DISCRETE SEMICONDUCTORS DATA SHEET book, halfpage M3D168 BZG01 series SMA voltage regulator diodes Product specification 2000 Feb 17 Philips Semiconductors Product specification SMA voltage regulator diodes BZG01 series FEATURES DESCRIPTION • Glass passivated DO-214AC surface mountable package with glass passivated chip. • High maximum operating temperature • Ideal for surface mount automotive applications The well-defined void-free case is of a transfer-moulded thermo-setting plastic. The small rectangular package has two J bent leads. • Low leakage current • Excellent stability • UL 94V-O classified plastic package • Zener working voltage range: 10 to 270 V for 35 types • Supplied in 12 mm embossed tape and reel, 1500 and 7500 pieces cathode band olumns k • Marking: cathode, date code, type name a • Easy pick and place. Top view Side view MBL143 Fig.1 Simplified outline (DO-214AC) and symbol. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL Ptot PARAMETER total power dissipation CONDITIONS MIN. MAX. UNIT Ttp = 100 °C; see Fig.2 − 2.50 W Tamb = 25 °C; see Fig.2; device mounted on an Al2O3 printed-circuit board: see Fig.5 − 1.50 W tp = 100 µs; square pulse; Tj = 25 °C prior to surge; see Fig.3 − 150 W PZSM non-repetitive peak reverse power dissipation Tstg storage temperature −65 +175 °C Tj junction temperature −65 +175 °C 2000 Feb 17 2 Philips Semiconductors Product specification SMA voltage regulator diodes BZG01 series ELECTRICAL CHARACTERISTICS Total series Tj = 25 °C unless otherwise specified. SYMBOL PARAMETER CONDITIONS forward voltage VF IF = 0.1 A; see Fig.4 MAX. UNIT 1.2 V Per type Tj = 25 °C unless otherwise specified. TYPE No. SUFFIX WORKING VOLTAGE DIFFERENTIAL RESISTANCE VZ (V) at IZ rdif (Ω) at IZ TEMPERATURE TEST COEFFICIENT CURRENT SZ (%/K) at IZ (1) IZ (mA) REVERSE CURRENT at REVERSE VOLTAGE IR (µA) NOM. MAX. TYP. MAX. MIN. MAX. C10 9.4 10 10.6 2 7 0.05 0.09 25 10 7.5 C11 10.4 11 11.6 3 8 0.05 0.10 20 4 8.2 C12 11.4 12 12.7 3 9 0.05 0.10 20 3 9.1 C13 12.4 13 14.1 3 10 0.05 0.10 20 2 10 C15 13.8 15 15.6 5 15 0.05 0.10 15 1 11 C16 15.3 16 17.1 5 15 0.06 0.11 15 1 12 C18 16.8 18 19.1 7 20 0.06 0.11 15 1 13 C20 18.8 20 21.2 8 24 0.06 0.11 10 1 15 C22 20.8 22 23.3 8 25 0.06 0.11 10 1 16 C24 22.8 24 25.6 8 25 0.06 0.11 10 1 18 C27 25.1 27 28.9 10 30 0.06 0.11 8 1 20 C30 28 30 32 10 30 0.06 0.11 8 1 22 C33 31 33 35 12 35 0.06 0.11 8 1 24 C36 34 36 38 13 40 0.06 0.11 8 1 27 C39 37 39 41 17 50 0.06 0.11 6 1 30 C43 40 43 46 17 50 0.07 0.12 6 1 33 C47 44 47 50 30 90 0.07 0.12 4 1 36 C51 48 51 54 40 115 0.07 0.12 4 1 39 C56 52 56 60 40 120 0.07 0.12 4 1 43 C62 58 62 66 40 125 0.08 0.13 4 1 47 C68 64 68 72 40 130 0.08 0.13 4 1 51 C75 70 75 79 40 135 0.08 0.13 4 1 56 C82 77 82 87 70 200 0.08 0.13 2.7 1 62 C91 85 91 96 80 250 0.09 0.13 2.7 1 68 C100 94 100 106 120 350 0.09 0.13 2.7 1 75 C110 104 110 116 150 450 0.09 0.13 2.7 1 82 C120 114 120 127 200 550 0.09 0.13 2 1 91 C130 124 130 141 250 