NIC NXED0402S15X501TRF Surface mount esd suppressor Datasheet

Surface Mount ESD Suppressor
NXED Series
FEATURES
• IDEAL FOR USB2.0, IEEE1394 & HDMI HIGH SPEED DATA APPLICATIONS
• SUPER LOW CAPACITANCE (AS LOW AS 0.05pF)
RoHS
Compliant
• EIA SIZES 0402 AND 0603
includes all homogeneous materials
• MEETS STANDARDS OF IEC 61000-4-2, LEVEL 4
*See Part Number System for Details
• Pb-FREE REFLOW PROCESS COMPATIBLE
SPECIFICATIONS
Case
Size
Part Number
Capacitance
(*1)
0402
0603
NXED0402S15X501TRF
NXED0603S15Y501TRF
0.05 ± 0.05pF
0.10 ± 0.1pF
Peak
Voltage
(*2)
500V max.
(350V typ.)
Clamping
Voltage
(*3)
Rated Voltage
Leakage
Current (max.)
(*4)
Temperature
Range
100V max.
15V max.
1μA
-55 ~ +125°C
1. Capacitance value shall be measured at 1MHz ±10%, 1V ± 0.2Vrms and 25 ± 2°C
2. Peak voltage shall be measured under the IEC61000-4-2, 8kV contact dischsrge ESD test conditions.
3. Clamping voltage shall be measured at 20ns after initiation of pulse and measured under IEC61000-4-2, 8kV
contact dischsrge ESD test conditions
4. Leakage current shall be measured at 15Vdc.
DIMENSIONS (mm)
Case
L
W
T
a
b
Size
0402 1.00 ± 0.05 0.50 ± 0.05 0.38 ± 0.05 0.20 ± 0.1 0.25±0.1
0603 1.60 ± 0.10 0.80 ± 0.10 0.50 ± 0.10 0.30 ± 0.2 0.30±0.2
PART NUMBERING SYSTEM
NXED 0603 S 15 X 501 TR F
RoHS Compliant
Tape & Reel
Peak Voltage
Capacitance Code: X = 0.05pF, Y = 0.1pF
Rated Voltage: 15Vdc
S = Standard
Case Size
L
Series
W
a
Structure
Substrate
Protective Coating
ESD Element
Inner Electrode
Barrier Plating
Termination Finish
a
T
b
Material
AI203
Resin
Composite metal powder and resin
Thin metal film
Nickel
100% Sn
Inner
electrode
b
ESD element
Barrier
Plating
Termination finish
Protective
coating
Substrate
NXED APPLICATIONS
ESD Protection of Data Lines
®
68
NIC COMPONENTS CORP.
www.niccomp.com
www.lowESR.com
www.RFpassives.com
www.SMTmagnetics.com
Surface Mount ESD Suppressor
NXED Series
RECOMMENDED LAND PATTERN
DIMENSIONS (mm)
TYPICAL ESD SUPPRESSION CHARACTERISTICS
400
0402
0603
300
250
Volts (V)
Reflow Soldering
A
B
C
0.5 ~ 0.6 0.40 ~ 0.55 0.4 ~ 0.6
0.7 ~ 0.9 0.55 ~ 0.75 0.8 ~ 1.0
Case Size
350
200
150
C
100
50
0
-50
B
-20 0 20 40 60 80 100 120 140 160180 200
Time (nano-seconds)
A
B
RECOMMENDED REFLOW
SOLDERING TEMPERATURE PROFILE
300
10 Sec.
Peak Temperature 260°C
260
230
200
180
Natural
Cooling
150
100
Time above 230°C
30 ~ 40 Sec.
60 ~ 120 Sec.
50
0
CARRIER TAPE DIMENSIONS (mm)
Type
A
B
NXED0402
0.70 ±0.05
1.20 ± 0.05
NXED0603
1.10 ± 0.10
1.90 ± 0.10
φ1.5+0.1/-0.0
W
F
E
8.0 ± 0.2
3.50 ±0.05
1.75 ±0.10
P1
T
Qty/Reel
2.00 ±0.05
0.60 ± 0.05
10,000
4.00 ± 0.05
0.70 ± 0.05
5,000
4.0 ±0.1
B
F
W
B
t
P1
A
C
REEL DIMENSIONS (mm)
A +0/-3
B ± 1.0
C min.
W ± 0.3
180
13
60
9.0
W
®
NIC COMPONENTS CORP.
A
www.niccomp.com
www.lowESR.com
www.RFpassives.com
www.SMTmagnetics.com
69
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