Freescale MCF5271 Integrated microprocessor hardware specification Datasheet

Freescale Semiconductor
Hardware Specification
Document Number: MCF5271EC
Rev. 2, 08/2006
MCF5271 Integrated
Microprocessor
Hardware Specification
by: Microcontroller Division
The MCF5271 family is a highly integrated
implementation of the ColdFire® family of reduced
instruction set computing (RISC) microprocessors. This
document describes pertinent features and functions of
the MCF5271 family. The MCF5271 family includes the
MCF5271 and MCF5270 microprocessors. The
differences between these parts are summarized below in
Table 1. This document is written from the perspective of
the MCF5271 and unless otherwise noted, the
information applies also to the MCF5270.
The MCF5271 family combines low cost with high
integration on the popular version 2 ColdFire core with
over 144 (Dhrystone 2.1) MIPS at 150 MHz. Positioned
for applications requiring a cost-sensitive 32-bit
solution, the MCF5271 family features a 10/100 Ethernet
MAC and optional hardware encryption to ensure the
application can be connected and protected. In addition,
the MCF5271 family features an enhanced multiply
accumulate unit (eMAC), large on-chip memory (64
Kbytes SRAM, 8 Kbytes configurable cache), and a
32-bit SDR SDRAM memory controller.
© Freescale Semiconductor, Inc., 2006. All rights reserved.
Contents
1
2
3
4
5
6
7
8
9
MCF5271 Family Configurations . . . . . . . . . . . . . . . . . . . 2
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Signal Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Design Recommendations . . . . . . . . . . . . . . . . . . . . . . . 8
Mechanicals/Pinouts and Part Numbers . . . . . . . . . . . . 12
Preliminary Electrical Characteristics . . . . . . . . . . . . . . 17
Documentation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Document Revision History . . . . . . . . . . . . . . . . . . . . . . 38
MCF5271 Family Configurations
1
MCF5271 Family Configurations
Table 1. MCF5271 Family Configurations
Module
ColdFire V2 Core with EMAC and
Hardware Divide
MCF5270
MCF5271
x
x
System Clock
150 MHz
Performance (Dhrystone/2.1 MIPS)
Instruction/Data Cache
8 Kbytes
Static RAM (SRAM)
64 Kbytes
Interrupt Controllers (INTC)
2
2
Edge Port Module (EPORT)
x
x
External Interface Module (EIM)
x
x
4-channel Direct-Memory Access (DMA)
x
x
SDRAM Controller
x
x
Fast Ethernet Controller (FEC)
x
x
Hardware Encryption
—
x
Watchdog Timer (WDT)
x
x
Four Periodic Interrupt Timers (PIT)
x
x
32-bit DMA Timers
4
4
QSPI
x
x
UART(s)
3
3
I2C
x
x
General Purpose I/O Module (GPIO)
x
x
JTAG - IEEE 1149.1 Test Access Port
x
x
Package
2
144
160 QFP,
160 QFP,
196 MAPBGA 196 MAPBGA
Block Diagram
The superset device in the MCF5271 family comes in a 196 mold array plastic ball grid array (MAPBGA)
package. Figure shows a top-level block diagram of the MCF5271.
MCF5271 Integrated Microprocessor Hardware Specification, Rev. 2
2
Freescale Semiconductor
Block Diagram
SDRAMC
QSPI
EIM
I2C_SDA
CHIP
SELECTS
(To/From SRAM backdoor)
I2C_SCL
UnTXD
UnRXD
UnRTS
(To/From PADI)
FAST
ETHERNET
CONTROLLER
(FEC)
UART
0
UART
1
UART
2
INTC1
I2 C
UnCTS
DTnOUT
QSPI
SDRAMC
DTnIN
PADI – Pin Muxing
INTC0
Arbiter
EBI
FEC
D[31:0]
(To/From PADI)
4 CH DMA
DTIM
0
DTIM
1
DTIM
2
A[23:0]
DTIM
3
R/W
CS[3:0]
(To/From
PADI)
TA
TSIZ[1:0]
JTAG_EN
BDM
MUX
DREQ[2:0] DACK[2:0]
TEA
V2 ColdFire CPU
DIV
BS[3:0]
EMAC
JTAG
TAP
64 Kbytes
SRAM
(8Kx16)x4
Watchdog
Timer
MDHA
PORTS
(GPIO)
CIM
(To/From Arbiter)
SKHA
RNGA
8 Kbytes
CACHE
(1Kx32)x2
PLL
CLKGEN
PIT0
PIT1
PIT2
PIT3
(To/From INTC)
Edge
Port
Cryptography
Modules
MCF5271 Block Diagram
MCF5271 Integrated Microprocessor Hardware Specification, Rev. 2
Freescale Semiconductor
3
Features
3
Features
For a detailed feature list see the MCF5271 Reference Manual (MCF5271RM).
4
Signal Descriptions
This section describes signals that connect off chip, including a table of signal properties. For a more
detailed discussion of the MCF5271 signals, consult the MCF5271 Reference Manual (MCF5271RM).
4.1
Signal Properties
Table 2 lists all of the signals grouped by function. The “Dir” column is the direction for the primary
function of the pin. Refer to Section 6, “Mechanicals/Pinouts and Part Numbers,” for package diagrams.
NOTE
In this table and throughout this document a single signal within a group is
designated without square brackets (i.e., A24), while designations for
multiple signals within a group use brackets (i.e., A[23:21]) and is meant to
include all signals within the two bracketed numbers when these numbers
are separated by a colon.
NOTE
The primary functionality of a pin is not necessarily its default functionality.
Pins that are muxed with GPIO will default to their GPIO functionality.
Table 2. MCF5270 and MCF5271 Signal Information and Muxing
Signal Name
GPIO
Alternate 1 Alternate 2 Dir.1
MCF5270
MCF5271
160 QFP
MCF5270
MCF5271
196 MAPBGA
Reset
RESET
—
—
—
I
83
N13
RSTOUT
—
—
—
O
82
P13
Clock
EXTAL
—
—
—
I
86
M14
XTAL
—
—
—
O
85
N14
CLKOUT
—
—
—
O
89
K14
Mode Selection
CLKMOD[1:0]
—
—
—
I
20,21
G5,H5
RCON
—
—
—
I
79
K10
126, 125, 124
B11, C11, D11
External Memory Interface and Ports
A[23:21]
PADDR[7:5]
CS[6:4]
—
O
MCF5271 Integrated Microprocessor Hardware Specification, Rev. 2
4
Freescale Semiconductor
Signal Descriptions
Table 2. MCF5270 and MCF5271 Signal Information and Muxing (continued)
Alternate 1 Alternate 2 Dir.1
MCF5270
MCF5271
160 QFP
MCF5270
MCF5271
196 MAPBGA
Signal Name
GPIO
A[20:0]
—
—
—
O
D[31:16]
—
—
—
O
22:30, 33:39
G1, G2, H1, H2,
H3, H4, J1, J2,
J3, J4, K1, K2,
K3, K4, L1, L2
D[15:8]
PDATAH[7:0]
—
—
O
42:49
M1, N1, M2, N2,
P2, L3, M3, N3
D[7:0]
PDATAL[7:0]
—
—
O
50:52, 56:60
P3, M4, N4, P4,
L5, M5, N5, P5
BS[3:0]
PBS[7:4]
CAS[3:0]
—
O
143:140
B6, C6, D7, C7
OE
PBUSCTL7
—
—
O
62
N6
TA
PBUSCTL6
—
—
I
96
H11
TEA
PBUSCTL5
DREQ1
—
I
—
J14
R/W
PBUSCTL4
—
—
O
95
J13
TSIZ1
PBUSCTL3
DACK1
—
O
—
P6
TSIZ0
PBUSCTL2
DACK0
—
O
—
P7
TS
PBUSCTL1
DACK2
—
O
97
H13
TIP
PBUSCTL0
DREQ0
—
O
—
H12
123:115,
A12, B12, C12,
112:106, 102:98 A13, B13, B14,
C13, C14, D12,
D13, D14, E11,
E12, E13, E14,
F12, F13, F14,
G11, G12, G13
Chip Selects
CS[7:4]
PCS[7:4]
—
—
O
—
B9, A10, C10,
A11
CS[3:2]
PCS[3:2]
SD_CS[1:0]
—
O
132,131
A9, C9
CS1
PCS1
—
—
O
130
B10
CS0
—
—
—
O
129
D10
SDRAM Controller
SD_WE
PSDRAM5
—
—
O
92
K13
SD_SCAS
PSDRAM4
—
—
O
91
K12
SD_SRAS
PSDRAM3
—
—
O
90
K11
SD_CKE
PSDRAM2
—
—
O
—
E8
—
—
O
—
L12, L13
SD_CS[1:0] PSDRAM[1:0]
MCF5271 Integrated Microprocessor Hardware Specification, Rev. 2
Freescale Semiconductor
5
Signal Descriptions
Table 2. MCF5270 and MCF5271 Signal Information and Muxing (continued)
Signal Name
GPIO
Alternate 1 Alternate 2 Dir.1
MCF5270
MCF5271
160 QFP
MCF5270
MCF5271
196 MAPBGA
External Interrupts Port
IRQ[7:3]
PIRQ[7:3]
—
—
I
IRQ7=63
IRQ4=64
N7, M7, L7, P8,
N8
IRQ2
PIRQ2
DREQ2
—
I
—
M8
IRQ1
PIRQ1
—
—
I
65
L8
FEC
EMDC
PFECI2C3
I2C_SCL
U2TXD
O
151
D4
EMDIO
PFECI2C2
I2C_SDA
U2RXD
I/O
150
D5
ECOL
—
—
—
I
9
E2
ECRS
—
—
—
I
8
E1
ERXCLK
—
—
—
I
7
D1
ERXDV
—
—
—
I
6
D2
ERXD[3:0]
—
—
—
I
5:2
D3, C1, C2, B1
ERXER
—
—
—
O
159
B2
ETXCLK
—
—
—
I
158
A2
ETXEN
—
—
—
I
157
C3
ETXER
—
—
—
O
156
B3
ETXD[3:0]
—
—
—
O
155:152
A3, A4, C4, B4
I2C
I2C_SDA
PFECI2C1
—
—
I/O
—
J12
I2C_SCL
PFECI2C0
—
—
I/O
—
J11
—
—
DMA
DACK[2:0] and DREQ[2:0] do not have a dedicated bond
pads. Please refer to the following pins for muxing:
TS and DT2OUT for DACK2, TSIZ1and DT1OUT for DACK1,
TSIZ0 and DT0OUT for DACK0, IRQ2 and DT2IN for DREQ2,
TEA and DT1IN for DREQ1, and TIP and DT0IN for DREQ0.
