SEMICONDUCTOR TECHNICAL DATA L SUFFIX CERAMIC CASE 632 The MC14562B is a 128–bit static shift register constructed with MOS P–channel and N–channel enhancement mode devices in a single monolithic structure. Data is clocked in and out of the shift register on the positive edge of the clock input. Data outputs are available every 16 bits, from 16 through bit 128. This complementary MOS shift register is primarily used where low power dissipation and/or high noise immunity is desired. • • • • • P SUFFIX PLASTIC CASE 646 Diode Protection on All Inputs Fully Static Operation Cascadable to Provide Longer Shift Register Lengths Supply Voltage Range = 3.0 Vdc to 18 Vdc Capable of Driving Two Low–power TTL Loads or One Low–power Schottky TTL Load Over the Rated Temperature Range ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ D SUFFIX SOIC CASE 751A ORDERING INFORMATION MC14XXXBCP MC14XXXBCL MC14XXXBD MAXIMUM RATINGS* (Voltages Referenced to VSS) Parameter Symbol VDD DC Supply Voltage Value Unit – 0.5 to + 18.0 V Vin, Vout Input or Output Voltage (DC or Transient) – 0.5 to VDD + 0.5 V Iin, Iout Input or Output Current (DC or Transient), per Pin ± 10 mA PD Power Dissipation, per Package† 500 mW Tstg Storage Temperature – 65 to + 150 _C 260 _C TL Lead Temperature (8–Second Soldering) Plastic Ceramic SOIC TA = – 55° to 125°C for all packages. BLOCK DIAGRAM 12 * Maximum Ratings are those values beyond which damage to the device may occur. †Temperature Derating: Plastic “P and D/DW” Packages: – 7.0 mW/_C From 65_C To 125_C Ceramic “L” Packages: – 12 mW/_C From 100_C To 125_C LOGIC DIAGRAM 5 DATA CLOCK Pins 4 and 11 not used. CLOCK 5 Q16 Q32 Q48 Q64 Q80 Q96 Q112 Q128 10 13 9 1 8 2 6 3 VDD = PIN 14 VSS = PIN 7 DATA IN 12 DQ C 1 D Q C 2 DQ C 3 DQ C 16 D Q C 17 DQ C 32 D Q C 33 DQ C 48 D Q C 49 DQ C 64 10 Q16 DQ C 65 D Q C 80 DQ C 81 D Q C 96 DQ C 97 DQ C 112 D Q C 113 DQ C 128 13 Q32 9 Q48 1 Q64 8 Q80 2 Q96 6 Q112 3 Q128 REV 3 1/94 MOTOROLA Motorola, Inc. 1995 CMOS LOGIC DATA MC14562B 1 ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ELECTRICAL CHARACTERISTICS (Voltages Referenced to VSS) Characteristic Output Voltage Vin = VDD or 0 Symbol – 55_C 25_C 125_C VDD Vdc Min Max Min Typ # Max Min Max Unit “0” Level VOL 5.0 10 15 — — — 0.05 0.05 0.05 — — — 0 0 0 0.05 0.05 0.05 — — — 0.05 0.05 0.05 Vdc “1” Level VOH 5.0 10 15 4.95 9.95 14.95 — — — 4.95 9.95 14.95 5.0 10 15 — — — 4.95 9.95 14.95 — — — Vdc 5.0 10 15 — — — 1.5 3.0 4.0 — — — 2.25 4.50 6.75 1.5 3.0 4.0 — — — 1.5 3.0 4.0 5.0 10 15 3.5 7.0 11 — — — 3.5 7.0 11 2.75 5.50 8.25 — — — 3.5 7.0 11 — — — 5.0 5.0 10 15 – 3.0 – 0.64 – 1.6 – 4.2 — — — — – 2.4 – 0.51 – 1.3 – 3.4 – 4.2 – 0.88 – 2.25 – 8.8 — — — — – 1.7 – 0.36 – 0.9 – 2.4 — — — — IOL 5.0 10 15 0.64 1.6 4.2 — — — 0.51 1.3 3.4 0.88 2.25 8.8 — — — 0.36 0.9 2.4 — — — mAdc Input Current Iin 15 — ± 0.1 — ± 0.00001 ± 0.1 — ± 1.0 µAdc Input Capacitance (Vin = 0) Cin — — — — 5.0 7.5 — — pF Quiescent Current (Per Package) IDD 5.0 10 15 — — — 5.0 10 20 — — — 0.010 0.020 0.030 5.0 10 20 — — — 150 300 600 µAdc IT 5.0 10 15 Vin = 0 or VDD Input Voltage “0” Level (VO = 4.5 or 05 Vdc) (VO = 9.0 or 1.0 Vdc) (VO = 13.5 or 1.5 Vdc) VIL “1” Level VIH (VO = 0.5 or 4.5 Vdc) (VO = 1.0 or 9.0 Vdc) (VO = 1.5 or 13.5 Vdc) Output Drive Current (VOH = 2.5 Vdc) (VOH = 4.6 Vdc) (VOH = 9.5 Vdc) (VOH = 13.5 Vdc) (VOL = 0.4 Vdc) (VOL = 0.5 Vdc) (VOL = 1.5 Vdc) Vdc Vdc IOH Source Sink Total Supply Current**† (Dynamic plus Quiescent, Per Package) (CL = 50 pF on all outputs, all buffers switching) mAdc IT = (1.94 µA/kHz) f + IDD IT = (3.81 µA/kHz) f + IDD IT = (5.52 µA/kHz) f + IDD µAdc #Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance. ** The formulas given are for the typical characteristics only at 25_C. †To calculate total supply current at loads other than 50 pF: IT(CL) = IT(50 pF) + (CL – 50) Vfk where: IT is in µA (per package), CL in pF, V = (VDD – VSS) in volts, f in kHz is input frequency, and k = 0.004. This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, Vin and Vout should be constrained to the range VSS ≤ (Vin or Vout) ≤ VDD. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either VSS or VDD). Unused outputs must be left open. PIN ASSIGNMENT Q64 1 14 VDD Q96 2 13 Q32 Q128 3 12 DATA NC 4 11 NC CLOCK 5 10 Q16 Q112 6 9 Q48 VSS 7 8 Q80 NC = NO CONNECTION MC14562B 2 MOTOROLA CMOS LOGIC DATA ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ SWITCHING CHARACTERISTICS* (CL = 50 pF, TA = 25_C) Characteristic Symbol Output Rise and Fall Time tTLH, tTHL = (1.5 ns/pF) CL + 25 ns tTLH, tTHL = (0.75 ns/pF) CL + 12.5 ns tTLH, tTHL = (0.55 ns/pF) CL + 9.5 ns tTLH, tTHL Propagation Delay Time Clock to Q tPLH, tPHL = (1.7 ns/pF) CL + 515 ns tPLH, tPHL = (0.66 ns/pF) CL + 217 ns tPLH, tPHL = (0.5 ns/pF) CL + 145 ns tPLH, tPHL Clock Pulse Width (50% Duty Cycle) Clock Pulse Frequency Data to Clock Setup Time Data to Clock Hold Time Clock Input Rise and Fall Times VDD Min Typ # Max 5.0 10 15 — — — 100 50 40 200 100 80 Unit ns ns 5.0 10 15 — — — 600 250 170 1200 500 340 tWH 5.0 10 15 600 220 150 300 110 75 — — — ns fcl 5.0 10 15 — — — 1.9 5.6 8.0 1.1 3.0 4.0 MHz tsu(1) 5.0 10 15 – 20 – 10 0 – 170 – 64 – 60 — — — ns tsu(0) 5.0 10 15 – 20 – 10 0 – 91 – 58 – 48 — — — ns th(1) 5.0 10 15 350 165 155 263 109 100 — — — ns th(0) 5.0 10 15 350 200 140 267 140 93 — — — ns tr, tf 5.0 10 15 — — — — — — 15 5 4 µs * The formulas given are for the typical characteristics only at 25_C. #Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance. VDD Q16 Q32 Q48 Q64 Q80 Q96 Q112 Q128 DATA CLOCK 7 CL VSS CL CL CL CL CL CL CL 500 µF ID fo CLOCK VDD DATA (f = 1/2 fo) VDD VSS VSS Figure 1. Power Dissipation Test Circuit and Waveforms MOTOROLA CMOS LOGIC DATA MC14562B 3 TIMING DIAGRAM PIN NO.’S PULSE 16 PULSE 1 PULSE 32 PULSE 