control (WC) being driven high, the
device replies with NoAck, and the location is not modified. If, instead, the addressed
location is not Write-protected, the device replies with Ack. The bus master terminates the
transfer by generating a Stop condition, as shown in Figure 9.
4.8
Page Write
The Page Write mode allows up to 32 bytes (for the M24C32 and M24C64) or 64 bytes (for
the M24128) to be written in a single Write cycle, provided that they are all located in the
same ’row’ in the memory: that is, the most significant memory address bits (b13-b6 for
M24128, b12-b5 for M24C64, and b11-b5 for M24C32) are the same. If more bytes are sent
than will fit up to the end of the row, a condition known as ‘roll-over’ occurs. This should be
avoided, as data starts to become overwritten in an implementation dependent way.
The bus master sends from 1 to 32 bytes of data (for the M24C32 and M24C64) or 64 bytes
of data (for the M24128), each of which is acknowledged by the device if Write Control (WC)
is low. If Write Control (WC) is high, the contents of the addressed memory location are not
modified, and each data byte is followed by a NoAck. After each byte is transferred, the
internal byte address counter (inside the page) is incremented. The transfer is terminated by
the bus master generating a Stop condition.
16/39
M24128, M24C64, M24C32
Figure 9.
Device operation
Write mode sequences with WC = 0 (data write enabled)
WC
ACK
Byte address
ACK
Byte address
ACK
Data in
Stop
Dev Select
Start
Byte Write
ACK
R/W
WC
ACK
Dev Select
Start
Page Write
ACK
Byte address
ACK
Byte address
ACK
Data in 1
Data in 2
R/W
WC (cont'd)
ACK
Data in N
Stop
Page Write
(cont'd)
ACK
4.9
AI01106d
ECC (error correction code) and write cycling
The M24128 and M24C64 in UFDFPN8 (MLP) 2 × 3 mm package and the M24128 in
WLCSP package offer an ECC (error correction code) logic which compares each 4-byte
word with its six associated EEPROM ECC bits. As a result, if a single bit out of 4 bytes of
data happens to be erroneous during a read operation, the ECC detects it and replaces it by
the correct value. The read reliability is therefore much improved by the use of this feature.
Note however that even if a single byte has to be written, 4 bytes are internally modified
(plus the ECC word), that is, the addressed byte is cycled together with the three other bytes
making up the word. It is therefore recommended to write by packets of 4 bytes in order to
benefit from the larger amount of write cycles.
All M24C32, M24C64 and M24128 devices are qualified at 1 million (1 000 000) write
cycles; the M24128 and M24C64 in UFDFPN8 (MLP) 2 × 3 mm package and the M24128 in
WLCSP package are qualified (at 1 million write cycles), using a cycling routine that writes
to the device by multiples of 4-byte words.
17/39
Device operation
M24128, M24C64, M24C32
Figure 10. Write cycle polling flowchart using ACK
Write cycle
in progress
Start condition
Device select
with RW = 0
NO
First byte of instruction
with RW = 0 already
decoded by the device
ACK
Returned
YES
NO
Next
operation is
addressing the
memory
YES
Send address
and receive ACK
ReStart
NO
Stop
Start
condition
YES
Data for the
Write operation
Device select
with RW = 1
Continue the
Write operation
Continue the
Random Read operation
AI01847d
4.10
Minimizing system delays by polling on ACK
During the internal Write cycle, the device disconnects itself from the bus, and writes a copy
of the data from its internal latches to the memory cells. The maximum Write time (tw) is
shown in Table 17 and Table 18, but the typical time is shorter. To make use of this, a polling
sequence can be used by the bus master.
The sequence, as shown in Figure 10, is:
18/39
1.
Initial condition: a Write cycle is in progress.
2.
Step 1: the bus master issues a Start condition followed by a device select code (the
first byte of the new instruction).
3.
Step 2: if the device is busy with the internal Write cycle, no Ack will be returned and
the bus master goes back to Step 1. If the device has terminated the internal Write
cycle, it responds with an Ack, indicating that the device is ready to receive the second
part of the instruction (the first byte of this instruction having been sent during Step 1).
M24128, M24C64, M24C32
Device operation
Figure 11. Read mode sequences
ACK
Data out
Stop
Start
Dev select
NO ACK
R/W
ACK
Start
Dev select *
Byte address
Dev select *
ACK
ACK
Data out 1
ACK
NO ACK
Data out N
Byte address
ACK
Byte address
ACK
Dev select *
Start
Start
ACK
R/W
ACK
Data out
R/W
R/W
Dev select *
NO ACK
Stop
Start
Dev select
Sequential
Random
Read
ACK
Byte address
R/W
ACK
Sequential
Current
Read
ACK
Start
Random
Address
Read
ACK
Stop
Current
Address
Read
ACK
Data out 1
R/W
NO ACK
Stop
Data out N
AI01105d
1. The seven most significant bits of the device select code of a Random Read (in the 1st and 4th bytes) must
be identical.