QSPI
QSPI_CS1
PQSPI4
SD_CKE
—
O
139
B7
QSPI_CS0
PQSPI3
—
—
O
146
A6
QSPI_CLK
PQSPI2
I2C_SCL
—
O
147
C5
QSPI_DIN
PQSPI1
I2C_SDA
—
I
148
B5
QSPI_DOUT
PQSPI0
—
—
O
149
A5
MCF5271 Integrated Microprocessor Hardware Specification, Rev. 2
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Freescale Semiconductor
Signal Descriptions
Table 2. MCF5270 and MCF5271 Signal Information and Muxing (continued)
Signal Name
GPIO
Alternate 1 Alternate 2 Dir.1
MCF5270
MCF5271
160 QFP
MCF5270
MCF5271
196 MAPBGA
UARTs
U2TXD
PUARTH1
—
—
O
—
A8
U2RXD
PUARTH0
—
—
I
—
A7
U1CTS
PUARTL7
U2CTS
—
I
136
B8
U1RTS
PUARTL6
U2RTS
—
O
135
C8
U1TXD
PUARTL5
—
—
O
133
D9
U1RXD
PUARTL4
—
—
I
134
D8
U0CTS
PUARTL3
—
—
I
12
F3
U0RTS
PUARTL2
—
—
O
15
G3
U0TXD
PUARTL1
—
—
O
14
F1
U0RXD
PUARTL0
—
—
I
13
F2
DMA Timers
DT3IN
PTIMER7
U2CTS
QSPI_CS2
I
—
H14
DT3OUT
PTIMER6
U2RTS
QSPI_CS3
O
—
G14
DT2IN
PTIMER5
DREQ2
DT2OUT
I
66
M9
DT2OUT
PTIMER4
DACK2
—
O
—
L9
DT1IN
PTIMER3
DREQ1
DT1OUT
I
61
L6
DT1OUT
PTIMER2
DACK1
—
O
—
M6
DT0IN
PTIMER1
DREQ0
—
I
10
E4
DT0OUT
PTIMER0
DACK0
—
O
11
F4
BDM/JTAG2
DSCLK
—
TRST
—
O
70
N9
PSTCLK
—
TCLK
—
O
68
P9
BKPT
—
TMS
—
O
71
P10
DSI
—
TDI
—
I
73
M10
DSO
—
TDO
—
O
72
N10
JTAG_EN
—
—
—
I
78
K9
DDATA[3:0]
—
—
—
O
—
M12, N12, P12,
L11
PST[3:0]
—
—
—
O
77:74
M11, N11, P11,
L10
MCF5271 Integrated Microprocessor Hardware Specification, Rev. 2
Freescale Semiconductor
7
Design Recommendations
Table 2. MCF5270 and MCF5271 Signal Information and Muxing (continued)
Signal Name
GPIO
Alternate 1 Alternate 2 Dir.1
MCF5270
MCF5271
160 QFP
MCF5270
MCF5271
196 MAPBGA
F5
Test
TEST
—
—
—
I
19
PLL_TEST
—
—
—
I
—
Power Supplies
VDDPLL
—
—
—
I
87
M13
VSSPLL
—
—
—
I
84
L14
OVDD
—
—
—
I
1, 18, 32, 41, 55, E5, E7, E10, F7,
69, 81, 94, 105, F9, G6, G8, H7,
114, 128, 138, H8, H9, J6, J8,
145
J10, K5, K6, K8
VSS
—
—
—
I
17, 31, 40, 54, A1, A14, E6, E9,
67, 80, 88, 93, F6, F8, F10, G7,
104, 113, 127, G9, H6, J5, J7,
137, 144, 160 J9, K7, P1, P14
VDD
—
—
—
I
16, 53, 103
D6, F11, G4, L4
1
Refers to pin’s primary function. All pins which are configurable for GPIO have a pullup enabled
in GPIO mode with the exception of PBUSCTL[7], PBUSCTL[4:0], PADDR, PBS, PSDRAM.
2
If JTAG_EN is asserted, these pins default to Alternate 1 (JTAG) functionality. The GPIO module
is not responsible for assigning these pins.
5
Design Recommendations
5.1
Layout
•
•
•
5.2
•
Use a 4-layer printed circuit board with the VDD and GND pins connected directly to the power
and ground planes for the MCF5271.
See application note AN1259, System Design and Layout Techniques for Noise Reduction in
Processor-Based Systems.
Match the PC layout trace width and routing to match trace length to operating frequency and board
impedance. Add termination (series or therein) to the traces to dampen reflections. Increase the
PCB impedance (if possible) keeping the trace lengths balanced and short. Then do cross-talk
analysis to separate traces with significant parallelism or are otherwise "noisy". Use 6 mils trace
and separation. Clocks get extra separation and more precise balancing.
Power Supply
33 µF, 0.1 µF, and 0.01 µF across each power supply
MCF5271 Integrated Microprocessor Hardware Specification, Rev. 2
8
Freescale Semiconductor
Design Recommendations
5.2.1
Supply Voltage Sequencing and Separation Cautions
DC Power Supply Voltage
Figure 1 shows situations in sequencing the I/O VDD (OVDD), PLL VDD (PLLVDD), and Core VDD (VDD).
OVDD is specified relative to VDD.
OVDD
3.3V
Supplies Stable
2.5V
1.5V
VDD, PLLVDD
1
2
0
Time
Notes:
1. VDD should not exceed OVDD or PLLVDD by more than 0.4 V
at any time, including power-up.
2. Recommended that VDD/PLLVDD should track OVDD up to
0.9 V, then separate for completion of ramps.
3. Input voltage must not be greater than the supply voltage (OVDD,
VDD, or PLLVDD) by more than 0.5 V at any time, including during power-up.
4. Use 1 ms or slower rise time for all supplies.
Figure 1. Supply Voltage Sequencing and Separation Cautions
5.2.1.1
Power Up Sequence
If OVDD are powered up with VDD at 0 V, then the sense circuits in the I/O pads will cause all pad output
drivers connected to the OVDD to be in a high impedance state. There is no limit on how long after OVDD
powers up before VDD must powered up. VDD should not lead the OVDD or PLLVDD by more than 0.4 V
during power ramp-up, or there will be high current in the internal ESD protection diodes. The rise times
on the power supplies should be slower than 1 µs to avoid turning on the internal ESD protection clamp
diodes.
The recommended power up sequence is as follows:
1. Use 1 µs or slower rise time for all supplies.
2. VDD/PLLVDD and OVDD should track up to 0.9 V, then separate for the completion of ramps with
OVDD going to the higher external voltages. One way to accomplish this is to use a low drop-out
voltage regulator.
5.2.1.2
Power Down Sequence
If VDD/PLLVDD are powered down first, then sense circuits in the I/O pads will cause all output drivers to
be in a high impedance state. There is no limit on how long after VDD and PLLVDD power down before
OVDD must power down. VDD should not lag OVDD or PLLVDD going low by more than 0.4 V during
MCF5271 Integrated Microprocessor Hardware Specification, Rev. 2
Freescale Semiconductor
9
Design Recommendations
power down or there will be undesired high current in the ESD protection diodes. There are no
requirements for the fall times of the power supplies.
The recommended power down sequence is as follows:
1. Drop VDD/PLLVDD to 0 V.
2. Drop OVDD supplies.
5.3
•
•
Decoupling
Place the decoupling caps as close to the pins as possible, but they can be outside the footprint of
the package.