700 0.09 0.13 2 1 100 C150 138 150 156 300 1000 0.09 0.13 2 1 110 2000 Feb 17 3 MAX. VR (V) MIN. Philips Semiconductors Product specification SMA voltage regulator diodes TYPE No. SUFFIX BZG01 series WORKING VOLTAGE DIFFERENTIAL RESISTANCE VZ (V) at IZ rdif (Ω) at IZ TEMPERATURE TEST COEFFICIENT CURRENT SZ (%/K) at IZ (1) IZ (mA) REVERSE CURRENT at REVERSE VOLTAGE IR (µA) MAX. VR (V) MIN. NOM. MAX. TYP. MAX. MIN. MAX. C160 153 160 171 350 1100 0.09 0.13 1.5 1 120 C180 168 180 191 400 1200 0.09 0.13 1.5 1 130 C200 188 200 212 500 1500 0.09 0.13 1.5 1 150 C220 208 220 233 700 2250 0.09 0.13 1 1 160 C240 228 240 256 800 2550 0.09 0.13 1 1 180 C270 251 270 289 1000 3000 0.09 0.13 1 1 200 VALUE UNIT 30 K/W Note 1. To complete the type number the suffix is added to the basic type number, e.g. BZG01-C130. THERMAL CHARACTERISTICS SYMBOL PARAMETER Rth j-tp thermal resistance from junction to tie-point Rth j-a thermal resistance from junction to ambient CONDITIONS note 1 100 K/W note 2 150 K/W Notes 1. Device mounted on an Al2O3 printed-circuit board, 0.7 mm thick; thickness of Cu-layer ≥35 µm, see Fig.5. 2. Device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of Cu-layer ≥40 µm, see Fig.5. For more information please refer to the ‘General Part of associated Handbook’. 2000 Feb 17 4 Philips Semiconductors Product specification SMA voltage regulator diodes BZG01 series GRAPHICAL DATA MCD826 handbook, halfpage 103 handbook, halfpage Ptot PZSM (W) (W) 3 2 102 1 10 1 10−2 0 0 40 80 120 160 200 T (°C) Solid line: tie-point temperature. Dotted line: ambient temperature; device mounted on an Al2O3 printed-circuit board as shown in Fig.5. 10−1 1 tp (ms) 10 Tj = 25 °C prior to surge. Fig.3 Fig.2 MCD825 Maximum total power dissipation as a function of temperature. Maximum non-repetitive peak reverse power dissipation as a function of pulse duration (square pulse). MCD824 3 handbook, halfpage 50 IF (A) 2 4.5 50 1 2.5 0 1 1.1 1.2 1.3 1.4 1.5 VF (V) 1.25 MSB213 Tj = 25 °C. Dimensions in mm. Fig.4 Forward current as a function of forward voltage; typical values. 2000 Feb 17 Fig.5 Printed-circuit board for surface mounting. 5 Philips Semiconductors Product specification SMA voltage regulator diodes BZG01 series PACKAGE OUTLINE Transfer-moulded thermo-setting plastic small rectangular surface mounted package; 2 connectors SOD124 H D A A1 c Q E b (1) 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 b c D E H Q mm 2.3 2.0 0.05 1.6 1.4 0.2 4.5 4.3 2.8 2.4 5.5 5.1 3.3 2.7 Note 1. The marking band indicates the cathode. OUTLINE VERSION SOD124 2000 Feb 17 REFERENCES IEC JEDEC EIAJ DO-214AC EUROPEAN PROJECTION ISSUE DATE 99-10-22 6 Philips Semiconductors Product specification SMA voltage regulator diodes BZG01 series DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Short-form specification The data in this specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. 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