FPF1107 / FPF1108 Advance Load Management Switch Features Description The FPF1107/08 are low RDS P-channel MOSFET load switches of the IntelliMAX™ family. Integrated slew-rate control prevents inrush current from glitch supply rails with capacitive loads common in power applications. 1.2V to 4V Input Voltage Operating Range Typical RDS(ON): - 35mΩ at VIN=3.3V - 55mΩ at VIN=1.8V - 85mΩ at VIN=1.2V The input voltage range operates from 1.2V to 4V to fulfill today's lowest ultra-portable device supply requirements. Switch control is by a logic input (ON-pin) capable of interfacing directly with low-voltage CMOS control signals and GPIOs in embedded processors. Slew Rate Control with tR: 130µs Output Discharge Function on FPF1108 Low <1µA Quiescent Current at VON=VIN ESD Protected: Above 4000V HBM, 2000V CDM GPIO/CMOS-Compatible Enable Circuitry Applications Mobile Devices and Smart Phones Portable Media Devices Digital Cameras Advanced Notebook, UMPC, MID Portable Medical Devices GPS and Navigation Equipment Ordering Information Part Number Switch Part Input Output ON Pin (Typical) Marking Buffer Discharge Activity At 1.8VIN tR Eco Status Package 4-Ball, Wafer-Level Chip-Scale Package (WLCSP), 1.0 x 1.0mm, 0.5mm Pitch FPF1107 QC 55mΩ CMOS NA Active HIGH 130µs Green FPF1108 QD 55mΩ CMOS 65Ω Active HIGH 130µs Green For Fairchild’s definition of Eco Status, please visit: http://www.fairchildsemi.com/company/green/rohs_green.html. © 2009 Fairchild Semiconductor Corporation FPF1107 / FPF1108 • Rev. 1.0.1 www.fairchildsemi.com FPF1107 / FPF1108 — Advance Load Management Switch November 2009 VIN CIN VOUT FPF1107/FPF1108 OFF ON ON To Load COUT GND Figure 1. Typical Application Notes: 1. CIN=1μF, X5R, 0603, for example Murata GRM185R60J105KE26 2. COUT=1μF, X5R, 0805, for example Murata GRM216R61A105KA01 Block Diagram FPF1107 / FPF1108 — Advance Load Management Switch Application Diagram FPF1107/8 Figure 2. Block Diagram (Output Discharge for FPF1108 Only) © 2009 Fairchild Semiconductor Corporation FPF1107 / FPF1108 • Rev. 1.0.1 www.fairchildsemi.com 2 Figure 3. 1 x 1mm WLCSP Bumps Facing Down VOUT A1 A2 VIN GND B1 B2 ON Figure 4. 1 x 1mm WLCSP Bumps Facing Up Pin Definitions Name Description A1 VOUT Switch Output A2 VIN B1 GND B2 ON A2 A1 VOUT ON B2 B1 GND Figure 6. Pin Assignments (Bottom View) Figure 5. Pin Assignments (Top View) Pin # VIN FPF1107 / FPF1108 — Advance Load Management Switch Pin Configurations Supply Input: Input to the Power Switch. Ground ON/OFF Control, Active HIGH © 2009 Fairchild Semiconductor Corporation FPF1107 / FPF1108 • Rev. 1.0.1 www.fairchildsemi.com 3 Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Symbol VIN Parameter VIN, VOUT, VON