Freescale MCIMX253CJM4A I.mx25 applications processor for consumer and industrial product Datasheet

Freescale Semiconductor
Data Sheet: Technical Data
i.MX25 Applications
Processor for
Consumer and
Industrial Products
Silicon Version 1.2
1
Introduction
The i.MX25 multimedia applications processor has
the right mix of high performance, low power, and
integration to support the growing needs of the
industrial and general embedded markets.
At the core of the i.MX25 is Freescale's fast,
proven, power-efficient implementation of the
ARM926EJ-S core, with speeds of up to 400 MHz.
The i.MX25 includes support for up to 133 MHz
DDR2 memory, integrated 10/100 Ethernet MAC,
and two on-chip USB PHYs. The device is suitable
for a wide range of applications, including the
following:
• Graphical remote controls
• Human Machine Interface (HMI)
• Residential and commercial control panels
• Residential gateway (smart metering)
• Handheld scanners and printers
• Electronic point-of-sale terminals
• Patient-monitoring devices
© 2012 Freescale Semiconductor, Inc. All rights reserved.
Document Number: IMX25CEC
Rev. 9, 06/2012
MCIMX25
Package Information
Plastic package
Case 5284 17 x 17 mm, 0.8 mm Pitch
Case 2107 12 x 12 mm, 0.5 mm Pitch
Ordering Information
See Table 1 on page 3 for ordering information.
1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 3
1.2. Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.1. Special Signal Considerations . . . . . . . . . . . . . . . . 9
3. Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 11
3.1. i.MX25 Chip-Level Conditions . . . . . . . . . . . . . . . . 11
3.2. Supply Power-Up/Power-Down Requirements and
Restrictions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
3.3. Power Characteristics . . . . . . . . . . . . . . . . . . . . . . 18
3.4. Thermal Characteristics . . . . . . . . . . . . . . . . . . . . 19
3.5. I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 20
3.6. AC Electrical Characteristics . . . . . . . . . . . . . . . . 24
3.7. Module Timing and Electrical Parameters . . . . . . 41
4. Package Information and Contact Assignment . . . . . . 124
4.1. 400 MAPBGA—Case 17x17 mm, 0.8 mm Pitch . 124
4.2. Ground, Power, Sense, and Reference Contact
Assignments Case 17x17 mm, 0.8 mm Pitch . . . 125
4.3. Signal Contact Assignments—17 x 17 mm, 0.8 mm
Pitch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127
4.4. i.MX25 17x17 Package Ball Map . . . . . . . . . . . . 135
4.5. 347 MAPBGA—Case 12 x 12 mm, 0.5 mm Pitch 138
4.6. Ground, Power, Sense, and Reference Contact
Assignments Case 12x12 mm, 0.5 mm Pitch . . . 139
4.7. Signal Contact Assignments—12 x 12 mm, 0.5 mm
Pitch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 140
4.8. i.MX25 12x12 Package Ball Map . . . . . . . . . . . . 148
5. Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 151
Features of the i.MX25 processor include the following:
• Advanced power management—The heart of the device is a level of power management
throughout the IC that enables the multimedia features and peripherals to achieve minimum system
power consumption in active and various low-power modes. Power management techniques allow
the designer to deliver a feature-rich product that requires levels of power far lower than typical
industry expectations.
• Multimedia powerhouse—The multimedia performance of the i.MX25 processor is boosted by a
16 KB L1 instruction and data cache system and further enhanced by an LCD controller (with
alpha blending), a CMOS image sensor interface, an A/D controller (integrated touchscreen
controller), and a programmable Smart DMA (SDMA) controller.
• 128 Kbytes on-chip SRAM—The additional 128 Kbyte on-chip SRAM makes the device ideal for
eliminating external RAM in applications with small footprint RTOS. The on-chip SRAM allows
the designer to enable an ultra low power LCD refresh.
• Interface flexibility—The device interface supports connection to all common types of external
memories: MobileDDR, DDR, DDR2, NOR Flash, PSRAM, SDRAM and SRAM, NAND Flash,
and managed NAND.
• Increased security—Because the need for advanced security for tethered and untethered devices
continues to increase, the i.MX25 processor delivers hardware-enabled security features that
enable secure e-commerce, Digital Rights Management (DRM), information encryption, robust
tamper detection, secure boot, and secure software downloads.
• On-chip PHY—The device includes an HS USB OTG PHY and FS USB HOST PHY.
• Fast Ethernet—For rapid external communication, a Fast Ethernet Controller (FEC) is included.
• i.MX25 only supports Little Endian mode.
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9
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1.1
Ordering Information
Table 1 provides ordering information for the i.MX25.
Table 1. Ordering Information
Description
Part Number
Silicon
Version
Projected
Temperature
Range (°C)
i.MX253
MCIMX253DVM4
1.1
i.MX257
MCIMX257DVM4
i.MX253
Package
Ballmap
–20 to +70
17 x 17 mm, 0.8 mm pitch,
MAPBGA-400
Table 103
1.1
–20 to +70
17 x 17 mm, 0.8 mm pitch,
MAPBGA-400
Table 103
MCIMX253CVM4
1.1
–40 to +85
17 x 17 mm, 0.8 mm pitch,
MAPBGA-400
Table 103
i.MX257
MCIMX257CVM4
1.1
–40 to +85
17 x 17 mm, 0.8 mm pitch,
MAPBGA-400
Table 103
i.MX258
MCIMX258CVM4
1.1
–40 to +85
17 x 17 mm, 0.8 mm pitch,
MAPBGA-400
Table 103
i.MX253
MCIMX253DJM4
1.1
–20 to +70
17 x 17 mm, 0.8 mm pitch,
MAPBGA-400
Table 103
i.MX257
MCIMX257DJM4
1.1
–20 to +70
17 x 17 mm, 0.8 mm pitch,
MAPBGA-400
Table 103
i.MX253
MCIMX253CJM4
1.1
–40 to +85
17 x 17 mm, 0.8 mm pitch,
MAPBGA-400
Table 103
i.MX257
MCIMX257CJM4
1.1
–40 to +85
17 x 17 mm, 0.8 mm pitch,
MAPBGA-400
Table 103
i.MX258
MCIMX258CJM4
1.1
–40 to +85
17 x 17 mm, 0.8 mm pitch,
MAPBGA-400
Table 103
i.MX253
MCIMX253DJM4A
1.2
–20 to +70
17 x 17 mm, 0.8 mm pitch,
MAPBGA-400
Table 103
i.MX257
MCIMX257DJM4A
1.2
–20 to +70
17 x 17 mm, 0.8 mm pitch,
MAPBGA-400
Table 103
i.MX257
MCIMX257DJM4AR2
1.2
–20 to +70
17 x 17 mm, 0.8 mm pitch,
MAPBGA-400
Table 103
i.MX253
MCIMX253CJM4A
1.2
–40 to +85
17 x 17 mm, 0.8 mm pitch,
MAPBGA-400
Table 103
i.MX257
MCIMX257CJM4A
1.2
–40 to +85
17 x 17 mm, 0.8 mm pitch,
MAPBGA-400
Table 103
i.MX258
MCIMX258CJM4A
1.2
–40 to +85
17 x 17 mm, 0.8 mm pitch,
MAPBGA-400
Table 103
i.MX257
MCIMX257CJN4A
1.2
–40 to +85
12 x 12mm, 0.5mm pitch,
MAPBGA-347
Table 107
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9
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Table 2 shows the functional differences between the different parts in the i.MX25 family.
Table 2. i.MX25 Parts Functional Differences
Features
MCIMX253
MCIMX257
MCIMX258
ARM926EJ-S™
ARM926EJ-S™
ARM926EJ-S™
CPU Speed
400 MHz
400 MHz
400 MHz
L1 I/D Cache
16K I/D
16K I/D
16K I/D
On-chip SRAM
128 KB
128 KB
128 KB
PATA/CE-ATA
Yes
Yes
Yes
LCD Controller
Yes
Yes
Yes
Touchscreen
—
Yes
Yes
CSI
—
Yes
Yes
FlexCAN (2)
—
Yes
Yes
ESAI
—
Yes
Yes
SIM (2)
—
Yes
Yes
Security
—
—
Yes
10/100 Ethernet
Yes
Yes
Yes
HS USB 2.0 OTG + PHY
Yes
Yes
Yes
HS USB 2.0 Host + PHY
Yes
Yes
Yes
12-bit ADC
Yes
Yes
Yes
SD/SDIO/MMC (2)
Yes
Yes
Yes
External Memory Controller
Yes
Yes
Yes
I2C (3)
Yes
Yes
Yes
SSI/I2S (2)
Yes
Yes
Yes
CSPI (2)
Yes
Yes
Yes
UART (5)
Yes
Yes
Yes
Core
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9
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1.2
Block Diagram
Figure 1 shows the simplified interface block diagram.
DDR2 /
MDDR
NOR
Flash/
PSRAM
NAND
Flash
Ext. Graphics
Accelerator
Camera
Sensor
LCD Display 1
ARM® Processor Domain (AP)
External Memory
Interface (EMI)
CSI
Smart
DMA
Shared
Domain
ARM9
Platform
ARM926EJ-S
SPBA
LCDC /
SLCDC
ARM Peripherals
SSI
AUDMUX
HS USB Host
L1 I/D cache
I2 C(3)
SDMA Peripherals
SSI(1)
ESAI
AVIC
UART(2)
MAX
CSPI
AIPS(2)
CSPI(2)
ADC/TSC
FS USB Host PHY
eSDHC(2)
ETM
FlexCAN(2)
UART(3)
SIM(2)
ATA
HS USB OTG
HS USB OTG PHY
Internal
Memory
FEC
ECT
ECT
IOMUX
IIM
RTICv3
GPIO(3)
RNGB
EPIT(2)
SCC
DRYICE
PWM(4)
Timers
RTC
WDOG
1-WIRE
GPT(4)
KPP
Fusebox
Audio/Power
Management
JTAG
Bluetooth
MMC/SDIO
or WLAN
Keypad
Access.
Conn.
Figure 1. i.MX25 Simplified Interface Block Diagram
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9
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2
Features
Table 3 describes the digital and analog modules of the device.
Table 3. i.MX25 Digital and Analog Modules
Block
Mnemonic
Block Name
Subsystem
Brief Description
1-WIRE
1-Wire
Interface
Connectivity
peripherals
1-Wire support provided for interfacing with an on-board EEPROM, and
smart battery interfaces, for example: Dallas DS2502.
ARM9 or
ARM926
ARM926
platform and
memory
ARM®
The ARM926 Platform consists of the ARM926EJ-S™ core, the ETM
real-time debug modules, a 5x5 Multi-Layer AHB crossbar switch, and a
“primary AHB” complex. It contains the 16 Kbyte L1 instruction cache, 16
Kbyte L1 data cache, 32 Kbyte ROM and 128 Kbyte RAM.
ATA
ATA module
Connectivity
peripherals
The ATA module is an AT attachment host interface. Its main use is to
interface with IDE hard disc drives and ATAPI optical disc drives. It interfaces
with the ATA device over a number of ATA signals.
AUDMUX
Digital audio
mux
Multimedia
peripherals
The AUDMUX is a programmable interconnect for voice, audio, and
synchronous data routing between host serial interfaces (SSIs) and
peripheral serial interfaces (audio codecs). The AUDMUX has two sets of
interfaces: internal ports to on-chip peripherals, and external ports to off-chip
audio devices. Data is routed by configuring the appropriate internal and
external ports.
CCM
Clock control
module
Clocks
This block generates all clocks for the iMX25 system. The CCM also
manages the ARM926 Platform's low-power modes (wait, stop, and doze) by
disabling peripheral clocks appropriately for power conservation.
CSPI(3)
Configurable
serial
peripheral
interface
Connectivity
peripherals
This module is a serial interface equipped with data FIFOs. Each
master/slave-configurable SPI module is capable of interfacing to both serial
port interface master and slave devices. The CSPI ready (SPI_RDY) and
Slave Select (SS) control signals enable fast data communication with fewer
software interrupts.
DRYICE
DryIce module Security
EMI
External
memory
interface
Connectivity
peripherals
DryIce provides volatile key storage for Point-of-Sale (POS) terminals, and a
trusted time source for Digital Rights Management (DRM) schemes. Several
tamper-detect circuits are also provided to support key erasure and time
invalidation in the event of tampering. Alarms and/or interrupts can also
assert if tampering is detected. DryIce also includes a Real Time clock (RTC)
that can be used in secure and non-secure applications.
The External Memory Interface (EMI) module provides access to external
memory for the ARM and other masters. It is composed of four main
submodules:
• M3IF provides arbitration between multiple masters requesting access to
the external memory.
• Enhanced SDRAM/LPDDR memory controller (ESDCTL) interfaces to
DDR2 and SDR interfaces.
• NAND Flash controller (NFC) provides an interface to NAND Flash
memories.
• Wireless External Interface Memory controller (WEIM) interfaces to NOR
Flash and PSRAM.
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9
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Table 3. i.MX25 Digital and Analog Modules (continued)
Block
Mnemonic
EPIT(2)
Block Name
Subsystem
Timer
Enhanced
peripherals
periodic
interrupt timer
Brief Description
Each Enhanced Periodic Interrupt Timer (EPIT) is a 32-bit set-and-forget
timer that starts counting after the EPIT is enabled by software. It is capable
of providing precise interrupts at regular intervals with minimal processor
intervention. It has a 12-bit prescaler to adjust the input clock frequency to
the required time setting for the interrupts, and the counter value can be
programmed on the fly.
Connectivity
peripherals
ESAI provides a full-duplex serial port for serial communication with a variety
of serial devices, including industry-standard codecs, SPDIF transceivers,
and other DSPs. The ESAI consists of independent transmitter and receiver
sections, each section with its own clock generator.
Connectivity
Enhanced
peripherals
multimedia
card/
secure digital
host controller
The features of the eSDHC module, when serving as host, include the
following:
• Conforms to the SD host controller standard specification version 2.0
• Compatible with the JEDEC MMC system specification version 4.2
• Compatible with the SD memory card specification version 2.0
• Compatible with the SDIO specification version 1.2
• Designed to work with SD memory, miniSD memory, SDIO, miniSDIO, SD
combo, MMC and MMC RS cards
• Configurable to work in one of the following modes:
—SD/SDIO 1-bit, 4-bit
—MMC 1-bit, 4-bit, 8-bit
• Full-/high-speed mode
• Host clock frequency variable between 32 kHz and 52 MHz
• Up to 200-Mbps data transfer for SD/SDIO cards using four parallel data
lines
• Up to 416-Mbps data transfer for MMC cards using eight parallel data lines
FEC
Fast ethernet
controller
Connectivity
peripherals
The Ethernet Media Access Controller (MAC) is designed to support both 10and 100-Mbps Ethernet networks compliant with IEEE 802.3® standard. An
external transceiver interface and transceiver function are required to
complete the interface to the media
FlexCAN(2)
Controller
area network
module
Connectivity
peripherals
The Controller Area Network (CAN) protocol is primarily designed to be used
as a vehicle serial data bus running at 1 MBps.
GPIO(4)
General
purpose I/O
modules
System control Used for general purpose input/output to external ICs. Each GPIO module
peripherals
supports 32 bits of I/O.
GPT(4)
General
purpose
timers
Timer
peripherals
ESAI
eSDHC(2)
Enhanced
serial audio
interface
Each GPT is a 32-bit free-running or set-and-forget mode timer with
programmable prescaler and compare and capture register. A timer counter
value can be captured using an external event and can be configured to
trigger a capture event on either the leading or trailing edges of an input
pulse. When the timer is configured to operate in set-and-forget mode, it is
capable of providing precise interrupts at regular intervals with minimal
processor intervention. The counter has output compare logic to provide the
status and interrupt at comparison. This timer can be configured to run either
on an external clock or on an internal clock.
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9
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7
Table 3. i.MX25 Digital and Analog Modules (continued)
Block
Mnemonic
I2C(3)
IIM
IOMUX
Block Name
Subsystem
Brief Description
I2C module
Connectivity
peripherals
Inter-IC Communication (I2C) is an industry-standard, bidirectional serial bus
that provides a simple, efficient method of data exchange, minimizing the
interconnection between devices. I2C is suitable for applications requiring
occasional communications over a short distance between many devices.
The interface operates up to 100 kbps with maximum bus loading and timing.
The I2C system is a true multiple-master bus, including arbitration and
collision detection that prevents data corruption if multiple devices attempt to
control the bus simultaneously. This feature supports complex applications
with multiprocessor control and can be used for rapid testing and alignment
of end products through external connections to an assembly-line computer.
IC
Identification
Module
Security
The IIM provides the primary user-visible mechanism for interfacing with
on-chip fuse elements. Among the uses for the fuses are unique chip
identifiers, mask revision numbers, cryptographic keys, and various control
signals requiring a fixed value.
I/O multiplexer Pins
Each I/O multiplexer provides a flexible, scalable multiplexing solution:
• Up to eight output sources multiplexed per pin
• Up to four destinations for each input pin
• Unselected input paths are held at constant level for reduced power
consumption
Keypad port
Connectivity
peripherals
KPP can be used for either keypad matrix scanning or general purpose I/O.
LCDC
LCD
Controller
Multimedia
peripherals
LCDC provides display data for external gray-scale or color LCD panels.
LCDC is capable of supporting black-and-white, gray-scale, passive-matrix
color (passive color or CSTN), and active-matrix color (active color or TFT)
LCD panels.
MAX
ARM platform ARM platform
multilayer
AHB crossbar
switch
MAX concurrently supports up to five simultaneous connections between
master ports and slave ports. MAX allows for concurrent transactions to
occur from any master port to any slave port.
PWM(4)
Pulse width
modulation
Connectivity
peripherals
The Pulse-Width Modulator (PWM) has a 16-bit counter and is optimized to
generate sound from stored sample audio images. It can also generate
tones. The PWM uses 16-bit resolution and a 4x16 data FIFO to generate
sound.
SDMA
Smart DMA
engine
System control The SDMA provides DMA capabilities inside the processor. It is a shared
module that implements 32 DMA channels.
SIM(2)
Subscriber
identity
module
interface
Connectivity
peripherals
Secure JTAG
interface
System control The System JTAG Controller (SJC) provides debug and test control with
peripherals
maximum security.
KPP
SJC
The SIM is an asynchronous interface designed to facilitate communication
with SIM cards or pre-paid phone cards. This module was designed based
on the ISO7816 standard; however, the module does require an external
companion controller to allow communication to certain smart cards or to
pass certain certifications, such as EMV.
The SIM supports only 11 and 12ETU cards and can communicate at the
default rate, which is obtained at Fi/Di=372/1. An external companion
controller is required to support cards aligned on 10.8 or 11.8ETU and to
support other rates, such as those obtained at Fi/Di=372/2 and Fi/Di=372/4.
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9
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Table 3. i.MX25 Digital and Analog Modules (continued)
Block
Mnemonic
Block Name
Subsystem
Multimedia
peripherals
SLCD
Smart LCD
controller
The SLCDC module transfers data from the display memory buffer to the
external display device.
SPBA
System control The SPBA controls access to the shared peripherals. It supports shared
Shared
peripheral ownership and access rights to an owned peripheral.
peripheral bus
arbiter
SSI(2)
I2S/SSI/AC97 Connectivity
interface
peripherals
TSC (and ADC) Touchscreen Multimedia
controller (and peripherals
A/D converter)
UART(5)
USBOTG
USBHOST
2.1
Brief Description
The SSI is a full-duplex serial port that allows the processor to communicate
with a variety of serial protocols, including the Freescale Semiconductor SPI
standard and the inter-IC sound bus standard (I2S). The SSIs
interface to the AUDMUX for flexible audio routing.
The touchscreen controller and associated Analog-to-Digital Converter
(ADC) together provide a resistive touchscreen solution. The module
implements simultaneous touchscreen control and auxiliary ADC operation
for temperature, voltage, and other measurement functions.
UART
interface
Connectivity
peripherals
Each of the UART modules supports the following serial data
transmit/receive protocols and configurations:
• 7- or 8-bit data words, one or two stop bits, programmable parity (even,
odd, or none)
• Programmable baud rates up to 4 MHz. This is a higher maximum baud
rate than the 1.875 MHz specified by the TIA/EIA-232-F standard and
previous Freescale UART modules. 32-byte FIFO on Tx and 32 half-word
FIFO on Rx supporting auto-baud
• IrDA-1.0 support (up to SIR speed of 115200 bps)
• Option to operate as 8-pins full UART, DCE, or DTE
High-speed
USB
on-the-go
Connectivity
peripherals
The USB module provides high-performance USB On-The-Go (OTG) and
host functionality (up to 480 Mbps), compliant with the USB 2.0 specification,
the OTG supplement, and the ULPI 1.0 Low Pin Count specification. The
module has DMA capabilities for handling data transfer between internal
buffers and system memory. An OTG HS PHY and HOST FS PHY are also
integrated.
Special Signal Considerations
Special signal considerations are listed in Table 4. The package contact assignment is found in Section 4,
“Package Information and Contact Assignment.” Signal descriptions are provided in the reference manual.
.
Table 4. Signal Considerations
Signal
BAT_VDD
Description
DryIce backup power supply input.
CLK0
Clock-out pin; renders the internal clock visible to users for debugging. The clock source is controllable
through CRM registers. This pin can also be configured (through muxing) to work as a normal GPIO.
CLK_SEL
Used to select the ARM clock source from MPLL out or from external EXT_ARMCLK. In normal operation,
CLK_SEL should be connected to GND.
EXT_ARMCLK
Primarily for Freescale factory use. There is no internal on-chip pull-up/down on this pin, so it must be
externally connected to GND or VDD. Aside from factory use, this pin can also be configured (through
muxing) to work as a normal GPIO.
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9
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9
Table 4. Signal Considerations (continued)
Signal
Description
MESH_C, MESH_D Wire-mesh tamper detect pins that can be routed at the PCB board to detect attempted tampering of a
protected wire. When security measures are implemented, MESH_C should be pulled-up or connected to
NVCC_DRYICE and triggers a tamper event when floating or when connected to MESH_D. MESH_D
should be pulled-down or connected to GND and triggers an event when floating or connected to
MESH_C. These pins can be left unconnected if the DryIce security features are not being used.
NVCC_DRYICE
This is the DryIce power supply output. The supply source is QVDD when the i.MX25 is in run mode.
When i.MX25 is in reduced power mode, the DryIce supply source is the BATT_VDD supply. This pin can
be used to power external DryIce components (external tamper detect, wire-mesh tamper detect). In
order to guarantee the power-loss protection feature which guarantees that RTC and/or secure keys be
maintained after power-off an external capacitor no less than 4 µF must be connected to this supply output
pin. A 4.7 µF capacitor is recommended.
OSC_BYP
The 32 kHz oscillator bypass-control pin. If this signal is pulled down, then OSC32K_EXTAL and
OSC32K_XTAL analog pins should be tied to the external 32.768 kHz crystal circuit. If on the other hand
the signal is pulled up, then the external 32 kHz oscillator output clock must be connected to
OSC32K_EXTAL analog pin, and OSC32K_XTAL can be no connect (NC).
OSC32K_EXTAL
OSC32K_XTAL
These analog pins are connected to an external 32 kHz CLK circuit depending on the state of OSC_BYP
pin (see the description of OSC_BYP under the preceding bullet). The 32 kHz reference CLK is required
for normal operation.
POWER_FAIL
An interrupt from PMIC, which should be connected to a low-battery detection circuit. This signal is
internally connected to an on-chip 100 kΩ pull-down device. If there is no low-battery detection, then users
can tie this pin to GND through a pull-down resistor, or leave the signal as NC. This pin can also be
configured to work as a normal GPIO.
REF
External ADC reference voltage. REF may be tied to GND if the user plans to only use the internally
generated 2.5 V reference supply.
SJC_MOD
Must be externally connected to GND for normal operation. Termination to GND through an external
pull-down resistor (such as 1 kΩ) is allowed, but the value should be much smaller than the on-chip 100
kΩ pull-up.
TAMPER_A,
TAMPER _B
DryIce external tamper detect pins, active high. If TAMPER_A or TAMPER_B is connected to
NVCC_DRYICE, then external tampering is detected. These pins can be left unconnected if the DryIce
security features are not being used.
TEST_MODE
For Freescale factory use only. This signal is internally connected to an on-chip pull-down device. Users
must either float this signal or tie it to GND.
UPLL_BYPCLK
Primarily for Freescale factory use. There is no internal on-chip pull-up/down on this pin, so it must be
externally connected to GND or VDD. Aside from factory use, this pin can also be configured (through
muxing) to work as a normal GPIO.
USBPHY1_RREF
Determines the reference current for the USB PHY1 bandgap reference. An external 10 kΩ 1% resistor to
GND is required.
USBPHY2_DM
USBPHY2_DP
The output impedance of these signals is expected at 10 Ω. It is recommended to also have on-board 33 Ω
series resistors (close to the pins).
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9
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Freescale Semiconductor
3
Electrical Characteristics
This section provides the device-level and module-level electrical characteristics for the i.MX25.
3.1
i.MX25 Chip-Level Conditions
This section provides the chip-level electrical characteristics for the IC.
3.1.1
DC Absolute Maximum Ratings
Table 5 provides the DC absolute maximum operating conditions.
•
•
•
CAUTION
Stresses beyond those listed under Table 5 may cause permanent
damage to the device.
Exposure to absolute-maximum-rated conditions for extended periods
may affect device reliability.
Table 5 gives stress ratings only—functional operation of the device is
not implied beyond the conditions indicated in Table 6.
Table 5. DC Absolute Maximum Ratings
Parameter
Supply voltage
Supply voltage (level shift i/o)
ESD damage immunity:
Min.
Max.
Units
QVDD
–0.5
1.52
V
VDDIOmax
–0.5
3.6
V
Vesd
V
Human body model (HBM)
—
2500
Charge device model (CDM)
—
400
Machine model (MM)
—
200
–0.5
NVDD + 0.3
V
105
oC
Input voltage range
VImax
Storage temperature range
3.1.2
Symbol
Tstorage
–40
DC Operating Conditions
Table 6 provides the DC recommended operating conditions.
Table 6. DC Operating Conditions
Parameter
Symbol
Min.
Typ.
Max.
Units
Core supply voltage (at 266 MHz)
QVDD
1.15
1.34
1.52
V
Core supply voltage (at 400 MHz)
QVDD
1.38
1.45
1.52
V
VDD_BAT
1.15
—
1.55
V
NVDD_GPIO1
1.75
—
3.6
V
battery1
Coin
BAT_VDD
I/O supply voltage, GPIO
NFC,CSI,SDIO
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9
Freescale Semiconductor
11
Table 6. DC Operating Conditions (continued)
Parameter
Symbol
Min.
Typ.
Max.
Units
I/O supply voltage, GPIO
CRM,LCDC,JTAG,MISC
NVDD_GPIO2
3.0
3.3
3.6
—
I/O supply voltage DDR (Mobile DDR mode)
EMI1, EMI2
NVDD_MDDR
1.75
—
1.95
V
I/O supply voltage DDR (DDR2 mode)
EMI1,EMI2
NVDD_DDR2
1.75
—
1.9
V
I/O supply voltage DDR (SDRAM mode)
EMI1,EMI2
NVDD_SDRAM
1.75
—
3.6
V
Supply of USBPHY1 (HS)
USBPHY1_VDDA_BIAS, USBPHY1_UPLL_VDD,USBPHY1_VDDA
VDD_usbphy1
3.17
3.3
3.43
V
Supply of USBPHY2 (FS)
USBPHY2_VDD
VDD_usbphy2
3.0
3.3
3.6
V
Supply of OSC24M
OSC24M_VDD
VDD_OSC24M
3.0
3.3
3.6
V
Supply of PLL
MPLL_VDD,UPLL_VDD
VDD_PLL
1.4
—
1.65
V
Supply of touchscreen ADC
NVCC_ADC
VDD_tsc
3.0
3.3
3.6
V
Vref
2.5
External reference of touchscreen ADC
Ref
Fusebox program supply voltage
FUSE_VDD2
Supply output3
NVCC_DRYICE
Operating ambient temperature
FUSEVDD
3.3 ± 5%
(program mode)
VDD_tsc VDD_tsc
V
—
3.6
V
VDD_
1.0
—
1.55
V
TA
–40
—
85
oC
1
VDD_BAT must always be powered by battery in security application. In non-security case, VDD_BAT can be connected to
QVDD.
2
The fusebox read supply is connected to supply of the full speed USBPHY2_VDD. FUSE_VDD is only used for programming.
It is recommended that FUSE_VDD be connected to ground when not being used for programming. See Table 7 for current
parameters.
3 NVCC_DRYICE is a supply output. An external capacitor no less than 4 µF must be connected to it. A 4.7 µF capacitor is
recommended.
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9
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3.1.3
Fusebox Supply Current Parameters
Table 7 lists the fusebox supply current parameters.
Table 7. Fusebox Supply Current Parameters
Parameter
Symbol
Min.
Typ.
Max.
Units
Iprogram
26
35
62
mA
Iread
—
12.5
15
mA
eFuse program current1
Current to program one eFuse bit
The associated VDD_FUSE supply = 3.6 V
eFuse read current2
Current to read an 8-bit eFuse word
1
2
The current Iprogram is during program time (tprogram).
The current Iread is present for approximately 50 ns of the read access to the 8-bit word.
3.1.4
Interface Frequency Limits
Table 8 provides information for interface frequency limits.
Table 8. Interface Frequency Limits
Parameter
Min.
Typ.
Max.
Units
JTAG: TCK Frequency of Operation
DC
5
10
MHz
OSC24M_XTAL Oscillator
—
24
—
MHz
OSC32K_XTAL Oscillator
—
32.768
—
kHz
Table 9 provides the recommended external crystal specifications.
Table 9. Recommended External Crystal Specifications
24 MHz
32.768 kHz
<= ± 30 ppm
<= ± 30 ppm
< 80 Ω
50 K~60 K
Load Capacitor
8 pF–12 pF
6 pF–8 pF (12 pF–16 pF on each pin)
Shunt Capacitor
< 7 pF
1 pF
> 150 µW
> 1 µW
Frequency Tolerance
ESR
Drive Level
Table 10 provides the recommended external reference clock oscillator specifications (when reference is
used from an external clock source).
Table 10. Recommended External Reference Clock Specifications
24 MHz
32.768 kHz
Voh
min = 0.7* VDD
min = 0.7* VDD
Vol
max = 0.3* VDD
max = 0.3* VDD
Frequency Tolerance
= 30 ppm
= 30 ppm
Trise
1% Tclock
1% Tclock
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9
Freescale Semiconductor
13
Tfall
Duty Cycle
3.1.5
1% Tclock
1% Tclock
50%
50%
USB_PHY Current Consumption
Table 11 provides information for USB_PHY current consumption.
Table 11. USB PHY Current Consumption1
Parameter
Conditions
Analog supply
USBPHY1_VDDA_BIAS, USBPHY1_UPLL_VDD,
USBPHY1_VDDA (3.3 V)
Rx
11.4
—
Tx
22,6
—
Rx
21.5
—
High speed
Tx
33.8
—
Suspend
—
0.6
Rx
120
—
μA
Tx
25
—
mA
Rx
252
—
μA
Tx
5.5
—
mA
50
100
Full speed
Analog supply
USBPHY2_VDD (3.3 V)
Full Speed
Low Speed
All supplies
1
Typ.
Max.
Unit
(@Typ. Temp) (@Max. Temp)
Suspend
mA
μA
μA
Values must be verified
3.1.6
Power Modes
Table 12 describes the core, clock, and module settings for the different power modes of the processor.
Table 12. i.MX25 Power Mode Settings
Power Mode
Core/Clock/Module
Doze
Wait
Stop/Sleep1
ARM core
Platform clock is off
In wait-for-interrupt mode
—
Active @
266 MHz
Active @
400 MHz
Well bias
On
Off
On
Off
Off
MCU PLL
On
On
Off
On
On
USB PLL
Off
Off
Off
On
On
OSC24M
On
On
Off
On
On
OSC32K
On
On
On
On
On
Other modules
Off
Off
Off
On
On
1
Run (266 MHz) Run (400 MHz)
Sleep mode differs from stop mode in that the core voltage is reduced to 1 V.
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9
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Table 13 shows typical current consumption for the various power supplies under the various power
modes.
Table 13. i.MX25 Power Mode Current Consumption
Power Group
Power Supplies
Voltage
Setting
Current Consumption for Power Modes1
Doze
Wait
Stop
Sleep
NVCC_EMI
NVCC_EMI1
NVCC_EMI2
3.0 V
5 μA
3.15 μA
3.51 μA
3.61 μA
NVCC_CRM
NVCC_CRM
3.0 V
1.15 μA
4.31 μΑ
0.267 μΑ
0.32 μΑ
NVCC_
OTHER
NVCC_SDIO
NVCC_CSI
NVCC_NFC
NVCC_JTAG
NVCC_LCDC
NVCC_MISC
3.0 V
31.2 μA
29.5 μΑ
31.7 μA
32.1 μΑ
NVCC_ADC
NVCC_ADC
3.0 V
163 μA
3.25 μΑ
1.14 μΑ
0.871 μΑ
OSC24M
OSC24M_
VDD
3.0 V
906 μA
903 μΑ
10.2 μΑ mA
10.5 μΑ
PLL_VDD
MPLL_VDD
UPLL_VDD
1.4 V
6.83 mA
6.83 mΑ
38.9 μΑ
39.1 μΑ
QVDD
QVDD
1.15 V
8.79 mA
11.28 mA
842 μA
665 μA
USBPHY1_
VDDA
USBPHY1_
VDDA
3.17 V
240 μA
240 μΑ
241 μΑ
242 μΑ
USBPHY1_
VDDA_VBIAS
USBPHY1_
VDDA_VBIAS
3.17 V
0.6 μΑ
1.46 μΑ
0.328 μΑ
0.231 μΑ
USBPHY1_
UPLL_VDD
USBPHY1_
UPLL_VDD
3.17 V
201 μΑ
201 μΑ
191 μΑ
191 μΑ
USBPHY2
USBPHY2_
VDD
3.0 V
158 μA
0158 μΑ
164 μΑ
164 μΑ
1
Values are typical, under typical use conditions.
In the reduced power mode, shown in Table 14, the i.MX25 is powered down, while the RTC clock and
the secure keys (in secure-use case), remain operational. BAT_VDD is tied to a battery while all other
supplies are turned off.
NOTE
In this low-power mode, i.MX25 cannot be woken up with an interrupt; it
must be powered back up before it can detect any events.
Table 14. iMX25 Reduced Power Mode Current Consumption
Power Group
Power Supply
Voltage Setting
Typical Current Consumption
BAT_VDD
BAT_VDD
1.15 V
9.95 μA
1.55 V
12.6 μA
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9
Freescale Semiconductor
15
3.2
Supply Power-Up/Power-Down Requirements and Restrictions
Any i.MX25 board design must comply with the power-up and power-down sequence guidelines given in
this section to ensure reliable operation of the device. Recommended power-up and power-down
sequences are given in the following subsections.
CAUTION
Deviations from the guidelines in this section may result in the following
situations:
•
•
•
Excessive current during power-up phase
Prevention of the device from booting
Irreversible damage to the i.MX25 (worst-case scenario)
NOTE
For security applications, the coin battery must be connected during both
power-up and power-down sequences to ensure that security keys are not
unintentionally erased.
3.2.1
Power-Up Sequence
For those users that are not using DryIce/SRTC, the following power-up sequence is recommended:
1. Assert power on reset (POR).
2. Turn on QVDD digital logic domain supplies.
3. Turn on NVCCx digital I/O power supplies after QVDD is stable.
4. Turn on all other analog power supplies, including USBPHY1_VDDA_BIAS,
USBPHY1_UPLL_VDD, USBPHY1_VDDA, USBPHY2_VDD, OSC24M_VDD,
MPPLL_VDD, UPLL_VDD, NVCC_ADC, and FUSEVDD (FUSEVDD is tied to GND if fuses
are not programmed), after all NVCCx digital I/O supplies are stable.
5. Negate the POR signal.
•
•
•
•
NOTE
The user is advised to connect FUSEVDD to GND except when fuses
are programmed, to prevent unintentional blowing of fuses.
Other power-up sequences may be possible; however, the above
sequence has been verified and is recommended.
There is a 1 ms minimum time between supplies coming up, and a 1 ms
minimum time between POR_B assert and de-assert.
The dV/dT should be no faster than 0.25 V/μs for all power supplies, to
avoid triggering ESD circuit.
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9
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Freescale Semiconductor
Figure 2 shows the power-up sequence diagram. After POR_B is asserted, Core VDD and NVDDx can be
powered up. After Core VDD and NVDDx are stable, the analog supplies can be powered up.
Figure 2. Power-Up Sequence Diagram
3.2.2
Power-Down Sequence
There are no special requirements for the power-down sequence. All power supplies can be shut down at
the same time.