19/39
Device operation
4.11
M24128, M24C64, M24C32
Read operations
Read operations are performed independently of the state of the Write Control (WC) signal.
After the successful completion of a Read operation, the device’s internal address counter is
incremented by one, to point to the next byte address.
4.12
Random Address Read
A dummy Write is first performed to load the address into this address counter (as shown in
Figure 11) but without sending a Stop condition. Then, the bus master sends another Start
condition, and repeats the device select code, with the Read/Write bit (RW) set to 1. The
device acknowledges this, and outputs the contents of the addressed byte. The bus master
must not acknowledge the byte, and terminates the transfer with a Stop condition.
4.13
Current Address Read
For the Current Address Read operation, following a Start condition, the bus master only
sends a device select code with the Read/Write bit (RW) set to 1. The device acknowledges
this, and outputs the byte addressed by the internal address counter. The counter is then
incremented. The bus master terminates the transfer with a Stop condition, as shown in
Figure 11, without acknowledging the Byte.
4.14
Sequential Read
This operation can be used after a Current Address Read or a Random Address Read. The
bus master does acknowledge the data byte output, and sends additional clock pulses so
that the device continues to output the next byte in sequence. To terminate the stream of
bytes, the bus master must not acknowledge the last byte, and must generate a Stop
condition, as shown in Figure 11.
The output data comes from consecutive addresses, with the internal address counter
automatically incremented after each byte output. After the last memory address, the
address counter ‘rolls-over’, and the device continues to output data from memory address
00h.
4.15
Acknowledge in Read mode
For all Read commands, the device waits, after each byte read, for an acknowledgment
during the 9th bit time. If the bus master does not drive Serial Data (SDA) low during this
time, the device terminates the data transfer and switches to its Standby mode.
20/39
M24128, M24C64, M24C32
5
Initial delivery state
Initial delivery state
The device is delivered with all bits in the memory array set to 1 (each byte contains FFh).
6
Maximum rating
Stressing the device outside the ratings listed in Table 7 may cause permanent damage to
the device. These are stress ratings only, and operation of the device at these, or any other
conditions outside those indicated in the Operating sections of this specification, is not
implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability. Refer also to the STMicroelectronics SURE Program and other relevant
quality documents.
Table 7.
Absolute maximum ratings
Symbol
TA
TSTG
Parameter
Min.
Max.
Unit
Ambient operating temperature
–40
130
°C
Storage temperature
–65
150
°C
(1)
°C
Lead temperature during soldering
TLEAD
(2)
PDIP-specific lead temperature during soldering
VIO
Input or output range
IOL
DC output current (SDA = 0)
VCC
Supply voltage
VESD
see note
Electrostatic discharge voltage (human body
model)(3)
260
°C
–0.50
6.5
V
-
5
mA
–0.50
6.5
V
–4000
4000
V
1. Compliant with JEDEC Std J-STD-020D (for small body, Sn-Pb or Pb assembly), the ST ECOPACK®
7191395 specification, and the European directive on Restrictions on Hazardous Substances (RoHS)
2002/95/EU.
2. TLEAD max must not be applied for more than 10 s.
3. AEC-Q100-002 (compliant with JEDEC Std JESD22-A114A, C1=100pF, R1=1500 Ω, R2=500 Ω)
21/39
DC and AC parameters
7
M24128, M24C64, M24C32
DC and AC parameters
This section summarizes the operating and measurement conditions, and the DC and AC
characteristics of the device. The parameters in the DC and AC characteristic tables that
follow are derived from tests performed under the measurement conditions summarized in
the relevant tables. Designers should check that the operating conditions in their circuit
match the measurement conditions when relying on the quoted parameters.
Table 8.
Operating conditions (M24xxx-W)
Symbol
VCC
TA
Table 9.
Parameter
Min.
Max.
Unit
Supply voltage
2.5
5.5
V
Ambient operating temperature (device grade 6)
–40
85
°C
Ambient operating temperature (device grade 3)
–40
125
°C
Operating conditions (M24xxx-R)
Symbol
VCC
TA
Table 10.
Parameter
Min.
Max.
Unit
Supply voltage
1.8
5.5
V
Ambient operating temperature
–40
85
°C
Operating conditions (M24xxx-F)
Symbol
VCC
TA
Table 11.