0.1 µF and 0.01 µF at each supply input
5.4
•
Buffering
Use bus buffers on all data/address lines for all off-board accesses and for all on-board accesses
when excessive loading is expected. See Section 7, “Preliminary Electrical Characteristics.”
5.5
•
Pull-up Recommendations
Use external pull-up resistors on unused inputs. See pin table.
5.6
•
•
•
•
•
•
•
•
Clocking Recommendations
Use a multi-layer board with a separate ground plane.
Place the crystal and all other associated components as close to the EXTAL and XTAL (oscillator
pins) as possible.
Do not run a high frequency trace around crystal circuit.
Ensure that the ground for the bypass capacitors is connected to a solid ground trace.
Tie the ground trace to the ground pin nearest EXTAL and XTAL. This prevents large loop currents
in the vicinity of the crystal.
Tie the ground pin to the most solid ground in the system.
Do not connect the trace that connects the oscillator and the ground plane to any other circuit
element. This tends to make the oscillator unstable.
Tie XTAL to ground when an external oscillator is clocking the device.
5.7
5.7.1
5.7.1.1
Interface Recommendations
SDRAM Controller
SDRAM Controller Signals in Synchronous Mode
Table 3 shows the behavior of SDRAM signals in synchronous mode.
MCF5271 Integrated Microprocessor Hardware Specification, Rev. 2
10
Freescale Semiconductor
Design Recommendations
Table 3. Synchronous DRAM Signal Connections
Signal
Description
SD_SRAS
Synchronous row address strobe. Indicates a valid SDRAM row address is present and can be
latched by the SDRAM. SD_SRAS should be connected to the corresponding SDRAM
SD_SRAS. Do not confuse SD_SRAS with the DRAM controller’s SD_CS[1:0], which should not
be interfaced to the SDRAM SD_SRAS signals.
SD_SCAS
Synchronous column address strobe. Indicates a valid column address is present and can be
latched by the SDRAM. SD_SCAS should be connected to the corresponding signal labeled
SD_SCAS on the SDRAM.
DRAMW
DRAM read/write. Asserted for write operations and negated for read operations.
SD_CS[1:0]
Row address strobe. Select each memory block of SDRAMs connected to the MCF5271. One
SD_CS signal selects one SDRAM block and connects to the corresponding CS signals.
SD_CKE
Synchronous DRAM clock enable. Connected directly to the CKE (clock enable) signal of
SDRAMs. Enables and disables the clock internal to SDRAM. When CKE is low, memory can
enter a power-down mode where operations are suspended or they can enter self-refresh mode.
SD_CKE functionality is controlled by DCR[COC]. For designs using external multiplexing,
setting COC allows SD_CKE to provide command-bit functionality.
BS[3:0]
Column address strobe. For synchronous operation, BS[3:0] function as byte enables to the
SDRAMs. They connect to the DQM signals (or mask qualifiers) of the SDRAMs.
CLKOUT
Bus clock output. Connects to the CLK input of SDRAMs.
5.7.1.2
Address Multiplexing
See the SDRAM controller module chapter in the MCF5271 Reference Manual for details on address
multiplexing.
5.7.2
Ethernet PHY Transceiver Connection
The FEC supports both an MII interface for 10/100 Mbps Ethernet and a seven-wire serial interface for 10
Mbps Ethernet. The interface mode is selected by R_CNTRL[MII_MODE]. In MII mode, the 802.3
standard defines and the FEC module supports 18 signals. These are shown in Table 4.
Table 4. MII Mode
Signal Description
MCF5271 Pin
Transmit clock
ETXCLK
Transmit enable
ETXEN
Transmit data
ETXD[3:0]
Transmit error
ETXER
Collision
ECOL
Carrier sense
ECRS
Receive clock
ERXCLK
Receive enable
ERXDV
Receive data
ERXD[3:0]
MCF5271 Integrated Microprocessor Hardware Specification, Rev. 2
Freescale Semiconductor
11
Mechanicals/Pinouts and Part Numbers
Table 4. MII Mode (continued)
Signal Description
MCF5271 Pin
Receive error
ERXER
Management channel clock
EMDC
Management channel serial data
EMDIO
The serial mode interface operates in what is generally referred to as AMD mode. The MCF5271
configuration for seven-wire serial mode connections to the external transceiver are shown in Table 5.
Table 5. Seven-Wire Mode Configuration
Signal Description
MCF5271 Pin
Transmit clock
ETXCLK
Transmit enable
ETXEN
Transmit data
ETXD[0]
Collision
ECOL
Receive clock
ERXCLK
Receive enable
ERXDV
Receive data
ERXD[0]
Unused, configure as PB14
ERXER
Unused input, tie to ground
ECRS
Unused, configure as PB[13:11]
ERXD[3:1]
Unused output, ignore
ETXER
Unused, configure as PB[10:8]
ETXD[3:1]
Unused, configure as PB15
EMDC
Input after reset, connect to ground
EMDIO
Refer to the M5271EVB evaluation board user’s manual for an example of how to connect an external
PHY. Schematics for this board are accessible at the MCF5271 site by navigating to:
http://www.freescale.com/coldfire.
5.7.3
BDM
Use the BDM interface as shown in the M5271EVB evaluation board user’s manual. The schematics for
this board are accessible at the Freescale website at: http://www.freescale.com/coldfire.
6
Mechanicals/Pinouts and Part Numbers
This section contains drawings showing the pinout and the packaging and mechanical characteristics of
the MCF5271 devices. See Table 2 for a list the signal names and pin locations for each device.
MCF5271 Integrated Microprocessor Hardware Specification, Rev. 2
12
Freescale Semiconductor
Mechanicals/Pinouts and Part Numbers
6.1
Pinout—196 MAPBGA
The following figure shows a pinout of the MCF5270/71CVMxxx package.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
A
VSS
ETXCLK
ETXD3
ETXD2
QSPI_
DOUT
QSPI_CS0
U2RXD
U2TXD
CS3
CS6
CS4
A20
A17
VSS
A
B
ERXD0
ERXER
ETXER
ETXD0
QSPI_DIN
BS3
QSPI_CS1
U1CTS
CS7
CS1
A23
A19
A16
A15
B
C
ERXD2
ERXD1
ETXEN
ETXD1
QSCK
BS2
BS0
RTS1
CS2
CS5
A22
A18
A14
A13
C
D
ERXCLK
ERXDV
ERXD3
EMDC
EMDIO
Core
VDD_4
BS1
U1RXD1
U1TXD
CS0
A21
A12
A11
A10
D
E
ECRS
ECOL
NC
TIN0
VDD
VSS
VDD
SD_CKE
VSS
VDD
A9
A8
A7
A6
E
F
U0TXD
U0RXD
U0CTS
DTOUT0
TEST
VSS
VDD
VSS
VDD
VSS
Core
VDD_3
A5
A4
A3
F
G
Data31
DATA30
U0RTS
Core
VDD_1
CLK
MOD1
VDD
VSS
VDD
VSS
NC
A2
A1
A0
DTOUT3
G
H
DATA29
DATA28
DATA27
DATA26
CLK
MOD0
VSS
VDD
VDD
VDD
NC
TA
TIP
TS
DTIN3
H
J
DATA25
DATA24
DATA23
DATA22
VSS
VDD
VSS
VDD
VSS
VDD
I2C_SCL
I2C_SDA
R/W
TEA
J
K
DATA21
DATA20
DATA19
DATA18
VDD
VDD
VSS
VDD
JTAG_EN
RCON
SD_ RAS
SD_ CAS
SD_ WE
CLKOUT
K
L
DATA17
DATA16
DATA10
Core
VDD_2
DATA3
DTIN1
IRQ5
IRQ1
DTOUT2
PST0
DDATA0
SD_ CS1
SD_ CS0
VSSPLL
L
M
DATA15
DATA13
DATA9
DATA5
DATA2
DTOUT1
IRQ6
IRQ2
DTIN2
TDI/DSI
PST3
DDATA3
VDDPLL
EXTAL
M
N
DATA14
DATA12
DATA8
DATA5
DATA1
OE
IRQ7
IRQ3
TRST/
DSCLK
TDO/DSO
PST2
DDATA2
RESET
XTAL
N
P
VSS
DATA11
DATA7
DATA4
DATA0
TSIZ1
TSIZ0
IRQ4
TCLK/
PSTCLK
TMS/
BKPT
PST1
DDATA1
RSTOUT
VSS
P
1
2
3
4
5
6
7
8
9
10
11
12
13
14
Figure 2. MCF5270/71CVMxxx Pinout (196 MAPBGA)
MCF5271 Integrated Microprocessor Hardware Specification, Rev. 2
Freescale Semiconductor
13
Mechanicals/Pinouts and Part Numbers
6.2
Package Dimensions—196 MAPBGA
Figure 3 shows MCF5270/71CVMxxx package dimensions.
X
D
Y
Laser mark for pin 1
identification in
this area
NOTES:
1. Dimensions are in millimeters.
2. Interpret dimensions and tolerances
per ASME Y14.5M, 1994.
3. Dimension b is measured at the
maximum solder ball diameter,
parallel to datum plane Z.
4. Datum Z (seating plane) is defined
by the spherical crowns of the solder
balls.
