Ohmite AMC0805 Thick film automotive grade chip Datasheet

AMC Series
The Ohmite AMC series is compliant with AECQ200 specifications. These AEC-Q200 qualified
chips are ideal for automotive electronics and
other applications requiring great reliability. The
AMC chips are halogen free and RoHS compliant reducing the effects on the environment.
The wide range of chip sizes offered makes
choosing the AMC series even easier.
Thick Film Automotive Grade Chips
S e r i e s S p e c i f i ca t i o n s
Series
AMC0201
Power
1/20 W
Max.
Working
Voltage
25V
Max.
Overload
Voltage
50V
Dielec.
Withst.
Voltage
50V
AMC0402
1/16 W
50V
100V
100V
AMC0805
1/8 W
150V
300V
300V
AMC0603
AMC1206
AMC1210
AMC2010
AMC2512
1/10 W
1/4 W
1/2 W
3/4 W
1W
75V
200V
200V
200V
200V
150V
400V
500V
500V
500V
Resistance Range (by tolerance)
5.00%
1.00%
0.5%
1-10MΩ
1-10MΩ
150V
10-1MΩ
1-10MΩ
500V
1-22MΩ
500V
1-10MΩ
500V
10-1MΩ
500V
c h a r ac t e r i s t i cs
Construction
Marking layer
Overcoat
Protective glass
Resistive layer
Termination
(Ni/matte tin)
Ceramic substrate
12
Inner electrode
Derating
Percent Rated Power
100
80
-55°
70°
60
40
20
155°
0
-60 -40 -20 0 20 40 60 80 100 120 140 160
Ambient Temperature, °C
Soldering Conditions
300
270°
250
Temperature °C
Operating -55℃ to +155℃
Temp. Range
Rated The DC or AC (rms) continuous working voltage corVoltage responding to the rated power is determined by the
following formula:
V = √(PxR)
or max. working voltage whichever is less, where:
V = Cont. rated DC or AC (rms) working voltage (V)
P = Rated power (W)
R = Resistance value (Ω)
Temperature Resistance range
±200ppm
Coeff. of 1Ω-10Ω
±100ppm
Resistance 10Ω-10MΩ
10MΩ-22MΩ
±200ppm
24MΩ-100MΩ ±300ppm
ramp up
rate <3K/s
200
ramp down
rate <6K/s
190°
150
100
ramp up
rate <3K/s
50
0
Preheating
0
50
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100
150
Time (sec.)
200
250
AMC Series
Thick Film Automotive Grade Chips
p e r f o r ma n c e d a t a
Test Method
Procedure
MIL-STD-202
Method
At +25/–55°C and +25/+125°C
Temp. Coeff.
of Res. 304
High AEC-Q200 Test 3
Temperature MIL-STD-202 Method
Exposure 108
Moisture AEC-Q200 Test 6
Resistance MIL-STD-202 Method
106
Biased AEC-Q200 Test 7
Humidity MIL-STD-202 Method
103
Operational AEC-Q200 Test 8
Life MIL-STD-202 Method
108
Resistance AEC-Q200 Test 15
to Soldering MIL-STD-202 Method
Heat 210
Thermal AEC-Q200 Test 16
Shock MIL-STD-202 Method
107
ESD AEC-Q200 Test 17
AEC-Q200-002
Solderability AEC-Q200 Test 18
Wetting J-STD-002
Board Flex AEC-Q200 Test 21
AEC-Q200-005
Short Time IEC60115-1 4.13
Overload
FOS ASTM-B-809-95
Requirements
1,000 hours at TA = 155°C, unpowered
±(1.0%+0.05Ω) for D/F tol
±(2.0%+0.05Ω) for J tol
Each temperature / humidity cycle is defined at 8 hours (method 106F),
3 cycles / 24 hours for 10d. with 25°C / 65°C 95% R.H, without steps 7a
& 7b, unpowered. Parts mounted on test-boards, without condensation
on parts
1,000 hours; 85°C / 85% RH 10% of operating power
Measurement at 24±4 hours after test conclusion.