Parameter
Min.
Max.
Unit
Supply voltage
1.7
5.5
V
Ambient operating temperature (device grade 6)
–40
85
°C
Ambient operating temperature (device grade 5)
–20
85
°C
AC test measurement conditions
Symbol
CL
Parameter
Min.
Load capacitance
Max.
100
Input rise and fall times
pF
50
ns
Input levels
0.2VCC to 0.8VCC
V
Input and output timing reference levels
0.3VCC to 0.7VCC
V
Figure 12. AC test measurement I/O waveform
Input Levels
0.8VCC
0.2VCC
Input and Output
Timing Reference Levels
0.7VCC
0.3VCC
AI00825B
22/39
Unit
M24128, M24C64, M24C32
Table 12.
DC and AC parameters
Input parameters
Symbol
Parameter
Test condition
Min.
Max.
Unit
CIN
Input capacitance (SDA)
8
pF
CIN
Input capacitance (other pins)
6
pF
200
kΩ
ZWCL(1)
WC input impedance
VIN < 0.3VCC
50
ZWCH(1)
WC input impedance
VIN > 0.7VCC
500
tNS(1)
kΩ
Pulse width ignored
(Input filter on SCL and SDA)
200
ns
1. Characterized only.
Table 13.
Symbol
DC characteristics (M24xxx-W, device grade 6)
Parameter
Test condition
(in addition to those in Table 8)
Min.
Max.
Unit
ILI
Input leakage current
(SCL, SDA, E2, E1, E0)
VIN = VSS or VCC
device in Standby mode
±2
µA
ILO
Output leakage current
SDA in Hi-Z, external voltage
applied on SDA: VSS or VCC
±2
µA
ICC
Supply current (Read)
2.5 V < VCC < 5.5 V, fc = 400 kHz
2
mA
Supply current (Write)
During tW, 2.5 V < VCC < 5.5 V
5(1)
mA
Standby supply current
VIN = VSS or VCC,
VCC = 5.5 V
5
µA
Standby supply current
VIN = VSS or VCC,
VCC = 2.5 V
2
µA
0.3VCC
V
0.7VCC VCC+0.6
V
ICC0
ICC1
VIL
Input low voltage (SDA,
SCL, WC)
VIH
Input high voltage (SDA,
SCL, WC)
VOL
Output low voltage
–0.45
IOL = 2.1 mA, VCC = 2.5 V or
IOL = 3 mA, VCC = 5.5 V
0.4
V
1. Characterized value, not tested in production.
23/39
DC and AC parameters
Table 14.
Symbol
M24128, M24C64, M24C32
DC characteristics (M24xxx-W, device grade 3)
Parameter
Test condition
(in addition to those in Table 8)
Min.
Max.
Unit
ILI
Input leakage current
(SCL, SDA, E2, E1, E0)
VIN = VSS or VCC
device in Standby mode
±2
µA
ILO
Output leakage current
SDA in Hi-Z, external voltage
applied on SDA: VSS or VCC
±2
µA
ICC
Supply current (Read)
2.5 V < VCC < 5.5 V, fc = 400 kHz
2
mA
(1)
mA
10
µA
0.3VCC
V
0.7VCC VCC+0.6
V
ICC0
Supply current (Write)
During tW, 2.5 V < VCC < 5.5 V
ICC1
Standby supply current
VIN = VSS or VCC,
2.5 V < VCC < 5.5 V
VIL
Input low voltage (SDA,
SCL, WC)
VIH
Input high voltage (SDA,
SCL, WC)
VOL
Output low voltage
5
–0.45
IOL = 2.1 mA, VCC = 2.5 V or
IOL = 3 mA, VCC = 5.5 V
0.4
V
Max.
Unit
1. Characterized value, not tested in production.
Table 15.
Symbol
DC characteristics (M24xxx-R - device grade 6)
Parameter
Test condition
(in addition to those in Table 9)
ILI
Input leakage current
(SCL, SDA, E2, E1, E0)
VIN = VSS or VCC
device in Standby mode
±2
µA
ILO
Output leakage current
SDA Hi-Z, external voltage
applied on SDA: VSS or VCC
±2
µA
ICC
Supply current (Read)
VCC = 1.8 V, fc = 400 kHz
0.8
mA
ICC0
Supply current (Write)
During tW, 1.8 V < VCC < 2.5 V
3(1)
mA
ICC1
Standby supply current
VIN = VSS or VCC,
1.8 V < VCC < 2.5 V
1
µA
VIL
Input low voltage (SDA,
SCL, WC)
VIH
Input high voltage (SDA,
SCL, WC)
VOL
Output low voltage
1.8 V ≤VCC < 2.5 V
–0.45
0.25 VCC
V
2.5 V ≤VCC < 5.5 V
–0.45
0.3 VCC
V
1.8 V ≤VCC < 2.5 V
0.75VCC
VCC+1
V
2.5 V ≤VCC < 5.5 V
0.7VCC
VCC+1
V
0.2
V
IOL = 1 mA, VCC = 1.8 V
1. Characterized value, not tested in production.
24/39
Min.