5. Parallelism measurement shall
exclude any effect of mark on top
surface of package.
M
K
E
Millimeters
DIM
Min
Max
A
1.25
1.60
A1
0.27
0.47
A2
M
b
TOL
13X e
S
14 13 12 11 10 9
6
5
4
3
2
Metalized mark for
pin 1 identification
in this area
1
1.16 REF
0.45
0.55
D
15.00 BSC
E
15.00 BSC
e
1.00 BSC
S
0.50 BSC
A
B
C
5
D
S
E
13X e
F
A
0.20 Z
A2
G
H
J
K
L
M
A1
Z
0.10 Z
196X
4
Detail K
Rotated 90° Clockwise
N
P
3
196X
b
0.15 Z X Y
View M-M
0.08 Z
Figure 3. 196 MAPBGA Package Dimensions (Case No. 1128A-01)
MCF5271 Integrated Microprocessor Hardware Specification, Rev. 2
14
Freescale Semiconductor
Mechanicals/Pinouts and Part Numbers
6.3
Pinout—160 QFP
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
MCF5271
120
119
118
117
116
115
114
113
112
111
110
109
108
107
106
105
104
103
102
101
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
A17
A16
A15
A14
A13
A12
O-VDD
VSS
A11
A10
A9
A8
A7
A6
A5
O-VDD
VSS
Core_Vdd_3
A4
A3
A2
A1
A0
TS
TA
R/W
O-VDD
VSS
SD_WE
SD_SCAS
SD_SRAS
CLKOUT
VSS
VDDPLL
EXTAL
XTAL
VSSPLL
RESET
RSTOUT
O-VDD
O-VDD
DATA15
DATA14
DATA13
DATA12
DATA11
DATA10
DATA9
DATA8
DATA7
DATA6
DATA5
Core Vdd_2
VSS
O-VDD
DATA4
DATA3
DATA2
DATA1
DATA0
DTIN1
OE
IRQ7
IRQ4
IRQ1
DTIN2
VSS
TCLK\PSTCLK
O-VDD
TRST/DSCLK
TMS\BKPT
TDO/DSO
TDI/DSI
PST0
PST1
PST2
PST3
JTAG_EN
RCON
VSS
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
O-VDD
ERXD0
ERXD1
ERXD2
ERXD3
ERXDV
ERXCLK
ECRS
ECOL
U0TIN
U0TOUT
U0CTS
U0RXD
U0TXD
U0RTS
Core VDD_1
VSS
O-VDD
TEST
CLKMOD1
CLKMOD0
DATA31
DATA30
DATA29
DATA28
DATA27
DATA26
DATA25
DATA24
DATA23
VSS
O-VDD
DATA22
DATA21
DATA20
DATA19
DATA18
DATA17
DATA16
VSS
160
159
158
157
156
155
154
153
152
151
150
149
148
147
146
145
144
143
142
141
140
139
138
137
136
135
134
133
132
131
130
129
128
127
126
125
124
123
122
121
VSS
ERXER
ETXCLK
ETXEN
ETXER
ETXD3
ETXD2
ETXD1
ETXD0
EMDC
EMDIO
QSPI_DOUT
QSPI_DIN
QSPI_CLK
QSPI_CS0
O-VDD
VSS
BS3
BS2
BS1
BS0
QSPI_CS1/SD_CKE
O-VDD
VSS
U1CTS
U1RTS
U1RXD
U1TXD
CS3
CS2
CS1
CS0
O-VDD
VSS
A23
A18
A21
A20
A19
A18
Figure 4 shows a pinout of the MCF5271CABxxx package.
Figure 4. MCF5270/71CABxxx Pinout (160 QFP)
6.4
Package Dimensions—160 QFP
Figure 5 shows MCF5270/71CAB80 package dimensions.
MCF5271 Integrated Microprocessor Hardware Specification, Rev. 2
Freescale Semiconductor
15
Mechanicals/Pinouts and Part Numbers
L
DETAIL A
B
H
V
B
0.20 (0.008) M
A-B
H
0.20 (0.008)
M
B
0.20 (0.008)
–B–
–A–
L
–A–, –B–, –D–
A-B S
A-B S
D S
D S
Y
P
G
DETAIL A
Z
A
0.20 (0.008) M C
0.20 (0.008)
S
A-B
BASE
METAL
D S
A-B
N
S
0.20 (0.008)
M C
A-B
S
J
D S
F
DETAIL C
D
–H–
0.13 (0.005) M
C A-B
S
D S
SECTION B–B
M×
TOP &
BOTTOM
U×
C
E
NOTES
T
–H–
R
Q×
W
–C–
K
H
X
0.110 (0.004)
DETAIL C
1. DIMENSIONING AND TOLERINCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER
3. DATUM PLAN -H- IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD WHERE
THE LEAD EXITS THE PLASTIC BODY AT THE
BOTTOM OF THE PARTING LINE.
4. DATUMS -A-, -B-, AND -D- TO BE DETERMINED AT
DATUM PLANE -H-.
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE -C-.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25
(0.010) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE DETERMINED
AT DATUM PLANE -H-.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT.
MILLIMETERS
DIM MIN
MAX
A
27.90 28.10
27.90 28.10
B
3.35
3.85
C
D
0.22
0.38
3.20
3.50
E
0.22
0.33
F
0.65 BSC
G
H
0.25
0.35
J
0.11
0.23
K
0.70
0.90
25.35
BSC
L
16°
M
5°
0.11
0.19
N
0.325 BSC
P
Q
7°
0°
R
0.13
0.30
S
31.00 31.40
0.13
—
T
U
0°
—
V
31.00 31.40
0.4
—
W
1.60 REF
X
Y
1.33 REF
1.33 REF
Z
INCHES
MIN
MAX
1.098 1.106
1.098 1.106
0.132 1.106
0.009 0.015
0.126 0.138
0.009 0.013
0.026 REF
0.010 0.014
0.004 0.009
0.028 0.035
0.998 REF
5°
16°
0.004 0.007
0.013 REF
0°
7°
0.005 0.012
1.220 1.236
0.005
—
0°
—
1.220 1.236
0.016
—
0.063 REF
0.052 REF
0.052 REF
Case 864A-03
Figure 5. 160 QFP Package Dimensions
MCF5271 Integrated Microprocessor Hardware Specification, Rev. 2
16
Freescale Semiconductor
Preliminary Electrical Characteristics
6.5
Ordering Information
Table 6. Orderable Part Numbers
7
Freescale Part
Number
Description
Speed
Temperature
MCF5270AB100
MCF5270 RISC Microprocessor, 160 QFP
100MHz
0° to +70° C
MCF5270VM100
MCF5270 RISC Microprocessor, 196 MAPBGA
100MHz
0° to +70° C
MCF5270CVM150
MCF5270 RISC Microprocessor, 196 MAPBGA
150MHz
-40° to +85° C
MCF5271CAB100
MCF5271 RISC Microprocessor, 160 QFP
100MHz
-40° to +85° C
MCF5271CVM100
MCF5271 RISC Microprocessor, 196 MAPBGA
100MHz
-40° to +85° C
MCF5271CVM150
MCF5271 RISC Microprocessor, 196 MAPBGA
150MHz
-40° to +85° C
Preliminary Electrical Characteristics
This chapter contains electrical specification tables and reference timing diagrams for the MCF5271
microcontroller unit. This section contains detailed information on power considerations, DC/AC
electrical characteristics, and AC timing specifications of MCF5271.
The electrical specifications are preliminary and are from previous designs or design simulations. These
specifications may not be fully tested or guaranteed at this early stage of the product life cycle, however
for production silicon these specifications will be met. Finalized specifications will be published after
complete characterization and device qualifications have been completed.
NOTE
The parameters specified in this processor document supersede any values
found in the module specifications.
7.1
Maximum Ratings
Table 7. Absolute Maximum Ratings1, 2
Rating
Symbol
Value
Unit
Core Supply Voltage
VDD
– 0.5 to +2.0
V
Pad Supply Voltage
OVDD
– 0.3 to +4.0
V
VDDPLL
– 0.3 to +4.0
V
VIN
– 0.3 to + 4.0
V
ID
25
mA
TA
(TL - TH)
– 40 to 85
°C
Tstg
– 65 to 150
°C
Clock Synthesizer Supply Voltage
Digital Input Voltage 3
Instantaneous Maximum Current
Single pin limit (applies to all pins) 3,4,5
Operating Temperature Range (Packaged)
Storage Temperature Range
MCF5271 Integrated Microprocessor Hardware Specification, Rev. 2
Freescale Semiconductor
17
Preliminary Electrical Characteristics
1
2
3
4
5
7.2
Functional operating conditions are given in DC Electrical Specifications. Absolute Maximum
Ratings are stress ratings only, and functional operation at the maxima is not guaranteed.
Continued operation at these levels may affect device reliability or cause permanent damage
to the device.
This device contains circuitry protecting against damage due to high static voltage or
electrical fields; however, it is advised that normal precautions be taken to avoid application of
any voltages higher than maximum-rated voltages to this high-impedance circuit. Reliability of
operation is enhanced if unused inputs are tied to an appropriate logic voltage level (e.g.,
either VSS or OVDD).
