MITSUBISHI SEMICONDUCTORS <HVIC> M81734FP HIGH VOLTAGE HALF BRIDGE DRIVER DESCRIPTION M81734FP is high voltage Power MOSFET and IGBT module driver for half bridge applications. PIN CONFIGURATION (TOP VIEW) FEATURES ●FLOATING SUPPLY VOLTAGE ････････600V ●OUTPUT CURRENT ････････±500mA ●SINGLE INPUT TYPE ●INTERNALLY SET DEADTIME ●HALF BRIDGE DRIVER ●UNDERVOLTAGE LOCKOUT ●SOP-8 PACKAGE APPLICATIONS MOSFET and IGBT module inverter driver for PDP, HID lamp, refrigerator, air-conditioner, washing machine, AC servomotor and general purpose. Outline:8P2S BLOCK DIAGRAM May. 2010 MITSUBISHI SEMICONDUCTORS <HVIC> M81734FP HIGH VOLTAGE HALF BRIDGE DRIVER ABSOLUTE MAXIMUM RATINGS (Ta=25°C unless otherwise specified) Symbol VB VS VBS VHO VCC VLO Parameter Test conditions High Side Floating Supply Absolute Voltage High Side Floating Supply Offset Voltage High Side Floating Supply Voltage High Side Output Voltage Low Side Fixed Supply Voltage Low Side Output Voltage VIN Logic Input Voltage dVS/dt Pd Kθ Rth(j-c) Tj Topr Tstg TL Allowable Offset Voltage Transient Package Power Dissipation Linear Derating Factor Junction-Case Thermal Resistance Junction Temperature Operation Temperature Storage Temperature Solder Heatproof VBS=VB-VS Ta= 25 °C ,On Board Ta> 25 °C ,On Board RoHS Correspondence Ratings Unit -0.5 ~ 624 VB-24 ~ VB+0.5 -0.5 ~ 24 VS-0.5 ~ VB+0.5 -0.5 ~ 24 -0.5 ~ Vcc+0.5 V V V V V V -0.5 ~ Vcc+0.5 V ±50 0.55 4.4 50 -20 ~ +150 -20 ~ +125 -40 ~ +150 255:10s,max 260 V/ns W mW/°C °C/W ℃ ℃ ℃ ℃ RECOMMENDED OPERATING CONDITIONS Symbol VB VS VBS VHO VCC VLO VIN Parameter Test conditions High Side Floating Supply Absolute Voltage High Side Floating Supply Offset Voltage High Side Floating Supply Voltage High Side Output Voltage Low Side Fixed Supply Voltage Low Side Output Voltage Logic Input Voltage VB>10V VBS=VB-VS Min. VS+10 0 10 VS 10 0 0 Limits Typ. — — — — — — — Max. VS+20 500 20 VB 20 VCC VCC Unit V V V V V V V * For proper operation, the device should be used within the recommended conditions Package Power Dissipation Pd (W) THERMAL DERATING FACTOR CHARACTERISTIC (MAXIMUM RATING) 0.6 0.5 0.4 0.3 0.2 0.1 0 0 25 50 75 100 125 150 Temperature Ta(oC) May. 2010 2 MITSUBISHI SEMICONDUCTORS <HVIC> M81734FP HIGH VOLTAGE HALF BRIDGE DRIVER ELECTRICAL CHARACTERISTICS (Ta=25°C,VCC=VBS(=VB-VS)=15V, unless otherwise specified) Symbol IFS IBS ICC VOH VOL VIH VIL IIH IIL VBSuvr VBSuvh tVBSuv VCCuvr VCCuvh tVCCuv IOH IOL ROH Min. — — 0.2 13.8 — 1.6 0.8 — — 7.0 0.3 — 7.0 0.3 — Limits Typ.* — 0.2 0.5 14.4 — 2.2 1.55 15 — 8.4 0.5 7.5 8.4 0.5 7.5 Max. 1.0 0.5 0.75 — 0.1 2.7 2.1 45 1 9.8 — — 9.8 — — VO = 0V, PW < 10μs — -500 — mA VO = 15V, PW < 10μs — 500 — mA IO = -200mA, ROH = (VOH-VO)/IO — 30 — Ω IO = 200mA, ROL = VO/IO CL = 1000pF between HO-VS, LO-GND VIN = 0～3V — 12 — Ω 0.5 — 1.00 μs — 300 — — 6 — V ns 0.6 0.9 1.2 μs 0.1 0.15 0.25 μs — — — — 75 75 75 75 180 180 180 180 ns ns ns ns Parameter Floating Supply Leakage Current VBS Standby Current VCC Standby Current High Level Output Voltage Low Level Output Voltage High Level Input Threshold Voltage Low Level