M24128, M24C64, M24C32
Table 16.
DC and AC parameters
DC characteristics (M24xxx-F)(1)
Symbol
Parameter
Test condition
(in addition to those in
Table 10)
Min.
Max.
Unit
ILI
Input leakage current
(SCL, SDA, E2, E1, E0)
VIN = VSS or VCC
device in Standby mode
±2
µA
ILO
Output leakage current
SDA Hi-Z, external voltage
applied on SDA: VSS or VCC
±2
µA
ICC
Supply current (Read)
VCC =1.7 V, fc = 400 kHz
0.8
mA
ICC0
Supply current (Write)
During tW, 1.7 V < VCC < 2.5
V
3(2)
mA
ICC1
Standby supply current
VIN = VSS or VCC,
1.7 V < VCC < 2.5 V
1
µA
VIL
Input low voltage (SDA, SCL,
WC)
VIH
Input high voltage (SDA, SCL,
WC)
VOL
Output low voltage
1.8 V ≤VCC < 2.5 V
–0.45
0.25 VCC
V
2.5 V ≤VCC < 5.5 V
–0.45
0.3 VCC
V
1.8 V ≤VCC < 2.5 V
0.75VCC
VCC+1
V
2.5 V ≤VCC < 5.5 V
0.7VCC
VCC+1
V
0.2
V
IOL = 0.7 mA, VCC = 1.7 V
1. Preliminary data.
2. Characterized value, not tested in production.
25/39
DC and AC parameters
Table 17.
M24128, M24C64, M24C32
AC characteristics (M24xxx-W6, M24xxW3, M24xxR6)
Test conditions specified in Table 8 and Table 9
Symbol
Alt.
Parameter
Min.
Max.
Unit
400
kHz
fC
fSCL
Clock frequency
tCHCL
tHIGH
Clock pulse width high
600
ns
tCLCH
ns
tLOW
Clock pulse width low
1300
tXH1XH2(1)
tR
Input signal rise time
20
300
ns
tXL1XL2(1)
tF
Input signal fall time
20
300
ns
tDL1DL2
tF
SDA (out) fall time
20
100
ns
tDXCX
tSU:DAT
Data in set up time
100
ns
tCLDX
tHD:DAT
Data in hold time
0
ns
tCLQX
tDH
Data out hold time
200
ns
tCLQV(2)(3)
tAA
Clock low to next data valid (access time)
200
900
ns
tCHDX(4)
tSU:STA
Start condition set up time
600
ns
tDLCL
tHD:STA
Start condition hold time
600
ns
tCHDH
tSU:STO
Stop condition set up time
600
ns
tDHDL
tBUF
Time between Stop condition and next Start
condition
1300
ns
tW
Write time
5(5)
ms
1. Values recommended by the I²C-bus Fast-Mode specification.
2. To avoid spurious Start and Stop conditions, a minimum delay is placed between SCL=1 and the falling or
rising edge of SDA.
3. tCLQV is the time (from the falling edge of SCL) required by the SDA bus line to reach 0.8VCC in a
compatible way with the I2C specification (which specifies tSU:DAT (min) = 100 ns), assuming that the Rbus
× Cbus time constant is less than 500 ns (as specified in Figure 5).
4. For a reStart condition, or following a Write cycle.
5. For production lots assembled from 1st July 2007 (data code 727: week27, year 2007), the M24xxx-R
(1.8 V to 5.5 V range) memories are specified with tW = 5 ms (instead of 10ms).
26/39
M24128, M24C64, M24C32
Table 18.
DC and AC parameters
AC characteristics (M24xxx-F)
Test conditions specified in Table 10
Symbol
Alt.
Parameter
Min.
Max.