to GND Min. Max. Unit -0.3 4.2 V ISW Maximum Continuous Switch Current 1.2 A PD Power Dissipation at TA=25°C 1.0 W TSTG Storage Junction Temperature -65 +150 °C TA Operating Temperature Range -40 +85 °C ΘJA Thermal Resistance, Junction-to-Ambient ESD Electrostatic Discharge Capability 1S2P with 1 Thermal Via 95 1S2P without Thermal Via 187 Human Body Model, JESD22-A114 4 Charged Device Model, JESD22-C101 2 °C/W kV Recommended Operating Conditions The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend exceeding them or designing to Absolute Maximum Ratings. Symbol Parameter Min. Max. Unit VIN Supply Voltage 1.2 4.0 V TA Ambient Operating Temperature -40 +85 °C © 2009 Fairchild Semiconductor Corporation FPF1107 / FPF1108 • Rev. 1.0.1 FPF1107 / FPF1108 — Advance Load Management Switch Absolute Maximum Ratings www.fairchildsemi.com 4 Unless otherwise noted, VIN=1.2 to 4.0V, TA=-40 to +85°C, typical values are at VIN=3.3V and TA=25°C. Symbol Parameter Conditions Min. Typ. Max. Units 4.0 V Basic Operation VIN Supply Voltage 1.2 IQ(OFF) Off Supply Current VON=GND VOUT=Open, VIN=4V 1 μA ISD(OFF) Off Switch Current VON=GND VOUT=GND 1 μA IQ Quiescent Current IOUT=0mA, VON=VIN 1 IOUT=0mA, VON < VIN 3 RON On Resistance VIN=3.3V, IOUT=200mA, TA=25°C 35 50 VIN=1.8V, IOUT=200mA, TA=25°C 55 70 VIN=1.5V, IOUT=200mA, TA=25°C 70 VIN=1.2V, IOUT=200mA, TA=25°C mΩ 85 150 VIN=1.8V, IOUT=200mA, TA=85°C 65 100 65 110 (3) RPD Output Discharge RPULL DOWN VIN=3.3V, VON=0V, IFORCE=20mA, TA=25°C, FPF1108 VIH On Input Logic High Voltage VIN=1.2V to 4.0V VIL On Input Logic Low Voltage VIN=1.2V to 4.0V ION On Input Leakage VON=VIN or GND μA 1.1 Ω V -1 0.35 V 1 μA Dynamic Characteristics (4) tDON Turn-On Delay tR VOUT Rise Time tON Turn-On Time (4) (4,6) VIN=3.3V, RL=10Ω, CL=0.1µF, TA=25°C, FPF1107/8 (4) tDON Turn-On Delay (4) tR VOUT Rise Time tON Turn-On Time (4,6) VIN=3.3V, RL=500Ω, CL=0.1µF, TA=25°C, FPF1107/8 80 μs 130 μs 210 μs 70 95 FPF1107 / FPF1108 — Advance Load Management Switch Electrical Characteristics μs 95 120 μs 165 215 μs 2.0 2.5 μs FPF1107 (4) tDOFF Turn-Off Delay (4) tF VOUT Fall Time (4,7) tOFF Turn-Off tDOFF Turn-Off Delay VIN=3.3V, RL=10Ω, CL=0.1µF, TA=25°C (4) (4) tF VOUT Fall Time tOFF Turn-Off (4,7) VIN=3.3V, RL=500Ω, CL=0.1µF, TA=25°C 2.2 μs 4.2 μs 7.0 μs 110 μs 117 μs (5) FPF1108 tDOFF tF tOFF tDOFF tF tOFF (4) Turn-Off Delay (4) VOUT Fall Time Turn-Off (4,7) VIN=3.3V, RL=10Ω, CL=0.1µF, RPD=65Ω, TA=25°C (4) Turn-Off Delay (4) VOUT Fall Time Turn-Off (4,7) VIN=3.3V, RL=500Ω, CL=0.1µF, RPD=65Ω, TA=25°C 2.0 2.5 μs 1.9 μs 3.9 μs 2.5 μs 10.6 μs 13.1 μs Notes: 3. This parameter is guaranteed by design and characterization; not production tested. 