3.2.3
SRTC DryIce Power-Up/Down Sequence
In order to guarantee DryIce power-loss protection, including retention of SRTC time data during power
down, users must do the following:
• Place a proper capacitor on the NVCC_DRYICE output pin, and
• Implement the below power-up/down sequence
1. Assert power on reset (POR).
2. Turn on NVCC_CRM.
3. Turn on QVDD digital logic domain supplies for not less than 1 ms and not more than 32 ms, after
NVCC_CRM reaches 90% of 3.3 V.
NOTE
This is to guarantee that POR is stable already at NVCC_CRM/QVDD
power domain interface before QVDD is turned on, and POR instantly
propagates to QVDD domain after QVDD is turned on.
4. Turn on other NVCCx digital I/O power supplies for not less than 1 ms and not more than 32 ms,
after QVDD reaches 90% of 1.2 V.
5. Turn on all other analog power supplies, including USBPHY1_VDDA_BIAS,
USBPHY1_UPLL_VDD, USBPHY1_VDDA, USBPHY2_VDD, NVCC_ADC,
OSC24M_VDD, MPPLL_VDD, UPLL_VDD, and FUSEVDD (FUSEVDD is tied to GND if
fuses are not programmed) for not less than 1 ms and not more than 32 ms, after NVCCx reaches
90% of 3.3 V.
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9
Freescale Semiconductor
17
NOTE
This is to guarantee that analog peripherals can get properly initialized
(reset) values from QVDD domain and NVCCx domain.
6. Negate the POR signal for at least 90 μs after all previous steps.
•
•
NOTE
This is to guarantee that both POR logic and clocks are stable inside the
i.MX25 chip, before POR is removed.
The dV/dT should be no faster than 0.25 V/us for all power supplies, to
avoid triggering ESD circuit.
In addition, the following power-down sequence is recommended:
1. Turn off power for analog parts, including USBPHY1_VDDA_BIAS, USBPHY1_UPLL_VDD,
USBPHY1_VDDA, USBPHY2_VDD, NVCC_ADC, and FUSEVDD (FUSEVDD is tied to GND
if fuses are not programmed).
2. Turn off QVDD.
3. Turn off NVCCx, PLL, OSC, and other powers.
NOTE
The power-down steps can be executed simultaneously, or very shortly one
after another.
3.3
Power Characteristics
Table 15 shows values representing maximum current numbers for the i.MX25 under worst case voltage
and temperature conditions. These values are derived from the i.MX25 with core clock speed up to
400 MHz. Additionally, no power saving techniques such as clock gating were implemented when
measuring these values. Common supplies are bundled according to the i.MX25 power-up sequence
requirements. Peak numbers are provided for system designers so that the i.MX25 power supply
requirements are satisfied during startup and transient conditions. Freescale recommends that system
current measurements are taken with customer-specific use-cases to reflect the normal operating
conditions in the end system.
Table 15. Power Consumption
Power Supply
Voltage (V)
Max Current (mA)
QVDD
1.52
360
NVCC_EMI1, NVCC_EMI2
1.9
30
NVCC_CRM, NVCC_SDIO, NVCC_CSI,
NVCC_NFC, NVCC_JTAG, NVCC_LCDC,
NVCC_MISC
3.6
110
MPLL_VDD, UPLL_VDD
1.65
20
USBPHY1_VDDA_BIAS, USBPHY1_UPLL_VDD,
USBPHY1_VDDA, USBPHY2_VDD,
OSC24M_VDD, NVCC_ADC
3.3
40
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9
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Table 15. Power Consumption (continued)
Power Supply
Voltage (V)
Max Current (mA)
FUSE_VDD1
3.6
62
BATT_VDD
1.55
0.030
1
The FUSE_VDD rail is connected to ground. it only needs a voltage if the system fuse burning is needed.
The method for obtaining the maximum current is as follows:
1. Measure the worst case power consumption on individual rails using directed test on i.MX25.
2. Correlate the worst case power consumption power measurements with the worst case power
consumption simulations.
3. Combine common voltage rails based on the power supply sequencing requirements (add the
worst case power consumption on each rail within some test cases from several test cases run, to
maximize different rails in the power group).
4. Guard the worst case numbers for temperature and process variation.
5. The sum of individual rails is greater than the real world power consumption, since a real system
does not typically maximize the power consumption on all peripherals simultaneously.
6. BATT_VDD current is measured when the system is in reduced power mode maintaining the
RTC. When the system is in run mode, QVDD is used to supply the DryIce, so this current
becomes negligible. See Table 12, for more details on the power modes.
NOTE
The values mentioned above should not be taken as a typical max run data
for specific use cases. These values are Absolute MAX data. Freescale
recommends that the system current measurements are taken with
customer-specific use-cases to reflect normal operating conditions in the
end system.
3.4
Thermal Characteristics
The thermal resistance characteristics for the device are given in Table 16. These values are measured
under the following conditions:
• Two-layer substrate
• Substrate solder mask thickness: 0.025 mm
• Substrate metal thicknesses: 0.016 mm
• Substrate core thickness: 0.200 mm
• Core through I.D: 0.118 mm, Core through plating 0.016 mm.
• Flag: Trace style with ground balls under the die connected to the flag
• Die Attach: 0.033 mm non-conductive die attach, k = 0.3 W/m K
• Mold compound: Generic mold compound; k = 0.9 W/m K
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9
Freescale Semiconductor
19
Table 16. Thermal Resistance Data
Rating
Condition
Symbol
Value
Unit
Junction to ambient1 natural convection
Single layer board (1s)
ReJA
55
°C/W
Junction to ambient1 natural convection
Four layer board (2s2p)
ReJA
33
°C/W
Junction to ambient1 (@200 ft/min)
Single layer board (1s)
ReJMA
46
°C/W
Junction to ambient1 (@200 ft/min)
Four layer board (2s2p)
ReJMA
29
°C/W
Junction to boards2
—
ReJB
22
°C/W
Junction to case (top)3
—
ReJCtop
13
°C/W
ΨJT
2
°C/W
Junction to package top4
Natural convection
1
Junction-to-ambient thermal resistance determined per JEDC JESD51-3 and JESD51-6. Thermal test board meets JEDEC
specification for this package.
2 Junction-to-board thermal resistance determined per JEDC JESD51-8. Thermal test board meets JEDEC specification for
this package.
3 Junction-to-case at the top of the package determined using MIL-STD 883 Method 1012.1. The cold plate temperature is
used for the case temperature. Reported value includes the thermal resistance of the interface layer.
4
Thermal characterization parameter indicating the temperature difference between the package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, this thermal characterization parameter is written
as Psi-JT.
3.5
I/O DC Parameters
This section includes the DC parameters of the following I/O types:
• DDR I/O: Mobile DDR (mDDR), double data rate (DDR2), or synchronous dynamic random
access memory (SDRAM)
• General purpose I/O (GPIO)
NOTE
The term ‘OVDD’ in this section refers to the associated supply rail of an
input or output. The association is shown in the “Signal Multiplexing”
chapter of the reference manual.
3.5.1
DDR I/O DC Parameters
The DDR pad type is configured by the IOMUXC_SW_PAD_CTL_GRP_DDRTYPE register (see the
External Signals and Pin Multiplexing chapter of the i.MX25 Reference Manual for details).
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3.5.1.1
DDR_TYPE = 00 Standard Setting DDR I/O DC Parameters
Table 17 shows the I/O parameters for mobile DDR. These settings are suitable for mDDR and DDR2
1.8V (± 5%) applications.
Table 17. Mobile DDR I/O DC Electrical Characteristics
DC Electrical Characteristics
Symbol
Test Conditions
Min.
Typ.
Max.
Units
High-level output voltage
Voh
IOH = –1mA
IOH = Specified Drive
OVDD – 0.08
0.8 × OVDD
—
—
V
Low-level output voltage
Vol
IOL = 1mA
IOL = Specified Drive
—
—
0.08
0.2 × OVDD
V
I
Voh = 0.8 × OVDDV
Standard Drive
High Drive
Max. Drive
—
—
–3.6
–7.2
–10.8
Vol = 0.2 × OVDDV
Standard Drive
High Drive
Max. Drive
3.6
7.2
10.8
High-level output current
Ioh
Low-level output current
I
Iol
mA
—
—
mA
High-level DC CMOS input voltage
VIH
—
0.7 × OVDD
OVDD
OVDD+0.3
V
Low-level DC CMOS input voltage
VIL
—
–0.3
0
0.3 × OVDD
V
Differential receiver VTH+
VTH+
—
—
100
mV
Differential receiver VTH-
VTH-
–100
—
—
mV
Input current (no pull-up/down)
IIN
VI = 0
VI = OVDD
—
—
110
60
nA
High-impedance I/O supply current
Icc-ovdd
VI = OVDD or 0
—
—
990
nA
High-impedance core supply current
Icc-vddi
VI = VDD or 0
—
—
1220
nA
3.5.1.2
DDR_TYPE = 01 SDRAM I/O DC Parameters
Table 18 shows the DC I/O parameters for SDRAM.
Table 18. SDRAM DC Electrical Characteristics
DC Electrical Characteristics
Symbol
Test Conditions
Min.
Typ.
Max.
Units
High-level output voltage
Voh
Ioh = Specified Drive
(Ioh = –4, –8, –12, –16mA)
2.4
—
—
V
Low-level output voltage
Vol
Ioh = Specified Drive
(Ioh = 4, 8, 12, 16mA)
—
—
0.4
V
High-level output current
I
Standard Drive
High Drive
Max. Drive
–4.0
–8.0
–12.0
—
—
mA
4.0
8.0
12.0
—
—
mA
Iol
Standard Drive
High Drive
Max. Drive
VIH
—
2.0
—
3.6
V
Ioh
Low-level output current
High-level DC input voltage
I
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9
Freescale Semiconductor
21
Table 18. SDRAM DC Electrical Characteristics (continued)
DC Electrical Characteristics
Symbol
Test Conditions
Min.
Typ.
Max.
Units
Low-level DC input voltage
VIL
—
–0.3 V
—
0.8
V
Input current (no pull-up/down)
IIN
VI = 0
VI = OVDD
—
—
150
80
nA
High-impedance I/O supply current
Icc-ovdd
VI = OVDD or 0
—
—
1180
nA
High-impedance core supply current
Icc-vddi
VI = VDD or 0
—
—
1220
nA
3.5.1.3
DDR_TYPE = 10 Max Setting DDR I/O DC Parameters
Table 19 shows the I/O parameters for DDR2 (SSTL_18).
Table 19. DDR2 (SSTL_18) I/O DC Electrical Characteristics
DC Electrical Characteristics
Symbol Test Conditions
Min.
Typ.
Max.
Units
High-level output voltage
Voh
—
OVDD – 0.28
—
—
V
Low-level output voltage
Vol
—
—
—
0.28
V
Output min. source current1
IIoh
—
–13.4
—
—
mA
IIol
—
13.4
—
—
mA
DC input logic high
VIH(dc)
—
OVDD/2 + 0.125
—
OVDD + 0.3
V
DC input logic low
VIL(dc)
—
–0.3 V
—
OVDD/2 – 0.125
V
DC input signal voltage3 (for differential
signal)
Vin(dc)
—
–0.3
—
OVDD + 0.3
V
DC differential input voltage4
Vid(dc)
—
0.25
—
OVDD+0.6
V
Vtt
—
IIN
VI = 0
VI = OVDD
Output min. sink
Termination
Input
current2
voltage5
current6(no
pull-up/down)
High-impedance I/O supply current6
High-impedance core supply current
1
2
3
4
5
6
6
OVDD/2 – 0.04
OVDD/2
OVDD/2 + 0.04
—
—
110
60
nA
Icc-ovdd VI = OVDD or 0
—
—
980
nA
Icc-vddi
—
—
1210
nA
VI = VDD or 0
OVDD = 1.7 V; Vout = 1.42 V. (Vout-OVDD)/IOH must be less than 21 W for values of Vout between OVDD and OVDD-0.28 V.
OVDD = 1.7 V; Vout = 280 mV. Vout/IOL must be less than 21 W for values of Vout between 0 V and 280 mV. Simulation circuit
for parameters Voh and Vol for I/O cells is below.
Vin(dc) specifies the allowable DC excursion of each differential input.
Vid(dc) specifies the input differential voltage required for switching. The minimum value is equal to Vih(dc) - Vil(dc).
Vtt is expected to track OVDD/2.
Minimum condition: BCS model, 1.95 V, and –40 °C. Typical condition: typical model, 1.8 V, and 25 °C. Maximum condition:
wcs model, 1.65 V, and 105 °C.
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9
22
Freescale Semiconductor
3.5.2
GPIO I/O DC Parameters
Table 20 shows the I/O parameters for GPIO.
Table 20. GPIO DC Electrical Characteristics
DC Electrical Characteristics
Symbol
Test Conditions
Min.
Typ.
Max.
Units
High-level output voltage1
Voh
Ioh=–1mA
Ioh = Specified Drive
OVDD – 0.15
0.8 × OVDD
—
—
V
Low-level output voltage1
Vol
Iol=1mA
Iol=Specified Drive
—
—
0.15
0.2 × OVDD
V
I
Voh=0.8 × OVDD
Standard Drive
High Drive
Max. Drive
—
—
mA
–2.0
–4.0
–8.0
Voh=0.8 × OVDD
Standard Drive
High Drive
Max. Drive
—
—
mA
–4.0
–6.0
–8.0
Voh=0.2 × OVDD
Standard Drive
High Drive
Max. Drive
—
—
mA
2.0
4.0
8.0
Voh=0.2 × OVDD
Standard Drive
High Drive
Max. Drive
—
—
mA
4.0
6.0
8.0
High-level output current for slow mode
Ioh
High-level output current for fast mode
I
Ioh
Low-level output current for slow mode
I
Iol
Low-level output current for fast mode
I
Iol
High-level DC input voltage
VIH
—
0.7 × OVDD
—
OVDD
V
Low-level DC input voltage
VIL
—
–0.3 V
—
0.3 × OVDD
V
VHYS
OVDD = 3.3 V
OVDD = 1.8V
370
290
—
420
320
mV
Schmitt trigger VT+1
VT+
—
0.5 × OVDD
—
—
V
1
VT–
—
—
—
0.5 × OVDD
V
Pull-up resistor (22 kΩ PU)
Rpu
Vi=0
18.5
22
25.6
kΩ
Pull-up resistor (47 kΩ PU)
Rpu
Vi=0
41
47
55
kΩ
Pull-up resistor (100 kΩ PU)
Rpu
Vi=0
85
100
120
kΩ
Pull-down resistor (100 kΩ PD)
Rpd
VI = OVDD
85
100
120
kΩ
Input current (no pull-up/down)
IIN
VI = 0, OVDD = 3.3 V
VI = OVDD = 3.3 V
VI = 0, OVDD = 1.8 V
VI = OVDD = 1.8 V
—
—
100
60
77
50
nA
Input current (22 kΩ PU)
IIN
VI = 0, OVDD = 3.3 V
VI = OVDD = 3.3 V
VI = 0, OVDD = 1.8 V
VI = OVDD = 1.8 V
117
0.0001
64
0.0001
—
184
0.0001
104
0.0001
μA
Input hysteresis
Schmitt trigger VT–
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9
Freescale Semiconductor
23
Table 20. GPIO DC Electrical Characteristics (continued)
DC Electrical Characteristics
Symbol
Test Conditions
Min.
Typ.
Max.
Units
Input current (47 kΩ PU)
IIN
VI = 0, OVDD = 3.3 V
VI = OVDD = 3.3 V
VI = 0, OVDD = 1.8 V
VI = OVDD = 1.8 V
54
0.0001
30
0.0001
—
88
0.0001
49
0.0001
μA
Input current (100 kΩ PU)
IIN
VI = 0, OVDD = 3.3 V
VI = OVDD = 3.3 V
VI = 0, OVDD = 1.8 V
VI = OVDD = 1.8 V
25
0.0001
14
0.0001
—
42
0.0001
23
0.0001
μA
Input current (100 kΩ PD)
IIN
VI = 0, OVDD = 3.3 V
VI = OVDD = 3.3 V
VI = 0, OVDD = 1.8 V
VI = OVDD = 1.8 V
25
0.0001
14
0.0001
—
42
0.001
23
0.0001
μA
High-impedance I/O supply current
Icc–ovdd
VI = 0, OVDD = 3.3 V
VI = OVDD = 3.3 V
VI = 0, OVDD = 1.8 V
VI = OVDD = 1.8 V
—
—
688
688
560
560
nA
High-impedance core supply current
Icc–vddi
VI = 0, OVDD = 3.3 V
VI = OVDD = 3.3 V
VI = 0, OVDD = 1.8 V
VI = OVDD = 1.8 V
—
—
490
490
410
410
nA
1
Hysteresis of 250 mV is guaranteed over all operating conditions when hysteresis is enabled.
3.6
AC Electrical Characteristics
This section provides the AC parameters for slow and fast I/O.
Figure 3 shows the load circuit for output. Figure 4 through Figure 6 show the output transition time and
propagation waveforms.
From Output
Under Test
Test Point
CL
CL includes package, probe and jig capacitance
Figure 3. Load Circuit for Output
OVDD
80%
80%
Output (at pad)
20%
20%
PA1
0V
PA1
Figure 4. Output Pad Transition Time Waveform
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9
24
Freescale Semiconductor
VDD
50%
50%
Input from core
(1 ns transition times)
0V
tPHL
tPLH
Output (at pad)
80%
50%
20%
80%
50%
20%
OVDD
0V
tTHL
tTLH
Figure 5. Output Pad Propagation and Transition Time Waveform
VDD
signal “1” pdat from core
0
signal “0” pdat from core
VDD
50%
signal open from core
tpv
OVDD
50%
Output (at pad)
Figure 6. Output Enable to Output Valid
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9
Freescale Semiconductor
25
3.6.1
Slow I/O AC Parameters
Table 21 shows the slow I/O AC parameters.
Table 21. Slow I/O AC Parameters
Symbol
Test Voltage
Test
Capacitance
Min.
Rise/Fall
Typ.
Rise/Fall
Max.
Rise/Fall
Units
Fduty
—
—
40
—
60
%
Output pad transition times1 (max.
drive)
tpr
3.0–3.6 V
3.0–3.6 V
1.65–1.95 V
1.65–1.95 V
25 pF
50 pF
25 pF
50 pF
0.95/0.84
1.58/1.37
2.70/2.50
3.40/3.20
1.36/1.11
2.19/1.77
1.80/1.40
2.80/2.14
2.06/1.60
3.20/2.47
3.01/2.37
4.63/3.38
ns
Output pad transition times1 (high
drive)
tpr
3.0–3.6 V
3.0–3.6 V
1.65–1.95 V
1.65–1.95 V
25 pF
50 pF
25 pF
50 pF
1.60/1.39
2.94/2.51
1.85/1.48
2.93/2.37
2.23/1.79
4.05/3.17
2.90/2.17
4.56/3.40
3.26/2.50
5.72/4.27
4.75/3.43
7.33/5.26
Output pad transition times1
(standard drive)
tpr
3.0–3.6 V
3.0–3.6 V
1.65–1.95 V
1.65–1.95 V
25 pF
50 pF
25 pF
50 pF
3.07/2.62
5.82/4.95
3.04/2.47
5.37/4.40
4.22/3.30
7.94/6.19
4.73/3.50
7.70/8.10
6.03/4.48
11.28/8.28
3.01/2.36
4.63/3.38
Output pad propagation delay1
(max. drive), 50%–50%
tpo
3.0–3.6 V
3.0–3.6 V
1.65–1.95 V
1.65–1.95 V
25 pF
50 pF
25 pF
50 pF
1.92/2.1
2.44/2.53
2.05/2.27
2.71/2.84
2.96/2.96
3.7/3.64
3.32/3.67
4.39/4.51
4.47/4.38
5.54/5.31
5.27/5.85
7.00/7.15
Output pad propagation delay1
(high drive), 50%–50%
tpo
3.0–3.6 V
3.0–3.6 V
1.65–1.95 V
1.65–1.95 V
25 pF
50 pF
25 pF
50 pF
2.35/2.49
3.31/3.43
2.58/2.69
3.62/3.60
3.58/3.61
4.9/4.786
4.17/4.27
5.86/5.61
5.35/5.24
7.19/6.8
6.64/6.74
9.34/8.76
Output pad propagation delay1
(standard drive), 50%–50%
tpo
3.0–3.6 V
3.0–3.6 V
1.65–1.95 V
1.65–1.95 V
25 pF
50 pF
25 pF
50 pF
3.39/3.51
5.28/5.35
3.71/3.68
5.52/5.32
5.03/4.89
7.6/7.14
6.03/5.75
8.80/7.96
7.39/6.95
10.97/9.45
9.64/8.97
13.9/11.3
Output pad propagation delay1
(max. drive), 40%–60%
tpo
3.0–3.6 V
3.0–3.6 V
1.65–1.95 V
1.65–1.95 V
25 pF
50 pF
25 pF
50 pF
1.942/2.04
2.378/2.48
2.03/2.28
2.59/2.73
2.923/2.95
3.541/3.53
3.19/3.59
4.10/4.33
4.33/4.3
5.29/5.09
4.97/5.64
6.43/6.77
Output pad propagation delay1
(high drive), 40%–60%
tpo
3.0–3.6 V
3.0–3.6 V
1.65–1.95 V
1.65–1.95 V
25 pF
50 pF
25 pF
50 pF
2.29/2.44
3.05/3.20
2.45/2.62
3.36/3.39
3.42/3.49
4.46/4.45
3.86/4.07
5.34/5.22
5.05/5.02
6.53/6.3
6.02/6.35
8.40/8.08
Output pad propagation delay1
(standard drive), 40%–60%
tpo
3.0–3.6 V
3.0–3.6 V
1.65–1.95 V
1.65–1.95 V
25 pF
50 pF
25 pF
50 pF
3.12/3.26
4.60/4.73
3.43/3.46
4.89/4.79
4.58/4.53
6.61/6.32
5.48/5.34
7.75/7.16
6.69/6.42
9.5/8.32
8.65/8.26
12.2/9.97
Parameter
Duty cycle
ns
ns
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9
26
Freescale Semiconductor
Table 21. Slow I/O AC Parameters (continued)
Symbol
Test Voltage
Test
Capacitance
Min.
Rise/Fall
Output enable to output valid
delay1 (max. drive), 50%–50%
tpv
3.0–3.6 V
3.0–3.6 V
1.65–1.95 V
1.65–1.95 V
25 pF
50 pF
25 pF
50 pF
2.13/2.01
2.65/2.46
2.31/2.45
2.95/3.01
3.3/3.045 5.072/4.609
4.038/3.639 6.142/5.423
6.11/6.47
3.76/4.00
7.81/7.73
4.81/4.82
Output enable to output valid
delay1 (high drive), 50%–50%
tpv
3.0–3.6 V
3.0–3.6 V
1.65–1.95 V
1.65–1.95 V
25 pF
50 pF
25 pF
50 pF
2.56/2.43
3.55/3.21
2.85/2.90
3.87/3.78
3.91/3.604
5.21/4.598
4.65/4.64
6.31/5.95
5.937/5.36
7.776/6.694
7.58/7.44
10.3/9.43
Output enable to output valid
delay1 (standard drive), 50%–50%
tpv
3.0–3.6 V
3.0–3.6 V
1.65–1.95 V
1.65–1.95 V
25 pF
50 pF
25 pF
50 pF
3.60/3.28
5.50/4.81
4.04/3.94
5.85/5.56
5.35/4.70
7.93/6.603
6.65/6.21
9.47/8.49
7.97/6.836
11.58/9.338
10.9/9.22
15.5/13.3
Output enable to output valid
delay1 (max. drive), 40%–60%
tpv
3.0–3.6 V
3.0–3.6 V
1.65–1.95 V
1.65–1.95 V
25 pF
50 pF
25 pF
50 pF
2.152/1.7
2.6/2.07
2.28/2.46
2.83/2.93
3.25/2.68
3.88/3.17
3.62/3.92
4.50/4.62
4.93/4.162
5.842/4.846
5.77/6.24
7.20/7.32
Output enable to output valid
delay1 (high drive), 40%–60%
tpv
3.0–3.6 V
3.0–3.6 V
1.65–1.95 V
1.65–1.95 V
25 pF
50 pF
25 pF
50 pF
2.497/2.036
3.254/2.647
2.71/2.81
3.59/3.56
3.75/3.135
4.8/3.9
4.31/4.23
5.75/5.54
5.633/4.782
7.117/5.84
6.89/7.01
9.23/8.71
Output enable to output valid
delay1 (standard drive), 40%–60%
tpv
3.0–3.6 V
3.0–3.6 V
1.65–1.95 V
1.65–1.95 V
25 pF
50 pF
25 pF
50 pF
3.326/2.7
4.81/3.85
3.73/3.69
5.16/4.99
4.9/3.9
6.9/5.4
6.04/5.77
8.28/7.61
7.269/5.95
10.12/7.86
9.81/9.11
13.4/11.8
Output pad slew rate2 (max. drive)
tps
3.0–3.6 V
3.0–3.6 V
1.65–1.95 V
1.65–1.95 V
25 pF
50 pF
25 pF
50 pF
0.79/1.12
0.49/0.73
0.30/0.42
0.20/0.29
1.30/1.77
0.84/1.23
0.54/0.73
0.35/0.50
2.02/2.58
1.19/1.58
0.91/1.20
0.60/0.80
Output pad slew rate2 (high drive)
tps
3.0–3.6 V
3.0–3.6 V
1.65–1.95 V
1.65–1.95 V
25 pF
50 pF
25 pF
50 pF
0.48/0.72
0.27/0.42
0.19/0.28
0.12/0.18
0.76/1.10
0.41/0.62
0.34/0.49
0.34/0.49
1.17/1.56
0.63/0.86
0.58/0/79
0.36/0.49
Output pad slew rate2 (standard
drive)
tps
3.0–3.6 V
3.0–3.6 V
1.65–1.95 V
1.65–1.95 V
25 pF
50 pF
25 pF
50 pF
0.25/0.40
0.14/0.21
0.12/0.18
0.07/0.11
0.40/0.59
0.21/0.32
0.20/0.30
0.11/0.17
0.60/0.83
0.32/0.44
0.34/0.47
0.20/0.27
Parameter
Typ.
Rise/Fall
Max.
Rise/Fall
Units
ns
ns
V/ns
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9
Freescale Semiconductor
27
Table 21. Slow I/O AC Parameters (continued)
Symbol
Test Voltage
Test
Capacitance
Min.
Rise/Fall
Typ.
Rise/Fall
Max.
Rise/Fall
Output pad dI/dt3 (max. drive)
tdit
3.0–3.6 V
3.0–3.6 V
1.65–1.95 V
1.65–1.95 V
25 pF
50 pF
25 pF
50 pF
15
16
7
7
36
38
21
22
76
80
56
58
Output pad dI/dt3 (high drive)
tdit
3.0–3.6 V
3.0–3.6 V
1.65–1.95 V
1.65–1.95 V
25 pF
50 pF
25 pF
50 pF
8
9
5
5
20
21
14
15
45
47
38
40
Output pad dI/dt3 (standard
drive)
tdit
3.0–3.6 V
3.0–3.6 V
1.65–1.95 V
1.65–1.95 V
25 pF
50 pF
25 pF
50 pF
4
4
2
2
10
10
7
7
22
23
18
19
Input pad propagation delay
without hysteresis, 50%–50% 4
tpi
—
1.6 pF
0.82/0.47
0.74/1
1.1/0.76
1.1/1.5
1.6/1.04
1.75/2.16
Input pad propagation delay with
hysteresis, 50%–50% 4
tpi
—
1.6 pF
1.1/1.3
1.75/1.63
1.43/1.6
2.67/2.22
2/2
2.92/3
Input pad propagation delay
without hysteresis, 40%–60% 4
tpi
—
1.6 pF
1.62/1.28
1.82/1.55
1.9/1.56
2.28/1.87
2.38/1.82
2.95/2.54
Input pad propagation delay with
hysteresis, 40%–60% 4
tpi
—
1.6 pF
1.88/2.1
2.4/2.6
2.2/2.4
3/3.07
2.7/2.75
3.77/3.71
Input pad transition times without
hysteresis4
trfi
—
1.6 pF
0.16/0.12
0.23/0.18
0.33/0.29
Input pad transition times with
hysteresis4
trfi
1.6 pF
0.16/0.13
0.22/0.18
0.33/0.29
Maximum input transition times5
trm
—
—
—
25
Parameter
1
2
3
4
5
—
Units
mA
/ns
ns
ns
Maximum condition for tpr, tpo, and tpv: wcs model, 1.1 V, I/O 3.0 V (3.0–3.6 V range) or 1.65 V (1.65–1.95 V range), and 105
°C. Minimum condition for tpr, tpo, and tpv: bcs model, 1.3 V, I/O 3.6 V (3.0–3.6 V range) or 1.95 V (1.65–1.95 V range), and
–40 °C. Input transition time from core is 1 ns (20%–80%).
Minimum condition for tps: wcs model, 1.1 V, I/O 3.0 V (3.0–3.6 V range) or 1.65 V (1.65–1.95 V range), and 105 °C. tps is
measured between VIL to VIH for rising edge and between VIH to VIL for falling edge.
Maximum condition for tdit: bcs model, 1.3 V, I/O 3.6 V (3.0–3.6 V range) or 1.95 V (1.65–1.95 V range), and –40 °C.
Maximum condition for tpi and trfi: wcs model, 1.1 V, I/O 3.0 V (3.0–3.6 V range) or 1.65 V (1.65–1.95 V range), and 105 °C.
Minimum condition for tpi and trfi: bcs model, 1.3 V, I/O 3.6 V or 1.95 V (1.65–1.95 V range), and –40 °C. Input transition time
from pad is 5 ns (20%–80%).
Hysteresis mode is recommended for input with transition time greater than 25 ns.
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9
28
Freescale Semiconductor
3.6.2
Fast I/O AC Parameters
Table 22 shows the fast I/O AC parameters for OVDD = 1.65–1.95 V.
Table 22. Fast I/O AC Parameters for OVDD = 1.65–1.95 V
Symbol
Test
Condition
Min.
Rise/Fall
Typ.
Max.
Rise/Fall
Units
Fduty
—
40
—
60
%
Output pad transition times1 (max. drive)
tpr
25 pF
50 pF
0.88/0.77
1.45/1.24
1.36/1.10
2.20/1.80
2.10/1.70
3.50/2.70
ns
Output pad transition times1 (high drive)
tpr
25 pF
50 pF
1.10/0.92
1.84/1.54
1.65/1.33
2.80/2.20
2.64/2.10
4.40/3.30
ns
Output pad transition times1 (standard drive)
tpr
25 pF
50 pF
1.60/1.35
2.74/2.26
2.47/1.95
4.20/3.20
3.99/3.10
6.56/4.86
ns
Output pad propagation delay1 (max. drive),
50%–50%
tpo
25 pF
50 pF
1.64/1.53
2.15/2.01
2.68/2.41
3.47/3.08
4.25/3.74
5.50/4.77
ns
Output pad propagation delay1 (high drive),
50%–50%
tpo
25 pF
50 pF
1.82/1.71
2.46/2.29
2.98/2.66
3.96/3.49
4.74/4.13
6.27/5.37
ns
Output pad propagation delay1 (standard drive),
50%–50%
tpo
25 pF
50 pF
2.24/2.06
3.17/2.92
3.63/3.15
5.09/4.41
5.73/4.84
8.06/6.75
ns
Output pad propagation delay1 (max. drive),
40%–60%
tpo
25 pF
50 pF
1.67/1.58
2.09/1.98
2.63/2.38
3.30/2.97
4.06/3.63
5.14/4.51
ns
Output pad propagation delay1 (high drive),
40%–60%
tpo
25 pF
50 pF
1.94/1.73
2.34/2.22
2.89/2.61
3.69/3.30
4.49/3.97
5.76/5.01
ns
Output pad propagation delay1 (standard drive),
40%–60%
tpo
25 pF
50 pF
2.15/1.99
2.94/2.74
3.39/2.99
4.65/4.07
5.28/4.53
7.28/6.13
ns
Output enable to output valid delay1 (max. drive),
50%–50%
tpv
25 pF
50 pF
1.87/1.70
2.36/2.16
3.06/2.71
3.83/3.37
4.97/4.30
6.18/5.30
ns
Output enable to output valid delay1 (high drive),
50%–50%
tpv
25 pF
50 pF
2.05/1.88
2.68/2.45
3.67/2.98
4.32/3.78
5.46/4.72
6.98/5.92
ns
Output enable to output valid delay1 (standard
drive), 50%–50%
tpv
25 pF
50 pF
2.49/2.25
3.40/3.08
4.06/3.50
5.50/4.73
6.57/5.49
8.88/7.37
ns
Output enable to output valid delay1 (max. drive),
40%–60%
tpv
25 pF
50 pF
1.90/1.74
2.30/2.13
3.00/2.69
3.65/3.24
4.76/4.18
5.79/5.02
ns
Output enable to output valid delay1 (high drive),
40%–60%
tpv
25 pF
50 pF
2.06/1.90
2.56/2.37
3.28/2.33
4.04/3.59
5.21/4.54
6.43/5.54
ns
Output enable to output valid delay1 (standard
drive), 40%–60%
tpv
25 pF
50 pF
2.39/2.18
3.16/2.89
3.80/3.18
5.03/4.37
6.05/5.14
8.02/6.72
ns
Output pad slew rate2 (max. drive)
tps
25 pF
50 pF
0.40/0.57
0.25/0.36
0.72/0.97
0.43/0.61
1.2/1.5
0.72/0.95
V/ns
Output pad slew rate2 (high drive)
tps
25 pF
50 pF
0.38/0.48
0.20/0.30
0.59/0.81
0.34/0.50
0.98/1.27
0.56/0.72
V/ns
Output pad slew rate2 (standard drive)
tps
25 pF
50 pF
0.23/0.32
0.13/0.20
0.40/0.55
0.23/0.34
0.66/0.87
0.38/0.52
V/ns
Parameter
Duty cycle
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9
Freescale Semiconductor
29
Table 22. Fast I/O AC Parameters for OVDD = 1.65–1.95 V (continued)
Parameter
Symbol
Test
Condition
Min.
Rise/Fall
Typ.
Max.
Rise/Fall
Units
Output pad dI/dt3 (max. drive)
tdit
25 pF
50 pF
7
7
43
46
112
118
mA/ns
Output pad dI/dt3 (high drive)
tdit
25 pF
50 pF
11
12
31
33
81
85
mA/ns
Output pad dI/dt3 (standard
drive)
tdit
25 pF
50 pF
9
10
27
28
71
74
mA/ns
Input pad propagation delay without hysteresis,
50%–50%4
tpi
1.6 pF
0.74/1
1.1/1.5
1.75/2.16
ns
Input pad propagation delay with hysteresis,
50%–50%4
tpi
1.6 pF
1.75/1.63
2.67/2.22
2.92/3
ns
Input pad propagation delay without hysteresis,
40%–60%4
tpi
1.6 pF
1.82/1.55
2.28/1.87
2.95/2.54
ns
Input pad propagation delay with hysteresis,
40%–60%4
tpi
1.6 pF
2.4/2.6
3/3.07
3.77/3.71
ns
Input pad transition times without hysteresis4
trfi
1.6 pF
0.16/0.12
0.30/0.18
0.33/0.29
ns
Input pad transition times with hysteresis4
trfi
1.6 pF
0.16/0.13
0.30/0.18
0.33/0.29
ns
Maximum input transition times5
trm
—
—
—
25
ns
1
2
3
4
5
Maximum condition for tpr, tpo, and tpv: wcs model, 1.1 V, I/O 1.65 V, and 105 °C. Minimum condition for tpr, tpo, and tpv: bcs
model, 1.3 V, I/O 1.95 V, and –40 °C. Input transition time from core is 1 ns (20%–80%).
Minimum condition for tps: wcs model, 1.1 V, I/O 1.65 V and 105 °C. tps is measured between VIL to VIH for rising edge and
between VIH to VIL for falling edge.
Maximum condition for tdit: bcs model, 1.3 V, I/O 1.95 V and –40 °C.
Maximum condition for tpi and trfi: wcs model, 1.1 V, I/O 1.65 V and 105 °C. Minimum condition for tpi and trfi: bcs model, 1.3 V,
I/O 1.95 V and –40 °C. Input transition time from pad is 5 ns (20%–80%).
Hysteresis mode is recommended for input with transition time greater than 25 ns.
Table 23 shows the fast I/O AC parameters for OVDD = 3.0–3.6 V.
Table 23. Fast I/O AC Parameters for OVDD = 3.0–3.6 V
Parameter
Duty Cycle
Output Pad Transition
Symbol
Test
Condition
Fduty
Times1
Min.
Rise/Fall
Typ.
40
Max.