128 CLOCK 5 DATA IN 12 Q16 10 Q32 13 Q28 3 AC TEST WAVEFORMS PULSE 1 CLOCK 50% 50% PULSE 2 50% tWH tr tWL DATA IN PULSE 16 90% 10% PULSE 17 VSS tf VDD 50% 50% VSS tsu(0) th(0) 50% 10% Q16 tPHL PULSE 1 CLOCK VDD 50% 50% 50% PULSE 2 90% VSS tTHL PULSE 17 PULSE 16 VDD 50% 50% VSS tWH tWL DATA IN 50% tsu(1) VDD VDD 50% VSS th(1) 50% Q16 tPLH 90% 10% VDD VSS tTHL NOTE: The remaining Data–Bit Outputs (Q32, Q48, Q64, Q80, Q96, Q112 and Q128) will occur at Clock Pulse 32, 48, 64, 80, 96, 112, 128 in the same relationship as Q16. MC14562B 4 MOTOROLA CMOS LOGIC DATA OUTLINE DIMENSIONS L SUFFIX CERAMIC DIP PACKAGE CASE 632–08 ISSUE Y –A– 14 9 1 7 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMENSION F MAY NARROW TO 0.76 (0.030) WHERE THE LEAD ENTERS THE CERAMIC BODY. –B– C –T– L K SEATING PLANE F G D N M J 14 PL 0.25 (0.010) M T A S 14 PL 0.25 (0.010) M T B P SUFFIX PLASTIC DIP PACKAGE CASE 646–06 ISSUE L 14 8 1 7 B A F L C J N H G D SEATING PLANE MOTOROLA CMOS LOGIC DATA K M S DIM A B C D F G J K L M N INCHES MIN MAX 0.750 0.785 0.245 0.280 0.155 0.200 0.015 0.020 0.055 0.065 0.100 BSC 0.008 0.015 0.125 0.170 0.300 BSC 0_ 15_ 0.020 0.040 MILLIMETERS MIN MAX 19.05 19.94 6.23 7.11 3.94 5.08 0.39 0.50 1.40 1.65 2.54 BSC 0.21 0.38 3.18 4.31 7.62 BSC 0_ 15_ 0.51 1.01 NOTES: 1. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE POSITION AT SEATING PLANE AT MAXIMUM MATERIAL CONDITION. 2. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 3. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 4. ROUNDED CORNERS OPTIONAL. DIM A B C D F G H J K L M N INCHES MIN MAX 0.715 0.770 0.240 0.260 0.145 0.185 0.015 0.021 0.040 0.070 0.100 BSC 0.052 0.095 0.008 0.015 0.115 0.135 0.300 BSC 0_ 10_ 0.015 0.039 MILLIMETERS MIN MAX 18.16 19.56 6.10 6.60 3.69 4.69 0.38 0.53 1.02 1.78 2.54 BSC 1.32 2.41 0.20 0.38 2.92 3.43 7.62 BSC 0_ 10_ 0.39 1.01 MC14562B 5 OUTLINE DIMENSIONS D SUFFIX PLASTIC SOIC PACKAGE CASE 751A–03 ISSUE F NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. –A– 14 8 –B– 1 P 7 PL 0.25 (0.010) 7 G M F –T– M K D 14 PL 0.25 (0.010) M T B S M R X 45 _ C SEATING PLANE B A S J DIM A B C D F G J K M P R MILLIMETERS MIN MAX 8.55 8.75 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0_ 7_ 5.80 6.20 0.25 0.50 INCHES MIN MAX 0.337 0.344 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0_ 7_ 0.228 0.244 0.010 0.019 Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer. How to reach us: USA/EUROPE/Locations Not Listed: Motorola Literature Distribution; P.O. Box 20912; Phoenix, Arizona 85036. 1–800–441–2447 or 602–303–5454 JAPAN: Nippon Motorola Ltd.; Tatsumi–SPD–JLDC, 6F Seibu–Butsuryu–Center, 3–14–2 Tatsumi Koto–Ku, Tokyo 135, Japan. 03–81–3521–8315 MFAX: [email protected] – TOUCHTONE 602–244–6609 INTERNET: http://Design–NET.com ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298 MC14562B 6 ◊ *MC14562B/D* MOTOROLA CMOS LOGIC DATA MC14562B/D