Input must be current limited to the value specified. To determine the value of the required
current-limiting resistor, calculate resistance values for positive and negative clamp voltages,
then use the larger of the two values.
All functional non-supply pins are internally clamped to VSS and OVDD.
Power supply must maintain regulation within operating OVDD range during instantaneous
and operating maximum current conditions. If positive injection current (Vin > OVDD) is greater
than IDD, the injection current may flow out of OVDD and could result in external power supply
going out of regulation. Insure external OVDD load will shunt current greater than maximum
injection current. This will be the greatest risk when the processor is not consuming power
(ex; no clock).Power supply must maintain regulation within operating OVDD range during
instantaneous and operating maximum current conditions.
Thermal Characteristics
The below table lists thermal resistance values.
Table 8. Thermal Characteristics
Characteristic
Junction to ambient, natural convection
Junction to ambient (@200 ft/min)
1
2
3
4
5
Symbol
196
160QFP
MAPBGA
Unit
Four layer board (2s2p)
θJMA
321,2
401,2
°C/ W
Four layer board (2s2p)
θJMA
1,2
1,2
°C/ W
3
°C/ W
4
10
°C/ W
29
36
Junction to board
θJB
203
Junction to case
θJC
10
4
Junction to top of package
Ψjt
21,5
21,5
°C/ W
Maximum operating junction temperature
Tj
104
105
oC
25
θJMA and Ψjt parameters are simulated in conformance with EIA/JESD Standard 51-2 for natural convection.
Freescale recommends the use of θJmA and power dissipation specifications in the system design to prevent
device junction temperatures from exceeding the rated specification. System designers should be aware that
device junction temperatures can be significantly influenced by board layout and surrounding devices.
Conformance to the device junction temperature specification can be verified by physical measurement in the
customer’s system using the Ψjt parameter, the device power dissipation, and the method described in
EIA/JESD Standard 51-2.
Per JEDEC JESD51-6 with the board horizontal.
Thermal resistance between the die and the printed circuit board in conformance with JEDEC JESD51-8.
Board temperature is measured on the top surface of the board near the package.
Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL
SPEC-883 Method 1012.1).
Thermal characterization parameter indicating the temperature difference between package top and the
junction temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization
parameter is written in conformance with Psi-JT.
MCF5271 Integrated Microprocessor Hardware Specification, Rev. 2
18
Freescale Semiconductor
Preliminary Electrical Characteristics
The average chip-junction temperature (TJ) in °C can be obtained from:
T J = T A + ( P D × Θ JMA ) (1)
Where:
TA= Ambient Temperature, °C
ΘJMA= Package Thermal Resistance, Junction-to-Ambient, °C/W
PD= PINT + PI/O
PINT= IDD × VDD, Watts - Chip Internal Power
PI/O= Power Dissipation on Input and Output Pins — User Determined
For most applications PI/O < PINT and can be ignored. An approximate relationship between PD
and TJ (if PI/O is neglected) is:
P D = K ÷ ( T J + 273°C )
(2)
Solving equations 1 and 2 for K gives:
K = PD × (TA + 273 °C) + ΘJMA × PD 2 (3)
where K is a constant pertaining to the particular part. K can be determined from equation (3)
by measuring PD (at equilibrium) for a known TA. Using this value of K, the values of PD and
TJ can be obtained by solving equations (1) and (2) iteratively for any value of TA.
7.3
DC Electrical Specifications
Table 9. DC Electrical Specifications1
Characteristic
Symbol
Min
Typical
Max
Unit
Core Supply Voltage
VDD
1.4
—
1.6
V
Pad Supply Voltage
OVDD
3
—
3.6
V
Input High Voltage
VIH
0.7 × OVDD
—
3.65
V
Input Low Voltage
VIL
VSS – 0.3
—
0.35 × OVDD
V
VHYS
0.06 × OVDD
—
—
mV
Input Leakage Current
Vin = VDD or VSS, Input-only pins
Iin
–1.0
—
1.0
µA
High Impedance (Off-State) Leakage Current
Vin = VDD or VSS, All input/output and output pins
IOZ
–1.0
—
1.0
µA
Output High Voltage (All input/output and all output pins)
IOH = –5.0 mA
VOH
OVDD - 0.5
—
—
V
Output Low Voltage (All input/output and all output pins)
IOL = 5.0mA
VOL
—
—
0.5
V
Weak Internal Pull Up Device Current, tested at VIL Max.2
IAPU
–10
—
– 130
µA
Input Hysteresis
3
Input Capacitance
All input-only pins
All input/output (three-state) pins
Cin
—
—
—
pF
7
7
MCF5271 Integrated Microprocessor Hardware Specification, Rev. 2
Freescale Semiconductor
19
Preliminary Electrical Characteristics
Table 9. DC Electrical Specifications1 (continued)
Characteristic
Symbol
Load Capacitance4
Low drive strength
High drive strength
CL
Core Operating Supply Current 5
Master Mode
IDD
Pad Operating Supply Current
Master Mode
Low Power Modes
2
3
4
5
6
7
8
Typical
Max
Unit
—
—
25
50
pF
pF
—
135
150
mA
—
—
100
TBD
—
—
mA
µA
1.0
10
mA
mA
OIDD
DC Injection Current 3, 6, 7, 8
VNEGCLAMP =VSS– 0.3 V, VPOSCLAMP = VDD + 0.3
Single Pin Limit
Total processor Limit, Includes sum of all stressed pins
1
Min
IIC
–1.0
–10
Refer to Table 10 for additional PLL specifications.
Refer to the MCF5271 signals section for pins having weak internal pull-up devices.
This parameter is characterized before qualification rather than 100% tested.
pF load ratings are based on DC loading and are provided as an indication of driver strength. High speed interfaces require
transmission line analysis to determine proper drive strength and termination. See High Speed Signal Propagation:
Advanced Black Magic by Howard W. Johnson for design guidelines.
Current measured at maximum system clock frequency, all modules active, and default drive strength with matching load.
All functional non-supply pins are internally clamped to VSS and their respective VDD.
Input must be current limited to the value specified. To determine the value of the required current-limiting resistor, calculate
resistance values for positive and negative clamp voltages, then use the larger of the two values.
Power supply must maintain regulation within operating VDD range during instantaneous and operating maximum current
conditions. If positive injection current (Vin > VDD) is greater than IDD, the injection current may flow out of VDD and could
result in external power supply going out of regulation. Insure external VDD load will shunt current greater than maximum
injection current. This will be the greatest risk when the processor is not consuming power. Examples are: if no system
clock is present, or if clock rate is very low which would reduce overall power consumption. Also, at power-up, system clock
is not present during the power-up sequence until the PLL has attained lock.
7.4
Oscillator and PLLMRFM Electrical Characteristics
Table 10. HiP7 PLLMRFM Electrical Specifications1
Num
1
2
3
Characteristic
PLL Reference Frequency Range
Crystal reference
External reference
1:1 mode (NOTE: fsys/2 = 2 × fref_1:1)
Core frequency
CLKOUT Frequency 2
External reference
On-Chip PLL Frequency
Self Clocked Mode Frequency
5
Crystal Start-up Time 5, 6
Min.
Value
Max.
Value
fref_crystal
fref_ext
fref_1:1
8
8
24
25
25
75
fsys/2
0
fref ÷ 32
150
75
75
MHz
MHz
MHz
4, 5
fLOR
100
1000
kHz
fSCM
10.25
15.25
MHz
tcst
—
10
ms
Unit
MHz
fsys
Loss of Reference Frequency 3, 5
4
Symbol
MCF5271 Integrated Microprocessor Hardware Specification, Rev. 2
20
Freescale Semiconductor
Preliminary Electrical Characteristics
Table 10. HiP7 PLLMRFM Electrical Specifications1 (continued)
Num
6
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
Characteristic
Symbol
XTAL Load Capacitance5
5, 7,13
Min.
Value
Max.
Value
Unit
5
30
pF
—
750
µs
—
—
11
750
ms
µs
7
PLL Lock Time
8
Power-up To Lock Time 5, 6,8
With Crystal Reference (includes 5 time)
Without Crystal Reference9
tlplk
9
1:1 Mode Clock Skew (between CLKOUT
and EXTAL) 10
tskew
–1
1
ns
10
Duty Cycle of reference 5
tdc
40
60
%
11
Frequency un-LOCK Range
fUL
–3.8
4.1
% fsys/2
12
Frequency LOCK Range
fLCK
–1.7
2.0
% fsys/2
13
CLKOUT Period Jitter, 5, 6, 8,11, 12
Measured at fsys/2 Max
Peak-to-peak Jitter (Clock edge to clock
edge)
Long Term Jitter (Averaged over 2 ms
interval)
Cjitter
—
—
5.0
.01
% fsys/2
14
Frequency Modulation Range Limit13,14
(fsys/2 Max must not be exceeded)
Cmod
0.8
2.2
%fsys/2
15
ICO Frequency. fico = fref × 2 × (MFD+2) 15
fico
48
150
MHz
tlpll
All values given are initial design targets and subject to change.