Unit
400
kHz
fC
fSCL
Clock frequency
tCHCL
tHIGH
Clock pulse width high
600
ns
tCLCH
ns
tLOW
Clock pulse width low
1300
tXH1XH2(1)
tR
Input signal rise time
20
300
ns
tXL1XL2(1)
tF
Input signal fall time
20
300
ns
tDL1DL2
tF
SDA (out) fall time
20
100
ns
tDXCX
tSU:DAT
Data in set up time
100
ns
tCLDX
tHD:DAT
Data in hold time
0
ns
tCLQX
tDH
Data out hold time
200
ns
tCLQV(2)(3)
tAA
Clock low to next data valid (access time)
200
900
ns
tCHDX(4)
tSU:STA
Start condition set up time
600
ns
tDLCL
tHD:STA
Start condition hold time
600
ns
tCHDH
tSU:STO
Stop condition set up time
600
ns
tDHDL
tBUF
Time between Stop condition and next Start
condition
1300
ns
tW
Write time
10(5)
ms
1. Values recommended by the I²C-bus Fast-Mode specification.
2. To avoid spurious Start and Stop conditions, a minimum delay is placed between SCL=1 and the falling or
rising edge of SDA.
3. tCLQV is the time (from the falling edge of SCL) required by the SDA bus line to reach 0.8VCC in a
compatible way with the I2C specification (which specifies tSU:DAT (min) = 100 ns), assuming that the Rbus
× Cbus time constant is less than 500 ns (as specified in Figure 5).
4. For a reStart condition, or following a Write cycle.
5. For temperature range 6: tW(max) = 5 ms.
For temperature range 5: tW(max) = 10 ms.
27/39
DC and AC parameters
M24128, M24C64, M24C32
Figure 13. AC waveforms
tXL1XL2
tCHCL
tXH1XH2
tCLCH
SCL
tDLCL
tXL1XL2
SDA In
tCHDX
tCLDX
tXH1XH2
Start
condition
SDA
Input
SDA tDXCX
Change
tCHDH tDHDL
Start
Stop
condition condition
SCL
SDA In
tW
tCHDH
tCHDX
Stop
condition
Write cycle
Start
condition
tCHCL
SCL
tCLQV
SDA Out
tCLQX
Data valid
tDL1DL2
Data valid
AI00795e
28/39
M24128, M24C64, M24C32
8
Package mechanical data
Package mechanical data
In order to meet environmental requirements, ST offers the M24C32, M24C64 and M24128
in ECOPACK® packages. These packages have a lead-free second level interconnect. The
category of second level interconnect is marked on the package and on the inner box label,
in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at www.st.com.
Figure 14. PDIP8 – 8 pin plastic DIP, 0.25 mm lead frame, package outline
E
b2
A2
A1
b
A
L
c
e
eA
eB
D
8
E1
1
PDIP-B
1. Drawing is not to scale.
Table 19.
PDIP8 – 8 pin plastic DIP, 0.25 mm lead frame, package mechanical data
inches(1)
millimeters
Symbol
Typ.
Min.
A
Max.
Typ.
Min.
5.33
A1
Max.
0.2098
0.38
0.0150
A2
3.30
2.92
4.95
0.1299
0.1150
0.1949
b
0.46
0.36
0.56
0.0181
0.0142
0.0220
b2
1.52
1.14
1.78
0.0598
0.0449
0.0701
c
0.25
0.20
0.36
0.0098
0.0079
0.0142
D
9.27
9.02
10.16
0.3650
0.3551
0.4000
E
7.87
7.62
8.26
0.3098
0.3000
0.3252
E1
6.35
6.10
7.11
0.2500
0.2402
0.2799
e
2.54
–
–
0.1000
–
–
eA
7.62
–
–
0.3000
–
–
eB
L
10.92
3.30
2.92
3.81
0.4299
0.1299
0.1150
0.1500
1. Values in inches are converted from mm and rounded to 4 decimal digits.
29/39
Package mechanical data
M24128, M24C64, M24C32
Figure 15. SO8 narrow – 8 lead plastic small outline, 150 mils body width, package
outline
h x 45˚
A2
A
c
ccc
b
e
0.25 mm
GAUGE PLANE
D
k
8
E1
E
1
L
A1
L1
SO-A
1. Drawing is not to scale.
Table 20.
SO8 narrow – 8 lead plastic small outline, 150 mils body width,
package mechanical data
inches(1)
millimeters
Symbol
Typ
Min
A
Max
Typ
1.75
Max
0.0689
A1
0.10
A2
1.25
b
0.28
0.48
0.0110
0.0189
c
0.17
0.23
0.0067
0.0091
ccc
0.25
0.0039
0.0098
0.0492
0.10
0.0039
D
4.90
4.80
5.00
0.1929
0.1890
0.1969
E
6.00
5.80
6.20
0.2362
0.2283
0.2441
E1
3.90
3.80
4.00
0.1535
0.1496
0.1575
e
1.27
–
–
0.0500
–
–
h
0.25
0.50
k
0°
8°
0°
8°
L
0.40
1.27
0.0157
0.0500
L1
1.04
0.0410
1. Values in inches are converted from mm and rounded to 4 decimal digits.
30/39
Min
M24128, M24C64, M24C32
Package mechanical data
Figure 16. TSSOP8 – 8 lead thin shrink small outline, package outline
D
8
5
c
E1
1
E
4
α
A1
A
L
A2
L1
CP
b
e
TSSOP8AM
1. Drawing is not to scale.
Table 21.