Input Threshold Voltage High Level Input Bias Current Low Level Input Bias Current VBS Supply UV Reset Voltage VBS Supply UV Hysteresis Voltage VBS Supply UV Filter Time VCC Supply UV Reset Voltage VCC Supply UV Hysteresis Voltage VCC Supply UV Filter Time Output High Level Short Circuit Pulsed Current Output Low Level Short Circuit Pulsed Current Output High Level On Resistance ROL Output Low Level On Resistance Dead Time LO Turn-Off to HO Turn-On & tDEAD HO Turn-Off to LO Turn-On VPonr Power On Reset Voltage tPonr(FIL) Power On Reset Filter Time tdLH Turn-On Propagation Delay tdHL Turn-Off Propagation Delay trH tfH trL tfL High Side Turn-On Rise Time High Side Turn-Off Fall Time Low Side Turn-On Rise Time Low Side Turn-Off Fall Time Test conditions VB = VS = 600V IN = 0V IN = 0V IO = 0mA, LO, HO IO = 0mA, LO, HO VIN = 3V VIN = 0V CL = 1000pF between HO-VS, LO-GND VIN = 0～3V CL = 1000pF between HO-VS , LO-GND VIN = 0～3V CL = 1000pF between HO-VS CL = 1000pF between HO-VS CL = 1000pF between LO-GND CL = 1000pF between LO-GND Unit μA mA mA V V V V μA μA V V μs V V μs * Typ. is not specified. INPUT/OUTPUT TIMING DIAGRAM May. 2010 3 MITSUBISHI SEMICONDUCTORS <HVIC> M81734FP HIGH VOLTAGE HALF BRIDGE DRIVER FUNCTION TIMING DIAGRAM 1. HO has positive logic with reference to IN. LO has negative logic with reference to IN. 2. Output signal (HO) is triggered by the edge of input signal. 3. Logic During UV(VCC, VBS) Error Error Signal HO LO UV error (VCC) HO is locked at “L” level as long as UV error for VCC is detected. After VCC UV reset level, the lock for HO is removed following an “L” state of the IN signal, and then HO responds to the input. (VCC>VBS) LO is locked at “L” level as long as UV error for VCC is detected. After VCC exceeds VCC UV reset level, the lock for LO is removed and responds to IN signal. UV error (VBS) HO is locked at “L” level as long as UV error for VBS is detected. After VBS UV reset level, the lock for HO is removed following an “L” state of the IN signal, and then HO responds to the input. LO is independent of VBS to respond to IN. *IF UV error for VCC is detected when HO is in “H” level and the falling speed of VCC is exceeds 0.03V/μs, the off signal for HO might not be transmitted from low side to high side and then HO stays “H”. *If supply voltage drops lower than VPonr, output becomes “L” not after tVccuv or tVBSuv but after tPonr(FIL). May. 2010 4 MITSUBISHI SEMICONDUCTORS <HVIC> M81734FP HIGH VOLTAGE HALF BRIDGE DRIVER 4. Supply start up sequence Please start up VCC supply and VBS supply in that order, and, please shut down VBS supply and VCC supply in that order. Please start up VCC supply and VBS supply with gentle slope. If you start up supply with sharp slope, there is some possibility that HO or LO outputs “H” for a moment. If VCC supply is less than 10V(outside of RECOMMENDED OPERATING CONDITIONS), there is some possibility that output does not change in response to input. Please evaluate carefully about supply start up or restart after shut down in your application systems. PACKAGE OUTLINE May. 2010 5