Rise/Fall
Units
60
%
(Max Drive)
tpr
25 pF
50 pF
0.80/0.70
1.40/1.60
1.12/2.51
1.60/2.39
1.64/1.32
2.84/2.10
ns
Output Pad Transition Times1 (High Drive)
tpr
25 pF
50 pF
1.00/0.90
1.95/1.66
1.43/1.16
2.66/2.09
2.05/1.60
3.70/2.80
ns
Output Pad Transition Times1 (Standard Drive)
tpr
25 pF
50 pF
1.50/1.30
2.90/2.50
2.09/1.67
3.40/3.09
3.00/2.30
5.56/4.12
ns
Output Pad Propagation Delay1 (Max Drive),
50%–50%
tpo
25 pF
50 pF
1.20/1.28
1.67/1.75
1.74/1.73
2.39/2.32
2.67/2.52
3.58/3.33
ns
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9
30
Freescale Semiconductor
Table 23. Fast I/O AC Parameters for OVDD = 3.0–3.6 V (continued)
Output Pad Propagation Delay1 (High Drive),
50%–50%
tpo
25 pF
50 pF
1.35/1.42
1.98/2.04
1.95/1.91
2.81/2.68
2.96/2.76
4.16/3.78
ns
Output Pad Propagation Delay1 (Standard Drive),
50%–50%
tpo
25 pF
50 pF
1.77/1.85
2.70/2.78
2.54/2.48
3.82/3.62
3.80/3.60
5.62/5.10
ns
Output Pad Propagation Delay1 (Max Drive),
40%–60%
tpo
25 pF
50 pF
1.37/1.50
1.74/1.88
1.94/2.05
2.46/2.55
2.95/3.07
3.71/3.75
ns
Output Pad Propagation Delay1 (High Drive),
40%–60%
tpo
25 pF
50 pF
1.48/1.61
1.98/2.10
2.11/2.19
2.78/2.81
3.19/3.26
4.14/4.09
ns
Output Pad Propagation Delay1 (Standard Drive),
40%–60%
tpo
25 pF
50 pF
1.84/1.97
2.58/2.71
2.61/2.67
3.62/3.58
3.95/3.95
5.36/5.15
ns
Output Enable to Output Valid Delay1 (Max Drive),
50%–50%
tpv
25 pF
50 pF
1.34/1.32
1.81/1.79
1.91/1.81
2.56/2.40
2.92/2.67
3.83/3.47
ns
Output Enable to Output Valid Delay1 (High Drive),
50%–50%
tpv
25 pF
50 pF
1.48/1.47
2.12/2.1
2.12/2.00
2.98/2.76
3.21/2.92
4.41/3.94
ns
Output Enable to Output Valid Delay1 (Standard
Drive), 50%–50%
tpv
25 pF
50 pF
1.90/1.90
2.85/2.83
2.70/2.60
4.00/3.70
4.07/3.74
5.86/5.24
ns
Output Enable to Output Valid Delay1 (Max Drive),
40%–60%
tpv
25 pF
50 pF
1.55/1.42
1.93/1.81
2.25/2.08
2.77/2.58
3.50/3.31
4.24/3.99
ns
Output Enable to Output Valid Delay1 (High Drive),
40%–60%
tpv
25 pF
50 pF
1.67/1.54
2.16/2.03
2.41/2.23
3.08/2.86
3.74/3.51
4.66/4.34
ns
Output Enable to Output Valid Delay1 (Standard
Drive), 40%–60%
tpv
25 pF
50 pF
2.02/1.90
2.76/2.63
2.91/2.71
3.91/3.62
4.48/4.21
5.85/5.39
ns
Output Pad Slew Rate2 (Max Drive)
tps
25 pF
50 pF
0.96/1.40
0.54/0.83
1.54/2.10
0.85/1.24
2.30/3.00
1.26/1.70
V/ns
Output Pad Slew Rate2 (High Drive)
tps
25 pF
50 pF
0.76/1.10
0.41/0.64
1.19/1.71
0.63/0.95
1.78/2.39
0.95/1.30
V/ns
Output Pad Slew Rate2 (Standard Drive)
tps
25 pF
50 pF
0.52/0.78
0.28/0.44
0.80/1.19
0.43/0.64
1.20/1.60
0.63/0.87
V/ns
Output Pad di/dt3 (Max Drive)
didt
25 pF
50 pF
46
49
108
113
250
262
mA/ns
Output Pad di/dt3 (High Drive)
didt
25 pF
50 pF
35
37
82
86
197
207
mA/ns
Output Pad di/dt3 (Standard Drive)
didt
25 pF
50 pF
22
23
52
55
116
121
mA/ns
Input Pad Propagation Delay without Hysteresis,
50%–50%4
tpi
1.6pF
Input Pad Propagation Delay with Hysteresis,
50%–50%4
tpi
1.6pF
Input Pad Propagation Delay without Hysteresis,
40%–60%4
tpi
1.6pF
0.729/0.458 0.97/0.0649
1.404/0.97
1.203/0.938 1.172/1.187 1.713/1.535
0.879/0.977
1.434/1.12
1.854/1.427
ns
ns
ns
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9
Freescale Semiconductor
31
Table 23. Fast I/O AC Parameters for OVDD = 3.0–3.6 V (continued)
Input Pad Propagation Delay with Hysteresis,
40%–60%4
tpi
1.6pF
Input Pad Transition Times without Hysteresis4
trfi
1.6pF
0.16/0.12
0.23/0.18
0.33/0.29
ns
trfi
1.6pF
0.16/0.13
0.22/0.18
0.33/0.29
ns
trm
—
—
—
—
ns
Input Pad Transition Times with
Maximum Input Transition
1
2
3
4
5
Hysteresis4
Times5
1.353/1.457 1.637/1.659 2.163/1.991
ns
Maximum condition for tpr, tpo, and tpv: wcs model, 1.1 V, IO 3.0 V and 105 °C. Minimum condition for tpr, tpo, and tpv: bcs
model, 1.3 V, IO 3.6 V and –40 °C. Input transition time from core is 1ns (20%–80%).
Minimum condition for tps: wcs model, 1.1 V, IO 3.0 V and 105 °C. tps is measured between VIL to VIH for rising edge and
between VIH to VIL for falling edge.
Maximum condition for tdit: bcs model, 1.3 V, IO 3.6 V and –40 °C.
Maximum condition for tpi and trfi: wcs model, 1.1 V, IO 3.0 V and 105 °C. Minimum condition for tpi and trfi: bcs model, 1.3 V,
IO 3.6 V and –40 °C. Input transition time from pad is 5 ns (20%–80%).
Hysteresis mode is recommended for input with transition time greater than 25 ns.
3.6.3
DDR I/O AC Parameters
The DDR pad type is configured by the IOMUXC_SW_PAD_CTL_GRP_DDRTYPE register (see
Chapter 4, “External Signals and Pin Multiplexing,” in the i.MX25 Multimedia Applications Processor
Reference Manual).
3.6.3.1
DDR_TYPE = 00 Standard Setting I/O AC Parameters and Requirements
Table 24 shows AC parameters for mobile DDR I/O. These settings are suitable for mDDR and DDR2
1.8V (± 5%) applications.
Table 24. AC Parameters for Mobile DDR I/O
Symbol
Load
Condition
Min.
Rise/Fall
Typ.
Max.
Rise/Fall
Units
Fduty
—
40
50
60
%
f
—
—
—
133
MHz
Output pad transition times1 (max. drive)
tpr
25 pF
50 pF
0.52/0.51
0.98/0.96
0.79/0.72
1.49/1.34
1.25/1.09
2.31/1.98
ns
Output pad transition times1 (high drive)
tpr
25 pF
50 pF
1.13/1.10
2.15/2.10
1.74/1.55
3.28/2.92
2.71/2.30
5.11/4.31
ns
Output pad transition times1 (standard drive)
tpr
25 pF
50 pF
2.26/2.19
4.30/4.18
3.46/3.07
6.59/5.79
5.39/4.56
10.13/8.55
ns
Output pad propagation delay1 (max. drive),
50%–50%
tpo
15 pF
35 pF
0.80/1.03
1.06/1.32
1.36/1.50
1.76/1.90
2.21/2.40
2.83/2.82
ns
Output pad propagation delay1 (high drive),
50%–50%
tpo
15 pF
35 pF
1.04/1.27
1.63/1.90
1.74/1.83
2.63/2.69
2.79/2.70
4.18/3.86
ns
Output pad propagation delay1 (standard drive),
50%–50%
tpo
15 pF
35 pF
1.55/1.80
2.72/3.06
2.53/2.57
4.31/4.29
4.03/3.76
6.80/6.19
ns
Output pad propagation delay1 (max. drive),
40%–60%
tpo
15 pF
35 pF
0.80/0.91
1.06/1.12
1.44/1.59
1.76/1.91
2.24/2.29
2.74/2.75
ns
Parameter
Duty cycle
1
Clock frequency
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9
32
Freescale Semiconductor
Table 24. AC Parameters for Mobile DDR I/O (continued)
Parameter
Symbol
Load
Condition
Min.
Rise/Fall
Typ.
Max.
Rise/Fall
Units
Output pad propagation delay1 (high drive),
40%–60%
tpo
15 pF
35 pF
1.04/1.09
1.63/1.56
1.73/1.83
2.43/2.52
2.69/2.62
3.79/3.62
ns
Output pad propagation delay1 (standard drive),
40%–60%
tpo
15 pF
35 pF
1.50/1.74
2.73/2.42
2.36/2.41
3.77/3.78
3.67/3.46
5.86/5.37
ns
Output enable to output valid delay1 (max. drive),
50%–50%
tpv
15 pF
35 pF
1.17/1.01
1.43/1.30
1.93/1.61
2.33/2.00
3.06/2.55
3.69/3.13
ns
Output enable to output valid delay1 (high drive),
50%–50%
tpv
15 pF
35 pF
1.38/1.28
1.97/1.92
2.25/1.99
3.16/2.86
3.58/3.10
5.01/4.39
ns
Output enable to output valid delay1 (standard
drive), 50%–50%
tpv
15 pF
35 pF
1.92/1.57
3.12/3.16
3.11/2.79
4.97/4.59
4.98/4.13
7.97/6.98
ns
Output enable to output valid delay1 (max. drive),
40%–60%
tpv
15 pF
35 pF
1.28/1.12
1.49/1.36
2.01/1.70
2.33/2.01
3.09/2.60
3.60/3.06
ns
Output enable to output valid delay1 (high drive),
40%–60%
tpv
15 pF
35 pF
1.43/1.33
1.90/1.84
2.24/1.99
2.96/2.68
3.47/3.02
4.59/4.03
ns
Output enable to output valid delay1 (standard
drive), 40%–60%
tpv
15 pF
35 pF
1.85/1.78
2.80/2.81
2.91/2.62
4.37/4.53
4.54/3.96
6.88/6.05
ns
Output pad slew rate2 (max. drive)
tps
25 pF
50 pF
0.80/0.92
0.43/0.50
1.35/1.50
0.72/0.81
2.23/2.27
1.66/1.68
V/ns
Output pad slew rate2 (high drive)
tps
25 pF
50 pF
0.37/0.43
0.19/0.23
0.62/0.70
0.33/0.37
1.03/1.05
0.75/0.77
V/ns
Output pad slew rate2 (standard drive)
tps
25 pF
50 pF
0.18/0.22
0.10/0.12
0.31/0.35
0.16/0.18
0.51/0.53
0.38/0.39
V/ns
Output pad dI/dt3 (max. drive)
tdit
25 pF
50 pF
64
69
171
183
407
432
mA/ns
Output pad dI/dt3 (high drive)
tdit
25 pF
50 pF
37
39
100
106
232
246
mA/ns
Output pad di/dt3 (standard drive)
tdit
25 pF
50 pF
18
20
50
52
116
123
mA/ns
Input pad transition times4
trfi
1.0 pF
0.07/0.08
0.11/0.13
0.16/0.20
ns
Input pad propagation delay,
50%–50%4
tpi
1.0 pF
0.77/1.00
1.22/1.45
1.89/2.21
ns
Input pad propagation delay,
40%–60%4
tpi
1.0 pF
1.59/1.82
2.04/2.27
2.69/3.01
ns
1
Maximum condition for tpr, tpo, tpi, and tpv: wcs model, 1.1 V, I/O 1.65 V, and 105 °C. Minimum condition for tpr, tpo, and tpv:
bcs model, 1.3 V, I/O 1.95 V and –40 °C. Input transition time from core is 1 ns (20%–80%).
2 Minimum condition for tps: wcs model, 1.1 V, I/O 1.65 V, and 105 °C. tps is measured between VIL to VIH for rising edge and
between VIH to VIL for falling edge.
3 Maximum condition for tdit: bcs model, 1.3 V, I/O 1.95 V, and –40 °C.
4
Maximum condition for tpi and trfi: wcs model, 1.1 V, I/O 1.65 V and 105 °C. Minimum condition for tpi and trfi: bcs model, 1.3 V,
I/O 1.95 V and –40 °C. Input transition time from pad is 5 ns (20%–80%).
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9
Freescale Semiconductor
33
Table 25 shows the AC parameters for mobile DDR pbijtov18_33_ddr_clk I/O.
Table 25. AC Parameters for Mobile DDR pbijtov18_33_ddr_clk I/O
Symbol
Load
Condition
Min.
Rise/Fall
Typ.
Max.
Rise/Fall
Units
Fduty
—
40
50
60
%
f
—
—
—
133
MHz
(max. drive)
tpr
25 pF
50 pF
0.52/0.51
0.98/0.96
0.79/0.72
1.49/1.34
1.25/1.09
2.31/1.98
ns
Output pad transition times1 (high drive)
tpr
25 pF
50 pF
1.13/1.10
2.15/2.10
1.74/1.55
3.28/2.92
2.71/2.30
5.11/4.31
ns
Output pad transition times1 (standard drive)
tpr
25 pF
50 pF
2.26/2.19
4.30/4.18
3.46/3.07
6.59/5.79
5.39/4.56
10.13/8.55
ns
Output pad propagation delay1 (max. drive),
50%–50% input signals and crossing of output
signals
tpo
15 pF
35 pF
1.28/1.19
1.56/1.47
1.97/1.83
2.37/2.23
2.98/2.78
3.57/3.37
ns
Output pad propagation delay1 (high drive),
50%–50% input signals and crossing of output
signals
tpo
15 pF
35 pF
1.54/1.43
2.14/2.04
2.34/2.20
3.22/3.08
3.54/3.33
4.85/4.65
ns
Output pad propagation delay1 (standard drive),
50%–50% input signals and crossing of output
signals
tpo
15 pF
35 pF
2.05/1.94
3.27/3.16
3.11/2.96
4.86/4.72
4.70/4.50
7.33/7.12
ns
Output pad propagation delay1 (max. drive),
40%–60% input signals and crossing of output
signals
tpo
15 pF
35 pF
1.45/1.36
1.73/1.64
2.13/2.00
2.53/2.40
3.14/2.94
3.74/3.54
ns
Output pad propagation delay1 (high drive),
40%–60% input signals and crossing of output
signals
tpo
15 pF
35 pF
1.70/1.60
2.31/2.21
2.51/2.37
3.38/3.24
3.70/3.50
5.02/4.82
ns
Output pad propagation delay1 (standard drive),
40%–60% input signals and crossing of output
signals
tpo
15 pF
35 pF
2.22/2.11
3.43/3.32
3.27/3.13
5.02/4.88
4.87/4.66
7.49/7.29
ns
Output enable to output valid delay1 (max. drive),
50%–50%
tpv
15 pF
35 pF
1.16/1.12
1.42/1.41
1.91/1.81
2.31/2.20
3.10/2.89
3.72/3.47
ns
Output enable to output valid delay1 (high drive),
50%–50%
tpv
15 pF
35 pF
1.39/1.39
1.98/2.02
2.28/2.18
3.18/3.04
3.69/3.43
5.08/4.69
ns
Output enable to output valid delay1 (standard
drive), 50%–50%
tpv
15 pF
35 pF
1.90/1.94
3.07/3.20
3.09/2.94
4.88/4.66
4.95/4.55
7.73/7.05
ns
Output enable to output valid delay1 (max. drive),
40%–60%
tpv
15 pF
35 pF
1.28/1.24
1.49/1.47
2.00/1.90
2.32/2.21
3.14/2.93
3.64/3.41
ns
Output enable to output valid delay1 (high drive),
40%–60%
tpv
15 pF
35 pF
1.45/1.44
1.92/1.95
2.28/2.19
2.99/2.87
3.60/3.36
4.69/4.36
ns
Output enable to output valid delay1 (standard
drive), 40%–60%
tpv
15 pF
35 pF
1.85/1.88
2.78/2.88
2.92/2.79
4.34/4.16
4.5894.25
6.79/6.24
ns
Output pad slew rate2 (max. drive)
tps
25 pF
50 pF
0.37/0.45
0.30/0.36
0.64/0.79
0.52/0.61
1.14/1.36
0.90/1.02
V/ns
Parameter
Duty cycle
Clock frequency
1
Output pad transition
times1
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9
34
Freescale Semiconductor
Table 25. AC Parameters for Mobile DDR pbijtov18_33_ddr_clk I/O (continued)
Parameter
Symbol
Load
Condition
Min.
Rise/Fall
Typ.
Max.
Rise/Fall
Units
Output pad slew rate2 (high drive)
tps
25 pF
50 pF
0.30/0.37
0.21/0.25
0.51/0.63
0.36/0.42
091/1.06
0.63/0.67
V/ns
Output pad slew rate2 (standard drive)
tps
25 pF
50 pF
0.22/0.26
0.13/0.16
0.37/0.44
0.23/0.26
0.65/0.72
0.39/0.40
V/ns
Output pad dI/dt3 (max. drive)
tdit
25 pF
50 pF
65
70
171
183
426
450
mA/ns
Output pad dI/dt3 (high drive)
tdit
25 pF
50 pF
31
33
82
87
233
245
mA/ns
Output pad dI/dt3 (standard drive)
tdit
25 pF
50 pF
16
17
43
46
115
120
mA/ns
Input pad transition times4
trfi
1.0 pF
0.07/0.08
0.11/0.13
0.16/0.20
ns
Input pad propagation delay,
50%–50%4
tpi
1.0 pF
0.84/0.84
1.40/1.34
2.25/2.16
ns
Input pad propagation delay,
40%–60%4
tpi
1.0 pF
1.66/1.66
2.22/2.16
3.06/2.97
ns
1
Maximum condition for tpr, tpo, tpi, and tpv: wcs model, 1.1 V, I/O 1.65 V, and 105 °C. Minimum condition for tpr, tpo, and tpv:
bcs model, 1.3 V, I/O 1.95 V and –40 °C. Input transition time from core is 1 ns (20%–80%).
2 Minimum condition for tps: wcs model, 1.1 V, I/O 1.65 V, and 105 °C. tps is measured between VIL to VIH for rising edge and
between VIH to VIL for falling edge.
3 Maximum condition for tdit: bcs model, 1.3 V, I/O 1.95 V, and –40 °C.
4 Maximum condition for tpi and trfi: wcs model, 1.1 V, I/O 1.65 V and 105 °C. Minimum condition for tpi and trfi: bcs model, 1.3 V,
I/O 1.95 V and –40 °C. Input transition time from pad is 5 ns (20%–80%).
Table 26 shows the AC requirements for mobile DDR I/O.
Table 26. AC Requirements for Mobile DDR I/O
Parameter
Symbol
Min.
Max.
Units
AC input logic high
VIH(ac)
0.8 × OVDD
OVDD+0.3
V
AC input logic low
VIL(ac)
–0.3
0.2 × OVDD
V
AC differential input voltage
Vid(ac)
0.6 × OVDD
OVDD+0.6
V
AC differential cross point voltage for input
Vix(ac)
0.4 × OVDD
OVDD+0.6
V
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9
Freescale Semiconductor
35
3.6.3.2
DDR_TYPE = 01 SDRAM I/O AC Parameters and Requirements
Table 27 shows AC parameters for SDRAM I/O.
Table 27. AC Parameters for SDRAM I/O
Symbol
Load
Condition
Min.
Rise/Fall
Typ.
Max.
Rise/Fall
Units
Fduty
—
40
50
60
%
f
—
—
—
133
MHz
Output pad transition times1 (max. drive)
tpr
25 pF
50 pF
0.82/0.87
1.56/1.67
1.14/1.13
2.13/2.09
1.62/1.50
3.015/2.7
7
ns
Output pad transition times1 (high drive)
tpr
25 pF
50 pF
1.23/1.31
2.31/2.47
1.71/1.68
3.22/3.12
2.39/2.22
4.53/4.16
ns
Output pad transition times1 (standard drive)
tpr
25 pF
50 pF
2.44/2.60
4.65/4.99
3.38/3.27
6.38/6.23
4.73/4.38
9.05/8.23
ns
Output pad propagation delay1 (max. drive),
50%–50%
tpo
15 pF
35 pF
0.97/1.19
2.85/3.21
1.69/0.75
2.02/2.30
2.17/2.46
2.93/3.27
ns
Output pad propagation delay1 (high drive),
50%–50%
tpo
15 pF
35 pF
1.15/1.39
3.57/3.91
1.72/1.93
2.54/2.85
2.51/2.77
3.66/3.97
ns
Output pad propagation delay1 (standard drive),
50%–50%
tpo
15 pF
35 pF
2.01/1.57
5.73/6.05
2.45/2.69
4.10/4.51
3.54/3.77
5.84/6.13
ns
Output pad propagation delay1 (max. drive),
40%–60%
tpo
15 pF
35 pF
1.06/1.26
1.38/1.38
1.53/1.73
1.96/2.23
2.18/2.47
2.78/3.12
ns
Output pad propagation delay1 (high drive),
40%–60%
tpo
15 pF
35 pF
1.15/1.20
1.75/1.67
1.72/1.93
2.37/2.66
2.45/2.71
3.35/3.67
ns
Output pad propagation delay1 (standard drive),
40%–60%
tpo
15 pF
35 pF
1.91/2.01
2.88/2.56
2.30/2.52
3.59/3.97
3.26/3.50
5.06/5.36
ns
Output enable to output valid delay1 (max. drive),
50%–50%
tpv
15 pF
35 pF
0.90/1.27
1.07/1.77
1.44/1.89
1.66/2.51
2.19/2.87
2.51/3.69
ns
Output enable to output valid delay1 (high drive),
50%–50%
tpv
15 pF
35 pF
1.01/1.48
1.37/2.33
1.58/2.16
2.06/3.09
2.38/3.23
3.06/4.46
ns
Output enable to output valid delay1 (standard drive),
50%–50%
tpv
15 pF
35 pF
1.32/2.14
2.04/3.67
2.02/3.00
3.00/4.91
3.01/4.36
4.40/6.90
ns
Output enable to output valid delay1 (max. drive),
40%–60%
tpv
15 pF
35 pF
1.03/1.34
1.16/1.74
1.54/1.94
1.74/2.44
2.26/2.88
2.55/3.54
ns
Output enable to output valid delay1 (high drive),
40%–60%
tpv
15 pF
35 pF
1.11/1.51
1.39/2.10
1.65/2.15
2.03/2.89
2.43/3.16
2.95/4.13
ns
Output enable to output valid delay1 (standard drive),
40%–60%
tpv
15 pF
35 pF
1.35/2.03
1.91/3.23
1.99/2.83
2.76/4.30
2.89/4.03
3.98/6.01
ns
Output pad slew rate2 (max. drive)
tps
25 pF
50 pF
1.11/1.20
0.97/0.65
1.74/1.75
0.92/0.94
2.42/2.46
1.39/1.30
V/ns
Output pad slew rate2 (high drive)
tps
25 pF
50 pF
0.76/0.80
0.40/0.43
1.16/1.19
0.61/0.63
1.76/1.66
0.93/0.87
V/ns
Parameter
Duty cycle
Clock frequency1
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9
36
Freescale Semiconductor
Table 27. AC Parameters for SDRAM I/O (continued)
Parameter
Symbol
Load
Condition
Min.
Rise/Fall
Typ.
Max.
Rise/Fall
Units
Output pad slew rate2 (standard drive)
tps
25 pF
50 pF
0.38/0.41
0.20/0.22
0.59/0.60
0.31/0.32
0.89/0.82
0.47/0.43
V/ns
Output pad dI/dt3 (max. drive)
tdit
25 pF
50 pF
89
94
198
209
398
421
mA/ns
Output pad dI/dt3 (high drive)
tdit
25 pF
50 pF
59
62
132
139
265
279
mA/ns
Output pad dI/dt3 (standard drive)
tdit
25 pF
50 pF
29
31
65
69
132
139
mA/ns
Input pad transition times4
Input pad propagation delay,
trfi
1.0 pF
0.07/0.08
0.11/0.12
0.16/0.20
ns
50%–50%4
tpi
1.0 pF
0.35/1.17
0.63/1.53
1.16/2.04
ns
4
tpi
—
1.18/1.99
1.45/2.35
1.97/2.85
—
Input pad propagation delay, 40%–60%
1
Maximum condition for tpr, tpo, tpi, and tpv: wcs model, 1.1 V, I/O 3.0 V, and 105 °C. Minimum condition for tpr, tpo, and tpv:
bcs model, 1.3 V, I/O 3.6 V and –40 °C. Input transition time from core is 1 ns (20%–80%).
2 Minimum condition for tps: wcs model, 1.1 V, I/O 3.0 V, and 105 °C. tps is measured between VIL to VIH for rising edge and
between VIH to VIL for falling edge.
3 Maximum condition for tdit: bcs model, 1.3 V, I/O 3.6 V, and –40 °C.
4 Maximum condition for tpi and trfi: wcs model, 1.1 V, I/O 3.0 V and 105 °C. Minimum condition for tpi and trfi: bcs model, 1.3 V,
I/O 3.6 V and –40 °C. Input transition time from pad is 5 ns (20%–80%).
Table 28 shows AC parameters for SDRAM pbijtov18_33_ddr_clk I/O.
Table 28. AC Parameters for SDRAM pbijtov18_33_ddr_clk I/O
Symbol
Load
Condition
Min.
Rise/Fall
Typ.
Max.
Rise/Fall
Units
Fduty
—
40
50
60
%
f
—
—
—
133
MHz
(max. drive)
tpr
25 pF
50 pF
0.82/0.87
1.56/1.67
1.14/1.13
2.13/2.09
1.62/1.50
3.015/2.7
7
ns
Output pad transition times1 (high drive)
tpr
25 pF
50 pF
1.23/1.31
2.31/2.47
1.71/1.68
3.22/3.12
2.39/2.22
4.53/4.16
ns
Output pad transition times1 (standard drive)
tpr
25 pF
50 pF
2.44/2.60
4.65/4.99
3.38/3.27
6.38/6.23
4.73/4.38
9.05/8.23
ns
Output pad propagation delay1 (max. drive),
50%–50% input signals and crossing of output signals
tpo
15 pF
35 pF
1.50/1.40
1.95/1.85
2.23/2.07
2.81/2.66
3.28/3.04
4.06/3.82
ns
Output pad propagation delay1 (high drive),
50%–50% input signals and crossing of output signals
tpo
15 pF
35 pF
1.69/1.59
2.35/2.25
2.48/2.32
3.35/3.19
3.63/3.38
4.80/4.56
ns
Output pad propagation delay1 (standard drive),
50%–50% input signals and crossing of output signals
tpo
15 pF
35 pF
2.26/2.15
3.59/3.49
3.24/3.08
4.98/4.82
4.66/4.42
7.00/6.75
ns
Output pad propagation delay1 (max. drive),
40%–60% input signals and crossing of output signals
tpo
15 pF
35 pF
1.67/1.57
2.11/2.02
2.39/2.24
2.97/2.82
3.45/3.21
4.23/3.99
ns
Parameter
Duty cycle
Clock frequency
1
Output pad transition
times1
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9
Freescale Semiconductor
37
Table 28. AC Parameters for SDRAM pbijtov18_33_ddr_clk I/O (continued)
Load
Condition
Min.
Rise/Fall
Typ.
Max.
Rise/Fall
tpo
15 pF
35 pF
1.85/1.75
2.52/2.42
2.65/2.49
3.51/3.36
3.79/3.55
4.97/4.72
ns
Output pad propagation delay1 (standard drive),
40%–60% input signals and crossing of output signals
tpo
15 pF
35 pF
2.42/2.32
3.76/3.66
3.40/3.25
5.15/4.99
4.83/4.59
7.17/6.92
ns
Output enable to output valid delay1 (max. drive),
50%–50%
tpv
15 pF
35 pF
1.37/1.34
1.77/1.83
2.22/2.02
2.77/2.63
3.53/3.12
4.30/3.92
ns
Output enable to output valid delay1 (high drive),
50%–50%
tpv
15 pF
35 pF
1.55/1.56
2.15/2.29
2.46/2.30
3.28/3.21
3.87/3.47
5.02/4.67
ns
Output enable to output valid delay1 (standard drive),
50%–50%
tpv
15 pF
35 pF
2.07/2.18
3.28/3.65
3.20/3.08
4.84/4.90
4.92/4.50
7.21/6.89
ns
Output enable to output valid delay1 (max. drive),
40%–60%
tpv
15 pF
35 pF
1.46/1.42
1.77/1.81
2.28/2.07
2.71/2.56
3.54/3.13
4.15/3.78
ns
Output enable to output valid delay1 (high drive),
40%–60%
tpv
15 pF
35 pF
1.60/1.59
2.07/2.18
2.47/2.30
3.12/3.02
3.82/3.41
4.72/4.37
ns
Output enable to output valid delay1 (standard drive),
40%–60%
tpv
15 pF
35 pF
2.01/2.09
2.96/3.26
3.05/2.91
4.34/4.37
4.64/4.23
6.45/6.13
ns
Output pad slew rate 2 (max. drive)
tps
25 pF
50 pF
1.11/1.20
0.60/0.65
1.74/1.75
0.93/0.95
2.63/2.48
1.39/1.29
V/ns
Output pad slew rate 2 (high drive)
tps
25 pF
50 pF
0.75/0.81
0.40/0.43
1.16/1.18
0.62/0.64
1.76/1.65
094/0.87
V/ns
Output pad slew rate 2 (standard drive)
tps
25 pF
50 pF
0.38/0.41
0.20/0.22
0.59/0.61
0.31/0.32
0.89/0.83
0.47/0.43
V/ns
Output pad dI/dt3 (max. drive)
tdit
25 pF
50 pF
89
95
202
213
435
456
mA/ns
Output pad dI/dt3 (high drive)
tdit
25 pF
50 pF
60
63
135
142
288
302
mA/ns
Output pad dI/dt3 (standard drive)
tdit
25 pF
50 pF
29
31
67
70
144
150
mA/ns
Input pad transition times4
Parameter
Symbol
Output pad propagation delay1 (high drive),
40%–60% input signals and crossing of output signals
Units
trfi
1.0 pF
0.07/0.08
0.11/0.12
0.16/0.20
ns
Input pad propagation delay,
50%–50%4
tpi
1.0 pF
0.56/0.69
0.87/1.08
1.37/1.62
ns
Input pad propagation delay,
40%–60%4
tpi
1.38/1.51
1.68/1.89
2.18/2.42
1
Maximum condition for tpr, tpo, tpi, and tpv: wcs model, 1.1 V, I/O 3.0 V, and 105 °C. Minimum condition for tpr, tpo, and tpv:
bcs model, 1.3 V, I/O 3.6 V and –40 °C. Input transition time from core is 1 ns (20%–80%).
2 Minimum condition for tps: wcs model, 1.1 V, I/O 3.0 V, and 105 °C. tps is measured between VIL to VIH for rising edge and
between VIH to VIL for falling edge.
3 Maximum condition for tdit: bcs model, 1.3 V, I/O 3.6 V, and –40 °C.
4
Maximum condition for tpi and trfi: wcs model, 1.1 V, I/O 3.0 V and 105 °C. Minimum condition for tpi and trfi: bcs model, 1.3 V,
I/O 3.6 V and –40 °C. Input transition time from pad is 5 ns (20%–80%).
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9
38
Freescale Semiconductor
3.6.3.3
DDR_TYPE = 10 Max Setting I/O AC Parameters and Requirements
Table 29 shows AC parameters for DDR2 I/O.
Table 29. AC Parameters for DDR2 I/O
Symbol
Load
Condition
Min.
Rise/Fall
Typ.
Max.
Rise/Fall
Units
Fduty
—
40
50
60
%
f
—
—
—
133
MHz
Output pad transition times1
tpr
25 pF
50 pF
0.53/0.52
1.01/0.98
0.80/0.72
1.49/1.34
1.19/1.04
2.21/1.90
ns
Output pad propagation delay, 50%–50%1
tpo
25 pF
50 pF
0.93/1.25
1.26/1.54
1.56/1.70
2.07/2.19
2.52/2.53
3.29/3.24
ns
Output pad propagation delay, 40%–60%1
tpo
25 pF
50 pF
1.01/1.17
1.27/1.53
1.60/1.75
2.00/2.14
2.49/2.52
3.11/3.10
ns
Output enable to output valid delay, 50%–50%1
tpv
25 pF
50 pF
1.30/1.19
1.62/1.54
2.17/1.81
2.56/2.29
3.35/2.84
3.35/2.54
ns
Output enable to output valid delay, 40%–60%1
tpv
25 pF
50 pF
1.39/1.27
1.64/1.55
2.13/1.86
2.62/2.23
3.38/2.83
4.14/2.38
ns
Output pad slew rate2
tps
25 pF
50 pF
0.86/0.98
0.46/054
1.35/1.5
0.72/0.81
2.15/2.19
1.12/1.16
V/ns
Output pad dI/dt3
tdit
25 pF
50 pF
65
70
157
167
373
396
mA/ns
Parameter
Duty cycle
Clock frequency
Input pad transition times4
trfi
1.0 pF
0.07/0.08
0.10/0.12
0.17/0.20
ns
Input pad propagation delay,
50%–50%4
tpi
1.0 pF
0.83/0.99
1.23/1.49
1.79/2.04
ns
Input pad propagation delay,
40%–60%4
tpi
1.0 pF
1.65/1.81
2.05/2.31
2.60/2.84
ns
1
Maximum condition for tpr, tpo, tpi, and tpv: wcs model, 1.1 V, I/O 1. V, and 105 °C. Minimum condition for tpr, tpo, and tpv: bcs
model, 1.3 V, I/O 1.9 V and –40 °C. Input transition time from core is 1 ns (20%–80%).
2 Minimum condition for tps: wcs model, 1.1 V, I/O 1.7 V, and 105 °C. tps is measured between VIL to VIH for rising edge and
between VIH to VIL for falling edge.
3 Maximum condition for tdit: bcs model, 1.3 V, I/O 1.9 V, and –40 °C.
4
Maximum condition for tpi and trfi: wcs model, 1.1 V, I/O 1.7 V and 105 °C. Minimum condition for tpi and trfi: bcs model, 1.3 V,
I/O 1.9 V and –40 °C. Input transition time from pad is 5 ns (20%–80%).
Table 30 shows AC parameters for DDR2 pbijtov18_33_ddr_clk I/O.
Table 30. AC Parameters for DDR2 pbijtov18_33_ddr_clk I/O
Parameter
Duty cycle
Clock frequency
Output pad transition
times1
Output pad propagation delay1, 50%–50% input
signals and crossing of output signals
Symbol
Load
Condition
Min.
Rise/Fall
Typ.
Max.
Rise/Fall
Units
Fduty
—
40
50
60
%
f
—
—
—
133
MHz
tpr
25 pF
50 pF
0.53/0.52
1.01/0.98
0.80/0.72
1.49/1.34
1.19/1.04
2.21/1.90
ns
tpo
25 pF
50 pF
1.3/1.21
1.59/1.5
1.97/1.84
2.37/2.24
2.91/2.71
3.48/3.28
ns
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9
Freescale Semiconductor
39
Table 30. AC Parameters for DDR2 pbijtov18_33_ddr_clk I/O (continued)
Parameter
Symbol
Load
Condition
Min.
Rise/Fall
Typ.
Max.
Rise/Fall
Units
Output pad propagation delay1, 40%–60% input
signals and crossing of output signals
tpo
25 pF
50 pF
1.47/1.38
1.75/1.67
2.13/2.00
2.54/2.40
3.072/2.87
3.65/3.45
ns
Output enable to output valid delay, 50%–50%1
tpv
25 pF
50 pF
1.32/1.28
1.66/1.65
2.11/2.00
2.61/2.50
3.31/3.12
4.06/3.81
ns
Output enable to output valid delay, 40%–60%1
tpv
25 pF
50 pF
1.40/1.37
1.67/1.66
2.16/2.06
2.56/2.45
3.30/3.13
3.89/3.67
ns
Output pad slew rate2
tps
25 pF
50 pF
0.86/0.98
0.46/054
1.35/1.5
0.72/0.81
2.15/2.19
1.12/1.16
V/ns
Output pad dI/dt3
tdit
25 pF
50 pF
72
77
172
183
400
422
mA/ns
Input pad transition times4
trfi
1.0 pF
0.07/0.08
0.10/0.12
0.17/0.20
ns
Input pad propagation delay,
50%–50%4
tpi
1.0 pF
0.89/0.87
1.41/1.37
2.16/2.07
ns
Input pad propagation delay,
40%–60%4
tpi
1.0 pF
1.71/1.69
2.22/2.18
2.98/2.88
ns
1
Maximum condition for tpr, tpo, tpi, and tpv: wcs model, 1.1 V, I/O 1. V, and 105 °C. Minimum condition for tpr, tpo, and tpv: bcs
model, 1.3 V, I/O 1.9 V and –40 °C. Input transition time from core is 1 ns (20%–80%).