±(0.5%+0.05Ω) for D/F tol
±(2.0%+0.05Ω) for J tol
±(1.0%+0.05Ω) for D/F tol
±(3.0%+0.05Ω) for J tol
1,000 hours at 125°C, derated voltage applied for 1.5 hours on, 0.5 hour ±(1.0%+0.05Ω) for D/F tol
off, still-air required
±(3.0%+0.05Ω) for J tol
Condition B, no pre-heat of samples
Lead-free solder, 260±5°C, 10±1 seconds immersion time
Procedure 2 for SMD: devices fluxed and cleaned with isopropanol
-55/+125°C
Number of cycles is 300. Devices mounted
Maximum transfer time is 20 seconds. Dwell time is 15 minutes. Air – Air
Human Body Model, 1 pos. + 1 neg. discharges. 0201: 500V;
0402/0603: 1KV; 0805 and above: 2KV
±(0.5%+0.05Ω) for D/F tol
±(1.0%+0.05Ω) for J tol
No visible damage
±(0.5%+0.05Ω) for D/F tol
±(1.0%+0.05Ω) for J tol
Electrical Test not required Magnification 50X. SMD conditions: (a)
Method B, aging 4 hours at 155°C dry heat, dipping at 235±3°C for
5±0.5 seconds. (b) Method B, steam aging 8 hours, dipping at 215±3°C
for 5±0.5 seconds. (c) Method D, steam aging 8 hours, dipping at
260±3°C for 7±0.5 seconds.
Chips mounted on a 90mm glass epoxy resin PCB (FR4)
Bending for 0201/0402: 5 mm 0603/0805: 3 mm 1206 and above: 2 mm
Holding time: minimum 60 seconds
2.5 times of rated voltage or maximum overload voltage whichever is
less for 5 sec at room temperature
Well tinned (≥95% covered)
No visible damage
Sulfur (saturated vapor) 500 hours, 60±2℃, unpowered
±(3.0%+0.05 Ω)
±(1.0%+0.05Ω)
±(1.0%+0.05Ω) for D/F tol
±(2.0%+0.05Ω) for J tol
±(1.0%+0.05Ω)
dimensions
(mm)
l1
Size
L
W
H
l1
l2
0201
0.60 ±0.03
0.30 ±0.03
0.23 ±0.03
0.12 ±0.05
0.15 ±0.05
0603
1.60 ±0.10
0.80 ±0.10
0.45 ±0.10
0.25 ±0.15
0.25 ±0.15
0402
1.00 ±0.05
0805
2.00 ±0.10
1206
1210
l2
Reflow soldering footprint
Size
A
B
C
D
0201
1.0
0.3
0.35
0.4
0603 2.70 0.90 0.90 0.80
0.9
0.8
1206 4.70 2.50 1.10 1.70
1.0
1.5
0402
0603
0805
1.5
2.6
3.0
0.5
0.8
1.2
0.9
2.2
1.0
1206
4.2
2 .2
2010
6.1
3.3
1210
2512
4.2
8.0
0.5
4.4
1.4
1.8
0.6
1.2
2.4
2.4
3.0
A
3.10 ±0.10
2010
B
C
5.00 ±0.10
2512
Wave soldering footprint
Size
3.10 ±0.10
6.35 ±0.10
0.50 ±0.05
1.25 ±0.10
1.60 ±0.10
2.60 ±0.15
2.50 ±0.15
3.10 ±0.15
D
C
0805 3.30 1.30 1.00 1.30
1210 4.70 2.50 1.10 2.50
2010 6.40 4.20 1.10 2.50
2512 8.20 5.50 1.35 3.20
Note: Wave soldering not recommended for parts smaller
than 0603.
