Material Content Data Sheet Sales Product Name TLE42764D V50 MA# MA001140440 Package PG-TO252-5-11 Issued 28. August 2013 Weight* 365.94 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal inorganic material non noble metal non noble metal organic material plastics inorganic material non noble metal non noble metal inorganic material noble metal non noble metal non noble metal < 10% silicon iron phosphorus copper aluminium carbon black epoxy resin silicondioxide tin nickel phosphorus silver tin lead 7440-21-3 7439-89-6 7723-14-0 7440-50-8 7429-90-5 1333-86-4 60676-86-0 7440-31-5 7440-02-0 7723-14-0 7440-22-4 7440-31-5 7439-92-1 3.179 0.87 0.205 0.06 wire encapsulation leadfinish plating solder *deviation Sum [%] Average Mass [ppm] Sum [ppm] 0.87 8687 8687 559 0.061 0.02 204.243 55.81 55.89 558128 168 558856 0.185 0.05 0.05 506 506 0.296 0.08 810 13.630 3.72 134.227 36.68 40.48 366800 404857 5.072 1.39 1.39 13861 13861 0.076 0.02 0.000 0.00 0.119 0.03 0.095 0.03 4.552 1.24 37247 208 0.02 1 260 1.30 12439 Sum in total: 100,00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 208 326 13025 1000000