2 Minimum condition for tps: wcs model, 1.1 V, I/O 1.7 V, and 105 °C. tps is measured between VIL to VIH for rising edge and
between VIH to VIL for falling edge.
3 Maximum condition for tdit: bcs model, 1.3 V, I/O 1.9 V, and –40 °C.
4 Maximum condition for tpi and trfi: wcs model, 1.1 V, I/O 1.7 V and 105 °C. Minimum condition for tpi and trfi: bcs model, 1.3 V,
I/O 1.9 V and –40 °C. Input transition time from pad is 5 ns (20%–80%).
Table 31 shows the AC requirements for DDR2 I/O.
Table 31. AC Requirements for DDR2 I/O
Parameter1
Symbol
Min.
Max.
Units
AC input logic high
VIH(ac)
OVDD/2 + 0.25
OVDD + 0.3
V
AC input logic low
VIL(ac)
–0.3
OVDD/2 – 0.25
V
AC differential input voltage2
Vid(ac)
0.5
OVDD + 0.6
V
AC differential cross point voltage for
input3
Vix(ac)
OVDD/2–0.175
OVDD/2 + 0.175
V
AC differential cross point voltage for
output4
Vox(ac)
OVDD/2–0.125
OVDD/2 + 0.125
V
1
The Jedec SSTL_18 specification (JESD8-15a) for an SSTL interface for class II operation supersedes any specification in
this document.
2 Vid(ac) specifies the input differential voltage |Vtr–Vcp| required for switching, where Vtr is the “true” input signal and Vcp is
the “complementary” input signal. The minimum value is equal to Vih(ac)–Vil(ac)
3 The typical value of Vix(ac) is expected to be about 0.5 × OVDD. and Vix(ac) is expected to track variation of OVDD. Vix(ac)
indicates the voltage at which differential input signal must cross.
4
The typical value of Vox(ac) is expected to be about 0.5 × OVDD and Vox(ac) is expected to track variation in OVDD. Vox(ac)
indicates the voltage at which differential output signal must cross. Cload = 25 pF.
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3.7
Module Timing and Electrical Parameters
This section contains the timing and electrical parameters for i.MX25 modules.
3.7.1
1-Wire Timing Parameters
Figure 7 shows the reset and presence pulses (RPP) timing for 1-Wire.
1-Wire Tx
“Reset Pulse”
1-Wire Memory Device
“Presence Pulse”
OW2
1-Wire bus
(OWIRE_LINE)
OW3
OW1
OW4
Figure 7. 1-Wire RPP Timing Diagram
Table 32 lists the RPP timing parameters.
Table 32. RPP Sequence Delay Comparisons Timing Parameters
ID
Parameters
Symbol
Min.
Typ.
Max.
Units
OW1
Reset Time Low
tRSTL
480
511
—
μs
OW2
Presence Detect High
tPDH
15
—
60
μs
OW3
Presence Detect Low
tPDL
60
—
240
μs
OW4
Reset Time High
tRSTH
480
512
—
μs
Figure 8 shows write 0 sequence timing, and Table 33 describes the timing parameters (OW5–OW6) that
are shown in the figure.
OW6
1-Wire bus
(OWIRE_LINE)
OW5
Figure 8. Write 0 Sequence Timing Diagram
Table 33. WR0 Sequence Timing Parameters
ID
Parameter
OW5
Write 0 Low Time
OW6
Transmission Time Slot
Symbol
Min.
Typ.
Max.
Units
tWR0_low
60
100
120
μs
tSLOT
OW5
117
120
μs
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41
Figure 9 and Figure 10 show write 1 and read sequence timing, respectively. Table 34 describes the timing
parameters (OW7–OW8) that are shown in the figure.
OW8
1-Wire bus
(OWIRE_LINE)
OW7
Figure 9. Write 1 Sequence Timing Diagram
OW8
1-Wire bus
(OWIRE_LINE)
OW7
OW9
Figure 10. Read Sequence Timing Diagram
Table 34. WR1 /RD Timing Parameters
ID
Parameter
Symbol
Min.
Typ.
Max.
Units
OW7
Write 1 / read low time
tLOW1
1
5
15
μs
OW8
Transmission time slot
tSLOT
60
117
120
μs
OW9
Release time
tRELEASE
15
—
45
μs
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3.7.2
ATA Timing Parameters
Table 35 shows parameters used to specify the ATA timing. These parameters depend on the
implementation of the ATA interface on silicon, the bus buffer used, the cable delay and cable skew.
Table 35. Timing Parameters
Name
T
ti_ds
ti_dh
Description
Bus clock period
Value/Contributing Factor
Peripheral clock frequency
Set-up time ata_data to ata_iordy edge (UDMA-in only)
UDMA0
UDMA1
UDMA2,UDMA3
UDMA4
UDMA5
15 ns
10 ns
7 ns
5 ns
4 ns
Hold time ata_iordy edge to ata_data (UDMA-in only)
UDMA0,UDMA1,UDMA2,UDMA3,UDMA4
UDMA5
5.0 ns
4.6 ns
tco
Propagation delay bus clock L-to-H to
ata_cs0, ata_cs1, ata_da2, ata_da1, ata_da0, ata_dior, ata_diow, ata_dmack,
ata_data, ata_buffer_en
12.0 ns
tsu
Set-up time ata_data to bus clock L-to-H
8.5 ns
tsui
Set-up time ata_iordy to bus clock H-to-L
8.5 ns
thi
Hold time ata_iordy to bus clock H-to-L
2.5 ns
7 ns
tskew1
Maximum difference in propagation delay bus clock L-to-H to any of the
following signals
ata_cs0, ata_cs1, ata_da2, ata_da1, ata_da0, ata_dior, ata_diow,
ata_dmack, ata_data (write), ata_buffer_en
tskew2
Maximum difference in buffer propagation delay for any of the following signals
ata_cs0, ata_cs1, ata_da2, ata_da1, ata_da0, ata_dior, ata_diow,
ata_dmack, ata_data (write), ata_buffer_en
Transceiver
tskew3
Maximum difference in buffer propagation delay for any of the following signals
ata_iordy, ata_data (read)
Transceiver
Maximum buffer propagation delay
Transceiver
tbuf
tcable1
cable propagation delay for ata_data
Cable
tcable2
cable propagation delay for control signals ata_dior, ata_diow, ata_iordy,
ata_dmack
Cable
tskew4
Maximum difference in cable propagation delay between ata_iordy and
ata_data (read)
Cable
tskew5
Maximum difference in cable propagation delay between (ata_dior, ata_diow,
ata_dmack) and ata_cs0, ata_cs1, ata_da2, ata_da1, ata_da0,
ata_data(write)
Cable
tskew6
Maximum difference in cable propagation delay without accounting for ground
bounce
Cable
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3.7.2.1
PIO Mode Timing Parameters
Figure 11 shows a timing diagram for PIO read mode.
t1
t2r
t9
ADDR
(See note 1)
t5
DIOR
t6
tA
READ Data(15:0)
IORDY
IORDY
trd1
Figure 11. PIO Read Mode Timing
To meet PIO read mode timing requirements, a number of timing parameters must be controlled. Table 36
shows timing parameters and their determining relations, and indicates parameters that can be adjusted to
meet required conditions.
Table 36. Timing Parameters for PIO Read Mode
PIO Read
ATA
Mode Timing
Parameter
Parameter1
1
Relation
Adjustable Parameter
t1
t1
t1(min.) = time_1 × T – (tskew1 + tskew2 + tskew5)
time_1
t2
t2r
t2(min.) = time_2r × T – (tskew1 + tskew2 + tskew5)
time_2r
t9
t9
t9(min.) = time_9 × T – (tskew1 + tskew2 + tskew6)
time_9
t5
t5
t5(min.) = tco + tsu + tbuf + tbuf + tcable1 + tcable2
If not met, increase time_2
t6
t6
0
tA
tA
tA(min.) = (1.5 + time_ax) × T – (tco + tsui + tcable2 + tcable2 + 2 × tbuf)
trd
trd1
t0
—
—
time_ax
time_pio_rdx
trd1(max.) = (–trd) + (tskew3 + tskew4)
trd1(min.) = (time_pio_rdx – 0.5) × T – (tsu + thi)
(time_pio_rdx – 0.5) × T > tsu + thi + tskew3 + tskew4
t0(min.) = (time_1 + time_2 + time_9) × T
time_1, time_2r, time_9
See Figure 11.
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Figure 12 gives timing waveforms for PIO write mode.
t1
t2w
t9
ADDR
(See note 1)
DIOR
DIOW
buffer_en
Write Data(15:0)
ton
tA
tB t4 toff
t1
IORDY
IORDY
Figure 12. PIO Write Mode Timing
To meet PIO write mode timing requirements, a number of timing parameters must be controlled. Table 37
shows timing parameters and their determining relations, and indicates parameters that can be adjusted to
meet required conditions.
Table 37. Timing Parameters for PIO Write Mode
PIO Write
ATA
Mode Timing
Parameter
Parameter1
1
Relation
Adjustable Parameter(s)
t1(min.) = time_1 × T – (tskew1 + tskew2 + tskew5)
t1
t1
time_1
t2
t2w
t9
t9
t9(min.) = time_9 × T – (tskew1 + tskew2 + tskew6)
t3
—
t3(min.) = (time_2w – time_on) × T – (tskew1 + tskew2 +tskew5)
t4
t4
t4(min.) = time_4 × T – tskew1
time_4
tA
tA
tA = (1.5 + time_ax) × T – (tco + tsui + tcable2 + tcable2 + 2 × tbuf)
time_ax
t0
—
t0(min.) = (time_1 + time_2 + time_9) × T
—
—
Avoid bus contention when switching buffer on by making ton long
enough
—
—
—
Avoid bus contention when switching buffer off by making toff long
enough
—
t2(min.) = time_2w × T – (tskew1 + tskew2 + tskew5)
time_2w
time_9
if not met, increase time_2w
time_1, time_2r, time_9
See Figure 12.
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3.7.2.2
Multiword DMA (MDMA) Mode Timing
Figure 13 and Figure 14 show the timing for MDMA read and write modes, respectively.
tk1
DMARQ
ADDR
(See note 1)
DMACK
DIOR
tm
READ Data(15:0)
td
tk
te
tgr
tkjn
tfr
Figure 13. MDMA Read Mode Timing
tk1
DMARQ
ADDR
(See note 1)
DMACK
buffer_en
DIOW
tm ton td1
tk
td
tkjn toff
Write Data(15:0)
Figure 14. MDMA Write Mode Timing
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To meet timing requirements, a number of timing parameters must be controlled. See Table 38 for details
on timing parameters for MDMA read and write modes.
Table 38. Timing Parameters for MDMA Read and Write Modes
ATA
Parameter
MDMA Read1
and Write2
Timing
Parameters
tm, ti
tm
tm(min.) = ti(min.) = time_m × T – (tskew1 + tskew2 + tskew5)
time_m
td
td, td1
td1(min.) = td(min.) = time_d × T – (tskew1 + tskew2 + tskew6)
time_d
tk
tk
tk(min.) = time_k × T – (tskew1 + tskew2 + tskew6)
time_k
t0
—
t0(min.) = (time_d + time_k) × T
tg(read)
tgr
tgr(min.–read) = tco + tsu + tbuf + tbuf + tcable1 + tcable2
tgr(min.–drive) = td – te(drive)
tf(read)
tfr
tfr(min.–drive) =0 k
tg(write)
—
tg(min.–write) = time_d × T –(tskew1 + tskew2 + tskew5)
time_d
tf(write)
—
tf(min.–write) = time_k × T – (tskew1 + tskew2 + tskew6)
time_k
tL
—
tL(max.) = (time_d + time_k–2) × T – (tsu + tco + 2 × tbuf + 2 × tcable2)
time_d, time_k3
tn, tj
tkjn
tn= tj= tkjn = (max.(time_k,. time_jn) × T – (tskew1 + tskew2 + tskew6)
time_jn
—
ton
toff
ton = time_on × T – tskew1
toff = time_off × T – tskew1
Relation
Adjustable
Parameter(s)
time_d, time_k
time_d
—
—
1
See Figure 13.
See Figure 14.
3 tk1 in the UDMA figures equals (tk –2 × T).
2
3.7.2.3
Ultra DMA (UDMA) Mode Timing
UDMA mode timing is more complicated than PIO mode or MDMA mode. In this section, timing
diagrams for UDMA in- and out-transfers are provided.
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3.7.2.3.1
UDMA In-Transfer Timing
Figure 15 shows the timing for UDMA in-transfer start.
tack
ADDR
DMARQ
DMACK
tenv
DIOR
DIOW
tc1
tc1
IORDY
DATA READ
tds
tdh
Figure 15. Timing for UDMA In-Transfer Start
Figure 16 shows the timing for host-terminated UDMA in-transfer.
ADDR
tack
DMARQ
DMACK
DIOR
trp
DIOW
tc1
tc1
tmli
tx1
IORDY
tmli
DATA READ
tds
tdh
tzah
tzah
ton tdzfs tcvh
toff
DATA WRITE
buffer_en
Figure 16. Timing for Host-Terminated UDMA In-Transfer
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Figure 17 shows timing for device-terminated UDMA in-transfer.
ADDR
tack
DMARQ
DMACK
DIOR
DIOW
tmli
tc1
tc1 tss1 tli5
IORDY
tmli
DATA READ
tds
tdh
tzah
tzah
ton tdzfs tcvh
toff
DATA WRITE
buffer_en
Figure 17. Timing for Device-Terminated UDMA Transfer
Timing parameters for UDMA in-burst are listed in Table 39.
Table 39. Timing Parameters for UDMA In-Burst
ATA
Parameter
Spec.
Parameter
tack
tack
tack(min.) = (time_ack × T) – (tskew1 + tskew2)
time_ack
tenv
tenv
tenv(min.) = (time_env × T) – (tskew1 + tskew2)
tenv(max.) = (time_env × T) + (tskew1 + tskew2)
time_env
tds
tds1
tds – (tskew3) – ti_ds > 0
tdh
tdh1
tdh – (tskew3) –ti_dh > 0
tcyc
tc1
(tcyc – tskew) > T
trp
trp
trp(min.) = time_rp × T – (tskew1 + tskew2 + tskew6)
time_rp
—
tx11
(time_rp × T) – (tco + tsu + 3T + 2 × tbuf + 2 × tcable2) > trfs (drive)
time_rp
tmli
tmli1
tmli1(min.) = (time_mlix + 0.4) × T
time_mlix
tzah
tzah
tzah(min.) = (time_zah + 0.4) × T
time_zah
tdzfs
tdzfs
tdzfs = (time_dzfs × T) – (tskew1 + tskew2)
time_dzfs
tcvh
tcvh
tcvh = (time_cvh × T) – (tskew1 + tskew2)
time_cvh
—
ton
toff
ton = time_on × T – tskew1
toff = time_off × T – tskew1
Value
Required Conditions
tskew3, ti_ds, ti_dh
should be low enough
T big enough
—
1
There is a special timing requirement in the ATA host that requires the internal DIOW to go only high three clocks after the last
active edge on the DSTROBE signal. The equation given on this line tries to capture this constraint.
Make ton and toff big enough to avoid bus contention.
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3.7.2.4
UDMA Out-Transfer Timing
Figure 18 shows the timing for start of UDMA out-transfer.
tack
ADDR
DMARQ
DMACK
tenv
DIOW
DIOR
buffer_en
tcyc
ton
tcyc
tdzfs tdvs tdvh tdvs
DATA WRITE
tli1
IORDY
trfs1
Figure 18. Timing for UDMA Out-Transfer Start
Figure 19 shows timing for host-terminated UDMA out-transfer.
ADDR
tack
DMARQ
DMACK
DIOW
tss
DIOR
tcyc
tli2
tcyc1
tdzfs_mli tcvh
toff
DATA WRITE
IORDY
tli3
buffer_en
Figure 19. Timing for Host-Terminated UDMA Out-Transfer
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Timing parameters for UDMA out-bursts are listed in Table 40.
Table 40. Timing Parameters UDMA Out-Bursts
ATA
Parameter
Spec
Parameter
tack
tack
tack(min.) = (time_ack × T) – (tskew1 + tskew2)
time_ack
tenv
tenv
tenv(min.) = (time_env × T) – (tskew1 + tskew2)
tenv(max.) = (time_env × T) + (tskew1 + tskew2)
time_env
tdvs
tdvs
tdvs = (time_dvs × T) – (tskew1 + tskew2)
time_dvs
tdvh
tdvh
tdvs = (time_dvh × T) – (tskew1 + tskew2)
time_dvh
tcyc
tcyc
tcyc = time_cyc × T – (tskew1 + tskew2)
time_cyc
t2cyc
—
t2cyc = time_cyc × 2 × T
time_cyc
trfs1
trfs
trfs = 1.6 × T + tsui + tco + tbuf + tbuf
—
tdzfs
tss
tss
tmli
tdzfs_mli
tli
Value
tdzfs = time_dzfs × T – (tskew1)
tss = time_ss × T – (tskew1 + tskew2)
How to Meet?
—
time_dzfs
time_ss
tdzfs_mli =max.(time_dzfs, time_mli) × T – (tskew1 + tskew2)
—
tli1
tli1 > 0
—
tli
tli2
tli2 > 0
—
tli
tli3
tli3 > 0
—
tcvh
tcvh
tcvh = (time_cvh × T) – (tskew1 + tskew2)
—
ton
toff
ton = time_on × T – tskew1
toff = time_off × T – tskew1
3.7.3
time_cvh
—
Digital Audio Mux (AUDMUX) Timing
The AUDMUX provides a programmable interconnect logic for voice, audio, and data routing between
internal serial interfaces (SSI and SAP) and external serial interfaces (audio and voice codecs). The AC
timing of AUDMUX external pins is governed by the SSI modules. For more information, see
Section 3.7.17, “Synchronous Serial Interface (SSI) Timing.”
3.7.4
CMOS Sensor Interface (CSI) Timing
The CSI enables the chip to connect directly to external CMOS image sensors, which are classified as
dumb or smart as follows:
• Dumb sensors only support traditional sensor timing (vertical sync (VSYNC) and horizontal sync
(HSYNC)) and output-only Bayer and statistics data.
• Smart sensors support CCIR656 video decoder formats and perform additional processing of the
image (for example, image compression, image pre-filtering, and various data output formats).
The following subsections describe the CSI timing in gated and ungated clock modes.
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3.7.4.1
Gated Clock Mode Timing
Figure 20 and Figure 21 shows the gated clock mode timings for CSI, and Table 41 describes the timing
parameters (P1–P7) shown in the figures. A frame starts with a rising/falling edge on VSYNC, then
HSYNC is asserted and holds for the entire line. The pixel clock is valid as long as HSYNC is asserted.
VSYNC
P1
HSYNC
P7
P2
P5
P6
PIXCLK
P3
P4
DATA[15:0]
Figure 20. CSI Gated Clock Mode—Sensor Data at Falling Edge, Latch Data at Rising Edge
VSYNC
P1
HSYNC
P7
P2
P6
P5
PIXCLK
P3
P4
DATA[15:0]
Figure 21. CSI Gated Clock Mode—Sensor Data at Rising Edge, Latch Data at Falling Edge
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Table 41. CSI Gated Clock Mode Timing Parameters
ID
Parameter
Symbol
Min.
Max.
Units
P1
CSI VSYNC to HSYNC time
tV2H
67.5
—
ns
P2
CSI HSYNC setup time
tHsu
1
—
ns
P3
CSI DATA setup time
tDsu
1
—
ns
P4
CSI DATA hold time
tDh
1.2
—
ns
P5
CSI pixel clock high time
tCLKh
10
—
ns
P6
CSI pixel clock low time
tCLKl
10
—
ns
P7
CSI pixel clock frequency
fCLK
—
48 ± 10%
MHz
3.7.4.2
Ungated Clock Mode Timing
Figure 22 shows the ungated clock mode timings of CSI, and Table 42 describes the timing parameters
(P1–P6) that are shown in the figure. In ungated mode the VSYNC and PIXCLK signals are used, and the
HSYNC signal is ignored.
VSYNC
P1
P6
P4
P5
PIXCLK
P2
P3
DATA[15:0]
Figure 22. CSI Ungated Clock Mode—Sensor Data at Falling Edge, Latch Data at Rising Edge
Table 42. CSI Ungated Clock Mode Timing Parameters
ID
Parameter
Symbol
Min.
Max.
Units
tVSYNC
67.5
—
ns
P1
CSI VSYNC to pixel clock time
P2
CSI DATA setup time
tDsu
1
—
ns
P3
CSI DATA hold time
tDh
1.2
—
ns
P4
CSI pixel clock high time
tCLKh
10
—
ns
P5
CSI pixel clock low time
tCLKl
10
—
ns
P6
CSI pixel clock frequency
fCLK
—
48 ± 10%
MHz
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3.7.5
Configurable Serial Peripheral Interface (CSPI) Timing
Figure 23 and Figure 24 provide CSPI master and slave mode timing diagrams, respectively. Table 43
describes the timing parameters (t1–t14) that are shown in the figures. The values shown in timing
diagrams were tested using a worst-case core voltage of 1.1 V, slow pad voltage of 2.68 V, and fast pad
voltage of 1.65 V.
t7
SSn
(output)
t5
t8
t9
t6
RDY
(input)
SCLK
(output)
t1
t10
t2
t3
t11
t4
t4
MOSI
t12
t13
MISO
Figure 23. CSPI Master Mode Timing Diagram
t7’
t5’
SSn
(input)
t6’
t1’
SCLK
(input)
t10
t2’
t3’
t11
t4
t4
t14
MISO
t12
t13
t14
MOSI
Figure 24. CSPI Slave Mode Timing Diagram
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Table 43. CSPI Interface Timing Parameters
ID
Parameter Description
Symbol
Minimum
Maximum
Units
t1
CSPI master SCLK cycle time
tclko
60.2
—
ns
t2
CSPI master SCLK high time
tclkoH
22.65
—
ns
t3
CSPI master SCLK low time
tclkoL
22.47
—
ns
t1’
CSPI slave SCLK cycle time
tclki
60.2
—
ns
t2’
CSPI slave SCLK high time
tclkiH
30.1
—
ns
t3’
CSPI slave SCLK low time
tclkiL
30.1
—
ns
CSPI SCLK transition time
1
8.5
ns
t4
t5
SSn output pulse width
tpr
tWsso
2.6
2Tsclk2
+T wait
3
—
—
—
—
t5’
SSn input pulse width
tWssi
Tper4
t6
SSn output asserted to first SCLK edge (SS output setup
time)
tSsso
3Tsclk
—
—
t6’
SSn input asserted to first SCLK edge (SS input setup
time)
tSssi
Tper
—
—
t7
CSPI master: Last SCLK edge to SSn negated (SS
output hold time)
tHsso
2Tsclk
—
—
t7’
CSPI slave: Last SCLK edge to SSn negated (SS input
hold time)
tHssi
30
—
ns
t8
CSPI master: CSPI1_RDY low to SSn asserted
(CSPI1_RDY setup time)
tSrdy
2Tper
5Tper
—
t9
CSPI master: SSn negated to CSPI1_RDY low
tHrdy
0
—
ns
t10
Output data setup time
tSdatao
(tclkoL or tclkoH or
tclkiL or tclkiH) –
Tipg5
—
—
t11
Output data hold time
tHdatao
tclkoL or tclkoH or
tclkiL or tclkiH
—
—
t12
Input data setup time
tSdatai
Tipg + 0.5
—
ns
t13
Input data hold time
tHdatai
0
—
ns
t14
Pause between data word
tpause
0
—
ns
1
The output SCLK transition time is tested with 25 pF drive.
Tsclk = CSPI clock period
3 T
wait = Wait time, as specified in the sample period control register
4 T
per = CSPI reference baud rate clock period (PERCLK2)
5
Tipg = CSPI main clock IPG_CLOCK period
2
3.7.6
External Memory Interface (EMI) Timing
The EMI module includes the enhanced SDRAM/LPDDR memory controller (ESDCTL), NAND Flash
controller (NFC), and wireless external interface module (WEIM). The following subsections give timing
information for these submodules.
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3.7.6.1
ESDCTL Electrical Specifications
3.7.6.1.1
SDRAM Memory Controller
The following diagrams and tables specify the timings related to the SDRAMC module which interfaces
SDRAM.
SD1
SDCLK
SDCLK
SD2
SD3
SD4
CS
SD5
RAS
SD4
SD5
SD4
CAS
SD4
SD5
SD5
WE
SD6
SD7
ADDR
ROW/BA
COL/BA
SD8
SD10
SD9
DQ
Data
SD4
DQM
Note: CKE is high during the read/write cycle.
SD5
Figure 25. SDRAM Read Cycle Timing Diagram
Table 44. DDR/SDR SDRAM Read Cycle Timing Parameters
ID
SD1
Parameter
SDRAM clock high-level width1
width1
Symbol
Min.
Max.
Unit
tCH
3.4
4.1
ns
tCL
3.4
4.1
ns
tCK
7.5
—
ns
SD2
SDRAM clock low-level
SD3
SDRAM clock cycle time
SD4
CS, RAS, CAS, WE, DQM, CKE setup time
tCMS
2.0
—
ns
SD5
CS, RAS, CAS, WE, DQM, CKE hold time
tCMH
1.8
—
ns
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Table 44. DDR/SDR SDRAM Read Cycle Timing Parameters (continued)
ID
1
2
Parameter
Symbol
Min.
Max.
Unit
SD6
Address setup time
tAS
2.0
—
ns
SD7
Address hold time
tAH
1.8
—
ns
SD8
SDRAM access time
tAC
—
6.47
ns
SD9
Data out hold time2
tOH
1.2
—
ns
SD10
Active to read/write command period
tRC
10
—
clock
SD1 + SD2 does not exceed 7.5 ns for 133 MHz.
Timing parameters are relevant only to SDR SDRAM. For the specific DDR SDRAM data related timing parameters, see
Table 48 and Table 49.
SD1
SDCLK
SDCLK
SD2
SD3
SD4
CS
SD5
RAS
SD11
SD4
CAS
SD5
SD4
SD4
WE
SD5
SD5
SD12
SD7
SD6
ADDR
BA
COL/BA
ROW / BA
SD13
DQ
SD14
DATA
DQM
Figure 26. SDR SDRAM Write Cycle Timing Diagram
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Table 45. SDR SDRAM Write Timing Parameters
ID
Parameter
Min.
Max.
Unit
SD1
SDRAM clock high-level width
tCH
3.4
4.1
ns
SD2
SDRAM clock low-level width
tCL
3.4
4.1
ns
SD3
SDRAM clock cycle time
tCK
7.5
—
ns
SD4
CS, RAS, CAS, WE, DQM, CKE setup time
tCMS
2.0
—
ns
SD5
CS, RAS, CAS, WE, DQM, CKE hold time
tCMH
1.8
—
ns
SD6
Address setup time
tAS
2.0
—
ns
SD7
Address hold time
tAH
1.8
—
ns
tRP
1
4
clock
tRCD
1
8
clock
SD11
1
Symbol
Precharge cycle
period1
1
SD12
Active to read/write command delay
SD13
Data setup time
tDS
2.0
—
ns
SD14
Data hold time
tDH
1.3
—
ns
SD11 and SD12 are determined by SDRAM controller register settings.
SD1
SDCLK
SDCLK
SD2
SD3
CS
RAS
SD11
CAS
SD10
SD10
WE
SD7
SD6
ADDR
BA
ROW/BA
Figure 27. SDRAM Refresh Timing Diagram
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Table 46. SDRAM Refresh Timing Parameters
ID
Parameter
Min.
Max.
Unit
SD1
SDRAM clock high-level width
tCH
3.4
4.1
ns
SD2
SDRAM clock low-level width
tCL
3.4
4.1
ns
SD3
SDRAM clock cycle time
tCK
7.5
—
ns
SD6
Address setup time
tAS
1.8
—
ns
SD7
Address hold time
tAH
1.8
—
ns
SD10
Precharge cycle period1
tRP
1
4
clock
tRC
2
20
clock
SD11
1
Symbol
Auto precharge command
period1
SD10 and SD11 are determined by SDRAM controller register settings.
SDCLK
CS
RAS
CAS
WE
ADDR
BA
SD16
CKE
SD16
Don’t care
Figure 28. SDRAM Self-Refresh Cycle Timing Diagram
NOTE
The clock continues to run unless CKE is low. Then the clock is stopped in
low state.
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Table 47. SDRAM Self-Refresh Cycle Timing Parameters
ID
Parameter
SD16
CKE output delay time
3.7.6.1.2
Symbol
Min.
Max.
Unit
tCKS
1.8
—
ns
Mobile DDR SDRAM–Specific Parameters
The following diagrams and tables specify the timings related to the SDRAMC module which interfaces
with the mobile DDR SDRAM.
SDCLK
SDCLK
SD20
SD19
DQS (output)
SD18
SD17
DQ (output)
DQM (output)
SD17
SD18
Data
Data
Data
Data
Data
Data
Data
Data
DM
DM
DM
DM
DM
DM
DM
DM
SD17
SD17
SD18
SD18
Figure 29. Mobile DDR SDRAM Write Cycle Timing Diagram
Table 48. Mobile DDR SDRAM Write Cycle Timing Parameters1
ID
Parameter
Symbol
Min.
Max.
Unit
SD17
DQ and DQM setup time to DQS
tDS
0.95
—
ns
SD18
DQ and DQM hold time to DQS
tDH
0.95
—
ns
SD19
Write cycle DQS falling edge to SDCLK output delay time
tDSS
1.8
—
ns
SD20
Write cycle DQS falling edge to SDCLK output hold time
tDSH
1.8
—
ns
1
Test condition: Measured using delay line 5 programmed as follows: ESDCDLY5[15:0] = 0x0703.
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SDCLK
SDCLK
SD23
DQS (input)
SD22
SD21
DQ (input)
Data
Data
Data
Data
Data
Data
Data
Data
Figure 30. Mobile DDR SDRAM DQ versus DQS and SDCLK Read Cycle Timing Diagram
Table 49. Mobile DDR SDRAM Read Cycle Timing Parameters
ID
Parameter
SD21 DQS – DQ Skew (defines the data valid window in read cycles related to DQS)
SD22 DQS DQ HOLD time from DQS
SD23 DQS output access time from SDCLK posedge
Symbol
Min. Max. Unit
tDQSQ
—
0.85
ns
tQH
2.3
—
ns
tDQSCK
—
6.7
ns
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3.7.6.1.3
DDR2 SDRAM–Specific Parameters
The following diagrams and tables specify timing related to the SDRAMC module, which interfaces with
DDR2 SDRAM.
DDR1
SDCLK
SDCLK
DDR2
DDR4
DDR3
CS
DDR5
DDR4
RAS
DDR5
DDR4
CAS
DDR4
DDR5
DDR5
WE
CKE
DDR4
DDR6
ADDR
DDR7
ROW/BA
COL/BA
Figure 31. DDR2 SDRAM Basic Timing Parameters
Table 50 provides values for a command/address slew rate of 1 V/ns and an SDCLK, SDCLK_B
differential slew rate of 2 V/ns. For additional values, use Table 51, “tlS, tlH Derating Values for
DDR2-400, DDR2-533.”
Table 50. DDR2 SDRAM Timing Parameter Table
DDR2-400
ID
Parameter
Symbol
Unit
Min.
Max.
DDR1
SDRAM clock high-level width
tCH
0.45
0.55
tCK
DDR2
SDRAM clock low-level width
tCL
0.45
0.55
tCK
DDR3
SDRAM clock cycle time
tCK
7.5
8
ns
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Table 50. DDR2 SDRAM Timing Parameter Table (continued)
DDR2-400
ID
Parameter
Symbol
Unit
Min.
Max.
DDR4
CS, RAS, CAS, CKE, WE setup time
tIS
0.35
—
ns
DDR5
CS, RAS, CAS, CKE, WE hold time
tIH
0.475
—
ns
DDR6
Address output setup time
tIS
0.35
—
ns
DDR7
Address output hold time
tIH
0.475
—
ns
Table 50 shows values for a command/address slew rate of 1 V/ns and an SDCLK, SDCLK_B differential
slew rate of 2 V/ns. Table 51 shows additional values for DDR2-400 and DDR2-533.
Table 51. tlS, tlH Derating Values for DDR2-400, DDR2-533
CK, CK Differential Slew Rate
Command/
Address
Slew Rate (V/Ns)
2.0 V/ns
1.5 V/ns
1.0 V/ns
Units
ΔtlS
ΔtlH
ΔtlS
ΔtlH
ΔtlS
ΔtlH
4.0
+187
+94
+217
+124
+247
+154
ps
3.5
+179
+89
+209
+119
+239
+149
ps
3.0
+167
+83
+197
+113
+227
+143
ps
2.5
+150
+75
+180
+105
+210
+135
ps
2.0
+125
+45
+155
+75
+185
+105
ps
1.5
+83
+21
+113
+51
+143
+81
ps
1.0
0
0
+30
+30
+60
+60
ps
0.9
–11
–14
+19
+16
+49
+46
ps
0.8
–25
–31
+5
–1
+35
+29
ps
0.7
–43
–54
–13
–24
+17
+6
ps
0.6
–67
–83
–37
–53
–7
–23
ps
0.5
–110
–125
–80
–95
–50
–65
ps
0.4
–175
–188
–145
–158
–115
–128
ps
0.3
–285
–292
–255
–262
–225
–232
ps
0.25
–350
–375
–320
–345
–290
–315
ps
0.2
–525
–500
–495
–470
–465
–440
ps
0.15
–800
–708
–770
–678
–740
–648
ps
0.1
–1450
–1125
–1420
–1095
–1390
–1065
ps
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SDCLK
SDCLK_B
DDR21
DDR22
DQS (output)
DDR18
DDR17
DQ (output)
DQM (output)
DDR20
DDR23
DDR17
DDR19
DDR18
Data
Data
Data
Data
Data
Data
Data
Data
DM
DM
DM
DM
DM
DM
DM
DM
DDR17
DDR18
DDR17
DDR18
Figure 32. DDR2 SDRAM Write Cycle Timing Diagram
Table 52. DDR2 SDRAM Write Cycle Parameter Table
DDR2-400
ID
DDR17
1
Parameter
Symbol
DQ & DQM setup time to DQS (single-ended strobe)1
strobe)1
Unit
Min.
Max.
tDS1(base)
0.025
—
ns
tDH1(base)
0.025
—
ns
DDR18
DQ & DQM hold time to DQS (single-ended
DDR19
Write cycle DQS falling edge to SDCLK output setup time
tDSS
0.2
—
tCK
DDR20
Write cycle DQS falling edge to SDCLK output hold time
tDSH
0.2
—
tCK
DDR21
DQS latching rising transitions to associated clock edges
tDQSS
-0.25
0.25
tCK
DDR22
DQS high-level width
tDQSH
0.35
—
tCK
DDR23
DQS low-level width
tDQSL
0.35
—
tCK
These values are for a DQ/DM slew rate of 1 V/ns and a DQS slew rate of 1 V/ns. For additional values use Table 53, “DtDS1,
DtDH1 Derating Values for DDR2-400, DDR2-533.”
Table 53. ΔtDS1, ΔtDH1 Derating Values for DDR2-400, DDR2-5331,2,3
DQS Single-Ended Slew Rate
2.0 V/ns
1.5 V/ns
1.0 V/ns
0.9 V/ns
0.8 V/ns
0.7 V/ns
ΔtD ΔtD ΔtD ΔtD ΔtD ΔtD ΔtD ΔtD ΔtD ΔtD ΔtD
S1 H1 S1 H1 S1 H1 S1 H1 S1 H1 S1
ΔtD
H1
0.6 V/ns
ΔtD
S1
0.5 Vns
ΔtD
H1
ΔtD
S1
ΔtD
H1
0.4 V/ns
ΔtD
S1
ΔtD
H1
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Table 53. ΔtDS1, ΔtDH1 Derating Values for DDR2-400, DDR2-5331,2,3 (continued)
DQS Single-Ended Slew Rate
2.0 188
188 167 146 125
63
—
—
—
—
—
—
—
—
—
—
—
—
1.5 146
167 125 125
83
42
81
43
—
—
—
—
—
—
—
—
—
—
1.0 63
125
42
83
0
0
–2
1
–7
–13
—
—
—
—
—
—
—
—
0.9
DQ Slew Rate
0.8
V/ns
0.7
—
—
31
69
–11 –14 –13 –13 –18 –27 –29
–45
—
—
—
—
—
—
—
—
—
—
–25 –31 –27 –30 –32 –44 –43
–62
–60
–86
—
—
—
—
—
—
—
—
—
—
–85
–78 –109 –108 –152
—
—
0.6
—
—
—
—
—
—
—
—
0.5
—
—
—
—
—
—
—
—
—
—
0.4
—
—
—
—
—
—
—
—
—
—
–45 –53 –50 –67 –61
–74 –96 –85 –114 –102 –138 –132 –181 –183 –246
–128 –156 –145 –180 –175 –223 –226 –288
—
—
–210 –243 –240 –286 –291 –351
1
All units in ‘ps’.