4. tDON/tDOFF/tR/tF are defined in Figure 7. 5. Output discharge path is enabled during off. © 2009 Fairchild Semiconductor Corporation FPF1107 / FPF1108 • Rev. 1.0.1 www.fairchildsemi.com 5 90% VOUT 90% 10% 10% tR tF 3.3V 50% 50% VON 90% 10% VOUT tDOFF tDON Notes: 6. tON=tR + tDON. 7. tOFF=tF + tDOFF. © 2009 Fairchild Semiconductor Corporation FPF1107 / FPF1108 • Rev. 1.0.1 FPF1107 / FPF1108 — Advance Load Management Switch Timing Diagram Figure 7. Timing Diagram www.fairchildsemi.com 6 0.30 0 .2 5 V IN SH UTDOW N C U R RENT ( μA) V IN SH U T DO W N C U R R EN T ( μA ) VON = VOUT = 0V 0.25 0.20 VIN = 4.0V 0.15 VIN = 3.3V 0.10 VIN = 1.2V 0.05 0.00 -40 -15 10 35 60 VON = V OUT = 0V 0 .2 0 0 .1 5 0 .1 0 8 5 °C 0 .0 5 2 5 °C 85 1 .0 1 .5 TJ, JUNCTION TEMPERATURE (°C) 2 .5 3 .0 3 .5 4 .0 Figure 9. Shutdown Current vs. Supply Voltage 0.07 0.10 O FF SUPPLY CU RRENT ( μA) VON = 0V 0.09 O FF SU PPLY CUR RENT ( μA) 2 .0 S U PP L Y V O L T A G E (V ) Figure 8. Shutdown Current vs. Temperature 0.08 0.07 0.06 0.05 VIN = 4.0V 0.04 VIN = 3.3V 0.03 VIN = 1.2V 0.02 0.01 0.00 VON = 0V 0.06 0.05 0.04 0.03 85°C 0.02 -40°C 0.01 25°C 0.00 -40 -15 10 35 60 85 1.0 1.5 TJ, JUNCTION TEMPERATURE (°C) 3.0 3.5 4.0 0.40 VON = VIN 0.045 0.35 SUPPLY CURRENT ( μA) 0.040 0.035 0.030 0.025 VIN = 4.0V 0.015 2.5 Figure 11. Off Supply Current vs. Supply Voltage (FPF1107, VOUT is Floating) 0.050 0.020 2.0 SUPPLY VOLTAGE (V) Figure 10. Off Supply Current vs. Temperature (FPF1107, VOUT is Floating) SUPPLY CU RRENT ( μA) -4 0 °C 0 .0 0 FPF1107 / FPF1108 — Advance Load Management Switch Typical Performance Characteristics VIN = 3.3V VIN = 1.2V 0.010 VON = VIN 0.30 0.25 -40°C 0.20 0.15 0.10 25°C 0.05 0.005 85°C 0.00 0.000 -40 -15 10 35 60 1.0 85 Figure 12. Quiescent Current vs. Temperature (VON=VIN) © 2009 Fairchild Semiconductor Corporation FPF1107 / FPF1108 • Rev. 1.0.1 1.5 2.0 2.5 3.0 3.5 4.0 SUPPLY VOLTAGE (V) TJ, JUNCTION TEMPERATURE (°C) Figure 13. Quiescent Current vs. Supply Voltage www.fairchildsemi.com 7 3.00 2.50 VON = 0.75 x VIN 2.00 VIN = 4.0V S U P P LY C U R R E N T (µA) S U PP L Y C U R RE N T ( μA ) 2.50 2.00 1.50 VIN = 3.3V 1.00 0.50 +25°C 1.50 +85°C 1.00 -40°C 0.50 VIN = 1.2V 0.00 0.00 -40 -15 10 35 60 85 1.0 1.5 2.0 TJ, JUNCTION TEMPERATURE (°C) Figure 14. Quiescent Current vs. Temperature (VON=0.75 x VIN) 2.5 3.0 S U P P LY V O LTA G E (V ) 3.5 4.0 Figure 15. Quiescent Current vs. Supply Voltage at VON=1.2V 300 120 VON = VIN IOUT = 200mA VIN = 1.2V 100 ) VON=VIN IOUT=200mA 250 O N R E SIS TA N C E (m Ω ) Ω 200 80 150 60 VIN = 3.3V 100 40 FPF1107 / FPF1108 — Advance Load Management Switch Typical Performance Characteristics ON RESI STANCE (m 50 -40°C 0 0 -40 -15 10 25°C 85°C VIN = 4.0V 