B
D
A
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Preferred
direction
during
wave
soldering
13
0.35 ±0.05
0.50 ±0.10
0.55 ±0.10
0.50 ±0.10
0.55 ±0.10
0.55 ±0.10
0.20 ±0.10
0.35 ±0.20
0.45 ±0.20
0.45 ±0.15
0.45 ±0.15
0.60 ±0.20
0.25 ±0.10
0.35 ±0.20
0.40 ±0.20
0.50 ±0.20
0.50 ±0.20
0.50 ±0.20
AMC Series
Thick Film Automotive Grade Chips
Ta p e a n d r e e l
(mm)
Paper/PE tape
T
D0
P2
P0
E
B0
A0
Embossed/blister tape
P1
P2
D0
W2
F W
Direction
of feed
P0
D
CN A
E
cover tape
B0
A0
F W
W1
D1
P1
T
Paper/PE tape
Size
A0
B0
W
E
F
P0
P1
P2
ØD0
T
Qty. per reel
(178mm)
0201
0.35 ±0.10
0.65 ±0.10
8.0 ±0.20
1.75 ±0.10
3.5 ±0.05
4.0 ±0.10
2.0 ±0.05
2.0 ±0.05
1.5 +0.1/-0
0.35 ±0.10*
10000
0603
1.10 ±0.10
1.90 ±0.10
8.0 ±0.20
1.75 ±0.10
3.5 ±0.05
4.0 ±0.10
4.0 ±0.05
2.0 ±0.05
1.5 +0.1/-0
0.70 ±0.10
5000
0402
0805
1206
1210
0.65 ±0.10
1.65 ±0.10
1.90 ±0.10
2.80 ±0.10
1.15 ±0.10
2.40 ±0.10
3.50 ±0.10
3.50 ±0.10
8.0 ±0.20
8.0 ±0.20
8.0 ±0.20
8.0 ±0.20
1.75 ±0.10
1.75 ±0.10
1.75 ±0.10
1.75 ±0.10
3.5 ±0.05
4.0 ±0.10
3.5 ±0.05
2.0 ±0.05
4.0 ±0.10
3.5 ±0.05
4.0 ±0.05
4.0 ±0.10
3.5 ±0.05
2.0 ±0.05
2.0 ±0.05
4.0 ±0.05
4.0 ±0.10
2.0 ±0.05
4.0 ±0.05
2.0 ±0.05
*For size 0201, the typical value of thickness (excluding cover tape) is 0.42 mm for paper tape and 0.33 mm for PE tape.
1.5 +0.1/-0
1.5 +0.1/-0
1.5 +0.1/-0
1.5 +0.1/-0
0.53 ±0.10
0.85 ±0.10
0.85 ±0.10
0.85 ±0.10
10000
5000
5000
5000
Embossed/blister tape
Size
A0
B0
W
E
F
P0
P1
P2
2010
2.80 ±0.20
5.40 ±0.20
12 ±0.20
1.75 ±0.10
5.5 ±0.05
4.0 ±0.10
4.0 ±0.10
2.0 ±0.05
2512
1210
3.50 ±0.20
2.80 ±0.10
6.70 ±0.20
3.50 ±0.10
12 ±0.20
8.0 ±0.20
1.75 ±0.10
1.75 ±0.10
5.5 ±0.05
3.5 ±0.05
4.0 ±0.10
4.0 ±0.10
4.0 ±0.10
4.0 ±0.05
2.0 ±0.05
2.0 ±0.05
ØD0
ØD1
T
1.5 +0.1/-0 1.50 +0.25/-0 1.0 ±0.10
1.5 +0.1/-0 1.50 +0.25/-0 1.0 ±0.10
1.5 +0.1/-0
0.85 ±0.10
Reel dimensions
Size
Qty./reel
8mm tape
12mm tape
A
N
C
D
W1
W2 max.
0201
10,000
7" (Ø178mm)
---
180 +0/-3
60 +1/-0
13.0 ±0.2
21.0 ±0.8
9.0 ±0.2
12.0 ±0.2
0402
0603/0805/1206
1210
2010
10,000
5,000
5,000
7" (Ø178mm)
4,000
---
4,000
2512
7" (Ø178mm)
7" (Ø178mm)
---
---
---
---
7" (Ø178mm)
7" (Ø178mm)
180 +0/-3
180 +0/-3
180 +0/-3
180 +0/-3
180 +0/-3
60 +1/-0
60 +1/-0
60 +1/-0
60 +1/-0
60 +1/-0
13.0 ±0.2
13.0 ±0.2
13.0 ±0.2
13.5 ±0.5
13.5 ±0.5
ORDERIN G INFOR M A TION
RoHS Compliant
AMC0603J1K00ET
Part series
Automotive
chip
Size
Tolerance
K = 10%
J = 5%
F = 1%
D = 0.5%
Ohms
5% in E24
values, 1% and
lower tolerances
available in E24
and E96 values
Tape
& reel
rev 9/17-1
14
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21.0 ±0.8
21.0 ±0.8
21.0 ±0.8
21.0 ±0.8
21.0 ±0.8
9.0 ±0.2
9.0 ±0.2
9.0 ±0.2
13.6 ±0.5
13.6 ±0.5
12.0 ±0.2
12.0 ±0.2
12.0 ±0.2
16.5 ±0.5
16.5 ±0.5
Qty/reel
4000
4000
5000
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