Test conditions are at capacitance=15pF for DDR PADS. Recommended drive strengths are medium for SDCLK and high for
address and controls.
3 SDRAM CLK and DQS related parameters are measured from the 50% point. That is, high is defined as 50% of the signal
value, and low is defined as 50% of the signal value. DDR SDRAM CLK parameters are measured at the crossing point of
SDCLK and SDCLK (inverted clock).
2
SDCLK
SDCLK_B
DDR26
DQS (input)
DDR25
DDR24
DQ (input)
DATA
DATA
DATA
DATA
DATA
DATA
DATA
DATA
Figure 33. DDR2 SDRAM DQ vs. DQS and SDCLK READ Cycle Timing Diagram
Table 54. DDR2 SDRAM Read Cycle Parameter Table1,2
DDR2-400
ID
Parameter
Symbol
Unit
Min. Max.
DDR24 DQS - DQ Skew (defines the Data valid window in read cycles related to DQS)
DDR25 DQS DQ in HOLD time from
DQS3
DDR26 DQS output access time from SDCLK posedge
1
tDQSQ
—
0.35
ns
tQH
2.925
—
ns
tDQSCK
–0.5
0.5
ns
Test conditions are at capacitance=15 pF for DDR PADS. Recommended drive strengths are medium for SDCLK and high for
address and controls.
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2
SDRAM CLK and DQS-related parameters are measured from the 50% point. That is, high is defined as 50% of the signal
value, and low is defined as 50% of the signal value. DDR SDRAM CLK parameters are measured at the crossing point of
SDCLK and SDCLK (inverted clock).
3
The value was calculated for an SDCLK frequency of 133 MHz, by the formula tQH = tHP – tQHS = min. (tCL,tCH) – tQHS =
0.45*tCK – tQHS = 0.45 * 7.5 – 0.45 = 2.925 ns
3.7.6.2
NAND Flash Controller (NFC) Timing
The i.MX25 NFC supports normal timing mode, using two Flash clock cycles for one access of RE and
WE. AC timings are provided as multiplications of the clock cycle and fixed delay. Figure 34 through
Figure 37 depicts the relative timing between NFC signals at the module level for different operations
under normal mode. Table 55 describes the timing parameters (NF1–NF17) that are shown in the figures.
NFCLE
NF2
NF1
NF3
NF4
NFCE
NF5
NFWE
NF6
NF7
NFALE
NF8
NF9
Command
NFIO[7:0]
Figure 34. Command Latch Cycle Timing Diagram
NFCLE
NF1
NF4
NF3
NFCE
NF10
NF11
NF5
NFWE
NF7
NF6
NFALE
NF8
NF9
NFIO[7:0]
Address
Figure 35. Address Latch Cycle Timing Diagram
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NFCLE
NF1
NF3
NFCE
NF10
NF11
NF5
NFWE
NF7
NF6
NFALE
NF8
NF9
NFIO[15:0]
Data to NF
Figure 36. Write Data Latch Cycle Timing Diagram
NFCLE
NFCE
NF14
NF15
NF13
NFRE
NF16
NF17
NFRB
NF12
NFIO[15:0]
Data from NF
Figure 37. Read Data Latch Cycle Timing Diagram
Table 55. NFC Timing Parameters1
ID
Parameter
Symbol
Timing
T = NFC Clock Cycle
Example Timing for
NFC Clock ≈ 33 MHz
T = 30 ns
Min.
Max.
Min.
Max.
Unit
NF1
NFCLE setup time
tCLS
T–1.0 ns
—
29
—
ns
NF2
NFCLE hold time
tCLH
T–2.0 ns
—
28
—
ns
NF3
NFCE setup time
tCS
2T–5.0 ns
—
55
—
ns
NF4
NFCE hold time
tCH
7T–5.0 ns
—
205
—
ns
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Table 55. NFC Timing Parameters1 (continued)
ID
Parameter
Symbol
Timing
T = NFC Clock Cycle
Min.
1
Max.
Example Timing for
NFC Clock ≈ 33 MHz
T = 30 ns
Min.
T–1.5 ns
Unit
Max.
NF5
NF_WP pulse width
tWP
28.5
ns
NF6
NFALE setup time
tALS
T
—
30
—
ns
NF7
NFALE hold time
tALH
T–3.0 ns
—
27
—
ns
NF8
Data setup time
tDS
2T ns
—
60
—
ns
NF9
Data hold time
tDH
T–5.0 ns
—
25
—
ns
NF10
Write cycle time
tWC
2T
60
ns
NF11
NFWE hold time
tWH
T–2.5 ns
27.5
ns
NF12
Ready to NFRE low
tRR
21T–10 ns
—
620
—
ns
NF13
NFRE pulse width
tRP
1.5T
—
45
—
ns
NF14
READ cycle time
tRC
2T
—
60
—
ns
NF15
NFRE high hold time
tREH
0.5T–2.5 ns
12.5
—
ns
NF16
Data setup on read
tDSR
N/A
10
—
ns
NF17
Data hold on read
tDHR
N/A
0
—
ns
The Flash clock maximum frequency is 50 MHz.
NOTE
For timing purposes, transition to signal high is defined as 80% of signal
value; while signal low is defined as 20% of signal value.
Timing for HCLK is 133 MHz. The internal NFC clock (Flash clock) is
approximately 33 MHz (30 ns). All timings are listed according to this NFC
clock frequency (multiples of NFC clock phases), except NF16 and NF17,
which are not related to the NFC clock.
3.7.6.3
Wireless External Interface Module (WEIM) Timing
Figure 38 depicts the timing of the WEIM module, and Table 56 describes the timing parameters
(WE1–WE27) shown in the figure.
All WEIM output control signals may be asserted and negated by internal clock relative to BCLK rising
edge or falling edge according to corresponding assertion/negation control fields. Address always begins
relative to BCLK falling edge, but may be ended on rising or falling edge in muxed mode according to the
control register configuration. Output data begins relative to BCLK rising edge except in muxed mode,
where rising or falling edge may be used according to the control register configuration. Input data, ECB
and DTACK are all captured relative to BCLK rising edge.
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WEIM Output Timing
WE2
WE1
BCLK
WE3
...
WE4
WE5
WE6
WE7
WE8
WE9
WE10
WE11
WE12
WE13
WE14
WE15
WE16
WE17
Address
CS[x]
RW
OE
EB[y]
LBA
Output Data
WEIM Input Timing
BCLK
WE18, WE19
Input Data
WE20, WE21
WE22, WE23
ECB
WE24, WE25
WE26
DTACK
WE27
Figure 38. WEIM Bus Timing Diagram
Table 56. WEIM Bus Timing Parameters1
ID
WE1
WE2
Parameter
BCLK cycle time2
BCLK low-level width
2
width2
Min.
Max.
Unit
14.5
—
ns
7
—
ns
7
—
ns
WE3
BCLK high-level
WE4
Clock fall to address valid
15
21
ns
WE5
Clock rise/fall to address invalid
22
25
ns
WE6
Clock rise/fall to CS[x] valid
15
19
ns
WE7
Clock rise/fall to CS[x] invalid
3.3
5
ns
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69
Table 56. WEIM Bus Timing Parameters1 (continued)
ID
1
2
Parameter
Min.
Max.
Unit
WE8
Clock rise/fall to RW valid
8
12
ns
WE9
Clock rise/fall to RW invalid
3
8
ns
WE10
Clock rise/fall to OE valid
7
12
ns
WE11
Clock rise/fall to OE invalid
3.6
5.5
ns
WE12
Clock rise/fall to EB[y] valid
6
11.5
ns
WE13
Clock rise/fall to EB[y] invalid
6
10
ns
WE14
Clock rise/fall to LBA valid
17.5
20
ns
WE15
Clock rise/fall to LBA invalid
0
1
ns
WE16
Clock rise/fall to output data valid
5
10
ns
WE17
Clock rise to output data invalid
0
2.5
ns
WE18
Input data valid to clock rise, FCE=1
1
—
ns
WE19
Input Data Valid to Clock rise, FCE=0 (in the case there is ECB asserted during
access)
1/2 BCLK
+2.63
—
ns
Input Data Valid to Clock rise, FCE=0 (in the case there is NO ECB asserted
during access)
6.9
—
ns
WE20
Clock rise to input data invalid, FCE=1
1
—
ns
WE21
Clock rise to input data invalid, FCE=0
2.4
—
ns
WE22
ECB setup time, FCE=1
5
—
ns
WE23
ECB setup time, FCE=0
7.2
—
ns
WE24
ECB hold time, FCE=1
5
—
ns
WE25
ECB hold time, FCE=0
0
—
ns
WE26
DTACK setup time
5.4
—
ns
WE27
DTACK hold time
–3.2
—
ns
High is defined as 80% of signal value; low is defined as 20% of signal value.
BCLK parameters are being measured from the 50% point. For example, high is defined as 50% of signal value and low is
defined as 50% as signal value.
NOTE
The test condition load capacitance was 25 pF. Recommended drive
strength for all controls, address, and BCLK is maximum drive.
Recommended drive strength for all controls, address and BCLK is
maximum drive.
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Figure 39 through Figure 44 give examples of basic WEIM accesses to external memory devices with the
timing parameters described in Table 56 for specific control parameter settings.
BCLK
WE5
WE4
V1
Last Valid Address
ADDR
Next Address
WE6
WE7
WE14
WE15
WE10
WE11
WE12
WE13
CS[x]
RW
LBA
OE
EB[y]
WE21
V1
DATA
WE19
Figure 39. Synchronous Memory Timing Diagram for Read Access—WSC=1
BCLK
WE5
WE4
ADDR
Last Valid Address
CS[x]
RW
WE7
WE8
WE9
WE14
LBA
Next Address
V1
WE6
WE15
OE
WE12
EB[y]
WE13
WE17
DATA
V1
WE16
Figure 40. Synchronous Memory Timing Diagram for Write Access—
WSC=1, EBWA=1, EBWN=1, LBN=1
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71
BCLK
WE4
WE5
ADDR Last Valid Addr
CS[x]
Address V1
Address V2
WE7
WE6
RW
LBA
OE
EB[y]
WE14
WE15
WE11
WE10
WE13
WE12
WE24
WE24
ECB
WE22
WE22
WE19
WE19
V1
V1+2
Halfword Halfword
DATA
WE18
V2
Halfword
V2+2
Halfword
WE18
Figure 41. Synchronous Memory Timing Diagram for Two Non-Sequential Read Accesses—
WSC=2, SYNC=1, DOL=0
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BCLK
WE5
WE4
ADDR Last Valid Addr
CS[x]
RW
Address V1
WE6
WE7
WE8
WE9
WE15
WE14
LBA
OE
WE13
WE12
EB[y]
WE24
ECB
WE22
WE17
WE17
V1+4 V1+8 V1+12
V1
DATA
WE16
WE16
Figure 42. Synchronous Memory TIming Diagram for Burst Write Access—
BCS=1, WSC=4, SYNC=1, DOL=0, PSR=1
BCLK
WE4
ADDR/
M_DATA Last Valid Addr
CS[x]
RW
WE17
WE5
Write Data
Address V1
WE16
WE6
WE8
WE7
WE9
Write
WE14
LBA
WE15
OE
EB[y]
WE12
WE13
Figure 43. Muxed A/D Mode Timing Diagram for Synchronous Write Access—
WSC=7, LBA=1, LBN=1, LAH=1
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BCLK
WE4
ADDR/
Last
Valid
Addr
M_DATA
WE6
CS[x]
WE20
WE5
Address V1
Read Data
WE18
WE7
RW
WE14
WE15
LBA
WE10
OE
EB[y]
WE11
WE12
WE13
Figure 44. Muxed A/D Mode Timing Diagram for Synchronous Read Access—
WSC=7, LBA=1, LBN=1, LAH=1, OEA=7
Figure 45 through Figure 49, and Table 57 help to determine timing parameters relative to chip select (CS)
state for asynchronous and DTACK WEIM accesses with corresponding WEIM bit fields and the timing
parameters mentioned above.
CS [x]
WE31
ADDR
Last Valid Address
WE32
Next Address
Address V1
RW
WE39
WE40
WE35
WE36
WE37
WE38
LBA
OE
EB[y]
WE44
DATA
V1
WE43
Figure 45. Asynchronous Memory Read Access
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CS[x]
MAXDI
WE31
ADDR/
M_DATA
D(V1)
Addr. V1
WE32A
WE
WE44
WE40
WE39
LBA
WE35A
WE36
OE
WE37
WE38
EB[y]
MAXCO
Figure 46. Asynchronous A/D Muxed Read Access (RWSC = 5)
CS[x]
WE31
ADDR
Last Valid Address
WE32
Next Address
Address V1
WE33
WE34
WE39
WE40
WE45
WE46
RW
LBA
OE
EB[y]
WE42
DATA
D(V1)
WE41
Figure 47. Asynchronous Memory Write Access
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75
CS[x]
WE41
WE31
ADDR/
M_DATA
D(V1)
Addr. V1
WE32A
WE33
WE42
WE34
RW
WE40A
WE39
LBA
OE
WE45
WE46
EB[y]
WE42
Figure 48. Asynchronous A/D Mux Write Access
CS [x]
WE31
ADDR
WE32
Last Valid Address
Next Address
Address V1
RW
WE39
WE40
WE35
WE36
WE37
WE38
LBA
OE
EB[y]
WE44
DATA
V1
WE43
WE48
DATA
WE47
Figure 49. DTACK Read Access
Table 57. WEIM Asynchronous Timing Parameters Relative to Chip Select Table
Ref No.
Parameter
Determination By
Synchronous Measured
Parameters1
Min
Max
(If 133 MHz is
supported by SoC)
Unit
WE31
CS[x] valid to Address Valid
WE4 – WE6 – CSA2
—
3 – CSA
ns
WE32
Address Invalid to CS[x] invalid
WE7 – WE5 – CSN3
—
3 – CSN
ns
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Table 57. WEIM Asynchronous Timing Parameters Relative to Chip Select Table (continued)
Determination By
Synchronous Measured
Parameters1
Max
(If 133 MHz is
supported by SoC)
Unit
—
ns
—
3 + (RWA – CSA)
ns
WE7 – WE9 + (RWN – CSN)
—
3 – (RWN_CSN)
ns
CS[x] Valid to OE Valid
WE10 – WE6 + (OEA – CSA)
—
3 + (OEA – CSA)
ns
WE35A
(muxed
A/D)
CS[x] Valid to OE Valid
WE10 – WE6 + (OEA + LBN + –3 + (OEA + LBN
LBA + LAH + 1 – CSA)
+ LBA + LAH + 1 –
CSA)
3 + (OEA + LBN +
LBA + LAH + 1 –
CSA)
ns
WE36
OE Invalid to CS[x] Invalid
WE7 – WE11 + (OEN – CSN)
—
3 – (OEN – CSN)
ns
CS[x] Valid to EB[y] Valid (Read WE12 – WE6 + (EBRA – CSA)
access)
—
3 + (EBRA4 – CSA)
ns
Ref No.
Parameter
WE32A(
muxed
A/D
CS[x] valid to Address Invalid
WE33
CS[x] Valid to RW Valid
WE8 – WE6 + (RWA – CSA)
WE34
RW Invalid to CS[x] Invalid
WE35
WE37
Min
WE4 – WE7 + (LBN + LBA + 1 –3 + (LBN + LBA +
– CSA2)
1 – CSA)
WE38
EB[y] Invalid to CS[x] Invalid
(Read access)
WE7 – WE13 + (EBRN – CSN)
—
3 – (EBRN5 – CSN)
ns
WE39
CS[x] Valid to LBA Valid
WE14 – WE6 + (LBA – CSA)
—
3 + (LBA – CSA)
ns
WE40
LBA Invalid to CS[x] Invalid
WE7 – WE15 – CSN
—
3 – CSN
ns
WE40A
(muxed
A/D)
CS[x] Valid to LBA Invalid
WE41
CS[x] Valid to Output Data Valid
WE14 – WE6 + (LBN + LBA + 1 –3 + (LBN + LBA + 3 + (LBN + LBA + 1 –
– CSA)
1 – CSA)
CSA)
WE16 – WE6 – CSA
WE41A CS[x] Valid to Output Data Valid WE16 – WE6 + (LBN + LBA +
(muxed
LAH + 1 – CSA)
A/D)
ns
—
3 – CSA
ns
—
3 + (LBN + LBA +
LAH + 1 – CSA)
ns
WE42
Output Data Invalid to CS[x]
Invalid
WE17 – WE7 – CSN
—
3 – CSN
ns
WE43
Input Data Valid to CS[x]
Invalid
MAXCO – MAXCSO + MAXDI
MAXCO6 –
MAXCSO7 +
MAXDI8
—
ns
WE44
CS[x] Invalid to Input Data
invalid
0
0
—
ns
WE45
CS[x] Valid to EB[y] Valid
(Write access)
WE12 – WE6 + (EBWA – CSA)
—
3 + (EBWA – CSA)
ns
WE46
EB[y] Invalid to CS[x] Invalid
(Write access)
WE7 – WE13 + (EBWN – CSN)
—
–3 + (EBWN – CSN)
ns
WE47
DTACK Valid to CS[x] Invalid
MAXCO – MAXCSO + MAXDTI
MAXCO6 –
MAXCSO7 +
MAXDTI9
—
ns
WE48
CS[x] Invalid to DTACK invalid
0
0
—
ns
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77
1
2
3
4
5
6
7
8
9
For the value of parameters WE4–WE21, see column BCD = 0 in Table 56.
CS Assertion. This bit field determines when the CS signal is asserted during read/write cycles.
CS Negation. This bit field determines when the CS signal is negated during read/write cycles.
BE Assertion. This bit field determines when the BE signal is asserted during read cycles.
BE Negation. This bit field determines when the BE signal is negated during read cycles.
Output maximum delay from internal driving ADDR/control FFs to chip outputs.
Output maximum delay from CS[x] internal driving FFs to CS[x] out.
DATA maximum delay from chip input data to its internal FF.
DTACK maximum delay from chip dtack input to its internal FF.
NOTE
All configuration parameters (CSA, CSN, EBWA, EBWN, LBA, LBN,
LAH, OEN, OEA, EBRA, and EBRN) are in cycle units.
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3.7.7
Enhanced Serial Audio Interface (ESAI) Timing
This section describes general timing requirements for ESAI, as well as the ESAI transmit and receive
timing.
Figure 50 shows the ESAI transmit timing diagram.
62
63
64
SCKT
(Input/Output)
78
79
FST (bit)
out
82
FST (word)
out
83
86
86
84
87
first bit
Data out
last bit
93
Transmitter #0
drive enable
(internal signal)
89
85
88
91
FST (bit) in
92
91
90
FST (word) in
94
See Note
Flags out
Note: In network mode, output flag transitions can occur at the start of each time slot within the
frame. In normal mode, the output flag state is asserted for the entire frame period.
Figure 50. ESAI Transmit Timing
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Figure 51 shows the ESAI receive timing diagram.
62
63
64
SCKR
(input/output)
65
66
FSR (bit)
out
69
70
FSR (word)
out
72
71
Data in
first bit
last bit
75
73
FSR (bit)
in
74
75
FSR (word)
in
76
77
Flags in
Figure 51. ESAI Receive Timing Diagram
Figure 52 shows the ESAI HCKT timing diagram.
HCKT
SCKT (output)
95
96
Figure 52. ESAI HCKT Timing
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Figure 53 shows the ESAI HCKR timing diagram.
HCKR
95
SCKR (output)
97
Figure 53. ESAI HCKR Timing
Table 60 describes the general timing requirements for the ESAI module. Table 58 and Table 59 describe
respectively the conditions and signals cited in Table 60.
Table 58. ESAI Timing Conditions
Symbol
Significance
Comments
i ck
Internal clock
In the i.MX25, the internal clock frequency is equal to the IP bus frequency
(133 MHz)
x ck
External clock
The external clock may be derived from the CRM module or other external
clock sources
i ck a
Internal clock, asynchronous mode
In asynchronous mode, SCKT and SCKR are different clocks
i ck s
Internal clock, synchronous mode
In synchronous mode, SCKT and SCKR are the same clock
Table 59. ESAI Signals
Signal Name
Significance
SCKT
Transmit clock
SCKR
Receive clock
FST
Transmit frame sync
HCKT
Transmit high-frequency clock
HCKR
Receive high-frequency clock
Table 60. ESAI General Timing Requirements
Characteristics1 2
No.
Symbol
Expression3
Min.
Max.
Condition
Unit
tSSICC
4 × Tc
4 × Tc
30.0
30.0
—
—
i ck
i ck
ns
ns
62
Clock cycle4
63
Clock high period
For internal clock
—
—
—
2 × Tc − 9.0
—
6
—
—
—
For external clock
—
2 × Tc
15
—
—
Clock low period
For internal clock
—
2 × Tc − 9.0
6
—
For external clock
—
2 × Tc
15
—
64
—
ns
—
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Table 60. ESAI General Timing Requirements (continued)
No.
Characteristics1 2
Symbol
Expression3
Min.
Max.
Condition
Unit
65
SCKR rising edge to FSR out (bl) high
—
—
—
—
17.0
7.0
x ck
i ck a
ns
66
SCKR rising edge to FSR out (bl) low
—
—
—
—
17.0
7.0
x ck
i ck a
ns
67
SCKR rising edge to FSR out (wr) high5
—
—
—
—
19.0
9.0
x ck
i ck a
ns
68
SCKR rising edge to FSR out (wr) low 5
—
—
—
—
19.0
9.0
x ck
i ck a
ns
69
SCKR rising edge to FSR out (wl) high
—
—
—
—
16.0
6.0
x ck
i ck a
ns
70
SCKR rising edge to FSR out (wl) low
—
—
—
—
17.0
7.0
x ck
i ck a
ns
71
Data in setup time before SCKR (SCK in
synchronous mode) falling edge
—
—
12.0
19.0
—
—
x ck
i ck
ns
72
Data in hold time after SCKR falling edge
—
—
3.5
9.0
—
—
x ck
i ck
ns
73
FSR input (bl, wr) high before SCKR falling
edge5
—
—
2.0
12.0
—
—
x ck
i ck a
ns
74
FSR input (wl) high before SCKR falling edge
—
—
2.0
12.0
—
—
x ck
i ck a
ns
75
FSR input hold time after SCKR falling edge
—
—
2.5
8.5
—
—
x ck
i ck a
ns
76
Flags input setup before SCKR falling edge
—
—
0.0
19.0
—
—
x ck
i ck s
ns
77
Flags input hold time after SCKR falling edge
—
—
6.0
0.0
—
—
x ck
i ck s
ns
78
SCKT rising edge to FST out (bl) high
—
—
—
—
18.0
8.0
x ck
i ck
ns
79
SCKT rising edge to FST out (bl) low
—
—
—
—
20.0
10.0
x ck
i ck
ns
80
SCKT rising edge to FST out (wr) high5
—
—
—
—
20.0
10.0
x ck
i ck
ns
81
SCKT rising edge to FST out (wr) low5
—
—
—
—
22.0
12.0
x ck
i ck
ns
82
SCKT rising edge to FST out (wl) high
—
—
—
—
19.0
9.0
x ck
i ck
ns
83
SCKT rising edge to FST out (wl) low
—
—
—
—
20.0
10.0
x ck
i ck
ns
84
SCKT rising edge to data out enable from
high impedance
—
—
—
—
22.0
17.0
x ck
i ck
ns
85
SCKT rising edge to transmitter #0 drive
enable assertion
—
—
—
—
17.0
11.0
x ck
i ck
ns
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Table 60. ESAI General Timing Requirements (continued)
Characteristics1 2
No.
1
2
3
4
5
6
Symbol
Expression3
Min.
Max.
Condition
Unit
86
SCKT rising edge to data out valid
—
—
—
—
18.0
13.0
x ck
i ck
ns
87
SCKT rising edge to data out high
impedance6
—
—
—
—
21.0
16.0
x ck
i ck
ns
88
SCKT rising edge to transmitter #0 drive
enable negation6
—
—
—
—
14.0
9.0
x ck
i ck
ns
89
FST input (bl, wr) setup time before SCKT
falling edge5
—
—
2.0
18.0
—
—
x ck
i ck
ns
90
FST input (wl) setup time before SCKT falling
edge
—
—
2.0
18.0
—
—
x ck
i ck
ns
91
FST input hold time after SCKT falling edge
—
—
4.0
5.0
—
—
x ck
i ck
ns
92
FST input (wl) to data out enable from high
impedance
—
—
—
21.0
—
ns
93
FST input (wl) to transmitter #0 drive enable
assertion
—
—
—
14.0
—
ns
94
Flag output valid after SCKT rising edge
—
—
—
—
14.0
9.0
x ck
i ck
ns
95
HCKR/HCKT clock cycle
—
2 x TC
15
—
—
ns
96
HCKT input rising edge to SCKT output
—
—
—
18.0
—
ns
97
HCKR input rising edge to SCKR output
—
—
—
18.0
—
ns
VCORE_VDD = 1.00 ± 0.10 V; TJ = –40 °C to 125 °C, CL = 50 pF
In the “Characteristics” column, bl = bit length, wl = word length, wr = word length relative
In the “Expression” column, TC = 7.5 ns.
For the internal clock, the external clock cycle is defined by Icyc and the ESAI control register.
The word-relative frame sync signal waveform relative to the clock operates in the same manner as the bit-length frame sync
signal waveform, but spreads starting from one serial clock before the first bit clock (same as the bit length frame sync signal),
until the second-to-last bit-clock of the first word in the frame.
Periodically sampled and not 100% tested.
3.7.8
Enhanced Secured Digital Host Controller (eSDHCv2) Timing
Figure 54 shows eSDHCv2 timing, and Table 61 describes the timing parameters (SD1–SD8) used in the
figure. The following definitions apply to values and signals described in Table 61:
• LS: low-speed mode. Low-speed card can tolerate clocks up to 400 kHz
• FS: full-speed mode. Full-speed MMC card’s clock can reach 20 MHz; full speed SD/SDIO card
clock can reach 25 MHz
• HS: high-speed mode. High-speed MMC card’s clock can reach 52 MHz; SD/SDIO card clock can
reach 50 MHz
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83
SD4
SD2
SD1
SD5
CLK
SD3
output from eSDHCv2 to card
CMD
DAT0
DAT1
......
DAT7
SD6
SD7
input from card to eSDHCv2
SD8
CMD
DAT0
DAT1
......
DAT3
Figure 54. eSDHCv2 Timing
Table 61. eSDHCv2 Interface Timing Specification
ID
Parameter
Symbols
Min.
Max.
Unit
Clock frequency (low speed)
fPP1
0
400
kHz
Clock frequency (SD/SDIO full speed/high speed)
fPP2
0
25/50
MHz
Clock frequency (MMC full speed/high speed)
fPP3
0
20/52
MHz
Clock frequency (identification mode)
fOD
100
400
kHz
SD2
Clock low time
tWL
6.5
—
ns
SD3
Clock high time
tWH
6.5
—
ns
SD4
Clock rise time
tTLH
—
3
ns
SD5
Clock fall time
tTHL
—
3
ns
tOD
–3
3
ns
tISU
2.5
—
ns
4
2.5
—
ns
Card Input Clock
SD1
eSDHC Output / Card Inputs CMD, DAT (Reference to CLK)
SD6
eSDHC output delay
eSDHC Input / Card Outputs CMD, DAT (Reference to CLK)
SD7
SD8
eSDHC input setup time
eSDHC input hold time
tIH
1
In low-speed mode, card clock must be lower than 400 kHz, voltage ranges from 2.7 to 3.6 V.
In normal-speed mode for SD/SDIO card, clock frequency can be any value between 0 ~ 25 MHz. In high speed mode, clock
frequency can be any value between 0 ~ 50 MHz.
3 In normal-speed mode for MMC card, clock frequency can be any value between 0 ~ 20 MHz. In high speed mode, clock
frequency can be any value between 0 ~ 52 MHz.
4
To satisfy hold timing, the delay difference between clock input and cmd/data input must not exceed 2 ns.
2
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3.7.9
Fast Ethernet Controller (FEC) Timing
The FEC is designed to support both 10- and 100-Mbps Ethernet networks compliant with the IEEE 802.3
standard. An external transceiver interface and transceiver function are required to complete the interface
to the media. The FEC supports 10/100 Mbps MII (18 pins altogether), 10/100 Mbps RMII (ten pins,
including serial management interface) and the 10-Mbps-only 7-Wire interface (which uses seven of the
MII pins), for connection to an external Ethernet transceiver. All signals are compatible with transceivers
operating at a voltage of 3.3 V.
The following subsections describe the timing for MII and RMII modes.
3.7.9.1
FEC MII Mode Timing
The following subsections describe MII receive, transmit, asynchronous inputs, and serial management
signal timings.
3.7.9.1.4
MII Receive Signal Timing (FEC_RXD[3:0], FEC_RX_DV, FEC_RX_ER, and
FEC_RX_CLK)
The receiver functions correctly up to an FEC_RX_CLK maximum frequency of 25 MHz + 1%. There is
no minimum frequency requirement. Additionally, the processor clock frequency must exceed twice the
FEC_RX_CLK frequency.
Figure 55 shows MII receive signal timings. Table 62 describes the timing parameters (M1–M4) shown in
the figure.
M3
FEC_RX_CLK (input)
M4
FEC_RXD[3:0] (inputs)
FEC_RX_DV
FEC_RX_ER
M1
M2
Figure 55. MII Receive Signal Timing Diagram
Table 62. MII Receive Signal Timing
Characteristic1
Min.
Max.
Unit
M1
FEC_RXD[3:0], FEC_RX_DV, FEC_RX_ER to FEC_RX_CLK setup
5
—
ns
M2
FEC_RX_CLK to FEC_RXD[3:0], FEC_RX_DV, FEC_RX_ER hold
5
—
ns
M3
FEC_RX_CLK pulse width high
35%
65%
FEC_RX_CLK period
M4
FEC_RX_CLK pulse width low
35%
65%
FEC_RX_CLK period
ID
1 FEC_RX_DV,
FEC_RX_CLK, and FEC_RXD0 have the same timing in 10 Mbps 7-wire interface mode.
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9
Freescale Semiconductor
85
3.7.9.1.5
MII Transmit Signal Timing (FEC_TXD[3:0], FEC_TX_EN, FEC_TX_ER, and
FEC_TX_CLK)
The transmitter functions correctly up to an FEC_TX_CLK maximum frequency of 25 MHz + 1%. There
is no minimum frequency requirement. Additionally, the processor clock frequency must exceed twice the
FEC_TX_CLK frequency.
Figure 56 shows MII transmit signal timings. Table 63 describes the timing parameters (M5–M8) shown
in the figure.
M7
FEC_TX_CLK (input)
M5
M8
FEC_TXD[3:0] (outputs)
FEC_TX_EN
FEC_TX_ER
M6
Figure 56. MII Transmit Signal Timing Diagram
Table 63. MII Transmit Signal Timing
Characteristic1
ID
Min.
Max.
Unit
M5
FEC_TX_CLK to FEC_TXD[3:0], FEC_TX_EN, FEC_TX_ER invalid
5
—
ns
M6
FEC_TX_CLK to FEC_TXD[3:0], FEC_TX_EN, FEC_TX_ER valid
—
20
ns
M7
FEC_TX_CLK pulse width high
35%
65%
FEC_TX_CLK period
M8
FEC_TX_CLK pulse width low
35%
65%
FEC_TX_CLK period
1 FEC_TX_EN,
3.7.9.1.6
FEC_TX_CLK, and FEC_TXD0 have the same timing in 10-Mbps 7-wire interface mode.
MII Asynchronous Inputs Signal Timing (FEC_CRS and FEC_COL)
Figure 57 shows MII asynchronous input timings. Table 64 describes the timing parameter (M9) shown in
the figure.
FEC_CRS, FEC_COL
M9
Figure 57. MII Async Inputs Timing Diagram
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Freescale Semiconductor
Table 64. MII Asynchronous Inputs Signal Timing
ID
Characteristic
M91
1
FEC_CRS to FEC_COL minimum pulse width
Min.
Max.
Unit
1.5
—
FEC_TX_CLK period
FEC_COL has the same timing in 10-Mbit 7-wire interface mode.
3.7.9.2
MII Serial Management Channel Timing (FEC_MDIO and FEC_MDC)
The MDC frequency is designed to be equal to or less than 2.5 MHz to comply with the IEEE 802.3
standard MII specification. However the FEC can function correctly with a maximum MDC frequency of
15 MHz.
Figure 58 shows MII asynchronous input timings. Table 65 describes the timing parameters (M10—M15)
shown in the figure.
M14
M15
FEC_MDC (output)
M10
FEC_MDIO (output)
M11
FEC_MDIO (input)
M12
M13
Figure 58. MII Serial Management Channel Timing Diagram
Table 65. MII Serial Management Channel Timing
ID
Characteristic
Min.
Max.
Unit
M10
FEC_MDC falling edge to FEC_MDIO output invalid (min.
propagation delay)
0
—
ns
M11
FEC_MDC falling edge to FEC_MDIO output valid (max.
propagation delay)
—
5
ns
M12
FEC_MDIO (input) to FEC_MDC rising edge setup
18
—
ns
M13
FEC_MDIO (input) to FEC_MDC rising edge hold
0
—
ns
M14
FEC_MDC pulse width high
40%
60%
FEC_MDC period
M15
FEC_MDC pulse width low
40%
60%
FEC_MDC period
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Freescale Semiconductor
87
3.7.9.3
RMII Mode Timing
In RMII mode, FEC_TX_CLK is used as the REF_CLK, which is a 50 MHz ± 50 ppm continuous
reference clock. FEC_RX_DV is used as the CRS_DV in RMII. Other signals under RMII mode include
FEC_TX_EN, FEC_TXD[1:0], FEC_RXD[1:0] and FEC_RX_ER.
Figure 59 shows RMII mode timings. Table 66 describes the timing parameters (M16–M21) shown in the
figure.
M16
M17
REF_CLK (input)
M18
FEC_TXD[1:0] (output)
FEC_TX_EN
M19
CRS_DV (input)
FEC_RXD[1:0]
FEC_RX_ER
M20
M21
Figure 59. RMII Mode Signal Timing Diagram
Table 66. RMII Signal Timing
ID
Characteristic
Min.
Max.
Unit
M16
REF_CLK(FEC_TX_CLK) pulse width high
35%
65%
REF_CLK period
M17
REF_CLK(FEC_TX_CLK) pulse width low
35%
65%
REF_CLK period
M18
REF_CLK to FEC_TXD[1:0], FEC_TX_EN invalid
3
—
ns
M19
REF_CLK to FEC_TXD[1:0], FEC_TX_EN valid
—
12
ns
M20
FEC_RXD[1:0], CRS_DV(FEC_RX_DV), FEC_RX_ER to REF_CLK setup
2
—
ns
M21
REF_CLK to FEC_RXD[1:0], FEC_RX_DV, FEC_RX_ER hold
2
—
ns
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Freescale Semiconductor
3.7.10
Controller Area Network (FlexCAN) Transceiver Parameters and
Timing
Table 67 and Table 68 show voltage requirements for the FlexCAN transceiver Tx and Rx pins.
Table 67. Tx Pin Characteristics
1
Parameter
Symbol
Min.
Typ.
Max.
Units
High-level output voltage
VOH
2
—
Vcc1 + 0.3
V
Low-level output voltage
VOL
—
0.8
—
V
Vcc = +3.3 V ± 5%
Table 68. Rx Pin Characteristics
1
Parameter
Symbol
Min.
Typ.
Max.
Units
High-level input voltage
VIH
0.8 × Vcc1
—
Vcc1
V
Low-level input voltage
VIL
—
0.4
—
V
Vcc = +3.3 V ± 5%
Figure 60 through Figure 63 show the FlexCAN timing, including timing of the standby and shutdown
signals.
VCC/2
TXD
VCC/2
tOFFTXD
tONTXD
0.9V
VDIFF
0.5V
tONRXD
RXD
tOFFRXD
VCC/2
VCC/2
Figure 60. FlexCAN Timing Diagram
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9
Freescale Semiconductor
89
VCC x 0.75
RS
Bus Externally
Driven
1.1V
VDIFF
tSBRXDL
tDRXDL
RXD
VCC/2
VCC/2
Figure 61. Timing Diagram for FlexCAN Standby Signal
SHDN
VCC/2
VCC/2
tOFFSHDN
tONSHDN
VDIFF
0.5V
Bus Externally
Driven
VCC/2
RXD
Figure 62. Timing Diagram for FlexCAN Shutdown Signal
SHDN
VCC/2
tSHDNSB
0.75 x V CC
RS
Figure 63. Timing Diagram for FlexCAN Shutdown-to-Standby Signal
Because integer multiples are not possible, taking into account the range of frequencies at which the SoC
has to operate, DPLLs work in FOL mode only.