20 35 60 1.0 85 1.5 2.0 2.5 3.0 3.5 4.0 SUPPLY VOLTAGE (V) TJ, JUNCTION TEMPERATURE (°C) Figure 16. RON vs. Temperature Figure 17. RON vs. Supply Voltage V ON INPUT LO GIC VO L TAGE (V) 1.00 25°C 0.90 0.80 V IH 0.70 0.60 0.50 V IL 0.40 0.30 0.20 1.0 1.5 2.0 2.5 3.0 3.5 4.0 SUPPLY VOL TAGE (V) Figure 18. ON-Pin Threshold vs. VIN © 2009 Fairchild Semiconductor Corporation FPF1107 / FPF1108 • Rev. 1.0.1 www.fairchildsemi.com 8 t 1000 V IN = 3.3V C L = 0.1μ F R L = 10 Ω R O N /O F F D ELAY T IM E (µ s) RIS E/FA L L TIM E ( µ s) 100 0 10 0 10 t V IN = 3.3V C L = 0.1μF R L = 10 Ω tDON 100 10 F tDOFF 1 1 -40 -15 10 35 60 85 -40 -15 T J , JUN C T IO N T EM PERA T UR E (°C ) Figure 19. VOUT Rise and Fall Time vs. Temperature at RL=10Ω 35 60 V IN = 3.3V C L = 0.1μF R L = 500Ω 100 90 F V IN = 3.3V C L = 0.1μF R L = 500Ω 90 ON/OF F DELAY TIME (µ s) 110 t 85 Figure 20. VOUT Turn-On and Turn-Off Delay vs. Temperature at RL=10Ω 100 120 R IS E/FA L L TIM E ( µ s) 10 T J , JUNCTION TEMP ERATURE (°C) tR 80 70 60 80 tDON 70 60 50 40 30 20 tDOFF 10 50 FPF1107 / FPF1108 — Advance Load Management Switch Typical Performance Characteristics 0 -40 -15 10 35 60 85 -40 T J , JU N CTION TEMP ER ATU RE (°C) -15 10 35 60 85 T J , JU N CTION TEMPER ATU RE (°C) Figure 21. VOUT Rise and Fall Time vs. Temperature at RL=500Ω Figure 22. VOUT Turn-On and Turn-Off Delay vs. Temperature at RL=500Ω 1 60 1 40 R ISE / D ELAY T IM E [µs] 1 20 tR 1 00 80 60 t DON 40 20 10 1 00 O U T PU T LO AD [ 10 00 ] Figure 23. VOUT Turn-On and Turn-Off Delay vs. Output Load at VIN=3.3V © 2009 Fairchild Semiconductor Corporation FPF1107 / FPF1108 • Rev. 1.0.1 www.fairchildsemi.com 9 Figure 24. Turn-On Response (VIN=3.3V, CIN=1µF, COUT=0.1µF, RL=10Ω) Figure 25. Turn-Off Response (VIN=3.3V, CIN=1µF, COUT=0.1µF, RL=10Ω) Figure 26. Turn-On Response (VIN=3.3V, CIN=1µF, COUT=0.1µF, RL=500Ω) Figure 27. Turn-Off Response (FPF1107 – No Output Pull-Down Resistor) (VIN=3.3V, CIN=1µF, COUT=0.1µF, RL=500Ω) © 2009 Fairchild Semiconductor Corporation FPF1107 / FPF1108 • Rev. 1.0.1 FPF1107 / FPF1108 — Advance Load Management Switch Typical Performance Characteristics www.fairchildsemi.com 10 Input Capacitor Fall Time TM The IntelliMAX switch doesn’t require input capacitor. To reduce device inrush current effect, a 0.1µF ceramic capacitor, CIN, is recommended close to the VIN pin. A higher value of CIN can be used to further reduce the voltage drop experienced as the switch is turned on into a large capacitive load. Device output fall time can be calculated based on RC constant of external components as follows: tF = RL × CL × 2.2 (1) where tF is 90% to 10% fall time, RL is output load and CL is output capacitor. Output