All internal registers retain data at 0 Hz.
“Loss of Reference Frequency” is the reference frequency detected internally, which transitions the PLL
into self clocked mode.
Self clocked mode frequency is the frequency that the PLL operates at when the reference frequency falls
below fLOR with default MFD/RFD settings.
This parameter is guaranteed by characterization before qualification rather than 100% tested.
Proper PC board layout procedures must be followed to achieve specifications.
This specification applies to the period required for the PLL to relock after changing the MFD frequency
control bits in the synthesizer control register (SYNCR).
Assuming a reference is available at power up, lock time is measured from the time VDD and VDDSYN are
valid to RSTOUT negating. If the crystal oscillator is being used as the reference for the PLL, then the
crystal start up time must be added to the PLL lock time to determine the total start-up time.
tlpll = (64 * 4 * 5 + 5 τ) Tref, where Tref = 1/Fref_crystal = 1/Fref_ext = 1/Fref_1:1, and τ = 1.57x10-6 2(MFD +
2).
PLL is operating in 1:1 PLL mode.
Jitter is the average deviation from the programmed frequency measured over the specified interval at
maximum fsys/2. Measurements are made with the device powered by filtered supplies and clocked by a
stable external clock signal. Noise injected into the PLL circuitry via VDDSYN and VSSSYN and variation in
crystal oscillator frequency increase the Cjitter percentage for a given interval.
Values are with frequency modulation disabled. If frequency modulation is enabled, jitter is the sum of
Cjitter+Cmod.
Modulation percentage applies over an interval of 10µs, or equivalently the modulation rate is 100KHz.
Modulation rate selected must not result in fsys/2 value greater than the fsys/2 maximum specified value.
Modulation range determined by hardware design.
fsys/2 = fico / (2 * 2RFD)
MCF5271 Integrated Microprocessor Hardware Specification, Rev. 2
Freescale Semiconductor
21
Preliminary Electrical Characteristics
7.5
External Interface Timing Characteristics
Table 11 lists processor bus input timings.
NOTE
All processor bus timings are synchronous; that is, input setup/hold and
output delay with respect to the rising edge of a reference clock. The
reference clock is the CLKOUT output.
All other timing relationships can be derived from these values.
Table 11. Processor Bus Input Timing Specifications
Characteristic1
Name
freq
System bus frequency
B0
CLKOUT period
Symbol
Min
Max
Unit
fsys/2
50
75
MHz
tcyc
—
1/75
ns
Control Inputs
B1a
Control input valid to CLKOUT high2
tCVCH
9
—
ns
B1b
BKPT valid to CLKOUT high3
tBKVCH
9
—
ns
B2a
CLKOUT high to control inputs invalid2
tCHCII
0
—
ns
tBKNCH
0
—
ns
B2b
CLKOUT high to asynchronous control input BKPT
invalid3
Data Inputs
B4
Data input (D[31:0]) valid to CLKOUT high
tDIVCH
4
—
ns
B5
CLKOUT high to data input (D[31:0]) invalid
tCHDII
0
—
ns
1
Timing specifications are tested using full drive strength pad configurations in a 50ohm transmission line
environment..
2
TEA and TA pins are being referred to as control inputs.
3 Refer to figure A-19.
Timings listed in Table 11 are shown in Figure 6 & Figure A-3.
MCF5271 Integrated Microprocessor Hardware Specification, Rev. 2
22
Freescale Semiconductor
Preliminary Electrical Characteristics
* The timings are also valid for inputs sampled on the negative clock edge.
1.5V
CLKOUT(75MHz)
TSETUP
THOLD
Input Setup And Hold
Invalid
1.5V Valid 1.5V
Invalid
trise
Input Rise Time
Vh = VIH
Vl = VIL
tfall
Input Fall Time
CLKOUT
Vh = VIH
Vl = VIL
B4
B5
Inputs
Figure 6. General Input Timing Requirements
7.6
Processor Bus Output Timing Specifications
Table 12 lists processor bus output timings.
Table 12. External Bus Output Timing Specifications
Name
Characteristic
Symbol
Min
Max
Unit
Control Outputs
B6a
CLKOUT high to chip selects valid 1
tCHCV
—
0.5tCYC +5
ns
B6b
CLKOUT high to byte enables (BS[3:0]) valid2
tCHBV
—
0.5tCYC +5
ns
B6c
CLKOUT high to output enable (OE) valid3
tCHOV
—
0.5tCYC +5
ns
B7
CLKOUT high to control output (BS[3:0], OE) invalid
tCHCOI
0.5tCYC+1.5
—
ns
B7a
CLKOUT high to chip selects invalid
tCHCI
0.5tCYC+1.5
—
ns
—
9
ns
Address and Attribute Outputs
B8
CLKOUT high to address (A[23:0]) and control (TS,
TSIZ[1:0], TIP, R/W) valid
tCHAV
MCF5271 Integrated Microprocessor Hardware Specification, Rev. 2
Freescale Semiconductor
23
Preliminary Electrical Characteristics
Table 12. External Bus Output Timing Specifications (continued)
Name
B9
Characteristic
CLKOUT high to address (A[23:0]) and control (TS,
TSIZ[1:0], TIP, R/W) invalid
Symbol
Min
Max
Unit
tCHAI
1.5
—
ns
Data Outputs
1
2
3
B11
CLKOUT high to data output (D[31:0]) valid
tCHDOV
—
9
ns
B12
CLKOUT high to data output (D[31:0]) invalid
tCHDOI
1.5
—
ns
B13
CLKOUT high to data output (D[31:0]) high impedance
tCHDOZ
—
9
ns
CS transitions after the falling edge of CLKOUT.
BS transitions after the falling edge of CLKOUT.
OE transitions after the falling edge of CLKOUT.
Read/write bus timings listed in Table 12 are shown in Figure 7, Figure 8, and Figure 9.
S1
S0
S2
S3
S4
S5
S0
S1
S2
S3
S4
S5
CLKOUT
B7a
CSn
A[23:0]
TSIZ[1:0]
B6a
B6a
B7a
B8
B8
B8
B9
B9
TS
B9
B8
B9
TIP
B8
B6c
B0
B7
OE
R/W (H)
B9
B8
B6b
B6b
BS[3:0]
B7
B7
B11
B4
B12
D[31:0]
B5
B13
TA (H)
TEA (H)
Figure 7. Read/Write (Internally Terminated) SRAM Bus Timing
MCF5271 Integrated Microprocessor Hardware Specification, Rev. 2
24
Freescale Semiconductor
Preliminary Electrical Characteristics
Figure 8 shows a bus cycle terminated by TA showing timings listed in Table 12.
S0
S1
S2
S3
S4
S5
S0
S1
CLKOUT
B6a
B7a
CSn
A[23:0]
B8
B9
TSIZ[1:0]
B8
B9
TS
B8
B9
TIP
B6c
OE
B7
R/W (H)
B6b
B7
BS[3:0]
B5
B4
D[31:0]
B2a
TA
B1a
TEA (H)
Figure 8. SRAM Read Bus Cycle Terminated by TA
Figure 9 shows an SRAM bus cycle terminated by TEA showing timings listed in Table 12.
MCF5271 Integrated Microprocessor Hardware Specification, Rev. 2
Freescale Semiconductor
25
Preliminary Electrical Characteristics
S0
S1
S2
S3
S4
S5
S0
S1
CLKOUT
B6a
B7a
CSn
A[23:0]
TSIZ[1:0]
B8
B9
B8
B9
TS
B8
TIP
B9
B6c
B7
OE
R/W (H)
B6b
B7
BS[3:0]
D[31:0]
TA (H)
B1a
TEA
B2a
Figure 9. SRAM Read Bus Cycle Terminated by TEA
Figure 10 shows an SDRAM read cycle.
MCF5271 Integrated Microprocessor Hardware Specification, Rev. 2
26
Freescale Semiconductor
Preliminary Electrical Characteristics
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
SD_CKE
D3
D1
Row
A[23:0]
Column
D2
D4
SD_SRAS
D4
D2
SD_CAS1
D2
D4
SDWE
D6
D5
D[31:0]
D2
RAS[1:0]
D2
D4
CAS[3:0]
ACTV
1
NOP
READ
NOP
NOP
PALL
DACR[CASL] = 2
Figure 10. SDRAM Read Cycle
Table 13. SDRAM Timing
NUM
Symbol
Min
Max
Unit
D1
CLKOUT high to SDRAM address valid
tCHDAV
—
9
ns
D2
CLKOUT high to SDRAM control valid
tCHDCV
—
9
ns
D3
CLKOUT high to SDRAM address invalid
tCHDAI
1.5
—
ns
D4
CLKOUT high to SDRAM control invalid
tCHDCI
1.5
—
ns
D5
SDRAM data valid to CLKOUT high
tDDVCH
4
—
ns
D6
CLKOUT high to SDRAM data invalid
tCHDDI
1.5
—
ns
D71
CLKOUT high to SDRAM data valid
tCHDDVW
—
9
ns
CLKOUT high to SDRAM data invalid
tCHDDIW
1.5
—
ns
2
D8
1
Characteristic
D7 and D8 are for write cycles only.