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3.7.11
Inter IC Communication (I2C) Timing
The I2C communication protocol consists of the following seven elements:
• Start
• Data source/recipient
• Data direction
• Slave acknowledge
• Data
• Data acknowledge
• Stop
Figure 64 shows the timing of the I2C module. Table 69 and Table 70 describe the I2C module timing
parameters (IC1–IC6) shown in the figure.
I2CLK
IC11
IC10
I2DAT
IC2
START
IC7
IC4
IC8
IC10
IC11
IC6
IC9
IC3
STOP
START
START
IC5
IC1
Figure 64. I2C Module Timing Diagram
Table 69. I2C Module Timing Parameters: 3.0 V +/–0.30 V
Standard Mode
ID
Fast Mode
Parameter
Unit
Min.
Max.
Min.
Max.
μs
IC1
I2CLK cycle time
10
-
2.5
IC2
Hold time (repeated) START condition
4.0
-
0.6
-
μs
IC3
Set-up time for STOP condition
4.0
-
0.6
-
μs
IC4
Data hold time
01
3.452
01
0.92
μs
IC5
HIGH Period of I2CLK Clock
4.0
-
0.6
-
μs
IC6
LOW Period of the I2CLK Clock
4.7
-
1.3
-
μs
IC7
Set-up time for a repeated START condition
4.7
-
0.6
-
μs
-
ns
IC8
Data set-up time
250
-
1003
IC9
Bus free time between a STOP and START condition
4.7
-
1.3
IC10
Rise time of both I2DAT and I2CLK signals
-
1000
-
μs
20+0.1Cb
4
300
ns
4
300
ns
400
pF
IC11
Fall time of both I2DAT and I2CLK signals
-
300
20+0.1Cb
IC12
Capacitive load for each bus line (Cb)
-
400
-
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Freescale Semiconductor
91
1
A device must internally provide a hold time of at least 300 ns for I2DAT signal in order to bridge the undefined region of the
falling edge of I2CLK.
2
The maximum hold time has only to be met if the device does not stretch the LOW period (ID no IC5) of the I2CLK signal
3
A Fast-mode I2C-bus device can be used in a Standard-mode I2C-bus system, but the requirement of Set-up time (ID No IC7)
of 250 ns must then be met. This is automatically the case if the device does not stretch the LOW period of the I2CLK signal.
If such a device does stretch the LOW period of the I2CLK signal, it must output the next data bit to the I2DAT line
max_rise_time(ID No IC9) + data_setup_time(ID No IC7) = 1000 + 250 = 1250 ns (according to the Standard-mode I2C-bus
specification) before the I2CLK line is released.
4
Cb = total capacitance of one bus line in pF.
Table 70. I2C Module Timing Parameters: 1.8 V +/– 0.10 V
Standard Mode
ID
Parameter
Unit
Min.
Max.
IC1
I2CLK cycle time
10
-
μs
IC2
Hold time (repeated) START condition
4.0
-
μs
IC3
Set-up time for STOP condition
4.0
-
μs
IC4
Data hold time
01
3.452
μs
IC5
HIGH Period of I2CLK Clock
4.0
-
μs
IC6
LOW Period of the I2CLK Clock
4.7
-
μs
IC7
Set-up time for a repeated START condition
4.7
-
μs
IC8
Data set-up time
250
-
ns
IC9
Bus free time between a STOP and START condition
4.7
-
μs
IC10
Rise time of both I2DAT and I2CLK signals
-
1000
ns
IC11
Fall time of both I2DAT and I2CLK signals
-
300
ns
IC12
Capacitive load for each bus line (C b)
-
400
pF
1
A device must internally provide a hold time of at least 300 ns for I2DAT signal in order to bridge the undefined region of the
falling edge of I2CLK.
2
The maximum hold time has only to be met if the device does not stretch the LOW period (ID no IC5) of the I2CLK signal
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3.7.12
Liquid Crystal Display Controller (LCDC) Timing
Figure 65 and Figure 66 show LCDC timing in non-TFT and TFT mode respectively, and Table 71 and
Table 72 list the timing parameters used in the associated figures.
T5
VSYNC
HSYNC
Line 1
Line n
Line 2
Line 1
T2
HSYNC
T1
T6
LSCLK
T3
T4
LD
Figure 65. LCDC Non-TFT Mode Timing Diagram
Table 71. LCDC Non-TFT Mode Timing Parameters
ID
1
Description
Min.
Max.
Unit
22.5
1000
ns
T1
Pixel clock period
T2
HSYNC width
1
—
T1
T3
LD setup time
5
—
ns
T4
LD hold time
5
—
ns
T5
Wait between HSYNC and VSYNC rising edge
2
—
T1
T6
Wait between last data and HSYNC rising edge
1
—
T1
T is pixel clock period
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9
Freescale Semiconductor
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VSYNC
HSYNC
Line 1
Line n
Line 2
Line 1
HSYNC
T2
T5
T6
OE
T1
LSCLK
T3
T4
LD
Figure 66. LCDC TFT Mode Timing Diagram
Table 72. LCDC TFT Mode Timing Parameters
ID
1
Description
Min.
Ma
Unit
22.5
1000
ns
T1
Pixel clock period
T2
HSYNC width
1
—
T1
T3
LD setup time
5
—
ns
T4
LD hold time
5
—
ns
T5
Delay from the end of HSYNC to the beginning of the OE pulse
3
—
T1
T6
Delay from end of OE to the beginning of the HSYNC pulse
1
—
T1
T is pixel clock period
3.7.13
Pulse Width Modulator (PWM) Timing Parameters
Figure 67 depicts the timing of the PWM, and Table 73 lists the PWM timing characteristics.
The PWM can be programmed to select one of three clock signals as its source frequency. The selected
clock signal is passed through a prescaler before being input to the counter. The output is available at the
pulse width modulator output (PWMO) external pin.
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1
2a
3b
PWM Source Clock
2b
4b
3a
4a
PWM Output
Figure 67. PWM Timing
Table 73. PWM Output Timing Parameter
1
Ref No.
Parameter
Minimum
Maximum
Unit
1
System CLK frequency1
0
ipg_clk
MHz
2a
Clock high time
12.29
—
ns
2b
Clock low time
9.91
—
ns
3a
Clock fall time
—
0.5
ns
3b
Clock rise time
—
0.5
ns
4a
Output delay time
—
9.37
ns
4b
Output setup time
8.71
—
ns
CL of PWMO = 30 pF
3.7.14
Subscriber Identity Module (SIM) Timing
Each SIM module interface consists of a total of 12 pins (two separate ports, each containing six signals).
Typically a port uses five signals.
The interface is designed to be used with synchronous SIM cards, meaning the SIM module provides the
clock used by the SIM card. The clock frequency is typically 372 times the Tx/Rx data rate; however, the
SIM module can also work with CLK frequencies of 16 times the Tx/Rx data rate.
There is no timing relationship between the clock and the data. The clock that the SIM module provides
to the SIM card is used by the SIM card to recover the clock from the data in the same manner as standard
UART data exchanges. All six signals (five for bidirectional Tx/Rx) of the SIM module are asynchronous
with each other.
There are no required timing relationships between signals in normal mode. The SIM card is initiated by
the interface device; the SIM card responds with Answer to Reset. Although the SIM interface has no
defined requirements, the ISO/IEC 7816 defines reset and power-down sequences (for detailed
information see ISO/IEC 7816).
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9
Freescale Semiconductor
95
1/SI1
SIMx_CLKy
SI3
SI2
SI4
SI4
SIMx_DATAy_TX_RX
SIMx_SIMPDy
SIMx_DATAy_TX_RX
SI5
SI5
SI6
SI6
SIMx_RSTy
Figure 68. SIM Clock Timing Diagram
Table 74 defines the general timing requirements for the SIM interface.
Table 74. Timing Specifications, High Drive Strength
ID
SI1
SI2
Parameter
SIM clock frequency (SIMx_CLKy)1
SIM clock rise time
(SIMx_CLKy)2
(SIMx_CLKy)3
SI3
SIM clock fall time
SI4
SIM input transition time (SIMx_DATAy_RX_TX, SIMx_SIMPDy)
SI5
SI6
SIM I/O rise time / fall time
(SIMx_DATAy_RX_TX)4
SIM RST rise time / fall time
(SIMx_RSTy)5
Symbol
Min.
Max.
Unit
Sfreq
0.01
25
MHz
Srise
—
0.09 × (1/Sfreq)
ns
Sfall
—
0.09 × (1/Sfreq)
ns
Strans
10
25
ns
Tr/Tf
—
1
μs
Tr/Tf
—
1
μs
1
50% duty cycle clock,
With C = 50 pF
3
With C = 50 pF
4 With Cin = 30 pF, Cout = 30 pF,
5
With Cin = 30 pF,
2
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3.7.14.1
SIM Reset Sequences
SIM cards may have internal reset, or active low reset. The following subset describes the reset sequences
in these two cases.
3.7.14.1.1
SIM Cards with Internal Reset
Figure 69 shows the reset sequence for SIM cards with internal reset. The reset sequence comprises the
following steps:
• After power-up, the clock signal is enabled on SIMx_CLKy (time T0)
• After 200 clock cycles, SIMx_DATAy_RX_TX must be asserted.
• The card must send a response on SIMx_DATAy_RX_TX acknowledging the reset between
400–40000 clock cycles after T0.
SIMn_SVENm
SIMx_CLKy
SIMx_DATAy_RX_TX
RESPONSE
1
2
T0
Figure 69. Internal Reset Card Reset Sequence
Table 75 defines the general timing requirements for the SIM interface.
Table 75. Timing Specifications, Internal Reset Card Reset Sequence
Ref No.
Min.
Max.
Units
1
—
200
clk cycles
2
400
40,000
clk cycles
3.7.14.1.2
SIM Cards with Active Low Reset
Figure 70 shows the reset sequence for SIM cards with active low reset. The reset sequence comprises the
following steps:
• After power-up, the clock signal is enabled on SIMx_CLKy (time T0)
• After 200 clock cycles, SIMx_DATAy_RX_TX must be asserted.
• SIMx_RSTy must remain low for at least 40,000 clock cycles after T0 (no response is to be received
on RX during those 40,000 clock cycles)
• SIMx_RSTy is asserted (at time T1)
• SIMx_RSTy must remain asserted for at least 40,000 clock cycles after T1, and a response must be
received on SIMx_DATAy_RX_TX between 400 and 40,000 clock cycles after T1.
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97
SIMx_SVENy
SIMx_RSTy
SIMx_CLKy
RESPONSE
SIMx_DATAy_RX_TX
2
1
3
3
T0
T1
Figure 70. Active-Low-Reset SIM Card Reset Sequence
Table 76 defines the general timing requirements for the SIM interface.
Table 76. Timing Specifications, Active-Low-Reset SIM Card Reset Sequence
3.7.14.2
Ref No.
Min.
Max.
Unit
1
—
200
clk cycles
2
400
40,000
clk cycles
3
40,000
—
clk cycles
SIM Power-Down Sequence
Figure 71 shows the SIM interface power-down AC timing diagram. Table 77 shows the timing
requirements for parameters (SI7–SI10) shown in the figure.
The power-down sequence for the SIM interface is as follows:
• SIMx_SIMPDy port detects the removal of the SIM Card
• SIMx_RSTy is negated
• SIMx_CLKy is negated
• SIMx_DATAy_RX_TX is negated
• SIMx_SVENy is negated
Each of the above steps requires one CKIL period (usually 32 kHz). Power-down may be initiated by a
SIM card removal detection; or it may be launched by the processor.
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Freescale Semiconductor
SI10
SIMx_SIMPDy
SIMx_RSTy
SI7
SIMx_CLKy
SI8
SIMx_RXy & SIMx_TXy
SI9
SIMx_VENy
Figure 71. SmartCard Interface Power Down AC Timing
Table 77. Timing Requirements for Power-down Sequence
ID
PARAMETER
SYMBOL
Min.
Max.
Unit
SI7
SIM reset to SIM clock stop
Srst2clk
0.9 × 1/Fckil
1.1 × 1/Fckil
ns
SI8
SIM reset to SIM Tx data low
Srst2dat
1.8 × 1/Fckil
2.2 × 1/Fckil
ns
SI9
SIM reset to SIM voltage enable low
Srst2ven
2.7 × 1/Fckil
3.3 × 1/Fckil
ns
SI10
SIM presence detect to SIM reset low
Spd2rst
0.9 × 1/Fckil
1.1 × 1/Fckil
ns
3.7.15
System JTAG Controller (SJC) Timing
Figure 72 through Figure 75 show respectively the test clock input, boundary scan, test access port, and
TRST timings for the SJC. Table 78 describes the SJC timing parameters (SJ1–SJ13) indicated in the
figures.
SJ1
SJ2
TCK
(Input)
VM
VIH
SJ2
VM
VIL
SJ3
SJ3
Figure 72. Test Clock Input Timing Diagram
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Freescale Semiconductor
99
TCK
(Input)
VIH
VIL
SJ5
SJ4
Data
Inputs
Input Data Valid
SJ6
Data
Outputs
Output Data Valid
SJ7
Data
Outputs
SJ6
Data
Outputs
Output Data Valid
Figure 73. Boundary Scan (JTAG) Timing Diagram
TCK
(Input)
VIH
VIL
SJ8
TDI
TMS
(Input)
SJ9
Input Data Valid
SJ10
TDO
(Output)
Output Data Valid
SJ11
TDO
(Output)
SJ10
TDO
(Output)
Output Data Valid
Figure 74. Test Access Port Timing Diagram
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TCK
(Input)
SJ13
TRST
(Input)
SJ12
Figure 75. TRST Timing Diagram
Table 78. SJC Timing Parameters
All Frequencies
ID
SJ1
Parameter
Unit
TCK cycle time
VM2
Min.
Max.
1001
—
ns
40
—
ns
SJ2
TCK clock pulse width measured at
SJ3
TCK rise and fall times
—
3
ns
SJ4
Boundary scan input data set-up time
10
—
ns
SJ5
Boundary scan input data hold time
50
—
ns
SJ6
TCK low to output data valid
—
50
ns
SJ7
TCK low to output high impedance
—
50
ns
SJ8
TMS, TDI data set-up time
10
—
ns
SJ9
TMS, TDI data hold time
50
—
ns
SJ10
TCK low to TDO data valid
—
44
ns
SJ11
TCK low to TDO high impedance
—
44
ns
SJ12
TRST assert time
100
—
ns
SJ13
TRST set-up time to TCK low
40
—
ns
1
In cases where SDMA TAP is put in the chain, the maximum TCK frequency is limited by the maximum ratio of 1:8 of SDMA
core frequency to TCK. This implies a maximum frequency of 8.25 MHz (or 121.2 ns) for a 66 MHz IPG clock.
2
VM – mid point voltage
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3.7.16
Smart Liquid Crystal Display Controller (SLCDC)
Figure 76 and Figure 77 show SLCDC timing for serial and parallel transfers respectively. Table 79 and
Table 80 describe the timing parameters shown in the respective figures.
tcsh
tcss
tcyc
LCD_CS
tcl
tch
LCD_CLK (LCD_DATA[6])
SDATA (LCD_DATA[7])
trsh
tdh
tds
MSB
LSB
trss
RS=0 => command data, RS=1=> display data
RS
(This diagram shows the case SCKPOL = 1, CSPOL = 0)
tcss
tcsh
tcyc
LCD_CS
tcl
tch
LCD_CLK (LCD_DATA[6])
trsh
tdh
tds
SDATA (LCD_DATA[7])
MSB
LSB
trss
RS=0 => command data, RS=1=> display data
RS
(This diagram shows the case SCKPOL = 0, CSPOL = 0)
tcss
tcsh
tcyc
LCD_CS
tcl
tch
LCD_CLK (LCD_DATA[6])
SDATA (LCD_DATA[7])
trsh
tdh
tds
MSB
LSB
trss
RS=0 => command data, RS=1=> display data
RS
(This diagram shows the case SCKPOL = 1, CSPOL = 1)
tcss
tcsh
tcyc
LCD_CS
tcl
tch
LCD_CLK (LCD_DATA[6])
tdh
tds
SDATA (LCD_DATA[7])
MSB
trsh
LSB
trss
RS
RS=0 => command data, RS=1=> display data
(This diagram shows the case SCKPOL = 0, CSPOL = 1)
Figure 76. SLCDC Timing Diagram—Serial Transfers to LCD Device
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Table 79. SLCDC Serial Interface Timing Parameters
Symbol
Parameter
Min.
Typ.
Max.
Units
tcss
Chip select setup time
(tcyc / 2) (±) tprop
—
—
ns
tcsh
Chip select hold time
(tcyc / 2) (±) tprop
—
—
ns
tcyc
Serial clock cycle time
39 (±) tprop
—
2641
ns
tcl
Serial clock low pulse
18 (±) tprop
—
—
ns
tch
Serial clock high pulse
18 (±) tprop
—
—
ns
tds
Data setup time
(tcyc / 2) (±) tprop
—
—
ns
tdh
Data hold time
(tcyc / 2) (±) tprop
—
—
ns
trss
Register select setup time
(15 × tcyc / 2) (±) tprop
—
—
ns
trsh
Register select hold time
(tcyc / 2) (±) tprop
—
—
ns
LCD_CLK
trss
trsh
LCD_RS
tcyc
LCD_CS
tds
LCD_DATA[15:0]
tdh
command data
display data
(This diagram shows the case CSPOL=0)
LCD_CLK
trss
trsh
LCD_RS
tcyc
LCD_CS
tds
LCD_DATA[15:0]
tdh
command data
display data
(This diagram shows the case CSPOL=1)
Figure 77. SLCDC Timing Diagram—Parallel Transfers to LCD Device
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Table 80. SLCDC Parallel Interface Timing Parameters
Symbol
Parameter
Min.
Typ.
Max.
Units
tcyc
Parallel clock cycle time
78 (±) tprop
—
4923
ns
tds
Data setup time
(tcyc / 2) (±) tprop
—
—
—
tdh
Data hold time
(tcyc / 2) (±) tprop
—
—
—
trss
Register select setup time
(tcyc / 2) (±) tprop
—
—
—
trsh
Register select hold time
(tcyc / 2) (±) tprop
—
—
—
3.7.17
Synchronous Serial Interface (SSI) Timing
The following subsections describe SSI timing in four cases:
• Transmitter with external clock
• Receiver with external clock
• Transmitter with internal clock
• Receiver with internal clock
3.7.17.1
SSI Transmitter Timing with Internal Clock
Figure 78 shows the timing for SSI transmitter with internal clock, and Table 81 describes the timing
parameters (SS1–SS52).
SS1
SS3
SS5
SS2
SS4
AUDn_TXC
(Output)
SS6
SS8
AUDn_TXFS (bl)
(Output)
SS10
SS12
AUDn_TXFS (wl)
(Output)
SS14
SS15
SS16
SS18
SS17
AUDn_TXD
(Output)
SS43
SS42
SS19
AUDn_RXD
(Input)
Note: SRXD Input in Synchronous mode only
Figure 78. SSI Transmitter with Internal Clock Timing Diagram
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Table 81. SSI Transmitter Timing with Internal Clock
ID
Parameter
Min.
Max.
Unit
Internal Clock Operation
SS1
(Tx/Rx) CK clock period
81.4
—
ns
SS2
(Tx/Rx) CK clock high period
36.0
—
ns
SS3
(Tx/Rx) CK clock rise time
—
6.0
ns
SS4
(Tx/Rx) CK clock low period
36.0
—
ns
SS5
(Tx/Rx) CK clock fall time
—
6.0
ns
SS6
(Tx) CK high to FS (bl) high
—
15.0
ns
SS8
(Tx) CK high to FS (bl) low
—
15.0
ns
SS10
(Tx) CK high to FS (wl) high
—
15.0
ns
SS12
(Tx) CK high to FS (wl) low
—
15.0
ns
SS14
(Tx/Rx) internal FS rise time
—
6.0
ns
SS15
(Tx/Rx) internal FS fall time
—
6.0
ns
SS16
(Tx) CK high to STXD valid from high impedance
—
15.0
ns
SS17
(Tx) CK high to STXD high/low
—
15.0
ns
SS18
(Tx) CK high to STXD high impedance
—
15.0
ns
SS19
STXD rise/fall time
—
6.0
ns
Synchronous Internal Clock Operation
SS42
SRXD setup before (Tx) CK falling
10.0
—
ns
SS43
SRXD hold after (Tx) CK falling
0.0
—
ns
SS52
Loading
—
25.0
pf
Note:
• All the timings for the SSI are given for a non-inverted serial clock polarity (TSCKP/RSCKP = 0) and a non-inverted frame sync
(TFSI/RFSI = 0). If the polarity of the clock and/or the frame sync have been inverted, all the timing remains valid by inverting
the clock signal STCK/SRCK and/or the frame sync STFS/SRFS shown in the tables and in the figures.
• All timings are on pads when SSI is being used for a data transfer.
• ”Tx” and “Rx” refer, respectively, to the transmit and receive sections of the SSI.
• For internal frame sync operation using external clock, the FS timing is the same as that of Tx data (for example, during AC97
mode of operation).
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3.7.17.2
SSI Receiver Timing with Internal Clock
Figure 79 shows the timing for the SSI receiver with internal clock. Table 82 describes the timing
parameters (SS1–SS51) shown in the figure.
SS1
SS3
SS5
SS2
SS4
AUDn_TXC
(Output)
SS9
SS7
AUDn_TXFS (bl)
(Output)
SS11
SS13
AUDn_TXFS (wl)
(Output)
SS20
SS21
AUDn_RXD
(Input)
SS47
SS48
SS51
SS49
SS50
AUDn_RXC
(Output)
Figure 79. SSI Receiver Internal Clock Timing Diagram
Table 82. SSI Receiver Timing with Internal Clock
ID
Parameter
Min.
Max.
Unit
Internal Clock Operation
SS1
(Tx/Rx) CK clock period
81.4
—
ns
SS2
(Tx/Rx) CK clock high period
36.0
—
ns
SS3
(Tx/Rx) CK clock rise time
—
6.0
ns
SS4
(Tx/Rx) CK clock low period
36.0
—
ns
SS5
(Tx/Rx) CK clock fall time
—
6.0
ns
SS7
(Rx) CK high to FS (bl) high
—
15.0
ns
SS9
(Rx) CK high to FS (bl) low
—
15.0
ns
SS11
(Rx) CK high to FS (wl) high
—
15.0
ns
SS13
(Rx) CK high to FS (wl) low
—
15.0
ns
SS20
SRXD setup time before (Rx) CK low
10.0
—
ns
SS21
SRXD hold time after (Rx) CK low
0.0
—
ns
15.04
—
ns
Oversampling Clock Operation
SS47
Oversampling clock period
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Table 82. SSI Receiver Timing with Internal Clock (continued)
ID
Parameter
Min.
Max.
Unit
SS48
Oversampling clock high period
6.0
—
ns
SS49
Oversampling clock rise time
—
3.0
ns
SS50
Oversampling clock low period
6.0
—
ns
SS51
Oversampling clock fall time
—
3.0
ns
Note:
• All the timings for the SSI are given for a non-inverted serial clock polarity (TSCKP/RSCKP = 0) and a non-inverted frame sync
(TFSI/RFSI = 0). If the polarity of the clock and/or the frame sync have been inverted, all the timing remains valid by inverting
the clock signal STCK/SRCK and/or the frame sync STFS/SRFS shown in the tables and in the figures.
• All timings are on pads when SSI is being used for a data transfer.
• ”Tx” and “Rx” refer to the transmit and receive sections of the SSI.
• For internal frame sync operation using external clock, the FS timing is the same as that of Tx Data (for example, during AC97
mode of operation).
3.7.17.3
SSI Transmitter Timing with External Clock
Figure 80 shows the timing for the SSI transmitter with external clock. Table 83 describes the timing
parameters (SS22-SS46) shown in the figure.
SS22
SS23
SS25
SS26
SS24
AUDn_TXC
(Input)
SS27
SS29
AUDn_TXFS (bl)
(Input)
SS33
SS31
AUDn_TXFS (wl)
(Input)
SS39
SS37
SS38
AUDn_TXD
(Output)
SS45
SS44
AUDn_RXD
(Input)
Note: SRXD Input in Synchronous mode only
SS46
Figure 80. SSI Transmitter with External Clock Timing Diagram
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Table 83. SSI Transmitter Timing with External Clock
ID
Parameter
Min.
Max.
Unit
External Clock Operation
SS22
(Tx/Rx) CK clock period
81.4
—
ns
SS23
(Tx/Rx) CK clock high period
36.0
—
ns
SS24
(Tx/Rx) CK clock rise time
—
6.0
ns
SS25
(Tx/Rx) CK clock low period
36.0
—
ns
SS26
(Tx/Rx) CK clock fall time
—
6.0
ns
SS27
FS (bl) low/ high setup before (Tx) CK falling
–10.0
15.0
ns
SS29
FS (bl) low/ high setup before (Tx) CK falling
10.0
—
ns
SS31
FS (wl) low/ high setup before (Tx) CK falling
–10.0
15.0
ns
SS33
FS (wl) low/ high setup before (Tx) CK falling
10.0
—
ns
SS37
(Tx) CK high to STXD valid from high impedance
—
15.0
ns
SS38
(Tx) CK high to STXD high/low
—
15.0
ns
SS39
(Tx) CK high to STXD high impedance
—
15.0
ns
Synchronous External Clock Operation
SS44
SRXD setup before (Tx) CK falling
10.0
—
ns
SS45
SRXD hold after (Tx) CK falling
2.0
—
ns
SS46
SRXD rise/fall time
—
6.0
ns
Note:
• All the timings for the SSI are given for a non-inverted serial clock polarity (TSCKP/RSCKP = 0) and a non-inverted frame sync
(TFSI/RFSI = 0). If the polarity of the clock and/or the frame sync have been inverted, all the timing remains valid by inverting
the clock signal STCK/SRCK and/or the frame sync STFS/SRFS shown in the tables figures.
• All timings are on pads when SSI is being used for data transfer.
• ”Tx” and “Rx” refer, respectively, to the transmit and receive sections of the SSI.
• For internal frame sync operation using external clock, the FS timing is the same as that of Tx data (for example, during AC97
mode of operation).
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3.7.17.4
SSI Receiver Timing with External Clock
Figure 81 shows the timing for SSI receiver with external clock. Table 84 describes the timing parameters
(SS22–SS41) used in the figure.
SS22
SS26
SS24
SS25
SS23
AUDn_TXC
(Input)
SS30
SS28
AUDn_TXFS (bl)
(Input)
SS32
AUDn_TXFS (wl)
(Input)
SS34
SS35
SS41
SS36
SS40
AUDn_RXD
(Input)
Figure 81. SSI Receiver with External Clock Timing Diagram
Table 84. SSI Receiver Timing with External Clock
ID
Parameter
Min.
Max.
Unit
External Clock Operation
SS22
(Tx/Rx) CK clock period
81.4
—
ns
SS23
(Tx/Rx) CK clock high period
36.0
—
ns
SS24
(Tx/Rx) CK clock rise time
—
6.0
ns
SS25
(Tx/Rx) CK clock low period
36.0
—
ns
SS26
(Tx/Rx) CK clock fall time
—
6.0
ns
SS28
FS (bl) low/high setup before (Tx) CK falling
–10.0
15.0
ns
SS30
FS (bl) low/high setup before (Tx) CK falling
10.0
—
ns
SS32
FS (wl) low/high setup before (Tx) CK falling
–10.0
15.0
ns
SS34
FS (wl) low/high setup before (Tx) CK falling
10.0
—
ns
SS35
(Tx/Rx) External FS rise time
—
6.0
ns
SS36
(Tx/Rx) External FS fall time
—
6.0
ns
SS40
SRXD setup time before (Rx) CK low
10.0
—
ns
SS41
SRXD hold time after (Rx) CK low
2.0
—
ns
Note:
• All the timings for the SSI are given for a non-inverted serial clock polarity (TSCKP/RSCKP = 0) and a non-inverted frame sync
(TFSI/RFSI = 0). If the polarity of the clock and/or the frame sync have been inverted, all the timing remains valid by inverting
the clock signal STCK/SRCK and/or the frame sync STFS/SRFS shown in the tables and in the figures.
• All timings are on pads when SSI is being used for data transfer.
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• ”Tx” and “Rx” refer, respectively, to the transmit and receive sections of the SSI.
• For internal frame sync operation using external clock, the FS timing is the same as that of Tx data (for example, during AC97
mode of operation).
3.7.18
Touchscreen ADC Electrical Specifications and Timing
This section describes the electrical specifications, operation modes, and timing of the touchscreen ADC.
3.7.18.1
ADC Electrical Specifications
Table 85 shows the electrical specifications for the touchscreen ADC.
Table 85. Touchscreen ADC Electrical Specifications
Parameter
Conditions
Min.
Typ.
Max.
Unit
—
2
—
pF
ADC
Input sampling capacitance (CS)
No pin/pad capacitance included
Resolution
—
12
bits
Analog Bias
Resistance value between ref and
agndref
—
—
1.6
—
kΩ
Timing Characteristics
Sampling rate (fs)
—
—
—
125
kHz
Internal ADC/TSC clock frequency
—
—
—
1.75
MHz
Multiplexed inputs
—
8
—
Data latency
—
12.5
clk
cycles
Power-up time1
—
14
clk
cycles
clk falling edge to sampling delay
(tsd)
—
2
5
8
ns
soc input setup time before clk rising
edge (tsocst)
—
0.5
1
3
ns
soc input hold time after clk rising
edge (tsochld)
—
2
3
6
ns
eoc delay after clk rise edge (teoc)
With a 250 pF load
2
7
10
ns
Valid data out delay after eoc rise
edge (tdata)
With a 250 pF load
5
8
13
ns
—
—
2.1
0.5
mA
mA
Power Supply Requirements
Current consumption2 NVCC_ADC
QVDD
—
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Table 85. Touchscreen ADC Electrical Specifications (continued)
Parameter
Power-down current
NVCC_ADC
QVDD
Conditions
Min.
Typ.
Max.
Unit
—
—
—
1
10
uA
uA
100
—
1500
Ω
—
—
10
Ω
Touchscreen Interface
Expected plate resistance
Switch drivers on resistance
—
GND and VDD switches
Conversion Characteristics3
DNL4
fin = 1 kHz
—
+/–0.75
—
LSB
INL4
fin = 1 kHz
—
+/–2.0
—
LSB
—
—
+/–2
%FS
Gain + Offset Error
—
1
This comprises only the required initial dummy conversion cycle. Additional power-up time depends on the enadc, reset and
soc signals applied to the touchscreen controller.
2 This value only includes the ADC and the driver switches, but it does not take into account the current consumption in the
touchscreen plate. For example, if the plate resistance is 100 W, the total current consumption is about 33 mA.
3 At avdd = 3.3 V, dvdd = 1.2 V, Tjunction = 50 °C, fclk = 1.75 MHz, any process corner, unless otherwise noted.
4 Value measured with a –0.5 dBFS sinusoidal input signal and computed with the code density test.
3.7.18.2
ADC Timing Diagrams
Figure 82 represents the synchronization between the signals clk, soc, eoc, and the output bits in the usage
of the internal ADC. After a conversion cycle eoc is asserted, a new conversion begins only when the
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assertion of soc is detected. Thus, if the soc signal is continuously asserted, the ADC undergoes successive
conversion cycles and achieves the maximum sampling rate. If soc is negated, no conversion is initiated.
Figure 82. Start-up Sequence
The output data can be read from adcout11...adcout0, and is available tdata nanoseconds after the rising
edge of eoc. The reset signal and the digital signals controlling the analog switches (ypsw, xpsw, ynsw,
xnsw) are totally asynchronous.
The following conditions are necessary to guarantee the correct operation of the ADC:
• The input multiplexer selection (selin11…selin0) is stable during both the last clock cycle (14th)
and the first clock cycle (1st). The best way to guarantee this is to make the input multiplexer
selection during clock cycles 2 to 13.
• The references are stable during clock cycle 1 to 13. The best way to guarantee this is to make the
reference multiplexer selection (selrefp and selrefn) before issuing an soc pulse and changing it
only after an eoc pulse has been acquired, during the last clock cycle (14).
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Figure 83 shows the timing for ADC normal operation.
Figure 83. Timing for ADC Normal Operation
When the ADC is used so that the idle clock cycles occur between conversions (due to the negation of soc),
the selin inputs must be stable at least 1 clock cycle before the clock's rising edge where the soc signal is
latched. Also, selrefp and selrefn must be stable by the time the soc signal is latched. These conditions are
met if enadc=1 and reset=0 throughout ADC operation, including the idle cycles. If the conditions are not
met, or if power is lost during ADC operation, then a new start-up sequence is required for ADC to become
operational again.
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Figure 84 represents the usage of the ADC with idle cycles between conversions. This diagram is valid for
any value of N equal or greater than 1.
Figure 84. ADC Usage with Idle Cycles Between Conversions
3.7.19
UART Timing
This section describes the timing of the UART module in serial and parallel mode.
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3.7.19.1
3.7.19.1.1
UART RS-232 Serial Mode Timing
UART Transmit Timing in RS-232 Serial Mode
Figure 85 shows the UART transmit timing in RS-232 serial mode, showing only 8 data bits and 1 stop
bit. Table 86 describes the timing parameter (UA1) shown in the figure.
UA1
TXD
(output)
Possible
Parity
Bit
UA1
Start
Bit
Bit 0
Bit 1
Bit 2
Bit 3
Bit 4
Bit 5
Bit 6
Bit 7
Par Bit STOP
BIT
Next
Start
Bit
UA1
UA1
Figure 85. UART RS-232 Serial Mode Transmit Timing Diagram
Table 86. UART RS-232 Serial Mode Transmit Timing Parameters
ID
UA1
1
Parameter
Symbol
Transmit Bit Time
Min.
1
tTbit
1/Fbaud_rate –
Tref_clk2
Max.
Units
1/Fbaud_rate + Tref_clk
—
Fbaud_rate: Baud rate frequency. The maximum baud rate the UART can support is (ipg_perclk frequency)/16.
Tref_clk: The period of UART reference clock ref_clk (ipg_perclk after RFDIV divider).
2
3.7.19.1.2
UART Receive Timing in RS-232 Serial Mode
Figure 86 shows the UART receive timing in RS-232 serial mode, showing only 8 data bits and 1 stop bit.
Table 87 describes the timing parameter (UA2) shown in the figure.
–
UA2
RXD
(input)
Start
Bit
Possible
Parity
Bit
UA2
Bit 0
Bit 1
Bit 2
Bit 3
Bit 4
Bit 5
Bit 6
Bit 7
Par Bit STOP
BIT
Next
Start
Bit
UA2
UA2
Figure 86. UART RS-232 Serial Mode Receive Timing Diagram
Table 87. UART RS-232 Serial Mode Receive Timing Parameters
ID
Parameter
Symbol
UA2
Receive bit time1
tRbit
Min.
Max.
1/Fbaud_rate2 – 1/(16 1/F baud_rate + 1/(16
× F baud_rate)
× Fbaud_rate)
Units
—
1
The UART receiver can tolerate 1/(16 × Fbaud_rate) tolerance in each bit. But accumulation tolerance in one frame must not
exceed 3/(16 × Fbaud_rate).
2
Fbaud_rate: Baud rate frequency. The maximum baud rate the UART can support is (ipg_perclk frequency)/16.
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3.7.19.2
UART Infrared (IrDA) Mode Timing
The following subsections describe the UART transmit and receive timing in IrDA mode.
3.7.19.2.3
UART IrDA Mode Transmit Timing
Figure 87 depicts the UART transmit timing in IrDA mode, showing only 8 data bits and 1 stop bit.
Table 88 describes the timing parameters (UA3–UA4) shown in the figure.
UA3
UA4
UA3
UA3
UA3
TXD
(output)
Start
Bit
Bit 0
Bit 1
Bit 3
Bit 2
Bit 4
Bit 5
Bit 6
Bit 7
Possible
Parity
Bit
STOP
BIT
Figure 87. UART IrDA Mode Transmit Timing Diagram
Table 88. UART IrDA Mode Transmit Timing Parameters
1
2
ID
Parameter
Symbol
Min.
Max.
Units
UA3
Transmit bit time in IrDA mode
tTIRbit
1/Fbaud_rate1 – Tref_clk2
1/Fbaud_rate + Tref_clk
—
UA4
Transmit IR pulse duration
tTIRpulse
(3/16) × (1/Fbaud_rate) – Tref_clk (3/16) × (1/Fbaud_rate) + Tref_clk
—
Fbaud_rate: Baud rate frequency. The maximum baud rate the UART can support is (ipg_perclk frequency)/16.
Tref_clk: The period of UART reference clock ref_clk (ipg_perclk after RFDIV divider).