Capacitor The same equation works for a device with a pull-down output resistor, then RL is replaced by a parallel connected pull-down and external output resistor combination, as follows: TM The IntelliMAX switch works without an output capacitor. However, if parasitic board inductance forces VOUT below GND when switching off, a 0.1µF capacitor, COUT, should be placed between VOUT and GND. tF = R L × R PD × C L × 2. 2 R L + R PD (2) where tF is 90% to 10% fall time, RL is output load, RPD=65Ω is output pull-down resistor, and CL is the output capacitor. Resistive Output Load TM If resistive output load is missing, the IntelliMAX switch without pull-down output resistor is not discharging output voltage. Output voltage drop depends, in that case, mainly on external device leaks. © 2009 Fairchild Semiconductor Corporation FPF1107 / FPF1108 • Rev. 1.0.1 FPF1107 / FPF1108 — Advance Load Management Switch Application Information www.fairchildsemi.com 11 For best thermal performance and minimal inductance and parasitic effects, it is recommended to keep input and output traces short and capacitors as close to the device as possible. Below is a recommended layout for this device to achieve optimum performance. FPF1107 / FPF1108 — Advance Load Management Switch Recommended Land Pattern and Layout Figure 28. Recommended Land Pattern and Layout © 2009 Fairchild Semiconductor Corporation FPF1107 / FPF1108 • Rev. 1.0.1 www.fairchildsemi.com 12 FPF1107 / FPF1108 — Advance Load Management Switch Physical Dimensions 0.03 C E 2X F A PIN A1 AREA B 0.50 D 0.50 (Ø0.250) Cu Pad (Ø0.350) Solder Mask 0.03 C 2X TOP VIEW RECOMMENDED LAND PATTERN (NSMD PAD TYPE) 0.06 C 0.332±0.018 0.250±0.025 0.625 0.539 0.05 C C D SEATING PLANE SIDE VIEWS 0.005 0.50 C A B Ø0.315±0.025 4X B A 0.50 A. NO JEDEC REGISTRATION APPLIES. (Y)±0.018 F 1 2 NOTES: (X)±0.018 B. DIMENSIONS ARE IN MILLIMETERS. C. DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. D. DATUM C IS DEFINED BY THE SPHERICAL CROWNS OF THE BALLS. E. PACKAGE NOMINAL HEIGHT IS 582 MICRONS ±43 MICRONS (539-625 MICRONS). BOTTOM VIEW F. FOR DIMENSIONS D, E, X, AND Y SEE PRODUCT DATASHEET. G. DRAWING FILENAME: MKT-UC004ABrev2. Figure 29. 4 Ball, 1.0 x 1.0mm Wafer Level Chip Scale WLCSP Packaging Product-Specific Dimensions Product D E X Y FPF1107 960µm ± 30µm 960µm ± 30µm 0.230mm 0.230mm FPF1108 960um ± 30µm 960um ± 30µm 0.230mm 0.230mm Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/. © 2009 Fairchild Semiconductor Corporation FPF1107 / FPF1108 • Rev. 1.0.1 www.fairchildsemi.com 13 FPF1107 / FPF1108 — Advance Load Management Switch © 2009 Fairchild Semiconductor Corporation FPF1107 / FPF1108 • Rev. 1.0.1 www.fairchildsemi.com 14