Figure 11 shows an SDRAM write cycle.
MCF5271 Integrated Microprocessor Hardware Specification, Rev. 2
Freescale Semiconductor
27
Preliminary Electrical Characteristics
0
1
2
3
4
5
6
7
8
9
10
11
12
SD_CKE
D3
D1
A[23:0]
Row
Column
D4
D2
SD_SRAS
D2
SD_SCAS1
D2
D4
SD_WE
D7
D[31:0]
D2
D8
RAS[1:0]
D4
D2
CAS[3:0]
ACTV
1 DACR[CASL]
NOP
WRITE
NOP
PALL
=2
Figure 11. SDRAM Write Cycle
7.7
General Purpose I/O Timing
Table 14. GPIO Timing1
NUM
G1
G2
G3
G4
1
Characteristic
Symbol
Min
Max
Unit
CLKOUT High to GPIO Output Valid
tCHPOV
—
10
ns
CLKOUT High to GPIO Output Invalid
tCHPOI
1.5
—
ns
GPIO Input Valid to CLKOUT High
tPVCH
9
—
ns
CLKOUT High to GPIO Input Invalid
tCHPI
1.5
—
ns
GPIO pins include: INT, UART, and Timer pins.
MCF5271 Integrated Microprocessor Hardware Specification, Rev. 2
28
Freescale Semiconductor
Preliminary Electrical Characteristics
CLKOUT
G2
G1
GPIO Outputs
G3
G4
GPIO Inputs
Figure 12. GPIO Timing
7.8
Reset and Configuration Override Timing
Table 15. Reset and Configuration Override Timing
(VDD = 2.7 to 3.6 V, VSS = 0 V, TA = TL to TH)1
NUM
1
2
Characteristic
Symbol
Min
Max
Unit
R1
RESET Input valid to CLKOUT High
tRVCH
9
—
ns
R2
CLKOUT High to RESET Input invalid
tCHRI
1.5
—
ns
tRIVT
5
—
tCYC
2
R3
RESET Input valid Time
R4
CLKOUT High to RSTOUT Valid
tCHROV
—
10
ns
R5
RSTOUT valid to Config. Overrides valid
tROVCV
0
—
ns
R6
Configuration Override Setup Time to RSTOUT invalid
tCOS
20
—
tCYC
R7
Configuration Override Hold Time after RSTOUT invalid
tCOH
0
—
ns
R8
RSTOUT invalid to Configuration Override High Impedance
tROICZ
—
1
tCYC
All AC timing is shown with respect to 50% VDD levels unless otherwise noted.
During low power STOP, the synchronizers for the RESET input are bypassed and RESET is asserted asynchronously
to the system. Thus, RESET must be held a minimum of 100 ns.
CLKOUT
R1
R2
R3
RESET
R4
R4
RSTOUT
R8
R5
R6
R7
Configuration Overrides*:
(RCON, Override pins])
Figure 13. RESET and Configuration Override Timing
Refer to the chip configuration module (CCM) chapter in the device’s reference manual for more
information.
MCF5271 Integrated Microprocessor Hardware Specification, Rev. 2
Freescale Semiconductor
29
Preliminary Electrical Characteristics
I2C Input/Output Timing Specifications
7.9
Table 16 lists specifications for the I2C input timing parameters shown in Figure 14.
Table 16. I2C Input Timing Specifications between I2C_SCL and I2C_SDA
Num
Characteristic
Min
Max
Units
I1
Start condition hold time
2
—
tcyc
I2
Clock low period
8
—
tcyc
I3
I2C_SCL/I2C_SDA rise time (VIL = 0.5 V to VIH = 2.4 V)
—
1
ms
I4
Data hold time
0
—
ns
I5
I2C_SCL/I2C_SDA fall time (VIH = 2.4 V to VIL = 0.5 V)
—
1
ms
I6
Clock high time
4
—
tcyc
I7
Data setup time
0
—
ns
I8
Start condition setup time (for repeated start condition only)
2
—
tcyc
I9
Stop condition setup time
2
—
tcyc
Table 17 lists specifications for the I2C output timing parameters shown in Figure 14.
Table 17. I2C Output Timing Specifications between I2C_SCL and I2C_SDA
Num
Characteristic
Min
Max
Units
I11
Start condition hold time
6
—
tcyc
I2 1
Clock low period
10
—
tcyc
I3 2
I2C_SCL/I2C_SDA rise time (VIL = 0.5 V to VIH = 2.4 V)
—
—
µs
I4
1
Data hold time
7
—
tcyc
I5
3
I2C_SCL/I2C_SDA fall time (VIH = 2.4 V to VIL = 0.5 V)
—
3
ns
I6 1
Clock high time
10
—
tcyc
I7 1
Data setup time
2
—
tcyc
I8
1
Start condition setup time (for repeated start condition only)
20
—
tcyc
I9
1
Stop condition setup time
10
—
tcyc
1
Note: Output numbers depend on the value programmed into the IFDR; an IFDR programmed with
the maximum frequency (IFDR = 0x20) results in minimum output timings as shown in Table 17. The
I2C interface is designed to scale the actual data transition time to move it to the middle of the
I2C_SCL low period. The actual position is affected by the prescale and division values programmed
into the IFDR; however, the numbers given in Table 17 are minimum values.
2
Because I2C_SCL and I2C_SDA are open-collector-type outputs, which the processor can only
actively drive low, the time I2C_SCL or I2C_SDA take to reach a high level depends on external
signal capacitance and pull-up resistor values.
3
Specified at a nominal 50-pF load.
Figure 14 shows timing for the values in Table 16 and Table 17.
MCF5271 Integrated Microprocessor Hardware Specification, Rev. 2
30
Freescale Semiconductor
Preliminary Electrical Characteristics
I2
I6
I5
I2C_SCL
I1
I4
I3
I8
I9
I7
I2C_SDA
Figure 14. I2C Input/Output Timings
7.10
Fast Ethernet AC Timing Specifications
MII signals use TTL signal levels compatible with devices operating at either 5.0 V or 3.3 V.
7.10.1
MII Receive Signal Timing (ERXD[3:0], ERXDV, ERXER, and
ERXCLK)
The receiver functions correctly up to a ERXCLK maximum frequency of 25 MHz +1%. The processor
clock frequency must exceed twice the ERXCLK frequency.
Table 18 lists MII receive channel timings.
Table 18. MII Receive Signal Timing
Num
Characteristic
Min
Max
Unit
M1
ERXD[3:0], ERXDV, ERXER to ERXCLK setup
5
—
ns
M2
ERXCLK to ERXD[3:0], ERXDV, ERXER hold
5
—
ns
M3
ERXCLK pulse width high
35%
65%
ERXCLK period
M4
ERXCLK pulse width low
35%
65%
ERXCLK period
Figure 15 shows MII receive signal timings listed in Table 18.
M3
ERXCLK (input)
M4
ERXD[3:0] (inputs)
ERXDV
ERXER
M1
M2
Figure 15. MII Receive Signal Timing Diagram
MCF5271 Integrated Microprocessor Hardware Specification, Rev. 2
Freescale Semiconductor
31
Preliminary Electrical Characteristics
7.10.2
MII Transmit Signal Timing (ETXD[3:0], ETXEN, ETXER, ETXCLK)
Table 19 lists MII transmit channel timings.
The transmitter functions correctly up to a ETXCLK maximum frequency of 25 MHz +1%. The processor
clock frequency must exceed twice the ETXCLK frequency.
Table 19. MII Transmit Signal Timing
Num
Characteristic
Min
Max
Unit
M5
ETXCLK to ETXD[3:0], ETXEN, ETXER invalid
5
—
ns
M6
ETXCLK to ETXD[3:0], ETXEN, ETXER valid
—
25
ns
M7
ETXCLK pulse width high
35%
65%
ETXCLK period
M8
ETXCLK pulse width low
35%
65%
ETXCLK period
Figure 16 shows MII transmit signal timings listed in Table 19.
M7
ETXCLK (input)
M5
M8
ETXD[3:0] (outputs)
ETXEN
ETXER
M6
Figure 16. MII Transmit Signal Timing Diagram
7.10.3
MII Async Inputs Signal Timing (ECRS and ECOL)
Table 20 lists MII asynchronous inputs signal timing.
Table 20. MII Async Inputs Signal Timing
Num
M9
Characteristic
Min
Max
Unit
1.5
—
ETXCLK period
ECRS, ECOL minimum pulse width
Figure 17 shows MII asynchronous input timings listed in Table 20.
ECRS, ECOL
M9
Figure 17. MII Async Inputs Timing Diagram
MCF5271 Integrated Microprocessor Hardware Specification, Rev. 2
32
Freescale Semiconductor
Preliminary Electrical Characteristics
7.10.4
MII Serial Management Channel Timing (EMDIO and EMDC)
Table 21 lists MII serial management channel timings. The FEC functions correctly with a maximum
MDC frequency of 2.5 MHz.