3.7.19.2.4
UART IrDA Mode Receive Timing
Figure 88 shows the UART receive timing for IrDA mode, for a format of 8 data bits and 1 stop bit.
Table 89 describes the timing parameters (UA5–UA6) shown in the figure.
UA5
UA6
UA5
UA5
UA5
RXD
(input)
Start
Bit
Bit 0
Bit 1
Bit 2
Bit 3
Bit 4
Bit 5
Bit 6
Bit 7
Possible
Parity
Bit
STOP
BIT
Figure 88. UART IrDA Mode Receive Timing Diagram
Table 89. UART IrDA Mode Receive Timing Parameters
1
ID
Parameter
Symbol
Min.
Max.
Units
UA5
Receive bit time1 in IrDA mode
tRIRbit
1/Fbaud_rate2 – 1/(16 × Fbaud_rate)
1/Fbaud_rate + 1/(16 × F baud_rate)
—
UA6
Receive IR pulse duration
tRIRpulse
1.41 μs
(5/16) × (1/Fbaud_rate)
—
The UART receiver can tolerate 1/(16 × Fbaud_rate) tolerance in each bit. But accumulation tolerance in one frame must not
exceed 3/(16 × Fbaud_rate).
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2
Fbaud_rate: Baud rate frequency. The maximum baud rate the UART can support is (ipg_perclk frequency)/16.
3.7.20
USBOTG Timing
This section describes timing for the USB OTG port and host ports. Both serial and parallel interfaces are
described.
3.7.20.1
USB Serial Interface Timing
The USB serial transceiver is configurable to four modes supporting four different serial interfaces:
• DAT_SE0 bidirectional, 3-wire mode
• DAT_SE0 unidirectional, 6-wire mode
• VP_VM bidirectional, 4-wire mode
• VP_VM unidirectional, 6-wire mode
The following subsections describe the timings for these four modes.
3.7.20.1.1
DAT_SE0 Bidirectional Mode Timing
Table 90 defines the DAT_SE0 bidirectional mode signals.
Table 90. Signal Definitions—DAT_SE0 Bidirectional Mode
Name
Direction
Signal Description
USB_TXOE_B
Out
Transmit enable, active low
USB_DAT_VP
Out
In
Tx data when USB_TXOE_B is low
Differential Rx data when USB_TXOE_B is high
USB_SE0_VM
Out
In
SE0 drive when USB_TXOE_B is low
SE0 Rx indicator when USB_TXOE_B is high
Figure 89 shows the USB transmit waveform in DAT_SE0 bidirectional mode diagram.
Transmit
USB_DAT_VP
US1
USB_SE0_VM
US4
US2
Figure 89. USB Transmit Waveform in DAT_SE0 Bidirectional Mode
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Figure 90 shows the USB receive waveform in DAT_SE0 bidirectional mode diagram.
Receive
USB_TXOE_B
USB_DAT_VP
USB_SE0_VM
US5
US7/US8
US6
Figure 90. USB Receive Waveform in DAT_SE0 Bidirectional Mode
Table 91 shows the OTG port timing specification in DAT_SE0 bidirectional mode.
Table 91. OTG Port Timing Specification in DAT_SE0 Bidirectional Mode
No.
Parameter
Signal Name
Direction
Min.
Max.
Unit
Conditions/
Reference Signal
US1
Tx rise/fall time
USB_DAT_VP
Out
—
5.0
ns
50 pF
US2
Tx rise/fall time
USB_SE0_VM
Out
—
5.0
ns
50 pF
US3
Tx rise/fall time
USB_TXOE_B
Out
—
5.0
ns
50 pF
US4
Tx duty cycle
USB_DAT_VP
Out
49.0
51.0
%
—
US5
Enable Delay
USB_DAT_VP
USB_SE0_VM
In
—
8.0
ns
USB_TXOE_B
US6
Disable Delay
USB_DAT_VP
USB_SE0_VM
In
—
10.0
ns
USB_TXOE_B
US7
Rx rise/fall time
USB_DAT_VP
In
—
3.0
ns
35 pF
US8
Rx rise/fall time
USB_SE0_VM
In
—
3.0
ns
35 pF
3.7.20.1.2
DAT_SE0 Unidirectional Mode Timing
Table 92 defines the DAT_SE0 unidirectional mode signals.
Table 92. Signal Definitions—DAT_SE0 Unidirectional Mode
Name
Direction
Signal Description
USB_TXOE_B
Out
Transmit enable, active low
USB_DAT_VP
Out
Tx data when USB_TXOE_B is low
USB_SE0_VM
Out
SE0 drive when USB_TXOE_B is low
USB_VP1
In
Buffered data on DP when USB_TXOE_B is high
USB_VM1
In
Buffered data on DM when USB_TXOE_B is high
USB_RCV
In
Differential Rx data when USB_TXOE_B is high
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Figure 91 shows the USB transmit waveform in DAT_SE0 unidirectional mode diagram.
Transmit
USB_DAT_VP
US9
USB_SE0_VM
US10
US12
Figure 91. USB Transmit Waveform in DAT_SE0 Unidirectional Mode
Figure 92 shows the USB receive waveform in DAT_SE0 unidirectional mode diagram.
Receive
USB_DAT_VP
USB_SE0_VM
RCV
US13
US17
US14
Figure 92. USB Receive Waveform in DAT_SE0 Unidirectional Mode
Table 93 shows the USB port timing specification in DAT_SE0 unidirectional mode.
Table 93. USB Port Timing Specification in DAT_SE0 Unidirectional Mode
No.
Parameter
Signal Name
Signal
Source
Min.
Max.
Unit
Condition/
Reference Signal
US9
Tx rise/fall time
USB_DAT_VP
Out
—
5.0
ns
50 pF
US10
Tx rise/fall time
USB_SE0_VM
Out
—
5.0
ns
50 pF
US11
Tx rise/fall time
USB_TXOE_B
Out
—
5.0
ns
50 pF
US12
Tx duty cycle
USB_DAT_VP
Out
49.0
51.0
%
—
US13
Enable Delay
USB_DAT_VP
USB_SE0_VM
In
—
8.0
ns
USB_TXOE_B
US14
Disable Delay
USB_DAT_VP
USB_SE0_VM
In
—
10.0
ns
USB_TXOE_B
US15
Rx rise/fall time
USB_VP1
In
—
3.0
ns
35 pF
US16
Rx rise/fall time
USB_VM1
In
—
3.0
ns
35 pF
US17
Rx rise/fall time
USB_RCV
In
—
3.0
ns
35 pF
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3.7.20.1.3
VP_VM Bidirectional Mode Timing
Table 94 defines the VP_VM bidirectional mode signals.
Table 94. Signal Definitions—VP_VM Bidirectional Mode
Name
Direction
Signal Description
USB_TXOE_B
Out
USB_DAT_VP
Out (Tx)
In (Rx)
• Tx VP data when USB_TXOE_B is low
• Rx VP data when USB_TXOE_B is high
USB_SE0_VM
Out (Tx)
In (Rx)
• Tx VM data when USB_TXOE_B low
• Rx VM data when USB_TXOE_B high
USB_RCV
In
• Transmit enable, active low
• Differential Rx data
Figure 93 shows the USB transmit waveform in VP_VM bidirectional mode diagram.
Transmit
US1
USB_TXENB
US4
US2
USB_VPOUT
USB_VMOUT
US3
Figure 93. USB Transmit Waveform in VP_VM Bidirectional Mode
Figure 94 shows the USB receive waveform in VP_VM bidirectional mode diagram.
Receive
US5
USB_VPIN
USB_VMIN
US6
Figure 94. USB Receive Waveform in VP_VM Bidirectional Mode
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Table 95 shows the USB port timing specification in VP_VM bidirectional mode.
Table 95. USB Port Timing Specifications in VP_VM Bidirectional Mode
No.
Parameter
Signal Name
Direction
Min.
Max.
Unit
Condition/
Reference Signal
US18
Tx rise/fall time
USB_DAT_VP
Out
—
5.0
ns
50 pF
US19
Tx rise/fall time
USB_SE0_VM
Out
—
5.0
ns
50 pF
US20
Tx rise/fall time
USB_TXOE_B
Out
—
5.0
ns
50 pF
US21
Tx duty cycle
USB_DAT_VP
Out
49.0
51.0
%
—
US22
Tx high overlap
USB_SE0_VM
Out
0.0
—
ns
USB_DAT_VP
US23
Tx low overlap
USB_SE0_VM
Out
—
0.0
ns
USB_DAT_VP
US24
Enable delay
USB_DAT_VP
USB_SE0_VM
In
—
8.0
ns
USB_TXOE_B
US25
Disable delay
USB_DAT_VP
USB_SE0_VM
In
—
10.0
ns
USB_TXOE_B
US26
Rx rise/fall time
USB_DAT_VP
In
—
3.0
ns
35 pF
US27
Rx rise/fall time
USB_SE0_VM
In
—
3.0
ns
35 pF
US28
Rx skew
USB_DAT_VP
Out
–4.0
+4.0
ns
USB_SE0_VM
US29
Rx skew
USB_RCV
Out
–6.0
+2.0
ns
USB_DAT_VP
3.7.20.1.4
VP_VM Unidirectional Mode Timing
Table 96 defines the signals for USB in VP_VM unidirectional mode.
Table 96. Signal Definitions for USB VP_VM Unidirectional Mode
Name
Direction
Signal Description
USB_TXOE_B
Out
Transmit enable, active low
USB_DAT_VP
Out
Tx VP data when USB_TXOE_B is low
USB_SE0_VM
Out
Tx VM data when USB_TXOE_B is low
USB_VP1
In
Rx VP data when USB_TXOE_B is high
USB_VM1
In
Rx VM data when USB_TXOE_B is high
USB_RCV
In
Differential Rx data
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Figure 95 shows the USB transmit waveform in VP_VM unidirectional mode diagram.
Transmit
US32
USB_TXOE_B
USB_DAT_VP
USB_SE0_VM
US30
US33
US31
US34
Figure 95. USB Transmit Waveform in VP_VM Unidirectional Mode
Figure 96 shows the USB receive waveform in VP_VM unidirectional mode diagram.
Receive
USB_TXOE_B
USB_VP1
US36
US38
US37
USB_VM1
US40
US39
USB_RCV
US41
Figure 96. USB Receive Waveform in VP_VM Unidirectional Mode
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Table 97 shows the timing specifications for USB in VP_VM unidirectional mode.
Table 97. USB Timing Specifications in VP_VM Unidirectional Mode
No.
Parameter
Signal
Direction
Min.
Max.
Unit
Conditions/
Reference Signal
US30
Tx rise/fall time
USB_DAT_VP
Out
—
5.0
ns
50 pF
US31
Tx rise/fall time
USB_SE0_VM
Out
—
5.0
ns
50 pF
US32
Tx rise/fall time
USB_TXOE_B
Out
—
5.0
ns
50 pF
US33
Tx duty cycle
USB_DAT_VP
Out
49.0
51.0
%
—
US34
Tx high overlap
USB_SE0_VM
Out
0.0
—
ns
USB_DAT_VP
US35
Tx low overlap
USB_SE0_VM
Out
—
0.0
ns
USB_DAT_VP
US36
Enable delay
USB_DAT_VP
USB_SE0_VM
In
—
8.0
ns
USB_TXOE_B
US37
Disable delay
USB_DAT_VP
USB_SE0_VM
In
—
10.0
ns
USB_TXOE_B
US38
Rx rise/fall time
USB_VP1
In
—
3.0
ns
35 pF
US39
Rx rise/fall time
USB_VM1
In
—
3.0
ns
35 pF
US40
Rx skew
USB_VP1
Out
–4.0
+4.0
ns
USB_SE0_VM
US41
Rx skew
USB_RCV
Out
–6.0
+2.0
ns
USB_DAT_VP
3.7.20.2
USB Parallel Interface Timing
Table 98 defines the USB parallel interface signals.
Table 98. Signal Definitions for USB Parallel Interface
Name
Direction
Signal Description
USB_Clk
In
Interface clock—All interface signals are synchronous to USB_Clk
USB_Data[7:0]
I/O
Bidirectional data bus, driven low by the link during idle—Bus ownership is determined by the
direction
USB_Dir
In
Direction—Control the direction of the data bus
USB_Stp
Out
USB_Nxt
In
Stop—The link asserts this signal for one clock cycle to stop the data stream currently on the bus
Next—The PHY asserts this signal to throttle the data
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Figure 97 shows the USB parallel mode transmit/receive waveform. Table 99 describes the timing
parameters (USB15–USB17) shown in the figure.
USB_Clk
US15
US16
USB_Stp
US15
US16
USB_Data
US17
US17
USB_Dir/Nxt
Figure 97. USB Parallel Mode Transmit/Receive Waveform
Table 99. USB Timing Specification in Parallel Mode
ID
Parameter
Min.
Max.
Unit
Conditions/Reference Signal
US15
Setup time (Dir&Nxt in, Data in)
6.0
—
ns
10 pF
US16
Hold time (Dir&Nxt in, Data in)
0.0
—
ns
10 pF
US17
Output delay time (Stp out, Data out
—
9.0
ns
10 pF
4
4.1
Package Information and Contact Assignment
400 MAPBGA—Case 17x17 mm, 0.8 mm Pitch
Figure 98 shows the 17×17 mm i.MX25 production package. The following notes apply to Figure 98:
• All dimensions in millimeters.
• Dimensioning and tolerancing per ASME Y14.5M-1994.
• Maximum solder bump diameter measured parallel to datum A.
• Datum A, the seating plane, is determined by the spherical crowns of the solder bumps.
• Parallelism measurement shall exclude any effect of mark on top surface of package.
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Figure 98. 17×17 i.MX25 Production Package
zzxz
4.2
Ground, Power, Sense, and Reference Contact Assignments
Case 17x17 mm, 0.8 mm Pitch
Table 100 shows the 17×17 mm package ground, power, sense, and reference contact assignments.
Table 100. 17×17 mm Package Ground, Power Sense, and Reference Contact Assignments
Contact Name
Contact Assignment
BATT_VDD
P10
FUSE_VDD
T17
MPLL_GND
U17
MPLL_VDD
U18
NGND_ADC
Y13
NVCC_ADC
W13
NVCC_CRM
N14
NVCC_CSI
J13, J14
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Table 100. 17×17 mm Package Ground, Power Sense, and Reference Contact Assignments (continued)
Contact Name
Contact Assignment
NVCC_DRYICE1
1
W11
NVCC_EMI1
G6, G7, G8, G9, H6, H7, H8, J6, J7
NVCC_EMI2
G12, G13, G14, G15, H12, H13, H14
NVCC_JTAG
U10
NVCC_LCDC
P6, P7, R6, R7
NVCC_MISC
N5, N6, N7
NVCC_NFC
L6, L7, L8
NVCC_SDIO
R17
OSC24M_GND
W15
OSC24M_VDD
W16
QGND
A1, A11, A20, B11, C11, D11, E5, E6, E7, E8, E9, E10, E11, E12, E13, E14, E15, E16, F5, F6,
F7, F8, F9, F10, F11, F12, F13, F14, F15, F16, G5, G10, G16, H5, H9, H10, H11, H15, H16, J5,
J9, J10, J11, J15, J16, K1, K2, K3, K4, K5, K8, K9, K10, K11, K13, K14, K15, L5, L9, L10, L11,
L12, L13, L14, L15, M8, M9, M10, M11, M12, M13, M14, M15, N9, N12, N13, N15, N16, P5, P13,
P14, P15, P16, R5, R8, R9, R10, R11, R12, R13, R14, R15, R16, T5, T6, T7, T8, T9, T10, T11,
T12, T13, T14, T15, T16, Y1, Y20
QVDD
G11, J8, J12, K6, K7, K12, M5, M6, M7, N8, P8, P9
REF
V11
UPLL_GND
M16
UPLL_VDD
L16
USBPHY1_UPLLVDD
M17
USBPHY1_UPLLVSS
N17
USBPHY1_VDDA
K16
USBPHY1_VDDA_BIAS
K19
USBPHY1_VSSA
L19
USBPHY1_VSSA_BIAS
J17
USBPHY2_VDD
W18
USBPHY2_VSS
W17
NVCC_DRYICE is a supply output. An external capacitor no less than 4 µF must be connected to it. A 4.7 µF capacitor is
recommended.
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4.3
Signal Contact Assignments—17 x 17 mm, 0.8 mm Pitch
Table 101 lists the 17×17 mm package i.MX25 signal contact assignments.
Table 101. 17×17 mm Package i.MX25 Signal Contact Assignment
Contact Name
Contact
Assignment
Power Rail
I/O Buffer Type
Direction after
Reset1
Configuration
after Reset1
A0
A18
EMI2
DDR
OUTPUT
Low
A1
B17
EMI2
DDR
OUTPUT
Low
A2
C17
EMI2
DDR
OUTPUT
Low
A3
B18
EMI2
DDR
OUTPUT
Low
A4
C20
EMI2
DDR
OUTPUT
Low
A5
A19
EMI2
DDR
OUTPUT
Low
A6
C19
EMI2
DDR
OUTPUT
Low
A7
B19
EMI2
DDR
OUTPUT
Low
A8
D18
EMI2
DDR
OUTPUT
Low
A9
C18
EMI2
DDR
OUTPUT
Low
A10
A2
EMI1
DDR
OUTPUT
Low
MA10
D16
EMI2
DDR
OUTPUT
Low
A11
D20
EMI2
DDR
OUTPUT
Low
A12
D17
EMI2
DDR
OUTPUT
Low
A13
D19
EMI2
DDR
OUTPUT
Low
A14
A3
EMI1
DDR
OUTPUT
Low
A15
B4
EMI1
DDR
OUTPUT
Low
A16
C6
EMI1
DDR
OUTPUT
Low
A17
B5
EMI1
DDR
OUTPUT
Low
A18
D7
EMI1
DDR
OUTPUT
Low
A19
A4
EMI1
DDR
OUTPUT
Low
A20
B6
EMI1
DDR
OUTPUT
Low
A21
C7
EMI1
DDR
OUTPUT
Low
A22
A5
EMI1
DDR
OUTPUT
Low
A23
A6
EMI1
DDR
OUTPUT
Low
A24
B7
EMI1
DDR
OUTPUT
Low
A25
A7
EMI1
DDR
OUTPUT
Low
SD0
A12
EMI1
DDR
INPUT
Keeper
SD1
C13
EMI1
DDR
INPUT
Keeper
SD2
B13
EMI1
DDR
INPUT
Keeper
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Table 101. 17×17 mm Package i.MX25 Signal Contact Assignment (continued)
Contact Name
Contact
Assignment
Power Rail
I/O Buffer Type
Direction after
Reset1
Configuration
after Reset1
SD3
D14
EMI1
DDR
INPUT
Keeper
SD4
D13
EMI1
DDR
INPUT
Keeper
SD5
A13
EMI1
DDR
INPUT
Keeper
SD6
D12
EMI1
DDR
INPUT
Keeper
SD7
A10
EMI1
DDR
INPUT
Keeper
SD8
B9
EMI1
DDR
INPUT
Keeper
SD9
D10
EMI1
DDR
INPUT
Keeper
SD10
B10
EMI1
DDR
INPUT
Keeper
SD11
C10
EMI1
DDR
INPUT
Keeper
SD12
C9
EMI1
DDR
INPUT
Keeper
SD13
A9
EMI1
DDR
INPUT
Keeper
SD14
D9
EMI1
DDR
INPUT
Keeper
SD15
A8
EMI1
DDR
INPUT
Keeper
SDBA1
A16
EMI2
DDR
OUTPUT
Low
SDBA0
B15
EMI2
DDR
OUTPUT
Low
DQM0
C12
EMI1
DDR
OUTPUT
High
DQM1
C8
EMI1
DDR
OUTPUT
High
RAS
C14
EMI2
DDR
OUTPUT
High
CAS
C16
EMI2
DDR
OUTPUT
High
SDWE
A15
EMI2
DDR
OUTPUT
High
SDCKE0
D15
EMI2
DDR
OUTPUT
High
SDCKE1
C15
EMI2
DDR
OUTPUT
High
SDCLK
B14
EMI2
DDR
OUTPUT
Low
SDCLK_B
A14
EMI2
DDR
OUTPUT
High
SDQS0
B12
EMI2
DDR
INPUT
Keeper
SDQS1
B8
EMI2
DDR
INPUT
Keeper
EB0
B3
EMI1
DDR
OUTPUT
High
EB1
C5
EMI1
DDR
OUTPUT
High
OE
D6
EMI1
DDR
OUTPUT
High
CS0
C3
EMI1
DDR
OUTPUT
High
CS1
D3
EMI1
DDR
OUTPUT
High
CS2
B16
EMI2
DDR
OUTPUT
High
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Table 101. 17×17 mm Package i.MX25 Signal Contact Assignment (continued)
Contact Name
Contact
Assignment
Power Rail
I/O Buffer Type
Direction after
Reset1
Configuration
after Reset1
CS3
A17
EMI2
DDR
OUTPUT
High
CS4
D5
EMI1
GPIO
OUTPUT
High
CS5
D4
EMI1
GPIO
OUTPUT
High
NF_CE0
D2
NFC
GPIO
OUTPUT
High
ECB
B2
EMI1
GPIO
INPUT
100 KΩ Pull-Up
LBA
B1
EMI1
DDR
OUTPUT
High
BCLK
D8
EMI1
DDR
OUTPUT
Low
RW
C4
EMI1
DDR
OUTPUT
High
NFWE_B
G4
NFC
GPIO
OUTPUT
High
NFRE_B
C1
NFC
GPIO
OUTPUT
High
NFALE
F4
NFC
GPIO
OUTPUT
Low
NFCLE
E4
NFC
GPIO
OUTPUT
Low
NFWP_B
H4
NFC
GPIO
OUTPUT
High
NFRB
C2
NFC
GPIO
INPUT
100 KΩ Pull-Up
D15
J2
NFC
GPIO
INPUT
Keeper
D14
J1
NFC
GPIO
INPUT
Keeper
D13
H2
NFC
GPIO
INPUT
Keeper
D12
H3
NFC
GPIO
INPUT
Keeper
D11
F1
NFC
GPIO
INPUT
-
D10
F2
NFC
GPIO
INPUT
Keeper
D9
D1
NFC
GPIO
INPUT
Keeper
D8
E2
NFC
GPIO
INPUT
Keeper
D7
J3
NFC
GPIO
INPUT
Keeper
D6
H1
NFC
GPIO
INPUT
Keeper
D5
G1
NFC
GPIO
INPUT
Keeper
D4
G2
NFC
GPIO
INPUT
Keeper
D3
G3
NFC
GPIO
INPUT
Keeper
D2
E1
NFC
GPIO
INPUT
Keeper
D1
F3
NFC
GPIO
INPUT
Keeper
D0
E3
NFC
GPIO
INPUT
Keeper
LD02
Y7
LCDC
GPIO
OUTPUT
Low
LD12
V8
LCDC
GPIO
OUTPUT
Low
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Table 101. 17×17 mm Package i.MX25 Signal Contact Assignment (continued)
Contact Name
Contact
Assignment
Power Rail
I/O Buffer Type
Direction after
Reset1
Configuration
after Reset1
LD22
W7
LCDC
GPIO
OUTPUT
Low
LD32
U8
LCDC
GPIO
OUTPUT
Low
LD42
Y6
LCDC
GPIO
OUTPUT
Low
LD52
V7
LCDC
GPIO
OUTPUT
Low
LD62
W6
LCDC
GPIO
OUTPUT
Low
LD72
Y5
LCDC
GPIO
OUTPUT
Low
LD82
V6
LCDC
GPIO
OUTPUT
Low
LD92
W5
LCDC
GPIO
OUTPUT
Low
LD102
Y4
LCDC
GPIO
OUTPUT
Low
LD112
Y3
LCDC
GPIO
OUTPUT
Low
LD122
V5
LCDC
GPIO
OUTPUT
Low
LD132
W4
LCDC
GPIO
OUTPUT
Low
LD142
V4
LCDC
GPIO
OUTPUT
Low
LD152
W3
LCDC
GPIO
OUTPUT
Low
HSYNC2
U7
LCDC
GPIO
OUTPUT
Low
VSYNC2
U6
LCDC
GPIO
OUTPUT
Low
LSCLK2
U5
LCDC
GPIO
OUTPUT
Low
OE_ACD2
V3
LCDC
GPIO
OUTPUT
Low
CONTRAST
U4
LCDC
GPIO
OUTPUT
Low
PWM2
W2
LCDC
GPIO
INPUT
100 KΩ Pull-Down
CSI_D2
F18
CSI
GPIO
INPUT
Keeper
CSI_D3
E19
CSI
GPIO
INPUT
Keeper
CSI_D4
F19
CSI
GPIO
INPUT
Keeper
CSI_D5
G18
CSI
GPIO
INPUT
Keeper
CSI_D6
E20
CSI
GPIO
INPUT
Keeper
CSI_D7
E18
CSI
GPIO
INPUT
Keeper
CSI_D8
G19
CSI
GPIO
INPUT
Keeper
CSI_D9
F20
CSI
GPIO
INPUT
Keeper
CSI_MCLK2
H18
CSI
GPIO
OUTPUT
Low
CSI_VSYNC2
G20
CSI
GPIO
INPUT
Keeper
CSI_HSYNC2
H19
CSI
GPIO
INPUT
Keeper
CSI_PIXCLK2
H20
CSI
GPIO
INPUT
Keeper
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9
130
Freescale Semiconductor
Table 101. 17×17 mm Package i.MX25 Signal Contact Assignment (continued)
Contact Name
Contact
Assignment
Power Rail
I/O Buffer Type
Direction after
Reset1
Configuration
after Reset1
I2C1_CLK
F17
CSI
GPIO
INPUT
100 KΩ Pull-Up
I2C1_DAT
G17
CSI
GPIO
INPUT
100 KΩ Pull-Up
CSPI1_MOSI
T4
MISC
GPIO
INPUT
100 KΩ Pull-Up
CSPI1_MISO
W1
MISC
GPIO
OUTPUT
Low
CSPI1_SS0
R4
MISC
GPIO
INPUT
100 KΩ Pull-Up
CSPI1_SS1
V2
MISC
GPIO
INPUT
100 KΩ Pull-Up
CSPI1_SCLK
U3
MISC
GPIO
INPUT
100 KΩ Pull-Up
CSPI1_RDY
V1
MISC
GPIO
INPUT
100 KΩ Pull-Up
UART1_RXD
U2
MISC
GPIO
INPUT
100 KΩ Pull-Up
UART1_TXD
U1
MISC
GPIO
OUTPUT
High
UART1_RTS
T3
MISC
GPIO
INPUT
100 KΩ Pull-Up
UART1_CTS
T2
MISC
GPIO
OUTPUT
High
UART2_RXD
P4
MISC
GPIO
INPUT
100 KΩ Pull-Up
UART2_TXD
T1
MISC
GPIO
OUTPUT
High
UART2_RTS
R3
MISC
GPIO
INPUT
100 KΩ Pull-Up
UART2_CTS
R2
MISC
GPIO
INPUT
-
SD1_CMD
K20
SDIO
GPIO
INPUT
47 KΩ Pull-Up
SD1_CLK
M20
SDIO
GPIO
OUTPUT
High
SD1_DATA0
L20
SDIO
GPIO
INPUT
47 KΩ Pull-Up
SD1_DATA1
N20
SDIO
GPIO
INPUT
47 KΩ Pull-Up
SD1_DATA2
M19
SDIO
GPIO
INPUT
47 KΩ Pull-Up
SD1_DATA3
J20
SDIO
GPIO
INPUT
47 KΩ Pull-Up
KPP_ROW0
N4
MISC
GPIO
INPUT
100 KΩ Pull-Up
KPP_ROW1
R1
MISC
GPIO
INPUT
100 KΩ Pull-Up
KPP_ROW2
P3
MISC
GPIO
INPUT
100 KΩ Pull-Up
KPP_ROW3
P2
MISC
GPIO
INPUT
100 KΩ Pull-Up
KPP_COL0
P1
MISC
GPIO
INPUT
100 KΩ Pull-Up
KPP_COL1
N3
MISC
GPIO
INPUT
100 KΩ Pull-Up
KPP_COL2
N2
MISC
GPIO
INPUT
100 KΩ Pull-Up
KPP_COL3
N1
MISC
GPIO
INPUT
100 KΩ Pull-Up
FEC_MDC
L1
MISC
GPIO
OUTPUT
Low
FEC_MDIO
L2
MISC
GPIO
INPUT
22 KΩ Pull-Up
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9
Freescale Semiconductor
131
Table 101. 17×17 mm Package i.MX25 Signal Contact Assignment (continued)
Contact Name
Contact
Assignment
Power Rail
I/O Buffer Type
Direction after
Reset1
Configuration
after Reset1
FEC_TDATA0
L3
MISC
GPIO
OUTPUT
High
FEC_TDATA1
J4
MISC
GPIO
OUTPUT
High
FEC_TX_EN
M2
MISC
GPIO
OUTPUT
Low
FEC_RDATA0
M1
MISC
GPIO
INPUT
100 KΩ Pull-Down
FEC_RDATA1
M4
MISC
GPIO
INPUT
100 KΩ Pull-Down
FEC_RX_DV
M3
MISC
GPIO
INPUT
100 KΩ Pull-Down
FEC_TX_CLK
L4
MISC
GPIO
INPUT
100 KΩ Pull-Down
RTCK
W10
JTAG
GPIO
OUTPUT
Low
TCK
V10
JTAG
GPIO
INPUT
100 KΩ Pull-Down
TMS
Y9
JTAG
GPIO
INPUT
47 KΩ Pull-Up
TDI
W9
JTAG
GPIO
INPUT
47 KΩ Pull-Up
TDO
Y8
JTAG
GPIO
INPUT
-
TRSTB
V9
JTAG
GPIO
INPUT
47 KΩ Pull-Up
DE_B
W8
JTAG
GPIO
INPUT
47 KΩ Pull-Up
SJC_MOD
U9
JTAG
GPIO
INPUT
100 KΩ Pull-Up
USBPHY1_VBU
S
K17
USBPHY1
ANALOG
ANALOG
-
USBPHY1_DP
L18
USBPHY1
ANALOG
ANALOG
-
USBPHY1_DM
K18
USBPHY1
ANALOG
ANALOG
-
USBPHY1_UID
J18
USBPHY1
ANALOG
ANALOG
-
USBPHY1_RRE
F
L17
USBPHY1_BIAS
ANALOG
ANALOG
-
USBPHY2_DM
Y19
USBPHY2
ANALOG
ANALOG
-
USBPHY2_DP
Y18
USBPHY2
ANALOG
ANALOG
-
GPIO_A
N19
CRM
GPIO
INPUT
-
GPIO_B
N18
CRM
GPIO
INPUT
100 KΩ Pull-Down
GPIO_C
P17
CRM
GPIO
INPUT
100 KΩ Pull-Down
GPIO_D
P19
CRM
GPIO
INPUT
-
GPIO_E
P18
CRM
GPIO
INPUT
100 KΩ Pull-Up
GPIO_F
R19
CRM
GPIO
INPUT
-
EXT_ARMCLK
R20
CRM
GPIO
INPUT
-
UPLL_BYPCLK
U20
CRM
GPIO
INPUT
-
VSTBY_REQ
R18
CRM
GPIO
OUTPUT
Low
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9
132
Freescale Semiconductor
Table 101. 17×17 mm Package i.MX25 Signal Contact Assignment (continued)
Contact Name
Contact
Assignment
Power Rail
I/O Buffer Type
Direction after
Reset1
Configuration
after Reset1
VSTBY_ACK3
T20
CRM
GPIO
OUTPUT
Low
POWER_FAIL
T19
CRM
GPIO
INPUT
100 KΩ Pull-Down
RESET_B
T18
CRM
GPIO
INPUT
100 KΩ Pull-Up
POR_B
U19
CRM
GPIO
INPUT
100 KΩ Pull-Up
CLKO
V20
CRM
GPIO
OUTPUT
Low
BOOT_MODE02
V19
CRM
GPIO
INPUT
100 KΩ Pull-Down
BOOT_MODE12
W20
CRM
GPIO
INPUT
100 KΩ Pull-Down
CLK_SEL
W19
CRM
GPIO
INPUT
100 KΩ Pull-Down
TEST_MODE
V18
CRM
GPIO
INPUT
100 KΩ Pull-Down
OSC24M_EXTAL
Y15
OSC24M
ANALOG
ANALOG
-
OSC24M_XTAL
Y16
OSC24M
ANALOG
ANALOG
-
OSC32K_EXTAL
Y11
DRYICE
ANALOG
ANALOG
-
OSC32K_XTAL
Y10
DRYICE
ANALOG
ANALOG
-
TAMPER_A
N10
DRYICE
ANALOG
ANALOG
-
TAMPER_B
N11
DRYICE
ANALOG
ANALOG
-
MESH_C
P11
DRYICE
ANALOG
ANALOG
-
MESH_D
P12
DRYICE
ANALOG
ANALOG
-
OSC_BYP
Y12
DRYICE
ANALOG
ANALOG
-
XP
V14
ADC
ANALOG
ANALOG
-
XN
U13
ADC
ANALOG
ANALOG
-
YP
V13
ADC
ANALOG
ANALOG
-
YN
W12
ADC
ANALOG
ANALOG
-
WIPER
U14
ADC
ANALOG
ANALOG
-
INAUX0
U11
ADC
ANALOG
ANALOG
-
INAUX1
V12
ADC
ANALOG
ANALOG
-
INAUX2
U12
ADC
ANALOG
ANALOG
-
1
The state immediately after reset and before ROM firmware or software has executed.
During power-on reset this port acts as input for fuse override signal.
3 During power-on reset this port acts as output for diagnostic signal.
2
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9
Freescale Semiconductor
133
Table 102 lists the 17×17 mm package i.MX25 no connect contact assignments.
Table 102. 17×17 mm Package i.MX25 No Connect Contact Assignments
Signal Name
Contact Assignment
NC_BGA_B20
B20
NC_BGA_E17
E17
NC_BGA_H17
H17
NC_BGA_J19
J19
NC_BGA_M18
M18
NC_BGA_P20
P20
NC_BGA_U15
U15
NC_BGA_U16
U16
NC_BGA_V15
V15
NC_BGA_V16
V16
NC_BGA_V17
V17
NC_BGA_W14
W14
NC_BGA_Y2
Y2
NC_BGA_Y14
Y14
NC_BGA_Y17
Y17
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9
134
Freescale Semiconductor
Freescale Semiconductor
A8
A13
A11
CSI_D7
CSI_D3
CSI_D6
CSI_D2
CSI_D4
CSI_D9
CSI_D5
CSI_D8
CSI_HSYNC
CSI_PIXCLK CSI_VSYNC
NC_BGA_J19
SD1_DATA3
A12
MA10
CSI_MCLK
I2C1_CLK NC_BGA_E17
RAS
SD1
DQM0
QGND
SD11
SD12
DQM1
A21
A16
EB1
RW
CS0
NFRB
NFRE_B
C
A4
A6
A9
A2
CAS
SDCKE0 SDCKE1
SD3
SD4
SD6
QGND
SD9
SD14
BCLK
A18
OE
CS4
CS5
CS1
NF_CE0
D9
D
USBPHY1_UID
I2C1_DAT
QGND
QGND
QGND
QGND
QGND
USBPHY1_VSSA_BIAS NC_BGA_H17
QGND
QGND
NVCC_EMI2
QGND
QGND
QGND
NVCC_EMI2 NVCC_EMI2
NVCC_CSI
QGND
QGND
QGND
NVCC_EMI2 NVCC_EMI2
NVCC_CSI
QGND
QGND
QVDD
QGND
QGND
QGND
QGND
QGND
QGND
QGND
QGND
QGND
QGND
QGND
NVCC_EMI1
QGND
QGND
NVCC_EMI2 NVCC_EMI2
QGND
QGND
NVCC_EMI1 NVCC_EMI1
QVDD
QVDD
QGND
QGND
NVCC_EMI1 NVCC_EMI1
QGND
QGND
QGND
QGND
QGND
NVCC_EMI1
NFCLE
NFALE
NFWE_B
NFWP_B
FEC_TDATA1
QGND
D0
D1
D3
D12
D7
QGND
D8
D10
D4
D13
D15
NVCC_EMI1 NVCC_EMI1
D2
D11
D5
D6
D14
NVCC_EMI1
E
F
G
H
J
NC_BGA_B20
A7
A3
A1
CS2
SDBA0
SDCLK
SD2
SDQS0
QGND
SD10
SD8
SDQS1
A24
A20
A17
A15
EB0
ECB
LBA
B
13
12
11
10
9
8
7
6
5
4
3
2
1
QGND
A5
A0
CS3
SDBA1
SDWE
20
19
18
17
16
15
SDCLK_B 14
SD5
SD0
QGND
SD7
SD13
SD15
A25
A23
A22
A19
A14
A10
QGND
A
4.4
i.MX25 17x17 Package Ball Map
Table 103 shows the i.MX25 17×17 package ball map.