TSSOP8 – 8 lead thin shrink small outline, package mechanical data
inches(1)
millimeters
Symbol
Typ.
Min.
A
Max.
Min.
1.200
A1
0.050
0.150
0.800
1.050
b
0.190
c
0.090
A2
Typ.
1.000
CP
Max.
0.0472
0.0020
0.0059
0.0315
0.0413
0.300
0.0075
0.0118
0.200
0.0035
0.0079
0.0394
0.100
0.0039
D
3.000
2.900
3.100
0.1181
0.1142
0.1220
e
0.650
–
–
0.0256
–
–
E
6.400
6.200
6.600
0.2520
0.2441
0.2598
E1
4.400
4.300
4.500
0.1732
0.1693
0.1772
L
0.600
0.450
0.750
0.0236
0.0177
0.0295
L1
1.000
0°
8°
α
0.0394
0°
8°
1. Values in inches are converted from mm and rounded to 4 decimal digits.
31/39
Package mechanical data
M24128, M24C64, M24C32
Figure 17. UFDFPN8 (MLP8) – 8-lead ultra thin fine pitch dual flat package no lead
2 × 3mm, package outline
e
D
b
L1
L3
E
E2
L
A
D2
ddd
A1
UFDFPN-01
1. Drawing is not to scale.
Table 22.
UFDFPN8 (MLP8) – 8-lead ultra thin fine pitch dual flat package no lead
2 × 3mm, package mechanical data
inches(1)
millimeters
Symbol
Typ
Min
Max
Typ
Min
Max
A
0.55
0.50
0.60
0.0217
0.0197
0.0236
A1
0.02
0.00
0.05
0.0008
0
0.0020
b
0.25
0.20
0.30
0.0098
0.0079
0.0118
D
2.00
1.90
2.10
0.0787
0.0748
0.0827
D2
1.60
1.50
1.70
0.0630
0.0591
0.0669
ddd
0.08
0.0031
E
3.00
2.90
3.10
0.1181
0.1142
0.1220
E2
0.20
0.10
0.30
0.0079
0.0039
0.0118
e
0.50
–
–
0.0197
–
–
L
0.45
0.40
0.50
0.0177
0.0157
0.0197
L1
L3
0.15
0.30
1. Values in inches are converted from mm and rounded to 4 decimal digits.
32/39
0.0059
0.0118
M24128, M24C64, M24C32
Package mechanical data
Figure 18. M24128 WLCSP, 0.5 mm pitch, package outline
Orientation references
5
4
D
3
2
1
A
E
B
e1
B
e3
C
F
G
e2
e
A
A1
A2
1. Drawing is not to scale.
Table 23.
M24128 WLCSP, 0.5 mm pitch, package mechanical data
inches(1)
millimeters
Symbol
Typ.
Min.
Max.
Typ.
Min.
Max.
A
0.585
0.535
0.635
0.0230
0.0211
0.0250
A1
0.230
0.205
0.255
0.0091
0.0081
0.0100
A2
0.355
0.330
0.380
0.0140
0.0130
0.0150
B
0.320
0.290
0.350
0.0126
0.0114
0.0138
D
1.805
1.785
1.825
0.0711
0.0703
0.0719
E
1.400
1.380
1.420
0.0551
0.0543
0.0559
e
0.5
0.0197
e1
0.886
0.0349
e2
0.250
0.0098
e3
0.443
0.0174
F
0.257
0.0101
G
0.4025
0.0158
N(2)
8
8
1. Values in inches are converted from mm and rounded to 4 decimal digits.
2. N is the total number of terminals.
33/39
Part numbering
9
M24128, M24C64, M24C32
Part numbering
Table 24.
Ordering information scheme
Example:
M24C32–
W MN 6
T
P /P
Device type
M24 = I2C serial access EEPROM
Device function
128–B = 128 Kbit (16384 x 8)
C64– = 64 Kbit (8192 x 8)
C32– = 32 Kbit (4096 x 8)
Operating voltage
W = VCC = 2.5 V to 5.5 V
R = VCC = 1.8 V to 5.5 V
F = VCC = 1.7 V to 5.5 V
Package
BN = PDIP8
MN = SO8 (150 mil width)
DW = TSSOP8 (169 mil width)
MB = UFDFPN8 (MLP8)
CS = WLCSP
Device grade
6 = Industrial: device tested with standard test flow over –40 to 85 °C
3 = Automotive: device tested with high reliability certified flow(1) over –40 to 125°C.