Table 21. MII Serial Management Channel Timing
Num
Characteristic
Min
Max
Unit
M10
EMDC falling edge to EMDIO output invalid (minimum propagation delay)
0
—
ns
M11
EMDC falling edge to EMDIO output valid (max prop delay)
—
25
ns
M12
EMDIO (input) to EMDC rising edge setup
10
—
ns
M13
EMDIO (input) to EMDC rising edge hold
0
—
ns
M14
EMDC pulse width high
40% 60% MDC period
M15
EMDC pulse width low
40% 60% MDC period
Figure 18 shows MII serial management channel timings listed in Table 21.
M14
M15
EMDC (output)
M10
EMDIO (output)
M11
EMDIO (input)
M12
M13
Figure 18. MII Serial Management Channel Timing Diagram
7.11
32-Bit Timer Module AC Timing Specifications
Table 22 lists timer module AC timings.
MCF5271 Integrated Microprocessor Hardware Specification, Rev. 2
Freescale Semiconductor
33
Preliminary Electrical Characteristics
Table 22. Timer Module AC Timing Specifications
0–66 MHz
Name
Characteristic
Unit
Min
Max
T1
DT0IN / DT1IN / DT2IN / DT3IN cycle time
3
—
tCYC
T2
DT0IN / DT1IN / DT2IN / DT3IN pulse width
1
—
tCYC
7.12
QSPI Electrical Specifications
Table 23 lists QSPI timings.
Table 23. QSPI Modules AC Timing Specifications
Name
Characteristic
Min
Max
Unit
QS1
QSPI_CS[1:0] to QSPI_CLK
1
510
tcyc
QS2
QSPI_CLK high to QSPI_DOUT valid.
—
10
ns
QS3
QSPI_CLK high to QSPI_DOUT invalid. (Output hold)
2
—
ns
QS4
QSPI_DIN to QSPI_CLK (Input setup)
9
—
ns
QS5
QSPI_DIN to QSPI_CLK (Input hold)
9
—
ns
The values in Table 23 correspond to Figure 19.
QS1
QSPI_CS[1:0]
QSPI_CLK
QS2
QSPI_DOUT
QS3
QS4
QS5
QSPI_DIN
Figure 19. QSPI Timing
MCF5271 Integrated Microprocessor Hardware Specification, Rev. 2
34
Freescale Semiconductor
Preliminary Electrical Characteristics
7.13
JTAG and Boundary Scan Timing
Table 24. JTAG and Boundary Scan Timing
Characteristics1
Num
1
Symbol
Min
Max
Unit
J1
TCLK Frequency of Operation
fJCYC
DC
1/4
fsys/2
J2
TCLK Cycle Period
tJCYC
4
—
tCYC
J3
TCLK Clock Pulse Width
tJCW
26
—
ns
J4
TCLK Rise and Fall Times
tJCRF
0
3
ns
J5
Boundary Scan Input Data Setup Time to TCLK Rise
tBSDST
4
—
ns
J6
Boundary Scan Input Data Hold Time after TCLK Rise
tBSDHT
26
—
ns
J7
TCLK Low to Boundary Scan Output Data Valid
tBSDV
0
33
ns
J8
TCLK Low to Boundary Scan Output High Z
tBSDZ
0
33
ns
J9
TMS, TDI Input Data Setup Time to TCLK Rise
tTAPBST
4
—
ns
J10
TMS, TDI Input Data Hold Time after TCLK Rise
tTAPBHT
10
—
ns
J11
TCLK Low to TDO Data Valid
tTDODV
0
26
ns
J12
TCLK Low to TDO High Z
tTDODZ
0
8
ns
J13
TRST Assert Time
tTRSTAT
100
—
ns
J14
TRST Setup Time (Negation) to TCLK High
tTRSTST
10
—
ns
JTAG_EN is expected to be a static signal. Hence, specific timing is not associated with it.
J2
J3
J3
VIH
TCLK
(input)
J4
VIL
J4
Figure 20. Test Clock Input Timing
MCF5271 Integrated Microprocessor Hardware Specification, Rev. 2
Freescale Semiconductor
35
Preliminary Electrical Characteristics
TCLK
VIL
VIH
J5
Data Inputs
J6
Input Data Valid
J7
Data Outputs
Output Data Valid
J8
Data Outputs
J7
Data Outputs
Output Data Valid
Figure 21. Boundary Scan (JTAG) Timing
TCLK
VIL
VIH
J9
TDI
TMS
J10
Input Data Valid
J11
TDO
Output Data Valid
J12
TDO
J11
TDO
Output Data Valid
Figure 22. Test Access Port Timing
TCLK
J14
TRST
J13
Figure 23. TRST Timing
7.14
Debug AC Timing Specifications
Table 25 lists specifications for the debug AC timing parameters shown in Figure 25.
MCF5271 Integrated Microprocessor Hardware Specification, Rev. 2
36
Freescale Semiconductor
Preliminary Electrical Characteristics
Table 25. Debug AC Timing Specification
150 MHz
Num
Units
Min
Max
DE0
PSTCLK cycle time
—
0.5
tcyc
DE1
PST valid to PSTCLK high
4
—
ns
DE2
PSTCLK high to PST invalid
1.5
—
ns
DE3
DSCLK cycle time
5
—
tcyc
DE4
DSI valid to DSCLK high
1
—
tcyc
DE5
DSCLK high to DSO invalid
4
—
tcyc
DE6
BKPT input data setup time to CLKOUT rise
4
—
ns
DE7
CLKOUT high to BKPT high Z
0
10
ns
1
1
Characteristic
DSCLK and DSI are synchronized internally. D4 is measured from the synchronized DSCLK
input relative to the rising edge of CLKOUT.
Figure 24 shows real-time trace timing for the values in Table 25.
PSTCLK
DE0
DE1
DE2
PST[3:0]
DDATA[3:0]
Figure 24. Real-Time Trace AC Timing
Figure 25 shows BDM serial port AC timing for the values in Table 25.
MCF5271 Integrated Microprocessor Hardware Specification, Rev. 2
Freescale Semiconductor
37
Documentation
CLKOUT
DE6
BKPT
DE7
DE5
DSCLK
DE3
Current
DSI
Next
DE4
Past
DSO
Current
Figure 25. BDM Serial Port AC Timing
8
Documentation
Documentation regarding the MCF5271 and their development support tools is available from a local
Freescale distributor, a Freescale semiconductor sales office, the Freescale Literature Distribution Center,
or through the Freescale web address at http://www.freescale.com/coldfire.
9
Document Revision History
The below table provides a revision history for this document.
Table 26. MCF5271EC Revision History
Rev. No.
Substantive Change(s)
0
Initial release
1
• Fixed several clock values.
• Updated Signal List table
1.1
• Removed duplicate information in the module description sections. The information is all in the
Signals Description Table.
1.2
• Removed detailed signal description section. This information can be found in the
MCF5271RM Chapter 2.
• Removed detailed feature list. This information can be found in the MCF5271RM Chapter 1.
• Changed instances of Motorola to Freescale
• Added values for ‘Maximum operating junction temperature’ in Table 8.
• Added typical values for ‘Core operating supply current (master mode)’ in Table 9.
• Added typical values for ‘Pad operating supply current (master mode)’ in Table 9.
• Removed unnecessary PLL specifications, #6-9, in Table 10.
MCF5271 Integrated Microprocessor Hardware Specification, Rev. 2
38
Freescale Semiconductor
Document Revision History
Table 26. MCF5271EC Revision History (continued)
Rev. No.
Substantive Change(s)
1.3
• Device is now available in 150 MHz versions. Updated specs where necessary to reflect this
improvement.
• Added 2 new part numbers to Table 6: MCF5270CVM150 and MCF5271CVM150.
• Removed features list. This information can be found in the MCF5271RM.
• Removed SDRAM address multiplexing section. This information can be found in the
MCF5271RM.
1.4
• Added Section 5.2.1, “Supply Voltage Sequencing and Separation Cautions.”
• Updated 196MAPBGA package dimensions, Figure 3.
2
•
•
•
•
•
•
Table 2: Changed SD_CKE pin location from 139 to “—” for the 160QFP device.
Table 2: Changed QSPI_CS1 pin location from “—” to 139 for the 160QFP device.
Table 2: Changed DT3IN pin’s alternate 2 function from “—” to QSPI_CS2.
Table 2: Changed DT3OUT pin’s alternate 2 function from “—” to QSPI_CS3.
Figure 4: Changed pin 139 label from “SD_CKE/QSPI_CS1” to “QSPI_CS1/SD_CKE”.
Removed second sentence from Section 7.10.1, “MII Receive Signal Timing (ERXD[3:0],
ERXDV, ERXER, and ERXCLK),” and Section 7.10.2, “MII Transmit Signal Timing (ETXD[3:0],
ETXEN, ETXER, ETXCLK),” regarding no minimum frequency requirement for TXCLK.
• Removed third and fourth paragraphs from Section 7.10.2, “MII Transmit Signal Timing
(ETXD[3:0], ETXEN, ETXER, ETXCLK),” as this feature is not supported on this device.
MCF5271 Integrated Microprocessor Hardware Specification, Rev. 2
Freescale Semiconductor
39
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Document Number: MCF5271EC
Rev. 2
08/2006
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