Table 103. i.MX25 17×17 Package Ball Map
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9
135
136
CSPI1_SS0
QGND
CSPI1_MOSI
QGND
QGND
UART2_RXD
KPP_ROW2
MESH_C
MESH_D
QGND
QGND
QGND
QGND
GPIO_C
GPIO_E
GPIO_D
QGND
QGND
QGND
QGND
QGND
QGND
QGND
NVCC_SDIO
VSTBY_REQ
GPIO_F
QGND
QGND
QGND
QGND
QGND
QGND
QGND
FUSE_VDD
RESET_B
POWER_FAIL
VSTBY_ACK EXT_ARMCLK NC_BGA_P20
BAT_VDD
QVDD
QGND
QGND
QVDD
QGND
QGND
NVCC_LCDC NVCC_LCDC
UART2_RTS
UART1_RTS
KPP_ROW3
QGND
UART2_CTS
UART1_CTS
KPP_COL0
NVCC_LCDC NVCC_LCDC
KPP_ROW1
UART2_TXD
P
QGND
R
T
UPLL_GND
QGND
QGND
QGND
QGND
QGND
QGND
QGND
QGND
QVDD
QVDD
QVDD
FEC_RDATA1
FEC_RX_DV
FEC_TX_EN
FEC_RDATA0
M
UPLL_VDD
QGND
QGND
QGND
QGND
QGND
QGND
QGND
NVCC_NFC
NVCC_NFC
NVCC_NFC
QGND
FEC_TX_CLK
FEC_TDATA0
FEC_MDIO
FEC_MDC
L
SD1_DATA1
GPIO_A
GPIO_B
SD1_CLK
SD1_DATA2
NC_BGA_M18
3
4
5
6
7
8
9
10
11
QGND
QGND
QGND
QVDD
QVDD
QGND
QGND
QGND
QGND
USBPHY1_DM
USBPHY1_VBUS
USBPHY1_VDDA
QGND
QGND
QGND
18
17
16
15
14
13
12
2
QGND
QVDD
1
QGND
K
SD1_DATA0
SD1_CMD
20
USBPHY1_VSSA USBPHY1_VDDA_BIAS 19
USBPHY1_DP
USBPHY1_UPLLVSS USBPHY1_UPLLVDD USBPHY1_RREF
QGND
QGND
NVCC_CRM
QGND
QGND
TAMPER_B
TAMPER_A
QGND
QVDD
NVCC_MISC
NVCC_MISC
NVCC_MISC
KPP_ROW0
KPP_COL1
KPP_COL2
KPP_COL3
N
Table 103. i.MX25 17×17 Package Ball Map (continued)
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9
Freescale Semiconductor
Freescale Semiconductor
2
3
4
5
6
7
8
9
10
11
UART1_TXD
UART1_RXD
CSPI1_SCLK
CONTRAST
LSCLK
VSYNC
HSYNC
LD3
SJC_MOD
NVCC_JTAG
INAUX0
CSPI1_RDY
CSPI1_SS1
OE_ACD
LD14
LD12
LD8
LD5
LD1
TRSTB
TCK
REF
CSPI1_MISO
PWM
LD15
LD13
LD9
LD6
LD2
DE_B
TDI
RTCK
QGND
NC_BGA_Y2
LD11
LD10
LD7
LD4
LD0
TDO
TMS
OSC32K_XTAL
13
14
XN
WIPER
YP
XP
NVCC_ADC
NC_BGA_W14
NGND_ADC
NC_BGA_Y14
18
19
MPLL_VDD
POR_B
USBPHY2_VSS NC_BGA_V17
USBPHY2_VDD TEST_MODE
BOOT_MODE0
CLKO
CLK_SEL
BOOT_MODE1
NC_BGA_Y17
USBPHY2_DP
USBPHY2_DM
QGND
UPLL_BYPCLK 20
17
MPLL_GND
OSC24M_VDD
OSC24M_XTAL
NC_BGA_V16 NC_BGA_U16 16
OSC24M_EXTAL OSC24M_GND NC_BGA_V15 NC_BGA_U15 15
12
INAUX2
INAUX1
YN
OSC_BYP
OSC32K_EXTAL NVCC_DRYICE
1
U
V
W
Y
Table 103. i.MX25 17×17 Package Ball Map (continued)
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9
137
4.5
347 MAPBGA—Case 12 x 12 mm, 0.5 mm Pitch
Figure 99 shows the 12×12 mm i.MX25 production package. The following notes apply to Figure 99:
• All dimensions in millimeters.Dimensioning and tolerancing per ASME Y14.5M-1994.
• Maximum solder ball diameter measured parallel to datum A.
• Datum A, the seating plane, is determined by the spherical crowns of the solder balls.
• Parallelism measurement shall exclude any effect of mark on package’s top surface.
Figure 99. 12×12 mm i.MX25 Production Package
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9
138
Freescale Semiconductor
4.6
Ground, Power, Sense, and Reference Contact Assignments
Case 12x12 mm, 0.5 mm Pitch
Table 104 shows the 12×12 mm package ground, power, sense, and reference contact assignment.
Table 104. 12x12 mm Package Ground, Power Sense, and Reference Contact Assignments
Contact Name
Contact Assignment
BATT_VDD
AA10
FUSE_VDD
P18
MPLL_GND
V17
MPLL_VDD
W19
NGND_ADC
N15
NVCC_ADC
P15
NVCC_CRM
P16
NVCC_CSI
J15, J16
NVCC_DRYICE1
R14
NVCC_EMI1
G8, G9, G10, H8, H9, H10
NVCC_EMI2
E15, F15, G15, G16, H15, H16
NVCC_JTAG
W10
NVCC_LCDC
R8, R9, T8
NVCC_MISC
P7, P8, R7, T7
NVCC_NFC
J7, J8, K7, K8
NVCC_SDIO
N19
OSC24M_GND
T15
OSC24M_VDD
V15
QGND
A1, A22, B2, B14, B21, E18, F13, F14, F18, G6, G11, G12, G14, H11, H12, H14, J12, K10, K11, K12,
K13, L7, L8, L9, L10, L11, L12, L13, L14, L15, L16, M7, M8, M9, M10, M11, M12, M13, M14, M15,
M16, N10, N11, N12, N13, P11, P12, R11, R12, R18, T5, T6, T11, T12, T18, V18, V19, W2, W9, Y21,
AA2, AA21, AB1, AB18, AB21, AB22, J11
QVDD
G7, G13, H7, H13, H18, J18, N7, N8, R10, R15, R16, T9, T10, V10,
REF
AA14
UPLL_GND
N16
UPLL_VDD
M18
USBPHY1_UPLLVDD
L21
USBPHY1_UPLLVSS
M19
USBPHY1_VDDA
K15, K16
USBPHY1_VDDA_BIAS L22
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9
Freescale Semiconductor
139
Table 104. 12x12 mm Package Ground, Power Sense, and Reference Contact Assignments (continued)
Contact Name
USBPHY1_VSSA
Contact Assignment
K19
USBPHY1_VSSA_BIAS K18
1
USBPHY2_VDD
T16
USBPHY2_VSS
W16
NVCC_DRYICE is a supply output. An external capacitor no less than 4 µF must be connected to it. A 4.7 µF capacitor is
recommended.
4.7
Signal Contact Assignments—12 x 12 mm, 0.5 mm Pitch
Table 105 lists the 12×12 mm package i.MX25 signal contact assignments.
Table 105. 12x12 mm Package i.MX25 Signal Contact Assignment
Contact Name
Contact
Assignment
Power Rail
I/O Buffer Type
Direction after
Reset1
Configuration
after Reset1
A0
A20
EMI2
DDR
OUTPUT
Low
A1
A19
EMI2
DDR
OUTPUT
Low
A2
B18
EMI2
DDR
OUTPUT
Low
A3
D17
EMI2
DDR
OUTPUT
Low
A4
A21
EMI2
DDR
OUTPUT
Low
A5
B19
EMI2
DDR
OUTPUT
Low
A6
D18
EMI2
DDR
OUTPUT
Low
A7
B20
EMI2
DDR
OUTPUT
Low
A8
E19
EMI2
DDR
OUTPUT
Low
A9
D19
EMI2
DDR
OUTPUT
Low
A10
B5
EMI1
DDR
OUTPUT
Low
MA10
E17
EMI2
DDR
OUTPUT
Low
A11
C21
EMI2
DDR
OUTPUT
Low
A12
B22
EMI2
DDR
OUTPUT
Low
A13
D21
EMI2
DDR
OUTPUT
Low
A14
A4
EMI1
DDR
OUTPUT
Low
A15
D6
EMI1
DDR
OUTPUT
Low
A16
A5
EMI1
DDR
OUTPUT
Low
A17
E6
EMI1
DDR
OUTPUT
Low
A18
A6
EMI1
DDR
OUTPUT
Low
A19
E7
EMI1
DDR
OUTPUT
Low
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9
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Freescale Semiconductor
Table 105. 12x12 mm Package i.MX25 Signal Contact Assignment (continued)
Contact Name
Contact
Assignment
Power Rail
I/O Buffer Type
Direction after
Reset1
Configuration
after Reset1
A20
B6
EMI1
DDR
OUTPUT
Low
A21
D7
EMI1
DDR
OUTPUT
Low
A22
A7
EMI1
DDR
OUTPUT
Low
A23
E9
EMI1
DDR
OUTPUT
Low
A24
B7
EMI1
DDR
OUTPUT
Low
A25
D8
EMI1
DDR
OUTPUT
Low
SD0
A13
EMI1
DDR
INPUT
Keeper
SD1
D12
EMI1
DDR
INPUT
Keeper
SD2
B12
EMI1
DDR
INPUT
Keeper
SD3
A14
EMI1
DDR
INPUT
Keeper
SD4
B13
EMI1
DDR
INPUT
Keeper
SD5
A15
EMI1
DDR
INPUT
Keeper
SD6
B11
EMI1
DDR
INPUT
Keeper
SD7
A12
EMI1
DDR
INPUT
Keeper
SD8
D10
EMI1
DDR
INPUT
Keeper
SD9
A10
EMI1
DDR
INPUT
Keeper
SD10
A11
EMI1
DDR
INPUT
Keeper
SD11
B10
EMI1
DDR
INPUT
Keeper
SD12
B9
EMI1
DDR
INPUT
Keeper
SD13
E11
EMI1
DDR
INPUT
Keeper
SD14
B8
EMI1
DDR
INPUT
Keeper
SD15
D9
EMI1
DDR
INPUT
Keeper
SDBA1
D16
EMI2
DDR
OUTPUT
Low
SDBA0
A17
EMI2
DDR
OUTPUT
Low
DQM0
D11
EMI1
DDR
OUTPUT
High
DQM1
A9
EMI1
DDR
OUTPUT
High
RAS
D15
EMI2
DDR
OUTPUT
High
CAS
B16
EMI2
DDR
OUTPUT
High
SDWE
B15
EMI2
DDR
OUTPUT
High
SDCKE0
A16
EMI2
DDR
OUTPUT
High
SDCKE1
F16
EMI2
DDR
OUTPUT
High
SDCLK
D13
EMI2
DDR
OUTPUT
Low
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9
Freescale Semiconductor
141
Table 105. 12x12 mm Package i.MX25 Signal Contact Assignment (continued)
Contact Name
Contact
Assignment
Power Rail
I/O Buffer Type
Direction after
Reset1
Configuration
after Reset1
SDCLK_B
D14
EMI2
DDR
OUTPUT
High
SDQS0
E14
EMI2
DDR
INPUT
Keeper
SDQS1
E12
EMI2
DDR
INPUT
Keeper
EB0
A2
EMI1
DDR
OUTPUT
High
EB1
B4
EMI1
DDR
OUTPUT
High
OE
A3
EMI1
DDR
OUTPUT
High
CS0
C2
EMI1
DDR
OUTPUT
High
CS1
D4
EMI1
DDR
OUTPUT
High
CS2
B17
EMI2
DDR
OUTPUT
High
CS3
A18
EMI2
DDR
OUTPUT
High
CS4
E5
EMI1
GPIO
OUTPUT
High
CS5
D2
EMI1
GPIO
OUTPUT
High
NF_CE0
F4
NFC
GPIO
OUTPUT
High
ECB
B1
EMI1
GPIO
INPUT
100 KΩ Pull-Up
LBA
B3
EMI1
DDR
OUTPUT
High
BCLK
A8
EMI1
DDR
OUTPUT
Low
RW
D5
EMI1
DDR
OUTPUT
High
NFWE_B
E1
NFC
GPIO
OUTPUT
High
NFRE_B
C1
NFC
GPIO
OUTPUT
High
NFALE
E2
NFC
GPIO
OUTPUT
Low
NFCLE
D1
NFC
GPIO
OUTPUT
Low
NFWP_B
G4
NFC
GPIO
OUTPUT
High
NFRB
G5
NFC
GPIO
INPUT
100 KΩ Pull-Up
D15
K2
NFC
GPIO
INPUT
Keeper
D14
K4
NFC
GPIO
INPUT
Keeper
D13
J2
NFC
GPIO
INPUT
Keeper
D12
J4
NFC
GPIO
INPUT
Keeper
D11
K5
NFC
GPIO
INPUT
-
D10
H4
NFC
GPIO
INPUT
Keeper
D9
H5
NFC
GPIO
INPUT
Keeper
D8
G2
NFC
GPIO
INPUT
Keeper
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9
142
Freescale Semiconductor
Table 105. 12x12 mm Package i.MX25 Signal Contact Assignment (continued)
Contact Name
Contact
Assignment
Power Rail
I/O Buffer Type
Direction after
Reset1
Configuration
after Reset1
D7
L1
NFC
GPIO
INPUT
Keeper
D6
K1
NFC
GPIO
INPUT
Keeper
D5
J1
NFC
GPIO
INPUT
Keeper
D4
H2
NFC
GPIO
INPUT
Keeper
D3
H1
NFC
GPIO
INPUT
Keeper
D2
G1
NFC
GPIO
INPUT
Keeper
D1
F1
NFC
GPIO
INPUT
Keeper
D0
F2
NFC
GPIO
INPUT
Keeper
LD02
AB10
LCDC
GPIO
OUTPUT
Low
LD12
W8
LCDC
GPIO
OUTPUT
Low
LD22
AB9
LCDC
GPIO
OUTPUT
Low
LD32
AA9
LCDC
GPIO
OUTPUT
Low
LD42
AB8
LCDC
GPIO
OUTPUT
Low
LD52
AA8
LCDC
GPIO
OUTPUT
Low
LD62
AB7
LCDC
GPIO
OUTPUT
Low
LD72
AA7
LCDC
GPIO
OUTPUT
Low
LD82
AB6
LCDC
GPIO
OUTPUT
Low
LD92
AA6
LCDC
GPIO
OUTPUT
Low
LD102
AB5
LCDC
GPIO
OUTPUT
Low
LD112
W7
LCDC
GPIO
OUTPUT
Low
LD122
AB4
LCDC
GPIO
OUTPUT
Low
LD132
W6
LCDC
GPIO
OUTPUT
Low
LD142
AB3
LCDC
GPIO
OUTPUT
Low
LD152
AA5
LCDC
GPIO
OUTPUT
Low
HSYNC2
AA4
LCDC
GPIO
OUTPUT
Low
VSYNC2
W5
LCDC
GPIO
OUTPUT
Low
LSCLK2
AB2
LCDC
GPIO
OUTPUT
Low
OE_ACD2
AA3
LCDC
GPIO
OUTPUT
Low
CONTRAST
Y2
LCDC
GPIO
OUTPUT
Low
PWM 2
W4
LCDC
GPIO
INPUT
100 KΩ Pull-Down
CSI_D2
C22
CSI
GPIO
INPUT
Keeper
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9
Freescale Semiconductor
143
Table 105. 12x12 mm Package i.MX25 Signal Contact Assignment (continued)
Contact Name
Contact
Assignment
Power Rail
I/O Buffer Type
Direction after
Reset1
Configuration
after Reset1
CSI_D3
F19
CSI
GPIO
INPUT
Keeper
CSI_D4
E21
CSI
GPIO
INPUT
Keeper
CSI_D5
G19
CSI
GPIO
INPUT
Keeper
CSI_D6
D22
CSI
GPIO
INPUT
Keeper
CSI_D7
F21
CSI
GPIO
INPUT
Keeper
CSI_D8
E22
CSI
GPIO
INPUT
Keeper
CSI_D9
H19
CSI
GPIO
INPUT
Keeper
CSI_MCLK 2
F22
CSI
GPIO
OUTPUT
Low
CSI_VSYNC2
G21
CSI
GPIO
INPUT
Keeper
CSI_HSYNC2
G22
CSI
GPIO
INPUT
Keeper
CSI_PIXCLK2
J19
CSI
GPIO
INPUT
Keeper
I2C1_CLK
H22
CSI
GPIO
INPUT
100 KΩ Pull-Up
I2C1_DAT
H21
CSI
GPIO
INPUT
100 KΩ Pull-Up
CSPI1_MOSI
AA1
MISC
GPIO
INPUT
100 KΩ Pull-Up
CSPI1_MISO
V4
MISC
GPIO
OUTPUT
Low
CSPI1_SS0
V2
MISC
GPIO
INPUT
100 KΩ Pull-Up
CSPI1_SS1
U4
MISC
GPIO
INPUT
100 KΩ Pull-Up
CSPI1_SCLK
Y1
MISC
GPIO
INPUT
100 KΩ Pull-Up
CSPI1_RDY
U5
MISC
GPIO
INPUT
100 KΩ Pull-Up
UART1_RXD
U2
MISC
GPIO
INPUT
100 KΩ Pull-Up
UART1_TXD
V6
MISC
GPIO
OUTPUT
High
UART1_RTS
W1
MISC
GPIO
INPUT
100 KΩ Pull-Up
UART1_CTS
R5
MISC
GPIO
OUTPUT
High
UART2_RXD
V1
MISC
GPIO
INPUT
100 KΩ Pull-Up
UART2_TXD
T4
MISC
GPIO
OUTPUT
High
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9
144
Freescale Semiconductor
Table 105. 12x12 mm Package i.MX25 Signal Contact Assignment (continued)
Contact Name
Contact
Assignment
Power Rail
I/O Buffer Type
Direction after
Reset1
Configuration
after Reset1
UART2_RTS
T2
MISC
GPIO
INPUT
100 KΩ Pull-Up
UART2_CTS
P5
MISC
GPIO
INPUT
-
SD1_CMD
N22
SDIO
GPIO
INPUT
47 KΩ Pull-Up
SD1_CLK
N21
SDIO
GPIO
OUTPUT
High
SD1_DATA0
P22
SDIO
GPIO
INPUT
47 KΩ Pull-Up
SD1_DATA1
R22
SDIO
GPIO
INPUT
47 KΩ Pull-Up
SD1_DATA2
M22
SDIO
GPIO
INPUT
47 KΩ Pull-Up
SD1_DATA3
M21
SDIO
GPIO
INPUT
47 KΩ Pull-Up
KPP_ROW0
R2
MISC
GPIO
INPUT
100 KΩ Pull-Up
KPP_ROW1
R4
MISC
GPIO
INPUT
100 KΩ Pull-Up
KPP_ROW2
U1
MISC
GPIO
INPUT
100 KΩ Pull-Up
KPP_ROW3
P4
MISC
GPIO
INPUT
100 KΩ Pull-Up
KPP_COL0
T1
MISC
GPIO
INPUT
100 KΩ Pull-Up
KPP_COL1
N5
MISC
GPIO
INPUT
100 KΩ Pull-Up
KPP_COL2
P2
MISC
GPIO
INPUT
100 KΩ Pull-Up
KPP_COL3
N4
MISC
GPIO
INPUT
100 KΩ Pull-Up
FEC_MDC
P1
MISC
GPIO
OUTPUT
Low
FEC_MDIO
M2
MISC
GPIO
INPUT
22 KΩ Pull-Up
FEC_TDATA0
L2
MISC
GPIO
OUTPUT
High
FEC_TDATA1
M1
MISC
GPIO
OUTPUT
High
FEC_TX_EN
R1
MISC
GPIO
OUTPUT
Low
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9
Freescale Semiconductor
145
Table 105. 12x12 mm Package i.MX25 Signal Contact Assignment (continued)
Contact Name
Contact
Assignment
Power Rail
I/O Buffer Type
Direction after
Reset1
Configuration
after Reset1
FEC_RDATA0
M4
MISC
GPIO
INPUT
100 KΩ Pull-Down
FEC_RDATA1
N2
MISC
GPIO
INPUT
100 KΩ Pull-Down
FEC_RX_DV
L5
MISC
GPIO
INPUT
100 KΩ Pull-Down
FEC_TX_CLK
N1
MISC
GPIO
INPUT
100 KΩ Pull-Down
RTCK
W13
JTAG
GPIO
OUTPUT
Low
TCK
AA13
JTAG
GPIO
INPUT
100 KΩ Pull-Down
TMS
AA12
JTAG
GPIO
INPUT
47 KΩ Pull-Up
TDI
W12
JTAG
GPIO
INPUT
47 KΩ Pull-Up
TDO
AA11
JTAG
GPIO
INPUT
-
TRSTB
AB14
JTAG
GPIO
INPUT
47 KΩ Pull-Up
DE_B
W11
JTAG
GPIO
INPUT
47 KΩ Pull-Up
SJC_MOD
AB11
JTAG
GPIO
INPUT
100 KΩ Pull-Up
USBPHY1_VBUS
K22
USBPHY1
ANALOG
ANALOG
-
USBPHY1_DP
K21
USBPHY1
ANALOG
ANALOG
-
USBPHY1_DM
J21
USBPHY1
ANALOG
ANALOG
-
USBPHY1_UID
J22
USBPHY1
ANALOG
ANALOG
-
USBPHY1_RREF
L19
USBPHY1_BIAS
ANALOG
ANALOG
-
USBPHY2_DM
W18
USBPHY2
ANALOG
ANALOG
-
USBPHY2_DP
W17
USBPHY2
ANALOG
ANALOG
-
GPIO_A
T22
CRM
GPIO
INPUT
-
GPIO_B
P21
CRM
GPIO
INPUT
100 KΩ Pull-Down
GPIO_C
U22
CRM
GPIO
INPUT
100 KΩ Pull-Down
GPIO_D
P19
CRM
GPIO
INPUT
-
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9
146
Freescale Semiconductor
Table 105. 12x12 mm Package i.MX25 Signal Contact Assignment (continued)
Contact Name
Contact
Assignment
Power Rail
I/O Buffer Type
Direction after
Reset1
Configuration
after Reset1
GPIO_E
R21
CRM
GPIO
INPUT
100 KΩ Pull-Up
GPIO_F
R19
CRM
GPIO
INPUT
-
EXT_ARMCLK
V22
CRM
GPIO
INPUT
-
UPLL_BYPCLK
U21
CRM
GPIO
INPUT
-
VSTBY_REQ
T21
CRM
GPIO
OUTPUT
Low
VSTBY_ACK 3
W22
CRM
GPIO
OUTPUT
Low
POWER_FAIL
T19
CRM
GPIO
INPUT
100 KΩ Pull-Down
RESET_B
U19
CRM
GPIO
INPUT
100 KΩ Pull-Up
POR_B
V21
CRM
GPIO
INPUT
100 KΩ Pull-Up
CLKO
Y22
CRM
GPIO
OUTPUT
Low
2
BOOT_MODE0
AA22
CRM
GPIO
INPUT
100 KΩ Pull-Down
BOOT_MODE12
W21
CRM
GPIO
INPUT
100 KΩ Pull-Down
CLK_SEL
AA20
CRM
GPIO
INPUT
100 KΩ Pull-Down
TEST_MODE
AA19
CRM
GPIO
INPUT
100 KΩ Pull-Down
OSC24M_EXTAL
AB19
OSC24M
ANALOG
ANALOG
-
OSC24M_XTAL
AB20
OSC24M
ANALOG
ANALOG
-
OSC32K_EXTAL
AB13
DRYICE
ANALOG
ANALOG
-
OSC32K_XTAL
AB12
DRYICE
ANALOG
ANALOG
-
TAMPER_A
V11
DRYICE
ANALOG
ANALOG
-
TAMPER_B
V13
DRYICE
ANALOG
ANALOG
-
MESH_C
T13
DRYICE
ANALOG
ANALOG
-
MESH_D
R13
DRYICE
ANALOG
ANALOG
-
OSC_BYP
AB15
DRYICE
ANALOG
ANALOG
-
XP
AA18
ADC
ANALOG
ANALOG
-
XN
AA16
ADC
ANALOG
ANALOG
-
YP
AB17
ADC
ANALOG
ANALOG
-
YN
W15
ADC
ANALOG
ANALOG
-
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9
Freescale Semiconductor
147
Table 105. 12x12 mm Package i.MX25 Signal Contact Assignment (continued)
Contact Name
Contact
Assignment
Power Rail
I/O Buffer Type
Direction after
Reset1
Configuration
after Reset1
WIPER
AA17
ADC
ANALOG
ANALOG
-
INAUX0
AA15
ADC
ANALOG
ANALOG
-
INAUX1
W14
ADC
ANALOG
ANALOG
-
INAUX2
AB16
ADC
ANALOG
ANALOG
-
1
The state immediately after reset and before ROM firmware or software has executed.
During power-on reset this port acts as input for fuse override signal.
3
During power-on reset this port acts as output for diagnostic signal.
2
Table 106 lists the 12×12 mm package i.MX25 no connect contact assignments.
Table 106. 12×12 mm Package i.MX25 No Connect Contact Assignments
Signal Name
4.8
Contact Assignment
NC_BGA_E4
E4
NC_BGA_L4
L4
i.MX25 12x12 Package Ball Map
Table 107 shows the i.MX25 12×12 package ball map.
QGND 22
CS1_D2
CSI_D8
CSI_MCLK
CSI_D6
A12
21
A4
QGND
CSI_D4
CSI_D7
A11
A8
CSI_D3
A13
A0
A7
QGND
QGND
MA10
SDBA1
SDCKE1
SDQS0
A23
NVCC_EMI2 NVCC_EMI2
NF_CE0
20
A1
A5
A9
19
18
CS3
A2
A6
SDBA0 17
CS2
A3
CAS SDCKE0 16
15
SDWE
RAS
SD5
14
QGND
SDCLK_B
QGND
SD3
13
SD4
SDCLK
QGND
SD0
12
SD2
SD1
SDQS1
SD7
11
SD10
SD6
DQM0
SD13
10
SD11
SD8
SD9
9
DQM1
SD12
SD15
8
SD14
A25
BCLK
7
A24
A21
A19
A22
6
A20
A15
A17
A18
5
A10
RW
CS4
A16
4
A14
EB1
CS1
NC_BGA_E4
3
OE
LBA
2
EB0
QGND
CS5
NFALE
D0
CS0
QGND
NFCLE
NFWE_B
D1
NFRE_B ECB
D
E
F
C
B
A
1
Table 107. i.MX25 12×12 Package Ball Map
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9
148
Freescale Semiconductor
Freescale Semiconductor
KPP_COL1
QVDD
QVDD
UART2_CTS
NVCC_MISC
NVCC_MISC
SD1_CLK
SD1_CMD
SD1_DATA0
SD1_DATA2
SD1_DATA3
NVCC_SDIO USBPHY1_UPLLVSS
GPIO_B
GPIO_D
FUSE_VDD
UPLL_VDD
USBPHY1_VSSA
USBPHY1_DP
USBPHY1_VBUS
USBPHY1_UPLLVDD
USBPHY1_VDDA_BIAS
USBPHY1_VSSA_BIAS
USBPHY1_VDDA
USBPHY1_VDDA
QGND
QGND
QGND
QGND
NVCC_NFC
NVCC_NFC
USBPHY1_RREF
QGND
QGND
UPLL_GND
QGND
QGND
NVCC_CRM
QGND
QGND
NGND_ADC
QGND
QGND
QGND
NVCC_ADC
QGND
QGND
QGND
QGND
QGND
QGND
QGND
QGND
QGND
QGND
QGND
QGND
QGND
QGND
D11
FEC_RX_DV
QGND
D14
QGND
QGND
KPP_COL3
KPP_ROW3
D15
D6
K
NC_BGA_L4
FEC_TDATA0
FEC_MDIO
KPP_COL2 FEC_RDATA1
FEC_RDATA0
D7
FEC_TDATA1
FEC_TX_CLK
FEC_MDC
L
M
N
P
USBPHY1_UID
USBPHY1_DM
CSI_PIXCLK
QVDD
NVCC_CSI
NVCC_CSI
QGND
QGND
NVCC_NFC
NVCC_NFC
D12
D13
D5
J
7
6
QGND
QVDD
5
4
3
2
1
NFRB
NFWP_B
D8
D2
G
QGND
QVDD
QGND
QGND
14
13
12
11
I2C1_CLK
I2C1_DAT
CSI_D9
QVDD
20
19
CSI_HSYNC 22
CSI_VSYNC 21
CSI_D5
18
17
NVCC_EMI2 NVCC_EMI2 16
NVCC_EMI2 NVCC_EMI2 15
QGND
QVDD
QGND
QGND
NVCC_EMI1 NVCC_EMI1 10
NVCC_EMI1 NVCC_EMI1 9
NVCC_EMI1 NVCC_EMI1 8
QVDD
D9
D10
D4
D3
H
Table 107. i.MX25 12×12 Package Ball Map (continued)
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9
149
150
Y
LD13
LD11
LD1
QGND
NVCC_JTAG
DE_B
TDI
RTCK
INAUX1
LD9
LD7
LD5
LD3
BAT_VDD
TDO
TMS
TCK
REF
INAUX0
XN
WIPER
XP
LD8
LD6
LD4
LD2
LD0
SJC_MOD
OSC32K_XTAL
OSC32K_EXTAL
TRSTB
OSC_BYP
INAUX2
YP
QGND
CLK_SEL
QGND
BOOT_MODE0
OSC24M_XTAL
QGND
QGND
OSC24M_EXTAL TEST_MODE
VSYNC
LD15
LD10
VSTBY_ACK
CLKO
EXT_ARMCLK
POR_B
QGND
MPLL_VDD
BOOT_MODE1
QGND
USBPHY2_DM
QGND
MPLL_GND
OSC24M_VDD
TAMPER_B
TAMPER_A
QVDD
UART1_TXD
CSPI1_MISO
CSPI1_SS0
UART2_RXD
V
USBPHY2_DP
USBPHY2_VSS
YN
PWM
QGND
HSYNC
OE_ACD
LD14
CONTRAST
UART1_RTS
W
LD12
QGND
CSPI1_MOSI CSPI1_SCLK
AA
LSCLK
QGND
AB
GPIO_C
UPLL_BYPCLK
RESET_B
CSPi1_RDY
CSPI1_SS1
UART1_RXD
KPP_ROW2
U
GPIO_A
VSTBY_REQ
POWER_FAIL
QGND
USBPHY2_VDD
OSC24M_GND
MESH_C
QGND
QGND
QVDD
QVDD
NVCC_LCDC
NVCC_MISC
QGND
QGND
UART2_TXD
UART2_RTS
KPP_COL0
T
13
12
11
10
9
8
7
6
5
4
3
2
1
SD1_DATA1
GPIO_E
GPIO_F
QGND
QVDD
QVDD
22
21
20
19
18
17
16
15
NVCC_DRYICE 14
MESH_D
QGND
QGND
QVDD
NVCC_LCDC
NVCC_LCDC
NVCC_MISC
UART1_CTS
KPP_ROW1
KPP_ROW0
FEC_TX_EN
R
Table 107. i.MX25 12×12 Package Ball Map (continued)
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9
Freescale Semiconductor
5
Revision History
Table 108 summarizes revisions to this document.
Table 108. Revision History
Rev.
Number
Date
Substantive Change(s)
Rev. 9
06/2012
• In Table 1, "Ordering Information," on page 3, removed exclamation marks from table rows and also
removed table footnote.
• In Table 3, "i.MX25 Digital and Analog Modules," on page 6, modified description of block mnemonic,
SIM.
• Updated Section 3.2.1, “Power-Up Sequence.”
• Updated Section 3.2.3, “SRTC DryIce Power-Up/Down Sequence.”
• In Figure 38 and Table 56:
—Removed “_B” and added an overbar to signal names, CSx_B, RW_B, OE_B, EBy_B, LBA_B,
ECB_B, and DTACK_B
—Changed CSx and CSy to CS[x] and CS[y], respectively
• In Table 57, "WEIM Asynchronous Timing Parameters Relative to Chip Select Table," on page 76:
—Changed WE and WEA to RW and RWA, respectively, for reference number, WE33
—Changed WE and WEN to RW and RWN, respectively, for reference number, WE34
—Changed RLBA, RLBN, and ADH to LBA, LBN, and LAH, respectively, for reference number, WE35A
—Changed RBEA to EBRA for reference number, WE37
—Changed RBEN to EBRN for reference number, WE38
—Changed WCSA to CSA for reference numbers, WE41 and WE41A
—Changed WLBA, WLBN, and ADH to LBA, LBN, and LAH, respectively, for reference number, WE41A
—Changed WBEA and WBEN to EBWA and EBWN, respectively, for reference numbers, WE45 and
WE46
• Updated the note after Table 57.
• In Table 99, "USB Timing Specification in Parallel Mode," on page 124, swapped the values of Min and
Max columns for IDs, US15 and US16.
Rev. 8
01/2011
• In Table 27, "AC Parameters for SDRAM I/O," on page 36, the frequency specification has been updated
to 133 MHz.
• In Table 28, "AC Parameters for SDRAM pbijtov18_33_ddr_clk I/O," on page 37, the frequency
specification has been updated to 133 MHz.
Rev. 7
12/2010
•
•
•
•
•
•
•
•
•
•
Updated the first paragraph of Section 3.2.3, “SRTC DryIce Power-Up/Down Sequence.”
Updated Table 4, "Signal Considerations," on page 9 for NVCC_DRYICE signal.
Updated the third note for Table 6, "DC Operating Conditions," on page 11.
Added Table 9, "Recommended External Crystal Specifications," on page 13.
Added Table 10, "Recommended External Reference Clock Specifications," on page 13.
Added a note for the line NVCC_DRYICE in Table 100, "17×17 mm Package Ground, Power Sense, and
Reference Contact Assignments," on page 125.
Updated Table 101, "17×17 mm Package i.MX25 Signal Contact Assignment," on page 127.
Added a note for the line NVCC_DRYICE in Table 104, "12x12 mm Package Ground, Power Sense, and
Reference Contact Assignments," on page 139.
Removed records for UPLL_BYPCLK, USBPHY2_DP, USBPHY1RREF, USBPHY1_DM,
USBPHY1_DP, USBPHY1_UID, USBPHY1_VBUS, and USBPHY2_DM contacts from Table 104,
"12x12 mm Package Ground, Power Sense, and Reference Contact Assignments," on page 139.
Updated Table 105, "12x12 mm Package i.MX25 Signal Contact Assignment," on page 140.
Rev. 6
09/2010
• Added Section 3.2.3, “SRTC DryIce Power-Up/Down Sequence.”
Rev. 5
08/2010
• Updated Table 56, "WEIM Bus Timing Parameters," on page 69 to include new row for WE19.
• Updated Table 6, "DC Operating Conditions," on page 11 to include Min and Max values of FUSE_VDD.
Rev. 4
06/2010
• Updated Table 1, “Ordering Information,” to include new part numbers.
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9
Freescale Semiconductor
151
Table 108. Revision History (continued)
Rev.
Number
Date
Rev. 3
03/2010
•
•
•
•
•
Rev. 2
12/2009
• Updated Table 1, “Ordering Information,” to include new part numbers.
Rev. 1
10/2009
•
•
•
•
•
•
•
•
•
•
Rev. 0
6/2009
Initial release.
Substantive Change(s)
Updated Table 1, “Ordering Information,” to include new part numbers.
Added Table 2, “i.MX25 Parts Functional Differences.”
Added Section 3.3, “Power Characteristics.”
Added Section 4.5, “347 MAPBGA—Case 12 x 12 mm, 0.5 mm Pitch.”
Added Section 4.6, “Ground, Power, Sense, and Reference Contact Assignments Case 12x12 mm, 0.5
mm Pitch.”
• Added Section 4.7, “Signal Contact Assignments—12 x 12 mm, 0.5 mm Pitch.
• Added Section 4.8, “i.MX25 12x12 Package Ball Map.”
Updated Table 1, “Ordering Information,” to include new part numbers.
Updated DRYICE description in Table 3, “i.MX25 Digital and Analog Modules.”
Updated REF signal description in Table 4, “Signal Considerations.”
Updated ESD damage immunity values in Table 5, “DC Absolute Maximum Ratings.”
Updated values in Table 13, “i.MX25 Power Mode Current Consumption.”
Added a note on timing in Section 3.2.1, “Power-Up Sequence.”
Added Table 14, “iMX25 Reduced Power Mode Current Consumption.”
Updated Table 55, “NFC Timing Parameters.”
Updated values in Table 56, “WEIM Bus Timing Parameters.
Updated Table 85, “Touchscreen ADC Electrical Specifications.”
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9
152
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