5 = Consumer: device tested with standard test flow over –20 to 85°C
Option
blank = standard packing
T = Tape and reel packing
Plating technology
P or G = ECOPACK® (RoHS compliant)
Process(2)
P = F6DP26% Chartered
A = F8L Rousset (only for the WLCSP package)
1. ST strongly recommends the use of the Automotive Grade devices for use in an automotive environment.
The high reliability certified flow (HRCF) is described in the quality note QNEE9801. Please ask your
nearest ST sales office for a copy.
2. Used only for device grade 3 and WLCSP packages.
For a list of available options (speed, package, etc.) or for further information on any aspect
of this device, please contact your nearest ST sales office.
34/39
M24128, M24C64, M24C32
Table 25.
Part numbering
Available M24C32 products (package, voltage range, temperature grade)
M24C32-F
1.7 V to 5.5 V
M24C32-R
1.8 V to 5.5 V
M24C32-W
2.5 V to 5.5 V
DIP8 (BN)
-
-
Grade6
SO8N (MN)
-
Grade 6
Grade 3
Grade 6
TSSOP8 (DW)
Grade 5
Grade 6
Grade 6
MLP8 (MB)
Grade 5
Grade 6
-
Package
Table 26.
Available M24C64 products (package, voltage range, temperature grade)
M24C64-F
1.7 V to 5.5 V
M24C64-R
1.8 V to 5.5 V
M24C64-W
2.5 V to 5.5 V
DIP8 (BN)
-
-
Grade6
SO8N (MN)
-
Grade 6
Grade 3
Grade 6
TSSOP8 (DW)
Grade 5
Grade 6
Grade 6
MLP8 (MB)
Grade 6
-
-
Package
Table 27.
Available M24128 products (package, voltage range, temperature grade)
M24128-BF
1.7 V to 5.5 V
M24128-BR
1.8 V to 5.5 V
M24128-BW
2.5 V to 5.5 V
DIP8 (BN)
-
-
-
SO8N (MN)
-
Grade 6
Grade 3
Grade 6
TSSOP8 (DW)
-
Grade 6
Grade 6
MLP8 (MB)
Grade 6
-
-
WLCSP (CS)
Grade 6
-
-
Package
35/39
Revision history
10
M24128, M24C64, M24C32
Revision history
Table 28.
36/39
Document revision history
Date
Revision
Changes
22-Dec-1999
2.3
TSSOP8 package in place of TSSOP14 (pp 1, 2, OrderingInfo,
PackageMechData).
28-Jun-2000
2.4
TSSOP8 package data corrected
31-Oct-2000
2.5
References to Temperature Range 3 removed from Ordering Information
Voltage range -S added, and range -R removed from text and tables
throughout.
20-Apr-2001
2.6
Lead Soldering Temperature in the Absolute Maximum Ratings table
amended
Write Cycle Polling Flow Chart using ACK illustration updated
References to PSDIP changed to PDIP and Package Mechanical data
updated
16-Jan-2002
2.7
Test condition for ILI made more precise, and value of ILI for E2-E0 and
WC added
-R voltage range added
02-Aug-2002
2.8
Document reformatted using new template.
TSSOP8 (3x3mm² body size) package (MSOP8) added.
5ms write time offered for 5V and 2.5V devices
04-Feb-2003
2.9
SO8W package removed. -S voltage range removed
27-May-2003
2.10
TSSOP8 (3x3mm² body size) package (MSOP8) removed
22-Oct-2003
3.0
Table of contents, and Pb-free options added. Minor wording changes in
Summary Description, Power-On Reset, Memory Addressing, Write
Operations, Read Operations. VIL(min) improved to -0.45V.
01-Jun-2004
4.0
Absolute Maximum Ratings for VIO(min) and VCC(min) improved.
Soldering temperature information clarified for RoHS compliant devices.
Device Grade clarified
04-Nov-2004
5.0
Product List summary table added. Device Grade 3 added. 4.5-5.5V
range is Not for New Design. Some minor wording changes. AEC-Q100002 compliance. tNS(max) changed. VIL(min) is the same on all input
pins of the device. ZWCL changed.
05-Jan-2005
6.0
UFDFPN8 package added. Small text changes.
M24128, M24C64, M24C32
Table 28.
Revision history
Document revision history (continued)
Date
29-Jun-2006
03-Jul-2006
17-Oct-2006
27-Apr-2007
27-Nov-2007
Revision
Changes
7
Document converted to new ST template.
M24C32 and M24C64 products (4.5 to 5.5V supply voltage) removed.
M24C64 and M24C32 products (1.7 to 5.5V supply voltage) added.
Section 2.3: Chip Enable (E0, E1, E2) and Section 2.4: Write Control
(WC) modified, Section 2.6: Supply voltage (VCC) added and replaces
Power On Reset: VCC Lock-Out Write Protect section.
TA added, Note 1 updated and TLEAD specified for PDIP packages in
Table 7: Absolute maximum ratings.
ICC0 added, ICC voltage conditions changed and ICC1 specified over the
whole voltage range in Table 13: DC characteristics (M24xxx-W, device
grade 6).
ICC0 added, ICC frequency conditions changed and ICC1 specified over
the whole voltage range in Table 15: DC characteristics (M24xxx-R device grade 6).
tW modified in Table 17: AC characteristics (M24xxx-W6, M24xxW3,
M24xxR6).
SO8N package specifications updated (see Figure 15 and Table 20).
Device grade 5 added, B and P Process letters added to Table 24:
Ordering information scheme. Small text changes.
8
ICC1 modified in Table 13: DC characteristics (M24xxx-W, device grade
6).
Note 1 added to Table 16: DC characteristics (M24xxx-F) and table title
modified.
9
UFDFPN8 package specifications updated (see Table 22). M24128-BWand M24128-BR part numbers added.
Generic part number corrected in Features on page 1.
ICC0 corrected in Table 14 and Table 13.
Packages are ECOPACK® compliant.
10
Available packages and temperature ranges by product specified in
Table 25, Table 26 and Table 27.
Notes modified below Table 12: Input parameters.
VIH max modified in DC characteristics tables (see Table 13, Table 14,
Table 15 and Table 16).
C process code added to Table 24: Ordering information scheme.
For M24xxx-R (1.8 V to 5.5 V range) products assembled from July 2007
on, tW will be 5 ms (see Table 17: AC characteristics (M24xxx-W6,
M24xxW3, M24xxR6).
11
Small text changes. Section 2.5: VSS ground and Section 4.9: ECC
(error correction code) and write cycling added.
VIL and VIH modified in Table 15: DC characteristics (M24xxx-R - device
grade 6).
JEDEC standard reference updated below Table 7: Absolute maximum
ratings.
Package mechanical data inch values calculated from mm and rounded
to 4 decimal digits (see Section 8: Package mechanical data).
37/39
Revision history
M24128, M24C64, M24C32
Table 28.
Document revision history (continued)
Date
Revision
Changes
18-Dec-2007
12
Added Section 2.6.2: Power-up conditions, updated Section 2.6.3:
Device reset, and Section 2.6.4: Power-down conditions in Section 2.6:
Supply voltage (VCC).
Updated Figure 5: Maximum RP value versus bus parasitic capacitance
(C) for an I2C bus.
Replace M24128 and M24C64 by M24128-BFMB6 and M24C64-FMB6,
respectively, in Section 4.9: ECC (error correction code) and write
cycling.
Added temperature grade 6 in Table 10: Operating conditions (M24xxxF).
Updated test conditions for ILO and VLO in Table 13: DC characteristics
(M24xxx-W, device grade 6), Table 14: DC characteristics (M24xxx-W,
device grade 3), and Table 15: DC characteristics (M24xxx-R - device
grade 6).
Test condition updated for ILO, and VIH and VIL differentiate for 1.8 V ≤
VCC < 2.5 V and 2.5 V ≤VCC < 5.5 V in Table 16: DC characteristics
(M24xxx-F).
Updated Table 17: AC characteristics (M24xxx-W6, M24xxW3,
M24xxR6), and Table 18: AC characteristics (M24xxx-F).
Updated Figure 13: AC waveforms.
Added M24128-BF in Table 27: Available M24128 products (package,
voltage range, temperature grade).
Process B removed fromTable 24: Ordering information scheme.
30-May-2008
13
Small text changes.
C Process option and Blank Plating technology option removed from
Table 24: Ordering information scheme.
14
WLCSP package added (see Figure 3: M24128 WLCSP connections
(top view, marking side, with balls on the underside) and Section 8:
Package mechanical data). Section 4.9: ECC (error correction code)
and write cycling updated.
15
IOL added to Table 7: Absolute maximum ratings.
Table 26: Available M24C64 products (package, voltage range,
temperature grade) and Table 27: Available M24128 products (package,
voltage range, temperature grade) updated.
15-Jul-2008
16-Sep-2008
38/39
M24128, M24C64, M24C32
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39/39